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$99 Android 4.0.3 7” IPS tablet with an Allwinner SoC capable of 2160p Quad HD and built-in HDMI–another inflection point, from China again

[This is a huge, compiled collection basically finished in September, 2012. Contains updates till November, 2012. It was published in early December, 2012. A new USD 99 Allwinner blog was launched on Nov 30, 2012 based on this compilation. Please read the two entry posts of that as well: The upcoming Chinese tablet and device invasion lead by the Allwinner SoCs and $40 entry-level Allwinner tablets–now for the 220 million students Aakash project in India in order to understand very quickly that  It’s a Strategic Inflection Point of enourmous consequences, and not only for the ICT industry.]
Or it is first time that we can see globally that China is on a different, significantly more effective price/performance/functionality trajectory of its own than anybody else. Even the latest challengers to the already fading Wintel empire will be affected by this. We should therefore understand: 1. The new challenge—2. The learnings from similar fundamental shifts in the history of ICT—3. The current market for this new industry trajectory—4. The initial advantage that made possible this trajectory—5. The most significant new customer value which will assure its global victory in the end—6. The current way of thinking of the established client device players.—7. Possible further hardware advances sustaining this new trajectory.
Inside PRC the situation is even more dramatic. Below you could see 3 market leading products on the mainland China market as was indicated on Sept 25 by vast and quite sophisticated marketplace information of PConline, the largest portal in the PRC specialising in IT product-related content, in terms of advertising revenue. The type of SoC used in those products is shown in blue ink. A13 and A10 are from Allwinner Technology, while RK3066 is from Fuzhou Rockchip Electronics. Both are quite successful SoC companies founded in China. Information about these tablets will be given in section 3. The Teclast & Window tablets shown below are also available globally for $120 and $215 respectively.

image

Update: All three tablets essentially have kept their position up to now (Dec 3). The price of Teclast P75D even went down to ¥499 i.e. $80 at one of the dealers, three of the dealers have price between ¥594 and ¥599, i.e. between $95 and $96, while 5 others still selling it for ¥699 i.e. $112 by today’s exchange rate. This is showing clearly that the $99 pricing for the HAIPAD i7 is realistic even in terms of the hottest tablet of such kind on the mainland China market which has ¥646 i.e. $104 across all of its dealers on PConline.
At the same time the unchanged ¥259 i.e. $41.5 price of Andorra A713 clearly shows the fact that for a non-IPS 7” tablet with the Allwinner A13 SoC, essentially a constrained to 512M RAM version of A10 with no HDMI output, there is a well established entry-level price in China. Note that the A713 tablet has a capacitive multi-touch (5-point touch) screen, so it is not a kind of cheap resistive screen variety of tablets.
This whole story will end in section 7. with the even more dramatic development of a PCMCIA card (or as was renamed PC Card) format package called EOMA-68 (see: Embedded Open Modular Architecture), which contains a whole computer with an Allwinner A10 SoC, 1GB of RAM, 1 to 16 GB of NAND Flash etc. All this for a target price of $15. Almost all interfaces available of the Allwinner A10 SoC have been made available on the 55x85mm credit-card-sized card, including both Transport Streams, SIM Card, PATA, the 24-pin Camera Interface, both 24-pin LCD Interfaces, VGA, Composite Video (CVBS), SPDIF, AC97, I2S, GPS, CAN-Bus, Infrared, and many more. This is in addition to the standard EOMA-68 Interfaces of Ethernet, I2C, SATA, LCD 24-pin RGB/TTL, USB2 and 16 GPIO pins.
While this is a FLOSS-related initiative rooted in UK, the hardware part is fully based on mainland China companies, including Allwinner Technology. What is the benefit for the FLOSS-people could be much more for the Chinese industry network already moving along a much faster and more effective trajectory than the outside world. To me it can go as far as a SoC vendor like Allwinner Technology will be able to produce these type of cards as well which will significantly enhance the possibilities and worldwide competitiveness of the hundreds of independent manufacturers is Shenzhen, Zhuhai and elsewhere in PRC. As a consequence the consumer equipment prices could go down even more and/or functionaly, as well as quality, could be risen even more.
Meanwhile the SoC and subsequent Android tablet competition is intensifying very-very fast inside PRC as evidenced by this latest Overview of the latest/best 7″ Tablets out of Shenzhen China [Charbax YouTube channel, Oct 28, 2012]:
Here’s my overview video showing some of the latest best value 7″ Android tablets that I have found in Shenzhen on this trip. At least the samples that I was able to buy. [IN BULK PRICES, i.e. in 1K orders at least:] $40 A13 800×480, $65 RK3066 1024×600, $80 Nufront NS115 1024×600 IPS, and there’s also the sub-$50 VIA 8850 (which can run a Windows RT clone UI on top of Android), and I compare these with the $199 Kindle Fire HD
Finally there is an even stronger newcomer, Nufront already on the Chinese SoC market, also posing the greatest challenge to Allwinner for the next year as it stands on Nov 1. We are talking about the Taishan platform with:
The NS115 mobile computing chip, a dual-core ARM Cortex™-A9 MPCore™ processor up to 1.5GHz and Mali™-400 MP GPU implementation, features 1080P HD encode/decode and support of Android 4.0
which justifies a whole section of its own to describe the whole strength of:
8. The Nufront challenge coming from inside

All those finding are compiled into this very large composite post on my trend-tracking blog here, which has the following sections with final names reflecting better the individual section contents as:

    1. The new challenge
    2. A proper recollection of what happened to Intel’s memory business
    3. The market and industry situation reflecting this new inflection point
    4. The Allwinner advantage 全志
    5. The wireless display and 2160p (“Quad HD”/4K) outlook
    6. Are the established client device players recognizing this strategic inflection point or not?
    7. Possible further hardware advances sustaining this new trajectory
    8. The Nufront challenge coming from inside

      Please go through those compiled sections at least by reading the emphasized texts which I’ve put everywhere to make fast reading possible.

      Note as well that section 2. is also on a new blog of mine, USD 99 Allwinner, as an expanded version standing on its own and made accessible from every post there via It’s a Strategic Inflection Point page.

      Finally, on this new blog you will find the USD 99 Allwinner page as well which, besides providing the rationale for the naming and the existence of that blog, will summarize my current (Dec. 1) opinion about the mobile device market for 2013, especially the threat which may force Microsoft and Intel to adjust their current strategies radically.


      1. The new challenge

      HAIPAD I7 IPS 1024*600 Multitouch Screen with Android 4.0 Dual Camera 1080P HDMI [Merimobiles.com, Sept 10, 2012]

      List Price: $269.99   Your Price: $99.99  [with free shipping worldwide]
      [when it became available in April’12 it was briefly $137.99 already]
      [more tablets of this kind coming to the market too, e.g. the $99 Dragon]

      Haipad i7 Android ICS 7” capacitive IPS Thin Tablet Review – Allwinner A10 Merimobiles ColonelZap [SchlumpfiHB YouTube channel, April 15, 2012]
      The only cons are that the cameras are “really, really bad”

      TECH SPECS:

      Warranty:
      – 1 Year, click here for details
      CPU:
      Allwinner A10 1.2 GHz
      OS:
      – Android 4.0.3
      Memory:
      1GB DDR3 Ram, 8GB Nandflash built in
      – Extend Memory up to 32GB via micro sd card
      Screen:
      – 7 inch IPS 5 points Capacitive Multitouch
      – 1024*600
      Audio:
      – Stereo Speaker
      – 3.5MM headphone jack
      – Supports: AAC, AAC+, eAAC+, AMR-NB, AMR-WB, QCP, MP3, WMA, WAV, MIDI, M4A
      Video:
      1080P,WMV/ASF/MP4/
      3GP/3G2M4V/AVI/MJPEG/RV10/DivX/
      VC-1/MPEG-2/
      MPEG-4/H.263/H.264
      – 1280*720P HD 30 fps, 1080P,720*480 D1 30fps
      – Real-time Video decode
      Camera:
      Front 0.3MP camera,
      back 2.0MP
      Battery:
      – 3600mAh
      Features and highlights: – Allwinner A10
      – 8GB Nandflash
      – 3D G- Sensor
      – 802.11b/g,support WAPI
      – Capacitive touching panel multi-point( 5 point touch)
      – OTG and host expand
      – USB2.0 data transfer
      – Micro 5pin USB
      – Supports mouse, external keyboard
      HDMI output
      – Multilanguage support
      – Excellent Ebook reader
      – Weather on line
      – Web Browser
      – Slim body
      – Sound Card:AC97
      – 196.3*122.3*8.5mm
      – standby time:36 hours
      – working time:4~5hours (play video online)
      Package Content:
        • HAIPAD I7
        • Earphone
        • USB Cable
        • Charger
        Color:
          • Gray
          Language:
          • English
          Regarding the multimedia capabilities I will suggest to go through a review of a similar tablet: MPMan MID74c (NATPC Primatab 7″) tablet review part 3: multimedia and HD video playing capabilities (Boxchip Allwinner A10) [ARCHTABLET NEWS, May 25, 2012]. Two videos are included there as well!

          As you can see this process was well visible much earlier, in the beginning of Q2 2012 at the latest. Besides the September milestone of reaching the $99 cost with such a high-quality IPS tablet, another impetus for me to write this post was a last Sunday’s article titled Hardware is dead [VentureBeat, September 15, 2012]:

          I go to China every four or five months for work. I have to visit all the corporate headquarters in Beijing and Shanghai, but the highlight of every trip is the day I spend at Hua Qiang Road North in Shenzhen. Pretty much every piece of electronics we use today is sourced and manufactured within 100 miles of Shenzhen, and Hua Qiang is the city’s electronics shopping district.
          On my last trip, in July, I met a ‘procurement’ consultant, and he told me which of the 50 mega malls in the area to visit to buy tablets.
          In the US, when we talk about tablets we usually mean the iPad and increasingly the Kindle devices, but beyond that there is not much else in the market. I had heard that tablets in China had already reached low price points. You can buy a reasonable Android phone for $100 retail, and I wanted to see if I could find a $150 tablet. This consultant pointed me to a mall filled with hundreds of stalls selling nothing but tablets. I walked into the middle of the scrum to a random stall. I pointed to one of the devices on display and asked, “How much for this one?” 300 kuai. My Mandarin is a bit rusty, so I had to ask again. Slowly, the stall owner repeated renminbi 300 yuan.
          If this were a movie, the lights would have dimmed and all the activity in the room frozen. 300 renminbi is US $ 45. And that was the initial offer price given to a bewildered foreigner in China, no haggling. I felt a literal shock.
          I bought the device and did some more research. This was a 7-inch tablet, Wi-Fi only with all the attributes of a good tablet. Capacitive touchscreen. Snappy processor. Front facing camera. 4GB of internal memory and an expandable memory slot.
          I later found out that these devices are now all over the supply chain in Shenzhen. At volume, say 20,000 units, you can get them for $35 apiece. My device ran full Android 4.0 Ice Cream Sandwich and had access to the full Google API, including Gmail, Maps, YouTube and Google Play (not quite sure how that works either).
          Once my heart started beating again, the first thing I thought was, “I thought the screen alone would cost more than $45.” My next thought was, “This is really bad news for anyone who makes computing hardware.”
          My contacts in the supply chain tell me they expect these devices to ship 20 million to 40 million units this year. Most of these designs are powered by a processor from a company that is not known outside China — All Winner [Allwinner]. As a result, we have heard the tablets referred to as “A-Pads.”
          When I show this tablet to people in the industry, they have universally shared my shock. And then they always ask “Who made it?.” My stock answer is “Who cares?” But the truth of it is that I do not know. There was no brand on the box or on the device. I have combed some of the internal documentation and cannot find an answer. This is how far the Shenzhen electronics complex has evolved. The hardware maker literally does not matter. Contract manufacturers can download a reference design from the chip maker and build to suit customer orders. If I had 20,000 friends and an easy way to import these into the US, I would put my own name on it and hand them out as a business cards or Chanukah gifts.
          I think this leads to an important conclusion: No one can make money selling hardware anymore. The only way to make money with hardware is to sell something else and get consumers to pay for the whole device and experience.
          Postscript
          I thought discovering the A-Pad was pretty exciting. So I was dismayed to find that the week after I got back from China, a device that looks a lot like my A-Pad was on sale at Fry’s Electronics for $79. No brand listed. The process has already begun.
          Jay Goldberg is a financial analyst with an investment bank. He has been working with tech companies for ten years. Prior to that he lived and worked in China for almost 10 years.

          A morale of this story is not the one written in the title of the article, i.e. it is not true at all that “hardware is dead”, rather we are witnessing again an old phenomenon first discovered by Intel’s Andy Grove back in the 80’s and coined with a term “[strategic inflection point]”. With no proper representations in places like Wikipedia (don’t confuse with mathemetical concept only included there) you better search the web with the phrase:

          “Andy Grove” “inflection point” Japanese “memory chips”

          For me the best quote for my initial purposes here is from the permitted excerpt of Andy Grove’s famous Only the Paranoid Survive [Sept 1, 1996] book, reformatted for more immediate recognition of the intended meanings as follows:

          I’ll describe what a strategic inflection point is a bit later in this book. For now, let me just say that a strategic inflection point is a time in the life of a business when its fundamentals are about to change.  That change can mean an opportunity to rise to new heights.  But it may just as likely signal the beginning of the end.
          You can be the subject of a strategic inflection point but you can also be the cause of one. Intel, where I work, has been both
            • In the mid-eighties, the Japanese memory producers brought upon us an inflection point so overwhelming that it forced us out of memory chips and into the relatively new field of microprocessors.
            • The microprocessor business that we have dedicated ourselves to has since gone on to cause the mother of all inflection points for other companies, bringing very difficult times to the classical mainframe computer industry
              Having both been affected by strategic inflection points and having caused them, I can safely say that the former is tougher.

              Next I should give a brief explanation for “changing fundamentals of a business”. As is obvious from the recollection given below (section 2.) there were certain assumptions on which Intel’s original DRAM business was based upon. These assumptions were questioned by its Japanese competitors entering the lucrative DRAM market, first time winning against Intel in 1979 with better manufacturing yields and then by 1982 in terms of overall manufacturing competence as well. Equally important was that Intel was not able to remedy the situation although the symptoms were well recognized and seemingly effective actions were taken as well.

              Please study that recollection first and then the sections which follow after that and which describe the observable facts about this very latest strategic inflection point. You will be able to both understand the current situation properly (unlike the investment analyst quoted above) as well as to predict the possible outcome of this inflection point for the ICT industry as whole (with the highest probability possible at all). I wish you good reading!

              From the brief understanding of the new challenge as given above I should also paraphrase my remaining points of study as:

              2. A proper recollection of what happenned to Intel’s memory business
              3. The market and industry situation reflecting this new inflection point
              4. The Allwinner advantage
              5. The wireless display and 2160p (“Quad HD”/4K) outlook
              6. Are the established client device players recognizing this strategic inflection point or not?
              7. Possible further hardware advances sustaining this new trajectory


              2. A proper recollection
              of what happened to Intel’s memory business

              Exerpts about the factual evidence are taken from the following scientific article:
              A PROCESS MODEL OF STRATEGIC BUSINESS EXIT: IMPLICATIONS FOR AN EVOLUTIONARY PERSPECTIVE ON STRATEGY [Robert A. Burgelman, Strategic Management Journal, Vol. 17, 193-214 (1996)] (available here for download)

              Table 1. Key events in the evolution of DRAMs at Intel: 1970-85
              1970
              E1. Intel introduced the first 1K (kilobit) dynamic random access memory (DRAM) in volume. The product used the new metal-oxide semiconductor (MOS) process technology. This process technology was relatively slow but less power consuming than the standard bipolar process technology. Intel was the first successful mover in DRAMs.
              1972-74
              E2. Intel introduced 4K DRAMs. Intel captured more than 80% of the 4K DRAM market in 1974.
              E3. The first competitive challenge came from Mostek, a new startup. Mostek focused on user-friendliness of DRAMs in the 4K DRAM generation.
              1976-77
              E4. Intel introduced a standard 16K DRAM. Intel captured more than 35% of the 16K DRAM market in 1976.
              E5. The competitive challenge from Mostek and others continued. By 1979, Intel’s market share in standard 16K DRAM was less than 5%.
              E6. High demand for EPROMs created a shortage in Intel’s manufacturing capacity. For the first time, DRAM manufacturing capacity was shifted toward the higher-margin EPROM products.
              1979
              E7. Intel introduced the first 5-volt ‘single-power-supply’ 16K DRAM. Single-power supply greatly simplified the user’s design and production tasks. In 1979, Intel was the only supplier of single-power-supply 16K DRAMs and captured a price premium of double the industry average for three-power-supply 16K DRAMs.
              E8. Intel expected the 64K DRAM generation to be introduced later and to be based on single power supply. Fujitsu introduced a standard 64K DRAM in 1979 and captured a large market share.
              E9. The single-power-supply 16K DRAM remained a small-niche product.
              E10. Intel fell behind in manufacturing yields relative to top Japanese producers of DRAMs (Prestowitz, 1988: 46).
              1982
              E11. Intel’s 64K DRAM with ‘redundancy’ entered production. Redundancy involves adding an extra column of memory elements so that, in the event of a process-induced defect, the auxiliary column could be activated. This allows a defective memory chip (at testing) to be reprogrammed before shipment and to increase yields. Intel expected that ‘redundancy’ would help overcome its disadvantage in manufacturing yields relative to the Japanese, and that the 256K DRAM generation would be based on the redundancy process technology.
              E12. However; Fujitsu and Hitachi entered with a standard 256K DRAM in 1982 and captured a large market share.
              E13. Intel was now far behind in manufacturing competence relative to the Japanese.
              March 1985
              E30. COO Andy Grove felt strongly that the burgeoning logic (microprocessor) business needed to get more resources
              Summer 1985
              E34. The General Manager of the Components Group stepped down and was reassigned to another business area. Andy Grove assumed direct operational control over the DRAM exit process. He assigned two senior managers to immediately and fully implement the DRAM exit decision.
              October 1985
              E35. The decision was reached to close Fab 5 for DRAM production. Fab 5 was to be transformed into a process technology site for microprocessors. Animosity and mistrust between manufacturing and process technology personnel flared at Fab 5.
              E36. Andy Grove went to Portland to speak to the group: ‘Welcome to the Mainstream Intel’. That is, Intel the ‘microcomputer company’.

              Intel’s initial success in the 1K (kilobit) DRAM (1971-73) was due to the ability of its technologists to come up with a process technology that allowed production yields sufficiently high to beat magnetic core memory, which was the industry standard of the day, in the market (E1). Process technology was therefore viewed by Intel management as the firms’ ‘distinctive competence’ (Selznick, 1957) on which its ability to differentiate its products and get a premium price depended (E7, E11, E18, E22). Having maintained leadership in the 4K DRAM generation (1972-76) (E2, E3), Intel’s process technologists came up with the first 5-volt single-power-supply 16K DRAM in 1979. Intel process technologists decided to focus on the single-power-supply 16K DRAM because they projected a relatively long life cycle for the 16K generation due to the technological challenges posed by the 64K generation (E18). They also believed that the single-power-supply process would eventually dominate the memory industry. They considered it too risky to tackle both the 64K DRAM generation and the single power supply in the same product.
              While it is usually difficult to observe distinctive competence independent of the successful product with which it is associated, and the risk of tautology is high, Intel’s pattern of strategic actions offers the opportunity to make independent observations. When changes in the DRAM industry structure shifted the basis of competition from process technology to largescale precision manufacturing, Intel continued to rely on process technology to compete in four successive product generations. The first independent observation concerned the 16K DRAM generation. But, as documented below, inertial deployment of process technology competence was also observed in the 64K, 256K, and 1 Meg (megabit) product generations. Paradoxically, the distinctive competence that provided Intel with its initial competitive advantage became a source of failure later on.
              Falling behind reinforces the impetus process
              Falling behind in the market made it difficult for the DRAM business managers to compete with Intel’s other businesses for resources. Business managers had tried to reposition Intel’s single power-supply 16K DRAM as a niche product that would fetch a higher unit price (‘2x’). They had expected that eventually the whole 16K market would have to go for single-power-supply. This did not happen for the 16K generation, however, and further impetus for exit was gained when the strategy to reposition Intel’s DRAMs as niche products failed (E9; Cogan and Burgelman, 1990).
              Repositioning
              Intel was already late in the 64K generation and Japanese companies had entered the DRAM market in 1979. In addition, Intel’s 64K product design was flawed and expected to result in uncompetitive low manufacturing yields (E10). The DRAM process technology group responded by introducing a new process technology called ‘redundancy’, as a way to overcome the low yield problem (E11). This new process, however, had a major defect which showed up late in its development. Intel introduced its 64K DRAM with redundancy only in 1982. These delays were fatal for Intel’s strategic position in the 64K generation. A former General Manager of the Memory Components Division (during the early 1980s) said that he took a 1-week trip to see the Intel sales engineers and explain that Intel would be late. He said (Cogan and Burgelman, 1990: 15):
              The sales force was very disappointed in the company’s performance. Any sales force wants a commodity line. It’s an easy sell and sometimes it’s a big sell. That trip was perhaps the most difficult time in my whole career. When I announced we would be late with the product, the implication was that Intel would not be a factor in the 64K generation.
              Having assessed that they were behind in the 64K generation, the DRAM process technology group took another gamble. They had come up with yet another innovative process technology—complementary metal-oxide semiconductor (CMOS)—which was to eventually supersede the standard n-channel MOS (NMOS) technology. They decided to apply the CMOS technology to a new 64K DRAM product as well as in the 256K generation (E16). This raised the difficult question for the memory components division about how to effect the transition from NMOS to CMOS. The NMOS products had been made at the Chandler (Arizona) facility, but that capacity had been shifted to microcontrollers based on the maxmize margin-per-wafer start rule. In early 1984, the decision was made to phase out the NMOS line (E17).
              The former General Manager of the Memory Components Division (during the early 1980s) said that the new business strategy was to reposition Intel in DRAMs. The idea was to create a niche market with premium pricing for 64K and 256K CMOS products, so that Intel could maintain a memory presence while accelerating back into an overall leadership position at the 1 Meg (Megabit) generation. But for both the 64K and 256K DRAM products, the innovative solution did not produce competitive advantage. The large majority of customers for the 64K generation were looking for standard products of high quality (few defect devices) at low prices. Japanese companies provided what customers wanted at very low prices. The Japanese had introduced standard 256K DRAMs in 1982 (E12), and Intel had fallen far behind the Japanese in manufacturing yields (E13). Intel entered with its CMOS 256K product only in 1984, and it remained a small niche product. The former General Manager of the Memory Components Division (during the early 1980s) said that standard DRAMs were being sold at less than half of the price Intel was asking, and the improved performance of the CMOS chips just wasn’t worth it to most customers. Intel’s repositioning effort resulted in completely losing strategic position in the DRAM market. Intel’ s market share shrunk from more than 80 percent in the 4K DRAM generation in 1974 to less than 1 percent in the 256K DRAM generation in 1984 (Cogan and Burgelman, 1990). Repositioning thus failed to reestablish Intel as a key player in the industry. Also, prices for the niche products were lower than expected, making it harder for DRAMs to compete with other products for Intel’s scarce manufacturing resources.
              The Director of Technology Development observed that Intel’s DRAM business had entered a ‘death spiral’. In the face of strong competition from Japanese manufacturers, business managers’ focus on the more profitable products and technology development’ s preoccupation with leading-edge processes contributed to missing the
              DRAM mainstream market. This led to cutbacks in manufacturing capacity and budgets which made it even more difficult to compete. This manager, in an interview in October 1988, anticipated a similar vicious circle (‘death spiral’) for EPROMs, which had also become a commodity product, and correctly foresaw the decision to exit from EPROM manufacturing, which happened in 1991.
              Strategic context
              For Intel’s top management, the strategic context of DRAMs had always been very clear. DRAMs had very strong legitimacy. DRAMs was the business that ‘made Intel’, as one senior manager put it, and some top managers, including the CEO, viewed DRAMs as a core business and one that served as technology driver on which the learning curve of the company depended. It was not easy for top management to admit that the legitimacy of DRAMs was vanishing. And it was difficult to decide to exit from DRAMs even though objective analysis seemed to suggest that this was the appropriate course of action in light of Intel’s strategic alternatives.

              3. The market and industry situation
              reflecting this new inflection point

              Let’s see first the latest market data by one global analyst companies, IDC:image 
              Source: IDC Expects Smart Connected Device Shipments to Grow by 14% Annually Through 2016, Led by Tablets and Smartphones [IDC press release, Sept 26, 2012]

              According to the latest information from China the tablet market is quite underestimated by IDC:

              How many tablets does China make, how big is the Chinese market?
              80 percent of media tablets made in China are exported
              Unit: Million of units
              S
              ource: Chinese industry estimates

              as China alone will be delivering 50 million tablets this year and the overall Chinese estimate is 155 million units vs. 120 million per IDC:

              By volume, the Android tablet sector has grown to an estimated 80 million units, outpacing the 75 million iPads sold by Apple thus far, according to estimates by Rockchip [marketing] vice president Feng Chen.

              as reported by Junko Yoshida, ex-editor in chief of EE Times who now has a strong emphasis on China as “a roving reporter”: 

              in China Fabless: Rockchip rattled by Android tablet wars [Sept 25, 2012]
              Just nine months ago, Fuzhou Rockchip Electronics, a developer of apps processor for tablets, looked almost invincible. …
              … since then, the Android-based media tablet market has gotten far more competitive. By volume, the Android tablet sector has grown to an estimated 80 million units, outpacing the 75 million iPads sold by Apple thus far, according to estimates by Rockchip [marketing] vice president Feng Chen.
              At the beginning of 2012, the target price of a 7-inch capacitive screen media tablet featuring Cortex-A8 was $99. That price has since dropped to around $65, due largely to Allwinner, a red-hot Chinese fabless company that has flooded the tablet market with its own turnkey system. … Rockchip’s situation vividly illustrates the challenges most Chinese fabless chip companies now face.

              During a recent interview with EE Times here, Rockchip’s Chen said, “This is a new world war we’re fighting.” … Indeed, nearly every apps processor [sic, SoC] vendor here is in a rough spot because “the time-to-market requirement has gotten much shorter,” he noted. “Worse, catching the market rhythm or cycle — at the right time – has become much harder.”

              “… now, as end-product cycles get shorter, we do everything from designing a chip to developing a board and software that goes around the hardware — literally within a couple of months,” he explained. In March, for example, Rockchip started to design its RK3066, a dual-core Cortex A9 chip with a quad-core Mali-400 GPU. By April [15], it hustled to showcase sample tablets based on the chip at the Hong Kong Electronics Fair. By May, the company began shipping the new apps processor to its customers.

              Note regarding the timing of RK3066 SoC development:
              – The initial version of RK3066 datasheet brief is dated Oct 30, 2011. the 1.0 version of it February 15, 2012.
              – The RK30xx platform was announced on Feb 27, 2012 with information that “Dual-core ARM Cortex-A9 processor with up to 1.4GHz speed, implemented with Artisan Processor Optimization Pack (POP)” and that “Samples of the Rockchip RK30xx platform will be available in March 2012.”

              Unlike other startups here, Rockchip has been profitable from the start. But as the tablet battle heats up, it also needs to find a way to move to the next level. “We are fighting a world war. We need the world’s top talent.”
              The company also needs access to capital. Without it, Rockchip can’t even think about mergers or acquisitions. Organic growth alone won’t get it to the next level, Chen acknowledge, saying he expects consolidation in the Chinese fabless sector but “no Chinese companies want to give up.” 
              Lastly, Chen said, “We need to be clear on the market” so that Rockchip can choose its battles.

              Another of her observation:

              Yoshida in China: How Nokia failed, MediaTek won [Sept 26, 2012]

              Earlier this month when I sat down for breakfast here with Feng Chen, vice president of China fabless company Rockchip, he abruptly asked if I knew the “80-3-2 rule.” I had never heard of it.
              The subject came up as we were discussing the global media tablet market. Chen, who noted that this is his personal theory, not Rockchip’s, explained: If you design a system (or chip) with performance of at 80 percent compared to the best-in-class product on the market, and if you offer it at one-third the price, you can double the sales volume of your system (chip).
              Chen used the media tablet market as an example. Many Android-based tablets with relatively less performance than Apple’s iPad, will eventually exceed sales of iPad in volume, he argued.
              In other words, don’t over-engineer it.
              Android, along with outsourcing and faster product turnarounds are the key elements that make the 80-3-2 rule possible. The rule also offers a mechanism for getting products in the hands of consumers.
              Source: IHS iSuppli
              Does the 80-3-2 rule make sense? Sort of.
              The chart above illustrates the theory’s flaw: While Apple gets all the profits generated by the iPad, sales revenue for the Android camp is divvied up by many me-too Android tablet and chip suppliers.  Presumably those companies, all subscribing to the 80-3-2 rule, are fiercely undercutting one another, further reducing their margins.
              So, the 80-3-2 rule is simplicity itself, but it doesn’t look sustainable to me.
              Chen’s theory reminded me of something else. The Economist carried a story about “frugal innovation.” The article cited companies like General Electric and India’s Tata Consultancy Services (TCS) that developed new products like a hand-held electrocardiogram (by GE) and a water filter (TCS).
              “Instead of adding ever more bells and whistles, they strip the products down to their bare essentials,” embarking on “frugal innovation,” or as it is sometimes called, “reverse innovation,” the Economist explained.
              According to the Economist, “Frugal innovation is not just about redesigning products; it involves rethinking entire production processes and business models. Companies need to squeeze costs so they can reach more customers, and accept thin profit margins to gain volume….”
              Therein are the dots we can use to connect to Chen’s theory. His 80-3-2 rule also addresses the issue of how a company finds a way to develop a product and a business process to squeeze costs, gain volume and reach millions of new customers.
              (Full disclosure here. The Economist article was first pointed out to me by a U.K.-based engineering executive who works for Taiwan’s chip giant MediaTek. He was explaining how MediaTek’s recent success has a lot to do with “frugal innovation.” MediaTek, virtually unknown 10 years ago, is now a power house with huge market share in the Chinese smartphone  and media tablet markets.)
              MediaTek has fundamentally changed the playbook for the chip industry here, especially for smartphones and tablets. More chip suppliers for smartphones and tablets who are competing with MediaTek are now expected to provide similar “turnkey systems” that MediaTek delivers, rather than just reference designs.
              Technology development, especially in the electronics industry, has historically been one-dimensional. It all pretty much comes down to how your engineering team makes a system operate faster, run more apps and features, while consuming less power.
              Frugal, or reverse, innovation and the 80-3-2 rule both suggest that it’s time to rethink innovation in more in multi-dimensional terms.
              I can think of two good examples for how ignoring reverse innovation costs companies. … Nokia … Japanese LCD TV manufacturers like Sharp …

              Her latest report continues with Yoshida in China: ‘Shanzhai’ clouds tablet data [EE Times, Nov 8, 2012]

              NEW YORK – The global tablet market may be a lot bigger — perhaps as much as 50 percent bigger — than previously thought depending on how you measure the increasing numbers of “Shanzhai” tablets produced in China.
              Loosely translated, “Shanzhai” means white box, as in, no label. These tablets manufactured in China are distinguished from “knockoff” products, which the original Chinese term “Shanzhai” suggests.
              Earlier, I wrote about the global market for tablets during the third quarter of this year. According to estimates, shipments reached 27.8 million units.
              Several industry sources based in Beijing and Shenzhen responded with notes  saying that the math behind the industry estimates didn’t add up. The Chinese observers argue that most estimates ignore the size of the white box tablet market. 

              Factoring in the number of apps processors shipped by Chinese fabless companies and tablet displays from its panel vendors, the number of white box tablets made in Shenzhen during the third quarter could total as high as 18 million units, Chinese sources claimed. 

              Add those to the branded tablets sold by Apple, Samsung, Amazon, Asus and Lenovo and the global tablet market in the third quarter jumps to 42.5 million units. That’s 52 percent more than the global total estimated by IDC in 3Q.
              This huge gap makes me wonder what other Chinese consumer electronics products are uncounted or under-counted.

              One thing to take into account is Chinese fabless chip company Allwinner Technology — how it operates and and how it has taken advantage of the growing white box market.

              The  applications processor vendor has substantially expanded its market share over the last 18 months, primarily based on the strength of its turnkey system that has been described as “super easy to use” by Chinese industry sources. The solution allegedly makes it a snap for practically any white-box vendor to make media tablets and ramp up production in a Shenzhen minute.

              According to sources in Shenzhen, Allwinner holds as much as 60 percent of the white box market and shipped 3.5 million apps processors in August alone. Allwinner is said to have shipped 5 million apps processors in October, generating $30 million revenue (at a $6 average selling price). If true, wow!

              The momentum behind white box tablet production in Shenzhen is building. Chinese sources now believe shipments have climbed from 6 million units in August to 9 million in October.

              Who’s buying all these tablets?

              A source in Beijing describes them as “tablets shipped by no-name brands at about $50.” The end market is not necessarily China, but “mostly emerging economies including Southeast Asia, the Middle East, Eastern Europe, South America and Africa, etc.” He added that Chinese consumers “have similar tastes and demands as those living in the developed world. They don’t really buy these low-end tablets. They buy iPad or Samsung.”

              If true, we may need to rethink not just the size of the booming tablet market, but the consumer revolution triggered by the tablet market well beyond China’s border.
              The lack of recognizable brand names makes it that much harder to track unit shipments. Plus, chip shipment figures can be inflated or double-counted. Then there is China’s vast gray market.
              Even taking all of those factors in account, the explosion of tablets in emerging markets is no mirage – and it might be spreading much faster than any one imagined.
              For example, one source in Shenzhen estimates that  annual shipment of white box tablets this year could hit 50 million units.

              With all that she (Junko Yoshida) came closest from the West to understand the new ICT phenomenon rooted in China. Now let’s look at what others have come to so far:

              The overall tablet market trend is illustrated by IHS iSuppli via the tablet display shipments as follows: 

              image

              then it is described in Global Tablet Display Shipments to Soar by 56 Percent in 2012 [IHS iSuppli press release, Sept 17, 2012] as:

              … [the first part of the press release is essentially giving information which is represented by the diagram above] …

              LG and Samsung Dominate Tablet Display Shipments
              LG Display and Samsung Display were the main suppliers of tablet displays in the first quarter with 42 percent and 38 percent shipment market share, respectively. Both are market leaders because they make the liquid crystal display (LCD) panels that are used in the iPad, which continued to dominate the media tablet space with a commanding 58 percent of all tablets shipped in the first quarter.
              [LG Display holds 70% of iPad panel shipments [DIGITIMES, Sept 20, 2012]: while Samsung Electronics, Sharp and Chimei Innolux (CMI) have all been seeing decreasing shipments … CMI will make up less than 5% of overall iPad panel shipments by the end of the third quarter in 2012.]
              Aside from supplying Apple, LGD also furnishes display panels to Amazon and Barnes & Noble, while Samsung provides panels to its internal tablet division. Investments are being made by the two major tablet panel suppliers in capacity allocation and technological improvements to supply high-performance tablet panels and to develop wide-viewing-angle technologies like in-plane switching (IPS) and fringe-field switching (FFS). Both LGD and Samsung Display are also looking to convert amorphous-silicon fabs into making oxide silicon panels to help improve tablet panel resolution, power consumption and overall performance.
              Panel Manufacturers Enter the Tablet Panel Fray
              Other LCD panel suppliers also are jumping into the fast-growing tablet market. In particular, Japanese suppliers such as Sharp, Japan Display and Panasonic are actively targeting the tablet panel market by dedicating capacity at their Generation 6 and Generation 8 fabs in order to make tablet panels.
              Together the capacity allocation this year for small and medium displays by the Japanese is expected to increase 164 percent from last year’s levels, reaching 5.5 million square meters in 2012. Of particular interest is the oxide silicon capacity at Sharp, which has been supplying panels from its G8 fab for the latest iteration of the iPad—also called the new iPad. Another company, Panasonic, is likely to produce 7.x-inch and 8.x-inch tablet panels during the second half of this year.

              For their part, LCD suppliers based in Taiwan, such as AU Optronics and ChiMei Innolux, reportedly are adjusting their business models—some to focus on tablets for the education sector, and others to supply tablets for the white-box market in China.

              It is believed that AUO may be one of the suppliers qualified to supply the smaller iPad’s 7.85-in panels.

              But unlike Tier 1 tablet display makers LGD and Samsung Display, Taiwanese panel suppliers primarily target the Chinese market that is geared more toward lower-priced tablets. To meet lower price points, display specifications are usually dialed down compared to Tier 1 products. Displays targeted at the white-box tablet market in China mainly employ the more basic twisted nematic (TN) LCD, not the wide-viewing-angle LCD technologies of IPS and FFS.

              Regardless of the display technology and market segment, display suppliers are making sure they align their strategies to serve this fast-growing market.

              Chimei Innolux to Win 40%-50% Share of White-brand Tablet PC Touch-panel Market [CENS, Aug 15, 2012]

              Chimei Innolux Corp., the largest thin film transistor-liquid crystal display (TFT-LCD) panel manufacturer in Taiwan, is expected to win a 40% to 50% share of the global market for white-brand tablet PC applications, according to the company.

              Some 40 million to 60 million white-brand tablet PCs are expected to be shipped this year, similar to the total shipments of Apple`s iPad.

              Major market research firm DisplaySearch recently forecast that some 121 million tablet PCs would be shipped worldwide this year, and the annual volume would increase to 416 million units in 2016, in conjunction with a compound annual growth rate (CAGR) of 28% over next five years. Apple would continue to be the market leader in next five years with a market share of 60%, while white-brand counterparts are expected to enjoy high growth due to their advantageous pricing.
              Jeff Hsu, Chimei Innolux`s vice president, pointed out that demand for white-brand tablet PCs from emerging markets has been quite strong this year. In addition to sales in China, many Chinese white-brand tablet PC makers also export products to other nations. So, the annual demand for touch panels for white-brand tablet PCs this year is expected to reach some 60 million units, with 7-inch models as the mainstream and followed by 10-inch ones. Chimei Innolux aims to ship more than 25 million touch panels for white-brand tablet PCs, accounting for 40% to 50% of the application market, Hsu said.
              Hsu also added that this year, the mainstream touch-panel type in tablet PC application has shifted from resistor to capacitive, which is expected to benefit many Taiwanese suppliers with more advanced technology. Jtouch Corp. of Taiwan, for example, is stepping up boosting production capacity of its new touch-panel factory in Hunan Province of China. The firm`s large-sized touch panels are expected to account for more than 20% of its revenue this year. Mutto Optronics Co., Ltd. recently also won big-ticket orders for tablet PC touch panels, and expected to see a 30% sequential revenue growth in the third quarter.
              Google recently pushed its Nexus 7 tablet PC priced for only US$199, and the company immediately sold out one million units. A white-brand tablet PC with 7-inch screen is often priced for about US$100 only, and such more affordable device has won very hot market responses in Latin America, Southeast Asia etc. Currently, monthly tablet PC shipments in China are between three million and four million units.

              However in Tablet PCs will have good sales in the third quarter [Micdigi from China, July 19, 2012], from a knowledgeable source in Shezhen:

              In the first quarter of 2012, the manufactures have good business, but in the second quarter they have so worse business.
              As they have produced so many products in the first quarter, they have large stock of goods that they have to mark down price to sell them.
              In the second quarter of 2011, the tablet PCs has good sales. But in this year, it is so cold.
              In the third quarter, tablet market will rebound.
              VIA chips was the winner in all the chip manufactures last year.
              But in this year, Allwinner with high cost/performance chips gets the winner.
              Most of Shenzhen tablet manufactures export to other countries. Because Chinese do not like knock off tablet PCs or SurperPad tablet PCs, they like brand ones.
              In the third quarter, the tablet market will rebound and the fourth quarter will be the boom season.
              I think the manufactures must get ready for the fourth quarter.
              They had better prepare products with high cost performance.

              This is one of the reasons why Nexus 7 not yet allowed to enter China market [Sept 11, 2012]:

              While the Nexus 7, the tablet co-developed by Google and Taiwan-based vendor Asustek Computer, has been witnessing booming sales in major markets around the world, it is difficult for the model to be available for sale in the China market because the China government has not yet approved its import, according to industry sources in Taiwan.
              The China government’s negative attitude is interpreted as a response to Google’s announcement of withdrawing from the China market in March 2010, the sources pointed out. It is difficult for the Nexus 7 to enter the China market, even through sale of Asustek’s marketing network there, the sources indicated.
              Without the Nexus 7 in the market, China-based white-box vendors of tablets are under much less competitive pressure, the sources indicated. This is because the Nexus 7 has the advantage of Google’s and Asustek’s brand image with commensurate product quality and is expected to be strongly competitive with 8GB Android 4.0 tablet models in the 7- to 9-inch range launched by China-based white-box vendors, including Ainol, Onda, Teclast and Cube, at US$149, the sources pointed out. In addition, the Nexus 7 will bring competitive pressure on tablet PC models of equal specifications offered by Samsung Electronics and China-based vendors Lenovo and Hasee Computer in the China market, the sources indicated.
              Without the China market, the cumulative global sales volume of Nexus 7 will reach an estimated 3.5 million units at the end of 2012, the sources noted.

              Tablet Shipments to Surpass Notebook Shipments in 2016 [NPD DisplaySearch press release, July 3, 2012]

              Total Mobile PC Shipments Exceed 800M Units by 2017
              Tablet PCs, such as Apple’s iPad, are expected to be the growth driver for the mobile PC market over the next few years. Tablet shipments will surpass notebook shipments in 2016, according to the latest NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report. Overall mobile PC shipments will grow from 347M units in 2012 to over 809M units by 2017.
              While notebook PC shipments are expected to increase from 208M units in 2012 to 393M units by 2017, tablet PC shipments are expected to grow from 121M units to 416M units in this period, for a compound annual growth rate of 28%. A key driver for tablet PC growth is adoption in mature markets (including North America, Japan and Western Europe), which will account for 66% of shipments in 2012 and remain in the 60% range throughout the forecast period. Tablet PC shipments into mature markets will grow from 80M units in 2012 to 254M units by 2017.
              Figure 1: Worldwide Mobile PC Shipment Forecast (000s)

              Source: NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report
              “Consumer preference for mobile computing devices is shifting from notebook to tablet PCs, particularly in mature markets,” said Richard Shim, senior analyst at NPD DisplaySearch. “While the lines between tablet and notebook PCs are blurring, we expect mature markets to be the primary regions for tablet PC adoption. New entrants are tending to launch their initial products in mature markets. Services and infrastructure needed to create compelling new usage models are often better established in mature markets.”
              Figure 2: Emerging and Mature Market Tablet Shipments (000s)

              Source: NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report
              Building upon convenience-oriented features including instant-on capability, long battery life and extreme portability, tablet PCs are expected to evolve in form factor and performance, making them a compelling alternative to notebook PCs. Tablet PCs are expected to incorporate multi-core processors, increasingly stable operating systems, growing app libraries and higher resolution displays.
              In addition, notebook PCs are also evolving to meet the challenge from tablet PCs. Thinner form factors, higher resolution displays and touch functionality features are expected to increase. The notebook PC market will remain the largest part of the mobile PC market during the forecast period, accounting for 60% of mobile PC shipments in 2012, declining to 49% by 2017.

              Digitimes Research: China tablet SoC developers enjoy robust shipment growth in 2012 [DIGITIMES Research, Nov 20, 2012]

              There has been a surge in demand for tablet-use SoC solutions in the China market thus far in 2012, benefiting local IC design companies such as Allwinner Technology, Rockchip Technology and Amlogic, according to Digitimes Research. The tablet-IC market in China is dominated by local SoC developers, which mainly adopt the ARM architecture enabling a low-cost and easy-to-design platform.

              Shipments of China makers’ branded and white-box tablets destined for the local market are forecast to reach about 15 million units in 2012, while those destined for overseas will climb to as high as 44.15 million, Digitimes Research said. In total, shipments of China makers’ branded and white-box tablets are estimated at nearly 60 million units in 2012, Digitimes Research indicated.

              China’s white-box tablet companies will account for 81% of the overall units shipped in 2012, Digitimes Research said. Shipments of China’s brand-name tablet companies are set to reach only about five million units in 2012, Digitimes Research added.

              Europe, the Middle East, Southeast Asia and South America are the key markets which China-based tablet exporters will target in 2012, Digitimes Research noted. The exporters, mainly white-box makers, have their products sold through local distributors and telecom carriers in the target markets. [8%]

              Allwinner will unseat Rockchip as the top developer of tablet SoCs in 2012. Allwinner is forecast to ship a total of 22 million chips in 2012 [37%], while Rockchip‘s shipments will total 12.5 million units [21%], Digitimes Research said. Amlogic will rank third with shipments of 5.5 million units [9%],  followed by Taiwan-based VIA Technologies with 4.5 million units [8%], according to Digitimes Research.
              Source: Digitimes Research, November 2012

              Non-Apple tablets to drop to US$150-200 upon release of upcoming 7.85-inch iPad [DIGITIMES, Sept 18, 2012]

              Tablets priced US$199-400 are expected to drop in price to US$150-200 in order to help non-Apple tablet makers stay competitive when Apple releases its reported 7.85-inch iPad, according to industry sources.
              The sources are predicting that Apple will have a big influence on the 7-inch tablet market just like it currently has with its 9.7-inch iPad series and competitors will need to drop their tablet prices as well as provide more value-added features for the devices, said the sources.
              If major tablet makers were to drop product prices they would most likely not incur losses as many makers make a substantial amount of profits from 3G plans with telecommunication providers, added the sources.
              The sources still haven’t confirmed an exact release date for Apple’s 7.85-inch iPad but are expecting it will be early in the fourth quarter.

              MediaTek’s Q3 sales expected to beat company’s guidance [Focus Taiwan, Sept 16, 2012]

              … Bill Lu, a Morgan Stanley analyst in Hong Kong, expected MediaTek to ship over 200 million smartphone chips in 2013 by offering a more complete solution to Chinese handset. …

              Another upside factor for MediaTek is growing interest in “white-box” tablets in emerging markets, which could approach 100 million to 150 million units in 2013 and drive up MediaTek’s revenue if the company can tap into the supply chain, Lu said.

              A white-box tablet is a model without a registered brand name, which is usually sold more cheaply than branded tablets to gain traction among price-sensitive consumers.

              Global shipments of white-box tablet PCs to reach 40 million units in 2012, say chip designers [DIGITIMES, July 25, 2012]

              Forecast global shipments of white-box tablet PCs in 2012 have been upward adjusted from 30 million units originally to 40 million units due to growing demand in emerging markets including China, India, Thailand and Latin America, according to Taiwan-based design houses of ICs used in tablet PCs.

              An estimated 10 million white-box tablet PCs were shipped globally in 2011, and shipments increased to 18 million units in the first half of 2012, the sources indicated.

              Vendors/makers of white-box tablet PCs currently cluster in Shenzhen and Dongguan, southern China, the sources noted. A large portion originally made netbooks and have stepped into tablet PCs as chips and the Android operating systems have matured, the sources said.

              White-box tablet PCs are primarily competitive in price with models launched by own-brand vendors, with retail prices standing at US$59 for 7-inch models and US$149 for 10.1-inch models, the sources indicated.

              China white-box vendors showcase tablets at HK fair [DIGITIMES, April 16, 2012]

              Many China-based white-box vendors are showcasing 7.0-inch tablet PC models at shipment prices of US$65-80 and 10.1-inch models at US$100-110 at the 2012 Hong Kong Electronics Fair (Spring Edition) taking place during April 13-16.
              These white-box vendors include Dream Technology, Aocos, PCTX, HKC, Onn and Onda.
              These tablet PC models are equipped with chipset solutions mostly developed by China-based Allwinner Technology, Android 4.0, Wi-Fi modules, 4GB built-in memory, 800×480 or 1,024×600 16:9 touch screens, plastic casings. In addition, 9.7-inch tablet PCs equipped with IPS touch screens and metal casings are priced at US$130-140.
              If these tablet PC models are also equipped with 3.5G modules, shipment prices will increase by US$45 on average, according to white-box vendors.
              White-box vendors indicated that they have reached combined shipments of three million tablet PCs a month.

              China-based white-box tablet PC makers ramping up shipments, say sources [DIGITIMES, April 13, 2012]

              China-based white-box tablet PC makers have ramped up their combined shipments to three million units a month recently, and total shipments of tablet PCs by all makers are expected to top 50 million units in 2012, market research firm eMedia Asia has estimated.
              In Guangdong province alone, hundreds of small- and medium-size businesses have entered the development and production of tablet PCs on an OEM, ODM or OBM basis, according to industry sources.
              With the availability of Android 4.0 platform, white-box makers have rolled out tablets in 7-, 8-, 9.7- and 10.1-inch sizes with specifications catered to customer’s demand, said the sources, adding that the models target markets in the Middle East, Southeast Asia and Latin America.
              The white-box makers are able to deliver a 10.1-inch model, which runs on Android 4.0 and has a display resolution of 1024 by 600 and 4GB built-in storage, at FOB prices of about US$100-110, indicated the sources.
              Shipments of tablet PCs by China-based makers totaled 14 million units in 2011, eMedia Asia said.

              Suggested further reading: Here is a recent set of briefing documents produced by Seasize Technology Co., Ltd, formed in 2007 in Shenzhen China with roots in trading of electronic goods for export as early as 2005, see: Support [Seasize, Aug 20, 2012] 

              Download Free
              CHINA TABLET PC SOURCING GUIDE (English) [Aug 8, 2012]
              This is a guide to purchasing (“sourcing”) from China, and working with Chinese factories. It will probably be most helpful to people like me – entrepreneurs developing a new product or starting a new business that need to obtain parts and raw materials from China. It is written humorously, but hopefully there is some useful advice.
              CHINA TABLET PC WHOLDSALES MARKET 2012(English) [Aug 7, 2012]
              This article is provided by Seasize Technology- professional tablet PC manufacturer in Shenzhen,China, exclusively to customers. You may share this information to your friends and colleagues. Seasize should not be held responsible for any information that may be misleading or incorrect.
              CHINA TABLET SOLUTIONS INTRODUCTION(English) [Aug 8, 2012]
              This article is provided by Seasize Technology- China popular tablet pc solutions:chips company&chips introduction. The performance of a tablet model is determined by the tablet solution. To select and source the right tablet products, you have to know the difference among tablet solutions and identify the right tablet designers and manufacturers.
              which are giving a kind of industry insider’s view into the complex world of the Chinese ICT goods market.
              How relevant is it? A year earlier Company Introduction [Sept 5, 2011] described Seasize Technology’s business as:
              After years of development, Seasize technology already has a strong domestic procurement and export capacities. We are committed to provide affordable and quality digital video and GPS navigation products. Our company persist the principle of: Customer first, quality first not only meets the needs of customers and has been recognized by customers.
              Since its inception, the company mainly engaged in two major product lines: digital audio playback systems and GPS navigation devices,
              Digital audio and video aspects of the products covered MP3/MP4/MP5 players, digital TV set-top box, digital television etc.
              GPS navigation devices contain : GPS navigator, GPS tracker, networking version of GPS, GPS navigation and digital TV combo products, and the recently launched GPS navigation function with Internet personal terminal device (MID).
              Based on trade in the same time, has been developing its own brand and own technology products, after years of effort, the company has filed multiple patents in the country, and has registered the brand. Dependent on many years of trading experience and technology accumulation Seasize Technology already has more advanced ability to enter  this industry. It can be  expected in the near future that we will get a place in the relevant fields, and access to long-term development.
              Its new profile [May 27, 2012] stated a subsequently changed description as:
              After years of development, we have grown up into a strong company which enjoys many advantages from procurement, production and export. We have passed ISO9001:2008 certificate in year 2011 and established a standard quality system that will ensure our delivery of quality product to our customers. Our product lines include two areas: digital audio&video products and GPS-related products. We are committed to provide our customers with cost-effective solutions, whose value has been seriously balanced against its prices.
              and then there is a SOURCING GUIDE-Android Tablet pc,tablet pc,wifi tablet pc,google tablet pc,tablet pc review,wholesale tablet pc [Aug 8, 2012] page which was quite probably the marketing campaign page for the above documents with leads generated via registrations for each, with more direct indication of the China Tablet Solutions Introduction [Aug 8, 2012] as well as another one of Risks of Doing Business in China.
              Seasize therefore is definitely trying to expand its purchasing business as well, so its documents could be valuable, even sufficiently authentic for those people who are potential partners of Seasize. As such these documents might describe the purchasing situation over there for everybody else as well. For Seasize’s track record of activities see: Seasize Technology Co., Ltd.: Newsletter Archive [May 31, 2011 – Aug 7, 2012 and beyond].

              4. The Allwinner advantage 全志

              image珠海 Zhuhai 全志科技 Allwinner Technology (150 ~ 499 employees) — 148 campus hirees only for 2013 (click here for a full content) recruited with a roadshow held in:
              – 西安 Xi’an: at 西安交通大学 Xi’an Jiaotong University (XJTU) on Sep 18; at 西安电子科技大学 Xidian University on Sept 21
              – 哈尔滨  Harbin: at 哈尔滨工业大学 Harbin Institute of Technology on Sept 25
              – 武汉 Wuhan: at 华中科技大学 Huazhong University of Science & Technology (HUST) on Sept 22.
              – 广州 Guangzhou: at 华南理工大学 South China University of Technology (SCUT) on Sept 17, at 中山大学 Sun Yat-sen University TBD
              – 成都 Chengdu: at 电子科技大学 University of Electronic Science and Technology of China (UESTC) on Oct 11.

              image

              From jobyun.com:
              = US$ 1,113

              Company Overview of AllWinner Technology Co., Ltd.
              [Bloomberg Businessweek]

              AllWinner Technology Co., Ltd. engages in mixed-mode SOC technology research and VLSI design. The company’s products are used in high-definition television and digital photo frame markets. It also provides support services. The company was founded in 2007 and is based in Zhuhai [Guangdong province], China.

              From: AllWinner Technology Selects ARM Cortex CPU and Mali GPU Technologies To Bring Integrated SoC To Android OS-Based, Connected Consumer Devices [ARM press release, April 12, 2011]

              AllWinner Technology Co., Ltd was founded in 2007, and is engaged in mixed-mode SOC technology research and VLSI design.  AllWinner Technology is dedicated to be the major leader in the HD media field, to excel in low-power VLSI design, advanced technology and innovative architecture; to be the pulse of the consumer market, with a unique understanding of self-developed core technologies.  Through functionality, performance and cost advantages of integrated products and the industrialization of the operational capabilities of the market to provide customers with leading designs and services from SOC products to comprehensive solutions. 

              From: Zhuhai sez daily: Gan Lin investigated in high-tech zones “two little two two high” enterprise [Allwinner press release, June 10, 2010]

              Gan LinParty Secretary of Zhuhai city … accompanied by director of the CMC Qiu Shi, successively investigated the Kingsoft Park (Jinshan Software Park) project site, Xuan Garment Co., Ltd. Design Center, BOXlight (Po Wright) Medical Technology Inc., Tin Shui Power Technology Limited, Allwinner Technology Co., Ltd. and Bioenergy Limited. …
              Zhuhai Allwinner Technology Limited is committed to becoming a leader of application requirements in the area of key technologies for HD multimedia and communication networks, radio and television networks, and the Internet “triple play”; specializes in low power VLSI design capacity of independent research and development of core technologies, has completely independent intellectual property rights. According to the General Manager [Chairman and CEO] of the company, Zhang Jianhui (张建辉), the Allwinner company was established in 2007. In the first two years to April 2009, the company had been working hard on technology R & D and did not earn a penny, then launched two categories for the introduction of a series of nine full HD network integrated smardescriptiont chips in order to become one of the leading manufacturer of ultra-large-scale system-on-chip and embedded software technology.

              The roots of the Allwinner Technology:

              May I ask [about] Zhuhai [珠海] Victory Technology [全胜 科技] – How can I like it? [http://laoyaoba.com in Chinese, Oct 23, 2010]  

              Looking for a job, this company has come to our school, a little want to go, but I don’t know how on Earth is this company, [since there is] almost no information on the Internet, looking for an insider look, appreciate it!

              The entrepreneurial team of Zhao Guangmin[赵广民先]’s [Zhuhai] Actions Semiconductor Co., Ltd. was brought over after Zhao’s unfortunate, untimely death. The Zhang Jianhui[张建辉]-led team, however, is still very strong in the Chinese semiconductor industry. It began to grab the PMP [Personal Media Player >>> MP3 etc.] market share last year, and it is estimated that [its] revenue this year should be around $ 30 million ….

              The life and spiritual heritage of the legendary Chinese IC design industry leader Zhao Guangmin [Baidu in Chinese, Aug 27, 2007]

              … In early 2006, Zhao Guangmin left Actions, where had been working for a number of years, and with a number of like-minded partners co-founded Victory (Zhuhai) Microelectronics Co. as chairman with aspirations to win a new peak. …

              Actions pass the sudden departure of founder, investors have been excluded [VentureData.org, April 4, 2006], the picture of Zhao Guangmin below is from this source which is the Chinese origin of this material below:

              Led the company successfully landed on the Nasdaq after 4 months, founder of Zhuhai Actions Semiconductor Co., Ltd. (hereinafter referred to as “Actions”), Zhao Guangmin [then vice chairman of the company] suddenly announced his resignation.

              Zhao Guangmin the early 1980s graduated from Xi’an Jiaotong University, has a number of Semiconductor companies in the office. Zhao Guangmin founded in December 2001 and served as general manager [not CEO] of Actions. Actions a total investment of $ 10 million, primarily engaged in the development of VLSI design and test production. Taiwan-funded by the holding of shares in which Zhao Guangmin unknown.
              Under Zhao Guangmin leadership, relying on keen to capture the opportunity to MP3 chips, Actions to achieve rapid development. In 2002, Actions Semiconductor sales only 1.08 million yuan [US$ 130K]; in 2003 sales increased to 4,000 million [US$ 4.3 million – see the chart later]; in 2004 sales soared to more 460 million [US$ 55.5 million], net profit up 200 million yuan [US$ 24.1 million].
              At the same time, Actions also introduced more than a dozen proprietary chip. In 2004, the company was selected as the China Semiconductor Industry Association, the annual top ten IC design companies. To the fourth quarter of 2004, Actions in the global chip market share in the first MP3.
              November 30, 2005, to Actions as the main Action Semiconductor Co.Ltd (Nasdaq: ACTS) in the U.S. Nasdaq market, the first phase of financing $ 72 million. Since listing, the market responded well to the Actions, and there have been investment banking analyst cut its rating to “buy.”
              Actions with the same period of rapid development and to the patent dispute. Zhao Guangmin issue in the mail two days before departure, the U.S. International Trade Commission a preliminary ruling, Actions part of the audio processor infringes two U.S. SigmaTel’s patents. SigmaTel is the world’s leading mobile phones and digital audio players, chip vendors, the company early last year to the U.S. District Court in Austin, sued Actions Semiconductor infringed its patents.
              “Now I can not say anything, but to leave and certainly nothing to do with the lawsuit.” Zhao Guangmin side of the phone hesitantly.
              Zhao reasons for leaving, Actions official answer is “retired.” One of the company staff responsible for media relations, said, “Although less than the retirement age, but Zhao fame in this industry has made the decision to retreat is also very natural.”
              However, close to Zhao Guangmin the industry does not think so. He said that Zhao’s departure and the investors.
              The source said, as early as Actions Prior to listing, to facilitate investment in the idea of ​​a replacement company executives. Public information, Zhao Guangmin general manager of the term of Actions of August 2005, is the company going public push. Zhao’s successor as general manager, is working with many years experience in the semiconductor industry, China Taiwan nationals Yenan Hong.
              On this course, after listing a media interview, Zhao Guangmin stunned: “In order listed, and sometimes take their cut first!”
              According to Zhao said, in order to make more in line with investors Actions taste, Actions update prior to listing a number of board members and executives. Most of these people in the chip industry has a deep background and is familiar to foreign investors, including former vice president of operations SMIC Chiu Tsz Wan.
              Interestingly, in the Actions of the prospectus, as the founder of Zhao Guangmin not appear in the list of shareholders, executives, Zhao’s team did not name.

              Further explanation is given here, only two sentences are important to quote (the picture of Zhao Guangmin below is from this source which is the Chinese origin of this material below):

              … [Till] June 2005 Zhao Guangmin has been Actions’ general manager, [then] since June to become vice president, and in November the company officially listed [that] Zhao Guangmin had [been] transformed into a vice chairman. … In fact, although Zhao Guangmin since 1993 as was general manager of Zhuhai Actions, but he has had no control of the company, the company has had been in a firm grip on the hands of equity investment in Taiwan.

              Note that Actions is a still existing company keeping its description as under Zhao Guangmin’s leadersip: About Actions [Sept 6, 2005]

              … Actions has successfully put into market some products, such as digital audio/video SOC chip and its total solution, a series of IC for digital potential meter, SOC chip for TV entertainment products and its total solution, … etc, since the first day it was found. All Actions’ products are under the protection of intellectual property law, and have been gradually showing their competitive power after directly joining the international market.

              With management and techniques accumulated, high-tech and product positioning, precise market position, strong innovative power, Actions sustains fast improvement and development. In 2003, Actions was identified as one of the top 10 fastest growing IC design companies within the China area by the China semiconductor association; the same situation will happen again in 2004 as well.

              Actions’ latest product developed under his leadership: Actions Introduces New Video Technology — Advanced Media Video (AMV) [Actions press release, April 10, 2006]

              … provides comprehensive mixed-signal system-on-a-chip solutions for portable consumer electronics, today introduced a new generation of video technology, Advanced Media Video-AMV3.0.  This new technology supports a higher degree of picture resolution (QCIF i.e. 176 x 144), a better display of motion picture than the AMV1.0 and 2.0 technologies, and is capable of converting SWF files and other regular movie formats.  This technology was developed specifically to be the video engine for Actions’ new 9 series SoCs.
              The history of Actions’ audio and video technology can be traced back to 2004, when Actions introduced two video technologies, MTV1.0 and MTV2.2, ahead of a majority of its competitors. This breakthrough innovation of Actions had risen the technology playing field of the entire digital music industry to a higher level.
              “Although our current 9 series SoCs require conversion software to enable playback, our next generation of SoC products, embedded with a MIPS core, will support direct streaming video playback.  With the benefits of a MIPS core, the data processing speed will be much faster,” continued Mr. [John] Lee [Senior Product Manager of the company].
              “The advancement of our MIPS core technology will remain consistent with our development in AMV4.0.  Furthermore, based on the MIPS platform, both the design house and the manufacturer will be able to freely take full advantage of their expert technology, thus providing them with a favorable position in a fiercely competitive market,” concluded Mr. Lee.
              Here is the “Proven Management Experience and Expertise” slide (#11) from the May 2006 Corporate Overview of Actions presentation. Note that this was immediately after the departure of Zhao Guangmin and there were three managers from the original founding team, neither of them with executive power (as evidenced by EDGAR submissions), and only Shao Chuan (Shawn) Li is still with Actions as a director of the board (since September 2005) but more importantly as Chief Technology Officer (since the establishment of Actions in December 2001), while Zhang Jianhui was the head of Multimedia Division and as such he was the topmost manager with core innovation competency, and it was no surprise that he left Actions when Zhao Guangmin established his next venture, Victory (Zhuhai) Microelectronics Co. which after his death became the current Allwinner managed by Zhang Jianhui. (There is no information about Gong Hui.) Note as well that at the time of that presentation Actions had 280 employees; 210 engineers with IC, system, and software capabilities.
              image
              imageIt is quite remarkable that after Zhao Guangmin’s departure Actions went into decline as visible from the chart showing the revenues generated by the company. With $150M in 2005 Actions was the second-largest China-based fabless company. Employing not less than 280 people in 2006 the new Taiwanese executive duo of Nan-Horng Yeh as CEO and David Lee as CFO (both educated in the United States) have completely failed. This is all despite of their strategy to move into midrange products by developing mobile TV SoCs via licensing core technology from U.S.-based Mavrix Technology. See: SoC firm finds fertile ground in China [EDN, Aug 22, 2006]. This licensing decision led only into an industry sideline with stronger external reliance on MIPS processor cores (originally selected by Zhao Guangmin in July 2005 as the vice president, but for fast internal development) and a subsequent, necessary acquisition of Mavrix as licensee in 2010. Paradoxically Mavrix’s CEO, Dr. Zhenyu Zhou became even the CEO of Actions in December 2011. Only David Lee has still a high-level position with the company as chairman of the board. The future outlook for Actions is also rather uncertain as only a single analyst had any interest in the company’s Q2 2012 Results Call [Aug 7, 2012].

              What a contrast with Zhao Guangmin’s new company which became after his death today’s Allwinner. Here is the Commemorate [what] Zhao insisted: a win-win situation, team together and do things realistic [Aug 24, 2007] by his deputy (??) and effective successor in charge of his Victory Microelectronics Co., Ltd., Zhang Jianhui:

              Zhao went away from us, the circle of friends chatted about Zhao, and so far we are still unable to accept that this is a fact. Remembered Zhao, in addition to in the legendary entrepreneurial experience at Actions, we talk about the most, is the insistence of Zhao and low-key.
              Speaking of the insistence of old Zhao, when Zhao won the Zhuhai Special Economic Person of the Year in 2004, in an interview he said: “As long as you choose the right direction, be sure to persist in walking, did not insist on was not successful.” It is this insistence on belief and perseverance of action which created Zhao’s unusual success story.
              First, Zhao insisted on the concept of win-win, through the development of core IC products to add value for the customer, and industry chain downstream supporting enterprise vertical and horizontal, building win-win business model among enterprises, resulting in overall lead between the company and the customer.
              Zhao served as general manager of Actions by virtue of more than 10 years accumulated of IC design and enterprise operating management experience. He led there a well-trained professional operating team to share common goals, to carry out efforts with hard work, to get global semiconductor industry attention via achievements. This made Actions from an unknown small company, in just a few years, China IC design industry’s  first to become a globally known enterprise. The MP3 multimedia master chip R & D accounted for more than 50% of the world market share. This led to billions of dollars via the quick formation of the MP3 industry chain in China, prompting mainland China to become world’s major export base of MP3 which has brought tremendous development and benefits to the consumer electronics industry [here].
              This was for the first time as a mainland China IC design company established itself in the field of global consumer electronics products, mastered and mass provided the core technology products with international advanced level. Actions’ operating income grew significantly from a few million yuan in 2002 to 1.2 billion yuan in 2005, [thus] creating rapid growth of more than 100 times for the Actions Semiconductor in three years only, and [then] eventually prompting the success of Actions to be listed on NASDAQ.
              Second, Zhao insisted on the need to uphold the integrity of the fundamental values [which] can be established between the team and the customer, [on the] long term sustainable growth of business culture, [that] the strength of the team is always greater than the power of any individual.
              In the early venture days of Actions Zhao personally wrote a column for the internal publications, talked about the issues of development ideas and the reform of corporate culture, and also to encourage other executives to write articles for publication. Fixed each Wednesday [?his?] commuting leadership talked about the exchange of business issues, to develop common thinking habits and language of communication – because every time before this would open, the kitchen will cook a pot of noodles as participants of dinner, affectionately called “noodles will”.
              This will sometimes be open until two o’clock at night, and the truth is argued more and more out; companies and departments use the monthly regular meeting with employees face-to-face communication. After a year passed, not only everyone has made great progress, but he also formed a fully functional teamwork of high degree of homogeneity and quality, great combat effectiveness of entrepreneurial backbone of the team, and subsequently laid a very good foundation to the success of the company.
              Third, Zhao insisted on doing anything seriously, down-to-earth. He used to say that a 99.99% working IC is still not working. Design paradoxes are in place, it is where the BUG. In 1995 I and old Zhao did cooperative research and development projects for the first time. I was responsible for the system design, Zhao for the circuit design. There was no RTL coding method as now, the circuit was built by human hand structures. Zhao’s design adhered to repeated scrutiny and carefully optimized design logic based on clear, simple drawing. Sometimes he explained to me where is the circuit of the collar, which is the heart of the circuit and the limbs, old Zhao could meander, and the favorite circuit design is input ready.
              It is quite unfortunate that China’s IC design industry has lost an outstanding leader, and friends lost an honest, down-to-earth best friend. However, true to Zhao’s spirit, I believe in increasing prosperity and burgeoning growth of Chinese IC design, offering useful lessons and inspirations, and I believe this will also correspond to Zhao’s heartfelt wishes and expectations.
              Mr. Zhao Guangmin may rest [in peace] .
              Author: Zhang Jianhui, Victory Microelectronics [全胜] Co., Ltd. (Zhuhai), general manager, for the friends and colleagues of Zhao Guangmin years
              For more information see Mr. Zhao Guangmin Memorial page [Aug 29, 2007] of eMedia Asia Global resources. Note from there that he entered the university in 1977 which is the first year of entry after the Cultural Revolution when only exceptional people were able to enter the universities. More explanation about that phenomenon see in Yoshida in China: Cultural rev survivors leap forward [EE Times, Oct 1, 2012]

              Allwinner’s close cooperation with ARM Holdings started with Victory Technology selects ARM processor for ultra-low-power high-definition network video applications [joint press release available only in Chineese on eetrend.com and elsewhere, Feb 9, 2010]

              ARM926EJ-S processor to achieve high-definition video processing while reducing power consumption by up to 50%.
              Zhuhai Victory Technology Co., Ltd. (referred Victory Technology) and ARM [(LSE: ARM); (Nasdaq: ARMH)] today jointly announced: Victory Technology licensed the ARM926EJ-S ™ processor for its IC design for ultra-low-power high-definition network video applications. These applications include: home Internet video streaming via the Internet, cable television and wireless network high-definition video player and other network video equipment.applications include: home video streaming via the Internet, cable television and wireless network high-definition video player and other video devices on the network.
              Victory CEO Zhang Jianhui said: “In addition to the well known high-performance and low-power characteristics, another important feature of the ARM ® processors is versatility, they can bring better scalability, reducing the workload and difficulty of development, and shorten time to market. These features help us design IC products for the fast-changing Internet video applications, and are very important. ARM has always spared no effort to promote innovation through its strong product planning, which provides an opportunity for us to further cooperation in the future. The resources required to design the system is very rich around the ARM ecosystem, and we are very confident in each other’s cooperation capability that it will be successful.”
              With more and more Chinese consumers having broadband access at home or on the move, China’s Internet video applications market is developing very rapidly. With rich experience in the field of video processing technology, as well as a deep understanding of the market, combined with ARM’s top high-performance, low-power processor technology Victory Technology has the capability to meet the standards and local consumer demand to develop IC products for the high-definition Internet video equipment. Through the use of excellent performance at low power consumption of ARM926EJ-S processor as well as Victory Technology’s ultra-low-power design techniques, the company hopes that its new chip can achieve 50% of energy consumption savings versus the similar products on the market, without sacrificing performance needed for HD video streaming on the Internet.

              Brief English content appearing about the same on Sept 26, 2012:
              Gan Lin, Party Secretary of Zhuhai, Visited Allwinner Technology

               

              全志科技

              全志科技

              Gan Lin, Party Secretary of Zhuhai, accompanied by several other leaders, visited Allwinner Technology on June 10, 2011.
              During the visit, Gan gave Allwinner Technology credit for its independent R&D and spirit of leadership in technology. He pointed out that Allwinner Technology should continue embracing innovation to boost its competitive edge and accelerate the development of strategic emerging industry.

              A10 won “The Most Promising Award” on the Sixth “China Chip” Ceremony [Allwinner press release, in Chinese: Dec 31, 2011, reproduced in English: Sept 26, 2011]

              Allwinner Technology A10, xPad SoC of High Integration and High Definition, has won “The Most Promising Award” in China IC Industry Promotion Conference 2011, also the sixth “China chip” ceremony held in Jinan on December 16th.
              The China Chip hosted by the Software and Integrate Circuit Promotion center (CSIP) of Information Industry Ministry, is a rather influential ceremony among domestic IC enterprises, experts, as well as other manufacturers involved in the industry chain. More than three hundreds enterprise representatives attended this ceremony.
              On the basis of striking video codec technology, DVFS, multi-core multiplexing technology, and advanced 55nm process, A10 outruns other competing solutions in its high integration, and outstanding multimedia and network processing capability. It supports 3D video playback, 2160P ultra-HD video decoding and 1080P HD H.264 video encoding, multi-screen, and integrates full-format audio codec engine, rich A/V outputs such as HDMI, LVDS, VGA, TVOUT, etc, and memory interfaces such as DDR3, DDR2, LPDDR1, NAND flash, etc, plus its edge in BOM and power consumption, it becomes one of the most favored solutions after marketing for several months, and is honored “the most promising” solutions in this ceremony.
              Zhang Jianhui, General Manager of Allwinner Technology, said that this award bears testimony to the efforts Allwinner has made in the past few years, and will definitely encourage Allwinner to come up with better solutions to meet customer demand, and carry forward the IC industry.

              Allwinner Technology and ARM working together to get to market quicker [ARM’s Multimedia blog, June 19, 2012in Chinese on Oct 4, 2012]

              Attached ImageThe dynamics of the mobile device industry can be seen in the rise of tablets and in particular the growth in Android based tablets. This new form factor has grown to an expected 100M shipping volume in 2012 with this being projected to exceed 200M by 2016 – when Android tablet shipments is expected to be over 50% (Source: IDC). This new form factor and pace of change have opened up opportunities for new companies to offer specific System on Chip (SoC) businesses a chance to address this market. Allwinner Technology Co., Ltd.is one of these. Over the last 12 months Allwinner Technology has become one of the major China Android tablet SoC chip vendors, with many of the Android tablet OEM system makers adopting our chip and system solution. A key industry analyst in China expects 40M Android tablets to ship in the China grey market in 2012, and it is expected that 60% of the share will be from Allwinner Technology.
              Attached ImageThis rapid time to market has been achievable through the close working relationship and usage of ARM Intellectual Property (IP). Allwinner Technology uses a combination of the ARM CortexTM-A8 and ARM MaliTM-400 MP. This combination enables Allwinner Technology to balance the required performance needs for tablet applications with the power consumption boundaries of a mobile device. By working with ARM for both CPU and GPU elements Allwinner Technology have been able to maximize the benefits of both high performance with low power consumption that ARMs years of knowledge in the mobile device market brings to new entrants to the market.
              Allwinner Technology has gone from the licensing [in April 2011] of the Mali-400 to production silicon in 7 months . This speed of execution has been enabled by the close linkage between the CPU and GPU from a design perspective, the RVDS [toolchain, the legacy solution for software development on older ARM processors replaced by the new ARM Development Studio 5, DS-5] and ARM DS-5TM toolchain [comprises tools such as the best-in-class ARM C/C++ Compiler, a powerful Linux/Android™/RTOS-aware debugger, the ARM Streamline™ system-wide performance analyzer and real-time system model simulators, all conveniently packaged in a user friendly integrated development environment (IDE) based on the Eclipse] and the out-the-box quality software drivers which are all supported by localised support teams. All these elements combined have enabled Allwinner Technology to move swifter and in an agile way to address the needs of this market and we look forward to working with ARM going forward.
              Attached Image
              Guest Partner Blogger:
              Jack Lee, CMO, Allwinner Technology Co., Ltd.

              ARM gaining traction in GPU IP market [DIGITIMES, June 22, 2012]

              … ARM has expanded its GPU licensee base at a fast pace, according to Kevin Smith, VP of strategic marketing at the firm’s media processing division. Taking the China market as an example, ARM’s Mali GPUs are currently shipping in over 70% of graphics-enabled digital TVs, 50% of Android tablet PCs and 20% of Android phones, said Smith.
              ARM’s partners are forecast to ship more than 100 million Mali GPUs in 2012, up over 100% from 2011 levels, Smith indicated. The anticipated shipment rise – driven by brisk demand for Android smartphones and tablets, and China’s growing smart-TV market – will boost ARM’s presence significantly in the global GPU-IP market this year, Smith added.
              ARM’s Mali GPUs are targeted at smart TVs, handsets and tablets, which require high-definition graphics and higher picture fluency, Smith stated. The product line has been enhanced to meet various customer needs such as high-resolution images, multi-game offerings and energy saving, Smith said.

              Combining with ARM’s CPU platform, the Mali GPU technology comes with additional features such as power efficiency, Smith noted. The combination is able to generate a complete multi-IP solution, Smith said.

              In addition, Smith indicated that ARM’s solutions are able to help system customers speed up time-to-market. For example, it took less than half a year for both China-based AllWinner Technology and Rockchip Electronics to launch their integrated CPU-GPU SoC solutions targeting the local tablet PC market, Smith said.

              New ARM DS-5 v5.9 Toolchain Provides Developers With an Integrated Processor and GPU Software Optimization Platform For Mobile Gaming [ARM press release, March 5, 2012]

              ARM today released the latest edition of the ARM Development Studio 5 (DS-5™ v5.9) toolchain with additional support for graphics analysis on ARM Mali Graphics Processing Units (GPUs). The toolchain can be downloaded by developers today, enabling them to achieve integrated optimization across the whole system, including both the applications processor and GPU. The ARM DS-5 v5.9 toolchain provides significant benefits to semiconductor suppliers and OEMs, as well as mobile application and game developers, by enabling improved system visibility and decreased time-to-market. In particular, the ARM Streamline™ Performance Analyzer, within the DS-5 toolchain, allows developers to design more interactive interfaces and immersive game play for end users whilst extending battery life. This will enable next generation user experiences for use on smartphones, tablets, smart-TVs and set-top boxes.
              The launch of the updated toolchain addresses the increasing demand for high-performance graphics development. Such advanced visual computing capabilities will deliver next generation smartphone and tablet applications where console-like gaming graphics, 3D User Interfaces (UI) and Augmented Reality (AR) will be the norm. Multicore systems, such as these, benefit from optimization of intensive tasks where integrated applications processor, GPU and memory subsystem designs can be configured to achieve the highest levels of performance and energy-efficiency.
              By using the ARM DS-5 v5.9 toolchain, developers can quickly and easily locate system performance bottlenecks across the Cortex processors, Mali GPUs and System IP, enabling the creation of faster applications and accelerating the software development cycle.
              … [additional information: Developing Top Performing Graphics Applications for Android Made Easy [ARM’s Software Enablement blog, March 7, 2012] and

              ARM Launches Free Toolkit For Android Application Developer Community [ARM press release of the DS-5 Community Edition, Nov 28, 2011]]

              The first Allwinner A10 tablets came to the market from a number of vendors in November 2011. See just these reports by Micdigi from China:

              In December more tablets of that kind came to the Chinese market as Micdigi reported:

              The tablet based on Allwinner A10 processor and 5-point touch capacitive screen [Dec 7, 2011]

              Recently, Allwinner tablet PCs are so popular. 7-inch capacitive screen tablet based on Allwinner [Cortex-]A8 solution sells for only $80.

              Now I will introduce a tablet based on Allwinner A10 from Shenzhen HongYuXing.

              Based on Allwinner A10 processor, Q780 is launched [Dec 8, 2011]

              Allwinner A10 has so good cost performance that it is the most suitable chip for entry level tablet PCs.

              Q780 from Shenzhen Xlong is launched.

              Allwinner A10 tablet—PC741 [from Shenzhen Inote] [Dec 12, 2011]

              Now the tablet chips are like a hundred flowers in bloom, like ten thousand horses galloping ahead. Allwinner A10 appeared late in the market but they came back. At present most of the tablet PCs from China are based on Allwinner A10 chips.

              Q701 based on Allwinner A10 [Dec 16, 2011]

              With cheap price and powerful performance for video playback, Allwinner A10 processor is popular in the world.

              Q701 is introduced Allwinner A10 processor.

              Then the events unfolded as follows:

              Based on high cost performance, Allwinner A10 has good sales after the Spring Festival. The chips with high cost performance are welcome.

              AMLogic based on A9 core is a high-end chip, which is introduced by SONY and Philips.

              RockChip chips became cheaper and cheaper since Allwinner released A10.

              As the first chip of Allwinner, A10 is released with cheap price, which makes it has good sales. Allwinner is a famous company in MP3 times so that Allwinner has a strong customer base.

              In addition, A10 has few bugs since it is released. The performance of other chips is not stable in the beginning, such as RK2808 and VIA8505.

              The agents who have ordered VIA chips go to order Allwinner A10. VIA will release VIA8850 next month [but mass production just started in June, see later] which is based on A9 core. The performance is not different from A10. It means that it does not have any advantage.

              VIA8850 will be cheaper than Allwinner A10. Allwinner will release A13 to compete with VIA8850 so that VIA will get in a difficult position. [Was more expensive the the A13 when  mass production started in June, see later]

              MTK will release MTK6575 which is the upgraded version of MTK6573, based on dual-core, 1GHz frequency and A9 core. The chip with excellent call function is mainly introduced by smart phone. It is also suitable for tablet PCs.

              AMLogic will release AMLogic M6 and RockChip will release RK30XX. They are all dual-core chips.

              [for RK30XX  and the earlier RK29XX and RK28XX see MWC 2012: Fuzhou Rockchip Electronics [this same ‘Experiencing the Cloud’ blog, March 13, 2012] where it is stated: Samples of the Rockchip RK30xx platform will be available in March 2012]

              At present, there are few new products in the market, but many new products will be released in May.

              As Allwinner A10 solution is so cheap, it is introduced by most of Chinese tablet PCs.

              The Allwinner A10 PCBA from Shenzhen Crownho sells for about $27.

              With this PCBA, the cost price of the tablet will be less than $64, such as DA701 [tablet] based on capacitive screen, which sells for about $63.5.


              INSERT ABOUT THE CURRENT AND FUTURE SoC COMPETITION

              Competitive SoCs from Chinese vendors that were available in March’12 or came soon after March’12:
              Amlogic 8726-MX (dual core), 8726-M3; Rockchip RK3066(dual core), RK2918Source: http://www.eeworld.com.cn/xfdz/2012/0725/article_14042.html
              (A10 $7, A13 $5)image

              Among those competitors the Rockchip RK3066 (dual core) became a market leader in China on its own as was already shown in the very beginning by the example of Window N90 Dual Core II 2 (16G) leading the dual core market in China:

              No surprise therefore that this is also a kind of leading product on the global market as shown by Merimobiles:
              List Price: $399.99 Your Price: $214.99 (with shipping)

              First Review – Window N90 Dual Core II 2 – RK3066 IPS – Purchase at: Merimobiles.com [MrTasselhof YouTube channel, May 24, 2012]

              while the Benchmarks Review – Window N90 Dual Core II 2 – RK3066 IPS – Purchase at: Merimobiles.com [MrTasselhof YouTube channel, May 24, 2012] is:

              Window N90 II – Dual Core – SlateDroid Forum: – http://www.slatedroid.com/forum/337-window-n90-ii-dual-core/ Window N90 Dual Core II – WiFi Benchmark Results – http://www.slatedroid.com/topic/33590-benchmarks-window-n90-dual-core-ii-wifi… Window N90 Dual Core II – Internal Components Pictures – http://www.slatedroid.com/topic/33614-window-n90-dual-core-ii-teardown-compon…

              and the global dual-core competition represented by Merimobiles as follows:

              Window N90 Dual Core 1.6GHz RK3066 9.7 Inch Comparison Chart

              imageNote that for the 1.5GHz Windows N70 (as opposed to the above 1.6GHz version available globally) the AnTuTu v2.4 benchmark on the PConline is on the right (see also: AnTuTu Benchmark):

              Since a multiple core Cortex ARM based Allwinner SoC will come just after those SoCs (“processors” – as named wrongly) shown in the table above, given the credentials of Allwinner presented in this post I dare to predict that the next-generation in the “A series” SoCs from Allwinner will beat the Rockchip RK3066 (or RK30XX in general) and others. There was just one concrete rumor recently: Ampe Allwinner Cortex-A7 Quad-core Tablet is Coming [ChinaEshops.com, July 12, 2012]

              Rockchip and AMLogic dual-core tablet come out to snatch the tablet PC market while AllWinner dual-core tablet keeps in silence. Although Allwinner A10 & A13 still hot in the middle-low end market. Rockchip RK3066 and AMLogic AML8726-MX has already listed for two months from the beginning of May. Now these two chip still mainly occupy the china dual-core tablet PC market. Freescale’s quad-core tablet PCs begin to launch, even Tegra3 quad-core.  Obviously, allwinner may it is late for launch dual-core, but it doesn’t mean that Allwinner will give up dual-core tablet.  Allwinner will launch Quad-core chips in August. Latest news report that AMPE will launch a new 10.1 Inch IPS Tablet PC equipped with allwinner quad-core processor.
              According to latest report the allwinner quad-core is using ARM Cortex-A7 structure. …
              max says: August 8, 2012 at 8:43 pm
              any news on this.
              chinaeshops says: August 31, 2012 at 5:11 pm
              Sorry, it is coming soon
              .

              As a matter of fact the Cortex-A7 was meant to be a companion ship for the Cortex-A15, all targeted for 28nm TSMC technology which is in extremely tighty supply at least till the end of the year. On the Cortex-A7 Processor—Related Products page we can find (among other things) that:

              Physical IP

              ARM Physical IP Platforms deliver process optimized IP, for best-in-class implementations of the Cortex-A7 processor at 40nm and below. A set of high performance Processor Optimization Packs (POPs) containing advanced ARM Physical IP for 28nm technologies to enable rapid development of leadership physical implementation supports the Cortex-A7 processor. ARM is also working early to assure a roadmap to 20nm optimizations. Optimization packs support ARM’s strategy of offering specifically targeted Physical IP to enable Partners to achieve tuned implementations of ARM cores. ARM is uniquely able to design the optimization packs in parallel with the Cortex-A7 MPCore processor architecture, enabling the processor and physical IP combination to deliver workstation class performance in a mobile power envelope while facilitating rapid time-to-market.

              But according to the later ARM Expands Processor Optimization Pack Solutions for TSMC 40nm and 28nm Process Variants [ARM press release, April 16, 2012] Cortex-A7 PoP became available for both “TSMC 40LP” and “TSMC 40 LP high speed options” type of process technologies (where LP stands for “Low Power”). This practically means that Allwinner can indeed deliver by this time its next-gen SoC at 40nm.

              Breaking news:

              1. Quad-core tablets large chaos department: Allwinner quad-wide prototype will debut in November [Bolopad.com, Oct 3, 2012]

              Before beginning I have to say to you: “I’m sorry”. Because last week we happily told everyone interested in quad-core prototype that it appeared in September, and it is not far from the days of mass production. But yesterday your editor suddenly received a mysterious call to be informed that the Allwinner quad-core prototype can’t come in September, it is estimated to be out in November to meet with you. I really wanted OOXX to be cursed to death (thought better of course).

              2. Exclusive: Allwinner quad-core processors code-named A15X coming soon [Bolopad.com, Sept 18, 2012]

              All right, now that the product finally appeared, we at Bolopad are also excited and highly interested in the quad-core chip code-named A15X (don’t get me wrong, this A15X has nothing to do with Apple A15 [rather Cortex A15 wrongly percieved by many to be in the A6 SoC of the iPhone 5]). Now the related PCBA layout began to take shape, the chip samples came out and so on. Last reportedly bounced because the Allwinner quad-core is dependent on [Cortex] A7 architecture build, but as 40nm and 32nm was short of the desired effect, the 28nm tapeout eventually came in to achieve the desired results.

              END OF THE INSERT ABOUT THE CURRENT AND FUTURE SoC COMPETITION


              NOW BACK TO THE CADENCE OF
              ALLWINNER A10-RELATED EVENTS & INFORMATION:

              An even bigger market push started when Allwinner A10 with the Android 4.0.3 Software Development Kit was officially launched on March 10, 2012. From the press release:

              TSMC’s 55 nanometer “half generation” derivative of the 65-nanometer process technology directly miniatures 90%, including input/output and analog circuits, for customer provides competitive advantage with single die cost significantly reduced, while can also save power consumption by 8% at the same speed of operation.

              As it was reported later in Taiwan: Allwinner Technology Introduces New SoC Platform on TSMC 55nm Process [CENS, March 29, 2012]

              Allwinner Technology Co., Ltd., a leading supplier of high-definition media semiconductor solutions headquartered in Shanghai [Zhuhai, as the contact address is: Block 1 Software Park, Zhuhai City, Guangdong Province, B6, four], recently released a new system-on-chip (SoC) platform based on Taiwan Semiconductor Manufacturing Co.’s (TSMC’s) 55nm process technology.
              The platform, codenamed A10, employs advanced SoC design technology to integrate central processing unit, graphic processing unit, high-definition multi-frame video engine, 3D multi-screen engine, and high-speed video interface module on a chip.
              Equipped with Allwinner’s Android 4.0.3 Software Development Kit, A10 consumes fewer energy to achieve higher computing efficiency on mobile devices.
              Using TSMC’s 55nm process technology, A10 is able to deliver quality dynamic voltage frequency scaling (DVFS) performance and brand new video management capability on mobile computing devices, and extend battery lifespan of the devices.
              TSMC’s 55nm process shrinks geometry of integrated circuits, including I/O, on chips by 90% as compared with chips with 65nm process, considerably cutting down cost of every single chip and saving electricity on a chip by 8% relative to competing chips.
              Allwinner General Manager Zhang Jianghui pointed out that TSMC has been a reliable partner supporting Allwinner in product production, quality and lead time.

              Allwinner Technology-A10 [product page, April 13, 2012]    The full Jifh A10 chip

              In A10 Allwinner used 55nm technology, the integrated chip has four times full HD [i.e. the 2160p “Quad HD”] video decoding technology, smart power management system CoolFlex, HD multi-screen display processing and output, efficient and high-speed system architecture, mixed analog-digital high-speed signal design and integration of advanced technology, and integrated, smart power balance, and more items of leading technology. A10 is mainly used in tablet PCs, high-definition players, smart phones, network set-top boxes, smart TV machines.
              With A10, Allwinner Technology will drive SoC into a brand new era of connected Smart HD which can enhance the application of connected HD SoC as well as user experience of electronic multimedia products. A10 is offering MULTI-CHANNEL decoding and 1080p encoding, MULTI-CHANNEL display with independently developed advanced frame, as well as MULTI-CHANNEL Analog TV Decoder Interfaces. What’s more, power consumption can be much lower than its competitors during 1080p decoding process.
              Features
              • VPU
                HD Video Decoding (Super HD 2160P/3D Film)
                – Support all popular video formats, including VP8, AVS, H. 264 MVC, VC-1, MPEG-1/2/4, …
                HD Video Encoding (H.264 High Profile) [datasheet: 1080p@60fps]
                – Support encoding in H.264 format
                [datasheet: 720p@100fps]
              • Rich Connectivity
                – USB2.0 Port
                – CSI, TS
                – SD Card3.0
                10/100 Ethernet controller
                CAN Bus, Built-in SATA2.0 Interface
                I2S, SPDIF and AC97 audio interfaces
                PS2 , SPI , TWI and UART
              • DPU
                MULTI-CHANNEL HD displays
                Built-in HDMI
                – YPbPr, CVBS, VGA
                – LCD interfaces: CPU, RGB, LVDS up to Full HD
              • Boot Devices
                – NAND FLASH
                – SPI NOR FLASH
                – SD Card
                – USB

              • Powerful Acceleration
                – Graphic( 2D/3D)
                – VPU(Super HD)
                – APU
                – E-reader

              Benefits
                • High-performance processing and multimedia capabilities
                • Outstanding Super HD 2160p/3D Film video decoder makes bunds of creative application possible
                • High level of integration enables you to launch products in less time, with less effort and at a lower total system cost
                • Further development Kits, including OS BSP( Android2.3.4, Linux2.6,WinCE6.0)
                Typical Application

                Pad
                Integrated Smart TV
                Internet Player
                Vehicle Multimedia Center
                HDMI Dongle
                Projector

                2160p [Wikipedia, excerpted on Sept 18, 2012]

                2160p is the shorthand name for 4K UHDTV, a video mode planned to appear in future HDTV products.[1] It has a resolution of 3840×2160 (8.3 megapixels in the 16:9 aspect ratio) and is one of the levels of Ultra-high-definition television.[2][3][4][5] The number 2160 stands for 2,160 lines of vertical display resolution, while the letter p stands for progressive scan or non-interlaced. In a progressive image, the lines of resolution of the image go from the top of the screen to the bottom.
                2160p is also called “Quad HD” since it displays four times the number of pixels of the highest HDTV standard resolution, 1080p (a standard which is also known as “Full HD“). The only planned higher definition format for television is 8K UHDTV.
                Phillips has made a 3D Quad HDTV with a native resolution of 2160p.[6]
                In June 2012, Toshiba launched the world’s first 3D TV without glasses with 9 parallax images which passed through special lenticular lenses to deliver 3D effect with glasses-free on a 55″ Toshiba Regza RZ1 Quad Full HD TV, 3840x2160p resolution.[7] Due to delivered 9 parallax images at the same time, so the 3D image will only be seen as HD 720p (1280×720) —> 3840×2160 = 9x1280x720.
                Sony plans Quad HD TV to launch between 2012 and 2020. Holographic Versatile Discs and Blu-ray Disc may be used for 2160p video, since it theoretically has a storage capacity of up to 10 Terabytes.[citation needed]

                The AllWinner A10 System on Chip Specifications [the alternative allwinner.com product page, July 20, 2012]

                Overview

                Using 55nm technology, Allwinner Technology’s A10 SoC chip integrates full HD video decoding technology, multi-screen display processing, various analog-digital I/O interfaces, and a high-speed efficient ARM core with intelligent power management. The A10 is used in a number of consumer products such as tablet PCs, high-definition players, smart phones, network set-top boxes and mobile media hubs but with the availability of excellent development tools, the A10 is positioned to expand that list.

                Key Features

                VPU
                HD Video Decoding (Super HD 2160P/3D Film)
                Support all popular video formats, including VP8, AVS, H. 264 MVC ,VC-1, MPEG-1, 2,4, …
                HD Video Encoding (H.264 High Profile)
                Support encoding in H.264 format
                1080p @ 60 fps
                720p @ 100 fps
                DPU
                MULTI-CHANNEL of HD displays
                Built-in HDMI v1.3/v1.4
                YPbPr, CVBS,VGA
                LCD interfaces: CPU, RGB, LVDS up to Full HD
                Rich Connectivity
                THREE USB2.0 Port (OTG/HOST/UTI)
                UTI Digital TV(TS over USB)
                CSI(2), TS(2)
                SD Card3.0(4)
                10/100 Ethernet controller
                CAN Bus, Built-in SATA2.0 Interface
                • I2S, SPDIF and AC97 audio interfaces
                PS2 (2), SPI (4), TWI (3) and UART (8)
                Boot Devices
                On board NAND FLASH
                SPI NOR FLASH
                SD Card
                USB
                Powerful Acceleration
                Graphic( 2D/3D, Mali400 MP)
                VPU(Super HD 2160P/3D)
                APU
                E-reader
                Support text in EPUB, PDF, FB2, PDB, CHM, HTML, TXT
                Support coding format in ANSI/ASCII, UTF-8, UTF16-BE, UTF16-LE, GB2312, EUC-KR, SHIFT-JIS, Windows-1250/1251, Support Chinese, English, French, Italian, Spanish, Dutch, Russian, Japanese, and Korea
                CPU/GPU
                ARM Cortex-A8 at 1.2 Ghz without cooling
                • 32KB I-Cache/32KB D-Cache
                256KB L2 Cache
                MALI 400 MP GPU
                ARM NEON general-purpose SIMD engine
                Memory
                DDR3 SDRAM, 32-bit 16G bits Memory Capacity
                • SLC/MLC/TLC/DDR NAND
                8 flash chips, ECC 64bits
                Memory Capacity up to 64GB/chip
                Security
                Trustzone Technology and DRM
                Supports DES, 3DES AES encryption/decryption
                Support SHA-1, MD5 message digest
                hardware 64-bit random generator
                128-bit EFUSE chip ID
                PMU
                Flexible built-in power options
                Intelligent Power Select allocates power safely and transparently among USB, external AC adapter, Li-battery and application loads
                adaptive and USB-compatible PWM charger
                Benefits
                • Very high performance processing and multimedia capabilities
                • Hardware acceleration enables very low power consumption for HD video and graphics
                • High level of integration makes you can launch product in less time, with less effort and at a lower total system cost
                • Optimized Standard Operation Procedure (SOP) creates high First Pass Yield (FPY) in mass production
                • OS Board Support Packages for Android, Linux and WinCE

                AllWinner A10 Datasheet V1.0

                NEW Allwinner Technology-A10s [product page, Sept 26, 2012]

                全志科技 A10s 芯片

                Allwinner Tech has expanded its processor lineup to include a new ARM Cortex-A8 chip A10s which is even more competitive for HDMI Dongle with higher performance (ManyCore Structure), better compatibility of Streaming Video Protocol/local multimedia formats, lower power consumption, and lower total system cost. As the brains of Android 4.0.4, A10s makes multitasking smoother, apps loading more quickly, and anything you use responds instantly. What’s more important, A10s is available in BGA336 package with Audio Codec, and HDMI integrated.
                Features
                • CPU / GPU
                  – ARM Cortex-A8 Core
                  – 32KB D-Cache / 32KB I-Cache
                  – 256KB L2 Cache
                  – Mali-400 3-D Engine
                • VPU
                  – HD Video Decoding
                  – 1920 * 1080 @ 30fps
                  – Support VP8/6, H.264/H.263, WMV9/VC-1, WMV7/8, MPEG-4/2/1, Xvid, etc
                  – HD Video Encoding
                  – Support encoding in H.264 format up to 1920 * 1080 @ 30fps
                • HDMI
                  HDMI 1.4
                  1080P Output
                • Boot Devices
                  – NAND Flash
                  – SPI Nor Flash
                  – SD Card
                  – USB
                • Ultra-low System Power Consumption
                  15 ~ 20% lower than competitors
                • DPU
                  – LCD Interfaces: CPU, RGB
                • Memory
                  – DDR2/DDR3: Up to 533MHz
                  – 16 bits/32 bits Data Bus
                  – MLC / TLC / SLC / EF-NAND
                  – ECC 64-bit
                  – Support NAND of 4xnm, 3xnm, 2xnm …
                  – Support NADN of Samsung, Toshiba, Hynix …
                • Peripherals
                  – USB2.0 OTG, USB2.0 HOST (OHCI / EHCI)
                  – SD Card V.3.0, eMMC V.4.2
                  – SPI, TWI and UART
                  TS Port
                  EMAC
                  – CSI
                  IIS
                • Audio Codec
                  – integrated Audio Codec
                  – MIC/FM/LINEIN Input
                • Powerful Acceleration
                  – Graphic (3D, Mali400 MP)
                  – VPU (1080P)
                  – APU
                • Package
                  BGA336, 14mm*14mm
                Benefits
                Optimum multimedia and processing abilities
                Lower power consumption of HD videos and graphics due to hardware acceleration
                Lower power consumption of HD videos and graphics due to hardware acceleration
                Total solution, including OS BSP (Android 4.0.4 UP)
                Typical application

                HDMI Dongle
                Homlet (Android Box)

                And A10s is definitely coming to the market as per this [Sept, 21, 2012] discussion thread

                Today I found a seller on on a website selling new model of Android TV stick, it claims adopting new A10S chip & support DLNA function that is just what I want, is that a good deal?

                Allwinner Technology-A13 [product page, April 13, 2012]

                The full Jifh A13 chip

                Allwinner Technology has expanded its processor lineup to include a new ARM Cortex-A8 chip A13 which is even more competitive for Android tablets with higher performance (ManyCore Lite), lower power consumption, and lower total system cost. As the brains of Android 4.0. 3, A13 makes multitasking smoother, apps loading more quickly, and anything you touch responds instantly. What’s more important, A13 is available in eLQFP176 package with Audio Codec, and 2 Points R-TP integrated.

                Features

                • CPU / GPU
                  – ARM Cortex-A8 Core
                  – 32KB D-Cache / 32KB I-Cache
                  – 256KB L2 Cache
                  – Mali-400 3-D Engine
                • VPU
                  – HD Video Decoding
                  – 1920 * 1080 @ 30fps
                  – Support H.264, H.263, VC1, Mpeg1/2/4, Divx 3/4/5/6, Xvid, VP6 / 8, AVS etc
                  – HD Video Encoding
                  – Support encoding in H.264 format up to 1920 * 1080 @ 30fps

                • Boot Devices
                  – NAND Flash
                  – SPI Nor Flash
                  – SD Card
                  – USB
                • Ultra-low System Power Consumption
                  15 ~ 20% lower than competitors
                  – Smart Backlight: auto adjust backlight acc. to the image display

                • DPU
                  – LCD Interfaces: CPU, RGB
                • Memory
                  – DDR2/DDR3: Up to 533MHz
                  – 16 bits Data Bus
                  Memory capacity up to 512MB
                  – MLC / TLC / SLC / EF-NAND
                  – 2 flash chips, ECC 64-bit
                  – Support NAND of 5xnm, 4xnm, 3xnm, 2xnm …
                  – Support NADN of Samsung, Toshiba, Hynix …
                • Peripherals
                  – USB2.0 OTG, USB2.0 HOST (OHCI / EHCI)
                  – SD Card V.3.0, eMMC V.4.2
                  – SPI, TWI and UART
                  – integrated Audio Codec
                  – CSI
                • R-TP Controller
                  – 4-wire resistive TP interface
                  2 points and gesture detection
                • Powerful Acceleration
                  – Graphic (3D, Mali400 MP)
                  – VPU (1080P)
                  – APU
                  E-Reader
                • Package
                  eLQFP176

                Benefits
                  • Optimum multimedia and processing abilities
                  • Lower power consumption of HD videos and graphics due to hardware acceleration
                  • Much faster, easier and cost efficient product launch due to the high integration
                  • Further development kits, including OS BSP (Android 4.0.3 UP)
                  Typical application

                  Pad
                  E-BOOK

                  Note that Allwinner is operating in a world-class environment as you could easily see from the below picture of their office building taken from their brief intro page [April 13, 2012]:

                  Jifh Southern Software Park Zhuhai

                  全志科技 Allwinner Technology has been committed to the IC design industry, is one of a handful of domestic enterprise engaged in system-level ultra-large-scale mixed analog-digital chip design the SoC and intelligent power management. Our main products are intelligent terminal application processor chip, smart power management chip.
                  With excellent R & D team and technical strength, the company’s products to achieve industry-leading levels of high-definition video codec, a high level of integration, low power consumption, rapid market expansion, has become a domestic Tablet PC application processor chip, high-definition player application processor chip as well as one of the mainstream supplier of intelligent power management chip market, has a clear lead.

                  New content replacing the above on Sept 26, 2012:

                  Allwinner Technology, one of the domestic companies in integrated circuit design industry, is dedicated to the design of mixed analog-digital VLSI SoC and smart power management SoC.

                  Depending on its excellent R&D capability, Allwinner Technology has been led the industry in terms of its HD video codec, high integration and low power consumption, etc. As a result, it is gaining more market share, and has become one of the domestic mainstream suppliers of tablet processors, HD player processors, as well as smart power management SoC.

                  Note therefore that Allwinner’s roots are in the video (multimedia) related chips as also shown by their latest pre-A10 SoC product (introduced in August’11) for that market, the F1C100 (another SoC, the more focussed F20 introduced in August’11 for portable video players, living room computers etc. has even better, 1080p full HD decode technology; as well as the very latest F10 introduced in April’12 for HD players and lower end –relative to A10—car multimedia), described on its product page as:
                  With advanced independently developed video decoding technique, F1C100 becomes the ONLY processor in the market that can decode video in all formats based on ONLY 4MB NOR FLASH and 16MB SDRAM. In the mass production of final products, NOR bootloader burning is much easier and faster compared with NAND FLAHS ‘. Last but not least, F1C100 supports two-point touch which can improve the using experience of end-users.

                  New F10 content replacing the above on Sept 26, 2012:

                  The F10 is an advanced HD video CODEC processor with unparalleled competitive edges in integration, video compatibility and cost efficiency, which have been widely verified by mass production of dozens of applications. End-users are overwhelmed by its capability to serve banquet for the eyes.

                  Typical Application

                  HD PMP
                  Student Computer
                  HD Media Player
                  Car MP5
                  HD AD Player

                  F1C100’s datasheet [initial version, March 31, 2011] is providing the following, more precise description:

                  image

                  and for the video engine of their own design in particular:

                  image

                  image

                  With this intellectual property they were able to upscale to a market leading 2160p functionality in the A10 (vs. the 720p in the above F1C100) while using a less upscaled IP for the 1080p in A13. So they can even have a scaleable video engine IP of their own.

                  In the A10 datasheet or here [initial version, Aug 22, 2011] the following description is giving some hint regarding the company’s strategic intent to remain in the forefront of video acceleration technology:

                  image

                  It is quite notable that neither on the product page nor in this datasheet Allwinner is giving further information about their video engine. Even in the functional block diagram of datasheet the video engine (VE) is simple put into a central box with Cartex-A8 and the Mali GPU:

                  image

                  The only available information is the CedarX wiki page [July 14 – Sept 16, 2012] on linux-sunxi wiki:

                  CedarX is Allwinner’s multimedia decoding technology. It is composed of several parts, including:

                    1. A hardware video decoding unit
                    2. Proprietary libraries to communicate with the hardware unit
                    3. Glue code to use those libraries on an actual system with video playback capabilities (e.g. Android)
                    Benefits
                      • Efficient use of system resources when decoding multimedia.
                      • Allows small ARM systems to playback high resolution/bitrate multimedia content, which wouldn’t be possible using software-only decoding.
                          Disadvantages
                            • The proprietary libraries have no clear usage license.
                            • The android glue code is implemented as a “media player” (parallel to stagefright) instead of as OMX components.
                            • This media player has limitations when it comes to playing back content pointed to by Android URIs and some web-based content.
                            • There is no glue code for any other multimedia frameworks on GNU/Linux systems. The use of OMX would’ve rendered this a non-issue, with existing projects like GstOpenMAX.
                                Integration
                                Reverse Engineering
                                On June 15 2012 Iain Bullard started reverse engineering the proprietary libraries.
                                Some leading tablets (single core) as of April, 2012  per Merimobiles (with an office in Canada)
                                (Haipad I7 is now $99, the price of Ployer Momo9 is unchanged, see: HAIPAD I7 IPS 1024*600 Multitouch Screen with Android 4.0 Dual Camera 1080P HDMI [Merimobiles.com, Sept 10, 2012],  Haipad’s latest 7-inch ICS tablet Haipad i7 gets FCC clearance [Merimobiles blog, March 6, 2012], from Shenzhen Haina Electronic Co., Ltd “founded in 2003 as a high-tech company specializing in laptops and other digital mobile devices”)

                                comparison-chart-haipad-i7.png

                                The Allwinner A10 based tablets came to the global market from quite a number of vendors as shown by the following table (=50) compiled from two related threads from SlateDroid.com (note that global arrival of A10-based product started in Jan’12):

                                Comprehensive List of Allwinner A1X/A10 devices on SlateDroid.com, as of April 18, 2012 (first version: Feb 26, 2012)
                                A10 Tablets with less than 1GB memory („1st generation”):
                                AllDro Speed
                                Ainol: Novo 7 Advanced, Novo 7 Advanced II
                                OEM Novo 7 Advanced
                                Allview AllDro Speed
                                Audemars Piguet PC741 (w/ bluetooth)
                                Aura LY-F1
                                BRONCHO A710
                                Bmorn: V9 plus, V11
                                Dropad A8HD
                                Eken: MB1001, T01A, t10a
                                Eneoze 7 inch or 10 inch
                                Hyundai A7
                                ICOO: D70W, D90W
                                LY-F1 (Netpad A10, TPGA-7AWN, A710)
                                Leoxsys Leopad i7-1500
                                Moonpad2
                                Onda: VX610W, Vi20W, Vi10 deluxe edition, Vi20W deluxe (the original Vi20W is RK2918-based), Vi30W deluxe, Vx610w, VX580W Deluxe Edition (5” tablet)
                                Ployer: Momo8 (8″ screen 800×600), Momo9 (C, Enhanced, etc), Momo15 (10” screen)
                                Rexing V7
                                Sanei N70 N71 N72 N73 N80 N81 (N7x is 7” and N8x is 8”)
                                Saycool A710
                                Scroll Excel
                                Sigotech V700 (resistive touch)
                                Skypad Alpha 2
                                Teclast: P76 Resistive, P76ti
                                Tracer OVO
                                WoPad A7 (upcoming)
                                „2nd generation” A10 tablets (with 1 GB or more):
                                Ainol: Novo Elf, Novo Aurora
                                Bmorn V11 Extreme
                                Ampe A90
                                Gemei: G9, Gemei G2
                                Eken A90
                                Ployer Momo11 Bird
                                newman P81
                                Onda: Vi40 (8g, 16g, 32g/ 10” screen), Vi10 elite, 1GB Ram, 8 GB Flash, 1024×600 LCD
                                Teclast: P85 (8″ screen), A10
                                Later/OTHER devices (not verified, just put on the thread, THOSE WITH LINKS are from the Adding new Allwinner A10 CPU Devices THREAD [Jan 19-Sept 17, 2012]):
                                Ampe: A80, A85, A10
                                Andtai FG-A97
                                Benyi M8
                                Coby Kryos 7042
                                Gemei G3
                                Haipad i7
                                HKC M701
                                ICOO: D50 deluxe edition, D80W
                                iNote: V4, A8, A8-2, A-8-3
                                Kliver MB9703
                                MyAudio 908A
                                Naviatec MD710
                                Onda Vi40 Flagship
                                Polaroid PMID701C
                                Shimaro M5
                                Sinvigo M7
                                Sysbay s-mp99
                                Treq A10C
                                Trio Stealth Pro 7
                                VISTURE 3
                                Zonge M90
                                Yarvik Xerios TAB464
                                Xtouch X716
                                Woxter Tablet PC 97

                                Note that there were only couple of Chinese vendors with multiple Allwinner A10-based tablet offerings, namely: Ainol, Ampe, Bmorn, Eken, Gemei, ICOO, iNote, Onda, Ployer, Sanei, Teclast (i.e. just 11 out of 50).

                                There is a much shorter and later started list of Allwinner A13-based tablets on SlateDroid.com, see: List of Allwinner A13 CPU Devices [from Aug 1, 2012]

                                Then from April to August there were the following events unfolding in China as per Micdigi reports:

                                A13 is cheaper than A10 with only 512M memory and 800×600 resolution but without Bluetooth and HDMI. Allwinner A13 can be only used for 7-inch tablet PC and 8-inch tablet PC, it does not support 10-inch tablet PC.

                                Contrasted with VIA8850 and RK2906, A13 with low cost will have strong market competitive capability. The price of 7-inch tablet with A13 and capacitive screen will be less than $48 in May.

                                Rockchip has released RK2906 chip to defeat Allwinner A10. The chip is not different from RK2918 but it can only used for 7-inch tablet and 8-inch tablet.

                                The tablet based on RK2906 comes from Shenzhen DavidMid.

                                The two sample tablet PCs from SMIT are based on slot-in screen and flat screen. The price of the slot-in screen is less $8 than the price of the flat screen.  

                                The price of the PCBA sells for about $19, the tablet PC based on A13 solution, slot-in screen and capacitive control sells for about $47.

                                … The slot-in screen does not have external glass and interaction sets that it is cheaper. But the experience is not different from the flat screen. …

                                Remark: Embedded Touchscreen Technology and Market Analysis [Displaybank, March, 2010]

                                The embedded touch technology is divided into In-cell and On-cell technologies. Conventionally, only the In-cell technology which was exclusively developed by panel makers drew attention, but it entailed issues in technology and cost regarding a mass production by satisfying the touch function demanded by customers and market. The on-cell technology lies at a grafting point between the conventional touch industry infra and LCD panel industry that it tends to mutually supplement the two industries in terms of performance and function.
                                The embedded touch technology which includes above On-cell and In-cell technologies is ideal since it reduces thickness and weight as well as it overcomes shortcomings of the conventional add-on type: reduced transmittance, lowered readability due to contrast ratio decrease, and thick bezel width. Based on above advantages, related makers continue with the technology development. The market is yet insignificant, but it is expected to show high growth rate comparable to the Touch market’s growth.

                                Latest info:
                                On-cell Touch Screen Panel Slims Down Mobile Displays [Electronic Design, June 10, 2012]
                                TOUCH TECHNOLOGY IN SMARTPHONES EXPLAINED [FlatpanelsHD, Sept 19, 2012]

                                VIA8850 based on Cortex-A9 core is powerful than VIA8650. VIA8650 is so worse that some famous manufactures in China have not made their tablet PCs to introduce VIA8650 chip, such as Ramos, Window and TOBE.

                                VIA8850 will come with cheap price and powerful performance. It will be mainly used for SuperPad tablet PCs. It is said that VIA will release another chip for big-brand companies.

                                Actually it is same with VIA8850, but it has different name.

                                As VIA8650 chip is so worse, Infotmic [X200] 7-inch chip, Allwinner A10, Allwinner A13 have got most of the market share.

                                Could VIA8850 chip get more market share in this year?

                                1.  There are so many Allwinner A10 tablet PCs that the competition is so fierce. Some manufactures do not make any money. They will not continue to release A10 tablet PCs. Maybe they will release VIA8850 tablet PCs.

                                2.  VIA8850 based on Cortex-A9 core is [more] powerful than Allwinner A10 based on A8 core and A13 based on A8 core. With the resource of HTC, the system optimization of the VIA8850 tablet PC is excellent. It not only has powerful performance but also has cheap price.

                                3. VIA is a famous chip company in the world. They have good marketing channel.

                                Allwinner has released the A10 chip for about half a year. They have earned so much money including the investment cost and the profit.

                                VIA must do their best to earn the investment cost. The cost of VIA8850 is [more] expensive than Allwinner A13.

                                Allwinner has advantage in the price war.

                                Configurations: Infotmic solution, 256M memory, 4G storage, 7-inch resistive screen with 800×480 resolution, front facing camera, Android2.3 OS.

                                Infotmic X200 series are based on ARM11, 1GHz frequency, supports 1080P video decode.

                                Recent examples of tablets:

                                $39 AllWinner A13 Tablet (100K bulk) by Hott at IFA 2012 [Charbax YouTube channel, Sept 2, 2012]

                                Hott presents one of their latest cheapest tablet to manufacture and they also have a new cheap bluetooth and cabled speaker.

                                $46 AllWinner A13 by OMG at IFA 2012 [Charbax YouTube channel, Sept 2, 2012]

                                I show a range of the latest tablets by OMG of Shenzhen China. $46-$48 (if buying 500) AllWinner A13, $55 VIA Cortex-A9 [VIA/WM8850], $110 AllWinner A10 with 3G modem (likely Huawei).

                                $99 3G Allwinner A10 Eken G70 at IFA 2012 [Charbax YouTube channel, Sept 1, 2012]

                                Here’s a sub-$100 (in bulk) 3G-connected Allwinner A10 7″ capacitive tablet.

                                And here is an earlier $55 AllWinner Boxchip A13 Tablet Factory Tour [Charbax YouTube channel, May 27, 2012] to understand why and how the workforce is able to assembe the tablets at such a cheap price:

                                See how they are assembling the $55 (soon $49) AllWinner Boxchip A13 7″ Capacitive tablet. This Shenzhen factory assembly line cranks out about 4000 such tablets in a day’s work. If you like this video, you should also watch my Shenzhen Speakers Factory video (http://www.youtube.com/watch?v=3fcmbHMnqbo) that I posted last month. I think that they are treated better than Apple/Foxconn workers, I think they make better money, they have better working conditions (for example they may wear their own clothes), they probably have more flexibility and the work may be less monotonous. Yet, of course I think working conditions can be improved for all Chinese consumer electronics factory workers. My suggestion is that consumers must have the choice to buy “vouchers that go 100% to the workers that made the devices”, for example, decide to pay $5 extra for your tablet, and know that the $5 goes 100% to the factory workers that build it meaning you double their salary (if 50% of all consumers decide to give an average of $5 each per device).

                                AAPPAA Shenzhen JinPinXing Tablets [Charbax YouTube channel, Sept 2, 2012]

                                Here they’re showing [on IFA 2012 in Berlin] their PCB and Tablet casing designs. They claim to have the worlds thinnest 9.7″ IPS tablet at 8.9mm.

                                Some important information mentioned in the video:

                                MID-971:
                                – World’s Thinnest 9.7” [IPS] Pad
                                – Only 8.9 mm
                                – Built-in 3G (can be also without it)
                                – WiFi + Bluetooth
                                VIMICRO??? or Longcheer 2918/3066
                                – the WiFi only version is US$115-120 depending on quantity

                                MID-803:
                                – 8” Pad
                                – Built-in 3G
                                – Dual Camera
                                Rockchip 3066 dual core
                                – US$172 with 8GB and 3G

                                ?MID-973?: a 9” tablet with Allwinner A13 is said to cost US$73-74
                                30K tablets sold per month, can sell upto 50K per month
                                On their product microsite (see below) the tablets shown currently have the following SoCs and parameters:
                                Allwinner A10 (Cortex A8@1.5GHz): MID-501 and MID-702 (both 512MB DDR3 and 7” 800×480 with Android 4.0.4)
                                Allwinner A13 (Cortex A8@1.0GHz): MID-438 (7” 262×480 and Android 4.0.3), MID-703 (7” 800×480 and Android 4.0.4) both with 512MB DDR3
                                VIMICRO882 (Cortex A8@1.0GHz): MID-706 (512MB DDR3 and 7” 800×480 with Android 4.0)
                                – all the those are with capacitive touch screens, NAND FLASH 4GB/8GB/16GB / 32GB (optional), AMD graphics acceleration, full support for OpenGL ES2.0 (AMD Z340) and h.264 720P HD 1080i

                                Jinpin Xing Technology Co., Ltd., Shenzhen – Tablet PC – Products – [as of Sept 18, 2012]
                                深圳市金品兴科技有限公司 – 平板电脑 – 产品介绍


                                MID-702


                                MID-438

                                MID-971


                                MID-973


                                MID-708


                                MID-706


                                MID-501


                                MID-1001


                                MID-703

                                AAPPAA –About us [Aug 19, 2011]

                                AAPPAA, founded in 2005, is an established manufacture of smart digital products with super perfect design in MP3/4/5, Mini Speaker products field. We design and produce super perfect quality products, many of them are original which we ship to wholesale customers all over the world. Given the wide array of geographic regions across which we distribute product, we work closely with our customers and retail partners to ensure the AAPPAA team remains innovative and competitive in a constantly evolving market sector.

                                AAPPAA’s Success: AAPPAA’s success can be attributed to close collaboration with our global set of customers and partners combined with internal efforts to continually improve our productivity, design creativity and quality management initiatives. Through the years, AAPPAA has experienced tremendous growth while also enhancing the personal lives of our customers, and the well being of our loyal employee base. AAPPAA employs 60+ people with an average employment tenure of nearly 3 years a fantastic achievement amidst China’s explosive growth that has offered a continuous list of new opportunities of a young, energetic workers.
                                AAPPAA’s Manufacturing Capacity: AAPPAA’s 1500 square meters of manufacturing space and 60+ workers are based in Shenzhen China. We operate multiple production lines with SMT machines, hot plastic packing machines as well as high & low temperature age and vibration testing units. Production capacity exceeds 110,000 units per month. In addition, AAPPAA’s products are CE, FCC, RoHS certified.
                                Address: 5F, Nankeng No.2 Industrial Park Abuilding, Bantian Town, Longgang District, ShenZhen City 518129, China
                                Tel : +86-755-83579180    Fax:+86-755-83579189    E-mail: sales@aappaa.com

                                5. The wireless display and 2160p (“Quad HD”/4K) outlook

                                Wi-Fi CERTIFIED Miracast™: Your Content – Now Showing on Screens Everywhere [WiFiAlliance YouTube channel, Sept 18, 2012]

                                Wi-Fi CERTIFIED Miracast™ is a groundbreaking solution for seamlessly displaying video between devices, without cables or a network connection. Users can do things like view pictures from a smartphone on a big screen television, share a laptop screen with the conference room projector in real-time, and watch live programs from a home cable box on a tablet. Miracast connections are formed using Wi-Fi CERTIFIED Wi-Fi Direct™, so access to a Wi-Fi® network is not needed — the ability to connect is inside Miracast-certified devices. Miracast is an industry-wide solution, so the technology works well across devices, regardless of brand. Connections are easy to set up and use since the devices choose the appropriate settings automatically. Miracast supports premium content—like Blu-ray feature films, live television shows and sports, or any other copy-protected premium content—allowing you to watch what you want, where you want.

                                What that means practically is currently best shown by a non-Chinese tablet SoC vendor:
                                NVIDIA Tegra 3 Enhances Miracast Wireless Display [nvidia YouTube channel, July 26, 2012]

                                Watch how NVIDIA’s Tegra 3 can enhance the experience of the WiFi Alliance’s new open standard for wireless display called Miracast. From the same organization that established the ubiquitous Wi-Fi standard, comes the ability to wirelessly beam the display contents of your mobile phone or tablet directly to the large HDTV screen in your home without a wireless router. See how the performance of Tegra 3 can deliver the ultimate Miracast experience by bringing super clear HD videos and console quality game play with Tegra Zone games

                                What you see here is the Hardware + software optimization done by NVIDIA for Miracast. Since Allwinner is using its own video processing unit (VPU) which is said to be the fastest relative to the video engines of its Chinese SoC competitors (e.g. Amlogic) we can expect a similar to the NVIDIA’s kind of software optimization for the Allwinner VPU. (Take also into consideration “the company’s strategic intent to remain in the forefront of video acceleration technology” as it was proven in the “Allwinner Advantage” section before.)

                                In other respect a separate 3d party WiFi chip is coming into the play, and there is already quite a number of those chips already to be designated Wi-Fi CERTIFIED Miracast:

                                Easy-to-use, multi-vendor wireless display has arrived: Wi-Fi Alliance® launches Wi-Fi CERTIFIED Miracast™ [Wi-Fi Alliance press release, Sept 19, 2012]

                                Wi-Fi Alliance® today announced the launch of the Wi-Fi CERTIFIED Miracastcertification program. Miracast devices provide simplified discovery and setup, so users can quickly transmit video content from one device to another. Industry analysts predict annual shipments of Miracast-certified devices to exceed one billion units within the next four years.
                                Miracast users can do things like view pictures from a smartphone on a big screen television, share a laptop screen with the conference room projector in real-time, and watch live programs from a home cable box on a tablet. Miracast connections are formed using Wi-Fi CERTIFIED Wi-Fi Direct, so access to a Wi-Fi® network is not needed – the ability to connect is inside Miracast-certified devices.
                                “Wi-Fi users around the world want to experience multimedia on the device of their choice – no matter what brand – and Miracast is the breakthrough they have been waiting for,” said Edgar Figueroa, CEO of Wi-Fi Alliance. “We have been delighted with the level of enthusiasm and support among our member companies for this new offering.”
                                Miracast supports protected content streaming, enabling devices to stream feature films and other copy-protected materials. To protect premium content, Miracast uses a wireless adaptation of the trusted content protection mechanisms widely used today for cabled interfaces like HDMI® and DisplayPort. In addition, the latest WPA2™ security protections are automatically enabled on every device, making the transport of all multimedia content private.
                                “Miracast builds on Wi-Fi Direct with a compelling application,” said Brian O’Rourke from IHS iSuppli Research. “This is a big step forward in a market migration from single-vendor display solutions, into an offering from a wide array of vendors. With more than 1.5 billion Miracast devices expected to ship in 2016, the program is poised to have broad adoption.”
                                The technology underlying Miracast was developed in Wi-Fi Alliance by a diverse group of mobile and consumer electronics manufacturers and silicon vendors to standardize methods for simplified video sharing. Based on the Wi-Fi Alliance Display Specification, products bearing the Miracast brand interoperate across vendors, making it easy to enjoy video on screens throughout the home or office.
                                The first products to be designated Wi-Fi CERTIFIED Miracast, and which form the test suite for the certification program, are:
                                  • Broadcom Dualband 11n WiFi
                                  • Intel® WiDi
                                  • Marvell Avastar USB-8782 802.11n 1×1 Dual-band Reference Design
                                  • MediaTek a/b/g/n Dualband Mobile Phone Client, MT662X_v1 and DTV Sink, MV0690
                                  • Ralink 802.11n Wireless Adapter, RT3592
                                  • Realtek Dual-band 2×2 RTL8192DE HM92D01 PCIe Half Mini Card and RTD1185 RealShare Smart Display Adapter
                                    The first consumer products certified since testing opened to vendors include the LG Optimus G smartphone, Samsung Galaxy S III smartphone and Samsung Echo-P Series TV.
                                    More information, including a list of Wi-Fi CERTIFIED Miracast products, the Wi-Fi Alliance Display technical specification, white paper, and more is available at www.wi-fi.org/miracast.  
                                    Broad industry support for Wi-Fi CERTIFIED Miracast
                                    “As a Wi-Fi market leader, Broadcom is honored to be one of the primary certification solutions for the Wi-Fi Alliance Miracast™ program and is committed to driving new Wi-Fi standards,” said Dino Bekis, Senior Director, Wireless Connectivity Combo Group at Broadcom. “The standardization of this technology will enable consumers to easily and seamlessly share content across the ever-growing landscape of connected devices.”
                                    “Users clearly expect that they should be able to move their content and applications freely at home, at work, in the classroom, and on the go,” said Joe Van De Water, Director of Consumer Product Marketing at Intel. “Intel has seen tremendous user enthusiasm for Intel® WiDi, and as a member of the Wi-Fi Alliance, we support enabling this usage more broadly and are excited to announce WiDi as one of the first Wi-Fi CERTIFIED Miracast solutions.’’
                                    “We celebrate the launch of the Wi-Fi CERTIFIED Miracast program,” said Hyunghoon Oh, Head of LG Mobile Communication R&D Division. “Miracast brings an exciting advancement in the way devices deliver display applications.”
                                    “The Wi-Fi Alliance’s Miracast certification program will allow for easy sharing of video content, regardless of vendor,” said Bart Giordano, Director, Wireless Marketing at Marvell Semiconductor, Inc. “We have included Miracast in our solutions, and are honored to have been selected for the program’s test bed.”
                                    “The video streaming applications enabled by Wi-Fi CERTIFIED Miracast™ are key to the growth of the Wi-Fi ecosystem encompassing Consumer Electronics, Personal Computing, and Mobile devices.” said Mr. SR Tsai, General Manager of Wireless Connectivity & Networking Business Unit at MediaTek. “We are honored to have our Android mobile platforms, Digital TV, as well as our connectivity solutions for Windows platforms selected for the Miracast test bed.”
                                    “Miracast on NVIDIA Tegra will bridge the distance between mobile devices and high-def TVs, providing customers a rich – and cable-free – multimedia experience,” said Matt Wuebbling, Director of Product Marketing at NVIDIA. “We have embraced Miracast and are working with our OEM partners to bring its amazing possibilities to market.”
                                    “We are happy to have been involved in developing the Miracast program and to be one of the first companies to receive certification,” said Jessy Chen, Vice President and Spokesman at Realtek. “The solution will greatly expand the market for easy-to-use interoperable wireless display connectivity.”
                                    “As a leader in N-screen technology, Samsung has introduced AllShare Cast (based on Miracast), which is incorporated into most of Samsung’s high-end smart mobile devices including the GALAXY S III, GALAXY Note 10.1, and GALAXY Note II, “ said Hankil Yoon, Senior Vice President of Product Strategy Team, Samsung’s Mobile Communication Business. “We will continue to support the program, and plan to offer more Miracast-certified devices to our customers going forward.”
                                    “Sony Mobile is pleased to support the Wi-Fi CERTIFIED Miracast™ certification program. We continuously strive to deliver new exciting user experiences and Miracast™ technology will enhance our ability to offer consumers seamless connectivity to move their content freely between smartphones and other screens,” says Nikolaus Scheurer, Director Marketing Planning for Sony Mobile Communications.
                                    “Miracast will play an important role in enabling true seamless media streaming, gaming and content sharing between mobile screens and large displays,” said Ram Machness, director of marketing, Wireless Connectivity Solutions, Texas Instruments Incorporated. “Our OMAP™ platform, DaVinci™ video processors and WiLink™ connectivity products will offer Miracast-certified source and sink solutions to provide a rich experience for our customers’ end products.”
                                    About the Wi-Fi Alliance®
                                    www.wi-fi.org
                                    The Wi-Fi Alliance is a global non-profit industry association of hundreds of leading companies devoted to seamless connectivity. With technology development, market building, and regulatory programs, the Wi-Fi Alliance has enabled widespread adoption of Wi-Fi worldwide.
                                    The Wi-Fi CERTIFIED™ program was launched in March 2000. It provides a widely-recognized designation of interoperability and quality and it helps to ensure that Wi-Fi-enabled products deliver the best user experience. The Wi-Fi Alliance has completed more than 15,000 product certifications, encouraging the expanded use of Wi-Fi products and services in new and established markets.
                                    Wi-Fi®, Wi-Fi Alliance®, WMM®, Wi-Fi Protected Access® (WPA), the Wi-Fi CERTIFIED logo, the Wi-Fi logo, the Wi-Fi ZONE logo and the Wi-Fi Protected Setup logo are registered trademarks of the Wi-Fi Alliance. Wi-Fi CERTIFIED™, Wi-Fi Direct™, Wi-Fi Protected Setup™, Wi-Fi Multimedia™, WPA2™, Wi-Fi CERTIFIED Passpoint™, Passpoint™, Wi-Fi CERTIFIED Miracast™, Miracast™, Wi-Fi ZONE™ and the Wi-Fi Alliance logo are trademarks of the Wi-Fi Alliance.
                                    All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

                                    For Chinese vendors the WiFi-related MediaTek chips are the most accessible and affordable, so I am including the additional MediaTek press release as well:

                                    MediaTek Interlinks Mobile Devices and TVs for Wireless Display MiracastTM Applications [MediaTek press release, Sept 19, 2012]

                                    MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced that its 802.11a/b/g/n Dual-band Mobile Phone Client (MT662X), 802.11n Wireless Adapter (RT3592) and DTV Sink solutions (MV0690) have all been selected as part of the Wi-Fi CERTIFIED MiracastTM test bed. As the benchmark to drive interoperability testing for the newest Wi-Fi program, MediaTek’s Miracast-certified solutions allow mobile devices to wirelessly stream multimedia content, such as video and games, onto big screen DTVs without a connection to an access point.
                                    “We congratulate MediaTek on achieving selection to the Wi-Fi CERTIFIED MiracastTM test bed,” said Wi-Fi Alliance CEO Edgar Figueroa. “MediaTek’s participation in the development of this program has been instrumental in the achievement of industry-wide certification.”
                                    In a typical MiracastTM usage scenario, one device acts as the source (the transmitting device sending out the content) while the other becomes a sink (a receiving device displaying the content). Thanks to the new Wi-Fi test program and MediaTek’s proven technologies, interoperability and user experience of Miracast applications can be guaranteed.
                                    “We are partnering with MediaTek to provide consumers with high-performance, affordable smartphone solutions that incorporate the latest Miracast Wi-Fi display technology for the home and on the go, “ said Dr. Ji-Yang Wang, COO at TCL Communications Technology. “MediaTek’s industry-leading technologies, cross-platform advantages across home and mobile, and ‘hands-on’ approach to design and support, are essential in creating products that helps us deliver a compelling user experience and differentiated offering.”
                                    “The video streaming applications enabled by Wi-Fi CERTIFIED MiracastTM are key to the growth of the Wi-Fi ecosystem encompassing Consumer Electronics, Personal Computing, and mobile devices.” said Mr. SR Tsai, General Manager of MediaTek’s Wireless Connectivity & Networking Business Unit. “Having our Android Smartphone, Digital TV, as well as our connectivity solutions for Windows platforms selected for the MiracastTM test bed is a strong testament to the breadth and quality of MediaTek’s Wi-Fi technology.”
                                    MediaTek offers a broad portfolio of high-performance SoC and wireless connectivity solutions for the proliferation of smartphones, tablets, PCs, DTVs, Blu-ray players and AP/routers. The Wi-Fi CERTIFIED MiracastTM MediaTek solutions included in the test bed are:
                                    MT662X a/b/g/n Dual-band Mobile Connectivity Combo
                                    RT3592, Ralink 802.11n Wireless Adapter
                                    MV0690 DTV Sink
                                    The Wi-Fi CERTIFIED MiracastTM MediaTek solutions have entered mass production and are shipping in commercially launched devices.
                                    * Windows is a registered trademark of Microsoft Corporation in the United States and other countries.

                                    See also:
                                    Wi-Fi CERTIFIED Wi-Fi Direct™: Personal, portable Wi-Fi® that goes with you anywhere, anytime [Wi-Fi Alliance, Aug 15, 2010]

                                    As far as the 2160p (“Quad HD” or 4K) technology is concerned, which is already on our footsteps, I would first recommend to watch the below demo video available on YouTube in QUAD HD resolution. You should “simply” select the “Original” quality in full screen viewing mode, and if your monitor has sufficient resolution than you could get the proper experience (do not forget that your Internet connection should be sufficiently fast in terms of guarranteed dowload speed as well). If not than correspondingly less:

                                    IT005 QUAD HD 4K – Italy travel guide Bird watching [VOXLIBERTUM YouTube channel]

                                    Birdwatching in 4K on the River Adda. Natural Reserve maintained by Pro loco Villa D’adda – Footage courtesy by http://www.iris32.com – This 4K video is posted in original QUAD HD resolution. It has been produced with RED 16×9 HD with 4096 x 2304 pixel resolution. The color grading was done with REDCINE PRO X. It was mastered in FCP 7 with 4444 PRORES and than downscaled to 3840 x 2160 (QUAD HD) in PRORES 422 (LT) to reduce the file size under 20 GB. All original sequences used in this video are available on http://www.iris32.com. Should you require the 4444 PRORES original for maximum quality, please go to the IRIS32 website and mail a request. I hope you enjoy this little piece of birdwatching on the River Adda. Copyright 2012 – Frederick von Sulle, VOXLIBERTUM

                                    Then please watch another video which is showing what the leader in this TV technology, Toshiba was showing on the recent IFA 2012 fair in Berlin:
                                    Toshiba 4K Quad-HD 3840×2160 TVs with CEVO Engine upscaling/processing from 55″ to 84″ [Charbax YouTube channel, Aug 30, 2012]

                                    Toshiba is ramping up the production of their awesome Quad-HD screens, the 2D-only 55″ is awesome, but only for sale in Japan for now. But this year and the next, Toshiba is going to ramp up the manufacturing of these, I hope they lower the price of 55″ Quad-HD to sub-$2000 as soon as possible! The slideshows of 8 megapixel photos and 4K videos filmed with the Red camera videos look awesome on it!

                                    The reporter (Nicolas Charbonnier alias Charbax) did an excellent job with this video, as well as the Toshiba guy showing him around. Even his English is very good and enjoyable. Note that from [02:10] and “Glassless 3D” is shown and explained quite extensively, then highly zoomable Google Maps in 3D etc. Charbonnier is doing during all this an excellent job zooming with camera so one can really grasp the 4K and 3D experience quite well even in a normal viewing environment of your monitor. THANKS!

                                    More information:
                                    Toshiba unveils the first large-screen glasses-free 3D TV in Asia
                                    [Toshiba Singapore press release, May 3, 2012]
                                    Toshiba Brings New Generation of TVs and PCs to the Philippines Announces New Brand Ambassador [Toshiba Philippines press release, June 20, 2012]
                                    RZ1 SERIES NEW! Glasses-Free 3D TV [Regza Asia microsite, June 4, 2012]
                                    Toshiba Regza RZ1 [Toshiba Regza YouTube channel, May 31, 2012]

                                    Toshiba Regza RZ1 3D TV Review [gadgetguruindia YouTube channel, Aug 6, 2012]

                                    You can also watch Charbonnier’s shorter report about Sony 84″ 4K TV KD-84X9005 with 4K X-Reality Pro [Charbax YouTube channel, Sept 2, 2012] which came after Toshiba to the market and said to be widely available for Christmas.

                                    Finally: Status of the TV Display industry by Paul Gray, Director of European TV Research for DisplaySearch [Charbax YouTube channel, Aug 31, 2012]

                                    Here’s a 10-minute overview of the TV Display industry by Paul Gray, Director of European TV Research for DisplaySearch. Talking about Samsung, LG, Panasonic, Sharp, AUO, CMI, how they are losing money, how they are trying to bring new technologies like 3D and hopefully as soon as possible 4K to the market.

                                    6. Are the established client device players
                                    recognizing this strategic inflection point or not?

                                    Decide for your yoursel, dear reader:

                                    Ballmer trumpets Microsoft’s ‘epic year’ [The Seattle Times, Sept 15, 2012]

                                    Q: The iPad has the largest share of the tablet market, but its soft spot, it seems to me, is the price.With the Surface, are you planning to compete with the iPad on price or on features?
                                    A: We haven’t announced pricing. I think we have a very competitive product from the features perspective. …
                                    I think most people would tell you that the iPad is not a superexpensive device. … (When) people offer cheaper, they do less. They look less good, they’re chintzier, they’re cheaper.
                                    If you say to somebody, would you use one of the 7-inch tablets, would somebody ever use a Kindle (Kindle Fire, $199) to do their homework? The answer is no; you never would. It’s just not a good enough product. It doesn’t mean you might not read a book on it….
                                    If you look at the bulk of the PC market, it would run between, say, probably $300 to about $700 or $800. That’s the sweet spot.
                                    Q: Where do you see Microsoft’s position in five years, 10 years?
                                    A: First of all, I’d say: pre-eminent technology company. I think that in a back-looking view, people would say we were a software company. That’s kind of how we were born.
                                    I think when you look forward, our core capability will be software, (but) you’ll probably think of us more as a devices-and-services company. Which is a little different. Software powers devices and software powers these cloud services, but it’s a different form of delivery….
                                    Doesn’t mean we have to make every device. I don’t want you to leap to that conclusion. We’ll have partners who make devices with our software in it and our services built in. … We’re going to be a leader at that.

                                    Supply chain estimates x86 Surface Price at US$500-700 and RT below US$399 [DIGITIMES, Sept 18, 2012]

                                    Microsoft’s own-brand Surface tablets are expected to launch at the end of October with the related supply chain players estimating that the Surface RT’s hardware cost is at around US$300-400 and the end price will be less than US$399. However, the pricing is not confirmed by Microsoft.
                                    Microsoft’s pricing strategy for its own-brand tablets will relatively affect PC brand vendors’ pricing strategy and sales projections for their Windows 8 tablets. As the launch time at the end of October is approaching, PC brand vendors are keeping a close eye on Microsoft’s actions. With the related Surface pricing speculations having been floating around the market, Surface RT was previously rumored to be priced at only US$199, leaving the PC brand vendor in a cold sweat.
                                    Since CEO Steve Ballmer in a recent interview pointed out that a price level between US$300-800 will be the sweet spot for PC sales, some market watchers have interpreted the statement as a hint for Surface pricing.
                                    The sources revealed that the hardware cost of Surface RT is at US$300-400 and US$400-500 for the x86 version. Since the devices will not need to pay the licensing fee for the operating system. The RT version will be priced below US$399, while the x86 version is estimated to be US$100-200 higher based on hardware costs and priced at US$500-700.
                                    The PC brand vendors also pointed out that they will not be absent from launching x86-based Windows tablet products since Windows still has leadership position in the global enterprise market. If the x86 Surface’s end user price is at US$500-700, although they will feel the pressure from competition, the product line would still be profitable.

                                    Acer, Asustek Windows 8 tablet prices may be to high to attract consumers [DIGITIMES, Sept 20, 2012]

                                    Acer and Asustek Computer’s Windows 8 tablets are reportedly to be priced at above US$800, about the same price as the New iPad with the highest specifications, and market watchers are concerned that the high price may drag down consumer demand and impact the vendors’ performance.

                                    Although PC brands including Acer, Toshiba, Dell, Lenovo, Asustek, Samsung and Sony, have mostly unveiled or showcased their Windows 8 tablets publicly, their prices and specifications are still not yet to be officially revealed. However, some websites have recently leaked information about Acer and Asustek’s tablets including prices and specifications.

                                    Asustek is reportedly to release three Windows 8 tablet models and the 11.6-inch Vivo Tab will be priced at US$799.

                                    Acer reportedly will release two sizes of Windows 8 tablet – the 10.1-inch 64GB Iconia Tab W510 with Wi-Fi support only and priced at NZD999 (US$827), a keyboard accessory will raise the price to about US$993; and the 11.6-inch 128GB Iconia Tab W700 with Wi-Fi support only at NZD1,799 (US$1,490), and with a Bluetooth keyboard, the machine’s price will go up to about US $1,570.

                                    However, Acer and Asustek have both declined to comment on the leaked prices and only pointed out that they will host product launches in the near future. Intel has also recently sent out media invitations and will host a Windows 8 tablet conference on September 27 in the US to showcase tablets and convertibles from Acer, Asustek, HP, Lenovo, Dell, Samsung and ZTE to promote for the launch of Windows 8.

                                    Acer and Asus to Launch Windows 8 Tablet PCs in Q4 [CENS, Aug 22, 2012]

                                    Eying business opportunities created by the new Windows 8 operating system (OS), scheduled for release in October, Taiwan-based personal computer (PC) vendors Acer and Asus will soon launch Win 8 tablet PC models.

                                    Acer plans to launch two Windows 8 tablet PCs supporting keyboard input, and will soon launch several Android smartphone models, including the A9- and C-series in September. Acer`s CA and C1 smartphones will be demonstrated in pan-European market in the fourth quarter possibly in cooperation with some telecom carriers.

                                    Industry sources said that Asus` new tablet PC TF500T will be priced between its lower-end Transformer Pad TF300 and high-level model Transformer Pad Infinity TF700.

                                    Some institutional investors deem that after the Windows 8 products go to market, consumer response will decide how intensive PC vendors will promote compatible models.

                                    Lenovo has also announced to launch price-competitive Windows 8 tablet models priced from US$200 to US$300, with its IdeaPad Yoga notebook PC also to be announced in October.

                                    According to PC part and component suppliers, all major international vendors, including Dell, HP, Lenovo, Samsung, Acer and Asus, are actively developing Windows 8 products, leading to parts suppliers` revenue peaks in the fourth quarter.

                                    Compal Electronics Inc., a major contract notebook PC assembler, is reportedly developing Windows 8 notebook PC models for HP, which plans to unveil the new models in the fourth quarter to boost sales in the Christmas season.

                                    Acer to Keep Launching Netbook PCs: Chairman Wang [CENS, Sept 18, 2012]

                                    In the face of tablet PCs encroaching on sales of netbooks worldwide, J.T. Wang, chairman of Acer Inc., a Taiwanese, globally leading brand vendor of PCs, stated that his company will keep launching netbook models in the future.
                                    Since the launch of Apple Inc.’s iPad in 2010 ignited the market for tablet PCs, such emerging electronic devices have rapidly eaten into market shares of netbook PCs over the past few years. This forces most PC vendors, including Samsung, Dell and Lenovo, to consider giving up the diminishing market.
                                    Acer’s Taiwanese counterpart Asustek Computer Inc., which once rode on netbook PCs to achieve bigger shares of the global laptop market, also confirmed earlier that it will retire netbook PC production lines starting in the fourth quarter of this year, since such products, the company’s CEO Jerry Shen said, have already fulfilled tasks for the development of the global PC industry.
                                    Another factor prompting PC vendors to exit the netbook market is the lack of support from Microsoft and Intel. Accordingly, Microsoft doesn’t launch any starter edition of Windows 8 for netbook PCs, while Intel will focus the development of its Atom processors on tablet PCs and smartphones. This has made netbook PCs even more unworthy of development.
                                    But, Acer’s chairman Wang is still optimistic about the market for netbook PCs. He said that consumer demand for such devices will continue growing in emerging countries, not to mention that netbook sales in developed countries still make up a majority of the global total at present. Therefore, Wang said promotion of netbook PCs will remain part of his company’s product strategy in the short term.
                                    The latest statistics issued by International Data Corp. (IDC), a global PC market researcher, show that global sales of netbook PC totaled 8.913 million units in the first half of this year, with 26.2% of which supplied by Acer. The sales volume is estimated to reach between 15 million and 16 million units for the whole year.
                                    With most of its peers jumping out of the market, Acer, backed by strong brand recognition and huge outlets, is expected to take over most of the shares that they will leave to dominate this segment.

                                    Shares by Top 5 Brands in Global Market for Netbook PCs in Q2

                                    Ranking

                                    Brand

                                    Sales Volume

                                    Market Share

                                    1

                                    Acer

                                    1.182 million units

                                    26.2%

                                    2

                                    Asus

                                    1.019 million units

                                    22.6%

                                    3

                                    HP

                                    413,000 units

                                    9.2%

                                    4

                                    Samsung

                                    407,000 units

                                    9.0%

                                    5

                                    Canaima

                                    293,000 units

                                    6.5%

                                    Source: International Data Corp.

                                    Contract Manufacturers Make About Nine Out of 10 Media Tablets in 2012 [IHS iSuppli press release, Sept 21, 2012]

                                    Although your new media tablet may sport the logo of a familiar brand name like Apple or Amazon, there’s a 90 percent chance the device was actually made by a company with a much less famous moniker, such as Hon Hai or Quanta.
                                    That’s because the vast majority of tablets—including the iPad and Kindle Fire—actually are made by contract or outsourced manufacturers based in Asia, according to an IHS iSuppli Global Manufacturing & Design Report from information and analytics provider IHS. (NYSE: IHS). The percentage of tablets made by outsourced manufacturers is set to rise this year and beyond as brands seek to minimize operational risks and reduce costs.
                                    Outsourced manufacturers in 2011 were responsible for 87.5 percent of tablet production, compared to 12.5 percent that were made in-house. The percentage of outsourced tablets this year is expected to increase to 89.2 percent, with the portion claimed by in-house production projected to decline to 10.8 percent, as shown in the figure below. The years after that will see the share by outsourced manufacturing of tablets remain in the low 90 percent range, hitting a high of 91.1 percent by 2015 before settling back down at 90.4 percent in 2016.
                                    “The high percentage of outsourced manufacturing of tablets reflects the choice among tablet brands and original equipment manufacturers—even ones as big as Apple—to refrain from in-house production,” said Jeffrey Wu, senior analyst for OEM at IHS. “Tablet brands use outsourcing for many reasons, including faster time to market; the leveraging of capabilities, especially for firmware development and hardware integration; and asset flexibility that translates into reduced corporate expenditures and lower headcount.”
                                    Hon Hai Dominates Tablet Contract Manufacturing
                                    The biggest contract manufacturer of tablets is Apple partner Hon Hai, of Taiwan, also known as Foxconn. Hon Hai accounted for 62 percent of tablet shipments last year. The company’s position in the tablet space is unique—not only because it accounts for the majority of tablet shipments in 2011, but also because of its close relationship with Apple.
                                    Hon Hai is an EMS provider, a type of outsourced manufacturer that generally does not participate in designing product but simply offers manufacturing and supply chain management services. EMS providers for the most part control a smaller piece of the outsourced manufacturing space for computing products like notebook PCs—traditionally dominated by a rival group of makers known as original design manufacturers (ODM), which enjoy an advantage over EMS providers by being able to design products and offer manufacturing services alike. In the tablet production space, however, ODMs are the underdogs.
                                    This is because Hon Hai, with Apple as its main client, holds the coveted right to make the iPad, the industry’s best-selling tablet by a wide margin. The ODMs have then been left to scramble for what remains of the tablet market—making rival devices for the likes of Barnes & Noble, Amazon and Asus, none of whose product offerings matches the iPad’s soaring sales and unequalled clout.
                                    Android and Windows Power Rise of ODMs in Tablet Market
                                    With the emergence of Android—and soon, Windows-based tablets—ODMs will have a better chance of breaking Hon Hai’s near-impregnable hold on the market. If the Android and Windows tablets prove successful, ODMs could see their share of the tablet outsourcing market grow, expanding to as much as 53 percent by 2016, on the assumption that consumers will embrace iPad alternatives.
                                    Nonetheless, concerns for ODMs and Hon Hai alike could be in store.
                                    Currently sidelined in much of the dynamic tablet space, ODMs also have concerns about their prospects in future tablet production. Most ODMs make notebook PCs as well, and choosing to produce tablets for other clients could mean endangering their own stake in the PC market—much as tablets are now eating into the share traditionally enjoyed by notebook computers among consumers. However, strengthening their foothold in the tablet space is inevitable for ODMs, especially as tablets continue to gain momentum at the expense of notebook computers.
                                    ODMs also face potentially higher operating expenses and risks with the emergence of more tablet platform options—signified by the rise of Android and Windows—which would involve additional research and development costs in order for ODMs to maintain technical capabilities on those fronts.
                                    Hon Hai, the current champion among tablet producers, is likewise not entirely free of peril. Should Apple shift some of its tablet production to other contract manufacturers in an effort to diversify its contract manufacturing base, Hon Hai could suffer a blow.
                                    For other tablet brands like Samsung and Motorola that choose in-house production, their share of tablet manufacturing is not expected to exceed the 12.5 percent that the collective in-house space saw in 2011. Share of in-house production in the years ahead will stay in the 9 to 10 percent range, IHS  predicts, as ODMs and EMS providers battle fiercely among themselves for an increasing stake in the hotly contested tablet business.

                                    7. Possible further hardware advances
                                    sustaining this new trajectory.

                                    The current and already mature value proposition in brief is:

                                    the rhombus tech initiative, along with the EOMA-68 standard, has been designed to tackle the very problems that RockChip and other SoC vendors face. our strategy is very straightforward:

                                    a) invite SoC vendors to release EVBs in a standardised modular form which can go straight into mass-production, needing only a very simple 2 to 4 layer PCB for the main I/O of any matching product.

                                    b) standardise and therefore greatly simplify the software development. the advantage of having standard I/O boards (products into which the CPU Modules can fit) is that the software for those products will already have been written. porting a CPU Card to work in a range of existing hardware products is far, far simpler than forcing everyone to design complete products from scratch (including the software).

                                    the cost savings and time savings should be evident, and this is absolutely critical and will only become more so as the prices are driven down further by 28nm and beyond, as well as the product lifecycles becoming shorter and shorter.

                                    it’s quite complex to explain initially but very straightforward once it’s fully understood, and very exciting as well. would you be so kind as to mention to Mr Chen that we would love to work with him, especially to help introduce RockChip CPUs properly into the Free Software Community, which will result in considerable engineering cost saving for RockChip, apart from anything else? i am easy to find on the internet but here is my email address anyway: lkcl@lkcl.net

                                    Comment on 10/1/2012 by Luke Kenneth Casson Leighton, CTO at Rhombus Tech entered for China Fabless: Rockchip rattled by Android tablet wars [EE Times, Sept 25, 2012] 

                                    Latest information: A10 EOMA-68 CPU Card [luke.leighton | 24 Nov, 2012]

                                    hi folks, small update: wits-tech detected an ambiguity in how the usb
                                    interfaces work, which needed clarification from allwinner as well as
                                    a PCB layout alteration.  we'll have more details as-and-when they're
                                    available to us and as-and-when knowledge of the solution has been
                                    shared with is.  usual china "save face" thing is going on at the
                                    moment i.e. don't share details of the problem until a full solution
                                    has been found.
                                    
                                    what this translates into is at least another 2 weeks whilst the new
                                    PCB layout's done and the new sample PCBs are printed.  obviously
                                    that's an estimate, as it's beyond our control.

                                    Note: wits-tech = Shenzhen WITS Technology Co.,Ltd

                                    The original concept of a year ago:

                                    Embedded Open Modular Architecture/EOMA-68 [Embedded Linux Wiki, Sept 23, 2012]
                                    earlier: Embedded Open Modular Architecture/PCMCIA [Embedded Linux Wiki, Sept 5, 2011 – March 11, 2012]

                                    The Obligatory Tablet – a simple tablet motherboard which could potentially be developed as a very low cost single-sided 2-layer PCB. Components are chosen to reduce development cost and risk, as well as reduce manufacturing cost.

                                    Embedded Open Modular Architecture/EOMA-68/Tablet [Embedded Linux Wiki, Sept 21, 2011],
                                    note that what is excerpted below had not essentially been changed till Feb 12, 2012, the last date of change for this wiki page

                                    The Tablet Motherboard

                                    Popular by decree, but only successfully-sold when the price is stunningly low yet the feature-set rich, tablets are the “must-have” for all ODMs and OEMs who aspire to a chunk of the large apple pie. Key goals for this motherboard are therefore to be small, slim, low component count and based on a low-risk development strategy. Thanks also to the modular design, the board is sufficiently simple that it may even be possible to do as a single 2-layer PCB, thus reducing costs even further.

                                    Connectors and Components

                                    The connectors required are:

                                    • 1x USB2
                                    • PCMCIA Connector “inline” (signals conforming to EOMA/PCMCIA Standard)
                                    • 5V Power
                                    • 1x PCI Express “inline” (supporting USB Wifi, not PCI-e Wifi, such as RT2070 and RT8191)
                                    • 1x Stereo Speakers and Microphone
                                    • 1x RGB/TTL LCD Output (with LED Backlight)
                                    • 2x Battery Connectors

                                    Major components are:

                                    • An STM32F103RBT6 Embedded Controller (same as in the Micro Engineering Board)
                                    • A 4-port USB-2 High-speed Hub (e.g. FE11
                                    • 12.5Mhz XTAL (for the USB Hub)
                                    • Power Management ICs (Buck Converters for 3.8v Lithium to 5.0v; 3.3v LDOs)
                                    • Step-up DC-DC Converter for the LCD Backlight AP3029
                                    • An I2C EEPROM
                                    • An RT2070, RT8191 or Atheros ath9k USB-compliant MiniPCIe WIFI Module
                                    • An Antenna for the WIFI Module
                                    • A 7in LED-backlit LCD (e.g. AT070TN93)
                                    • A resistive or capacitive touchpanel (resistive: low-cost; capactive: expensive, often more expensive than the LCD)
                                    • A slim-line PCMCIA Ejector Assembly

                                    The estimated BOM is therefore around the $30 to 35 mark [Sept 21, 2011 !], excluding the EOMA/PCMCIA-compliant CPU Card, and including the batteries, case and WIFI module. The most expensive component is the LCD Panel, whilst the 2nd most expensive one is the batteries.

                                    Diagram of Tablet Motherboard Layout

                                    From this diagram, it can be seen that there is very little involved. Like the Odroid, it’s possible to have a product where the connectors and buttons define the size of the PCB more than the ICs and discrete components. In this case, many of the major connectors (such as USB-OTG, HDMI, Micro-SD and Headphones) will already be on the EOMA/PCMCIA-compliant CPU Card, leaving nothing left for the motherboard than to provide USB2 and Power connectors! An alternative revision is also shown which takes a USB 3G Modem, in PCI-e form-factor.

                                    image

                                    Diagram of Tablet Construction

                                    image

                                    Others:     Laptop                                               LCD Monitor (TV)

                                    File:A10 eoma pcmcia laptop.pngFile:EOMA Lcd tv motherboard.png

                                    Embedded Open Modular Architecture/EOMA-68 [Embedded Linux Wiki, Sept 23, 2012]
                                    earlier: Embedded Open Modular Architecture/PCMCIA [Embedded Linux Wiki, Sept 5, 2011 – March 11, 2012],
                                    note that the excerpts below are essentially as of Sept 21, 2011, image: Jan 16, 2012

                                    EOMA-68 Specification

                                    This page describes the specification of EOMA-68. The number of pins on the interface is 68; the physical form-factor is the legacy PCMCIA.

                                    Re-purposing of the PCMCIA interface and form-factor has been chosen to create portable Embedded Computing Modules (Computer on Module). Mass-volume “Lowest Common Denominator” interfaces have been chosen, all of which have existed for over a decade, but are low-power enough to be standard across virtually all mass-produced powerful Embedded CPUs.

                                    The interfaces are:

                                    • 24-pin RGB/TTL (for LCD Panels)
                                    • I2C
                                    • USB (Low Speed, Full Speed, optionally Hi Speed/480 Mbit/s and optionally USB3)
                                    • 10/100 Ethernet (optionally 1,000 ethernet)
                                    • SATA-II (optionally SATA-III)
                                    • 8 pins of General-purpose Digital I/O (GPIO).

                                    These interfaces are NOT OPTIONAL for CPU Cards. All CPU Cards MUST provide all interfaces. I/O Boards on the other hand are free to implement whichever interfaces are required for the device. For example: whilst all CPU Cards must have an SATA interface, devices such as tablets or laptops into which CPU Cards are plugged are not required to have an SATA hard drive.

                                    Future Versions

                                    … At the time of writing (2011), the interfaces in the 1.0 Specification are “Lowest Common Denominator” yet are still present across the majority of 2011’s powerful embedded SoCs (OMAP4440, Enyxos4210, Tegra 3, iMX53 etc.) However, in the future, the “Lowest Common Denominator” could well comprise MIPI instead of RGB/TTL, 2 lane PCI-express (or its successor), and USB-3 instead of USB-2 (perhaps even a faster version of ULPI).

                                    As of 2011 however, the total number of Embedded CPUs supporting all these newer interfaces and still keeping to a 1.5 watt budget is precisely zero. Support for these high-speed interfaces will therefore be re-evaluated in 2 to 3 years time, and a future version of this standard created when a large proportion of available embedded CPUs have these or other high-speed interfaces that are available at the time.

                                    The project had been initiated by a Crowd funding proposal [Rhombus Tech, Dec 25, 2011],

                                    note that Rhombus Tech website rhombus-tech.net started on Nov 18, 2011 as well as there was an earlier low-cost EOMA-PCMCIA CPU Card initiative (allwinner cortex a8) e-mail by Luke Kenneth Casson Leighton <lkcl@lkcl.net> on Dec 14, 2011
                                    To: opensuse-arm@opensuse.orglinaro-dev@lists.linaro.org, arm@lists.fedoraproject.orgmeego-community@meego.com,ubuntu-server-arm@lists.ubuntu.com,   maemo-developers@maemo.org, gentoo-embedded@lists.gentoo.orggeneral@lists.tizen.org,
                                    ARM <debian-arm@lists.debian.org>
                                    Cc: Linux on small ARM machines <arm-netbook@lists.phcomp.co.uk>

                                    Aim: Small (Free as in Speech) Linux device which can be upgraded

                                    In particular, a small CPU card which:-

                                    • Complies with GPL (Free as in Speech)
                                    • Powerful
                                    • Upgradeable
                                    • Cheap

                                    For example I can buy a tablet, after a few years the display, touch-screen and memory will be perfect. After a few years I may want to upgrade the CPU, or fix a software bug, or both – at the moment this is not possible.

                                    We are aiming for this CPU Card will have full GPL Source Code publicly available and will be suitable for many purposes including use as a Freedom Box, or as an embedded computer, or in the future to drive products such as Tablets, Laptops, IPTVs and Desktop PCs simply by plugging it in. These devices can then run a nice GNU/Linux distribution like Debian, Ubuntu or similar.

                                    Current Situation
                                    Not many tablets or small devices run a nice GNU/Linux distribution like Debian, Ubuntu or similar. They are either low powered, closed source, GPL violating or not cheap.
                                    The problem that if you want low-cost mass-produced hardware, you normally have to go with GPL-violating product. We then spend the majority of our time reverse-engineering before getting something useful. By the time we are done, the product is usually end-of-life: thus if it breaks, we are back to square one. If there is a security bug in the kernel supplied – again we are back to square one.
                                    The reason for the GPL violations is that the low-cost China-based Factories simply have zero software skill and a chain of about five business relationships between the seller and manufacturer. The manufacturer has got their money at this stage, so at this point we are asking the manufacturer for more effort in return for no extra income. Thus, we logically concluded that the only way to get non-GPL-violating product out there is to go directly to the factories and be the supplier of their software.
                                    Aim of this Funding Round
                                    To get funding, to deliver a stable CPU on a card:-
                                      • GPL: Full source code available.
                                      • Powerful: 1.5ghz
                                      • Upgradeable: A standard layout, which will allow the card to be ejected and replaced.
                                      • Cheap: Stable version at $30
                                        Long Term Aim
                                        High-volume production, then the costs will be $15. Yes $15 for GPL-Loving, powerful, packaged CPU Card.
                                        So put this with :-
                                          • 2000mAh battery $8,
                                          • 7in 800×600 LCD $15,
                                          • resistive touchpanel $5,
                                          • main motherboard including WIFI module about $8,
                                          • Case about $3

                                            Total of $39. yes, really – $39. So basically, you can see that a mass-volume retail cost of about $80 for a 7in tablet with the Allwinner A10 and a resistive touchpanel would be quite reasonable. Running Debian, with a CPU upgrade only costing $15.

                                            Progress So Far
                                            Rhombus Tech has been established to serve Free Software Developers, entrepreneurs, enthusiasts and Engineers with access to affordable, modern and importantly GPL-compliant hardware. It is a Community interest company – designed for social enterprises that want to use their profits and assets for the public good.
                                            Over the past two years we been contacting and vetting China-based factories, directly, to find at least one which is prepared to work with us. We found one.

                                            We have also found an absolutely great CPU, called the Allwinner A10, which in mass-volume quantities is only about $7: that means that a PCB similar to the raspberrypi with similar features can be made for about $15 (not $25) and, because the Allwinner CPU is an ARM Cortex A8 not an ARM11 it is at least three times quicker than the raspberrypi’s CPU. (A 400-pin highly feature-rich 1.5ghz ARM Cortex A8 with a MALI400 GPU. )

                                            We have full support of the Board of Directors of the Allwinner CPU: they released full source code to us in advance. We have made it available and found it to compile successfully.

                                            We have selected a standard layout, which will fit within 55mm, which large number of pins can be removed by the user without damage. Which will be the cases are already available and which will have a trivial cost in low-volumes. A PCMCIA format.
                                              • Complies with GPL – Yes
                                              • Powerful – Yes
                                              • Upgradeable – Yes
                                              • Cheap – Not yet.
                                                Next Steps
                                                The primary reason for using a Community Interest Company for the sale of GPL-compliant products to Free Software Developers is that profits from sales will be re-invested directly into development of further products, with a primary focus of serving the Free Software Community yet at the same time leveraging mass-volume sales opportunities.
                                                But this needs a kick-start. Then the end-product will get cheaper, then profits are re-invested and end-products get cheaper still. The snowball needs a little magic snow to get it started.
                                                Magic Snow required: $13,500
                                                To fund the three stages:-
                                                  • Unstable (Also know as Sid for all Debian lovers) : $3,500
                                                  • Testing Stage: $4,000
                                                  • Stable: $6,000
                                                  • Long Term Support: Self-funding
                                                    Unstable
                                                    5 CPU cards available at a cost of $3,500
                                                    A initial cost of $2000 per “board development change”. This is the non-recurring expense. This sets up the PCB tooling so further changes cost about $1500. The aim is to have a development board, tweak then have a second set of development boards.
                                                    This gives us the hardware only – about 5 development boards available. Time for the 15 Debian developers, already on board to start coding. (Bootloader, Kernel and main software).
                                                    Timeframe – AA months
                                                    Rhombus Tech to loan the boards to the developers, free as in beer, in return for help with coding.
                                                    Testing
                                                    100 CPU cards available at a total cost of $4,000 Timeframe – AA + BB months
                                                    We have a board, the bootloader work and the kernel is okay. No full Distribution images as yet. If you are a software developer and are basically happy to get involved doing u-boot, debian-installer, ubuntu images a board is suitable to play with at this point. Hard, but not impossible.
                                                    Rhombus Tech to loan half (50) CPU cards to developers, free as in beer, in return for help with coding. The other half of the board to be sent as premium rewards.
                                                    Stable
                                                    250 CPU cards available at a total cost of $6,000 Timeframe – AA + BB + CC months
                                                    Rhombus Tech to give 50 boards to developers, free as in beer who helped with coding. The remainder of CPU cards to be sent as rewards.
                                                    Long Term Support (Just for Ubuntu lovers)
                                                    Timeframe – AA + BB + CC + DD months CPU Cards at less than $30
                                                    The CPU cards can then be produced in mass-volume. Sold through Rhombus Tech, with profits used to seed further CPU upgrades.
                                                    Rewards
                                                    Total funds required for Unstable, Testing and Stable stages: $13,500
                                                      • Testing CPU Cards – $50 (Aiming for 50 = $2,500)
                                                      • Stable CPU Cards, with working OS image – $50 (Aiming for 50 = $2,500)
                                                      • Stable CPU Cards – $35 (Aiming for 200 = $7,000)
                                                        Special Rewards
                                                          • A Rhombus Tech Sticker sent world wide – $5 ($1.50 profit per sticker)
                                                          • Mention in the source code – $5
                                                          • A certificate mentioning your contribution to the Small (Free as in Speech) Linux device which can be upgraded. – $10
                                                          • A testing CPU Card, with your choice of Debian Packages loaded by a Debian Developer – $250
                                                          • You select the code name for the Unstable Board (legal, ethical names only) – $250
                                                          • You select the code name for Testing CPU Card (legal, ethical names only) – $500
                                                          • You select the code name for Stable CPU Card (legal, ethical names only) – $1,000

                                                          Then more information came in the for of FAQ [Rhombus Tech, March 25, 2012]

                                                          What’s the goal, again?
                                                            • To create a synergy between the ultra-low-cost Factories and SoC vendors of China with their expertise in Hardware, and Software (Libre) Developers with their expertise in GNU/Linux and other OSes, with a view to leveraging the combination to create affordable and desirable mass-volume products that are GPL-compliant before they hit the Retail Hypermarket shelves;
                                                            • For those products to be modular, versatile and open, so that they can be upgraded without the environmental waste of throwing away an entire device; for Retailers, Factories and users to be able to keep up with the rapid and increasing pace of technological development;
                                                            • For anyone to be able to use the products for their original purpose as well as for Educational purposes, Research, Engineering and more.
                                                              How will this goal be achieved?
                                                              Very carefully, in small steps, having learned from the experiences of the OpenMoko and OpenPandora projects.
                                                                1. Produce very simple EOMA-68-compliant CPU modules which can act as stand-alone computers in their own right (powered via USB-OTG) so that Software (Libre) Developers have something to start working on.
                                                                2. Start designing IO boards.
                                                                3. Software (Libre) Developers help develop the software to run on the products.
                                                                4. Products go to market.
                                                                5. Profit.
                                                                6. Use profits to repeat the process, to the benefit of all parties, including the Software (Libre) Developers.
                                                                  And… a CIC? really? But those are for Social Clubs!
                                                                  The rules for CICs are “to not make a loss”, which makes sense for any business. There is no limit on the profitability of a CIC: it’s just that, at the end of each Financial Year, the profits have to be allocated to a charitable cause, or they have to have been ploughed back into the business. A Community Interest Company simply does makes more sense in the context of the goals of bringing Software (Libre) Developers together into this exciting technological area that has previously been dominated by vertical market sales strategies.
                                                                  Why is the price of the Allwinner A10 EOMA-68 Card $15?
                                                                  It damn well isn’t! We are getting a massive amount of misunderstandings about this. We have reported that based on estimates from the Reference Board supplied by the Manufacturer of the SoC that the MATERIALS COST is APPROACHING $15 in MASS VOLUME quantities of 100,000 units.
                                                                  That is excluding a case, power supply (which as the unit can be powered by USB-OTG is not needed), packaging, tax, customs duty, shipping and, most importantly, a profit margin.
                                                                  Any company has to make a profit, and a CIC is no different. Charities and Not-for-Profit Foundations can get away with not making a profit, but Rhombus Tech is not a Charity.
                                                                  Profits made will be used to fund Free Software Developers, as well as future CPU Cards and the creation of Reference Design Products: Laptops, Routers and so on, all of which will be done in an Open fashion.
                                                                  What is EOMA?
                                                                  It stands for “Embedded Open Modular Architecture”. The concept of modular architecture isn’t new: many companies have divided out CPUs into separate PCBs or modules, but it just hasn’t been done recently, not on a mass-volume scale and not on a user-controllable basis. See the elinux.org EOMA page for more information.
                                                                  Why re-use PCMCIA??
                                                                  It’s legacy – nobody makes PCMCIA cards any more: it’s all changed to the PCIe-based “PCI express” aka “ExpressCard” thing. However, it turns out that Satellite TV “Conditional Access Modules” are in PCMCIA form-factor, meaning that the connectors, housings and assemblies are all still mass-produced. So there’s less risk of having someone destroy their CPU card if they force-break the mechanical barriers (see specification for details) but the pricing on parts is still good in mass-volume quantities.
                                                                  What’s so special about the interfaces on EOMA-68?
                                                                  The interfaces that have been picked happen to have been around for at least a decade, and the number of pins, including 16 pins of GPIO and including enough GND pins to separate each of the high-speed signals, by a jammy coincidence comes to exactly 68 pins.
                                                                    • RGB/TTL: 28 pins
                                                                    • USB2: 2 pins
                                                                    • I2C: 2 pins
                                                                    • 10/100 Ethernet: 4 pins
                                                                    • SATA-II: 4 pins
                                                                    • GPIO: 16 pins
                                                                    • 5V Power: 2 pins @ 0.5A per pin
                                                                      The total comes to 58 pins, and there are 5 groups of GND pins to separate each group. Grand total: 68 pins. jammy or what? More information is available here.
                                                                      Whoa, wait, PCMCIA is 100ohms approximately!
                                                                      Yes, we know. It’s not all bad. By a coincidence, SATA-II is 100 ohms and USB-2 is 90 ohms. We think that’s close enough. Absolute absolute last resort: both SATA-II and USB-2 can be ramped down in speed. This would be a bugger, but at least product would work. Other than that: yes it is possible to adjust impedance through careful placement of tracks and ground planes etc.
                                                                      Bottom line: we’ll just have to pick the right PCMCIA connector supplier, that’s all.
                                                                      Why is the first CPU that RHT picked a China-based one?
                                                                      Cost and features – pure and simple. Consumers do not care about Software Freedom – they just don’t. Only Software (Libre) Developers care about Software Freedom. However, GPL Compliance is very very important to RHT, because we do not wish to be liable for GPL violations, and we do not wish our mass-volume Retail Hypermarket Clients to be liable for GPL Violations, either. So, RHT has spent the past two years negotiating with SoC vendors to find one that has the three critical factors of: 1) Cost 2) features 3) GPL Compliance. Amazingly, it was a China-based Fabless Semiconductor Company that first met the requirements. Yes we are looking for more.
                                                                      Which CPUs have you analysed so far, and why were they rejected?
                                                                      We have analysed dozens of CPUs. With the exception of the Allwinner A10, none of them really fulfil all of the criteria. This section turned out to be so large that it was moved to its own page: Evaluated CPUs.
                                                                      So what FSF Hardware-Endorseable options are there?
                                                                        • The Ingenic MIPS jz4760 (700mhz) – $USD 7 in mass-volume
                                                                        • The 600mhz ARM Cortex A8 OMAP 3503 ($19, 1k volumes)
                                                                        • The 720mhz ARM Cortex A8 AM3357 – ($14, 1k volumes and $5 in 100k)
                                                                          Sadly, none of these CPUs however fulfil the mass-volume criteria of being able to do 3D Graphics or 1080p video. Some of them can do 720p, but that is not enough for commercial mass-volume purposes: it really does have to be 1080p now. 4 years ago, 720p was acceptable: now it isn’t.
                                                                          These CPUs are listed on the Evaluated CPUs page.
                                                                          Is this an “Open Hardware” Project i.e. can I get the full schematics?
                                                                          This is a misleading question: here’s some clarification. The EOMA-68 initiative is an “Open Specification. That means that anyone can create either CPU cards or motherboards that conform to it. Thus, it is possible for anyone to create an “Open Hardware” compliant CPU card or motherboard.
                                                                          Rhombus Tech has chosen to work with a small, dynamic factory in China that loved the idea of the “we’ll do the software if you do the hardware” deal. It would be rather a different proposition for us to then ask them to release the full schematics.
                                                                          Also in development is a 8mm-high (Type III) EOMA-68 CPU card with a AMD 64-bit x86 APU with Dual-core CPU, integrated Radeon 3D Graphics, with full Free Software support.
                                                                          Bari also has an initiative to turn the Beaglebone or any other ARM SOC or AMD Fusion APU into an EOMA-68 CPU card, if enough people show interest in this happening. Given that the Beaglebone (and other systems like it such as the IMX53QSB, Origen, Pandaboard etc.) schematics are available under an Open Hardware License, the Beaglebone EOMA-68 CPU Card will be “Open Hardware”.
                                                                          Additionally, given that the Leaflabs Maple is an “Open Hardware” Project, there exists the possibility for the creation of EOMA-68-compliant Motherboards based around the adaption of Leaflabs Maple Boards.
                                                                          Summary of the above: it’ll happen. (update: 10jan12 – sooner than anticipated!schematics being developed here).

                                                                          Rhombus-Tech/ allwinner a10/ news

                                                                          24 Jul 2012: Casework for EOMA-68 CPU Card

                                                                          Titoma Design is delighted to be involved with the EOMA-68 project and has a preliminary design for the first EOMA-68 CPU Card, using the Allwinner A10 SoC. Titoma Design specialises in casework and full product design, and will be more than happy to assist clients to develop products based around the time and cost saving benefits of the EOMA-68 upgradeable design strategy.

                                                                          28 Jul 2012: GPIO and Expansion Headers for EOMA-68 CPU Card

                                                                          A rework of the GPIO and Expansion Headers for the first Qimod EOMA-68 CPU Card has been carried out. Almost all interfaces available of the Allwinner A10 CPU have been made available on the 55x85mm Credit-card-sized CPU Card, including both Transport Streams, SIM Card, PATA, the 24-pin Camera Interface, both 24-pin LCD Interfaces, VGA, Composite Video (CVBS), SPDIF, AC97, I2S, GPS, CAN-Bus, Infrared, and many more. This is in addition to the standard EOMA-68 Interfaces of Ethernet, I2C, SATA, LCD 24-pin RGB/TTL, USB2 and 16 GPIO pins.

                                                                          The rework involved adding an extra optional 45-pin FPC, which is in addition to the optional 44-pin FPC. The orders page has been updated to reflect the full pinouts, as well as the finalised selection for the 16 EOMA-68 GPIO pins.

                                                                          The most current product information therefore is available on Preorders [Rhombus Tech, July 28, 2012, but preorders are listed from Dec 12, 2011 to Sept 23, 2012]

                                                                          This is the preorders page for EOMA-68-compliant Allwinner Cortex A8 CPU modules. This product will have full GPL Source Code publicly available, and will be suitable for many purposes including Educational and R&D purposes, a USB-OTG-powered Thin Client, use as a Freedom Box, or as an embedded computer, or in the future to drive products such as Tablets, Laptops, IPTVs and Desktop PCs simply by plugging it in. Some options for hardware that is on the roadmap are described as example motherboards on the EOMA-68 page.

                                                                          Features

                                                                          The Allwinner EOMA-68-compliant module will have the following features:

                                                                          • Approximately Credit-card size format (56mm x 90mm)
                                                                          • An Allwinner A10, 1.2ghz ARM Cortex A8
                                                                          • 1gb of RAM
                                                                          • at least 1gb of NAND Flash (possibly up to 16gb)
                                                                          • Operation as a stand-alone computer (USB-OTG powered)
                                                                          • 2160p (double 1080p) Video playback
                                                                          • MALI 400MP 3D Graphics, OpenGL ES 2.0 compliant.
                                                                          • HDMI, Micro-SD, Headphones Socket,
                                                                          • EOMA-68-compliant interfaces (RGB/TTL, I2C, USB2, SATA-II, 10/100 Eth)
                                                                          • Expansion Header (similar to Beagleboard, IMX53QSB, Origen etc.)

                                                                          These are the available interfaces on the 44-pin [Expansion Header’s interfaces] DIL:

                                                                          • 2pins: 1x USB-2
                                                                          • 8pins: 5-pin AC97 shared with 8-pin I2S Signals.
                                                                          • 2pins: PWM0 (PB2)
                                                                          • 4pins: TV-Out, VGA-Out
                                                                          • 4pins: 4-wire Resistive Touchscreen
                                                                          • 10pins: LVDS0 (multiplexed with LCD0)
                                                                          • 10pins: LVDS1 (multiplexed with LCD0)
                                                                          • 5V and 3.3V power

                                                                          Due to multiplexing on the Allwinner A10, the following interfaces are also available on the PCMCIA connector via the 24-pin RGB/TTL pins (WARNING: non-EOMA-compliant).
                                                                          • IDE (PATA)
                                                                          • 24-bit Camera Sensor
                                                                          • 20 External Interrupts
                                                                          • 8×8 Keypad Interface
                                                                          • 2 full UARTS with RX,TX,CTS,RTS
                                                                          • CAN-bus
                                                                          • 2 PS/2 interfaces
                                                                          • SD/MMC 3.0 Ultra-High-Speed Class, UHC-I
                                                                          Further multiplexing also allows the I2C interface to be switched over to two extra GPIO pins (WARNING: non-EOMA-compliant).
                                                                          Also, the pins on the Micro SD/MMC interface can also be switched over to JTAG and a UART. With a special PCB with a Micro SD/MMC slot on the end it is possible to perform debugging of the device, live, without opening it up.
                                                                          The Infrared Interface on the expansion header supports the following data formats:
                                                                          • MIR FIR IrDA 1.1
                                                                          • 0.576 Mbit/s 1.152 Mbit/s Medium Infrared (MIR)
                                                                          • 4 Mbit/s FIR IrDA 1.4
                                                                          • CIR
                                                                          These are being considered:
                                                                          • 2pins: 3.8v Battery Connection, on separate connector
                                                                          • 3pins: Reset and Power, on separate connector
                                                                          • 3pins: u-boot select, on separate connector
                                                                          Pricing
                                                                          Regarding pricing: the hardware NREs from the factory are $USD 2,000. Therefore, based on the number of committments so far (23 as of 2011Dec12), pricing looks set to be around $100. By the time the number of preorders reaches 30, that will be around $75 (30 reached as of 2011Dec17). (Update: as of 2012Mar01 the alpha units have reached 141 and it’s down to $41 per unit assuming NREs of $2,000 and component costs of $30. Please note: we do not yet know the unit cost! this is entirely preliminary!).
                                                                          The mass-volume (100k units) cost will be somewhere around $15: the more committments received, the closer the price will get to that. One expression of interest has been received for 1,000 (stable) units: a pricing evaluation request is outstanding with the factory and will be reported as soon as it is received.
                                                                          Please note: this cost excludes a case, power supply, packaging, shipping, tax, customs and import duty. and profit.
                                                                          Software Freedom Information
                                                                          Regarding Software Freedom: the caveat regarding this CPU is that it requires ARM-proprietary libraries for the 3D Graphics (as does virtually every single suitable consumer-grade embedded SoC on the planet with the almost exclusive sole exception of the Ingenic jz4760 and some of the TI ARM Cortex OMAP and Sitara SoCs). However, simply not using the proprietary MALI 3D GPU does not impact any other functionality in any way.
                                                                          (update: MALI 400MP is being reverse-engineered)
                                                                          Yet to be determined is how to program the proprietary 2160p MPEG decoder, but through a preliminary examination of the GPL Source Code it would appear that the drivers are publicly available. However, this CPU does have NEON, so can be used for Software Decode of Open CODECs.
                                                                          Overall: if this module is not for you, an AM3357 module may be more suitable.

                                                                          [committments so far:
                                                                          – 23 as of Dec 12, 2011
                                                                          – 30 as of Dec 17, 2011
                                                                          – 141 alpha units as of Mar 01, 2012
                                                                          large (=5 or more) number of units on preorder after Mar 01:
                                                                          215= 43×5
                                                                          762=9×10+1×15+1×18+3×20+1×30+1×49+2×50+4×100
                                                                          3466=1000+1000+1000+466
                                                                          75000=15000+50000+10000
                                                                          so the whole project looks quite feasible from the point of view of achieving the $15 unit cost for which 100K units should be on order
                                                                          ]

                                                                          Rhombus-Tech/ allwinner a10/ news

                                                                          6 Sep 2012: PCB design completed for EOMA-68 CPU Card

                                                                          Many thanks to Wits Tech for completing the PCB design: the board layout and GERBER files are done. This brings the A10 EOMA-68 CPU Card one step closer to reality. The next stage is to get initial samples made up, the first script.fex created and a first boot completed.

                                                                          [Wits Tech with products such as: MID and PCBA, e-book, smart MP4, 1080P high-definition MP4, 768P, 1080P harddisk player, IPTV, Google TV-BOX and so on]

                                                                          Following on very very quickly from this, and driving a rather fast development schedule, is a commission from a client to convert an existing x86 laptop (1280×800) over to using the new A10 EOMA-68 CPU Card, and to provide 25 working prototypes for a Trade Show. Luckily, as the CPU Card is completely independent of the I/O Board, separate teams can focus on the development tasks.

                                                                          Other news coverage:

                                                                          Marketing Strategy [Rhombus Tech, May 1, 2012]

                                                                          • TTM – Time to market lead
                                                                          • Open versatile Common Platform
                                                                          • EOMA One

                                                                          Three ways EOMA helps to bring new products to market faster and save money

                                                                          EOMA – From month to weeks TTM reduction
                                                                          ODM
                                                                          One platform, many Distros: Vanilla GNU/Linux, Android etc.
                                                                          Software comes pre-flashed by default
                                                                          One module, many applications
                                                                          Instant upstream compatibility with Linux GIT tree
                                                                          OEM
                                                                          Need for software expertise is removed from OEM side
                                                                          BOM reduction X 5
                                                                          Access to bigger market platform
                                                                          Readapting the design is as easy as changing one module
                                                                          System Integrators
                                                                          Quick access to many ODM designs
                                                                          Plug and play
                                                                          LOW TTM and high flexibility
                                                                          Update process is made trivial and faster
                                                                          Reasoning behind the Marketing Strategy
                                                                          EOMA is platform for the whole industry that benefits the whole “food chain”.
                                                                          Its good for ODM because they will have upstream support and they will be able to support their own clients better.
                                                                          For OEMs the benefit is that they will no longer need to deal with software by themselves, it simplifies production and logistics, lowers production run times thus less cost of capital.
                                                                          For integrators, the benefit is less obvious, but its also lower time to market, increased ability to reuse existing designs.
                                                                          In general, the idea is that EOMA uses open source principles to increase efficiency across the industry. EOMA will be doing to computer hardware market the same thing what linux has done to server OS market.

                                                                          Rhombus Tech Presentation [Rhombus Tech, March 12, 2012]

                                                                          • what is the project.
                                                                              EOMA is an initiative to separate the platform from the widget
                                                                              EOMA module is System-On-Module that will come in standardized 68 pin package
                                                                              It can utilize most of low cost SoC of your choice. At current stage, Allwinner A10 is the favoured chip.
                                                                              The first EOMA-68 CPU Card is Cortex A8 based design
                                                                              Module provides I2C, USB, Ethernet, SATA, 8 bit ttl rgb (display), and gpio on remaining pins
                                                                              At current stage Rhombus plans to reinvest all profits into platform development and improvement
                                                                              • what is the advantage and scenarios.
                                                                                  Rhombus facilitates upstream integration with linux and other major OSS projects.
                                                                                  OEMs receive standard platform that greatly reduces time-to-market.
                                                                                  OEMs no longer need to contract ODMs or have extensive software expertise to make a worthwhile product.
                                                                                  • what is the latest status of this project.
                                                                                      Rhombus is in process of getting pre-orders
                                                                                      lkcl [Luke Kenneth Casson Leighton] is working with manufacturers to start production

                                                                                    See also: Embedded Open Modular Architecture

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                                                                                    More background: British company looks to create cheap, open platforms [iTWire [Australia], Jan 10, 2012]

                                                                                    Luke LeightonA British community interest company, Rhombus Tech, is part of the way towards developing a micro-computer on a circuit board, much like the Raspberry Pi.
                                                                                    The man behind the effort, Luke Kenneth Casson Leighton, says his product will be much more powerful, having an ARM Cortex A8 CPU, which is 3x times faster than the 700mhz ARM11 used in the Raspberry Pi. The mass-volume cost target being aimed for is $US15 and it will be available for educational purposes as well as being a part of a retail product line.
                                                                                    Leighton (pictured above), who is a free software developer, is also attempting to bring together FOSS developers with Chinese hardware makers, so that each can use the other’s creation and benefit from doing so.
                                                                                    He has ambitious plans for Rhombus Tech to help build a number of devices, including a tablet, using the same method – harnessing the effort of free software developers and Chinese hardware manufacturers.
                                                                                    One thing he sees as a plus in the tablet effort is that it will create an Android system that conforms to the norms of the GPL and be easier for FOSS developers to deal with. At present, there is a plethora or tablets and many of the manufacturers, who are the vendors as well, are unaware of GPL requirements or else do not care.
                                                                                    “We are acting as the catalyst to invite other people to make such products by inviting them to participate, through the EOMA-PCMCIA initiative – simplified modular upgradeable hardware – and putting them in touch with Software (Libre) Developers,” Leighton says.  
                                                                                    “We’re not funding the products, we’re doing deals with factories and with SoC fabless semiconductor companies, offering them free access to free software developers, asking them in return that they not charge us for their hardware engineering time.”
                                                                                    Leighton says the efforts he is making are both altruistic and profit-oriented. “The fundamental principles behind Software (Libre) are more important to me than profit, but no profit gets you nowhere, so we’re setting out to do something rather unusual: merge both worlds.
                                                                                    “I’ve learned the lesson: you can’t make money from selling software (Libre) as a service in a world which has been Pavlov-trained to pay for boxed product and zero for the service. Patronage is dead – I’m the lead developer of – or have been the lead developer of – quite a number of free software projects, and the amount of money I’ve received through donations since 1996 is under $1000 in total. That’s under $65 per year, despite saving hundreds of thousands of businesses vast sums of money in proprietary software licence fees.
                                                                                    Instead, we’ve made the decision to profit from sales of hardware, with GPL-compliant software (Libre) pre-installed that actually does the job, masquerading as ‘yet another mass-volume product’ and beating the (GPL-violating) competition on price, convenience and usefulness.”
                                                                                    Leighton has been at this game for nearly eight years. “I started contacting companies to get the source code of Linux phones – the Shanghai-based E28 smartphone, for example – back in about 2004,” he says.
                                                                                    “It was a complete failure. I just had to let the GPL violations go. Instead I focused on reverse-engineering HTC’s smartphones. Then Android came along, some years later, and the situation has clearly got worse, not better.”
                                                                                    But there are some upsides to the plethora of Android devices out in the market. “At least the cost of hardware came tumbling down. However, because of Android and because of the endemic GPL violations surrounding Android, this fantastic hardware, which could potentially be used for so much more than it is, is basically stuck in dead-end roles such as ‘browsing uh few web pagiz’, ‘wotchin uh film’ and ‘playing a few gamez like angry burds’.”
                                                                                    Leighton has had some interesting early experiences trying to achieve his goal, learning through his own mistakes. “As the very first experimental ARM11 (non-x86) Linux-based (non-Android), laptop (non-tablet) hardware began to make its way out of China-based R&D companies, we reached out to them. The first was the Chitech CT-PC89E which turned out to be a complete nightmare, but an important learning curve.”
                                                                                    “Over the course of several months, and after 18 months of thinking about what the hell went wrong, empirical evidence tends to suggest that the development of the CT-PC89E was PRC Government-funded, and was supposed to be used for monitoring of PRC citizens, in a hardware-locked fashion, running an ARM-based PRC-Government-funded port of Red Flag Linux.”
                                                                                    Leighton says that he was “naively” intending to sell this ARM-based laptop in Europe and asked for versions of the laptop that would support European-based EDGE/3G modems. All that he was offered were China Telecom WCDMA modems that would only work in China.
                                                                                    Since source code could not be obtained, he took recourse to reverse-engineering. “We reverse-engineered the Linux kernel (discovering some very poorly-designed ‘security’ measures along the way), installed Debian on it, and an associate of ours took it along to their office and presented one of their machines running Debian/Lenny to them. They went extremely quiet.
                                                                                    “The poor girls at the Chitech factory in China, who have absolutely no software engineers but just ‘make hardware’, were so scared of what they learned, through us, that they pulled the product from their portfolio. We were the first – and last – people to ever order samples. That was over two years ago, now.”
                                                                                    Leighton was not put off, however, and persisted in trying to make headway. Next we decided that this was a ridiculous situation, and began a process of contacting more than 200 factories in China to find one that was willing to do a deal. Two years later, we found one. It actually took going over to China and having face-to-face meetings with over 30 companies even to find that one factory.”
                                                                                    His deal with the factory basically boils down to “we won’t charge you for software engineering if you won’t charge us for hardware engineering“.
                                                                                    “As these factories often have to pay large sums of cash upfront for BSPs (board support packages) and then have to also pay to have them customised so that the factory at least has ‘some’ unique selling point and they ‘still’ end up with a GPL-violating binary-only firmware blob, it’s a good deal for them,” he says.
                                                                                    The problems Leighton has faced make for interesting reading – though they were anything but interesting at the time when he encountered them.
                                                                                    “We’ve bought samples from factories, shipped some of them to potential clients, requested the GPL source code and been denied access to it, in direct violation of the GPL,” he says. “Often we were told that we had to place orders for 20,000 units in order to be given the source code; we told them absolutely not, why the hell would we place such a massive order for an untested product that didn’t do the job that the client needed? In the cases where product was shipped to potential clients prior to non-receipt of the GPL source code, this was incredibly embarrassing for us.”
                                                                                    What he has learned is that there is a long chain of people involved, with communication breakdowns and GPL violations in some cases beginning right at the start of the chain.

                                                                                    “The SoC (system on a chip) manufacturer provides a reference design including a BSP. The reference design is bought by original design manufacturers (ODMs), usually under NDA (which is the first GPL violation). The ODMs license their modifications to factories and give them binary-only distributions, a second GPL violation.

                                                                                    “The factories have absolutely no software engineers. They do not even know what source code is, let alone what an ‘Apache’ (licence) or a ‘GPL’ is. The factories sell product to importers; they in turn sell to wholesalers who sell to retailers and from there it is sold to end-users.”

                                                                                    Leighton says it is absolute hell to chase a GPL violation back through this chain, fighting ignorance and arrogance across international boundaries every step of the way. “After trying to be patient with this process, several times, we have concluded that it is a complete waste of time to pursue GPL violations just to do a deal, selling hardware product that is GPL-compliant: it’s too late by then.”

                                                                                    Instead, he has decided to do things a different way. “We are looking to work with the factories and with the SoC vendors, being involved right down the chain, keeping software (Libre) developers involved and informed along the way as well, such that the products, when they reach the shelves in Europe for example, are fully GPL-compliant before they even get there.
                                                                                    “That involves finding a SoC company, a factory and software (Libre) developers who will trust us, as well as finding a hypermarket retail store in Europe that will trust us!”
                                                                                    Despite all these issues, light is visible at the end of the tunnel. “We’re at a critical phase where we’ve managed to convince our first China-based factory of the value of a ‘we won’t charge you for software engineering time if you won’t charge us for hardware engineering time’ deal. The CPU that we’ve found is an ARM Cortex A8, it runs at up to 1.5ghz, it’s an absolute corker, and it’s only $7 in mass-volume. That means that a PCB that’s equivalent to the Raspberry Pi in size and features could be manufactured for a whopping 40 per cent less money – only around $15 instead of $25, and yet it would be at least 3 times faster than the Raspberry Pi (which uses only a 700mhz ARM11),” Leighton says.
                                                                                    We have the full support of the SoC fabless semiconductor company, Allwinner: they’ve given us full access to the GPL source code and the complete BSP; from a small-scale series of announcements (we’ve kept it to the debian-arm mailing list so far) we have more than 30 software (Libre) developers interested in buying first alphas of the ‘bare-bones’ EOMA-PCMCIA-compliant CPU card using Allwinner’s CPU card.”
                                                                                    While Rhombus Tech’s first product will be just a credit-card-sized PCMCIA CPU card that can run as a USB-OTG-powered computer, Leighton says that, provided there are sufficient advance orders, “for a 10-inch laptop, with Android, we’re looking at mass-volume pricing of around £90, retail, in the UK (and about £125 for a 12in one). For a 7-inch tablet (with the lower-quality but lower-priced resistive touch screen), we’re looking at around £50 retail.”
                                                                                    He says the only reason this is achievable is because there was no £250,000 to £500,000 up-front cost on development of the product – not on the cost of the hardware, and not on the cost of the software. The products will all be fully GPL-compliant.
                                                                                    “What’s even better is that when a new, or faster, or cheaper (or all three) CPU comes along, then rather than force people to throw away the entire device, we will be in a position to pay a factory to get a new EOMA-PCMCIA-compliant CPU card out in record time, and then just sell that through the same channels, as a user-installable ‘upgrade’ to their ‘existing’ laptop, tablet, desktop, internet TV, whatever it is that’s been designed to take EOMA-PCMCIA-compliant CPU cards at the time.
                                                                                    “With the embedded computing market moving so rapidly, we want to give both factories and users the opportunity to keep up-to-date without feeling guilty about land-fill. And, the GPL compliance and involvement of the free software community means that the devices will always be ‘unlocked’, and will serve both their original purpose as well as being a low-cost open educational and R&D platform.”
                                                                                    Rhombus Tech has just five people involved, all operating on a commissions-only basis. The relationships between the five go way back, with the company being set up just two years ago.
                                                                                    Luke Kenneth Casson Leighton, CTO at Rhombus Tech [LinkedIn]
                                                                                    Current: Rhombus Tech [since Nov 2011], Pyjamas, VizzEco Inc.
                                                                                    Previous: NC3A, iYonderBZflag
                                                                                    Education: Imperial College London

                                                                                    I’m a free software advocate, technology specialist and technology researcher.
                                                                                    My vocation is to seek out, understand, document and then explain all the archaic, esoteric and obscure technologies i come into contact with. So far, that has led me to network-reverse-engineering of Windows NT 4.0 Domains; reverse-engineering the High Tech Corporation’s Wince Mobiles in order to run Linux on them just for fun; Adopting Python as a core programming skill before it became fashionable; Writing an XML-based programming language before _that_ became fashionable.
                                                                                    The upshot of all this is that there really isn’t very much in Computing Technology that I would particularly find difficult – or if it _is_ difficult, I’ll be able to tell you why; and if I’ve not encountered a technology before, I’ll tell you so, up-front, and then go find out about it for you. So if you need advice on what technology can do for you, or if you need to know if something is possible, you only have to ask.
                                                                                    Also, I am able to advise on best working practices in Software Development, as I have done a significant amount of Software Engineering and Project Management in Free Software. Free Software leadership is a little different from traditional Project Management, in that the people you’re leading don’t actually have to listen to you! So if there is a delicate situation that needs handling, and your current approaches simply aren’t working and you still need to get results, you might want to consider asking for my help and advice.

                                                                                    Rhombus Tech preparing to launch a PCMCIA-sized computer module for tablets, notebooks, more [Liliputing, Sept 8, 2012]

                                                                                    Rhombus Tech is working on a project to develop a computer module that supports open source software and which can be used in a variety of devices.
                                                                                    The idea is that you’ll have a PC-on-a-board that works a bit like a Raspberry Pi or MK802 mini PC. But instead of using this as a standalone computer, you’ll be able to slot it into a wide range of devices including tablets and notebooks.
                                                                                    So instead of replacing your laptop when the CPU starts to feel outdated, you’ll be able to pull out the module containing the CPU and other vital components and slide in a newer model.
                                                                                    The first Rhombus Tech design is called the A10 EOMA-68, and it’s expected to be a PCMCIA card-sized PC module powered by an Allwinner A10 ARM Cortex-A8 processor.
                                                                                    That’s the same chip used in the Mela A1000, MK802, Mini X, and a number of other inexpensive Android tablets, TV boxes, and other devices.
                                                                                    In fact, members of the Rhombus Tech team were responsible for the first builds of Ubuntu Linux that were able to run on the Mele A1000… which led to a number of developers porting Ubuntu, Fedora, Puppy, and other Linux-based operating systems to run on Allwinner A10 devices such as the MK802.
                                                                                    Right now the A10 EOMA-68 is still in the planning stages, but Rhombus Tech announced that there’s now a PCB design in place, and the next step is to produce samples that can be used for testing and demonstration purposes.

                                                                                    Tom Cubie’s role in the initiative and elsewhere:

                                                                                    Tom Cubie’s Public Profile – Ushi

                                                                                    Tom Cubie cubieTech co-founder
                                                                                    China’s Mainland
                                                                                    Guangdong – Zhuhai >>>>>>>>>
                                                                                    Industry: Semi-conductor

                                                                                    Work Experience

                                                                                    嵌入式软件工程师 [Embedded software engineer]
                                                                                    珠海全志科技 [珠海Zhuhai全志科技Allwinner Technology] (100 ~ 499)

                                                                                    June 2011 – Present (1 year 3 months)
                                                                                    ARM Linux BSP 内核开发[Kernel development]

                                                                                    [Software] Design Engineer
                                                                                    Imagination Technologies Ltd.
                                                                                    August 2010 – June 2011 (10 months)

                                                                                    Education:
                                                                                    HUST [Huazhong University of Science and Technology]

                                                                                    CUBIETECH LIMITED or in more detail
                                                                                    方糖科技有限公司

                                                                                    Domicile: Hong Kong
                                                                                    Type: Private, ltd by shares
                                                                                    Formed: 29-Aug-2012
                                                                                    HK companies registry: 1793090

                                                                                    websites: 1. www.cubietech.com  2. http://cubieboard.org but the content is the same at the moment

                                                                                    Zhuhai [Wikipedia]

                                                                                    Zhūhǎi (Chinese: 珠海) is a prefecture-level city on the southern coast of Guangdong province in the People’s Republic of China. Located in the Pearl River Delta, Zhuhai borders Jiangmen to the northwest, Zhongshan to the north, and Macau to the south. Zhuhai was one of the original Special Economic Zones established in the 1980s. Zhuhai is also one of China’s premier tourist destinations, being called the Chinese Riviera.
                                                                                    Zhuhai became a city in 1979, a year before it was named as one of the first Special Economic Zones (SEZ). The neighboring city of Shenzhen became the first Special Economic Zones of the Special Economy Zone in 1978. The implementation of this policy is logical as Zhuhai is located on the strategic position facing Macau, in the identical fashion by which Shenzhen faces Hong Kong. This enabled the Chinese Central Government to open another “window” in front of Macau. Even though the city is situated at the southern end of the Pearl River Delta area, Zhuhai acts as one of the central cities in the Pearl River Delta according to the new general urban plan approved by the State Council. The implementation of Special Economy Zone means that the city will grow as a powerful modern port city, science and education city, scenic and tourism city, and as a regional hub for transportation.

                                                                                    Introducing the MK802 FreedomStick [FreedomBoxBlog, ]

                                                                                    Recently a whole range of cheap Android devices have become available, all powered by the Allwinner A10 SOC. Thanks to the way A10 devices boot they are very easy to hack. All that is needed is a bootable SD card. How to make such a card is no big secret, and there are now multiple SD card images available. You can boot for example Lubuntu or Debian instead of Android. One A10 device, the MK802 stick computer, is almost ideal for a small home server. I bought one to examine its potential for the FreedomBox.
                                                                                    What A10 devices are available?
                                                                                    The A10 is used in a whole range of products, from tablets to TV multi media boxes to stick computers. The most popular devices are:
                                                                                    The $70 Mele A1000. This is a complete computer. Some specs: 512 Mb RAM, SD slot, support for SATA Hard-disks, connectors for multiple types of monitor (VGA/HDMI/Analog video), 10/100 Ethernet connector, WIFI, Audio out and two USB host ports.
                                                                                    The $65 MK802. This is a stick sized computer (0.47 x 3.46 x 1.38 inch) that has (of course) less connectors than the Mele A1000. The specs are: 1024 MB RAM (older versions 512 MB), microSD slot, HDMI video out, WIFI, one USB host port and one USB-OTG port.
                                                                                    You will probably agree with me that the $70 Mele is a better deal – the MK802 is overpriced. It would not surprise me if the MK802 drops in price to about $40 in the near future.
                                                                                    Links.
                                                                                    Here are some links to start with if you are interested in A10 devices:
                                                                                    Much pioneering work on the A10 was done by Luke Kenneth Casson Leighton. Luke is the one behind Rhombus Tech. A Community Interest Company, which is developing an open hardware Computer-on-Module that uses the A10. Lots of info can be found at:
                                                                                    http://rhombus-tech.net/allwinner_a10/

                                                                                    A good place to buy an A10 device is “The Cubies hacker shop” at:
                                                                                    http://www.aliexpress.com/store/511685

                                                                                    from HERE: Tom Cubie Jul 15, 2012 +3 
                                                                                    Hi, i am Tom Cubie, i have a shop on aliexpress selling allwinner powered devices. I am also the developer who ported u-boot to A10 and contribute to the A10 kernel source code. Welcome to my shop: http://www.aliexpress.com/store/511685
                                                                                    Mele A1000 70$(A10, 512MB, 4G)
                                                                                    Mele A2000 75$(A10, 512MB, 4G)
                                                                                    Smallart uHost 70$(A10, 1GB, 4G)
                                                                                    [these are set-top boxes]

                                                                                    Tom Cubie (alias hipboi) is very actively involved in getting GNU/Linux working on the A10. Just like Luke he is planning to release open hardware based on the A10.
                                                                                    http://cubieboard.org/

                                                                                    Both the SD card images i used come from the miniand.com website. Miniand sells A10 devices and has a busy forum at:
                                                                                    https://www.miniand.com/forums/
                                                                                    MK802 images are available at:
                                                                                    https://www.miniand.com/forums/forums/development/topics/mk802-guides-and-images
                                                                                    Another company that sells the MK802 and other A10 devices is Rikomagic.
                                                                                    http://www.rikomagic.co.uk/
                                                                                    forum:
                                                                                    http://www.rikomagic.co.uk/forum/viewforum.php?f=2&sid=3c3ef83dd83af61f8af6a82c6b28cf47
                                                                                    Someone named gnexus has a very interesting site about A10 devices:
                                                                                    http://a10linux.org/
                                                                                    Last but not least – i enjoyed the info at Jeff Doozan’s site.
                                                                                    http://forum.doozan.com/list.php?6
                                                                                    Android-powered Cubieboard is already sold out [TG Daily, Sept 11, 2012]
                                                                                    We first covered [Sept 3, 2011 – bit the first public info was available from CNXSoft on Aug 31, 2012] the Android-powered Cubieboard – which is targeted at devs and modders – last week.
                                                                                    The uber-mini developer board is priced at a rather sweet $49, so one really can’t avoid drawing comparisons  between this little device and the wildly popular Raspberry Pi.
                                                                                    However, the little Cubieboard boasts a faster processor, more memory and integrated storage. The first Cubieboard prototypes were offered for $49 plus shipping (from China) on  AliExpress – but have already sold out. [e-mail address be given on a cubieboard page]
                                                                                    Here’s a quick rundown of the Cubieboard specs if you missed it the first time around last week. The device is powered by a a 1 GHz Allwinner A10 ARM Cortex-A8 processor paired with Mali 400 Graphics. Cubieboard also features 512 MB of RAM and 4 GB integrated flash storage. Unsurprisingly, a souped-up version of the board is reportedly in the works and will be loaded with a total of 1 GB of RAM.
                                                                                    The dev board is also equipped with an HDMI output, dual USB ports, an SD card slot for memory expansion, and other expansion pins and connectors for adding peripherals. Although the Cubieboard does sport an integrated Ethernet jack it lacks integrated Wi-Fi. As such, one of the available USB ports will have to be given up for a dongle – if wireless access is required. Soldering is a must if you want to use any of those header pins for additional accessories.
                                                                                    Originally, there was no indication that the bare-bones Cubieboard was equipped with 4 GB of flash storage,  a feature which will make the already attractive system even more appealing to devs and modders.
                                                                                    Cubieboard is capable of running Android (2.3 and 4.0), as well as multiple flavors of Linux.

                                                                                    There is a Cubieboard wiki page [Aug 4 – Sept 24, 2012] on linux-sunxi wiki from June 30, 2012. This wiki is:

                                                                                    dedicated to all software and documentation related to hacking sunxi based devices and to thedevices themselves and is maintained by the arm-netbook community.
                                                                                    sunxi represents the family of ARM SoCs made by Allwinner Tech. in Zhuhai (Guangdong, China). The most popular sunxi SoC model is the Allwinner A10 (aka sun4i) and the Allwinner A13 (aka sun5i). Their predecesor was an ARM9 named Boxchip F20 (sun3i) and their successor whose specs are currently unknown, will be the sun6i.
                                                                                    Main components of the A10 / A13:
                                                                                      The A13 is a cheaper version of the A10. It lacks HDMI and SATA and is primarily targeted towards tablets.[1]
                                                                                      Featured Community Hardware
                                                                                      EOMA68-A10

                                                                                      RhombusTech aims to create an Open Hardware EOMA68 compliant CoM with an Allwinner A10 CPU inside to be the user replaceable heart of different devices.
                                                                                      cubieboard

                                                                                      A mini (10x6cm), hacker friendly, extendable and very low-cost while powerful ARM board with A10.
                                                                                      Open Source Hardware
                                                                                      A13-OLinuXino

                                                                                      Open Hardware SBC with an Allwinner A13 CPU inside developed by Olimex with 512MB RAM, 4GB NAND Flash, VGA, Audio In/Out, WIFI, 3x USB Hosts, USB-OTG, LiPo, SD-card, 72 GPIOs, 6-16VDC power input

                                                                                      A10-OLinuXino

                                                                                      Open Hardware SBC with an Allwinner A10 CPU inside developed by Olimex with 1GB RAM, 4GB NAND Flash, VGA, HDMI, RS232, JTAG, SATA, 100MBit Ethernet, SD and micro-SD cards, 2x USB hosts, USB-OTG, LiPo, 132 GPIOs, 6-16VDC power input

                                                                                      CedarX wiki page [July 14 – Sept 16, 2012] on linux-sunxi wiki:

                                                                                      CedarX is Allwinner’s multimedia decoding technology. It is composed of several parts, including:
                                                                                        1. A hardware video decoding unit
                                                                                        2. Proprietary libraries to communicate with the hardware unit
                                                                                        3. Glue code to use those libraries on an actual system with video playback capabilities (e.g. Android)
                                                                                        Benefits
                                                                                          • Efficient use of system resources when decoding multimedia.
                                                                                          • Allows small ARM systems to playback high resolution/bitrate multimedia content, which wouldn’t be possible using software-only decoding.
                                                                                              Disadvantages
                                                                                                • The proprietary libraries have no clear usage license.
                                                                                                • The android glue code is implemented as a “media player” (parallel to stagefright) instead of as OMX components.
                                                                                                • This media player has limitations when it comes to playing back content pointed to by Android URIs and some web-based content.
                                                                                                • There is no glue code for any other multimedia frameworks on GNU/Linux systems. The use of OMX would’ve rendered this a non-issue, with existing projects like GstOpenMAX.
                                                                                                    Integration
                                                                                                    Reverse Engineering
                                                                                                    On June 15 2012 Iain Bullard started reverse engineering the proprietary libraries.

                                                                                                    Allwinner A10 devices [XBMC Wiki for collaborative documentation of XBMC Media Center and related topics, May 19 – Sept 6, 2012]

                                                                                                    Set-top boxes

                                                                                                    Mele A1000/A2000
                                                                                                    Mele A2000.jpg
                                                                                                    Mele A1000 is the same hardware and specs as the Mele A2000. The case design is slightly different, and the A1000 only has 2GB of internal flash formatted, but still has 4GB of internal flash total (should be able to be reformatted to use full 4GB).
                                                                                                    The Mele units appear to have the most ports available of all the Allwinner A10 set-top/TV boxes, including SATA (normally accessible from a top “dock” for 2.5 HDDs, but can also be accessed from plugging an SATA cable to the main board inside.)
                                                                                                      Mele A100
                                                                                                      Same as the A1000/A2000, but lacks an SATA dock/connector.
                                                                                                      MK802
                                                                                                      MK802.jpg
                                                                                                      Some units have 512MB of RAM, while others have 1GB of RAM. Has a female mini HDMI port, but comes with a short miniHDMI to full sized HDMI cable. One USB B port, and one USB mini OTG port that can also act as a USB host port with included adapter, or be powered by the mini USB port. DC power connector. Internal wifi. MicroSD card slot.
                                                                                                      DX.com has a listing for a “AK802” that appears to be an identical unit to the 1GB RAM version.
                                                                                                        Mini X
                                                                                                        Pineriver H24.jpg
                                                                                                        Might be called Mini X, H24, or even the Mini Xplus (for legal reasons, apparently). All three are the exact same hardware. Has HDMI and analog video (composite?), two USB ports, one microSD card slot, IR sensor (most should come with a remote), removable wifi antenna, DC power connector (5 volts). Can be powered by included DC adapter, USB to DC cable (not included) or a male-to-male USB cable on the USB OTG port. Similar to the MK802, some units have 512MB of RAM, while others have 1GB of RAM.
                                                                                                          Smallart UHOST
                                                                                                          Smallart UHOST.jpg
                                                                                                          Comes with a motion activated remote. Male HDMI port is directly on device. Size: 120mm x 50mm x 13mm. 1GB RAM. Built-in wifi b/g/n. Has one USB host port, and another microUSB port that turns the device into a USB drive. This microUSB port also seems to provide power to the device. Micro SD card slot. Mic jack and what seems to be an on-board mic (?).
                                                                                                          Also sold as “Oval Elephant” from Oval Elephant.

                                                                                                            Other

                                                                                                            Gooseberry Board
                                                                                                            Gooseberry.jpg
                                                                                                              HackBerry
                                                                                                              Hackberry.jpg
                                                                                                              1 GB RAM, 4GB internal flash, SDHC slot, 2 USB 2.0 ports, 10/100Mbit ethernet, wifi: 802.11 b/g/n, HDMI video out, composite video out, audio in minijack, audio out minijack, IR sensor.
                                                                                                                Cubieboard
                                                                                                                1G ARM cortex-A8 processor, NEON, VFPv3, 512KB L2 cache, Mali400, OpenGL ES GPU, 1GB DDR3 @480MHz, HDMI 1080p Output, 100M Ethernet, 4GB Nand Flash 2 USB Host, 1 MMC slot, 1 SATA, 1 ir, 96 extend pin including i2c, spi, lcd, sensors, ..

                                                                                                                MeLE website: http://www.mele.cn/ (Chinese) or http://en.mele.cn/ (English)

                                                                                                                Congratulation to Mele’s 8th Anniversary [Mele press release, Sept 4, 2012]

                                                                                                                About Mele [Dec 20, 2012]:

                                                                                                                Shenzhen Mele Digital Technology Ltd. is a global leader for design and manufacturing of internet High Definition (HD) multimedia terminals and a system solution provider for customers worldwide.
                                                                                                                Shenzhen Mele has been leading the trend of introducing multimedia internet devices and applications into living rooms. Shenzhen Mele’s forward-looking market research, proven technological expertise and acumen, mature and efficient development process, ever-expanding manufacturing capacity and capability, rigorous quality assurance measures, enables Shenzhen Mele to win competitions by product innovation, feature differentiation, and time to market. Shenzhen Mele has a long history of successful track records of providing Original Product-planning Manufacturing (OPM) services and Original Design Manufacturing (ODM) services to our premium brand customers globally, and providing internet multimedia terminals with Shenzhen Mele’s own brand to our consumers in China.
                                                                                                                Shenzhen Mele’s multimedia terminal products manifest the direction of digital evolution of future home. Shenzhen Mele’s products integrate internet applications, local area network (LAN) content browsing and sharing, data storage, data transport, HD multimedia playback and recording, HD digital TV playback and recording, multimedia home theater system, multimedia player and DVD combo, SoundBar multimedia player, camera and mobile phone etc. Shenzhen Mele’s system solutions include remote content distribution, device configuration and management, and product and feature customization for service providers, and remote data transport and content management service for end customers.
                                                                                                                Shenzhen Mele is devoted to Complete Customer Satisfaction (CCS). We provide 7×24 around the clock services. We always solve customer issues by investigating root causes and addressing source of a problem. We strive for daily improvement and continuous progress in our course of pursuing perfectionism. Our corporate vision, our corporate social responsibility, and our down-to-the-earth working style of “starting from me” motivate our staff to work harder and smarter everyday. We sincerely believe that Innovations Enriches Quality Life.

                                                                                                                8. The Nufront challenge coming from inside

                                                                                                                Information about the latest tablet SoC contender Nufront, also posing the greatest challenge to Allwinner for the next year as it stands now (as of Nov 1, 2012):
                                                                                                                Nufront Announces Taishan Platform Targeting Mobile Devices Market [Nufront press release, May 7, 2012]: “The NS115 mobile computing chip, a dual-core ARM Cortex™-A9 MPCore™ processor up to 1.5GHz and Mali™-400 MP GPU implementation, features 1080P HD encode/decode and support of Android 4.0.
                                                                                                                NUFRONT NS115 dualcore chipset – ARM at Computex 2012 [ARMflixYouTube channel, June 14, 2012]
                                                                                                                $81 Nufront NS115 ARM Cortex-A9 Dual-core 7″ 1024×600 IPS Tablet by Xusit [Charbax YouTube channel, Oct 28, 2012]
                                                                                                                Nufront and ARM Extend Partnership to Provide OEMs with Competitive Solutions for Next-Generation Smartphones, Tablets and Smart-TVs [joint ARM and Nufront press release, Sept 24, 2012]: “Nufront licenses latest ARM Cortex-A15 Processor and Mali-T658 GPU technology to drive innovation and address consumer demand for advanced features
                                                                                                                Nufront licenses cores from Ceva, Vivante [EE Times, Sept 8, 2011]
                                                                                                                Interview with Nufront: “Windows RT will take away market share from notebooks” [ITProPortal, Oct 17, 2012]: “When do you expect Nufront to bring out (a) its first Cortex-A15/Mali Midgard products (b) products based on your Vivante/Ceva license? We are targeting the end of 2013.
                                                                                                                Why is it that Nufront is not as popular as rivals such as AllWinner, VIA, Mediatek, Rockchip especially at the lower end of the market? We started from dual core system-on-chips, and dual core SoCs are going down to low end but not yet, it’s still single Cortex-A8 everywhere, while we believe the dual core A9 will go to the low end by the end of this year, and we will definitely be there, we are ready.”
                                                                                                                ARM Technologies Power Nufront’s First Computer System Chip To Reshape Laptop Market [Nufront press release, Sept 14, 2010]: “NuSmart™ 2816 is the world’s first chip to integrate a 2GHz dual-core ARM Cortex-A9 processor, a multi-core 2D/3D graphics processor, 64bits DDR2/3-1066 memory controller, 1080p multi-format video engine, SATA2 controller, USB2, Ethernet, together with general I/O controllers. By leveraging the multi-layer hybrid interconnection technology, multi-level fine grain power management technology and advanced 40nm manufacture process, NuSmart™ 2816 is very energy efficient consuming less than 2 Watts when running at 1.6GHz.
                                                                                                                Ubuntu Adds Sparkle to Nufront Laptops at CES [PCWorld, Jan 7, 2011]
                                                                                                                – From ARM.com: POP™ IP > Cortex-A9: “Nufront was the first company to produce an SoC with the Osprey hard macro running at 2.0 GHz (typical conditions).” … Osprey: ARM Announces 2GHz Capable Cortex-A9 Dual Core Processor Implementation [ARM press release, Sept 16, 2009]: “The Cortex-A9 hard macros and the corresponding optimized physical IP used to develop the speed-optimized and power-optimized implementations are available for license today with delivery in the fourth quarter of 2009.” … Partnership in action > Nufront CSC: Vince Zhou, General Manager at NUFRONT CSC on their adoption of ARM’s Cortex-A9 processor and Mali multi-core graphics processor technology, and high-performance Physical IP “... For 2011, we have set a target that $250 laptops will be widely available in China and rest of the world, based on the NuSmart 2816. Together with our partners we have an opportunity to create low-cost laptops with low-energy chips that drive the new computing era.
                                                                                                                ARM announces ‘Osprey’ A9 core as Atom-beater [EE Times, Sept 16, 2009]
                                                                                                                Nufront released the second generation of NuSmart2816 series chip – NuSmart2816M [Nufront press release, Feb 13, 2012]
                                                                                                                Nufront at Computex 2012 [Charbax YouTube channel, June 8, 2012] where both the 2nd gen NumSmart2816M and the 3d gen NS115 are shown, the latter introduced as a LP (Low Power) and improved architecture implementation with 40% less power consumption than the NS2816M, also targeted for the smartphone market (in the video also their baseband chip is shown to be shipped in 2-3 months) and to be shipped a month later. Towards the end they acknowledge that their big hope for the NS2816 and NS2816M didn’t become a reality, because the laptop market remained a niche one (I would add it was due to overwhelming success of Android in the tablet space vs. the envisaged by them Ubuntu on the laptops), so they are refocusing on the tablet market. They also acknowledge trying to work with Microsoft on the Windows RT opportunity (but Microsoft is NOT shown as a partner). It is also said that they have almost 700 people working for them. To the last question they say that they have been living so far on mobile TV systems for China only [not true considering that they lost the battle against CMMB in China as shown in the following]. Note from their website: “Our superior, patented T-MMB (Terrestrial- Mobile Multimedia Broadcasting) system” (see also the T-MMB Q&A), Enhanced Ultra-High Throughput (EUHT) SuperWlanUHT (Ultra-high Throughput Wireless LAN) and NUHT (Next UHT), and probably video search by “NuVideoTM supports hundreds of TV channels anywhere, anytime in any situation with real time catalog, automatic high-speed editing and processing.” as well.
                                                                                                                – From Nufront’s own sponsored content on DIGITIMES [June 6, 2012]: “… Nufront was established in June 2004 with its first office located in Bejing, China. Through support from the government, Nufront began R&D of T-MMB systems. By 2006, Nufront’s T-MMB system had passed field tests conducted by the government. By November 2007, the firm had announced success in developing the first T-MMB chip called NF9001. In 2009, Nufront added two new branches, Beijing Pu Ji Xin Technology and Beijing Nufront Mobile Communication Technology. … The firm stated its goal is to become a comparable firm to Qualcomm and MediaTek. Nufront aims to create a unified platform that consists of both telecommunication and PC functions to meet the needs of various types of mobile smart products.
                                                                                                                China Digital TV Transmitter Market Report, 2012 [Reportlinker.com press release, Oct 30, 2012]: “With respect to mobile devices, T-MMB was adopted as the national standard on April 3, 2008, but denied by the State Administration of Radio, Film and Television (SARFT) which has been actively promoting CMMB (China Mobile Multimedia Broadcasting) network construction. With investment in digital TV transmitter reaching approximately RMB600 million in 2010 and not less than RMB800 million in 2011, CMMB has become the major player with respect to signal coverage and user group.
                                                                                                                2011 Mobile TV Development Report [Zhang Rui on Sina blog, Oct 15, 2012]: “.. by the end of 2011, CMMB network covered more than 336 prefecture-level cities, 885 economically developed county-level cities with signal coverage rate reaching 98.22%, covering a population of nearly 800 million, and as such CMMB has become the world’s largest mobile radio and TV coverage network. … as of the end of 2011, CMMB nationally more than 35 million users, paying subscribers reached 16 million. In 2011, through the widespread cooperation with China Mobile, they jointly promoted the development of 11.29 million bi-directional end users, creating a precedent for the conversion rate of mobile data services with a 73.3% conversion rate; with new users the one-way terminal user base increased in 2011 to 6 million. …” Note: CMMB… is based on the Satellite and Terrestrial Interactive Multiservice Infrastructure (STiMi), developed by TiMiTech, a company formed by the Chinese Academy of Broadcasting Science. Announced in October 2006, it has been described as being similar to Europe’s DVB-SH standard for digital video broadcast from both satellites and terrestrial repeaters to handheld devices. …
                                                                                                                Mobile TV: at least three years to take to maturity, preliminary [coming in 20]08 [XINHUANET.COM, Aug 14, 2006]: “<nicely and broadly covering the STiMi story then TMMB as well: > … T-MMB standard was developed under the auspices of the Ministry of information industry, which is Korea DMB standard as the basis for in-depth research and development of a standard, part of independent intellectual property rights. It is a broadcast system, is also a one way system. T-MMB advantages: first, compatibility, compatible Korea T-DMB technology easier to implement roaming. …
                                                                                                                – which is really shown by the below illustration from this Aug’11 Norvegian research paper:

                                                                                                                – Then 3 years later came Tug of war [China Daily, April 14, 2008] between SARFT and MIIT: “The format (T-MMB) was not strictly tested or undergo necessary trials and the standardization was manipulated by a small group of people,” claims Wang Xiaojie, head of SARFT’s Science and Technology Department. “The result is not relevant to us and we will not adopt the standard.” which resulted in the current situation when still the old NF9001 is the only T-MMB chip and Nufront is not listed even as a mobile TV chip provider while some other providers are covering now several standards with a single chip. The current best example is DiBcom whose “Octopus2s [launched on Sept 5, 2012] … single die System-On-Chip … supports all the active digital TV formats available in the World such as ISDB-T one-seg, full-seg, and sb for Japan and South America; DVB-T for Europe, Africa, South East Asia and Columbia; DAB/DAB+ digital radio for Europe; T-DMB for Korea, CMMB and CTTB for China; ATSC and ATSC M/H for North America.
                                                                                                                – Media report published on the Nufront website: Nufront: Technological innovation-oriented computing and communications develop simultaneously [April 27, 2012]: “… “In fact, as early as in 2005, began in-depth study of wireless LAN technology, developed a new generation of ultra-high-speed wireless LAN technology EUHT before the 802.11n standard in data throughput, spectrum efficiency and economy have done better than the existing WiFi technology, “said Yang Yuxin. Outdoor communications 3G/4G network in the room it will rely on the ultra-high-speed local area network. “The mentioned EUHT He is a new generation of communications technology specifically for the short-range wireless communication environment specifically optimized design can short distance (100 m coverage, expandable to 500 m) to support a large number of high-speed connection, and to ensure the business real-time requirements, the physical layer peak rates up to 3.86Gbps, about 90% of the efficiency of the system can be widely used in the Internet of Things, digital applications in the home, digital city, has obvious advantages compared with existing wireless LAN technology. …Note: MIIT in China announced on February 13, 2012 that it has approved the UHT/EUHT standard specification (click for Chinese announcement). The announcement reads that MIIT has finalized the previously discussed UHT and EUHT layer standards; the document for download is simply a table naming the two finalized standards. The actual text of the standards will be published by the Peoples’ Post and Telecoms Publishing House.

                                                                                                                And the latest report about Nufront: China fabless: Nufront ventures beyond tablet chips [EE Times, Nov 6, 2012]

                                                                                                                … Where Nufront differs from other up and comers, though, is that the company, founded in 2004, has already been around the block. Its eight years in the industry have cemented closer ties with the Chinese government agencies. With that comes government funding. Not everything has worked out in its favor, though, and the company has a few scars to show for it.
                                                                                                                A case in point is China’s mobile TV standard. Nufront, in the mid-2000’s, dabbled with the nascent digital mobile TV market, throwing itself behind one of China’s home-grown mobile TV standards, Terrestrial-Mobile Multimedia Broadcasting (T-MMB). However, just before the Beijing Olympics, China’s State Administration of Radio, Film and Television (SARFT) ended up supporting — and institutionalizing — a rival standard, China Mobile Multimedia Broadcasting (CMMB).
                                                                                                                Nufront is also known for its deep involvement in developing China’s national wireless technology, called Enhanced Ultra-High Throughput (EUHT) WLAN. With government funding, Nufront has been working on the national standard for more than several years. While the world is yet to see EUHT commercialized, Rock Yang, vice president of marketing at Nufront, stressed that the project is still on, and its ultra-high throughput wireless technology – 1.2Gbit per second throughput – will be deployed in China’s vertical market in 2013.
                                                                                                                Nufront today has about 700 employees, with a team of 400 engineers. Two hundred are software engineers, while 150 are working on hardware systems, and 50 are specifically focused on chipsets, according to the company.
                                                                                                                Nufront’s strategy doesn’t stop at the apps processor. The company is rolling out its first-generation GSM/WCDMA 3G baseband chip, TeLink 7619. Calling it a “dual-modem platform,” the new chip incorporates digital RF, power management and baseband, according to the company. How this will fare against other GSM/WCDMA baseband chips from competitors is unknown. But Nufront hopes to offer a “complete smartphone solution” in 2013, by adding its baseband chip to NS115.
                                                                                                                Yang made it clear that Nufront, during the second quarter this year, acquired some essential IPRs on WCDMA. The Chinese company paid $9.0 million to InterDigital, a company with broad wireless patent portfolio. However, it remains unclear what exactly Nufront got. InterDigital only confirms the deal in vague terms: “We did enter into a set of agreements with Nufront, and those agreements included the transfer of a certain number of patents as well as other elements.” InterDigital’s spokesman added, “Our practice is not to offer any comment on the specifics of patent transfers with partners.”
                                                                                                                Separately, in June, Intel cut a deal to buy about a host of wireless technology patents from InterDigital for $375 million.
                                                                                                                The “Internet of Things” is also in Nufront’s sights. The company believes its 3G modules could be particularly useful in the vertical market for Internet of Things applications.

                                                                                                                Microsoft Surface with some questions about the performance and smoothness of the experience

                                                                                                                Update: Upstream supply chain sees Surface RT orders cut by half [DIGITIMES, Nov 28, 2012]

                                                                                                                The upstream supply chain of Microsoft’s Surface RT has recently seen the tablet’s orders reduced by half, and with other Windows RT-based tablet orders also seeing weak performance, sources from the upstream supply chain believe the new operating system may not perform as well as expected in the market.

                                                                                                                Microsoft originally expected to ship four million Surface RT devices by the end of 2012, but has recently reduced the orders by half to only two million units.

                                                                                                                Although Asustek Computer, Samsung Electronics and Dell have all launched Windows RT-based tablets, consumer demand for those devices is also weak.

                                                                                                                The sources also pointed out that Surface RT is also unlikely to achieve great performance in the upcoming quarter which may force Microsoft to bring out its Intel-based Surface Pro tablet earlier in December.

                                                                                                                The sources also noted that Microsoft may consider reducing its Surface Pro price to attract more consumers; however, such a decision may put the already awkward relationship between the software giant and notebook vendors in an even worse situation.

                                                                                                                Something is indeed wrong to a certain extent with the Microsoft Surface as in an earlier report even Microsoft CEO Says Surface Sales Starting ‘Modestly’ – Report [Capital.gr, Nov 10, 2012]. It was the first report in English from the news in leParisien. The French headline is even telling that: Microsoft: Steve Ballmer announces “a new tablet upscale”. And indeed we find in the Capital.gr report that:

                                                                                                                The CEO also said that in the three months following Surface’s launch, Microsoft plans to offer a high-end version of its tablet equipped with Intel Corp.’s (INTC) new processor and a higher-definition screen.

                                                                                                                So I have investigated what users have found during this two weeks with the Microsoft Surface tablet.

                                                                                                                My conclusion: some software, including parts of the Windows RT operating system need tuning! In certain scenarios Microsoft Surface is definitely underperforming!

                                                                                                                Updates: providing additional evidence of the “under-engineered” character of the Windows RT software for the Microsoft Surface

                                                                                                                • Technology explanation for lower software performance on ARM from here:

                                                                                                                He explained that creating Windows 8 and its new tablet-friendly Windows Runtime has absorbed much of the C++ team’s energy.
                                                                                                                We’ve been really busy for two years with our biggest release ever. There’s an industry tsunami to the tablet revolution, the GPU compute revolution. Because C++ matters is why we’re at the centre of it. Now we can emphasise conformance again,” he said.

                                                                                                                “We have a really mature compiler and optimiser. It’s been around for a decade or two, on x86 and x64. Then we have a version 1 release of ARM. You can expect that to get better.”

                                                                                                                Note that people present on that BUILD 2012 session and even having an opportunity to speak to Herb Sutter the day before were not only confirming the importance of the above but even adding to that: “the Visual C++ team had the biggest pressure inside Microsoft in the last 2 years as everybody was relying on them

                                                                                                                Patch Tuesday, the second Tuesday of the month, and the time when Microsoft pushes out software updates for their products.

                                                                                                                On this occasion this includes includes Microsoft’s first ARM computer, the Surface, and the update  is  a “Cumulative Update for performance/compatibility” and another is a firmware update which hopefully addresses the same issue.

                                                                                                                We noticed definite performance improvements, including in multi-tasking, text input, quicker loading times and improvements in IE, including in tab switching and closing.

                                                                                                                Techtony • a day ago
                                                                                                                Not only the Surface was updated, The Asus Vivo Tab RT was also Updated. New Firmware Message and a total of 8 Updates

                                                                                                                RJD • 2 days ago Absolutely notice performance improvements across the board…loading apps, screen accuracy, word accuracy, IE improved to boot.

                                                                                                                surur Mod Eric Hon2 days ago Apparently apps open faster.

                                                                                                                GG002 surur2 days ago And less sound stuttering while Surface sleeps. At least buggy music playback while Sleep isn’t a problem for me anymore (knock on wood).

                                                                                                                It is indeed faster. In some cases much faster. A Hungarian developer was measuring the improvement via the CPU usage with the Mandelbrot program as a benchmark: C#: +25%, C++: +110%!, C++ AMP (software emultaion): +72% improvements were found by him (see in this Facebook message in Hungarian).

                                                                                                                End of updates

                                                                                                                I’ve also found videos on YouTube which will prove my point accordingly:

                                                                                                                Microsoft Surface with Windows RT: Performance [lockergnome YouTube channel, Nov 4, 2012]

                                                                                                                iPad 3 VS Surface: Fruit Ninja – Gaming Performance [DarGdgtZ YouTube channel, Oct 28, 2012]

                                                                                                                A quick video of Fruit Ninja running on both the iPad 3 and Microsoft Surface. This was just to give people a feel of how a game runs on Microsoft’s first tablet. If you have any questions on the product feel free to contact us on our website or message us on YouTube. Our website: http://www.dargadgetz.com App Reviewing Channel: http://www.youtube.com/appquest Twitter: http://www.twitter.com/dargadgetz Google+: http://goo.gl/jy4Bf Instagram: dargadgetz Facebook: http://www.facebook.com/dargadgetz

                                                                                                                Microsoft Surface RT HD video and gaming [Bravo0 YouTube channel, Nov 4, 2012]

                                                                                                                I’ve heard a few reviewers say that 1080p video is not smooth and that gaming (specifically Hydro Thunder) is laggy and doesn’t play well. I prove them wrong. Enjoy. Follow me on Twitter: @ludwighildmann I can also make a video of Reckless Racing Ultimate Edition if you guys want. It also plays without any lag and looks great and plays great! You can turn the graphics up to the max in the settings without any problems on the Surface RT. Yes I know the screen doesn’t have super high resolution so please refrain from commenting on that.

                                                                                                                The historic cadence leading to Microsoft Surface:

                                                                                                                Was there enough time to tune everything properly? I thinks so. Look at the following history of the Windows on ARM (Windows RT) evolution:

                                                                                                                CES 2011 – Windows on ARM Demos [leslie2823 YouTube channel, Jan 9, 2011]

                                                                                                                See the next gen systems on a chip running during the Microsoft keynote recorded on 1/6/2011 at CES using a Flip Video camcorder.

                                                                                                                NVIDIA quad-core Tegra 3 “Kal-El” quad-core processor demo blows us away [IntoMobile YouTube channel, Feb 15, 2011]

                                                                                                                We get a preview of NVIDIA’s Tegra 3 “Kal-El” quad-core processor. It can outperform an Intel Core 2 Duo while sipping less battery power than the current dual-core Tegra 2 processor. The Kal-El is also capable of driving extreme HD resolutions of 2560×1600.

                                                                                                                Directly related videos from NVIDIA published at the  same time:
                                                                                                                Project Kal-El web-browsing benchmark [nvidia YouTube channel, Feb 15, 2011]

                                                                                                                This video shows a web-browsing benchmark, NVbench, running on all four cores of the Project Kal-El mobile processor. The video shows how web browsing will be up to twice as fast with our next-generation, quad-core Tegra processor.

                                                                                                                Coremark performance on Kal-El [nvidia YouTube channel, Feb 15, 2011]

                                                                                                                This video shows the quad-core CPU performance of Project Kal-El. Coremark performance on Kal-El exceeds that of an Intel Core2Duo processor.

                                                                                                                NVIDIA Tegra 3 Tablet running Windows 8 [minipcpro YouTube channel, June 2, 2011]

                                                                                                                http://www.netbooknews.com/27326/nvidia-tegra-3-ti-omap4430-and-qualcomm-snapdragon-powered-tablets-laptop-running-windows-8/ – Demo of an NVIDIA Tegra 3 aka Project Kal-El tablet running Windows 8 at Computex 2011

                                                                                                                Nvidia Kal-El Windows 8 ARM tablet hands-on [Thisismynextvideo YouTube channel, Sept 14, 2011

                                                                                                                Who is gaining with that?

                                                                                                                It is no doubt that Intel is the party gaining most with that!

                                                                                                                Look at the stakes:
                                                                                                                – Intel market capitalisation: US$ 103.50B which is critical for large investors because a collapse of Intel may cause an unprecedented upheaval on the stock market. Also note that Windows 8 is the last chance for Intel to prevent such collapse to happen.
                                                                                                                – Intel fabs which are:

                                                                                                                1. Huge, numerous and most of them are representing the latest manufacturing technologies: see List of Intel manufacturing sites on Wikipedia
                                                                                                                2. Each representing multibillion dollars of multi-year investments:
                                                                                                                  see New $5 billion Intel facility planned for Chandler [AZCentral.com, Feb 19, 2011] as the latest example
                                                                                                                3. A tremendous effort made by Intel to outgun its fabless competitors exactly through such cutting-edge manufacturing. It is now described not only as leading edge in terms of smaller die sizes and thus higher chip volumes on the same wafers, better performance and/or lower power use, but also speed and agility with the time to manufacture a component halved in the past five years.
                                                                                                                4. Strategic for the US economy as whole to prevent its advanced manufacturing sector to go the way of its lower-tech predecessors – to Asia. See Insight: As chip plants get pricey, U.S. risks losing edge [Reuters, May 1, 2012].
                                                                                                                5. Entering into a critical phase against its major by far fab competitor, TSMC for whom the capacity shortage of its leading 28nm nodes will end by December, 2012. See my Qualcomm’s critical reliance on supply constrained 28nm foundry capacity [this same ‘Experiencing the cloud’ blog, July 27-Nov 8, 2012] post as updated just 4 days ago. Considering that the competitive strength of all of its fabless competitors depend on TSMC manufacturing capabilities this is the most critical window for strategic survival in Intel’s whole history.

                                                                                                                A further evidence of why Intel’s survival might be behind that is the fact that the latest mobile SoC from Intel, so called Clover Trail will be in the Windows 8 tablets only in the later part of November. Even the first tablets based on that, the Acer Iconia W510 models are “Temporarily out of stock” on the Amazon while it was oiginally promised to be available from Nov 9 in the US and Canada. See: Acer Iconia W510: Windows 8 Clover Trail (Intel Z2760) hybrid tablets from OEMs [this same ‘Experiencing the cloud’ blog, Oct 28, 2012]. So the tuning was going on well after the “final” Windows 8 launch of Oct 26, and might continue even these days.

                                                                                                                Another evidence is the fact that the x86-based version of the Microsoft Surface, Surface Pro will arrive just 3 month later as was pointed out in the leParisien interview of Steve Ballmer referred to in beginning of this post. Moreover when it was announced it was for the much better performing Ivy Bridge processor, not the Clover Trail we indicated here as available in a numerous products by the end of November. This could mean a delivery of Surface Pro as late as January next year! Plenty of time to make the new Windows software and the available applications performing well and smooth in all respects.

                                                                                                                Other information on this blog:
                                                                                                                Microsoft Surface: its premium quality/price vs. even iPad3 [Oct 26, 2012]
                                                                                                                Microsoft Surface: First media reflections after the New-York press launch [Oct 26, 2012]
                                                                                                                Core post: Giving up the total OEM reliance strategy: the Microsoft Surface tablet [June 19, 2012]

                                                                                                                Qualcomm’s critical reliance on supply constrained 28nm foundry capacity

                                                                                                                KEY UPDATES: TSMC Board of Directors Meeting Resolutions [TSMC press release, Nov 13, 2012]

                                                                                                                Hsinchu, Taiwan, R.O.C. – November 13, 2012 – TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

                                                                                                                1. Approved capital appropriations totaling approximately US$2.975 billion for the purpose of expanding advanced process capacity, construction of 12-inch GigaFabstm, and installation of facilities systems.

                                                                                                                2. Approved R&D capital appropriations and 2013 sustaining capital appropriations totaling approximately US$209.5 million.

                                                                                                                3. Approved the issuance of no more than NT$45 billion (approximately US$1.53 billion) in unsecured corporate bonds in Taiwan to finance TSMC’s capacity expansion.

                                                                                                                4. Approved the subscription of NT$1.24 billion (approximately US$42.28 million) in new shares to be issued by TSMC Solid State Lighting Ltd. in 2013.
                                                                                                                5. Approved the subscription of NT$636 million (approximately US$21.63 million) in new shares to be issued by TSMC Solar Ltd. in 2013.

                                                                                                                TSMC sees orders returning for its 28nm process [DIGITIMES, Nov 8, 2012]

                                                                                                                In first-half 2012, Taiwan Semiconductor Manufacturing Company (TSMC) saw its 28nm process lacking enough capacity, forcing customers such as Qualcomm to shift orders to United Microelectronics (UMC), Globalfoundries, and Samsung.

                                                                                                                However, TSMC has been seeing orders returning from tier-one customers such as Qualcomm as it solves the capacity issues.

                                                                                                                According to TSMC’s financial forecast for the fourth quarter, revenues will show a single digit decrease compared to the third quarter. Market observers expected TSMC to see an on-quarter decrease of 15% in its fourth-quarter revenues. But due to sufficient 28nm capacity, orders have been returning and revenues are likely to be higher than expected. TSMC forecasts revenues from the 28nm process will exceed 20% in the fourth quarter.

                                                                                                                UMC recently announced its 28nm process progress, which has been delayed due to lower than expected yield ramps. UMC noted that 28nm process gross margin has been lower than its average gross margin, and the firm originally planned to increase revenues from the 28nm process to 5% of total revenues by the end of 2012. But the firm has become conservative about the progress, and hopes that among total revenues in December, 5% will be from the 28nm process. Revenues from other processes such as 40nm will likely reach 15% of total revenues before the end of 2012, ahead of schedule, according to UMC.

                                                                                                                China-based Semiconductor Manufacturing International Corporation (SMIC) plans to put 28nm process into volume production at the end of 2012. Despite the relatively slow pace on expanding 28nm capacity, the China government has been subsidizing local IC design firms. If local IC design firms enter the 45nm and 28nm process market, the government reportedly will subsidize up to 50% of reticle costs.

                                                                                                                Note from the Reticle article of the Wikipedia: Photomask – plate with holes or transparencies used in photolithography integrated circuit fabrication also called a “reticle”

                                                                                                                QUALCOMM Incorporated Management Discusses Q4 2012 Results – Earnings Call Transcript [Seeking Alpha, Nov 7, 20]

                                                                                                                QCT had another strong year, with record revenues up 37% year-over-year, driven by record shipments of 590 million MSM chipsets, which were up 22% year-over-year. In the fiscal fourth quarter, we shipped approximately 141 million MSM chipsets, above the midpoint of our prior guidance.
                                                                                                                Revenue per MSM was up approximately 9% sequentially, driven by a greater mix of multimode 3G LTE devices, which more than doubled quarter-over-quarter and made up approximately 1/3 of our shipments exiting the quarter as expected. Similarly, shipments of our new dual-core MSM8960 tripled quarter-over-quarter as demand for our integrated application processors continues to grow.
                                                                                                                Demand for our 28-nanometer products remained strong, including significant design activity on our follow-on chipsets. As expected, we ramped our 28-nanometer supply significantly in the fiscal fourth quarter, and we remain on track to match our current 28-nanometer demand profile exiting the December quarter.
                                                                                                                We believe our first 28-nanometer Snapdragon product, the dual-core MSM8960 with integrated 3G/LTE has become the global standard for combined performance and battery life, powering recent flagship devices such as the Samsung Galaxy S III, the HTC 8X, the Motorola RAZR M and the new Nokia Lumia phones.
                                                                                                                As carriers deploy LTE networks, they are looking to Qualcomm as the leader in multimode LTE for smartphones. For example, KDDI, NTT DOCOMO and SoftBank announced 27 new smartphones in Japan in October, and 24 of those were powered by Qualcomm Snapdragon processors.
                                                                                                                Since releasing the MSM8960, 15 OEMs have launched devices with this chipset across 19 carriers around the globe. The 8960 was our fastest integrated product to ship 100 10 [as later corrected in the discussion] million units.
                                                                                                                Our OEM customers have also moved quickly to adopt the Snapdragon S4 Pro, which includes our latest Adreno 320 GPU, 4 Krait CPU cores and is paired with an MDM9x15 multimode LTE modem. Early reviews show that this product has set a new bar for multitasking and graphics performance. The first OEM devices based on this platform include the Google Nexus 4, LG Optimus G and Xiaomi MI2, and we expect more leading devices on this platform to be announced soon.
                                                                                                                Smartphone demand in emerging regions is growing rapidly, and we continue to invest in our Qualcomm Reference Design program to help service a new group of emerging customer accounts. The program now has over 40 OEM customers and 100 commercially launched devices. And this quarter we expanded our road map to include the new Snapdragon quad-core MSM8x25Q and our new 28-nanometer based MSM8930 with an integrated global modem.
                                                                                                                As we mentioned on the last call, we expect a strong December quarter for QCT as our supply of 28-nanometer chipsets continues to ramp and our partners launch a broad lineup of handsets for the holiday quarter. We are expecting record MSM shipments of between 168 million and 178 million units in the first fiscal quarter, up approximately 19% to 26% sequentially, with revenue per MSM also up sequentially.
                                                                                                                Question-and-Answer Session
                                                                                                                Q: … could you talk a little bit about what’s going on with ASP at the lower end? Obviously, MediaTek is starting to do a little bit better. Are you seeing more price pressure there? …
                                                                                                                … On the low end, it’s pretty much playing out the way that we’ve discussed and/or described over the last year or so, which is pretty competitive market at the low end. It’s very crowded a bit competitively, and people are really pricing aggressively in order to get share or to maintain share. So we expect that to continue to some degree as we talked about for some time. …
                                                                                                                Q: You’re upping estimates for emerging market devices in 2012 by $15 million. Could you talk about that? And do you have thoughts on how much of the China market can actually migrate to 3G and 4G? There is a bit of a negative case out there that EDGE plus WiFi is a sufficient smartphone experience for some, given the density of WiFi hotspots in China, and even like iPhones already on the China Mobile network.
                                                                                                                … If we look at the EDGE smartphone market, I mean, we believe that‘s a transitional step. Obviously, people aren’t going to be satisfied with the EDGE experience when it comes to the kind of content that many people are consuming on their smartphones, high-bandwidth content like video. The other thing is WiFi is going to tap out because it’s going to be interference limited. And the nice thing about the licensed band technologies that you can cause the base stations to manage interference among themselves. And that’s the kind of technologies that we’re going to be bringing to the market over the next few years. And those, I think, will drive the kind of capacities of the network at very, very much decreased cost points. So the wireless operators are going to be in a position to really supply a lot better data experience, lot better quality of service over the 3G and 4G networks. And so while we love WiFi and we sell an awful lot of WiFi through Atheros, we believe in it for offload, it’s not going to be the solution for the mass of smartphones and tablets going forward.

                                                                                                                Q: … You had said earlier that you would expect supply to only match demand later in the second half of the December quarter. Does that mean that you will still be working off demand in the March quarter? Is that the implication of that statement?

                                                                                                                With respect to seasonality, let me clarify my comments. For the fourth quarter, we have been talking about how we thought that exiting the fourth quarter we thought supply and demand of 28-nanometer would be matched. By implication, the starting point or the beginning part of the quarter, meaning the October and September time frame, we are still burning off excess or not enough supply. And by the way, these are calendar quarters. So I’m talking about the December quarter. Now going into March, we feel that we have supply and demand imbalance. And we think that, that will be the case, really, exiting the December month. So hopefully that clarifies it.
                                                                                                                Q: … I wanted to follow up on an earlier question related to device ASPs. I think Mike Walkley has asked about when we might expect to see the growth in emerging market start to have downward pressure on ASPs. At least, how we should think about that qualitatively? …
                                                                                                                [William E. Keitel – Chief Financial Officer, Principal Accounting Officer and Executive Vice President] … On the device ASP, emerging markets having a larger effect on the total average. The — although emerging market units are growing faster than the developed markets are, the total dollar value of the developed TRDS [Total Reported Device Sales] is far greater than the emerging market TRDS. And so we’re ways away from that crossing over where emerging market dollar value is equal to or greater than the developed market. But I think we’re planning a little more color on this next week. So I’ll leave that point there. …
                                                                                                                Q: And just to follow up on ASPs, my understanding is that the strong smartphone adoption that’s happening in the emerging markets has been driven in part because the smartphone ASPs have come down. I think, Paul [Jacobs, the CEO], you were talking recently about the price points getting to $100 and, at some point, maybe going down as low as $50. And I’m just trying to reconcile that with the comments around ASPs at the low end running up, and hence, supporting the outlook of flat to up ASPs in 2013.
                                                                                                                [Derek K. Aberle – Executive Vice President and Group President] Let me just try to take part of that, and then if Paul wants to add on. I think there’s still — even though the pricing from smartphone is coming down tier, which obviously is a positive for driving growth, there still is a meaningful gap between sort of the lower-end smartphone and the low-end 2G or 3G feature phones that have been sold before those became available. So as we look out and we see the trends, I think we do continue to expect, even as the prices come down, a combination of more people buying at a higher price than they were historically on a feature phone as well as people migrating to even the higher-tier devices will provide some stability there.

                                                                                                                END OF KEY UPDATES

                                                                                                                Rumors came yesterday that Apple to postpone iPhone 5 amid undersupply of 28nm chips [Want China Times, July 26, 2012]. And the reason:

                                                                                                                Apple’s leading chip supplier, Qualcomm, will be able to tackle the 28nm chip undersupply only by the end of this year, said Qi Fei, a spokesman for Qualcomm China. The problem arose during the second quarter of this year, as demand for 28nm chips has been growing alongside the popularity of smartphones.

                                                                                                                QUALCOMM Incorporated Management Discusses Q3 2012 Results – Earnings Call Transcript [Seeking Alpha, July 18, 2012]

                                                                                                                Paul E. Jacobs – Chairman and Chief Executive Officer:
                                                                                                                In QCT, we’re continuing to see strong demand for our new Snapdragon S4, and other 28 nanometer chipsets, and that demand continues to exceed our available supply. We will continue to ramp capacity in the upcoming quarters consistent with our prior expectation. However, the constraints on 28 nanometer supply are continuing to limit our potential revenue upside this fiscal year.

                                                                                                                Steven M. Mollenkopf – President and Chief Operating Officer:
                                                                                                                We continue to be supplies constrained on our 28 nanometer products but are ramping supply with multiple foundries in the September quarter and again into the December quarter consistent with our prior expectations. We currently project that we’ll be able to closely match supply with demand as we exit the calendar year.

                                                                                                                The reduced demand profile and ongoing 28 nanometer supply constraints, as well as our increased efforts to bring additional 28 nanometer capacity online and continue investments in our QRD and mobile computing programs in advance of the opportunities ahead are driving lower operating margins in the fiscal third and fourth quartersversus historical norms.

                                                                                                                Looking ahead, we anticipate a strong lineup of device launches leading into the holiday season and believe QCT is well positioned for the December quarter, particularly with the increasing supply of industry-leading chipsets for high-tier devices.

                                                                                                                Over 15 devices based on our S4 MSM8960 28 nanometer chipsets have launched to date, including the Samsung GALAXY S III, the HTC One S and One X, LG Optimus LTE2, Pantech Vega Racer 2 and Sony Xperia SX. There are now more than 420 announced Snapdragon-based devices with over 400 more in design, including 175 S4 designs. Third-party reviews and benchmarks again reinforced our product leadership this quarter, confirming that the Snapdragon MSM8960 outperforms quad-core CPUs-based handsets by using a complete multi-core system with our custom GPU, DSP and dual-Krait CPU cores. We also sampled 3 new S4 chips this quarter, including the APQ8064 and the MSM8x30. The APQ8064 includes 4 Krait CPUs. It is the first to use our new Adreno 320 GPU and will extend the performance expectations we recently established with the MSM8960. The MSM8x30 integrates a multi-mode LG or 3G LTE and is designed to enable 3G/4G smartphones at high-volume price points globally.

                                                                                                                Our modem leadership also continues to be a differentiator for design wins in modem plus AP smartphones, in tablets, modules and WiFi personal hotspots, including over 90 designs in process based on our 28 nanometer 3G/4G LTE MDM9x15 modem. While many companies are still commercializing their first LTE products, we have already announced our third-generation LTE chipsetsand will continue investing in our modem road map to maintain our leadership.

                                                                                                                In emerging regions, our QRD program, which provides turnkey designs for affordable smartphones, continues to expand rapidly. We continue to grow our QRD road map with differentiated technology, including our new [45nm] Snapdragon 8×25 1.2 gigahertz dual-core chipset, which began shipping commercially in July, only 2 months after first sampling. We are engaged with over 40 OEMs, many of which are now transitioning their platforms from 2G to 3G, and these OEMs have announced approximately 50 devices based on our chipsets for China and other emerging countries. In addition to the announced devices, we currently have 100 new QRD-based smartphone designs in the pipeline.

                                                                                                                We also continue to invest in mobile computing and are pleased to see the momentum building around the new ARM-based Windows platform. As the only chipset provider supporting Windows on both PCs and phones sold commercially, we look forward to the availability of both Windows 8 and Windows Phone 8 this fall.

                                                                                                                Looking ahead, while we are forecasting sequentially lower MSM shipments based on midpoints in the September quarter consistent with the pause and re-profiling of demand, we expect a strong December quarter as new high-tier smartphone devices launch for the holidays and we have an improved supply of 28 nanometer products.

                                                                                                                [Question-and-Answer Session]

                                                                                                                Brian T. Modoff – Deutsche Bank AG, Research Division

                                                                                                                Steve, on the 28 nanometer, can you talk a little bit about how you see demand in the current quarter? You’ve talked about hitting 1/3 of volume by September. Is that still feasible? In terms of the guide down sequentially, is this — a lot of this — have you seen cuts in the 45-nanometer demand trends as well? And then are you bringing a second source on for — in terms of meeting the demand as you get into the fourth quarter? And are you happy with the yields that you’re seeing on that second source at this point?

                                                                                                                Steven M. Mollenkopf

                                                                                                                Brian, yes, it’s Steve. The 28 nanometer right now, as I said, we’re supply limited. So it’s — and it’s going quite well in terms of bringing up additional sources. We actually have 4 sources that we’re now bringing up. If you track through the calendar year, we’re engaged with all of them now. And it’s going the way that we had thought. You had — you talked a little bit about the 45-nanometer products and such, and I think what you’re seeing a bit of is a little less of the backfill that we would have expected. And I think that’s consistent with what we were talking about, the re-profiling of demand. That’s really a little bit less of the backfill and a little bit more waiting for the new products to come out. So we’re just working very hard to try to get those products out the door.

                                                                                                                Brian T. Modoff – Deutsche Bank AG, Research Division

                                                                                                                So in terms of talking through the — just talking about a more positive December quarter, some of this is you’re getting demand. People want the 28 nanometer. So the push in demand is to that quarter is what you’re saying?

                                                                                                                Steven M. Mollenkopf

                                                                                                                That’s right. You — at the same time, you’re — we have a significant demand for the 28-nanometer products. And as you get into the December quarter, you now have a tier of products on 28 nanometer, which, I think, is a big advantage for our portfolio. And they’re moving forward. And you’re essentially in a situation where demand is increasing and supply is increasing, and we’re trying to match those 2 ramps. And it’s — we’re just in execution mode getting through that right now and engaged with 4 fabs in order to do that.

                                                                                                                Simona Jankowski – Goldman Sachs Group Inc., Research Division

                                                                                                                Just a couple of questions. First, to clarify. With your comments on the 28 nanometer, suffice to say it’s alleviating in the December quarter, was that referring to the entirety of the December quarter? Or is it just for the exit run rate? In other words, would you still see inability to meet some of the demand in the entirety of that quarter? And then as it pertains to your chipset margin, is there any reason to think that in December, chipset margins should not be above your typical average margin given the volumes you’re expecting?

                                                                                                                Steven M. Mollenkopf

                                                                                                                Simona, it’s — this is Steve. The supply really exits the quarter on a matched situation. It doesn’t end — enter the quarter that way. So at the beginning of the quarter, we still have a gap that we need to deal with, but it improves throughout the quarter. We think it matches up toward the end.

                                                                                                                Simona Jankowski – Goldman Sachs Group Inc., Research Division

                                                                                                                So then maybe just a question for Paul. In terms of looking strategically longer at some of your big customers who are becoming more vertically integrated, and obviously, we had the announcement yesterday from Samsung are buying some of the technology and connectivity from CSR, now how should we think about customers like that longer termfor fall coming in terms of your potential share of their silicon business?

                                                                                                                Paul E. Jacobs

                                                                                                                Yes. So we’ve had these same issues throughout the history of the company where internal efforts — people try to build the silicon for their own chipsets. And I think the key way to combat that, as we’ve done all along, is to continue to drive the technology hard. Obviously, we’re driving it very rapidly in a number of areas now, not just the radio. It used to be just the radio. But now it’s also processor and graphics technology. And we’ve seen — I’m sure you’ve seen a number of the benchmarks coming out talking about how, I think the latest one I saw was on graphics, how we were really winning on the graphics side but, obviously also, on the computing side, we’ve had great comparisons. So the key, as I said, is drive the technology hard. Do people for their internal uses have enough scale to invest at the same rate that we do? And the answer is generally no. And plus, we have just a level of experience that we can bring to bear, and I think that, that strategy will continue to work as it has in the past.

                                                                                                                    • [from a later part]
                                                                                                                      Jeffrey T. Kvaal – Barclays Capital, Research Divisio
                                                                                                                      … first is to follow up on the internal production. I think we’ve seen the pendulum shift back and forth between internal and outsourced a bit over the years. Where are we in the current swing? Should we expect production to go a little bit more internal perhaps over the course of the next few quarters or years?
                                                                                                                    • Steven M. Mollenkopf
                                                                                                                      … I’m assuming the first question is really more about the vertical customers. I would say that it’s really consistent with what Paul said. I think it’s getting harder and harder to create chipsets moving forward. It’s primarily because in order to create particularly high-end products, you need to innovate across so many different technology vectors. And unless you’re fairly large and you have a fairly broad technology portfolio and you’re at the leading nodes, I think you’re going to have a difficult time producing the type of products that you need. So in our view, it’s actually getting harder to do chipsets and so, therefore, probably more favoring of our model.
                                                                                                                    • [It is also worth to look at this video published just a day before the earnings call]
                                                                                                                Travis Lanier, director of CPU product management, discusses in detail what goes inside Snapdragon processors and sets them apart from the competition. This video sheds light on the thought that Qualcomm puts into its designs—from thermal management, power efficiency and extending device term battery life to asymmetrical loading, multiple cores and more—resulting in a highly optimized chip.

                                                                                                                Rod B. Hall – JP Morgan Chase & Co, Research Division

                                                                                                                … on 28 nanometer, just one more thing. Can you quantify at all what kind of 28-nanometer shortfall you’re assuming in the fiscal Q4 guidance?

                                                                                                                William E. Keitel- Chief Financial Officer, Principal Accounting Officer and Executive Vice President
                                                                                                                Oh, in the shortfall. Well, let me say this. First of all, 28 nanometer, our shipment estimates both for the fourth fiscal quarter and what we expect for the first fiscal quarter, we’re essentially in line with where we were 3 months ago. So the QCT team is executing well on that aggressive ramp that we had talked about last time. But going out of this quarter, if we could ship all the demand that’s in front of us for this quarter, I would just say that our revenue and operating margin would be materially higher.

                                                                                                                James E. Faucette – Pacific Crest Securities, Inc., Research Division

                                                                                                                Just a few follow-up questions. First, back to Steve or Paul related to your partnerships with your foundries. I think, Steve, you said that you’re now sourcing 28 nanometer from 4 different partners. Going forward as we look at future geometry and process improvements, should we expect you to continue to be diversified at the outset across multiple partners? Or should we expect you to return to concentrating on 1 or 2 key partners for future transitions, firstly? …

                                                                                                                Steven M. Mollenkopf

                                                                                                                James, this is Steve. Our product portfolio at the high tier, we tend to be on the leading node; on the lower tiers or the mass-market tiers, we may be one node behind. So we tend to have a broad sourcing strategy to take account of the fact that we’re on leading node. And also, following nodes, we tend to engage with a lot of fab partners by necessity. On the leading nodes, I think you’re not going to see a big change in our strategy moving forward with the exception that we do, obviously, a much better job of matching our ramps, capacity ramps and demand ramps, as we drive leading nodes. For us, you’re going to continue to see us really taking advantage of the fact that you can play the integration game at the leading nodes. And there’s a number of different good road maps that we’re seeing from the industry through the fab — through fab partners, and we’re going to continue to drive the best ones that we can find.

                                                                                                                QUALCOMM Incorporated’s CEO Discusses Q2 2012 Results – Earnings Call Transcript [Seeking Alpha, April 18, 2012]

                                                                                                                Steven M. Mollenkopf – President and Chief Operating Officer:
                                                                                                                Our QCT business delivered another strong quarter. We shipped 152 million MSMs, up 29% year-over-year driven by increased demand for our integrated smartphone solutions and advanced modems.
                                                                                                                Smart — Snapdragon shipments increased by more than 70% year-over-year, driven by growth across all price tiers from Snapdragon S1 products to our latest generation of Snapdragon S4 processors. There are now more than 370 announced Snapdragon-based devices with over 400 more in design, of which over 150 are S4 designs.
                                                                                                                As you know, we have made significant investments in recent years to establish a leadership position in LTE chipsets, and we believe we are succeeding. In parallel, industry adoption of LTE technology is growing rapidly. And with our strong portfolio of products, we are at the forefront of this technology transition.
                                                                                                                As a result of these trends and as Paul mentioned, demand for our 28-nanometer chipsets continues to exceed available supply. To address 28-nanometer demand, we are increasing our related operating expenses and are working closely with our fab partners to bring up additional capacity.
                                                                                                                Within this environment, it is worth noting that our current estimates for total 28-nanometer shipments this fiscal year are largely in line with our prior guidance, though our forecast for the June quarter is a bit lower. Our increased investment to bring up additional 28-nanometer capacity is expected to show results in fiscal 2013.
                                                                                                                Across the rest of the business, demand trends are very strong, and we continue to drive our technology leadership. At Mobile World Congress in Barcelona, several leading OEMs announced their first Snapdragon S4 dual-core devices, including ASUS, HTC, Huawei, Lenovo and Panasonic. We also demonstrated our new S4 quad-core processor, the APQ8064 running 4 separate HD video streams; and we announced our S4 Snapdragon MSM8960 Pro, which integrates our new high performance programmable Adreno 320 GPU for higher-end mobile computing devices.
                                                                                                                We announced and demonstrated our new 802.11ac Wi-Fi solution and announced a broad family of 11 AC chipsets for mobile, computing, consumer electronics, as well as home and enterprise networking. Also, our new integrated connectivity solution, which includes digital Wi-Fi, GPS, Bluetooth and FM, continues to be designed in by our customers in the vast majority of our growing S4 pipeline.
                                                                                                                We continue to invest in our Qualcomm reference design program to support growth of lower-tier smartphones in emerging regions. Shipments into Chinese emerging accounts are expected to grow at a strong double-digit rate quarter-over-quarter while we transition customers to 7x27A. There have been 10 OEM designs launched on our reference programs over the last quarter with more to follow. We are on track to expand the reference design programs to include a new dual-core Snapdragon processor the MSM8x25. We will do this before the end of the June quarter.
                                                                                                                We are increasing our investments to address incremental opportunities beyond traditional cellular, including mobile computing and Windows on Snapdragon. And looking ahead, our leadership position across multiple technologies, delivered to our customers with a tiered and expanding chipset road map, positions us well for smartphone and computing trends in both emerging and developed regions.
                                                                                                                T. Michael Walkley – Canaccord Genuity, Research Division
                                                                                                                Steve, I wonder if you could just elaborate a little more on the 8960 ramp. Obviously, some of your customers are worried about your ability to supply, given the demand’s greater than the ability to supply. So how do you manage maybe losing some share in the short term? And then also how do you manage maybe some double ordering that might come from customers trying to get that supply?
                                                                                                                Steven M. Mollenkopf
                                                                                                                Mike, it’s Steve here. A couple of things, one is we have taken approach to spread the supply across all of the customers as best we can, and so I think everybody is dealing with this issue. And obviously, it’s a pretty difficult issue to deal with. But in the near term, some of the OEMs have been looking at alternative chipsets, in particular our Fusion 2 lineup, which can be substituted in some cases. But other than that, it’s really a question where we are accelerating as best we can the supply, consistent with what I was saying and what Paul was saying. We’re really focused very much on getting additional supply throughout the year.
                                                                                                                Parag Agarwal – UBS Investment Bank, Research Division
                                                                                                                Steve, can you please explain the alternative your customer have, given that the supply is constrained? And then what has been the reaction so far? I mean what — I mean are these customers willing to go to older Snapdragon designs? Are they looking at alternatives? Are they trying to use their own set [ph] of solutions?
                                                                                                                Steven M. Mollenkopf
                                                                                                                Well, I think you see a combination of people. In any constrained environment, people look for any alternative they can in order to solve the problem. Now what you have, particularly in this case, is these are devices that primarily are using LTE type of chipsets, and so the alternatives are a little bit smaller than they would be, let’s say, in a general allocation scenario, maybe in another industry. And we’ve been helping customers to see how they can swap in our Fusion 2 chipset, which is the chipset that we have been ramping over the last 8 months in production. Now in some cases also, our OEM partners are, of course, working with us very closely to try to help us accelerate our own supply, and that is primarily what we’re seeing. And we do expect to see some alternative non-Qualcomm chipsets being used to solve that issue as well. But I will remind you that in addition to the 8960, right on its heels is the 8×30, as well as the APQ8064. So we’re continuing to drive our tiered road map throughout the year on the same schedule, again, gated by the supply here in the near term. But I think that’s a pretty attractive road map that people are interested in doing. So we need to solve the supply issues, and then we’ll move the business on.

                                                                                                                Qualcomm chip shortage to continue [The Korea Times, June 21, 2012]

                                                                                                                Qualcomm said Thursday that its chip supply will not likely meet high demand from its major clients, including Samsung Electronics, LG Electronics and Pantech, dampening their hopes that chip supply would improve in the latter half of this year.

                                                                                                                “We are still struggling to meet an explosive demand for the latest MSM8960 chipsets and other chip variants using a 28-nanometer processing technology, though the production yields of our chip products have steadily been improving,” said Kim Jong-ha, a senior executive at Qualcomm CDMA Technology Korea, Thursday.

                                                                                                                Industry sources said Qualcomm has been in negotiations with three and four chip foundries other than Taiwan’s TSMC to increase supply of the chips and stressed “visible results” to follow shortly. Kim was at the sidelines in the press conference to unveil Qualcomm’s updated business strategies at the Plaza Hotel, downtown Seoul.

                                                                                                                Qualcomm had warned in April that it will have trouble meeting demand for some of its advance cellphone chips for the rest of the year due to manufacturing constraints and operating expenses will increase faster than expected.

                                                                                                                The MSM8960 chipsets, which sport Long-Term Evolution (LTE) functionality, are currently being used in Samsung, LG and Pantech’s premium smartphones. Samsung’s Galaxy SIII LTE smartphone is also using the Qualcomm chipset.

                                                                                                                But the Qualcomm executive said the chip shortage problem should soon ease, though he declined to say exactly when.

                                                                                                                Qualcomm has attempted to appease its clients by offering an alternative in the form of the “Fusion 2” chipset; however the manufacturer is conceding; “We do expect to see some alternative non-Qualcomm chipsets being used to solve that issue as well.”

                                                                                                                The executive said it will commercialize its quad-core one chip solutions from the latter half of next year and a smartphone that uses the latest chip solution will be released in July next year.

                                                                                                                Qualcomm plans to put the VoLTE functionality on its upgraded MSM8960 chipsets in a goodwill gesture to help local carriers smoothly push their VoLTE services from September this year.

                                                                                                                Qualcomm sources said the existing MSM8960 chipsets don’t support the VoLTE functionalities, which is impossible for consumers using Samsung’s Galaxy R Style, LG’s Optimus LTE2 and Pantech’s VegaRacer2 models to experience the VoLTE service.

                                                                                                                During the conference, Qualcomm pledged business expansion to Internet-connected TVs, PCs and tablets and reiterated its bullish plan to support Microsoft’s Windows 8 software.

                                                                                                                Globalfoundries to the “rescue”:

                                                                                                                Globalfoundries to fab 28nm chips for Qualcomm, says paper [DIGITIMES, July 13, 2012]

                                                                                                                Qualcomm has contracted Globalfoundries’ Dresden fab to manufacture 28nm chips, the Chinese-language Commercial Times cited unnamed equipment makers as saying in a recent report. The foundry chipmaker will start shipping the orders to Qualcomm in the fourth quarter of 2012, the paper said.

                                                                                                                Commercial Timespreviously reported that UMC had secured orders for 28nm Snapdragon S4 chips from Qualcomm with volume production slated for the last quarter of 2012.

                                                                                                                Rumors circulated earlier in the year that TSMC’s supply shortfalls at 28nm would likely drive its longtime partners toward other foundries. In addition to Qualcomm, Nvidia was identified as another TSMC customer considering a second-source supplier.

                                                                                                                In fact, Globalfoundries has already entered into a non-binding MoU with Qualcomm to collaborate on leading-edge technologies. Globalfoundries said in a January 2010 company release that initially the firm intends to provide Qualcomm with access to 45nm LP and 28nm LP technologies, with an intended collaboration on future advanced process nodes.

                                                                                                                In other news, IC design service company Socle Technology recently disclosed that the firm has developed and taped out its first ARM Cortex-A9 based 28nm ASIC design using Globalfoundries’ 28nm super low power technology (SLP) with HKMG. The ASIC design will soon be mass produced at Globalfoundries, Socle said.

                                                                                                                Formerly a IC design service subsidiary of Chartered Semiconductor Manufacturing, Socle now works closely with Globalfoundries.

                                                                                                                GlobalFoundries Interview with Subramani (Subi) Kengeri [BrightSideofNews YouTube channel, May 22, 2012]

                                                                                                                An interview with Subramani “Subi” Kengeri, Vice President of Design Solutions at GlobalFoundries. We discussed topics such as 28nm and future nodes such as 20nm and 14nm, the future of Silicon-on-Insulator (SOI), as well as relationship with over 150 GlobalFoundries customers.

                                                                                                                GLOBALFOUNDRIES Extending Fab 8 to Meet Strong Customer Demand [GLOBALFOUNDRIES press release, July 24, 2012]

                                                                                                                Cleanroom extension to add hundreds of new jobs and 90,000 square feet of manufacturing capacity
                                                                                                                GLOBALFOUNDRIES today announced it is moving forward with the final construction for the extension of Module 1 at the Fab 8 campus in New York. The project will add 90,000 square feet of manufacturing capacity, bringing the total capacity for Fab 8 Module 1 to 300,000 square feet. Construction activities are scheduled to begin in August and work is expected to be completed in December 2013.
                                                                                                                “During the construction of Fab 8, we extended the shell of the Module 1 building with the expectation that our business would continue to grow. Today we see increasingly strong demand from our customers, especially at the 28nm node, and we are excited to be moving forward with this next phase in the development of the Fab 8 campus,” said Eric Choh, vice president and general manager, Fab 8, GLOBALFOUNDRIES. “By continuing to expand our investment in the project, GLOBALFOUNDRIES is delivering more options to our global customers, while helping to redefine upstate New York as a premier hub of the global semiconductor industry, creating thousands of new advanced manufacturing jobs, and contributing billions of dollars to the regional economy.”
                                                                                                                Consisting of approximately two million square feet, Fab 8 is being developed as the world’s most advanced semiconductor foundry manufacturing facility and is consistently hitting all major development milestones. GLOBALFOUNDRIES began construction on Fab 8 in July 2009 and began moving people and equipment into the facility in mid-2011. Initial wafer starts began earlier this year and the facility is on track to begin risk production by the end of the year, with volume production in early 2013.
                                                                                                                Extending the Fab 8 cleanroom is expected to increase the Fab 8 capacity to approximately 60,000 wafers per month and increase the capital budget by approximately $2.3 billion, taking the total capital budget from $4.6 billion to approximately $6.9 billion, once tools and equipment are installed.
                                                                                                                Since breaking ground on Fab 8 in 2009, GLOBALFOUNDRIES has created more than 1,500 new direct jobs, developing a unique and diverse workforce drawn from local talent in the region as well as experienced professionals from across the United States and more than 30 countries.
                                                                                                                In addition, the project has created an additional 4,300 construction-related jobs and established the largest private Project Labor Agreement in history, generating hundreds of millions of dollars of economic development throughout upstate New York during the worst economic downturn since the Great Depression.
                                                                                                                GLOBALFOUNDRIES has a total of about 1,800 employees across New York, including research teams at the IBM facilities in East Fishkill and at CNSE at the University of Albany, and more than 12,000 employees worldwide with additional manufacturing campuses in Germany and Singapore.

                                                                                                                Execution, Innovation, Location: 3 Reasons to Choose GLOBALFOUNDRIES at 28nm [thefoundryfiles.com blog by Michael Noonen, Executive Vice President, Worldwide Marketing and Sales, for GLOBALFOUNDRIES, July 5, 2012]

                                                                                                                Refers to: – Rory Read, 2nd gen AMD A-Series APU using HKMG – Rambus: Joe Louis-Chandran @[6:06] Fab 8 in Saratoga County, New York is: fully operational ramping ahead of schedule shipping products for revenue in early 2013

                                                                                                                We recently attended the Design Automation Conference in San Francisco, where we showcased our wide array of foundry offerings and met with customers, partners, and industry influencers. All of them asked how GLOBALFOUNDRIES can address the increased demand for 28nm.  We answered that we have three major reasons why our customers can depend upon GLOBALFOUNDRIES for their 28nm needs: execution, innovation and location.

                                                                                                                Execution

                                                                                                                GLOBALFOUNDRIES has a tradition of rapidly ramping leading-edge technologies to volume production.  We delivered the fastest time-to-volume for the 45/40nm production ramp, and we are leading the foundry ramp at 32/28nm in volumes well ahead of others foundries. In fact, earlier this year we reached a major milestone by shipping our 250,000th HKMG wafer, and we have shipped many thousands more since. Overall, we have shipped more HKMG wafers than all the other foundries combined.

                                                                                                                Not convinced? Just ask our customers. For example, AMD CEO Rory Read said, “In just one quarter, we were able to see more than a doubling of yields on 32nm, allowing us to exit 2011 having exceeded our 32nm product shipment requirements. Based on this successful ramp of 32nm HKMG, we are committed to moving ahead on 28nm with GLOBALFOUNDRIES.”

                                                                                                                Innovation

                                                                                                                Everyone knows our industry faces huge challenges as we move to more advanced technology nodes. At 28nm, we worked tirelessly to maintain true scaling and deliver an industry-leading technology in a System-on-Chip (SoC) design platform based on our production-proven HKMG technology. Here are a few highlights of our 28nm technology in comparison to the previous generation:

                                                                                                                • ~100 percent density increase.
                                                                                                                • Up to 50 percent increased speed and 50 percent reduction in energy/switch.
                                                                                                                • Sustains 40nm layout style advantages: Bi-directional Poly, Poly Jogs, Large Caps.
                                                                                                                • ~20% smaller die relative to 28nm “Gate Last.”

                                                                                                                Here again, our customers are seeing the benefits. Thucydides Xanthopoulos, distinguished engineer at Cavium, says with GLOBALFOUNDRIES, his company received outstanding levels of in-depth technical support: “This was essential in addressing the new technical challenges of the 28nm process technology to meet our stringent power requirements and demanding frequency goals. This ensured our product design timeliness and success.”

                                                                                                                Location

                                                                                                                Not only is GLOBALFOUNDRIES now the second largest semiconductor foundry in the world, but with manufacturing plants located in Europe, Asia and North America, we are the only truly global foundry.

                                                                                                                Designed for 32/28nm and beyond, our newest location, Fab 8 in New York, is one of the most advanced semiconductor facilities in the world. Fab 8 is the largest public-private sector industrial investment in state history and a cornerstone of New York’s burgeoning “Tech Valley.” Forbes magazine recently said the Capital Region could become the “Silicon Valley of Nanotech and even surpass it in economic importance.”

                                                                                                                To paint a clearer picture of how advanced the nearly 2 million square foot campus is, here are a few more facts:

                                                                                                                • The clean room is larger than 6 football fields and has 7 miles of track for overhead transport vehicles.
                                                                                                                • Fab 8 took over six million man hours to complete – that’s more man hours than it took to construct the Empire State Building in New York City.
                                                                                                                • Fab 8 has over 60,000 cubic yards of concrete, enough to build a 105 mile-long sidewalk.
                                                                                                                • 75 miles of pipe total square footage exceeds the Chrysler building in NYC.

                                                                                                                Fab 8 is fully operational, ramping ahead of schedule, and shipping products for revenue in early 2013. Once fully ramped, the first fab module will be capable of 60,000 wafer starts per month.

                                                                                                                These are just a few of the reasons why customers should work with GLOBALFOUNDRIES on 28nm—and they are. We taped out our first 28nm product in Q4 2011 and we have dozens in the pipeline. To learn more about our complete value proposition at 28nm, check out this video we created for DAC.

                                                                                                                More information: Globalfoundries Vows to Ramp Up 28nm Production Quickly. [X-bit labs, July 5, 2012]

                                                                                                                ChipEstimate.TV interview with Mike Noonen, GLOBALFOUNDRIES at Common Platform Tech Forum [chipestimate YouTube channel, March 21, 2012]

                                                                                                                Sean O’Kane, producer/host ChipEstimate.TV interviews Mike Noonen, Sr. VP of Worldwide Sales and Marketing, GLOBALFOUNDRIES at Common Platform Tech Forum 2012 For more information about GLOBALFOUNDRIES go to:http://www.globalfoundries.com/.

                                                                                                                GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer [GLOBALFOUNDRIES press release, March 21, 2012]

                                                                                                                … based on 32nm High-k Metal Gate (HKMG) technology

                                                                                                                On a unit basis, cumulative 32nm shipments for the first five quarters of wafer production are more than double that achieved during the same period of the 45nm technology ramp, demonstrating that the overall 32nm ramp has significantly outpaced the 45nm ramp, despite the integration of a number of new and complex elements in both design and process technologies.

                                                                                                                “AMD and GLOBALFOUNDRIES worked in close partnership during 2011, and today’s announcement is a testament to the progress we have made together,” said AMD president and CEO Rory Read. “In just one quarter, we were able to see more than a doubling of yields on 32nm, allowing us to exit 2011 having exceeded our 32nm product shipment requirements. Based on this successful ramp of 32nm HKMG, we are committed to moving ahead on 28nm with GLOBALFOUNDRIES.”

                                                                                                                At Fab 1 in Dresden, GLOBALFOUNDRIES recently completed construction of an additional wafer manufacturing facility designed to add capacity at 45nm and below, which has the potential to increase the overall output of the Fab 1 campus to 80,000 wafers per month once fully ramped. The expansion project is adding more than 110,000 square feet of cleanroom space to the site, making Fab 1 the largest wafer fab in Europe for leading-edge technology. More than 50 percent of Fab 1’s production is now on HKMG technology. In addition to the 32nm technology, the company’s 28nm HKMG offerings are qualified and ready for design-in today.

                                                                                                                28nm Ramp Starts At Globalfoundries. [Manerisms blog on ElectronicsWeekly.com, April 17, 2012]: “We’re starting the volume production ramp on 28nm. With our experience at 32nm we expect less issues on the 28nm,” Rutger Wijburg, vice president and general manager GLOBALFOUNDRIES Fab 1, told EW.

                                                                                                                Globalfoundries opens up 28nm, 20nm FD-SOI process to all-comers[ElectronicsWeekly.com, June 20, 2012]:

                                                                                                                Globalfoundries is to manufacture FD-SOI chips for STMicroelectronics and ST-Ericsson at both 28nm and 20nm process generations which will be made avaialble to anyone wanting to use them. ST has a limited availability of FD-SOI from its line at Crolles. “This arrangement ensures our customers will have a secure source of supply, says ST vp Joel Hartmann. 28nm FD-SOI, is currently in the ‘industrialisation phase’, says ST and is scheduled to be available for prototyping by July 2012.

                                                                                                                The Rambus experience with GLOBALFOUNDRIES 28nm Super Low Power (28nm-SLP) technology see in the collaborative whitepaper: Designing into a Foundry Low Power High-k Metal Gate 28nm CMOS Solution for High-Performance Analog Mixed Signal and Mobile Applications [June 26, 2012]

                                                                                                                Background video on GLOBALFOUNDRIES’ leadership in 28nm capacity:

                                                                                                                Thomas Wong, Director Design Enablement, GLOBALFOUNDRIES. IP Talks speaker with ChipEstimate.com at DAC 2012 in San Francisco. Leadership in 28nm capacity.

                                                                                                                Background video on Sand to Silicon [globalfoundries YouTube channel, May 9, 2012]

                                                                                                                Have you ever wondered what goes in to making a semiconductor? Watch ths video.

                                                                                                                Collaborative partner Samsung Electronics also joining the “rescue” effort:

                                                                                                                Common Platform Technology Forum 2012, Ana Hunter, VP Foundry Services, Samsung interview on ChipEstimate.TV [chipestimate YouTube channel, Feb 13, 2012]

                                                                                                                GLOBALFOUNDRIES and Samsung Extend Fab Sync to New High-Performance 28nm Technology for Mobile Applications [GLOBALFOUNDRIES  press release, Aug 31, 2011]

                                                                                                                GLOBALFOUNDRIES and Samsung Electronics, Co., Ltd. broadened their collaboration, announcing plans to synchronize global semiconductor fabrication facilities to produce chips based on a new high-performance and low-leakage 28nm High-K Metal Gate (HKMG) technology. The technology has been specifically developed for mobile device applications, offering 60 percent of active power reduction at the same frequency or 55 percent of performance boost at the same leakage over 45nm low power (LP) SoC designs.

                                                                                                                In 2010, GLOBALFOUNDRIES and Samsung announced a fab synchronization on low-power 28nm HKMG technology in collaboration with IBM and STMicroelectronics. This low-power technology is qualified and fully design enabled with standard cell libraries, memory compilers, and additional complex IP blocks. The high-performance offering announced today complements the low-power technology, extending the frequency of operation for high-performance smartphones, tablets, and notebook computers, while retaining ultra-low leakage transistors and memories to enable the long battery life needed for mobile environments.

                                                                                                                The companies are proving the collaborative value of a synchronized platform by working with several customers to optimize processes and tooling for both the low-power and high-performance 28nm HKMG technologies. The synchronization process helps ensure consistent production worldwide, enabling customer chip designs to be produced at multiple sources with no redesign required, leveraging the customers’ design investments.

                                                                                                                By virtue of the synchronization, the collaboration presents a “virtual fab” that derives manufacturing capacity from four geographically diverse fabs. Each company has two 300mm fabs that will qualify the technology: GLOBALFOUNDRIES Fab 1 in Dresden, Germany and Fab 8 in Saratoga County, New York; and Samsung S1 in Giheung, Korea and the company’s recently expanded fab, S2 in Austin, Texas. The four fabs represent a global footprint estimated to be the largest in the foundry industry for leading-edge capacity, offering customer choice enabled by close collaboration and an unparalleled de-risking of supply chain uncertainties.

                                                                                                                The new high performance process is based on the 28nm “Gate First” HKMG technology utilized for the low power process announced in 2010. As with the low power 28nm technology that is fully design-enabled today, a comprehensive System-on-a-Chip (SoC) design platform will be implemented for the high performance offering to enable seamless customer design-in to the multiple global manufacturing sites.

                                                                                                                Ana Hunter – Vice President of Foundry for Samsung Semiconductor Inc. [globalfoundries YouTube channel, May 29, 2012]

                                                                                                                Qualcomm, Samsung to team up for chip [The Korea Times, July 5, 2012]

                                                                                                                As part of efforts to solve a supply shortage Qualcomm will soon sign a deal with Samsung Electronics to produce chips used in the Korean firm’s smartphones, according to industry sources.

                                                                                                                Industry and Samsung officials said Thursday that Samsung Electronics has “tentatively agreed” with Qualcomm to produce the latter’s Snapdragon S4 chipsets using Samsung’s 28-nanometer technology from the first half of 2013.

                                                                                                                “The two companies have agreed in principle on chip production and are now trying to iron out details, including production volume,” an industry source said.

                                                                                                                Samsung expects that the latest partnership will help the company strengthen its capabilities for non-memory chip management. The Korean technology giant plans to invest more in non-memory chips this year than in conventional memory chips for the first time since it started its chip-making business.

                                                                                                                Qualcomm CEO Paul Jacobs has said his firm is seeing “very strong demand” for the S4 chipsets amid the rising popularity of data-intensive and speedier phones that also use advanced long-term evolution (LTE) networks.

                                                                                                                Qualcomm’s MSM8960 chipsets are currently being used in the latest smartphones by Samsung, LG Electronics, Motorola and Taiwan’s HTC.
                                                                                                                ”Because Samsung is a long-time partner with Qualcomm for modem chips, it’s no surprise that the partnership has expanded to real chipsets,” said another industry source.

                                                                                                                With the Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung producing the Qualcomm chipsets, analysts expect the supply will improve from early next year.

                                                                                                                Qualcomm has also designated United Microelectronics Corp. (UMC) as another supplier with the capacity to help cope with tight supply of the leading-edge process at TSMC.

                                                                                                                ”The contract with Samsung, as well as UMC, means that Qualcomm plans to lower its heavy dependence on TSMC. It also means that Samsung’s foundry chip-making has reached a competitive level to guarantee the capacity that Qualcomm wants,” said an analyst at Semiconductor Equipment and Materials International (SEMI).

                                                                                                                Samsung, which controls near 50 percent of the global memory chip market, is busy transferring its conventional chip lines to profitable non-memory lines such as foundry facilities.

                                                                                                                Samsung’s global share for the foundry chip-making business was less than 2 percent as of the end of last year. However, market experts say Samsung is one of the few players that can threaten TSMC’s leadership as Samsung has abundant cash and top-class memory chip-making technology.

                                                                                                                “It’s probable for Samsung to win more deals from Texas Instruments and Nvidia – which are key partners of TSMC. In the near future, Samsung will become a top-tier foundry chipmaker that could compete with TSMC,” said the SEMI analyst.

                                                                                                                See also: Proven Track Record at 32/28nm [Samsung Foundry presentation, July 3, 2012]

                                                                                                                A New Foundry Business Model [by Ana Hunter Voices@SamsungSemiconductor, June 26, 2012]

                                                                                                                As we hit the half way mark of 2012, it’s been an eventful year so far.  Conversations swirl around:
                                                                                                                • The need for more 28nm capacity
                                                                                                                • Is 450mm wafer manufacturing really going to happen?
                                                                                                                • When will FinFET transistors become standard?
                                                                                                                • Will the foundry/fabless industry continue to thrive?
                                                                                                                There’s no doubt we’re at a crossroads at the most advanced process technology nodes. In order to take positive steps forward, significant monetary and collaborative investments and resources are required from both the manufacturing and design sides of the equation.
                                                                                                                The foundry/fabless semiconductor industry is not going to collapse or disappear as some have recently predicted. See the recent report from SEMI.org on equipment spending. But, a new approach to doing business is in order to stay competitive with pure IDMs [Integrated Device Manufacturer, like once Gobalfoundries was under AMD]. The foundry industry has taken huge strides on the ecosystem side to ensure that physical IP, libraries and design flows are all in place as a new process node comes online. That tight working relationship needs to be pushed beyond the partner ecosystem to include the customer’s design teams.
                                                                                                                There is a lot to be said for mimicking a more IDM-like relationship between a foundry and its fabless customers. For faster product rollout and ramp to high-volume manufacturing at the most advanced process nodes, integrated relationships between the foundry and its strategic customers where quasi-IDM operating procedures are established is key to the health and growth of the foundry industry. Fabless companies and foundries need to collaborate on the factors that allow products to be manufacturable, crossing traditional customer and vendor barriers. This is already happening as leading fabless companies learn from experience that closer integration with foundry design flows and kits, starting very early in the development cycle, enables faster feedback and improvement to both the product design and the manufacturing process.
                                                                                                                The industry is at an inflection point and the model is changing. A more simulated IDM environment will allow fabless semiconductor companies to be more competitive at the advanced process nodes. As an IDM foundry, Samsung is keenly aware of the advantages that can be gained by this approach. We strive to deliver these benefits to our foundry customers.

                                                                                                                UMC is coming to the “rescue” as well:

                                                                                                                Chip industry undergoing structural shift, says UMC CEO [DIGITIMES, July 27, 2012]

                                                                                                                The semiconductor industry is in the process of structural change, and United Microelectronics (UMC) has a big growth opportunity in the advanced chip segment, according to Shih-Wei Sun, CEO for the IC foundry.

                                                                                                                Sun said that he has observed some form of evolution in the IC sector which will likely lead to gradual changes in market leadership. UMC’s high-end foundry business has entered its next stage of growth, which will help strengthen its foundation for future growth, Sun claimed.

                                                                                                                Sales generated from advanced process technologies are set to climb substantially and drive sales growth for the company in the second half of 2012, Sun noted. Growth momentum will continue into next year, when the fifth and sixth phase (P5 and P6) factories of its 12-inch plant in southern Taiwan are ready to come online, according to Sun.

                                                                                                                UMC’s planned capex budget for 2012 of US$2 billion remains unchanged, said Sun, adding that the expenditure will be mainly used to expand 28nm manufacturing capacity and develop 20nm and more advanced technologies.

                                                                                                                Sun indicated that 28nm process technology will account for about 5% of UMC’s revenues by the end of 2012. Moving forward, the foundry expects to start making small volume chips using 20nm process sometime in the second half of 2013, Sun said.

                                                                                                                UMC also set a goal of moving 20nm FinFET process to volume production in the second half of 2014, according to Sun. The company has signed a licensing agreement with IBM to expedite the development of its 20nm CMOS process with FinFET 3D transistors.

                                                                                                                UMC has long been ranked the world’s second-largest pure-play foundry, trailing only Taiwan Semiconductor Manufacturing Company (TSMC). However, it now faces tougher competition from Globalfoundries, and has been aggressively ramping up its foundry business. Globalfoundries recently claimed that the firm narrowed its gap with UMC in the foundry rankings in 2011, and moved up to second in the first quarter of 2012.

                                                                                                                In other news, UMC has reported better-than-expected results for the second quarter of 2012. The firm estimated third-quarter sales will grow only slightly on quarter, but did not provide its guidance for the fourth quarter of 2012 citing uncertainty in end-market demand.

                                                                                                                UMC 2Q12 results beat guidance [DIGITIMES, July 25, 2012]

                                                                                                                … UMC CEO Shih-Wei Sun, said in a statement. “For the upcoming quarter, we expect mild revenue growth, with 40nm percentage contribution increasing significantly as volume production begins for several new products.”…. UMC saw 40nm and more advanced processes account for 9% of revenues in the second quarter, compared to 9% in the first quarter and 6% in second-quarter 2011. …

                                                                                                                UMC reportedly seeking investment from Qualcomm [DIGITIMES, July 13, 2012]

                                                                                                                UMC has approached Qualcomm to participate its upcoming private placement with an aim to establish a strategic partnership with the chip vendor, according to industry sources.

                                                                                                                In response, UMC said it has no specific target investors for the fundraiser.

                                                                                                                UMC’s board of directors in April approved plans to issue up to 1.292 billion new shares in a private placement, which is aimed at bringing in new strategic partners as well as strengthening its capital structure. The resolution later received the nod from the company’s shareholders.

                                                                                                                UMC reportedly to start building 28nm chips for Qualcomm in 4Q12, says report [DIGITIMES, July 2, 2012]

                                                                                                                United Microelectronics (UMC) reportedly has secured orders for 28nm Snapdragon S4 chips from Qualcomm with volume production slated for the fourth quarter of 2012, according to a Chinese-language Commercial Timesreport.

                                                                                                                UMC’s monthly output for Qualcomm’s 28nm chips is initially estimated at 3,000-5,000 wafers, equivalent to 20-30% of Qualcomm’s total orders placed with Taiwan Semiconductor Manufacturing Company (TSMC)for the fourth quarter, the report indicated.

                                                                                                                The report comes on the heels of a Bloomberg report citing Qualcomm CEO Paul Jacobs as saying that the firm would not rule out owning a manufacturing plat or consider “writing big checks” to its contract partners to ensure sufficient supply.

                                                                                                                Previous reports cited industry sources saying that the tight supply of chips built using TSMC’s 28nm process technology would likely drive Qualcomm and TSMC’s other major client Nvidia toward other foundries as a second source.

                                                                                                                TSMC has reiterated that supply of 28nm chips will come close to meeting demand in the fourth quarter of 2012, and satisfy demand completely by the first quarter of 2013.

                                                                                                                UMC Aligns With IBM on 20nm Process with FinFET 3D Transistors [UMC press release, June 29, 2012]

                                                                                                                Engagement will expedite the development of UMC’s next generation technologies

                                                                                                                Hsinchu, Taiwan, June 29, 2012 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that it has licensed IBM technology to expedite the development of the foundry’s next generation 20nm CMOS process with FinFET 3D transistors. Under the terms of the agreement, IBM will license its 20nm process design kit and FinFET technology to UMC so the foundry can use these technologies in order to accelerate the availability of these processes for UMC customers.

                                                                                                                Dr. IC Chen, vice president of Advanced Technology Development at UMC, said, “We are happy to engage with a recognized technology leader such as IBM for this technology advancement effort. UMC’s position as a world-leading foundry involves timely introduction of leading-edge processes to enable next generation customer chip designs. Leveraging IBM’s technology expertise to shorten our 20nm and FinFET R&D cycle will create a win-win situation for UMC and our customers.”

                                                                                                                This agreement between UMC and IBM is only inclusive of IBM’s 20nm CMOS and FinFET. UMC’s internally developed 20nm planar process will be aligned to IBM’s design rules and process/device targets, while UMC’s FinFET will be offered as a low-power technology enhancement option for mobile computing and communication products. Implementation will take place at the company’s Tainan, Taiwan R&D site.

                                                                                                                About UMC
                                                                                                                UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC’s customer-driven foundry solutions allow chip designers to leverage the strength of the company’s leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 14,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.

                                                                                                                Comment on that by X-bit labs [July 3, 2012]

                                                                                                                It is necessary to note that UMC does not currently enter the so-called “IBM fab club”, or Common Platform alliance between IBM, Globalfoundries and Samsung Semiconductor that develops common process technologies for all three companies’ semiconductor manufacturing facilities. As a result, UMC will not be able to align its manufacturing processes with CP members.

                                                                                                                Nonetheless, licensing technologies from IBM demonstrates inability of UMC to design competitive process technologies fully on its own. Potentially, it means that going forward UMC may either join the Common Platform alliance or to continue licensing fabrication processes from others.

                                                                                                                Comment on that by EE Times [June 29, 2012]

                                                                                                                Though he declined to disclose the specific cost of the license deal, the spokesman described the terms as “reasonable and insignificant to our financial statements after expense amortization.” The deal will enable UMC to save the considerable costs that would have been involved in developing 20-nm and FinFETs on its own, the spokesman.

                                                                                                                FinFETs are three-dimensional, fin-based multi-gate transistors. Intel Corp. is currently in production of 22-nm devices featuring FinFETs—known by Intel as tri-gate transistors. Taiwan Semiconductor Manufacturing Co. Ltd., UMC’s biggest rival in the foundry business, is not planning to implement FinFETs until the 14-nm node. Globalfoundries and Samsung are also planning to implement FinFETs at the 14-nm node.

                                                                                                                While Qualcomm’s long supplier TSMC is declaring:

                                                                                                                TSMC reiterates supply of 28nm chips to come close to demand in 4Q12 [DIGITIMES, June 13, 2012]

                                                                                                                Taiwan Semiconductor Manufacturing Company (TSMC) has reiterated its previous remarks that supply of 28nm chips would come close to meeting demand in the fourth quarter of 2012, in response to speculation that companies lining up for the foundry’s 28nm process capacity had dispersed.

                                                                                                                At its most-recent investors meeting, TSMC also suggested that demand for the foundry’s 28nm manufacturing capacity would be completely satisfied by the first quarter of 2013.

                                                                                                                TSMC chairman and CEO Morris Chang remarked at the company’s annual shareholders meeting yesterday (June 12) that the foundry’s 28nm foundry capacity will remain tight through the third quarter of 2012. Company efforts in production expansion will help supply catch up and come near the total market demand in the last quarter of the year, according to Chang.

                                                                                                                Chang admitted that TSMC had failed to make a precise estimate of demand for 28nm chips this yearand therefore, the foundry could not immediately provide the needed additional capacity.

                                                                                                                In order to accelerate its pace of 28nm capacity expansion, TSMC has revised upward its 2012 capex to US$8-8.5 billion. The foundry also unveiled plans to ramp up 20nm production ahead of schedule.

                                                                                                                TSMC Reports Second Quarter EPS of NT$1.61 [TSMC press release, July 19, 2012]

                                                                                                                28-nanometer process technology accounted for 7% of total wafer revenues, meeting our internal plan. 40-nanometer accounted for 28% of total wafer revenues, and 65-nanometer was 26%. These advanced technologies accounted for 61% of totalwafer revenues.

                                                                                                                “Due to continuing strong demand for our 28-nanometer technology, we expect to double the shipments of 28-nanometer in the third quarter. This increase in 28nm business will account for more than 80% of revenue growth in the third quarter,” said Lora Ho, SVP and Chief Financial Officer of TSMC.

                                                                                                                TSMC Reports First Quarter EPS of NT$1.29 [TSMC press release, April 26, 2012]

                                                                                                                28-nanometer process technology accounted for 5% of total wafer revenues, 40-nanometer was 32%, and 65-nanometer accounted for 26%. These advanced technologies accounted for 63% of total wafer revenues. …

                                                                                                                TSMC Reports Fourth Quarter EPS of NT$1.22 [TSMC press release, Jan 18, 2012]

                                                                                                                28-nanometer process technology accounted for 2% of total wafer revenues, 40-nanometer was 27%, and 65-nanometer accounted for 30%. These advanced technologies accounted for 59% of total wafer revenues. …

                                                                                                                TSMC Reports Third Quarter EPS of NT$1.17 [TSMC press release, Oct 27, 2011]

                                                                                                                40-nanometer and 28-nanometer process technologies accounted for 27% of total wafer revenues, and 65-nanometer accounted for 27%. These advanced technologies accounted for 54% of total revenues. …

                                                                                                                Taiwan Semiconductor Manufacturing Company Limited, 2012 Annual General Shareholders’ Meeting Minutes [June 12, 2012]

                                                                                                                … We became the first foundry to offer volume production of 28-nanometer, with the first-to-market 28-nanometer high-k/metal gate (HKMG) technology portfolio. …

                                                                                                                … Based on a record number of customer product tape-outs, TSMC entered volume production of superior 28-nanometer Gate-Last HKMG logic technology.  Revenue from the 28-nanometer node contributed 2% of fourth quarter 2011 wafer revenue, and is expected to contribute approximately 10% wafer revenue in 2012.  …

                                                                                                                TSMC plans to make as small as 7nm processors, 28nm is now in volume production [Charbax YouTube channel, Oct 25, 2011]

                                                                                                                TSMC is the worlds largest independent ARM Processor foundry. Here’s a video about how TSMC makes the processors of the present and the future, they do them for many of the major ARM chip designers such as Texas Instruments, Nvidia, Qualcomm and others.

                                                                                                                More background information: ChipEstimate.com DAC 2012 IP Talks presenter Dan Kochpatcharin [chipestimate YouTube channel, June 26, 2012]

                                                                                                                Dan Kochpatcharin, Deputy Director, IP Portfolio Marketing, TSMC. IP Talks presenter with ChipEstimate.com at DAC 2012 in San Francisco. TSMC OIP and IP Quality.

                                                                                                                There are 41 IP partners in TSMC IP alliance program and also have 20-25 IP partners directly supported but not part of the IP alliance program.

                                                                                                                image

                                                                                                                And here are the number of titles in TSMC IP portfolio also vs. other foundries:

                                                                                                                image

                                                                                                                After that the whole discussion is about the IP quality, which is also discussed in the following video: IP Quality — It’s Imperative! – Voices of DAC 2012 [synopsys YouTube channel, June 11, 2012]

                                                                                                                TSMC offers some of the most advanced processes in the industry. They are used to manufacture many of the most complex semiconductors ever produced. Semiconductor IP is a key ingredient to successful System-on-Chip design. Both the processes and the IP face big challenges. Dan Kochpatcharin talks with us about the latest TSMC process technology, the challenges in designing in the latest technology, and why IP quality is imperative. Links of Interest: http://www.tsmc.com/english/default.htm http://blogs.synopsys.com/conversationcentral/

                                                                                                                In this video TSMC 9000 IP library is mentioned as critical to the TSMC’s foundry operation. See additional information on extension of that as well, the so called Soft-IP alliance program: A Comprehensive Soft IP Qualification System (Atrenta) [TSMC page, Nov 3, 2011]

                                                                                                                Abstract:
                                                                                                                Knowing the quality, completeness and integration risks associated with soft, or synthesizable semiconductor IP is critical to meeting power, performance, area and schedule targets for complex system on chip (SoC) designs. In many cases, over 80% of the SoC design is composed of reused IP, much of it synthesizable.

                                                                                                                Atrenta has collaborated with TSMC to create a comprehensive system to automate the process of soft IP qualification. Based on the popular SpyGlass® platform, the system programmatically analyzes soft IP using an IP handoff methodology consisting of TSMC’s Golden Rule Set covering various design aspects (risk analysis, integration readiness, implementation readiness, reusability etc.) for an IP. These Golden Rules can help to detect various types of design issues such as simulation-synthesis mismatches, unsynchronized clock domain crossing paths, electrical/connectivity related issues, testability bottlenecks and timing constraints not fully aligned with the design topology/configuration. This approach also provides in-depth analysis reports on various design parameters such as power consumption and optimization, stuck-at and at-speed fault coverage, clock-reset propagation and timing constraints coverage. The results of all tests are summarized in a concise, portable, easy to read HTML-based Atrenta DashBoard report. Once all errors are addressed, the IP is further profiled through an Atrenta DataSheet report that summarizes many aspects of the IP, including estimated power consumption, IO profile, clock and reset trees, gate count, testability and timing constraints. These reports are then posted on TSMC’s online IP databases for customer review as part of the TSMC 9000 IP library.

                                                                                                                In this presentation, we will describe the process used to develop the qualification flow. We will provide details regarding what aspects of the IP are checked and how the information is used to assess IP completeness, readiness and integration risks. We’ll review the process to install, setup and run the software and share some results of its application on production soft IP.

                                                                                                                Also: Atrenta and TSMC IP Quality Initiative Gains Broad Industry Acceptance [Atrenta press release, March 5, 2012]

                                                                                                                Atrenta Inc., a leading provider of SoC Realization solutions for the semiconductor and electronic systems industries, today announced that 10 intellectual property (IP) providers have qualified their soft IP for inclusion in the TSMC 9000 IP library using the Atrenta IP Handoff Kit.

                                                                                                                Those companies, part of TSMC’s Soft-IP Alliance Program, include Arteris, Inc.; CEVA; Chips&Media, Inc.; Digital Media Professionals Inc. (DMP); Imagination Technologies; Intrinsic-ID; MIPS Technologies, Inc.; Sonics, Inc.; Tensilica, Inc.; and Vivante Corporation. The participating companies are able to provide quantitative information to TSMC’s customers regarding the robustness and completeness of their soft or synthesizable semiconductor IP that is part of the TSMC 9000 IP library.

                                                                                                                In May 2011, TSMC and Atrenta announced the Soft-IP Alliance Program, which uses Atrenta’s SpyGlass® platform and a targeted subset of its GuideWare reference methodology to implement TSMC’s IP quality assessment program. TSMC requires all soft IP providers to reach a minimum level of completeness, as documented by Atrenta DashBoard and DataSheet reports, before their IP is listed on TSMC online.

                                                                                                                Atrenta integrated all the software and methodologies needed to implement TSMC’s IP qualification requirements to form the IP Handoff Kit, which uses the SpyGlass register transfer level (RTL) analysis and optimization product suite. To qualify for inclusion in TSMC Online, soft IP must be verified for language syntax and semantic correctness, simulation-synthesis mismatches, electrical and connectivity rules, power consumption, synchronization of clock domain crossing paths, stuck-at and at-speed test coverage and timing constraints. All results are summarized in Atrenta DashBoard and DataSheet reports that capture the results of these SpyGlass tests in an easy-to-read and track HTML format.

                                                                                                                “Given the complexity inherent in today’s system on chip (SoC) designs, TSMC is proactively helping our customers mitigate risk and meet their time-to-market goals,” said Suk Lee, director, Design Infrastructure Marketing Division, TSMC. “The IP qualification flow with Atrenta addresses many of the quality challenges inherent in re-using third-party IP. We are pleased with the number of IP providers that are participating in this program and the measurable improvement in delivered IP quality available for TSMC’s end customers.”

                                                                                                                “As designers face the challenge of finding quality third-party IP, this program – a collaboration between TSMC, Atrenta and IP providers – is a powerful example of what teamwork in the supply chain can accomplish,” said Mike Gianfagna, vice president of marketing at Atrenta. “TSMC customers can now make more informed decisions that improve the handoff of IP between members of the semiconductor supply chain. This is one way to drive more effective SoC Realization.”

                                                                                                                About Atrenta
                                                                                                                Atrenta is a leading provider of SoC Realization solutions for the semiconductor and electronic systems industries. As one of the largest private electronic design automation companies, Atrenta provides a comprehensive SoC Realization solution that delivers higher quality semiconductor IP, predictable design coherence, automated chip assembly and improved implementation readiness. Its SpyGlass® and GenSys™ products and GuideWare reference methodologies open the way for broader deployment of system on chip (SoC) devices in the marketplace, improving time to market, reducing implementation costs and lowering risk. With nearly 200 customers, including 19 of the top 20 semiconductor and consumer electronics companies, Atrenta enables the most complex SoC designs in the world. Atrenta, the SoC Realization Company. http://www.atrenta.com.
                                                                                                                Atrenta and TSMC IP Quality Initiative Gains Broad Industry Acceptance
                                                                                                                Partner Quotes

                                                                                                                 

                                                                                                                Arteris
                                                                                                                “Based on our long-standing relationship with TSMC, Arteris is pleased to participate in TSMC’s Soft-IP Alliance Program and TSMC Reference Flows 11 and 12. By validating Arteris’ configurable NoC interconnect IP with the SpyGlass platform, customers can choose our IP and handoff their design to TSMC with even greater confidence.”
                                                                                                                K. Charles Janac, President and CEO, Arteris
                                                                                                                CEVA
                                                                                                                “CEVA is committed to streamlining the SoC design process and supply chain through a robust ecosystem that improves the efficiency of how customers use our DSP-based solutions. The link to the manufacturing process is critical as we move into the realm of 28 nanometer and beyond. We are pleased to be able to work with Atrenta and TSMC to certify our IP using TSMC’s soft IP validation kit. This will result in faster and more reliable manufacturability for our customers.”
                                                                                                                Moshe Sheier, Director of Product Marketing, CEVA, Inc.
                                                                                                                Chips & Media

                                                                                                                 

                                                                                                                “As consumers demand a better experience from their multimedia devices, SoC designs are becoming more complex. By working closely with TSMC and Atrenta, Chips&Media is capable of delivering its leading-edge video processing technologies to customers more efficiently and effectively.”
                                                                                                                Steve Kim, CEO, Chips&Media,Inc.
                                                                                                                Digital Media Professionals

                                                                                                                 

                                                                                                                “In support of our advanced graphics IP technology based on industry-standard OpenGL ES and DMP’s proprietary Maestro extension, we are able to leverage excellent semiconductor process technology from TSMC and comprehensive assessment metrics from Atrenta. With a wide-range of leading-edge technologies and eco-system support, DMP will provide highly optimized and validated graphics IPs for embedded markets.”
                                                                                                                Tatsuo Yamamoto, President & CEO, Digital Media Professionals Inc.
                                                                                                                Intrinsic-ID

                                                                                                                 

                                                                                                                “As SoC devices become more prevalent and customer needs become increasingly more complex, Intrinsic-ID offers a wide-ranging portfolio of IP available in the TSMC 9000 IP library. Working with TSMC and Atrenta, the quality of our IP is demonstrated and customers will be more informed when using it in their designs, reducing the risk in the handoff to other members of the supply chain.”
                                                                                                                Pim Tuyls, CEO, Intrinsic-ID
                                                                                                                MIPS

                                                                                                                 

                                                                                                                “The Atrenta IP Handoff Kit can help assure customers of quality and consistency across the variety of IP available for use at TSMC. As a member of the TSMC Soft IP Alliance Program, MIPS Technologies is committed to working closely with TSMC to speed our customers’ time-to-market. Starting with our superscalar multicore MIPS32® 1074K™ coherent processing system, MIPS is leveraging the IP Handoff Kit to validate that our IP meets and surpasses TSMC’s expectations of quality for soft IP.”
                                                                                                                Gideon Intrater, Vice President of Marketing, MIPS Technologies, Inc.
                                                                                                                Sonics

                                                                                                                 

                                                                                                                “As the number of unique IP cores increase with each process node, the need for a reliable, high-performance on-chip network is critical for successful SoC execution. As a partner in the Atrenta and TSMC IP Quality Initiative, and a TSMC Soft IP Alliance member, Sonics gives customers complete assurance and support from the initial design to TSMC hand-off. Our partnership with Atrenta continues to help semiconductor leaders realize their broad range of SoC designs, and the SpyGlass product suite will continue to play an integral part of Sonics’ RTL flow.”
                                                                                                                Frank Ferro, Director of Marketing, Sonics
                                                                                                                Tensilica

                                                                                                                 

                                                                                                                “Tensilica is pleased to participate in TSMC’s Soft-IP Alliance Program after many years of producing successful tapeouts for mutual customers. By validating our IP against quality metrics established by TSMC and measured using the SpyGlass platform, our customers can choose Xtensa processors and deliver their designs to TSMC with even greater confidence.”
                                                                                                                Chris Jones, Director, Product Marketing, Tensilica, Inc.
                                                                                                                Vivante

                                                                                                                 

                                                                                                                “Vivante is pleased to be part of TSMC’s Soft-IP Alliance Program, offering customers our full line of high performance, power efficient GPU/GPGPU cores. By going through extensive validation of our IP on the SpyGlass platform to ensure reliability and quality, customers can be confident that selecting Vivante products will reduce their risk and expedite time to market of their designs.”
                                                                                                                Wei-Jin Dai, President and CEO, Vivante Corporation

                                                                                                                And here is a video with Atrenta CTO Bernard Murphy about the current changes:
                                                                                                                DAC Retrospective [SperlingMediaGroup YouTube channel, June 13, 2012]

                                                                                                                Is DAC really a design automation conference, or has it shifted to a design enablement conference due to rising complexity breaking down traditional barriers and silos? Low Power High Performance Engineering talks with Atrenta CTO Bernard Murphy about the changes.

                                                                                                                Qualcomm and TSMC Collaborating on 28nm Process Technology [joint TSMC and Qualcomm press release, Jan 8, 2010]

                                                                                                                Cutting-edge Semiconductor Technology Enables Mobile Devices to Offer Greater Functionality and Lower Power Consumption

                                                                                                                Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today announced that the Company is working closely with foundry partner Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) on 28 nanometer (nm) process technology. The advanced process node enables more features to be integrated into smaller chips with a high level of cost efficiency, accelerating the expansion of wireless into new market segments.

                                                                                                                Small form factor and low power consumption are important features of Qualcomm’s next generation of system-on-a-chip (SoC) solutions, including the Snapdragon™ chipset platform. The two companies are capitalizing on their long-term relationshipas Qualcomm works on migrating directly from the 45nm to the 28nm node.

                                                                                                                “TSMC prides itself on its ability to deliver cutting-edge technology platforms, including the related design ecosystems. Our 28nm platform supports the high-performance, low-power products that deliver next-generation experiences,” said Jason Chen, vice president of Worldwide Sales and Marketing. “We are pleased to be working with Qualcomm, a market leader in wireless technology, on bringing these new experiences to reality.”

                                                                                                                “Qualcomm’s close collaboration with TSMC has always been a key part of our ability to deliver significant advantages to our customers through the industry-leading integration, power efficiency and cost efficiency of our products – enabling them to do more with less,” said Jim Clifford, senior vice president and general manager of Qualcomm CDMA Technologies. “Qualcomm’s integrated fabless manufacturing model and migration to smaller geometries will allow us to continue enabling the best mobile user experience possible on handsets, smartphones and smartbook devices.”

                                                                                                                Qualcomm and TSMC worked closely on 65nm and 45nm technologies. They are continuing their relationship into low-power, low-leakage 28nm designs for high-volume manufacturing. Delivering up to twice the density of previous manufacturing nodes, 28nm technology allows semiconductors that power mobile devices to do far more with less power. Qualcomm and TSMC are working on both high-k metal gate (HKMG) 28HP and silicon oxynitride (SiON) 28LP technologies. Qualcomm expects to tape out its first commercial 28nm products in mid-2010.

                                                                                                                Close collaboration with strategic technology and foundry partners is a key part of Qualcomm’s Integrated Fabless Manufacturing (IFM) business model, which delivers greater efficiencies and accelerated technology advancement to the industry.

                                                                                                                Background video on Semiconductor Technology at TSMC, 2011 [AndrewatEML YouTube channel, March 26, 2011]

                                                                                                                An up to date and current overview of semiconductor manufacturing technology from TSMC in Taiwan. Nicely produced and informative if you tune-out the voice-over slightly. Better access than any Fab tour. Recommended if you have any interest in how semiconductors are made/manufactured in volume right now.

                                                                                                                MWC 2012: Fuzhou Rockchip Electronics

                                                                                                                Follow-upCore post: China’s HW engineering lead: The Rockchip RK292 series (RK2928 and RK2926) example [Oct 27, 2012]

                                                                                                                Exclusive : ST Ericsson, Rockchip To Join Windows 8 For ARM Club In 2013 [Feb 29, 2012]

                                                                                                                Rockchip RK30xx ARM Cortex-A9 announced at Mobile World Congress 2012 [Charbax, Feb 29, 2012]

                                                                                                                Rockchip [a fabless SoC company with 400+ employees now] and ARM have announced the new [40nm LP] Rockchip RK30 series at Mobile World Congress. Expect full mass production to happen around May 2012, with samples being shipped around right now. Check back on my blog in the coming weeks and months for many affordable tablets, smartphones and Set-top-boxes featuring this new up to 1.4Ghz Dual-core 40nm Rockchip processor. The SoC price is just $15 for this dual-core ARM Cortex-A9 system!

                                                                                                                Rockchip Licenses a Wide Range of ARM IP for Turnkey Solution Targeting Mass Market, Cost-Effective Android Tablets [Rockchip press release, Feb 27, 2012]

                                                                                                                Rockchip, a leading Chinese fabless semiconductor company and mobile Internet System-on-Chip (SoC) solution provider, today announced its next generation RK30xx platform, targeting the mass market, cost-effective Android tablets. The new platform is based on wide range of ARM® Intellectual Property (IP) that Rockchip has licensed, including dual-core ARM Cortex™-A9 MPCore™ processors, ARM quad-core Mali™-400 MP Graphics Processing Units (GPUs) and an ARM Artisan® Physical IP Process Optimization Pack (POP) for the Cortex-A9 processor. The RK30xx platform is a turnkey solution that reduces design complexity and enables faster time-to-market for Android tablet manufacturers, enabling them to address fast changing consumer demands.

                                                                                                                The combination of Rockchip’s market-leading design experience for mobile Internet devices and high-performance, energy-efficient processor and GPU technologies from ARM has resulted in a platform that delivers captivating 3D gaming experiences and fluent HD video playback, as well featuring a rich set of memory interfaces and peripherals.

                                                                                                                “The tablet market is growing rapidly, and putting greater demands on semiconductor companies to deliver cost-effective solutions that can sustain an ever-increasing level of graphics, video and gaming performance, while still being energy-efficient,” said Mr. Feng Chen, Chief Marketing Officer, Rockchip. “The partnership enables us to use proven mobile Internet technologies from ARM and provide a high-performance, low-cost and easy-to-design platform. This turnkey solution is ideal for customers to quickly adopt for their Android-based tablet devices. The combination of the ARM Cortex-A9 processor and the POP has enabled the highest performance with the lowest power in the fastest time possible. Rockchip has been able to deliver a highly efficient processor implementation on a 40nm LP process.”

                                                                                                                “ARM is committed to providing advanced processor, GPU and physical IP technologies to our Partners. This enables them to innovate for complex, smart system applications, such as mobile Internet,” said Mike Inglis, executive vice president and general manager, processor division, ARM. “We are pleased that Rockchip, whose solutions are already being used in many mobile Internet products, has chosen a range of ARM IP for their innovative, next generation RK30xx platform. We look forward to their continued success in the Android tablet market.”

                                                                                                                The Rockchip RK30xx platform features:

                                                                                                                Dual-core ARM Cortex-A9 processor with up to 1.4GHz speed, implemented with Artisan Processor Optimization Pack (POP)
                                                                                                                • Quad-core ARM Mali-400 MP GPU, supporting OpenGL ES 1.1/2.0 and OpenVG 1.1
                                                                                                                • Full memory support, including DDRIII, DDRII, and LPDDRII
                                                                                                                • High performance dedicated 2D processor
                                                                                                                • 1080P multi-format video decoder
                                                                                                                • 1080P video encoding for H.264 and vp8
                                                                                                                • Stereoscopic 3D H.264 MVC video codec
                                                                                                                • Embedded HDMI 1.4a, supporting 3D display
                                                                                                                • Embedded 60bit/s ECC, supporting MLC NAND, E-MMC, i-NAND and booting
                                                                                                                • Support of dual panel display and dual camera

                                                                                                                Availability

                                                                                                                Samples of the Rockchip RK30xx platform will be available in March 2012.

                                                                                                                Rockchip Tablets – ARM at CES 2012 [ARMflix, Jan 12, 2012]

                                                                                                                Rockchip their new ARM Powered tablets at the Consumer Electronics Show 2012, including a tablet that streams live TV, Android-based tablets, 4G LTE tablets, dual-input tablets, E-Home 4G connected solutions, and multi-screen tablet-TV sharing.

                                                                                                                Review On The Major Tablet Chips In Shenzhen Market [M.I.C. Digi, March 27, 2011]

                                                                                                                Rockchip RK2818: Rockchip RK2818 is an ARM9-based core. It is made by the 65nm process [Chartered Semiconductor Manufacturing – now part of Global Foundries] and has a frequency of 624MHz, beginning to support DDR2 memory. So the performance of RK2818 is fair. The drawback is that the 3D display is realized by the CPU instead of an seperate graphics core, so it can only support the 720P video when doing its upmost. Tablets with RK2818 came into season around last October. The current price of RK2818 tablets with the lowest configuration has dropped to 500 yuan.

                                                                                                                Rockchip RK2918: RK2918 is the next-generation product of RK2818. Its clock can reach 1.2GHz. With the 55nm process [TSMC], Cortex-A8 core, and the separate graphics core [GC800 from Vivante with 60 million triangles/s], RK2918 is attractive. But there haven’t been RK2918 tablets large quantities on the market. …

                                                                                                                Photo: people who know better?  On the MID Tablet market trends clash

                                                                                                                Shenzhen Wabook shows $93 Rockchip RK2918 Laptop [Charbax, March 7, 2012]

                                                                                                                The Wabook EPC1029 [shown on Cebit 2012 in Germany], with a 10.1″ 1024×600, runs on the Rockchip RK2918 ARM Cortex-A8, 3 USB Host ports, it can run Android 4.0, the price for bulk (1000+) orders is $93. I want to see how smooth Chrome for Android runs on this Laptop. Check back soon, I will try to get them to show the performance of Chrome for Android on ICS on this RK2918 laptop as soon as possible.

                                                                                                                Fan of Android 4.0, Ice Cream Sandwich? See What Rockchip is Serving up in Las Vegas [Rockchip press release, Jan 6, 2012]

                                                                                                                Chinese Semiconductor Company will feature
                                                                                                                4G Tablets with Adobe® Flash® 11 at 2012 CES

                                                                                                                You recognize Android phones, tablets, TVs, and home phone systems, but do you recognize one of the worldwide leaders behind much of this technology?

                                                                                                                Chinese-based Fuzhou Rockchip Electronics Co., Ltd, Asia’s leading developer of fabless semiconductors with an emphasis on Mobile Internet Platforms, will release the RK2918 chip for Google’s Android 4.0 Operating System – known as the Ice Cream Sandwichat the 2012 Consumer Electronics Show (CES) in Las Vegas, January 10-13.

                                                                                                                Rockchip will feature phones and tablets utilizing their technology and Android 4.0 at their booth – including some that incorporate Adobe® Flash® 11, not currently standard with 4.0 technology.

                                                                                                                With 80 percent market share penetration in China– a figure that would make them a virtual behemoth here in North America – Rockchip’s product can be found in dozens of famous name brand products including Samsung, Philips, Sony, Toshiba and Archos. And with consumer demand for the Ice Cream Sandwich poised to explode across all products and platforms on six continents, Europe and the Americas are `logical targets for the Chinese company.

                                                                                                                “The global environment is right for our Android 4.0 product, and as a company, we are in precisely the right position to play a major role in satisfying a healthy portion of that demand,” said Chen Feng, Vice President of Rockchip. “We are looking at CES as an opportunity to introduce our latest technology to the trade, and the public, as we build towards more solidly establishing our name outside of the Chinese market.”

                                                                                                                The world’s leading provider of microchips for the entire MP3/MP4 market, exclusive of Apple®, Rockchip will showcase at CES the largest selection of tablets that utilize their technology. “We think we will have between 30 and 40 tablets at Vegas,” said Feng. “We’ve adding new products every day, so even now, as we prepare to leave for CES, we’re not sure what that final number will be!”

                                                                                                                Not yet familiar with Rockchip here in North America?

                                                                                                                That’s not altogether surprising; but as this rapidly growing company continues to make its mark on a burgeoning industry, you can rest assured of one thing …

                                                                                                                You will be soon!

                                                                                                                First ICS Tablet in Hand! Android 4.0 Tablet Powered by RK2918 Goes on Sale! [Rockchip press release, Jan 11, 2012]

                                                                                                                This week, the first Android 4.0 tablet in the world will go on sale, which is powered by Rockchip RK2918 chipsand manufactured by numbers of brand companies in China. For those who have got an Android 2.3 tablet in hand, the device can get a free to the newly released version at the same time. Let’s get a big bite on the Ice Cream Sandwich!

                                                                                                                This is really a big hit after we’ve seen videos showing ICS demos on tablets with RK2918 last week, on reports from several big tech websites.

                                                                                                                Tablets like Newsmy K97, Window N90, Cube U9GT2 and Telecast T76 are on the list of first , and the ICS pre-installed products are available on local brand stores and online shops. U.S. and European markets also get access to RK2918 tablets manufactured by overseas ODMs.

                                                                                                                “The OS will be continuously optimized for better compatibility and performance,” Rockchip announced, “to achieve the best experience on ICS”. And later we will see more brand companies updating their tablets with RK2918 solution.

                                                                                                                The specific date of ICS release will be announced according to different brands, please pay attention to our latest report.

                                                                                                                Newsmy K97

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                                                                                                                Window N90

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                                                                                                                Cube U9GT2

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                                                                                                                Fuzhou Rockchip grabs 70% market share of China’s tablet PC chips [What’s On Xiamen, Dec 6, 2010]

                                                                                                                … “Almost all the big venture capital companies in China have indicated an interest in investing in us,” said Chen Feng, chief marketing officer of Fuzhou Rockchip Electronics Co Ltd, a Chinese tablet PC chip producer. Its chips have a market share of about 70 percent in China.

                                                                                                                The company has produced 5 million chips for tablet PCs since April. “The market is heating up and next year investments in tablet PCs will become red hot,” said Chen. He said Rockchip will accept venture capital when they find the right partner. …

                                                                                                                ARM at CES2011 with Rockchip [ARMflix, Jan 6, 2011]

                                                                                                                ARM talks to Rockchip about their newest ARM-based chips at this year’s CES show.

                                                                                                                Rockchip Releases its NEW Mobile Internet Platform – RK29xx World’s 1st SOC for 1080P VP8+android 2.3+Internet TV+1080P+3D GPU [Rockchip press release, Jan 7, 2011]

                                                                                                                Fuzhou Rockchip Electronics Co., Ltd, a leading developer of fabless semiconductors, today released its new RK29xx generation Mobile Internet Platform.

                                                                                                                RK2918 is a high-performance, low-power processor designed for mobile internet applications. The CPU subsystem is an ARM® Cortex-A8 CPU and includes the NEON SIMD engine to improve software media processing capability. With the TSMC advanced process, the A8 core can enable up to 1.2GHz.

                                                                                                                RK2918 is the world’s first SOC to support decoding of the Full HD (1080P) VP8 video codec entirely in hardware. It also provides FULL HD decoder and encoder processor, hardware accelerated Adobe® Flash® Player 10.1, ultra powerful 3D/2D GPU, high speed internet surfing experience and more.

                                                                                                                RK2918 now supports Gingerbread (Android 2.3) for Mobile Internet Devices, Smartphone and Internet TV, etc. Highlights of the RK29XX include:

                                                                                                                • 1.2G ARM Cortex A8 core with Neon and 512KB L2 cache
                                                                                                                • High performance 2D and 3D processors support OPENGL ES 2.0 and OPEN VG, Support 60M tri/s max
                                                                                                                • 1080P video decoding for H.264, VP8, RV, WMV, AVS, H.263, MPEG4 etc.
                                                                                                                • 1080P video encoding for H.264
                                                                                                                • Support DDRIII, DDRII, Mobile DDR memory
                                                                                                                • 24bit HW ECC for MLC NAND, support e-MMC boot
                                                                                                                • Three USB ports for Device, Host, 3G module
                                                                                                                • Two SD ports for SD card and WIFI
                                                                                                                • Sensors interface for front and rear camera, up to 5M
                                                                                                                • Standard TFT/EPD controller for variable panels
                                                                                                                • MAX 8 channel I2S  and SPDIF output for HD movie
                                                                                                                • TS port for mobile and terrestrial TV, ATSC-T/MH…
                                                                                                                • Ethernet networking interfaces
                                                                                                                • Support VoIP
                                                                                                                • Support Android 2.3 and future version

                                                                                                                Rockchip will highlight MID and Internet TV powered by RK29xx at CES, and Rockchip’s  Internet TV solution with new technique and applications based on Android OS.

                                                                                                                Rockchip and WebM release RK29XX–World’s first SOC to support WebM HD Video Playback in Hardware [Rockchip press release, Jan 7, 2010]

                                                                                                                Fuzhou Rockchip Electronics Co., Ltd, a leading developer offabless semiconductors, today released its new RK29XX generation mobile Internet platform.

                                                                                                                Rockchip 55-nm RK29XX solution is a high-performance, low-power processor designed for mobile internet applications. It integrates an ARM® Cortex-A8 CPU includes the NEON SIMD engine to improve software media processing capability. With TSMC advanced process, the A8 core can enable up to 1.2GHz. RK29XX also provides FULL HD decoder and encoder processor, hardware accelerated Adobe® Flash® Player 10.1, ultra powerful 3D/2D GPU, high speed internet surfing experience and more, now RK29XX supports Gingerbread (Android 2.3).

                                                                                                                The RK29XX is the world’s first system-on-a-chip (SOC) to support 1080P HD decoding of the VP8 video codec entirely in hardware. VP8 is the codec used in the open WebM video format. To build VP8 decoding the RK29xx graphics accelerators, Rockchip licensed the WebM project’s G-Series 1 video decoder IP design.

                                                                                                                “Cooperating with WebM has brought the benefit of Rockchip’s years of experience in the audio and video fields,” said Chen Feng, Vice Present of Rockchip. “The successful support of VP8 marks China’s semiconductor industry becoming international and Rockchip is devoted to continued support.”

                                                                                                                “We’re very excited that Rockchip chose our G-Series 1 hardware design to add VP8 support to the RK29XX,” said Jani Huoponen, Hardware Product Manager for the WebM project. “Playback of HD content in hardware is very important to the WebM project and we look forward to seeing deployment of devices powered by the RK29xx.”

                                                                                                                About WebM

                                                                                                                The WebM project is dedicated to developing a high-quality, open video format for the web that is freely available to everyone.To learn more, visit www.webmproject.org

                                                                                                                Industry background

                                                                                                                A New Threat to Korean Semiconductor Companies? [Korea IT Times, March 8, 2012]

                                                                                                                China’s semiconductor design technology has greatly advanced. Now, Chinese semiconductor design companies are threatening Korean competitors. Some Korean companies expect to have tough competition with Chinese competitors in the near future.

                                                                                                                According to industrial sources, Chinese companies such as Huawei and ZTE are hiring thousands of excellent semiconductor designers. Huawei unveiled a smartphone whose quad core application processor was featured at the MWC 2012. Surprisingly, Huawei did not use Nvidia and Qualcomm products. The quad-core AP K3V2 CUP for this smartphone was jointly developed by Huawei and its subsidiary, HiSilicon.  The chip will go on sale in March. HiSilicon also announced the world’s first multi-mode baseband chips that supports LTE-FDD, TD-LTE and 3GPP Release 9.

                                                                                                                The design capabilities of Chinese companies are growing fast thanks to excellent human resources who returned to China from the Silicon Valley. It has also received the support of the Chinese government and conglomerate Chinese set companies. Moreover, China’s independent standards such as TD-LTE, CMMB have become the foundation for reinforcing the technological power of Chinese companies. Some say that the design capabilities of Chinese companies are stronger than those of Korean firms. ZTE, the world’s fourth largest cell phone maker, produces its own special chips; some of which are exported to Korea. The company developed and used TD-LTE baseband chipsets or chipsets for telecommunication equipment in its products. They even design and use analog semiconductors.

                                                                                                                The growth of these companies is noteworthy. It is expected that these corporations will post one trillion won [US$ 3.56 billion] in sales this year. China has about 500 fables companies. HIS iSuppli expects that total sales of Chinese companies will be doubled to USD 10.7 billion in 2015 from USD 5.2 billion in 2010.  HiSilicon, the biggest fables company in China has been said to post about USD850 million in sales last year. This year, the company is expected to post USD1 billion in sales. Huawei is its biggest customer.

                                                                                                                Spreadtrum, specializing in basebands and RF chips, saw its 2011 sales jump 94.7% to USD 674 million. This is due to the expansion of the 3G chipset sector by a whopping 336.8%. Spreadtrum modem chips are used in the Galaxy S2 or Galaxy Note exported to China. At this current pace, its sales are expected to surpass one trillion won within one to two years.

                                                                                                                In the AP sector, Rockchip and Ingenichave remarkably grown. Rockchip recently released a 1.4㎓ AP which used an ARM Cortex-A9 dual core CPU. The AP is competitive in terms of price and performance.

                                                                                                                Innopfidei is performing well in the digital audio broadcasting chip sector. RDA Micro Electronics specializes in RFs and mixed signal semiconductors and is also growing rapidly. In 2011, this company posted USD 289 million, an increase of 51% from 2010.

                                                                                                                “The history of China’s semiconductor industry is short, up to 15 years,” said a semiconductor industry expert. “Those who returned from the Silicon Valley are taking the lead in the development of the Chinese semiconductor industry.  Soon Chinese fable companies will post one trillion won in sales.”

                                                                                                                Manufacturing background

                                                                                                                Rockchip Collaborates with Synopsys and Chartered to Achieve First-Pass Silicon Success [Chartered press release, Aug 3, 2009]

                                                                                                                Fuzhou Rockchip Electronics Company, Ltd., Synopsys, Inc. and Chartered Semiconductor Manufacturing Ltd. today announced that Rockchip has achieved first-time silicon success on its next-generation multimedia system-on-a-chip (SoC), using a combination of Synopsys’ tools, intellectual property (IP) and services with Chartered’s 65-nanometer (nm) manufacturing technology. The RK 28 multimedia SoC, Rockchip’s first mass-production 65nm chip designed in China and targeted primarily for the China market, is an application processor for mobile handheld devices. The RK28 chip was designed with Synopsys’ full RTL-to-GDSII flow using best-in-class technology from the Galaxy™ Implementation and Discovery™ Verification Platforms, as well as DesignWare® IP, and implemented in Chartered’s advanced low-power (65nm LP) process.

                                                                                                                “The mobile applications served by our customers require chips that can meet stringent low-power specifications without compromising performance, and our multimedia RK28 SoC delivers on both fronts,” said Feng Chen, chief marketing officer of Rockchip. “Our EDA and manufacturing partners played key roles in the success of our program. Our ability to reach design closure within our market window then rapidly move from tapeout to production silicon validates the choices we made with Synopsys and Chartered.”

                                                                                                                Since the 65nm RK28 represented Rockchip’s first design at a new technology node, production-proven technology and knowledge sharing among the parties were essential to project success. The design took advantage of Synopsys’ IC Compiler with Zroute technology to exceed its 500MHz performance target, while employing advanced low-power design techniques such as multi-voltage and power gating to reduce power consumption. The production-proven VMM verification methodology and VCSTM functional verification solution were used to verify Rockchip’s design. The RK28 chip also integrates silicon-proven Synopsys DesignWare IP, including USB 2.0 PHY, USB HS OTG Controller and SD/MMC Host Controller. Design consultants from Synopsys Professional Services worked closely with Rockchip’s engineers throughout the project, merging critical skills and expertise to mitigate project risks and address schedule pressures. The implementation of the design in Chartered’s 65nm LP process enabled the chip to achieve target power, performance and area goals with first silicon, and quickly ramp to production volume.

                                                                                                                “At Chartered, we understand our customers need technology and solutions with low risk and high yield to speed time to market, and we are pleased to see our collaboration with Rockchip and Synopsys achieve first-pass silicon success,” said Dr. Liang-Choo “LC” Hsia, senior vice president of technology development at Chartered. “The Rockchip-Synopsys-Chartered collaboration demonstrates how a strong foundation can support companies on the leading edge of design, especially those in the consumer entertainment and mobile applications.”

                                                                                                                “Rockchip joins a growing list of innovative chip developers that are taking advantage of Synopsys’ broad portfolio of tools, IP and services to accomplish their aggressive design goals with efficiency,” said John Chilton, senior vice president of marketing and strategic development at Synopsys. “Our collaboration with Rockchip and Chartered demonstrates our commitment to serve customers in China and the rest of the world with solutions that accelerate tapeout and enhance manufacturability.”

                                                                                                                SMIC lands new order for 65nm process foundry services [DIGITIMES, Nov 30, 2010]

                                                                                                                Foundry chipmaker Semiconductor Manufacturing International Corporation (SMIC) has said it recently grabbed orders for 65nm chips from China-based consumer IC design house Fuzhou Rockchip Electronics. The new orders are expected to help boost further its sales generated from the process.

                                                                                                                Fuzhou’s design of a high-end digital-analog mixed SoC chip has successfully entered into commercial production at SMIC using the foundry’s 65nm LP process. Dubbed RK Cayman, the series is targeted for use in digital media players, e-book readers, and other digital consumer products.

                                                                                                                SMIC revealed that 65nm accounted for 7.1% of its total wafer revenues in the third quarter pf 2010, up from 3.7% in the second quarter. Demand for the node has been rising at a fast pace, the company added.

                                                                                                                In addition, SMIC said sales generated from its 45nm node are expected to become solid starting from the second half of 2011.

                                                                                                                Rockchip and SMIC in commercial production of 65-nm multimedia chips [SMIC press release, Nov 29, 2011]

                                                                                                                Fuzhou Rockchip Electronics Co., Ltd. (hereinafter referred to as “Rockchip”), a leading Fabless Semiconductor company and mobile-internet SOC solution provider, today announced that its design of a high-end digital-analog mixed SOC chip has successfully entered into commercial production at Semiconductor Manufacturing International Corporation (“SMIC”, NYSE: SMI and SEHK: 0981.HK) using SMIC’s 65-nm Low-Power process.

                                                                                                                The Rockchip RK Cayman series solution platform [?RK28xx?], based on ARM9 and DSP dual-core processors, adopts a number of SMIC’s self-developed 65-nm IPs and is a highly-integrated, programmable, and high-performance digital-analog mixed SOC chip. The chip supports 24bit/1K ECC (error checking and correcting), NAND, eMMC, and SPI (Single Program Initiation). With the built-in EPD (Electrophoretic Displays) driver, the chip can support a variety of EPD displays and various formats of 720P video playback. The chip also adopts Synopsys’ USB PHY, PHY I/O and USB 2.0 IP and features an OTG (On-The-Go) function that makes data exchange with other mobile devices quick and easy. The RK Cayman series is targeted for use in MP3, MP4, e-book reader, and other digital consumer product markets.

                                                                                                                “Rockchip, with its strong R&D focus, continues to dedicate its in-house development to innovated products and solutions. The RK Cayman chip has a strong computing and video playback capability. The chip also supports CMMB, ISDB, mobile TV and other multimedia features. The camera interfaces also enable video and photo capabilities,” said Feng Cheng, Vice President of Rockchip. “SMIC’s 65-nm platform provides customers solutions with more reliability, stability, and lower costs, and thus significantly enhances our market competitiveness. The success of the RK Cayman chip marks a meaningful milestone for both parties.”

                                                                                                                Chris Chi, Senior Vice President and Chief Business Officer of SMIC, said: “The successful collaboration with Rockchip, the leading semiconductor and SOC chip provider in China, further consolidates SMIC’s leadership position in the relevant 65-nm multimedia market. SMIC will continue with the R&D of our 65-nm platform to better serve China’s rapidly growing consumer electronics market.”

                                                                                                                SMIC moves 65-nm to volume production [EE Times Europe, Aug 4, 2010]

                                                                                                                Chinese chip foundry Semiconductor Manufacturing International Corp. (SMIC) has moved its low-leakage 65-nm process technology into volume production at its 300-mm facility in Beijing, the company said Tuesday (Aug. 3).

                                                                                                                SMIC (Shanghai) has shipped more than 10,000 65-nm wafers since mass since the third quarter of 2009, the company said. SMIC, China’s largest wafer foundry, said it is also working on the transition to 55-nm technology.

                                                                                                                “SMIC’s 65-nm can take designs at 65-nm and aim it toward the advantages of 55-nm, I’m delighted with the progress of SMIC’s 65/55-nm project team which continues to meet rigorous deadlines,” said Chris Chi, SMIC’s senior vice president and chief business officer.

                                                                                                                SMIC CEO: China foundry vendor back on track [EE Times Europe, Oct 11, 2010]

                                                                                                                … Wang acknowledged that SMIC is at least five years behind the competition at 65-nm and two-to-three years behind at 45-nm. The goal for the company is to narrow the gap between SMIC and its rivals. …

                                                                                                                …  Recently, SMIC has moved its low-leakage 65-nm process technology into volume production at its 300-mm facility in Beijing. It is also working on the transition to 55-nm technology, which is due in pilot production by the third quarter of 2011.

                                                                                                                SMIC is also working on a 55-nm general purpose process, which is due in pilot production in the fourth quarter of 2011.

                                                                                                                SMIC is also working on a 45-/40-nm low leakage process, which is due in pilot production in the fourth quarter of 2011. SMIC is also working on a 45-/40-nm general purpose process, which is due in pilot production in the second quarter of 2012.

                                                                                                                SMIC licensed the 45-nm process from IBM in 2007. SMIC is also devising a 32-nm process, which was also licensed from IBM.SMIC is also working on analog and mixed-signal. It is devising a bipolar-CMOS-DMOS (BCD) process. …

                                                                                                                Emerging markets to drive China foundries’ growth: Q&A with Digitimes Research analyst Nobunaga Chai [DIGITIMES, Feb 24, 2011]

                                                                                                                China’s foundries may not be able to compete head-to-head against the industry’s global top-three players in the most advanced process technologies, but their opportunities lie elsewhere – their own country and other emerging markets where demand for less sophisticated products will remain robust and drive their growth, according to Nobunaga Chai, author of the recently published Digitimes Research Special Report, “Greater China IC foundry industry overview.”

                                                                                                                Q: Though SMIC (Semiconductor Manufacturing International Corporation) and GSMC (Grace Semiconductor Manufacturing Corporation) ranked fourth and tenth globally in 2010, China-based foundries seem to be less competitive in cost and are unable to meet demand for leading-edge applications. Is the situation changing, and what kind of competitiveness do China’s foundries have?

                                                                                                                A:In order to improve their competitiveness, China’s foundry players are eager to migrate to next-generation process technologies. Although SMIC is still lagging one to two years behind TSMC (Taiwan Semiconductor Manufacturing Company) in process advancement, it already overcame the problem of low yield at 65nm node in the second quarter of 2010 and managed to raise 65nm node’s share of overall revenues to 7% in third-quarter 2010 from 2% in first-quarter 2010. GSMC also plans to volume produce at 90nm in 2011 to become the second China-based foundry to enter the nanometer club. GSMC, Hua Hong NEC and the Shanghai city government also have a plan to set up a joint venture, Shanghai Huali Microelectronics, which will build a 12-inch fab and directly enter 65nm production.

                                                                                                                There is still a big gap between China-based foundries and their Taiwan competitors TSMC and UMC (United Microelectronics Corporation) in R&D for advanced processes, but China’s foundries are in a strong position to meet the robust demand from its home market, Hong Kong and other Asian emerging markets. Demand from the Asian emerging markets will be mainly for chips made using less advanced technologies, which is the strength of China’s foundries.

                                                                                                                Q: Can you give us a picture of the Chinese foundries’ capacity expansion roadmap? How fast is their capacity growing?

                                                                                                                A:SMIC has been actively ramping its 12-inch capacity, which reached a quarterly capacity of 152,000 8-inch equivalent units in third-quarter 2010 from 138,000 units a quarter earlier. As there is still plenty of room for expansion at SMIC’s 12-inch fabs in Beijing and Shanghai, it currently has no plans to build new 12-inch fabs. But Shanghai Huali will build a 12-inch fab in Shanghai with a monthly capacity of 35,000 wafers (79,000 8-inch equivalent wafers). Others, such as TSMC’s subsidiary and CSMC Technologies, will also expand their 8-inch fabs.

                                                                                                                Q: With the industry dominated by such giants as TSMC, UMC and Globalfoundries, will China’s players seek to compete head-to-head against them, or look to other market segments to avoid a head-on clash? SMIC may be an exception, but how good is the chance that it will become a Top-3 player?

                                                                                                                A:From the pace of shrinking geometry to the construction of new capacity, TSMC, UMC and Globalfoundries are taking a runaway lead in sub-65nm development against their Chinese competitors. These top players are also giving top priority to advanced nodes when expanding capacity. But that means that if demand continues expanding, low-end capacity for such products as PWMICs and LCD driver ICs – which only need 0.15 micron or more mature processes – will be insufficient. This is where the opportunities will be for China’s foundries that target the lower-end segments.

                                                                                                                Up till the end of third-quarter 2010, SMIC had a total quarterly capacity of 489,000 8-inch equivalent wafers, just about half of Globalfoundries’ one million 8-inch equivalent units. Globalfoundries’ Fab 8 in New York is expected to ramp up its capacity to 60,000 12-inch wafers monthly in 2012, further widening the capacity gap between Globalfoundries and SMIC. Therefore, it is unlikely that SMIC will become a Top-3 player in the near future. But SMIC will see major momentum of growth from the strong demand from its major markets – China and other emerging markets.

                                                                                                                Q: How fast will China’s foundry production value grow?

                                                                                                                A: Demand from China, Hong Kong and Asia’s emerging markets will remain strong, with the communications and consumer electronics segments to see particularly strong growth. With China’s foundries ramping up their capacities, Digitimes Research predicts that China’s foundry sector will have a high single-digit CAGR from 2010-2013.

                                                                                                                Marvell SoCs to win both Microsoft and Nokia for Windows Phone and Windows 8 platforms (after the Kinect success)

                                                                                                                Update: – Marvell licenses VeriSilicon DSP cores [Feb 13, 2012]

                                                                                                                SAN FRANCISCO—Marvell Technology Group Ltd. has signed a licensing agreement for VeriSilicon Holdings Co. Ltd.’s ZSP G3 intellectual property cores, including the dual-MAC ZSP800M and ZSP880M synthesizable DSP cores, VeriSilicon said Monday (Feb. 13). Financial terms of the deal were not disclosed.

                                                                                                                Marvell is also using VeriSilicon’s quad-MAC ZSP800 core and suite of HD-audio software solutions in the ARMADA 1000 HD media processor SoC and the recently introduced Marvell ARMADA 1500 media processor SoC, VeriSilicon (Santa Clara, Calif.) said. These chips are designed for applications such as Blu-ray players, digital media adapters, HD-STB and HDTVs.

                                                                                                                According to VeriSilion, the dual-MAC ZSP architecture offers a balance of high performance, power efficiency and lower cost to support the increasing feature convergence in mobile and digital entertainment products and enable prolonged battery life. The company claims its products offer ease of use and strong customer support.

                                                                                                                “We are quite impressed with the area and power efficiency of the dual-MAC ZSP800M core, combined with the ease of programming on the ZSP architecture,” said Ivan Lee, vice president of mobile products at Marvell, in a statement. “VeriSilicon’s ZSP-based HD-audio and voice software solutions will provide us with faster time-to-market advantages necessary to meet the growing demands of the mobile platform solutions for use in tablets and smartphones.”

                                                                                                                Marvell’s Cutting-Edge Application Processors [Jan 10, 2012]

                                                                                                                Marvell’s Allen Leibovitch talks about the cutting-edge PXA [also called ARMADA] family of application processors, which enable Marvell customers to build high performance systems at a very low cost.
                                                                                                                From [2:45] the so-called hybrid multiprocessing technology is mentioned with showing the above architecture. It was introduced back in September 2010 with ARMADA 628 (see: Marvell ARMADA beats Qualcomm Snapdragon, NVIDIA Tegra and Samsung/Apple Hummingbird in the SoC market [again] [Sept 23, 2010 – Jan 17, 2011]) at the time when Marvell was working on the earlier ARMADA 610 (see also in the indicated post) for the RIM Blackberry Playbook. Six month into the project RIM dumped the 610 for a TI SoC, but even with that was only able to deliver the stable version of its new QNX software on version 2, missing the crucial 2010 Holiday season. While rumors of that time blamed Marvell for that, according to a current view: “It appears that the failures are largely RIM’s, and often software related. The Marvell processors, when used, seem to work well.
                                                                                                                The first larger scale win for ARMADA 610 was the VIZIO VTAB1008 8″ tablet operating with Android, made available in August 2011 (see: Innovative entertainment class [Android] tablet from VIZIO plus a unified UX for all cloud based CE devices, from TVs to smartphones [Aug 21, 2011 – Jan 7, 2012]). This tablet is shown earlier in the above video (from [0:19] to [1:24]). The ARMADA 628 still has to arrive in a tablet which probably will happen only late in 2012 on Android (as “The company looks at the tablets market as ‘saturated’ and is avoiding it for the next couple quarters“, see below) and might happen in Q4 as the earliest on Windows 8 as hinted explicitly below by Marvell. This is just a possibility (but a very big opportunity for OEMs considering the obvious maturity of 628), nothing more, as any OEM engagement currently under way might end up in a market relased product, or not (as in the case of Playbook with ARMADA 610).
                                                                                                                Note: in the above video instead of ARMADA the earlier PXA branding is used by Marvell’s Allen Leibovitch. Jack Kang in charge of the Application Processors business is also using the PXA branding, as you could read below.

                                                                                                                After the First real chances for Marvell on the tablet and smartphone fronts [Aug 21, 2011 – Jan 19, 2012], so far in the Android, Google TV, educational (more edu) and OPhone spaces, here is the next large scale opportunity for the company. With the young and entrepreneurial Jack Kang in charge since H2CY2010, who has an excellent earlier track record with Microsoft via the hugely successfull Microsoft Kinect application SoC effort, there is a real chance for the company to conclude with platform wins the reported below new engagements with both Microsoft and Nokia in 2012:

                                                                                                                Exclusive: Marvell Says it Will Find a Home in Chinese Windows Phones [DailyTech, Jan 31, 2012]

                                                                                                                Marvell also hints at possible Windows 8 tablets/laptops

                                                                                                                We had an interesting chat with the Marvell Technology Group, Ltd. (MRVL).

                                                                                                                Marvell is perhaps best known as the company that took the Xscale ARM division off of Intel Corp.’s (INTC) hands in 2006.  During the modern smartphone era, Marvell has been a quiet competitor, overshadowed by companies like Qualcomm Inc. (QCOM) and Samsung Electronics Comp., Ltd. (KS:005930) which have pushed the smartphone processing power envelope more aggressively.

                                                                                                                By contrast Marvell has focused on budget smartphones.  It is in most of Research in Motion, Ltd.’s (TSE:RIM) BlackBerry smartphones.  These budget smartphones have led it to strong sales in Indonesia and China.

                                                                                                                Blackberry 8910 China
                                                                                                                Marvell has done well in China, thanks to close ties with RIM and Nokia.
                                                                                                                [Image Source: BlackBerry Rocks]

                                                                                                                Interestingly, the American company sees China as perhaps its most valuable market.  Jack Kang, director of Marvell’s applications processor business unit states, “China was a very strategic investment.”

                                                                                                                With Windows Phones set to land in China later this year in budget smartphones, Mr. Kang is making a bold prediction — “If there’s Windows Phones in China, there will probably be Windows Phones with Marvell in China.”

                                                                                                                That would be a major market event as thus far Qualcomm has been the exclusive ARM chipmaker partner of Windows Phone.  While Windows Phone has struggled in the U.S. where key Windows Phone partner Nokia Oyj. (HEL:NOK1V) has virtually no market share, in China Nokia is the top smartphone maker, so a switch to Marvell ARM cores would be quite a coup.


                                                                                                                Nokia is the top phonemaker in China, thus it’s crucial that Marvell gets in Nokia’s new Chinese Windows Phones when it makes the shift later this year. [Image Source: M.I.C. Gadget]

                                                                                                                Mr. Kang feels his firm’s biggest strength is providing “quality low-cost devices”.  While it doesn’t bake discrete Wi-Fi circuitry into some of its system-on-a-chip devices, it says this approach works in markets like Indonesia or rural China where there’s plentiful 3G but sparse Wi-Fi coverage.

                                                                                                                Marvell current produces single and dual-core chips, with the smartphone-aimed ARMADA family.  Despite competitors like Qualcomm and NVIDIA Corp. (NVDA) jumping to quad core, Marvell says that approach doesn’t make sense.  Mr. Kang comments, “We don’t think quad core makes sense at 40 [nm] from a power perspective, from a price perspective.”

                                                                                                                OLPC Marvell chip
                                                                                                                Marvell’s ARMADA series ARM CPUs power smartphones and mobile devices like the ARM OLPC variant. [Image Source: OLPC.tv]

                                                                                                                He says that Marvell is tentatively slotted to release quad-core designs when it hits 28 nm in mid-2013.  The chipmaker uses Taiwan Semiconductor Manufacturing Comp., Ltd.’s (TPE:2330) third-party fabrication services.  TSMC has struggled at the 28 nm node, delivering low yields and in turn higher costs — a combination that doesn’t work with Marvell’s business model — hence the delay.

                                                                                                                Marvell feels that the fact that it takes its ARM license and build a unique core from the ground up using the ARM instruction set gives it an advantage over competitors like NVIDIA that simply take the core licensed from ARM Holdings plc (LON:ARM), but don’t do a complete redesign.

                                                                                                                The company looks at the tablets market as “saturated” and is avoiding it for the next couple quarters, although it did seem distraught at losing RIM’s PlayBook to Texas Instruments Inc. (TXN), another U.S. chipmaker.

                                                                                                                Mr. Kang hinted Marvell may jump on the tablet bandwagon or even release budget ARM laptops in Q4 2012 when Windows 8 arrives — and with it the first-ever ARM CPU support for a Windows main line operating system.  He comments, “Microsoft already said Windows 8 will run on ARM.  And we build ARM devices, so….”

                                                                                                                Windows 8 tablet

                                                                                                                Marvell hints it may be cooking up ARM Windows 8 tablets/laptops, too.

                                                                                                                This move would make sense because Marvell has been involved with the One Laptop Per Child (OLPC) project in producing an ARM (Marvell) powered design.  It has also played with low cost Linux laptops for years.

                                                                                                                The company also showed off a (Android 3.2) “Honeycomb” television set, which it plans to target as an introduction to Internet TV in budget markets like China.  This was a reference design, whereas Marvell would partner with a traditional TV maker for production designs.

                                                                                                                The Honeycomb set uses Marvell’s latest dual-core chip, which contains an extra low-power core to conserve energy during simpler tasks.  The power savings approach mirrors that found in Tegra 3.  In that sense Marvell’s dual-core is technically a tri-core, much as NVIDIA’s quad-core is technically a penta-core.

                                                                                                                There could indeed be a real 2012 opportunity for Marvell as Nokia CEO Stephen Elop highlighted in an answer to questions about the Quarter 4 results last week (Nokia Quarter 4 results 2011 webcast [Nokia, Jan 26, 2012]):

                                                                                                                on China dynamics:

                                                                                                                … The Chinese operators are increasingly, on accellerated basis entering into structures where there’s effectively retail rate plan bundling is going on at the store. The operators are driving very hard for the volume of 3G data subscribers. And this is not necessary an economic measure as it is driving volume on certain networks for certain technologies. I think those targets are probably set more broadly for all of the operators [he could mean: by the state, as all three operators are majority owned by the state]. And the impact of that is that they are discovering that with very low priced devices on certain radio technologies they can drive a lot of volume at those levels. And so we are seeing, for example, a very significant uptake in a number of low-priced devices that are on CDMA, there’s also a very significant focus on the Chinese technology TD-SCDMA, again all of the low levels ought to drive those volumes. My comment in the prepared remarks is that Symbian is not well positioned today against that. We do not have Symbian CDMA products at all, so we are not participating in that part of the market. So as that part of the market grows our addressable market has gone down because of that. In TD-SCDMA we do have some products in that space but not at the price points and configurations that is the real focus of this market. …

                                                                                                                … We have not yet announced our specific products for the Chinese market but I will say that when we first announced our launch plans, I think all the way back in October, we did highlight that we would have CDMA based Windows Phone products and TD-SCDMA Windows Phone products. That thing said it is the case that we have work to do to successively drive the prices down further and further and further. That will take a bit of time but this is clearly the pattern you are going to see us on the months ahead. …

                                                                                                                [I have a couple of deep and current analysis on that:
                                                                                                                The new, high-volume market in China is ready to define the 2012 smartphone war [Jan 6, 2012]
                                                                                                                China TD-SCDMA and W-CDMA 3G subscribers by the end of 2011: China Mobile lost its original growth momentum [Jan 21, 2012]
                                                                                                                China becoming the lead market for mobile Internet in 2012/13 [Dec 1, 2011]]

                                                                                                                High performance SOC handles HD media [Jan 6, 2012]

                                                                                                                The ARMADA 1500 HD media SOC decodes high-definition advanced multi-format video and audio using it’s dual ARMv7 compatible PJ4B 1.2 GHz processors with symmetric multi-processing and DSP accelerators. The chip targets IP/cable/satellite set-top boxes, advanced Blu-Ray players, digital media adapters, Google TV, and DTV applications.

                                                                                                                The SOCs processors yield 6,000 DMIPS. It includes a secure boot ROM and USB, Fast Ethernet, HDMI, SATA, and SDIO interfaces, plus a 32-bit DDR3 at 800 MHz interface. The chips security engine handles OTP, RNG, AES/(3), DES, RSA, SHA-1, and MD5 and a comprehensive software development kit is available. (No price given – available now.)

                                                                                                                See also my other posts regarding the other high volume opportunities for Marvell:
                                                                                                                Marvell® ARMADA® PXA168 based XO laptops and tablets from OLPC with $185 and target $100 list prices respectively [Jan 8, 2012]
                                                                                                                Google’s revitalization of its Android-based TV effort via Marvell SoC and reference design [Jan 5, 2012]
                                                                                                                (the VIZIO VAP430 Stream Player, introduced below, is likely based on that)
                                                                                                                VIZIO’s two pronged strategy: Android based V.I.A. Plus device ecosystem + Windows based premium PC entertainment [Jan 11, 2012]

                                                                                                                Background on Marvell’s relationship with Microsoft

                                                                                                                A Cal ‘Kinect-ion’ [Innovations by UC Berkeley College of Engineering, Nov 9, 2011]

                                                                                                                Some engineers wait a lifetime for a project like the one that Jack Kang (B.S.’04 EECS) landed when he was barely 26.

                                                                                                                In the fall of 2008, Kang was settling into a new marketing position [Technical Marketing Manager] at Marvell, a Santa Clara-based semiconductor company, when Microsoft came knocking with a mysterious assignmentfor the company. Working on an undisclosed product, the computing giant needed a team to design a complex chip for manufacture on a massive scale.

                                                                                                                “This project was very secretive,” recalls Kang, who had shifted from hands-on chip design to marketing management at Marvell. Marvell got the Microsoft contract, but “we didn’t really know what it was for,” says Kang. Many months into the development of a specialized microprocessor—often touted as a system’s “brains”—he got his answer. The mystery chip was destined for Kinect, Microsoft’s controller-free and immensely popular electronic game sensor device.

                                                                                                                Introduced last November, Kinect uses sophisticated visual and voice recognition to run electronic games, movies and other entertainment. A companion to Microsoft’s Xbox 360 video gaming system, it became the fastest-selling consumer electronics gadget in history, selling 8 million devices in 60 days.

                                                                                                                Kinect’s appeal came as no surprise to Kang. “It was a giant leap,” he says of the technology that lets users interact with media through body motions and voice commands. In fact, when Kang first learned about Kinect, he was so dazzled by the concept that he wondered if it could actually be pulled off.

                                                                                                                His work on the Kinect chip spanned two years. Acting as the project champion in a “do-whatever-it-takes” capacity, Kang managed the effort from the earliest negotiations through a series of designs to manufacturing. In all, more than 100 Marvell chip designers, marketing representatives, software engineers and othersparticipated in a process that witnessed its share of evolutionary curveballs.

                                                                                                                For the first six months, the Marvell team focused on what Kang believes would have been one of the most powerful mobile or consumer chips on the market. Shortly after the chip was completed, Microsoft asked for an even higher performing version. But the company soon switched course, deciding to put more of the computing functions into the Xbox instead of Kinect, Kang says.

                                                                                                                Ultimately, Marvell engineers were asked to build a general purpose chip capable of controlling voice recognition and sending data to the Xbox. The team wound up modifying a chip already in development. That chip, as it turned out, was one that Kang had helped design in his earlier capacity as a Marvell engineer.

                                                                                                                Jack Kang at Marvell

                                                                                                                PHOTO BY ABBY COHN

                                                                                                                Excited by his role in unleashing Kinect, Kang sees many possibilities for human-machine interaction. “We’re just at the tip of the iceberg of what this device can do,” he says, envisioning future Kinect systems that help the disabled and the elderly, and play a role in medical treatment and procedures.

                                                                                                                Beyond Kinect’s intended use for home entertainment, the $150 system has already triggered a flood of creative applications for its cameras, 3-D sensing and other features. At UC Berkeley, graduate student Patrick Bouffard installed a Kinect on a small four-rotor robotic helicopter to enable it to sense its height above the floor and detect objects in its way. Other concepts have included video-conferencing, surveillance and a navigational aid for the blind.

                                                                                                                With his boyish smile and animated personality, Kang, now 29, is at least a decade younger than most of his professional peers. He has developed 11 patents, mostly in the field of CPU (central processing unit) technology. “Everything I needed to know I learned in CS152!” he quips. Kang took that computer architecture and engineering class at Berkeley Engineering and became a teaching assistant his senior year.

                                                                                                                Born in Taiwan and raised in the South Bay, Kang was drawn to a career at the intersection of engineering and business. “I felt you could have more of an impact,” he says. At Berkeley, he minored in business administration and was powerfully influenced by his experience as a TA. Hired as a Marvell engineer in February 2006, he was increasingly tapped to showcase company products in technical presentations for clients. “I had the mindset of marketing,” says Kang, who also enjoyed the social interaction that came with it.

                                                                                                                Twice promoted since 2008, Kang now serves as director of Marvell’s application processor business unit. Today, with a 12-member staff, Kang manages Marvell product lines for e-readers, gaming, education, tabletsand other devices. Long gone is a work schedule with room for lunchtime volleyball and soccer games. “There’s always someone up in some time zone,” Kang observes.

                                                                                                                Kang is eager for the next project of Kinect-like proportions to come his way. “Technology is always evolving,” he says. “I certainly hope I have something that beats it.”

                                                                                                                Marvell: Lazard Says Buy On Kinect, TD-SCDMA Opportunities [Tech Trader Daily, June 20, 2011]

                                                                                                                Lazard Capital Markets analyst Daniel Amirraised the stock to Buy from Neutral …

                                                                                                                Marvell’s sales of chips into China’s home-brewed TD-SCDMA cellular network standard, which is being developed by China Mobile (CHL), and backed by the government, is perhaps underestimated by the Street.

                                                                                                                Marvell could produce $90 million in revenue this year from those chip sales, and $151 million next year, but it could actually go as high as $202 million next year, he thinks. The Street has just $80 million modeled for this year, on average.

                                                                                                                Moreover, the company’s sales into Microsoft’s (MSFT) “Kinect” gaming accessory are “opening new doors” for Marvell in the mobile and wireless business, he thinks, which may help Marvell catch up after missing earlier tablet and smartphone bids. Kinect will probably produce $104 million in revenue for Marvell this year, up from $64 million last year, on Kinect units of 16 million, Amir thinks.

                                                                                                                [Microsoft Reports Record Revenue of $20.9 Billion in Second Quarter [Microsoft press release, Jan 19, 2012]: “The Xbox 360 installed base now totals approximately 66 million consoles and 18 million Kinect sensors”]

                                                                                                                Teardown: Kinect has processor after all [EE Times, Nov 15, 2010]

                                                                                                                Despite Microsoft Corp.’s claims to the contrary, its new Kinect motion-gaming ad-on for the Xbox 360 uses a standalone applications processor marketed by Marvell Technology Group Ltd. , according to a teardown analysis of the Kinect performed by UBM TechInsights.

                                                                                                                TechInsights’ teardown uncovered within Kinect a Marvell PXA 168 applications processor, a part usually found in notebook computers. In September, Microsoft reportedly said it decided not to use a dedicated processor in Kinect. Instead, the company reportedly said the peripheral would harness the power of the processor within the Xbox.

                                                                                                                Microsoft (Redmond, Wash.) did not immediately respond to request for comment about the discrepancy.

                                                                                                                TechInsights analysts concluded that Microsoft’s head fake means the company has bigger plans to make Kinect more of a platform for applications beyond gaming, or that the company was simply trying to prevent the device from being hacked. The Kinect has reportedly already been hacked multiple times.

                                                                                                                The analysts also believe that Microsoft may have underestimated the resource demand on the 360 console processor and was forced into using a laptop-equivalent processor to integrate the imaging, sensing, motor-drive and control functions and orchestrate I/O and communications between the Kinect and Xbox 360. It’s also possible that the processor was required to support the spatial aspects of Kinect’s multiple microphones, they said.

                                                                                                                “It’s difficult to identify exactly what the Marvell processor accomplishes on the Kinect as investigation on how the firmware and software manage all control and processing functions and how they could be localized/virtualized to the Xbox haven’t been investigated yet,” said Allan Yogasingam, a technical marketing manager at TechInsights. “Regardless, Microsoft has created a product that takes full advantage of all its components to provide an innovative gaming experience. The existence of this Marvell processor just opens the door for further innovation down the line and an extension of the Kinect from more than just a sensor-based gaming accessory.”

                                                                                                                TechInsights also conducted further study on the sensor unit that works with Kinect’s image processor, made by PrimeSense Ltd. The firm discovered that the CMOS image sensors used were provided by Aptina Imaging (the die markings on the sensors still refer to Micron Imaging, which was spun off into Aptina in 2008). The infrared camera uses the MT9M001 sensor and RGB input from the color camera features the MT9M112 sensor, TechInsights said.

                                                                                                                Close up of the Marvell PXA 168 applications processor found inside Kinect.
                                                                                                                Source: UBM TechInsights.

                                                                                                                TechInsights’ recent teardown of Kinect found chips made by PrimeSense, Marvell, Texas Instruments Inc., STMicroelectronics NV and others. The firm estimates that Kinect carries a bill-of-materials of roughly $56 for the components, not including the the price of design, R&D and the $500 million Microsoft plans to spend to market the device.

                                                                                                                Teardown of the Microsoft Kinect – Focused on Motion Capture [Chipworks, Dec 23, 2010]

                                                                                                                Application processor An Armada Series 800 MHz application processor by Marvell was also inside the Microsoft Kinect. Interestingly, this device is typically aimed at the e-reader market

                                                                                                                Marvell-88AP1-BJD2

                                                                                                                Why did MS dump Kinect processor? There was ‘no need’ for it  [ComputerAndVideoGames.com, Sept 29, 2010]

                                                                                                                Camera tracks fewer points than it did last year

                                                                                                                It emerged in January that MS had ditched a standalone processor in the camera – which some have claimed has subsequently affected performance.

                                                                                                                Kinect now relies on the processing power of the Xbox itself – although the platform holder has claimed that it uses “less than one per cent” of the 360’s motherboard.

                                                                                                                We didn’t know how much processing Kinect was going to take at the start of development,” Kinect creative boss Kudo Tsunoda told the new Xbox World 360.

                                                                                                                “Obviously you don’t want to lose any of the things that are important to Xbox customers. Graphic fidelity is something that Xbox has always been known for, and you want to make sure that you still hit that level.

                                                                                                                “Forza is a graphical showpiece, and we had Forza with Kinect at E3… the graphic fidelity has actually improved in some areas from what they shipped with Forza 3. It’s still running at 60 FPS and it’s supporting Kinect, so there’s just no need to have that extra processor.”

                                                                                                                When asked why Kinect detected less points on the player’s body than it did last year, Tsunoda added:

                                                                                                                “As you start building the stuff, you’re like: ‘Wow, to track everything in the human body we can do less points. That’s just normal game development. Anything you do with games, you want the processing power to be used as efficiently as possible to get the experience that you want.”

                                                                                                                Kinect launches in the UK on November 10 and the US on November 4.

                                                                                                                Microsoft drops internal Natal chip [Jan 7, 2010]

                                                                                                                GamesIndustry.biz has learned that Microsoft has dropped a chip from its forthcoming Natal motion control system as the platform holder eyes accessible price points in the build-up to release later this year.

                                                                                                                Kinect Downgraded To Save Money, Can’t Read Sign Language [Kotaku, Aug 11, 2010]

                                                                                                                The patent for Microsoft’s motion-sensing camera Kinect suggested that the device could understand American Sign Language. Well, it can’t. At least, the version going on sale in November can’t.

                                                                                                                Responding to the claims made in the patent, Microsoft has told Kotaku “We are excited about the potential of Kinect and its potential to impact gaming and entertainment. Microsoft files lots of patent applications to protect our intellectual property, not all of which are brought to market right away. Kinect that is shipping this holiday will not support sign language.”

                                                                                                                So why did the patent suggest it could? Well, sources close to the evolution of Kinect’s development tell us it’s because the version of the hardware that’ll be available later this year isn’t as capable as was originally intended.

                                                                                                                The original Kinect had a much higher resolution (over twice that of the final model’s 320×240), and as such, was able to not only recognise the limbs of a player as the current model version can, but their fingers as well (which the current version can’t). And when the hardware could recognise fingers, it would have been able to read sign language.

                                                                                                                But that capability came at a cost, and while Microsoft had always intended Kinect to sell for $150, “dumbing down” the camera would have meant that Microsoft wouldn’t be losing as much money on each unit sold, an important point should Kinect prove to be a failure. So dumb it down they did, reducing the camera’s resolution (which in turn reduced the number of appendages it’d have to track) and placing the burden for some of the device’s processing on the console and not Kinect’s own hardware.

                                                                                                                This probably isn’t the first time you’ve heard such a rumour, but this latest time at least explains why Kinect can’t read sign language!

                                                                                                                We’ve reached out to Microsoft for comment on the matter, and will update if we hear back.

                                                                                                                Background on Jack Kang

                                                                                                                Jack Kang, Director, Application Processors at Marvell [LinkedIn profile, excerpted, Feb 1, 2012]

                                                                                                                Current

                                                                                                                Past

                                                                                                                Education

                                                                                                                • University of California, Berkeley
                                                                                                                • University of California, Berkeley – Walter A. Haas School of Business

                                                                                                                Jack is currently director of Marvell’s Application Processor Business Unit. He has been in the semiconductor business for more than seven years, holding previous positions in design engineering at several leading technology vendors. At Marvell, Mr. Kang manages multiple product lines from design conception to mass market implementation and adoption. These include the industry-leading PXA168, PXA618 and PXA510 processors, which are fueling today’s premier consumer devices.

                                                                                                                Additionally, he oversees various market segments, including education, eReaders, gaming, tablets and other connected consumer and embeddeddevices. Most recently, Mr. Kang was responsible for the processor design powering Microsoft’s gaming console, Microsoft Kinect. This gaming console shattered sales records and was named the fastest-selling tech gadget of all time by the Guinness Book of World Records – totaling more than 10 million units since its launch in November, 2010.

                                                                                                                [Steve Ballmer, Houston Technology Forum, March 10, 2011: “We shipped those in November. We just announced that we’re over 10 million sold, in what amounts to about two-and-a-half months.”]

                                                                                                                Outside of his work at Marvell, Mr. Kang also serves as a technical expert on CPU technology and has more than 11 patents pending in the field of CPU technology. He holds a degree in Electrical Engineering and Computer Science from the University of California, Berkeley, with an emphasis in Computer Architecture.

                                                                                                                Jack Kang, Patents and Publications [LinkedIn page, excerpted, Feb 1, 2012]

                                                                                                                Jack Kang’s Patents

                                                                                                                Interrupt Handling

                                                                                                                • United States Patent 7,870,372
                                                                                                                • Issued January 11, 2011

                                                                                                                Inventors: Jack Kang, Hsi-Cheng Chu, Rich, Yu-Chi Chuang

                                                                                                                Method and apparatus for idling and waking threads by a multithread processor

                                                                                                                • United States Patent 7,904,703
                                                                                                                • Issued March 8, 2011

                                                                                                                Inventors: Jack Kang, Rich, Yu-Chi Chuang

                                                                                                                MULTI-THREAD PROCESSOR WITH MULTIPLE PROGRAM COUNTERS

                                                                                                                • United States Patent 7,941,643
                                                                                                                • Issued May 10, 2011

                                                                                                                Inventors: Jack Kang, Rich, Yu-Chi Chuang

                                                                                                                Methods, apparatuses, and system for facilitating control of multiple instruction threads

                                                                                                                • United States Patent 7,757,070
                                                                                                                • Issued July 13, 2010

                                                                                                                Inventors: Jack Kang, Hsi-Cheng Chu, Rich, Yu-Chi Chuang

                                                                                                                Multithread processor with thread based throttling

                                                                                                                • United States Patent 7,886,131
                                                                                                                • Issued February 8, 2011

                                                                                                                Inventors: Jack Kang

                                                                                                                Instruction dispatching method and apparatus

                                                                                                                • United States Patent 7,904,704
                                                                                                                • Issued March 8, 2011

                                                                                                                Inventors: Jack Kang, Rich, Yu-Chi Chuang

                                                                                                                Methods and apparatus for handling switching among threads within a multithread processor

                                                                                                                • United States Patent 8,032,737
                                                                                                                • Issued October 4, 2011

                                                                                                                Inventors: Jack Kang, Hsi-Cheng Chu

                                                                                                                Event-based bandwidth allocation mode switching method and apparatus

                                                                                                                • United States Patent 8,046,775
                                                                                                                • Issued October 25, 2011

                                                                                                                Inventors: Jack Kang, Rich, Yu-Chi Chuang

                                                                                                                Jack Kang’s Publications

                                                                                                                A Cal ‘Kinect-ion’

                                                                                                                • Berkeley Innovations
                                                                                                                • November 28, 2011

                                                                                                                Authors: Jack Kang, Abby Cohn

                                                                                                                Marvell’s processors for embedded systems – Discussion of the PXA510 processor and the D2Plug developer kit

                                                                                                                Mr. Jack Kang of Marvell discusses the PXA510 ARM V7 based 800 MHz application processor with with 512 Kbytes of level 2 cache and it’s associated developer kit.

                                                                                                                From Dewey to Digital [HigherEdTECH, Jan 6, 2011]

                                                                                                                No more pencils?! No more books? No more teachers? On-demand digital content, do-it-yourself learning, new generation learning platforms, and new modes of assessment are disrupting traditional textbooks, grading, courses, and degrees. Is technology really a catalyst for change? Let us count the ways.

                                                                                                                Moderator:
                                                                                                                Kenneth C. Green, Founding Director, The Campus Computing Project

                                                                                                                Panel:

                                                                                                                • Sean Devine, Chief Executive Officer, CourseSmart
                                                                                                                • Felice Nudelman, Executive Director, Education, The New York Times Company
                                                                                                                • William D. Rieders, Executive Vice President of Global New Media, Cengage Learning
                                                                                                                • Jack Kang, Director, Application Processor Business Unit, Marvell

                                                                                                                Video Records (~10 min each) of the From Dewey to Digital (Jan 6, 2011) panel discussion:

                                                                                                                The new, high-volume market in China is ready to define the 2012 smartphone war

                                                                                                                Follow-up: Boosting the MediaTek MT6575 success story with the MT6577 announcement [June 27, 2012]
                                                                                                                – China TD-SCDMA and W-CDMA 3G subscribers by the end of 2011: China Mobile lost its original growth momentum [Jan 21, 2011]

                                                                                                                UpdatesChina market: Local vendors to roll out CNY300 smartphones [DIGITIMES, July 13, 2012]

                                                                                                                China-based handset makers are ready to begin volume shipments of smartphones priced at CNY300 (US$50) in the second half of 2012 compared to the previous focus on CNY600 models in the first half of the year, according to industry sources.

                                                                                                                Competition among chipset solution vendors, promotions by telecom carriers, and the rise of new brands in China have contributed to the rapid decline in prices of smartphones in China, the sources revealed.

                                                                                                                The top-3 telecom carriers had previously focused purchases on smartphones with a price tag of CNY1,000, but some local handset makers are now willing to offer quotes at around CNY500 in order to win orders, said the sources, adding that the pricing will serve as an indication for channel operators to follow.

                                                                                                                While quotes for 2G smartphones in China have already dropped to below US$50, prices for 3G models currently range from US$60-80 and are expected to reach US$50 soon, the sources asserted.

                                                                                                                Sub-CNY1,000 smartphones accounted for 21% of all smartphones sold in China in the first quarter of 2012, compared to a ratio of 12% a year earlier, according to IDC.

                                                                                                                – China market: Nearly 195 million handsets shipped in 1H12 [DIGITIMES, July 10, 2012]

                                                                                                                There were 194.913 million handsets shipped in the China market during the first half of 2012, consisting of 106.874 million (54.83%) 3G handsets in 801 models and 88.039 million (45.17%) 2G handsets in 1,298 models, according to statistics published by the China Academy of Telecommunication Research (CATR) under the Ministry of Industry and Information Technology (MIIT).

                                                                                                                Of the shipment volume, 94.855 million or 48.67% were smartphones in 822 models of which 801 models or 97.44% were based on Android. China-based vendors accounted for 75.16% of the half-year shipment volume, and international vendors 24.84%.

                                                                                                                The monthly shipment volume of smartphones exceeded that of feature phones for the first time in April 2012, with the corresponding proportion increasing to 56.9% in June.

                                                                                                                China market: Breakdown of total handset shipment volume, 1H12
                                                                                                                Generation

                                                                                                                Technology standard

                                                                                                                Number of models

                                                                                                                Shipment volume (m handsets)

                                                                                                                3G

                                                                                                                WCDMA (China Unicom)

                                                                                                                476

                                                                                                                53.099

                                                                                                                CDMA2000 (China Telecom)

                                                                                                                174

                                                                                                                28.197

                                                                                                                TD-SCDMA (China Mobile)

                                                                                                                151

                                                                                                                25.578

                                                                                                                2G

                                                                                                                GSM

                                                                                                                1,272

                                                                                                                81.915

                                                                                                                CDMA1x

                                                                                                                26

                                                                                                                6.076

                                                                                                                Source: CATR under MIIT, compiled by Digitimes,  July 2012

                                                                                                                – Second- and third-tier handset makers in China may not adopt Windows Phone 8 platform [DIGITIMES, July 5, 2012]

                                                                                                                Microsoft has been eager to promote Windows Phone 8, Windows 8 and Windows RT. Despite having partners such as Nokia, Samsung, and HTC for Windows Phone 8, severe price competition in China will likely prevent second- and third-tier handset makers from switching from Google’s Android.

                                                                                                                China-based handset makers have been aiming at customers switching from feature phones to smartphones for the first time and hence have little desire to adopt new platforms.

                                                                                                                Industry sources indicated that competition in China’s smartphone market has been cutthroat. First-tier brands such as ZTE, Huawei, Coolpad and Lenovo have been introducing models at the price range of CNY1,000 (US$157). To increase market exposure, second-tier brands such as Haier and Konka have been introducing models below CNY500 in efforts to obtain cooperation with telecommunications service providers. The price difference is significant, said industry sources.

                                                                                                                Microsoft hopes to increase market share in China’s smartphone market. However, Windows Phone 8 is unlikely to compete with Android in features such as localized applications and marketing resources, added industry sources.

                                                                                                                Nevertheless, Microsoft has been adding new alliances such as Huawei and ZTE. Industry sources believe the two firms hope to generate more profits by providing products with different platforms.

                                                                                                                – China smartphone market 2012: Trends and analysis [DIGITIMES Research, July 3, 2012]

                                                                                                                Abstract

                                                                                                                The China handset market has exhibited strong growth, with the total number of mobile users in the country reaching 980 million people according to figures from the Ministry of Industry and Information Technology (MIIT), an increase of 130 million over the 2010 figure. Digitimes Research estimates that mobile user numbers could top 1.13 billion in 2012.

                                                                                                                Digitimes Research estimates that the China handset market reached some 390 million units in 2011, representing 16% growth on 2010; the market is likely to grow to 430 million units in 2012, representing further growth of 9%. Thanks to the expansion of 3G service coverage and further falls in budget smartphone prices, the share of the handset market accounted for by smartphones is likely to reach 32% or around 143 million units, 70% of which will be Android handsets.

                                                                                                                Digitimes Research believes that market share rankings for the China smartphone market will change significantly during 2012Samsung and Apple will take the top two places, while the big four China-based brands – HuaweiZTELenovo and Coolpad – will take third to sixth places, while Nokia will drop to seventh; these seven firms will collectively account for 85% of shipments.

                                                                                                                In other words, the many other brands hoping to seize a share of the market will essentially be confined to competing for a potential market of just 15% of overall shipments or around 21 million handsets. Given such a situation, Digitimes Research projects that many of China’s best known smaller brands such as XiaomiTCLGioneeTianyuOppo and BBK will see shipments of no more than a few million handsets.

                                                                                                                – China-based white-box vendors expected to ship 200 million smartphones [DIGITIMES, April 17, 2012]

                                                                                                                China-based white-box vendors, mainly due to the availability of inexpensive new chip solutions, have been increasing the production of smartphones, with the total shipment volume expected to reach 200 million units in 2012, according to industry sources in Taiwan.

                                                                                                                Taiwan-based MediaTek is offering the makers its MT6575 a chip solution for use in entry-level smartphones in the first quarter of 2012 and will offer the MT6577, a solution for high-level smartphones, in the middle of the third quarter of 2012, the sources indicated. MediaTek will ship 50-70 million chips to China-based white-box vendors to account for nearly 30% of smartphones to be shipped by these vendors in 2012.

                                                                                                                In addition, Qualcomm has strengthened its marketing in the China market by offering turn-key solutions to white-box vendors, with prices for a chips lowered to US$6, the sources cited eMedia Asia as indicating.

                                                                                                                China-based white-box vendors sell more than 60% of their smartphone output to overseas markets, including 2.5G models for markets where deployment of 3G networks is not mature yet, the sources indicated. White-box vendors are expected to see larger market demand if their production costs for entry-, medium- and high-level smartphones drop to US$60, US$85 and US$130 respectively, the sources pointed out.

                                                                                                                – China market: Handset makers upgrading hardware specifications of sub-CNY1,000 smartphone models [Feb 17, 2012]

                                                                                                                 China-based handset makers, including ZTE, Huawei Device, Lenovo and Coolpad, have continued to upgrade the hardware specifications of their sub-CNY1,000 (US$159) smartphone models due to intensifying competition in the segment, according to industry sources.

                                                                                                                With the introduction of dual-core 1GHz CPUs for high-end models in 2011, the single-core 1GHz CPU is likely to become one of the standards for entry-level smartphones in China this year, the sources indicated.

                                                                                                                Additionally, some vendors have also begun to adopt 4-inch displays for their sub-CNY1,000 models, instead of 3.5-inch displays used previously, the sources added.

                                                                                                                Coolpad has recently launched a 4-inch model, the 7260, and saw sales of the model reach 30,000 units a month in the initial period, the sources revealed, adding that monthly shipments of the 7260 may top 100,000 units soon.

                                                                                                                – China handset makers to push sales of sub-CNY1,000 smartphones to mature markets [Feb 16, 2012]

                                                                                                                Having mass-produced smartphones with a price tag of around CNY1,000 (US$159) for the China market since 2011, China-based handset makers ZTE, Huawei Device, Lenovo and Coolpad plan to push the sale of sub-CNY1,000 smartphones to mature markets including North America and Taiwan, according to industry sources.

                                                                                                                Sales of smartphones by Coolpad, Lenovo, ZTE and Huawei combined currently account for 30-40% of China’s smartphone market, with the ratio likely to surpass 50% by year-end 2012, the sources estimated.

                                                                                                                In the Taiwan market, Coolpad has recently a WCDMA model with a suggested retail price of NT$5,990 (US$203). However, the company plans to launch more entry-level smartphones later and aims to take up a 3-5% share in the segment. Coolpad shipped about 270,000-280,000 CDMA models in Taiwan in 2011, the sources revealed.

                                                                                                                – Chinese smartphone market sees explosive growth [Feb 16, 2012]

                                                                                                                Judging from the structure of the smartphone market in 2011, Chinese smart terminals brands such as ZTE and Huawei seem to be on a trend of full-scale explosion. Having been suppressed by foreign brands for a long time, Chinese smartphones begin to take a solid footstep in the smartphone market by working closely with telecommunication operators and making full use of their “Chinese characteristics”, breaking the old pattern of market that has long been dominated by foreign brands. According to industrial participants, Chinese brands are rising in the 3G era.

                                                                                                                According to media report, the Coolpad 7260, one of China Unicom’s 1000-Yuan smartphones, created a record sales of 110,000 units three days after it was put on the market, refreshing the shipment volume record of 1000-Yuan Chinese 3G smartphones, scoring a victory in its first battle. Also, this number gives the market more expectation for Unicom’s 8 new models of 4.0 series “WO 3G” 1000-Yuan smartphones that are co-launched by China Unicom and technology-intensive Chinese mobile phone manufacturers.

                                                                                                                It is learned that these new 4.0 series 1000-Yuan phones boast three major features: big, fast, and HD. Big screens, previous 3.5-inch screens are replaced by 4-inch screens; fast processing speed, previous 600MHz CPUs are replaced by CPUs that are higher than 800MHz now; fast upload speed, supporting HSUPV; fast running speed, memory upgrades from 256M in the past to 512M now. High-definition picture taking, camera are required to increase from 2-3 million pixels to 3-5 million pixels.

                                                                                                                According to person from China Unicom, the re-defined 1000-Yuan smart terminals introduced by China Unicom in May, 2011, and the numerous star terminals subsequently co-produced by China Unicom and Chinese mobile phones manufacturers have won excellent market response. Among these products, ZTE’s V880 scored daily sales of more than 10,000 units and monthly sales of more than 300,000 units. After months of promotion, the 1000-Yuan smartphones strategy remains effective, propelling the fast growth of China Unicom’s 3G subscribers.

                                                                                                                In November, Unicom’s net growth of 3G subscribers was as high as 3.384 million with total 3G subscribers amounting to 36.534 million, making it the operator with the fastest 3G subscriber growth rate. This indicates that 1000-Yuan phones have accumulated significant subscriber base in the market and have established some brand effect. Presently, China Unicom makes use of the favorable conditions and defines the standards of 4.0 series 1000-Yuan smartphones, and offers high subsidy for the newly defined 4.0 series phones, with the purpose of making deployment in the middle-end market and grab a say of Chinese smart terminals in advance.

                                                                                                                According to industrial participants, “users-friendly price and high-end experience” is the key to the success of China Unicom’s customized 1000-Yuan smartphones. Consumers’ favor for China Unicom’s customized terminals comes from its preferential subsidy policy, rather high-end configuration, and the user experience brought by the WCDMA network. Market research statistics show that the number of 3G subscribers worldwide in 2011 approached 1.3 billion, of which WCDMA subscribers accounted for 76 percent. In China, as per October 2011, WCDMA smartphones accounted for 69 percent of all 3G smartphones. Currently, China has become the largest smartphone market in the world, with nearly 70 percent of the phones being WCMDA. It is thus quite clear that WCDMA mobile phones are the mainstream in China and even all over the world.

                                                                                                                Industrial participants point out that with the rapid development of smart terminals in the 3G era, the competition pattern of the mobile phone market will become even more complicated. In the meantime, the industry thinks positively of the marriage between domestic mobile phones and China Unicom’s WCDMA. Amidst the fierce competition of the terminal market globally, however, Chinese smartphones need to understand the market better, and puts more efforts in products R&D and brand image improvement, hoping to evolve from the “copycat” image to a national brand as soon as possible.

                                                                                                                End of updates

                                                                                                                The new high-volume smartphone market has been established by China Unicom with Lenovo and ZTE involvement from August 2011 on under the so called ‘RMB 1000’ [US$158]  inititiative of the carrier.

                                                                                                                China Unicom and China Mobile Feb-09--Nov-11 3G SubscribersAs visible on the chart (see left) China Unicom was able to return to the previous 10% month/month growth rate of the 3G subscribers as the result of this approach. Unicom’s main rival the much bigger China Mobile was, however, unable to sustain that growth rate. One of the reasons is certainly the fact that China Unicom has so far been the only Chinese operator with official iPhone  offerings. By looking to the enlarged picture of the chart for the August-November period one can nevertheless see that the gap in month/month growth rates of the two companies has been steadily growing. This cannot be explained in other ways than by this 1st stage of the ‘RMB 1000’ initiative. Since in the end of December the initiative has been extended to the RMB 1500 [US$238] price cap with not less than 8 models joing the offerings under this umbrella, this will define an obvious smartphone war for 2012.

                                                                                                                The first stage of this initiative has already radically redefined the 3G smartphone market for W-CDMA customers in China:
                                                                                                                – the ‘RMB 1000’ [US$158] Android phone (Lenovo A60) has slightly better graphics performance than either the 4.26x more pricey iPhone 3G S or the 1.62x more pricey best classic Android phone (Sony Ericsson WT19i)
                                                                                                                – the Dhrystone performance of that phone is quite enough  comparing to both (2/3d of the iPhone and 4/10th of the Sony Ericsson device)

                                                                                                                Smartphone
                                                                                                                and its availability
                                                                                                                (+ recent price)
                                                                                                                Lenovo A60
                                                                                                                August, 2011
                                                                                                                ($145 in Dec’11)
                                                                                                                Sony Ericsson WT19i
                                                                                                                November, 2011 ($235)
                                                                                                                Apple iPhone 3G S
                                                                                                                June, 2009 ($618 8GB from Nov’11 on)
                                                                                                                DMIPS 812.5 2100 1200
                                                                                                                GLBenchmark 2.1 Egypt High
                                                                                                                (+ Standard)      (Frames) http://www.glbenchmark.com/:
                                                                                                                • Top
                                                                                                                2787 (3174) 2653 (4806) 2714 (3352)
                                                                                                                • Average
                                                                                                                2765 (3159) 2653 (4806) 2646 (2913)
                                                                                                                • Median
                                                                                                                2757 (3155) 2653 (4806) 2646 (3257)
                                                                                                                Screen size 480 x 320 480 x 320 480 x 320
                                                                                                                SoC w/ core inside
                                                                                                                MediaTek MT6573 w/ 650MHz ARM11
                                                                                                                Qualcomm MSM8255 w/ 1GHz Scorpion
                                                                                                                Samsung S5PC100 w/
                                                                                                                600MHz Cortex-A8
                                                                                                                GPU inside the SoC
                                                                                                                PowerVR SGX 531
                                                                                                                Adreno 205
                                                                                                                PowerVR SGX 535

                                                                                                                Note: For realistic graphics performance the results of the ‘High’ version of the GLBenchmark 2.1 are used here since this is showing how the GPU is performing in high-quality rendering with “multi-sample anti-aliasing and at least 24 bits of color- and Z-buffer depths”. Also the results are shown here for the so called ‘Egypt’ benchmark as it “tests OpenGL ES 2.0 and represents the newest and most demanding benchmark” according to Anandtech. To understand what we are talking about here is also a video demonstration of the 2.1 Egypt benchmark by the globally recognized and accepted creator of it, Kishonti Informatics Ltd:

                                                                                                                Since China Unicom launched the second stage of its ‘RMB 1000’ in the end of December, when not less than 8 models with a higher, 1500 [US$238] price cap have been joining the offerings, we can safely argue that what is happening now in China will apply to the global markets as well. We have already shown in an earlier post that China becoming the lead market for mobile Internet in 2012/13 [Dec 1, 2011], so there is no question about that.

                                                                                                                Please find below a collection of all related information. It is necessary to highlight here the fact that with the higher, 1500 [US$238] price cap we are already in the 1.0 GHz Cortex-A9 and A5 CPU performance territories which mean 2500 and 1570 DMIPS respectively. The screen is also larger, 4” as well as the resolution is 800×480.

                                                                                                                Another thing that needs to be highlighted here is China Unicom’s very attractive contract plan, described below as:

                                                                                                                Customers who select the RMB 96 [US$15] per month two-year contract plan can receive the handset for free with a RMB 1,599 prepaid deposit. Users who purchase a smartphone without a contract plan for RMB 1,299 can later select a two-year contract plan starting at RMB 46 [US$7.3] per month and receive free calling credit.

                                                                                                                NOW THE DETAILED COLLECTION

                                                                                                                China Unicom Releases Eight Low-cost 3G Smartphones [Marbridge Daily, Jan 4, 2012]

                                                                                                                During a recent [Dec 26, 2011] event in Beijing, China Unicom (NYSE: CHU; 0762.HK; 600050.SH) unveiled eight new “RMB 1,000” smartphones with 4-inch displays and CPUs clocking up to 1 GHz, as well as announcing its 3G smartphone policy for 2012.

                                                                                                                The eight phones, all priced under RMB 1,500 [US$238], including China Wireless Technologies (2369.HK) subsidiary Yulong’s Coolpad 7260, the Hisense (600060.SH) HS-U8, ZTE (0763.HK; 000063.SZ) V889D, Huawei U8818, Lenovo (0992.HK) A750, TCL Communication Technology (2618.HK) W989, Amoi N89, and Philips W635. The Coolpad 7260 and Hisense HS-U8 hit the market in late December 2011.

                                                                                                                Unicom expects China’s RMB 1,000 smartphone market to reach 90 mln units sold in 2012, while 60 mln smartphones priced between RMB 1,000 and RMB 2,000 will be sold, including both well-known domestic and international brands. Unicom expects the iPhone to continue to be the carrier’s flagship strategic product in the high-end RMB 2,000 or more smartphone market, and Unicom will continue to strengthen its line-up of operator-customized Android smartphones as well as a range of Windows Phone handsets. Unicom will also push dual-mode, dual-standby, dual-SIM smartphones.

                                                                                                                The WCDMA/GSM dual-SIM, dual-standby Coolpad 7260 features a 4-inch WVGA 16 mln color HD multitouch display, Android 2.3, and Coolpad’s secure cloud services. The Hisense HS-U8 WCDMA/GSM dual-SIM, dual-standby smartphone is 1.6 mm thick and features a 5 MP autofocus camera and 3 MP front-facing camera. Both are available with contract plans. Customers who select the RMB 96 [US$15] per month two-year contract plan can receive the handset for free with a RMB 1,599 prepaid deposit. Users who purchase a smartphone without a contract plan for RMB 1,299 can later select a two-year contract plan starting at RMB 46 [US$7.3] per month and receive free calling credit.

                                                                                                                China Unicom’s 3G network already covers 341 cities and over 95% of county towns nationwide. HSPA+ peak downlink speeds reach up to 21 MB in 56 key cities. Nearly 20,000 Unicom service centers offer 3G services, as well as nearly 10,000 non-operator stores run by hundreds of major retail chains. Unicom 3G service is also available through mainstream e-commerce channels. According to a source within Unicom, non-operator channels contribute over 50% of China Unicom’s 3G growth.

                                                                                                                According to an industry source, China has 900 mln handset users, 90% of whom have a handset priced under RMB 2,000.

                                                                                                                Regarding the full contract plan the only available information is from the Chinese press release: China Unicom released eight new definition of thousands of intelligent machines new 4.0 series [translated by Google, Dec 26, 2011]

                                                                                                                Attachment: Cool 7260, Hisense HS-U8 contract plans

                                                                                                                (A) “Stored send phone calls” contract plan

                                                                                                                (B) “purchase mobile phones to send calls” contract plan

                                                                                                                China Unicom releases low-end smartphones to woo 3G users [Want China Times, Dec 28, 2011 ]

                                                                                                                image
                                                                                                                A China Unicom promotion offers free smartphones paired with 3G service packages.

                                                                                                                China Unicom, one of China’s three major state-run telecom operators, has teamed up with several local cell phone vendors to launch its latest low-end smartphone in a bid to attract more 3G users.

                                                                                                                Along with eight handset vendors — including Hisense, ZTE and Huawei — China Unicom on Monday unveiled its latest low-end smartphone, marketed as the “1,000-yuan (US$158) smartphone 4.0.” The new smartphone is equipped with a 1GHz processor and 4.0-inch screen, an improvement over the 3.5-inch screen of an earlier model.

                                                                                                                The launch is widely seen as a move to attract more phone users to 3G smartphones. The number of [W-CDMA i.e. China Unicom’s] 3G users in China has increased to over 36 million, just three years after 3G licenses were made available in 2009.

                                                                                                                “(The phone) is a win-win situation for chip makers, cell phone manufacturers and distribution vendors, and the boost in the 3G business is attributable to inexpensive cell phones,” said China Unicom general manager Lu Yimin.

                                                                                                                “The launch of the inexpensive 4-inch-screen phone signals that the battleground has shifted from high-end phones to mid- to low-end phones,” said Fu Liang, an independent analyst.

                                                                                                                Telecom operators agree that lowering the prices of 3G smartphones will be key in bringing the technology to 2G subscribers, who mainly use mobile phones to make calls, the analyst said. They realize that a price tag of 1,000 yuan will be instrumental in initiating that shift, the analyst said.

                                                                                                                The boost to business is most obvious among handsets jointly launched by Chinese electronics makers Lenovo and ZTE. The two companies currently lead the market for phones that use the WCDMA network standard, with Lenovo selling 340,000 of its A60 phones and ZTE selling 240,000 of its V880 handsets per month, according to an analyst. In 2012, the analyst estimated, the number of phones priced under 1,000 yuan will climb to 90 million, while those priced between 1,000 and 2,000 yuan (US$316) will number around 60 million.

                                                                                                                China Unicom has seen its 3G subscribers rapidly increase since it partnered with cell phone vendors such as Huawei and Lenovo to roll out inexpensive models in China. According to data from the three major telecom operators in China — China Unicom, China Telecom and China Mobile — 3G subscribers using China Unicom’s network increased to by 3.38 million in November, while China Mobile and China Telecom saw their 3G users rise to by 2.68 million and 2.16 million, respectively.

                                                                                                                China Unicom today released an upgraded version of the new definition of thousands of intelligent machines 4.0 [Google translation, Dec 26, 2011]

                                                                                                                … The first listing contains the models are Coolpad 7260 [酷派 Yulong], Hisense [海信] HS-U8, ZTE [中兴] V889D, Huawei [华为] U8818, Lenovo [联想] A750, TCL A996, Amoi [厦新] N89 and Philips* W635 …image_thumb3

                                                                                                                * Sang Fei [桑菲通信]:

                                                                                                                Sang Fei is one of China’s biggest mobile communication enterprises with a large export market and a fast-emerging domestic brand presence. A core subsidiary of China Electronics Corporation (CEC) [a highly specialized contract manufacturer in Taiwan] and SED Group [Shenzhen SED Industry Co., Ltd., a state-owned enterprise, which contains 20 solely-funded enterprises and Joint Ventures enterprises, is a publicly listed company on the Shenzhen Stock Exchange [from: the staff is over 5000, the yearly turnover is over 1000 million of U.S Dollar]] …

                                                                                                                Sang Fei has evolved into a multi-million mobile communications player on the international stage since it was established in 1996 as a joint venture between electronics giant Royal Dutch Philips Electronics Ltd and SED. In 2007, its official buyout of Philip’s global mobile phone businessof Philips, backed by decades of knowledge transfer from the Dutch company, marked the beginning of a new chapter in Sang Fei’s history.

                                                                                                                Although it has retained the world-famous Philips brand for its mobile phone products, Sang Fei has stamped its own mark on the business. With an accumulated output exceeding tens of millions, its mobile phones are well recognized by both the industry and customers from home and abroad …

                                                                                                                Platform Qualcomm Snapdragon S1 [Google translation, Dec 26, 2011]

                                                                                                                … Five models are using Qualcomm Snapdragon S1

                                                                                                                • Coolpad 7260
                                                                                                                  [MSM7227T based with 800 MHz ARM11 processor, 4” display],
                                                                                                                • Hisense HS-U8
                                                                                                                  [MSM7227A based with Cortex A5 processor],
                                                                                                                • ZTE V889D
                                                                                                                  [MSM7227A based with 1.0 GHz Cortex A5 processor, 4” display],
                                                                                                                • Huawei U8818 [MSM7227A based with 1.0 GHz Cortex A5 processor, 4” display] and
                                                                                                                • Philips [Sang Fei] W635 [MSM7227A based with 1.0 GHz Cortex A5 processor, 4” display]. …

                                                                                                                [i.e. Lenovo A750, TCL A996 and Amoi N89 are not:

                                                                                                                • Lenovo A750 has MediaTek MT6575 SoC with a 1.0 GHz Cortex-A9 core and HSPA+ support, and 4” display
                                                                                                                • Amoi N89 quite probably has MediaTek MT6575 SoC with a 1.0 GHz Cortex-A9 core … as well
                                                                                                                • TCL A996, meanwhile has the following specifications:
                                                                                                                • Network standard: GSM / WCDMA
                                                                                                                • Size: 123 × 65.5 × 12.9mm
                                                                                                                • Screen: 4.0 inch IPScapacitive screen resolution of WVGA (480 × 800)
                                                                                                                • Battery Capacity: 1500mAh
                                                                                                                • Standby time: 300 hours
                                                                                                                • Talk time: 4 hours
                                                                                                                • Operating System: Android 2.3
                                                                                                                • Processor: [Broadcom ARM11-based] BCM 21552
                                                                                                                • Memory: RAM 512MB/ROM 512MB, support Micro SD expansion (up to 32GB)

                                                                                                                image_thumb9[1]]

                                                                                                                TCL increases smartphone sales 24x to over 1 mln units [Dec 9, 2011]

                                                                                                                Chinese handset maker TCL shipped 1.1 million smartphones as part of the 39.15 million units of mobile phones and other products it sold in January-November, 24 times more than the 42,384 smartphones it shipped in the year-earlier period, when total product shipments stood at 39.15 million units. Due to the increasing popularity of handsets that carry social networking functions, the group continued to launch more Facebook phones, strengthening its brand reputation and expanding market share. In November, FrenchTelecom-Orange announced that it would launch the first of three new phones featuring a Facebook key, the Alcatel One Touch 908F. TCL said that the Alcatel phones with Facebook keys are set to be launched across Africa and Europe before the end of the year. TCL, which produced the Vodafone 555 Blue phone as a white-label product, expects its Alcatel One Touch branded phones to raise the product mix towards higher revenue-earning smartphones. TCL is also involved in future mobile technologies, including Terahertz spectrum (0.1-10THz). Still not fully utitilised, the band is being considered in China where TCL has produced a phone supporting THz communications, the Xianguyn A919.

                                                                                                                Top TCL Executive Visits Taiwan’s Electronics Makers With Huge Procurement Hint [Dec 7, 2011]

                                                                                                                Taipei, Dec. 7, 2011 (CENS)–TCL Corp. Chairman and Chief Executive Officer Li Dongsheng said his company will not limit spending on procurements of Taiwan’s electronics products when recently visiting some Taiwanese electronics heavyweights, including chip vendor MediaTek Inc.

                                                                                                                TCL, currently the world’s 25th biggest producer of household appliances, plans to ship 12 million LCD TVs and 50 million mobile phones in 2012. Industry executives estimated the company to budget more than US$1 billion for sourcing Taiwan’s electronics products next year.

                                                                                                                Among Taiwan’s contract suppliers on TCL’s outsourcing lists are MediaTek Inc., AU Optronics Corp. (AUO), and Chimei Innolux Corp. Li visited MediaTek’s and AUO’s Taiwan headquarters a few days ago. He said his talk with MediaTek Chairman M.K. Cai mainly focused on cooperation over smartphone development.

                                                                                                                However, both AUO and MediaTek executives declined to comment on the meetings.

                                                                                                                TCL is now MediaTek’s biggest customer, purchasing up to 30 million mobile phone chipsets from MediaTek in 2010. Li touted that TCL is already among the mainland’s first-tier handset makers, shipping around 45 million systems in 2011. The company shipped 36.2 million mobile phones in 2010.

                                                                                                                Taiwan’s industry executives noted that TCL is also one of MediaTek’s major customers of TV chips. TCL has reportedly designed MediaTek MT6573 chip, MediaTek’s first 3.75G 3.5G smartphone chip unveiled early this year, into its mobile phones. MediaTek’s 3D TV chip launched early this year has also entered into TCL TVs.

                                                                                                                Handset chips and TV chips have accounted for over 90% of MediaTek’s revenue.

                                                                                                                Li pointed out that unlike tepid LCD TV demands in Europe and North America, the mainland’s LCD TV market will grow at least 10% in 2011. He estimated the mainland to turn out a total of 90 million LCD TVs throughout this year, with nearly half of which set aside for the mainland’s domestic market. Although TCL has secured supply of 30 million LCD panels with LCD maker BOE Co., Ltd. of the mainland, the volume is far short of its demand.

                                                                                                                Li stressed that his company has entered into cooperation with LCD maker AUO and several Taiwanese LED makers to ensure steady supplies for its TVs.

                                                                                                                Backend firms gearing up for new MediaTek solution [Dec 23, 2011]

                                                                                                                IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and substrate makers Unimicron Technology and Kinsus Interconnect Technology are all getting ready for the launch of MediaTek’s MT6575 single-chip solution, according to industry sources.

                                                                                                                The upcoming MT6575 will run at 1GHz – an upgrade from 650MHz that the predecessor MT6573 has – targeting growing demand for low-cost smartphones. MediaTek adopts the advanced 40nm process for its MT6575 chip line, and uses wire bonding instead of flip-chip packaging in the products for cost reasons, the sources indicated.
                                                                                                                [from: MediaTek MT6575 chips [are] using the new 40-nanometer process, compared with the previous generation chip [the] MT6573 [is] smaller, [the] single-wafer die production is up to 1,200 pieces, [which is] an increase of nearly 50%, [thus] help[ing to] reduce costs.]

                                                                                                                MediaTek has delivered samples of the new MT6575 solution for design-in to about 40 companies since December, the sources said. It expects to start shipping in volume to customers between January and February 2012, the sources noted. [from: first in December for a small amount of trial production, about 400,000 single month]

                                                                                                                Shipments of MediaTek’s MT6575 solution are likely to top 1.5 million units in January, and further expand to three million in February, the sources estimated. The anticipated boost in shipments will buoy sales at its backend suppliers in the first quarter of 2012, the sources said.

                                                                                                                ASE remarked at its most recent investors meeting that shipments would decrease 3-4% sequentially in the last quarter of 2011. Looking forward, fewer working days in January might affect the company’s sales performance, said ASE, without elaborating further.

                                                                                                                Kinsus has estimated flat sequential growth in fourth-quarter sales. Sales for the first quarter of 2012 would slide as a result of seasonal factors, the company said.

                                                                                                                From a MediaTek product document:

                                                                                                                MT6573(ap+modem+pmu) + MT6162(rf) + MT662(wifi,gps,bt,fm)

                                                                                                                MT6573: ARM11 AP, ARM9 Modem processor,HSPA。
                                                                                                                MT6573: 8 Mega pixel camera, OpenGL ES2.0

                                                                                                                MediaTek MT6573 is a highly integrated 3G system-on-chip (SOC) which incorporates advanced features like HSPA R6 modem, 650MHz ARM11 CPU, 3D graphics(OpenGL|ES 2.0), 8M camera ISP, LPDDR 400MHz, FWVGA(854×480) video decoder. MT6573 can helps phone manufacturers build high performance 3G smart phone with PC-like browser, 3D gaming and cinema class home entertainment experience.

                                                                                                                World-Leading Technology:

                                                                                                                Based on MediaTek’s world-leading mobile chip SOC architecture and 65nm advanced process, the MT6573 is the grand new generation smart phone SOC. It integrates the MediaTek HSPA R6 modem, 650MHz CPU, 3D graphics, FWVGA video decoder and power management unit.

                                                                                                                Rich Feature for High Valued Product:

                                                                                                                To enrich camera feature, MT6573 equips a 8M camera ISP with advanced features like auto focus, anti-handshake, continuous video AF, face detection, burst shot, optical zoom, panorama view and 3D photo.

                                                                                                                Incredible Browser experience:

                                                                                                                The 650MHz CPU brings PC-like browser experience and help accelerate OpenGL|ES 2.0 3D Adobe Flash 10 rendering performance to an unbeatable level.

                                                                                                                3G chip market opening price war or acceleration of intelligent mobile phone [Dec 15, 2011]

                                                                                                                … With MT6573 scenery, MediaTek then released their latest MT6575, treatment efficacy faster, as high chip MSM7227A. Frequency up to 1GHz, using ARM CortexA9, support for HSPA+. By comparison, MT6573 is inferior many, the chip using ARM11 AP processor frequency is 650 MHz, modem support HSPA speed of 7.2Mbps / 5.76Mbps. …

                                                                                                                MediaTek reiterates 4Q11 sales guidance [Dec 29, 2011]

                                                                                                                Following a report regarding falling feature phone and smartphone demand in China, MediaTek has said its sales guidance for the current fourth quarter should remain on track. MediaTek expects fourth-quarter sales to fall somewhere between a decrease of 2% to an increase of 5% sequentially.

                                                                                                                MediaTek’s consolidated revenues for October and November totaled NT$15.16 billion, already making up 62-66% of the company’s targeted NT$22.9-24.5 billion for the fourth quarter.

                                                                                                                Industry sources were quoted in a recent report suggesting a recent slowdown in chip orders from China’s handset market would imply an early arrival of the low season. Many Taiwan-based handset chip suppliers, which rely heavily on the China market, might report 5-10% sequential decreases in December revenues, the sources were quoted as saying.

                                                                                                                Qualcomm cuts chip prices for Chinese smartphones [Dec 25, 2011]

                                                                                                                Deep price cuts in new dual-core chips produced by American telecom equipment manufacturer Qualcommand used in smartphones produced in China could intensify competition between the company and Taiwan-based integrated circuit designer MediaTek.

                                                                                                                The move marks the beginning of a new round of price slashing, Gao Guiming, senior vice president of A’Hong Communication & Digital Information, told the Shanghai-based First Financial Daily.

                                                                                                                The US$7 reduction in the price of Qualcomm’s new dual-core chips will pit the company in direct competition with MediaTek in the market for smartphones priced at around 1,000 yuan (US$158). Gao pointed out that MediaTek remains a follower in the smartphone market and that Qualcomm’s price cut will force the Taiwanese firm to follow suit in order to expand its market share in China.

                                                                                                                Smartphone shipments in China reached 24 million units in the third quarter of 2011, surging 58% from the second quarter and leading the country to pass the US as the world’s biggest market for the devices, according to data compiled by research and consulting firm Strategy Analytics. Total sales volume in China is projected to expand to 153 million phones in 2012.

                                                                                                                Qualcomm’s latest price cut signals its plan to supply smartphone manufacturers with “public boards” designed for common use by various producers to quickly develop low-cost handsets.

                                                                                                                Qian Zhijun, product director at Qualcomm China, revealed at a summit on smartphones held in Shenzhen last month that his company’s new research and development center in Shanghai will help producers shorten the time needed to roll out new products. Qualcomm aims to use its QRD development platform to help producers put new models on the market within 30-60 days, compared with the more than six months required today.

                                                                                                                Sources at MediaTek say there is still no news about the company’s possible plans to cut prices in response. MediaTek president Hsieh Ching-chiang stressed in November that providing customers with low-cost customized chips has long been the company’s forte and that the smartphone sector will see little change.

                                                                                                                Hsieh implied that MediaTek still has an advantage over Qualcomm in terms of offering more comprehensive services to clients. He revealed that MediaTek has shifted most of its resources to the smartphone sector. Hsieh expects the company’s shipments of dual-core chips for intelligent handsets to double to 20 million sets in 2012.

                                                                                                                Liu Wenquan, an industry analyst based in Shenzhen, says an intense price war is unlikely in the near future as aggressive promotion by Chinese telecom service carriers has brought about skyrocketing demand for low-cost smartphones. MediaTek’s MT6573 chips are still in short supply, he said.

                                                                                                                Analysts said Qualcomm’s major targets in China are larger smartphone producers, not mobile phone copycats. Senior vice president Jeff Lorbeck stated that the QRD development platform will be open mainly to companies that have already won Qualcomm technology certification and authorization.

                                                                                                                Further, Qualcomm’s price still hovers about US$10 higher than similar products from MediaTek, which maintains the advantage of higher flexibility as well as closer and smoother communication with Chinese smartphone manufacturers.

                                                                                                                Gu Wenjun, an analyst at market research firm iSuppli, said the Chinese market is too big and diverse for any single chip supplier to maintain a dominant role. The best policy for Qualcomm and MediaTek is to take better care of their largest clients, he suggested. Smartphone manufacturers are expected to continue the policy of choosing two or even three core chip suppliers in order to produce a variety of smartphones to satisfy consumers’ tastes, added Gu.

                                                                                                                ZTE Skate [V960] Review CNET [cnetuk, Nov 23, 2011]

                                                                                                                In this video review, Amie Parker-Williams does a double take when she gets her mitts on the ZTE Skate, the identical twin of the Orange Monte Carlo. While the two phones may have been cast in the same mold in terms of design, the Skate thankfully comes without the Orange bloatware, and is better off for it. Hit play to take a closer look at this glossy Android blower.

                                                                                                                China Unicom Hopes To Sell Cheaper Phones Next Year [Dec 20, 2011]

                                                                                                                Chinese telecom operator China Unicom announced its strategic focus for 2012 and said it will focus on the sales of phones with the prices between CNY1,000 and CNY2,000.

                                                                                                                On December 12, 2011, China Unicom and ZTE, the Chinese telecom equipment maker, jointly launched a customized phone named Skate V960, which is recognized as a strategic productby Yu Yingtao, general manager for the sales department of China Unicom.

                                                                                                                Yu previously revealed during an interview that many manufacturers were developing phones with the prices between CNY1,000 and CNY2,000 and China Unicom will bring surprises to users in 2012. The company plans to introduce more cost-effective products then.

                                                                                                                Following the launch of Skate V960, other Chinese and International makers such as Huawei, Motorola, HTC, and Samsung will provide more options in this price range, said Yu. Products of this price range hold a 20% share of the market in China, which means a user group of about 50 million people. Therefore, China Unicom will cooperate with first-class makers in China and the world to meet the demands of these consumers.

                                                                                                                However, Yu pointed out that it does not mean the company will focus less on smartphones with prices lower than CNY1,000, because these products own 63% share of the market and more international brands expressed their intention to launch CNY1,000 smartphones. According to Yu, for the year 2011, China Unicom’s sales of CNY1,000 smartphones made by ZTE, Huawei, Lenovo, Coolpad, and Amoi is expected to be over 10 million units.

                                                                                                                ZTE SKATE [V960], Smart Choice, Bright Life [ZTEGlobal, Sept 22, 2011]

                                                                                                                ZTE Smartphone Sales Top 12M Units [Dec 13, 2011]

                                                                                                                ZTE Corporation (000063, 0763.HK) has met its 2011 annual sales target of 12 million smartphones, reports 163.com, citing company vice president He Shiyou. The companysold three million smartphones last year.

                                                                                                                He said ZTE is currently planning its 2012 sales target, and that there will be more than a doublingof the smartphone sales target.

                                                                                                                ZTE and China Unicom (600050, 0762.HK) jointly launched the Skate V960 smartphone priced at 1,499 yuanon December 12.

                                                                                                                The Skate V960 mobile phone was first rolled out in overseas markets, including Brazil, Spain, Hong Kong, Germany and the U.S., before its launch in the domestic market.

                                                                                                                He said ZTE will continue to cooperate with operators in terminal sales, and will develop other sales channels as well.

                                                                                                                ZTE Skate – Light your smart world [ZTEGlobal, Oct 13, 2011]

                                                                                                                ZTE V960 [= Skate] product page[translated by Google, Sept 23, 2011]

                                                                                                                  • Frequency range GSM: 900/1800/1900 UMTS: 900/2100 HSDPA: 7.2Mbps DL
                                                                                                                  • Chipset Qualcomm MSM7227-T [800 MHz]
                                                                                                                  • Size 126.5 * 68 * 11.2mm
                                                                                                                  • Weight 140g (with battery)
                                                                                                                  • Antenna comes with built-in antenna modeling straight memory
                                                                                                                  • Memory: 200 MB of available space is greater than the available expansion card memory MicroSD memory card expansion (up to 32 GB)
                                                                                                                  • The main screen 800 * 480 pixels, 262K TFT color screen, 4.3-inch external screen without camera
                                                                                                                  • 5M pixel camera take a picture: up to 2560 * 1920,
                                                                                                                  • Shooting video: up to 640 * 480
                                                                                                                  • Digital zoom: 1.6 times
                                                                                                                  • Battery Standard battery: Li-ion 1400 mAh
                                                                                                                  • Side keys (volume keys) with the keyboard menu, home, back
                                                                                                                  • Touch-screen full-touch capacitive touch-screen interface,
                                                                                                                  • Bluetooth extension, MicroSD card, USB 2.0 Full Speed
                                                                                                                  • SIM card insertion, 3V, 1.8V
                                                                                                                  • Stereo headphones with a microphone headset hands-free speaker with charger 5pin Micro-USB
                                                                                                                  • Sensor support gravity sensor, light sensor, proximity sensor

                                                                                                                China-based branded smartphone vendors to produce sub-US$100 models [Nov 3, 2011]

                                                                                                                China-based branded handset vendors including Lenovo, ZTE and Huawei Technologies are expected to venture into the production of smartphone models with a price tag of around US$100 in 2012 – a move which will add pressure on white-box vendorsin China as well as on upstream parts and components suppliers, according to industry sources.

                                                                                                                The China-based makers are responding to growing competition from foreign branded smartphones vendors including HTC, Apple and Samsung Electronics, which have recently expanded their product lineups for the entry-level and mid-range markets, the sources noted.

                                                                                                                Although HTC has refuted market rumors that it plans to launch smartphones for the US$100 segment, the sources said HTC has been trying to reduce its production costs by introducing models with comparable hardware specifications but running on different operating systems.

                                                                                                                Taking the HTC Titan and HTC Sensational XL for example, the hardware specifications of the two models are comparable, but the HTC Titan runs on Windows Phone platform, while the HTC Sensational XL is powered by Android 2.3.4.

                                                                                                                Apple’s launch of 8GB iPhone 4 and iPhone 3GS is also a vivid indication of the vendor’s ambition to expand its share in the entry-level and mid-range smartphone segments, the sources commented.

                                                                                                                Qualcomm competing with MediaTek in China market with price competition [Dec 6, 2011]

                                                                                                                In view of increasing adoption of the MT6575, a 1GHz chip solution developed by Taiwan-based MediaTek for use in 3G handsets and smartphones, by several China-based vendors and white-box clients, Qualcomm has lowered its quotes by keeping them close to MediaTek in order to strengthen its price competitiveness, according to China-based white-box vendors.

                                                                                                                Following selling the 650MHz chip MT6573 in the China market during early October peak sales period, MediaTek has begun offering the MT6575featuring mainstream a computing speed of 1GHz and four functions, GPS, FM, Bluetooth and Wi-Fi, in one chip. The specifications plus price and rich content available on MediaTek’s handset development platform have made M6575 strongly competitive in the China market, the sources indicated.

                                                                                                                Qualcomm has had its MSM7727 and MSM7727Acompete with MediaTek’s MT6573 and MT6575 respectively, the sources noted.

                                                                                                                Based on a general price level of about US$10 for a 3G handset chip, the MT6575 is competitive enough in price, the sources indicated. To be competitive, Qualcomm has to decrease prices because its quotes for 3G handset chip solutions are mostly higher than MediaTek by more than 20%, the sources pointed out.

                                                                                                                The competition for 3G handset chip solutions between Qualcomm and MediaTek will extend from China to emerging markets in 2012, the sources indicated.

                                                                                                                The new frontier in mobile computing: Q&A with Qualcomm EVP Steve Mollenkopf [May 31, 2011]

                                                                                                                Q: Convergence has been talked about for years, why is now such a critical time in the evolution of the market?

                                                                                                                A: If you look at the current market situation, there are there are three areas that have driven the industry to reach critical mass.

                                                                                                                First of all, advancements in semiconductor designhave substantially increased the amount of computing power that you be put into the small thermal envelope needed to efficiently power a mobile phone or portable device. What this means is that you can now put the same processing power in a smartphone or another type of handheld device that used to be in a notebook, and that is really opening up the market to new designs and usage models.

                                                                                                                The second thing that is shaping the current market is that the shift to next-generation mobile networkshas meant that a lot of data can be quickly delivered to – and enjoyed by – mobile devices, with multimedia and Internet content driving demand. High-speed 3G and 4G networks really enable an enormous amount of connectivity to occur with mobile devices.

                                                                                                                The third area where the market is really evolving is that the dynamics of the software markethave changed a great deal. Most developers used to focus on the PC ecosystem, and a major priority driving software vendors in the past was making sure that they maintained backward compatibility for their applications. If you look at the market now, most people are developing for smartphone platforms and those platforms are migrating up. This has broken the link of being encumbered by legacy applications. This phenomena is only going to accelerate even more as we move into cloud computing and most user data and applications end up being positioned somewhere in the cloud.

                                                                                                                So what this means is that currently there is a kind of perfect stormin the mobile environment that is bringing the best of all worlds together. It is really going to change the way mobile devices are used and it is also going to change the technology in them.

                                                                                                                Q: While users are expecting more from their mobile devices, system providers have to deal with more complexity, making it harder to quickly deliver products to market. Can you explain how Qualcomm can help enable its partners in this area?

                                                                                                                A: It’s true. What you see, particularly as you start moving into mobile computing is that the devices are very complex. For market players, this means that your solution needs to excel along many different vectors. It has to have a high-performing processor. It has to have a high-performing graphics engine. It has to have a high-performing modem. It has to be a high performing connectivity solution.

                                                                                                                Moreover, all of those areas need to be blended together in an optimal manner. It doesn’t make sense for a device to simply be a collection of assets. All the areas need to work properly together for that system to be a success. What that means for semiconductor solution providers is that you need to have all of these assets in house in order to best enable your customers.

                                                                                                                Really, when the complexity of the solution becomes quite high, it is going to be very difficult for many players to deliver that system solution efficiently and at the speed that is required in order to be competitive in the market. A lot of solution providers may excel in one area or another, but not really in all areas. This makes things more difficult for downstream system providers. What Qualcomm has endeavored to achieve is to try to excel across multiple vectors. We have been lucky in that we have had the scale to invest, to allow us to be successful.

                                                                                                                Q: Can you tell us a bit about your hardware features, especially Snapdragon?

                                                                                                                A: Referring back to Qualcomm being able to succeed across multiple vectors, the Snapdragon is a perfect example. One misconception many users have about Snapdragon is that it is a processor but Snapdragon is an integrated system. It doesn’t refer solely to the processor or to the graphics engine. It doesn’t refer to the connectivity assetsor the modem individually. It refers to all of them together in an integrated solution.

                                                                                                                Looking back at the first Snapdragon we did, which was really the first 1GhHz processor in a mobile phone; that was when we really began enabling the market with a much differentiated product relative to what the market had seen before. We are now on our fourth generation productand we will continue investing heavily in the platform as we move forward.

                                                                                                                In terms of processing on the ARM-based Snapdragon platform, we currently have a mix of the highest performance and lowest power mix in the industry with our 28nm versions of the device. On the network side, Qualcomm has always been known as a leading modem company and we integrate the modem into the processor. Together with the GPU, the SoC (system on chip) family of solutions delivers one of the most integrated solutions today. In addition to providing us with a leadership position, this is pretty important because it allows our partners to develop unique designs. For example, the first LTE smartphone from Verizon is built around our Snapdragon platform.

                                                                                                                And it is not just about hardware. A solution provider needs to be able to deliver software support as well. For example, currently we deliver Android over multiple chipsets at the same time. This is important because there are many tiers of devices, from high-end tablets down to entry level smartphones. With Qualcomm being able to deliver solutions that cover all market segments, we enable our partners to be competitive with a full range of products as well.

                                                                                                                We started talking about complexity and finished with integration, but integration is really just the ability to pull together many different types of technologies into one easily deliverable package, whether it is one physical package or one system solution tied together by one set of software. As the market progresses and becomes more complex, fewer companies can deliver on this. That is why Qualcomm is leading the way.

                                                                                                                Q: How does this level of integration help you enable your partners?

                                                                                                                A:Combining all the levels of integration in our family of solutions allows for more creativity for system houses. OEMs can spend their resources and investment in areas that help differentiate their products. It is a much more efficient way to deliver technology.

                                                                                                                In addition, our highly integrated solution actually expands the market by enabling more partners to participate in system design. By providing so much to our partners, we don’t limit our customer base to companies with very large engineering teams only. Many more companies are able to go to market with our products.

                                                                                                                Taiwan foundries cut prices 10-15% [Dec 30, 2011]

                                                                                                                Taiwan-based foundry service providers have cut their prices for wafers built on mature node processes to reflect lower production costs, according to sources at IC design firm. The move is also aimed to encourage customers to build inventory, the sources said.

                                                                                                                Some fabless IC firms tend to accept their foundry partners’ low-price offerings in consideration of their long-term relationships, the sources indicated.

                                                                                                                Chip inventories throughout the supply chain have actually been lowered to safe levels, the sources said. However, companies hold a wait-and-see attitude rather than restocking because of an uncertain business outlook, the sources pointed out.

                                                                                                                Inventories climbed to excessive levels between the end of the second quarter and the beginning of the third quarter, due to a combination of negative macroeconomic factors such as weak consumer confidence in the US and the European crisis.

                                                                                                                In other news, despite slow demand for mature process manufacturing, Taiwan Semiconductor Manufacturing Company (TSMC) continues to see orders heat up for advanced 28nm technology, according to sources at non Taiwan-based chip suppliers.

                                                                                                                Foundry orders losing momentum [Nov 22, 2011]

                                                                                                                Foundry chipmakers have seen short lead-time orders lose momentum, according to industry sources. Short lead-time orders were a key factor contributing to their revenue growth in October and better-than-expected results in the third quarter.

                                                                                                                A surge of short lead-time orders was previously expected to emerge around this time amid low inventories in the semiconductor supply chain, the sources pointed out.

                                                                                                                But fabless IC clients are now unable to meet order estimates placed earlier with the foundries, and have requested delivery to be delayed until after the first quarter of 2012, the sources indicated.

                                                                                                                Major foundry players including Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) might post double-digit sequential dips in revenues for the first quarter of 2012, due to a slowdown in orders, the sources said. Gross margin and operating margin for the quarter will also come under downward pressure along with their utilitzation rate declines, the sources added.

                                                                                                                But starting from the middle of the second quarter, foundries are expected to see orders pick upwith clearer order visibility, the sources believe.

                                                                                                                TSMC at its most-recent investors meeting estimated consolidated sales for the fourth quarter of 2011 would slip 1-3% sequentially. The firm reported higher-than-expected results for the third quarter driven short lead-time orders.

                                                                                                                UMC has guided wafer shipments for the fourth quarter would decrease about 10% sequentially with ASPs up 5%. It did not provide a revenue guidance.

                                                                                                                Both TSMC and UMC have not disclosed their revenue forecast for the first quarter of 2012.

                                                                                                                China market: Handset demand weak [Dec 26, 2011]

                                                                                                                Demand for feature phones in China has turned weaker than expected since the middle of October, according to sources at Taiwan’s LCD driver IC design houses. Smartphone demand in China is also slowing down recently, bringing further adverse impact to some firms’ sales performance, the sources indicated.

                                                                                                                The slowdown in orders reflects an early arrival of the low season, the sources observed.

                                                                                                                Many of Taiwan’s handset chip suppliers which rely heavily on the China market are likely to report 5-10% sequential decreases in December revenues, the sources estimated, citing falling demand from the region. Sales might further decline 10% or more sequentially in the first quarter of 2012, as a result of fewer working days during the long Chinese New Year holiday and seasonality, the sources noted.

                                                                                                                However, most of Taiwan’s handset chip designers will see their sales recover starting the second quarter of 2012 when China-based handset firms’ inventories will be low, the sources said.

                                                                                                                MediaTek likely to post higher revenues in December [Dec 21, 2011]

                                                                                                                Brisk orders from China-based smartphone vendors who are preparing for Lunar New Year sales campaignsare buoying MediaTek’s sales in December, according to industry sources. The IC design firm is expected to post sequential growth in consolidated revenues for the month, the sources said.

                                                                                                                The sources estimated MediaTek’s December consolidated revenues at between NT$7.7 billion (US$255 million) and NT$9.2 billion [US$305 million].

                                                                                                                MediaTek previously guided consolidated sales for the fourth quarter would be NT$22.9-24.5 billion, compared to NT$23.38 billion in the third quarter.

                                                                                                                MediaTek accumulated NT$79.36 billion [US$2,628 million] in consolidated sales from January through November, a 24.8% decline from 2010.

                                                                                                                MediaTek posts lower-than-expected sales in November [Dec 8, 2011]

                                                                                                                MediaTek has reported consolidated revenues grew 1.2% sequentially to NT$7.63 billion (US$252.9 million) in November. The figure came below market watcher estimates of NT$8.5-9.5 billion.

                                                                                                                MediaTek’s November sales were affected by its China-based white-box clients’ lower-than-expected smartphone shipments, according to industry sources. Shipments were disrupted by tight supplies of ambient light sensorsfrom Texas Advanced Optoelectronic Solutions (TAOS), the sources revealed.

                                                                                                                TAOS’ back-end operations in Thailandhave been suspended causing disruptions to its ambient light sensor shipments to customers, which also include brand-name consumer electronics vendors such as Apple, HTC and Nokia, the sources indicated. With its ambient light sensor availability becoming tight, TAOS is giving priority to orders placed by the first-tier brands, at the expense of those from second-tier and China’s white-box companies, the sources said.

                                                                                                                TAOS is unlikely to provide adequate supplies of its ambient light sensors by the end of 2011, which would continue to disrupt certain CE manufacturers’ deliveries, the sources noted.

                                                                                                                Previous reports quoted industry sources saying MediaTek had enjoyed brisk demand for its solutions targeting low-cost smartphones, and an influx of short lead-time orders from clients in China after the country’s National Day holidays.

                                                                                                                MediaTek sales to top NT$9 billion in November [Dec 5, 2011]

                                                                                                                Buoyed by an influx of short lead-time orders from handset clients in China, MediaTek will report better-than-expected sales results for November 2011, industry sources have said.

                                                                                                                MediaTek’s consolidated revenues are likely to top NT$9 billion (US$298 million) in November, hitting the highest monthly level for 2011, according to the sources. The company saw its sales decrease about 5% sequentially to NT$7.53 billion in October.

                                                                                                                MediaTek reportedly has enjoyed brisk demand for its MT6573 smartphone solutiontargeting low-cost smartphones. In particular, demand received a boost driven by orders from China during the country’s National Day holidays in Octonber, the sources observed. Next-generation MT6575 is scheduled to start shipping prior to Lunar New Year, the sources indicated.

                                                                                                                The upcoming MT6575 single-chip solution will run at 1GHz, an upgrade from 650MHz that its predecessor has, the sources revealed. In addition to white-box handset makers, a number of brand-name firms targeting the China marketreportedly will adopt the solution from MediaTek, the sources indicated.

                                                                                                                MediaTek previously reiterated that its sales estimate of NT$22.9-24.5 billion for the fourth quarter remains unchanged. The company posted consolidated revenues of NT$23.38 billion in the third quarter, up 11.4% sequentially but down 17.1% on year.

                                                                                                                Motorola increasing orders to Taiwan production partners, say sources [Dec 6, 2011]

                                                                                                                Motorola Mobility has been strengthening its ties with Taiwan-based handset ODMs and parts and components suppliers with procurements from those production partners to increase 10% sequentially in the second half of 2011 and to further expand by 10-15% in 2012, according to sources in the supply chain.

                                                                                                                Motorola’s increased orders to Taiwan production partners reflect a steady integration process between Google and Motorola as well as the vendor’s stepped-up efforts to launch new models, including the Razr XT910 flagship model [(Dec) TI OMAP 4430 based, with dual Cortex-A9 @1GHz], the high-end Milestone 3, [ME883 (July), XT860 (Sept) and ME863 (Sept) – all OMAP 4430 based, with dual Cortex-A9 @1GHz], the DEFY+ [MB526 (Sept) OMAP 3620 based, with Cortex-A8 @ 720 MHz] social networking phone and the entry-level XT319 [XT319 (Oct) with Qualcomm MSM7227T @ 800 MHz], in the fourth quarter of 2011, revealed the sources.

                                                                                                                Motorola’s ODM handset orders to Taiwan production partners are expected to total 11-13 million units in 2011, of which over 90% are feature phones, estimated the sources, noting that Taiwan ODMs may receive more orders for smartphones from the vendor in 2012.

                                                                                                                Motorola’s ODM partners include Arima Communications, Compal Communications and Foxconn International Holdings (FIH), while parts and components suppliers include Merry Electronics and Chi Cheng Enterprise.

                                                                                                                Merry has reported consolidated revenues of NT$880 million (US$29.1 million) for November, increasing 25.47% on month and 9.67% on year and representing the highest monthly figures in 47 months, according to a company filing with the Taiwan Stock Exchange (TSE).

                                                                                                                MediaTek, Spreadtrum, MStar sharing China market of handset chips [Dec 13, 2011]

                                                                                                                Taiwan-based IC design house MediaTek and MStar Semiconductor and China-based fellow company Spreadtrum Communications are sharing the market demand for handset chips, according to China-based white-box vendors of handsets.

                                                                                                                MediaTek, following victorious sales of its 3G chip MT6573 during the peak sales period in early October 2011, has launched 1GHz 3G chip MT6575 and received good market response, the sources pointed out. MediaTek’s shipments of MT6575 are expected to peak prior to the 2012 Lunar New Year in late January, the sources indicated.

                                                                                                                Spreadtrum has dominated the market segment of TD-SCDMA, China-developed 3G standard, chips, with shipments of TD-SCDMA chip SC8800G on the rise, the sources noted.

                                                                                                                While MediaTek and Spreadtrum have shifted focus to 3G chip solutions, MStar has focused on marketing of 2.5/2.75G chips with many new products, the sources indicated. MStar’s monthly shipments of 2.5/2.75G chips have climbed to 5.0 million units, more than triple the level in the first half of 2011, the sources pointed out.

                                                                                                                Currently, MediaTek has a market share of 60% for 2.5/2.75G chips, while Spreadtrum and MStar have those of 25% and 10% respectively, the sources noted.

                                                                                                                MStar reports on-year revenue growth for November [Dec 9, 2011]

                                                                                                                MStar Semiconductor has announced consolidated revenues of NT$3.25 billion (US$107.7 million) for November, down 4.4% on month but up 6.5% on year, according to a company filing the Taiwan Stock Exchange.

                                                                                                                For the first 11 months of 2011, revenues amounted to NT$32.52 billion [US$1,077.7 million], increasing 3.5% from a year earlier.

                                                                                                                MStar taping out 3.75G [?3.5G?] handset solutions in 4Q11 [Nov 9, 2011]

                                                                                                                Taiwan-based IC design house MStar Semiconductor will begin to tape out 3.75G [?3.5G?] handset solutions supporting TD-SCDMA and CDMA technologies soon with end market devices to hit the market in the first quarter of 2012, according to company chairman Wayne Liang.

                                                                                                                Shipments of handset solutions will increase 30-50% sequentially in the fourth quarter, pushing handset solution revenues to 15% of the company’s total revenues in the quarter compared to 10% in the third quarter, Liang predicted.

                                                                                                                Fourth-quarter revenues are expected to top US$311-329 million, up or down in a range of 3% from the previous quarter, Liang said at an investors conference. Gross margin will range 40-42% in the fourth quarter compared to 42.1% in the last quarter.

                                                                                                                Shipments of TV chips will drop slightly in the fourth quarter, and demand for TV chips is expected to continue growing in emerging markets in 2012, but the prospects in the US and Europe are still unclear, said Liang.

                                                                                                                MStar posted net profits of NT$1.62 billion (US$53.8 million) in the third quarter, up 7.2% sequentially. Third-quarter earnings translated into an EPS of NT$3.06 compared to NT$3.73 posted by rival MediaTek, according to data from the companies.

                                                                                                                China market: 2.5G handset chipset prices falling [Nov 24, 2011]

                                                                                                                Prices for 2.5G handset chipsets have slipped more than 10% in the fourth quarter of 2011, and will continue to fall at the same rate in first-quarter 2012 due to continued oversupply in the market, according to sources at white-box handset makersin China.

                                                                                                                With branded and white-box handset vendors shifting their focus to smartphones, demand for 2.5G feature phones in China is decelerating, the sources said. Taking sales during China’s National Day holidays last month as an example, supplies were tight for many top-selling smartphones while 2.5G devices were unremarkable, the sources indicated.

                                                                                                                As end-market demand began to fall, chipmakers including MediaTek, MStar Semiconductor and Spreadtrum Communications decided to lower their prices for 2.5G solutionsto stimulate demand and protect their market shares, the sources pointed out.

                                                                                                                Another cause of the intensified price competition is high similarity of products. MediaTek’s 40nm-made 2.5G chipset that comes with a high level of integration enabled the company to stand out from the crowd in the first half of 2011, when competition with rivals was less fierce, the sources said. However, with MStar and Spreadtrum both launching 40nm, highly-integrated solutions, competition has intensified leading prices to fall in the second half of the year, the sources noted.

                                                                                                                In addition, MediaTek, MStar and Spreadtrum have stepped up R&D efforts for the development of 3G WCDMA and TD-SCDMA chipset solutions, according to the sources.

                                                                                                                Motorola to adopt MediaTek solutions for WCDMA smartphones, says paper [Oct 14, 2011]

                                                                                                                Motorola Mobility will adopt MediaTek’s MT6573 solutions for its WCDMA-enabled smartphones, the Chinese-language Commercial Timescited Daiwa Securities analyst Chen Hui-ming as indicating.

                                                                                                                Motorola’s order volume to MediaTek is still unclear as it will depend on market demand during the upcoming Lunar New Year holidays as well as Motorola’s cooperation with China-based telecom carriers, Chen was quoted as saying.

                                                                                                                In addition, China-based Huawei Technologies is also likely to adopt smartphone solutions from MediaTek in early 2012, said Chen, but added that Huawei is going to buy MediaTek’s new 3.75G solution, the MT6575, instead of the MT6573. Huawei previously purchased most of its handset solutions from Qualcomm.

                                                                                                                MediaTek Pursuing Japan’s 4G Biz [Nov 30, 2011]

                                                                                                                … MediaTek President C.J Hsieh touted that MediaTek chipsets are not inferior to Qualcomm’s. MediaTek MT6573, for instance, supports EDGE and WCDMA specifications with its Bluetooth, LAN, GPS and FM wireless designs.

                                                                                                                The company plans to ship 20 million smartphone chipsets in 2012, 10 million more than its goal for 2011. Totally, the company will deliver 550 million chipsets for various types of handsets this year. The shipment increase comes against the backdrop of the forecast that global market penetration of smartphones will increase to 50% from 2011’s projected 30%.

                                                                                                                Hsieh believed that his company’s smartphone chipsets will be quickly flowing into global markets along with its mainland Chinese customers striving to ship mobile phones to Europe and North America.

                                                                                                                Orders for MediaTek 3.75G 3.5G smartphone chip soaring [Oct 13, 2011]

                                                                                                                China’s brand-name handset vendors, including Lenovo, ZTE and TCL, have ordered more MT6573 3.75G 3.5G smartphone chips from MediaTek, according to industry sources. To meet the continued rising demand, the fabless IC firm has asked for additional foundry capacity equivalent to 6,000-8,000 12-inch wafers from United Microelectronics Corporation(UMC), the sources indicated.

                                                                                                                Backend service providers including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), King Yuan Electronics (KYEC) and Sigurd Microelectronics are also pinpointed by the sources as beneficiaries of the increased orders.

                                                                                                                MediaTek released additional orders to UMC as well as Taiwan Semiconductor Manufacturing Company (TSMC) for foundry services in August – equivalent to a combined 25,000 12-inch wafers – to satisfy brisk demand for its MT6573 solution, which is gaining acceptance from the company’s principal customers in China, the sources revealed.

                                                                                                                MediaTek is expected to see monthly shipments of its MT6573 chipset solutions to reach 1-1.5 million units in October and November, and continue expanding to 3.5-4 million in December, the sources estimated. The growing shipments will boost the company’s sales in the fourth quarter of 2011, the sources said.

                                                                                                                In addition, acknowledging the MT6573’s popularity, Huawei Technologies reportedly is asking MediaTek to accelerate development of the chip’s successor, the sources said. Dubbed the MT6575, the next-generation single-chip solution could start shipping as early as the first quarter of 2012, the sources indicated.

                                                                                                                MediaTek shares closed up 2% at NT$336 (US$11.10) on the Taiwan Stock Exchange on October 13. The price scored the highest in eight trading days.

                                                                                                                In other news, ASE, SPIL, KYEC and Sigurd are likely to see their revenues for the fourth quarter of 2011 stay flat sequentially, the best-case scenario amid a global economic downturn, according to the sources. Orders from MediaTek as well as the depreciation of the NT dollar are seen as the major contributing factors.

                                                                                                                MediaTek asks for additional capacity from UMC due to increased orders for MT6573 chip [Aug 24, 2011]

                                                                                                                Due higher than expected orders for its MT6573 3.75G smartphone chip, MediaTek has asked for additional foundry capacity equivalent to several thousands of wafers from United Microelectronics Corporation (UMC), according to industry sources.

                                                                                                                MT6573 has been adopted by Lenovo and other China-based vendors because its FOB price of US$60-70is much lower than US$100-120 quoted by MediaTek’s competitors and functional performance is better, the sources said. Based on orders received, MediaTek will ship more than one million MT6573 chips in September 2011, with monthly shipments to increase to 2-3 million chips in November and December, the sources indicated.

                                                                                                                Due to the additional orders for foundry services, UMC has offered a 10% discount for all orders from MediaTek, the sources indicated. Similarly, MediaTek has asked Advanced Semiconductor Engineering and Siliconware Precision Industries to offer a 10% discount on IC packaging and testing services for the fourth quarter in exchange for additional orders, the sources said.

                                                                                                                MediaTek profits improve sequentially in 3Q11 [Oct 28, 2011]

                                                                                                                MediaTek has announced net income of NT$4.07 billion (US$135.38 million) for the third quarter of 2011, an increase of 22.4% from the prior quarter, but down 41.6% from the year-ago quarter. Third-quarter EPS were NT$3.73, compared with NT$3.05 in the previous quarter and NT$6.39 of a year earlier.

                                                                                                                Consolidated revenues amounted to NT$23.376 billion [US$777.6 million] in the third quarter, up 11.4% sequentially but down 17.1% from a year earlier. The on-quarter revenue growth was mainly driven by seasonality and the increase of handset sales volume.

                                                                                                                Third-quarter gross margin was 45.1%, or 0.8pps and 7.1pps lower than the previous quarter and the same period of last year, respectively, due mainly to decreased handset chipset prices.

                                                                                                                MediaTek 3.5G-chip shipments likely to hit 1 million mark in September [Sept 30, 2011]

                                                                                                                Shipments of MediaTek’s MT6573 3.5G chipset solution approached one million units in August, and are likely to exceed the mark in September, according to industry sources. Shipments have been fueled by roll-outs of new 3G handsets in China.

                                                                                                                Monthly shipments of MediaTek’s MT6573 chips are expected to reach 1.5 million units in the fourth quarter, and climb further to two million in 2012, the sources said.

                                                                                                                However, MediaTek has internally estimated that its sales for September will decrease slightly from August levels, the sources indicated. The company also maintained its revenue guidance for the third quarter at NT$22-23 billion (US$721.5 million-754.3 million), the sources revealed.

                                                                                                                The sources previously predicted that MediaTek’s September sales would post another on-month growth following the 16.3% sequential rise in August. But a number of clients in China had actually made advance orders, which constrained the company’s sales growth in September.

                                                                                                                MediaTek’s sales for the fourth quarter are set to decline about 10% sequentially, due to generally low order visibility, the sources said. The company has not given its outlook for the quarter.

                                                                                                                Lenovo places short lead-time 3G chipset solution orders with MediaTek, says paper [Sept 27, 2011]

                                                                                                                Lenovo has placed short lead-time orders for MT6573 3G solutions with MediaTek recently as the first batch of 500,000 units of its A60 smartphone, priced at CNY1,000 (US$156), have nearly sold out since the device launched in August, according to a Chinese-language Commercial Timesreport.

                                                                                                                Due to strong sales of the A60, other vendors in China, including ZTE, Huawei Technologies, and Beijing Tianyu Communication Equipment, plan to launch low-priced smartphones soon, with chipset solutions also coming from MediaTek, the paper said.

                                                                                                                MediaTek’s shipments of MT6573 chips are expected to top 1.2-1.3 million units a month prior to the arrival of the Lunar New Year holiday, which begins on January 22, 2012, added the paper.

                                                                                                                Short lead-time orders buoying TSMC sales [Sept 14, 2011]

                                                                                                                Taiwan Semiconductor Manufacturing Company ((TSMC) has disclosed that its consolidated revenues for the third quarter of 2011 are expected to exceed its guidance given in July, thanks to some “rush” orders from customers.

                                                                                                                Industry sources speculate that the short lead-time orders were placed by the foundry’s fabless clients including Qualcomm, Broadcom, MediaTek and MStarSemiconductor, which enjoyed rising demand for their smartphone solutions targeting China and other emerging markets.

                                                                                                                However, demand for smartphones coming from the Europe, Japan and US markets remain sluggish, the sources indicated. The major chip providers actually are bracing for unusual weak demand during the Christmas and year-end shopping season, the sources added.

                                                                                                                TSMC’s sales and utilization rate for the fourth quarter may come under downward pressure, as order visibility remains opaque, the sources said.

                                                                                                                TSMC reported NT$37.64 billion (US$1.29 billion) in consolidated revenues for August 2011, up 6.2% sequentially. Consolidated sales for July and August totaled NT$73.08 billion, already making up 69-72% of the company’s targeted NT$102-104 billion for the third quarter.

                                                                                                                LENOVO LePhone A60 [Sept 9, 2011]

                                                                                                                Price: USD169.00

                                                                                                                image_thumb9

                                                                                                                Specifications

                                                                                                                • Features
                                                                                                                  Android 2.3 / Capacitive / Dual-SIM Dual-stanby
                                                                                                                • Network
                                                                                                                  GSM + GSM or GSM + WCDMA, WCDMA:900/2100, GPRS/EDGE:900/1800/1900
                                                                                                                • Processor
                                                                                                                  MTK MT6573 650MHz / GPU PowerVR SGX 531
                                                                                                                • RAM
                                                                                                                  256MB RAM
                                                                                                                • Flash Memory
                                                                                                                  512MB ROM
                                                                                                                • Expansion Memory
                                                                                                                  Extend Memory up to 32GB micro sd card
                                                                                                                • Operating System
                                                                                                                  Androind 2.3
                                                                                                                • Languages
                                                                                                                  Multi-language: English, Chinese
                                                                                                                • Screen
                                                                                                                  3.5 inch 320x480pixels, Capacitive Multi-Touch screen
                                                                                                                • Video
                                                                                                                  rm,.rmvb,rv,.wmv,.mp4,.3gp,.asf, .m4v,.avi,.mov,.mpg.mpeg,.flv,.f4v,.asf,.mkv
                                                                                                                • Audio
                                                                                                                  RA, AAC, AAC+, MP3, WMA, WAV, OGG, MIDI, AMR NB,AU,AIFF, M4A, F4A
                                                                                                                • Peripherals Support
                                                                                                                  3.5mm Stereo Interface, Micro USB v2.0
                                                                                                                • Wireless
                                                                                                                  802.11b/g, Bluetooth, FM radio
                                                                                                                • GPS
                                                                                                                  Yes
                                                                                                                • Camera
                                                                                                                  Front: 0.3MP, Back: 3.2MP
                                                                                                                • Color
                                                                                                                  Black / White
                                                                                                                • Battery
                                                                                                                  1500mAH, 3.7V
                                                                                                                • Size & weight
                                                                                                                  116.5×60×13.2mm, 135 grams
                                                                                                                • Package Content
                                                                                                                  110-230V USB Charger, Battery, USB cable, Earphone

                                                                                                                MediaTek buoyed by rising demand for Lenovo smartphones [Sept 15, 2011]

                                                                                                                Brisk sales of Lenovo’s A60-series smartphone in China has been boosting MediaTek’s shipments of its 3.5G solution, the MT6573, according to market sources. Order momentum is expected to remain strong to sustain the chip supplier’s sales growth in September and the third quarter.

                                                                                                                The new Lenovo smartphone hit store shelves in China earlier in the third quarter, but has been selling well thanks to its rich feature set and affordable price point, the sources said. With demand outpacing supply, the A60 has been quoted at as high as CNY1,100 (US$172) by local channel operators, up about 30% from the just over CNY800 original priced, the sources indicated.

                                                                                                                Meanwhile, in view of the Lenovo A60’s rising popularity, China’s channel operators have released more orders for the device prior to China’s National Day holidays, the sources observed. The booming demand will simultaneously push up MediaTek’s sales generated from the orders placed by Lenovo, the sources said.

                                                                                                                MediaTek began to ship its MT6573 3.5G chipset solution to China in August. The company was quoted as saying in previous reports that it aims to ship 10 million 3G smartphone solutions in 2011.

                                                                                                                MediaTek has estimated consolidated revenues at NT$22-23 billion (US$743-777 million) for the third quarter of 2011. Sales grew 16.3% sequentially to NT$8.31 billion in August, and are expected to post another sequential growth in September.

                                                                                                                Market watchers now expect MediaTek to enjoy a more than 15% sequential increase in third-quarter sales, exceeding its guidance of 5-10% growth given previously.

                                                                                                                Spreadtrum increases TD-SCDMA chip orders to TSMC, says paper [Sept 29, 2011]

                                                                                                                China-based handset solution vendor Spreadtrum Communications will increase its orders for TD-SCDMA baseband chips to Taiwan Semiconductor Manufacturing Company (TSMC) in the fourth quarter of 2011, according to a Chinese-language Commercial Times report.

                                                                                                                Spreadtrum has avoided directly competing with MediaTek in the 3G and 4G segments and instead focuses on TD-SCDMA chips in cooperation with China Mobile. Spreadtrum currently holds 56% of the TD-SCDMA chip market in China, the paper said.

                                                                                                                The TD-SCDMA chips will be made on a 40nm process at TSMC, while Advanced Semiconductor Engineering (ASE) will handle the backend packaging and testing, said the paper.

                                                                                                                Handset solution vendors competing neck and neck in 3G smartphone market in China [Sept 13, 2011]

                                                                                                                Demand for smartphone solutions in emerging markets, particularly in China, is gaining momentum, pushing chipset vendors to compete neck and neck to grab a large piece for the growing market, according to industry sources.

                                                                                                                Qualcomm and MediaTek are both targeting the WCDMA solution market in China, and the two companies have landed orders from some branded handset vendorsin China, the sources noted.

                                                                                                                China-based chipset vendor Spreadtrum Communications has received orders for TD-SCDMA solutions from Samsung Electronics, while rival Taiwan-based MStar Semiconductor has ventured into the EDGE solution segment.

                                                                                                                Qualcomm’s launch of QRD (Qualcomm reference design) in 2010 paved the way for the company to gain more 3G solution orders in 2011, and the US-based solution vendor is expected to further enhance its market leadership with the launch of its next generation QRD, said the sources.

                                                                                                                HTC, a strong supporter of Qualcomm, also plans to strengthen its marketing in China in 2012which will also help Qualcomm expand its share in China’s smartphone market, the sources added.

                                                                                                                MediaTek has continued to exert efforts to reduce its production costs through integration of hardware, software, firmware and even applications, said sources, noting that MediaTek also reportedly plans to cut the prices of 3G solutions by 10-20% at the end of the third quarter in order to compete with Qualcomm’s forthcoming second-generation QRD.

                                                                                                                Meanwhile, MStar‘s shipments of EDGE solutions have reportedly reached over five million units a month recently and will soon become a growth driver for the company, the sources added.

                                                                                                                Smartphones moving toward hardware competition [Aug 30, 2011]

                                                                                                                The global market competition among iOS, Android, Windows Mango and BlackBerry platforms is expected to heat up in the fourth quarter as international vendors are going to launch flagship smartphone models, with hardware specifications expected to develop toward 1.5GHz dual-core processors, large screens over 4-inch, ultra-slim form-factors and supporting HSPA+download speeds of 21Mbps, according to Taiwan-based handset makers.

                                                                                                                Given some mid-range smartphones have already adopted 1GHz processors, the new flagship high-end smartphones are trended towards processors clocking at 1.2-1.5GHz, the sources noted.

                                                                                                                In addition to market speculation of dual-core A5 processors for Apple’s forthcoming iPhone 5, new flagship models from Samsung Electronics, HTC and Sony Ericsson will also be powered by dual-core CPUs, the sources added. However, Nokia and RIM (Research in Motion) are not expected to roll out dual-core models until 2012.

                                                                                                                HTC, Samsung and LG Electronics (LGE) are also expected to roll out models with display sizes ranging from 4.3- to 4.5-, or even up 4.7 inch, the sources indicated.

                                                                                                                Taiwan handset ODMs bracing for structural upheaval [Aug 23, 2011]

                                                                                                                Taiwan-based handset ODMs are bracing for repercussions of structural upheaval to be brought by Google’s intention to buy Motorola Mobility and Hewlett-Packard’s (HP’s) plan to stop selling WebOS-based smartphones, according to sources at Taiwan’s handset industry.

                                                                                                                Even before the announcements of the latest deals in the hectic smartphone industry, Taiwan-based handset ODMs have mostly failed to perform well due to lackluster sales of smarphones of their branded handset clients, including HP, Dell, Acer, Lenovo and even Motorola and Sony Ericsson, the sources noted.

                                                                                                                Although Taiwan handset ODMs have diversified their product roadmapsto include models supporting Android, Windows Mobile and WebOS platforms, their operations would still be affected by Google’s and HP’s stunning announcements, said the sources, adding that Compal Communications and Foxconn International Holding (FIH) are expected to suffer the most.

                                                                                                                While some handset ODMs have also ventured into the development of tablet PCs, shipment volume of tablets from those handset ODMs have been smaller than expected due to the dominance of the Apple iPad in the market, the sources pointed out.

                                                                                                                Handset vendors reportedly cutting back chipset orders for 4Q11 [Aug 19, 2011]

                                                                                                                Some handset solution suppliers have indicated that a number of handset vendors, including Apple and HTC, have scaled down their chipset orders for the fourth quarter as compared with the third on concerns of the global economy, according to sources at Taiwan-based chipset makers.

                                                                                                                While most smartphone vendors are likely to reach their shipment targets for the third quarter, they have begun to reduce orders for parts and components for the fourth quarter in preparation for a possible impact from changing economic conditions, the sources noted.

                                                                                                                HTC raised its internal shipment target for 2011 to 70 million units in the first quarter, from 50 million units it projected at the end of 2010. However, the company has recently revised downward the target to 50-60 million units, according to sources familiar with HTC’s roadmap.

                                                                                                                Sources in the supply chain of iPhone have revealed that Apple has also scaled down its orders for handset parts and components to be shipped at the end of third quarter.

                                                                                                                MediaTek to increase investment in 3G, says chairman [July 19, 2011]

                                                                                                                MediaTek will further strengthen its deployment in the global 3G chipset market by pouring more capital and resources into the development of platform products and application software, according to company chairman Tsai Ming-kai.

                                                                                                                Buoyed by rapid growth in applications for mobile connectivity, the 3G industry and market in China has been developing in a fast manner, and MediaTek aims to grow in tandem with China’s booming 3G industry, Tsai said at a WCDMA supply chain conference held by China Unicom in China recently.

                                                                                                                MediaTek will also cooperate with the WCDMA operators and makers of the WCDMA supply chain in China on technology development and marketingto accelerate the advancement of the WCDMA industry in China.

                                                                                                                MediaTek has offered its highly integrated MT6268 WCDMA solution plus multiple application software platforms to handset makers to develop and manufacture high performance WCDMA handsets.

                                                                                                                MediaTek to ship 3G solutions in August [July 13, 2011]

                                                                                                                MediaTek has confirmed that it will begin to ship its HSUPA solution, the MT6573, to clients in August, but the company declined to comment on market speculations that it has landed orders for a quantity of over one million units each from clients including Lenovo and ZTE.

                                                                                                                The specifications and performance of the MT6573, which is set to run on Android 2.3.3 platform, are similar to those chips adopted by Apple’s iPhones and HTC’s 3G smartphones, indicating that MediaTek has begun to make inroads into the global 3G chipset market, commented industry sources in Taiwan.

                                                                                                                Other China-based handset makers, including Ningbo Bird, China Tianx and Shanghai Ragentek Communication Technology, have also decided to adopt the MT6573 solutions, the sources added.

                                                                                                                Qualcomm likely to slash 30% off entry-level 3G solutions in next 9-12 months, says paper [June 16, 2011]

                                                                                                                Qualcomm is likely to slash its prices for 3G smartphone solutions by 30% in the next 9-12 months in order to prevent other chipset makers from grabbing its share in the entry-level 3G solution segment, the Chinese-language Commercial Times quoted Michael Chou, a semiconductor analyst with Deutsche Securities in Taipei, as indicating.

                                                                                                                More first-tier branded handset vendors are likely to adopt Qualcomm’s solutions for the production of entry-level and mid-range 3G smartphones in the next 12 months as Qualcomm has migrated the production of its chipset solutions to a 40nm processat Taiwan Semiconductor Manufacturing Company (TSMC), Chou said.

                                                                                                                Qualcomm’s price-cutting strategy will affect the performance of Asia-based chipset makers, including MediaTek and MStar Semiconductor. Deutsche Securities has recommended a sell rating on shares of MediaTek and a hold rating on MStar, said the paper.

                                                                                                                MT6573 Innovative Platform for Mainstream Smartphones [Feb 11, 2011]

                                                                                                                Overview

                                                                                                                The MediaTek MT6573 platform incorporates a highly-integrated core chipset, a full range of connectivity solutions and supports the latest versions of the popular AndroidTM operating system. The MT6573 platform supports a quad-band, 3G/HSPA modem with mobile broadband rates of 7.2Mbps in the downlink and 5.76 Mbps uplink, as well as quad-band EDGE. The integrated applications processing system combines a 650 MHz dedicated ARM®11 subsystem for the Android operating system; support for advanced 3D graphics; multi-format video capture and playback up to FWVGA 30fps; high-resolution camera support to 8MP and a high-end FWVGA, touch-screen display. This platform chipset is completed with a full range of connectivity solutions for Bluetooth, WiFi, GPS, FM and Mobile TV from MediaTek.

                                                                                                                Key Features

                                                                                                                • The core chipset of the MT6573 integrates the modem, applications & multimedia subsystem and all necessary power management functions into a single SOC.

                                                                                                                • Combined with a single-chip, multi-mode, multi-band transceiver, it enables extremely small footprints that allow for smaller, more innovative industrial designs and form-factors.

                                                                                                                • Additionally, the integrated 3D graphics capability brings gaming and user interface capabilities that were previously available only to high-end smartphones.

                                                                                                                • Finally, the platform provides for advanced camera and multimedia features that include smile and face detection, panorama and burst shot, as well as high-resolution video capture and playback.

                                                                                                                • The platform can be delivered as a full system solution consisting of hardware reference design and fully-tested, compliant software suite that can improve design efficiency and speed time to market for customers in the rapidly changing smartphone market.

                                                                                                                MediaTek’s newly announced MT6573 application processor integrates POWERVR graphics [March 8, 2011]

                                                                                                                New SoC brings advanced graphics to mass-market smartphones

                                                                                                                MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, and Imagination Technologies, a leading multimedia and communications technologies company, announce that MediaTek’s new application processor, features POWERVR graphics acceleration.

                                                                                                                The MT6573 incorporates a POWERVR Series5 SGX GPU (graphics processing unit) from Imaginationto enable advanced smartphone graphics applications including gaming, navigation and location-based services, augmented reality and highly visual and dynamic user interfaces for the mainstream volume phone market.

                                                                                                                MediaTek delivers innovative, feature-rich yet cost-effective solutions to meet consumer’s entertainment, communication and information needs. MediaTek is launching the MT6573 platform to address the accelerating demand for smartphones with features that can delight users at price points that meet the needs of operators in developed markets and consumers in emerging markets.

                                                                                                                Says Hossein Yassaie, CEO, Imagination: “We are delighted that MediaTek has delivered this highly capable new mass-market application processor, which will enable its customers to address new levels of capabilities and meet emerging consumer demands for advanced performance in lower-priced smartphones. We look forward to building on our strategic relationship with this important semiconductor partner.”

                                                                                                                Says Jeffrey Ju, General Manager of the Smartphone Business Unit at MediaTek: “MediaTek is committed to ensuring that wireless consumers across the globe can access the most advanced mobile technologies. Imagination delivers industry leading graphics technology and support, as well as an extensive and strong ecosystem of developers capable of utilising the technology. We are thrilled to have POWERVR graphics acceleration in MT6573, and the benefit of Imagination’s insight and experience as a strategic partner going forward.”

                                                                                                                MediaTek announced the MT6573 platform for mainstream 3G smartphones [Feb 11] (emphasis is mine):

                                                                                                                The MT6573 platform incorporates a highly-integrated, core chipset, a full range of connectivity solutions and supports the latest versions of the popular AndroidTM operating system. The MT6573 platform supports a quad-band [i.e.: all 4 GSM bands, the 850 and 1900 MHz bands – used in Americas – and 900/1800, used elsewhere], 3G/HSPA modem with mobile broadband rates of 7.2Mbps in the downlink and 5.76 Mbps uplink, as well as quad-band EDGE. The integrated applications processing system combines a 650 MHz dedicated ARM®11subsystem for the Android operating system; support for advanced 3D graphics; multi-format video capture and playback up to FWVGA 30fps; high-resolution camera support to 8MP and a high-end FWVGA, touch-screen display. The platform chipset is completed with a full range of connectivity solutions for Bluetooth, WiFi, GPS, FM radio and Mobile TV from MediaTek.

                                                                                                                The core chipset of the MT6573 integrates the modem, applications, multimedia subsystem and all necessary power management functions into a single SOC. Combined with a single-chip, multi-mode, multi-band transceiver, it enables extremely small footprints that allow for smaller, more innovative industrial designs and form-factors. Additionally, the integrated 3D graphics capability brings gaming and user interface capabilities that were previously available only to high-end smartphones. Finally, the platform provides advanced camera and multimedia features that include smile and face detection, panorama and burst shot, as well as high-resolution video capture and playback. The platform can be delivered as a full system solution consisting of hardware reference design and fully-tested, compliant software suite that can improve design efficiency and speed time to market for customers in the rapidly changing smartphone market.

                                                                                                                … The MT6573 platform is currently sampling to lead customers and will be in mass-production by mid 2011.

                                                                                                                TD-SCDMA: US$3B into the network (by the end of 2012) and 6 million phones procured (just in October)

                                                                                                                Updates: China government not expected to issue TD-LTE operating license for the time being [Jan 16, 2012]

                                                                                                                While China Mobile has been actively promoting TD-LTE, the China government is not expected to issue a TD-LTE operating license to China Mobile for the time being, according to industry sources.

                                                                                                                China Mobile finished initial TD-LTE trials in seven selected cities in China around the end of 2011 and has proposed a second-round of trials, but the China government has not yet approved the plans, signaling the government’s attitude to slow down promotion of TD-LTE in China, the sources indicated.

                                                                                                                This is because 3G mobile communication services are taking off in the China market and therefore the government does not want to issue a TD-LTE operating license out of consideration for China Telecom and China Unicom, the sources said.

                                                                                                                – China Outstrips U.S. in Smartphone Market [Nov 23, 2011]

                                                                                                                Deliveries of smart phones to operators and retailers in China grew 58% in the third quarter from the previous quarter to 24 million units. That surpassed 23 million units delivered to the U.S. market, down 7% from the previous quarter …

                                                                                                                Nokia Corp. had the largest share of China’s smartphone market in the third quarter, with 29%. … Samsung Electronics Co. Ltd. is chasing hard with 18% of the Chinese market …

                                                                                                                Strategy Analytics estimates that 57% of the world’s handsets were manufactured in China in 2010. … two of Nokia’s eight production facilities are based in China and the company said China is also one of its bigger suppliers of mobile handset components. …

                                                                                                                End of updates

                                                                                                                China Mobile Begins New Round of TD-SCDMA Procurement [Oct 12, 2011]

                                                                                                                China Mobile (NYSE: CHL; 0941.HK) recently began its fifth-round TD-SCDMA equipment tender. China Mobile will further expand its TD-SCDMA 3G network by deploying base stations in county-level cities and other key urban areas, with total base stations expected to reach approximately 300,000 by the end of 2012. Mobile network equipment vendors have received tender orders and will place bids this week.

                                                                                                                China market: China Mobile to expand TD-SCDMA network, says report [Oct 14, 2011]

                                                                                                                China Mobile will invest an estimated CNY19 billion (US$2.97 billion) to expand its TD-SCDMA network, adding 53,000 base stations around China, according to China-based media DoNews.

                                                                                                                China Mobile has established about 210,000 TD-SCDMA base stations around China, the report indicated.

                                                                                                                The second-round value was not disclosed only the following became known (China Mobile Releases TD-SCDMA Tender Results [Nov 17, 2011])

                                                                                                                The second round TD-SCDMA tender, with a scale 1.53 times that of the first round, involved 23,000 wireless base stations in 28 Chinese cities.

                                                                                                                The third-round had a value of RMB8.6 billion ($1.26 billion), see: China Mobile releases 3rd-round TD-SCDMA bidding results [May 11, 2009]

                                                                                                                According to China Mobile to Release Results of Phase Four of TD-SCDMA Tender [TD Forum, July 1, 2011]

                                                                                                                China Mobile is expected to procure around 102,000 base stations for the TD-SCDMA network in 101 cities, close to the total number in the previous projects.

                                                                                                                In the previous three TD-SCDMA network construction projects, China Mobile set up 108,000 base stations in total, with a combined investment of over CNY90 billion (USD13.16 billion).

                                                                                                                According to Winners of New TD-SCDMA Bid [June 9, 2010]:

                                                                                                                CMC has spent about 103 billion yuan ($15 billion) on three phases of TD-SCDMA construction so far. Insiders estimate the new round will cost about 90 billion yuan ($13 billion) based on the number of BTSs that will be 2.5 times over the previous phase. Actual spending may be different because more or less BTSs may be needed as project goes along. Previously, CMC announced a phase-down in capex to reach about 80 billion yuan ($12 billon) by 2012 from 123 billion yuan ($18 billion) in 2010, a reduction of 35% in three years.

                                                                                                                CMC’s goal is, after the fourth phase, TD-SCDMA coverage will be available in all major cities with improved signal quality and low drop ratio. However, user experience can be very different. Even in cities where the service is available people still complain about shaky connection and jagged video especially in moving vehicles or traveling toward the edge of city. CMC officials say an objective of fourth phase is to “replenish” blind spots in existing networks missed from previous phase, a weakness that has put CMC behind its rivals in quality of service.

                                                                                                                If everything goes smoothly, construction is expected to begin in August or September.

                                                                                                                According to Chinese vendors take 70% of [4th round] TD tender: report [July 28, 2010]:

                                                                                                                China Mobile has built out its network in 238 cities over the last two years. It spent 129 billion yuan ($19b) on its 2G and 3G networks in 2009-10 and this year expects to invest 123 billion yuan, of which 106 billion will go to its combined 2G/3G rollout.

                                                                                                                CMCC to Invest CNY 19bn to Construct TD-SCDMA Network [Oct 13, 2011]

                                                                                                                BEIJING, Oct 13, 2011 (SinoCast Daily Business Beat via COMTEX) — The insider disclosed on October that CMCC (China Mobile Communications Corporation) is to invest CNY 19 billion to construct TD-SCDMA network in different counties and important villages and towns in China.

                                                                                                                Meanwhile, the existing TD network topology in cities will be perfected. It is reported that CMCC plans to construct 53,000 new TD base stations. Through the first four phases of construction and continuous blind compensation, CMCC has constructed 210,000 base stations by the beginning of this year.

                                                                                                                The invitation for the bidding started from the later half of September and has entered into the crucial bidding returning stage at present. According to the requirements of CMCC, manufacturers have to return the tenders today.

                                                                                                                It is specially required by CMCC that the TD-SCDMA network to be newly constructed should be smoothly upgraded to TD-LTE network with the same frequency, namely, the TD-SCDMA network should be upgraded and evolved to the future LTE-frequency network in terms of wireless equipment, core network equipment, transmission and supporting facility at current frequency.

                                                                                                                Source: http://www.sina.com.cn (October 13, 2011)

                                                                                                                The current subscriber data (from the corresponding operators, till August 2011) is indeed showing that China Mobile TD-SCDMA needs a significant boost in the subscriber numbers:

                                                                                                                China - TD-SCDMA and W-CDMA 3G subscibers -- Aug-2011

                                                                                                                China Mobile had 627.628 million mobile subscribers as of August 31, 2011, and 40.318 million 3G subscribers, that is only 6.4% of the overall.

                                                                                                                China Unicom meanwhile had 186.1 million mobile subscribers as of August 31, 2011, and 27.868 million 3G subscribers, that is as much as 14.97% of the overall.

                                                                                                                China Mobile to purchase 6 million TD-SCDMA mobile phones [Oct 9, 2011]

                                                                                                                According to a notice issued to all mobile phone manufacturers , China Mobile has launched a new round of TD-SCDMA mobile phone purchases before National Day [Oct 1], and plans to purchase six million universal TD mobile phones.

                                                                                                                All procurement of universal TD handset

                                                                                                                A relevant mobile phone manufacturer said this purchase is called “universal G3 mobile phone” centralized procurement project, the procurement of universal G3 mobile phone estimates about 6 million, including 3.6 million low-end TV terminals , 2.4 million mid-end TV terminals.

                                                                                                                The mobile phone manufacturers received invitation to tender on the September 29th 16:00 to 18:00 and September 30 9:00-18:00 .

                                                                                                                The TD phones purchases maybe related to the fourth round TD-SCDMA network Construction. The construction is currently underway and will be extended to almost all cities of the country. In this case, the demand for TD mobile phones increased.

                                                                                                                Chipmakers are ready to support that:

                                                                                                                First real chances for Marvell on the tablet and smartphone fronts [Aug 21 – Sept 25, 2011]
                                                                                                                especially because: Kinoma is now the marvellous software owned by Marvell  [Feb 15, 2011]

                                                                                                                Spreadtrum is the other big player in that:

                                                                                                                China Mobile To Adjust Subsidies For TD-SCDMA Terminals [Oct 17, 2011]

                                                                                                                China Mobile (0941.HK) plans to adjust the subsidies given to buyers of its TD-SCDMA terminals in order to expand the pool of its 3G users following several unsuccessful attempts to introduce Apple Inc’s iPhone, reports yicai.com.

                                                                                                                Li Liyou, the C.E.O. of a TD-SCDMA chip maker [chairman of Spreadtrum], said the largest mobile operator in China has cut the procurement of TD-SCDMA terminals by two-thirds, and buyers of TD-SCDMA phones which are included under the operator’s list of TD-SCDMA phones will now be able to enjoy fee rebates.

                                                                                                                According to Li, 2012 will be the year in which GSM mobile phones are replaced by TD-SCDMA phones as the difference in production cost per phone is reduced to less than $2, and TD-SCDMA smartphones currently cost about $60 to make, and can be sold to customers at 700 yuan each.

                                                                                                                Procurement by China Mobile currently accounts for less than 30 percent of total TD-SCDMA terminal sales volume, said Gao Guiming, vice president of Changhong Communication and Digital Information.

                                                                                                                Spreadtrum Meets Milestone for China Mobile TD-SCDMA Grant [Sept 30, 2011]

                                                                                                                Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that in 3Q 2011 it has met the last major milestone of a TD-SCDMA research and development grant awarded by China Mobile to the Company in 2009.  This marks successful completion of the project and will enable the Company to recognize more than US$8 million in research and development grants as an offset to operating expenses in the third quarter of 2011, including subsidies recognized from both the China Mobile and other government projects. Spreadtrum’s TD-SCDMA customers include more than 30 global and domestic tier-1 manufacturers and design houses who have introduced more than 72 feature phone and smartphone models in 2011 using Spreadtrum’s baseband solutions.

                                                                                                                Spreadtrum now commands more than 50% market share of TD-SCDMA shipment volumes.  Dr. Leo Li, Spreadtrum’s president and CEO commented, “We are the clear leader in the feature phone and fixed wireless segments of the TD-SCDMA market, which account for the majority of industry shipments so far this year. Our 40nm-based single-chips with TD-SCDMA/EDGE/GPRS/GSM, multi-media and power management features have enabled customers building handsets on our platform to achieve breakthrough standby and talk times, at a retail price point that is attractive to 3G handset buyers.  We further expect to expand our footprint in the smartphone segment following the launch of our low-cost single-chip smartphone product.”

                                                                                                                Dr. Li added, “In addition to today’s news and in response to recent shareholder inquiries, we would like to provide additional clarification on our corporate structure.  Our primary operations in China are conducted through a wholly foreign owned enterprise (WFOE), distinct from the variable interest entity (VIE) structures that are common in the China Internet sector and that have been the subject of recent press speculation with regards to possible PRC or US government review.  There is no active investigation that we are aware of by either the China government or the US Department of Justice of our corporate structure or accounting practices, which adhere to conservative interpretation of US GAAP.”

                                                                                                                Spreadtrum Counts on Taiwan’s Chipmakers to Win 3G Battle In China [Oct 3, 2011]

                                                                                                                Spreadtrum Communications Inc. of mainland China has contracted Taiwan Semiconductor Manufacturing Co. (TSMC) and Advanced Semiconductor Engineering Inc. (ASE) to make its baseband chips designed on 40nm process rule amid white-hot competition among the mainland’s 3G chip vendors.

                                                                                                                Spreadtrum has commanded a 56% share of the mainland market for the wireless chips specifically designed for mobile phones that are built on the TD-SCDMA (time-division synchronous code division multiple access) 3G format, which is spearheaded by China Mobile Co., Ltd.

                                                                                                                The chip vendor recently completed a 40nm chip design, which it claimed consumes only two thirds of the electrical power that a 65nm chip does and brings down the cost of TD-SCDMA phone close to that of the 2.7G EDGE handset.

                                                                                                                Spreadtrum has designated TSMC to make the chips and ASE to package the chips for it in conjunction with China Mobile’s plan to promote TD-SCDMA handsets during the 2012 Chinese New Year holidays, which will begin on Jan. 23.

                                                                                                                The vendor will begin pilot production of its chips for the 4G TD-LTE (time division long term evolution) phones at the end of this year also at TSMC and ASE.

                                                                                                                Industry executives expect Spreadtrum to retain the championship in the mainland’s market for the TD-based chips given that it has shied away competition against Taiwan’s MedaTek Inc. for a slice on WCDMA (wideband code division multiple access) market, where competition is keener among chip vendors than on TD-SCDMA market. In addition to MediaTek, competitors in the mainland’s WCDMA market include MStar Semiconductor Inc., Qualcomm Inc. and ST-Ericsson Inc.

                                                                                                                The mainland now has around 100 million subscribers to 3G telecommunications service, which is mostly provided by China Telecom on CDMA2000 network, China Unicom on WCDMA network and China Mobile on TD-SCDMA network.

                                                                                                                Supply chain battles for much improved levels of price/performance competitiveness

                                                                                                                Current snapshot:

                                                                                                                Intel rejects 50% Ultrabook CPU price cut demand from notebook players [Aug 16, 2011]

                                                                                                                Intel’s Oak Trail platform, paired Atom Z670 CPU (US$75) with SM35 chipsets (US$20) for tablet PC machine, is priced at US$95, already accounting for about 40% of the total cost of a tablet PC, even with a 70-80% discount, the platform is still far less attractive than Nvidia’s Tegra 2 at around US$20. Although players such as Asustek Computer and Acer have launched models with the platform for the enterprise market, their machines’ high price still significantly limit their sales, the sources noted.

                                                                                                                As for Ultrabook CPUs, Intel is only willing to provide marketing subsides and 20% discount to the first-tier players, reducing the Core i7-2677 to US$317, Core i7-2637 to US$289 and Core i5-2557 to US$250.

                                                                                                                As for Intel’s insistence, the sources believe that Intel is concerned that once it agrees to reduce the price, the company may have difficulties to maintain gross margins in the 60% range and even after passing the crisis, the company may have difficulty in maintaining its pricing. Even with Intel able to maintain a high gross margin through its server platform, expecting Intel to drop CPU prices may be difficult to achieve, the sources added.

                                                                                                                Update: ASUStek seems to maneuver by far the best among them (special early ultrabook engagement with Intel, with popssible higher discount, in addition to exploiting the Tegra 2 opportunity best via the only successful so far EeePad Transformer):
                                                                                                                Asustek expects better business performance in 2H11 [Aug 17, 2011]

                                                                                                                Asustek Computer expects its performance in the second half of 2011 to be better than that of fellow Taiwan-based companies, according to CFO David Chang.

                                                                                                                Asustek is likely to hit record quarterly revenues in the third  quarter and is optimistic about business operation in the fourth mainly due to the launch of second-generation Eee Pad Transformer tablets and ultrabook notebooks, Chang said.

                                                                                                                Asustek aims at a 14% market share for notebooks in China, and
                                                                                                                became the largest vendor in Eastern Europe’s notebook market in the second quarter. In addition, Asustek is poised to make forays into Latin America, especially Brazil and Mexico.

                                                                                                                Asustek expects to ship 14 million notebooks and 4.5-5 million Eee PCs in 2011, Chang indicated. Asustek shipped 11.4 million motherboards in the first half and expects to ship 22.5-23 million for the year.

                                                                                                                Tablet players expected to cut price to digest inventory overstock [Aug 16, 2011]

                                                                                                                Non-Apple tablet PC players, facing the fact their devices are having weaker sales than their order volumes, while demand from the retail channel has been quickly shrinking, are expected to start cutting their tablet prices by the end of September to digest inventory and minimize losses, and the decisions are expected to trigger a new price war within the tablet industry, according to sources from notebook players.

                                                                                                                The sources pointed out that most non-Apple tablet players had weaker-than-expected performances and Asustek, which had a rather better performance, had shipments of 700,000 tablets from May to July with actual sales only reaching 500,000 units.

                                                                                                                RIM and High Tech Computer (HTC) are already placing their hopes in 2012 with Samsung and Motorola both seeing their tablet demand weaker than expected, while some other players such as Acer are gradually reducing their orders.

                                                                                                                Motorola, Hewlett-Packard (HP), Asustek and Acer have all recently reduced their tablet prices with the lowest price currently at US$370; however, with their inventory will become harder to digest, the sources believe there will be at least two waves of price cuts from the end of September to the year-end holiday, reducing the tablet average price level to US$350 and may even drop further to US$300 in the future.

                                                                                                                More: Acer & Asus: Compensating lower PC sales by tablet PC push[March 29, 2011 with updates upto Aug 2, 2011]

                                                                                                                AMD’s Bright Outlook Likely to Boost Taiwan’s Supply Chain [Aug 16, 2011]

                                                                                                                Taiwan’s IC supply chain is expected to benefit from good business performance of Advanced Micro Devices Inc. (AMD), which is projected to outperform archrival Intel Corp. in the third quarter with increased shipment of accelerated processing units (APUs).

                                                                                                                The Taiwan supply chin is mainly composed of manufacturers including foundry Taiwan Semiconductor Manufacturing Co. (TSMC), packager Siliconware Precision Industries Co., Ltd., tester STATS ChipPAC Taiwan Semiconductor Corp., and substrate maker Nanya Printed Circuit Board Corp.

                                                                                                                AMD estimates its revenue for the third quarter to rise 8-12% from the second quarter, compared with Intel’s projected 8% revenue growth. According to AMD, it has enjoyed robust APU shipments since the second quarter, with both its PC and laptop APU shipments hit new highs.

                                                                                                                AMD has contracted TSMC, currently the world’s No.1 pure foundry, to make its Ontario [C-series], Zacate [E-series], and Desna [Z-series, specific for tablet PCs, a power optimized version of C-series, which are also for ultra-thin notebooks: Z-01 of 5.9W vs. C-50 9W in both cases with two 1 GHz “Bobcat” CPU cores + 6250 GPU] processors using 40-nanometer process technology as well as its Hudson chips using 65nm process technology.

                                                                                                                While increasing foundry outsourcing to TSMC, AMD has augmented packaging and testing contracts to Taiwan’s providers as well. Nanya is also expected to land contracts via Japanese partner NGK Spark Plug, which has directly received substrate contracts from AMD.

                                                                                                                In the second quarter, AMD saw its revenue slightly dip 2% from the first quarter to US$1.57 billion, while its gross margin was 46%, up from 45% recorded in the first quarter this year.

                                                                                                                AMD Llano processor shipments reach 1.3-1.5 million units in July [Aug 4, 2011]

                                                                                                                AMD shipped about one million Llano [A-series, for mainstream notebooks, all-in-one PCs and desktop PCs: with up to four up to 2.9 GHz x86 CPU cores and with an integrated DirectX 11-capable discrete-level graphics unit that features up to 400 Radeon cores along with dedicated HD video processing on a single chip] APUs in June and 1.3-1.5 million units in July, and with the appearance of the company’s new Llano APUs in the fourth quarter, annual shipments of Llano in 2011 should reach 7.5-8 million units, according to sources from motherboard players.

                                                                                                                The sources pointed out that AMD is pushing its 40nm-based C series (Ontario) and E series (Zacate) APUs for the entry-level market, while it is pushing 32nm-based Llano-based APUs for the mid-range to performance and mainstream markets, and is pushing 32nm AM3+ FX series (Zambezi) processors for the high-end market in the fourth quarter.

                                                                                                                In 2012, AMD will launch a new APU series codenamed Krishna using a 28nm process from Taiwan Semiconductor Manufacturing Company (TSMC), targeting mini PCs, and all-in-one PCs with an APU series codenamed Trinity to replace Llano for the mainstream market, adopting a 32nm process from Globalfoundries. For the high-end market, AMD will launch an APU series codenamed Komodo.

                                                                                                                AMD shipping Llano APUs; prices leaked [May 23, 2011]

                                                                                                                AMD has started shipping its Llano APUs to notebook clients and will begin to market the APUs to channels in July 2011, according to sources from notebook makers.

                                                                                                                AMD targets to ship one million notebook-use Llano APUs in June, 1.5 million in July, and a total of 8-9 million for the whole of 2011, revealed the sources, citing AMD’s internal estimates.

                                                                                                                If the shipment goals are realized, AMD will be able to boost its share in the notebook CPU segment to 15% by the end of the year, the sources commented.

                                                                                                                Additionally, AMD will also launch six Llano and four Bulldozer APUs for desktops.

                                                                                                                AMD: Llano and Bulldozer APU prices (k unit)
                                                                                                                Core Model Price Competing Intel model
                                                                                                                Llano/quad-core A8-3550P US$170 Core i5-2300
                                                                                                                Llano/quad-core A8-3550 US$150
                                                                                                                Llano/quad-core A6-3450P US$130 Core i3-2120/2010
                                                                                                                Llano/quad core A6-3450 US$110
                                                                                                                Llano/dual-core A4-3350P US$80 Pentium G6960/6950 and Sandy Bridge G800/600
                                                                                                                Llano/dual core E2-3250 US$70 Pentium G620
                                                                                                                Bulldozer/octo-core FX-8130P US$320 Core i7 2600K/2600
                                                                                                                Bulldozer/octo-core FX-8130 US$290
                                                                                                                Bulldozer/6-core FX-6110 US$240 Core i5 2500K/2500
                                                                                                                Bulldozer/quad-core FX-4110 US$220

                                                                                                                More: Acer repositioning for the post Wintel era starting with AMD Fusion APUs[June 17, 2011]

                                                                                                                Apple cancels supply schedule of iPad 3 for 2H11 [Aug 16, 2011]

                                                                                                                US-based tablet PC players Apple has recently canceled its iPad 3 supply schedule for the second half of 2011, forcing other tablet PC brand vendors that are set to launch same-level product to compete, to follow suit and delay their launch; however, supply of the iPad 2 in the second half will still be maintained at 28-30 million units, according to sources from the upstream supply chain.

                                                                                                                Apple was originally set to launch its iPad 3 in the second half of 2011 with a supply volume of 1.5-2 million units in the third quarter and 5-6 million in the fourth quarter, but Apple’s supply chain partners have recently discovered that the related figures have all already been deleted, the sources pointed out.

                                                                                                                The sources believe that the yield rate of the 9.7-inch panel that feature resolution of 2,048 by 1,536 may be the major reason of the supply delay since such panels are mainly supplied by Japan-based Sharp with a high price and Apple’s other supply partners Samsung Electronics and LG Display are both unable to reach a good yield. Since Apple is unable to control a certain level of supply volume, the iPad 3 is unlikely to be mass produced as scheduled, the sources added.

                                                                                                                Sources from panel players also pointed out that the 9.7-inch panel with high resolution requires a much larger backlight source and a single edge light bar is hardly able to reach satisfaction levels. Due to iPad 3’s requirements over the physical thinness, rich color support and toughness will all conflict with the panel’s technology restrictions; therefore, this could cause a delay in the launch.

                                                                                                                In June, LG Display supplied three million panels for the iPad 2 with Samsung supplying 1-1.5 million units and Chimei Innolux (CMI) 10,000-20,000 units. In July, LG’s supply volume dropped to 2.8 million units with Samsung maintaining its same levels, and CMI’s volume increased to 450,000-500,000 units.

                                                                                                                Update: CMI fails to become iPad 3 panel supplier, say sources [Aug 19, 2011]

                                                                                                                Chimei Innolux (CMI) has failed to become a LCD panel supplier for the Apple iPad 3 due to technological hurdles, according to industry sources.

                                                                                                                CMI has cut into the supply chain of iPad 2, which uses IPS panels, but the new Apple tablet is more demanding in terms of resolution, the sources said. The iPad 3 will feature a 9.7-inch panel with resolution of 2,048×1,536 compared to the iPad 2’s 1,024×768.

                                                                                                                CMI has been developing panels trying to meet the iPad 3 specifications, but problems with transmittance and yield rates of the panels have resulted in its failure to receive certification for the iPad, the sources said.

                                                                                                                CMI began developing IPS panels last year after receiving license from Hitachi in July 2010. The license covers IPS, Super-IPS, Advanced-Super IPS, IPS-Pro, and IPS-Pro-Prolleza.

                                                                                                                CMI previously scheduled mass production of IPS panels to begin as early as the end of 2010 or early 2011. But low yield rates delayed the mass production until recent months. The maker’s IPS panel monthly output in July 2011 reached nearly 500,000 units. It is looking forward to an output of one million units in August 2011, the sources said.

                                                                                                                The sources noted that the iPad 3’s resolution requirement of 2,048×1,536 pixels is also a challenge even for iPad panel regular suppliers such as LG Display (LGD) and Samsung Electronics. Apart from the two Korea makers, Japan’s Sharp has als been selected to supply panels for the iPad 3, the sources said.

                                                                                                                They noted that CMI still stands a chance of becoming a regular supplier for iPad 3 if it can improve its panel quality to meet Apple’s requirements. The maker recently invested NT$800 million to NT$1 billion [US$28 million to US$35 million] to improve manufacturing facilities, the sources said.

                                                                                                                Chimei Innolux Continues Suffering Loss in Q2 [Aug 16, 2011]

                                                                                                                Chimei Innolux Corp., the largest maker of thin film transistor-liquid crystal display (TFT-LCD) panels in Taiwan, reported a loss of NT$13 billion (US$448.3 million) in the second quarter, deeper than institutional investors` forecast.

                                                                                                                Industry sources said that the four major makers of large-sized TFT-LCD panels, i.e. AU Optronics Corp. (AUO), Chimei Innolux, Chunghwa Picture Tubes, Ltd. (CPT) and HannStar Display Corp., together reported total loss of about NT$120 billion (US$413.8 million [US$4.15 billion]) in the past about one year.

                                                                                                                Some institutional investors said that the all-size panel prices are expected to fall slightly, implying that makers` losses in the third quarter would not be less than second quarter`s.

                                                                                                                At its recent half-year online shareholder meeting, Chimei adjusted down its capital spending to NT$50 billion to NT$60 billion (US$1.7 billion to US$2.1 billion) from NT$75 billion to NT$70 billion (US$2.6 billion to US$2.4 billion) lowered previously and NT$100 billion (US$3.4 billion) announced in early this year. Chimei said that this year the company would focus mainly on high-level equipment and R&D projects for touch-panel technology.

                                                                                                                AUO, Chimei Innolux`s major rival and the No. 2 panel maker in Taiwan, recently also adjusted down its capital spending goal to under NT$70 billion (US$2.4 billion) from NT$90 billion to NT$95 billion (US$3.3 billion to US$3.1 billion).

                                                                                                                Chimei Innolux is a merger between three companies, including Chi Mei Optoelectronics Corp. (CMO), Innolux Display Corp., and TPO Displays Corp. (TPO), formed in the second quarter of 2010, and began reporting loss starting the third quarter of last year that has continued for four seasons.

                                                                                                                AUO reported an accumulated loss of NT$36 billion (US$1.24 billion) in the past three quarters.

                                                                                                                Eddie Chen, Chimei Innolux`s chief financial officer, said that his company focused on shipments of core businesses and cut many system assembly works in the second quarter. The company`s second-quarter shipments of large-sized panels increased about 10% quarter-on-quarter (QoQ), but its revenue generated from small/medium-sized panels fell 18.4% QoQ due to the falling panel prices. J.C. Wang, president of Chimei Innolux`s Southern Taiwan Science Park (STSP) branch, pointed out that his company decided to cut system-assembly business because it takes too many labor forces and that`s not his company`s core competitiveness.

                                                                                                                Wang said that the third quarter is a traditional high season, but the market now seems relatively weaker than it should be. In the second quarter, Chimei Innolux`s capacity utilization rate was about 80%, the company said that it would adjust according to market conditions.

                                                                                                                LCD maker CPT still deep in red in second quarter [July 30, 2011]

                                                                                                                LCD panel maker Chunghwa Picture Tubes Ltd (CPT, 中華映管) yesterday reported its 12th consecutive quarterly loss as prices for slim-screen panels for televisions and computers dropped on sluggish end demand.

                                                                                                                The company added that outlook for the third quarter remained sluggish, with demand expected to fall below the seasonal norm.

                                                                                                                However, Chunghwa Picture said it has no plans to cut its capital spending this year of between NT$2 billion (US$69 million) and NT$2.5 billion, which would be used to improve its equipment to produce high-definition flat panels used in tablet devices and smartphones.

                                                                                                                Earlier this week, its bigger local rival, AU Optronics Corp (友達光電), said it planned to slash capital spending by 30 percent.

                                                                                                                In the quarter ending June 30, Chunghwa Picture’s losses widened to NT$3.13 billion [US$108 million] from losses of NT$2.33 billion [US$80 million] in the first quarter. The Taoyuan-based company posted losses of NT$1.5 billion in the second quarter of last year.

                                                                                                                “Market demand, especially for TVs and IT products [computers], slumped in the first half. Oversupply caused panel prices to drop further,” company president Lin Sheng-chang (林盛昌) said during a teleconference with investors.

                                                                                                                “As the visibility for IT panels is unclear, we will make inventory management our priority,” Lin said.

                                                                                                                Days of inventory increased to 37 days last quarter from 31 days in the first quarter, the company said.

                                                                                                                The fragile economic recovery in the US and Europe is expected to curtail demand for consumer electronics, while demand for notebook computers should pick up slightly after new models hit the shelves, Chunghwa Picture said.

                                                                                                                To combat these difficult times, Lin said the company would have to accelerate its shift to high-margin products, such as tablet panels, touch sensors and smartphone screens, in the second half.

                                                                                                                Its newly formed strategic partnership with the world’s biggest e-paper display supplier, E Ink Holdings Inc (元太科技), will help it reach this goal, Lin said.

                                                                                                                Last week, E Ink agreed to spend NT$1.5 billion [US$52 million] to subscribe to Chunghwa Picture bonds. Chunghwa Picture agreed to supply LCD panels to E Ink.

                                                                                                                Besides e-paper displays, E Ink also supplies high-definition flat panels to LG Display and tablet device makers.

                                                                                                                Shipments of LCD panels used in smartphones, tablets and consumer electronics should grow by 20 percent to 25 percent in the second half, from 200 million units shipped in the first half, Lin said.

                                                                                                                Last quarter, revenues from small-and-medium LCD panels used in tablets and smartphones accounted for a larger share, 42 percent, of Chunghwa Picture’s total revenues of NT$15.93 billion, from 37 percent in the prior quarter, according to the company’s financial statement.

                                                                                                                Chunghwa Picture also said it would terminate its money-losing cathode-ray-tube (CRT) business. The company plans to revamp its CRT factories in Malaysia and in Fuzhou, Fujian Province, and shift to touch panel assembly.

                                                                                                                HannStar posts operating loss [Aug 15, 2011]

                                                                                                                HannStar Display has announced unconsolidated results for second-quarter 2011, with total sales rising 10% sequentially to NT$1.15 billion (US$387.4 million). But it recorded an operating loss of NT$1.04 billion and a net loss of NT$ 1.57 billion [US$54 million], which was translated into a loss per share of NT$ 0.27.

                                                                                                                Gross, operating, and net margin in the second quarter were 7%, -9%, and -14% respectively. Earnings before interest, taxes, depreciation and amortization (EBITDA) was 1%.

                                                                                                                HannStar said the operating loss in the second quarter was the result of an effort to enlarge its manufacturing capacity in Nanjing, China, which cost it an extra NT$1.88 billion [US$65 million] in operation.

                                                                                                                Capacity utilization of HannStar was nearly full in second-quarter 2011. Small- to medium-size panels under 10-inch took up about 45% of its total revenues. Notebook panels accounted for 10% and monitor panels 45%.

                                                                                                                HannStar is expected to enhance notebook panels’ share to 15% and small- to medium-size panels to 55% in third-quarter 2011. Monitor panels’ share will be lowered to around 30%.

                                                                                                                HannStar expects small- to medium-size panels’ share to reach 60% by end of 2011 and notebook panels to grow to 20%.

                                                                                                                Explanatory excerpts from Pixel Qi’s first big name device manufacturing partner is the extremely ambitious ZTE [Feb 15, 2011, with updates up to June 3, 2011]

                                                                                                                to engage some of the largest factories that have ever been made, and for that to work their economics need very high volumes. We need to have customers who really commit to large purchase orders almost before we start to design.”

                                                                                                                The display business can be considered to be the worlds biggest non-profit industry, the 5 biggest LCD makers who produce 90% of the worlds LCDs, produce for $120 Billion in screens every year but can only make small profit margins out of that because of the strong competition and the large volumes shipped. Those companies that produce the worlds LCD screens have very high costs, very high risks, little flexibility.

                                                                                                                Next-gen Snapdragon S4 class SoCs — exploiting TSMC’s 28nm process first — coming in December

                                                                                                                Preliminary information: TSMC led foundries and their SoC customers against Intel [May 10, 2011]
                                                                                                                Qualcomm Snapdragon SoCs with a new way of easy identification [Aug 4, 2011]

                                                                                                                Updates: TSMC seeing tight capacity for 28nm processes [Nov 25, 2011]

                                                                                                                Taiwan Semiconductor Manufacturing Company (TSMC) continues to see orders heat up for advanced 28nm technology, despite a general slowdown in the semiconductor industry, according to industry sources. Order visibility has stretched to about six months, said the sources.

                                                                                                                TSMC is expected to see 28nm processes account for more than 2% of company revenues in the fourth quarter of 2011. The proportion will expand further to over 10% in 2012, as more available capacity coupled with rising customer demand boost the output, the sources indicated.

                                                                                                                Wafer output using 28nm processes is projected to top 20,000 units a month by the end of 2011, and will expand significantly in 2012 when new capacity at Fab 15 comes online, the sources noted. Fab 15, TSMC’s third 12-inch fab, will begin volume production in the first quarter of 2012, and ultimately raise its monthly capacity to the designed level of 100,000 wafers per month.

                                                                                                                Altera, AMD, Nvidia, Qualcomm and Xilinx have all contracted TSMC to manufacture their 28nm products. Broadcom, LSI Logic and STMicroelectronics reportedly are among potential clients for TSMC’s 28nm technology.

                                                                                                                TSMC chairman and CEO Morris Chang remarked during the company’s most-recent investors meeting that sales from 28nm process technology would play an important source of company growth.

                                                                                                                Smartphones, Microsoft Driving Qualcomm Business: CEO [CNBC interview, Nov 16, 2011]

                                                                                                                The popularity of smartphones and its partnership with Microsoft have been very good for Qualcomm’s chip business, CEO Paul Jacobs said Wednesday.

                                                                                                                Jacobs, speaking to CNBC after he met with analysts in New York, said a lot of Qualcomm’sgrowth is driven by the worldwide popularity of smartphones.

                                                                                                                He estimates four billion smartphones will be sold between now and 2015, and that means a lot of “traction with our chips, too, going in all sorts of designs.”

                                                                                                                The tablet market has been dominated by Apple’s iPad, but he said Microsoft will be using Qualcomm chips for a new touch-screen tablet.

                                                                                                                Microsoft has a lot of assets they bring to the table,” he said. “It’s a full computing environment, the kind we’re all used to. It’s gonna have Office and that kind of capability, those applications, but it’s got this really cool new touch interface, too.”

                                                                                                                That will allow Microsoft “to compete head to head” with Apple and other tablet makers.

                                                                                                                “The kinds of technology that go into a handset these days are amazing,” Jacobs added. “That stuff will go into Windows tablets” creating a “new kind of computing environment.”

                                                                                                                [A 6 minutes long video record of the interview included, which is worth to watch.]

                                                                                                                Qualcomm Unveils New Snapdragon Mobile Processors Across All Tiers of Smartphones and Tablets [Qualcomm press release, Nov 16, 2011]

                                                                                                                Qualcomm Incorporated (NASDAQ: QCOM) announced today the expansion of its Snapdragon S4 class of next-generation mobile processors and the enhancement of its Snapdragon S1 solutions for entry-level smartphones.

                                                                                                                The addition of new Snapdragon S4 processors, which are aimed at lowering design, engineering and inventory costs while bringing leading-edge 3G and 4G Internet connection speeds, will allow OEMs to introduce S4-based devices with next-generation mobile architecture throughout their respective device roadmaps—from basic smartphones to high-end smartphones and tablets. The enhanced S4 processors are also optimized for use with a suite of software solutions available from Qualcomm that help enable OEMs to deliver industry-leading feature sets for multimedia, connectivity, camera, display, security, power management, browsing and natural user interface design.

                                                                                                                The Krait CPU is the next generation of Qualcomm’s micro architecture and is purpose-built from the ground up for significant mobile performance and power management advantages leading to enhanced user experience and better battery life. The Krait CPU is an essential part of the Snapdragon S4 class of processors. Today, Qualcomm announced several new S4 chipsets, including the MSM8660A, MSM8260A, MSM8630, MSM8230, MSM8627, MSM8227, APQ8060A and APQ8030. These are additional chipsets to the previously announced MSM8960, MSM8930 and APQ8064. Snapdragon S4 MSM processors include Qualcomm’s leading-edge wireless modem technologies, including EV-DO, HSPA+, TD-SCDMA, LTE FDD, LTE TDD and Wi-Fi® standards. Devices based on Snapdragon S4 processors are expected to appear in early 2012.

                                                                                                                The Snapdragon S1 product line is driving smartphone growth in all regions, and it offers a significant opportunity for market expansion and migration to 3G. To further this trend, Qualcomm is also announcing an upgrade to four of its existing Snapdragon S1 mobile processors. The MSM7225A, MSM7625A, MSM7227A and MSM7627A have been upgraded to deliver better performance and will enable new mobile experiences for entry-level smartphone users, particularly those transitioning from 2G to 3G.

                                                                                                                Qualcomm Announces Snapdragon GameCommand Application and Exclusive Mobile Games for Android [Qualcomm press release, Nov 16, 2011]

                                                                                                                … announced today the expansion of its 100+ games Snapdragon GamePack and launch of a new showcase application — Snapdragon™ GameCommand™ — further bolstering the supply of console-quality and casual games for mobile devices featuring Snapdragon processors. The new gaming titles being introduced as part of the extended Snapdragon GamePack and the new Snapdragon GameCommand app are all expected to hit the Android Market in early 2012. Additions to the Snapdragon GamePack include several new, exclusive gaming titles that will be available through the Android Market, and which will initially be designed to operate exclusively on Android-enabled devices powered by Snapdragon processors. These titles include a number of high-end PC games …

                                                                                                                … says Raj Talluri, vice president of product management at Qualcomm. “With more than 60 percent of smartphone users regularly playing games on their mobile devices, the time is right to bring more console-quality and casual games to the Snapdragon platform. We are very excited to put our new Snapdragon GameCommand app and more great gaming titles in the hands of consumers in early 2012.”

                                                                                                                Qualcomm Announces a Bunch of Krait Based Snapdragon S4 SoCs [Anandtech, Nov 16, 2011]

                                                                                                                If you want an 8960 without integrated LTE, Qualcomm has an SoC for you: the MSM8x60A. The CPU specs are the same as the 8960, just without LTE support.

                                                                                                                Below the 8960 is the MSM8930, a dual-core Krait (up to 1.2GHz) offering with only a single LPDDR2 memory channel (up to 1066MHz data rate). The 8930 will actually use a faster GPU than the 8960, the Adreno 305, although it’ll be more memory bandwidth limited. The 8930 will also debut later than the 8960 partially due to its new GPU.

                                                                                                                The 8930 features LTE support, but if you want a version without it there’s the new MSM8x30. Similarly, if you want a version without an integrated baseband altogether there’s the APQ8030. The ISP in the xx30 series supports 1080p video decode and up to a 13.5MP camera (down from 20MP in the xx60 SoCs).

                                                                                                                There’s an even even more affordable S4 in the lineup: the MSM8x27. Here you get two Krait cores running at up to 1GHz, a single channel LPDDR2 interface (800MHz max data rate). Video decode is limited to 720p in the 8×27.


                                                                                                                [* the numbering change is: MSM8270 –> MSM8x60A]

                                                                                                                The APQ8060, MSM8x30 and MSM8x27 parts won’t be out until the latter part of 2012.

                                                                                                                Compare this to the Qualcomm Snapdragon S1-S2-S3 SoCs lineup in production as of 16-Nov-2011:

                                                                                                                Note that the Krate based Snapdragon S4 will come to the mass market smartphone SoCs in 2012, while the previous Scorpion based Snapdragons were only available in the premium smartphone segment only!

                                                                                                                Qualcomm announces Snapdragon S4 Liquid mobile development platform tablet on The Engadget Show, we go hands-on (video) [Engadget, Nov 16, 2011]

                                                                                                                Hands-On: Qualcomm SnapDragon S4 [ via Engadget, Nov 16, 2011]

                                                                                                                [Note the LTE speed shown as 40+ Mbps on download and 4.2 Mbps on upload.]

                                                                                                                At its investor conference earlier today, Qualcomm unveiled a variety of new Snapdragon processors to join its recently-announced MSM8960 S4 chip. But we got an exclusive first look at the 8960 in New York City this evening, in the form of a mobile development platform (MDP) tablet demo during The Engadget Show. The tablet the company had on hand isn’t much to look at — it’s not the slimmest we’ve seen, and it feels a bit clunkier than models destined for consumers — but its specs, which include an on-die LTE modem (the first of its kind — we were seeing download speeds of around 45 Mbps), dual 1080p cameras (and another two for 3D), seven microphones, a spattering of sensors and a handful of connectors make this the ultimate platform for Android developers. Not convinced? Join us past the break for a hands-on walkthrough with Raj Talluri, Qualcomm’s VP of Product Management.

                                                                                                                The Snapdragon S4 MDP tablet is one of the first we’ve seen from Qualcomm that’s sleek enough to function as a primary tablet, perhaps even for power-hungry consumers. It won’t be cheap, though pricing has yet to be announced, but for developers that need a comprehensive platform for testing their Android apps, there’s no question that this is an excellent option.

                                                                                                                The tablet packs a 10.1-inch 1366 x 768 (16:9) 10-finger capacitive multitouch display, with a 13 megapixel rear-facing camera with flash and front-facing 2 megapixel camera (both capable of 1080p30 video capture), along with another pair of rear-facing side-by-side cams, specifically designed for shooting 3D. On the audio front, you’ll find seven microphones and surround sound stereo speakers, which we hear sound great for everything from video chat to movie viewing. It’s currently running Gingerbread, but expect Ice Cream Sandwich in early 2012, with support for Windows 8 to come after that.

                                                                                                                As far as sensors go, there are dual 3D accelerometers, a three-axis gyro, compass, ambient light and proximity, a temperature and pressure sensor and a fingerprint reader. Dual independently-controlled linear vibrator motors provide haptic feedback. Memory includes 2GB of 400MHz LPDDR2, 32GB eMMC, and 1MB of SPI NOR flash. There’s also a removable 5200 mAh lithium ion battery, which should provide many hours of power when paired with the efficient S4.

                                                                                                                When it comes to controls, this is far from a single-button affair — there’s a combo volume / zoom rocker, a power button, screen rotation lock, home button and recessed reset button. External connectors include a docking station port, micro USB with MHL, a 3.5mm audio jack with ANC contacts, a DC-in charger port and a microSD slot. There’s also a full-size SIM slot and touch panel programming connector under the battery door, along with a Sensor Fusion expansion connector. The docking station adds a pair of full-size USB connections, HDMI, Ethernet, JTAG, QEPM, UART and another DC-in.

                                                                                                                Ready to start coding? Devs will need to wait until the first half of 2012 before getting their hands on Qualcomm’s latest S4 MDP tablet, but if today’s demo is any indication, it’ll be worth the wait.

                                                                                                                QUALCOMM Incorporated’s CEO Discusses Q4 2011 Results – Earnings Call Transcript — Q & A [Nov 2, 2011]

                                                                                                                … just want to get some more color on the 8960. As you move to 28-nanometer, it seems like a turnkey product for your road map in 2012. This product brand, how should we think about it as it impacts your ASP? Should we kind of have our normal seasonal price decline in March, but then, as 8960 ramps, your ASPs could kind of go up embedded in your guidance? Just trying to get some color on ASP. And then, if you can just give any color on 8960 in general, that’d be very helpful.

                                                                                                                Steven M. Mollenkopf: A couple of things. One is it’s progressing pretty much the way that we had hoped. So it’s on track for the dates that we talked about last call. We’ll see that build volume through really the mid-calendar year of ’12 and — as we’ve said before. So quite happy with how that’s looking both from a designing perspective as well as from the engineering side. We will — that will build throughout the year. We’re also taking the 28-nanometer process and we’re actually going to create a tier of products, which I think we’ve talked a little bit about before. On a high-end, more of a tablet-specific part as well as a mass market LTE product. So if you look at 28-nanometer in total through next year, or through this year, fiscal year ’12, you’ll see it build on the 8960, which I would consider to be a premium part, and then transition to a tiered road map pretty consistent with what we’ve done with other technology transitions as well.

                                                                                                                TSMC Accelerates 28nm Process Output [Nov 3, 2011]

                                                                                                                Taiwan Semiconductor Manufacturing Co. (TSMC) will start volume production at the first facility in its Fab 15 building earlier than originally scheduled, suggesting the foundry giant is competing to ramp up general production based on 28nm process technology.

                                                                                                                The facility is designed to have maximum monthly capacity of 50,000 wafers of tailor-made chips using 28nm process, making it the most advanced chip-making factory in the Central Taiwan Science Park.

                                                                                                                … 28nm foundry to account for 10% of the company’s revenue next year, up from current 0.5%. Industry executives estimated the percentage will rise to 2% by the end of this year thanks to volume production starting at the new facility.

                                                                                                                The second facility in the Fab 15 building is estimated to start volume production in the fourth quarter next year after being tooled up in the first quarter of 2012. Construction of the third and fourth facilities will start sometime next year and be completed in late 2013. The latter two factories are likely to be equipped with 20nm tools.

                                                                                                                Fab 15 calls for a total of NT$400 billion (US$13.3 billion at US$1: NT$30) in investment spending.

                                                                                                                TSMC 28nm Technology in Volume Production [TSMC press release, Oct 24, 2011]

                                                                                                                … and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28nm node.

                                                                                                                TSMC’s 28nm process offering includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use.

                                                                                                                The number of customer 28nm production tape outs has more than doubled as compared with that of 40nm. At 28nm, there are currently more than 80 customer product tape-outs. The TSMC 28nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers.

                                                                                                                “Qualcomm and TSMC have a long history of collaboration to bring to market the latest in mobile semiconductor technology on the most advanced silicon manufacturing processes, and we are excited to be introducing the first integrated smartphone processors at the 28nm node,” said Jim Clifford, senior vice president and general manager of operations at Qualcomm. “Most recently, Qualcomm’s work with TSMC yielded our Snapdragon™ S4 class of processors, including the Snapdragon S4 MSM8960™, a highly-integrated, dual-core SoC designed to reduce power in cutting-edge smartphones and tablets. The Snapdragon S4 class of processors are manufactured in TSMC’s highly sophisticated 28LP process, enabling Qualcomm to deliver the breakthrough combination of high performance and ultra low power to mobile devices.”

                                                                                                                Qualcomm’s New Snapdragon S4: MSM8960 & Krait Architecture Explored [AnandTech, Oct 7, 2011]

                                                                                                                Performance Expectations

                                                                                                                Performance of ARM cores has always been characterized by DMIPS (Dhrystone Millions of Instructions per Second). An extremely old integer benchmark, Dhrystone was popular in the PC market when I was growing up but was abandoned long ago in favor of more representative benchmarks. You can get a general idea of performance improvements across similar architectures assuming there are no funny compiler tricks at play. The comparison of single-core DMIPS/MHz is below:

                                                                                                                ARM DMIPS/MHz
                                                                                                                ARM11 ARM Cortex A8 ARM Cortex A9 Qualcomm Scorpion Qualcomm Krait
                                                                                                                DMIPS/MHz 1.25 2.0 2.5 2.1 3.3

                                                                                                                At 3.3, Krait should be around 30% faster than a Cortex A9 running at the same frequency. At launch Krait will run 25% faster than most A9s on the market today, a gap that will only grow as Qualcomm introduces subsequent versions of the core. It’s not unreasonable to expect a 30 – 50% gain in performance over existing smartphone designs. ARM hasn’t published DMIPS/MHz numbers for the Cortex A15, although rumors place its performance around 3.5 DMIPS/MHz.

                                                                                                                The Adreno 225 GPU

                                                                                                                Qualcomm has historically been pretty silent about its GPU architectures. You’ll notice that specific details of Adreno GPU execution resources have been absent from most of our SoC comparisons. Starting with MSM8960 however, this is starting to change.

                                                                                                                The MSM8960 uses a current generation Adreno GPU with a couple of changes. Qualcomm calls this GPU the Adreno 225, a follow-on to Adreno 220. Subsequent Krait designs will use Adreno 3xx GPUs based on a brand new architecture.

                                                                                                                Architecturally the Adreno 225 and 220 are identical. Adreno 2xx is a DX9-class unified shader design. There’s a ton of compute on-board with eight 4-wide vector units and eight scalar units. Each 4-wide vector unit is capable of a maximum of 8 MADs per clock, while each scalar unit is similarly capable of 2 MADs per clock. That works out to 160 floating point operations per clock, or 32 GFLOPS at 200MHz.

                                                                                                                With Adreno 225 Qualcomm improves performance along two vectors, the first being clock speed. While Adreno 220 (used in the MSM8660) ran at 266MHz, Adreno 225 runs at 400MHz thanks to 28nm. Secondly, Qualcomm tells us Adreno 225 is accompanied by “significant driver improvements”. Keeping in mind the sheer amount of compute potential of the Adreno 22x family, it only makes sense that driver improvements could unlock a lot of performance. Qualcomm expects the 225 to be 50% faster than the outgoing 220

                                                                                                                While Adreno 225 is only Direct3D feature level 9_3 compliant, Qualcomm insisted that when the time is right it will have a D3D11 capable GPU using its own IP – putting to rest rumors of Qualcomm looking to license a third party GPU in order to be competitive in Windows 8 designs. Although Qualcomm committed to delivering D3D11 support, it didn’t commit to a timeframe.

                                                                                                                Final Words

                                                                                                                Qualcomm has had MSM8960 silicon back in house for the past 3 months and is on-track for a release sometime in the first half of next year. Assuming Qualcomm can deliver on its claims, performance alone would be enough to sell this chip. Improved power characteristics and integrated LTE baseband really complete the package though.

                                                                                                                The implications for a 1H 2012 MSM8960 release are tremendous. Android users will have to choose between a newer software platform (OMAP 4 running Ice Cream Sandwich) or much faster hardware (MSM8960). Windows Phone users may finally get a much needed performance boost if Microsoft chooses to standardize on Krait for its Windows Phone hardware refresh next year. End users will benefit as next year’s smartphones and tablets will see, once again, a generational performance improvement over what’s shipping today. LTE should also start to see much more widespread adoption (at the high end) as a result of Qualcomm’s integrated LTE baseband.

                                                                                                                Snapdragon S4 Processors: System on Chip Solutions for a New Mobile Age [Qualcomm 9 page long whitepaper, Oct 7, 2011]

                                                                                                                End of Updates

                                                                                                                With the introduction of Qualcomm Snapdragon SoCs with a new way of easy identification [Aug 4, 2011] came the realization on Qualcomm’s side that they should start to emphasize the SoC (system on a chip) aspect of their market leading chip products:

                                                                                                                … our current Snapdragon family of processors has grown to encompass over 15 different chips with feature sets that target mass market smartphones all the way through high end smartphones and tablets. And, although our Snapdragon chips are called processors, they are really system on chip solutions. Inside each Snapdragon chip are multiple hardware subsystems including CPUs, GPUs, modems, multimedia processors, GPS, DSPs, sensors, as well as advanced management software.

                                                                                                                And all of these components are integrated into a single small chip that is designed with mobile in mind. The result is that Snapdragon processors deliver outstanding performance and longer battery life. …

                                                                                                                From: A Simple Way to Identify Which Snapdragon System is Right for You [Tim McDonough Vice President, Marketing, Qualcomm QCT on Qualcomm’s blog: OnQ, Aug 3, 2011]

                                                                                                                Below is a simple technical overview of the four Snapdragon classes of chips with S1 to S3 being the current ones and S4 coming commercially in December this year:

                                                                                                                S4 class SoCs S3 class SoCs S2 class SoCs S1 class SoCs
                                                                                                                Up to 2.5 GHz Quad-core Krait CPUs Up to 1.5 GHz Dual-core Scorpion CPUs Up to 1.4 GHz Scorpion CPU Up to 1 GHz Scorpion CPU
                                                                                                                Adreno™ 225, 305, 320 GPUs
                                                                                                                Adreno™ 220 GPU Adreno™ 205 GPU Up to Adreno™ 200 GPU
                                                                                                                1080p HD video 1080p HD video 720p+ HD video Up to 720p HD video
                                                                                                                3G/LTE modem 3G modem – (HSPA+/1xAdv/1xEV
                                                                                                                DO/GSM/GPRS/EDGE)
                                                                                                                3G modem – (HSPA/DO/1x) 3G Modem – (HSPA/DO/1x)
                                                                                                                Information is not yet available Dual camera up to 16M pixels
                                                                                                                Stereoscopic 3D Kit
                                                                                                                Dual Cameras up to 12M pixels Single camera up to 12M pixels
                                                                                                                Information is not yet available gpsOne Gen8 gpsOne Gen8 gpsOne Gen 7
                                                                                                                Up to multiple USB ports USB 2.0 High Speed OTG (480Mbps) High Speed USB 2.0 USB 2.0

                                                                                                                Below one can find the latest information about the new class, first from the foundry partner TSMC and then from the SoC vendor Qualcomm itself.

                                                                                                                TSMC backs-off grand capex plan due to softening demand: 28nm ramp delayed [July 28, 2011]

                                                                                                                TSMC said in a conference call that its 28nm ramp had experienced delays due to customers deferring migration of chips to the next node due to the global economic conditions, rather than due to any fabrication issues.

                                                                                                                Chang also noted that 89 products had already been taped-out at the 28nm node all fully functioning and containing ‘satisfactory yields.’ The actual production ramp will take longer than expected due to the weakening macro-economic environment, as customers delay volume ramp plans until conditions can be seen to have improved.

                                                                                                                Taiwan Semiconductor Manufacturing CEO Discusses Q2 2011 Results – Earnings Call Transcript [July 28, 2011]

                                                                                                                Now, I’d like to report on our technology progress specifically first on 28-nanometer. We reported earlier that we had tape outs for 89 individual products and the tape out of each of those is on schedule. The first silicon of every tape out was fully functional would consistently satisfactory. In fact density reduction is on plan. The ramp of 28-nanometer however is taking longer than expected due to the softening economy and the demand outlook of 2011.

                                                                                                                Second item that I want to report on is that our close co-orporation ARM CPU core is allowing us to optimize our technology of ARM design. Recently in 28HP, which stands for 28 high-performance, we have delivered first industry silicon with higher speeds than any other computer using on. And in 28 HPM which tends to our 28 nanometer high-performance mobile we have enabled first tape out of even better performance.

                                                                                                                Taiwan Semiconductor Manufacturing CEO Discusses Q2 2011 Results – Earnings Call Transcript
                                                                                                                Question-and-Answer Session [July 28, 2011]

                                                                                                                … my fourth quarter is regarding 28-nanometer, you mentioned that 28-nanometer is taking a bit longer. Can you kind of describe if that is relate to just maturity of the process? Was it related to just customer not ramping the design that they have and you were previously, maybe previously expect them to ramp. And finally, how much of yourself do you expect to come with 28-nanometer for the second half or for the fourth quarter of this year?

                                                                                                                The delay of 28-nanometer is not due to their quality issue, actually we have regular tape out and it is unplanned. The July ramping is mainly because of softening economy for our customers, so customers delayed a tape out to us. So therefore, the 28-nanometer revenue contribution by the end of fourth quarter this year will be roughly above 1% of our total wafer revenue.

                                                                                                                … With the 28-nanometer, to what extent the ramp beyond Q4 is going to be driven by attracting new customers, or is that going to be just the volume ramp of these 70 to 80 tape outs that you have?

                                                                                                                No, we’re not counting on attracting new customers. Actually we have almost all of the major customers of the foundry business anyway, and all them are using, are planning to use or I should say, almost all of them are planning to use our 28-nanometer. And our tape outs would be 89 tape outs that I have mentioned a couple of times, I think equal to 10 times the combined tape outs of all of our competitors. So now, we’re not planning on, we’re not coming on attracting new customers on the 28-nanometer. And I believe that – the ramp up of 28-nanometer is mainly a function of demand and it will I think it ws both, in the December, this coming December and January we sharply there will be a inflection point in the ramp up curve.

                                                                                                                Can you give us some rough numbers on how much of your CapEx spend in the first half for 28-nanomter and how much you think you 28-nanometer CapEx spend will be in the second half of the year.

                                                                                                                This year we just revised the CapEx in 7.4, I can roughly tell you more than 2.5 billion will be on 28-nanometer, which is mainly on the first half of this year.

                                                                                                                … then further as I think about the fourth quarter significant utilization recovery, I guess that implies that it is in the middle node …

                                                                                                                we will have some 28-nanometer on fourth quarter as well.

                                                                                                                QUALCOMM Incorporated’s CEO Discusses Q3 2011 Results – Earnings Call Transcript [July 20, 2011]

                                                                                                                [Dr. Paul Jacobs, Chairman and CEO] During this quarter, we sampled our Snapdragon MSM 8960 chipset based on 28-nanometer process technology. The MSM 8960 is a dual-core solution which uses our next-generation micro-architecture called Krait with integrated multimode modem technology, including EV-DO, Dual-Carrier HSPA+ and both the TDD and FDD variances LTE.

                                                                                                                In June, we hosted our second annual Uplinq conference here in San Diego. The event was a success as it brought together industry leaders from across the ecosystem, including application developers, operators and device manufacturers. Our support of multiple operating systems is highlighted by keynote presentations delivered by HP, HTC and Nokia. The convergence of the mobile and computing ecosystem is accelerating as smartphones and tablets are becoming full-blown computing devices. Traditional computing device manufacturers are working on mobile devices, and developers are increasing their emphasis on mobile. According to Strategy Analytics, by 2012, the installed base of smartphones is estimated to exceed the installed base of PCs. Our collaboration with Microsoft to enable Windows 8 to run on our Snapdragon family of chipsets, including MSM 8960, further underscores a shift in computing.

                                                                                                                [Steve Mollenkopf, Executive VP and Group President* ] As Paul mentioned, we sampled the Snapdragon MSM 8960 ahead of schedule this quarter, which is the industry’s first multimode 3G LTE dual core chipset for handsets. This is the first of multiple 28-nanometer chipsets on our roadmap and it is designed to integrate seamlessly with our new connectivity solution, the WCN3660, which supports dual band WiFi, Bluetooth and FM and is optimized for smartphone and tablet devices. As we announced at Computex, the MSM 8960 will be the first processor in the Snapdragon family to power devices using Windows 8.

                                                                                                                The MSM 8960 and a broad platform of multimode 3G LTE chipsets on our roadmap will greatly expand the reach of LTE and take our high-performance high-efficiency designs to the next wave of smartphones, tablets and upcoming generations of Windows computing devices.

                                                                                                                Demonstrating our potential expanded opportunities that the Atheros acquisition provides, since the deal closed in May, we have launched the industry’s first FTC-certified WiFi system and package for microcontroller-based designs to enable machine-to-machine communications and introduced the industry’s lowest EPON solutions for broadband over fiber networks and the power grid.

                                                                                                                We are modestly increasing our R&D investments in the fiscal fourth quarter to support new process technologies, the commercialization of our expanding multi-core and LTE product offerings and to support multiple new customer opportunities. Our strategic focus on integrated system solutions, leveraging our modem application processor connectivity graphics and software leadership is working well, and we expect to see strong volume growth in the coming quarters. …

                                                                                                                * Since Sept’10 [the beginning of current fiscal year] Mollenkopf’s [only 41 years old, note that even Jacobs is only 48 years old] executive oversight responsibilities include not only Qualcomm CDMA Technologies (QCT), but also Qualcomm Internet Services (QIS) and Qualcomm MEMS Technologies, Inc [now also over Qualcomm Atheros]. (QMT) which is actually a stepping stone to become a COO as evidenced with case of Len Lauer [53] promoted  to COO role alongside with Mollenkopf’s promotion to president of QCT in April’08. The COO role became vacant when Lauer decided to move to Memjet in Dec’09 because of huge and quite rare opportunities to develop a new ICT power breaker. See more on that in The Memjet disruption to the printing industry [July 30, 2011].

                                                                                                                Important note: QCT’s full name of “Qualcomm CDMA Technologies” may easily be interpreted as narrowly related to CDMA mobile communications technology only. In fact QCT has an overall mobile communications/computing role described as:

                                                                                                                QCT offers comprehensive chipset solutions for all types of smart connected devices.

                                                                                                                … QCT offers solutions for CDMA, UMTS, GSM and LTE technologies, providing support for both 3G and 4G networks and devices. Complementing our offerings, Qualcomm Atheros, Inc., a wholly owned subsidiary of Qualcomm, offers a broad portfolio of additional wired and wireless technologies for the mobile, networking, computing and consumer electronics product segments.

                                                                                                                Our combined portfolio now features an expanded array of high-performance, end-to-end solutions ranging from Wi-Fi®, GPS, Bluetooth®, FM and Ethernet — to HomePlug™ Powerline and passive optical network (PON) technologies.

                                                                                                                All of our solutions and products are elegantly engineered for optimal performance and power consumption. And our system-on-chip solutions like Snapdragon™ bring together CPU, GPU, connectivity, multimedia and GPS technologies in a way that is redefining mobile possibilities for people everywhere.

                                                                                                                CEO’s background:
                                                                                                                At Qualcomm, Rise of Founder’s Son Defies Hazards of Succession [June 12, 2011]

                                                                                                                When Paul E. Jacobs took over from his father as chief executive of the chip maker Qualcommin 2005, mobile phones were just beginning their transition from tools for talking to hand-held computers delivering data and entertainment.

                                                                                                                “We talk about the future of computing being mobile, but I don’t feel that way,” said Mr. Jacobs, 48. “I feel the present of computing is mobile.”

                                                                                                                Mr. Jacobs has spent the last six years expanding Qualcomm’s business beyond his father’s tight focus on the digital wireless technology known as C.D.M.A. (code division multiple access)

                                                                                                                While Irwin Jacobs, 77, the M.I.T. professor and electronics wizard who founded the company in 1985 and retired in 2005, was known for his dogged defense of the company’s intellectual property, his son Paul is more prone to talk breathlessly about a connected world where mobile devices diagnose our illnesses, turn on our lights, control our thermostats and allow doctors to remotely monitor our health in real time.

                                                                                                                Last year Qualcomm dominated a diverse field of smartphone chip makers with 41 percent of the total market share in terms of revenue and nearly 61 percent of the market share for application processors used in smartphones powered by Google’s Android operating system, according to the market research firm Strategy Analytics.

                                                                                                                Qualcomm has a two- or three-year advantage in terms of integration,” said Stuart Robinson, an analyst at Strategy Analytics.

                                                                                                                The third of four sons, Mr. Jacobs took to computers early, learning to program in middle school on a Teletype terminal. Beginning in seventh grade he worked part time at Linkabit, another technology company founded by his father, which made communications equipment for the military. During college he worked summers at Qualcomm.

                                                                                                                “Another thing that my father did for me was that every summer I worked in another area of engineering, so that by the time I went to college, I had done almost every kind of engineering there was,” said Mr. Jacobs, who went on to earn a Ph.D. in electrical engineering at the University of California, Berkeley, where he focused on robotics.

                                                                                                                Mr. Jacobs enjoys talking about a world where chips spread out beyond the confines of smartphones. In this so-called Internet of things, everyday objects like TVs, dishwashers, running shoes, blood glucose monitors, picture frames, heart defibrillatorsand even Band-Aids have tiny chips or sensors that transmit information and communicate with mobile devices like smartphones and tablets.

                                                                                                                “The sensors are going to be on your body, they’re going to be in the environment around you,” Mr. Jacobs said. “You’ll go and step on the scale and the scale will automatically talk to your phone and keep track of your health.”

                                                                                                                Qualcomm’s purchase of the chip maker Atheros Communications for $3.1 billion, the company’s largest acquisition, expands Qualcomm beyond phones into tablets and home electronic devices. It moves the company closer to “fulfilling this vision that wireless is going to be embedded in the world around us,” Mr. Jacobs said.

                                                                                                                QUALCOMM Incorporated’s CEO Discusses Q3 2011 Results – Earnings Call Transcript
                                                                                                                Question-and-Answer Session [July 20, 2011]

                                                                                                                … then a question for Steve [Mollenkopf]. You said that yourself had to use 28-nanometer device. Realistically, how much of your overall mix do you think 28-nanometer should be in, let’s say, 2 quarters from now?

                                                                                                                28-nanometer, our first 28-nanometer device will really go commercial at the end of this calendar year so it really won’t show up until the next calendar year. We, however, are very optimistic about that device. We’ve had great success with it so far in terms of how it’s looking in the lab. I mentioned that we sampled that early, which is pretty rare for us and actually probably an indicator of how much priority is on that now as a company. I mentioned that we’ve added some additional OpEx in order to really — I think we’re pretty optimistic about that chip. We want to measure that we de-risk it as best as we can, but we expect that to be something really more in the middle of next fiscal year.

                                                                                                                … And then Steve, just on the market share on the application processor aside of the business. Can you talk a little bit about how you see Snapdragon market share shaping up over the next few quarters particularly as you get the 8960 into the market?

                                                                                                                As I mentioned in my comments, we saw from quarter-to-quarter, we saw 32% rise actually in our integrated AP chipsets. That’s really across tiers so we’re quite happy with how that’s looking. Looking forward, as you mentioned, the 28-nanometer devices do include integrated LTE as well as all the other modes and Wireless LAN. And I think what’s going to happen here in next year is at the top end of the portfolio, it’s going to be very, very important to have these high-end modems and connectivity integrated in very tightly with the apps process. We’re seeing significant amount of customer traction on this device, and that’s one of the reasons why we really kind of put the gas on it here in the fourth fiscal quarter.

                                                                                                                Steve, … how should we be looking at that for next quarter? Does it go back up again? You’ve been talking previously that when you get in the 28-nanometer at the end of the year going to next year, sort of now there were 8960 that we see that bounce back up again. So I want to make sure that we’re still — or just understand that the trajectory of that is going forward. I’m wondering that 120 to 125 MSMs next quarter. If those opportunities you’re talking about come through, would we see that impact next quarter?…

                                                                                                                … As we commented, we’re not, at this point, seeing a significant increase in the MSM volume. And as Steve noted, he’s stepping up his R&D because of some opportunities that we see here in the near term. … This is Steve. On the R&D investment, it’s really a combination of things. The majority of it is things that I would consider to be more onetime events in the sense that they are increases in terms of integration platforms that we use internally to develop the devices or tape-outs or things that you would do that accelerate the program because you’re confident in it or you have more confidence in it. We also, as we announced in the quarter, we announced a small acquisition, which closed in the September quarter that’s also now in the results or in the OpEx forecast as well. So very much on track in terms of how we guided you in terms of OpEx, op margin trajectory and what we expect. And then looking into next year, we tend to invest into units a little bit ahead of — more than one quarter ahead, I think, in terms of the volume ramp. So it’s really the products that we’re going to ramp in fiscal year ’12. [FY12 starts on Sept 26, 2011]

                                                                                                                … one more question on Krait. So you’re sampled and now shipping sometime next year beginning next year. You said it’s going to support one of the — I guess the integrated connectivity solutions from Atheros. My understanding was the Krait chips in general were going to have connectivity integrated directly on the dye. Can you verify do the MSM, the chipsets coming there, does it have connectivity capability that’s integrated on the dye? Doesn’t sound like it. And if it doesn’t, can you give us some feel for what your connectivity integration roadmap actually looks like going through, I guess, going into 2012 as you roll those products out?

                                                                                                                This is Steve. I’ll take the first part of the Krait question. Maybe ask Craig if he can handle the second part, probably better answers than I can give. But the 8960 device has, in addition to the application process of the GPU, all the modems, multi-mode modem functionality in GPS. It does have integrated wireless LAN. It is part of a digital dye, but the radio is actually outside of the device. We have, I think, a little bit different approach to integration than some of our competitors. And maybe, Craig, if you could provide a perspective on that would be great.

                                                                                                                Sure, this is Craig [Barratt]. Obviously, from my Atheros background, we’ve been on both sides of this debate. But one of the key things is the attach rate of Wi-Fi is really going up to very high levels pretty much in all smartphone and tablet platforms and there’s substantial benefits to integrating a significant part of the connectivity functions not just WiFi but also Bluetooth, FM. And as you know, GPS was being integrated actually for a long time. We can deliver much higher performance. There’s benefits in terms of reducing overall system-level power. The solution ends up contributing a much smaller increase in PCB size. So the solution area is smaller and that’s critical for more compact devices. And of course, I think there are benefits around cost as well. And so this is a trend that will fan out, I think, across many of the future MSM chips and other similar platforms in the future

                                                                                                                … then Steve, for you, on Snapdragon, there seems to be a lot of design activity ongoing as there has been for some time. Looking forward, do you think Snapdragon is best positioned for the smartphone or the tablet market? And maybe just give us your thoughts on how you see the tablet market x Apple evolving?

                                                                                                                … this is Steve. Perspectives on chipsets for tablets and phones. In some cases, the same device will be used for high-end phones that will be used for tablets. You’ve seen that in the market. And then in other cases, you may have a more specialized device. We have recently added both of those tiers into our roadmap. The difference between them may be a small amount of performance delta but also different interfaces that are required in a tablet, perhaps, than a phone depending on the class of tablet. In terms of the overall market, our perspective is quite bullish over the long term. If you look at mobile computing, we think that will really grow up and take a fairly significant share of the traditional laptop space really driven by the software that’s being driven on phones. That software is getting better every day and I think, as that happens, you’ll see I think a little bit more diversity in terms of supply base for suppliers into that market as well as the market itself growing. Both of those things being good things for Qualcomm and the industry.

                                                                                                                Nvidia Denies Plans to Release Kepler GPU in 2011 [Aug 4, 2011]

                                                                                                                Nvidia: Kepler-Based Products to Ship in 2012

                                                                                                                Nvidia Corp. on Thursday clarified its plans regarding the next-generation Kepler graphics processing units (GPUs) and their release timeframes. Apparently, the company is on schedule to receive the early silicon of Kepler from its manufacturing partner later in 2011, but the commercial launch of the product is scheduled to occur only in 2012.

                                                                                                                “Although we will have early silicon this year, Kepler-based products are actually scheduled to go into production in 2012. We wanted to clarify this so people wouldn’t expect product to be available this year,” said Ken Brown, a spokesman for Nvidia, in an email statement.

                                                                                                                TSMC reiterates plans to commercially produce 28nm chips later in 2011 [July 13, 2011]

                                                                                                                Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has said that its plans to start commercial production of chips using 28nm process this year remains unchanged. TSMC expects 28nm chips to start contributing to company revenues in the third quarter of 2011, and sales from the advanced technology will account for 2-3% of its total wafer sales in the last quarter of the year.

                                                                                                                TSMC also reiterated its target of 20% growth in 2011 consolidated revenues (denominated in US dollars).

                                                                                                                The remarks were made following speculation that launch of Nvidia’s Kepler GPU generation may be pushed back to 2012 due to manufacturing issues at TSMC. However, according to Nvidia, its schedule has not changed. It expect to begin production in 2011 with products based on Kepler being available in 2012. AMD’s upcoming Southern Islands GPU reportedly will have a similar schedule, industry sources have observed, with AMD also contracting TSMC to build the 28nm GPU generation.

                                                                                                                Nobunaga Chai, semiconductor analyst at Digitimes Research, has commented that any production transfer will need to go through a certain learning curve before the process attains satisfactory yields, and it is understandable that current yield rates for TSMC’s 28nm are not mature. Especially for performance-driven devices like GPUs, improving the yield rate would require more time than that for products with simpler architectures like FPGAs.

                                                                                                                However, TSMC should find it easier to improve its yields on 28nm compared to 40nm as the latter requires equipment upgrades, Chai said. The foundry previously spent about a year raising its 40nm process yields to a satisfactory level.

                                                                                                                Planned launch of Nvidia 28nm and 22/20nm GPUs moved back to 2012 and 2014 [July 8, 2011]

                                                                                                                Despite Nvidia CEO Huang Jen-hsun previously saying that the company is set to announce its new 28nm GPU architecture at the end of 2011 and 22/20nm in 2013, sources from graphics card makers have pointed out that Nvidia has already adjusted its roadmap and delayed 28nm Kepler and 22/20nm Maxwell to 2012 and 2014.

                                                                                                                The sources believe that the delay is due to unsatisfactory yield rates of Taiwan Semiconductor Manufacturing Company’s (TSMC) 28nm process. TSMC originally expected its 28nm capacity at Fab15 to be available in the fourth quarter of 2011 and was set to start pilot production for its 20nm process technology in the third quarter of 2012.

                                                                                                                However, TSMC’s other major client Qualcomm, currently, still has not yet adjusted its 28nm process schedule and is set to launch three new products, 8960, 8270 and 8260A using dual-core Krait architecture in the fourth quarter of 2011.

                                                                                                                Meanwhile, AMD will follow its original schedule and enter the 28nm era in the first half of 2012. The company’s next-generation graphics chips Southern Island as well as Krishna and Wichita processors, which will replace the existing Ontraio and Zacate processors, and will all adopt a 28nm process from TSMC.

                                                                                                                Qualcomm’s Chipset Roadmap: 1.7GHz Dual-Core + Adreno 225 for 2011, Quad Core for 2013 [July 5, 2011]

                                                                                                                Qualcomm Roadmap -- mid 2011

                                                                                                                Qualcomm looks just about set to make even more leaps in the chipset game to get them caught up with their competitors. A new roadmap spotted shows where Qualcomm’s headed with their plans in the next few years. For starters, we’ll be getting 1.5GHz to 1.7GHz dual-core chipsets near the end of this year which are expected to make its way into phones in Q4 2011 or Q1 2012. It’ll have an Adreno 225 which is said to rival the GPU powering the Playstation Vita.

                                                                                                                Next up is a bit more of the same. The 8230 and 8930 are both set to be dual-core offerings with their cores clocked anywhere between 1GHz and 1.2GHz, depending on what the manufacturer wants. The biggest difference will be in the graphics department where phones will be powered by Adreno 3 (305, to be specific) which will take us far beyond the possibilities of the Playstation Vita and more into the realm of the Xbox 360 or the Playstation 3.

                                                                                                                Finally, 2013 will bring us their quad-core beasts with chipsets ranging from 2.0GHz to 2.5GHz in clock speed and an Adreno 320 GPU. Needless to say, I’m ready to throw the power of a mid-range gaming computer into my front pocket.

                                                                                                                These all sound very good, but when you think about how far along their competitors are, you start to wonder if their efforts will matter in the coming years. I’m mainly talking about NVIDIA, who has their quad-core Kal-El Tegra 3 chipset coming later this year. To be fair, they are in line with Samsung and are actually ahead of Texas Instruments in the chipset games when it comes to technological advances. Still, quite a long wait between now and 2013.

                                                                                                                Qualcomm roadmap reveals quad-core, 2.5GHz ARM CPU [July 6, 2011]

                                                                                                                Now, a July 5 posting by MobileTechWorld.com author Makran Daouprovides additional information about the MSM8960, tips a lower-end version called the MSM8930, and reveals the MSM8974 — apparently an even-more-powerful version of the APQ8064. The details are said to have come from a leaked Qualcomm document, a link to which the company’s legal department subsequently asked Daou to remove.

                                                                                                                The MSM8960 and APQ8064 were first announced in February, at which time Qualcomm touted the fact that it had employed its ARM architectural license to develop original processor cores. The company’s homegrown architecture, codenamed “Krait,” was claimed to deliver 150 percent higher overall performance and 65 percent lower power consumption than currently available ARM-based cores.

                                                                                                                Quoted in a February article by PC‘s Sascha Segan, Qualcomm’s Pineda said Krait is compatible with, but not the same as, the ARM Cortex-A9 cores used in Nvidia’s Tegra 2 and TI’s OMAP 4. “We don’t see this as competing with Cortex-A9. We see it as competing with Cortex-A15 [link],” he reportedly added.

                                                                                                                The MSM8960

                                                                                                                Aimed at both smartphones and tablets, the dual-core MSM8960 includes an integrated multi-mode 3G/LTE modem, Qualcomm said in February. Featuring “asynchronous CPU cores which can be independently controlled for maximum efficiency,” the device supports dual-channel LP DDR memory and features the Adreno 225 GPU (graphics processing unit), offering eight times the performance of the one found in the original 2007 Snapdragon, the company added.


                                                                                                                Qualcomm’s MSM8960
                                                                                                                Source: MobileTechWorld

                                                                                                                According to MobileTechWorld‘s Daou, the MSM8960’s two Krait cores will be clocked between 1.5 and 1.7GHz, and the device will offer dual 500MHz LPDDR2 memory channels. The MSM8960 will support the capture of stereoscopic 20 megapixel images or 1080p video at 30 frames per second (fps), while its GPU will provide DirectX 9.3 compatibility and 125M triangles/sec. performance, he adds.

                                                                                                                The MSM8960 will start shipping in production quantities during the fourth quarter of this year, the MobileTechWorldstory adds.

                                                                                                                The MSM8930

                                                                                                                Daou’s story also reveals another Snapdragon known as the MSM8930, which is essentially a cost-reduced version of the MSM8960. It has the same dual Krait cores, but they’re clocked only up to 1.2GHz, and there’s just a single 533MHz memory channel, MobileTechWorldsays.


                                                                                                                Qualcomm’s MSM8930
                                                                                                                Source: MobileTechWorld

                                                                                                                For the MSM8930, the Qualcomm document apparently cited “Adreno 305” graphics, which again provide DirectX 9.3 compatibility, this time with 80M triangles/sec. performance. Stereoscopic stills are supported up to 12 megapixels, and 30fps 1080p video capture is again possible, the story adds.

                                                                                                                According to the MobileTechWorldstory, the MSM8930 will start shipping in the third quarter of 2012.

                                                                                                                The MSM8974

                                                                                                                In February, Qualcomm heralded the APQ8064, saying that it would include four asynchronous CPU cores, plus a quad-core Adreno 320 GPU that performs 15 times faster than the original Adreno, “enabling console-quality gaming.” Also offered will be support for both PC and LP DDR memory, serial and PCI Express interfaces, and operation with cameras up to 20 megapixels, Qualcomm said.

                                                                                                                Daou now brings word of the MSM8974, “which I guess replaces the MSM8964/APQ8064.” (Qualcomm’s “MSM” devices include on-chip cellular radios, whereas their “AP” equivalents feature only application processors.)


                                                                                                                Qualcomm’s MSM8974
                                                                                                                Source: MobileTechWorld

                                                                                                                According to the MobileTechWorldstory, the powerful MSM8974 will include quad Krait cores clocked at up to 2.5GHz, plus 2MB of second-level cache and support for two 667/800MHz LPDDR3 memory channels. It will support 30 megapixel stills — 3D is likely, but wasn’t mentioned — and 60fps 1080p video capture, while the Adreno 320 is said to provide 225M triangles/sec. performance.

                                                                                                                The MSM8974 will start shipping in the first quarter of 2013, writes Daou.

                                                                                                                Recent Product Briefs for current 45nm Scorpion-based products: [or heterogeneous multi processing, see later]
                                                                                                                Snapdragon single-core MSM8x55 and APQ8055 with upto 1.4GHz [latest version at the moment: Feb 23, 2011]: “This second generation Snapdragon CPU processor substantially improves overall user experience, increases system performance and further extends battery life. The 8×55 CPU chipset is designed specifically for mid and high-tier smartphones as well as larger display devices such as tablets. It also includes the new AP-only option APQ8055. Supported operating systems include Android™, Blackberry®, webOS, and Windows® Phone. … Modem: MSM8255 – UMTS / Single Mode, MSM8655 – CDMA / Multimode … GPU Processor: Adreno 205 with dedicated 2D engine …
                                                                                                                Snapdragon dual-core MSM8x60 and APQ8060 with upto 1.5GHz [latest version at the moment: June 6, 2011]: “This third generation Snapdragon mobile processor includes the industry’s first asynchronous SMP [or heterogeneous multi processing, see later] dual-core CPU design, delivering superior performance and power optimization for high-tier mobile devices, particularly for mobile entertainment and gaming applications. … Unlike synchronous dual-core SMP designs where both cores must run at the same frequency and voltage when operational, the dual-core Scorpion asynchronous power design provides independent clocking and voltage per core, allowing each to work independently. This highly efficient design provides substantial power savings over traditional SMP technology by intelligently adjusting performance to suit the needs of the application. … Supported operating systems include Android™, Chrome, Blackberry ®, and Windows® Phone. … Modem: MSM8260 – UMTS / Single Mode, MSM8660 – CDMA / Multimode … GPU Processor: Adreno 220 with dedicated 2D engine …

                                                                                                                Qualcomm Announces Next-generation Snapdragon Mobile Chipset Family [Feb 14, 2011]

                                                                                                                Mobile Technology Leader Debuting New Quad-, Dual- and Single-core Snapdragon Chipsets with a new CPU Architecture

                                                                                                                Qualcomm Incorporated (NASDAQ: QCOM) today announced its next mobile processor architecture for the Snapdragon family. The new processor micro-architecture, code-named Krait, in the next-generation Snapdragon will redefine performance for the industry, offering speeds of up to 2.5GHz per core and delivering 150 percent higher overall performance, as well as 65 percent lower power than currently available ARM-based CPU cores. These chipsets will be available in single-, dual- and quad-core versions and include a new Adreno® GPU series with up to four 3D cores, and integrated multi-mode LTE modem.

                                                                                                                The latest family of Snapdragon chipsets will include the single-core MSM8930™, the dual-core MSM8960™ and the quad-core APQ8064™. All chipsets in the family will integrate a quad-combo of connectivity solutions — WiFi, GPS, Bluetooth and FM — and include support for near field communication (NFC), as well as stereoscopic 3D (S3D) video and photo capture and playback. Support for every major operating system, across all tiers of products, comes standardon all Snapdragon chipsets.

                                                                                                                The software compatible chipset family will share the same 28nm technology and new, purpose-built CPUs and GPUs for the best mobile performance at the lowest power consumption. The latest Adreno GPUs will also be included in the family, allowing developers to continue to utilize high-performance Adreno graphics capabilities to drive spectacular gaming and user experiences across all device tiers. The Adreno GPU has the largest mobile graphics ecosystems with hundreds of games for Android, Windows Phone 7 Xbox gaming, and PlayStation Certified gaming.

                                                                                                                At the high end, the Adreno 320 quad-core GPU will deliver up to 15 times the performance of the original Adreno to drive the latest games and S3D video on larger-screen devices. Adreno 320 delivers similar graphics performance to today’s latest game consoles, but for mobile devices. In addition, the chipset family will support 3D and S3D games, capture and playback of S3D photos and videos, and output in full HD to a 1080P flat panel display over HDMI.

                                                                                                                “Just as the original Snapdragon revolutionized smartphones with the first 1GHz processor, these new generations of Snapdragon will revolutionize the next wave of mobile entertainment and computing,” said Steve Mollenkopf, executive vice president and group president for Qualcomm. “We believe we have an incredible lineup of chips and software, representing a single platform that OEMs can utilize to create new devices ranging from mass market smartphones with integrated LTE, to tablets, to next generation computing and entertainment devices.”

                                                                                                                The single-core MSM8930 is the world’s first single-chip solution with an integrated LTE modem designed to take LTE to mass market smartphones. It will include the new Adreno 305 GPU which delivers more than six times the performance of the original Adreno.

                                                                                                                The dual-core MSM8960 is the world’s first dual-core solution with an integrated multi-mode 3G/LTE modem and was designed to meet the requirements of multi-tasking smartphones and tablets. It will include dual asynchronous CPU cores which can be independently controlled for maximum efficiency. The MSM8960 will also support dual-channel LP DDR memory and will feature the Adreno 225 GPU which delivers eight times the performance of the original Adreno.

                                                                                                                The quad-core APQ8064 will be designed to meet the performance requirements of the next generation of computing and entertainment deviceswhile minimizing power consumption. As with the Snapdragon dual-core, the APQ8064 will include four asynchronous CPU cores which can be independently controlled for maximum efficiency. The Adreno 320 quad-core GPU debuts in the APQ8064 processor where it enables console-quality gaming and renders rich user interfaces.

                                                                                                                The APQ8064 will also include a variety of features that make it a compelling processing solution for use in mobile entertainment and computing devices, including support for both PC and LP DDR memory, serial and PCIe interfaces, and multiple USB ports. The APQ8064 will also seamlessly integrate with Qualcomm 3G and LTE MDM™ modems and modules, giving OEMs a flexible and cost-efficient platform that can meet all of their design configuration needs and help reduce time to market.

                                                                                                                Samples of the MSM8960 are anticipated to be available in Q2 2011 and samples of the MSM8930 and APQ8064 are anticipated to be available in early 2012.

                                                                                                                For more information about the Snapdragon processor’s next-generation CPU architecture, the first quad-core CPU and GPU features, and to see many of the top new devices powered by Snapdragon processors, please visit us during the GSMA Mobile World Congress 2010 (Booth 8B53, Hall 8), Feb. 14-17 in Barcelona or visit www.qualcomm.com/snapdragon.

                                                                                                                Qualcomm Collaborates with Microsoft on Next Version of Windows [July 1, 2011]

                                                                                                                Qualcomm Incorporated (NASDAQ: QCOM) announced today that its upcoming award-winning Snapdragon™ family of smart mobile processors, including the MSM8960™ with integrated 3G/LTE modem, is designed to power devices running the next version of Windows. The companies’ collaboration continues to address the converging and fast-changing mobile computing landscape, and Qualcomm’s Snapdragon family of dual-core and quad-core processors will enable optimal computing performance, extended battery life and connectivity, and top-notch graphics and multimedia in devices.

                                                                                                                Qualcomm and Microsoft have a long and productive history of collaborationfocused on driving innovation forward, and we are pleased to be among the leaders of the next evolution of mobile computing,” said Luis Pineda, senior vice president of product management, computing and consumer products at Qualcomm. “Our upcoming family of Snapdragon processors is intelligently integrated, optimized for mobile and built smarter, making it the ideal processor to address consumers’ growing demands for new, innovative experiences and usage scenarios that we believe will be delivered by the next version of Windows.”

                                                                                                                The first processor in the Snapdragon family to power devices using the next version of Windows will be the MSM8960, which is sampling this month, followed by the quad-core Snapdragon APQ8064™, which is anticipated to sample in early 2012. Qualcomm has built its Snapdragon family of mobile processors from the ground up to deliver enhanced power efficiency for devices running the next version of Windows. The MSM8960 from the Snapdragon family of mobile processors provides the first dual-core solution with an integrated multi-mode 3G/LTE modem and is designed to meet the multi-tasking requirements of the next version of Windows. The Snapdragon family of mobile processors will include dual and quad asynchronous CPU cores that can be independently controlled to deliver maximum performance at maximum efficiency.

                                                                                                                “Windows 8 will enable customers to have the flexibility, connectivity and power that they expect from Windows today with new, touch-only devices like tablets. This will require high-performing, low-power processors like those from Qualcomm, with features like 3G and 4G wireless wide area network (WWAN) connectivity,” said Mike Angiulo, corporate vice president of Windows planning, hardware and PC ecosystem. “We collaborate with Qualcomm because Snapdragon-powered devices will help Windows 8 consumers experience more out of their Windows device and enable hardware manufacturers to try exciting new PC designs.”

                                                                                                                Qualcomm will be showcasing the latest Snapdragon-powered tablets and smartphones at COMPUTEX TAIPEI 2011. For more information on Snapdragon processors, please visit www.qualcomm.com/snapdragon.

                                                                                                                Qualcomm Atheros Announces Highly Integrated Connectivity Solution for Superior Performance in Smartphones and Tablets [May 31, 2011]

                                                                                                                WCN3660 Combo Chip Brings Dual-band Wi-Fi, Bluetooth and FM Radio Connectivity to Qualcomm’s 28nm Snapdragon Family of Mobile Processors

                                                                                                                Qualcomm Atheros Inc., the networking and connectivity subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced it has begun sampling its new WCN3660 combo chip, which is designed to bring expanded connectivity options to the Qualcomm Snapdragon™ family of mobile processors. Optimized for use in smartphone and tablet devices, the WCN3660 supports an extensive suite of advanced Wi-Fi connectivity options with multiple Wi-Fi standards. The WCN3660 chip also supports Bluetooth 3.0 and Bluetooth 4.0 and the worldwide FM radio frequency band. Designed to interface with Qualcomm’s 28nm Snapdragon mobile processors, the new WCN3660 is a highly integrated solution, enabling customers to provide enhanced connectivity in mobile devices, while reducing the board area required for Wi-Fi, Bluetooth® and FM radio support by up to 50 percentover existing solutions.

                                                                                                                “With the launch of the WCN3660, Qualcomm Atheros is demonstrating its commitment to provide an extensive connectivity portfolio of discrete, combo and integrated platform solutions to our smartphone and tablet customers,” said Amir Faintuch, senior vice president and general manager, consumer business unit, Qualcomm Atheros. “Qualcomm Atheros is pleased to help enable a new generation of mobile devices that connect users to the growing array of must-have social, media and cloud applications.”

                                                                                                                The WCN3660 chip features single-stream, 802.11n with dual-band (2.4 GHz and 5 GHz) operation to enhance mobile wireless multimedia applications. The chip also supports mobile hotspot functionality for up to 14 clients with industry standards-based Wi-Fi Direct™ for peer-to-peer wireless connections without an access point present. The WCN3660 also will support the emerging Wi-Fi Display™ standard for streaming video directly from a smartphone or tablet to a Wi-Fi-enabled display or television.

                                                                                                                The WCN3660 chip has an integrated dual-band power amplifier, transmit antenna switch and on-chip matching circuit, which allows the chip to meet the most stringent carrier requirements while minimizing solution size and power consumption. Bluetooth standards supported by the WCN3660 chip include high-speed Bluetooth 3.0 for audio streaming and device connectivity, and low-power Bluetooth 4.0, which is designed to work with low-power sensors, health monitoring devices and other low data-rate applications. The FM radio capabilities of the WCN3660 include support for both FM receiver and transceiver functionality; worldwide FM band support (76 to 108 MHz); RDS support for Europe and RBDS support for the U.S.; autonomous search, seek and manual tuning; and active noise cancellation.

                                                                                                                The WCN3660 chip is compatible and directly interfaces with Snapdragon devices manufactured in the 28nm process, including the MSM8960™, MSM8270™, MSM8x30™ and APQ8064™. It uses a fully calibrated, wafer-level package smaller than 15mm-squared for direct mounting to a PCB for ease of design and implementation. The WCN3660’s small size and low power consumption in both active and standby modes help provide excellent battery life in mobile devices. To minimize interference and provide high LTE data throughput and optimal audio quality, the WCN3660 interfaces directly with the centralized coexistence manager in the Snapdragon device to provide real-time, intelligent packet arbitration and scheduling, providing an LTE/ISM coexistence solution that is optimized beyond the capabilities of standard filtering approaches.

                                                                                                                “Qualcomm Atheros is utilizing its systems expertise to deliver a highly innovative and integrated architecture for connectivity solutions in smartphones and tablets,” said David Favreau, vice president of product management, Qualcomm Atheros. “The new WCN3660 combo chip with the Qualcomm Snapdragon mobile processors provides a powerful solution for always-connected mobile devices that support WAN, WLAN and WPAN connections.”

                                                                                                                The WCN3660 is optimized to work with a broad range of mobile operating systems including Android, next-generation Windows and Windows Phone, Palm® WebOS™ and QNX®. Samples of the WCN3660 chip are available now, with a commercial release scheduled for late 2011.

                                                                                                                QDevNet | QDSP Access Program – Multimedia Optimization [March 23, 2011]

                                                                                                                Qualcomm is helping device manufacturers to differentiate their smartphone and tablet offerings by providing them the tools, documentation and sample code to enable them to optimize their multimedia solutions running on our hardware. Device manufacturers can augment or modify the multimedia suite with their own features, or work with independent software vendors (ISVs) to customize their optimizations for execution on Qualcomm chipset audio-video acceleration hardware.

                                                                                                                We will be making tools, documentation and sample code available for the following chipsets:

                                                                                                                • MSM8x60™
                                                                                                                • MSM8960™
                                                                                                                • MSM8270™
                                                                                                                • MXM8x55™
                                                                                                                • MSM7x30™
                                                                                                                • MSM7x27™

                                                                                                                Qualcomm’s DSP Access Program Debuts [March 22, 2011]

                                                                                                                Program Enables Manufacturers (OEMs) and Independent Software Vendors (ISVs) to Optimize Multimedia Solutions Utilizing Qualcomm Audio and Video Acceleration Hardware

                                                                                                                … Both OEMs and ISVs can optimize the features and performance of their multimedia software for execution on Qualcomm chipset audio-video acceleration hardware. Qualcomm will offer software development tools that the OEM or ISV can utilize to compile (C/C++) or hand-code (assembly) their proprietary algorithms on Qualcomm’s optimized audio-video processor architectures. These tools are provided with training and support documentation to assist OEMs and ISVs with their audio/video programming on supported chipsets. Additional details on the Qualcomm Developer Network DSP Access Program are available on the Qualcomm Developer Network (http://developer.qualcomm.com/multimedia). …

                                                                                                                Dual Cores—Is Anyone Really taking Advantage of Them? [By Liat Ben-Zur, July 8, 2011]

                                                                                                                I recently spoke with Kevin Kwang of ZD Net Asia to discuss the state of mobile multi-core processors. I pointed out that while it’s exciting to see powerful, dual-core Snapdragon™ processors commercially available (in products like the HTC EVO™ 3D and HP TouchPad), if developers aren’t coding their applications with distinct APIs that take advantage of multiple cores, the power of the hardware is often underutilized.

                                                                                                                ZDNet Asia: Lack of Software Expertise Dampens Multicore Use

                                                                                                                The reality is that this technology trend of multi-cores can be somewhat confusing for most developers. Most are writing downloadable applications, which are only able to take advantage of the HLOS APIs exposed by the platform provider. Most developers are just not exposed to multiple core technology via the standard HLOS API sets that they use every day to build their applications.

                                                                                                                Qualcomm recognizes this, and we’re spending a lot of time helping to bridge the gap between what the technology under the hood has the capability of doing with the actual user experiences that developers enable. We want to help expose the power of the system solution, help connect the dots between low-level hardware, high-level software and high-level apps. Qualcomm is focusing on heterogeneous multi processing [or asynchronous SMP, see earlier] as opposed to SMP which means the system can be extremely optimized based on the load. Of course this furthers the need for developers to understand how to take advantage of this flexibility. That’s why we spend so much time working with developers to optimize things like multimedia performance today.

                                                                                                                For example, Qualcomm and its subsidiary Qualcomm Innovation Center, Inc. (QuIC) are investing more energy into middleware and web application frameworks that distribute loading of heavy tasks like WebKit, V8 and HTML5 features. Since roughly 70% of web pages are images, we have been working to make image decoding in WebKit to be asynchronousand multi-threaded (optimized for dual-core computing). In addition, Qualcomm works closely with many HLOS providers to make sure that effective APIs are being exposed that take advantage of the parallel processing capabilities of multiple cores.

                                                                                                                Qualcomm and QuIC are also investing in optimizing LLVM and the relevant runtimes such as Android Renderscript today and longer term for OpenCL and Google’s PNaCL to better take advantage of our multi-core hardware.

                                                                                                                The real differentiation for Qualcomm comes in how we enable the developer community to take advantage of our processors. We’re beyond simply marketing the “speeds and feeds” of our hardware specs. Qualcomm’s real differentiation comes in how we’re enabling the community to take advantage of all the possibilities of true mobile computing power.

                                                                                                                MobileBeat Sponsor: What Qualcomm is doing for consumer [July 12, 2011]

                                                                                                                At the 2011 MobileBeat conference, Qualcomm vice president of product management Raj Talluri discusses the chip maker’s focus on benefiting the end consumer.

                                                                                                                What is the biggest challenge for Qualcomm in engaging the consumer?

                                                                                                                For Qualcomm, to launch a product that the end consumer can enjoy, we must work with a laundry list of people. Using mobile payments as an example, we spend our time interacting with partners like Google that create secure operating systems. Next we work with the operator to launch the system. We engage service providers like Paypal or Citybank to enable financial transactions. And we collaborate with phone makers like HTC to launch the app on their phone. There is a lot of plumbing that we take care of before it can reach the consumer. We create the machine.

                                                                                                                Today, 3G is pretty widespread, but what are you doing to move the needle toward 4G?

                                                                                                                We launched the first 4G phone, the HTC Thunderbolt on Verizon, so we have the best 4G solution out there today. We focus on how to integrate, how to pull all these aspects together onto one chip. Put it together and you get lower costs, better power. We announced our integrated 4G plus apps processor called 8960, which will support Windows 8. The next generation of 4G phones that will come out in the first half of next year will all be using integrated 4G plus apps processor.

                                                                                                                A theme of this year’s MobileBeat is mobile payments. How is Qualcomm working within this new sub-industry?

                                                                                                                The issue with financial transactions on mobile is the limit on how much money you can move, given security parameters. We are spending time at Qualcomm to build an infrastructure that secures financial payments and lifts the limit. The infrastructure includes hardware inside the processor and software that allows applications to run inside a secure environment, which is authenticated with by a key mechanism. You’ll see products late this year or early next.

                                                                                                                Are you partnering with anyone exciting for the consumer?

                                                                                                                Scalado, a European company, came up with a really exciting technology that processes images in the JPEG domain very fast. We built the hardware inside our developer platform, Snapdragon, to take pictures at high speeds and compress them into the perfect shot. Scalado then built their application to complements our hardware. The app allows the user to choose a face from those high speed-taken photos and layers it smoothly on your end picture. It’s a total solution for mobile picture taking.

                                                                                                                Acer repositioning for the post Wintel era starting with AMD Fusion APUs

                                                                                                                Follow-Up (Aug 2, 2011):
                                                                                                                Acer & Asus: Compensating lower PC sales by tablet PC push [March 29, 2011 with comprehensive update on Aug 2, 2011] which is showing serious technical and market problems with the original version of Honeycomb (particularly for Acer!) which are only now overcome

                                                                                                                Acer reducing 2011 tablet PC shipment target by 50% [June 16, 2011]

                                                                                                                Acer, on June 15, announced that the company has reduced its annual tablet PC shipment forecast from originally 5-7 million units to only 2.5-3 million units, a drop close to 50% and with brand vendors such as Motorola, RIM and Samsung Electronics all reportedly having reduced their tablet PC sales targets for 2011, concerns about whether Android-based tablet PCs will be able to compete against Apple’s iPad are starting to rise among market watchers.

                                                                                                                At the company’s investors meeting on June 15, Acer chairman JT Wang pointed out that the company is currently in the middle of a great transition and the company’s current goal is to lower its retail channel inventory. The company expects to continue working on digesting its inventory throughout the third quarter with expectations to have an inventory level the same as 7-8 years ago. Although Acer will reduce its annual tablet PC shipments, Wang is still confident about the performance of Android-based tablet PCs.

                                                                                                                Wang pointed out that all the things that the closed system can do will all be able to function in the open system, but if consumers use the former, they will need to follow everything the closed system designers says and have no choice for expansion, or run Flash, and will not be able to be their own master. Acer is trying to serve consumers who want to make their own decisions.

                                                                                                                Wang noted that after taking a series of emergency measures, Acer is currently in a safer state than before and should reach its shipment goal for the second quarter of a sequential drop of 10%. For the future, Wang expects Acer’s third-quarter shipments to share a similar volume as in the second with a chance to be better. Its performance will bounce out of the button after the third quarter.

                                                                                                                In addition to reducing inventory, the company is also working on reorganizing its employee management and is set to lay off about 300 employees in Europe, Africa and the Middle-East, while the US, Greater China and Asia Pacific markets will see no changes.

                                                                                                                Acer president Jim Wong pointed out that the company already shipped 800,000 tablet PCs before the end of June and with the launch of its new 7-inch tablet PC, Acer’s tablet PC shipments in the third quarter will reach 800,000 units. Wong added that the estimated numbers are all retail channel sales and include no additional ‘push’.

                                                                                                                Acer may fall out of the worldwide top-3 notebook ranking in 2Q11 [June 16, 2011]

                                                                                                                As Acer is still working on resolving its notebook inventory issues and expects to suffer a sequential shipment drop of 10% in the second quarter, Lenovo, the fourth-largest global PC vendor, which is expected to see shipment growth in the quarter may surpass Acer and become the third-largest PC vendor worldwide.

                                                                                                                In the first quarter of 2011, Acer shipped 9.01 million PCs and ranked the third-largest PC vendor worldwide with Lenovo behind with shipments of 8.18 million units, a gap of about 800,000 unit, according to data from IDC. If Acer sees shipments drop, while Lenovo enjoys an increase, the two firms may see their ranking switch in the third quarter.

                                                                                                                In addition to strong PC demand in the China market, Lenovo’s acquisition of NEC’s PC business has successfully helped Lenovo to become the largest vendor in Japan, while its purchase of Germany-based brand Medion also significantly raised its visibility in Western Europe.

                                                                                                                However, Acer president Jim Wong, at its investor conference on June 15, pointed out that Acer lost about 3% share in the EMEA market while clearing its inventory, but the situation already turned stable in May and Acer is expected to maintain its advantage in the market.

                                                                                                                Acer decreases netbook shipments to focus on tablet PCs, say Taiwan makers [June 15, 2011]

                                                                                                                Acer shipped 400,000-500,000 netbooks in May, 50% fewer than in April, and will maintain such decreased shipments in June and July, implying that Acer will not give up netbooks but will shift R&D and operational resources from the product line to tablet PCs, according to Taiwan-based makers in its supply chain.

                                                                                                                With Acer’s tablet PC orders quickly rising to 200,000-300,000 units per month in May, the sources are optimistic about Acer’s strategy to turn its focus to the tablet PC as the profitability generated by netbooks is much lower than that of tablet PCs, and Acer’s upstream partners should all benefit from the higher gross margins of tablet PC products.

                                                                                                                In addition to Acer, players such as Asustek Computer, Hewlett-Packard (HP) and Lenovo have all switched their focus to tablet PCs, although the players are still launching new netbook products, related marketing resources invested are rather low compared to before, as netbooks can be easily substituted by tablet PCs.

                                                                                                                Although Acer is turning its focus to the tablet PC market, the company still launched its second-generation Aspire One Happy this month in the US and Europe.

                                                                                                                Acer notebook shipments in retail channel expected to surpass 3 million in June [June 14, 2011]

                                                                                                                Acer’s notebook shipments in the retail channel are expected to surpass three million units in June and if the company’s upstream partners such as Compal Electronics, Wistron and Quanta Computer all see increased shipments in the month, it will indicate that Acer has achieved a great advance in digesting its inventory and should return to its normal operation in near future, according to sources from the upstream supply chain.

                                                                                                                Acer only shipped about 1.6-1.8 million notebooks to the retail channel in April and the volume increased close to 60% on month in May; however, notebook shipments of Acer’s upstream partners did not enjoy the same amount of growth in May, especially Compal, which only shipped 3.6-3.7 million notebooks including tablet PCs in both April and May. Compal even saw s shipment drop on month in May, indicating that Acer was still working of digesting its inventory.

                                                                                                                The sources pointed out that Acer still has a high inventory level in Europe retail channel, but since the company has already seen improvements in both Southeast Asia and China, the company is now working aggressively to clear up its remaining inventory through its global logistic system with estimates of seeing shipments of 7.2-7.4 million notebooks in the second quarter.

                                                                                                                Acer’s non-consolidated revenues in May grew 25.9% on month indicating that the company is seeing slow recovery in its operation, but since the company still has not yet provided its guidance for the third quarter, the sources expect Acer to have chance to release the related information at its investor conference on June 15.

                                                                                                                Acer shareholders approve cash dividend and elect new board of directors [June 15, 2011]

                                                                                                                Acer’s shareholders have approved the 2011 cash dividend of NT$3.60 (US$0.12) per share, and the reduction of employee bonuses for 2010 by 40%. Shareholders also elected a new board of directors and supervisors.

                                                                                                                Acer announced in early June plans to lower channel inventory in Europe, Middle East and Africa (EMEA) by providing US$150 million in sales allowances and a one-time write off. The board and supervisors also voluntarily cut their remuneration by 50%. Today, the shareholders further approved plans to reduce employee bonuses by 40%, from NT$1.5 billion to NT$900 million. The cash dividend of NT$3.60 per share remains unchanged.

                                                                                                                Shareholders elected a new board of directors and supervisors for the next three-year term. The newly elected seven-member board consists of JT Wang, Stan Shih, Hung Rouan Investment, Philip Peng, representing Smart Capital, Hsin-I Lin (former chairman of Industrial Technology Research Institute), Dr FC Tseng, and Sir Julian Horn-Smith. The supervisors are Carolyn Yeh and George Huang.

                                                                                                                New to the board are the independent directors FC Tseng and Julian Horn-Smith. Acer expects to benefit from the knowledge and experience of Tseng and Horn-Smith, who are both globally distinguished talents. Their contribution from an independent standpoint to the company strategy, along with the board, will create a strong and well-rounded team to lead the corporation forward and enhance corporate governance, the company said.

                                                                                                                Tsengco-founded Taiwan Semiconductor Manufacturing Company (TSMC) as a pioneer specializing in the foundry-only semiconductor manufacturing business. A core member of the TSMC management, he is also considered a veteran in the semiconductor industry. Horn-Smith was a founding member of Vodafone Group and is regarded as the principal architect in developing Vodafone’s international strategy. He retired from the Vodafone board in July 2006, where he held the title of deputy CEO.

                                                                                                                What is an APU? [Jan 8, 2011]

                                                                                                                With Fusion technology from AMD, the PC industry will be changed forever. AMD is incorporating multi-core CPU (x86) technology, a powerful DirectX®11-capable discrete-level graphics and parallel processing engine onto a single die to create the first Accelerated Processing Unit (APU). Learn how AMD is doing that here.

                                                                                                                Computex 2011: AMD announces solution for tablet PC [June 2, 2011] (emphasis is mine)

                                                                                                                AMD, at its press conference at Computex 2011, announced a new 40nm Z series APU codenamed Desna to target the tablet PC market, according to Rick Bergman, Senior Vice President and General Manager Products Group, AMD.

                                                                                                                In 2012, the company will advance its Z series APU to a new structure with a codename Hondo. The Hondo-based Z series APU will have an even lower power consumption to allow it to become more suitable for tablet PC products.

                                                                                                                Bergman pointed out that AMD’s tablet PCs will be deeply integrated with operating systems such as Windows to support HTML 5, Adobe Flash 10.2 and external screens, and will add enterprise-level security functions to make them suitable also for the enterprise market.

                                                                                                                Bergman, at the conference, also displayed AMDs 28nm Trinity APU, which is set for mass production in 2012.

                                                                                                                AMD also announced its 9-series chipset, a part of AMD’s new desktop Scorpius platform. In addition to the chipset, the Scorpius platform is formed with an eight-core Zambezi processor and Radeon HD 6000 series discrete graphics card.

                                                                                                                The 9-series chipset supports AMD’s AM3+ CPU and is backward compatible with AM3-based CPUs. With native support for AMD’s CrossFireX, the chipset can support up to four Radeon graphics cards and through AMD’s OverDrive software, the chipset can also manage the clock speed of each card.

                                                                                                                A New Visual Computing Experience for Tablets | Fusion – AMD Blogs [May 31, 2011]

                                                                                                                While I’m not planning to edit or create any PowerPoint decks on a tablet anytime soon, I personally see value in a tablet that gives me both the ability to consume and create content. For example, one of the applications I use every day in my work and home life is the OneNote application in Microsoft Office. Being able to access it across multiple devices via Windows Live has been invaluable for me of late. When I tried to access this on a non-Windows device, you can see what the result was in this picture below:

                                                                                                                This is why I’m looking forward to getting my hands on one of the new tablets based on the new Z series AMD Fusion APU, code-named “Desna”. At Computex earlier today, we announced these new AMD Fusion APUs as part of our 2011 AMD HD Tablet Platform targeted at the fast-growing number of Windows-based tablet designs coming to market. And since a press release can only tell part of the story, here’s what you can expect from tablets powered by the new 2011 AMD HD Tablet Platform:

                                                                                                                • AMD Z-01 APU with AMD Radeon™ HD 6250 discrete-class graphics. This APU features two 1 GHz “Bobcat” CPU cores and checks in at TDP of 5.9 watts.
                                                                                                                • Full intelligence and operability of the Windows® 7 OS
                                                                                                                • Consistency in user interface and applications from work to home
                                                                                                                • Full access to view and edit work and personal documents created in Microsoft Office and other leading applications
                                                                                                                • Free and automatic online Windows 7 OS updates to enable the most current features
                                                                                                                • Full compatibility with iPhone, Windows Phone, Blackberry and other leading mobile phones
                                                                                                                • Seamless connectivity with virtually any USB device
                                                                                                                • HDMI support to enable a full 1080p visual experience
                                                                                                                • Full compatibility with XBOX 360 Media Extender Functionality

                                                                                                                The AMD Z-Series Fusion APUs are shipping today. MSI’s WinPad 110W is the first tablet announced by an OEM that leverages the new platform, giving consumers high-end performance graphics in a tablet that takes advantage of the Windows ecosystem –  the largest installed base of any client platform … by a wide margin.

                                                                                                                One final thought, a company to keep your radar screen as you do your tablet research is BlueStacks. BlueStacks is helping to reshape the tablet ecosystem by essentially bridging the Windows and Android ecosystems together, thus opening up new application possibilities in the amazing clarity and detail that only an AMD Fusion APU-powered tablet can offer.

                                                                                                                Look for a review of my experience on the MSI WinPad 110W in the coming weeks on our AMD Fusion blog.

                                                                                                                Computex 2011: AMD Announces Bobcat-based Z Series APUs for Tablet Market [June 1, 2011]

                                                                                                                While AMD does not have a true SoC to combat the likes of Intel, NVIDIA, and ARM, this doesn’t mean they’re completely ignoring the market for the type of devices SoCs normally go in. Announced today at Computex 2011 and shipping immediately will be AMD’z Z series APUs, AMD’s formal entry into the modern tablet market.

                                                                                                                While at this time it’s nigh-on impossible to get into a phone without a SoC (just ask Intel), tablets can be more forgiving. With a larger device and a larger battery, such devices don’t necessarily have the same extreme integration requirements and battery life requirements as a phone, even if the processors used in such devices are often the same. As a result of AMD’s current resources and technologies, it’s the tablet market that they have decided to go after first.

                                                                                                                The Z-series, codename “Desna”, currently has a single APU that is shipping immediately: the Z-01.

                                                                                                                AMD APU Lineup
                                                                                                                APU Model
                                                                                                                Number of Bobcat Cores
                                                                                                                CPU Clock Speed
                                                                                                                GPU
                                                                                                                Number of GPU Cores
                                                                                                                GPU Clock Speed
                                                                                                                TDP
                                                                                                                AMD Z-01
                                                                                                                2
                                                                                                                1.0GHz
                                                                                                                Radeon HD 6250
                                                                                                                80
                                                                                                                276Mhz
                                                                                                                5.9W
                                                                                                                AMD C-30
                                                                                                                1
                                                                                                                1.2GHz
                                                                                                                Radeon HD 6250
                                                                                                                80
                                                                                                                280MHz
                                                                                                                9W
                                                                                                                AMD C-50
                                                                                                                2
                                                                                                                1.0GHz
                                                                                                                Radeon HD 6250
                                                                                                                80
                                                                                                                280MHz
                                                                                                                9W
                                                                                                                AMD E-240
                                                                                                                1
                                                                                                                1.5GHz
                                                                                                                Radeon HD 6310
                                                                                                                80
                                                                                                                500MHz
                                                                                                                18W
                                                                                                                AMD E-350
                                                                                                                2
                                                                                                                1.6GHz
                                                                                                                Radeon HD 6310
                                                                                                                80
                                                                                                                500MHz
                                                                                                                18W

                                                                                                                The Z-01, as near as we can tell, is a power optimized version of AMD’s existing C-50 APU. It features the same dual-core CPU design, using a pair of Bobcat CPU cores running at 1GHz. The GPU meanwhile is a Radeon HD 6250, and while AMD hasn’t listed the clocks, we believe it’s clocked at the same 280MHz as in the C-50. We don’t have any information on whether AMD is using the same packaging for the Z-01 as they are the C series, but otherwise the available specifications are identical to the C-50 with one exception: TDP. While the C-50 is rated for 9W, the Z-01 is rated for 5.9W. Given the 33% power reduction, it’s a fair guess that AMD is binning Ontario chips to find ones that operate at the low voltages Z-01 would require.

                                                                                                                Based on what we’ve seen with the C-50, the Z-01 should perform far above any other tablet processor. However the 5.9W TDP means that it’s not going to be in the same market as the likes of OMAP 4, Tegra 2, Apple’s A5, or even Intel’s Moorestown. All of these SoCs/platforms use well under 5.9W, and with the exception of Moorestown are all ARM based.

                                                                                                                Ontario and Atom by Hans de Vries [Sept 16, 2010] [he is an industry and enthusiast community veteran]

                                                                                                                Improved image with some benchmark info:

                                                                                                                http://www.chip-architect.com/news/AMD_Ontario_Bobcat_vs_Intel_Pineview_Atom.jpg

                                                                                                                [Such sensity is indicating that TSMC’s 40nm process is quite dense. If these numbers hold true that would mean Ontario is not only smaller than Atom, but also much higher performing. Note the amount of die area dedicated to graphics. This is going to be very good for entry level systems.]

                                                                                                                Re: Welcome Llano! by Hans de Vries [March 13, 2011] (emphasis is mine)

                                                                                                                Azazel wrote:
                                                                                                                BTW, did you notice that top speed of mobile 4c Llano is just 1.8GHz when mobile 4c/8t SB lies in 2.2/2.3 GHz.
                                                                                                                Why is that?

                                                                                                                The “top-speed” part is made up by you……….

                                                                                                                A 1.8GHz quad core AMD propus uses only 25W at 45nm.
                                                                                                                Expect the power dissipation of the four 32nm Llano cores to reach far lower levels as that. It will get under 15W at 1.8GHz when the process matures.

                                                                                                                Intel doesn’t have any quad core mobile processor running at less than 45 Watt, not even at 32nm. 45W is too much power dissipation especially if you also want a bit of reasonable (discrete) graphics in your very expensive notebook.

                                                                                                                It’s seems we’ll have to wait until 2013 when Intel’s 22nm process matures enough to yield an economic quad core Ivy Bridge before we’ll see a quad core Intel mobile processor for the mainstream mobile market.

                                                                                                                Regards, Hans

                                                                                                                Acer Iconia Tab W500 Microsoft® Windows® 7 Tablet Delivers Ultimate Productivity for Customers in North America [April 21, 2011] (emphasis is mine)

                                                                                                                Acer America today announced that the Acer Iconia Tab W500 – a 10.1-inch tablet running Microsoft® Windows® 7 – is available for sale now in North America.

                                                                                                                The Acer Iconia Tab W500 is the ultimate productivity device for anyone who wants the flexibility and mobility of a tablet with the efficiency and familiarity of a Windows PC. It’s especially ideal for schools, small businesses, and for industries such as healthcare that need a tablet to be productive and stay in touch as they move around their work environment. In addition, customers can use the tablet to keep up with social networks and enjoy digital entertainment at work, at home and on the go.

                                                                                                                The unique design centers on the high-resolution 10.1-inch multi-touch screen. Supporting multi-touch allows customers to interact intuitively with the display to check email, access websites, use cloud-based applications, and enjoy digital media. When it’s time to focus on productivity and creating content such as reports, spreadsheets and presentations, customers can get a true notebook PC experience with the system’s full-size chiclet docking keyboard.

                                                                                                                “The Acer Iconia Tab W500 is the perfect tablet for people who want the touch capabilities that are so natural and efficient on the go, but also need a Windows environment to access productivity applications for work and school,” said Eric Ackerson, senior product marketing manager, Acer America. “So much of what we’re doing on the go is accessing information and consuming content in cloud-based applications, such as realtors and salespeople who need access to databases and Intranet sites. The Acer Iconia Tab W500 is the ultimate reflection of our lives – able to multitask between work and fun, and ready at a moment’s notice.”

                                                                                                                “We’re pleased to see Acer continue to drive innovation that delivers new, exciting computing experiences to customers,” said Soren Lau, general manager of OEM Marketing, Microsoft Corporation. “The Acer Iconia Tab W500 combines the familiarity, security and portability of Windows 7 with entertainment and social connection features that allow customers to work and play on a single PC.”

                                                                                                                Innovative Design Boosts Productivity
                                                                                                                The combination of a responsive and intuitive touch experience with a dedicated docking keyboard makes the Acer Iconia Tab W500 a productivity booster. The full-size chiclet docking keyboard easily connects to the tablet via USB, holding it up at a comfortable viewing angle. The keyboard also provides docking station capabilities with extended connectivity of an Ethernet port for fast Internet connections, and a USB port for external devices. Plus, the docking keyboard features the Acer FineTrack™ pointing device with two buttons for convenient navigation.

                                                                                                                When it’s time to transport the Acer Iconia Tab W500, the tablet deftly connects to the docking keyboard with quick-linking magnets, transforming it into an easy-to-store clamshell notebook. It easily fits in a briefcase or book bag. If users want to minimize travel weight, they can simply leave the keyboard behind; the tablet weighs only 2.14 pounds and measures 10.83(W) x 7.48(D) x 0.63(H) inches. The additional docking keyboard weighs 1.34 pounds and measures 10.83(W) x 7.48(D) x 0.43-0.77(H) inches.

                                                                                                                The embedded Acer PowerSmart long-life 3260 mAh Li-polymer battery pack delivers up to four hours of unplugged HD video playback and six hours of Internet browsing.(1)

                                                                                                                Configurations, Availability and Pricing
                                                                                                                The Acer Iconia Tab W500 is available in two models: the W500-BZ467 with Windows® 7 Home Premium has a Manufacturer’s Suggested Retail Price (MSRP) of $549.99, while the W500P-BZ841 with Windows® 7 Professional has a MSRP of $619.00. Both models are ready to be used for productivity and creation with Microsoft® Office Starter 2010 and are now available for sale at select retailers and channel partners in the United States.

                                                                                                                The Acer Iconia Tab W500-BZ607 with Windows® 7 Home Premium is available at select retailers and channel partners in Canada for a MSRP of $599 CAD. The Acer Iconia Tab W500P-BZ412 with Windows® 7 Professional has a MSRP of $649.00 CAD and will be available in the channel by end of June.

                                                                                                                Meaningful Communication with Video, Voice, Internet
                                                                                                                Staying in touch on the go is easy with the Acer Iconia Tab W500. Customers can connect to Wi-Fi networks with reliable Acer InviLink Nplify 802.11a/b/g/n Wi-Fi CERTIFIED wireless technology at home and on the go for Internet access, checking email, and staying current on everything from news and blog sites to their Twitter feed. They also have Bluetooth to connect to printers, keyboards and other Bluetooth devices.

                                                                                                                Two Acer Crystal Eye 1.3MP webcams – one each on the front and back of the device – used with Acer Video Conference Manager, let customers engage in video conferencing, as well as record HD videos and then quickly share them on Facebook, YouTube and other sites. The tablet also delivers excellent audio with Acer PureZone technology with two built-in stereo microphones featuring beam forming, echo cancellation, and noise suppression technologies.

                                                                                                                Entertainment and Fun on the Go with Latest Technology
                                                                                                                Work seamlessly blends into entertainment in so many ways today, and the Acer Iconia Tab W500 can be used to handle productivity and fun simultaneously. Powered by an AMD C-50 processor and supported by 2GB of DDR3 memory, the tablet delivers fast and reliable mobile performance. It also boasts integrated ATI Radeon HD 6250 graphics for realistic, crisp visuals on movies, web video and games. It also supports Adobe Flash and comes installed with Adobe Flash 10.1.

                                                                                                                The tablet is ready to play back high definition Internet content and 1080p video on the high resolution 1280×800 LED-backlit display. Plus, sound is vibrant and clear with Dolby® advanced audio v2. The models come with a 32GB solid state drive,(2) which provides incredibly fast data access while reducing weight and noise. The SD card reader can support SD cards up to 32GB in capacity.(2)

                                                                                                                The ambient light sensor on the Acer Iconia Tab W500 allows it to be used in a range of environments. The integrated accelerometer provides auto-rotation between portrait and landscape modes for viewing presentations, documents, websites, movies, games and more in the most appropriate orientation.

                                                                                                                Acer Ring Elevates Intuitive Touch Experience
                                                                                                                Like all Acer Iconia products, the core of the Acer Iconia Tab W500 touch experience is the Acer Ring. Easy to launch with a simple grab gesture, it offers immediate access to special features and touch applications. By placing five fingers in a circular pattern, the Acer Ring appears to let consumers surf the web, capture screen images, post photos and status updates, watch movies and more, all in the manner most comfortable and natural to them.

                                                                                                                Utilities in the Acer Ring include Clean Disk to manage and optimize disk space; Snipping Tool to quickly select, tag, and clip screen images; Device Control to fine-tune the tablet settings; Camera to launch Acer Crystal Eye Webcam; Calculator and Games.
                                                                                                                The Acer Ring also features a series of AppCards that enhance everyday usage:

                                                                                                                • TouchBrowser provides a touch-optimized browsing experience to let customers search for, open, resize, and select content from the web.
                                                                                                                • SocialJogger connects three of the most popular social networking sites – Flickr, Facebook, and YouTube – in a single interface so that customers can connect with and update their networks holistically.
                                                                                                                • My Journal lets customers collect web clips that are dynamically updated to stay posted on news of interest.
                                                                                                                • Scrapbook is a convenient place to store, annotate and share website and photo images and other content.
                                                                                                                • TouchPhoto, TouchMusic and TouchVideo provide direct access to multimedia files stored on the tablet.

                                                                                                                clear.fi for Digital Media Sharing
                                                                                                                Acer clear.fi is the digital media sharing system that lets customers enjoy their digital media content across their home quickly and effortlessly. Clear.fi automatically connects all Acer devices on a network (smartphones, notebooks, desktops, HD media players and storage devices) and then gathers and organizes media files by type (video, music, photo, pre-recorded TV). Users can browse the categories and then drag and drop the media to any of the connected PCs or devices for playback. The HDMI port with HDCP support ensures a single cable for true HD audio and video output.

                                                                                                                ICONIA FAQ 13 (emphasis is mine)

                                                                                                                Q: Does a stylus work on the Acer Iconia TAB W500 or Acer ICONIA dual screen touchbook?

                                                                                                                A: Yes, a stylus that is compatible with capacitive touch screens can function on the Acer Iconia TAB W500 or Acer ICONIA dual screen touchbook.

                                                                                                                Specifications Part Number: ICONIATabW500 Acer ICONIA Tab W500 Tablet Series

                                                                                                                Following are the specifications for the Acer ICONIA Tab W500.
                                                                                                                Specifications are subject to change without notice or obligation.

                                                                                                                Feature
                                                                                                                Specification
                                                                                                                Operating System
                                                                                                                Genuine Windows® 7 Home Premium 32-bit
                                                                                                                CPU and chipset1
                                                                                                                AMD C-Series dual-core processor C-50 (1 MB L2 cache, 1 GHz, DDR3 1066 MHz, 9 W)
                                                                                                                AMD A50M Fusion™ Controller Hub
                                                                                                                Memory1, 2,
                                                                                                                Up to 2 GB of DDR3 onboard system memory
                                                                                                                Display1
                                                                                                                10.1″ HD 1280 x 800 resolution, high-brightness (350-nit), 146 PPI Acer CrystalBrite™ LED-backlit TFT LCD with integrated multi-touch screen, supporting finger touch and image auto rotation
                                                                                                                Wide viewing angle up to 80/80/80/80 degrees (up/down/left/right)
                                                                                                                Mercury-free, environment-friendly
                                                                                                                Graphics
                                                                                                                AMD Radeon™ HD 6250 Graphics with 256 MB of dedicated system memory, supporting Unified Video Decoder 3 (UVD3), OpenGL® 3.1, OpenEXR High Dynamic-Range (HDR) technology, Shader Model 5.0, Microsoft® DirectX® 11
                                                                                                                Dual independent display support
                                                                                                                16.7 million colors
                                                                                                                External resolution / refresh rates3:
                                                                                                                • VGA port up to 1920 x 1200: 60 Hz
                                                                                                                • HDMI™ port up to 1920 x 1080: 60 Hz
                                                                                                                MPEG-2 DVD decoding
                                                                                                                VC-1 and H.264 AVC decoding
                                                                                                                MPEG-4 Part 2 DivX® decoding
                                                                                                                HDMI® (High-Definition Multimedia Interface) with HDCP (High-bandwidth Digital Content Protection) support
                                                                                                                Audio
                                                                                                                Optimized Dolby® Advanced Audio® v2 audio enhancement, featuring Audio Optimizer, Audio Regulator, Volume Leveler, Volume Maximizer, and Surround Virtualizer (for built-in speakers) technologies4
                                                                                                                High-definition audio support
                                                                                                                Two built-in stereo speakers
                                                                                                                MS-Sound compatible
                                                                                                                Acer PureZone technology with two built-in stereo microphones, featuring beam forming, echo cancellation, and noise suppression technologies
                                                                                                                Storage
                                                                                                                Solid state drive
                                                                                                                • 32 GB or larger, with mini-SATA (mSATA™) interface connector1, 5,
                                                                                                                2-in-1 card reader, supporting:
                                                                                                                • Secure Digital™ (SD) Card, MultiMediaCard™ (MMC)
                                                                                                                • Storage cards with adapter: miniSD™, microSD™, Reduced-Size Multimedia Card (RS-MMC)
                                                                                                                Webcam
                                                                                                                Acer Video Conference1, featuring:
                                                                                                                • Dual Acer Crystal Eye webcams with 1280 x 1024 resolution
                                                                                                                • Acer Video Conference Manager software, featuring Video Quality Enhancement (VQE) technology, supporting online video calls6
                                                                                                                • Acer PureZone technology
                                                                                                                Wireless and networking
                                                                                                                WLAN:1, 7, 8,
                                                                                                                • Acer InviLink™ Nplify™ 802.11b/g/n Wi-Fi CERTIFIED™
                                                                                                                • Acer InviLink™ 802.11b/g Wi-Fi CERTIFIED™ (available only in Russia, Pakistan, Ukraine)
                                                                                                                • Supporting Acer SignalUp™ wireless technology
                                                                                                                WPAN:1 Bluetooth® 3.0+HS
                                                                                                                LAN: Fast Ethernet on the dock
                                                                                                                Dimensions and weight
                                                                                                                Dimensions
                                                                                                                275 (W) x 190 (D) x 15.95 (H) mm (10.83 x 7.48 x 0.63 inches) for the tablet
                                                                                                                275 (W) x 190 (D) x 11/19.5 (H) mm (10.83 x 7.48 x 0.43/0.77 inches) for the dock
                                                                                                                Weight
                                                                                                                0.97 kg (2.14 lbs.)9 with 3-cell embedded battery for the tablet
                                                                                                                0.61 kg (1.34 lbs.)9 for the dock
                                                                                                                Power adapter and battery1
                                                                                                                Product Safety Electric Appliance and Materials (PSE) certified for battery pack
                                                                                                                Power adapter
                                                                                                                2-pin 40 W Acer MiniGo AC adapter:
                                                                                                                • 93.2 (W) x 48 (D) x 32.2 (H) mm (3.66 x 1.88 x 1.26 inches)
                                                                                                                • 180 g (0.39 lbs.)9 with 250 cm DC cable
                                                                                                                Embedded battery
                                                                                                                • Acer PowerSmart long-life battery, supporting up to 1,000 charge cycles10
                                                                                                                • 36 Wh 3260 mAh 3-cell Li-polymer embedded battery
                                                                                                                Battery life: 6 hours11 for Internet browsing; 4 hours11 for 720p HD video playback
                                                                                                                Input and control
                                                                                                                84-/85-/88-key full-size Acer FineTip keyboard with international language support on the dock
                                                                                                                Acer FineTrack™ with two FineTrack™ buttons
                                                                                                                Dedicated Windows® key supporting single-press for Windows Start; single-press combined with power button for Ctrl+Alt+Del
                                                                                                                Dedicated volume up/down keys
                                                                                                                Rotation lock switch
                                                                                                                Input and output
                                                                                                                2-in-1 card reader (SD™, MMC)
                                                                                                                Two USB 2.0 ports each on the tablet and the dock
                                                                                                                HDMI® port with HDCP support
                                                                                                                Headphone/speaker jack, supporting 3.5 mm headset with built-in microphone for Acer smart handhelds
                                                                                                                Ethernet (RJ-45) port on the dock
                                                                                                                DC-in jack for AC adapter
                                                                                                                Sensors
                                                                                                                Ambient light sensor
                                                                                                                G-Sensor
                                                                                                                Software16
                                                                                                                Productivity
                                                                                                                • Acer Ring
                                                                                                                • Acer ePower Management
                                                                                                                • Adobe® Flash® Player 10.1
                                                                                                                • Adobe® Reader® 9.1
                                                                                                                • AUPEO! (US only)
                                                                                                                • Bing™ Bar
                                                                                                                • Device Control
                                                                                                                • Kobo™ (Canada only)
                                                                                                                • Microsoft® Office 2010 preloaded (purchase a product key to activate)13
                                                                                                                • Microsoft® Office Starter 201014
                                                                                                                • New York Times Reader (US only)
                                                                                                                • NOOK for PC (US only)
                                                                                                                Security
                                                                                                                • McAfee® Internet Security Suite Trial15
                                                                                                                Multimedia
                                                                                                                • Acer clear.fi
                                                                                                                Gaming
                                                                                                                • WildTangent® Tablet Edition
                                                                                                                Communication and ISP
                                                                                                                • Acer Crystal Eye for dual cameras
                                                                                                                • Acer Video Conference Manager1
                                                                                                                • Microsoft® Silverlight™
                                                                                                                • My Journal
                                                                                                                • SocialJogger
                                                                                                                • Skype™
                                                                                                                • TouchBrowser
                                                                                                                • Windows Live™ Essentials 20111
                                                                                                                Web links and Utilities
                                                                                                                • Acer Identity Card
                                                                                                                • Acer Registration
                                                                                                                • Acer Updater
                                                                                                                • eBay® shortcut 2009 (Canada, France, Germany, Italy, Mexico, Spain, UK, US only)
                                                                                                                • Netflix shortcut (US only)
                                                                                                                Ecocompliance
                                                                                                                ENERGY STAR®, WEEE, RoHS, Mercury-free
                                                                                                                Options and accessories
                                                                                                                Optional:
                                                                                                                • Exclusive USB keyboard dock
                                                                                                                • 2-pin 40 W Acer MiniGo AC adapter
                                                                                                                • External USB HDD
                                                                                                                • External USB ODD
                                                                                                                Warranty
                                                                                                                One-year International Travelers Warranty (ITW)
                                                                                                                Windows®. Life without Walls™. Acer recommends Windows 7.
                                                                                                                1. Specifications vary depending on model.
                                                                                                                2. Shared system memory may be allocated to support graphics, depending on system memory size and other factors. Actual system memory available to the operating system will be reduced by any memory used by the graphics solution and resources required by the operating environment.
                                                                                                                3. Resolution/refresh rates depend on display capability and color/depth settings.
                                                                                                                4. Dolby® is a registered trademark of Dolby® Laboratories. Dolby® Home Theater® is a trademark of Dolby® Laboratories.
                                                                                                                5. 1 GB is 1 billion bytes. Actual formatted capacity is less and may vary depending on preloaded materials and operating environment.
                                                                                                                6. Two VQE-enabled Acer notebooks with dual-core processors are required to enjoy the exclusive benefits and added performance of VQE.
                                                                                                                7. Actual throughput may vary depending on network conditions and environmental factors such as network traffic or overhead, building construction, and access point settings.
                                                                                                                8. Acer Nplify™, a high-throughput wireless solution, delivers superior performance and reliable connections while enabling emerging voice, video and data applications. Wi-Fi CERTIFIED™, it supports Acer SignalUp™ wireless technology and is compliant with 802.11a/b/g/n and 802.11b/g standards.
                                                                                                                9. Weight may vary depending on product configuration, vendor components, manufacturing variability, and selected options.
                                                                                                                10. The battery will hold up to 80% of its original capacity after as many as 1,000 recharges. A full recharge comprises a complete charge-and-discharge cycle, and does not always occur each time the notebook is plugged in to a power source, as several partial charges can add up to a full recharge.
                                                                                                                11. The listed battery life is based on the following test conditions: wireless on; 150-nit LCD brightness; 3G, light sensor, Bluetooth® off; McAfee® anti-virus program enabled; Windows® scheduled programs and Standby/Hibernation power states disabled. Battery life rating is for comparison purposes only. Actual battery life varies by model, configuration, applications, power management settings, operating conditions, and utilized features. A battery’s maximum capacity decreases with time and use.
                                                                                                                12. Bundled software may vary depending on hardware configuration, OS and regional availability.
                                                                                                                13. Purchase an Office 2010 product key to activate one of the following Office 2010 suites preloaded on this PC: Office Home and Student 2010, Office Home and Business 2010, Office Professional 2010.
                                                                                                                14. Includes limited-functionality Microsoft® Word and Excel with advertising; no PowerPoint or Outlook. Purchase Office 2010 to activate full-featured Office.
                                                                                                                15. Trial periods vary depending on the geographic region and specifications: 365-day trial for China, Taiwan, Hong Kong and Singapore (Simplified Chinese and Traditional Chinese OS models); 60-day trial for other regions.

                                                                                                                Acer places orders for 80,000 Z series APUs from AMD for tablet PCs [June 9, 2011] (emphasis is mine)

                                                                                                                Acer has recently placed orders for 80,000 Z series APUs from AMD for use in tablet PCs, targeting the enterprise market, according to sources from upstream component makers. However, both Acer and AMD did not confirm the orders.

                                                                                                                In addition to Acer, Micro-Star International (MSI) is also developing tablet PC models using AMD’s APU.

                                                                                                                Since Google Android 3.0 currently still has issues which need to be resolved, while the next-generation Android operating system codenamed Ice Cream Sandwich will not appear until the end of 2011, some tablet PC vendors have decided to launch Windows 7-based tablet PCs targeting the enterprise market to maintain their shipments.

                                                                                                                Since Intel’s Oak Trail-based Atom processor is higher in both price and power consumption, several notebook vendors have already started considering AMD’s platform. In addition to Acer and MSI, some vendors have also started inquiring about AMD’s Z series APU.

                                                                                                                AMD’s Z series APU is produced through Taiwan Semiconductor Manufacturing Company’s (TSMC’s) 40nm process and is already shipping, targeting the Windows-based tablet PC market, noted the sources adding that they expect shipments of Z series APUs to reach at least 500,000 units in the second half of 2011, creating strong pressure on Intel’s Oak Trail processor.

                                                                                                                AMD announces details of a new generation of Fusion chips for 2011-2012 – slideshow [June 15, 2011]

                                                                                                                AMD has now announced a complete line of series hybrid CPU + GPU Fusion chip designed for portable computers and mobile devices such as tablet (see previous news from the list of chips). In addition, AMD has presented information on the rest of the Fusion generation including processors that will compete with Intel’s Sandy Bridge generation – details can be seen on the slides.

                                                                                                                AMD announces A series APUs for mainstream PCs [June 14, 2011]

                                                                                                                AMD has announced the availability of the new high-performance AMD Fusion A series accelerated processing units (APUs) for consumer notebooks and desktops.

                                                                                                                The AMD A series APUs combine up to four x86 CPU cores with an integrated DirectX 11-capable discrete-level graphics unit that features up to 400 Radeon cores along with dedicated HD video processing on a single chip. AMD A series APUs also support features such as gesture interfaces, multiple-monitors, 3D and real-time image stabilization.

                                                                                                                The AMD A series APUs (Llano) are currently shipping and scheduled to appear in more than 150 notebooks and desktops from the global OEMs throughout the second quarter of 2011 and beyond. Delivering serial and parallel computing capabilities for HD video, 3D rendering and data-intensive workloads in a single-die processor, the AMD A Series APUs offer software developers unprecedented power and potential in an ever smaller package, said AMD.

                                                                                                                The AMD A series APUs are capable of delivering more than 10.5 hours of battery life during idle mode, a more than 50% increase compared to AMD’s previous mainstream platform. Additionally, AMD dynamic switchable graphics optimize battery life on PCs featuring AMD dual-graphics solutions by intelligently managing power states on the APU and separate discrete AMD Radeon GPU.

                                                                                                                TSMC wins orders for 28nm GPU from AMD, says paper [June 17, 2011] (emphasis is mine)

                                                                                                                AMD reportedly has completed the tape-out of its next-generation GPU, codenamed Southern Islands, on Taiwan Semiconductor Manufacturing Company’s (TSMC) 28nm process with High-k Metal Gate (HKMG) technology, according to a Chinese-language Commercial Times report. The chip is set to expected to enter mass produciton at the end of 2011.

                                                                                                                TSMC will also be AMD’s major foundry partner for the 28nmKrishna and Wichita accelerated processing units (APUs), with volume production set to begin in the first half of 2012, the report said.

                                                                                                                TSMC reportedly contract manufactures the Ontario, Zacate and Desna APUs for AMD as well as the Northern Island family of GPUs. All of these use the foundry’s 40nm process technology.

                                                                                                                TSMC was quoted as saying in previous reports that it had begun equipment move-in for the phase one facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products slated for the fourth quarter of 2011. The foundry previously said it would begin moving equipment into the facility in June, with volume production expected to kick off in the first quarter of 2012.

                                                                                                                Foundry partners for next-generation AMD APU and GPU series
                                                                                                                Product/Partner 2011 2012
                                                                                                                Mainstream and high-end APU Llano Trinity
                                                                                                                Foundry partners Globalfoundries 32nm SOI Globalfoundries 32nm SOI
                                                                                                                Entry-level APU targeting tablets Ontario/ Zacate/ Desna Krishna/Wichita
                                                                                                                Foundry partners TSMC 40nm TSMC 28nm HKMG, Globalfoundries 28nm HKMG
                                                                                                                GPU Northern Islands Southern Islands
                                                                                                                Foundry partners TSMC 40nm TSMC 28nm HKMG

                                                                                                                Source: Commercial Times [Chinese language], compiled by Digitimes, June 2011

                                                                                                                AMD Said to Contract TSMC, GlobalFoundries to Make 28nm Chips [June 20, 2011]

                                                                                                                Advanced Micro Devices (AMD) is reportedly to designate Taiwan Semiconductor Manufacturing Co. (TSMC) as its primary contract supplier of 28nm Krishna/Wichita microprocessors early next year and GlobalFoundries as another contract source later in 2012, according to local media.

                                                                                                                The report said that Krishna/Wichita are the next-generation versions of the low-end AMD Ontario/Zacate family. AMD has contracted TSMC, currently the world`s No.1 pure silicon foundry, to build its Ontario/Zacate processors and the Desna processors meant for tablet PCs using 40nm process technology.

                                                                                                                Robust demand for Ontario/Zacate and Desna processors in developing economies has promoted AMD to ramp up contracts to TSMC.

                                                                                                                Also, AMD Northern Island-family graphics processing units are under volume production at TSMC based on 40nm process. The graphics lineup`s next generation, the 28nm Southern Island family, has seen its tapeout completed by TSMC, which is expected to start contract manufacturing of the chips for AMD by the end of this year.

                                                                                                                AMD`s 32nm Llano processors have entered into volume production at GlobalFoudries. The report also noted that GlobalFoundries will be also a major contract manufacturer of AMD`s Trinity processors, which are designed on 32nm SOI rule, in 2012. Trinity is developed for laptops and more efficient than Llano.

                                                                                                                Globalfoundries names interim CEO, new key management appointments [June, 2011] (emphasis is mine)

                                                                                                                The board of directors of Globalfoundries, along with its majority shareholder the Advanced Technology Investment Company (ATIC), has announced its new leadership.

                                                                                                                Semiconductor industry veteran Ajit Manocha has been appointed interim CEO of Globalfoundries. James Norling will serve as executive chairman and Ibrahim Ajami will serve as VP of the company’s board of directors. All appointments are effective immediately.

                                                                                                                Doug Grose, who has served as CEO of Globalfoundries since its inception, will transition to become senior adviser to Globalfoundries and ATIC with a focus on technology leadership and ensuring delivery of next generation technologies for competitive differentiation. COO Chia Song Hwee will remain with the company in that position until August 2011, when he will return to be part of Singapore’s business future, Globalfoundries indicated.

                                                                                                                “Doug Grose and Chia Song Hwee formed the foundation of Globalfoundries, bringing together the world’s leading-edge manufacturing technology with the heritage of a full-service foundry partner,” said Norling. “This new leadership team will build on that foundation, as we increase investment in technology, capacity and talent while optimizing performance.”

                                                                                                                Norling also said an executive search for a permanent CEO has already begun. Manocha’s focus is to work closely with top management and talent of the company to optimize performance, and continue progress on the capacity and technology roadmap.

                                                                                                                Manocha has more than 30 years of global expertise in operations, general management and manufacturing. He was previously executive VP of Worldwide Operations at Spansion.

                                                                                                                Norling is the former chairman of Chartered and also served as interim CEO of that company in 2002. He was previously with Motorola from 1965 to 2000 holding various positions.

                                                                                                                “Globalfoundries, with the continuous support of ATIC, is in the middle of an intense, competitive ramp-up of manufacturing capacity and technology development,” said Ajami, who will also remain CEO of ATIC. “Under this new leadership team, investment in Globalfoundries will double over the next 18 months.”

                                                                                                                Through end of May 2011, ATIC had invested over US$6 billion to acquire the former manufacturing assets of AMD in Dresden, Germany, and the assets of Chartered Semiconductor Manufacturing of Singapore, as well as an estimated US$1 billion to construct a new fabrication facility in upstate New York. Through the end of 2012, ATIC will invest another approximately US$6 billion in manufacturing capacity in Dresden, Singapore and New York with initial construction to begin in Abu Dhabi, Globalfoundries said in a statement.

                                                                                                                AMD displaying next generation APU platform; adopts 28nm process in 2012 [June 16, 2011] (emphasis is mine)

                                                                                                                AMD has displayed notebook models using its next-generation Trinity platform, based on Bulldozer at its Fusion Developer Summit (AFDS), and is set to launch the new platform in 2012 with enhanced performance and power consumption compared to its current Llano platform. The new platform’s parallel calculations are also estimated to perform 50% better, according to Rick Bergman, Senior Vice President and General Manager Products Group, AMD.

                                                                                                                AMD’s APU product line is currently divided into several different segments:
                                                                                                                G series CPUs, set to target embedded products;
                                                                                                                C series CPUs designed for ultra-thin notebooks or tablet PCs;
                                                                                                                Z series mainly targeting tablet PCs;
                                                                                                                E series targeting ultra-thin notebooks or small form factor (SFF) desktop PCs; and
                                                                                                                A series targeting mainstream notebooks, all-in-one PCs and desktop PCs.

                                                                                                                Compared to Intel’s processors, Bergman believes AMD’s APU shares a similar concept as Intel’s Sandy Bridge, but Sandy Bridge is unable to provide parallel calculations as strong as AMD’s APU, and does not support the existing industry standards such as DirectX 11, Open GL 4.1 or OpenCL. In addition, Sandy Bridge is designed based on the application user interface of Windows Vista, while AMD’s APU is capable of fully supporting the application user interface of Windows 7, Bergman added.

                                                                                                                As for the product design, Intel’s graphics technologies only account for a small proportion of the CPU product’s size, while AMD’s GPU design accounts for about 40% of the APU’s size. The company is even integrating a graphics solution with a performance level of discrete graphics chips to offer strong parallel calculations and Intel’s graphic solution, which is rather basic and simple, is not capable of competing against such advances, Bergman noted.

                                                                                                                In addition, AMD’s Dual Graphics technology also allows its APU to coordinate with AMD’s discrete graphics cards to allow a graphics performance boost of 75%. With Intel’s graphics solution in Sandy Bridge, the integrated graphics is not used if an additional discrete graphics card is added to the platform, Berman pointed out.

                                                                                                                The Trinity platform will still adopt 32nm process and AMD is set to launch Krishna with 28nm process in 2012, Bergman noted. Commenting on questions whether AMD will outsource its production to Globalfoundries or Taiwan Semiconductor Manufacturing Company (TSMC), Bergman only said that both firms will have the chance to produce the 28nm products for AMD.

                                                                                                                Leaked Presentation Reveals AMD’s Fusion Strategy [May 27, 2011]

                                                                                                                AMD APUs for 2012: 32nm Trinity, 28nm Krishna, 28nm Hondo. Not shown are 28nm Wichita, Weatherford and Richland

                                                                                                                AMD Details Future Technical Roadmap for its Award Winning Fusion Architecture at Industry Developer Summit [June 14, 2011] (emphasis is mine)

                                                                                                                AMD (NYSE: AMD) detailed to more than 700 developers and PC industry executives the roadmap for its Fusion System Architecture (FSA). The specific design features planned for future AMD products were presented in the opening keynote of the AMD Fusion Developer Summit. FSA describes AMD’s overarching design for having combinations of CPU and GPU processor cores operate as a unified processing engine that is both higher performance and much lower power than previous architectures. Many of the specific FSA enhancements discussed will be leveraged by newer programming languages, and interfaces like OpenCL™ and DirectCompute, making it easier for the software developer to fully exploit the unique capabilities of the AMD accelerated processing unit (APU).

                                                                                                                “The first APUs from AMD dramatically increase processing performance while consuming less power and now we are building upon that achievement with our next generation of products” said Phil Rogers, AMD Corporate Fellow. “Future innovations are intended to make the different processor cores more transparent to programmers. They can then seamlessly tap into the gigaflops of power-efficient performance available on the APU and design even faster, more visually stunning applications on a wide range of form factors.”

                                                                                                                Today’s APUs

                                                                                                                Available since January of this year, AMD’s line-up of APUs are the first to integrate x86 CPU cores and DirectX™ 11-capable Radeon™ GPU cores on a single die and have been widely adopted by computing OEMs worldwide.  Being on the same chip reduces the system power and bill-of-materials, speeds the flow of data between the CPU and GPU through shared memory, and allows the GPU to function as both a graphics engine and an application accelerator in highly efficient compute platforms.

                                                                                                                APUs of Tomorrow

                                                                                                                Building on the success of the integration of CPU and GPU processing cores on the same chip, AMD is now focused on evolving the architecture to make it appear as a unified processing element to the software programmer.   That includes a number of evolutionary steps expected to continue through 2014 such as:

                                                                                                                • Support for C++ features that more fully leverage the GPU as a parallel processor
                                                                                                                • User-mode scheduling for lower latency task dispatch between CPUs and GPUs
                                                                                                                • Unified memory address space and fully coherent memory shared by the CPU and GPU so they operate seamlessly together

                                                                                                                AMD also announced plans to publish a detailed specification on the features and functionality required to meet the requirements of the architecture.

                                                                                                                Supporting Resources

                                                                                                                • A webcast replay of Phil Roger’s keynote will be available for 10 days
                                                                                                                • Access AMD’s Developer Central site for the latest tools and tutorials
                                                                                                                • Information on the AMD Fusion Family of APU processors

                                                                                                                What’s next for AMD Fusion? [June 15, 2011] By Phil Rogers – Corporate Fellow at AMD (emphasis is mine)

                                                                                                                What a year it has been already for AMD and its APU products – we have now announced top-to-bottom families of processors that support everything from low-power tablets to performance notebooks and desktops.   All of which integrate DirectX™ 11™-capable graphics with new “Bobcator 32nmStars” x86 CPU cores.   Bringing the GPU and the CPU together on a single chip was a critical step for AMD, and the resulting processors are finding a welcome home with OEMs and end-users.

                                                                                                                We are just getting started.

                                                                                                                At this week’s AMD Fusion Development Summit in Bellevue, Washington, I spoke to more than 600 attendees about where we plan to take the industry next with the AMD Fusion System Architecture (FSA).  The audience was primarily software developers, recognizing that they are critical to our success and that we want their participation during the development of the platform.  I have been developing 3D graphics and parallel computation software for more than 20 years, so I understand why total platform design is required to fully enable a programmer’s creativity and productivity.

                                                                                                                In steering the architectural direction of FSA in my role as Corporate Fellow, my primary concern has been how to make heterogeneous (i.e., APU) programming easier, more natural and accessible to the largest possible community of software developers.

                                                                                                                So what does that mean, really?  We aim to make the unprecedented parallel processing capability of the GPU on the APU as accessible to programmers as the CPU is today.  To do that there are a series of simplifying steps we plan to take that will improve on what is already a great foundation:

                                                                                                                • Add support for C++ features that more fully leverage the GPU as a parallel processor
                                                                                                                • Unify the memory address space shared by the CPU and GPU, and make it coherent, so they operate seamlessly together.
                                                                                                                • Add user mode scheduling, to dramatically reduce the time it takes for the CPU and GPU to dispatch work to each other.

                                                                                                                There are others, but these are big ones, resulting in the biggest leap forward.  Once the AMD Fusion System Architecture is realized, the GPU is a true peer processor to the CPU, with direct access by software.

                                                                                                                In the meantime, the benefits of the integration step are readily apparent:  dramatic improvements in battery life for AMD platforms; smaller form factors through reduction in the silicon footprint; acceleration of applications that leverage OpenCL and DirectCompute via the GPU, just to name a few.

                                                                                                                I hope you will check back in to the AMD Fusion Blog from time-to-time to get updates on our progress!

                                                                                                                A webcast replay of my keynote will be available for the next 10 days.

                                                                                                                AMD Announces Thought Leaders from ARM and Microsoft to be Among Keynote Speakers at AMD Fusion Developer Summit [April 26, 2011] (emphasis is mine)

                                                                                                                AMD (NYSE: AMD) today announced a distinguished line-up of keynote speakers as well as technical session topics for the inaugural AMD Fusion Developer Summit (AFDS), which will be held June 13-16, 2011 at the Meydenbauer Center in Bellevue, Washington.

                                                                                                                Industry keynote presentations will be delivered by esteemed industry experts from AMD, ARM and Microsoft. In his keynote “Heterogeneous Parallelism at Microsoft” Herb Sutter, Microsoft principal architect of Native Languages, will showcase upcoming innovations to bring access to increasingly heterogeneous compute resources directly into the world’s most popular native languages.

                                                                                                                Jem Davies, ARM fellow and vice president of Technology, Media Processing Division, will deliver a keynote about ARM’s long history of heterogeneous computing, its future strategy, and ARM’s support of standards, including OpenCL™.

                                                                                                                The summit will open and close with AMD keynote presentations as well. AMD corporate fellow Phil Rogers will explore the programmer’s guide to Accelerated Processing Units (APUs), and Eric Demers, AMD corporate vice president and chief technology officer, Graphics, will deliver a keynote that chronicles the evolution of AMD’s graphics cores and discuss next-generation AMD graphics technology.

                                                                                                                “The development experts we’ve chosen to share their work at AFDS are at the forefront of next-generation programming, and are working to harness the full processing power of heterogeneous computing technologies,” said  Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The AMD Fusion Developer Summit is the best place for developers, academics and innovators to collaborate around parallel programming and industry standards, helping the developer community to realize the promise of the latest computing methodologies, today and into the future.”

                                                                                                                Technical sessions, tutorials, hands-on labs and keynote presentations at AFDS will cover a range of topics including heterogeneous and high-performance computing (HPC), next-generation user interfaces, parallel programming tools and industry-standard application programming interfaces (APIs) such as OpenCL™, OpenGL™, Java and Microsoft DirectCompute. The Session Catalog for the AMD Fusion Developer Summit lists more than 90 in-depth technology sessions to be presented by industry and academic experts.

                                                                                                                Speakers will be in attendance from a range of industry companies, universities and government organizations. Session topics include:

                                                                                                                • Developer Tools
                                                                                                                • Enterprise Computing
                                                                                                                • High-Performance Computing
                                                                                                                • Multimedia Processing
                                                                                                                • Professional Graphics and Visual Computing
                                                                                                                • Programming Models
                                                                                                                • Security
                                                                                                                • User Interface and Media Experiences

                                                                                                                Developers interested in the latest heterogeneous computing tools and training can register for AFDS on the event website and take advantage of a special low registration fee of $300 this inaugural year.

                                                                                                                Resources

                                                                                                                AMD Demonstrates Llano APU [Oct 18, 2010]

                                                                                                                AMD’s Chris Cloran demonstrates the Llano APU in Taipei at the 6th annual AMD Technical Forum and Exhibition. In the first public demonstration of Llano, Chris demonstrates simultaneous HD video playback, multi-threaded Pi calculation, and N-Body simulation utilizing the CPU and GPU cores.

                                                                                                                AMD Ushers in Next Generation of Computing with AMD A-Series APUs [June 14, 2011] (emphasis is mine)

                                                                                                                AMD (NYSE: AMD) today announced the next generation in mainstream consumer computing with the availability of the new high-performance AMD Fusion A-Series Accelerated Processing Units (APUs). Enabling truly immersive computing experiences in consumer notebooks and desktops, the AMD A-Series APUs enable brilliant HD graphics, supercomputer-like performance and over 10.5 hours of battery life2.

                                                                                                                In an increasingly digital and visually oriented world, consumers are placing ever-higher priorities on multitasking, vivid graphics, lifelike games, lag-free videos, and ultimate multimedia performance. To meet these needs, the AMD A-Series APUs combine up to four x86 CPU cores with powerful DirectX®11-capable discrete-level graphics and up to 400 Radeon™ cores along with dedicated HD video processing on a single chip. AMD A-Series APUs also allow for advanced capabilities such as gestural interfaces, multi-monitor support, 3D entertainment and real-time image stabilization3.

                                                                                                                “The AMD A-Series APU represents an inflection point for AMD and is perhaps the industry’s biggest architectural change since the invention of the microprocessor,” said Rick Bergman, senior vice president and general manager, AMD Products Group. “It heralds the arrival of brilliant all-new computing experiences, and enables unprecedented graphics and video performance in notebooks and PCs. Beginning today we are bringing discrete-class graphics to the mainstream.”

                                                                                                                The AMD A-Series APUs (previously codenamed “Llano”) are currently shipping and scheduled to appear in more than 150 notebooks and desktops4 from leading OEMs throughout the second quarter of 2011 and beyond. Delivering powerful serial and parallel computing capabilities for HD video, 3D rendering and data-intensive workloads in a single-die processor, the AMD A-Series APUs offer software developers unprecedented power and potential in an ever smaller package.

                                                                                                                AMD AllDay™ Power: Battery Life that Lasts

                                                                                                                The AMD A-Series APU delivers the power to match how consumers actually use their PCs: all day – without sacrificing performance. Delivering more than 10.5 hours of resting battery life – a more than 50 percent increase compared to the 2010 AMD Mainstream Platform – users can get their work done or watch multiple HD movies on a single charge5. Additionally, AMD dynamic switchable graphics optimize battery life on PCs featuring AMD dual-graphics solutions by intelligently managing power states on the APU and separate discrete AMD Radeon™ GPU.

                                                                                                                “The battery life of the AMD A-Series APU is a huge leap forward and will surprise many consumers and commercial customers,” said Chris Cloran, Vice President and General Manager, Client Division, AMD. “And the supercomputer-like performance will give people some revolutionary capabilities, like real-time image stabilization –taking out all the shakes and jitters in those hand-held videos on the fly, while you’re watching.”

                                                                                                                Brilliant HD: Every Pixel Matters

                                                                                                                People are making, sharing and enjoying more digital content than ever on their PCs, and the AMD VISION Engine – cutting-edge hardware and software featured with every AMD A-Series APU that automatically helps digital content like videos, games and photos look their best. HD video is crystal clear through dedicated video playback technology and dynamic post-processing, and websites render faster with accelerated HTML5 and Direct2D performance. Editing, transferring and viewing HD content is fast and easy with support for advanced connection standards, including HDMI 1.4a, DisplayPort 1.1, and USB 3.0, along with native support for multiple monitors.

                                                                                                                Also introduced with the AMD A-Series APU is a new feature called AMD Steady Video6 designed to stabilize videos during playback – making unsteady, jumpy content look steady and smooth. The AMD A-Series APU can also enables advanced capabilities like gestural interfaces, 3D gaming and 3D Blu-ray video entertainment – features that are now key to consumer PC experiences and expectations.

                                                                                                                Every PC built with an AMD A-Series APU delivers brilliant HD by offering discrete-class DirectX® 11-capable graphics – with models available at virtually every price point. Only AMD Fusion APUs offer true AMD Dual Graphics, with up to 75 percent graphics performance boost, when paired with an AMD Radeon™ discrete graphics card7.  This faster, higher-quality, more vivid and lifelike delivery makes consumers feel fully present in their digital world, especially when gaming.

                                                                                                                Personal Supercomputing: Ultimate Performance

                                                                                                                Consumers are doing more than ever before with their PCs – from work to play – and with the AMD A-Series APU, even their laptops can keep up, delivering  next generation  parallel processing.  With up to 400 gigaflops for notebook, and up to 500 gigaflops for desktops8, AMD A-Series APUs ensure users have the horsepower needed to handle the most demanding applications such as video and image processing, facial recognition, gesture recognition and multitasking scenarios. For the most challenging environments, AMD Fusion A-Series APUs offer AMD Turbo Core Technology, which dynamically optimizes and boosts CPU and GPU performance to power-efficient levels depending on the applications being run.

                                                                                                                The Growing AMD Fusion Ecosystem

                                                                                                                AMD has seen great momentum in the software developer community since the launch of AMD Fusion APUs in January 2011, with more than 50 leading applications now accelerated by the family of AMD Fusion APUs and advanced browsers like Internet Explorer 9 delivering even more immersive, next generation web experiences when running on an AMD Fusion APU-powered PC. And, the inaugural AMD Fusion Developer Summit, running now through June 16 in Seattle, Washington, is providing a forum for developers, academics and innovators to collaborate around parallel programming and industry standards, like OpenCL™, helping the software ecosystem build on the promise of the latest computing methodologies.

                                                                                                                Supporting Resources

                                                                                                                AMD Fusion APU Llano in a Multi-Tasking Technology Demonstration [Feb 28, 2011]

                                                                                                                AMD’s Fusion APU code-named Llano handles high definition graphics and video with ease and excellent power efficiency. In this demonstration, The Llano APU goes head-to-head in visually intense workloads against a system based on Intel Core i7-2630QM based on the Sandy Bridge architecture. CPU –

                                                                                                                Configurations Employed In Video Demo
                                                                                                                APU – AMD Accelerated Quad-Core Processor [A8-3510MX later coming out @1.GHz and 45W] Engineering Sample
                                                                                                                Chipset – AMD Fusion Controller Hub Engineering Sample
                                                                                                                Video Driver – 8.830.0.0
                                                                                                                Screen Size – 14 inch Diagonal
                                                                                                                Screen Resolution – 1366 X 768
                                                                                                                Memory – 4 Gb 1333 DDR3Ram
                                                                                                                Hard Drive – C300 128Gb SSD
                                                                                                                OS – Windows 7 Professional 64 bit

                                                                                                                CPU – Intel® Core™ i7-2630QM 2.0Ghz
                                                                                                                Graphics – Intel® HD 3000 Graphics
                                                                                                                Chipset – Intel® 6 Series/C200 series chipset family
                                                                                                                Video Driver – 8.15.10.2279
                                                                                                                Screen Size – 14 inch Diagonal
                                                                                                                Screen Resolution – 1366 X 768
                                                                                                                Memory – 4 Gb 1333 DDR3Ram
                                                                                                                Hard Drive – C300 128Gb SSD
                                                                                                                OS – Windows 7 Professional 64 bit

                                                                                                                AMD Platform Innovations with ‘Sabine’ [A-Series] [June 9, 2011] (emphasis is mine)

                                                                                                                I recently attended an AMD event in Abu Dhabi, UAE where we held a briefing of our upcoming “Sabine” notebook platform featuring our new APU, codenamed “Llano.  In AMD parlance, “Llano” is the “big iron”, that is, processors designed for performance first.  After I delivered my presentation, I had a chance to speak with some of the press to gauge their feedback.  One universal theme was the great impression that we made with our platform innovations, features, features outside of the core x86, graphics, video and compute functions.  Here is a brief summary of the great steps forward we have made with the platform features of “Sabine”.

                                                                                                                Power

                                                                                                                Systems based on AMD technology have long been criticized for having a shorter battery life than systems based on competing technology.  This is no longer the case with “Sabine.”  Yes.  In fact, internal testing demonstrates our “Sabine” platform will yield as good or better battery life than our competitor’s current platforms.  In our labs we were able to exceed our expectations in terms of battery life using the Windows 7 idle test on the very same platform that we sampled to the press. This battery life performance handily surpasses a competing platform that was purchased at retail.

                                                                                                                This will be a shocker to many people including the competition.  As with any significantly disruptive product, the “Llano” APU is transformational across many vectors.  As if the nearly 500 Gigaflops or Quad Core x86 combined with a Discrete Class DirectX 11-capable GPU wasn’t enough, Llano has exceeded expectations is reducing our idle power consumption and increasing our power efficiency.

                                                                                                                AMD has become increasingly religious about lowering power consumption over the past few years.  When we designed the “Llano” APU, power was of primary importance in our design goals.  It would be very convenient if there was just one area that consumed excessive power; what we found however was that cumulative savings came from many contributing factors and our engineering teams fought for every last mW of those savings. In the end we delivered enough power savings to enable us boost battery life dramatically over our prior platforms! How long exactly? You’ll have to wait until we launch in June for that info. But trust me, it will be worth the wait.

                                                                                                                Ironically, we have engineers in the company who work on delivering the best performance available for a 300 watt graphics card — and those same engineers fought for 50 mW on other products.  50 mW is 1 6000th of 300 watts!

                                                                                                                Our course, it is not just idle power where AMD has innovated.  With modern graphics based workloads, we really show “Llano’s” mettle.  As the video below demonstrates, the “Llano” APU enables several hours of intensive graphics active platform use, while on battery power, surpassing the capability of the competitive platform. This is a testament to AMD’s decision to use an extremely efficient and powerful graphics processor.

                                                                                                                USB 3.0 Integration

                                                                                                                With our new “Sabine” platform, AMD is the first company to integrate USB 3.0 into its core logic.  Because of this, we’re enabling the following benefits of USB 3.0 over USB 2.0:

                                                                                                                • 10X bandwidth allowing up to 5 Gbps transfer rates
                                                                                                                • Full Duplex and Asynchronous operation
                                                                                                                • More power available through the ports

                                                                                                                Translation:  USB 3.0 enables the use of 1080p cameras!  This means a new level of realism for video conferencing and other forms of tele-presence.  We have been working with our partner, Point Grey who have developed a very small USB 3.0 based camera which they call “Flea3”.  This camera can stream uncompressed 1080p60 video. As you can see in the linked video <link>, while an AMD system using Flea3 is able to request and process the same frames per second rate as the Intel system, it’s also able to display up to 4x the Hz— enabling a much sharper, jolt-free visual experience.  There are other benefits to integrating USB 3.0 as well, including the availability of 4 ports instead of the current 2 found in most discrete solutions today.

                                                                                                                AMD has really transformed itself over the past 4 years as “Llano” gestated.  As we get closer to the launch, more details will continue to trickle out.  AMD is extremely excited to finally deliver the “Big Iron” APU.  Personally, I cannot wait until I can get hold of one to call my own.

                                                                                                                The art of the possible with Unilimited Realities [June 14, 2011]

                                                                                                                You know when you see something that makes you say “Wow”. That was my reaction when I saw the work that New Zealand-based Unlimited Realities was doing in the area of touch-based consumer applications. And now, I’m pleased to be able to talk about our collaboration on the next generation of their Fingertapps suite of apps.

                                                                                                                What is unique about Unlimited Realities is that they combine the latest technologies, like graphics acceleration with DirectX 11, with new ways of interacting with your PC, like touch, to create applications that appeal to a broad consumer base. Things like touch-based musical instruments, family activity apps and multi-player touch enabled games.

                                                                                                                At AMD’s Experience Brilliance launch of the AMD A-Series APUs in Seattle last night, we showed off some of the work that the teams have been doing over the past few months to demonstrate what is possible when you combine software and hardware innovation. The new apps take advantage of the unique capabilities in the AMD Fusion APUs to give you an amazing visual experience not possible on previous generations of processors.

                                                                                                                The AMD APU-optimized versions of Fingertapps are expected to be available later this summer.

                                                                                                                Flirtatious Francois: AMD Fusion [June 8, 2011]

                                                                                                                AMD’s line-up of APUs are the first to integrate x86 CPU cores and DirectX™ 11-capable Radeon™ GPU cores on a single die.

                                                                                                                AMD Unveils New Software Tools Designed to Accelerate the Development of Brilliant Computing Experiences [June 13, 2011]

                                                                                                                AMD (NYSE: AMD) today announced a new set of software development tools and solutions to enable developers to optimize their applications for OpenCL™ standards. These advanced tools create a foundation for software companies to realize the full potential of the AMD Fusion Family of Accelerated Processing Units (APUs), harnessing the combined compute power of AMD’s high-performance CPUs and GPUs across a wide array of heterogeneous computing platforms. As a result, developers can bring to life innovative experiences like HD video, 3D gaming, video conferencing and intuitive user interfaces, to truly differentiate their applications in the market.

                                                                                                                “AMD is working closely with the developer community to make it easier to bring the benefits of heterogeneous computing to consumers, enabling next-generation system features like vivid video, supercomputer-like performance and enhanced battery life,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “Our advanced developer tools and solutions enable a new era of parallel programming that’s based on industry standards and focused on delivering innovative user experiences that span a variety of computing form factors.”

                                                                                                                Among the new offerings is the gDEBugger™ product, which was created by experts from AMD’s new Israeli research center, based on AMD’s acquisition of startup company Graphic Remedy in October 2010. gDEBugger is an advanced OpenCL and OpenGL debugger, profiler and memory analyzer. The new AMD gDEBugger release provides developers with the ability to debug OpenCL kernels, running on AMD GPUs, and step through their source code while examining kernel variables and data. This product, which is a plug-in designed to work with Microsoft Visual Studio®, includes all of gDEBugger’s previous features and capabilities.

                                                                                                                Additional developer solutions include a Parallel Path Analyzer (PPA), Global Memory for Accelerators (GMAC) and Task Manager tools, which are being developed by Multicoreware in collaboration with AMD. These new tools and solutions, expected to be available in Beta during Q3 of this year, are designed to make OpenCL GPU development easier and more efficient.

                                                                                                                • Parallel Path Analyzer (PPA) is an advanced profiling tool for developing applications that optimize both GPU and CPU load. The PPA visualizes data transfers and kernel execution, identifies system-wide critical paths and locates data dependencies.
                                                                                                                • The Global Memory for Accelerators (GMAC) API provides a framework in which a developer can create applications leveraging the immense compute capabilities of OpenCL, but without the overhead of having to explicitly manage multiple data buffers across the separate address spaces of GPU and CPU.
                                                                                                                • The Task Manager API provides a framework for managing compute tasks in a heterogeneous multi-core environment. OpenCL kernels can be automatically scheduled to execute on an available and task-appropriate device, providing dynamic load balancing, optimizing use of available compute resources and removing the burden of explicit schedule handling.
                                                                                                                • The new tools expand AMD’s robust line of developer solutions that are publicly available on the AMD Developer Central website, including software development kits, libraries, compilers, webinars and educational support. In addition, developers will be able to learn more about AMD’s comprehensive set of software tools and solutions at the AMD Fusion Developer Summit taking place this week in Bellevue, Washington. Summit participants will be able to engage in interactive sessions and hands-on labs to deepen their knowledge of advanced CPU and GPU programmability.

                                                                                                                Resources

                                                                                                                AMD Launches Contest for Developers to Create Heterogeneous Compute Applications [June 15, 2011]

                                                                                                                AMD (NYSE: AMD) today announced the AMD OpenCL™ Coding Competition, being run by software development leader TopCoder. This contest is intended to encourage the creation of applications that take advantage of OpenCL™ as well as the award-winning AMD Fusion accelerated processing unit (APU) architecture. The OpenCL™ Coding Competition is open to software developers with great ideas, and up to $50,000 in prizes will be awarded to winning submissions.

                                                                                                                “We’re at an inflection point in the computing industry with evolving chip architectures and the shift to common programming interfaces and industry standards, which enable developers to enable amazing new experiences,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The OpenCL Coding Competition is just the beginning of a new wave of application development by the software community as they embrace heterogeneous computing across multiple platforms.”

                                                                                                                AMD Accelerated Parallel Processing (APP) technology (formerly ATI Stream) is a set of advanced hardware and software technologies that support OpenCL and enable highly parallel compute-capable GPUs to work in concert with a system’s CPU to accelerate applications beyond traditional x86 graphics and video processing. AMD Fusion APUs combine multi-core x86 technology with a discrete-level DirectX® 11-capable GPU in a single processor design, connected by a high speed link, to deliver up to 500 gigaflops of compute performance.1

                                                                                                                Developers and students who choose to participate will be asked to submit an abstract that outlines how they plan to use the latest generation AMD APP software development kit (SDK) with OpenCL support to create an accelerated application for the AMD Fusion APU platforms.

                                                                                                                Contestants can choose to create an application in any category including, but not limited to, the following:

                                                                                                                • Video Processing
                                                                                                                • Image Processing
                                                                                                                • Security
                                                                                                                • Human Computer Interface
                                                                                                                • Data Mining
                                                                                                                • Gaming
                                                                                                                • Physics processing
                                                                                                                • Social Networking / Communication
                                                                                                                • Other

                                                                                                                “We see APU architecture continuing to be widely adopted for new computing designs, and believe that developers will want to build and optimize their applications around the high performance achieved with these new hardware platforms,” said Matt Murphy, TopCoder platform manager. “This technology shift signifies a sizeable opportunity for developers around the world who want to be early to embrace a new era of heterogeneous computing.”

                                                                                                                In addition to the SDK, contestants will need the latest AMD Catalyst™ drivers that include the OpenCL runtime compiler. Released in May 2011, the latest AMD Catalyst drivers for Windows and Linux also bring new features, including expanded support for multi-display environments through AMD Eyefinity technology, which developers can leverage to create even more immersive experiences for end users.

                                                                                                                For full details and a complete set of Official Rules for the AMD OpenCL™ Coding Competition, please visit http://community.topcoder.com/amdapp/

                                                                                                                Resources

                                                                                                                AMD and Academic Experts Collaborate with Morgan Kaufmann Publishers on OpenCL™ Book [June 15, 2011]

                                                                                                                AMD (NYSE: AMD) today announced its   collaboration on a new book for developers, Heterogeneous Computing with OpenCL, to be published by Morgan Kaufmann, an imprint of Elsevier Science & Technology Books. The book provides hands-on OpenCL™ experience and details multiple device architectures and application programming interfaces (APIs), from multi-core CPUs, GPUs and fully integrated Accelerated Processing Units (APUs) like AMD Fusion APU technology, to fundamental parallel algorithms.

                                                                                                                “This book is just one more example of how AMD enables the university and the developer communities with information and tools they need to embrace OpenCL and other common platforms,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The continued adoption of OpenCL will significantly expand the possibilities for software vendors and developers leading to a wide array of innovative applications and new experiences that benefit from massively parallel processing. There is a resultant need for education and training of the university community which this book will meet.”

                                                                                                                “We are seeing increasing demand for reference resources about common APIs,” said Todd Green, senior acquisitions editor of Morgan Kaufmann. “Application development across the PC, tablet and smartphone markets are red hot in terms of reader interest. We thank AMD and Northeastern University for shedding light on the common platforms and parallel computing movement; it’s a must-read book for every developer.”

                                                                                                                The book was co-authored by several industry and academic leaders from AMD and Northeastern University, including:

                                                                                                                • Benedict Gaster, OpenCL architect, AMD
                                                                                                                • Lee Howes, member of technical staff, AMD
                                                                                                                • David R. Kaeli, director of the Northeastern University Computer Architecture Research Laboratory (NUCAR), co-leader of the Northeastern University Institute for Information Assurance (IIA) and associate dean of Undergraduate Programs in the College of Engineering at Northeastern University
                                                                                                                • Perhaad Mistry, Ph.D Student, Department of Electrical and Computer Engineering, Northeastern University
                                                                                                                • Dana Schaa, Ph.D Student, Department of Electrical and Computer Engineering, Northeastern University

                                                                                                                Heterogeneous Computing with OpenCL is expected to be available in print and electronic formats in August 2011 from many major booksellers. The book provides detailed examples that illustrate the power and elegance of OpenCL to handle image processing, web plugins, random number generation, video processing and more.

                                                                                                                Resources

                                                                                                                Hardware and Software Leaders Fulfill Promise of Brilliant Experiences and New PC Capabilities with AMD A-Series APU Technology [June 14, 2011]

                                                                                                                AMD (NYSE: AMD) today announced growing support for the AMD Fusion Family of Accelerated Processing Units (APUs) with more than 50 leading applications now accelerated by AMD Fusion APUs. With today’s launch of the new AMD A-Series APUs, AMD unleashes unprecedented levels of performance in mobile and small form factors, with outstanding battery life. From software vendors and developers to motherboard suppliers, AMD’s APU ecosystem is basing hardware and software development on the new AMD A-Series APUs to help bring innovative new devices and applications to market. The APU is enabling new user experiences, for example, making video more life-like and enabling notebooks to achieve “supercomputer-like” performance.

                                                                                                                “AMD’s APU architecture gives developers a new set of tools with which they can build exciting applications,” said Nathan Brookwood, research fellow at Insight 64. “Developers who best exploit these new capabilities will help position their organizations for dramatic success.”

                                                                                                                “Our developer community is embracing the AMD Fusion APU platform with wonderful creativity and initiative,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “We’re only at the beginning of a wave of innovation that’s powered by our APU technology. With forward thinking from leading software developers and device manufacturers, we are creating the next generation of computing experiences.”

                                                                                                                New, Differentiated Applications

                                                                                                                Dozens of today’s most popular software applications are accelerated by AMD APU technology, many of which are being showcased this week at the AMD Fusion Developer Summit in Bellevue, Washington. These applications span a wide range of PC and tablet user scenarios, including multimedia, gaming, productivity, web browsing, facial recognition, video conferencing and more.

                                                                                                                Following is a sample of leading software and online content providers offering vivid computing experiences that are accelerated by AMD A-Series APUs:

                                                                                                                “Our customers expect the ultimate viewing experience from their Storm media player,” said Tom Yang, chief technology officer, BaoFeng, Inc. “We optimized our application with AMD Fusion APU technology to continue to deliver outstanding performance. Now, hundreds of millions of users receive just that – clear, smooth and incredibly vivid video from BaoFeng, a leading high-definition media player company in China with 180M users.”

                                                                                                                Industry-Leading Infrastructure Partners

                                                                                                                AMD motherboard partners are also continuing to innovate around AMD Fusion APUs, as leading original design manufacturers (ODMs), including ASUS, ASRock, Biostar, ECS, Foxconn (Hong Hai Precision), Gigabyte, Jetway, MSI and Sapphire, are either shipping or have announced integrated APU/motherboard products featuring AMD Fusion technology.

                                                                                                                AMD Vision Engine Software

                                                                                                                AMD VISION Engine Software uniquely differentiates AMD APU-based PCs. This exclusive software suite includes the AMD software driver that controls graphics and display, the AMD Vision Engine Control Center, and an OpenCL driver. AMD Vision Engine offers graphics and video features enabling DirectX11 gaming, dynamic contrast, edge enhancement and vibrant colors to help videos and visuals look more life-like. This software set also includes AMD Steady Video, enabling advanced image post processing technology to help stabilize shaky images during real-time playback of streaming videos1.

                                                                                                                Resources

                                                                                                                AMD Celebrates Innovation with VISIONary of the Year Award Winners [June 14, 2011]

                                                                                                                AMD (NYSE: AMD) today announced the AMD OpenCL™ Coding Competition, being run by software development leader TopCoder. This contest is intended to encourage the creation of applications that take advantage of OpenCL™ as well as the award-winning AMD Fusion accelerated processing unit (APU) architecture. The OpenCL™ Coding Competition is open to software developers with great ideas, and up to $50,000 in prizes will be awarded to winning submissions.

                                                                                                                “We’re at an inflection point in the computing industry with evolving chip architectures and the shift to common programming interfaces and industry standards, which enable developers to enable amazing new experiences,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The OpenCL Coding Competition is just the beginning of a new wave of application development by the software community as they embrace heterogeneous computing across multiple platforms.”

                                                                                                                AMD Accelerated Parallel Processing (APP) technology (formerly ATI Stream) is a set of advanced hardware and software technologies that support OpenCL and enable highly parallel compute-capable GPUs to work in concert with a system’s CPU to accelerate applications beyond traditional x86 graphics and video processing. AMD Fusion APUs combine multi-core x86 technology with a discrete-level DirectX® 11-capable GPU in a single processor design, connected by a high speed link, to deliver up to 500 gigaflops of compute performance.1

                                                                                                                Developers and students who choose to participate will be asked to submit an abstract that outlines how they plan to use the latest generation AMD APP software development kit (SDK) with OpenCL support to create an accelerated application for the AMD Fusion APU platforms.

                                                                                                                Contestants can choose to create an application in any category including, but not limited to, the following:

                                                                                                                • Video Processing
                                                                                                                • Image Processing
                                                                                                                • Security
                                                                                                                • Human Computer Interface
                                                                                                                • Data Mining
                                                                                                                • Gaming
                                                                                                                • Physics processing
                                                                                                                • Social Networking / Communication
                                                                                                                • Other

                                                                                                                “We see APU architecture continuing to be widely adopted for new computing designs, and believe that developers will want to build and optimize their applications around the high performance achieved with these new hardware platforms,” said Matt Murphy, TopCoder platform manager. “This technology shift signifies a sizeable opportunity for developers around the world who want to be early to embrace a new era of heterogeneous computing.”

                                                                                                                In addition to the SDK, contestants will need the latest AMD Catalyst™ drivers that include the OpenCL runtime compiler. Released in May 2011, the latest AMD Catalyst drivers for Windows and Linux also bring new features, including expanded support for multi-display environments through AMD Eyefinity technology, which developers can leverage to create even more immersive experiences for end users.

                                                                                                                For full details and a complete set of Official Rules for the AMD OpenCL™ Coding Competition, please visit http://community.topcoder.com/amdapp/

                                                                                                                Resources

                                                                                                                AMD and Leading Software Vendors Continue to Expand Offerings Optimized for OpenCL™ Standard  [June 8, 2011]

                                                                                                                AMD (NYSE: AMD) today announced increasing industry adoption of the OpenCL™ standard across a broad range of innovative software applications. As a long-standing proponent of industry standards, AMD works closely with leading software companies to help optimize their applications across common platforms, while accelerating these solutions with the latest technology offerings, including AMD Fusion Accelerated Processing Units (APUs).

                                                                                                                “Software developers can benefit significantly from working with common programming interfaces to harness the outstanding performance of innovative, heterogeneous technology like AMD Fusion APUs across platforms,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The software industry continues to advance at breakneck speed with an ever increasing number of innovative applications that are coming to market, which are based on common platforms such as OpenCL, OpenGL and DirectCompute.”

                                                                                                                As software developers embrace common application programming interfaces (APIs), the industry is seeing a groundswell of consumer and commercial applications built on the OpenCL standard, thanks to its inherent flexibility across platforms, operating systems and vendor hardware.

                                                                                                                “Today’s creative professional needs a complete solution that delivers clear, crisp and stutter-free visuals that will allow them to edit, process and create content quickly and without interruption,” said Dave Chaimson, vice president of global marketing, Sony Creative Software. “New support has been added to Vegas Pro 10.0d for accelerated OpenCL based video rendering. We see this as a solid first step towards a faster production workflow for video professionals, and we are strongly committed to the OpenCL standard.”

                                                                                                                HP Labs also is working with AMD to implement OpenCL acceleration of real-time imaging software for HP large-format, commercial and industrial printing solutions. “Innovative, leading-edge technology is key to providing the best possible support to HP’s commercial printing customers,” said I-Jong Lin, principal scientist, Print and Content Delivery, HP Corporate Research Laboratory. “The application of GPU acceleration in raster image processing has enabled a breakthrough in commercial printing solutions, and we anticipate replicating that success across market segments by porting our OpenPL library to OpenCL standards.”

                                                                                                                Following is a sample of leading applications that already support OpenCL or will support it in the near future:

                                                                                                                DVD/Media Players

                                                                                                                • ArcSoft, TotalMedia® Theatre – All-in-one video playback software
                                                                                                                • Corel WinDVD® – Blu-ray™ and DVD player software

                                                                                                                Telepresence and Webcam Apps

                                                                                                                • ArcSoft, Webcam Companion® – Application bundle with HD and 3D support for web cameras
                                                                                                                • ViVu VuRoom – Multi-party desktop videoconferencing software
                                                                                                                • ViVu VuCast – Large-scale video webcast software

                                                                                                                Video Creation/Editing Software

                                                                                                                • ArcSoft, ShowBiz® – Video editing software
                                                                                                                • Corel Digital Studio™ – integrated multimedia software suite
                                                                                                                • Corel VideoStudio® Pro – HD video-editing software
                                                                                                                • Cyberlink PowerDirector – Video editing software
                                                                                                                • Sony, Vegas Movie Studio HD – Home studio solutions for HD video editing
                                                                                                                • Sony, Vegas Pro – Professional solutions for HD video, audio and Blu-ray™ Disc creation

                                                                                                                Video, Photo Effects, Imaging and Utilities

                                                                                                                • ArcSoft, Panorama Maker Pro – Photo and video stitch plus media manager
                                                                                                                • eyeon, Fusion® – Visual effects and compositing tool
                                                                                                                • HP Labs, “Every Page Is Different” raster image processing and giga-pixel real-time imaging for HP large-format, commercial and industrial printing solutions
                                                                                                                • Viewdle, Uploader® – Facial recognition software for photography formats
                                                                                                                • Viewdle, Video SDK – Facial recognition software kit for video development

                                                                                                                Video Transcode Software

                                                                                                                • ArcSoft, MediaConverter – Multimedia file converter
                                                                                                                • Rovi, MainConcept® Transcoding Platform – Professional transcoding applications
                                                                                                                • Rovi, MainConcept® H.264/AVC OpenCL – Encoding Software Development Kit

                                                                                                                Engineering Simulation Software

                                                                                                                • Altair Engineering, HyperWorks RADIOSS – Finite element analysis (FEA) solver for linear and non-linear simulations
                                                                                                                • Dassault Systemes, PLM (Product Lifecycle Management) – Simulation and CAD software
                                                                                                                • DEM Solutions, EDEM – Discrete element modeling software solutions for particle flow simulation
                                                                                                                • ESI Group, PAM-CRASH and PAM-STAMP 2G solvers – Digital simulation software for prototyping and manufacturing processes
                                                                                                                • MSC Software, MSC Nastran – General purpose finite element analysis solution
                                                                                                                • OPTIS, RTLab and VRLab – Real-time ray-tracing software solutions

                                                                                                                A sampling of these applications will be demonstrated in the Experience Zone at the AMD Fusion Developer Summit to take place June 13-16 in Bellevue, Washington. Summit participants will be able to engage in interactive sessions and hands-on labs to deepen their knowledge of advanced CPU and GPU programmability, and gain a better understanding of how software applications can take full advantage of the parallel processing power of APUs, bringing supercomputer-like performance to everyday computing tasks.

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                                                                                                                AMD Fusion Accelerated Processing Units Win 2011 Best Choice of COMPUTEX TAIPEI Award [May 24, 2011]

                                                                                                                MD (NYSE: AMD) is awarded today with the highest industry honor, “2011 Best Choice of Computex TAIPEI Award” for its Fusion Accelerated Processing Units (APUs) in the Computer & System category. The award is given by Taipei Computer Association, key player in IT industry and exhibition in Taiwan, and appraised by a panel of government representatives, academicians, research analysts, oversea media, editor-in-chiefs and industry experts.

                                                                                                                AMD Fusion APUs offer a brand-new approach to processor design and better address users’ needs to handle more demanding workloads and visual computing in a small form factor device with long battery life. Only AMD Fusion APUs are engineered to deliver powerful CPU and GPU compute capabilities in a single-die processor for today’s HD video, 3D and data-intensive workloads for anyone looking for a richer visual computing experience whenever, wherever they want.

                                                                                                                “We are honored to receive this prestigious award from the Taipei Computer Association, which is a manifestation of our efforts and excellence in AMD Fusion APUs,” said Andy Tseng, AMD Corporate Vice President and Taiwan General Manager. “AMD Fusion APUs are already widely recognized within the industry for being creative and innovative. This award proves the importance of listening to our customers and designing breakthrough products around their needs.”

                                                                                                                Best Choice of COMPUTEX TAIPEI Award has recognized achievements in product design and technology innovation since 2002; it’s one of the important official events during COMPUTEX TAIPEI, the second largest ICT exhibition worldwide. Through reviews, the jury selected outstanding design and cutting-edge technology across 10 product categories.

                                                                                                                AMD and other awarded products will be demonstrated at Best Choice Award Pavilion by Taipei Computer Association at the upcoming 2011 Computex Exhibition. In addition, AMD’s products showcase will be located at Booth# L0617 in the TWTC Nangang Exhibition Hall. For more information on AMD 2011 Computex, please visit our event portal.

                                                                                                                For developers interested in learning more about APUs and heterogeneous computing, AMD will be holding its first AMD Fusion Developer Summit (AFDS) from June 13-16 in Bellevue, Washington. Summit participants will be able to engage in interactive sessions and hands-on labs to deepen their knowledge of advanced CPU and GPU programmability, and gain a better understanding of how software applications can take full advantage of the parallel processing power of APUs, bringing supercomputer-like performance to everyday computing tasks.

                                                                                                                Additional Resources

                                                                                                                AMD Fusion APU Receives “Best in Show” Award at Embedded Systems Conference [May 11, 2011]

                                                                                                                AMD (NYSE: AMD) announced the AMD Embedded G-Series APU was named “Best in Show” for hardware at the Embedded Systems Conference by the industry analyst firm VDC Research, which has been presenting the Embeddy Awards at ESC for seven years running. The primary criteria for the hardware category are an enabling product that offers new innovation and new or significantly better functionality.

                                                                                                                “We selected the AMD Embedded G-Series processor because it is an integrated circuit that combines a low-power CPU and a discrete-level GPU into a single embedded Accelerated Processing Unit (APU) for advanced graphics and multi-media integration,” said Richard Dean, program manager, VDC Research. “Among the benefits are the integration of the APU, which reduces the foot print size of a three-chip platform to two chips, and the overall reduction in costs across the product’s lifecycle.”

                                                                                                                “Embedded Systems Conference showcases the best of the best in our industry and it’s very gratifying that a product we feel can change the dynamics of the industry has been recognized as the top hardware product this year,” said Buddy Broeker, director, Embedded Solutions, AMD. “The AMD Embedded G-Series platform represents a major advancement for the capabilities of embedded systems and yet still enables reduction of the key thresholds of power, area and costs. This is a trend that AMD expects to continue in the years to come.”

                                                                                                                AMD is the only company in the industry today providing a complete roster of CPUs, chipsets, discrete GPUs, and APUs with the features and support to meet embedded system requirements.

                                                                                                                Additional Resources

                                                                                                                New AMD Embedded G-Series APUs Provide Thirty Nine Percent Power Reduction for Fanless Designs [May 23, 2011] (emphasis is mine)

                                                                                                                AMD (NYSE: AMD) today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions1. The very low power consumption and small 361mm² package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 “Bobcat” CPU cores and a discreet class DirectX® 11-capable GPU on a single die.

                                                                                                                “We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement,” said Buddy Broeker, director, Embedded Solutions, AMD. “System designers can now unleash their creativity without being constrained by heat or size issues.”

                                                                                                                A fanless solution is crucial for many small embedded systems where the added cost for an active cooling system can be prohibitive or for environments where silent operation is a key requirement. Additionally, many embedded products are deployed in harsh environmental conditions where the presence of a fan represents a potential failure point for the system. The AMD Embedded G-Series platform provides enterprise-class features and performance with the reliability, cost- and power-efficiencies these systems require.

                                                                                                                Systems based on the new low power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE. Additional customers are expected to bring new products to market in the coming quarters.

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