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What is behind the ARM Holding’s acquisition by SoftBank Group?

Update: Recently SoftBank Group among other Silicon Valley notaries such as Apple and Facebook, have poured over $100 billion into a new Softbank “vision Fund” that Founder Masayoshi Son says is going to be used to help develop AI. This is allocated to spending on emerging technology companies in the next 5 years. To put that number in perspective, the entire global venture capital “industry” is only $65 billion in size. Here is his presentation about that from MWC 2017:
March 3, 2017: Globalfuturist.org: Softbank CEO, Masayoshi Son Keynote at MWC 2017 (25 and half min)

The How to Invest in the Singularity – It’s Near from June 3, 2017 will also give you a deep analysis of this initiative. Highly recommended!
End of Update

The quick answer is that “ARM is the driver of the IoT era” when every thing is interconnected. Another reason is that they have been steadily working in an early investment mode from very beginning, and quite successfully.

SoftBank CEO and Founder Masayoshi Son has been referring back to the PC and Internet era when his company invested into Yahoo US which had only 16 employees then. In the beginning of PC broadband they have invested into mobile internet. And now is one of the biggest paradigm shifts is coming BIG TIME, that is IoT — he says. Some of his quotes shed light on what kind of perspective he is thinking of:

I truly believe Singularity [*] is coming and that computers will one day become smarter than mankind.

Every street light will be interconnected to the internet because we can save when car is not passing.

Automobile will all be connected so driverless car much safer.

All the things will be connected and what is biggest common denominator, that is Arm.

Technological singularity (Wikipedia): “is a hypothetical event in which an upgradable intelligent agent (such as a computer running software-based artificial general intelligence) enters a ‘runaway reaction’ of self-improvement cycles, with each new and more intelligent generation appearing more and more rapidly, causing an intelligence explosion and resulting in a powerful superintelligence that would, qualitatively, far surpass all human intelligence.[1][2] This would signal the end of the human era, as the new superintelligence would continue to upgrade itself and would advance technologically at an incomprehensible rate.[3]
For more information see the rest of the Wikipedia article.

And about the automobile opportunity alone he said:

I would say automobile is becoming smarter and smarter so when automobile becomes so smart it is required to have more and more chips integrated inside the car, especially when it becomes a driverless car. Automotive itself will become a super computer which consists of a bunch of multiple chips so ARM will be going into that market very aggressively.

More information along these lines see in the SoftBank CEO: the average person will have 1,000 internet-connected devices by 2040 article by Tech in Asia.

July 18, 2016: ARM CEO Simon Segars about SoftBank acquisition 

Official video released at https://www.acceleratingtech.com/ a site to explain the SoftBank acquisition of ARM, they claim:
– SoftBank’s £17 offer price gives ARM shareholders a 43% premium on Friday’s closing share price and a 41.1% premium on the all-time high share price
– Assurance to double ARM’s UK headcount in the next five years and increase headcount outside the UK
– Leaves ARM’s successful partnership business model, culture and brand unchanged
– Great endorsement of UK tech

July 18, 2016: Acquisition of ARM Holdings plc
Background and Rationale by SoftBank Group Corp.
(from Recommended Acquisition of ARM by SoftBank)

The acquisition of ARM by SBG will deliver the following benefits:

  • Support and accelerate ARM’s position as the global leader in intellectual property licensing and R&D outsourcing for semiconductor companies

SBG’s deep industry expertise and global network of relationships will accelerate adoption of ARM’s intellectual property across existing and new markets.

  • Maintain ARM’s dedication to innovation

SBG intends to sustain ARM’s long-term focus on generating more value per device, and driving licensing wins and future royalty streams in new growth categories, specifically “Enterprise and Embedded Intelligence.”

  • Increased investment to drive the next wave of innovation

SBG intends to support ARM’s multiple growth initiatives by investing in engineering talent and complementary acquisitions with the aim of ensuring ARM maintains a R&D edge over existing and emerging competitors. SBG believes such an investment strategy in long-term growth will be easier to execute as a non-listed company.

  • Shared culture and long-term vision

SBG believes the two companies share the same technology-oriented culture, long-term vision, focus on innovation and commitment to attracting, developing and retaining top talent. These common values will be the foundation for the strong strategic partnership necessary to capture the significant opportunities ahead.

  • Maintain and grow the UK’s leadership in science and technology

SBG is investing in the UK as a world leader in science and technology development and innovation and, as evidence of this, intends to invest in multiple ARM growth initiatives, at least doubling the number of ARM employees in the UK over the next five years.

July 18, 2016: Our Business Model (from Presentation material (English) (PDF) )

SoftBank Group Corp. Business Model -- 18 July 2016

Everything in violet color has been added by myself to the slide.

July 2015, from CEO Message:

Transformation into “SoftBank 2.0”

Thirty-four years have now passed since the foundation of SoftBank, and so far, our position has been one of SoftBank holding assets in overseas companies as a company in Japan. Now, however, we are going to the second stage of SoftBank—“SoftBank 2.0”—in which we will transform SoftBank into a truly global company that can ensure sustained business growth over the long term. We are now in a major transition period.

As the founder, I have set out to create a business model that can deliver continued business growth for centuries. However, many technology companies face the common challenge of a 30-year life cycle where growth is followed by decline. This decline stems from factors such as the increasing obsolescence of technologies and business models, and an over-reliance on founders.

What is the solution? Not only do we need to transform our existing businesses, we also need to have a comprehensive structure in place for supporting disruptive entrepreneurs and facilitating continued development with them.

… [the rest is to see at the place of original]

July 18, 2016Press Conference: ARM to be acquired by SoftBank

Japanese SoftBank CEO and Founder Masayoshi Son (https://www.youtube.com/results?search_query=Masayoshi+Son), the richest person in Japan, speaks at the SoftBank Press Conference to announce the acquisition of ARM Holdings for $31.4 Billion, SoftBank promises to keep the same business model for ARM, to increase the employee count in the UK by 2x within the next 5 years, to increase ARM’s employee count around the world. You can read the official presentation materials here:
http://www.softbank.jp/corp/d/sbg_press_en/list/pdf/pressconference_01/material_en.pdf
[i.e. Presentation material (English) (PDF)]

July 2015, Major Subsidiaries

Company Name Voting Rights (%) Principal Business Activities

Mobile Communications Segment

SoftBank Mobile Corp.*1                         100 Mobile communications services, sale of mobile devices
BB Mobile Corp.                         100 Holding company
Ymobile Corporation*1*2                        99,7 Mobile broadband services, development and sale of communications devices, ADSL services, PHS-based mobile communications services
GungHo Online Entertainment, Inc.*3 40.2
[18.6]*
Production and distribution of online games for smartphones and other devices
Wireless City Planning Inc.                        33,3 Planning and provision of mobile broadband services
SoftBank Commerce & Service Corp.*5                         100 Manufacture, distribution, and sale of IT-related products, IT-related services
Brightstar Global Group Inc.                         100 Holding company
Brightstar Corp.                         100 Mobile device distribution, supply chain solutions, handset protection and insurance, buy-back and trade-in, omnichannel solutions and financial services
GRAVITY Co., Ltd.*6                        59,3 Planning, development, and operations of online games
Supercell Oy*7                        53,7 Production and distribution of mobile game applications

Sprint Segment

Sprint Corporation                        79,5 Holding company
Sprint Communications, Inc.                         100 Mobile communications services, sale of mobile devices and accessories, fixed-line telecommunications services

Fixed-line Telecommunications Segment

SoftBank BB Corp.*1                         100 ADSL services, IP telephony services
SoftBank Telecom Corp.*1                         100 Fixed-line telephone services, data transmission and leased-line services

Internet Segment

Yahoo Japan Corporation                        43,0 Operation of the Yahoo ! JAPAN portal, sale of Internet advertising, operation of e-commerce sites, membership services
IDC Frontier Inc.                         100 Data center business
ValueCommerce Co., Ltd.                        50,6 Ad affiliate marketing service, StoreMatch online advertising distribution service

Others

Mobiletech Corporation                         100 Holding company
SB Energy Corp.                         100 Generation of electricity from renewable energy sources, supply and sale of electricity
SoftBank Payment Service Corp.                         100 Settlement services, card services and related services
Fukuoka SoftBank HAWKS Corp.                         100 Ownership of professional baseball team, operation of baseball games, management and maintenance of baseball stadium and other sports facilities, distribution of video, voice and data content via media
SoftBank Robotics Holdings Corp.                         100 Planning, development, and sale of robots
SBBM Corporation                         100 Holding company
ITmedia Inc.                        57,9 Operation of comprehensive IT information site ITmedia, etc.
SoftBank Technology Corp.                        55,4 Solutions and services for online businesses
Vector Inc.                        52,4 Operation, sales, and marketing of online games, software downloads, advertising
SFJ Capital Limited                         100 Procurement of funds by issuing preferred (restricted voting) securities
SB Group US, Inc.                         100 Holding company
SB CHINA HOLDINGS PTE LTD                         100 Holding company
SoftBank Ventures Korea Corp.                         100 Holding company
SoftBank Korea Corp.                         100 Holding company
Starburst I, Inc.                         100 Holding company
SoftBank Holdings Inc.                         100 Holding company
SoftBank America Inc.                         100 Holding company
STARFISH I PTE. LTD.                         100 Holding company
SB Pan Pacific Corporation                         100 Holding company
Hayate Corporation                         100 Holding company
*1   On April 1, 2015 SoftBank BB, SoftBank Telecom, and Ymobile, merged into SoftBank Mobile.  On July 1, 2015, SoftBank Mobile changed its company name to SoftBank Corp.
*2   eAccess merged with WILLCOM on June 1, 2014 and changed its company name to Ymobile on July 1, 2014.
*3   As a result of the completion of a tender offer by GungHo for its shares on June 1, 2015, and other factors, GungHo became an equity method associate of SoftBank Corp. (currently SoftBank Group Corp.).  Please refer to page 190 for details.
*4   Holdings by parties in close relationships, etc., with SoftBank Corp. (currently SoftBank Group Corp.)
*5   SoftBank BB Corp., divided its commerce and service business and newly established SoftBank C&S on April 1, 2014.  All shares of SoftBank C&S held by SoftBank Corp. (currently SoftBank Group Corp.) were transferred to a wholly owned subsidiary of Brightstar.
*6   Since GRAVITY Co., Ltd.’s parent company GungHo is an equity method associate, as noted in *3, as of the publication of this annual report, GRAVITY is not a subsidiary of SoftBank Corp. (currently SoftBank Group Corp.).
*7   The Company purchased additional shares of Supercell from existing shareholders on May 29, 2015.  After this transaction, the Company’s share of voting rights stands at 77.8%.

July 2015, Major Associates

Company Name Voting Rights (%) Principal Business Activities

Internet Segment

ASKUL Corporation                    41,9 Mail order sales of stationary, office products, services, etc.
The Japan Net Bank, Limited                    41,2 Banking business
BOOKOFF CORPORATION LIMITED                    15,0 Auction service and reuse business

Others

Scigineer Inc.                    33,2 Provision of Internet marketing support services using the personalized engine “deqwas” for e-commerce business operators and retailers
Bharti SoftBank Holdings Pte. Ltd.                    50,0 Holding company
Renren Inc.                    43,0 Investor company of company operating Renren.com SNS site in China
Alibaba Group Holding Limited                    31,9 Investor company of companies operating e-commerce sites Alibaba.com, Taobao. com, and Tmall.com
InMobi Pte. Ltd.                    35,2 Mobile advertising services

Main Overseas Fund Data

Fund Name
Subsidiaries
SoftBank Ranger Venture Investment Partnership
SoftBank Capital Fund ’10 L.P.
Associates
SoftBank US Ventures VI L.P.
SoftBank Capital Technology Fund III L.P.

 

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Microsoft and partners to capitalize on Continuum for Phones instead of the exited Microsoft phone business

With The Nokia phone business is to be relaunched via a $500M private startup with Android smartphones and tablets in addition to the feature phones for which manufacturing, sales and distribution, would be acquired from Microsoft by a subsidiary of Foxconn published on this same ‘Experiencing the Cloud’ blog on May 20, 2016 I now dare to publish this follow-up post to the original message which was already available on October 13, 2015 under the title “Windows 10 enhancements for tablets and phones to achieve a powerful PC experience” (that original content see in the final part of this post) and with a statement for the start:

These are significant capabilities with which (although not only with these but with quite a number of other innovations) Microsoft—first time in its history—was able to beat Apple in its own game. You couldn’t believe it?

Unfortunately I’d felt a growing uncertainty about the future of the Microsoft Device business and therefore decided to wait till the picture gets clear. With the following Terry Myerson video appearing on the HP Business YouTube channel I’ve now felt certain to make the original information available in this curent post:

June 2, 2016HP Elite x3 and Windows 10: Terry Myerson

http://www.hp.com/go/elitex3Terry Myerson, Executive Vice President at Microsoft, talks about the collaboration between HP and Microsoft that brings to life the new HP Elite x3 with Windows 10 for business, pioneer in the 3-in-1 category.

My certainty was also supported by the Microsoft decision to exit the phone business as it had been acquired from Nokia:

May 25, 2016Microsoft announces streamlining of smartphone hardware business

Microsoft Corp. on Wednesday announced plans to streamline the company’s smartphone hardware business, which will impact up to 1,850 jobs. As a result, the company will record an impairment and restructuring charge of approximately $950 million, of which approximately $200 million will relate to severance payments.

“We are focusing our phone efforts where we have differentiation — with enterprises that value security, manageability and our Continuum capability, and consumers who value the same,” said Satya Nadella, chief executive officer of Microsoft. “We will continue to innovate across devices and on our cloud services across all mobile platforms.”

Microsoft anticipates this will result in the reduction of up to 1,350 jobs at Microsoft Mobile Oy in Finland, as well as up to 500 additional jobs globally. Employees working for Microsoft Oy, a separate Microsoft sales subsidiary based in Espoo, are not in scope for the planned reductions.

As a result of the action, Microsoft will record a charge in the fourth quarter of fiscal 2016 for the impairment of assets in its More Personal Computing segment, related to these phone decisions.

The actions associated with today’s announcement are expected to be substantially complete by the end of the calendar year and fully completed by July 2017, the end of the company’s next fiscal year.

More information about these charges will be provided in Microsoft’s fourth-quarter earnings announcement on July 19, 2016, and in the company’s 2016 Annual Report on Form 10-K.

In addition to the following sentence in the previous Microsoft selling feature phone business to FIH Mobile Ltd. and HMD Global, Oy press release on May 18, 2016:

Microsoft will continue to develop Windows 10 Mobile and support Lumia phones such as the Lumia 650, Lumia 950 and Lumia 950 XL, and phones from OEM partners like Acer, Alcatel, HP, Trinity and VAIO.

That last statement was not enough for me at that time, just 3 weeks ago as I had a truly shocking experience with upgrading my wife’s Lumia 640 XL to the Windows 10 Mobile version which had been released for that type of earlier Lumia phones last March. The software was so much buggy that I had’seen in my life any time before. I’d got so much angry that immediately bought an Android based Samsung Galaxy J5 for her. However, I became again confident in the future of Window 10 Mobile based phones after her bad experience with that Android software in terms of functionality (e.g. too many steps needed for some vital functions vs. that needed on Lumia) and the success of restoring the earlier 8.5 release on the 640 XL.

Several other videos which appeared on the same HP Business YouTube channel a little earlier gave me the final assurance:

May 27, 2016: HP Elite x3 turned heads at Mobile World Congress 2016

http://www.hp.com/go/elitex3 -HP Elite x3 made a powerful first impression at Mobile World Congress 2016 in Barcelona, winning 24 awards and positive reviews from industry experts. Meet the new HP Elite x3 the one device that’s every device.

June 2, 2016Reinventing mobility: Dion Weisler 

http://www.hp.com/go/elitex3 -Dion Weisler President and Chief Executive Officer for HP Inc. introduces to the revolution of mobility. Meet the new HP Elite x3 pioneer in the 3-in-1 category; the next generation of computing, designed specifically for business.

June 2, 2016The new HP Elite x3: Michael Park

http://www.hp.com/go/elitex3Michael Park, Vice President for Commercial Mobility & Software division at HP Inc., introduces the new HP Elite x3, pioneer in the 3-in-1 category that will transform business mobility.

June 2, 2016HP Elite x3 and Qualcomm: Steve Mollenkopf

http://www.hp.com/go/elitex3 -Steve Mollenkopf, Chief Executive Officer of Qualcomm Incorporated, presents the power of Snapdragon 820 processor in HP Elite x3, as part of the recent collaboration with HP. Meet the new HP Elite x3, pioneer in the 3-in-1 category; the next generation of computing, designed specifically for business.


Now a brief retrospective for the start:

From the full text of Q&A part of the Transcript of Microsoft Nokia Transaction Conference Call: Steve Ballmer, Stephen Elop, Brad Smith, Terry Myerson, Amy Hood; September 3, 2013 [Microsoft, Sept 3, 2013]

OPERATOR: Walter Pritchard, Citigroup, your line is open.
WALTER PRITCHARD: Great. Thanks for taking the question. Steve Ballmer, on the tablet side, obviously, we could say many of the same things as you’ve put into this slide deck as rationale for doing an acquisition on the phone side as we could say about the tablet side including picking up more gross margin.

I’m wondering how this transaction impacts the strategy going forward in tablets and whether or not you need to, in a sense, double down further on first-party hardware in the tablet market. And then just have one follow up.

STEVE BALLMER: Okay. Terry, do you want to talk a little bit about that? That would be great.

TERRY MYERSON: Well, phones and tablets are definitely a continuum. You know, we see the phone products growing up, the screen sizes and the user experience we have on the phones. We’ve now made that available in our Windows tablets, our application platform spans from phone to tablet. And I think it’s fair to say that our customers are expecting us to offer great tablets that look and feel and act in every way like our phones. We’ll be pursuing a strategy along those lines.

More information: Microsoft answers to the questions about Nokia devices and services acquisition: tablets, Windows downscaling, reorg effects, Windows Phone OEMs, cost rationalization, ‘One Microsoft’ empowerment, and supporting developers for an aggressive growth in market share ‘Experiencing the Cloud’, September 4, 2013

From the Microsoft Q4 2015 Earning Call Transcript by CEO Satya Nadella on July 21, 2015:

I am thrilled we are just days away from the start of Windows 10. It’s the first step towards our goal of 1 billion Windows 10 active devices in the fiscal year 2018. Our aspiration with Windows 10 is to move people from meeting to choosing to loving Windows. Based on feedback from more than 5 million people who have been using Windows 10, we believe people will love the familiarity of Windows 10 and the innovation. It’s safe, secure, and always up to date. Windows 10 is more personal and more productive with Cortana, Office, universal apps, and Continuum. And Windows 10 will deliver innovative new experiences like Inking on Microsoft Edge and gaming across Xbox and PCs, and also opens up entirely new device categories such as Hololens.

From Windows 10 available in 190 countries as a free upgrade Microsoft news release on July 28, 2015:

Windows 10 is more personal and productive, with voice, pen and gesture inputs for natural interaction with PCs. It’s designed to work with Office and Skype and allows you to switch between apps and stay organized with Snap and Task View. Windows 10 offers many innovative experiences and devices, including the following:

  • Cortana, the personal digital assistant, makes it easy to find the right information at the right time.
  • New Microsoft Edge browser lets people quickly browse, read, and mark up and share the Web.
  • The integrated Xbox app delivers the Xbox experience to Windows 10, bringing together friends, games and accomplishments across Xbox One and Windows 10 devices.
  • Continuum optimizes apps and experiences beautifully across touch and desktop modes.
  • Built-in apps including Photos; Maps; Microsoft’s new music app, Groove; and Movies & TV offer entertainment and productivity options. With OneDrive, files can be easily shared and kept up-to-date across all devices.
  • A Microsoft Phone Companion app enables iPhones, Android or Windows phones to work seamlessly with Windows 10 devices.
  • The all new Office Mobile apps for Windows 10 tablets are available today in the Windows Store.4 Built for work on-the-go, the Word, Excel and PowerPoint apps offer a consistent, touch-first experience for small tablets. For digital note-taking needs, the full-featured OneNote app comes pre-installed with Windows 10. The upcoming release of the Office desktop apps (Office 2016) will offer the richest feature set for professional content creation. Designed for the precision of a keyboard and mouse, these apps will be optimized for large-screen PCs, laptops and 2-in-1 devices such as the Surface Pro.

More information around the above 2 excerpts:
Windows 10 is here to help regain Microsoft’s leading position in ICT ‘Experiencing the Cloud’, July 31, 2015

From 2015 Annual Report>The ambitions that drive us on July 31, 2015:

Create more personal computing

Windows 10 is the cornerstone of our ambition to usher in an era of more personal computing. We see the launch of Windows 10 in July 2015 as a critical, transformative moment for the Company because we will move from an operating system that runs on a PC to a service that can power the full spectrum of devices in our customers’ lives. We developed Windows 10 not only to be familiar to our users, but more safe and secure, and always up-to-date. We believe Windows 10 is more personal and productive, working seamlessly with functionality such as Cortana, Office, Continuum, and universal applications. We designed Windows 10 to foster innovation – from us, our partners and developers – through experiences such as our new browser Microsoft Edge, across the range of existing devices, and into entirely new device categories.

Our future opportunity

There are several distinct areas of technology that we aim to drive forward. Our goal is to lead the industry in these areas over the long-term, which we expect will translate to sustained growth. We are investing significant resources in:

  • Delivering new productivity, entertainment, and business processes to improve how people communicate, collaborate, learn, work, play, and interact with one another.
  • Establishing the Windows platform across the PC, tablet, phone, server, other devices, and the cloud to drive a thriving ecosystem of developers,unify the cross-device user experience, and increase agility when bringing new advances to market.
  • Building and running cloud-based services in ways that unleash new experiences and opportunities for businesses and individuals.
  • Developing new devices that have increasingly natural ways to interact with them, including speech, pen, gesture, and augmented reality holograms.
  • Applying machine learning to make technology more intuitive and able to act on our behalf, instead of at our command.

January 14, 2016Continuum for Phones: Making the Phone Work Like a PC by  / Principal Program Manager Lead

Imagine having a phone that works like a PC. Continuum for Phones makes this a reality, enabling Windows customers to get things done like never before.

Check out the ways this capability comes alive. You’ll be able to travel and leave your laptop at home, knowing you’re still equipped to complete your most common tasks. Walk into a meeting with just your smartphone – you’re fully equipped for seamlessly projecting PowerPoint presentations to a larger screen. Or take a seat in a business center where you plug your phone into a monitor and keyboard – you’ve instantly gained PC-like productivity using Office apps and the Microsoft Edge browser.

Continuum for Phones - Making the Phone Work Like a PC -- January 14, 2016

How it all started

The road to Continuum began three years ago with a simple observation: we take our phones everywhere, we depend on them, and we feel lost without them. Yet, when the time comes to do “real work,” we reach for a laptop or desktop PC. So we end up carrying our phones plus our laptops, or we wait until we are at our desks to do the heavy lifting.

The thing is, today’s phones have more than enough processing power to handle our most common tasks and activities. We knew this was especially true in emerging markets where people rely only on their mobile phones to get online.  So — with these thoughts top of mind — we set out on our mission to help people get real work done with just their phone.

Who are we? We are the small team of people who built Continuum for Phones with a passion to change the future of personal productivity.

What people want

We started by talking to customers to understand what they needed. We spoke to people around the globe – from Chicago to Shanghai – and found that most people wanted the same thing: a phone that did more. Here are the main insights from the research:

  • “My most important device”: people universally describe their smartphone as the center of their connected life.
  • Connect to a bigger screen: people rely on their laptops and desktops because their phone lacks a large screen, keyboard and mouse. They want to easily connect to larger screens for both work and entertainment.
  • Tech-savvy people expect more: as the processing power of phones has risen, so has the expectations of the tech-savvy.
  • Many people around the world don’t have PCs: because they can’t afford a PC, people have a TV and a phone and that’s it. So any computing work gets done on their phone.

We realized that people embraced the idea of having a phone that could work like a PC.

Getting it done

So we started building Continuum, and we soon realized that we faced many technical and design challenges.

For example, there were two paradigms for connecting to a second screen: (1) mirroring your phone’s screen to a larger screen or (2) connecting your PC to multiple monitors. We needed to create a new design paradigm with two independent experiences – one on the phone and a separate one on the second screen. This was important because customers wanted to continue to use their phone as a phone, even while having a PC-like experience on the second screen. We spent months iterating with paper and software prototypes to arrive at an experience that was easy to understand and use.

The technical hurdles were just as big. For example, we had to build support for keyboard and mouse into Windows 10 Mobile. And many substantial architecture changes were needed in Windows to make Continuum work.

At the //Build conference in April 2015, we did our first live demo, and at the Windows 10 launch in July, we showed the full power of a phone running Office* apps on a second screen. The response – which exceeded our expectations — motivated us to keep going, working relentlessly with hundreds of colleagues around the world to deliver an integrated solution that required major changes to Windows, new capabilities in the phones, and creation of docks such as the Microsoft Display Dock.

Announcing Continuum

So, with the debut of Continuum for Phones, you really can have something new in your pocket: a smartphone that has the power and ability to work like a PC. In the words of our CEO Satya Nadella: “This is the beginning of how we are going to change what the form and function of a phone is.”

Right now, this means that you can carry a smartphone – like the new Lumia 950 and Lumia 950XL – and use a small dock or wireless dongle to connect it to a keyboard, mouse and monitor for a familiar PC-like experience. Run Office* apps, browse the Web, edit photos, write email, and much more.

Continuum for Phones No 2 - Making the Phone Work Like a PC -- January 14, 2016

While you’re working on the larger screen, you won’t lose your phone’s unique abilities. Continuum multi-tasks flawlessly so you can keep using your phone as a phone for calls, emails, texts, or Candy Crush. Or if you don’t have a mouse, you can use your phone as the trackpad for the apps on the larger screen.

If you share my enthusiasm for Continuum for Phones, please check out all the details, including multiple usage scenarios, at windows.com.

* App experience may vary. Office 365 subscription required for some Office features.

June 4, 2016 snapshot: New features coming soon to Windows 10 Anniversary Update

This year’s Windows 10 Anniversary Update will have great new innovative features including:1

The pen just got even mightier.

Windows 10 Anniversary Edition with a mightier Ink -- June 4, 2016

Turn thoughts into action with Windows Ink – using the pen, your fingertip, or both at once.2 Pair it with Office apps to effortlessly edit documents. With Windows Ink, you’ll be able to access features like Sticky Notes with a simple click of the pen.3 When you start drawing a figure like a chart or graph, it’ll turn into the real thing right before your eyes. And because Windows Ink stays active when your device is locked, you’ll be able to jot down notes even when you don’t have time to enter a password.

Cortana’s got you covered.

No time to enter your password but need some quick help? No problem — just ask. Cortana4 will now be at your service, even before you login. Whether you want to make a note, play music or set a reminder, Cortana will have you covered.

The secret password is: you.

With Windows Hello, unlocking your PC and devices is as quick as looking or touching.But the new Windows Hello will also let you unlock your PC simply by tapping your Windows Hello enabled phone.6 Beyond the hardware, Windows Hello will also give you instant access to paired apps and protected websites on Microsoft Edge – all while maintaining enterprise-level security. Windows Hello lets you say goodbye to cumbersome passwords.

Got game? We’ll deliver.

Windows 10 Anniversary Edition will deliver DirectX 12 games and Xbox Live features -- June 4, 2016Windows 10 will deliver incredible DirectX 12 games and Xbox Live features that will transform what you expect from PC gaming. Now you can play and connect with gamers across Xbox One and Windows 10 devices. From the best casual games to the next generation of PC releases, you’ll have more ways to play new games optimized for Windows.7

And that’s not all: Microsoft Studios is bringing a full portfolio of new games to Windows 10, including the forthcoming Forza Motorsport 6: Apex, which will be freefor Windows 10 users.

Ongoing progress reports (only two latest ones are summarised here):

June 1, 2016Announcing Windows 10 Mobile Insider Preview Build 14356

  • Cortana Improvements:
    – Get notifications from your phone to your PC
    – Send a photo from your phone to PC
    – New listening animation

May 26, 2016Announcing Windows 10 Insider Preview Build 14352

  • Cortana Improvements:
    – Cortana, Your Personal DJ
    – Set a timer
  • Windows Ink:
    – Updated Sticky Notes
    – Compass on the ruler
    – General improvements to the Windows Ink experience
  • Other items of note:
    – Windows Game bar improved with full-screen support
    – Feedback Hub will now show Microsoft responses
    – Updated File Explorer icon
    – Deploying Windows Enterprise edition gets easier
    – Limited Period Scanning
    – Introducing Hyper-V Containers (ADDED 5/31)

For more information see: https://blogs.windows.com/windowsexperience/tag/windows-insider-program/

Particularly relevant recent information from A change in leadership for the Windows Insider Program on June 1, 2016 by  / Corporate Vice President, Engineering Systems Team:

Since we first started the Windows Insider Program back in September 2014, Windows Insiders have helped us ship Windows 10 to over 300 million devices. We have released 35 PC builds and 22 Mobile builds to Insiders to date. This is a huge change from Windows 7 and Windows 8 which only had 2 and 3 public pre-release builds respectively. Windows Insiders have been more directly plugged in to our engineering processes for Windows than ever before, including participating in our first ever public Bug Bash this year. Windows Insiders contribute problem reports and suggestions which help us shape the platform, and are currently helping us get ready to ship the next major update to Windows 10 this summer – the Windows 10 Anniversary Update. This is just the beginning of the journey we’re on though. We really appreciate having such an amazing connection with our customers, and want Windows Insiders to continue to help shape Windows releases for years to come. With that in mind, I want to talk about a change to the Windows Insider Program going forward.

When I was introduced as leader of the Windows Insider Program over 18 months ago, I was responsible for the team that built our feedback and flighting systems for Windows. It made sense for me to be on the front lines talking with customers of the systems that my team was building to get Insider Preview Builds out and hear the feedback rolling in. In August of last year, I changed jobs to work on the Engineering Systems Team in WDG. In this role, I am responsible for the tools our engineers use to build Windows, including our planning and work management systems, source code management, build infrastructure, and test automation systems. …

Meet Dona Sarkar

I have worked with Dona for many years and think she is the perfect person to guide the Windows Insider Program forward. Her technical expertise, passion for customers, and commitment to listening to feedback is unmatched. …

You can follow Dona here on Twitter. Please welcome her as the new leader of the Windows Insider Program!

Get to know more about Dona here from Microsoft Stories!


Finally more as well as historic information on this subject which I’d originally put together on October 13, 2015 and intended to publish under the title:

Windows 10 enhancements for tablets and phones to achieve a powerful PC experience

These are significant capabilities with which (although not only with these but with quite a number of other innovations) Microsoft—first time in its history—was able to beat Apple in its own game. You couldn’t believe it?

First watch these two very short videos from CNNMoney presenting Microsoft’s “ultimate laptop” in terms of its device innovations:
Hands-on with Microsoft Surface Book


See Microsoft’s reversible laptop in :60

Then follow with the below information which is presenting one the most important Windows 10 software innovations, called Continuum (Continuum tablet mode for touch-capable devices) which makes that “ultimate laptop” an “ultimate tablet” as well.

Then get acquainted with a similar Windows 10 software innovation, called Continuum for Phones (it is rather for Mobile devices) which is allowing an entry level tablet or a premium phone to become a true PC with an extension to an external large size display after docking to it.

Note that while the “ultimate laptop/ultimate tablet” hybrid is for the premium client market, the second one is targeted at the entry level emerging markets as well. In that scenario Microsoft is hoping to capitalize on the availability of extremely low-cost tablets which could be enhanced to a PC-like experience with Continuum for Phones. When coupled with a similarly low-priced Windows 10 phone the emerging market user will have 2 devices for around $200 and a consistent Windows 10 experience easily dockable to a large size display, and with that easily achieving a true PC experience.

Suggested other information:
– July 30, 2015: Docking – Windows 10 hardware dev, Microsoft Hardware Dev Center
– March 28, 2015: Display – Windows 10 hardware dev, Microsoft Hardware Dev Center
– March 28, 2015: Graphics – Windows 10 hardware dev, Microsoft Hardware Dev Center

Continuum tablet mode for touch-capable devices

The Continuum feature of Windows 10 desktop edition adapts between tablet and PC modes when docking/undocking. More generally: “Continuum is available on all Windows 10 desktop editions by manually turning “tablet mode” on and off through the Action Center. Tablets and 2-in-1s with GPIO indicators or those that have a laptop and slate indicator will be able to be configured to enter ‘tablet mode’ automatically.” Source: Windows 10 Specifications, Microsoft, June 1, 2015

May 4, 2015Continuum For Windows 10 PCs and Tablets At Microsoft Ignite Event 2015 

June 12, 2015Continuum Overview – Windows 10 hardware dev, Microsoft Hardware Dev Center

Continuum is a new, adaptive user experience offered in Windows 10 that optimizes the look and behavior of apps and the Windows shell for the physical form factor and customer’s usage preferences. This document describes how to implement Continuum on 2-in-1 devices and tablets, specifically how to switch in and out of “tablet mode.”

Tablet Mode is a feature that switches your device experience from tablet mode to desktop mode and back. The primary way for a user to enter and exit “tablet mode” is manually through the Action Center. In addition, OEMs can report hardware transitions (for example, transformation of 2-in-1 device from clamshell to tablet and vice versa), enabling automatic switching between the two modes. However, a key promise of Continuum is that the user remains in control of their experience at all times, so these hardware transitions are surfaced through a toast prompt that must be confirmed by the user. The users also has the option to set the default response.

Target Devices

Dn917883.Continuum_tablet(en-us,VS.85).png Dn917883.Continuum_Detachables(en-us,VS.85).png Dn917883.Continuum_Convertibles(en-us,VS.85).png
Tablets Detachables Convertibles
Pure tablets and devices that can dock to external monitor + keyboard + mouse. Tablet-like devices with custom designed detachable keyboards. Laptop-like devices with keyboards that fold or swivel away.

When the device switches to tablet mode, the following occur:

  • Start resizes across the entire screen, providing an immersive experience.
  • The title bars of Store apps auto-hide to remove unnecessary chrome and let content shine through.
  • Store apps and Win32 apps can optimize their layout to be touch-first when in Tablet Mode.
  • The user can close apps, even Win32 apps, by swiping down from the top edge.
  • The user can snap up to two apps side-by-side, including Win32 apps, and easily resize them simultaneously with their finger.
  • The taskbar transforms into a navigation and status bar that’s more appropriate for tablets.
  • The touch keyboard can be auto-invoked.

Of course, even in “tablet mode”, users can enjoy Windows 10 features such as Snap Assist, Task View and Action Center. On touch-enabled devices, customers have access to touch-friendly invocations for those features: they can swipe in from the left edge to bring up Task View, or swipe in from the right edge to bring up Action Center.

With “tablet mode”, Continuum gives customers the flexibility to use their device in a way that is most comfortable for them. For example, a customer might want to use their 8” tablet in “tablet mode” exclusively until they dock it to an external monitor, mouse, and keyboard. At that point the customer will exit “tablet mode” and use all their apps as traditional windows on the desktop—the same way they have in previous versions of Windows. Similarly, a user of a convertible 2-in-1 device might want enter and exit “tablet mode” as they use their device throughout the day (for example, commuting on a bus, sitting at a desk in their office), using signals from the hardware to suggest appropriate transition moments.

Imagine the overall smoothness of that combined laptop and tablet experience on the brand new Microsoft Surface Book announced just on October 6, 2015. Out of a plethora of videos reporting on that new device with quite an entusiasm I’ve selected the one which—in my view—just right with its judgement and very concise at the same time.

Surface Book hands-on: Microsoft’s first laptop is simply amazing by Mark Hachman, senior editor of the PCWorld: “No one expected the Surface Book, and what they got was a true flagship for the Windows ecosystem.

And if you don’t need the leading edge ultrabook performance provided by the clever, “more power (GPU, longer batery life …) is in the detachable keyboard part” design of the Surface Book, then the 4th generation Surface Pro 4 may be more than sufficient for you to provide a state-of-the-art productivity work capability, including the best of the pen computing available on the market (which is also on the Surface Book, you could notice the same pen in the previous video), in addition to a new type cover for the tablet part. Here again the same source has been the best to present all that.

Surface Pro 4: Hands on with Microsoft’s category-creating productivity tablet by Mark Hachman, senior editor of the PCWorld 

Continuum for phones

With Continuum for phones in Windows 10 Mobile edition, connecting a phone enables a screen to become like a PC. Additionally: “Continuum for phones limited to select premium phones at launch. External monitor must support HDMI input. Continuum-compatible accessories sold separately. App availability and experience varies by device and market. Office 365 subscription required for some features.” Source: Windows 10 Specifications, Microsoft, June 1, 2015

April 29, 2015: As part of the Universal Windows Platform Microsoft shared at Build 2015 how apps can scale using Continuum for phones, enabling people to use their phones like PCs for productivity or entertainment. With that your phone app can start using a full-sized monitor, mouse, and keyboard, giving you even more mileage from your universal app’s shared code and UI.

April 29, 2015Windows Continuum for Phones See how new Windows Continuum functionality for mobile phones tailors the app experience across devices to transform a phone into a full-powered PC, TV or a Smart TV 

May 4, 2015Continuum For Windows 10 For Phones At Microsoft Ignite Event 2015

IC830854[1]7″ Tablet
[Sept 17, 2015]
IC830852[1]Premium Phone
[March 29, 2015]
Key Features
Low cost
Cortana
Continuum for Phones
Cortana
Windows Hello
Continuum for Phones
Operating System
Windows 10 Mobile
Windows 10 Mobile
Recommended Components
CPU
Supported entry SoC
Supported premium SoC
RAM/Storage
1-2GB/8-32GB eMMC w/SD card
2-4GB / 32-64GB with SD slot
Display
7” 480×800 or 1280×720 w/touch
4.5-5.5”+ / FHD-WQHD
Dimensions
<9mm & <.36kg
<7.5mm & <160g
Battery
10+ hours
2500+ mAh ( 1 day active use)
Connectivity
802.11ac+, 1 micro USB 2.0, mini HDMI, BT, LTE option
LTE/Cat 4+ /802.11b/g/n/ac 2×2, USB, 3.5mm jack, BT LE, NFC
Audio/Video/ Camera+
Front camera, speakers, headphones
20MP with OIS/Flash; 5MP FFC

Oct 6, 2015Windows 10 Continuum for Phones demo on Lumia 950 and Lumia 950 XL by Bryan Roper, Microsoft marketing manager, at Microsoft Windows 10 Devices Event 2015 

 

The Dawn of the SoC 2.0 Era: The TSMC Perspective

From its companion post The Dawn of the SoC 2.0 Era: The ARM Perspective

futureICT - Cortex-A Roadmap Strategy -- April-2015

Source of the slide: ARM Cortex系列核心介绍 (Core ARM Cortex Series Introduction, 52RD, April 13, 2015)

Regarding TSMC itself the April 8 conclusion in TSMC Outlines 16nm, 10nm Plans article by EE|Times is:

“It’s not completely clear who is ahead at 16/14 but I think TSMC is making a major commitment to trying to be ahead at 10,” Jones said. “If that happens and TSMC has closed the gap with Intel, the issue is then if TSMC’s 10 and Intel’s 10 are the same,” he said.

Background from the April 14, 2015 TSMC Symposium: “10nm is Ready for Design Starts at This Moment” article in Cadence Communities Blog:

The 10nm semiconductor process node is no longer in the distant future – it is here today, according to presenters at the recent TSMC 2015 Technology Symposium in San Jose, California. TSMC executives noted that EDA tools have been certified, most of the IP is ready or close to ready, and risk production is expected to begin in the fourth quarter of 2015.

Here are some more details about 10nm at TSMC as presented in talks by Dr. Cliff Hou, vice president of R&D at TSMC (right), and Dr. BJ Woo, vice president of business development at TSMC (below left). At the TSMC Symposium, speakers also introduced two new process nodes, 16HHC and 28HPC+ (see blog post here).

According to Woo, TSMC is not only keeping up with Moore’s Law – it is running ahead of the law with its 10FF offering. “We have done a lot more aggressive scaling than Moore’s Law demands for our 10nm technology,” she said. A case in point is the fully functional 256Mb SRAM with a cell size that is approximately 50% smaller than the 16FF+ cell size. She called this an “exceptional shrink ratio” that goes beyond traditional scaling.

And it’s not just SRAM. The 10FF node, Woo said, can scale key pitches by more than 70%. Combine that with innovative layout, and 10nm can achieve almost 50% die size scaling compared to 16FF+. “And this is very, very aggressive,” she said.

After noting that the 16FF+ already provides “clear performance leadership,” Woo said that 10FF offers a 22% performance gain over 16FF+ at the same power, or more than 40% power reduction at the same speed. This comparison is based on a TSMC internal ring oscillator benchmark circuit. For the Cortex-A57 test chip used to validate EDA tools, the result was a 19% speed increase at the same power, and a 38% power reduction at the same speed.

New features in 10FF include a unidirectional (1D) layout style and new local interconnect layer. These features help 10FF achieve a 2.1X logic density improvement over 16FF+, whereas normally TSMC gets about a 1.9X density boost for node migration, Woo said. In addition to the density improvement, the 1D Mx architecture can reduce CD (critical dimension) variation by 60%, she said.

And an already remarkable quote from April 12, 2015 TSMC Symposium: New Low-Power Process, Expanded R&D Will Drive Vast Innovation: TSMC Executive article in Cadence Communities Blog:

Hock Tan, CEO of Avago, described a symbiotic relationship between TSMC and his company that led to a super high-density switch for a networking customer, implemented in 16FF+. The switch has 96 ports, each running 100G Gbps, and drawing less than 2W each. That enables, in a next-generation data center, the tripling of a switch performance to more than 10 Tbps.

Moreover, according to the April 12, 2015 TSMC Symposium: New 16FFC and 28HPC+ Processes Target “Mainstream” Designers and Internet of Things (IoT) article from Cadence Communities Blog:

16FFC is a “compact” version of the 16nm FinFET+ (16FF+) process technology that is now in risk production at TSMC. It claims advantages in power, performance, and area compared to the existing 16FF+ process, along with easy migration from 16FF+. It can be used for ultra low-power IoT applications such as wearables, mobile, and consumer.

28HPC+ is an improved version of the 28HPC (High Performance Compact) process, which is itself a fairly recent development. Late last year 28HPC went into volume production, and it provides a 10% smaller die size and 30% power reduction compared to TSMC’s earlier 28LP process. 28HPC+ ups the ante by providing 15% faster speed at the same leakage, or 30-50% reduction in leakage at the same speed, compared to 28HPC.

TSMC also provided updates on other processes on its roadmap, which includes the following:

  • High Performance – 28HP, 28HPM, 20SoC, 16FF+
  • Mainstream – 28LP, 28HPC, 28HPC+, 16FFC
  • Ultra Low Power – 55ULP, 40ULP, 28ULP, 16FFC (16FFC is in both mainstream and low power categories)

In connection with that remember the September 29, 2014 announcement:
TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Device Applications

TSMC (TWSE: 2330, NYSE: TSM) today announced the foundry segment’s first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications. In this platform, TSMC offers multiple processes to provide significant power reduction benefits for IoT and wearable products and a comprehensive design ecosystem to accelerate time-to-market for customers.

TSMC’s ultra-low power process lineup expands from the existing 0.18-micron extremely low leakage (0.18eLL) and 90-nanometer ultra low leakage (90uLL) nodes, and 16-nanometer FinFET technology, to new offerings of 55-nanometer ultra-low power (55ULP), 40ULP and 28ULP, which support processing speeds of up to 1.2GHz. The wide spectrum of ultra-low power processes from 0.18-micron to 16-nanometer FinFET is ideally suited for a variety of smart and power-efficient applications in the IoT and wearable device markets. Radio frequency and embedded Flash memory capabilities are also available in 0.18um to 40nm ultra-low power technologies, enabling system level integration for smaller form factors as well as facilitating wireless connections among IoT products.

Compared with their previous low power generations, TSMC’s ultra-low power processes can further reduce operating voltages by 20% to 30% to lower both active power and standby power consumption and enable significant increases in battery life — by 2X to 10X — when much smaller batteries are demanded in IoT/wearable applications.

“This is the first time in the industry that we offer a comprehensive platform to meet the demands and innovation for the versatile Internet of Things market where ultra-low power and ubiquitous connectivity are most critical,” said TSMC President and Co-CEO, Dr. Mark Liu. “Bringing such a wide spectrum of offerings to this emerging market demonstrates TSMC’s technology leadership and commitment to bring great value to our customers and enable design wins with competitive products.”

One valuable advantage offered by TSMC’s ultra-low power technology platform is that customers can leverage TSMC’s existing IP ecosystem through the Open Innovation Platform®. Designers can easily re-use IPs and libraries built on TSMC’s low-power processes for new ultra-low power designs to boost first-silicon success rates and to achieve fast time-to-market product introduction. Some early design engagements with customers using 55ULP, 40ULP and 28ULP nodes are scheduled in 2014 and risk productions are planned in 2015.

“TSMC’s new ultra-low power process technology not only reduces power for always-on devices, but enables the integration of radios and FLASH delivering a significant performance and efficiency gain for next-generation intelligent products,” said Dr. Dipesh Patel, executive vice president and general manager, physical design group, ARM. “Through a collaborative partnership that leverages the energy-efficient ARM® Cortex®-M and Cortex-A CPUs and TSMC’s new process technology platform, we can collectively deliver the ingredients for innovation that will drive the next wave of IoT, wearable, and other connected technologies.”

“Low power is the number one priority for Internet-of-Things and battery-operated mobile devices,” said Martin Lund, Senior Vice President and General Manager of the IP Group at Cadence. “TSMC’s new ULP technology platform coupled with Cadence’s low-power mixed-signal design flow and extensive IP portfolio will better meet the unique always-on, low-power requirements of IoT and other power sensitive devices worldwide.”

CSR has an unequalled reputation in Bluetooth technology and has been instrumental in its progression, including helping to write the Bluetooth Smart standard that is meeting the demands of today’s rapidly evolving consumer electronics market,” said Joep van Beurden, CEO at CSR. “For many years, CSR has closely collaborated with TSMC, and we are pleased to demonstrate the results of that collaboration with the adoption of the 40ULP platform for our next generation of Bluetooth Smart devices including products for markets like smart home, lighting and wearables that are enabling the growth of the Internet of Things. Our solutions simplify complex customer challenges and help speed their time to market by allowing them to design and deliver breakthrough low power wireless connected products on these powerful new platforms.”

“The imaging SoC solutions of Fujitsu Semiconductor Limited bring the best balance between high imaging quality and low power consumption, to meet the significant demand from our customers and the electronics market,” said Tom Miyake, Corporate Vice President, at System LSI Company of Fujitsu Semiconductor Limited. “We welcome that TSMC is adding the 28ULP technology to its successful 28nm platform. We believe this technology will provide our SoCs with the key feature: low power consumption at low cost.”

Nordic Semiconductor has been a pioneer and leader in ultra-low power wireless solutions since 2002, and with the launch of its nRF51 Series of Systems-on-Chip (SoCs) in 2012 the company established itself as a leading vendor of Bluetooth Smart wireless technology,” said Svenn-Tore Larsen, CEO of Nordic Semiconductor. “We have been collaborating closely with TSMC on the selection of process technology for our upcoming nRF52 Series of ultra-low power RF SoCs. I am happy to announce that we have selected the TSMC 55ULP platform. This process is a key enabler for us to push the envelope on power consumption, performance and level of integration of the nRF52 Series to meet the future requirements of Wearable and Internet of Things applications.”

“Built on TSMC’s Ultra-Low Power technology platform and comprehensive design ecosystem, Realtek’s Bluetooth Energy Efficient smart SoC, BEE, supports the latest Bluetooth 4.1 specification featuring Bluetooth Low Energy (BLE) and GATT-based profiles,” said Realtek Vice President and Spokesman, Yee-Wei Huang. “BEE’s power efficient architecture, low power RF, and embedded Flash are ideal both for the IoT and for wearable devices such as smart watches, sport wristbands, smart home automation, remote controls, beacon devices, and wireless charging devices.”

Silicon Labs welcomes TSMC’s ultra-low power initiative because it will enable a range of energy-friendly processing, sensing and connectivity technologies we are actively developing for the Internet of Things,” said Tyson Tuttle, Chief Executive Officer, Silicon Labs. “We look forward to continuing our successful collaboration with TSMC to bring our solutions to market.”

“Synopsys is fully aligned with TSMC on providing designers with a broad portfolio of high-quality IP for TSMC’s ultra-low power process technology and the Internet of Things applications,” said John Koeter, Vice President of Marketing for IP and Prototyping at Synopsys. “Our wide range of silicon-proven DesignWare® interface, embedded memory, logic library, processor, analog and subsystem IP solutions are already optimized to help designers meet the power, energy and area requirements of wearable device SoCs, enabling them to quickly deliver products to the market.”

As well as the ARM and Cadence Expand Collaboration for IoT and Wearable Device Applications Targeting TSMC’s Ultra-Low Power Technology Platform announcement of Sept 29, 2015:

ARM® and Cadence® today announced an expanded collaboration for IoT and wearable devices targeting TSMC’s ultra-low power technology platform. The collaboration will enable the rapid development of IoT and wearable devices by optimizing the system integration of ARM IP and Cadence’s integrated flow for mixed-signal design and verification, and their leading low-power design and verification flow.

The partnership will deliver reference designs and physical design knowledge to integrate ARM Cortex® processors, ARM CoreLink™ system IP, and ARM Artisan® physical IP along with RF/analog/mixed-signal IP and embedded flash in the Virtuoso®-VDI Mixed-Signal Open Access integrated flow for the new TSMC process technology offerings of 55ULP, 40ULP and 28ULP.

“TSMC’s new ULP technology platform is an important development in addressing the IoT’s low-power requirements,” stated Nimish Modi, senior vice president of Marketing and Business Development at Cadence. “Cadence’s low-power expertise and leadership in mixed-signal design and verification form the most complete solution for implementing IoT applications. These flows, optimized for ARM’s Cortex-M processors including the new Cortex-M7, will enable designers to develop and deliver new and creative IoT applications that take maximum advantage of ULP technologies.”

“The reduction in leakage of TSMC’s new ULP technology platform combined with the proven power-efficiency of Cortex-M processors will enable a vast range of devices to operate in ultra energy-constrained environments,” said Richard York, vice president of embedded segment marketing, ARM. “Our collaboration with Cadence enables designers to continue developing the most innovative IoT devices in the market.”

This new collaboration builds on existing multi-year programs to optimize performance, power and area (PPA) via Cadence’s digital, mixed-signal and verification flows and complementary IP alongside ARM Cortex-A processors and ARM POP™ IP targeting TSMC 40nm, 28nm, and 16nm FinFET process technologies. Similarly, the companies have been optimizing the solution based around the Cortex-M processors in mixed-signal SoCs targeting TSMC 65/55nm and larger geometry nodes. The joint Cortex-M7 Reference Methodology for TSMC 40LP is the latest example of this collaboration.

For the above keep in mind The TSMC Grand Alliance [TSMC, Dec 3, 2013]:

The TSMC Grand Alliance is one of the most powerful force for innovation in the semiconductor industry, bringing together our customers, EDA partners, IP partners, and key equipment and materials suppliers at a new, higher level of collaboration.

The objectives of the TSMC Grand Alliance are straightforward: to help our customers, the alliance members and ourselves win business and stay competitive.

We know collaboration works. We have seen it in the great strides our customers and ecosystem members have made through the Open Innovation Platform® where today there are 5,000 qualified IP macros and over 100 EDA tools that supports our customers’ innovation and helps them attain maximum value from TSMC’s technology.

Today Open Innovation Platform is an unmatchable design ecosystem and a key part of the Grand Alliance that will prove much more powerful. Looking at R&D investment alone, we calculate that TSMC and ten of our customers invest more in R&D than the top two semiconductor IDMs combined.

Through the Grand Alliance TSMC will relentlessly pursue our mission and collaborate with customers and partners. We need each other to be competitive. We need each other to win. Such is the power of the Grand Alliance.

[Some more information is in the very end of this post]

A related overview in Kicking off #ARMWearablesWK with an analysts view of the market post of November 17, 2014 of ARM Connected Community blog by David Blaza:

Today as we kickoff ARM Wearables Week we hear from Shane Walker of IHS who is their Wearables and Medical market expert.

Shane’s take on this market is that it’s for real this time (there was a brief Smartwatch wave a few years ago) and will continue to be a hot growth sector through 2015. One of the great benefits of talking with analysts like Shane is they help you think through what’s going on and bust a few myths that may have found their way into our thinking. For example I asked Shane what the barriers to growth were and he carefully and patiently pointed out that Wearables are growing at a 21% CAGR already and will hit $12b in device sales this year (without services, more on that later in the week).  So this is not an emerging or promising market, it’s here and growing at an impressive rate. By 2019 Shane’s estimate is that it will hit $33.5b in device sales and services are increasingly going to factor into the wearables experience (Big Data is coming!).

Shane breaks the Wearables market down to 5 major categories:

  1. Healthcare and Medical
  2. Fitness and Wellness
  3. Infotainment
  4. Industrial
  5. Military

I’m glad he did this for me because wearables are incredibly diverse and this week you are going to see some category defying products here such as smart Jewelry where does that fit?

Below you can see a table chart that Shane was willing to share that shows his estimate for market size and units sold, the main learning for me is how much of this market is healthcare related. Also attached below are details on what services IHS offer in the Wearables market or you can find them here.

futureICT - World Market for Wearable Technology - Revenue by Application -- IHS-November-2014

attached is: Wearable Technology Intelligence Service 2014.pdf  [IHS Technology, November 17, 2014]

Note the following table in that:
futureICT - Wearable Technology Data Coverage Areas by IHS

More information:
– A Guide to the $32b Wearables Market [IHS Technology, March 11, 2015]
– which has a free to download whitepaper:
Wearable Technology: The Small Revolutions is Making Big Waves

Brief retrospective on the SoC 1.0 Era

futureICT - Shipments of TSMC Advanced Technologies Q1'2009 - Q1'2015

Detailed Background from TSMC’s quaterly calls

Q1 2015:

Mark Liu – TSMC – President & Co-CEO
[update on new technology]

The continuous demand of more functionality and integration in smartphones drives for more silicon content. We expect smartphones will continue to drive our growth in the next several years.

In the meantime, we see IoT appears us — present us new growth opportunities. The proliferation of IoT not only will bring us growth in the sensor, connectivity and advanced packaging areas, the associated application and services, such as big data analytics, will also further our growth in the computation space, including application processor, network processor, image processor, graphic processor, microcontroller and other various processors. That was the long-term outlook.

I’ll update some of our 10-nanometer development progress. Our 10-nanometer technology development is progressing well. Our technology qualification remains in Q4 this year.

Recently we have successfully achieved fully functional yields of our 256-megabit SRAM. Currently we have more than 10 customers fully engaged with us on 10-nanometer. We still expect to have 10-nanometer volume ramp in fourth quarter 2016 and to contribute billing in early 2017.

This technology adopts our third-generation FinFET transistor and have scaling more than one generation. Its price is fully justified by its value for various applications, including application processor, baseband SoC, network processor, CPU and graphic processors. Its cost and price ratio will comply to our structural profitability considerations.

As for new technology development at TSMC, I’d like to start with — to update you our 7-nanometer development. We have started our 7-nanometer technology development program early last year. We also have rolled out our 7-nanometer design and technology collaboration activity with several of our major customers. Our 7-nanometer technology developments today are well in progress.

TSMC’s 7-nanometer technology will leverage most of the tools used in 10-nanometer, in the meantime achieve a new generation of technology value to our customers. The 7-nanometer technology risk production date is targeted at early 2017.

Now I would like to give you an update on EUV. We have been making steady progress on EUV. Both our development tools, we have two NXE 3300 have been upgraded to the configuration of 80 watt of EUV power, with an average wafer throughput of a few hundred wafers per day. We continue to work with ASML to improve tool stability and availability. We also are working with ASML and our partners on developing the infrastructure of EUV, such as masks and resists.

Although today the process on record of both 10-nanometers and 7-nanometer are on immersion tools, with innovative multiple patterning techniques, we will continue to look for opportunity to further reduce the wafer cost and simplify the process flow by inserting EUV layer in the process.

Now I’d like to give you an update of our recently announced ultra-low-power technologies. We have offered the industry’s most comprehensive ultra-low-power technology portfolio, ranging from 55-nanometer ULP, 40-nanometer ULP, 28-nanometer ULP, to the recently announced 16 FFC, a compact version of 16 FinFET Plus, enable continual reduction of operating voltage and power consumption. Today more than 30 product tape-outs planned in 2015 from more than 25 customers.

This 55- and 40-nanometer ULP will be the most cost-effective solution for low- to mid-performance wearable and IoT devices. The 28 ULP and 16 FFC will be the most power-efficient solution for high-performance IoT applications. In particular, our 16 FFC offers the ultra-low-power operation at a supply voltage of 0.55 volts, with higher performance than all of the FD-SOI technologies marketed today.

Lastly I’ll give you an update of our recent IoT specialty technology development. We have developed the world’s first 1.0-micron pixel size 16-megapixel CMOS image sensor, with stacked image signal processor, which was announced in March by our customer for the next-generation smartphone. Secondly, we continue to drive the best low resistance in BCD [Bipolar-CMOS-DMOS for DC-to-DC converter: together with Ultra-High-Voltage (UHV) technology for AC-to-DC converter—are the key to enable monolithic integrated PMIC design] technology roadmap, from 0.18 micron to 0.13 micron and from 8-inch to 12-inch production for wireless charging and fast wired charging of mobile devices. We continue to extend our 0.13 BCD technology from consumer and industrial applications to automotive-grade electrical system control applications.

Lastly, recently we have started production in foundry’s first 40-nanometer industrial embedded Flash technology that was started from November last year. And this technology recently passed automotive-grade qualification, that was in March, for engine control applications.

C.C. Wei – TSMC – President & Co-CEO

I will update you the 28-nanometer, 20 and 16 FinFET status and also our InFO business.

First, 28-nanometer. This is the fifth year since TSMC’s 28-nanometer entered mass production. 28-nanometer has been a very large and successful node for us. Our market segment share at this node has held up well and is in the mid-70s this year. We expect this to continue in year 2016. In comparison, this is better than what we had in the 40-nanometer node.

The demand for 28-nanometer is expected to grow this year due to the growth of mid- and low-end smartphones and as well as the second-wave segment, such as radio frequency, circuit product and the Flash controllers that migrate into this node.

However, due to some customers’ inventory adjustments, which we believe is only going to be for the short term, the demand for 28-nanometer in the second quarter will be lower than our previous quarter, resulting in 28-nanometer capacity utilization rate to be in the high-80s range. But we expect the utilization rate of the 28-nanometer to recover soon and to be above 90% in the second half of this year.

While we are in the mass production, we also continue to improve the performance of our technology. Last year we have introduced our 28-HPC, which is a compact version of 28-HPM. For the purpose of helping 64-bit CPU conversion for mid- to low-end market, this year we further improved the 28-HPC to 28-HPC Plus. For comparison, 28-HPC Plus will have 18% power consumption — lower power consumption at the same speed or 15% faster speed at the same kind of power.

As for the competitive position, we are confident that we will continue to lead in performance and yield. So far we do not see there is a very much effective capacity in High K metal gate at 28-nanometer outside TSMC. And since we have already shipped more than 3m 12-inch 28-nanometer wafers, the learning curve has given us an absolute advantage in cost.

Now let me move to our 20 SoC. TSMC remains the sole solution provider in foundry industry for 20-nanometer process. Our yield has been consistently good after a very successful ramp last year. But recently we have observed customers’ planned schedule for product migration from 20 nanometer to 16 FinFET started sooner than we forecasted three months ago.

As a result, even we continue to grow 20-nanometer business in the second quarter of this year, our earlier forecast of 20-nanometer contributing above 20% of total wafer revenue this year has to be revised down by a few points to a level about the mid teens. That being the case, we still forecast the revenue from 20-nanometer will more than double that of year 2014’s level.

Now 16 FinFET. The schedule for 16 FinFET high-volume production remains unchanged. We will begin ramping in the third quarter this year. And the ramp rate appeared be faster than we forecasted three months ago, thanks to the excellent yield learning that we can leverage our 20-nanometer experience and also due to a faster migration from 20-nanometer to 16 FinFET.

In addition to good yield, our 16 FinFET device performance also met all products’ specs due to our very good transistor engineering. So we believe our 16 FinFET will be a very long-life node due to its good performance and the right cost. This is very similar to our 28-nanometer node.

We are highly confident that our 16 FinFET is very competitive. As we’ve said repeatedly, combining 20-nanometer and 16-nanometer, we will have the largest foundry share in year 2015. And if we only look at 16-nanometer alone, we still can say TSMC will have the largest 16- or 14-nanometer foundry share in year 2016.

Now let me move to our InFO business update. The schedule to ramp up the InFO in second quarter next year remains unchanged. We expect InFO will contribute more than $100m quarterly revenue by next year, fourth quarter next year, when it will be fully ramped.

Right now we are building a new facility in Longtan, that’s a city very near to Hsinchu, where our headquarters are, for ramping up InFO. Today a small product line is almost complete and it’s ready for early engineering experiment. This pilot line will be expanded to accommodate the high-volume ramp in year 2016.

Andrew Lu – Barclays – Analyst

… I think Mark presented at the Technology Symposium in San Jose mentioned that 16 FinFET versus competing technology is about 10% performance better. So can you elaborate what’s 10% performance better? If our die size is larger than our competitors, how can we get the 10% performance better?

Mark Liu – TSMC – President & Co-CEO

In the conference we talked about 16 FinFET Plus. That is our second-generation FinFET transistor. In that we improved our transistor performance a great deal. According to our information, that transistor speed, talk about speed at fixed power, is higher than the competitor by 10%. That’s what I meant. …  Because of the transistor structure, transistor engineering.

Andrew Lu – Barclays – Analyst

Compared to competing — is the competing the current competitor’s solution or the next-generation competitor’s solution? For example, LPE versus LPP or something like that?
Mark Liu – TSMC – President & Co-CEO
The fastest one. The fastest.
Andrew Lu – Barclays – Analyst
Their best one?
Mark Liu – TSMC – President & Co-CEO
Yes.

Dan Heyler – BofA Merrill Lynch – Analyst

My second question is relating to 20-nanometer. Here you certainly have a lot of growth in 16, with customers taping out aggressively, especially next year. Given your high share at 28, how do you keep 28 full? You obviously have a lot of technology there. Customers will move forward.

So I’m wondering, could you elaborate on new areas that are actually creating new demand at 28, such that you can continue to grow 28 next year. And do you think you can grow? I think previously you said maybe hold it at current levels even with 16 growing. So just maybe revisit that question.

C.C. Wei – TSMC – President & Co-CEO

To answer the question, I think the high-end smartphone will move to 16 FinFET. However, the mid- to — and lower-end smartphones will stay in the 28-nanometer because that’s very cost effective. And mid- and low-end smartphone continues to grow significantly. So that will give a very strong demand on 28-nanometer. In addition, we still have a second-wave product, like RF and Flash controller, as I use as an example, move into 28-nanometer.

So summing it up, I think the 28-nanometer’s demand continue to grow while we move into the 16 FinFET for high-end smartphone.

Michael Chou – Deutsche Bank – Analyst

As Mark has highlighted your EUV program, Does that imply you may consider using EUV in the second stage of your 16-nanometer — 10-nanometer ramp-up, potentially in 2018 or 2019? 

Mark Liu – TSMC – President & Co-CEO

Yes, we always look for opportunity to insert EUV in both 10-nanometer and 7-nanometer. The EUV technology provides not only some cost benefit, but also simplify the process. That means you can replace multiple layers with one layer that helps your yield improvement. So there’s opportunity both in quality and cost always exist so long as EUV’s productivity comes to the threshold point.

And in — as you noticed on 10-nanometer, our capacity build will largely done in 2016 and 2017. So 2018 will be inserted, if inserted, will be combined with some other tools upgrade, some tool upgrade to 7, for example, and replaced by the EUV tools. In that node it will not be a fresh capacity build with EUV at that time because that’s a little bit late in the schedule for the 10.

7-nanometer, of course it will be higher probability adopting EUV. And the benefit will be bigger because the 7-nanometer has a lot of multiple layers, quadruple, even multiple patterning layers, thus EUV can be more effective in reducing the cost and improve the yield, for example. So that’s our current status.

But today EUV is still in the engineering mode. The productivity, as you heard, will still have some gaps for practical insertion of the technology. So we’re still working on that, in that mode. And we have — although we have one-day performance up to 1,000 wafer per day, but I was talking about average still a few hundreds. And we need to get to more than 1,000 to consider a schedule to put it into the production.

Randy Abrams – Credit Suisse – Analyst

As you go to fourth quarter, how broad is the customer base? Is it a single key product or are you seeing broadening out of 16 FinFET as you ramp that in fourth quarter?

Mark Liu – TSMC – President & Co-CEO

… As for the second half, we think, first of all, the inventory adjustment will largely complete towards the end of second quarter.

We think the end market of smartphone is still healthy growth this year. Therefore the second half will resume the growth. And, more importantly, our 16 FinFET technology will start to ramp in the second half. So that will contribute a lot of growth, more than the 20-nanometer shipment reduction. So those two factors.

Roland Shu – Citigroup – Analyst

My first question is on given the fast ramp of 16-nanometer, so are we going to see meaningful revenue contribution for 16 in 3Q?

C.C. Wei – TSMC – President & Co-CEO

We ramp up in third quarter this year, but it’s many layers of process, plus about one month is back-end. So in 3Q we expect just the revenue just very minimum.

Bill Lu – Morgan Stanley – Analyst

This is a follow-up to Randy’s question. But I’m going to go over some numbers with you first before I ask the question, which is we did the math. I don’t think these are exactly right. But over the last five years we’ve got IDM zero growth, fabless 8%, but system houses above 20%, right. So system houses, I’m excluding memory, just the system LSI, the logic portion. I think that might be slightly conservative.

Now that’s a pretty big change. And I’m wondering how you should think about that, how you should — if you look at TSMC addressing the system houses versus the fabless customers, if you look at, for example, your market share, if you look at your margin for the system houses versus the fabless, how do you think about that?

Mark Liu – TSMC – President & Co-CEO

Yes. Indeed, in the past five years the system houses sourcing and foundry business to us has a much higher growth rate, as you quoted. But remember, that came from a very small base. Okay? But we welcome system house sourcing because we consider them are fabless too, fabless companies, the companies without fabs, bring business to us.

It’s not necessarily the margin has to do with what type of company sourced. It has to do with our value to that company and also the size, the size of the business. If the business is bigger, of course the — we probably can enjoy a slightly — a little bit better price. So it depends on the size of the business, less dependent on what company, system company or non-system company’s business.

Steven Pelayo – HSBC – Analyst

For the last three years or so, TSMC’s been growing 20%, 30% year-on-year revenue growth rates. First quarter 50% year on year. But to Bill’s question there, it does look like in the second half of the year, if I play around with your full-year guidance and what you’re doing, low single-digit year-on-year growth rates. And if we exclude maybe 16-nanometer, above 16-nanometer, maybe it’s flat to down. Is that the new industry? What are we talking now for industry growth rates for both the semi industry and in the foundry market this year?

90 days ago you suggested the semi market was going to grow 5% this year with foundries growing 12%. In light of your new guidance, in light of what it looks like you’re going to have very slight year-on-year growth rates in the second half of the year, what do you think that means for the overall industry?

Mark Liu – TSMC – President & Co-CEO

We think the semiconductor growth this year currently is indeed we adjusted down from 5% earlier to 4% at this time. Yes. We think it’s really due to the macroeconomic situation around the world today. And therefore the foundry market — foundry growth rate will adjusted down too. We are looking at about 10% range. So that’s why we revised our view on the current semiconductor growth.

Brett Simpson – Arete Research – Analyst

My question on 10-nanometer, I know it’s still 18 months away from ramp-up, but can you talk about how fast this ramp might scale relative to 20-nanometer or 28-nanometer?

And as you ramp up 10-nanometer for high-end smartphones, would you expect low-end smartphones to start migration from 28 with 16 FinFET in 2017?
Elizabeth Sun – TSMC – Director of Corporate Communications
… Your question seems to say that if we ramp 10-nanometer in the future, which will be targeting the high-end smartphone, will the low-end smartphone be migrating from 28-nanometer into 16-nanometers.
Brett Simpson – Arete Research – Analyst
And  just to add to that, Elizabeth, how quickly will 10-nanometer scale up relative to the scaling of 20-nanometer — the ramp-up of 20-nanometer and 28? Will it be as fast?
Elizabeth Sun – TSMC – Director of Corporate Communications
So the profile of the 10-nanometer ramp, will that be steeper than the profile of the 20 or the 28-nanometer?

Mark Liu – TSMC – President & Co-CEO

Okay. The first part of the question has to do with 10-nanometer ramp for the high-end smartphone, will the mid/low-end move to 16? I think we — this is up to our customers’ product portfolio. We definitely know a lot of customer is looking at 28-nanometer to use — to do as the low end. But the specification, the smartphone processor specification changes constantly. So what portion of that product will move to 16-nanometer? We think definitely there are some portion, but how a big portion really depends on their product strategy.

On the 10-nanometer ramp, I wouldn’t say it’s bigger. But at least it’s similar scale of our ramp as we do in 16 and as we do in 20.

Brett Simpson – Arete Research – Analyst Great.

Thank you. And let me just have a follow-up here. There’s been a lot of talk in the industry about one of your larger customers [Qualcomm] planning to introduce a new application processor on both Samsung’s 14-nanometer process as well as your 16 FinFET for the same chip later this year. And we haven’t really seen a single chip get taped out on two new processors at the same time before in the industry. So my question, how does this really work between the two foundries? Does it mean that that one customer can adjust dynamically, month to month, how they allocate wafers between you and Samsung? Or am I — or how might this work?
Elizabeth Sun – TSMC – Director of Corporate Communications … So your question seems to say that there is a customer that appeared to be working with two different foundries on the 14 and 16-nanometer node. And the products are about to arrive. You would like to understand how this customer will be allocating month by month the — what’s the production or the orders with both of the two foundries. Is that your question?
Brett Simpson – Arete Research – Analyst
Yes, that’s right. Whether they can move around dynamically how they allocate wafers. That’s right.

C.C. Wei – TSMC – President & Co-CEO

Well my answer is very typical. Our 16 FinFET is really very competitive. And we did not know that customer going to — how they’re going to allocate. I cannot even make any comment on that.

Gokul Hariharan – JPMorgan – Analyst

First of all on 16-nanometer, since Dr. Wei mentioned that next year a lot of demand on entry-level to mid-end smartphone is still going to stay at 28-nanometer, could you talk about your visibility for second-wave demand for 16-nanometer? 

What is the visibility that you have? Is it going to be really strong? Because you mentioned that a lot of the cost-sensitive customers would still stay on 28, at least for next year.

C.C. Wei – TSMC – President & Co-CEO

For 28-nanometer I said mid to low end this year that, and next year probably, that smartphone will stay in 28-nanometer because it’s very cost-effective and performance-wise is very good. For 16 FinFET I think that people will start to move with their product plan and some of the mid-end smartphone will move into 16-nanometer. That’s for sure.

In addition to that, we also see improving our 16 FinFET ultra-lower-power Mark just mentioned. And that will have a lot of application. And every product, lower power consumption is one of that advantage.

And so that would be our second wave of 16 FinFET.

Dan Heyler – BofA Merrill Lynch – Analyst

… So on 16, this FinFET Compact which is getting introduced, when would we expect to see that in volume production?

C.C. Wei – TSMC – President & Co-CEO

FFC? That will be ready next year. And we expect that high-volume production starts probably two years later. That’s year 2017. 2018 will reach the high volume.

Dan Heyler – BofA Merrill Lynch – Analyst

Okay. So is there a — so the cost-down version for mid-end phones FinFET that you alluded to, plus low power, when is that available?

C.C. Wei – TSMC – President & Co-CEO

Probably in 2017 second half.

Q4’2014:

Lora Ho – Taiwan Semiconductor Manufacturing Company Ltd – SVP and CFO

During the fourth quarter, the strong 20-nanometer ramp was mainly driven by communication-related applications. As a result, communication grew 18% sequentially and the revenue contribution increased from 59% in the third quarter to 65% in the fourth quarter. As for other applications, computer grew 7%, while consumer and industrial declined 21% and 11% respectively.

On a full-year basis, communication increased 39% and represented 59% of our revenue. The major contributing segments included baseband, application processors, image processors and display drivers. Another fast-growing application in 2014 was industrial and standard, which grew 30% year over year. The growth was mainly driven by increasing usage of power management ICs, near-field communications and audio codec within the mobile devices.

By technology, 20-nanometer revenue contribution started with a very small number in the second quarter, jumped to 9% in the third quarter and reached 21% in the fourth quarter. Such unprecedented ramp cannot be achieved without seamless teamwork with our customer, the R&D and operational people in TSMC.

On a full-year basis, 20 nanometer accounted for about 9% of our full-year wafer revenue. Looking forward, we are confident that 20 nanometer will continue its momentum to contribute 20% of the revenue for the whole year 2015.

Meanwhile, customer demand for our 28-nanometer wafers remained strong. Accordingly, these two advanced technologies, 20 nanometer plus 28 nanometer, represented 51% of our fourth-quarter total wafer revenue, a big increase from 43% in the third quarter.

Mark Liu – Taiwan Semiconductor Manufacturing Company Ltd – President and Co-CEO

Now I’ll give you a few words on 10-nanometer development update. Our 10-nanometer technology development is progressing and our qualification schedule at the end of 2015, end of this year, remains the same. We are now working with customers for their product tape-outs. We expect its volume production in 2017.

On the new technology development in TSMC, I’ll begin with beyond 10 nanometer I just talked about. We are now working on our future-generation platform technology development, with separate dedicated R&D development teams. These technologies will be offered in the 2017-to-2019 period. We are committed to push forward our technology envelope along the silicon scaling path.

In addition to the silicon device scaling, we are also working on the system scaling through advanced packaging to increase system bandwidth, to decrease power consumption and device form factors. Our first-generation InFO technology has been qualified. Currently we are qualifying customer InFO products with 16-nanometer technology. And it will be ready for volume ramp next year, 2016. We are now working on our second-generation InFO technology to supplement the silicon scaling of 10-nanometer generation.

On the other side, in addition to the recently announced 55ULP ultra-low power technology, 40ULP, 28ULP technologies for ultra-low power application, such as wearable and IoT, we are also working on 16ULP technology development. This 16ULP design kit will be available in June this year. It will be just suitable for both high-performance and ultra-low power or ultra-low voltage, less than 0.6-volt applications.

C.C. Wei – Taiwan Semiconductor Manufacturing Company Ltd – President and Co-CEO

Good afternoon, ladies and gentlemen. I’ll update you on 28, 20, 16-nanometer status and the InFO business.

First on 28 nanometer. Since year 2011, we started to ramp up 28-nanometer production. Up to now we have enjoyed a big success in terms of a good manufacturing result and, most importantly, the strong demand from our customers. This year we expect the success will continue.

Let me give a little bit more detail, first on the demand side. The demand continues to grow, which are driven by the strong growth of mid- and low-end 4G smartphones, as well as the technology migration from some second-wave segments, such as the radio frequency, hard disk drive, flash controller, connectivity and digital consumers.

Second, on the technology improvement, we continue our effort to enhance 28-nanometer technology by improving the speed performance while reducing the power consumption. 28HPC, 28 ultra-low power technology are some examples.

So to conclude the 28-nanometer status, we believe we can defend our segment share well because of excellent performance and performance/cost ratio and our superior defect density results.

Let’s talk about the 20 SoC business status. After successfully ramp up in high volume last year, we expect to grow 20-nanometer business more than double this year due to high-end mobile device demand, which were generated by our customers’ very competitive products. Our forecast of the 20-nanometer business, as Lora just pointed out, will contribute 20% of the total wafer revenue. That remains unchanged.

Now on 16-nanometer ramp-up. We expect to have more than 50 product tape-outs this year on 16-nanometer. High-volume production will start in third quarter, with meaningful revenue contribution starting in fourth quarter this year. In order to stress again what our Chairman already mentioned, that combining 20 nanometer and 16 nanometer we expect to enjoy overwhelming market segment share.

Last, I will update on the InFO business. The traction on InFO is strong. We have engaged with many customers. And a few of these customers are expected to ramp up in second quarter next year. Right now we are building a small pilot line in a new site to prepare for high-volume production next year. Also we expect this InFO technology will contribute sizeable revenue in 2016.

Dan Heyler – BofA Merrill Lynch – Analyst

…. I guess as we look at your pie chart on your slide with communications and computer being amazingly only 9% of your revenue, and, say, 10 years ago that chart was much, much different, with computer being the biggest. As we look at computer opportunities going forward, I think to some extent there’s maybe a sense of a little bit of disappointment in that we don’t see ARM necessarily in PCs yet. We haven’t really necessarily seen that ecosystem come through in the server business. And big data being such an important trend going forward, with compute growing about 15% per year, I’m wondering what TSMC is doing or what your view of that opportunity will be in the future as a potential growth driver.

Morris Chang – Taiwan Semiconductor Manufacturing Company Ltd – Chairman

Server is one of them, Mark. Well there’s IoT actually also, and just don’t forget that mobile actually we think has a few more years to run yet. Really the TSMC silicon content in the average phone is actually increasing, which is something that is not recognized by a lot of people, because everybody says that the weight, the gravity is shifting to the middle level, lower-level priced phones. But according to our data, and we have kept track of it for quite a long time, the average of TSMC silicon content in the average phone is actually increasing.

So — and look, we still look for over — I think the number we have is that by 2019 there’ll be 2b phones manufactured. It is — I think last year it was, what, 1.3b? I think, yes, 1.3b. 1.3b to 2b. And, well, and the average TSMC silicon content per phone is increasing. And the number of phones is going up. So that’s by no means a — it’s still there. It’s still a growth engine.

And then IoT, I think we talked about IoT before, and now we are certainly not oblivious to the server possibility. So why don’t I ask Mark to talk about the server and maybe C.C. will talk a little about the IoT.

Mark Liu – Taiwan Semiconductor Manufacturing Company Ltd – President and Co-CEO

Okay, Dan. I’ll just respond to you on the server part. Chairman talked about the area we’re mostly focused on, phone, today. And that would drive — give us growth momentum in the next several years.

On server, we work with the product innovators around the world. And such a field definitely we’ll not lose in our radar screen and theirs. And TSMC has been, over the years, developed our technology to suit for high-power computing.

And from 65, 40, 28 to 16 nanometer, we continuously improve our transistor performance. And today we believe our 16 FinFET Plus transistor performance probably is the top of — is one of the top of the world. It’s well suitable, well capable of doing the computing tasks.

And actually before server, and there are several supercomputers around the world, in US and in Japan, already powered by our technology, doing the weather forecasting, whether the geo exploration applications today. And on the server, on ARM in particular, we have very close partnership with ARM in recent years. And ARM is a very innovative company. They produce CPU core and new architecture every year. And we reached our leading-edge technology very early with ARM and to design their leading-edge CPU cores. And that will continue and several of our customers are taking advantage of that.

Yes, in the past it’s been getting into slower as expected. That’s because the software ecosystem is slower to come. And — but actually a lot of the server companies, system company is continuing investing in this ecosystem. Linux-based ecosystem is coming very strong too. So I think the trend will continue. And we will, with our customers, get into these segments in the next — in the near future. Yes.

C.C. Wei – Taiwan Semiconductor Manufacturing Company Ltd – President and Co-CEO

For the IoT, that would be a big topic right now in the whole industry. All I want to say is that we are happy to share with you that, a long time ago, we already focused on our specialty technology, which are the CMOS image sensor, MEMs, embedded Flash, all those kind of things. Today we add another new technology, ultra-low power, into it. And that will be the basis for the IoT technology necessary in the future. We believe that when the time comes and IoT business becomes big, TSMC will be in a very good position to capture most of the business. That’s what I share with you. Thank you.

Randy Abrams – Credit Suisse – Analyst

… And the follow-up question on profitability. If you could give a flavor on structural profitability for 2015 and some of the flavor for 20, how quick that may get to corporate margins, and for 16, because it’s an extension, whether that could be near corporate margins as that comes up. And if you could give a comment on the inventory at current levels, if there’s any — if that will stay at these higher levels from the WIP you’ve been building or if that may come back down to a different level.

Lora Ho – Taiwan Semiconductor Manufacturing Company Ltd – SVP and CFO

Randy, you have multiple questions. I recall you asked for the structural profitability. That’s you first question, right? From what we can see now, we are quite confident we can maintain equal or slightly better structural profitability, standard gross margin versus 2014.

For the 20-nanometer and 16-nanometer ramping, how would that affect corporate margin? I have said in last July it usually takes seven or eight quarters for any new leading-edge technology to get close to the corporate average. So for 20 nanometer, it will take eight quarters. So we believe — so 20 nanometer start to sell in second quarter 2014, and we expect by first quarter 2016, that’s eight quarters, it will be at corporate average level.

For 16, we are going to mass produce this product. It will follow the similar trend. 16 nanometer will be based on the feature of 20 nanometer, so the margin will start to be higher. But it will also follow the similar trend. It takes seven quarters to reach to corporate average. So say we plan to mass produce 16 FinFET in third quarter 2015, so by first quarter 2017 you will get close to corporate average. So there will — before that there will be still small dilutions. For this year, the dilution will be 2 to 3 percentage points. And the last year, the second half will be 3 to 4 percentage points and very low in 2016.

Donald Lu – Goldman Sachs – Analyst

… Chairman, about six months ago you gave us a comment on your estimate on TSMC’s market share in FinFET in 2015, 2016, 2017. So has that changed?

Morris Chang – Taiwan Semiconductor Manufacturing Company Ltd – Chairman

… Donald’s question was I said — actually I looked up my statement at that time, July 16 of last year. I said on the subject of 16 and 20, 16-nanometer and 20-nanometer technology, I said that — I actually made three statements.

The first statement was that because we started 16 a little late, our market share in 2015, our 16-nanometer market share in 2015 will be smaller than our major largest competitor’s.

The second statement I made was that we started 16 late because we wanted to do 20. And so if you combine 20 and 16, our major competitor, who will be slightly ahead of us this year on the 16, he has very little 20. Almost no 20 at all. And if we combine 20 and 16, our combined share in this year will be much higher than that competitor’s.

The third statement I made is that in 2016 we will have much larger share in just 16 nanometer than that competitor.

All right. First I want to say that I, at this time, stand on those statements. In fact, I now will add a couple of statements. The statements I will add are — that’s fourth statement now. Okay? When we have a larger share of just 16 alone in 2016, the 16 market will also be much larger than this year, 2015. So, yes, we’re slightly behind. We have a smaller market share in 2015 in a smaller market. Next year we will have a larger share, in fact much larger share, in a much larger market, 16.

So — and another statement I want to make is that I’m, at this point, very, very comfortable with all those statements that I have made on July 16 last year and the statements that I have added today. I’m very comfortable. I don’t know whether I answered your question or not, Donald.

Donald Lu – Goldman Sachs – Analyst

Yes. How about 2017, if –?

Morris Chang – Taiwan Semiconductor Manufacturing Company Ltd – Chairman

What? Well, 2017, the share is going to continue. We’re not going to lose the leadership on 16 market share once we recapture that in 2016. It’s going to continue 2017, 2018. And also both 20 and 16 are going to live longer than you might think now. Well 28, for that matter, will also live longer than you’d think.

Michael Chou – Deutsche Bank – Analyst

… Can we say your 16-nanometer market share in 2016 will be quite similar to your dominance in 28 nanometer, given that your 20 nanometer is the only provider? So the apple-to-apple comparison should be 28 to 16 nanometer.
Elizabeth Sun – Taiwan Semiconductor Manufacturing Company Ltd – Director of Corporate Communications
So market share in 16 nanometer in 2016, will that be the same as our market share at 28 nanometer, I would say, back in 2013, 2014?
Michael Chou – Deutsche Bank – Analyst Yes

Morris Chang – Taiwan Semiconductor Manufacturing Company Ltd – Chairman

Well, no, I don’t think so, because 28, of course we were virtually sole source. And 16, we already know we’re not. There’s at least one major competitor and then there’s another one that’s just eager to get in. I don’t mean that first competitor’s accessory, I mean another one.

Brett Simpson – Arete Research – Analyst

My question is around 28 nanometer. You’re running a large capacity at 28 nanometer at the moment. So can you share with us what your capacity plan is for 28? As you migrate more business to 20 nanometer and below over the next couple of years, do you intend to convert 28-nanometer capacity to lower nodes, or do you think you can keep the existing 28-nanometer capacity running full going forward.
Elizabeth Sun – Taiwan Semiconductor Manufacturing Company Ltd – Director of Corporate Communications
All right. Let me repeat Brett’s question so that people here can hear it better. Brett’s question is TSMC’s 28-nanometer capacity is very large. As our technology migrates to more advanced nodes, such as 20 and 16, in the next few years, what will be our plan on capacity of the 28 nanometer? Will we still have large demand to utilize those capacities or we need to do some changes?

Morris Chang – Taiwan Semiconductor Manufacturing Company Ltd – Chairman

Every — in every generation we worry a lot about the conversion loss we will suffer when we convert the equipment of that — the existing capacity of that generation to the capacity of the next generation. Now, so we do two things. First, we try to minimize that conversion loss. And since we’ve been living with the problem for so long now, I think we’re getting to be pretty good at it. So the conversion loss from one generation to another is normally in the low single digit, low middle single digit. Now the second thing we try to do is, and I think we actually have been doing it perhaps even more successfully than the first thing. The first thing was to try to minimize the conversion loss. The second thing we try to do is we try to prolong the life of each generation. And I was saying just five minutes ago that I think that the life of 28 nanometer may be longer than a lot of people think. And I mean it. Actually we’re still making half-micron stuff. And we try to prolong the life of every generation as we continue to migrate to advanced technologies. And 28 is certainly a generation that we want to prolong the life of.

Bill Lu – Morgan Stanley – Analyst

My first question is on 28 nanometers. If I look at your capacity this year versus 2014, how much is the increase in capacity?

Morris Chang – Taiwan Semiconductor Manufacturing Company Ltd – Chairman

High teens. High teens actually.

Gokul Hariharan – JPMorgan – Analyst

… First, I had a question on there’s been a lot of controversy about cost per transistor, whether Moore’s law — the economics of Moore’s law are slowing down. Your competitor Intel has put out a very emphatic statement saying that until 7 nanometer they’re seeing that continuing at the same pace as before. But there has been a lot of noise from the fabless community in the last couple of years that at 20 nanometer or at 16 nanometer there is a potential slowdown.

Could we have TSMC’s version now that you’re pretty much ready to start 10 nanometer and thinking already about 7? That’s my first question.
Elizabeth Sun – Taiwan Semiconductor Manufacturing Company Ltd – Director of Corporate Communications
So, all right. Let me repeat. Gokul, your question is mainly on the comments on cost per transistor. Some of the other players, I think you’re referring to Intel, who has made comments that they do see the cost per transistor to continue into 7 nanometer and so they can handle the economics of the Moore’s law. Whereas, on the other hand, fabless companies begin to complain about not seeing enough economics, starting with 20 nanometer. So what is TSMC’s statement regarding this economics issue?

Mark Liu – Taiwan Semiconductor Manufacturing Company Ltd – President and Co-CEO

Let me answer this question. The cost of transistor continues to go down. And by scaling mostly is — everybody knows, nobody I think has refused that statement — we see the cost of transistor continues going down in a constant rate. And in going forward, the cost of transistor going down probably at slightly slower rate. That’s the argument. But it really depends on companies. And for some companies simply do not have the technological capabilities. And today, further going down the Moore’s Law technology developments, just a few. And we — as far as whether those costs can — is — can get enough returns, and of course that has to do with how much that technology brings value to the product where they command the price. And today we see certain segments will continue to need that type of system performance to get enough return. So this is the reason we committed to push the system scaling.

Roland Shu – Citigroup – Analyst

Just a 10-nanometer question to C.C. Since, C.C., you said we are expecting to volume production of 10-nanometer in 2017. But I remember in the past two quarters actually our goal was to pulling in 10-nanometer mass production by end of 2016. So are we pushing out the 10-nanometer mass production schedule a little bit on that?

C.C. Wei – Taiwan Semiconductor Manufacturing Company Ltd – President and Co-CEO

Let me explain that, because 10 nanometer, the mask layers is about 70 to 80. So you’ve got to start in 2016 to have output in 2017. So what I’m talking about is 2017 is to start to have revenue.

Q3 2014:

Lora Ho – TSMC – SVP & CFO

By technology, after two years of meticulous preparation we began volume shipments of 20-nanometer wafers. The revenue contribution went up from 0% to 9% of the third quarter wafer revenue. This is the fastest and the most successful ramp for a new technology in TSMC’s history.

Mark Liu – TSMC – Co-CEO


On 10-nanometer development, our 10-nanometer development is progressing according to plan. Currently we are working on early customer collaboration for product tape-outs in 4Q of 2015. The risk production date remain targeted at the end of 2015.

Our goal is to enable our customers’ production in 2016. To meet this goal, we are getting our 10-nanometer design ecosystem ready now. We have completed certification of over 35 EDA tools using ARM’s CPU core as the vehicle. In addition, we have started the IP validation process six months earlier than previous nodes with our IP partners.

We are working with over 10 customers on their 10-nanometer product design. The product plans show wide range of applications, including application processors, baseband, CPU, server, graphics, network processor, FPGA and game console. Our 10-nanometer will achieve industry-leading speed, power and gate density.

C.C. Wei – TSMC – Co-CEO


Next, I’ll talk about the 16-nanometer ramp and competitive status. In 16-nanometer, we have two versions, 16 FinFET and the 16 FinFET Plus.

FinFET Plus has better performance and has been adopted by most of our customers. 16 FinFET we began the risk production in November last year and since then have passed all the reliability qual early this year. For the FinFET Plus, we also passed the first stage of the qualification on October 7 and since then entered the risk production. The full qualification, including the technology and product qual, is expected to be completed next month.

So right now we have more than 1,000 engineers working on ramp up for the FinFET Plus. On the yield learning side, the progress is much better than our original plan. This is because the 16-nanometer uses similar process to 20 SOC, except for the transistor. And since 20 SOC has been in mass production with a good yield, our 16 FinFET can leverage the yield learning from 20 SOC and enjoy a good and smooth progress. So we are happy to say that 16-nanometer has achieved the best technology maturity at the same corresponding stage as compared to all TSMC’s previous nodes.

In addition to the process technologies, our 16 FinFET design ecosystem is ready also. It supports 43 EDA tools and greater than 700 process design kits with more than 100 IPs. All these are silicon validated. We believe this is the biggest ecosystem in the industry today.

On the performance side, compared with the 20 SOC, 16 FinFET is greater than 40% speed faster than the 20 SOC at the same total power or consumes less than 50% power at the same speed. So our data shows that in high-speed applications it can run up to 2.3 gigahertz. Or on the other hand, for low-power applications it consumes as low as 75 miniwatts per core.

This kind of a performance will give our customer a lot of flexibility to optimize their design for different market applications. So far we expect to have close to 60 tape-outs by the end of next year.

In summary, because of the excellent progress in yield learning and readiness in manufacturing maturity and also to meet customers’ demand, we plan to pull in 16-nanometer volume production through the end of Q2 next year or early Q3 year 2015. The yield performance and smooth progress of our 16 FinFET, FinFET Plus further validate our strategy of starting 20 SOC first, quickly follow with the 16 FinFET and FinFET Plus. We chose this sequence to maximize our market share in the 20-, 16-nanometer generation.

Next, I’ll talk about 28-nanometer status. We had strong growth in second quarter on 28-nanometer. And the business grew another quarter and accounted for 34% of TSMC’s wafer revenue in third quarter. On the technology side, we continue our effort to improve yield and tighten the process corners, so that our customer can take advantage of these activities and shrink their die size and therefore reduce the cost.

Let me give you an example. On 28LP, the polysilicon gate version, we now offer a variety of enhanced processes to achieve better performance. We also offer a very competitive cost so that our customers can address the mid- to low-end smartphone market. In addition to the 28LP, we also provide a cost-effective high-K metal gate version, the 28HPC for customers to further optimize the performance and the cost. Recently, we added another 28-nanometer offering we called 28 Ultra Low Power, for ultra low power applications obviously. We believe this 28ULP will help TSMC customers to expand their business into the IoT area.

In summary, we expect our technology span in 28-nanometer node will enhance TSMC’s competitiveness and ensure a good market share. We also expect the strength of the demand for our 28-nanometer will continue for multi years to come. In response, we are preparing sufficient capacities to meet our customers’ future demand.

Q2 2014:


Morris Chang – TSMC – Chairman

Now a few words on 20-nanometer and 16-nanometer progress. In the last two and half to three years, 28-nanometer technology has driven our growth. In the next three years, 20 and 16-nanometer technologies are going to drive our growth; 28 in the last two and half to three, 20 and 16 in the next three.

After two years of meticulous preparation, we began volume shipments of our 20-nanometer wafers in June. The steepness of our 20-nanometer ramp sets a record. We expect 20-nanometer to generate about 10% of our wafer revenue in the third quarter and more than 20% of our wafer revenue in the fourth quarter. And we expect the demand for 20-nanometer will remain strong and will continue to contribute more than 20% of our wafer revenue in 2015. It will reach 20% of our total wafer revenue in the fourth quarter of this year and it will be above 20% of our total wafer revenue next year.

The 16-nanometer development leverages off 20-SoC learning and is moving forward smoothly. Our 16-nanometer is more than competitive, combining performance, density and yields considerations. 16-nanometer applications cover a wide range including baseband, application processors, consumer SoCs, GPU, network processors, hard disk drive, FPGA, servers and CPUs. Volume production of 16-nanometer is expected to begin in late 2015 and there will be a fast ramp up in 2016. The ecosystem for 16-nanometer designs is current and ready.

A few years ago, in order to take advantage of special market opportunities, we chose to develop 20-SoC first and then quickly follow with 16-nanometer. We chose this sequence to maximize our market share in the 20/16-nanometer generation. As the 20/16 foundry competition unfolds, we believe our decision to have been correct.

Number one, in 20-SoC, we believe we will enjoy overwhelmingly large share in 2014, 2015 and onwards.

Number two, in 16-nanometer, TSMC will have a smaller market share than a major competitor in 2015. But we’ll regain leading share in 2016, 2017 and onwards.

Number three, if you look at the combined 20 and 16 technologies, TSMC will have an overwhelming leading share every year from 2014 on.

Number four, in total foundry market share, after having jumped 4 percentage points in 2013, TSMC will again gain several percentage points in 2014. This is the total foundry market share covering all technologies. After having increased 4 percentage points last year, TSMC will gain another several percentage points this year.

Now a few words about 10-nanometer. The 10-nanometer development is progressing well. The 10-nanometer speed is 25% faster than the 16-nanometer. The power consumption is 45% less than 16-nanometer and the gate density is 2.2x that of the 16-nanometer. Power is 25% faster. Did I say power? I meant speed. Speed is 25% faster, power is 45% less, gate density 2.2 times more, all compared with 16-nanometer.

We work closely with our key customers to co-optimize our 10-nanometer process and design. We expect to have customer tape outs in the second half of 2015.

William Dong – UBS – Analyst

Good afternoon Mr. Chairman. I guess — we keep talking about technology. I guess the question I want to ask is that with all this rush to continue to push down technology roadmap, to go down to 16, to 14 and to 10 nanometer, what are our thoughts about what’s driving this demand? As we move toward, for example, Internet of Things, is there such a requirement to keep pushing on the technology front to actually have enough, sufficient demand to keep driving it down?

Morris Chang – TSMC – Chairman

Well, if the cost is low enough — cost is very much a part of the equation. If the cost is low enough, the demand will increase because we can see a lot of applications that are just waiting there. Of course I’m talking about the mobile products, but I’m also talking about Internet of Things, so wearables and so on, so on, Internet of Things. The applications are just waiting there for better, for faster speed and lower power and higher density ICs. Cost is definitely in the equation.

So, yes, when you ask will the demand be there. If we can get the cost down to an acceptable level, demand will be there. And of course that’s why — that’s how things like EUV come into the question. Nobody has asked about that yet. We actually were prepared to answer that with the same answer that we gave you last time, by the way, that we are still planning to — there’s still a possibility to use EUV on one, one or two — or just one layer in the 10 nanometer, yes. One layer, one layer in 10 nanometer and 7 I think is, of course, an even better candidate.

Dan Heyler – BofA-Merrill Lynch – Analyst

Hopefully this question simplifies and doesn’t complicate things. Just to make sure I understand this share loss thing, so basically what you’re saying is the share loss at 16, these are customers that are choosing to skip 20? Is that how should I think of this that these are not any — are any of these customers that are currently 20 that are going to 16 next year or is this all people that are choosing to skip 20?

Morris Chang – TSMC – Chairman

Well, first of all, I want to question the word share loss. I don’t consider there is share loss because just like 32/28 we had zero share in 32. But then we were very successful in 28. The two really belong to the same generation. And 20 and 16 also belong to the same generation. So, yes — and share loss means that you start with something and then you lose it, it becomes less. Well, this year nobody has — everybody has zero share, okay. And I am just saying that we will start on 16, we will start with a lower share than we did with 20 or 28. We start with a lower share than we did with 20 or 28. And then we’ll get back to a high share in 2016. I’m just arguing with him, but he did have a question; what was that?

Dan Heyler – BofA-Merrill Lynch – Analyst

Or just simply are your — are these customers moving to 16, are these the ones that have currently been on 20 or are these the guys that have skipped because the debate in the industry is should we go straight to 16 and skip 20. So are these customers that have basically been at 28 and are skipping 20 and going straight to 14 at your competitor?

Morris Chang – TSMC – Chairman

Mainly because our customers wanted it sooner. We got in a little late, as I said; our customers wanted it sooner. So that’s why we’re starting — and we’ll catch up only a little later.

Michael Chou – Deutsche Bank – Analyst

Chairman, regarding the 16/20 nanometer, could we say your total market share in 16 and 20 nanometer will be similar to 28/32 for the corresponding period? Can we say that?


Morris Chang – TSMC – Chairman

The combined 20 — I just ran an analysis just a couple of weeks ago, so I know exactly the answer to your question. The combined 20/16 market share in the first two years of its existence, which is this year and next year — well, I guess I have to add in 2016 — the combined — our combined 20/16 share in 2014, 2015 and 2016 will still be greater than our combined share of 32 and 28 in 2012, 2013 and 2014.

Q1 2014:


Mark Liu – Taiwan Semiconductor Manufacturing Company Ltd – President & Co-CEO

Then I cover the updates on 16 FinFET, 16 FinFET plus and our 10 FinFET. First, we have two general offers for customers, 16 FinFET and 16 FinFET plus. 16 FinFET plus offers 15% speed improvement, the same total power, compared to 16 FinFET. More importantly, 16 FinFET plus offers 30% total power reduction at the same speed, compared to 16 FinFET.

Our 16 FinFET plusmatches the highest performance among all available 16-nanometer and 14-nanometer technologies in the market today. Compared to our own 20 SoC, 16 FinFET plus offers 40% speed improvement. The design rules of 16 FinFET and 16 FinFET plus are the same; IPs are compatible.

We will receive our first customer product tapeout this month. About 15 products planned for 2014, another about 45 in 2015. Volume production is planned in 2015. Since 95% tools of 16 and 20 are common, we will ramp them in the same gigafabs in TSMC. 16 FinFET yield learning curve is very steep today and has already caught up with 20 SoC. This is a unique advantage in TSMC 16-nanometer.

For 10 FinFET, 10 FinFET offer TSMC’s third generation FinFET transistor, designed to meet the power and the performance requirement of mobile computing devices. 10 FinFET will offer greater than 25% speed improvement, the same total power, compared to 16 FinFET plus. More importantly, 10 FinFET offer greater than 45% total power reduction at the same speed, compared to 16 FinFET plus.

10 FinFET will offer 2.2X of density improvement over its previous generation, 16 FinFET plus. So, currently, 10 FinFET development progress is well on track, but risk production will be in 4Q 2015. Above are the key messages on three items.

C.C. Wei – Taiwan Semiconductor Manufacturing Company Ltd – President & Co-CEO

…  I would like to take this opportunity to share with you the two topics with you; namely, the 20 SoC ramp and TSMC’s advance assembly solution to our customer. First, I will brief you on the status of 20 SoC ramp.

Let me recap what we had said in the last meeting here. We started 20 SoC production in January this year and by fourth quarter of this year, the 20 SoC will account for 20% of the quarterly revenue — wafer revenue. And for the whole year of 2014 we expect 20 SoC will be about 10% of our total wafer revenue of the year of 2014, of course. All these expectations remain the same today.

Now, there are some major achievement I would like to share with you. First, on the ramping speed. 20 SoC by far is the fastest ramping in TSMC’s history. Of course, this fast ramp is to meet customers’ strong demand. And I believe this production of 20 SoC in TSMC represents one of the largest mobilization in semiconductor history. Let me share with some numbers, so you can have a snapshot on this ramp.

In about one year’s time we have built a manufacturing team of 4,600 engineers and 2,000 operators in two fabs; Fab 14 in Tainan and Fab 12 in Hsinchu. More impressively, in the same time period, close to one thousand engineer has been relocated among TSMC’s fabs in Hsinchu, Taichung and Tainan. All these are prepared for the 20 SoC’s ramp-up. This magnitude of mobilization, I believe, is not an easy job. We move people around that show our strength in manufacturing and this highly mobilization is not moving the tool or just a handful around. We’re talking about we’re moving the engineer and operator among TSMC’s fabs. In the meanwhile, we have installed more than 1,500 major tools for this 20 SoC ramp.

Of course, the faster ramp has done with a very good device reliability and a very good wafer defect density. Without those, the fast ramp will make no sense. Now how important are these 20 SoC ramp? Well we knew that 28 nanometer provided the engine of TSMC’s profitable growth in the years of 2012 and 2013 and similarly, we expect 20 SoC will provide the engine of TSMC’s profitable growth in year 2014 and 2015.

Now let me switch gear to advanced assembly technologies. The purpose of — for us to develop advanced assembly technology is to provide our customer a better performance and a lower power consumption, while at a lower cost as compared to the previous assembly solution. For example, we have developed CoWoS and CoWoS has been developed to connect two dies or more dies together to have a very high performance and a very low power consumption and today CoWoS is in a small volume production already. However, the cost structure of CoWoS has made CoWoS only suitable for some very high performance applications and the products. To address the cost structure issue and for those mobile — very large volume mobile devices, we have developed a derivative technology called InFO; that stands for integrated fan-out.

InFO will have significant lower cost as compared to CoWoS and at the same time, InFO also can have the same capability to connect multiple dies together just as the CoWoS did. Currently, we’re working with major customers and the InFO, to incorporate this structure into their future product. We have delivered many functional dies to our customers already and the process optimization are ongoing.

In fact, we are very excited about TSMC’s advanced assembly technology development as we’re building a innovative solution for our customers product, which requires high performance, lower power consumption and at a very reasonable cost structure.

Michael Chou – Deutsche Bank – Analyst

I don’t know, C.C. Wei, could you give us more color on the advanced packaging you just mentioned. What’s the difference between this one and CoWoS?

C.C. Wei – Taiwan Semiconductor Manufacturing Company Ltd – President & Co-CEO

The difference between the InFO and the CoWoS is actually the geometry to connect multi-dies together. In the CoWoS, actually we are using very small geometry, actually 65 nanometers of geometry to connect the multi-dies together. In InFO, we’re using the larger geometry, which are still technical confidential information. But the cost is much, much lower.

Brett Samson – Arete Research – Analyst

Just had a quick question. Can you give us a sense within the 28 nanometer nodes, how does that split between poly-SiON and high-K and how do you think this might trend through this year?
Elizabeth Sun – Taiwan Semiconductor Manufacturing Company Ltd – Director, Corporate Communications
So Brett’s question is what is really the mix between poly-SiON, that is our 28 LP, versus our high-k metal gate and what is going to be the trend with respect to that kind of mix throughout this year?

Mark Liu – Taiwan Semiconductor Manufacturing Company Ltd – President & Co-CEO

Allow me to answer that. Our 28 nanometer high-k metal gate has three options, 28HP, 28HPM and 28HPC. And this year these 28 high-k metal gate technology will be about 85% of the overall 28 nanometer in terms of the wafer.

Dan Heyler – Bank of America Merrill Lynch – Analyst

… I want to follow up on this InFO, this is quite interesting. Could you just maybe elaborate a bit more on what exactly are you going to be attaching, so which devices are we talking about in terms of what – with CoWoS it was pretty much PLD [Programmable Logic Devices, like Altera] companies were there and others, some baseband. So what devices are you attaching on the initial generation between the different chips? And second part of that question would be what kind of — how many customers do you expect to manage to have in this area, because you start peddling lots of devices and lots of customers it gets really complicated, you start to look more like an OSAT [Outsourced Semiconductor Assembly and Test]. So I wonder if this is going to be a pretty small group of high volume products? And finally on — as you attach — are you actually doing a chip attach or will you be doing only the wafer level activity and will you be having — working with the OSATs to do the actual chip attach?

C.C. Wei – Taiwan Semiconductor Manufacturing Company Ltd – President & Co-CEO

Dan, to answer your question, the InFO actually we’re right now working on application processor together with memory dies. That’s good enough for you. I cannot say anything more than that. We’re working with mobile product customers and we did not — we expect very high volume, but we did not with many, many customers as current status. We’re working on the wafer level process, stacking die, and couple of them, we’re able to do the complete line all here.

Q4 2013:


Morris Chang – Taiwan Semiconductor Manufacturing Co., Ltd. – Chairman

Good afternoon, ladies and gentlemen. Today, our comments are scheduled as on the slide on your left. First, I’m very glad to have the opportunity to introduce our new top management team.

I’d first start with Lora, although I think everyone knows Lora well. Lora has a bachelor’s degree from Chengchi University, a master’s degree from National Taiwan University, both degrees in finance. She worked for Cyanamid, Wyse, Thomas & Betts and TI-Acer before she joined TSMC in 1999. And she has been TSMC’s CFO since 2003.

Next, Dr. C. C. Wei. C. C. has a bachelor’s degree from Chiao Tung University and a Ph. D. from Yale University, both in electrical engineering. C. C. worked for TI, SGS, Chartered before joining TSMC in 1998. C. C. has been Senior VP of Operations, Senior VP of Business Development, Co-COO, and in the Co-COO job CC was successively responsible for R&D and Operations. Now C.C. is President and Co-CEO.

C.C. is 60 years old and I should add that Lora is 57 years old.

Mark Liu; Mark has a B.S. from National Taiwan University and a Ph. D. from Berkeley, both in electrical engineering and computer science. Mark worked for Intel, Bell Telephone Labs before joining TSMC in 1993. And at TSMC he has been VP, Senior VP of Operations and he was also a Co-COO, and all the time he was Co-COO he was responsible for our sales, marketing and planning.

And now Mark and C.C. are Presidents and Co-CEOs of the Company. Mark is 59 years old.

C.C. Wei – Taiwan Semiconductor Manufacturing Co., Ltd. – President & Co-CEO
[about the technology aspects of TSMC’s growth engine]

Good afternoon everybody. I am C.C. Wei and I will give you the update of our 28-nanometer high-K metal gate version. Let me recap the history. We started 28-nanometers volume production in year 2011 mainly on the 28LP, the oxynitride version. And since then the business continued to grow. So last year, we had tripled 28-nanometers of business versus year 2012. That in this year, year 2014, the business for 28-nanometer will continue to grow at least by another 20%, and all the increase are coming from the 28-nanometers high-K metal gate version, which is we name it 28HPM.

Let me add more color to it. We expect we’re going to have about more than 100 tape-outs from about 60 customers in this year in 28HPM. Now you may ask it why? Why there are so many products that were designed on this technology? One of the main reason I can give it to you is the performance, the superior performance. For example, 28 HPM compare with the 28LP that will gain another 30% of the speed at the same kind of power consumption, or you can say that at the same power consumption — at the same speed, you will consume 15% less power. And everybody knows that the power consumption in the mobile device is very important. That’s why we think we have a very high, good business on the 28 HPM.

Now, furthermore, after the 28HPM, we also offer 28HPC, which is a low-cost version of the 28HPM. The 28HPC is developed to meet the customers’ demand to compete in the mid-to-low-end smartphone market. We expect that this 28HPC will have a very strong demand in the next two years. That’s what we have.

Okay, let me give you some information on the competition to explain why we are so confident on this 28 nanometers high-K metal gate business. If you still remember that long time ago, we mentioned about gate-first and gate-last. Still remember that terminology? All right. So, simply to say that gate-last version will give you better performance and a better process control. As a result, all our customers will enjoy using the gate-last versions that technology to have a higher or better performance than other products which are designed with a different approach.

In addition to that I’ll say that because of the better process control and TSMC’s manufacturing excellence, we have a much better yield than our competitor, so that our customer will enjoy the lower die cost. That’s what we have. And that’s why we explained that our confidence that the 28 nanometers business continue a very good business for us.

Now, let me switch the gear to 20-SoC. That’s another exciting news that we have, I want to share with you. 20-SoC is a technology that we developed to enable TSMC’s customer to lead in the mobile device market. And this technology we are believe in this year, next year, well I have a very good business to capture. So, what is the status now of the 20-SoC? We have two fab, Fab 12 and Fab 14 that complete the qual of 20-SoC. And as a matter of fact, we started production. We are in volume production as we speak right now. So, it’s in the high-volume production as we are speaking right now.

Let me add more information to that. First, there are more than $10 billion had been committed to build capacity. Second, we have more than 2,500 engineers and 1,500 operators right now in manufacturing, doing the 20SoC volume production. The ramping rate will be the fastest one in TSMC’s history. Using the ramping rate, you can get the hint of the business, how big the business is.

Another fact to share with you, we have probably — at the end of this year, we have more than dozens of tape-out from about a dozen customers that they are producing the 20SoC product, okay? You may ask, good business, how about the competition? If you have a very strong competition, you might — cannot have too much of confidence on the future. Let me talk about the competition.

I’m very confident that our 20SoC is the highest gate density in volume production at 20 nanometers node. And please remember that; highest gate density and a high volume production. I don’t see any company today can claim on this kind of production and with this kind of gate density at this time, nobody. And most of our competitors, to be frank with you, they’re not even into this game yet. So we are confident to have a good business that will contribute to TSMC’s revenue — wafer revenue by probably around 10% this year. And with that I conclude my presentation and thank you for your attendance.

Mark Liu – Taiwan Semiconductor Manufacturing Co., Ltd. – President & Co-CEO
[about TSMC’s competitiveness versus Intel and Samsung]

I will start this topic by update you our recent development status of our 16-FinFET technology. 16-FinFET technology has been a very fast paced development work in TSMC and we have achieved the risk production milestone of 16-FinFET in November 2013, November last year. And this month, we should pass the 1,000 hours so-called the technology qualification. So the technology is ready for customer product tape-out.

Our 16-FinFET yield improvement has been ahead of our plan. This is because we have been leveraging the yield learning of 20SoC. Currently 16-FinFET SRAM yield is already close to 20SoC. And with this status we are developing an enhanced transistor version of 16-FinFET plus, with 15% performance improvement. It will be the highest performance technology among all available 16 and 14 nanometer technology in 2014. The above progress status is well ahead of Samsung.

Let me comment on the Intel’s recent graph shown in their investor meetings, showing on the screen. We usually do not comment on other company’s’ technology, but this is — because this has been talking about TSMC technology and as Chairman said, has been misleading. To me it’s erroneous, based on outdated data. So I like to make the following rebuttal.

futureICT - 2013--Intel Is Committed to Press Ahead on Density - Enables a 'Transistor Like' Lead in Density

2013: Intel Is Committed to Press Ahead on Density – Enables a “Transistor Like” Lead in Density

futureICT - Jan-2014--Density Comparison by TSMC vs Intel 2013 statement

January 14, 2014: Density Comparison by TSMC vs. Intel’s 2013 statement at its Investor Meeting

On this view graph, the vertical axis is the chip area on a log scale. Basically this is compared at chip area reduction. On the horizontal axis, it shows four different technologies; 32/28, 22/20, 14/16-FinFET and 10-nanometer. 32 is Intel technology and 28 is TSMC technology. So is the following three nodes; the smaller number 20, but on 14-FinFET is Intel, 16-FinFET is the TSMC. On the view graph shown at Intel investor meeting, it is with the grey plots showing here. The grey plots shows the 32 and 20 nanometer, TSMC is ahead of the area scaling, but however, with 16, the data, grey data shows a little bit uptick. And following the same slope, go down to the 10 nanometer. What’s the correct data we show on the red line, that’s our current TSMC data. The 16, we have been volume production on 20 nanometer, as C.C. just mentioned, this is the highest density technology in production today.

We took the approach of significantly using the FinFET transistor to improve the transistor performance on top of the similar back-end technology of our 20 nanometer. Therefore, we leveraged the volume experience into volume production this year, to be able to immediately go down to 16 volume production next year, within one year. And this transistor performance and innovative layout methodology can improve the chip size by about 15%. This is because the driving of the transistor is much stronger, so that you don’t need such a big area to deliver the same driving circuitries.

And for the 10 nanometer, we haven’t announced it, but we did communicate with many of our customers that that will be the aggressive scaling of technology we’re doing. And so, in the summary, our 10 FinFET technology will be qualified by the end of 2015. 10 FinFET transistor will be our third generation FinFET transistor. This technology will come with industry’s leading performance and density. So, I want to leave this slide by 16 FinFET scaling is much better than Intel said, but still a little bit behind Intel.

However, the real competition is between our customer’s product and Intel’s product or Samsung’s product. TSMC’s Grand Alliance; that is the alliance of us, our customers, EDA, IP, communities and our supplier is the largest and the only open technology platform for the widest range of product innovations in the industry today. As for the tape-out of our 16 FinFET, more than 20 customer product tape-outs on 16 FinFET technology is scheduled this year already. They include wide range of applications; baseband, application processors, application processor SoCs, graphics, networking, hard disk drive, field programmable array, CPUs and servers. Our 16 FinFET technology captured the vast portion of products in the semiconductor industry.

We’ve been actively working with our customer’s designer on this since last year. TSMC’s speed and productization of the customer’s product and our ability to execute for a short time-to-market for a customer are far superior than Intel and Samsung.

Lastly, I would comment on the mobile products. With this 16 FinFET technology and the innovations of processor architecture and various IP from our customers, we are confident that this planned, 16 FinFET mobile product, which is going to tape out to us, will be better than Samsung’s 14 nanometer and better than Intel’s 14 SoC. Thank you very much.

Roland Shu – Citigroup Global Markets – Analyst

… Is the 16-plus is improving from the design you were saying or this is just for the performance enhancement or are we going to consider to change our 16-plus to — even to the — same as the 14-nanometer? …

Mark Liu – Taiwan Semiconductor Manufacturing Co., Ltd. – President & Co-CEO

16 FinFET-plus is a transistor enhancement. For the design — back-end design rule are similar to 16 FinFET, therefore designer can design on 16 FinFET and re-characterize, upgrade their product performance. This transistor, as I mentioned, also can reduce the cell size, standard cell size, and with the enhanced performance transistor. That’s the way to reduce the chip size. So we do not intend to change the naming. I mean this is engineering, this is the word — this is the name that we chose earlier based on the physical consistent number and we do not intend to change name.

Randy Abrams – Credit Suisse – Analyst

My first question on the management structure now with the Co-COOs promoted to Co-CEOs. If you could talk about how the responsibilities would change with their promotion to Co-CEO? And for yourself, Dr. Chairman, how will your activities change versus before this move? So if you could talk about the roles for each of the different Co-CEOs and yourself now.

Morris Chang – Taiwan Semiconductor Manufacturing Co., Ltd. – Chairman

We started with President and the Co-CEO in November, and it has been now two months. And if you ask me now, has my life changed in the last two months? My answer is no. It has not changed. But I think that my effort, my time has been spent more on the coaching aspects. I think that — I do believe that I do more coaching. If I spend 100 hours and — I now perhaps spend 20 hours of the 100 hours on coaching, whereas in the past, I’d probably spend only 5 or 10 hours of the 100 hours on coaching.

Now, actually, this is an overseas call, is this correct? Yes. So let me just explain very briefly what the Taiwan law and customs are in relation to a Chairman’s authority and responsibility. Basically, by both law and custom, the Chairman of a company has the ultimate authority and responsibility, basically. However, he may delegate his authority and responsibility to the President. He may also take it back anytime. He can delegate any and all, any or all of the responsibilities to the President. And now these two gentlemen, their titles is President and co-CEO. President comes first. They are, in a very legal sense, Presidents. Now the co-CEO is basically a Western term. And then in the United States, a CEO usually bears the final ultimate responsibility and authority as a Chairman in Taiwan does. In the US, it’s the CEO. Now — so my role in the future is really to convert these two gentlemen from the Taiwan sense President to the US sense CEO, and it will be a gradual process.

Donald Lu – Goldman Sachs – Analyst So Chairman, (spoken in foreign language).

First question is, I want to ask the Chairman, how would you — are you satisfied with the transition so far and also, how the two Presidents would share their work? Are they still rotating or not? And (multiple speakers) but probably not now. And maybe give us some details about how the Company is run. And I have a follow-up question on competition.

Morris Chang – Taiwan Semiconductor Manufacturing Co., Ltd. – Chairman

All right. I am quite satisfied with the transition. And these two gentlemen; Mark is now responsible for sales, marketing, strategic planning, business development, and yes, information technology and materials management, all those. And C.C. is responsible for operations, all the operations, and he is also responsible for specialty technology R&D. Specialty technology incidentally accounts for 25% of our total business. So now, Donald, your other question is whether they’re going to rotate. My plan currently is, I don’t plan it that way, I don’t plan it that way right now. However, I deem it’s a pretty flexible thing. Tomorrow, I may take one part of Mark’s and give it to C.C. or vice versa. But I’m not considering rotation, per se. Yes, does that answer your first question?

Donald Lu – Goldman Sachs – Analyst

… Okay, since we are already doing it, why don’t you give us more color? 16-nanometer, for example, are we saying that in terms of die size, performance, our product will be very similar to Intel’s 40-nanometer FinFET? And also, Mark commented that for the FinFET tape-outs, specifically there’s a CPU and server chips, and can we say that TSMC’s CPU and server chips will have the similar physical performance as Intel’s products today?

Morris Chang – Taiwan Semiconductor Manufacturing Co., Ltd. – Chairman

Well, I think, Donald, we have already given everybody enough information on our 16-FinFET. I think that if we keep giving more, we would be helping our competitors who have picked on us. And so, now, we do stand on what we said. We are going to — our Grand Alliance will out-compete Intel and Samsung. Our Grand Alliance on the 16-FinFET will out-compete. By that I don’t mean that we’ll completely exclude them, no, no, no. We can’t do it. We won’t be able to do that. But our Grand Alliance, with us as foundry supplier, will capture a large share of the 16-nanometer. You agree with that don’t you?

Mark Liu – Taiwan Semiconductor Manufacturing Co., Ltd. – President & Co-CEO

The fabless companies in China are very aggressive approaching leading-edge technologies. To tell you, our 16-FinFET this year, already some of the fabless companies will be using it in tape-outs. So, I think all those fabless companies’ subsidy will propel them into the leading-edge technology more.

July 20, 2013: TSMC takes on rivals with Grand Alliance strategy, says Chang [Global Data Point] by TMC News

(Global Data Point Via Acquire Media NewsEdge) Taiwan Semiconductor Manufacturing Company (TSMC) chairman and CEO Morris Chang, at a July 18 investors conference, talked about the importance of the foundry’s close ties with customers and ecosystem partners, and described how TSMC has formed a “Grand Alliance” with EDA, IP, software IP, systems software and design services providers.

TSMC has been competitive against fellow pure-play foundries, said Chang. In the face of rising competition from IDMs, TSMC with its ability to deliver cutting-edge technologies and advanced manufacturing capacity is also able to outshine the rivals, Chang indicated.

With the industry moving towards sub-20nm technologies, Chang believes that TSMC will become more capable of fending off rivals like Samsung Electronics and Intel. “Now in this new era of competition, the competition is not between foundries. It is not between foundries and IDMs. It is between ‘Grand Alliances’ and IDMs,” Chang pointed out.

Chang named ARM, Imagination, Cadence and Mentor as some of TSMC’s IP and EDA partners.

TSMC’s so-called “Grand Alliance” seems like an expansion of its Open Innovation Platform (OIP), which was announced in 2008. TSMC’s OIP is a business strategy aiming to provide integrated services from design to manufacturing to testing and packaging. According to TSMC, the platform is to bring together the thinking of customers and partners under the common goal of shortening design time, minimizing time-to-volume and speeding time-to-market.

In addition, Chang noted that TSMC’s 28nm process technology is on track to triple in wafer sales in 2013. TSMC made 29% of its NT$155.89 billion (US$5.18 billion) revenues from selling 28nm chips in the second quarter of 2013.

Chang also reiterated TSMC’s plans that 20nm technology will begin volume production in early 2014, followed by volume production of 16nm FinFETs within one year.

Thin/Zero Client and Virtual Desktop Futures

26 years of Wyse and Citrix collaboration resulted in an advanced infrastructure solution bringing the Windows desktop into a virtualised cloud environment and accessible from any cloud computing client device, including even thin client and zero client devices, or ones  presenting a HTML5 browser functionality only. The infrastructure is getting a universal device management capability as well. And the most important hallmark of this infrastructure solution is complete security meaning immunity from viruses et al. In addition to the Windows desktop applications the next wave of web applications as well as SaaS applications (such as those provided by Salesforce.com) are made easily accessible and usable from any of those device and access points. The hallmark here is the possibility of continuing usage at the point where it has been left off from another device and access point. True flexibility from the user point of view.

For more introductory information please watch these two videos:

Jeff McNaught Interview One [CitrixTV YouTube channel, May 24, 2012]

Jeff McNaught, Chief Strategy and Marketing Officer from Wyse shares thoughts about Synergy i.e. Wyse and Citrix collaboration results. Everything started in 1995 !!

Zenith2 – The Product that Changes Evertyhing [CitrixTV YouTube channel, May 24, 2012]

Jeff McNaught, Chief Strategy and Marketing Officer from Wyse shares the benefits of Zenith2 which is the first zero client built for Citrix that is managed by Citrix XenDesktop. The only completely secure [“virus immune”] device, high performance for all types of workers and optimized for multimedia.

The detailed elaboration of the “Thin/Zero Client and Virtual Desktop Futures” topic will go through the following sections of the post:

  • Wyse entry-level solution for education
  • A glimpse into the Wyse portfolio and their large public / enterprise markets
  • Essential technology and market information
    A highly important preview from it:
    XenDesktop and Metro Receiver [CitrixTV YouTube channel, May 9, 2012]
Citrix Synergy demo: XenDesktop and Metro Receiver. Brad Peterson, Chief Demo Officer,  Citrix

Before going into those detailed sections here is a highly important introduction as well (in order to understand the future potential of this advanced infrastructure solution):

Wyse Technology’s President and CEO Tarkan Maner speaks with Edie Lush at Hub Davos [hubculture YouTube channel, Jan 26, 2012]

Wyse Technology’s device dramatically lowers the cost of computing by connecting users directly to the internet. There is no Software or Operating Systems on the device – everything comes from the cloud. The technology is much cheaper and much greener – they have no fans, create no heat and use much less power. The technology is being used by private companies trying to cut costs and by schools from San Jose, California to South Africa, making it possible for every student to have a computer, access to the internet and the ability to learn faster.

Notes:
– [00:40] Presumably the entry-level zero (which has no OS – see much below) client, Wyse E01 is shown as “working on only 2 watts” (the spec much below says upto 3 watts) and “costing less than $50, start at $35” (the current single unit retail price of E01 is $76 however, while the list price is $99 – see much below).
– That device is even presented as needing only the data center. Currently however entry-level zero client devices such as E01 (and the latest E02) require Microsoft MultiPoint Server (see much belo). So he is definitely pointing to an upcoming solution.
– [03:00] He mentions South-Africa with “10 million devices this year” as an educational example. So that kind of upcoming solution could definitely be in the works already. The power consumption difference might also indicate such a new entry-level device.

Management team [Wyse webpage, April 2, 2012]:

President, CEO and Chief Customer Advocate, Tarkan Maner

Tarkan Maner is the President and CEO at Wyse Technology, the global leader in Cloud Client Computing. Cloud Client Computing is the ultimate end user computing solution for our time, replacing the outdated, unsecure, unreliable, un-green and expensive client/server-centric systems. Cloud Client Computing delivers the security, manageability, availability, reliability, scalability, flexibility, and user experience with the lowest energy usage and total cost of ownership. Cloud Client Computing simply connects all the dots: Cloud client software, hardware and services.

Wyse provides its customers and partners with the broadest and deepest portfolio of Cloud Clients, including Thin, Zero and Cloud PC clients, supported by the leading cloud-centric firmware, virtualization, management and mobility software in the industry. Wyse independently partners with the leading data center, networking and collaboration solution providers within its global partner ecosystem to help organizations and people reach the clouds – in a private, public, government or, even in a personal cloud. Wyse’s mission is to enable any user, anywhere, to connect to any content via any app in any work environment without constraints, conflicts or compromises.

Tarkan believes that Cloud Client Computing not only drives better economic and productivity results for organizations, but, also drives societal change throughout the world. Cloud Client Computing reduces the cost, eliminates the complexity and enables the reach of computing to the next six billion users via billions of devices pervasive in every aspect of our lives.

Tarkan in the news

facebook.com/TarkanManer


Wyse entry-level solution for education

Post-PC Era Expands as Wyse and Serbian Government Partner for Nation-wide Cloud Client Computing Deployment in Education [Wyse press release, Sept 28, 2011]

More than 30,000 Students Gain Access to Latest Learning Technology with Wyse and Microsoft Solutions in Schools across Serbia

LONDON, UK and SAN JOSE, Calif. – 09/28/2011 – Wyse Technology, the global leader in cloud client computing, today announced a major implementation of its zero client technology in the Digital  School  project to transform classroom teaching in Serbia. In one of the largest projects of its kind in Europe, all elementary schools in Serbia will be outfitted with a new IT infrastructure based on Wyse zero clients and Microsoft Windows MultiPoint Server 2010, enabling every student to have access to the latest computing software, educational applications and online resources.

Committed to modernizing the country’s educational system,  among other reforms, the Ministry of Telecommunications and Information Society, identified the need for a better information technology and communications infrastructure to support teaching and learning in classrooms.

Working with its technology partner company ComTrade, the solution is based on Windows MultiPoint Server 2010 and enables multiple users to simultaneously share a single computer while each using their own monitor, keyboard and mouse. This is an ideal solution for educational customers that want to extend IT access to more students, easily and affordably. The solution is designed for simple implementation and ease-of-use for teachers, provides the familiar Windows 7 desktop experience, and requires no advanced IT expertise.

The ministry selected Wyse E01 zero clients because they maximize the advantages of Windows MultiPoint Server. The zero clients simply plug into the host computer which automatically configures and enables a student to start work immediately. Unlike comparable devices for Windows MultiPoint Server, the Wyse E01 zero client supports USB peripherals such as, webcams, and USB flash drives, allowing a more flexible computer-based teaching and learning experience.

Jasna Matic State Secretary for Digital Agenda, former Minister for Telecommunications and Information Society said , “Enhancing ICT for education is a major goal of the Government with this programme delivering on our promise to give every student access to their own computer at school. With cutting edge technology from Microsoft and Wyse, our schools have a solid foundation for delivering education to the highest standards.”

Deployment of the Microsoft and Wyse education solution started in December  2010 and will be completed this year.

For more information about Wyse E01 zero clients, please visit, http://www.wyse.com/products/hardware/zeroclients/E01/index.asp

Windows MultiPoint Server 2011 Overview [msmultipoint YouTube channel, May 25, 2011]

Windows MultiPoint Server 2011 is a low-cost computing solution that creates a 1:1 user to computer experience built on Windows Server. With MultiPoint Server 2011, one PC can provide up to 20 computing sessions at a fraction of the cost.

Wyse® E class™ – Affordable computing for education [Wyse brochure, Jan 23, 2012]

image1. One Windows Multipoint server shares its operating system and applications with up to 20 users at a time.

2. Features Wyse E class zero clients, one per desktop and each one linked by a USB [E01] or Ethernet [E02] cable.

3. Low cost, fast and simple to set up delivery of Windows desktops.

Windows MultiPoint Server 2011 Quick configuration guide

4 ~ 6 users 8 ~ 20 users
CPU Intel CPU i5/i7 Intel CPU i5/i7
Memory 4 GB 8 GB
Hard drive 250 GB 500 GB
Graphics/1 On board Intel HD Graphics 2000 or similar same
Graphics/2 PCI-Express Card ATI Radeon™ HD 4600 / 4770 / 5750 nVidia GeForce 8x, 9x Series / GT220,GT240 same
Software Microsoft Windows Multipoint Server 2011
Zero client Wyse E01 [retail: $76+] and E02 [$99] Zero Client
Licenses (Microsoft Academic VL) Microsoft MultiPoint Server License [$115]Microsoft MultiPoint CAL License per device [$29]

Technical specifications Wyse E01
[E02 difference is Ethernet networking + 2 USB 2.0 port instead of 4 with E01 + 98 x 98 x 20 millimeters dimensions and 128g + standing position]

Server OS Windows MultiPoint Server 2011
I/O peripheral support One VGA (DB-15)
Four USB 2.0 ports (1 on left side, 3 on right side)
One Mic In / One Line Out
USB keyboard (not included)
USB mouse (not included)
Networking One USB in to connect to host computer (cable included)
Maximum distance between each Wyse E01 zero client and the host computer is 5 meters (16 feet 5 inches)
Display Up to 1680 x 1050 @ 60Hz / 32bits or 1600 x 1200 @ 60Hz / 32bits
Audio Output: 1/8-inch mini jack, full 16 bit stereo
Input: 1/8-inch mini jack, 8 bit microphone
Physical characteristics Height: 21.5mm (0.85 inches)
Width: 132mm (5.20 inches)
Depth: 87mm (3.43 inches)
Shipping Weight 145g (0.32 lbs)
Power Worldwide auto-sensing 100-240 VAC, 50/60 Hz. power supply
Average power usage with device connected to 1 keyboard with 1 mouse and 1 monitor:
less than 3 Watts
Temperature Range Vertical position: 50° to 104° F (10° to 40° C)
Humidity 20% to 80% condensing
10% to 95% non-condensing

Announcement information:

$99 Wyse E01 Zero Client and Windows MultiPoint Server 2010 Optimize IT and Financial Resources for Schools in Tough Economy

“We’re happy to be launching with strong support from Wyse, which has committed to developing innovative and effective solutions like the Wyse E01 Zero Client for the MultiPoint platform,” said Ira Snyder, general manager, Windows MultiPoint Server at Microsoft Corp.  “MultiPoint Server can deliver a familiar Windows computing experience to educational institutions around the world, helping them get the best value out of technology investments while providing the very best education for their students.”

Wyse Expands E Class Zero Client Offering for Windows MultiPoint Server

Wyse Technology … today announced the introduction of the Wyse E02 zero client in support of  Microsoft’s Shape the Future program

The Wyse E01 zero client and the Wyse E02 zero client work with Windows MultiPoint Server 2011 to enable multiple students or SMB users to share a single server. The E02 is easy for teachers to set up and use in the classroom, providing an excellent Windows 7 desktop experience for their students. While the Wyse E01 zero client provides students access to the shared server via USB cabling up to 5 meters, the E02 goes a step further to provide access via Ethernet, at a distance of up to 100 metersfrom the Windows MultiPoint Server.

“Providing students with affordable access to technology is one way Microsoft is helping to ultimately create greater opportunities and more enriched lives for youth around the world. The Wyse E02 zero client, combined with Windows MultiPoint Server, is an excellent example of how we are working to deliver on this mission,” said Microsoft’s Shape the Future Senior Director, Joice Fernandes.

Appropriate and sustainable technology solutions for education in Africa [in The eLearning Africa 2012 Report (p. 17), May 23, 2012]

Widening access to reliable information technology is key to how we can help our children develop educationally. This is especially true in the fast developing economies of Africa where the expectation for access to ICT in the school has increased as more citizens use information technology like mobile phones in their everyday lives.

However, in our view, the ambitious eLearning goals in Africa can only be achieved with classroom technology that is intrinsically sustainable. But, in the African context, what do I mean by sustainability? First of all this is not about ticking the box of some green IT policy set by a government. The reality of extending digital classrooms into urban or rural Africa is that IT provision must take account of the absence of reliable power supplies. Any interruptions can be managed with novel solutions around battery back-ups or solar energy to power a classroom in a remote setting.

Even when reliable power supplies are available, low power consumption is going to remain important in how schools manage their budgets. This makes thin or zero client computers very attractive as they typically only use between 3 and 15 watts of power.

Sustainability in African eLearning is much more than about energy efficiency. It also refers to how IT in schools needs to be easy to set up and manage because it is unrealistic to expect a school to always have access to IT management skills on the ground. As African educators plan their expansion of eLearning, they need to ensure the classroom technology is largely self-sufficient and simple to set up, manage and use in the classroom. The centralised management and robust plug-and-play functionality of classroom labs that use virtualisation technology answers this requirement, ensuring that investments in school classroom labs deliver the maximum educational benefit over a long period of time.

In investing in digital classrooms African educators are demonstrating incredible foresight in what new generations of Africans need to improve their lives. They need to guard against making ICT decisions that trap them in the past. While budgets are always going to be tight, African educators must be ambitious about ICT in education and take advantage of the latest 21st century thinking on virtualised and cloud computing.

Another important dimension of sustainability is the degree to which the ICT is future-proofed in how it can keep pace with future developments in applications and data. Educators are already using solutions like this to transform ICT in their schools and colleges. In South Africa more than 1.5 million students already have ICT access thanks to classroom labs that utilise Wyse cloud computing technology.

Sustainability in African eLearning is vitally important in making ICT widely accessible to students across the Continent. Indeed, African countries look set to trail-blaze other economies in their innovative use of cloud client computing on a massive scale.

David Angwin is Vice President, Field Marketing for Wyse Technology,
and based in the United Kingdom

Wyse Cloud Client Computing Highlights Sustainable E-Learning for Students at eLearning Africa 2012 [Wyse press release, May 23, 2012]

Showcases Latest Digital Classroom Solutions to Widen Availability of School Labs and One-to-One Computing for High Quality IT Enhanced Teaching and Learning in African Schools and Colleges

SAN JOSE, CA and COTONOU, Benin – 05/23/2012 – Wyse, the global leader in cloud client computing, today announced its participation in the eLearning Africaconference and exhibition. As the event’s platinum sponsor for the second year running, Wyse will discuss how advanced cloud client computing can help African educators meet their goals for widening access to technology-enhanced education, development and training. eLearning Africa runs from 23rd – 25th May 2012 in Cotonou, Benin, under the patronage of the Government of Benin.

Working across the continent with its local technology partners, Wyse has developed and deployed a range of solutions that are ideally suited to widening access to IT-enhanced education and training in Africa. The technologies involved are tailored to the continent’s requirements for classroom ICT that is exceptionally reliable, affordable and energy efficient while not compromising on access to the latest applications and data for teaching and learning.

Delegates to eLearning Africa will have the opportunity to see the latest in digital classroom solutions co-developed by Wyse and Microsoft. This includes an entry level shared computing solution for school IT labs that combines Wyse E01 and Wyse E02 zero clients with Microsoft Windows MultiPoint Server 2011; and the Wyse WSM cloud software solution, which offers a centrally-managed, scalable one-to-one computing environment for students that scales across classrooms, labs and schools. Both solutions address the requirement for classroom IT that is secure and easy to set up and run, while delivering a great desktop experience for the students.

Mark Jordan, vice president and general manager, EMEA Sales, Wyse Technology will be delivering a keynote in the opening plenary session on 23rd May 2012. He will address how cloud solutions can play a pivotal role in helping IT enhanced education transform the prospects of African students. Tarkan will be speaking alongside S.E. Max Ahouêkê, Ministère de la Communication et des Technologies de l’Information et de la Communication (MCTIC), Benin; and Prof Sugata Mitra, Professor of Educational Technology, Newcastle University, UK and Visiting Professor, MIT Media Lab, Cambridge, USA.

The event will be ideal opportunity to be updated on how African customers are advancing their e-learning strategies with Wyse cloud client computing solutions. For example in South Africa more than 1.5 million students already have ICT access thanks to classroom labs that utilize Wyse cloud computing technology. In Nigeria, a new network of examination centers relies on a Wyse cloud client computing infrastructure to enable examinations to be delivered, taken and scored entirely electronically, saving time and money while also improving reliability and service with accurate results delivered in hours rather than months.

Education is Wyse’s second largest market, with ten of the world’s top fifteen universities using Wyse solutions to reduce costs and improve learning. They and other educational institutions benefit from Wyse’s position as the only cloud vendor to offer desktop virtualization solutions for every budget and scale of implementation, ranging from ten to upwards of ten thousand units.


A glimpse into the Wyse portfolio
and their large public / enterprise markets

image

Health care with Citrix and Wyse Xenith next-generation zero-client devices at Seattle Children’s Hospital [WyseTechnology YouTube Channel, May 23, 2011]

Seattle Children’s deployed a desktop virtualization solution leveraging Citrix XenDesktop® and Citrix XenApp™ in concert with approximately 3,000 Wyse Xenith next-generation zero-client devices. This implementation has accelerated systems logins from several minutes to less than 15 seconds, saving staff time and improving patient interactions; virtually eliminated desktop technical issues, enhancing patient service and saving, over the next five years, an estimated $1.2 million of IT staff time, $6 million in PC replacement costs, and $1 million in energy cost. Press release: http://www.wyse.com/about/press/release/565. Learn more at: http://www.wyse.com/solutions/industries/healthcare.

Microsoft HIMSS 2011 – Interview with Andre Beuchat of Wyse Technology [WyseTechnology YouTube Channel, May 10, 2011]

Microsoft’s Cindy Hibble, Industry Partner Account Manager, talks with Andre Beuchat, Alliance Manager, about Wyse’s cloud client computing solutions for the healthcare industry.

Japan’s Largest Bank Turns to Wyse for VDI and Mobility [Wyse blog, April 10, 2012]

Today, Wyse announced that Bank of Tokyo-Mitsubishi is deploying 50,000 Wyse devices. The combination of Wyse’s desktop and mobile hardware, virtualization software and overall Wyse domain expertise in cloud and virtualization is the reason why the Bank of Tokyo-Mitsubishi selected Wyse for its VDI implementation. Bank of Tokyo executive Mizuhiko Tokunaga commented that “… the deciding points were the technological edge of their unique software, Wyse ThinOS, their specialization in VDI, and the sense of trust we felt toward Wyse as a company. Wyse has been a global market leader for a long time, and it shows.”

The Bank of Tokyo-Mitsubishi, the largest bank in Japan and eighth largest in the world, began what was considered the largest systems integration project in the world in 2008 when it started this ambitious project to strengthen security across all 773 branches in Japan and 73 abroad. For more information on this initiative and how Bank of Tokyo is using Wyse, visit: http://www.wyse.com/about/press/release/1917

Diagram - Cloud Computing / Virtual Computing Structure

Cloud Computing involves using information technology as a service over the network.

  • Services with an API accessible over the Internet
  • Using compute and storage resources as a service
  • Built on the notion of efficiency above all
  • Using your own datacenter servers, or renting someone else?s in granular increments, or a combination

We at Wyse believe cloud computing has the potential to change how we invent, develop, deploy, scale, update, maintain, and pay for applications and the infrastructure on which they run.


Essential technology and market information

XenDesktop and Metro Receiver [CitrixTV YouTube channel, May 9, 2012]

Citrix Synergy demo: XenDesktop and Metro Receiver. Brad Peterson, Chief Demo Officer, Citrix

SYN229: What’s new with Citrix Receiver for desktop users [CitrixTV YouTube channel, May 10, 2012] — absolutely important to watch in order to understand how the virtual desktop future would be assured by the upcoming Citrix Receiver universal client experience across different end-user access points (PC, Mac, tablets, smartphones, thin clients and web browsers) for Windows, web and SaaS applications (at least go forward to the  [18:53 – 23:05] timeframe in the video) !!!

The Citrix Receiver universal client [18:53 – 23:05] provides a simple, intuitive, high-definition experience when accessing virtual desktops and Windows, web and SaaS applications anywhere, on any device. While keeping Citrix Receiver on track with the mobile device explosion, Citrix continues to enrich the laptop and desktop user experience with new capabilities including self-service, ease of deployment and HDX enhancements.

Wyse, Marvell, and the Citrix System-on-Chip Initiative [Wyse blog, May 10, 2012]

Yesterday Marvell announced participation in the Citrix System-on-Chip (SoC) initiative with the Marvell® ARMADA® 510 SoC for seamless integration with Citrix HDX in a complete silicon solution. The SoC combines a high-performance, low-power SoC with a hardware graphics processing unit and video decoding acceleration hardware. The end result is excellent processing power for high-end apps like HD multimedia in a very efficient, cost-effective footprint.

Wyse already uses the Marvell ARM SoC in our industry-leading T class thin clients. Combining Marvell’s high performance SoC with software optimized for Citrix HDX enables Wyse to offer compact, efficient, and powerful thin clients like the Linux-based T50 thin client and the super-secure T10 thin client based on Wyse ThinOS. In addition, our newly announced Xenith 2 zero client for Citrix XenDesktop and HDX is also based on the ARM SoC, and sets a new price/performance standard for Citrix zero clients in its class.

Zenith2 – The Product that Changes Evertyhing [CitrixTV YouTube channel, May 24, 2012]

Jeff McNaught, Chief Strategy and Marketing Officer from Wyse shares the benefits of Zenith2 which is the first zero client built for Citrix that is managed by Citrix XenDesktop. The only completely secure [“virus immune”] device, high performance for all types of workers and optimized for multimedia.

Wyse Zero [Engine] and Wyse ThinOS [Wyse webpage, Feb 24, 2012]

Built for VDI Optimized for Citrix XenApp, Citrix XenDesktop, Microsoft Terminal Server and VMware View virtual desktop environments
Lightning fast Super-fast start-up provides access to virtual desktops in under 20 seconds
Super Secure No attack surface provides immunity to viruses and malware
Easy-to-manage Hands-off, scalable device management with Wyse Device Manager; easy FTP-based configuration and automatic updates
Smart card support Seamless smart-card roaming ideal for workstation-based environments
Rich user experience Integrated Wyse TCX Suite for enhanced audio, video and multimedia

Overview

Wyse ThinOS

Wyse ThinOS is the most optimized, management-free solution for Citrix XenApp, Citrix XenDesktop, Microsoft Terminal Server and VMware Viewvirtual desktop environments. With an unpublished API and no attack surface, Wyse ThinOS is immune to malware and viruses that make other operating systems vulnerable to attack. This super-fast, purpose-built thin computing OS boots up in seconds, updates itself automatically and delivers simple, scalable administration to eliminate time-consuming maintenance tasks related to configuration, management and updates. With full support for Wyse Virtual Desktop Accelerator (VDA), ThinOS neutralizes the effects of network latency and packet loss, even in remote-branch and field-based applications.

Related link

  • What’s new in Wyse ThinOS with David Angwin, Wyse Technology Watch video »

Wyse Zero [Engine]

Already used in millions of thin clients, zero clients, and handheld smart devices, Wyse Zero [Engine] simplifies the development of cloud-connected smart devices, enabling seamless user access to cloud computing services and virtual desktops. Wyse Zero [Engine] addresses limitations with current embedded options, such as the typical security vulnerabilities of Windows and Linux-based operating systems, and slow initialization due to their large size. With a rich array of networking, management and protocol technology packaged in an engine less than 4MB in size, Wyse Zero reduces costs and simplifies management and updates. With no underlying OS to slow it down, it starts up instantly for a more satisfying user experience. And unlike Windows or Linux-based embedded products that require extensive protection, Wyse Zero [Engine] is original technology and therefore virtually immune to malware, viruses and hackers.

Wyse Stratus Overview [WyseTechnology YouTube channel, Feb 24, 2012]

Wyse Stratus is client infrastructure management from the cloud. Manage any device from anywhere. Learn more at http://www.wyse.com/Stratus

Wyse Announces Private Beta of Cloud-Based Service to Secure and Simplify Corporate Access for Users Across All Devices [Wyse press release, May 8, 2012]

Project Stratus Directly Tackles Consumerization of IT Challenges with Intelligent, Integrated and Cross-Platform User and Device Management

05/08/2012 – Wyse Technology, the global leader in cloud client computing, today announced the Project Stratus private beta program.  Project Stratus provides IT administrators with an intelligent and dynamic cloud-based console to securely manage and enable corporate access to any device, regardless if that device is owned by the company or by the individual.  Initial support will focus on securing and provisioning corporate access to smartphones, tablets, thin clients, and zero clients with plans to quickly expand support to additional devices used in the workplace.

Project Stratus delivers a unified console that goes beyond standard device management solutions by providing a complete view of the IT infrastructure serving end-users.  The console provides visibility not only into users and their devices, but also into their relationship with the IT ecosystem.  The result for IT is valuable insight into usage models, trends, and the means to identify areas of investment to more securely and effectively provide corporate services to end users.

“The biggest challenges to IT in a BYOD world has to do with the securing of corporate access to all devices being used by employees.  With Project Stratus, our goal is to eliminate the need to have a separate, silo’ed console for each device type and instead allow IT admins to set an access policy for a user that will apply regardless of what device they are using—providing for the first time a one-stop shop for device and access management,” said Hector Angulo, Product Manager at Wyse.

“For a company such as ours that relies on a distributed and mobile workforce, the means to simplify and secure our mobile devices is very appealing,” according to Adam Bari, Managing Director at IPM.  “We are very much looking forward to deploying Project Stratus to better manage our mobile computing infrastructure.”

Wyse will be showcasing Project Stratus at Citrix Synergy™ 2012 in San Francisco, May 9th – 11th in Wyse Booth #206 at the Moscone Center.   Companies interested in taking part of the private beta can sign-up by going to http://www.wyse.com/stratus

Key features of Project Stratus include:

Simplicity.  Streamlined, discoverable interface with user-centric policy management to help automate user access regardless of what device they are using, including easy exception handling– natural and intuitive management for today’s dynamic IT world
TCO Reduction.  Cloud-hosted service eliminates costly on-premise servers and enables instant deployment and scaling — drastically reduces the total cost of operations and ownership
Real-time Analytics.   Dynamic and instantly personalized data feeds always present admins with the most relevant insight to help expedite the task at hand – powerful analytic engine exposes most important activities, events, and trends
Actionable.   Pro-active alerts notify admins about compliance violations and other potential issues with option to take contextual actions in-place (i.e. warn user, block, ignore) or automate future mitigation (i.e. automatically approve roaming exception request for all members of ‘executive’ group)
Time-Saving.  User and device pages that provide instant visibility into any managed asset, including who is using the device, what it is interacting with, and any potential performance or security issues in order to expedite issue identification and resolution
Unified Console.  Visibility and management of all devices used in the enterprise, with support for smartphones, tablets, thin clients, and zero clients — one-stop shop for all devices, no more hassle of dealing with many consoles
Security.  Enterprise-ready, multi-tenant architecture with fully encrypted communication ensures only you have access to your data

HDX Ready Software-on-Chip with TI and NComputing [CitrixTV YouTube channel, Nov 8, 2011]

“See more videos on CitrixTV www.citrix.com/tv/“; The new “Citrix HDX™ Ready System-on-Chip (SoC)initiative is designed to enable an entirely new generation of devices to deliver high-definition virtual apps and desktops at an unprecedented low cost using the company’s market-leading HDX technology. By incorporating Citrix HDX technology directly into silicon, the new program will expand the market for virtual apps and desktops beyond traditional computing devices like PCs, tablets and smartphones.

HDX Ready Thin Clients [Citrix microsite, May 9, 2012]

The HDX Ready designation is reserved for thin client devices that have been verified to work with all of the XenDesktop and XenApp HDX features. HDX refers to High Definition User eXperience – a term coined by Citrix to describe capabilities in XenDesktop that optimize the user experience when accessing hosted virtual desktops and applications. The HDX Ready category assists IT managers to easily identify thin client devices that deliver the best possible high definition user experience with XenDesktop and XenApp.

There is a trade-off between a thin client’s cost and its capabilities. Not all users require the functionality of all of HDX features of XenDesktop or XenApp. Devices that are not deemed HDX Ready may still be useful for certain user types and use cases, generally at a lower price point than HDX Ready devices. The Citrix Ready thin client designation exists for those devices that support connectivity to XenDesktop or XenApp but only a subset of HDX functionality. Information regarding HDX feature coverage by a particular thin client device is available on the Citrix Ready website

HDX Ready Device Features
Feature Citrix Ready Thin Clients HDX Ready Thin Clients
HDX Broadcast clip_image001 clip_image001[1]
Out of the Box XenDesktop Integration clip_image001[2] clip_image001[3]
HDX Plug-n-Play:USB 2.0 clip_image001[4]
HDX Plug-n-Play:Printing clip_image001[5]
HDX Plug-n-Play:True Multi Monitor Support clip_image001[6]
HDX Plug-n-Play:Smartcard Support clip_image001[7]
HDX Plug-n-Play:Webcam Support clip_image001[8]
HDX RealTime:VOIP on LAN clip_image001[9]
HDX RealTime:Client Audio Recording clip_image001[10]
HDX MediaStream:CD Quality Audio on LAN (Server Rendered) clip_image001[11]
HDX MediaStream:Adaptive Display (Server Rendered): Minimum 15 Frames Per Second on LAN clip_image001[12]
HDX MediaStream: 1280*720 Quality Windows Media Redirection (Client Rendered) on LAN clip_image001[13]
HDX MediaStream: 1280*720 Quality Flash Redirection (Client Rendered; for Windows x86, Ubuntu x86, and Fedora x86) on LAN clip_image001[14]

Citrix HDX SoC spurs innovation and cuts the cost of thin clients in half [The Citrix Blog, May 9, 2012]

Today Citrix celebrates with our partners the unveiling of exciting new client computing devices that leverage the HDX SoC initiative.

Thousands of Citrix customers are already using thin client devices to access virtual desktops and apps delivered by Citrix infrastructure. These customers who have successfully deployed thin clients are getting the benefits of reducing or even eliminating their device management footprint, decreased their dependency on lifecycle management, and have reduced their power consumption by efficiently leveraging computing resources in the datacenter or server room.

There are also many customers who look at the cost of desktop virtualization and can easily justify supporting mobile workers and BYO programs. However, when it comes to replacing desktops in their offices, they may find it harder to justify purchasing a thin client when the price of the endpoint also, after all the dust settles, might be close to the replacement cost of a PC.

Delivering cost reduction

Last October, at Synergy Barcelona 2011, Citrix announced the HDX System on Chip initiative in partnership with Texas Instruments and NComputing,  to create new SoC reference designs based on ARM chipsets to accelerate HDX user experience technologies in silicon. By using optimized hardware-based  acceleration rather than decoding and rendering virtual desktop traffic on a general purpose processors in software, these SoCs can deliver the user experience of thin client devices costing twice as much or more while reducing power consumption, heat, and footprint. However, don’t mistake hardware-acceleration for “all-hardware.” Devices built on the HDX SoC initiative still run a Citrix Receiver in an embedded OS that permits updates to provide devices new functionality over time, further extending the expected lifecycle.

Taking cues from the living room

This direction of optimized delivery of high definition experience is no different than what many of us are seeing play out in our living rooms. Instead of collecting massive collections of videos to store in cabinets or home servers, cloud providers like NetFlix, Amazon, Apple, Hulu, Pandora, and others store media for us, allowing us us to stream in many cases real time content to our homes. This media can be displayed from TV’s using integrated “internet streaming,” from most any smartphone, tablet, or computer, or through the addition of a $50 appliance from companies like Roku that we plug into our TVs. It is this revolution in cloud entertainment services and the drive for low-cost, low-powered – long battery life devices overtaking the consumer electronics industry that Citrix can now leverage to optimize end point devices for desktop virtualization.

To learn more about these exciting, market-changing, transformative new devices being unveiled by HP, Atrust, Centerm, NComputing, and ThinLinX, please check out the HDX SoC 2012 partner page here.

Dell Wyse: acqusition of Wyse Technologies by Dell
(a summary of the many original materials compiled in the closing part of this post)

  • Wyse – a leader in Desktop Virtualization
  • Wyse – ranking number one worldwide in thin clientunit share in the fourth quarter of 2011
    • Differentiated IP and device management, thin client operating systems, and mobility software that is customized to offer the best user experience with Microsoft, Citrix and VMware virtual desktop infrastructures.
    • Much of their software value is captured in the hardware itself. Their ThinOS and the IP around the ThinOS has allowed them to drive greater performance using less memory. So Wyse solutions require less memory and processing power than other comparable thin client solutions, making them more cost competitive and effective for customers.
    • Wyse as an independent entity has really been gaining momentum to grow into a number one market share position. In fact, they are growth accelerated in their last fiscal year to 45 percent
    • Dell’s view on that:
      – The momentum around alternative computing is a trend that they see many customers continuing to experiment with and in many cases, beginning to deploy, although t
      he adoption rates are still relatively low for desktop virtualization.
      – They  don’t see the entire world going to thin clients. They still think there’s a healthy PC demand in the industry and there’s a balance of alternative computing that allows people to take advantage of securing their information, managing the assets in a very differentiated way. Even a common thin client deployment today is on a standard PC that’s been virtualized.
      – This is an opportunity particularly in the verticals around financial services, government healthcare, and the financial services sector to really take a leadership position. This is really specific use cases. For example, in regulated industries like healthcare and financial services, the value of centralizing your data to better have access and control is a specific use case that this thin client desktop virtualization lends itself to.
      – They needed it because it is also a different workload to move forward their cloud computing strategy.
      – A
      gain, they don’t think a zero client or a thin client is an answer for all customers. They think in their mind that the bigger message here is they now have a range of devices, an incredibly strong portfolio of thin client devices and zero client devices from Wyse, the standard Dell set of PCs, which do virtualization, and now the ability to manage those in a very differentiated way with the key software assets that they’re bringing on board that expand themselves to tablets, expands itself to mobile phones.
  • Wyse portfolio includes a wide selection of industry leading thin and zero client devices designed easily to integrate into a virtualized or web based infrastructure
    • It compliments and extends the desktop virtualization capabilities that Dell has today.
    • Also a big part of this transaction is the synergy that Dell would get from their datacenter solutions business, including servers, storage, networking services, and software. For every thin client hardware dollar that exists in the IT industry, there’s $5 of enterprise servers, storage, networking services that go along with that.
    • This could also remove the barrier for some companies that did not have the right level of datacenter portfolio and datacenter ecosystem to exploit the thin client alternative of enterprise computing: i.e. deploying desktop virtualization centric cloud client portfolios and platforms.
    • Wyse is a company that has 31 years of experience. They have the intellectual property, they have the software and 150 R&D engineers which 140 are in software. Wyse and one other competitor basically had almost 50 percent of the market. Wyse are pretty close partners with Microsoft, and they do a lot of work with VMware, with Citrix as well. As these providers provide desktop virtualization methodology and technology between the datacenter and end use computing platforms Wyse add to that value and they partner heavily with them and obviously that’s going to continue.
      • [Wyse:] And also, one other piece to add, we provide some of the software we provide is differentiated in the marketplace, is the leader in this space also from the cloud, both on the infrastructure management side from the cloud, with a product called Wyse Stratus. So, many of you on the phone are using today, Wyse PocketCloud, the market leading product for content management from the cloud on any mobile device and also from your web browser, connecting your apps and content inside the content voice data video from your choice of your cloud, private or public.

    • The software stack that brings together the edge device, the management software that manages that, that sits into the cloud or sits into the datacenter, and the ability to build that software from essentially ground zero to being able to acquire those capabilities and that experience and the technology with it, puts Dell in a leadership position. The differentiated technology that they are getting with the integration of Brad Anderson’s [Dell president, Enterprise Solutions] and Steve Schuckenbrock’s [Dell president of Services] businesses, allow them a unique position to do this for their customers. All this allows them to move quite quickly in the marketplace, much quicker than they could have done it on their own.
  • IDC: worldwide thin client demand will grow 15 percent per year to approximately 3 billion by 2015
  • IDC: the overall end to end solutions market with thin clients is expected to exceed 15 billion by 2015

Wyse Cloud Client Computing [WyseTechnology YouTube channel, April 1, 2012]

See what Cloud Client Computing from Wyse can do for you.

Citrix Announces New Innovations in Desktop Virtualization Lowering Cost and Accelerating the Transformation to Virtual Desktops [Citrix press release, May 9, 2012]

New XenDesktop, VDI-in-a-Box & AppDNA capabilities drive adoption

San Francisco, CA » 5/9/2012 » Today, at Citrix Synergy™, the conference where mobile workstyles and cloud services meet, Citrix announced a set of new innovations that help organizations transform their Windows desktops and apps into a cloud-like service that can be managed centrally and delivered to any device in any location. New releases of Citrix desktop virtualization products and new game-changing Citrix HDX Ready SoC-based endpoint devices from key partners are helping to ease the transition to virtual desktops, drive down the acquisition costs and provide expanded capabilities targeting broad use cases from the call center, to high-end engineering and mobile workers in enterprises, the public sector and SMBs, enabling organizations of all sizes to deliver anywhere, anytime access to desktops, applications and data to users.

With the tremendous explosion of new devices, operating systems and applications, organizations are struggling to keep up with the challenge of managing desktops and applications in this new highly mobile world. At the same time, trends such as consumerization and bring your own device (BYOD) programs are putting added strain on IT resources. Citrix is raising the bar once again delivering new innovations across its desktop virtualization products and working with partners to drive down the costs of virtual desktops.

Easier On-ramp to Desktop Virtualization

  • New Remote PC Option in XenDesktop FlexCast– The new RemotePC option is part of the FlexCast® delivery technology in the Citrix XenDesktop® product line. Using the new RemotePC capability, XenDesktop customers will be able to quickly turn existing office PCs into distributed VDI hubs without setting up additional servers and storage in the datacenter. This innovative new solution makes it easy for IT to give end users fast, secure remote access to all the apps and data on their office PC from any device. Once IT is ready to move to a more full-service VDI implementation, these distributed RemotePC images can be easily moved into the datacenter to run in a traditional hosted VDI model for better consolidation, security and management efficiency. Remote PC functionality will be included in XenDesktop 5.6 Feature Pack 1, which will ship in June, 2012.
  • New AppDNA Software Release – To ease the transition to Windows 7 and a virtual desktop infrastructure, the new release of Citrix AppDNA software brings a simplified overall installation, setup and user environment to accommodate a broader range of enterprises, the channel and global SIs. Citrix AppDNA also provides even more in-depth application details so enterprises can accurately assess, rationalize and act on applications before a project begins. The AppDNA 6.1 software will be available in Q2, 2012. (see announcement blog for more detail)

Reducing the Acquisition Costs of Virtual Desktops

  • First Wave of Game-changing Endpoints Arrives – The first results of the Citrix HDX System-on-Chip initiative that was announced at Citrix Synergy Barcelona are being delivered to the market. The initiative was designed to enable an entirely new generation of devices that deliver high-definition virtual desktops and apps at game-changing price points and form factors. These devices reduce the cost of high-performance HDX Ready thin clients by more than half, further driving down the cost of desktop virtualization. New devices from ATrust, Centerm, HP, NComputingand ThinLinx are being announced today at Citrix Synergy San Francisco and are built for Citrix XenDesktop, and Citrix VDI-in-a-Box. (See announcement blog for more detail)
  • Personalized VDI for Less than the Cost of PCs – The Project Aruba technology preview delivers a cost-efficient yet complete VDI solution by extending the simple affordable Citrix VDI-in-a-Box™ with layering technology using personal vDisks to deliver highly personalized virtual desktops that retain the cost-efficiencies of pooled desktops.  Project Aruba also provides a validated blueprint for service providers looking to deliver cost-effective VDI-based Desktops-as-a-Service.

Citrix has also made available a license migration path from VDI-in-a-Box to XenDesktop for customers that want to extend beyond VDI to leverage the full flexibility of XenDesktop while preserving their investment. The end-user experience is consistent across both products as both VDI-in-a-Box and XenDesktop use the same HDX stack and Citrix Receiver. (See announcement blog for more detail)

Delivering Expanded Functionality for Broad Use Cases

Citrix is delivering new innovations that create a very seamless experience for end-users, delivering a more complete solution than other alternatives on the market.

  • Empowering Point-to-Point Unified Communications for Cisco and Microsoft– With the introduction of HDX Real Time technologies for voice and video collaboration, industry-leading unified communications (UC) solutions including Cisco VXI Unified Communications and Microsoft Lync 2010 can process voice and video locally and create a peer-to-peer connection for the ultimate user experience while taking the load off datacenter processing and bandwidth resources. XenDesktop delivers new levels of efficiency and quality of service for the most demanding use cases. HDX Real Time will be available with XenDesktop 5.6 Feature Pack 1 in June, 2012. – Support for HDX Real-Time with select Cisco VXI clients was recently announced in April, 2012 representing the first optimized UC solution for desktop virtualization on the market. This solution represents one of the first deliverables from the recent collaboration agreement between Cisco and Citrix to optimize HDX for Cisco networks.- The new Optimization Pack for Microsoft Lync 2010 will be included in XenDesktop 5.6 Feature Pack 1. This pack supports Microsoft Lync 2010 for point to point voice and video communications to Windows and Linux devices and will extend across all Citrix Receiver™-enabled devices over the coming months.- Beyond traditional unified communications support, XenDesktop also optimizes voice and video collaboration for cloud-based solutions including Citrix GoToMeeting® by compressing voice and video traffic on the client before transmission over the network.
  • Cutting Network Bandwidth for Demanding 3D Engineering Environments – Whether collaborating with design engineers across oceans using advanced CAD/CAM or GIS apps or consulting medical imaging at a patient’s bedside with an iPad, the secure, high performance delivery of GPU accelerated 3D applications and desktops with XenDesktop has never been more powerful or efficient. Using new deep compression codec technology that reduces bandwidth requirements by 50 percent, XenDesktop with HDX 3D Pro technologies secures sensitive intellectual property and privacy-sensitive data while improving collaboration and performance eliminating the need to synchronize and transfer massive data files. Meanwhile, users leverage state-of-the-art graphics processing hardware in the datacenter to access designs and images from any device, anywhere. HDX 3D Pro will be available with XenDesktop 5.6 Feature Pack 1 in June, 2012. (See the announcement blog for more detail)
  • New XenClient Enterprise and Acquisition of Virtual Computer – Citrix announced the acquisition of Virtual Computer, provider of enterprise-scale management solutions for client-side virtualization. Citrix will combine the newly-acquired Virtual Computer technology with its market-leading XenClient® hypervisor to create the new Citrix XenClient Enterprise edition. The new XenClient Enterprise, available in Q2, 2012, will combine all the power of the XenClient hypervisor with a rich set of management functionality designed to help enterprise customers manage large fleets of corporate laptops across a distributed enterprise. The combined solution will give corporate laptop users the power of virtual desktops “to go”, while making it far more secure and cost-effective for IT to manage thousands of corporate laptops across today’s increasingly mobile enterprise.
  • Simplifying Printing with New HDX Universal Print Server – Now, Citrix desktop virtualization products tame the complexity of printing by completing a universal printing architecture with the Citrix HDX Universal Print Server. Combined with the previously available Universal Print Driver, administrators may now install a single driver in the virtual desktop image or application server to permit local or network printing from any device, including thin clients and tablets, leveraging HDX optimization technology to reduce bandwidth load over wide area networks and manage printing communications outside of the virtual desktop channel for enhanced quality of service. HDX Universal Print server will be available with XenDesktop 5.6 Feature Pack 1 in June, 2012. (See the announcement blog for more details)

Quote
“Citrix is helping to drive down the costs of virtual desktops, and advancing technology around user experience and manageability to move desktop virtualization adoption forward at a rapid pace. Though product innovation and strong partner ecosystems we are addressing barriers on all fronts including acquisition costs, migration complexity and delivering complete solutions for all customer segments from large enterprises to SMBs.”
– John Fanelli, Vice President of Product Marketing, Enterprise Desktops and Applications at Citrix
Related Links

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NOW to understand the whole picture from/through a very practical demonstration of the whole range of possibilities watch these videos:

The Future is Now (17 minutes – part 1 of 2) [citrixvideos YouTube channel, April 11, 2011]

The Future is Now Video with Brad Peterson – On December 17, 2010 we WOWed thousands of customers with our execution of the Virtual Desktops: From Wow to How program. We received hundreds of requests from customers, partners and our sales team to make the video available. We listened and now we are delivering the condensed 17 minute video of “The Future is Now”. This new version is more apt for sales meetings so that you can show the video and quickly turn to productive discussion.

The Future is Now (28 minutes – part 2 of 2) [citrixvideos YouTube channel, April 11, 2011]

Citrix Receiver on the Wyse Xenith, connecting to a XenDesktop virtual desktop [citrixvideos YouTube channel, April 10, 2011]

The Future is Now video with Brad Peterson highlights the Wyse Xenith (Zero client) using an enbedded Citrix Receiver to connect to a remote virtual desktop on Citrix XenDesktop.

Wyse Product/Technology Details

Wyse Changes Everything with Announcement of Xenith 2 Zero Client for Citrix VDI-Based Deployments [[Dell] Wyse press release, May 9, 2012]

Leading Zero Client Improves Performance for VDI Installations Using Citrix Desktop Virtualization Solutions

SAN JOSE, CA – 05/09/2012 –

Wyse Technology, the global leader in cloud client computing, today announced the Wyse Xenith 2, based on the ultra-secure Wyse zero framework.  This breakthrough zero client was revealed today at Citrix Synergy™ 2012, the premier event on cloud computing, virtualization and networking.  Wyse, the leading shipper of fixed and mobile desktop zero clients in the world, will be demonstrating the Xenith 2 at Wyse Booth #206 from May 9-10, 2012.

Following on the success of the Wyse Xenith and Wyse Xenith Pro, the Wyse Xenith 2 is the ideal Citrix zero client solution for both enterprise and SMB organizations. The Wyse Xenith 2 zero client is purpose-built for Citrix XenDesktop® blending the amazing cost benefits of the ARM System-on-Chip (SoC) architecture, with a non-Windows Citrix Receiver compatible client, developed in cooperation with Citrix.  Improving on the success of the Xenith, with 30% faster performance and lower power consumption, the result is a super secure, very affordable, true high-fidelity desktop experienceFor users requiring a diverse variety of applications, including HD multimedia, the Wyse Xenith 2 delivers a new standard in price and performance in a compact zero client and delivers an unprecedented combination of simplicity, performance and security for office-based workers.

The Wyse Xenith 2 requires no local configuration or management and can offer customers of all sizes a more secure client while helping reduce management and overall client cost.  Full AES 128 bit encryption enables encryption of network certificates on the client, which is a truly ironclad level of security.  Leveraging the Wyse zero framework, the Wyse Xenith 2 is able to provide a secure, ‘instant on’ experience for end users—booting up and logging into a Citrix XenDesktop® in less than 10 seconds.  With no exposed API’s and no attack surface, the Wyse Xenith 2 zero client is malware and virus immune, removing client security concerns.

“Wyse Xenith has been a game-changer for us,” according to Wes Wright, Chief Technology Officer at Seattle Children’s Hospital.  “Not only are we saving $6 million in hardware replacement costs, more than $1 million in staff time, and $300,000 per year in energy savings, we also have devices that are faster, more secure and more reliable than anything we had before.  With Xenith 2, Wyse is simply adding more appeal to an endpoint device family that makes Citrix XenDesktop a great end-to-end VDI solution.”

Like the Wyse Xenith and Wyse Xenith Pro, the Wyse Xenith 2 changes everything, including the economics of desktop computing.  Wyse Xenith 2 eliminates the complications of management and security issues associated with traditional client devices, while ensuring an unparalleled high-definition user experience, further lowering the barriers for mainstream adoption of desktop virtualization.

“As customers look to the flexibility of desktop virtualization, Citrix is enabling these enterprises to transform their traditional Windows computing environments into a cloud-like service, delivering anywhere, anytime access to desktops, applications and data. Through collaborative relationships like the one with Wyse, we are further driving down the costs of virtual desktop deployments and accelerating adoption. The Xenith 2 achieves this goal by providing a secure, affordable solution that is optimized to deliver a high-definition virtual desktop experience through Citrix Receiver,” said Sumit Dhawan, group vice president and general manager, Receiver and Gateways at Citrix Systems.

“By tightly-integrating with Citrix, we’re delivering a zero client that is second to none in performance, security, manageability, and ease of use for this class of VDI endpoint,” according to Param Desai, VP, Product Management at Wyse Technology.  “All of this plus it is more affordable than ever before.”

“Vendors like Wyse continue to push the envelope in zero client technology,” according to Bob O’Donnell, Program VP, Clients and Displays at IDC.  “The ability to improve device performance while adding additional functionality and reducing cost bodes well for future zero client customers.”

Top Product Benefits
• Secure.  Stateless zero client has zero attack surface for viruses & malware; no local disk and no APIs.  Xenith 2 also offers single sign-on and is integrated with Imprivata support.  Full AES 128 bit encryption enables encryption of network certificates on the device.
• Powerful. The Wyse Xenith 2 includes a Citrix Receiver client and achieves unparalleled user experience, great graphics performance and high fidelity multimedia due to Wyse’s innovative performance optimizations for ARM SoC and available only on Xenith 2 and T10.  Xenith 2 starts up in 6 seconds.
• Affordable.  Sets a new level of price / performance.
• Easy to manage. Integrated out of the box with XenDesktop management console in addition to also being managed by Wyse Stratus as part of a comprehensive device management from the cloud.  Xenith 2 also comes with auto detection of server and configuration and is a completely stateless device, always using the latest zero engine delivered directly from a central configuration file server and the XenDesktop server.
• Compact.  Requires very little space or none — includes VESA mount for back of display mounting. Xenith 2 is 30 percent smaller than original Xenith and utilizes only 7 watts in full operation.
• Zero-compromise user experience.  Network-based QoS ensures quality (HDX multi-stream).  Devices offers true 720P 25+ fps HD for wmv and H.264 with HW decoding engines.  Dual display with rotation and l-shaped [which is unique and essential for financial services environments with an additional screen for spreadsheet viewing in vertical] display capabilities.  New WAN support with local echo and bandwidth reporting allowing remote and at home users greater flexibility and performance..

Pricing and Availability
The Wyse Xenith 2 will be available soon with an estimated customer price TBD.  For more information, please visit:

http://www.wyse.com/products/cloud-clients/zero-clients/Xenith2

Wyse Xenith 2 (Front left angle)

Overview

Establishing a new price/performance standard for zero clients for Citrix, the new Wyse Xenith 2 provides an exceptional user experience at a highly affordable price for Citrix XenDesktop and XenApp environments. With zero attack surface, the ultra-secureXenith 2 offers network-borne viruses and malware zero target for attacks. Xenith 2 boots up in just seconds and delivers exceptional performance for Citrix XenDesktop and XenApp users while offering usability and management features found in premium Wyse cloud client devices. Xenith 2 delivers outstanding performance based on its system-on-chip (SoC) design optimized with its Wyse Zero architecture, and a built-in media processor delivers smooth multimedia, bi-directional audio and Flash playback. Flexible mounting options let you position Xenith 2 vertically or horizontally on your desk, on the wall or behind your display. Using about 7 watts of power in full operation, the Xenith 2 creates very little heat for a greener, more comfortable working environment.

Citrix Ready logoCitrix HDX Ready logo

Wyse Xenith 2,

Specifications

Operating System: Wyse Zero™ Engine
Processor: Marvell® ARMADA™ PXA 510 v7 1.0 GHz system-on-chip (SoC)
Memory: 0MB Flash / 1GB RAM DDR3
I/O peripheral support: • One DVI-I port, DVI to VGA (DB-15) adapter included
• Dual display support with optional DVI-I to DVI-D plus VGA-monitor splitter cable (sold separately)
• Four USB 2.0
Networking: • 10/100/1000 Base-T Gigabit Ethernet
• Optional internal wireless 802.11 b/g
Display: • VESA monitor support with Display Data Control (DDC) for automatic setting of resolution and refresh rate
Dual monitor supported with ‘L shaped’ display rotation
• Single: 1920×1200@60Hz; color depth: 32 bpp
• Dual: Up To 1920×1080@60Hz; color depth: 32 bpp
Audio: • Output: 1/8-inch mini jack, full 16-bit stereo, 48KHz sample rate
• Input: 1/8-inch mini jack, 8-bit microphone
Included: • Enhanced USB keyboard with PS/2 mouse port and Windows keys
• PS/2 mouse
Power: • Worldwide auto-sensing 100-240 VAC, 50/60 Hz.
• Energy Star V5.0
• Phase V external and EuP compliant power adapter
Power consumption: Under 7.2 Watts (average)
Dimensions: • Height: 1 inch (25mm)
• Width: 6.9 inches (177mm)
• Depth: 4.69 inches (119mm) Weight: 1 lb (450g)
Shipping Weight: 1.003 lbs. (.455kg)
Mountings: • Stand for horizontal use and VESA/wall mounting (included)
• Optional vertical stand
Temperature Range: • Operating
• Horizontal position: 50° to 95° F (10° to 35° C)
• Vertical position: Power button up: 50° to 104° F (10° to 40° C)
• Storage: 14° to 140° F (-10° to 60° C)
Humidity: • 20% to 80% condensing
• 10% to 95% non-condensing
Security: Built-in Kensington security slot (cable sold separately)
Safety Certifications: • Ergonomics: German EKI-ITB 2000, ISO 9241-3/-8
• Safety: cULus 60950, TÜV-GS, EN 60950
• RF Interference: FCC Class B, CE, VCCI, C-Tick
• Environmental: WEEE, RoHS Compliant
Warranty: 3-year limited hardware warranty

Jeff McNaught Interview One [CitrixTV YouTube channel, May 24, 2012]

Jeff McNaught, Chief Strategy and Marketing Officer from Wyse shares thoughts about Synergy i.e. Wyse and Citrix collaboration results. Everything started in 1995 !!

Marvell Joins Citrix System-on-Chip Initiative to Bring Citrix HDX Technology for Thin Clients to Market [Marvell press release, May 9, 2012]

Santa Clara, California (May 9, 2012) – Marvell (Nasdaq: MRVL) today announced participation in the Citrix System-on-Chip (SoC) initiative to enable an entirely new generation of thin clients for high-definition virtual applications and desktops at a low cost. The Marvell® ARMADA® 510 SoC seamlessly integrates Citrix HDX capabilities into a complete silicon solution. The first of many ARMADA chips to be verified as part of the Citrix SoC initiative, the ARMADA 510 is a high-performance, highly integrated, low-power SoC comprised of an ARM v6/v7-compliant superscalar processor core, a hardware graphics processing unit, video decoding acceleration hardware and a broad range of peripherals, answering the need for fast processing and a rich multimedia user experience.

“The future of enterprise computing is in the convergence between mobile devices and digital content – it’s imperative that end users have access to the content they need from any device, whether it’s a thin client, tablet or smartphone. Citrix has been abreast of this monumental shift in the computing landscape for years – and now the Citrix SoC initiative makes it even easier for companies to deliver a new category of mobile-enterprise friendly devices to users quickly and affordably,” said Jack Kang, director of marketing for mobile at Marvell Semiconductor, Inc. “Working closely with Wyse, Marvell is proud to integrate the performance enhancements from Citrix SoC initiative onto Wyse’s performance rich Citrix HDX Ready T50 device based on Marvell’s ARMADA 510. Marvell is also working closely with Citrix to verify its full portfolio of highly scalable enterprise silicon solutions, from cloud servers to mobile and consumer end point devices, and we look forward to further collaborations with Citrix Ready partners to deliver new and exciting products throughout the enterprise.”

“Citrix XenDesktop delivers the capabilities to enable enterprise customers to begin or accelerate their migration to Windows 7 and beyond, while gaining the mobility, flexibility, and management benefits of desktop virtualization.” said Ankur Shah, principal product manager at Citrix Systems. “We welcome Marvell to the Citrix System-on-Chip initiative. Marvell’s broad portfolio of technology will enable a wide variety of devices to leverage the benefits of Citrix desktop virtualization technology.”

”Wyse is excited about Marvell’s partnership with Citrix on the Citrix SoC initiative,” said Kiran Rao, director of product management at Wyse Technology. “The end-to-end approach, incorporating Marvell’s high performance hardware with software optimized for HDX technology, enables Wyse to quickly bring innovative devices to market that provide a superior end user experience. Wyse’s compact, affordable Citrix HDX Ready T50 and T10 thin clients, as well as the new Xenith 2 zero client, powered by Marvell’s ARMADA 510 SoC will further expand access to cloud-based desktop virtualization using Citrix XenDesktop in the enterprise and beyond.”

Wyse and Microsoft discuss cloud PCs and OS licensing [WyseTechnology YouTube channel, May 19, 2011]

Andre Beuchat, Wyse Technology, and Michael Hoyt, OEM Partner Account Manager, Microsoft Corporation, discuss the benefits of cloud PCs and how Microsoft licenses the OS for them. The cloud PC used in the demo is a Wyse Z class. Benefits of this cloud PC include: security, high performance, energy efficiency, TCO, works with Windows 7 and fit within distributed computing models. The types of license options discussed in the video are Microsoft Diskless PC COA, Windows 7 Professional Diskless PC COA, volume licensing. Software assurance is covered as well.

More Ways to Love Windows 7

Wyse Z Class Thin Client [WyseTechnology YouTube channel, Jan 31, 2011]

Wyse Z class – High performance Windows® Embedded Thin Client for the most demanding Virtual Desktop Environments. Visit product page at: http://www.wyse.com/products/hardware/thinclients/Z90/

Comparison of the current Z class products:  Wyse Z90DE7, Wyse Z90D7, Wyse Z90S7, Wyse Z50D, Wyse Z50S, Wyse Z90DW
All with dual-core AMD G-T56N. The 4  Windows® Embedded Standard 7 based ones at 1.6  or 1.65 GHz while the 2 Wyse-enhanced SUSE Linux based ones at 1.5 and 1.6 GHz respectively. Memory is 2/4/8GB Flash + 2/4GB RAM, DDR3, depending on the model. Memory on 3 models is expandable, and on 3 Windows® Embedded Standard 7 based ones SSD storage is also supported. Power consumption is under 15 Watts (average) for all. Dimensions are 200 x 47 x 225 millimeters. Weight is 1.1kg.

Wyse Introduces World’s Fastest Thin Client Family [Wyse press release, Aug 29, 2011]

Wyse, Cloud Client Computing, Z class, World, Fastest, Available, VMworld 2011

SAN JOSE, Calif. – 08/29/2011 – Today at VMworld® 2011, Wyse Technology, the global leader in cloud client computing, today announced that its fastest thin clients ever, the [Windows® Embedded Standard 7 based] Wyse Z90D7 and Z90DW are now shipping.  In addition, Wyse today introduced two new Linux-based members of its Z class family – the Wyse Z50S and Wyse Z50D.  The Wyse Z50 is the high performance thin client family based on Wyse Enhanced SUSE Linux Enterprise, the industry’s only enterprise-quality Linux operating system that combines the security, flexibility, and market-leading usability of SUSE Linux Enterprise from Novell, with Wyse’s thin computing optimizations in management and user experience.

Z-ClassIn connection with the availability of these breakthrough thin clients, Wyse also announced the results of independent testing, recently conducted by The Tolly Group, of the Wyse Z class versus the competition.  Wyse made this announcement in connection with VMworld® 2011, the global conference for virtualization and cloud computing held in Las Vegas, August 29th through September 1st at The Venetian.  As part of VMworld 2011, Wyse is demonstrating their award-winning virtualization, management, and cloud software and a wide range of thin, zero, mobile and cloud PC client hardware at Booth #1111.

At the heart of the Wyse Z class thin clients lie an entirely new engine, one where all the major system elements – CPU cores, vector engines, and a unified video decoder for HD decoding tasks – live on the same piece of silicon.  This design concept eliminates one of the fundamental constraints that limit performance.

The Wyse Z class delivers a combination of performance, simplicity, and connectivity never before seen in a thin client.  With available dual-core AMD G-series Fusion accelerated processing units, the Wyse Z class is the world’s best-performing thin client, able to support the most processing-intensive applications including 3D solids modeling, HD graphics simulation, and unified communications with ease.  They also include the first SuperSpeed USB 3.0 connectivity in a thin client, enabling the newest peripherals and speeds up to 10 times faster than USB 2.0.  With Wyse Z class thin clients, users have more display options than ever before including DisplayPort and DVI.

The Wyse Z class also includes advanced networking capabilities, with support for gigabit Ethernet, and available integrated A/B/G/N dual band Wi-Fi.  They are compliant with the ENERGY STAR Version 5.0 Thin Client specification.

Independent testing by The Tolly Group recently confirmed the Z90D7s substantial leadership position in thin client performance compared to rival products.  In support of rich video-based Web applications, for example, the Z90D7 boasted a clear advantage in video playback quality while using just a fraction of its processing and memory capability.  That equates to a clearly superior user experience on a much more energy-efficient platform.  In addition, the Z90D7 scored up to five times higher in industry-standard performance ratings (CPU Mark, 3D Graphics Mark, and PassMark ratings) than the competition.  Among secure, cost-effective, yet powerful thin clients, these independent tests confirmed that the Wyse Z class is the clear winner.

“Being able to combine power and performance in such an easily-managed device is something we are extremely proud of,” said Param Desai, Sr. Director, Product Management, with Wyse Technology.  “With the availability of Wyse Z class we’ve more than doubled the performance capabilities of competing top-of-the-line thin clients with similar energy requirements.”

Built on the same exact advanced single and dual core processor hardware platform as the Wyse Z90 thin clients, the upcoming Linux-based Wyse Z50 promises more of the same industry leading power and capability on an enterprise-class Linux operating system.

“We are very familiar with the performance of Wyse products having deployed several Z90 devices throughout our campus,” according to Ryan Foster, Network Engineer at Montgomery County Community College in Southeast Pennsylvania.  “We were particularly impressed with the improvements to our desktop security, and by the capabilities of these devices handling multimedia files such as audio, video and Flash.”

Supporting Quotes

“The Wyse Z Class and VMware View™ combine to take advantage of PCoIP® in ways that will enhance the end-user experience,” said Vittorio Viarengo, vice president, End-User Computing, VMware.  “Better security, easier management and significant energy savings all combine in a high-performance thin client that will benefit both IT and end users.”

Wyse has made innovative use of the AMD G-Series Accelerated Processing Unit which combines a multi-core CPU, a discrete-class DirectX® 11 capable GPU and HD video decoding in one tiny piece of silicon,” said Buddy Broeker, director of embedded solutions at Advanced Micro Devices “The Wyse Z class takes full advantage of the processor’s unprecedented level of graphics integration that delivers a unique combination of performance and efficiency.”

Availability
For more information on Wyse Z90 including independent report results, please visit:http://www.wyse.com/products/hardware/thinclients/Z90

The Wyse Z50 will be available later this year.

Wyse PocketCloud Family Overview [WyseTechnology YouTube channel, Feb 21, 2012]

The expanded Wyse PocketCloud family fuses streaming apps and data with search, file management and sharing across personal devices delivering content management from the cloud. Learn more at http://www.pocketcloud.com

Diagram - How Wyse Compliments Microsoft

Wyse PocketCloud Personal Cloud [WyseTechnology YouTube channel, Sept 21, 2011]

Need complete access to a cloud, your PC, Remote Desktop Services, a Terminal Server, VMware View or virtual machine from the palm of your hand? With Wyse PocketCloud™, it’s no problem! PocketCloud allows you to securely access your desktop anytime and anywhere on your iOS or Android devices. Learn more at http://www.wyse.com/pocketcloud

More videos about the PocketCloud:


Dell Wyse

Focus on Dell [May 24, 2012]

Kristen speaks with Rod Arnot (Executive Director, EUC Solutions, Dell) and Erik Dithmer (VP, WW End User Computing Sales, Dell) about the recent acquisition of Wyse technologies.

Dell Completes Acquisition of Cloud Client Computing Leader Wyse Technology [Dell press release, May 25, 2012]

  • With Wyse, Dell assumes a leadership position in Thin Clients[1]
  • Dell’s new Desktop Virtualization capabilities combined by Dell’s leadership position in Server, Storage and Networking solutions successfully positions the company as true end-to-end IT vendor

Dell today announced it has completed its acquisition of Wyse Technology, the global leader in cloud client computing. The combination of Wyse’s capabilities with Dell’s existing desktop virtualization offerings position the company as the leader in the desktop virtualization, enabling it to offer true end-to-end IT solutions for customers and partners.

Dell has made significant strategic investments over the past three years to expand its enterprise technology and services capabilities. The Dell Wyse portfolio with current Dell desktop virtualization offerings, leading data center products such as servers and storage, and Dell’s services division, provides customers and partners with a single vendor that can match the full range of their cloud computing and desktop virtualization needs.

The Dell Wyse solution portfolio includes industry-leading thin, zero and cloud client computing solutions with advanced management, desktop virtualization and cloud software supporting desktops, laptops and next generation mobile devices. Dell Wyse has more than 180 patents, both issued and pending, covering its solutions, software and differentiated intellectual property. Dell’s existing offerings include Desktop Virtualization Solution Simplified and Desktop Virtualization Solution Enterprise.

Dell recognizes it’s critical for the desktop virtualization solutions strategy to embrace simple device management, enhance security, scale, and boost user productivity, while providing the flexibility to support anytime, anywhere access on any device.

Dell plans to preserve Wyse’s channel offerings and all existing Wyse channel partners will be eligible for our PartnerDirect Program. Dell will combine the best of both companies’ channel deal registration programs, extend this new deal registration program to all partners, and introduce a program in which partners can grow and nurture a customer relationship.

Quotes
“We’re excited to officially welcome Wyse to Dell and help extend its industry-leading efforts to a broader range of customers and partners,” said Jeff Clarke, Dell vice chairman and president, Global Operations and End User Computing Solutions. “We believe the Dell Wyse capabilities, combined with our previous desktop virtualization offerings and the strength of the Dell enterprise portfolio, provides the most comprehensive and competitive DVS solution available today.”

“Wyse and Dell share the vision and passion in helping our customers and partners create a frictionless user experience via the cloud,” said Tarkan Maner, Vice President and General Manager Dell Wyse, Cloud Client Computing. “Combining our relentless IP innovation and tight operational skills, and most importantly our laser focus on customer and partner advocacy, Dell cloud client computing will develop and deliver the most advanced solutions globally, from the data center to the end user. We are and will be completely focused on the best user experience for any user, for any content, using any app, on any device, anytime, anywhere; without any conflict, compromise and constraint.”

“As a current customer who has deployed Wyse cloud client computing solutions with Dell PowerEdge servers and Dell EqualLogic storage, Western Wayne School District is excited about the combination of Dell and Wyse,” said Brian Seaman, Network Administrator at Western Wayne School District in Pennsylvania. “Like most school districts, Western Wayne operates in a budget constrained environment and our move to desktop virtualization technologies supported with strong enterprise infrastructure has enabled us to do more with less in service of our students and community. In working with Dell and Wyse to scope and deploy our computing environment, Western Wayne now has the right technology to help us achieve our vision of educating our students of today to become the productive citizens of tomorrow.”

End point computing models continue to evolve and are accelerating tremendous innovation and efficiencies across enterprise desktop and personal computing,” said Bob O’Donnell, vice president, Clients and Displays, IDC. “One area of strong customer growth is in the desktop virtualization space and we expect to see adoption rates continue to grow over the next several years. As use models continue to mature, so do the vendors who offer solutions in this product space. Dell’s acquisition of Wyse results in an industry-leading solutions and services provider with a formidable end-to-end technology stack from the end point to the datacenter to the cloud.”

Dell to Acquire Wyse Technology Conference Call

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Dave Johnson, Senior Vice President, Dell Corporate Strategy:

We at Dell continue to execute on our strategy to develop and expand our solutions capability built on Dell’s intellectual property.  These solutions are open with a focus on enhancing customer productivity, delivering results faster and eliminating unnecessary complexity.  We’re making great progress in delivering solid results on this strategy.

Today’s announcement is an important next step to our end user computing strategy.  It enhances our portfolio in the critical area of client computing and further supports our efforts to help our customers innovate end to end IT solutions from the edge to the core of the cloud. The acquisition of Wyse Technology compliments and expands Dell’s existing desktop virtualization capabilities, allowing us to offer industry leading and differentiated solutions to a fast-growing segment of the end user computing space.

In addition, it also provides synergies with our enterprise solutions business.  Our ability to now offer an industry leading cloud client computing solution will provide opportunities for Dell to further accelerate the growth of our servers, storage and network portfolios. IDC estimates that worldwide thin client demand will grow 15 percent per year to approximately 3 billion by 2015, and that the end to end datacenter infrastructure stack for these solutions is expected to exceed 15 billion by 2015.  And with Dell’s portfolio, we’ll be able to participate in this broader opportunity.

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Wyse Technology is a leader in the high growth and strategic area of cloud client computing, ranking number one worldwide in thin client unit share in the fourth quarter of 2011.  Wyse delivered approximately $375 million in annual revenue over the trailing 12 months.

Wyse has approximately 500 employees with 150 employees in research and development, most of which are software engineers.

In addition, it has approximately 250 sales specialists that are solely focused on selling Wyse cloud client computing end to end solutions.  They have more than 3000 channel partners that sell Wyse technology on a global basis.

This transaction expected to be accretive to Dell’s non-GAAP earnings in the second half of fiscal year 2013.

Dell’s reputation as a trusted adviser to our customer, our distribution and sales capabilities combined with Wyse’s innovative solutions in cloud computing will help address customers’ needs and is a great strategic fit, both operationally and culturally for Dell.

Finally, Dell has a strong track record of integrating acquisitions of this size.  Based on experience with similar acquisitions, we expect this transaction to be accretive to earnings on a non-GAAP basis in the second half of this year.

We’re really excited about welcoming Wyse to Dell and even more excited about the opportunities for our customers.

Jeff Clarke, Vice Chairman, Global Operations and End User Computing Solutions:

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We see a growing opportunity in cloud client computing.  This includes thin and zero client hardware, client infrastructure management software, virtualization end user optimization software, datacenter networking and implementation and managed services.

It compliments and extends the desktop virtualization capabilities that Dell has today.  These solutions offer customers an alternative compute model and helps enterprises enhance security, streamline desktop management and boost user productivity.

Examples of the benefits that a cloud client computing solution can provide include,

  • One, reducing the riskto customers’ most valuable information by protecting it behind the walls of their secure datacenter.
  • Two, improving control of their IT resourceswith a centralized, virtualized and automated approach to image and application management.
  • And three, encouraging their employees to produce their best results by giving them the flexibility to work where, when and how they choose.

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We have discussed our strategy and end user computer was first to strengthen our core business by implementing sustainable supply chain improvements and the results of which were evident in FY ’12.

Our next goal was to deliver solutions and include compelling devices plus the tools to secure, manage that hardware, software and data.  You’ve seen the results of that with some of our recent product announcements, as well as the strong growth of our transactional services business in FY ’12.

And finally, we indicated our intensions to expand our reach into new and fast-growing areas of the end user computing.  The acquisition of Wyse Technology and its portfolio of industry leading capabilities is the next step in our end user computing strategy.

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Wyse is a global leader in client – excuse me – in cloud client computing.  Its portfolio includes a wide selection of industry leading thin and zero client devices designed easily to integrate into a virtualized or web based infrastructure.

Differentiated IP and device management, thin client operating systems, and mobility software that is customized to offer the best user experience with Microsoft, Citrix and VMware virtual desktop infrastructures.

Wyse solutions require less memory and processing power than other comparable thin client solutions, making them more cost competitive and effective for customers.

To date, Dell has relied on shared IP solutions to serve its thin client customers.  With this transaction, we are moving to a more profitable industry leading and complete end to end solutions with Dell owned IP and the associated R&D capabilities with it.

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Wyse Technology’s portfolio complements and extends Dell vision of providing innovative and complete end to end solutions to our customers.  In addition, the combination of Wyse Technology with Dell’s brand and customer reach presents a dramatic increase in Wyse’s addressable demand.

I’d like to leave you with the following takeaways;

  • Client cloud computing addresses many of our concerns, or many of the concerns our customers have around security, manageability and productivity.
  • Dell is focused on developing innovative and complete end to end solutions that address the needs of our customers with key assets and fast growing and highly profitable areas of the industry.
  • Wyse Technology gives us access to best in class resources, technology, team members that position us well in this strategic segment of cloud client computing.
  • And lastly, the Wyse team is superb and a great cultural fit for Dell.

Tarkan Maner, CEO of Wyse Technology:

The entire team at Wyse is excited about joining the Dell team and becoming an integral part of enabling Dell’s end user company vision. This agreement is great news for our customers and channel members worldwide.  We’ve been focused on delivering innovative solutions for our customers and channel members for the past 30 years now.  To be exact, 31 years now.

Dell and Wyse share a focus on delivering innovative IP, world class service support, and optimized overall value to our customers and channel members.

Customers and channel members rely on Dell to provide comprehensive end to end IT solutions. Clearly, Dell distribution, reach and brand are well recognized across the industry and it has industry leading capabilities across servers, storage, networking services and end user computing solutions.

Wyse has historically been recognized as a leader in cloud client computing where our skills and capabilities in security, manageability, availability, reliability, lower total cost of ownership both in terms of CAPEX and OPEX, and scalability have been key differentiators in delivering the best value to our customers and channel members.

Through the combination with Dell, we see obviously a tremendous opportunities to grow our core desktop virtualization business, as well as to expand into new and fast growing market segments and on mobility, and cloud computing.

These include infrastructure and content management as a service solution from the cloud for large enterprises, for small and medium businesses, as well as consumers.

We have extended our solutions into the unified communications space lately as well, providing voice, data, and video (what we call triple play) type of content delivery from the cloud for any user, for any content, for any app on any device, anywhere, anytime.  And we would like to say, without compromise, without constraint or conflict.

Our strong alliance ecosystem will be able to benefit from the extensive solutions portfolio they can now provide to their customers in teaming up with Dell.  The Dell PartnerDirect program currently has 100,000 channel members and a proven track record of effectively onboarding and training channel members of acquired companies.

This is exciting for us.  Wyse has a history of innovation across all of our product lines and have recently introduced many new solutions for our customers and channel members with more than 180 patents; to be exact, 182 patents in cloud client computing.

We believe that taking the next step at Dell is a very natural progression for our business and offers our customers and channel members some great advantages that are not available to us today at our scale and size.

It is exciting to think about the potential of integrating Wyse’s technology and R&D capabilities with Dell’s reach, existing solutions, capabilities and reputation.

We believe our customers and channel members worldwide will benefit in a big way from this entire combination.

Q: … just some more detail on Wyse’s hardware/software mix and margin structure, and what growth assumptions did you guys make to justify the price and over what time period and did you make any assumptions about cross-selling Dell branded enterprise solutions when coming up with the price?

Today, the majority of the revenue is from the thin client and zero client business with the growing percentage of that revenue now starting to come from some other areas, including some of the things that Tarkan spoke about. … If we look at and project out a few years, clearly a big part of this transaction is the synergy that we would get from our datacenter solutions business, including servers, storage, networking services, and software.

We also would expect, you know, within the services space, maintenance and some ongoing hosting opportunities over time, and there are also opportunities even in software and peripherals (S&P) if you think about the things like monitors and other items that you would sell in conjunction with a thin client solution.

Wyse as an independent entity has really been gaining momentum to grow into a number one market share position.  In fact, they are growth accelerated in their last fiscal year to 45 percent.

Far outstripping the mid-teens industry average growth, both historically and projected in the future for this segment. And that’s driven by the breadth of their portfolio and the differentiation that they bring to their customers.

… the thin client portion of the entire stack is really a small piece.  Our expectation and our experience has been as we engage with our customers on helping them determine how to solve for this workload set of requirements – and it really is a workload that you’re talking about – and your engaging at a much more comprehensive enterprise level about a solution.

And if you move to a thin client solution, and clearly the network, compute and storage moves, whether that’s into a private cloud or a public cloud, it’s in part of the entire solution.

Wyse is an independent entity that didn’t have, of course, access to the broad portfolio that we do. …

So, we believe the combination of our service and enterprise with our capabilities and the added capabilities of Wyse in the client space is a great combination and will be extremely synergistic for us.

I think, a key element that much of their software value is captured in the hardware itself.  So, for example, they build on top of the protocols in our industry events features ahead of others, whether that’s multi-monitor support, the integration of voice, data and video, and/or USB redirect.

Their ability to put those features into the platform ahead of the industry has allowed Wyse to extract value for that from its customers.

It also, as we mentioned in our remarks, their thin OS and the IP around the thin OS has allowed them to drive greater performance using less memory and they extract a value for that in the industry.

And then the bigger picture Dave hit on, for every thin client hardware dollar that exists in our industry, there’s $5 of enterprise servers, storage, networking services that go along with that. So, our ability to really move into that $18 billion marketplace with an end to end set of solutions from Dell is certainly how we view the asset a key piece.

Q: Obviously, this is a capability that Dell could have developed probably internally.  Does the fact that you decided to do this acquisition now suggest that you’re – Dell is seeing an inflection in the number of customers that are looking for these types of solutions and maybe if you could just give a little more detail on that and what you’re hearing from customers at this point on thin client?

what we view is the momentum around alternative computing is a trend that we see many customers continuing to experiment with and in many cases, beginning to deploy.

The adoption rates are still relatively low for desktop virtualization, but there clearly are a lot of customers out kicking the tires, very similar to maybe a decade ago around server virtualization. Not that I’m comparing the two, but more of just the adoption rate.

And we think this is an opportunity particularly in the verticals around financial services, government healthcare, and the financial services sector to really take a leadership position. Wyse Technology does have a leadership position in the thin client itself.

We have very strong presence in the enterprise and each of those verticals and us building – and Dell now being able to build end to end vertical solutions for these set of customers where it makes sense is key.

And again, I would emphasize we don’t see the entire world going to thin clients.  We still think there’s a healthy PC demand in the industry and there’s a balance of alternative computing that allows people to take advantage of securing their information, managing the assets in a very differentiated way.

And as Dave said, which I think is key in our thinking here, this is a different workload.  We look at this workload from the device out on the edge to what we do in the datacenter, providing a set of services and value offerings to our customers.

This is really specific use cases.  For example, in regulated industries like healthcare and financial services, the value of centralizing your data to better have access and control is a specific use case that this thin client desktop virtualization lends itself to.

And also, lends itself to environments in industries where, again, there’s a desire to simplify the endpoint and manage the application much more centrally. That is often the case in education and ever increasing in some of the emerging geographies.

So, we see this as an opportunity, again, to provide specific solutions to specific customer problems and much more industry-centric approach to our business.

Q: … do you have any specifics around what percentage of your VDI customers for Dell are incorporating a full PC versus a thin client? And then any thoughts as to whether there’s anything on the horizon that would, you know, increase the ratio of thin client penetration versus a full PC in virtualized installations?

We don’t see any real dramatic change.  The IDC forecast continues to project into the future a sort of steady 15 percent growth rate.  So, there’s no apparent broad inflection point.

And as we articulated a moment ago, these are mostly fairly specific situations where the value proposition applies.  And so, today, the total opportunity is, you know, counting the entire stack is about $3 billion.  And so that’s still a relatively de minimis piece of the overall PC industry.

Q: But, just to be clear on that point, you do have customers who are virtualizing their desktop and still purchasing regular Dell PCs rather than thin client?

…  A common deployment today is on a standard PC that’s been virtualized. Yea, I mean, we’ve seen that business grow in demand through last year and expect it to grow in demand this year.

… And again, I don’t think a zero client or a thin client is an answer for all customers.  I think in our mind the bigger message here is we now have a range of devices, an incredibly strong portfolio of thin client devices and zero client devices from Wyse, the standard Dell set of PCs, which do virtualization, and now the ability to manage those in a very differentiated way with the key software assets that we’re bringing on board that expand themselves to tablets, expands itself to mobile phones.

And the fact that in some cases these usage models are moving to the cloud and the ability to do client cloud computing, I think is key, and a key element of this acquisition.

Q: … You mentioned earlier some of the verticals that have been early adopters for this type of technology, can you talk about what you think some of the remaining barriers to broader adoption may be and how, perhaps, Dell is still solving that and what this acquisition does to help you there?

… from a vertical perspective … we see growth both in public sector and private sector, obviously, both in large enterprise and midmarket.

And from a bigger perspective, we see from time to time, some companies do not have the right level of datacenter portfolio and datacenter ecosystem. Sometimes we see certain customers in certain – in vertical industries or geographies complain about the fact they don’t have the right networking systems in the backend.

… these open up an opportunity, obviously.  So, those two are mostly the biggest barriers for deploying desktop virtualization centric cloud client portfolios and platforms.

… I think the key elements – one of the opportunities we have has changed the value proposition to make the total cost of ownership around manageability, securing the data and the devices much more efficient and attractive for our customers.

I think the differentiated technology that we’re getting with the integration of Brad Anderson’s [Dell president, Enterprise Solutions] and Steve Schuckenbrock’s [Dell president of Services] businesses, allow us a unique position to do this for our customers.

Q: … because you had mentioned seeing specific vertical opportunities, do you have any details on the split today of [Wyse] revenue by verticals or by geography?

The geographic mix is roughly 40 percent U.S., 40 percent EMEA and 20 percent APJ. … from a vertical perspective, I would say 50 percent public sector, 50 percent private sector.  When I say public sector, we mean, obviously, you know, state and local governments, healthcare, education, and federal government type of deployments and also private sector, you get the point.

In terms of customer size segmentation, I would say about 50 percent large enterprise, 50 percent midmarket/small business is our business at very high level.

Q: … if you expect to accelerate the growth rate actually from 45 percent, given synergies from Dell, and then, if you do or whatnot, is the revenue incremental or do you expect any substitutional revenue as well?  Like, do you expect that maybe Dell client sales will be hurt by Wyse and then it wouldn’t be completely additive, we’d have to subtract a little from the client side?

our projection is that we will maybe conservatively grow with the industry relative to thin client.

But, of course, as you’re pointing out, they didn’t have the ability to integrate the comprehensive solution with networking, storage, compute, as well as wrap all the services around it.  So, much of the revenue acceleration is driven by those synergies that you’re pointing out and we expect that to be significant in terms of the growth rates that we’ll be able to achieve through the entire offering that we will provide.

Q: … could you go back and speak to build versus buy because it seems to me that Dell would have had a fairly easy time replicating the thin clients from Wyse.

Getting to your point about internal versus external, a comment on this that this is one of the industries when you look at it where Wyse and one other competitor basically had almost 50 percent of the market and then it’s a tremendous drop off to the rest of the players, none greater than 10 percent.

And so, the combination of Dell with Wyse will put us in a very dramatic number one – not dramatic, but clearly a number one market position.  And so, there’s certain value, as you know, of being a significant player in that kind of an industry situation.

… because one of the other elements of the question is Dell versus buy, could we have done this organically?

And our view is, I think, very straightforward.  This [Wyse] is a company that has 31 years of experience.  They have the intellectual property, they have the software and as Dave mentioned earlier, 150 R&D engineers which 140 are in software.

We think the stickiness and the solution in the stack that I showed on one of the earlier slides is the software stack that brings together the edge device, the management software that manages that, that sits into the cloud or sits into the datacenter, and the ability to build that software from essentially ground zero to being able to acquire those capabilities and that experience and the technology with it, puts in a, I think, a leadership position and in a position as we integrate this with Steve [Schuckenbrock’s] and Brad [Anderson]’s organizations and build out workloads and solutions to move quite quickly in the marketplace much quicker than we could have done it on our own.

Q: … specifically, I noticed than one of your newer products is where the T10 is on an ARM based platform, so what type of ARM engineers are you bringing to Dell? … I’m just curious about ARM technology that’s being – will this further Dell’s ARM, I guess, initiatives?

Well, the way that I’d like to answer that question is simply around we’re going to build client devices, both desktops, notebooks, tablets, smart phones, thin clients, zero clients at the appropriate hardware architecture.  That will be a combination of x86 and ARM.

Dell itself has a pretty strong capability around ARM processor architecture.  And as we mentioned, there’s only a dozen or so hardware engineers inside Wyse technology that work on the hardware.  So, us getting hardware competence or assets around the design of ARM from Wyse, that’s not the nature of this acquisition, it’s the 140 software engineers that were key.

The hardware architects on the Dell side that are working on ARM implementation across the plethora of devices that I mentioned earlier would still be the core ARM architects and the knowledge based for our ARM implementations.

The real question maybe lying in the fact, will we continue to support thin clients based on ARM architecture and this thin OS? Absolutely. We believe that’s part of the value proposition that Wyse has had in the marketplace today.  It’s allowed them to move quite quickly in implementing new products to the marketplace, providing a performance advantage or a lower cost option because they’ve done a great job in designing for cost and providing comparable features in the marketplace that others do in a more costly way.

And on top of that, they innovate the platform, as I mentioned earlier, around the management stack, and then the promise around the software engineer being able to take things like Stratus and PocketCloud and being able to build that around those platforms and integrate Dell’s services around that with the rest of our Dell client assets, we think is an opportunity for us to differentiate with this acquisition.

Q: … how this sort of positions yourself with Citrix and the VMware’s of the world, i.e. you know, there’s not going to be any attempts to (inaudible) features and functionality you get with some of those software partners.

… we have strong relationships with the key players in thin client computing and virtualization.  Not only are we going to continue those partnerships, we’re going to grow those and foster even deeper relationships.

… as you all know, we [Wyse] are pretty close partners with Microsoft, we do a lot of work with VMware, with Citrix.  As these providers, you know, provide desktop virtualization methodology and technology between the datacenter and end use computing platforms.

So, we add to that value and the partner heavily with them and obviously that’s going to continue and the opportunity now, obviously as Jeff said earlier, now we’re bringing the datacenter, the network and end user platform all in an integrated way to our customers for more value.  So, we’re going to have more opportunities to partner with Microsoft, with VMware, with Citrix and others in that space.

And also, one other piece to add, we provide some of the software we provide is differentiated in the marketplace, is the leader in this space also from the cloud, both on the infrastructure management side from the cloud, with a product called Wyse Stratus. So, many of you on the phone are using today, Wyse PocketCloud, the market leading product for content management from the cloud on any mobile device and also from your web browser, connecting your apps and content inside the content voice data video from your choice of your cloud, private or public.

So, these are all opportunities for us to do more with Microsoft, with VMware and Citrix as they move forward.  And that’s a big differentiator.

MWC 2012 day 1 news [Feb 27, 2012]: Samsung and Nokia

 

Samsung had a number of enhanced GALAXY products (see them in the “Details for Samsung” section below). The really strong message from innovation point of view from them has, however, been (considered by them as “hidden gems”):
Samsung Mobile – Beyond Product [ YouTube Channel]

Tour the Samsung Mobile booth at Mobile World Congress 2012 in Barcelona. Find out more about our new innovations, from AllShare Play and Control through Smart Driving and Smart School to NFC mobile payments.

UPDATE: for Nokia the major competition is the overall Android ecosystem, and not only in the proper smartphone market as:
– repeatedly stressed by Stephen Elop, the CEO of Nokia:

Our number-one focus is competing with Android. [see here and here]

The principal competition is Android, and then Apple. [see here]

– indicated in relevant excerpts from the Nokia 2011 fiscal year report [March 8, 2012] as:

Market overview

… Today, however, the distinction between these two classes of products is blurring. Increasingly, basic feature phone models, supported by innovations in both hardware and software, are also providing people with the opportunity to access the Internet and applications and, on the whole, offering them a more smartphone-like experience.

Whether smartphones or feature phones, mobile devices geared for Internet access and their accompanying Internet data plans are also becoming increasingly affordable and, consequently, they are becoming attractive to a broader range of consumer groups and geographic markets. A notable recent development has been the increased affordability of devices based on the Android platform, which has enabled some vendors to offer smartphones for below EUR 100, excluding taxes and subsidies, and thus address a portion of the market which has been dominated by more basic feature phone offerings.

….

Competition

…  some competitors’ offerings based on Android are available for purchase by consumers for below EUR 100, excluding taxes and subsidies, and thus address a portion of the market which has been traditionally dominated by feature phone offerings, including those offered by Nokia. Accordingly, lower-priced smartphones are increasingly reducing the addressable market and lowering the price points for feature phone. …

Principal Factors & Trends Affecting our Results of Operations

Devices & Service

Increased Pervasiveness of Smartphones and Smartphone-like Experiences Across the Price Spectrum

During the past year, we saw the increasing availability of more affordable smartphones, particularly Android-based smartphones, connected devices and related services which were able to reach lower price points contributing to a decline in the average selling prices of smartphones in our industry.

This trend affects us in two ways. First, it puts pressure on the price of our smartphones and potentially our profitability, as we need to price our smartphones competitively. We currently partially address this with our Symbian device offering in specific regions and distribution channels, and we plan to introduce and bring to markets new and more affordable Nokia products with Windows Phone in 2012, such as the Nokia Lumia 610 announced in February 2012. Second, lower-priced smartphones put pressure on our higher-end feature phone offering from our Mobile Phones unit. We are addressing this with our planned introductions in 2012 ofsmarter, competitively priced feature phones with more modern user experiences, including software, services and application experiences. In support of our Mobile Phones business, we also plan to drive third party innovation through working with our partners to engage in building strong, local ecosystems.

Full information is in the Nokia’s strategy for “the next billion” based on software and web optimization with super low-cost 2.5/2.75G SoCs [Feb 14 – March 8, 2012] post on this blog.

END OF UPDATE

For Nokia, accordingly, a number of innovations have already been introduced on the MWC 2012, from the hardware level up to the services which surround all that. So for Nokia I will provide a video-based overview here well before going into the “Details for Nokia” section in the very end:

Nokia Press Conference Highlights from MWC 2012 [ YouTube channel]

Key points: Nokia Lumia 610 is announced. Award-winning Nokia Lumia 900 will become available in various markets outside the US. Nokia PureView elevates industry standard in smartphone imaging. New Asha feature phones and services grow increasingly ‘smarter’.

Nokia Lumia 610 Hands-On Video [ YouTube channel]

The funky Nokia Lumia 610 http://nokia.ly/AztJvZ is the most affordable Lumia phone yet, but it delivers everything you need in a smartphone. The People Hub pulls family and friends’ contact details in one place, along with Facebook and Twitter feeds. A choice of colours, with metallic trim, makes the phone an individual style statement. [$254 (€189). Has a 3.7” 800 x 480 WVGA LCD display.]

The Windows Phone Xbox tie-in and 5-megapixel camera add to the funky package. And Nokia Music, with Mix Radio (availability may vary by market), Nokia Maps, Nokia Drive, Nokia Transport and Nokia Reading – make this phone unbeatable value.

UPDATE: the Nokia Lumia 610 won Tom’s Hardware Best in show and Best Budget Smartphone from Laptop. See here.

Introducing the White Nokia Lumia 900 – Live Large [ YouTube channel]

Meet the new Nokia Lumia 900 with Windows Phone http://nokia.ly/zoyq6L Find out how fast amazing can be. And social. And beautiful. With its award winning design including front facing camera and Live Tiles, keeping in touch with friends, and the entire Internet, has never been so easy. [$645 (€480). Has a 4.3” 800 x 480 WVGA AMOLED ClearBlack display with Gorilla Glass.]

Experience The Amazing Everyday.

First Look at Nokia Reading on Nokia Lumia [ YouTube channel]

In this hands on video, Rhidian from Nokia talks about Nokia Reading, a premium e-book and audio experience service announced at Mobile World Congress 2012, and shows how it works on Nokia Lumia.

Nokia Reading will be available for Nokia Lumia handsets from April and will first launch in six markets (UK, France, Germany, Italy, Spain and Russia) with more to follow.

UPDATE: Nokia Reading: Get gripped by a great book [Nokia Coversations blog, Feb 28, 2012]

Nokia Reading follows the same simple and elegant panorama design we’ve become used to with other services, delivering the whole experience through a beautifully designed “reading hub.”

Nokia is working with some of the world’s biggest publishers, including Penguin and Hachette, and Pearson to launch a world class e-book and audiobook experience that’s been designed specifically for the Nokia Lumia.

Using a single, simple app you can choose your own favourite authors, or select bestselling novels and the top local books in your own language. If you’re not sure that you’ll like a book, Nokia Reading lets you browse some sample pages before you buy. Or you can download and read one of the thousands of classic works of literature that will be available for free.

Once you have chosen a book, large, clear, smartphone screens like those on the Nokia Lumia make reading an enjoyable experience – and you can switch to ‘night mode,’ change the font or adjust brightness, if your eyes get tired in the evening. It’s also great on an underground train or plane, because you can read everything offline after downloading beforehand over WiFi or mobile network

In coming months you’ll also be able to create a personalized magazine page (called “news stream”) that updates content across the most popular categories, and adds web content from your chosen sites.

Nokia 808 PureView – The next breakthrough in photography [ YouTube channel]

The game changer! Nokia 808 PureView http://nokia.ly/xz6mhS takes every bit of image goodness captured by a 41MP sensor and Carl Zeiss lens and turns it into beautifully detailed images and Full HD videos. Be ready to shoot and share with friends in an instant. [$605 (€450). Has a 4” 640 x 360  16:9 nHD AMOLED display.]

The Nokia 808 PureView also features exclusive Dolby Headphone technology, transforming stereo content into a personal surround sound experience over any headphones and Dolby Digital Plus for 5.1 channel surround sound playback.

UPDATE: Zooming in on Nokia PureView [article on the Nokia Conversations‎ blog, Feb 29, 2012]: meet the brains behind Nokia PureView Eero Salmelin and Juha Alakarhu, and also learn the history of this 5 years long journey that lead to the delivery on MWC 2012

UPDATE: Nokia 808 PureView partner makes it unbeatable [Nokia Conversations blog, March 1, 2012]

Dolby reveals audio secret of new phone’s success

Taking pride of place at their stand, the world’s best camera phone owes much to Dolby technologies for helping to make it an HD mobile entertainment device.

For the PureView is also about pure audio thanks to its high-definition Dolby Digital Plus 5.1-channel surround sound which plays on HD TVs, and home theatre systems, and when combined with Dolby Headphone technology – also built into the PureView – provides a personal 5.1 surround experience over any headphones.

Nokia is also bringing the Dolby experience to other smartphones with Nokia Belle Feature Pack 1 software upgrade for the Nokia 700, Nokia 701, and Nokia 603, also displayed on the Dolby stand.

Mobile Sales Director Shawn Richards talked us through the tech on a Nokia 700 with a demo from Batman movie The Dark Knight.

He explained that the Dolby Headphone upgrade transforms stereo content into a personal surround sound.

“You get a more natural, engaging, and authentic sound,” he said. “Good audio is even more important when you are watching a movie on a small screen. And Dolby Headphone creates a totally immersive feel.”

UPDATE: Nokia 808 Pureview – Best New Mobile Handset, Device or Tablet at Mobile World Congress 2012 [ YouTube channel, March 1, 2012]

Nokia 808 PureView wins top MWC award!
Our awesome camera phone scoops the top award from Mobile World Congress 2012 judges.

UPDATE: Damian Dinning explains Nokia PureView technology [ YouTube channel, Feb 29, 2012]

Nokia’s imaging expert Damian Dinning explains the breakthrough camera technology behind Nokia 808 PureView.

You could also check out the gorgeous photos taken with Nokia 808 PureView from the flickr.

UPDATE: Nokia PureView Q&A with Damian Dinning [interview on the Nokia Conversations‎ blog, March 1, 2012]

Nokia Stereo Bluetooth Headset BH-221 – See what you hear [ YouTube channel]

The new Nokia Stereo Bluetooth Headset BH-221 comes with an integrated FM radio and OLED display. It as excellent audio quality and NFC for easy pairing with your phone. Learn more at: www.accessories.nokia.com

Nokia Asha 302: Meet the designer [ YouTube channel]

Nokia Asha 302 http://nokia.ly/xXK4kV was designed with one simple goal in mind – to design the best looking QWERTY phone for today’s urban professionals. The metallic touch points, bold and sophisticated colors and smooth edges help users stand out and project success giving the phone a great premium feel. [$128 (€95). Has a 2.4” 320 x 240  QVGA TFT display.]

UPDATE: The Nokia C3-00 won Best Feature Phone or Entry Level Phone at the GSMA Awards 2012 in Barcelona. Blanca Juti, VP for Mobile Phones Product Marketing said to Nokia Conversations after collecting the prize: “It’s great for our products going forward, because the Nokia Asha 302 we launched yesterday is pretty much the successor to C3 which has had an amazing run in the market.” See here.

Nokia Asha 302: Premium All Round QWERTY [ YouTube channel]

Nokia Asha 302 http://nokia.ly/x5m2zm is a QWERTY phone with great value for money. It is packed with a 1 Ghz processor and is great for social networking, Email, Instant messaging, supports Mail for Exchange and has a premium design with stunning looks.

Nokia Asha 203: Simply touch, connect and play [ YouTube channel]

The Nokia Asha 203 http://nokia.ly/x78ZBe is a touch phone with a traditional keypad, offering fast and affordable access to the internet, easy access to email and social networks as well as a 40 EA games gift offering. [$81 (€60). Has a 2.4” QVGA display.]

Nokia Asha 202 Dual SIM: Simply touch, connect and play [ YouTube channel]

The Nokia Asha 202 http://nokia.ly/yOGbDA is a touch phone with a traditional keypad, offering fast and affordable access to the internet, easy access to email and social networks as well as a 40 EA games gift offering. Plus it comes with Easy Swap Dual SIM.  [$81 (€60). Has a 2.4” QVGA display.]

After exactly a year from the announcement of their new strategic set-up and direction it is quite obvious from all that above that Nokia is well on to realizing the corresponding transition. In fact they are redefining themselves which is well described by this video just published 2 days before the start of MWC 2012:

The New Essence of Nokia  [ YouTube channel]

We believe that everybody can have a richer, fuller life every day, everywhere. That means upgrading an ordinary moment to an exciting one or finding an unexpected experience to share with others. Intuitively, fast and easy. This is Nokia’s new mantra, this is the new essence of Nokia.

I see this overall brand message fitting rather well with their new and enhanced portfolio as you could judge for yourself from the above video presentations. In this way they have proceeded quite well from the disastrous situation they were a year ago, and which had been described quite extensively in the following post on this blog: Be aware of ZTE et al. and white-box (Shanzhai) vendors: Wake up call now for Nokia, soon for Microsoft, Intel, RIM and even Apple! [Feb 21 – March 25, 2011].


 Details for Samsung

This is the first hands-on video of GALAXY Beam from the Mobile World Congress 2012. GALAXY Beam is Samsung’s new projector smartphone that allows you to display and share multimedia content or business information instantly no matter where you are. For more information: http://www.samsungmobilepress.com/2012/02/26/GALAXY-Beam
MobileBurn.com – Samsung had relatively few things to announce at MWC 2012 this year, but one of them was the Galaxy Note 10.1, a larger version of the original Galaxy Note. The Note 10.1 uses the Galaxy Tab 2 (10.1) as its design inspiration (it looks nearly identical), but it adds S Pen capabilities to draw and notate on the screen. The Note 10.1 is powered by a dual-core, 1.4GHz processor and runs Android 4.0 Ice Cream Sandwich with Samsung’s TouchWiz enhancements. More info: http://www.mobileburn.com/18681/gallery/samsung-galaxy-note-101-live-impressions

Details for Nokia

All the launches: Nokia at Mobile World Congress [Nokia Conversations‎ blog]

BARCELONA, Spain – Nokia announces six new phones and an array of new and updated services, advancing its new strategy and setting the pace for 2012.

Here’s our star-studded line-up for Barcelona 2012.

Nokia Lumia 610

The Nokia Lumia 610 is our most affordable Windows Phone to date – and the fourth we’ve brought to market. It’s aimed at young people who want access to a smartphone experience at the right price. Offering access to social networking, games, Nokia Maps and navigation, web-browsing and Nokia Music, the Lumia 610 comes in four bright colours. It will cost just €189 [$254] before taxes and subsidies, and starts shipping in April.

Nokia Lumia 900

First announced in January for AT&T’s LTE network in the US, the Nokia Lumia 900 will now be available worldwide in an HSPA+ edition. The Dual Carrier HSPA phone will allow for downloads up 42.2 Mbps. With a 4.3-inch ClearBlack AMOLED display, mobile media never looked so good, while an upgraded battery means there’s no compromise on longevity.

[Lumia 900 [DC-HSPA variant] $645 (€480) according to the press release]

Read the full story

which one is your favourite

Nokia 808 PureView

The Nokia 808 PureView extends our leadership in camera phones, with an amazing 41-megapixel sensor, Carl Zeiss optics and brand new pixel over-sampling technology. This means pin-sharp pictures, great low-light performance, yet with the ability to save your images in a suitable file size for social media, MMS and email. Also watch out for full 1080p video recording and exclusive Dolby Headphone technology to enrich the sound of any stereo content.
[The Nokia 808 PureView has a current price of €450 [$605]. It will be hitting stores in Q2 2012. – according to a press report]

Read the full story

Nokia Asha 302, 202 and 203

We’re also introducing three new Nokia Asha mobile phones with new capabilities to bring them to smarter heights than ever. Aimed at urban consumers across the world, the Nokia Asha 302, 202 and 203 offer more than ever in terms of work and play. The Asha 302 is a QWERTY phone with support for Microsoft Exchange synchronisation, a first for Series 40 phones. The Asha 202 and 203 bring touch screens to a lower price point than ever and come with a massive entertainment bundle.
[Asha 202/203 $81 (€60), Asha 302 $128 (€95) according to the press release]

Read the full story 

New-Capabilities

Super Services

Not satisfied with six new phones, there’s a whole raft of new and improved services. Nokia Drive for Windows Phone will now offer full, offline maps and turn-by-turn navigation. In addition, there’s Nokia Reading, the best e-book experience for Nokia Lumia. And Nokia Life bringing life skills, parenting, education, agriculture and entertainment services to Series 30 and 50 phones in India, China, Indonesia and Nigeria.

Read the full story

Click through for all the in-depth stories from today’s press conference. We’ll be bringing you even more detail, hands-on experiences and interviews with the brains behind these beauties over the course of the week.

Nokia 808 PureView

Remember that Nokia PureView tease from a few days ago? Well, suddenly it all makes sense. We are indeed looking at an imaging flagship phone and a true successor to the N8. It’s called the 808 PureView and it’s expected to reach Europe in the next quarter for a price of 450 Euros. Before we move on to its craziest feature — the camera, of course! — let’s run down the other key specs: The OS is Symbian Belle; the engine is a 1.3GHz single-core chip; the display is 4-inches corner to corner but its resolution is a Nokia-style 360 x 640 (nHD). There’s 512MB of RAM and 16GB of on-board storage that is thankfully expandable via microSD. A Pentaband modem increases the chances of getting a signal while globe-trotting, while data speeds will top out at plain HSPA 14.4Mbps. Now that Carl Zeiss-lensed camera: it handles continuous-focus 1080p, but is claimed to have an incredible sensor resolution of over 41-megapixels when shooting stills — or 34-megapixels for 16:9 images. It’s achieved by some clever sub-pixel interpolation jiggery-pokery that entails five pixels being merged into one to produce a final image with a max resolution of 8-megapixels, but we’ll dig deeper very soon. It’s expected to arrive in May at a price of €450 and if you’re curious, we’ve got a gallery of hands-on images and video for your viewing pleasure. Just follow the break for our first impressions. If you haven’t been sufficiently smacked in the face with the Nokia 808 PureView’s primary selling point, let’s settle the score right now: it’s a phone for camera enthusiasts. As niche devices often go, the sheer optical goodness will come with a few sacrifices. First and foremost, we’re a bit puzzled by Nokia’s choice of Symbian for the phone’s OS. That’s not to say that Belle isn’t a fine operating system, but it’s certainly a polarizing decision — not to mention perplexing, given the company’s ‘all-in’ approach to Windows Phone. Secondly, the 808 PureView is rather chunky, which is emphasized by the bulbous camera pod on the rear. In many ways, Nokia’s phone more closely rivals a point-and-shoot camera in size than a smartphone. That said, it’s still an infinitely pocketable handset, but there are certainly many other high-quality camera phones on the market that don’t demand such sacrifices. If you’re able to move beyond these two major caveats, the 808 PureView is likely a handset that many will come to adore — even if the fondness is learned over time. It features a lovely ClearBlack display, and while it’s decidedly low-res, it’s more than sufficient for Symbian Belle and its associated apps. Below the phone’s screen, users will find an extended rocker that provides access to the home screen, dialer and on / off switch. These physical buttons are combined with additional navigation options that are situated directly above on the touchscreen. The phone also features a headphone jack, micro-USB and micro-HDMI ports along the top — each recessed into a pod of their own — and the volume rocker, screen lock slider and dedicated camera button along the right-hand side. Via engadget

Nokia Lumia 610 and 900 [DC-HSPA variant]

Live from MWC 2012 Phonearena presents Nokia Lumia 610 demo. A heavily rumored handset, the Nokia Lumia 610 was finally announced today here at MWC 2012. As expected, the 610 is the first real budget-friendly Windows Phone, expected to retail for about $255 (EUR 189), which is pretty decent for a Windows Phone. For the full details, see our Nokia Lumia 610 Hands-on Review from MWC 2012 at: http://www.phonearena.com/news/Nokia-Lumia-610-Hands-on-Review_id27389

Nokia Asha 302, 202 and 203

PhoneArena live from MWC 2012: Nokia Asha 302 Hands-on Review. The Nokia Asha 302 is the full QWERTY business class addition to the extremely affordable Asha lineup based on Series 40. For the full details, see our Nokia Asha 302 hands-on from MWC 2012 at: http://www.phonearena.com/news/Nokia-Asha-302-Hands-on-Review_id27399

Super Services

E Ink strategic value proposition: displays on every smart surface

UpdatesReflective OutLook: Shades of Gray or Colorful? [Touch and Display-Enhancement Issue of Information Display, Sept 21, 2012]

E Ink and SiPix
Meanwhile, could color have anything do to do with E Ink’s recent announcement of its intention to acquire SiPix, whose microcup technology does show promise in that area? E Ink will certainly utilize SiPix’s color capabilities, says Sriram K. Peruvemba, Chief Marketing Officer for E Ink Holdings. Peruvemba characterizes that color as having “some of the same advantages as E Ink in that it is low power, sunlight readable, thin, light … .”
Beyond a doubt, one area of interest for E Ink is SiPix’s manufacturing capabilities. “SiPix’s factories, equipment, and infrastructure are relatively newer, which gives us greater flexibility and additional capacity as we seek new markets,” says Peruvemba. Among the markets that the potential acquisition will make more accessible, he says, are digital signage and smart cards.
When it comes to E Ink, it isn’t necessarily all about color, notes University of Cincinnati’s Jason Heikenfeld, who has served as a guest editor for Information Display (and is also a founder of e-Paper up-and-comer  Gamma Dynamics, mentioned later on). “We should maintain excitement about the continued expansion of monochrome e-Paper products,” he says. “A quiet revolution continues to take place there. Color-video e-Paper will also have its day, but today we should be impressed with E Ink’s continued product growth and diversification.”
Any way you look at it, with E Ink, whose share of the e-Reader market is more than 90%, poised to acquire AUO subsidiary SiPix, further consolidation in the e-Paper market seems inevitable. At press time, E Ink had reached an agreement to acquire 82.7% of SiPix’s shares and was seeking to acquire up to a 100% stake, valued at approximately NT$1.5 billion [US$ 51.2 million]. [See: Complementary ePaper technology adds to E Ink’s portfolio of offerings [E Ink Holdings press release, Aug 3, 2012]] As DisplaySearch analyst Paul Semenza wrote in a recent blog, titled And Then There Was One – E Ink to Acquire SiPix, “Combined with Bridgestone’s exit [earlier this year] from the electrophoretic display (EPD) business, this means that E Ink, the first company to mass produce EPDs, will be the sole manufacturer of the technology.”
Yet, the e-Paper story isn’t all black and white. In the future, look for news from Liquavista (which Samsung acquired in January 2011) and Gamma Dynamics (a spinoff from the University of Cincinnati). Both companies have video-capable displays (Liquivista’s is based on electrowetting and Gamma Dynamics’s on electrofluidics) that are reported to show more vibrant color than previously available.

Meanwhile innovation in “color inking” is continuing as evidenced by Vivid e-ink makes ditching books a colourful choice [NewScientist, Sept 5, 2012]

… Naoki Hiji of Fuji Xerox in Kaisei, Japan, and colleagues have built a prototype system that uses tiny fluid-filled cells containing cyan, magenta, yellow and white particles to produce almost any colour.
Black-and-white e-ink displays work by having negatively charged black particles and positively charged white particles suspended in fluid inside a cell. Apply a negative electrical field to the cell, and white particles move to the top and become visible; flip the current, and black shows up.
Hiji’s display uses the same principle, but each colour particle responds to a certain intensity of electrical field, while the white particles are uncharged (see diagram). …

No problem with reading on tablets over a long period of time [Eva Siegenthaler on IFeL bloggt, Sept 20, 2012]

Tablets are not suited for reading over an extended period of time”; this statement is widespread. For example Scott Liu, head of the American-Taiwanese company E Ink Holdings, states that reading over an extended period of time on a Liquid Crystal display leads to increased visual fatigue. “The iPad is a fascinating multifunctional device, but not intended for hour-long reading” (stern.de). In comparison, E-ink readers, with their paper similar displays, are looked at as an adequate replacement for a book.
But is it true that the tablet is an inadequate device for reading over an extended period of time? Critical statements against the tablet as a replacement for the book are widespread but there is a lack of scientific evidence for these assumptions. For that reason, a study answering this question was implemented at the Institute for Research in Open- Distance- and eLearning (IFeL).
In a laboratory study, the participants read for several hours on either E-ink (Sony PRS-600) or LCD-Tablet (Apple iPad), where different measures of reading behaviour and visual strain were regularly (after each hour) recorded. These dependent measures included subjective (visual) fatigue, a letter search task, reading speed, oculomotor behaviour, and pupillary light reflex.
The results of the study show that reading on both display types is good and very similar in terms of both subjective and objective measures. Participants did not have more visual fatigue when reading on a tablet than when reading on an E-ink device. We concluded from this study that it is not the technology itself, but rather the image quality that is crucial for reading. The study shows that compared to the visual display units of past decades, recent electronic displays allow good and comfortable reading, even for extended time periods.
A few critical remarks still need to be made though. This laboratory study was conducted under artificial light conditions. Therefore it is unclear if an experiment under daylight conditions would lead to the same results. Another interesting question is how the sleep quality is influenced by different display technologies.
But still, the result of the study is an important novelty in reading research, and is opposed to many statements from publishers and subjective user self tests, that have stated that tablets are not appropriate for reading over a long period of time.
More information on the study is available online: http://onlinelibrary.wiley.com/doi/10.1111/j.1475-1313.2012.00928.x/abstract
Publication:
Siegenthaler, E., Bochud, Y., Bergamin, P. and Wurtz, P. (2012), Reading on LCD vs e-Ink displays: effects on fatigue and visual strain. Ophthalmic and Physiological Optics, 32: 367–374. doi: 10.1111/j.1475-1313.2012.00928.x
Sources:
http://www.stern.de/digital/homeentertainment/e-book-lesegeraete-die-gretchenfrage-beim-elektronischen-lesen-1596371.html

Beyond the Kindle: what the future holds for E Ink [TechRadar, Sept 10, 2012]

IN DEPTH Ereaders for classrooms, smart locks and dual screen smartphones on the cards

The ereader market has been tripling in volume since 2007 but not this year,” explained Siram Peruvemba, E Ink’s chief marketing officer, to TechRadar.
“It is partly to do with tablets but the biggest reason is that the economy is off at the moment… we have also seen not as many product launches as last year and the year before.”
“We believe that E Ink will come to home appliances. We are thinking differently – we want E Ink on every surface.
“There are a lot of dumb surfaces around and by adding the E Ink technology we can transform them, by adding a display and making them smart.
“We are going to keep going in that direction, enhancing products. Whether it is animated shelf labels, USB keys… drills.”
“We create a lot of these concepts and some of them go nowhere, while some are picked up” – the company continues to create prototypes to show how versatile E Ink technology can be.
It also seems that sometimes an E Ink device created for one specific market may take on a wholly different guise when it is finally released in the wild.

E Ink, now available in lock form

“One concept that was picked up but not how we originally intended was our E Ink lock,” said Peruvemba.
“This was originally pitched as a bicycle lock, where it could tell you if your bike was locked properly or not. It’s very low powered, just an E Ink display with a hole in the middle. But it just didn’t get picked up; no one in the bicycle world wanted it.”
“And then a company called InVue decided to take it on and use it for cabinet displays, it’s virtually indestructible so no more broken keys – alleviating a problem that retailers have with their cabinets.”
White lightning
This move away from ereaders doesn’t mean that E Ink is not innovating in the market it continues to dominate.
The latest kindle to be launched, the Kindle Paperwhite, shows that E Ink can compete with tablets when it comes to display.
Using E Ink’s Pearl technology and LED lighting it means you can use your Kindle in the dark, but still offer a screen that’s easier on the eyes – something tablets just can’t do.

E Ink makes smartphones smarter

One final place where we could see an E Ink screen is on the back of a mobile phone. Again, it’s E ink’s mantra of making a ‘dumb’ space smart. According to Peruvemba an additional screen on a mobile could be exactly what consumers need.
“Most of these mobile phones have nothing going on on the back.
“We can add another display at low cost on the back of the device and offer things like clocks, stock information.”
Peruvemba also hinted: “There are vendors looking into this technology – it is very new but typically we should see this type of concept come within the year.”
Looks like the world is going to be E Ink stained for some time to come.

E Ink Booth Tour at SID 2012 [EInkSeeMore, the official YouTube channel of E Ink, June 20, 2012]

E Ink CMO Sri Peruvemba shows new products and concepts from E Ink and their partners, including traffic lights, crosswalks, kayak and bike computers, and various signage.

E Ink at IFA 2012 [Charbax YouTube channel, Aug 31, 2012]

Sriram Peruvemba of E Ink shows the latest demonstrations for the use of E Ink on devices and signage around the world. The backs of smartphones and tablets can be an E Ink screen.

E-Ink concept double-display smartphone hands-on [SlashGear, Aug 31, 2012]

… What could a twin-screen smartphone of this sort be used for? E Ink has a few ideas, though is leaving most of that to OEMs. An ereader app is the obvious choice, though you could also show a digital boarding pass for a plane (even if you had no battery life remaining on your phone to drive the regular screen), QR codes, or mapping directions. Alternatively, the panel could be used to show promotional information, such as vouchers for nearby stores, or even sponsored messages in return for free call, message and data credit. …

E INK ANNOUNCES 2011 FINANCIAL REPORT [E Ink Holdings press release, Feb 22, 2012] Company also launches new website, www.einkgroup.com to encompass all E Ink companies

… In 2011 consolidated sales revenues totaled NT$ 38.43 billion [US$1.3 billion], a growth of 53% as compared to 2010. Profit after-tax totaled NT $6.53 billion [US$220.85 million] and EPS totaled NT$6.05, a growth of 59 percent as compared to 2010. … Scott Liu, the chairman of E Ink, said, “… in 2012 we expect to strengthen our competitiveness and continue development of both flexible and color ePaper technologies. Additionally, we expect a customer to launch a high-resolution product with touch technology within this year.”

As to market development, Liu said, “in addition to the eReader market, we are also actively expanding into the education and business markets. …”

Today E Ink also announced the launch of a new global website, www.einkgroup.com, which provides product, technology and operational information for all of the companies under the E Ink umbrella.

Sriram Peruvemba, chief marketing officer of E Ink Holdings, said: “As our businesses expand and products become diversified, we are keenly aware of the importance of integrating our internal resources globally. This is why we decided to launch einkgroup.com as the portal of E Ink Holdings around the globe. This website provides information of product and technology of E Ink Holdings, in which browsers can easily find the information they need.”

Visitors to the site will find a consolidated location to browse the technology, product offerings and company backgrounds for the organizations under the E Ink Holdings umbrella. The site will host the Investor Relations portal for E Ink Holdings, as well as sales and marketing information. In addition to their inclusion in the new website, product line websites, such as www.eink.com and www.hydis.com will continue to host information particular to their technologies and job offerings.

Shares of E Ink under pressure amid market uncertainty [Focus Taiwan of the CNA, Feb 23, 2011]

“Despite record high earnings for 2011, E Ink’s gross margin has been squeezed by price cuts by the Kindle series of e-paper devices of Amazon, which is the largest customer of the Taiwanese firm,” Mirae Asset Management analyst Arch Shih said.

“With market uncertainty expected to continue to impact product prices, I am afraid that E Ink’s profit margin will keep falling in the first quarter of this year,” he said.

In the fourth quarter of last year, E Ink’s gross margin fell 6.8 percentage points to 28.6 percent, while it posted NT$1.28 billion in net profit, or NT$1.19 per share, down from NT$2.08 recorded in the third quarter.

… “Amazon has tried its best to stage a price war in a bid to grasp a larger market share, and at the same time, it has cut contract production fees to its suppliers like E Ink,” Shih said. “This development has imposed a pressing threat to E Ink’s operations.”

“Share prices tend to reflect forward-looking prospects, so it was no surprise to see investors dumping the stock,” he went on.

E Ink said it has become very cautious about its earnings outlook for 2012 and that it is possible its sales and profit will see the largest challenge of the year in the first quarter due to slow-season effects.

Shih said the global EPD market is suffering a failure to expand content to attract buyers and that the problem is unlikely to be resolved any time soon.

“I doubt E Ink will have a quick turnaround after the first quarter. Its share price is expected to continue to be pressured,” Shih said.

E Ink reports 33.26% earnings decline [Taipei Times, Feb 23, 2011]

… The decline in profit was because of the higher shipments of fringe field switching (FFS) LCD panels, which offer lower margins than the company’s flagship product — e-paper — E Ink chairman Scott Liu (劉思誠) said at an investors’ conference yesterday. …

Liu said this year would be a “challenging year full of uncertainties,” mainly because of the possible fallout from the unresolved eurozone debt crisis.

“Clients are conservative and said the market visibility is low,” he said, adding that E Ink would no longer provide shipment targets or projections in a response to clients’ requests.

E Ink posts EPS of over NT$6 in 2011 [DIGITIMES, Feb 23, 2012]


EIH plans to launch its next-generation color e-paper products in the fourth quarter of 2012, but the company currently does not have plans to ramp up its capacity for color EPD products, Liu said.

The company is also developing flexible e-paper products, using plastic substrates instead of glass substrates used previously, with new products to be released in the third or fourth quarter, Liu revealed.

Amazon 6″ color Kindle will not be arriving this year [übergizmo, Feb 21, 2012]

Just yesterday we reported that according to Digitimes, Amazon is supposedly working on a 6” Kindle e-reader that will be utilizing colored e-ink. This rumor supposedly came about based on reports that E Ink Holdings had landed an order from Amazon for 6” color e-reader modules, but Nate Hoffelder over at The Digital Reader, who’s had a pretty decent track record when it comes to these rumors, doesn’t seem to think so.

According to Nate who contacted his source at E Ink, this is completely untrue. His source told him that if Amazon were indeed planning a color e-reader, they would only be able to start shipping them in a year’s time, because that would be how long it would take Amazon to set up a new production line for this rumored device.

He also revealed that while E Ink has been making the Triton screens for years, it has mainly been the 9.7” model and not one in the 6” variety like the rumors had suggested and can be found in the Ectaco Jetbook Color. For now it looks like if you had hopes for a 6” color Amazon Kindle e-reader this year, you could be out of luck but we’ll be keeping our eyes open either way.

End of updates

EPD maker E Ink Holdings (EIH) reportedly has landed orders for 6-inch color e-book reader modules from Amazon with shipments to begin in March, according to a Chinese-language Economic Daily News (EDN) report.

Shipments of the touched-enabled e-book reader modules are expected to top three million units a month, the paper said.

EIH is to reveal its financial results for 2011 at an investors conference on February 22, said the paper, which added that EIH is expected to report an EPS of over NT$6 (US$0.2) for the year.

At: E Ink lands 6-inch color e-book reader module orders from Amazon, says paper [Feb 20, 2012]

So, E Ink’s business seems to expand quite well along the traditional e-book reader direction. But what is the more general business direction? In this post I am giving the answer.

Before that it is also worth to go through the previous posts: E Ink Holdings EPD prospects are good [April 30, 2011 – Jan 9, 2012], Barnes & Noble NOOK offensive [May 25, 2011], E Ink and Epson achieve world-leading ePaper resolution [May 23, 2011] and Hanvon – E-Ink strategic e-reader alliance for price/volume leadership supplementing Hanvon’s premium strategy mostly based on an alliance with Microsoft and Intel [Dec 21, 2010].

The marketing idea of E Ink as a technology for all kind of smart surfaces came up in 2008 at the E Ink Corporation when it was an organization independent of any EPD panel manufacturers:

“Fashion is a key driver in today’s world,” said Sriram Peruvemba, Vice President of Marketing, E Ink Corp.E Ink offers a smart surface that changes the design and brings mobile phones to the fashion forefront of technology.”

See: E INK ANNOUNCES MOBILE PHONE DESIGN WINS IN JAPAN [July 22, 2008]

When in 2010 it was acquired by the leading EPD panel manufacturer (then called Prime View International, immediately renamed as E Ink Holdings) that idea was picked up by the new owner as well and even extended into a kind of a general vision:

“The E Ink name is synonymous with the ePaper industry that we pioneered and in which we enjoy a leadership position,” said Dr. Scott Liu, Chairman and CEO of E Ink Holdings Incorporated. “We are now a globally recognized brand name and aim to have our displays on every smart surface.”

See: PRIME VIEW INTERNATIONAL (PVI) IS NOW E INK HOLDINGS INCORPORATED [June 18, 2010]

And now at CES 2012 we had a full manifestation of that marketing concept:

E Ink On Every Smart Surface [Charbax, Jan 15, 2012]

Exclusive 17-minute interview with E Ink’s CMO at CES, where they showed me a Triton color display for signage with color so saturated that it looked like an LCD except that it was thinner than OLED, sunlight readable, uses no backlights and uses very little power. I also saw the SURF display used in a hand drill which has not been filmed before. The 11.5″ 300DPI eDocument reader made in collaboration with Epson. The Triton color display based Ectaco eReader that had just won the CES innovation award, it is being deployed in Russian schools. New E Ink watches from Phosphor and Seiko. Finally, the Eton Ruckus music player with E Ink display that was launched this week was demonstrated, it is considered to be indestructible. E Ink has shipped over 25 million E Ink screens for e-readers alone in 2011, that’s up from 10 million screens in 2010 and 4 million screens in 2009. Now E Ink is also working to expand into new markets, signage, appliances, everywhere. The idea is that more and more devices and surfaces may get an E Ink screen on them that thus by being bi-stable can show the informations for a long time without using any battery. While many electronic paper technology companies show samples, E Ink is actually in mass production with monochrome, color and segmented displays and they claim that no technology in the world comes close to the reading experience on E Ink’s displays and these displays are easy on the eyes since they don’t have a shiny background or light emitting backlight.

The above note produced by the author of video, Nicolas Charbonnier, aka Charbax, is not meant to elaborate all the talk by the Chief Marketing Officer of E Ink Holdings Sriram Peruvemba (or Sri Peruvemba). Since this post is about the strategic value proposition of E Ink I had to compose a note of my own which also corresponds to the order of presentation by Sri Peruvemba on the Charbax video:

  1. Amazon Kindle lineup, most used in the area of leasure reading.
  2. The 11.5″ 300DPI eDocument reader made in collaboration with Epson, going beyond publishing into what they are calling e-document space. Their plan is to replace electronic forms that are used by different folks with their laptops replacing printed paper, pads of paper and that sort of the things. These devices will have WiFi support, pen input and ability to edit. Some applications you may imagine are in inventory logistics, in the doctor’s office, and attorneys and other office people carrying this. They can put a number of images on them which would be very suitable for this 300DPI display, e.g. circuits, graphs, charts, maps and that sort of things. This has almost twice the resolution of the most of the other displays they are shipping which have a 167 to 200DPI resolution.
  3. With E-Ink technology they are at the point where it is better than reading on printed paper [for B/W]. Now they have pen input available on their devices thus replacing both printed paper and pen with their products. The idea here is to allow people to highlight, annotate, write notes and use it to fill-out forms. The E-Ink display would come into play during this (not the processor is the “limiting factor”) in the B/W case the native speed can be used which is 250 msec response time for the E-Ink display.
  4. Color E-Ink display based on the Triton display material. ECTACO JetBook Color, an actually shipping device is shown. It is being deployed in Russian schools as replacement for textbooks. They are still in early stages of deployment with this device but see a lot of promise in the education sector. They expect the education to be one of the largest markets for E-Ink, both the monochrome and color Trident display. A devices like this ECTACO JetBook Color is not simply replacement for textbooks but in fact it is a library. You can put a thousand books or more on any one of these devices and replacing the library. Literally every student has a library of his/her own. It also increases the interaction between the student and the teacher. Tests are created and assessed almost instantenously. Another point is that the color feature in the EPD display allows to convey more information and so students have much better learning tool than they had with printed books. Also books will never be out of the stock, there will be no late fees with the library and the content is available 24×7 etc. As far as the price of the color display is concerned the color is still based on the monochrome display, they put a color filter on top. So the color filter is an additional cost but most of the additional costs on the device itself would probably be the cost of the software (from E-Ink Holdings’ customer engineering the device) that makes the additional features of a colored device possible compared to the monochrome.
  5. Triton color display for signage (like the large billboards put on the streets) with color so saturated that it looked like an LCD except that it was thinner than OLED, sunlight readable, uses no backlights and uses very little power. This is all the result of a significant increase of the pixel size when significantly more light is coming to each pixel. They are looking at applications at signage space where you are looking at a device not from 6″ away but to a device that is 6 feets or 60 feets awaywhere the larger pixels are perfect for that.
  6. Brief showing of the SURF display (used in a hand drill shown later) just to demonstrate the display materialfor that case.
  7. The actual E-Ink display material is extremely thin and flexible like a sheet of transparency foil. This is the direction they are going to make display without glass and conform to non-flat surfaces, getting into non-publishing applicationslike signage.
  8. A concept power drill with the SURF display put on the surface as a case of showing the usefullness of an EPD display for a battery powered device when otherwise you would have no idea about whether there is enough battery power left or not. This could be quite an annoyance when you climb up a ladder and in the process you discover that the battery power to work with the drill drained down too soon. They can cut the display material in a needed shape so the display can be non-rectangular. E.g. a wrist watch is shown where the display material is round shaped. E-Ink is very unique in this respectamong the display technologies.
  9. Eton Ruckus music player with E Ink display that was launched that week was demonstrated, it is meant for outdoor applications and considered to be virtually indestructible. It combines the solar technology with the E-Ink display, and essentially all of the solar power is used to listen to music rather than showing information. Considered to be a perfect combination for applications like that and they foresee many more deployments like that in the future.
  10. A couple of wristwatches. With a segmented SURF display which is curved and in a unique shape (a Phosphor device). Then a matrix display in a Seiko watch where you can have images changedon the display.
  11. For segmented display they can go for very low volumes because that kind of display doesn’t involve fabricating the backplane in a fab. But on the other hand the matrix displays (for which much larger order volumes are required) can be made in very large sizes since they are making their display material in rolls, seven feet wide and going a kilometer long. So a lot of new applications will come up, in areas where display technology hasn’t been used before. Then their unique selling point is the ruggedness of the E-Ink display material as well.

After that it is worth to watch the following, very recent branding/directional videos from E Ink Holdings:

    • Imagine… a classroom with no paper… Build an eLearning environment
    • Imagine… a schoolbag with no book… Build an eLearning environment
    • Imagine… A ubiquitous home… Build an eLearning environment
  • E Ink – The First Law of More – Innovation:
    E Ink – More 的第一法則 [EInkSeeMore YouTube channel, Feb 17, 2012]
    • states: the more you See, the more you Do
    • … Evolution is a collaborative process …
    • We’ve teamed up with some of the best names in the electronics business like: Epson, Freescale, Marvell Semiconductor and Texas Instruments to create an electronics ecosystem that will nurture the E Ink innovations of the future.
    • We’ve joined forces with some of the most iconic brands in the world including Sony, Amazon, Barnes&Noble, Samsung, Lexar and Motorola to bring an exiting new generation of consumer products to life.
    • We believe more innovation brings more good into the world. As an 840 million dollar [US] company we intend to do everything we can to make a big difference.
  • The Second Law of More – Growth:
    E Ink – More 的第二法則 [EInkSeeMore YouTube channel, Feb 17, 2012]
    • states: the more you Do, the more you Grow
    • 100,000 displays in 2006 … over 10 million in 2010 …
    • today almost every e-book device on the market uses E Ink enabled reflective displays
    • Tomorrow we expect to lead the way in e-textbooks, providing a libray in every student’s backpack. And a few years down the road we see ourselves in signage of all shapes and sizes.
    • The next generation of E Ink applications is being developed as we speak: the paperless office, electronic toll passes, sporting goods, musical score sheets, personal medical devices, and more.
    • Look at the future from our vantage point. You’ll see why we are excited.
  • The Third Law of More – Green:
    E Ink – More 的第二法則 [EInkSeeMore YouTube channel, Feb 17, 2012]
    • states: the more you Grow, the more you Care
    • Care = Save In more ways than you can imagine
    • E-Ink display use 97% less energy than the LCD versions
    • Under normal conditions an E Ink enabled e-reader runs three weeks on a single charge. That is supposed to be a day and a half on an LCD display.
    • A recent study from the University of California Berkely shows that an E Ink enabled electronic newspaper releases 32 – 140x less CO2than its paper counterpart. What’s more, e-book saved trees by drastically reducing the consumption of paper.
    • This year sales of e-books are predicted to top 1 billion [US] dollars, more than 10x increase over last year. …

Also important to see E Ink’s video about:
How E Ink Works [EInkSeeMore YouTube channel, Oct 17, 2011]

Ever wonder how your eReader screen works? The ePaper display is made with E Ink, which is basically black and white particles inside small microcapsules. Watch to learn how E Ink technology works!

As well as another video about:
E Ink Color Triton technology [EInkSeeMore YouTube channel, Sept 23, 2011]

Watch to learn about E Ink Triton, the only commercially available color electronic paper display, and see how E Ink technology works!

Finally there are two important electronic paper product demos:
E Ink Electronic Paper Display Products [EInkSeeMore YouTube channel, Nov 7, 2011]

E Ink CMO Sri Peruvemba explains E Ink products – electronic paper displays. The displays are both monochrome (Pearl) and color (Triton), up to 300dpi high resolution, and in several sizes.

E Ink Products/Concepts Tour at FPD [EInkSeeMore YouTube channel, Nov 7, 2011]

E Ink Director of Product Management Giovanni Mancini takes us on a tour at the 2011 FPD show in Yokohama, Japan. He shows us the new all plastic eReader, E Ink and LED road sign, Epson music stand with foot pedals that turn the page, and Toppan E Ink tags that update without batteries!

Then comes:
Ectaco jetBook Color on Fox News [ECTACO YouTube channel, Jan 24, 2012]

An edited clip showing the jetBook Color on Fox News at the 2012 CES in Las Vegas. The jetBook Color was the CES 2012 Innovations Award winner.

ECTACO jetBook Color introduced in Russian Schools – цветная эл.книга [ECTACO YouTube channel, Dec 2, 2011]

PLEASE TURN ON CC [Red] FOR ENGLISH CAPTIONS Introduction of Ectaco’s groundbreaking new jetBook Color in in Public School #239, Saint Petersburg, Russia. Презентация первой в мире электронной книги ECTACO jetBook COLOR в рамках проекта “О переходе на электронное образование” в школе №239, города Санк-Петербурга, Россия. Учитель и ученики делятся своими впечатлениями от полученного опыта.

William (Bill) Wong, staff technology editor from Electronic Design – focusing on embedded, software, and systems otherwise – who is an ardent follower of E Ink’s progress. For more E Ink related information you can watch his two Engineering TV Videos and a few Electronic Design excerpts given below:

Behind the Scenes at CES 2012 – Display Technology [William Wong, Electronic Design, Jan 25, 2012]

Eink’s electronic paper display (EPD) is popular with e-readers and it has been used on other devices such as Lexar’s JumpDrive flash that shows the amount of space used on the drive. The display uses no power when not plugged in and draws only a tiny amount when updating the display. Eink was showing off color demos and EPD prototype applications. It is a technology worth investigating for embedded applications.

Cortex-A9 Incorporates Electronic Paper Display Controller [William Wong, Electronic Design, Jan 18, 2012]

E-readers with electronic paper displays (EPDs) provide an excellent reading experience. But most of these e-readers have been underpowered compared to smart phones and tablets. E-reader manufacturers try to keep costs low, which is why processor performance has been lower.

Freescale’s i.MX 6SoloLite and i.MX 6DualLite target these low-cost products with one or two 1-GHz ARM Cortex-A9 cores. Developers will have to decide whether the i.MX 6SoloLite’s 2D graphics are sufficient or if they require the 3D graphics support of the i.MX 6DualLite. Likewise, the 6SoloLite has a 32-bit DDR3 controller, while the 6DualLite has a 64-bit DDR3 controller for a higher-performance platform. Both support LP-DDR2 memory along with a range of flash memory.

The i.MX 6DualLite has a single shader, compared to the four 3D shaders found in the higher-end i.MX 6Dual and i.MX6Quad chips. The family also addresses LCD screens, so these chips may find their way into low-end tablets and embedded display devices. The i.MX 6DualLite has HDMI, low-voltage differential signaling (LVDS), and MIPI display support along with a MIPI camera interface as well. And, this chip tops the Solo with a Gigabit Ethernet port and a PCI Express x1 link.

The i.MX 6DualLite is pin-compatible with other i.MX 6 chips like the 1-GHz i.MX 6Solo, 1.2-GHz i.MX 6Dual, and 1.2-GHz i.MX6Quad. All are software compatible. Software support includes Google Android 4.0, Windows Embedded CE, QNX, Ubuntu, Linux, Linaro, and Skype.

AMD 2012-13: a new Windows 8 strategy expanded with ultra low-power APUs for the tablets and fanless clients

AMD Strategy Transformation Brings Agile Delivery of Industry-Leading IP to the Market [AMD press release, Feb 2, 2012]

At its annual Financial Analyst Day, AMD (NYSE: AMD) detailed a new “ambidextrous” strategythat builds on the company’s long history of x86 and graphics innovation while embracing other technologies and intellectual property to deliver differentiated products.

AMD is adopting an SoC-centric roadmap designed to speed time-to-market, drive sustained execution, and enable the development of more tailored customer solutions. SoC design methodology is advantageous because it is a modular approach to processor design, leveraging best practice tools and microprocessor design flows with the ability to easily re-use IP and design blocksacross a range of products.

image“AMD’s strategy capitalizes on the convergence of technologies and devices that will define the next era of the industry,” said Rory Read, president and CEO, AMD. “The trends around consumerization, the Cloud and convergence will only grow stronger in the coming years. AMD has a unique opportunity to take advantage of this key industry inflection point.  We remain focused on continuing the work we began last year to re-position AMD.  Our new strategy will help AMD embrace the shifts occurring in the industry, marrying market needs with innovative technologies and become a consistent growth engine.”

Roadmap Updates Focus on Customer Needs

Additionally, AMD today announced updates to its product roadmaps for AMD Central Processing Unit (CPU) and Accelerated Processing Unit (APU) products it plans to introduce in 2012 and 2013. The roadmap modifications address key customer priorities across form factors including ultrathin notebooks, tablets, all-in-ones, desktops and servers with a clear focus on low power, emerging markets and the Cloud.

AMD’s updated product roadmap features second generationmainstream (“Trinity”) and low-power (“Brazos 2.0”) APUs for notebooks and desktops; “Hondo,” an APU specifically designed for tablets; new CPU cores in 2012 and 2013 with “Piledriver” and its successor “Steamroller,” as well as “Jaguar,” which is the successor to AMD’s popular “Bobcat” core. In 2012, AMD plans to introduce four new AMD Opteron™ processors. For a more in-depth look at AMD’s updated product roadmap, please visit http://blogs.amd.com.

Next-generation Architecture Standardizes and Facilitates Software Development

AMD also provided further details on its Heterogeneous System Architecture (HSA), which enables software developers to easily program APUs by combining scalar processing on the CPU with parallel processing on the Graphics Processing Unit (GPU), all while providing high bandwidth access to memory at low power. AMD is proactively working to make HSA an open industry standard for the developer community. The company plans to hold its 2nd annual AMD Fusion Developer Summitin June, 2012.

New Company Structure Strengthens Execution

In conjunction with announcing its restructuring plan in November 2011, AMD has strengthened its leadership team with the additions of Mark Papermaster as senior vice president and chief technology officer, Rajan Naik as senior vice president and chief strategy officer, and Lisa Su as senior vice president and general manager, Global Business Units. These executives will help ensure that sustainable, dependable execution becomes a hallmark of AMD.

Supporting Resources

AMD started talking about ‘Trinity’ and ‘Hondo’ last summer. See in Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]


What AMD could definitely be proud of for 2011 is A “Brazos” Story: The Little Chip That Could (And Then Just Kept On Going) [AMD Fusion blog, Feb 1, 2012]:

In late 2010, AMD shipped its first-ever Accelerated Processing Units (APUs), internally codenamed “Brazos,”which combined the tremendous processing power of graphics and x86 on a single chip.

We had high expectations for the low-voltage “Brazos” APU: great computing, HD, long battery life and DirectX 11 capable graphics, all on a single chip. Yet still we were blown away by the initial industry reception. It was only a year ago we left CES with seven highly-sought after innovation and technology awardsfor the little product we ultimately named the C- and E-Series APUs, including:

After CES we should have re-nicknamed “Brazos” the “Little Chip That Could.” And all throughout 2011, “Brazos” kept on chugging. We added the “Best in Show” Award at Embedded Systems Conference and the “2011 Best Choice of Computex TAIPEI Award” to the list of accolades. In the second quarter we sold more than five million C- and E-Series APUs. What a tremendous start to a new way of processing for AMD and the industry.

But “Brazos” kept on impressing, showing up in a variety of form factorsnotebooks, netbooks, small desktops and all-in-ones– from top global OEM partners.

So it was no surprise or mistake that we ended 2011 with more than 30 million APUs shipped. It all started with little “Brazos,” which has now earned its place in history as AMD’s fastest ramping platform ever.

John Taylor, Director of Worldwide Product Marketing at AMD

CES 2012 Consumer Showcase Tour [amd, Jan 11, 2012]

Leslie Sobon of AMD talks about how APU’s help enhance your digital lifestyle in any room in of your home.
AMD Codename Decoder – November 9, 2010 [AMD Business blog]
APU
An APU is an accelerated processing unit, a new generation of processors that combine either low-power or high-performance x86 CPU cores with the latest GPU technology (such as DirectX® 11) on a single die.
Planned for introduction: Q1 2011
“Bobcat”
Market: Multiple devices, including notebooks ultrathins, HD netbooks and small form factor desktops.
What is it? A sub-one watt capable x86 CPU core that first comes to market in the “Ontario” and “Zacate” Accelerated Processing Units (APU) for mainstream, ultrathin, value, and netbook form factors as well as small form factor desktop solutions. “Bobcat” is designed to be an extremely small, highly flexible, out-of-order execution x86 core that easily can be scaled up and combined with other IP in SoC configurations.
Planned for introduction: Q1 2011
“Brazos”
Markets: Value Mainstream Notebooks, HD Netbooks and Small Form Factor Desktops
What is it? “Brazos” is AMD’s 2011 low-power platform, available with two APUs; “Zacate” – currently planned to be marketed as the E Series – is an 18-watt TDP APU for ultrathin, mainstream and value notebooks as well as desktops and all-in-ones. “Ontario” – currently planned to be marketed as the C Series – is a 9-watt
APU for netbooks and small form factor desktops and devices. Both “Brazos” platform APUs include a DirectX® 11-capable GPU.
Planned for introduction: Q1 2011
“Bulldozer”
Market: Server and Client
What is it? A multi-threaded high-performance x86 CPU core contained in the “Zambezi” processor for client PCs and “Interlagos” and “Valencia” processors for servers. Included in the “Scorpius” enthusiast desktop PC platform and “Maranello,” “Adelaide,” and “San Marino” server platforms, “Bulldozer” is designed to be a completely new, high performance architecture that employs a new approach to multithreaded compute performance for achieving advanced efficiency and throughput. “Bulldozer” is designed to give AMD an exceptional CPU option for linking with GPUs in highly scalable, single-chip APU configurations. “Bulldozer” offers AMD another exceptional CPU option for combining with GPUs in highly scalable, single chip APU configurations, beginning in 2012 APU designs.
Planned for introduction: Client (1H 2011); Server (2H 2011)
“Llano”
Market: Notebooks and Desktops
What is it? Part of the “Sabine” platform, “Llano” is a 32nm APU including up to four x86 cores and a DirectX® 11-capable GPU, primarily intended for performance and mainstream notebooks and mainstream desktops. “Llano” is engineered to deliver impressive visual computing experiences, outstanding performance with low power and long battery life.
Planned for introduction: Mid-2011
“Ontario”
Market: Primarily ultrathin notebooks and HD netbooks
What is it? A 9W APU featuring dual or single “Bobcat” x86 cores currently planned to be marketed as the C Series, and primarily intended to serve the low power and highly portable PC markets for netbooks and small form factor desktops and devices.
Planned for introduction: Q1 2011
“Zacate”
Market: Notebook/Desktop
What is it? “Zacate” is AMD’s 18W APU designed for the mainstream notebook and desktop market. Zacate will feature low-power “Bobcat” CPU cores and support DirectX 11 technology.
Planned for introduction: Q1 2011

More information about 2011 AMD APU past on this blog:
Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]
Supply chain battles for much improved levels of price/performance competitiveness [Aug 16, 2011]
Acer & Asus: Compensating lower PC sales by tablet PC push [March 29 – Aug 2, 2011]
CES 2011 presence with Microsoft moving to SoC & screen level slot management that is not understood by analysts/observers at all [Jan 7, 2011]
Changing purchasing attitudes for consumer computing are leading to a new ICT paradigm [Jan 5, 2011]


AMD 2012 APU, code name “Trinity” [amd, Jan 11, 2012]

From the Technology Showcase at CES, John Taylor discusses the next-generation AMD APU, code name “Trinity”, and it’s benefits.

AMD started talking about ‘Trinity’ last summer. See in Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]

Advanced Micro Devices’ CEO Discusses Q4 2011 Results – Earnings Call Transcript [Seeking Alpha, Jan 24, 2012]

We are seeing particularly strong customer interest in our expanded low-power APUs for 2012. The low-power versions of our next-generation chip, Trinity APU, delivers mainstream performance while using half the power of our traditional notebook processor. This processor fits into an ultrathin notebook design, as thin as 17 millimeters, providing industry-leading visual performance and battery life at very attractive price points. Trinity remains on track to launch for midyear.

We achieved record quarter client revenue driven by an increase in supply of Llano APUs. And in Q4 of 2011, APUs accounted for nearly 100% of mobile microprocessors shipped and more than 60% of the total client microprocessors shipped. Microprocessor ASP increased sequentially due to an increase in mobile microprocessor ASP and an increase in server units shipped.

Question-and-Answer Session

There is no doubt that the customer acceptance of our APU architecture is quite strong. We’ve now shipped over 30 million of these APUs to date. And we’re seeing a strong uptake in terms of that architecture, what it means to the customer. They are looking for a better experience, and I think that’s a key reason why we’ve seen the momentum in our business and the ability to deliver on that. Our focus on execution around the APUs and around Llano is definitely paying off. And I think as we move forward, we should be able to continue to build on that momentum.

We’ve actually increased our Llano 32-nanometer product delivery by 80% from the third quarter, and now Llano makes up almost 60% of the mobile microprocessing revenue. … We’re going to continue to build on the strong relationships that we’ve been developing with GLOBALFOUNDRIES as we move forward.

The movement to thin and light is nothing new. Customers want mobility. And the idea of ultrathin is something that we’re very focused on. And if you think about it with our APU strategy that I mentioned, with the next-generation product, Trinity APU, we already are well ahead of the pace last year when we set a record-setting year for design wins with the Trinity product in 2012. With that product, we can deliver ultrathin in the range of 17 millimeters. And what’s really important and I think we have to all focus on is ultrathin and mobility, the ability for computing to reach customers across the planet. … And I’ll add that the improvements that we’ve made in Trinity in both our CPU and the GPU are really delivering outstanding results in performance per watt. So as well for the ultrathins being able to hit the 17-millimeter low-profile, we’re also getting a doubling of the performance per watt. So it’s an exciting application of our APU technology.

… as you think of the industry trends around consumerization, cloud and convergence, there’s no doubt, as we’ve seen these kinds of inflection points in the industry, there’s always a significant downward pressure in terms of the price points. So if you’re dragging huge asset base along with you and there comes pressure into the market around those price points, that could put pressure into their [Intel’s] — into a business model. … We think the emerging market and the entry — and the high-growth markets around entry and mainstream will be the hottest segment, and I think that’s playing to our hand. We’re going to emphasize this strategy. We want to embrace this inflection point that’s emerging. We want to accelerate it, because shift happens when there’s these inflecting points.

Of course, we see the investment of our competitor, but the fabless ecosystem is not sitting still. And if you look at the investments that are done on their — TSMC, at a GLOBALFOUNDRIES and a GLOBALFOUNDRIES and alliances level, then the numbers are very comparable. GLOBALFOUNDRIES and their partnership models invest about $9 billion this year. TSMC seeds around $6 billion, if I recall the number correctly. So this is, in terms of scale and absolute numbers, are very comparable to what Intel is putting on the table.

… I feel pretty good about where we are in terms of the transition around 32 nm. … And I want to emphasize, we’ve made real progress, but we’re not finished with that. And we need to continue to work every day with those tiger teams we’ve put in place. We’re tracking the test vehicles through the lines to make sure that we’re getting that consistent improvement, because that will reduce our consumption of wafers and give us far more flexibility in our supply chain. So while we have improved by 80% from the third quarter, we’re not all the way there yet … there’s more yield improvements possible on that 32-nanometer line. … And those same techniques and practices that the teams — the tiger teams applied on 32-nanometer, that momentum continues in the 28-nanometer. And so that poises us well going into the coming 2012.

… I think it’s fair to say from the improvements we have seen and the — and our foundry partners that we are not going to be supply-constrained in the first quarter. … I think the progress we have seen on Trinity has impressed us. And of course, all the learnings that have been done on 32-nanometer with the Llano product will be transferred to Trinity. So the start-off pace with Trinity is going to be significantly better from a yield perspective compared to where we were at Llano launch. So that makes us quite optimistic looking forward.

Here are also a couple of illustrations highlighting that 2011 APU success with the details of new APU strategy additions from Lisa Su‘s (Senior Vice President and General Manager, Global Business Units) presentation for the 2012 Financial Analyst Day held on February 2, 2012 (see her full presentation in PDF):

APUs BRING LEADERSHIP GRAPHICS/COMPUTE IP TO MAINSTREAM [#10]

image2011: AMD first to introduce heterogeneous computing to mainstream applications

“Llano” APU offers nearly 3X the performance in the same power envelope over conventional CPUs (2)

Fully leverages the growing ecosystem of GPU-accelerated apps

Source: AMD Performance labs
(1) Testing performed by AMD Performance Labs. Calculated compute performance or Theoretical Maximum GFLOPS score for 2013 Kaveri (4C, 8CU) 100w APU, use standard formula of (CPU Cores x freq x 8 FLOPS) + (GPU Cores x freq x 2 FLOPS). The calculated GFLOPS for the 2013 Kaveri (4C, 8CU) 100w APU was 1050. GFLOPs scores for 2011 A-Series “Llano” was 580 and the 2013 [2012] A-Series “Trinity” was 819. Scores rounded to the nearest whole number.
(2) Testing performed by AMD Performance Labs. Calculated compute performance or Theoretical Maximum GFLOPS score (use standard formula of CPU Cores x freq x 8 FLOPS) for conventional CPU alone in 2011 was 210 GFLOPs while the calculated GFLOPs for the 1st Gen APU using standard formula (CPU Cores x freq x 8 FLOPS) + (GPU Cores x freq x 2 FLOPS) was 580 or 2.8 times greater compute performance.

Related new codenames (from the AMD provided At-a-Glance Codename Decoder [Feb 2, 2012]):

“Trinity” APU (Traditional Notebooks, Ultrathin Notebooks and Desktops)

  • “Trinity” is AMD’s second generation APU and improves the power and performance of AMD’s A-Series APU lineup for mainstream and high-performance notebooks and desktops. “Trinity” will feature next-generation “Piledriver” CPU cores and new, DirectX® 11-capable, second generation AMD Radeon™ HD 7000 series graphics.
  • New for 2012, AMD will offer a BGA or pin-less format, low power “Trinity” APU specifically designed for ultrathin notebooks.
  • Planned for introduction: Mid-2012

“Piledriver” Core Micro Architecture

  • “Piledriver” is the next evolution of AMD’s revolutionary “Bulldozer” core architecture.
  • The “Trinity” line-up of APUs will be the first introduction of “Piledriver.”

“Kaveri” APU (Notebooks and Desktops)

  • “Kaveri” is AMD’s third generation APU for mainstream desktop and notebooks.
  • These APUs will include “Steamroller” cores, and new HSA-enabling features for easier programming of accelerated processing capabilities.
  • Planned for introduction: 2013

“Steamroller” Core Micro Architecture

  • “Steamroller” is the evolution of AMD’s “Piledriver” core architecture.

AMD OPTERON™ FUTURE TECHNOLOGY [#26]

image

Additional new codename (from the AMD provided At-a-Glance Codename Decoder):

“Excavator” Core Micro Architecture

  • “Excavator” is the evolution of AMD’s “Steamroller” core architecture.

APU ADOPTION: RECORD DESIGN WINS, STRONG END-USER DEMAND [#11]

image

Shipped > 30m APUs to date

11 of the world’s top 12 OEMs shipping AMD APU-based platforms

“Brazos” APUs shipped more units in its first year than any previous mobile platform in AMD history

“Llano” APUs ramped to represent nearly 60% of mobile processor revenue by Q4 2011

image

Additional new codenames (from the AMD provided At-a-Glance Codename Decoder):

“Southern Islands” Discrete Graphics

  • Internal codename for the entire family of desktop graphics ASICs based on Graphics Core Next architecture and utilizing 28nm process technology.
  • “Southern Islands” products include “Tahiti” (AMD Radeon™ HD 7900 series), “Pitcairn,” “Cape Verde” and “New Zealand.”

“Brazos 2.0” APU (Essential Desktop and Notebook, Netbook, All-In-One and Small Desktop)

  • The “Brazos 2.0” family of APUs will follow “Brazos”, AMD’s fastest ramping platform ever.
  • In addition to increased CPU and GPU frequencies, “Brazos 2.0” will offer additional features and functionality as compared to “Brazos”.
  • Planned for introduction: H1 2012

“Hondo” APU (Tablet)

  • “Hondo” is AMD’s sub-5W APU designed for tablets. “Hondo” will feature low-power “Bobcat” CPU cores and support DirectX® 11 technology in a BGA or pin-less format.
  • Planned for introduction: H2 2012

AMD started talking about ‘Hondo’ (as well as ‘Trinity’) last summer. See in Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]

image
(3) Projections and testing developed by AMD Performance Labs. Projected score for 2012 AMD Mainstream Notebook Platform “Comal” on the “Pumori” reference design for PC Mark Vantage Productivity benchmark is projected to increase by up to 25% over actual scores from the 2011 AMD Mainstream Notebook Platform “Sabine”. Projections were based on AMD A8/A6/A4 35w APUs for both platforms.
(4) Projections and testing developed by AMD Performance Labs. Projected score for the 2012 AMD Mainstream Notebook Platform “Comal” the “Pumori” reference design for 3D Mark Vantage Performance benchmark is projected to increase by up to 50% over actual scores from the 2011 AMD Mainstream Notebook Platform “Sabine”. Projections were based on AMD A8/A6/A4 35w APUs for both platforms.
(5) Testing performed by AMD Performance Labs. Battery life calculations using the “Pumori” reference design based on average power draw based on multiple benchmarks and usage scenarios. For Windows Idle calculations indicate 732 minutes (12:12 hours) as a resting metric; 421 minutes (7:01 hours) of DVD playback on Hollywood movie, 236 minutes (3:56 hours) of Blu-ray playback on Hollywood movie, and 205 minutes (3:25 hours) using 3D Mark ‘06 as an active metric.
Projections for the 2012 AMD Mainstream Platform Codename “Comal” assume a configuration of “Pumori” reference board, Trinity A8 35W 4C – highest performance GPU, AMD A70M FCH, 2 x 2G DDR3 1600, 1366 x 768 eDP Panel / LED Backlight, HDD (SATA) – 250GB 5400rpm, 62Whr Battery Pack and Windows 7 Home Premium.

image

image

image

Additional new codenames (from the AMD provided At-a-Glance Codename Decoder):

“Sea Islands” Graphics Architecture

  • New GPU Architecture and HSA Features
  • Planned for introduction: 2013

“Kabini” APU (Essential Desktop and Notebook, Netbook, All-In-One and Small Desktop)

  • The “Kabini” APU is AMD’s second generation low-power APU and follow-on to “Brazos 2.0.”
  • In addition to new “Jaguar” cores, these APUs will be enhanced with new Heterogeneous Systems Architecture (HSA), enabling features for easier programming of accelerated processing capabilities.
  • Planned for introduction: 2013

“Temash” APU (Tablet and Fanless Client)

  • The “Temash” APU is AMD’s second generation tablet APU and follow-on to “Hondo.”
  • In addition to new “Jaguar” cores, these APUs will be enhanced with new Heterogeneous Systems Architecture-enabling features for easier programming of accelerated processing capabilities.
  • Planned for introduction: 2013

“Jaguar” Core Micro Architecture

  • “Jaguar” is the evolution of AMD’s “Bobcat” core architecture for low-power APUs.

MOBILE MARKET PROJECTIONS [#29]                             AMD Direction:

imageFocus on true productivity and user experience in ultra-low power devices

Leadership graphics, web applications and video processing leveraging APUs

Agile, flexible SoC designs

Ambidextrous solutions across ISAs and ecosystems

Fanless, sealed designs


These APU related strategic moves have been summarized by the same John Taylor as Strengthening our Client Roadmap [AMD Fusion blog, Feb 2, 2012]:

Roadmaps signify our plans to customers and business partners, outlining the new products and technologies that we are bringing online. In an ideal world plans would never change. But in reality, change is a certainty in the tech industry – new form factors immerge, technologies and applications shift and consumer tastes remake technology plans.

Like any technology company, AMD desires to anticipate change in the industry. So we course-correct as we work with customers to ensure that we create products that address the optimal blend of timing, features and performance, cost and form factors.

Today at our Financial Analyst Day in Sunnyvale, AMD senior staff detailed how AMD will focus its investments in R&D and marketing going forward, including roadmaps for 2012-2013. As Phil Hughes summarized, the announced roadmaps are designed to extend platform longevity, accelerate time to market and enhance performance and features. These roadmaps strengthen AMD’s ability to make the most of shifting market dynamics, all the while giving stand-out experience across device categories through our graphics and video IP. This blog provides some insight into our 2012 and 2013 roadmaps – the words in quotes are the codenames for the particular AMD processor offerings discussed today.

2012 Client Roadmap

AMD’s “Brazos 2.0” Accelerated Processor Unit (APU) family will be used for essential desktop and notebook, netbook, tablet, all-in-one and small desktop form factors. This allows us to address a fast-growing segment of the PC market where we have proven success with the original “Brazos” line-up – the C-Series, E-Series and Z-SeriesAPUs. We will add plenty of new features to the “Brazos 2.0” APU family, including increased CPU and GPU performance, longer battery life, a bevy of integrated I/O options and improvements to AMD Steady Video technology. “Brazos 2.0” is scheduled to hit the market in the first half of 2012.

As we demoed at CES, AMD’s “Trinity” APU for desktop and notebook remains on track for introduction in mid-2012, with plans to pack up to four “Piledriver” CPU cores and next-generation DirectX® 11-capable graphics technology, together delivering up to 50% more compute performance than our “Llano” offerings, including superior entertainment potential, longer battery-life and an even more incredibly brilliant HD visual experience.

New for 2012, AMD will introduce a low voltage “Trinity” APU that will be ideal for the next-generation of ultrathin notebook. This “Trinity” APU matches the experience enabled by the AMD 2011 APU in up to half the TDP. As we said, “Trinity” is on track for introduction in mid-2012.

In 2012 we will also introduce the ultra-low voltage “Hondo” APU for tablets. These low-power (power maxes out at 5W TDP) APUs will have “Bobcat” CPU cores and support DirectX 11 technology in a BGA or pin-less, thin processor package. Look for these in the second half of 2012 – more details to come later.

On the desktop platform side of things, the “Vishera” CPU will replace the “Komodo” CPU for desktop. This change enables accelerated time to market for improved performance and next-generation CPU features while maintaining the existing AM3+ motherboards. The “Vishera” CPU ushers in many exciting updates, includes 8 “Piledriver” cores, and when compared with the previous generation, provides higher frequencies, improved instruction per clock performance, advanced instruction sets (thus increasing application performance), additional DDR3 memory support and next-generation AMD Turbo Core Technology. We plan to launch “Vishera” in the second half of 2012.

2013 Client Roadmap

2013 brings major evolution to the client roadmaps as the vision presented by Rory, Mark and Lisa today begin to manifest – including moving our low power APUs to a system on a chip (SoC) design with the AMD Fusion Controller Hub integrated right into a single chip design.

In the performance APU category our third-generation APU, “Kaveri,”will employ “Steamroller” (the evolution of AMD’s “Piledriver” core architecture) x86 cores for enhanced instructions per clock and power advantages. Applications that take advantage of GPU accelerate will give users an amazing experience thanks to our Graphics Core Next and new Heterogeneous Systems Architecture (HSA) enabling features for easier programming of accelerated processing capabilities.

In the low power category, the “Kabini” SoC APU takes over for “Brazos 2.0.” This second generation low power APU integrates “Jaguar” x86 cores for augmented performance and energy efficiency. These APUs will also benefit from select HSA features and functionality.

We keep on innovating for the ultra-low power space in 2013. Our second generation, ultra-low-power “Temash” SoC APU will follow “Hondo” for tablet and other fanless form factors. This APU will also leverage the “Jaguar” low-power x86 cores and HSA features.

We at AMD strongly believe these roadmap updates help us time new product introductions with customer design phases to hit key sales cycles across a range of form factors and experiences. We are moving with the market and on the path to deliver exceptional productivity and user experience in a wide array of form factors.

John Taylor, Director of Worldwide Product Marketing at AMD

He also provided the following answers to questions regarding how AMD spells out Windows 8 tablet strategy [CNET, Feb 2, 2012]:

Q: Before, we go to Windows 8, what is your smartphone strategy, if any?
Taylor: The smartphone market is eight, nine, ten, maybe a dozen players. [They have] lower ASPs (average selling price), lower [profit] margins, different competitive dynamic. So, there is no shift on the smartphone strategy.

And Window 8?
Taylor: But you will see much more focus on tablets, the convertible or hybrid devices that fit between tablets and notebooks, very thin [designs].

What chips exactly will get you there?
Taylor: For tablets, it will decidedly be the Hondo chip. We’re acknowledging that we still have a couple of watts to shave off to really be a more ideal tablet platform (to achieve optimal power efficiency). But we think that Temash gets us much, much closer to that in 2013.

And Windows 8 convertibles?
A 17-watt [power consumption] is the lowest that we’ll offer. That’s called Trinity. It will be unmatched in that [17-watt design] space. Discrete graphics-like performance. All types of dedicated video processing capabilities, better battery life than the competition. And all of these ways that we’re driving the new generation of accelerated applications. If you think about the Web apps that are being built for Win 8, using HTML5 and the graphics enginethat drives that higher level experience.

I will add to that the following two illustrations from the AMD Product and Technology Roadmaps[AMD FAD, Feb 2, 2012]:
image

“Vishera” CPU (Desktop)

  • The “Vishera” desktop CPU incorporates up to eight “Piledriver” cores, advanced instruction sets and other performance enhancing additions
  • This next-generation CPU will maintain the AM3+ infrastructure.
  • Planned for introduction: H2 2012

image


In addition to the above described expansion of the original APU strategy for the clients there is a kind of naming change with AMD Fusion System Architecture is now Heterogeneous Systems Architecture [AMD Fusion blog, Jan 18, 2012]

Since its introduction to the public in June 2011 at the AMD Fusion11 Developer Summit, the AMD Fusion System Architecture (FSA) has received widespread support and interest from our business partners and technology industry leaders. FSA was the blueprint for AMD’s overarching design for utilizing CPU and GPU processor cores as a unified processing engine, which we are making into an open platform standard. This architecture enables many benefits, including high application performance and low power consumption.

Our software partners are already taking advantage of the power and performance advantage of APU and GPU acceleration, with more than 200 accelerated applications shipped to date. The combination of industry standards like OpenCL and C++ AMP, alongside FSA, is ushering in the era of heterogeneous computing.

Together with these software partners, we have built a heterogeneous compute ecosystem that is built on industry standards. As such, we believe it’s only fitting that the name of this evolving architecture and platform be representative of the entire, technical community that is leading the way in this very important area of technology and programing development.

FSA will now be known as Heterogeneous Systems Architecture or HSA. The HSA platform will continue to be rooted in industry standards and will include some of the best innovations that the technology community has to offer.

Manju Hegde and I will be hosting a breakout session on HSA at AMD’s Financial Analyst Day on February 2nd 2012, which will be webcast live here.  More information on the latest advances in HSA design will be released at a future date.

Also, if you haven’t already made plans to attend the AMD Fusion12 Developer Summit in June 2012 in Bellevue, Washington, I encourage you to save the date. Leaders from the technology and programming development communities will converge at the summit to discuss Heterogeneous Computing and the next-generation user experiences that are enabled by this platform.

Phil Rogers, corporate fellow at AMD.

From the Analyst Day breakout session presentation I will include the following illustrations here as the food for thoughts and further interests:

image

image

image

image

For Windows 8 related HSA, “C++ AMP” (indicated on the last illustration) is worth to expand on via Introducing C++ Accelerated Massive Parallelism (C++ AMP) [MSDN Blogs, June 15, 2011]

A few months ago, Herb Sutter told about a keynote he was to delivered today in the AMD Fusion Developer Summit (happening these days). He said by then:

“Parallelism is not just in full bloom, but increasingly in full variety. We know that getting full computational performance out of most machines—nearly all desktops and laptops, most game consoles, and the newest smartphones—already means harnessing local parallel hardware, mainly in the form of multicore CPU processing. (…) More and more, however, getting that full performance can also mean using gradually ever-more-heterogeneous processing, from local GPGPU and Accelerated Processing Unit (APU) flavors to “often-on” remote parallel computing power in the form of elastic compute clouds. (…)”

In that sense, S. Somasegar, Senior Vice President of the Developer Division made this morning the following announcement:

“I’m excited to announce that we are introducing a new technology that helps C++ developers use the GPU for parallel programming. Today at the AMD Fusion Developer Summit, we announced C++ Accelerated Massive Parallelism (C++ AMP). (…) By building on the Windows DirectX platform, our implementation of C++ AMP allows you to target hardware from all the major hardware vendors. (…)”

C++ AMP, as Soma tells in his post, is actually an open specification. Microsoft will deliver an implementation based on its Windows DirectX platform (DirectCompute, as Daniel Moth specifies in a later posta few minutes ago).

Daniel added that C++ AMP will lower the barrier to entry for heterogeneous hardware programmability, bringing performance to the mainstream. Developers will get an STL-like library as part of the existing concurrency namespace (whose Parallel Patterns Library –PPL and its Concurrency Runtime –ConcRT are also being enhanced in the next version of Visual C++ –check references at the end of this post for further details) in a way that developers won’t need to learn a different syntax, nor using a different compiler.

Update (6/16/2011): “Heterogeneous Parallelism at Microsoft, the keynote where Herb Sutter and Daniel Moth introduced this technology with code and graphic demos is available for on-demand watching.

Update (6/17/2011): Daniel Moth’s session “Blazing-fast Code Using GPUs and More, with C++ AMP” is available as well! Beside, Dana Groff tells what’s new in Visual Studio 11 for PPL and ConcRT.

Pedal to the metal, let’s go native at full speed!

References:

  1. S. Somasegar’s announcement: http://blogs.msdn.com/b/somasegar/archive/2011/06/15/targeting-heterogeneity-with-c-amp-and-ppl.aspx
  2. Daniel Moth’s blog post: http://www.danielmoth.com/Blog/C-Accelerated-Massive-Parallelism.aspx
  3. Herb Sutter’s keynote at the AMD Fusion Developer Summit: http://channel9.msdn.com/Events/AMD-Fusion-Developer-Summit/AMD-Fusion-Developer-Summit-11/KEYNOTE
  4. Daniel Moth: Blazing-fast Code Using GPUs and More, with C++ AMP (session presented at AMD Fusion Developer Summit): http://channel9.msdn.com/Events/AMD-Fusion-Developer-Summit/AMD-Fusion-Developer-Summit-11/DanielMothAMP
  5. Announcing the PPL, Agents and ConcRT efforts for Visual Studio 11, by Dana Groff: http://blogs.msdn.com/b/nativeconcurrency/archive/2011/06/16/announcing-the-ppl-agents-and-concrt-efforts-for-v-next.aspx
  6. AMD Fusion Developer Summit Webcasts: http://developer.amd.com/afds/pages/webcast.aspx

With that in mind the upcoming 2012 AMD Fusion Developer Summit will definitely bring quite important updates as promised by the last breakout session illustration:

image
More on that: Adobe and Cloudera among Keynotes at AMD Fusion12 Developers Summit [AMD Fusion blog, Feb 3, 2012]


Finally, regarding the ‘ambidextrous’ strategy mentioned in the first sentence of the press release:

  1. ‘ambidextrous’ generally means ‘very skillful and versatile’ coming from ‘able to use the right and the left hand with equal skill’
  2. it is described in the press release as:
  3. adopting an SoC-centric roadmap designed to speed time-to-market, drive sustained execution, and enable the development of more tailored customer solutions. SoC design methodology is advantageous because it is a modular approach to processor design, leveraging best practice tools and microprocessor design flows with the ability to easily re-use IP and design blocks across a range of products. …

  4. and detailed in Mark Papermaster‘s (Senior Vice President and Chief Technology Officer) presentation for the 2012 Financial Analyst Day held on February 2, 2012 (see his full presentation in PDF) via the following illustrations:

image
as the Go-to-market approach together with ODM / OEM relationships

image
specifically highlighting the differentiation with it for the datacenter
image
related to MDC [Multi-DataCenter] workloads and HSA.

But also mentioning it in more generic terms as:
image
”Flexible around ISA [Instruction Set Architecture]” and
“Flexible around combination of AMD IP and third party IP”

Which caused probably the biggest interest and questions among participating analysts what made even The Wall Street Journal to report as AMD Will Incorporate Others’ Technology in Its Chips [Feb 3, 2011]:

Advanced Micro Devices Inc., the microprocessor maker whose fortunes have long been closely tied to the same technology as bigger rival IntelCorp., is planning a more flexible future.

The company on Thursday said it may pursue what it calls an “ambidextrous” strategy that would allow it to offer chips that include circuitry developed by other companies as well as its own. One obvious option would be low-power microprocessor technology from ARM HoldingsPLC that now dominates chip markets for cellphones and tablet computers.

AMD Chief Executive Rory Read, at a meeting with analysts here and in a subsequent interview, stopped short of saying that AMD would definitely add ARM-based technology to its chips in the future. But he noted that the company is laying the technical groundwork for modular chips that could accept blocks of circuitry developed by ARM as well as other companies.

“We have a relationship with ARM, and we will continue to build on it,” Mr. Read said in an interview. “We will continue to evolve that relationship as the market continues to evolve.”

Such possibilities are a sign of how the exploding market for mobile devices is causing many companies to alter their strategies. The x86 design used by AMD and Intel is the foundation of virtually all personal and most server computers.

But the two companies have struggled to make headway in the mobile-device market, in large part because of the lower power consumption of ARM-based designs. Meanwhile, ARM licensees—which include Qualcomm Inc., Texas Instruments Inc. and Nvidia Corp.—are adding to the pressures by edging toward the PC market, as MicrosoftCorp. finishes development of a new operating system that supports ARM and x86 chips.

AMD’s management team, in a meeting with analysts here, took pains to dispute the notion that AMD may become marginalized as ARM-powered competitors enter the PC market. Rather, they argued, AMD’s strength in graphics and microprocessors—and a strategy of customizing chips for large customers—will expand AMD’s opportunities.

Indeed, Mr. Read argued, it is Intel’s outsize influence of the tech industry that will tend to decline. “We will see the breakdown of proprietary control points,” Mr. Read said.

Though Mr. Read didn’t commit to embracing ARM’s designs, others who heard his presentation said the direction is clear. “AMD was very deliberate today about their goal to integrate more third-party intellectual property,” said Patrick Moorhead, a former AMD vice president and now principal analyst at Moor insights & Strategy. “Nothing they communicated excluded the potential for ARM.”

AMD’s remarks also underscore an industry shift—driven largely by the mobile market—away from separate chips and toward multi-function products that the industry calls SoCs, for systems on a chip, which save space and power in mobile devices and other hardware.

Intel and AMD have begun offering SoCs for laptop computers. But AMD discussed extensive plans to create more such products at a faster rate, using a flexible design scheme that can accommodate technology submitted by other companies.

Mr. Read, who previously served as a senior executive at PC maker Lenovo GroupLtd., has recruited others that also worked at IBM and have experience with other chip technologies than x86.

One is Mark Papermaster, AMD’s senior vice president and chief technology officer, who worked at Apple Inc. and Cisco Systems Inc. after leaving IBM in 2008. Another is Lisa Su, a senior vice president and general manager of AMD’s global business units, who most recently worked at Freescale Semiconductor HoldingsLtd., an ARM user.

Ms. Su gave an updated road map for a series of future chips, including products that AMD expects to be used in tablets that are powered by Microsoft’s forthcoming Windows 8 operating system. But Mr. Read said AMD would likely stay away from trying to sell chips for smartphones soon, characterizing the market as too crowded with competitors.