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NVIDIA Tegra 3 and ASUS Eee Pad Transformer Prime

Follow-up: Kindle Fire with its $200 price pushing everybody up, down or out of the Android tablet market [Dec 8, 2011]

Update: ASUS introduces [i.e. making available] the Eee Pad Transformer Prime with NVIDIA® Tegra® 3 Quad-Core Processor and Google® Android™ 4.0 Ice Cream Sandwich [ASUS press release, Dec 1, 2011]

Meet the ASUS Eee Pad Transformer Prime, the world’s first quad-core tablet. – Incredibly beautiful with a spun aluminum finish and measuring in at 8.3mm thin and 586g light. – Ultra performance with NVIDIA® Tegra® 3 quad-core processor, with 18 hours of battery life and upgradable to AndriodTM 4.0 Ice Cream Sandwich. – Amazing 8MP camera with LED flash and large F2.4 aperture. – Super IPS+ panel with 178° viewing angle and 600 nits display for outdoor enjoyment. – Supreme sound powered by ASUS SonicMaster Technology. ASUS exclusive application combined with the above makes the Transformer Prime the most powerful tablet ever.

Update: Nvidia Tegra 3 to challenge shipments of 25 million units in 2012 [Dec 2, 2011]

Nvidia is set to challenge to ship 25 million Tegra 3 processors for use in smartphones, tablet PCs and automobiles in 2012 as the company is unlikely to be able to achieve the same shipment goal for its Tegra 2 in 2011, according to industry sources.

Despite that Tegra 2 successfully landed orders from Motorola, LG Electronics, Samsung Electronics, Asustek Computer and Acer, because the chip was not able to gain enough share from the smartphone market, which is currently dominated by Qualcomm, while shipments of non-Apple tablet PCs, which Tegra 2 accounts for 75% of the volume, are limited, Nvidia’s goal of shipping 25 million Tegra 2 chips in 2011 will not be able to be realized, the sources noted.

Although Nvidia still faces strong competition from players such as Qualcomm and Texas Instruments, the company with its advances with the Tegra 3 processor will try to challenge the same shipments goal in 2012 and is eying Windows on ARM (WOA) in 2013 to achieve further growth.

Currently, there are 11 smartphones that have adopted Tegra 2 including Motorola’s Artix, LG’s Optimus 2X and Samsung’s Galaxy R. Meanwhile, there are 23 tablet PCs with Tegra 2 including Samsung’s Galaxy Tab 10.1, Asustek’s Eee Pad Transformer and Acer’s S3.

Tablet Specification Comparison (source: Anandtech)

  ASUS Eee Pad Transformer ASUS Eee Pad Transformer Prime Apple iPad 2 Samsung Galaxy Tab 10.1
Dimensions 271mm x 175mm x 12.95mm 263 x 180.8 x 8.3mm 241.2 x 185.7 x 8.8mm 256.6 x 172.9 x 8.6mm
Display 10.1-inch 1280 x 800 10.1-inch 1280 x 800 Super IPS+ 9.7-inch 1024 x 768 IPS 10.1-inch 1280 x 800 PLS
Weight 675g 586g 601g 565g
Processor 1GHz NVIDIA Tegra 2 (2 x Cortex A9) 1.3GHz NVIDIA Tegra 3 (4 x Cortex A9) 1GHz Apple A5 (2 x Cortex A9) 1GHz NVIDIA Tegra 2 (2 x Cortex A9)
Memory 1GB 1GB 512MB 1GB
Storage 16GB + microSD card 32GB/64GB + microSD slot 16GB 16GB
Pricing $399 $499/$599 $499 $499

ASUS Eee Pad Transformer Prime – All Details and Specifications [Nov 8, 2011]

ASUS Eee Pad Transformer Prime – http://www.netbooknews.com/38965/asus-eee-pad-transformer-prime-full-details/ – Check out the ASUS Eee Pad Transformer Prime, the very first quadcore tablet running on the new NVIDIA Tegra 3 platform

ASUS Announces the Eee Pad Transformer Prime [ASUS US press release, Nov 8, 2011]

ASUS officially announces the world’s first tablet with the NVIDIA® Tegra® 3 quad-core processor – the ASUS Eee Pad Transformer Prime. Cooperatively working with NVIDIA® to launch the first quad-core tablet in the world, the Eee Pad Transformer Prime features the innovative ASUS exclusive mobile dock, presenting a harmony of beauty and strength. ASUS CEO Jerry Shen says, “The combination between the Eee Pad Transformer Prime and Tegra 3 is the perfect fusion to deliver an uncompromising tablet experience. Together, we bring a whole new mobile computing experience to consumers around the world”. Echoing that sentiment, NVIDIA’s President and CEO Jen-Hsun Huang states, “The Eee Pad Transformer Prime is a category-defining product. Powered by Tegra 3, it brings us into a new era of mobile computing, in which quad-core performance and super energy-efficiency provide capabilities never available before. With Transformer Prime, ASUS has once again led the industry into the next generation.”

The Eee Pad Transformer Prime is ultra-thin at 8.3mm (0.33”) and lightweight at 586g (1.29lbs) while featuring a stylish metallic swirl design with class leading enhancements including ASUS SonicMaster audio technology, an HD 8MP rear auto-focus camera with LED flash and battery life rated for up to 18 hours*when combined with the optional mobile dock. Pricing will range from $499** (32GB) to $599** (64GB), with the optional mobile dock accessory priced at $149**.

Incredibly Slim yet Incredibly Powerful
Featuring an ultra-slim form factor, the Transformer Prime is only 8.3mm (0.33”) thin and weighs in at a mere 586g (1.29lbs without dock). This makes watching movies, surfing the web, playing games, taking photos, finishing up homework or video chatting with friends or family so easy and natural that you’ll wonder if the Transformer Prime was designed specifically with you in mind. Its innovative metallic swirl design is made of aluminum for a secure yet extremely comfortable grip that comes in two gorgeous colors: Amethyst Gray and Champagne Gold.

The Transformer Prime is the world’s first tablet to feature NVIDIA’s next-generation quad-core Tegra® 3 processor. With the quad-core CPU, 12-core GeForce® GPU and vSMP technology, the Transformer Prime delivers an optimum user experience featuring smooth multitasking capabilities, lightning fast app loading, a rich and fluid web experience, full 1080P HD video for realistic media playback or recording and of course, incredible gaming performance that allows you to experience games in an entirely new way.

Fantastic Battery Life
While the Transformer Prime is extremely slim and light, ASUS did not forget about battery life. Thanks to the advanced power management features of the Tegra® 3 processor and ASUS optimizations the Transformer Prime has a battery life of up to 12 hours*, but when combined with the mobile dock, it lasts up to an incredible 18 hours*, the longest battery life of any current tablet. That’s enough battery life for a trans-ocean flight, all-night game session, viewing several movies on a long road trip or even video recording, editing, and then playing back your child’s school play all in 1080P HD clarity.

Unrivaled Visuals
The Eee Pad Transformer Prime boasts a wide 178° viewing angle IPS display, protected by Corning® Gorilla® Glass, which features new ASUS technology to enhance the brightness of the screen for a better outdoor reading experience.
[The display’s normal brightness tops out at ~500 nits, but the Prime offers an alternate ‘Super IPS’ mode that pushes display brightness up to 600 nits for use in bright outdoor environments. ]

The high-resolution 10.1” display offers a remarkably vivid and brilliant viewing experience of photos, books, videos, games, and more in either landscape or portrait mode outdoors, indoors and even in low-light places like an airplane or train. Thanks to Multi-Touch technology, you can use your fingers to do everything from swiping through photos, surfing the web, playing the latest games, typing emails, instant messaging, reading books or magazines, and starting your favorite movie.

A 1.2MP front camera allows for instant photos or high-quality video conferencing with friends, family or coworkers while an 8MP rear camera with auto-focus and LED flash takes stunning photos or video thanks to a large F2.4 aperture, back illuminated CMOS sensor, touch-to-focus depth of field and low-light noise reduction to provide the clearest and sharpest photos or even 1080P HD videos.

Advanced Audio
The Transformer Prime offers impressive audio capabilities in a tablet, powered by ASUS exclusive SonicMaster technology, renowned for crisp and acoustically accurate audio. It produces crystal clear sound with a wide sound stage, increased audio fidelity, and distinct vocal enhancements for an immersive audio experience with your favorite music track, video, or movie.

Unlimited Productivity
The Transformer Prime is offered with either 32GB or 64B flash storage options for quick, efficient and reliable access to your applications. Both models feature a micro SD card slot, 3.5mm combo audio jack and micro HDMI port so sharing both what’s inside and on-screen is quick and easy. However, the function that gives the Transformer Prime its namesake is the mobile dock, which gives new meaning to the term versatility. This innovative and convenient design seamlessly provides the user with a keyboard and touchpad for superior content creation capabilities, longer battery life and incredible expandability options via the USB port and SD card slot.

ASUS will include several innovative applications like SuperNote that is fantastic for its ability to take, draw or record notes and Polaris® Office which is great for staying productive with the ability to read, edit or create Word, Excel and PowerPoint (MS Office 97-2007) compatible files. Thousands of top rated applications and games are also available at Android Market that fully takes advantage of the Transformer Prime’s amazing new features and power.

More information: Detailed specification [on NVIDIA site]

NVIDIA Tegra 3: Fifth Companion Core [NVIDIA, Nov 2, 2011]

The first mobile quad core CPU with The Fifth Companion Core is a look at how the Tegra 3 – Variable SMP processor works to deliver high performance while achieving the lowest power consumption.

Variable SMP – A Multi-Core CPU Architecture for Low Power and High Performance [NVIDIA whitepaper, Sept 20, 2011]


Variable Symmetric Multiprocessing

NVIDIA’s Project Kal-El is the world’s first mobile SoC device to implement a patented Variable Symmetric Multiprocessing (vSMP) technology that not only minimizes active standby state power consumption, but also delivers on-demand maximum quad core performance. In addition to four main Cortex A9 high-performance CPU cores, Kal-El has a fifth low power, low leakage Cortex A9 CPU core called the ‘CompanionCPU core that is optimized to minimize active standby state power consumption, and handle less demanding processing tasks.

Project Kal-El also includes other patented vSMP technologies that intelligently manage workload distribution between the main cores and the Companion core based on application and operating system requirements. This management is handled by NVIDIA’s Dynamic Voltage and Frequency Scaling (DVFS) and CPU Hot-Plug management software and does not require any other special modifications to the operating system

Low Power Companion Core

The Companion core is designed on a low power process technology, but has an identical internal architecture as the main Cortex A9 CPU cores. Since it is built on a low power process in the low performance ranges (and frequencies), it consumes lower power than the main CPU cores that are built on a fast process technology. Power-performance measurements on Kal-El show that the Companion core delivers higher performance per watt than the main cores at operating frequencies below 500 MHz, and therefore the maximum operating frequency of the Companion core is capped at 500MHz. Table 1 compares and contrasts the Companion core to the four main cores on Kal-El.

  Power optimized Companion CPU Core Performance optimized main CPU Cores
Architecture Cortex A9 Cortex A9
Process Technology Low Power (LP) General/Fast (G).
Operating Frequency Range 0 MHz to 500 MHz 0 MHz to Max GHz

Table 1 Companion and Main CPU Core features

The Companion core is used primarily when the mobile device is in active standby and performing background tasks such as Email syncs, Twitter updates, Facebook updates etc. It is also used for applications that do not require significant CPU processing power, such as streaming audio, offline audio, and both online or offline video playback. Note that both audio and video playback, in addition to video encoding, are largely processed by hardware-based encoders and decoders.

Unlike the Companion core, the main CPU cores need to operate at very high frequencies to deliver high performance. Therefore they are built on a fast process technology which allows them to scale up to very high operating frequencies at lower operating voltage ranges. Thus the main cores are able to deliver high performance without significant increases in dynamic power consumption.

imageFigure 3 Low Power Companion CPU on Kal-El

Using the combination of performance-optimized main cores and a power-optimized Companion core, Variable Symmetric Multiprocessing technology not only delivers ultra-low power consumption in active standby states, but also on-demand peak quad core performance for performance hungry mobile applications such as gaming, Web browsing, Flash media, and video conferencing.

vSMP technology successfully combines the power-performance benefits of the power-optimized CPU B and performance-optimized CPU A shown in Figure 2 and delivers a power-performance curve that looks like the one shown in Figure 4.

imageFigure 4 Power-Performance curve of Companion core
plus quad main cores running on vSMP technology

imageFigure 5 CPU core management based on workload

The Variable SMP architecture is also completely OS transparent, which means that operating systems and applications don’t need to be redesigned to take advantage of the fifth core.

More information: The Benefits of Quad Core CPUs in Mobile Devices [NVIDIA whitepaper, Sept 20, 2011] discusses the benefits of quad-core across different types of use cases – web, games, apps, multitasking and more. They also highlight examples of how quad-core Kal-El uses less power than dual-core processors across all performance points.

Anandtech:

With 1 core active, the max clock is 1.4GHz (up from 1.0GHz in the original Tegra 2 SoC). With more than one core active however the max clock is 1.3GHz. Each core can be power gated in Tegra 3, which wasn’t the case in Tegra 2. This should allow for lightly threaded workloads to execute on Tegra 3 in the same power envelope as Tegra 2. It’s only in those applications that fully utilize more than two cores that you’ll see Tegra 3 drawing more power than its predecessor.

NVIDIA Tegra 3: Side by Side Comparisons [NVIDIA, Nov 2, 2011]

Check out all our Tegra 3 blog posts at: http://blogs.nvidia.com/tag/tegra-3/ Get the best mobile experience with the NVIDIA Tegra 3 quad core processor. These Side by Side Comparisons showcases the Tegra 3 advantage for obtaining better web performance, accelerating your apps and experiencing the best gaming on mobile. Make sure to check out all NVIDIA Tegra 3 videos below: http://www.youtube.com/watch?v=C30ShWQm5pI (Glowball Part 2) http://www.youtube.com/watch?v=R1qKdBX4-jc (Fifth Companion Core) http://www.youtube.com/watch?v=2U2r3yKg0Ng (Next-gen Games) http://www.youtube.com/watch?v=N11AYQkr5Zs (Mobility At The Speed Of Life) (kevesebb információ)

NVIDIA Quad-Core Tegra 3 Chip Sets New Standards of Mobile Computing Performance, Energy Efficiency [NVIDIA press release, Nov 8, 2011]

NVIDIA today ushered in the era of quad-core mobile computing with the introduction of the NVIDIA® Tegra® 3 processor, bringing PC-class performance levels, better battery life and improved mobile experiences to tablets and phones. The world’s first quad-core tablet with the Tegra 3 processor is the ASUS Eee Pad Transformer Prime.

Known previously by the codename “Project Kal-El,” the Tegra 3 processor provides up to 3x the graphics performance of Tegra 2, and up to 61 percent lower power consumption. This translates into an industry-leading 12 hours of battery life for HD video playback.

The Tegra 3 processor implements a new, patent-pending technology known as Variable Symmetric Multiprocessing(vSMP). vSMP includes a fifth CPU “companion,” specifically designed for work requiring little power. The four main cores are specifically designed for work requiring high performance, and generally consume less power than dual-core processors.

During tasks that require less power consumption — like listening to music, playing back video or updating background data — the Tegra 3 processor completely shuts down its four performance-tuned cores and, instead, uses its companion core. For high-performance tasks — like web browsing, multitasking and gaming — the Tegra 3 processor disables the companion.

“NVIDIA’s fifth core is ingenious,” said Nathan Brookwood, Research Fellow at Insight 64. “Tegra 3’s vSMP technology extends the battery life of next-generation mobile devices by using less power when they’re handling undemanding tasks and then ratcheting up performance when it’s really needed.”

The Tegra 3 quad-core CPUs are complemented with a new 12-core NVIDIA GeForce® GPU, which delivers more realism with dynamic lighting, physical effects and high resolution environments, plus support for 3D stereo, giving developers the means to bring the next generation of mobile gamesto life.

For the millions who play games on mobile devices, the Tegra 3 processor provides an experience comparable to that of a game console. It offers full game-controller support, enabling consumers to play games on their tablet or super phone, or connect to big screen HDTVs for a truly immersive experience. It also leverages NVIDIA’s award-winning 3D Vision technology and automatically converts OpenGLapplications to stereo 3D, so consumers can experience 3D on a big screen 3D TV (via HDMI™ 1.4 technology).

The Tegra 3 processor provides the industry’s….

  • Fastest web experience – with accelerated Adobe Flash Player 11, HTML5 and WebGL browsing, and an optimized Javascript engine
  • Fastest applications – with blazing performance for multimedia apps, such as photo and video editing
  • Fastest multitasking – for switching between common uses, such as playing music and games, and background tasks
  • Fastest, highest-quality gaming [not true, eg. the Apple iPhone 4S is powered by PowerVR SGX 543MP2 GPU which more performance, see the below table from Anandtech] – including new Tegra 3 processor-optimized NVIDIA Tegra Zone™ app games such as Shadowgun, Riptide GP, Sprinkle, Big Top THD, Bladeslinger, DaVinci THD and Chidori.

Highlights / Key Facts:

  • The Tegra 3 processor redefines power consumption and mobile-computing performance with:
    • The world’s first quad-core ARM Cortex A9 CPU
    • New patent-pending vSMP technology, including a fifth CPU core that runs at a lower frequency and operates at exceptionally low power
    • 12-core GeForce GPU, with 3x the graphics performance of the Tegra 2 processor, including support for stereoscopic 3D
    • New video engines with support for 1080p high profile video at 40 Mbps
    • Up to 3x higher memory bandwidth
    • Up to 2x faster Image Signal Processor
  • 40 games are expected to be available by the end of 2011, and over 15 Tegra 3 games are under development for Tegra Zone, NVIDIA’s free Android Market app that showcases the best games optimized for the Tegra processor.
  • The Tegra 3 processor is in production. Developers can order the Tegra 3 Developer Kit to create applications for devices with Tegra such as tablets and super phones, at developer.nvidia.com/tegra.

Mobile SoC GPU Comparison (source: Anandtech)

 
Adreno 225
PowerVR SGX 540
PowerVR SGX 543
PowerVR SGX 543MP2
Mali-400 MP4
GeForce ULP
Kal-El GeForce
SIMD Name
USSE
USSE2
USSE2
Core
Core
Core
# of SIMDs
8
4
4
8
4 + 1
8
12
MADs per SIMD
4
2
4
4
4 / 2
1
1
Total MADs
32
8
16
32
18
8
12
GFLOPS @ 200MHz
12.8 GFLOPS
3.2 GFLOPS
6.4 GFLOPS
12.8 GFLOPS
7.2 GFLOPS
3.2 GFLOPS
4.8 GFLOPS
GFLOPS @ 300MHz
19.2 GFLOPS
4.8 GFLOPS
9.6 GFLOPS
19.2 GFLOPS
10.8 GFLOPS
4.8 GFLOPS
7.2 GFLOPS

NVIDIA wouldn’t confirm the target clock for Tegra 3’s GPU other than to say it was higher than Tegra 2’s 300MHz. Peak floating point throughput per core is unchanged (one MAD per clock), but each core should be more efficient thanks to larger caches in the design.

A combination of these improvements as well as newer drivers are what give Tegra 3’s GPU its 2x – 3x performance advantage over Tegra 2 despite only a 50% increase in overall execution resources. In pixel shader bound scenarios, there’s an effective doubling of execution horsepower so the 2x gains are more believable there. I don’t expect many games will be vertex processing bound so the lack of significant improvement there shouldn’t be a big issue for Tegra 3.

TI’s OMAP4460 in Samsung GALAXY Nexus with Android 4.0

Updates: Samsung cuts LTE chip cost by half, ABI Research teardown reveals [Feb 7, 2012]

The Samsung Galaxy Nexus made a big impact on the market in December 2011, thanks to its sleek design, new Android OS (Ice Cream Sandwich) and NFC capability. The smartphone has another notable hidden feature that makes it more cost-competitive.

The Samsung Galaxy Nexus modem is constructed with the combination of a VIA Telecom CDMA/EVDO Rev.A integrated circuit and a Samsung LTE baseband integrated circuit, ABI Research said in its teardown note. This combination is now common for Samsung’s Verizon phones, but the Galaxy Nexus sports a new version of the LTE baseband chip. The new chip is estimated at nearly half the cost of the prior chip’s US$23 price tag.

This cost reduction is an important milestone in securing the rapid migration to LTE throughout the world, ABI Research indicated.

The application processor found inside the Galaxy Nexus is a TI OMAP4460, which runs at 1.2GHz, according to ABI Research. Other notables include an NFC antenna embedded in the device battery, and a CSR GPS single chip, a Broadcom Wi-Fi/BT/FM single chip and an Avago LTE PA and GPS frontend.

Samsung Electronics Announces Fourth Quarter & FY 2011 Results [Samsung press release, Jan 27, 2012]


“Despite intensified competition amid the global economic slowdown, our Telecommunications businesses continued to post solid earnings with an enhanced line-up of high-end smartphones, resulting in higher average selling price (ASP). Moreover, improved profitability and earnings growth of our Set businesses, including smartphones and flat panel TVs led to our company’s strong earnings,” said Robert Yi, Senior Vice President and Head of Investor Relations.

Smartphone Sales Remain Main Driver
The Telecommunications businesses – including mobile communications and telecommunication systems – posted a record quarterly operating profit of 2.64 trillion won for the period. Fourth quarter revenue reached a record 17.82 trillion won compared with 11.75 trillion won for the same period of 2010.

The stellar performance has allowed Samsung to register full year 2011 operating profit of 8.27 trillion won, up 90 percent on-year. Total sales for fiscal year 2011 also hit an all-time yearly high of 55.53 trillion won, accounting for almost one-third of Samsung Electronics’ total revenue for the year.

Samsung’s flagship GALAXY S II smartphone and its full lineup of high-end mobile devices, such as the GALAXY Note and the GALAXY Nexus, and entry-level models drove up revenue for the year by almost 40 percent compared with the previous year.

All told, shipments of Samsung smartphones rose by approximately 30 percent in the fourth quarter, compared with the previous quarter.

For the global market outlook for this year, demand for entry-level smartphones and tablet PCs will increase significantly, while the growth momentum for feature phones is expected to stay static. Emerging markets and the spread of LTE (Long-Term Evolution) wireless telecommunications technology have also contributed to the growth of the smartphone market, which is expected to grow by more than 30 percent.

The Telecommunication System Business will further solidify its leadership in the wireless network market with the expansion of the LTE service in Korea and North America.

4Q FY2011 Earnings Conference Call [Samsung presentation, Jan 27, 2012]

End of updates

GALAXY Nexus is the next generation of Nexus devices co-developed by Samsung and Google. Nexus combines innovative hardware with the newest version of Android, 4.0, Ice Cream Sandwich, and the latest Google mobile services.

Samsung and Google introduce GALAXY Nexus [Samsung Mobile press release, Oct 19, 2011]

World’s First Smartphone to feature Android 4.0 Ice Cream Sandwich and a HD Super AMOLED display

Best-in-class hardware meets the most advanced software

GALAXY Nexus is the first smartphone to feature a 4.65’’ display with a market-leading resolution of 720p (1280×720), ensuring you can enjoy GALAXY Nexus’ immersive entertainment capabilities and fast web browsing in superior clarity.

Succeeding the original Contour Display of Nexus S, GALAXY Nexus comes with a rounded shape that fits perfectly within your palm or to your face for phone calling. Hyper-skin backing on the battery cover improves the ergonomic feel of the device and makes the phone slip-resistant. At just 8.94mm thick, with a minimal 4.29mm bezel, GALAXY Nexus provides superb portability alongside an expansive screen.

GALAXY Nexus also features an ultra-fast 1.2GHz dual core processor, providing superior power and speed, ensuring you can take full advantage of GALAXY Nexus’ enhanced multitasking capabilities with ease, or enjoy the large, vivid display to its full capacity with high-definition gaming or video streaming. LTE or HSPA+ connectivity combined with a dual core processor delivers high-speed web browsing which ensures you always have the web at your fingertips, wherever you are.

GALAXY Nexus will be available in the U.S., Europe, and Asia beginning in Novemberand gradually rolled out to other global markets.

Samsung GALAXY Nexus Product Image -- 19-Oct-2011
GALAXY Nexus Product Specifications

Network HSPA+ 21Mbps/HSUPA 5.76Mbps 850/900/1900/1700/2100
EDGE/GPRS 850/900/1800/1900
*LTE version will be available depending on the region.
Processor 1.2 GHz Dual Core Processor
Display 4.65” 1280X720 HD Super AMOLED
OS Android 4.0, Ice Cream Sandwich
Camera Main(Rear) : 5 MP AF with LED Flash with zero shutter lag and fast shot2shot
Sub (Front) : 1.3MP for Video Call
Video Codec : MPEG4/H.263/H.264
Playback : 1080p@ 30fps
Recording : 1080p Full HD Video@ 30fps
Audio Codec : MP3/AAC/AAC+/eAAC+3.5mm Ear Jack
Google™Mobile Services Android Market™, Gmail™, Google Earth™, YouTube™, Movie Studio
Google Maps™ 5.0 with 3D maps and turn-by-turn navigation
Syncing with Google Calendar™, Google+ app
Connectivity Bluetooth® technology v 3.0 USB 2.0
Wi-Fi 802.11 a/b/g/n (2.4GHz/ 5GHz)
NFC
Sensor Accelerometer, Compass, Gyro, Light, Proximity, Barometer
Memory 1GB(RAM) + 16GB/ 32GB Internal memory
Size 135.5 x 67.94 x 8.94mm, 135g
Battery Standard battery, Li-on 1,750 mAh

TI confirms OMAP 4460 is in Nexus Galaxy [Oct 19, 2011]

We got word from TI that says it clearly. “Yes, the highly-anticipated Android 4.0 “Ice Cream Sandwich” release runs on the OMAP4460 processor.”

They went on to say that this is mainly due the fact they are better than the competition. They claim “the ability to provide hardware-integrated security, distinctive and advanced imaging features, enhanced memory and
more, all on a smart multicore architecture.”

TI’s vice president of OMAP platform business, Remi El-Ouazzane continues with something we will break into a separate story. He tells the word that OMAP 4460 is inside Nexus and that they are the first with Android 4.0 phone. It looks like they are the reference even for Ice Cream Sandwich tablets.

“What I may be the most excited by is not only the ability to converge to one Android release for both smartphones and tablets, but to be able to pack that level of performance across graphics or video on an HD screen and within the power envelope of a smartphone device.This is where our OMAP smart multicore architecture makes a huge difference,” he said.

Also, He goes after Nvidia with this comment: “At the end of the day, brute force (number of cores, for instance) does not rival sophistication.” TI is telling the world that their two core with great video and graphics with great power is just enough.

According to OMAP™ 4 Platform: OMAP4430/OMAP4460 [March 28, 2011] and OMAP™ 4 Platform: OMAP4470 [June 2, 2011]:

OMAP4430 OMAP4460 OMAP4470
Process node 45nm 45nm 45nm
ARM® Cortex™-A9 Clock Speed (two) 1 GHz 1.5 GHz 1.8 GHz
2D & 3D Graphics Hardware accelerated
[POWERVR™ SGX540, greater than 2x the sustained performance compared to the previous SGX530 core]
Hardware accelerated
[POWERVR™ SGX540, greater than 2x the sustained performance compared to the previous SGX530 core ]
Hardware accelerated
Dedicated 2D and 3D graphic cores [POWERVR™ SGX544, more than two times the sustained performance compared to the previous SGX540 core performances, supports DirectX with maximum hardware acceleration]
Video performance (2D) 1080p HD 1080p HD 1080p HD
Video Performance (3D) 720p stereoscopic 3D 1080p Stereoscopic 3D 1080p Stereoscopic 3D
Imaging Performance (per second) 20 MP main camera
5MP stereo (dual cameras)
20MP main camera
12 MP stereo (dual cameras)
20MP main camera
12 MP stereo (dual cameras)
Availability Currently sampling Currently sampling Samples in 4Q 2011
Display Support WUXGA (1920 x 1200) WUXGA (1920 x 1200) QXGA (2048×1536), multiple screens

Why the Galaxy Nexus uses OMAP instead of Exynos [Oct 18, 2011]

The rumors seemed strange from the start — a Samsung phone with a Texas Instruments processor? Last year’s Nexus S was a Samsung device, and it was Samsung through and through with a 1GHz Hummingbird system-on-a-chip (SoC). Now here we are looking at the new Googleflagship, the Galaxy Nexus, and it has a TI OMAP4460 on the inside. Why not Samsung’s own Exynos part?

There area few factors at work here, but the most important one is related to how the Nexus program works. Back when Google announced the Motorola Mobility buy, the company finally revealed a bit about how it operates the Nexus program. This was done in an effort to show that Motorola won’t be getting preferential treatment.

According to Google’s Andy Rubin, each year Google selects a device maker that it wants to work closely with on the next Nexus phone. But it’s not just the OEM that is involved — Google decides on components in the phone individually. Unlike other devices, Google gets it way with the Nexus.

So the team that will eventually “huddle together in one building” will be made up of the OEM, and several component makers that supply things like the SoC and radios. Then 9-12 months later, a little Nexus is born. Last year, Google went with Samsungfor the device itself, and the SoC. This year, Google has decided to put Texas Instruments on the processor team.

So now the OMAP4460 is getting quite a lot of scrutiny, even though it isn’t exactly a new chip. This dual-core SoC is clocked at 1.2GHz, and uses ARM Cortex-A9 architecture, just like the Exynos. That’s not a problem, but the older GPU, the PowerVR SGX540 is. We were hoping for a step up in the graphics department.

[Samsung’s own Cortex A9 based SoC, Exynos 4210 [Sept 22, 2011] in 1GHz and 1.2GHz version is currently sampling.]

Why did Google choose the OMAP for its new Nexus? Well, it might not live up to the high graphical standards set out by the iPhone, but it is a solid chip in its own right. The OMAP4 platform makes use of an additional hardware accelerator called IVA 3 [IVA-HD as called in the Technical Reference below] that makes encoding and decoding HD video a snap. The Galaxy Nexus has an HD screen, so this hardware focus on video is a big plus.

Google engineers were likely also drawn to the OMAP for its use of a dual-channel memory controller. Android’s multitasking system means that data is constantly being moved into, and out of, active memory. This is definitely a strength of TI’s OMAP parts.

Google will be developing the new version of Android on OMAP for the next year, so be ready for more devices based on this one. Much like the Nexus One started the Snapdragon revolution two years ago, this could be TI’s time to shine. If that OMAP4460 starts looking old and tired to OEMs in the coming year, there is always the upcoming OMAP4470 (which is armed with the much-newer and faster SGX544 GPU) to maintain compatibility and increase performance, too.

One official benchmark (GLBenchmark 2.1) to show the GPU performance differences:

OMAP4460 Multimedia Device Silicon Revision 1.x – Technical Reference Manual [PRELIMINARY, February 2011–Revised October 2011, 5620 pages]

Overview

The OMAP4460 high-performance multimedia application device is based on enhanced OMAP™ architecture and uses 45-nm technology.

• The architecture is designed to provide best-in-class video, image, and graphics processing for 2.5/3G wireless terminals, high-performance personal digital assistants (PDAs). For that purpose, the device
supports the following functions:
– Streaming video up to full high definition (HD) (1920 × 1080 p, 30 fps)
– 2-dimensional (2D)/3-dimensional (3D) mobile gaming
– Video conferencing
– High-resolution still image (up to 16 Mp)

• The device supports high-level operating systems (OSs) such as:
– Linux®
– Palm OS™
– Symbian OS™
– Windows™ CE, WinMobile™

• The device is composed of the following subsystems:
Cortex™-A9 microprocessor unit (MPU) subsystem, including two ARM® Cortex-A9 cores
– Digital signal processor (DSP) subsystem
– Image and video accelerator high-definition (IVA-HD [IVA 3 as called in marketing materials]) subsystem
Cortex™-M3 MPU subsystem, including two ARM Cortex-M3 microprocessors
Display subsystem
– Audio back-end (ABE) subsystem
– Imaging subsystem (ISS), consisting of image signal processor (ISP) and still image coprocessor (SIMCOP) block
– 2D/3D graphic accelerator (SGX) subsystem
– Emulation (EMU) subsystem

Texas Instruments OMAP4460 Block Diagram -- 17-Oct-2011
Texas Instruments OMAP4460 Block Diagram

Texas Instruments OMAP4430 and OMAP4460 compared -- 17-Oct-2011
OMAP4430 and OMAP4460 compared

Memory Adapter
The purpose of the MA is to improve the missed latency of the L2 cache between the ARM Cortex-A9 processor and external memory. One of the PL310 master ports is connected to the MA and is used for all accesses to SCRAM. The PL310 address filtering mechanism is used to split incoming addresses between the MA connected to one of the PL310 master ports and the local interconnect connected to the other PL310 master port.

Cache Management Unit
The CMU provides the ability to perform maintenance operations on Cortex-A9 MPU caches by physical address range. This reduces the execution time required by the Cortex-A9 CPUs to perform cache maintenance operations, while improving the overall throughput of maintenance operations. This frees the CPUs for other useful work. The registers inside the CMU are configured using the 32-bit interconnect configuration port from the local interconnect. The CMU operates at half the clock speed of the CPU core.

EMIF Controller [EMI Module]

The EMIF [External Memory InterFace] module provides connectivity between the device and the LPDDR2-type memories and manages data bus read/write accesses between external memories, the microprocessor unit (MPU), and the direct memory access (DMA) controller.

The EMIF is an L3 bus peripheral that provides an interface to the LPDDR2 memories.

The diagram below shows the interconnection between the EMIF module and the other modules.

Digital locked loops (DLLs) are used to delay the input DQS signals during reads so that these strobe signals can be used to latch incoming data on the DQ pins, as required by the LPDDR2 standard.

Physical layers (PHYs) are hard macros that convert single-data rate (SDR) signals to DDR signals.

Texas Instruments EMIF of OMAP4430 and OMAP4460 compared -- 17-Oct-2011.jpg
EMIF of OMAP4430 and OMAP4460 compared

L3 Interface
The EMIF supports three local interfaces: one connects to the system interconnect, one to a low-latency master, and one comes from the MPU half of the EMIF-to-MPU connection. These interfaces are used to request all external memory device accesses, to access the EMIF registers, and to transfer all data to and from the EMIF controller. … A third interface arranges the connection between the EMIF and the MPU. It is separated to the MPU half of the EMIF-to-MPU L3 Interface and the EMIF half of the EMIF-to-MPU L3 Interface.

[PRCM module]
• The device includes state-of-art power-management techniques required for high-performance mobile products.
• Comprehensive power management is integrated into the device.

• The device also integrates:
– On-chip memory
– External memory interfaces
– Memory management
– Level 3 (L3) and level 4 (L4) interconnects
– System and connecting peripherals

Cortex-A9 MPU Subsystem Description

The Cortex-A9 MPU subsystem [is based on the symmetric multiprocessor (SMP) architecture and] integrates the following submodules:

• ARM Cortex-A9 MPCore
– Two ARM Cortex-A9 central processing units (CPUs)
– ARM Version 7 ISA™: Standard ARM instruction set plus Thumb®-2, Jazelle® RCT and Jazelle DBX Java™ accelerators
– Neon™ SIMD coprocessor and VFPv3 per CPU
– Interrupt controller (Cortex-A9 MPU INTC) with up to 128 interrupt requests
– One general-purpose timer and one watchdog timer per CPU
– Debug and trace features
– 32-KB instruction and 32-KB data level 1 (L1) caches per CPU

• Shared 1-MB level 2 (L2) cache
• 48 KB bootable ROM
• Local power, reset, and clock management (PRCM) module
Emulation features
• Digital phase-locked loop (DPLL)

Texas Instruments OMAP4460 Cortex-A9 MPU - ABE - DSP subsystem -- 17-Oct-2011
TI OMAP4460: Cortex-A9 MPU – ABE – DSP subsystems

ABE Subsystem Description
The ABE subsystem handles audio processing for the application. It manages the audio and voice streams between the Cortex-A9 MPU subsystem and/or DSP, and the physical interfaces.

The ABE subsystem allows:
• Buffering of audio samples
• Mixing audio with voice downstream and/or microphone upstream (sidetone)
• Postprocessing of equalization, 3D effects, bass-boost

The ABE subsystem consists of:

• Audio engine (AE) subsystem, which performs real-time signal processing such as:
– Muxing and mixing voice and data streams
– Postprocessing operations such as sampling rate conversion, volume control, 3D effects
– Execution of whole data transfers in the ABE subsystem using audio traffic controller (ATC)

The AE subsystem includes an AE and has the following on-chip memories available: 64-KB data memory (DMEM); 6-KB coefficient memory (CMEM); and 18-KB sample memory (SMEM).

The ATC manages the data movement in the ABE subsystem and is in charge of interrupt generation to the DSP and Cortex-A9 MPU subsystems.

• Four general-purpose timers (GPTIMERs) and one watchdog timer (WDTIMER)

• Peripheral interfaces:
– Three multichannel buffered serial ports (McBSPs) for inter-IC sound ( I2S™) external connectivity
– One multichannel audio serial port (McASP) supporting Sony/Philips digital interconnect format (S/PDIF) output
– One MIPI SLIMbus interface to support new generations of MIPI-compliant components
– One digital microphone (DMIC) for three stereo digital microphones support
– One multichannel pulse-density modulation (McPDM) interface, which ensures communication with the TWL6040 audio companion chip

• Internal interfaces for connection with the DSP and Cortex-A9 MPU subsystems and other modules in the device

• Dedicated power domain (ABE power domain)

DSP Subsystem Description

This information is not available in the public domain.

IVA-HD [IVA 3 as called in marketing materials] Subsystem Description

The IVA-HD subsystem is a set of video encoder/decoder hardware accelerators. It supports up to 1080p × 30 fps, slow-motion camcorder, triple play (HD and SD capture and JPEG capture), real-time transcoding of up to 720p, and video conferencing up to 720p.

The IVA-HD subsystem is composed of:
• Improved motion estimation acceleration engine (iME3), which is used in encoding processing
• Improved loop filter acceleration engine (iLF3), which performs deblocking filtering
• Improved sequencer (iCONT1) based on the ARM968E-S™ microcontroller. It includes memory and INTC and is used as a primary sequencer.
• Intraprediction estimation engine (iPE3). It is used in encoding processing.
• Calculation engine (CALC3), which performs transform and quantization calculations
• Motion compensation engine (MC3), which creates an interprediction macroblock with given motion vectors and modes from the reference data
• Entropy coder/decoder (ECD3), which uses Huffman and arithmetic codes during the process of encoding and decoding the stream
• Video DMA processor (iCONT2), which is also based on the ARM968E-S microcontroller and can be used as secondary sequencer
• Video DMA engine (vDMA), which is a DMA engine for data transmission between external memories and shared L2 memory
• Synchronization box (SyncBox) embedded in each hardware accelerator and in both iCONTs
• Mailbox for communication between IVA-HD and external to it processors (DSP, Cortex-A9, and Cortex-M3)
• Shared L2 interface and memory
• Video local interconnect for connection between the submodules of the IVA-HD, and between the IVA-HD and DSP subsystems
• IVA-HD system control module (SYSCTRL), which controls the clocks in the subsystem and PRCM handshaking

The IVA-HD subsystem can process three data formats for internal data: picture or slice, macroblock header, and residual data.

The IVA-HD supports [the following codec standards natively; that is, all functions of standards are accelerated (without any intervention of the digital signal processor [DSP])] the following formats:
• MPEG-1/-2/-4 such as MPEG-2 MP, ML, and MPEG-4 as SP/ASP
• Divx 5.02 and above
• Sorenson Spark [V0 and V1] (decode)
• H.263 P0 (encode and decode) and P3 (decode)
• H.264 Annex G (scalable baseline profile up to 720p)
• H.264 BP/MP/HP
• [H.264: Fast Profile/RCDO Encode and Decode]
• H.264 Annex H (partial) [up to 720p30]
• Stereoscopic video
• JPEG [(also MJPEG)] (encode/decode)
• VC-1 [WMV9/RTV] SP/MP/AP
• AVS-1.0
• RealVideo® 8/9/10 (decode only)
• On2® VP6.2/VP7 (decode only)

[IVA-HD 1.0 will use eXpressDSP Digital Media (xDM) standard as the principle software interface. The xDM standard defines application programming interfaces (APIs) through which an application invokes a
particular class of codec, such as video decode or audio encode.

xDM developers kit, technical documentation and full compliant codecs can be downloaded from http://focus.ti.com/docs/toolsw/folders/print/tmdxdaisxdm.html.
Software released on IVA-HD 1.0 will be xDM-compliant and will be available during 2010.]

Texas Instruments OMAP4460 DSP - IVAHD - Display subsystem -- 17-Oct-2011
TI OMAP4460: DSP – IVAHD – Display subsystems

Display Subsystem Description

The display subsystem provides the control signals required to interface the OMAP system memory frame buffer (SDRAM) directly to the displays. [The display subsystem (DSS) provides the logic to display a video frame from the memory frame buffer on a liquid-crystal display (LCD) panel or a TV set.] It supports hardware cursor, independent gamma curve on all interfaces, multiple-buffer, and programmable color phase rotation. The display subsystem allows low-power display refresh and arbitration between normal and low-priority pipelines.

The display subsystem consists of the following sections:

• Display controller: It can read and display the encoded pixel data stored in memory and write the output of one of the overlays or one of the pipelines into the system memory. It supports the following components:
– Three video pipelines, one graphic pipeline, and one write-back pipeline. The graphic pipeline supports pixel formats such as: ARGB16-4444, RGB16-565, ARGB16-1555, ARGB32-8888, RGBA32-8888, RGB24-888, and BITMAP (1, 2, 4, or 8 bits per pixel). It allows selection of the
color-depth expansion.
– Write-back pipeline: it uses poly-phase filtering for independent horizontal and vertical resampling (upsampling and downsampling). It allows programmable color space conversion of RGB24 into YUV4:2:2-UYVY, YUV4:2:2-YUV2, or YUV4:2:0-NV12, and selection of color-depth reduction from RGB24 to RGB16.
– Two LCD outputs, each one with dedicated overlay manager, for support of passive matrix color and monochrome displays (up to 8-bit interface) and active matrix color displays (up to 24-bit interface). Secondary LCD output is available through parallel CMOS interface for MIPI®-DPI 1.0
support.
– One TV output with dedicated overlay manager
– Own direct memory access (DMA) engine

• Remote frame buffer interface (RFBI) module.
– Support for MIPI-DBI protocol
– 8-/9-/16-bit parallel interface
– Programmable pixel modes and output formats

• Two MIPI display serial interfaces (DSIs) with the following main features:
– Support for MIPI-DSI (four data-lane complex inputs/outputs (I/Os) for DSI1 and two data-lane complex I/Os for DSI2)
– Support for video mode and command mode
– Data interleaving support for synchronous and asynchronous streams
– Bidirectional data link support

• High-definition multimedia interface (HDMI) encoder with the following main features:
– HDMI 1.3, HDCP 1.2, and DVI 1.0 compliant
— Including support for the 3D Stereoscopic frame-packing formats of HDMI v1.4 standard (720p, 50Hz, 720p, 60Hz and 1080p, 24Hz)
– Deep-color mode support (10-bit for up to 1080p and up to 12-bit for 1080i/720p)
– Support for uncompressed multichannel audio
– Integrated high-bandwidth digital content protection (HDCP) encryption engine for transmitting protected audio and video content
– Integrated transition minimized differential signaling (TMDS) and TERC4 encoders for data island support

• NTSC/PAL video encoder with the following main features:
– Output to on-chip video digital-to-analog converter (VDAC) providing composite analog output signal: NTSC-J, M; PAL-B, D, G, H, I; PAL-M
– Support for square pixel sampling
– Programmable horizontal synchronization, vertical timing, and waveforms

NOTE: The NTSC/PAL video encoder and VDAC function are not supported.

Face Detect Module Description

The face detect module is a stand-alone module that performs face detection and tracking on a picture stored in the SDRAM memory. It communicates with the Cortex-A9 MPU, DSP, and Cortex-M3 MPU
subsystems.

Face detect is typically used on:
• Video encoding
• Face-based priority auto-focusing
• Red-eye removal

The face detect module comprises:
• Face detection core with embedded DMA engine for data memory access
• RAM and ROM memories
• L3 and L4 port interfaces

Cortex-M3 MPU Subsystem Description

[The dual Cortex™-M3 microprocessor (MPU) subsystem controls the imaging subsystem (ISS) and manages some controls of the video and display subsystem. It contains two ARM® Cortex-M3 processors (CPUs) that share a common level 1 (L1) cache (shared cache). One of the CPUs is dedicated to sequencing still image coprocessor (SIMCOP) accelerators, and the other CPU is dedicated to the ISS and display subsystem control. A single image real-time operating system (RTOS) runs on both cores, thereby minimizing the code size. The integrated interrupt handling of the dual Cortex-M3 MPU allows efficient control of the ISS.]

The Cortex-M3 MPU subsystem includes the following components:
• Two Cortex-M3 CPUs: One for SIMCOP control, and the other for RTOS, ISP, and display subsystem control
• ARMv7-M and Thumb-2 instruction set architecture
• Dedicated INTC with up to 64 physical interrupt events
• Two-level memory subsystem hierarchy
– L1
— 32-KB shared cache memory
– L2 ROM + RAM
— 64-KB RAM
— 16-KB bootable ROM
• Cortex-M3 system bus directly connected to the ISS interconnect
• MMU for address translation
• Integrated power management
Emulation feature embedded in the Cortex-M3

Texas Instruments OMAP4460 Display - Face Detect - ISS - Cortex M3 MPU subsystem -- 17-Oct-2011
TI OMAP4460: Display – Face Detect – ISS – Cortex M3 MPU subsystems

ISS Description

[The imaging subsystem (ISS) deals with the processing of the pixel data coming from an external image sensor, data from memory (image format encoding and decoding can be done to and from memory), or data from SL2 in IVA-HD for hardware encoding. With its subparts, such as interfaces and interconnects, image signal processor (ISP), and still image coprocessor (SIMCOP), the ISS is a key component for the following multimedia applications: camera viewfinder, video record, and still image capture.]

The ISS processes data coming from the image sensor, memory, and IVA-HD subsystem. The ISS is responsible for multimedia applications such as: camera viewfinder; video record with up to 1080 p at 30 fps with digital zoom and still image processing, such as image capture up to 16 Mp with digital zoom and rotation. The ISS supports a pixel throughput of up to 200 Mp/s. It assures good performance with sensors up to 16 Mp and more (higher resolution can be achieved through multiple passes). The ISS can implement third-party algorithms for further flexibility when working with image sensors.

The ISS consists of:

• The ISP, which deals with on-the-fly or memory-to-memory data processing. It allows data collection for autoexposure, autowhite balance, autofocus, resizing, and histogram generation.

The ISP consists of:
– Image pipe interface (IPIPEIF) for synchronization signals (HD, VD) for the ISIF, IPIPE, RSZ, and hardware 3A (H3A) modules, and data transfer from video port, SDRAM, ISIF. Various pixel data manipulation functions.
– Image pipe (IPIPE) front-end and back-end modules for raw data processing and RGB and YUV data processing, respectively. They support:
— Sensor data linearization for dynamic range extension
— Programmable 2D lens shading compensation correction
— Black-level compensation
— Gamma correction
— RGB color correction
— RGB to YUV4:2:2 color conversion
— 3D look up table (LUT) for color correction
— 2D edge enhancement
— False chroma suppression
– H3A for autowhite balance, autoexposure, and autofocus
– Pattern generator (PG) for internal data generation for test purposes. It provides the ability to test some of the ISP submodules without the use of an external image sensor.
– Two independent resizers, which allow YUV4:2:2 to YUV4:2:0 planar Chroma filtering and downsampling. The resizers support input and output flows with up to 200 Mp/s, and memory-to-memory rescaling in the range ×1/4096 scale down, and ×20 scale up.– Image sensor interface (ISIF) can process the incoming data and supports the following main functions:
— Sensor data linearization
— Supports VGA read out mode
— Color space conversion
— Digital clamp with horizontal/vertical offset drift compensation
— Vertical line defect correction
— Programmable 2D-matrix lens shading correction
— 10-to-8 bits A-Law compression table inside
– Buffer logic (BL), which processes and manages the requests to the module and memory subsystem

• Peripheral serial interfaces for connection with sensors and memories:
– Two PHYs, CSIPHY1 and CSIPHY2, for physical connection to external sensors
– Peripheral serial interfaces CSI2-A and CSI2-B/CCP2 for image data transfer from sensors to memory or ISP

• Peripheral 16-bit parallel interface, BT656 and SYNC mode

[Parallel interface (CPI)
• 16 bits wide
• up to 148.5 MPix/s
• BT656 and SYNC mode (HS, VS, FIELD, WEN)

The camera subsystem can manage a parallel interface and [up to] two serial image sensors. Depending on the configuration of the shared pins, two of the interfaces can be active at the same time. However, only one data flow can use the ISP. Moreover, if the parallel interface is used data from it goes to ISP and the other used interface must send it to memory.]

• SIMCOP module for memory-to-memory operation; JPEG encode/decode hardware acceleration; high-ISO filtering; block-based rotation; warping and fusion; and general-purpose imaging acceleration.

The SIMCOP includes the following main submodules:
– Two imaging extension (iMX) modules – programmable image and video processing engines
– Noise filter 2 (NSF2) – for advanced noise filtering and edge-enhancement
– Variable-length coder/decoder for JPEG (VLCDJ) module
– Discrete cosine transform (DCT) module
– Lens distortion correction (LDC) module
– Rotation accelerator (ROT) engine
– Hardware sequencer, which offloads sequencing tasks from the MPU
– Shared buffers/memories
– DMA controller

• Timing control module for CAM global reset control, CAM flash strobe, and CAM shutter

• System interfaces and interconnects comprising:
– Two configuration interfaces
– One 128-bit master data interface
– Internal ISS interconnects for image data and configuration
– On-chip RAM interface
– Circular buffer (CBUFF) and burst-translation engine (BTE) for efficient communication with external memory (SDRAM/TILER support)

2D/3D Graphics Accelerator [SGX Subsystem] Description

The 2D/3D graphics accelerator subsystem is based on POWERVR® SGX540 core from Imagination Technologies. It supports phone/PDA and handheld gaming applications. [The POWERVR SGX540 v1.2.0 architecture is scalable and can target all market segments from mainstream mobile devices to high-end desktop graphics.] The SGX can process different data types simultaneously, such as: pixel data, vertex data, video data, and general-purpose data processing. [Targeted applications include feature phones, PDAs, and handheld gaming applications.]

The SGX subsystem has the following features:
• Universal scalable shader engine ( USSE™), multithreaded engine incorporating pixel and vertex shader functionality to reduce die area
• Advanced shader feature set in excess of Microsoft VS3.0, PS3.0, and OGL2.0
• Industry-standard API supports Direct3D™ Mobile, OGL-ES 1.1 and 2.0, OpenVG™ 1.1, and OpenMAX™
• Fine-grained task switching, load balancing, and power management
• Programmable high-quality image antialiasing
• Advanced geometry DMA driven operation for minimum CPU interaction
• Fully virtualized memory addressing for OS operation in a unified memory architecture
• Advanced and standard 2D operations, such as vector graphics, BLTs, ROPs, etc.
• Programmable video encode and decode support for H.264, H.263, MPEG-4 (SP), WMV9, and JPEG

On-Chip Debug Support [EMU Subsystem] Description

[Debugging a system containing an embedded processor involves an environment that connects high-level debugging software, executing on a host computer, to a low-level debug interface supported by the target
device. In between these levels is a debug and trace controller (DTC) that facilitates communication between the host debugger and the debug support logic on the target chip.

A combination of hardware and software that connects the host debugger to the target system, the DTC uses one or more hardware interfaces and/or protocols to convert actions dictated by the debugger user to
JTAG® commands and scans that execute the core hardware.

The debug software and hardware components let the user control multiple central processing unit (CPU) cores embedded in the device in a global or local manner. This environment provides:
• Synchronized global starting and stopping of multiple processors
• Starting and stopping of an individual processor
• Each processor can generate triggers that can be used to alter the execution flow of other processors.

System topics include but are not limited to:
• System clocking and power-down issues
• Interconnection of multiple devices
• Trigger channels

For easy integration into applications, a set of libraries (APIs) for debug-IP programming and a software message library are being provided. CToolsLib is a collection of embedded target APIs/library to enable
easy programmatic access to the chip tools (CTools), which are system-level debug facilities included in the debug subsystem capabilities of TI devices. More information about the APIs, download files, and
other useful links for available libraries can be found on the CToolsLib Wiki site: http://processors.wiki.ti.com/index.php/CToolsLib]

The on-chip debug support has the following features:

• Multiprocessor debugging lets users control multiple CPU cores embedded in the device, such as:
– Global starting and stopping of individual or multiple processors
– Each processor can generate triggers that can be used to alter the execution flow of other processors
– System clocking and power down
– Interconnection of multiple devices
– Channel triggering

• Target debugging, using IEEE1149.1 (JTAG®), or IEEE1149.7 (complementary superset of JTAG) port
• Reduction of power consumption in normal operating mode
• Real-time software trace allows the OMAP software masters to transmit trace data from OS processes or tasks on 256 different channels.

The debug subsystem includes:
• IEEE1149.7 adapter
• Generic TAP for emulation and test control ( ICEPick-D™)
• Debug access port (DAP)
• Processor trace subsystem
• System trace subsystem
EMU configuration interconnect
• Cross-triggering unit (XTRIGGER)
• Debug resource manager (DRM)

ICEMelter:
• Controls the wake-up and power-down of the emulation power domain

CORE instrumentation interconnect:
• Initiator ports:
– L3 interconnect (for software instrumentation and performance probes)
– OCP-WP
– IVA-HD instrumentation (HWA profiling)
– CM2 instrumentation
• Target port:
EMU instrumentation interconnect

OCP watch-point (OCP-WP):
• Monitors L3 interconnect transaction when target transaction attributes match the user-defined attributes or trigger on external debug event
• Only one instance, shared among the following L3 targets:
– GPMC
– L4_PER
– L4_CFG

Power management events profiler (PM instrumentation)

Clock management events profiler (CM instrumentation)

Statistics collector (performance probes)

Texas Instruments OMAP4460 EMU subsystem - PRCM module - System Peripherals - SAR RAM - SAR ROM - 17-Oct-2011
TI OMAP4460: EMU subsystem – PRCM module –
System Peripherals – SAR RAM – SAR ROM

Power, Reset, and Clock Management [PRCM module]Description

The PRCM module allows efficient control of clocks and power according to the required performance, and reduction of power consumption.

[Power management (efficient use of the limited battery resources on a mobile device) is one of the most important design aspects of any mobile system. It imposes strong control over limited available power resources to ensure they function for the longest possible length of time.

The device power-management architecture ensures maximum performance and operation time for user satisfaction (audio/video support) while offering versatile power-management techniques for maximum design flexibility, depending on application requirements.

This introduction contains the following information:
• Power-management architecture building blocks for the device
• State-of-the-art power-management techniques supported by the power-management architecture of the device

To provide a versatile architecture supporting multiple power-management techniques, the power-management framework is built with three levels of resource management: clock, power, and voltage management.

These management levels are enforced by defining the managed entities or building blocks of the power-management architecture, called the clock, power, and voltage domains.

A domain is a group of modules or subsections of the device that share a common entity (for example, common clock source, common voltage source, or a common power switch). The group forming the domain is managed by a policy manager. For example, a clock for a clock domain is managed by a dedicated clock manager within the power, reset, and clock management (PRCM) module. The clock manager takes into consideration the joint clocking constraints of all the modules belonging to that clock domain (and, hence, receiving that clock).

NOTE: In the following sections, the term module is used to represent the device IPs (that is, modules or subsystems), other than the PRCM module, that receive clock, reset, or power signals from the PRCM module.

Clock Management

The PRCM module manages the gating (that is, switching off) and enabling of the clocks to the device modules. The clocks are managed based on the requirement constraints of the associated modules. The following sections identify the module clock characteristics, management policy, clock domains, and clock domain management.

Power Management

The PRCM module manages the switching on and off of the power supply to the device modules. The power to the modules can be switched off when they are not in use to minimize device power consumption. Independent power control of sections of the device allow the PRCM module to turn on and off specific sections of the device without affecting the others.

Voltage Management

The PRCM module controls the voltage scaling (that is, switching the voltage in discrete steps or in a continuum within a range of possible values) of the power sources of the device. This allows control of the
device power consumption according to the performance criteria defined. Higher performance is ensured with higher voltage and clock frequencies (and hence higher power consumption), while lower performance can be supported with lowered power consumption by reducing or completely gating the power supply to specific areas of the device and gating the associated clocks.
…]

The PRCM module is divided into:

• Power and reset management (PRM), based on the SmartReflex™ framework with the following features:
– Dynamic clock gating
– Dynamic voltage and frequency scaling (DVFS)
– Dynamic power switching (DPS)
– Static leakage management (SLM)
– Adaptive body bias (ABB)
– Retention-till-access (RTA) for memories

• Clock management 1 (CM1) for clock generation, distribution, and management for the Cortex-A9 MPU, ABE, and CORE always-on power domains. The clock management allows reduction of dynamic
consumption.

• Clock management 2 (CM2) for clock generation, distribution, and management for other modules

System and Connection Peripherals

The OMAP device supports a comprehensive set of peripherals to provide flexible and high-speed (HS) interfacing and on-chip programming resources.

System Peripherals [see on the above diagram]
• Seven general-purpose timers (GPTIMER)
• One watchdog timer (WDTIMER)
• One 32-kHz synchronization timer (32KTIMER)

• System control module, which contains registers for the following functions:
– Static device configuration
– Debug and observability
– Status
– Pad configuration
– I/O configuration
– eFuse logic
– Analog function control
– System boot decoding logic

• System mailbox with eight mailbox message queues

[Communication between the on-chip processors – Cortex-A9 MPU, DSP and Cortex-M3 MPU – of the device uses a queued mailbox-interrupt mechanism. The queued mailbox-interrupt mechanism allows the software to establish a communication channel between two processors through a set of registers and associated interrupt signals by sending and receiving messages (mailboxes). ]

• One SPINLOCK module [provides hardware assistance for synchronizing the processes running on multiple processors in the device] with 32 hardware semaphores, which can service tasks between the Cortex-A9 MPU, DSP, and Cortex-M3 MPU subsystems

• One chip-to-chip (C2C) interface, which [is a serial, low-latency, peer-to-peer communication protocol that enables the extension of an internal protocol bus to one physical device over a printed circuit board (PCB). It] services the communication between the OMAP device and external devices

Connection Peripherals

… [see later]

On-Chip Memory Description

The on-chip memory is divided into L3 OCM RAM, SAR ROM, SAR RAM, and memories in the subsystems (Cortex-A9, Cortex-M3, ABE, and IVA-HD).

• The L3 OCM RAM consists of 56KB of on-chip SRAM.
• The save-and-restore (SAR) ROM [see on the above diagram] consists of 4KB and contains a linked list of descriptors used by the system DMA (sDMA).
• The SAR RAM [see on the above diagram] consists of 8KB divided into four blocks. It is used as context-saving memory when the device goes into off mode.

Memory Management Description

The memory management is performed from:

sDMA controller with up to 127 requests, 32 prioritizable logical channels, and 256 × 64-bit FIFO

[The system direct memory access (SDMA) module, also called DMA4, performs high-performance data transfers between memories and peripheral devices without microprocessor unit (MPU) or digital signal
processor (DSP) support during transfer. A DMA transfer is programmed through a logical DMA channel, which allows the transfer to be optimally tailored to the requirements of the application. ]

• Dynamic memory management (DMM) module, which performs global address translation, address rotation (tiling), and access interleaving

[The dynamic memory manager (DMM) module is typically located immediately in front of the synchronous dynamic random access memory (SDRAM) controller (SDRC), as shown in the below diagram.

In a broad sense, the DMM manages various aspects of memory accesses such as:
– Initiator-indexed priority generation
– Multizone SDRAM interleaving configuration
– Block object transfer optimization – tiling
– Centralized low-latency page translation – MMU-like feature

The dynamic qualifier for memory management highlights the software configurability, and hence the runtime nature, of the four aspects of memory management handled by the DMM.]

External Memory Interface Description

There are two main interfaces for connection to external memories: general-purpose memory controller (GPMC) and dual-channel SDRAM controller (SDRC).

The GPMC [an unified memory controller dedicated to interfacing external memory devices] supports:
• Asynchronous SRAM memories
• Asynchronous/synchronous [, and page mode (available only in nonmuxed mode) burst] NOR flash memories
• NAND flash memories
• Pseudo-SRAM devices

The SDRC/EMIF [provides connectivity between the device and LPDDR2-type memory and] allows:
• Connection between the device and LPDDR2-type memory. It supports double-data rate (DDR) and single-data rate (SDR) protocols. The EMIF is the interface between LPDDR2 SDRAM and the Cortex-A9 MPU subsystem, ISS, IVA-HD subsystem, SGX, and DMA controllers.
• PHY is the DDR physical interface, which implements data-rate conversion in compliance with LPDDR2 JEDEC requirements.

Texas Instruments OMAP4460 DMM Module - External Memory Interface - OCM RAM - Connection Peripherals - sDMA Controller - 17-Oct-2011
TI OMAP4460: DMM Module – External Memory Interface – L3 OCM RAM – Connection Peripherals – sDMA Controller

System and Connection Peripherals

The OMAP device supports a comprehensive set of peripherals to provide flexible and high-speed (HS) interfacing and on-chip programming resources.

System Peripherals
… [see earlier]

Connection Peripherals
• Three universal asynchronous receiver/transmitter (UART) modules as serial-communication interfaces
• One UART + IrDA SIR up to FIR + TV remote control interface (CIR)
• McBSP module to provide full-duplex serial communication between the OMAP and other applications chips and codecs
• Five HS I2C™ controller modules; four of them are general-purpose modules with rates up to 3.4 Mbps, and the fifth one, in the PRCM module, performs dynamic voltage control and power sequencing with an external power IC.
• HDQ™/ 1-Wire® – Benchmarq HDQ and Dallas Semiconductor 1-Wire protocols interface
• Two HS MMC/SD/SDIO modules with 8-bit data bus interface, that can act as an initiator on L3 interconnect thanks to an embedded DMA
• Three HS MMC/SD/SDIO modules with 4-bit data bus interface
• Six general-purpose input/output (GPIO) modules with 32 I/Os each
• One keyboard controller, which supports up to 9 × 9 matrix keypads
• One MIPI SLIMbus interface
• Four multichannel serial peripheral interface (MCSPI) modules
• One HS universal serial bus (USB) On-The-Go (OTG) module with embedded PHY, compliant with the USB2.0 (up to 480 Mbps) standard for HS functions and with the OTG supplement
• One HS multiport USB host module, which can be used for interchip connection or with an off-chip transceiver. It is compliant with the USB2.0 standard. The USB host module allows communication with USB peripherals with data rates up to 480 Mbps for HS, up to 12 Mbps for full-speed, and up to 1.5 Mbps for low-speed.
• One full-speed USB module compliant with the USB1.1 standard for full-speed functions
• One MIPI high-speed synchronous serial interface (HSI) module with two full-duplex serial communication interfaces. It is used for communication between the OMAP device and an external device, with data rates up to 192 Mbps for transmission, and up to 225 Mbps for reception. The MIPI HSI supports 16 logical channels on each destination (RX/TX).

GLBenchmark 2.1

Qualcomm is very close to getting the HTML5 web apps performance and feature set to rival that of native OS apps

OnQ: Delivering Better Web Experiences for Snapdragon S3 Mobile Processors [Sy Choudhury, Director of Product Management, Web Technologies, Oct 10, 2011]

Sy Choudhury, Director of Product Management for Qualcomm, demonstrates how our web optimizations can enhance the overall web browsing and web apps experience on Android for Snapdragon S3 mobile processor-based devices.

Heavy Lifting on the Mobile Web – Put It Where It Belongs [Sy Choudhury, Director of Product Management, Web Technologies, July 7, 2011]

I encourage you to take a close look at the Snapdragon™ mobile processor– its architecture, documentation and tools – as you consider developing mobile Web apps for Android. The image above maps the Snapdragon processor to the heavy lifting you face in delivering a good mobile Web experience to your customers.

Let’s go through them individually:

Transport– DNS lookup, page loads, page reloads, image downloads…the browser never lets the modem have any peace. But the browser – not to mention the user –is more forgiving on the desktop than on a mobile device. The Web transport functions need to work intelligently on mobile devices or the user experience will drown in latency and needless reloads from the network.

Layout – Images are almost 2/3 of the payload of the average Web page. Do you want graphics-rich sites like photo galleries and social networks hogging the CPU to decode images? The browser needs to take one look at them and offload them to dedicated hardware for decoding.

Scripting– JavaScript is a big part of the Web that is only going to get bigger on the mobile Web. Device APIs associated with HTML5, for example, give Web-based applications access to mobile-specific hardware components like compass, sensors, GPS, camera, audio and more. Last year’s JavaScript engine won’t suffice to handle these efficiently.

Rendering – Whether you need to compose pages in a frame or stream mobile video smoothly, there are better places to do it than the CPU. The work of drawing page objects on separate layers and merging them efficiently belongs on a graphics processing unit (GPU), and the coming onslaught of mobile videofavors chipsets with a dedicated multimedia engine.

In short, your mobile Web apps are going to rely on the browser and the JavaScript engine to perform a lot of heavy lifting. Dumping all that work on the CPU is not a good, long-term development strategy, which is why the Snapdragon processor is designed to carve it up and hand it off to function-specific engines.

That’s one big advantage to pulling all of this functionality into a single chip. Another advantage is that it makes things easier for everybody. We produce the components more efficiently, manufacturers sacrifice less real estate inside the device, and you keep your eye on just one set of rules for writing to hardware.

Also, as part of Qualcomm’s Web Technologiesinitiative, we’ve been developing and implementing optimizations for all of this functionality. Qualcomm has made them available as updates to Adobe® Flash® Player and Qualcomm Innovation Center, Inc., our wholly owned subsidiary that focuses on mobile open source contributions, has made them available to the community. You can take advantage of them by developing for the Snapdragon processor, because we also include them as part of the software bundle we ship.

Want to know more? We’ve written a series of papers on what it’s going to take – in the browser, in the JavaScript engine, in the mobile processor – to make users as productive on the mobile Web as they’re accustomed to being on the desktop. Have a look at the papers and …

Vellamo Mobile Web Browser Comparison for Android [Sy Choudhury, Director of Product Management, Web Technologies, July 14, 2011]

The Vellamo web browser comparison benchmark evaluates browser performance on Android devices. The tool provides comparative analysis of browser performance and stability, including networking, JavaScript, rendering, and user experience. Incorporating industry standards and custom benchmarks, Vellamo is sure to impress mobile users!

Web Technologies [Initiative] [QDevNet, Aug 24, 2011]

Give your end users mobile web applications that are designed to run like native applications.

Get ready for a few realities about developing for the mobile Web:

  • Your users want the kind of rich multimedia content and far-reaching applications that rely on the browser and JavaScript.
  • Rich content and complex Web applications also rely on hardware resources deep inside the mobile device.
  • You need to give your Web users desktop-quality performance on mobile devices before your competitors do.

To make this easier for you, the Web Technologies initiative from Qualcomm Incorporated and Qualcomm Innovation Center, Inc.(QuIC) enables a series of software features and hardware-tuned performance optimizations that give the Web application environment deep reach into the mobile device. The end result–a level of performance from your Web app that users typically expect from native applications and even desktop applications.

We’ve optimized the WebKit browser, the V8 JavaScript engine and Adobe® Flash® Player 10 for best-in-class support of the Web on smart mobile devices:faster page downloads and reloads

  • better interactivity with Web apps and pages
  • snappier, smoother response to user commands
  • the highest quality and resolution multimedia streams
  • lower overall power consumption
  • Web application functionality and performance on par with native mobile apps

Developer Resources

Web Technologies Tools and Resources
Using our runtime software packages, you can begin developing mobile Web apps that perform more like native apps.

Videos

Uplinq 2011 Super Session: Is HTML5 the Future of Smartphone Apps?: A Conversation About Web Technologies
Is HTML5 the future of mobile apps? Can web apps ever perform on par with native apps? What do the advances in browser-based experiences bode for mobile operating systems? How can hardware matter in such an abstracted environment? Join Ben Wood, director of research for leading industry analyst firm CCS Insight, as he engages Rob Chandhok, who leads Qualcomm’s software strategy efforts, on these and other questions central to the intersection of web technologies and mobile.

Uplinq 2011 Session: Session: Developing Rich Web Apps for Smartphones
Most mobile app developers today choose the native app route for performance and feature reasons. However with most apps, taking advantage of a connection to the internet, using the language of web, HTML, JavaScript and XML for future applications makes more sense than ever before. This session will provide an overview of the work to enhance the performance of the browser to enable web apps to equal the snappiness of their native counterparts. We will then cover new device-side functionality that web page and web app developers can expect to access in the near future to build everything from standalone graphically rich web apps through to connected and dynamic use cases.

Snapdragon HD 720p Video Performance [Sy Choudhury, April 29, 2011]

Sy Choudhury, Director of Product Management for Qualcomm, demonstrates Snapdragon’s the in-page web video capability, HD video at 720p in HTML5 and Flash, and full HD video at 1080p for mobile devices

DASH – Toward a Better Mobile Video User Experience [Sy Choudhury, Director of Product Management, Web Technologies, Aug 16, 2011]

Do you like jittery, staccato playback and long buffer times when you watch video on your phone or tablet? Neither do I. Neither does Qualcomm.

Let’s face it, though: the mobile video genie is out of the bottle, and it’s not going back in. Video streaming continues to dominate mobile bandwidth consumption, accounting for 39 percent of data usage in the first half of 2011, according to the H1 2011 Allot MobileTrends Report. Elsewhere, Frost & Sullivan notes that CTIA has called for an additional 800 MHz of bandwidth to cope with the onslaught of mobile video; the U.S. government is trying to provide 500 MHz of that request.

There’s no simple solution that will ensure a good mobile video experience. We’ve identified areas that are ripe for improvement and are working diligently to address them. DASH – Dynamic Adaptive Streaming over HTTP – is an important one. We see DASH as the industry’s best approach to streaming mobile video, while preserving the kind of video experience consumers expect.

What is DASH?

DASH is an open standard that addresses what we think are many of the biggest problems in delivering streaming video:

1. File size– In the old days, Web video was easy. You downloaded a 2- or 4- or 10 MB file to your device and then played it. That wasn’t really streaming, and it wasn’t scalable – imagine streaming high-definition movies that way. So DASH is a standard for chopping video streams into smaller segments.

2. Changing network conditions– To keep a stream of video flowing smoothly, servers need to send these smaller segments when the device can accommodate them. With DASH, the video lives on the server in several different bit-rates – for example, 250 kbit/s low quality, 500 kbit/s medium quality and 1000 kbit/s high quality. And here is the key; the device determines and then commands the server to send the best quality given the current network conditions (see diagram).

3. Proprietary formats– Most Web video is encoded in common codec formats like H.264 but stored in various streaming formats, depending on the media player on the device. Adobe, Apple, Microsoft, Netflix and many of the other names you associate with video delivery have their own streaming format and their own approach to streaming. DASH defines openly published profiles and the device’s native player can therefore easily support these various streaming profiles.

4. Digital rights management (DRM)– For premium video like movies and sporting events, content owners want their rights protected. DASH is focused only on the core streaming technology and hence works seamlessly with various DRM solutions.

If you want to know more of the technical details, Thomas Stockhammer, on our team has published a paper on the design principles and standards we’re putting into DASH.

What’s Qualcomm doing?

Qualcomm and Qualcomm Innovation Center, Inc. (QuIC) have participated as the work-item lead and helped promote DASH with 3GPP, and were the main authors of the DASH specification in MPEG. In collaboration with companies such as Ericsson, Apple, Netflix and Microsoft, Qualcomm has worked on the standard. Although MPEG-DASH content has yet to be published, we’re working with content owners to help bring this open standard to market.

As a result, we’re building a lot of expertise and we’ve chosen to make it widely available. As a matter of fact, to encourage adoption of the DASH standard, Qualcomm will not seek royalties or license fees for use of its DASH Essential Patents as defined in our DASH Licensing Commitment.

You’re going to see similar announcements from other technology companies who realize that it’s time for an open standard for adaptive, Internet streaming video – one which is also easy to implement and bring to market.

Keep an eye on DASH as the standard evolves, and let me know in the comments what your company is doing about the user experience in mobile video.

Snapdragon Processor Enables Flash Player on Windows 8 – A Qualcomm, Microsoft & Adobe [Rick Lau, Sept 15, 2011]

Through its collaboration with Microsoft, Qualcomm is proud to show the Windows 8 Developer Preview running on the latest dual-core Snapdragon processor. Shown running on the desktop, Internet Explorer in the Windows 8 Developer Preview features support for the latest web standards as well as the Adobe Flash Player, giving consumers a rich browser experience and developers support for whatever tools that best suit their needs. Flash is an important part of the web browsing experience – and Qualcomm supports the Flash Player today on our dual core Snapdragon processor running Windows 8.

The Next App OS is the Web Browser [Liat Ben-Zur on QDevNet, Oct 7, 2011]

By optimizing the browser to really take advantage of dedicated hardware blocks in our Snapdragon mobile processors, we’re seeing comparable levels of video performance across both web apps and native apps – 30 frames per second. Not only can we play 1080p video files, we can playback 1080p video in Flash and HTML5. In fact, in HTML5 we’re able to get multiple video streams running live on a page at the same time.

We’re also closing the gap on advanced graphics with the help of HTML5 Canvas for 2D graphics and WebGL for the 3D equivalent. We’re seeing sample 3D WebGL content benchmarked at 25fps in a Web App, vs. 50fps in a native, OpenGL-ES equivalent app on the same device. Though the native app offers twice as many fps, anything over 25fps is not very noticeable to the human eye. Though we see this gap steadily closing over time.

While HTML5 is truly catching up in terms of performance, it still lags behind native apps when it comes to accessing hardware features. Whether it’s full Bluetooth access, advanced camera features, accelerometers or gyros, native apps still have the edge. This is why we are now focusing on this area, so expect to see a lot more device features exposed via Javascript bindings in the future. Qualcomm Innovation Center, Inc. (QuIC) is also working with open standards organizations, such as W3C and Khronos, as well as collaborating with others to ensure an open web.

I think we will see web apps first in tablets followed by Smart TVs. Once more and more TVs have full HTML5 browsers in them, it’s going to break open a whole new set of exciting user experiences. For example, you will no longer be tied to a limited set of Samsung TV Apps, LG TV Apps or Roku Apps. The whole Web will be at your beck and call via your TV Remote. That’s quite a game changer — one that Google TV has attempted to bring us.

If web apps become mainstream on tablets and TVs, they will have to become mainstream on allmobile devices. Speaking of which, we cannot discount the growth of the hybrid apps that are currently available on smartphones, which leverage a lot of HTML5. These are already mainstream.

Web apps are destined to take off for another simple reason: there are a lot more web developers (familiar with HTML5) out there than native app developers. And there are even fewer developers building tablet apps and TV apps. So the momentum is behind web apps — it’s just a matter of time.

The technology in our Snapdragon chips is always evolving, and we are constantly adding more intelligence and features into the chipset via hardware and software. The more features we add, the more we want to expose to web apps.

For example, we’re pushing the envelope in terms of what the camera can do with things like facial recognition, multi-shot with zero shutter lag, smile detection, blink detection, gaze analyzer, etc. So now, it’s no longer just about exposing a camera API to web apps, its about exposing all these advanced post processing features to web apps, too. Similarly we’re doing some very cool things around proximity-based peer to peer (P2P). Imagine the possibilities when your web app can reach out, discover and connect with other web apps nearby you.

Also, as I touched on earlier, we’re working to bring our Snapdragon processors to TVs, too. We suspect that more people will want to buy connected TVs that have all these cool HTML5 web app capabilities, as opposed to spending thousands of dollars and being locked into just Samsung, LG or Roku TV apps.

… with the Snapdragon chip, your browser doesn’t have to be just another piece of software. It can be optimized to take full advantage of all of Snapdragon’s subsystems. Here are a few examples of how a web browser’s performance can be turbocharged when tuned for the Snapdragon chip:

Transport
(Optimizations for the Snapdragon integrated modem and intelligent connectivity engine.)

  • Designed to achieve up to 50% faster page and web app downloads1

Layout
(Leveraging smarter caching.)

  • Improved multi-core utilization

Scripting
(Optimizing JavaScript for Snapdragon’s CPU microarchitecture.)

  • 7x faster JavaScript performance in 18 months2

Rendering
(Leveraging Snapdragon’s GPU and multimedia hardware engines.)

  • HTLM5 video performing at full native rate
  • Faster and smoother scrolling, zooming and panning
  • GPU accelerated HTML5 <canvas>, <video>, WebGL and CSS3D animations

1 Source: Tests performed by Qualcomm Innovation Center, Inc. Tested with 30 sites on Wi-Fi and consistent environment on Android 2.3 using HTC Sensation and production OEM device with Dual-CPU A9.

2 Source: Tests performed by Qualcomm Innovation Center, Inc. Tested using Android 2.1 through 2.3 on HTC Nexus One).

First real chances for Marvell on the tablet and smartphone fronts

especially because: Kinoma is now the marvellous software owned by Marvell  [Feb 15, 2011]

Update [Aug 21, 2012]ZTE’s U880 is based on Marvell’s then market leading PXA920 single chip SoC, and was introduced a year ago at a list price of ¥1499 – US$235 but the street price came down to ¥958 – US$150 in October and now it is as low as ¥699 – US$110 [Aug 21, 2012], actually on Amazon in China (see: http://detail.zol.com.cn/cell_phone/index284242.shtml). ZTE achieved U880 sales of more than 3 million by May 15, 2012 by which it was the star TD smartphone as per 中国移动将推全频段TD终端 普及HSUPA report from Communications World Network.
End of update

Earlier updates: – Marvell Technology Group Hones Edge [Seeking Alpha, Jan 19, 2012]

For investors the last few years with Marvell have been tough. The stock pays no dividend. After splitting in 2004 and again in 2006, the stock price entered 2007 at well over $20 per share. At the 2008 bottom it hit a low around $4.48. Today it ended sharply up at $15.12 and represents a market capitalization of $8.8 billion.

These stock price gyrations exaggerated Marvell’s changes in revenues and net income. Total 2006 (fiscal 2007) revenue was $2.24 billion, with slightly negative net income. Revenues for 2010 (fiscal year 2011, ending January 29) were up to $3.6 billion, with net income hitting $904 million. This fiscal year 2012 revenues are trending towards $3.45 billion, but with just $690 million net income.

Meanwhile the main good news has been the rapid ramping of sales of Marvell-processor based smartphones in China. Marvell’s chips not only include the processor, but most of the functions needed to run a smartphone (graphics, cellular modem, wi-fi, bluetooth). Thus while brand-happy Chinese are dying (almost literally) to get iPhones, the middle-class masses are buying Android based smartphones that run on a new high-speed, invented-in-China protocol, TD. The ramp in revenue from this in calendar 2012 will be substantial, and the baseline should be noted in the Q4 report due in early March.

Which brings us back to CES (and leaves out Marvell’s leading enterprise-grade Wi-Fi and wired internet switch chips). I can only hit highlights, so many products were introduced.

Foremost, Google (GOOG) chose Marvell’s ARMADA 1500 HD Media System-on-Chip (SoC) for the next generation of Google TV. While there is no guarantee that Google TV will become a mass market product, it does much to validate the hundreds of millions of dollars Marvell has invested in research and development for ARMADA and related technologies. ARMADA is ARM-based and contains many of the same technologies used with smartphones and tablets. Google has worked closely with NVIDIA (NVDA), Qualcomm (QCOM) and other ARM-based chip designers; this is a clear sign Marvell is also in the inner circle. The ARMADA chip series has been adopted by OEMs for a wide range of consumer and business appliance applications. See also ARMADA and PXA application processors.

Plug computers are a Marvell invention: inexpensive, small but powerful computers that plug directly into electric sockets and can act as local servers. SMILE plugs are designed to connect a classroom of up to 60 students and complement the One Laptop per Child program and Marvell ARMADA based low cost, low power tablet computers. This is mainly for developing nations, but given funding shortages should be considered by U.S. schools as well.

In storage, much has been said about replacing hard drives with SSDs, and PCs with Flash-based tablets. Change has come slowly. Marvell already leads in SSD controller chips. Now it introduced a chip that attached through PCIe, an existing, faster port than the standard SATA disk port. Everyone agrees this will be popular. Alternately another chip allows for an SSD and hard drive to function together better, to lower response times while keeping bulk storage costs low.

Consumer home connectivity and automation were addressed by several products. New models of Avastar wireless chips make it easier for all sorts of devices to connect, including Internet phones and video surveillance. Lighting with LEDs was specifically addressed with new, automation-ready chips. The Smart Energy Platform, a combination of a wireless microcontroller and management software, is aimed at lowering price points for energy-conscious appliances in the home.

Except for Google, OEMs will make their own announcements as branded products become available this year.

I will wait on management’s Q4 fiscal 2012 in early March before trying to estimate directionality for the new year. Technology is rapidly evolving. More individual devices mean more information needs to be stored in the cloud, requiring in turn more HDD storage and connectivity. All these trends favor Marvell, but competitors will be gunning for the same revenue and profits.

What do I think would most enhance shareholder value? A dividend. As of last quarter Marvell had 2.4 billion in cash, no debt, and cash flow of $262 million. Marvell has used its cash mainly for stock buy backs, and is likely to continue to do so.

China Outstrips U.S. in Smartphone Market [Nov 23, 2011]

Deliveries of smart phones to operators and retailers in China grew 58% in the third quarter from the previous quarter to 24 million units. That surpassed 23 million units delivered to the U.S. market, down 7% from the previous quarter …

Nokia Corp. had the largest share of China’s smartphone market in the third quarter, with 29%. … Samsung Electronics Co. Ltd. is chasing hard with 18% of the Chinese market …

Strategy Analytics estimates that 57% of the world’s handsets were manufactured in China in 2010. … two of Nokia’s eight production facilities are based in China and the company said China is also one of its bigger suppliers of mobile handset components. …

TD-SCDMA: US$3B into the network (by the end of 2012) and 6 million phones procured (just in October) [Oct 18, 2011]: meaning a mature TD-SCDMA market (finally) with 627 million potential customers of which only 6.4% are on the 3G
Marvell, Lenovo and China Mobile Team Up To Drive Mass Market Adoption of China’s 3G TD-SCDMA Smartphones [Oct 26, 2011]

Marvell (NASDAQ: MRVL), a worldwide leader in integrated silicon solutions, today announced the launch of Lenovo’s LePhone A66t, a 3.5-inch high-definition screen smartphone customized for China Mobile’s 3G TD-SCDMA market and priced in the 1,000 RMB range [US$ 157]. The LePhone A66t is powered by the Marvell® PXA918 [@624MHz] platform, the first commercially available single-chip solution that integrates a high-performance, low-power application processor with an advanced multimode modem. Marvell’s advanced low-power TD single-chip solution is designed to enable exceptional user experience for watching mobile TV, navigation, video conferencing, social networking, and other popular mobile applications. It also features the Marvell Avastar™ 88W8787 wireless solution, which is Bluetooth 3.0 and FM enabled, offering exceptional Wi-Fi range with beamforming technology, robust 802.11n connectivity and crystal clear audio quality.

“As the second largest provider of PCs and other consumer electronics worldwide, Lenovo is committed to drive the connected lifestyle for billions of consumers around the world. Our LePhone A66t is an ideal mobile device that enables consumers easy access to social networking, e-commerce, gaming and mobile TV at an affordable price of around 1,000 RMB,” said Feng Xing, vice president and general manager of business operation at Lenovo. “Our partner Marvell is one of the top semiconductor leaders that has delivered the most advanced and competitive China 3G TD-SCDMA solution. I believe the introduction of the Lenovo LePhone A66t is a game-changer for the mass adoption of China Mobile’s 3G smartphones.”

“We’re happy to see the successful collaboration between Marvell and Lenovo for creating a world-class China 3G smartphone,” said Xing Hongtao, Deputy General Manager of Marketing, China Mobile Beijing Branch. “China Mobile is very excited on the fast adoption of the advanced 1,000 RMB smartphones and we’re confident of the explosive smartphone growth in the years to come.”

Lenovo’s LePhone A66t smartphone will provide consumers a high quality CMMB digital TV experience, along with best-in-class Wi-Fi connectivity, all delivered in a sleek and sophisticated design form factor. Powered by the Marvell PXA918, Lenovo’s LePhone A66t also features Android 2.2 Operating System, Mobile Hotspot capability, a 3.5 inch high-definition screen with multi-touch support, Marvell RF808 RF transceiver and a Marvell PM8607 integrated audio and power management solution.

For more information about the Marvell PXA918, please visit www.marvell.com/communication-processors/pxa918/ or contact a sales representative.

Samsung Selects Marvell’s Industry Leading China 3G TD-SCDMA Solution for Its New S5820 Android Smartphone with Breakthrough Social-Networking, Mobile Gaming and Mobile TV Capabilities [Oct 19, 2011]

Marvell continues to drive mass market adoption of China’s 3G TD-SCDMA standard and affirms the leadership of its PXA920, the industry’s first commercially available single-chip TD-SCDMA solution, and its Avastar 88W8787 wireless solution

… supporting China Mobile’s TD-HSPA (Time Division High-Speed Packet Access) network. It also features the Marvell Avastar™ 88W8787 wireless solution, which is Bluetooth 3.0 and FM enabled, offering exceptional Wi-Fi range with beamforming technology, robust 802.11n connectivity and crystal clear audio quality. The phone is available now through the retail stores of China Mobile, the largest mobile carrier in the world with over 650 million subscribers.

Update: Price of Samsung S5820 [Aug 21, 2012]: 1288 – US$203 (see: http://www.xj1616.com/product-1797.html)
The price leader is the ZTE-T U880 which has similar specification and a street price of ¥699 – US$110  [Aug 21, 2012] as the lowest.on Amazon in China (see: http://detail.zol.com.cn/cell_phone/index284242.shtml).
End of the update

Price of Samsung S5820 [Oct 22, 2011]: ¥1798 – US$282 (see: http://www.xj1616.com/product-1797.html)
[¥2518 – US$395 is shown striked over, so that could be a kind of list price.]
The price leader is the ZTE-T U880 which has similar specification and a street price of ¥958 – US$150 (see: http://detail.zol.com.cn/cell_phone/index284242.shtml). The list price is ¥1499 – US$235, but the W-SCDMA ZTE Blade version is just ¥1280 – US$200 with street price as low as ¥898 – US$141. Keep in mind however that the later has an only 750 DMIPS CPU [ARM1136 @600MHz] while the PXA920 has an 1168 DMIPS CPU [Marvell PJ1 Sheeva @800MHz].)
Marvell Drives New Rollout of TD-SCDMA Smartphones from China Mobile, the World’s Largest Mobile Operator [June 28, 2011] (emphasis is mine)

ZTE Launch Signals New Era of TD-SCDMA Smart Devices in China Powered by Marvell’s Industry-First Single Chipe Solutions

Blade U880, one of ZTE’s flagship smartphones, is powered by the Marvell® PXA920 and features a 3.5 inch WVGA capacitive touchscreen at a resolution of 800 x 480 pixels, delivering exquisite pictures with rich colors and multi-touch. Other features include Android 2.2 support, a TD-SCDMA +WLAN dual wireless Web connection, WLAN-AP wireless routing, CMMB (MBBMS) mobile phone TV, a 5 megapixel auto-focus camera, 720p high-definition video, GPS/AGPS navigation and a 3D graphics processing accelerator.

The TD version of ZTE Blade could be price leader because except the PXA920 SoC the rest of it is based on ZTE’s highest volume smartphone, the W-CDMA-based ZTE Blade.
See: ZTE Achieves 35 Million Handsets Milestone in First Half of 2011 [Aug 9, 2011]

 In 2011, ZTE’s Blade also became one of the world’s top-selling smartphones. Through partnerships with approximately 80 operators globally [see the ZTE Blade in wikipedia for operator branding], ZTE’s Blade is now available in nearly 50 countries and regions. The Blade’s daily sales in China are the nation’s highest for Android smartphones, averaging 16,000 units per day. ZTE has now sold 2.5 million Blade handsets globally and expects to break the five million mark this year.

[This was actually achieved by a big order: ZTE Receives Order for 2 Million ZTE Blade V880 Smartphones from China Unicom [Sept 26, 2011]]

Samsung S5820[-TD-HSDPA] [Samsung product page in Chinese only, Sept 14, 2011, as translated by Google]

Metallic appearance
– Metal body delightful sparkling.

Android ™ 2.3 smart operating system
– Android ™ 2.3 smart operating platform one-upmanship.

Social applications pre-installed
– Pre-happy network, all network, flying letters, Sina microblogging, social network are collected, and enjoy social fun.

WLAN high-speed Internet
– WLAN high-speed Internet access speed challenge.

CMMB mobile TV and mobile data services
– CMMB mobile TV and mobile data services, rich applications endless.

Marvell Showcases 16 China Mobile TD-SCDMA Smartphones from Leading Global OEMs at PT/EXPO Comm China 2011 [Sept 25, 2011]

Product display at PT/EXPO highlights ongoing collaboration between Marvell, China Mobile and leading global OEMs to deliver affordable, advanced China’s 3G TD-SCDMA smartphones to the world’s largest mobile market

Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced it will showcase a full suite of China’s 3G TD-SCDMA solutions at PT/EXPO Comm China 2011 in booth 1B005. The lineup includes smartphones, tablets and mobile hotspots powered by Marvell’s PXA920 single-chip product line and the PXA1202, the industry’s first Downlink Dual Carrier (DLDC) TD-HSPA+modem. Considered the most influential exhibition for China’s burgeoning communications industry, PT/EXPO Comm China 2011 takes place September 26 to 30 in Beijing. Marvell will demonstrate a total of 16 TD smart devices that feature its single-chip solutions from leading global OEMs: ASUS, Hisense, Huawei, Guangdong Mobile, Motorola, RIM, Samsung, Sharp, Sony Ericsson, Yulong and ZTE.

“We’re very pleased to see the great progress we’ve made with our vision of the connected lifestyle for everyone in the world. I believe the breakthrough in our China’s 3G TD-SCDMA technology with the largest mobile carrier, China Mobile, in the largest mobile market, is a major milestone and testimony to our vision. When China Mobile began its mission to build an advanced and affordable smartphone more than four years ago, Marvell was the major silicon partner who committed to the program because we believed in China Mobile’s vision and bright future of this great opportunity,” said Weili Dai, Marvell’s Co-Founder. “I believe Marvell has enabled a quantum leap in the development and adoption of the TD-SCDMA standard. For example, Marvell is leading the way to a new era of seamless global connectivity for the masses with the industry’s first single chip 3G/4G modem with support for FDD-LTE, TDD-LTE, HSPA+, TD-SDMA, and EDGE. Now through our work with other industry leaders, billions of end users can experience high-performance web browsing, live video, 3D gaming and other popular features on affordable, advanced devices including smartphones, tablets and mobile hot spots. I am very proud and thankful for Marvell’s global team of engineers for their hard work, innovation and dedication to move the industry forward. The products we are showcasing exemplify what can be accomplished with cutting-edge technology – and this is only the beginning of what’s to come with our continued commitment to TD-SCDMA.”

Marvell has partnered with the TD Industry Alliance (TDIA) at the show to demonstrate the rapid adoption and product implementation of TD-SCDMA. With its technological achievements and commitment to innovation, Marvell has been a strong supporter and contributor to the evolution of the TD-SCDMA industry in China. Other government, telecom operators and Marvell partners such as MIIT and China Mobile will also be in attendance, making the event the de facto meeting place for decision-makers in the TD ecosystem.

All of the products to be displayed – ranging from entry-level smart devices to mid-level devices with rich multimedia functions and 3D graphics – feature Marvell’s PXA 920 family of silicon, including:

  • The PXA920 – The industry’s first single-chip TD solution designed for multimedia-centric handsets featuring support for both TD-SCDMA and GSM/EDGE and now shipping in more than 10 devices.
  • The PXA918 – Tailor-made for entry-level smart devices, featuring 55 nm technology, 624 Mhz processors and rich multimedia functions.
  • The PXA920H – Designed for mid- and high-end smart devices featuring 55 nm technology, a 1Ghz processor and support for 720p video and 250mpps 3D graphics.

Marvell will also showcase the industry’s first DLDC TD-HSPA+ Modem PXA1202, a pivotal milestone in advancing China’s TD-SCDMA standard, which can help to achieve 4X data rate increase on TD-SCDMA networks. Featuring 40 nm technology and backwards compatible with previous generations of TD-SCDMA network equipment, the PXA1202 supports DLDC, 64QAM and TS0 enhancement technologies. It is also designed to enable seamless performance with bandwidth-hungry mobile applications and multimedia devices.

Marvell’s PXA920 Family of SoCs

PXA918

PXA920

PXA920H

Target market entry-level smart devices (a lower-cost yet high performance solution for multimedia-centric handsets) multimedia-centric handsets mid- and high-end smart devices (to provide higher performance solution for multimedia-centric handsets)
Silicon technology 55 nm 55 nm 55 nm
Clock frequency 624MHz 806 MHz 1GHz
Dhrystone performance 870 DMIPS 1130 DMIPS 1400 DMIPS
Memory interface LPDDR1 LPDDR1 LPDDR2
3D graphics performance up to 8Mtriangle/s and 150Mpixel/s fill rate up to 10M triangles/s sustained (20M triangles/s peak at 50% cull rate) and 200M pixels/s fill rate up to 12Mtriangle/s sustained and 250Mpixel/s fill rate
Video playback performance D1 at 30 fps for H.264, WMV, MPEG-4, H.263 720p at 30 fps for H.264, WMV, MPEG-4, H.263 720p at 30 fps for H.264, WMV, MPEG-4, H.263
Video capture performance D1 at 24 fps for H.264, WMV, MPEG-4, H.263 D1 at 30 fps for H.264, WMV, MPEG-4, H.263 D1 at 30 fps for H.264, WMV, MPEG-4, H.263

The block diagram for the SoCs is the same as shown by the PXA918 case below (only the above data written into the blocks is different):

the rest is in the: Complete information in PDF: Marvell PXA920 Family of SoCs [Sept 25, 2011]

End of earlier updates

How Marvell is doing after Marvell’s single chip TD-SCDMA solutions beaten (again) by two-chip solutions of Chinese vendors [July 11, 2011] despite High expectations on Marvell’s opportunities with China Mobile [May 28, 2011] as well as Marvell to capitalize on BRIC market with the Moby tablet [Feb 3, 2011]?

All excerpts below are from Marvell Technology Group’s CEO Discusses Q2 2012 Results – Earnings Call Transcript and the related Question-and-Answer Session[Seeking Alpha, Aug 18, 2011]. If no question is present before a statement from a Marvell executive then it is from the presentation part. The order of excerpts is different from that of in the transcripts. Sehat Sutardja is the CEO of the company, while Clyde Hosein is Marvell’s CFO.

First question is, you guys recently — made your first foray into the tablet market. It was — I believe it was a VIZIO Tablet launched through Costco. I was wondering if you can give us any color on kind of what the initial uptake or feedback has been around that device?

Clyde Hosein: It’s still early, Sanjay, you pointed to our first foray. The price point is, we believe, is very attractive. So it’s geared for people who perhaps cater for the higher end ones. And that price has been coming down, and expected to come down in the future, and as we develop more and follow-on products. So initial reaction is very good, but it’s still early. And I don’t think we want to make too much out of it at this early stage in the game, but it’s, I think, price performance in a very good place.

All the relevant information about the VIZIO tablet, as well as VIZIO’s general CE strategy you can find in Innovative entertainment class [Android] tablet from VIZIO plus a unified UX for all cloud based CE devices, from TVs to smartphones [Aug 21, 2011].

Sehat Sutardja: … in our mobile and wireless end market, Q2 revenues increased approximately 18% sequentially and represented approximately 26% of our overall revenues. The sequential increase was driven by growth from our new products such as TD in China, and seasonal growth from our wireless connectivity solutions. We believe the headwinds that faced our mobile and wireless end market in the prior quarters are mostly behind us, and we expect to make solid progress moving forward.

Today, we continue to be the only provider of a single-chip TD smartphone solution. These has resulted in over 20 TD smartphones being deployed both at OEM providers and white box manufacturers with our solutions.

For example, during the last quarter, ZTE announced our 4 new Marvell-based TD devices. In addition, Motorola, Huawei, Samsung, and others are currently deploying TD smartphones based on Marvell’s solutions. We are proud to say that working closely with our customers, we have helped them achieve an unsubsidized price point of $100 for TD smartphone, a first in the industry.

In the coming months, many of these handsets will be deployed in multiple Chinese provinces, both through the carrier and the channel. Our revenues for TD smartphones have roughly doubled in the last quarter, and we expect double-digit sequential growth again in the third quarter.

In addition to TD, business at our largest existing mobile customer [obviously RIM] has stabilized. We expect new 3G handset devices with Marvell solutions, Marvell silicon, to come to the market in the near term, targeting the high-volume segment. Further expanding our customer base during the second half of our fiscal year, we expect to launch multiple Android-based handsets targeted for consumers in Europe, Asia and South America.

… when does, or does RIM become kind of irrelevant in the context of the overall mobile and wireless business?

Clyde Hosein: … Our dependence, however, on any single customer in the mobile space today is much lower than it was at any given period since we bought this business 5 years ago. So as Sehat mentioned earlier, we are ramping up on TD. That’s beginning to do very, very well. Marvell is really acing it on the smartphones part of it. We mentioned earlier, we’ve got price point as low as $100. This is unsubsidized into the channel. We believe that there’s a huge demand for — a huge inflection point for low-cost smartphones, and we believe we’re delivering that in this space. In addition to that, we are on the cusp and inflection of non-TD Android-based smartphones. There’s a couple that we expect to come out, we had said second half of this year, that’s still on track. So you’ll see that probably in the next quarter or 2, you’ll see very [indiscernible]. …

Sehat Sutardja: I think investors should not discount RIM. We continue to work closely with RIM in delivering new solutions. They will make the product to look really, really nice, and better performance as well. So don’t discount that. Don’t discount it at all.

Sehat, what’s kind of the read through on demand and sell-through of either the high-end Android or OMS-based TD phones thus far?

Sehat Sutardja: So as we said, we are the first to work with our customers to deliver $100 TD smartphones. This is unprecedented. Just about a year ago, these phones are [were] selling for about $400 to $500 because they are [were]based on multiple chips in a system and [that] requires a very complex implementation. As the price gets to the $100 price point, the demand actually is increasing rapidly. This is what we expect to see. And we projected this was going to happen, and we’re seeing that. We’re seeing the customer demand is increasing. And also as more and more of these products [are] qualify[ied] by China Mobile to be released into the market, we expect the volume will continue to ramp. So we’re talking about phones there that are not much higher than a low end — I mean, like a high-end feature phone. Maybe even a similar price point, just if you take into account of the touchscreen feature phones. Literally, there’s not much difference in the bill of material to build those higher touchscreen feature phonesbecause these smartphones that we’re delivering. So we are very, very optimistic that more and more — the success of many of these customers will lead to other successes.

I’m kind of curious specific to the TD business. Can you help us quantify what percent of mobile wireless it is today? And as we think about kind of the market opportunity here, where do you think that can go over the next several quarters?

Clyde Hosein: So it’s a small part today. It’s just getting started and we think, as I have indicated, we think it’s a huge opportunity. We aren’t disclosing any, whether it’s TD or anything but specific segments. But it’s a small percent of the total today. And looking forward, a lot will depend on the consumption rates in China. We are opening up — or there is a lot more channels opening up in the next few months, so I expect that to pick up. Especially wide-box channels in each of the provinces that open up with these phones. So that should expect to pick up. Tough to predict. We think it’s a huge opportunity. There is several hundred million people who at the right price point, a significant percent of them should convert. But I think the next few months would tell us better. So we firmly believe and continue to believe that these smartphones at this price range, again $100 at the low end unsubsidized, we’re already there within 2 quarters of introduction of the technology. We think that’s an inflection point for demand. It’s hard to predict what the next 2 quarter’s demand is going to be. They sell-through today, some of our revenues for the quarter is already on a sell-through basis, granted some of it is in channel. But some of it is already sell-through. People have phones already, users, and we expect that to accelerate. But the penetration rate since the new market, new country, new set of users, difficult to predict near term. We are bullish in the long haul.

Sehat Sutardja: But in the long run, I think every time you ask for a short-term, a quarter, 2 quarters, I consider short-term projection. That’s very hard to project ramps. They can be — where the slope could be 10% slope, or 5% slope, or 15% slope. So those kind of projection is extremely dangerous to provide. But what we believe internally is that when you — when China Mobile has 500 million plus — or 550 to 600 million subscribers, okay, we can model whether it’s, okay, 2 to 3 years from now whether the 30% of it will be TD smartphones. Is that going to be 40%, is it going to be 30%? Now this is a kind of model that we can play. Of course everything is based on the price elasticity. So if the price goes to $100, how many percent do we expect this thing to be maturing at. When price goes to $70, what does it mean? And I don’t see any reason why this thing cannot be $70 in a year or so from now, for example. So we are bullish in the long run. Just a short term look, it’s very hard to say exactly what that slope begins to look like.

Let me just ask you about the TD LTE transition. … Will those be phones or will those be downloads [dongles]? And as you speak to China Mobile, how do they balance the transition to TD LTE with the extensive investments they’ve made in TD-SCDMA?

Sehat Sutardja: Well, yes, TD LTEs, as you should expect in any new deployment, the dongle will definitely will go in first. It’s easier to qualify the dongle. But the biggest volume, obviously, is not in dongle, the biggest volumes will be the handset. And when you go to the handset, more likely you will go into the highest end, highest price, the high-priced handset. So that will be, more likely, the phase-in of the TD LTE. So nothing surprising. So, okay, the key is, okay, over time, is to build lower price higher integration single-chip solutions to get to the mass-market TD LTE. So don’t expect that to happen, the volume to ramp up on the mass-market any time in next year. But to get a TD, as you say, China Mobile is really investing huge amount of dollars and resources in the infrastructure, base stations, several hundred — more than 200,000 base stations deployed with TD-SCDMA. So those are the ones that most likely to be ramped up first, okay, and then follow a certain selected cities — I mean, maybe not in every part of city, but like certain, in maybe the downtown area, where maybe they will start deploying a trial TD LTE deployment to test the system. Well, maybe, I don’t know, a year or so before they were all moved — before they all spread it out to the more major market. So we have nothing surprising. These things will have its own course. The key for us is to think we work very close with China Mobile, also, to make sure they have our specifications for the TD LTE is what they need.

… can you guys review where you stand with … not TD LTE, but just traditional LTE?

Sehat Sutardja: … So related to FDD, LTE, or TDD LTE, we have already sample[d] FDD LTE, so we talked last quarter. So what we’re talking about the TDD, is that the LTE and the TDD, is we’re we have to wait for that sample at the end of this year, specifically related to the requirements that China Mobile are putting into the marketplace.

Supply chain battles for much improved levels of price/performance competitiveness

Current snapshot:

Intel rejects 50% Ultrabook CPU price cut demand from notebook players [Aug 16, 2011]

Intel’s Oak Trail platform, paired Atom Z670 CPU (US$75) with SM35 chipsets (US$20) for tablet PC machine, is priced at US$95, already accounting for about 40% of the total cost of a tablet PC, even with a 70-80% discount, the platform is still far less attractive than Nvidia’s Tegra 2 at around US$20. Although players such as Asustek Computer and Acer have launched models with the platform for the enterprise market, their machines’ high price still significantly limit their sales, the sources noted.

As for Ultrabook CPUs, Intel is only willing to provide marketing subsides and 20% discount to the first-tier players, reducing the Core i7-2677 to US$317, Core i7-2637 to US$289 and Core i5-2557 to US$250.

As for Intel’s insistence, the sources believe that Intel is concerned that once it agrees to reduce the price, the company may have difficulties to maintain gross margins in the 60% range and even after passing the crisis, the company may have difficulty in maintaining its pricing. Even with Intel able to maintain a high gross margin through its server platform, expecting Intel to drop CPU prices may be difficult to achieve, the sources added.

Update: ASUStek seems to maneuver by far the best among them (special early ultrabook engagement with Intel, with popssible higher discount, in addition to exploiting the Tegra 2 opportunity best via the only successful so far EeePad Transformer):
Asustek expects better business performance in 2H11 [Aug 17, 2011]

Asustek Computer expects its performance in the second half of 2011 to be better than that of fellow Taiwan-based companies, according to CFO David Chang.

Asustek is likely to hit record quarterly revenues in the third  quarter and is optimistic about business operation in the fourth mainly due to the launch of second-generation Eee Pad Transformer tablets and ultrabook notebooks, Chang said.

Asustek aims at a 14% market share for notebooks in China, and
became the largest vendor in Eastern Europe’s notebook market in the second quarter. In addition, Asustek is poised to make forays into Latin America, especially Brazil and Mexico.

Asustek expects to ship 14 million notebooks and 4.5-5 million Eee PCs in 2011, Chang indicated. Asustek shipped 11.4 million motherboards in the first half and expects to ship 22.5-23 million for the year.

Tablet players expected to cut price to digest inventory overstock [Aug 16, 2011]

Non-Apple tablet PC players, facing the fact their devices are having weaker sales than their order volumes, while demand from the retail channel has been quickly shrinking, are expected to start cutting their tablet prices by the end of September to digest inventory and minimize losses, and the decisions are expected to trigger a new price war within the tablet industry, according to sources from notebook players.

The sources pointed out that most non-Apple tablet players had weaker-than-expected performances and Asustek, which had a rather better performance, had shipments of 700,000 tablets from May to July with actual sales only reaching 500,000 units.

RIM and High Tech Computer (HTC) are already placing their hopes in 2012 with Samsung and Motorola both seeing their tablet demand weaker than expected, while some other players such as Acer are gradually reducing their orders.

Motorola, Hewlett-Packard (HP), Asustek and Acer have all recently reduced their tablet prices with the lowest price currently at US$370; however, with their inventory will become harder to digest, the sources believe there will be at least two waves of price cuts from the end of September to the year-end holiday, reducing the tablet average price level to US$350 and may even drop further to US$300 in the future.

More: Acer & Asus: Compensating lower PC sales by tablet PC push[March 29, 2011 with updates upto Aug 2, 2011]

AMD’s Bright Outlook Likely to Boost Taiwan’s Supply Chain [Aug 16, 2011]

Taiwan’s IC supply chain is expected to benefit from good business performance of Advanced Micro Devices Inc. (AMD), which is projected to outperform archrival Intel Corp. in the third quarter with increased shipment of accelerated processing units (APUs).

The Taiwan supply chin is mainly composed of manufacturers including foundry Taiwan Semiconductor Manufacturing Co. (TSMC), packager Siliconware Precision Industries Co., Ltd., tester STATS ChipPAC Taiwan Semiconductor Corp., and substrate maker Nanya Printed Circuit Board Corp.

AMD estimates its revenue for the third quarter to rise 8-12% from the second quarter, compared with Intel’s projected 8% revenue growth. According to AMD, it has enjoyed robust APU shipments since the second quarter, with both its PC and laptop APU shipments hit new highs.

AMD has contracted TSMC, currently the world’s No.1 pure foundry, to make its Ontario [C-series], Zacate [E-series], and Desna [Z-series, specific for tablet PCs, a power optimized version of C-series, which are also for ultra-thin notebooks: Z-01 of 5.9W vs. C-50 9W in both cases with two 1 GHz “Bobcat” CPU cores + 6250 GPU] processors using 40-nanometer process technology as well as its Hudson chips using 65nm process technology.

While increasing foundry outsourcing to TSMC, AMD has augmented packaging and testing contracts to Taiwan’s providers as well. Nanya is also expected to land contracts via Japanese partner NGK Spark Plug, which has directly received substrate contracts from AMD.

In the second quarter, AMD saw its revenue slightly dip 2% from the first quarter to US$1.57 billion, while its gross margin was 46%, up from 45% recorded in the first quarter this year.

AMD Llano processor shipments reach 1.3-1.5 million units in July [Aug 4, 2011]

AMD shipped about one million Llano [A-series, for mainstream notebooks, all-in-one PCs and desktop PCs: with up to four up to 2.9 GHz x86 CPU cores and with an integrated DirectX 11-capable discrete-level graphics unit that features up to 400 Radeon cores along with dedicated HD video processing on a single chip] APUs in June and 1.3-1.5 million units in July, and with the appearance of the company’s new Llano APUs in the fourth quarter, annual shipments of Llano in 2011 should reach 7.5-8 million units, according to sources from motherboard players.

The sources pointed out that AMD is pushing its 40nm-based C series (Ontario) and E series (Zacate) APUs for the entry-level market, while it is pushing 32nm-based Llano-based APUs for the mid-range to performance and mainstream markets, and is pushing 32nm AM3+ FX series (Zambezi) processors for the high-end market in the fourth quarter.

In 2012, AMD will launch a new APU series codenamed Krishna using a 28nm process from Taiwan Semiconductor Manufacturing Company (TSMC), targeting mini PCs, and all-in-one PCs with an APU series codenamed Trinity to replace Llano for the mainstream market, adopting a 32nm process from Globalfoundries. For the high-end market, AMD will launch an APU series codenamed Komodo.

AMD shipping Llano APUs; prices leaked [May 23, 2011]

AMD has started shipping its Llano APUs to notebook clients and will begin to market the APUs to channels in July 2011, according to sources from notebook makers.

AMD targets to ship one million notebook-use Llano APUs in June, 1.5 million in July, and a total of 8-9 million for the whole of 2011, revealed the sources, citing AMD’s internal estimates.

If the shipment goals are realized, AMD will be able to boost its share in the notebook CPU segment to 15% by the end of the year, the sources commented.

Additionally, AMD will also launch six Llano and four Bulldozer APUs for desktops.

AMD: Llano and Bulldozer APU prices (k unit)
Core Model Price Competing Intel model
Llano/quad-core A8-3550P US$170 Core i5-2300
Llano/quad-core A8-3550 US$150
Llano/quad-core A6-3450P US$130 Core i3-2120/2010
Llano/quad core A6-3450 US$110
Llano/dual-core A4-3350P US$80 Pentium G6960/6950 and Sandy Bridge G800/600
Llano/dual core E2-3250 US$70 Pentium G620
Bulldozer/octo-core FX-8130P US$320 Core i7 2600K/2600
Bulldozer/octo-core FX-8130 US$290
Bulldozer/6-core FX-6110 US$240 Core i5 2500K/2500
Bulldozer/quad-core FX-4110 US$220

More: Acer repositioning for the post Wintel era starting with AMD Fusion APUs[June 17, 2011]

Apple cancels supply schedule of iPad 3 for 2H11 [Aug 16, 2011]

US-based tablet PC players Apple has recently canceled its iPad 3 supply schedule for the second half of 2011, forcing other tablet PC brand vendors that are set to launch same-level product to compete, to follow suit and delay their launch; however, supply of the iPad 2 in the second half will still be maintained at 28-30 million units, according to sources from the upstream supply chain.

Apple was originally set to launch its iPad 3 in the second half of 2011 with a supply volume of 1.5-2 million units in the third quarter and 5-6 million in the fourth quarter, but Apple’s supply chain partners have recently discovered that the related figures have all already been deleted, the sources pointed out.

The sources believe that the yield rate of the 9.7-inch panel that feature resolution of 2,048 by 1,536 may be the major reason of the supply delay since such panels are mainly supplied by Japan-based Sharp with a high price and Apple’s other supply partners Samsung Electronics and LG Display are both unable to reach a good yield. Since Apple is unable to control a certain level of supply volume, the iPad 3 is unlikely to be mass produced as scheduled, the sources added.

Sources from panel players also pointed out that the 9.7-inch panel with high resolution requires a much larger backlight source and a single edge light bar is hardly able to reach satisfaction levels. Due to iPad 3’s requirements over the physical thinness, rich color support and toughness will all conflict with the panel’s technology restrictions; therefore, this could cause a delay in the launch.

In June, LG Display supplied three million panels for the iPad 2 with Samsung supplying 1-1.5 million units and Chimei Innolux (CMI) 10,000-20,000 units. In July, LG’s supply volume dropped to 2.8 million units with Samsung maintaining its same levels, and CMI’s volume increased to 450,000-500,000 units.

Update: CMI fails to become iPad 3 panel supplier, say sources [Aug 19, 2011]

Chimei Innolux (CMI) has failed to become a LCD panel supplier for the Apple iPad 3 due to technological hurdles, according to industry sources.

CMI has cut into the supply chain of iPad 2, which uses IPS panels, but the new Apple tablet is more demanding in terms of resolution, the sources said. The iPad 3 will feature a 9.7-inch panel with resolution of 2,048×1,536 compared to the iPad 2’s 1,024×768.

CMI has been developing panels trying to meet the iPad 3 specifications, but problems with transmittance and yield rates of the panels have resulted in its failure to receive certification for the iPad, the sources said.

CMI began developing IPS panels last year after receiving license from Hitachi in July 2010. The license covers IPS, Super-IPS, Advanced-Super IPS, IPS-Pro, and IPS-Pro-Prolleza.

CMI previously scheduled mass production of IPS panels to begin as early as the end of 2010 or early 2011. But low yield rates delayed the mass production until recent months. The maker’s IPS panel monthly output in July 2011 reached nearly 500,000 units. It is looking forward to an output of one million units in August 2011, the sources said.

The sources noted that the iPad 3’s resolution requirement of 2,048×1,536 pixels is also a challenge even for iPad panel regular suppliers such as LG Display (LGD) and Samsung Electronics. Apart from the two Korea makers, Japan’s Sharp has als been selected to supply panels for the iPad 3, the sources said.

They noted that CMI still stands a chance of becoming a regular supplier for iPad 3 if it can improve its panel quality to meet Apple’s requirements. The maker recently invested NT$800 million to NT$1 billion [US$28 million to US$35 million] to improve manufacturing facilities, the sources said.

Chimei Innolux Continues Suffering Loss in Q2 [Aug 16, 2011]

Chimei Innolux Corp., the largest maker of thin film transistor-liquid crystal display (TFT-LCD) panels in Taiwan, reported a loss of NT$13 billion (US$448.3 million) in the second quarter, deeper than institutional investors` forecast.

Industry sources said that the four major makers of large-sized TFT-LCD panels, i.e. AU Optronics Corp. (AUO), Chimei Innolux, Chunghwa Picture Tubes, Ltd. (CPT) and HannStar Display Corp., together reported total loss of about NT$120 billion (US$413.8 million [US$4.15 billion]) in the past about one year.

Some institutional investors said that the all-size panel prices are expected to fall slightly, implying that makers` losses in the third quarter would not be less than second quarter`s.

At its recent half-year online shareholder meeting, Chimei adjusted down its capital spending to NT$50 billion to NT$60 billion (US$1.7 billion to US$2.1 billion) from NT$75 billion to NT$70 billion (US$2.6 billion to US$2.4 billion) lowered previously and NT$100 billion (US$3.4 billion) announced in early this year. Chimei said that this year the company would focus mainly on high-level equipment and R&D projects for touch-panel technology.

AUO, Chimei Innolux`s major rival and the No. 2 panel maker in Taiwan, recently also adjusted down its capital spending goal to under NT$70 billion (US$2.4 billion) from NT$90 billion to NT$95 billion (US$3.3 billion to US$3.1 billion).

Chimei Innolux is a merger between three companies, including Chi Mei Optoelectronics Corp. (CMO), Innolux Display Corp., and TPO Displays Corp. (TPO), formed in the second quarter of 2010, and began reporting loss starting the third quarter of last year that has continued for four seasons.

AUO reported an accumulated loss of NT$36 billion (US$1.24 billion) in the past three quarters.

Eddie Chen, Chimei Innolux`s chief financial officer, said that his company focused on shipments of core businesses and cut many system assembly works in the second quarter. The company`s second-quarter shipments of large-sized panels increased about 10% quarter-on-quarter (QoQ), but its revenue generated from small/medium-sized panels fell 18.4% QoQ due to the falling panel prices. J.C. Wang, president of Chimei Innolux`s Southern Taiwan Science Park (STSP) branch, pointed out that his company decided to cut system-assembly business because it takes too many labor forces and that`s not his company`s core competitiveness.

Wang said that the third quarter is a traditional high season, but the market now seems relatively weaker than it should be. In the second quarter, Chimei Innolux`s capacity utilization rate was about 80%, the company said that it would adjust according to market conditions.

LCD maker CPT still deep in red in second quarter [July 30, 2011]

LCD panel maker Chunghwa Picture Tubes Ltd (CPT, 中華映管) yesterday reported its 12th consecutive quarterly loss as prices for slim-screen panels for televisions and computers dropped on sluggish end demand.

The company added that outlook for the third quarter remained sluggish, with demand expected to fall below the seasonal norm.

However, Chunghwa Picture said it has no plans to cut its capital spending this year of between NT$2 billion (US$69 million) and NT$2.5 billion, which would be used to improve its equipment to produce high-definition flat panels used in tablet devices and smartphones.

Earlier this week, its bigger local rival, AU Optronics Corp (友達光電), said it planned to slash capital spending by 30 percent.

In the quarter ending June 30, Chunghwa Picture’s losses widened to NT$3.13 billion [US$108 million] from losses of NT$2.33 billion [US$80 million] in the first quarter. The Taoyuan-based company posted losses of NT$1.5 billion in the second quarter of last year.

“Market demand, especially for TVs and IT products [computers], slumped in the first half. Oversupply caused panel prices to drop further,” company president Lin Sheng-chang (林盛昌) said during a teleconference with investors.

“As the visibility for IT panels is unclear, we will make inventory management our priority,” Lin said.

Days of inventory increased to 37 days last quarter from 31 days in the first quarter, the company said.

The fragile economic recovery in the US and Europe is expected to curtail demand for consumer electronics, while demand for notebook computers should pick up slightly after new models hit the shelves, Chunghwa Picture said.

To combat these difficult times, Lin said the company would have to accelerate its shift to high-margin products, such as tablet panels, touch sensors and smartphone screens, in the second half.

Its newly formed strategic partnership with the world’s biggest e-paper display supplier, E Ink Holdings Inc (元太科技), will help it reach this goal, Lin said.

Last week, E Ink agreed to spend NT$1.5 billion [US$52 million] to subscribe to Chunghwa Picture bonds. Chunghwa Picture agreed to supply LCD panels to E Ink.

Besides e-paper displays, E Ink also supplies high-definition flat panels to LG Display and tablet device makers.

Shipments of LCD panels used in smartphones, tablets and consumer electronics should grow by 20 percent to 25 percent in the second half, from 200 million units shipped in the first half, Lin said.

Last quarter, revenues from small-and-medium LCD panels used in tablets and smartphones accounted for a larger share, 42 percent, of Chunghwa Picture’s total revenues of NT$15.93 billion, from 37 percent in the prior quarter, according to the company’s financial statement.

Chunghwa Picture also said it would terminate its money-losing cathode-ray-tube (CRT) business. The company plans to revamp its CRT factories in Malaysia and in Fuzhou, Fujian Province, and shift to touch panel assembly.

HannStar posts operating loss [Aug 15, 2011]

HannStar Display has announced unconsolidated results for second-quarter 2011, with total sales rising 10% sequentially to NT$1.15 billion (US$387.4 million). But it recorded an operating loss of NT$1.04 billion and a net loss of NT$ 1.57 billion [US$54 million], which was translated into a loss per share of NT$ 0.27.

Gross, operating, and net margin in the second quarter were 7%, -9%, and -14% respectively. Earnings before interest, taxes, depreciation and amortization (EBITDA) was 1%.

HannStar said the operating loss in the second quarter was the result of an effort to enlarge its manufacturing capacity in Nanjing, China, which cost it an extra NT$1.88 billion [US$65 million] in operation.

Capacity utilization of HannStar was nearly full in second-quarter 2011. Small- to medium-size panels under 10-inch took up about 45% of its total revenues. Notebook panels accounted for 10% and monitor panels 45%.

HannStar is expected to enhance notebook panels’ share to 15% and small- to medium-size panels to 55% in third-quarter 2011. Monitor panels’ share will be lowered to around 30%.

HannStar expects small- to medium-size panels’ share to reach 60% by end of 2011 and notebook panels to grow to 20%.

Explanatory excerpts from Pixel Qi’s first big name device manufacturing partner is the extremely ambitious ZTE [Feb 15, 2011, with updates up to June 3, 2011]

to engage some of the largest factories that have ever been made, and for that to work their economics need very high volumes. We need to have customers who really commit to large purchase orders almost before we start to design.”

The display business can be considered to be the worlds biggest non-profit industry, the 5 biggest LCD makers who produce 90% of the worlds LCDs, produce for $120 Billion in screens every year but can only make small profit margins out of that because of the strong competition and the large volumes shipped. Those companies that produce the worlds LCD screens have very high costs, very high risks, little flexibility.

Next-gen Snapdragon S4 class SoCs — exploiting TSMC’s 28nm process first — coming in December

Preliminary information: TSMC led foundries and their SoC customers against Intel [May 10, 2011]
Qualcomm Snapdragon SoCs with a new way of easy identification [Aug 4, 2011]

Updates: TSMC seeing tight capacity for 28nm processes [Nov 25, 2011]

Taiwan Semiconductor Manufacturing Company (TSMC) continues to see orders heat up for advanced 28nm technology, despite a general slowdown in the semiconductor industry, according to industry sources. Order visibility has stretched to about six months, said the sources.

TSMC is expected to see 28nm processes account for more than 2% of company revenues in the fourth quarter of 2011. The proportion will expand further to over 10% in 2012, as more available capacity coupled with rising customer demand boost the output, the sources indicated.

Wafer output using 28nm processes is projected to top 20,000 units a month by the end of 2011, and will expand significantly in 2012 when new capacity at Fab 15 comes online, the sources noted. Fab 15, TSMC’s third 12-inch fab, will begin volume production in the first quarter of 2012, and ultimately raise its monthly capacity to the designed level of 100,000 wafers per month.

Altera, AMD, Nvidia, Qualcomm and Xilinx have all contracted TSMC to manufacture their 28nm products. Broadcom, LSI Logic and STMicroelectronics reportedly are among potential clients for TSMC’s 28nm technology.

TSMC chairman and CEO Morris Chang remarked during the company’s most-recent investors meeting that sales from 28nm process technology would play an important source of company growth.

Smartphones, Microsoft Driving Qualcomm Business: CEO [CNBC interview, Nov 16, 2011]

The popularity of smartphones and its partnership with Microsoft have been very good for Qualcomm’s chip business, CEO Paul Jacobs said Wednesday.

Jacobs, speaking to CNBC after he met with analysts in New York, said a lot of Qualcomm’sgrowth is driven by the worldwide popularity of smartphones.

He estimates four billion smartphones will be sold between now and 2015, and that means a lot of “traction with our chips, too, going in all sorts of designs.”

The tablet market has been dominated by Apple’s iPad, but he said Microsoft will be using Qualcomm chips for a new touch-screen tablet.

Microsoft has a lot of assets they bring to the table,” he said. “It’s a full computing environment, the kind we’re all used to. It’s gonna have Office and that kind of capability, those applications, but it’s got this really cool new touch interface, too.”

That will allow Microsoft “to compete head to head” with Apple and other tablet makers.

“The kinds of technology that go into a handset these days are amazing,” Jacobs added. “That stuff will go into Windows tablets” creating a “new kind of computing environment.”

[A 6 minutes long video record of the interview included, which is worth to watch.]

Qualcomm Unveils New Snapdragon Mobile Processors Across All Tiers of Smartphones and Tablets [Qualcomm press release, Nov 16, 2011]

Qualcomm Incorporated (NASDAQ: QCOM) announced today the expansion of its Snapdragon S4 class of next-generation mobile processors and the enhancement of its Snapdragon S1 solutions for entry-level smartphones.

The addition of new Snapdragon S4 processors, which are aimed at lowering design, engineering and inventory costs while bringing leading-edge 3G and 4G Internet connection speeds, will allow OEMs to introduce S4-based devices with next-generation mobile architecture throughout their respective device roadmaps—from basic smartphones to high-end smartphones and tablets. The enhanced S4 processors are also optimized for use with a suite of software solutions available from Qualcomm that help enable OEMs to deliver industry-leading feature sets for multimedia, connectivity, camera, display, security, power management, browsing and natural user interface design.

The Krait CPU is the next generation of Qualcomm’s micro architecture and is purpose-built from the ground up for significant mobile performance and power management advantages leading to enhanced user experience and better battery life. The Krait CPU is an essential part of the Snapdragon S4 class of processors. Today, Qualcomm announced several new S4 chipsets, including the MSM8660A, MSM8260A, MSM8630, MSM8230, MSM8627, MSM8227, APQ8060A and APQ8030. These are additional chipsets to the previously announced MSM8960, MSM8930 and APQ8064. Snapdragon S4 MSM processors include Qualcomm’s leading-edge wireless modem technologies, including EV-DO, HSPA+, TD-SCDMA, LTE FDD, LTE TDD and Wi-Fi® standards. Devices based on Snapdragon S4 processors are expected to appear in early 2012.

The Snapdragon S1 product line is driving smartphone growth in all regions, and it offers a significant opportunity for market expansion and migration to 3G. To further this trend, Qualcomm is also announcing an upgrade to four of its existing Snapdragon S1 mobile processors. The MSM7225A, MSM7625A, MSM7227A and MSM7627A have been upgraded to deliver better performance and will enable new mobile experiences for entry-level smartphone users, particularly those transitioning from 2G to 3G.

Qualcomm Announces Snapdragon GameCommand Application and Exclusive Mobile Games for Android [Qualcomm press release, Nov 16, 2011]

… announced today the expansion of its 100+ games Snapdragon GamePack and launch of a new showcase application — Snapdragon™ GameCommand™ — further bolstering the supply of console-quality and casual games for mobile devices featuring Snapdragon processors. The new gaming titles being introduced as part of the extended Snapdragon GamePack and the new Snapdragon GameCommand app are all expected to hit the Android Market in early 2012. Additions to the Snapdragon GamePack include several new, exclusive gaming titles that will be available through the Android Market, and which will initially be designed to operate exclusively on Android-enabled devices powered by Snapdragon processors. These titles include a number of high-end PC games …

… says Raj Talluri, vice president of product management at Qualcomm. “With more than 60 percent of smartphone users regularly playing games on their mobile devices, the time is right to bring more console-quality and casual games to the Snapdragon platform. We are very excited to put our new Snapdragon GameCommand app and more great gaming titles in the hands of consumers in early 2012.”

Qualcomm Announces a Bunch of Krait Based Snapdragon S4 SoCs [Anandtech, Nov 16, 2011]

If you want an 8960 without integrated LTE, Qualcomm has an SoC for you: the MSM8x60A. The CPU specs are the same as the 8960, just without LTE support.

Below the 8960 is the MSM8930, a dual-core Krait (up to 1.2GHz) offering with only a single LPDDR2 memory channel (up to 1066MHz data rate). The 8930 will actually use a faster GPU than the 8960, the Adreno 305, although it’ll be more memory bandwidth limited. The 8930 will also debut later than the 8960 partially due to its new GPU.

The 8930 features LTE support, but if you want a version without it there’s the new MSM8x30. Similarly, if you want a version without an integrated baseband altogether there’s the APQ8030. The ISP in the xx30 series supports 1080p video decode and up to a 13.5MP camera (down from 20MP in the xx60 SoCs).

There’s an even even more affordable S4 in the lineup: the MSM8x27. Here you get two Krait cores running at up to 1GHz, a single channel LPDDR2 interface (800MHz max data rate). Video decode is limited to 720p in the 8×27.


[* the numbering change is: MSM8270 –> MSM8x60A]

The APQ8060, MSM8x30 and MSM8x27 parts won’t be out until the latter part of 2012.

Compare this to the Qualcomm Snapdragon S1-S2-S3 SoCs lineup in production as of 16-Nov-2011:

Note that the Krate based Snapdragon S4 will come to the mass market smartphone SoCs in 2012, while the previous Scorpion based Snapdragons were only available in the premium smartphone segment only!

Qualcomm announces Snapdragon S4 Liquid mobile development platform tablet on The Engadget Show, we go hands-on (video) [Engadget, Nov 16, 2011]

Hands-On: Qualcomm SnapDragon S4 [ via Engadget, Nov 16, 2011]

[Note the LTE speed shown as 40+ Mbps on download and 4.2 Mbps on upload.]

At its investor conference earlier today, Qualcomm unveiled a variety of new Snapdragon processors to join its recently-announced MSM8960 S4 chip. But we got an exclusive first look at the 8960 in New York City this evening, in the form of a mobile development platform (MDP) tablet demo during The Engadget Show. The tablet the company had on hand isn’t much to look at — it’s not the slimmest we’ve seen, and it feels a bit clunkier than models destined for consumers — but its specs, which include an on-die LTE modem (the first of its kind — we were seeing download speeds of around 45 Mbps), dual 1080p cameras (and another two for 3D), seven microphones, a spattering of sensors and a handful of connectors make this the ultimate platform for Android developers. Not convinced? Join us past the break for a hands-on walkthrough with Raj Talluri, Qualcomm’s VP of Product Management.

The Snapdragon S4 MDP tablet is one of the first we’ve seen from Qualcomm that’s sleek enough to function as a primary tablet, perhaps even for power-hungry consumers. It won’t be cheap, though pricing has yet to be announced, but for developers that need a comprehensive platform for testing their Android apps, there’s no question that this is an excellent option.

The tablet packs a 10.1-inch 1366 x 768 (16:9) 10-finger capacitive multitouch display, with a 13 megapixel rear-facing camera with flash and front-facing 2 megapixel camera (both capable of 1080p30 video capture), along with another pair of rear-facing side-by-side cams, specifically designed for shooting 3D. On the audio front, you’ll find seven microphones and surround sound stereo speakers, which we hear sound great for everything from video chat to movie viewing. It’s currently running Gingerbread, but expect Ice Cream Sandwich in early 2012, with support for Windows 8 to come after that.

As far as sensors go, there are dual 3D accelerometers, a three-axis gyro, compass, ambient light and proximity, a temperature and pressure sensor and a fingerprint reader. Dual independently-controlled linear vibrator motors provide haptic feedback. Memory includes 2GB of 400MHz LPDDR2, 32GB eMMC, and 1MB of SPI NOR flash. There’s also a removable 5200 mAh lithium ion battery, which should provide many hours of power when paired with the efficient S4.

When it comes to controls, this is far from a single-button affair — there’s a combo volume / zoom rocker, a power button, screen rotation lock, home button and recessed reset button. External connectors include a docking station port, micro USB with MHL, a 3.5mm audio jack with ANC contacts, a DC-in charger port and a microSD slot. There’s also a full-size SIM slot and touch panel programming connector under the battery door, along with a Sensor Fusion expansion connector. The docking station adds a pair of full-size USB connections, HDMI, Ethernet, JTAG, QEPM, UART and another DC-in.

Ready to start coding? Devs will need to wait until the first half of 2012 before getting their hands on Qualcomm’s latest S4 MDP tablet, but if today’s demo is any indication, it’ll be worth the wait.

QUALCOMM Incorporated’s CEO Discusses Q4 2011 Results – Earnings Call Transcript — Q & A [Nov 2, 2011]

… just want to get some more color on the 8960. As you move to 28-nanometer, it seems like a turnkey product for your road map in 2012. This product brand, how should we think about it as it impacts your ASP? Should we kind of have our normal seasonal price decline in March, but then, as 8960 ramps, your ASPs could kind of go up embedded in your guidance? Just trying to get some color on ASP. And then, if you can just give any color on 8960 in general, that’d be very helpful.

Steven M. Mollenkopf: A couple of things. One is it’s progressing pretty much the way that we had hoped. So it’s on track for the dates that we talked about last call. We’ll see that build volume through really the mid-calendar year of ’12 and — as we’ve said before. So quite happy with how that’s looking both from a designing perspective as well as from the engineering side. We will — that will build throughout the year. We’re also taking the 28-nanometer process and we’re actually going to create a tier of products, which I think we’ve talked a little bit about before. On a high-end, more of a tablet-specific part as well as a mass market LTE product. So if you look at 28-nanometer in total through next year, or through this year, fiscal year ’12, you’ll see it build on the 8960, which I would consider to be a premium part, and then transition to a tiered road map pretty consistent with what we’ve done with other technology transitions as well.

TSMC Accelerates 28nm Process Output [Nov 3, 2011]

Taiwan Semiconductor Manufacturing Co. (TSMC) will start volume production at the first facility in its Fab 15 building earlier than originally scheduled, suggesting the foundry giant is competing to ramp up general production based on 28nm process technology.

The facility is designed to have maximum monthly capacity of 50,000 wafers of tailor-made chips using 28nm process, making it the most advanced chip-making factory in the Central Taiwan Science Park.

… 28nm foundry to account for 10% of the company’s revenue next year, up from current 0.5%. Industry executives estimated the percentage will rise to 2% by the end of this year thanks to volume production starting at the new facility.

The second facility in the Fab 15 building is estimated to start volume production in the fourth quarter next year after being tooled up in the first quarter of 2012. Construction of the third and fourth facilities will start sometime next year and be completed in late 2013. The latter two factories are likely to be equipped with 20nm tools.

Fab 15 calls for a total of NT$400 billion (US$13.3 billion at US$1: NT$30) in investment spending.

TSMC 28nm Technology in Volume Production [TSMC press release, Oct 24, 2011]

… and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28nm node.

TSMC’s 28nm process offering includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use.

The number of customer 28nm production tape outs has more than doubled as compared with that of 40nm. At 28nm, there are currently more than 80 customer product tape-outs. The TSMC 28nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers.

“Qualcomm and TSMC have a long history of collaboration to bring to market the latest in mobile semiconductor technology on the most advanced silicon manufacturing processes, and we are excited to be introducing the first integrated smartphone processors at the 28nm node,” said Jim Clifford, senior vice president and general manager of operations at Qualcomm. “Most recently, Qualcomm’s work with TSMC yielded our Snapdragon™ S4 class of processors, including the Snapdragon S4 MSM8960™, a highly-integrated, dual-core SoC designed to reduce power in cutting-edge smartphones and tablets. The Snapdragon S4 class of processors are manufactured in TSMC’s highly sophisticated 28LP process, enabling Qualcomm to deliver the breakthrough combination of high performance and ultra low power to mobile devices.”

Qualcomm’s New Snapdragon S4: MSM8960 & Krait Architecture Explored [AnandTech, Oct 7, 2011]

Performance Expectations

Performance of ARM cores has always been characterized by DMIPS (Dhrystone Millions of Instructions per Second). An extremely old integer benchmark, Dhrystone was popular in the PC market when I was growing up but was abandoned long ago in favor of more representative benchmarks. You can get a general idea of performance improvements across similar architectures assuming there are no funny compiler tricks at play. The comparison of single-core DMIPS/MHz is below:

ARM DMIPS/MHz
ARM11 ARM Cortex A8 ARM Cortex A9 Qualcomm Scorpion Qualcomm Krait
DMIPS/MHz 1.25 2.0 2.5 2.1 3.3

At 3.3, Krait should be around 30% faster than a Cortex A9 running at the same frequency. At launch Krait will run 25% faster than most A9s on the market today, a gap that will only grow as Qualcomm introduces subsequent versions of the core. It’s not unreasonable to expect a 30 – 50% gain in performance over existing smartphone designs. ARM hasn’t published DMIPS/MHz numbers for the Cortex A15, although rumors place its performance around 3.5 DMIPS/MHz.

The Adreno 225 GPU

Qualcomm has historically been pretty silent about its GPU architectures. You’ll notice that specific details of Adreno GPU execution resources have been absent from most of our SoC comparisons. Starting with MSM8960 however, this is starting to change.

The MSM8960 uses a current generation Adreno GPU with a couple of changes. Qualcomm calls this GPU the Adreno 225, a follow-on to Adreno 220. Subsequent Krait designs will use Adreno 3xx GPUs based on a brand new architecture.

Architecturally the Adreno 225 and 220 are identical. Adreno 2xx is a DX9-class unified shader design. There’s a ton of compute on-board with eight 4-wide vector units and eight scalar units. Each 4-wide vector unit is capable of a maximum of 8 MADs per clock, while each scalar unit is similarly capable of 2 MADs per clock. That works out to 160 floating point operations per clock, or 32 GFLOPS at 200MHz.

With Adreno 225 Qualcomm improves performance along two vectors, the first being clock speed. While Adreno 220 (used in the MSM8660) ran at 266MHz, Adreno 225 runs at 400MHz thanks to 28nm. Secondly, Qualcomm tells us Adreno 225 is accompanied by “significant driver improvements”. Keeping in mind the sheer amount of compute potential of the Adreno 22x family, it only makes sense that driver improvements could unlock a lot of performance. Qualcomm expects the 225 to be 50% faster than the outgoing 220

While Adreno 225 is only Direct3D feature level 9_3 compliant, Qualcomm insisted that when the time is right it will have a D3D11 capable GPU using its own IP – putting to rest rumors of Qualcomm looking to license a third party GPU in order to be competitive in Windows 8 designs. Although Qualcomm committed to delivering D3D11 support, it didn’t commit to a timeframe.

Final Words

Qualcomm has had MSM8960 silicon back in house for the past 3 months and is on-track for a release sometime in the first half of next year. Assuming Qualcomm can deliver on its claims, performance alone would be enough to sell this chip. Improved power characteristics and integrated LTE baseband really complete the package though.

The implications for a 1H 2012 MSM8960 release are tremendous. Android users will have to choose between a newer software platform (OMAP 4 running Ice Cream Sandwich) or much faster hardware (MSM8960). Windows Phone users may finally get a much needed performance boost if Microsoft chooses to standardize on Krait for its Windows Phone hardware refresh next year. End users will benefit as next year’s smartphones and tablets will see, once again, a generational performance improvement over what’s shipping today. LTE should also start to see much more widespread adoption (at the high end) as a result of Qualcomm’s integrated LTE baseband.

Snapdragon S4 Processors: System on Chip Solutions for a New Mobile Age [Qualcomm 9 page long whitepaper, Oct 7, 2011]

End of Updates

With the introduction of Qualcomm Snapdragon SoCs with a new way of easy identification [Aug 4, 2011] came the realization on Qualcomm’s side that they should start to emphasize the SoC (system on a chip) aspect of their market leading chip products:

… our current Snapdragon family of processors has grown to encompass over 15 different chips with feature sets that target mass market smartphones all the way through high end smartphones and tablets. And, although our Snapdragon chips are called processors, they are really system on chip solutions. Inside each Snapdragon chip are multiple hardware subsystems including CPUs, GPUs, modems, multimedia processors, GPS, DSPs, sensors, as well as advanced management software.

And all of these components are integrated into a single small chip that is designed with mobile in mind. The result is that Snapdragon processors deliver outstanding performance and longer battery life. …

From: A Simple Way to Identify Which Snapdragon System is Right for You [Tim McDonough Vice President, Marketing, Qualcomm QCT on Qualcomm’s blog: OnQ, Aug 3, 2011]

Below is a simple technical overview of the four Snapdragon classes of chips with S1 to S3 being the current ones and S4 coming commercially in December this year:

S4 class SoCs S3 class SoCs S2 class SoCs S1 class SoCs
Up to 2.5 GHz Quad-core Krait CPUs Up to 1.5 GHz Dual-core Scorpion CPUs Up to 1.4 GHz Scorpion CPU Up to 1 GHz Scorpion CPU
Adreno™ 225, 305, 320 GPUs
Adreno™ 220 GPU Adreno™ 205 GPU Up to Adreno™ 200 GPU
1080p HD video 1080p HD video 720p+ HD video Up to 720p HD video
3G/LTE modem 3G modem – (HSPA+/1xAdv/1xEV
DO/GSM/GPRS/EDGE)
3G modem – (HSPA/DO/1x) 3G Modem – (HSPA/DO/1x)
Information is not yet available Dual camera up to 16M pixels
Stereoscopic 3D Kit
Dual Cameras up to 12M pixels Single camera up to 12M pixels
Information is not yet available gpsOne Gen8 gpsOne Gen8 gpsOne Gen 7
Up to multiple USB ports USB 2.0 High Speed OTG (480Mbps) High Speed USB 2.0 USB 2.0

Below one can find the latest information about the new class, first from the foundry partner TSMC and then from the SoC vendor Qualcomm itself.

TSMC backs-off grand capex plan due to softening demand: 28nm ramp delayed [July 28, 2011]

TSMC said in a conference call that its 28nm ramp had experienced delays due to customers deferring migration of chips to the next node due to the global economic conditions, rather than due to any fabrication issues.

Chang also noted that 89 products had already been taped-out at the 28nm node all fully functioning and containing ‘satisfactory yields.’ The actual production ramp will take longer than expected due to the weakening macro-economic environment, as customers delay volume ramp plans until conditions can be seen to have improved.

Taiwan Semiconductor Manufacturing CEO Discusses Q2 2011 Results – Earnings Call Transcript [July 28, 2011]

Now, I’d like to report on our technology progress specifically first on 28-nanometer. We reported earlier that we had tape outs for 89 individual products and the tape out of each of those is on schedule. The first silicon of every tape out was fully functional would consistently satisfactory. In fact density reduction is on plan. The ramp of 28-nanometer however is taking longer than expected due to the softening economy and the demand outlook of 2011.

Second item that I want to report on is that our close co-orporation ARM CPU core is allowing us to optimize our technology of ARM design. Recently in 28HP, which stands for 28 high-performance, we have delivered first industry silicon with higher speeds than any other computer using on. And in 28 HPM which tends to our 28 nanometer high-performance mobile we have enabled first tape out of even better performance.

Taiwan Semiconductor Manufacturing CEO Discusses Q2 2011 Results – Earnings Call Transcript
Question-and-Answer Session [July 28, 2011]

… my fourth quarter is regarding 28-nanometer, you mentioned that 28-nanometer is taking a bit longer. Can you kind of describe if that is relate to just maturity of the process? Was it related to just customer not ramping the design that they have and you were previously, maybe previously expect them to ramp. And finally, how much of yourself do you expect to come with 28-nanometer for the second half or for the fourth quarter of this year?

The delay of 28-nanometer is not due to their quality issue, actually we have regular tape out and it is unplanned. The July ramping is mainly because of softening economy for our customers, so customers delayed a tape out to us. So therefore, the 28-nanometer revenue contribution by the end of fourth quarter this year will be roughly above 1% of our total wafer revenue.

… With the 28-nanometer, to what extent the ramp beyond Q4 is going to be driven by attracting new customers, or is that going to be just the volume ramp of these 70 to 80 tape outs that you have?

No, we’re not counting on attracting new customers. Actually we have almost all of the major customers of the foundry business anyway, and all them are using, are planning to use or I should say, almost all of them are planning to use our 28-nanometer. And our tape outs would be 89 tape outs that I have mentioned a couple of times, I think equal to 10 times the combined tape outs of all of our competitors. So now, we’re not planning on, we’re not coming on attracting new customers on the 28-nanometer. And I believe that – the ramp up of 28-nanometer is mainly a function of demand and it will I think it ws both, in the December, this coming December and January we sharply there will be a inflection point in the ramp up curve.

Can you give us some rough numbers on how much of your CapEx spend in the first half for 28-nanomter and how much you think you 28-nanometer CapEx spend will be in the second half of the year.

This year we just revised the CapEx in 7.4, I can roughly tell you more than 2.5 billion will be on 28-nanometer, which is mainly on the first half of this year.

… then further as I think about the fourth quarter significant utilization recovery, I guess that implies that it is in the middle node …

we will have some 28-nanometer on fourth quarter as well.

QUALCOMM Incorporated’s CEO Discusses Q3 2011 Results – Earnings Call Transcript [July 20, 2011]

[Dr. Paul Jacobs, Chairman and CEO] During this quarter, we sampled our Snapdragon MSM 8960 chipset based on 28-nanometer process technology. The MSM 8960 is a dual-core solution which uses our next-generation micro-architecture called Krait with integrated multimode modem technology, including EV-DO, Dual-Carrier HSPA+ and both the TDD and FDD variances LTE.

In June, we hosted our second annual Uplinq conference here in San Diego. The event was a success as it brought together industry leaders from across the ecosystem, including application developers, operators and device manufacturers. Our support of multiple operating systems is highlighted by keynote presentations delivered by HP, HTC and Nokia. The convergence of the mobile and computing ecosystem is accelerating as smartphones and tablets are becoming full-blown computing devices. Traditional computing device manufacturers are working on mobile devices, and developers are increasing their emphasis on mobile. According to Strategy Analytics, by 2012, the installed base of smartphones is estimated to exceed the installed base of PCs. Our collaboration with Microsoft to enable Windows 8 to run on our Snapdragon family of chipsets, including MSM 8960, further underscores a shift in computing.

[Steve Mollenkopf, Executive VP and Group President* ] As Paul mentioned, we sampled the Snapdragon MSM 8960 ahead of schedule this quarter, which is the industry’s first multimode 3G LTE dual core chipset for handsets. This is the first of multiple 28-nanometer chipsets on our roadmap and it is designed to integrate seamlessly with our new connectivity solution, the WCN3660, which supports dual band WiFi, Bluetooth and FM and is optimized for smartphone and tablet devices. As we announced at Computex, the MSM 8960 will be the first processor in the Snapdragon family to power devices using Windows 8.

The MSM 8960 and a broad platform of multimode 3G LTE chipsets on our roadmap will greatly expand the reach of LTE and take our high-performance high-efficiency designs to the next wave of smartphones, tablets and upcoming generations of Windows computing devices.

Demonstrating our potential expanded opportunities that the Atheros acquisition provides, since the deal closed in May, we have launched the industry’s first FTC-certified WiFi system and package for microcontroller-based designs to enable machine-to-machine communications and introduced the industry’s lowest EPON solutions for broadband over fiber networks and the power grid.

We are modestly increasing our R&D investments in the fiscal fourth quarter to support new process technologies, the commercialization of our expanding multi-core and LTE product offerings and to support multiple new customer opportunities. Our strategic focus on integrated system solutions, leveraging our modem application processor connectivity graphics and software leadership is working well, and we expect to see strong volume growth in the coming quarters. …

* Since Sept’10 [the beginning of current fiscal year] Mollenkopf’s [only 41 years old, note that even Jacobs is only 48 years old] executive oversight responsibilities include not only Qualcomm CDMA Technologies (QCT), but also Qualcomm Internet Services (QIS) and Qualcomm MEMS Technologies, Inc [now also over Qualcomm Atheros]. (QMT) which is actually a stepping stone to become a COO as evidenced with case of Len Lauer [53] promoted  to COO role alongside with Mollenkopf’s promotion to president of QCT in April’08. The COO role became vacant when Lauer decided to move to Memjet in Dec’09 because of huge and quite rare opportunities to develop a new ICT power breaker. See more on that in The Memjet disruption to the printing industry [July 30, 2011].

Important note: QCT’s full name of “Qualcomm CDMA Technologies” may easily be interpreted as narrowly related to CDMA mobile communications technology only. In fact QCT has an overall mobile communications/computing role described as:

QCT offers comprehensive chipset solutions for all types of smart connected devices.

… QCT offers solutions for CDMA, UMTS, GSM and LTE technologies, providing support for both 3G and 4G networks and devices. Complementing our offerings, Qualcomm Atheros, Inc., a wholly owned subsidiary of Qualcomm, offers a broad portfolio of additional wired and wireless technologies for the mobile, networking, computing and consumer electronics product segments.

Our combined portfolio now features an expanded array of high-performance, end-to-end solutions ranging from Wi-Fi®, GPS, Bluetooth®, FM and Ethernet — to HomePlug™ Powerline and passive optical network (PON) technologies.

All of our solutions and products are elegantly engineered for optimal performance and power consumption. And our system-on-chip solutions like Snapdragon™ bring together CPU, GPU, connectivity, multimedia and GPS technologies in a way that is redefining mobile possibilities for people everywhere.

CEO’s background:
At Qualcomm, Rise of Founder’s Son Defies Hazards of Succession [June 12, 2011]

When Paul E. Jacobs took over from his father as chief executive of the chip maker Qualcommin 2005, mobile phones were just beginning their transition from tools for talking to hand-held computers delivering data and entertainment.

“We talk about the future of computing being mobile, but I don’t feel that way,” said Mr. Jacobs, 48. “I feel the present of computing is mobile.”

Mr. Jacobs has spent the last six years expanding Qualcomm’s business beyond his father’s tight focus on the digital wireless technology known as C.D.M.A. (code division multiple access)

While Irwin Jacobs, 77, the M.I.T. professor and electronics wizard who founded the company in 1985 and retired in 2005, was known for his dogged defense of the company’s intellectual property, his son Paul is more prone to talk breathlessly about a connected world where mobile devices diagnose our illnesses, turn on our lights, control our thermostats and allow doctors to remotely monitor our health in real time.

Last year Qualcomm dominated a diverse field of smartphone chip makers with 41 percent of the total market share in terms of revenue and nearly 61 percent of the market share for application processors used in smartphones powered by Google’s Android operating system, according to the market research firm Strategy Analytics.

Qualcomm has a two- or three-year advantage in terms of integration,” said Stuart Robinson, an analyst at Strategy Analytics.

The third of four sons, Mr. Jacobs took to computers early, learning to program in middle school on a Teletype terminal. Beginning in seventh grade he worked part time at Linkabit, another technology company founded by his father, which made communications equipment for the military. During college he worked summers at Qualcomm.

“Another thing that my father did for me was that every summer I worked in another area of engineering, so that by the time I went to college, I had done almost every kind of engineering there was,” said Mr. Jacobs, who went on to earn a Ph.D. in electrical engineering at the University of California, Berkeley, where he focused on robotics.

Mr. Jacobs enjoys talking about a world where chips spread out beyond the confines of smartphones. In this so-called Internet of things, everyday objects like TVs, dishwashers, running shoes, blood glucose monitors, picture frames, heart defibrillatorsand even Band-Aids have tiny chips or sensors that transmit information and communicate with mobile devices like smartphones and tablets.

“The sensors are going to be on your body, they’re going to be in the environment around you,” Mr. Jacobs said. “You’ll go and step on the scale and the scale will automatically talk to your phone and keep track of your health.”

Qualcomm’s purchase of the chip maker Atheros Communications for $3.1 billion, the company’s largest acquisition, expands Qualcomm beyond phones into tablets and home electronic devices. It moves the company closer to “fulfilling this vision that wireless is going to be embedded in the world around us,” Mr. Jacobs said.

QUALCOMM Incorporated’s CEO Discusses Q3 2011 Results – Earnings Call Transcript
Question-and-Answer Session [July 20, 2011]

… then a question for Steve [Mollenkopf]. You said that yourself had to use 28-nanometer device. Realistically, how much of your overall mix do you think 28-nanometer should be in, let’s say, 2 quarters from now?

28-nanometer, our first 28-nanometer device will really go commercial at the end of this calendar year so it really won’t show up until the next calendar year. We, however, are very optimistic about that device. We’ve had great success with it so far in terms of how it’s looking in the lab. I mentioned that we sampled that early, which is pretty rare for us and actually probably an indicator of how much priority is on that now as a company. I mentioned that we’ve added some additional OpEx in order to really — I think we’re pretty optimistic about that chip. We want to measure that we de-risk it as best as we can, but we expect that to be something really more in the middle of next fiscal year.

… And then Steve, just on the market share on the application processor aside of the business. Can you talk a little bit about how you see Snapdragon market share shaping up over the next few quarters particularly as you get the 8960 into the market?

As I mentioned in my comments, we saw from quarter-to-quarter, we saw 32% rise actually in our integrated AP chipsets. That’s really across tiers so we’re quite happy with how that’s looking. Looking forward, as you mentioned, the 28-nanometer devices do include integrated LTE as well as all the other modes and Wireless LAN. And I think what’s going to happen here in next year is at the top end of the portfolio, it’s going to be very, very important to have these high-end modems and connectivity integrated in very tightly with the apps process. We’re seeing significant amount of customer traction on this device, and that’s one of the reasons why we really kind of put the gas on it here in the fourth fiscal quarter.

Steve, … how should we be looking at that for next quarter? Does it go back up again? You’ve been talking previously that when you get in the 28-nanometer at the end of the year going to next year, sort of now there were 8960 that we see that bounce back up again. So I want to make sure that we’re still — or just understand that the trajectory of that is going forward. I’m wondering that 120 to 125 MSMs next quarter. If those opportunities you’re talking about come through, would we see that impact next quarter?…

… As we commented, we’re not, at this point, seeing a significant increase in the MSM volume. And as Steve noted, he’s stepping up his R&D because of some opportunities that we see here in the near term. … This is Steve. On the R&D investment, it’s really a combination of things. The majority of it is things that I would consider to be more onetime events in the sense that they are increases in terms of integration platforms that we use internally to develop the devices or tape-outs or things that you would do that accelerate the program because you’re confident in it or you have more confidence in it. We also, as we announced in the quarter, we announced a small acquisition, which closed in the September quarter that’s also now in the results or in the OpEx forecast as well. So very much on track in terms of how we guided you in terms of OpEx, op margin trajectory and what we expect. And then looking into next year, we tend to invest into units a little bit ahead of — more than one quarter ahead, I think, in terms of the volume ramp. So it’s really the products that we’re going to ramp in fiscal year ’12. [FY12 starts on Sept 26, 2011]

… one more question on Krait. So you’re sampled and now shipping sometime next year beginning next year. You said it’s going to support one of the — I guess the integrated connectivity solutions from Atheros. My understanding was the Krait chips in general were going to have connectivity integrated directly on the dye. Can you verify do the MSM, the chipsets coming there, does it have connectivity capability that’s integrated on the dye? Doesn’t sound like it. And if it doesn’t, can you give us some feel for what your connectivity integration roadmap actually looks like going through, I guess, going into 2012 as you roll those products out?

This is Steve. I’ll take the first part of the Krait question. Maybe ask Craig if he can handle the second part, probably better answers than I can give. But the 8960 device has, in addition to the application process of the GPU, all the modems, multi-mode modem functionality in GPS. It does have integrated wireless LAN. It is part of a digital dye, but the radio is actually outside of the device. We have, I think, a little bit different approach to integration than some of our competitors. And maybe, Craig, if you could provide a perspective on that would be great.

Sure, this is Craig [Barratt]. Obviously, from my Atheros background, we’ve been on both sides of this debate. But one of the key things is the attach rate of Wi-Fi is really going up to very high levels pretty much in all smartphone and tablet platforms and there’s substantial benefits to integrating a significant part of the connectivity functions not just WiFi but also Bluetooth, FM. And as you know, GPS was being integrated actually for a long time. We can deliver much higher performance. There’s benefits in terms of reducing overall system-level power. The solution ends up contributing a much smaller increase in PCB size. So the solution area is smaller and that’s critical for more compact devices. And of course, I think there are benefits around cost as well. And so this is a trend that will fan out, I think, across many of the future MSM chips and other similar platforms in the future

… then Steve, for you, on Snapdragon, there seems to be a lot of design activity ongoing as there has been for some time. Looking forward, do you think Snapdragon is best positioned for the smartphone or the tablet market? And maybe just give us your thoughts on how you see the tablet market x Apple evolving?

… this is Steve. Perspectives on chipsets for tablets and phones. In some cases, the same device will be used for high-end phones that will be used for tablets. You’ve seen that in the market. And then in other cases, you may have a more specialized device. We have recently added both of those tiers into our roadmap. The difference between them may be a small amount of performance delta but also different interfaces that are required in a tablet, perhaps, than a phone depending on the class of tablet. In terms of the overall market, our perspective is quite bullish over the long term. If you look at mobile computing, we think that will really grow up and take a fairly significant share of the traditional laptop space really driven by the software that’s being driven on phones. That software is getting better every day and I think, as that happens, you’ll see I think a little bit more diversity in terms of supply base for suppliers into that market as well as the market itself growing. Both of those things being good things for Qualcomm and the industry.

Nvidia Denies Plans to Release Kepler GPU in 2011 [Aug 4, 2011]

Nvidia: Kepler-Based Products to Ship in 2012

Nvidia Corp. on Thursday clarified its plans regarding the next-generation Kepler graphics processing units (GPUs) and their release timeframes. Apparently, the company is on schedule to receive the early silicon of Kepler from its manufacturing partner later in 2011, but the commercial launch of the product is scheduled to occur only in 2012.

“Although we will have early silicon this year, Kepler-based products are actually scheduled to go into production in 2012. We wanted to clarify this so people wouldn’t expect product to be available this year,” said Ken Brown, a spokesman for Nvidia, in an email statement.

TSMC reiterates plans to commercially produce 28nm chips later in 2011 [July 13, 2011]

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has said that its plans to start commercial production of chips using 28nm process this year remains unchanged. TSMC expects 28nm chips to start contributing to company revenues in the third quarter of 2011, and sales from the advanced technology will account for 2-3% of its total wafer sales in the last quarter of the year.

TSMC also reiterated its target of 20% growth in 2011 consolidated revenues (denominated in US dollars).

The remarks were made following speculation that launch of Nvidia’s Kepler GPU generation may be pushed back to 2012 due to manufacturing issues at TSMC. However, according to Nvidia, its schedule has not changed. It expect to begin production in 2011 with products based on Kepler being available in 2012. AMD’s upcoming Southern Islands GPU reportedly will have a similar schedule, industry sources have observed, with AMD also contracting TSMC to build the 28nm GPU generation.

Nobunaga Chai, semiconductor analyst at Digitimes Research, has commented that any production transfer will need to go through a certain learning curve before the process attains satisfactory yields, and it is understandable that current yield rates for TSMC’s 28nm are not mature. Especially for performance-driven devices like GPUs, improving the yield rate would require more time than that for products with simpler architectures like FPGAs.

However, TSMC should find it easier to improve its yields on 28nm compared to 40nm as the latter requires equipment upgrades, Chai said. The foundry previously spent about a year raising its 40nm process yields to a satisfactory level.

Planned launch of Nvidia 28nm and 22/20nm GPUs moved back to 2012 and 2014 [July 8, 2011]

Despite Nvidia CEO Huang Jen-hsun previously saying that the company is set to announce its new 28nm GPU architecture at the end of 2011 and 22/20nm in 2013, sources from graphics card makers have pointed out that Nvidia has already adjusted its roadmap and delayed 28nm Kepler and 22/20nm Maxwell to 2012 and 2014.

The sources believe that the delay is due to unsatisfactory yield rates of Taiwan Semiconductor Manufacturing Company’s (TSMC) 28nm process. TSMC originally expected its 28nm capacity at Fab15 to be available in the fourth quarter of 2011 and was set to start pilot production for its 20nm process technology in the third quarter of 2012.

However, TSMC’s other major client Qualcomm, currently, still has not yet adjusted its 28nm process schedule and is set to launch three new products, 8960, 8270 and 8260A using dual-core Krait architecture in the fourth quarter of 2011.

Meanwhile, AMD will follow its original schedule and enter the 28nm era in the first half of 2012. The company’s next-generation graphics chips Southern Island as well as Krishna and Wichita processors, which will replace the existing Ontraio and Zacate processors, and will all adopt a 28nm process from TSMC.

Qualcomm’s Chipset Roadmap: 1.7GHz Dual-Core + Adreno 225 for 2011, Quad Core for 2013 [July 5, 2011]

Qualcomm Roadmap -- mid 2011

Qualcomm looks just about set to make even more leaps in the chipset game to get them caught up with their competitors. A new roadmap spotted shows where Qualcomm’s headed with their plans in the next few years. For starters, we’ll be getting 1.5GHz to 1.7GHz dual-core chipsets near the end of this year which are expected to make its way into phones in Q4 2011 or Q1 2012. It’ll have an Adreno 225 which is said to rival the GPU powering the Playstation Vita.

Next up is a bit more of the same. The 8230 and 8930 are both set to be dual-core offerings with their cores clocked anywhere between 1GHz and 1.2GHz, depending on what the manufacturer wants. The biggest difference will be in the graphics department where phones will be powered by Adreno 3 (305, to be specific) which will take us far beyond the possibilities of the Playstation Vita and more into the realm of the Xbox 360 or the Playstation 3.

Finally, 2013 will bring us their quad-core beasts with chipsets ranging from 2.0GHz to 2.5GHz in clock speed and an Adreno 320 GPU. Needless to say, I’m ready to throw the power of a mid-range gaming computer into my front pocket.

These all sound very good, but when you think about how far along their competitors are, you start to wonder if their efforts will matter in the coming years. I’m mainly talking about NVIDIA, who has their quad-core Kal-El Tegra 3 chipset coming later this year. To be fair, they are in line with Samsung and are actually ahead of Texas Instruments in the chipset games when it comes to technological advances. Still, quite a long wait between now and 2013.

Qualcomm roadmap reveals quad-core, 2.5GHz ARM CPU [July 6, 2011]

Now, a July 5 posting by MobileTechWorld.com author Makran Daouprovides additional information about the MSM8960, tips a lower-end version called the MSM8930, and reveals the MSM8974 — apparently an even-more-powerful version of the APQ8064. The details are said to have come from a leaked Qualcomm document, a link to which the company’s legal department subsequently asked Daou to remove.

The MSM8960 and APQ8064 were first announced in February, at which time Qualcomm touted the fact that it had employed its ARM architectural license to develop original processor cores. The company’s homegrown architecture, codenamed “Krait,” was claimed to deliver 150 percent higher overall performance and 65 percent lower power consumption than currently available ARM-based cores.

Quoted in a February article by PC‘s Sascha Segan, Qualcomm’s Pineda said Krait is compatible with, but not the same as, the ARM Cortex-A9 cores used in Nvidia’s Tegra 2 and TI’s OMAP 4. “We don’t see this as competing with Cortex-A9. We see it as competing with Cortex-A15 [link],” he reportedly added.

The MSM8960

Aimed at both smartphones and tablets, the dual-core MSM8960 includes an integrated multi-mode 3G/LTE modem, Qualcomm said in February. Featuring “asynchronous CPU cores which can be independently controlled for maximum efficiency,” the device supports dual-channel LP DDR memory and features the Adreno 225 GPU (graphics processing unit), offering eight times the performance of the one found in the original 2007 Snapdragon, the company added.


Qualcomm’s MSM8960
Source: MobileTechWorld

According to MobileTechWorld‘s Daou, the MSM8960’s two Krait cores will be clocked between 1.5 and 1.7GHz, and the device will offer dual 500MHz LPDDR2 memory channels. The MSM8960 will support the capture of stereoscopic 20 megapixel images or 1080p video at 30 frames per second (fps), while its GPU will provide DirectX 9.3 compatibility and 125M triangles/sec. performance, he adds.

The MSM8960 will start shipping in production quantities during the fourth quarter of this year, the MobileTechWorldstory adds.

The MSM8930

Daou’s story also reveals another Snapdragon known as the MSM8930, which is essentially a cost-reduced version of the MSM8960. It has the same dual Krait cores, but they’re clocked only up to 1.2GHz, and there’s just a single 533MHz memory channel, MobileTechWorldsays.


Qualcomm’s MSM8930
Source: MobileTechWorld

For the MSM8930, the Qualcomm document apparently cited “Adreno 305” graphics, which again provide DirectX 9.3 compatibility, this time with 80M triangles/sec. performance. Stereoscopic stills are supported up to 12 megapixels, and 30fps 1080p video capture is again possible, the story adds.

According to the MobileTechWorldstory, the MSM8930 will start shipping in the third quarter of 2012.

The MSM8974

In February, Qualcomm heralded the APQ8064, saying that it would include four asynchronous CPU cores, plus a quad-core Adreno 320 GPU that performs 15 times faster than the original Adreno, “enabling console-quality gaming.” Also offered will be support for both PC and LP DDR memory, serial and PCI Express interfaces, and operation with cameras up to 20 megapixels, Qualcomm said.

Daou now brings word of the MSM8974, “which I guess replaces the MSM8964/APQ8064.” (Qualcomm’s “MSM” devices include on-chip cellular radios, whereas their “AP” equivalents feature only application processors.)


Qualcomm’s MSM8974
Source: MobileTechWorld

According to the MobileTechWorldstory, the powerful MSM8974 will include quad Krait cores clocked at up to 2.5GHz, plus 2MB of second-level cache and support for two 667/800MHz LPDDR3 memory channels. It will support 30 megapixel stills — 3D is likely, but wasn’t mentioned — and 60fps 1080p video capture, while the Adreno 320 is said to provide 225M triangles/sec. performance.

The MSM8974 will start shipping in the first quarter of 2013, writes Daou.

Recent Product Briefs for current 45nm Scorpion-based products: [or heterogeneous multi processing, see later]
Snapdragon single-core MSM8x55 and APQ8055 with upto 1.4GHz [latest version at the moment: Feb 23, 2011]: “This second generation Snapdragon CPU processor substantially improves overall user experience, increases system performance and further extends battery life. The 8×55 CPU chipset is designed specifically for mid and high-tier smartphones as well as larger display devices such as tablets. It also includes the new AP-only option APQ8055. Supported operating systems include Android™, Blackberry®, webOS, and Windows® Phone. … Modem: MSM8255 – UMTS / Single Mode, MSM8655 – CDMA / Multimode … GPU Processor: Adreno 205 with dedicated 2D engine …
Snapdragon dual-core MSM8x60 and APQ8060 with upto 1.5GHz [latest version at the moment: June 6, 2011]: “This third generation Snapdragon mobile processor includes the industry’s first asynchronous SMP [or heterogeneous multi processing, see later] dual-core CPU design, delivering superior performance and power optimization for high-tier mobile devices, particularly for mobile entertainment and gaming applications. … Unlike synchronous dual-core SMP designs where both cores must run at the same frequency and voltage when operational, the dual-core Scorpion asynchronous power design provides independent clocking and voltage per core, allowing each to work independently. This highly efficient design provides substantial power savings over traditional SMP technology by intelligently adjusting performance to suit the needs of the application. … Supported operating systems include Android™, Chrome, Blackberry ®, and Windows® Phone. … Modem: MSM8260 – UMTS / Single Mode, MSM8660 – CDMA / Multimode … GPU Processor: Adreno 220 with dedicated 2D engine …

Qualcomm Announces Next-generation Snapdragon Mobile Chipset Family [Feb 14, 2011]

Mobile Technology Leader Debuting New Quad-, Dual- and Single-core Snapdragon Chipsets with a new CPU Architecture

Qualcomm Incorporated (NASDAQ: QCOM) today announced its next mobile processor architecture for the Snapdragon family. The new processor micro-architecture, code-named Krait, in the next-generation Snapdragon will redefine performance for the industry, offering speeds of up to 2.5GHz per core and delivering 150 percent higher overall performance, as well as 65 percent lower power than currently available ARM-based CPU cores. These chipsets will be available in single-, dual- and quad-core versions and include a new Adreno® GPU series with up to four 3D cores, and integrated multi-mode LTE modem.

The latest family of Snapdragon chipsets will include the single-core MSM8930™, the dual-core MSM8960™ and the quad-core APQ8064™. All chipsets in the family will integrate a quad-combo of connectivity solutions — WiFi, GPS, Bluetooth and FM — and include support for near field communication (NFC), as well as stereoscopic 3D (S3D) video and photo capture and playback. Support for every major operating system, across all tiers of products, comes standardon all Snapdragon chipsets.

The software compatible chipset family will share the same 28nm technology and new, purpose-built CPUs and GPUs for the best mobile performance at the lowest power consumption. The latest Adreno GPUs will also be included in the family, allowing developers to continue to utilize high-performance Adreno graphics capabilities to drive spectacular gaming and user experiences across all device tiers. The Adreno GPU has the largest mobile graphics ecosystems with hundreds of games for Android, Windows Phone 7 Xbox gaming, and PlayStation Certified gaming.

At the high end, the Adreno 320 quad-core GPU will deliver up to 15 times the performance of the original Adreno to drive the latest games and S3D video on larger-screen devices. Adreno 320 delivers similar graphics performance to today’s latest game consoles, but for mobile devices. In addition, the chipset family will support 3D and S3D games, capture and playback of S3D photos and videos, and output in full HD to a 1080P flat panel display over HDMI.

“Just as the original Snapdragon revolutionized smartphones with the first 1GHz processor, these new generations of Snapdragon will revolutionize the next wave of mobile entertainment and computing,” said Steve Mollenkopf, executive vice president and group president for Qualcomm. “We believe we have an incredible lineup of chips and software, representing a single platform that OEMs can utilize to create new devices ranging from mass market smartphones with integrated LTE, to tablets, to next generation computing and entertainment devices.”

The single-core MSM8930 is the world’s first single-chip solution with an integrated LTE modem designed to take LTE to mass market smartphones. It will include the new Adreno 305 GPU which delivers more than six times the performance of the original Adreno.

The dual-core MSM8960 is the world’s first dual-core solution with an integrated multi-mode 3G/LTE modem and was designed to meet the requirements of multi-tasking smartphones and tablets. It will include dual asynchronous CPU cores which can be independently controlled for maximum efficiency. The MSM8960 will also support dual-channel LP DDR memory and will feature the Adreno 225 GPU which delivers eight times the performance of the original Adreno.

The quad-core APQ8064 will be designed to meet the performance requirements of the next generation of computing and entertainment deviceswhile minimizing power consumption. As with the Snapdragon dual-core, the APQ8064 will include four asynchronous CPU cores which can be independently controlled for maximum efficiency. The Adreno 320 quad-core GPU debuts in the APQ8064 processor where it enables console-quality gaming and renders rich user interfaces.

The APQ8064 will also include a variety of features that make it a compelling processing solution for use in mobile entertainment and computing devices, including support for both PC and LP DDR memory, serial and PCIe interfaces, and multiple USB ports. The APQ8064 will also seamlessly integrate with Qualcomm 3G and LTE MDM™ modems and modules, giving OEMs a flexible and cost-efficient platform that can meet all of their design configuration needs and help reduce time to market.

Samples of the MSM8960 are anticipated to be available in Q2 2011 and samples of the MSM8930 and APQ8064 are anticipated to be available in early 2012.

For more information about the Snapdragon processor’s next-generation CPU architecture, the first quad-core CPU and GPU features, and to see many of the top new devices powered by Snapdragon processors, please visit us during the GSMA Mobile World Congress 2010 (Booth 8B53, Hall 8), Feb. 14-17 in Barcelona or visit www.qualcomm.com/snapdragon.

Qualcomm Collaborates with Microsoft on Next Version of Windows [July 1, 2011]

Qualcomm Incorporated (NASDAQ: QCOM) announced today that its upcoming award-winning Snapdragon™ family of smart mobile processors, including the MSM8960™ with integrated 3G/LTE modem, is designed to power devices running the next version of Windows. The companies’ collaboration continues to address the converging and fast-changing mobile computing landscape, and Qualcomm’s Snapdragon family of dual-core and quad-core processors will enable optimal computing performance, extended battery life and connectivity, and top-notch graphics and multimedia in devices.

Qualcomm and Microsoft have a long and productive history of collaborationfocused on driving innovation forward, and we are pleased to be among the leaders of the next evolution of mobile computing,” said Luis Pineda, senior vice president of product management, computing and consumer products at Qualcomm. “Our upcoming family of Snapdragon processors is intelligently integrated, optimized for mobile and built smarter, making it the ideal processor to address consumers’ growing demands for new, innovative experiences and usage scenarios that we believe will be delivered by the next version of Windows.”

The first processor in the Snapdragon family to power devices using the next version of Windows will be the MSM8960, which is sampling this month, followed by the quad-core Snapdragon APQ8064™, which is anticipated to sample in early 2012. Qualcomm has built its Snapdragon family of mobile processors from the ground up to deliver enhanced power efficiency for devices running the next version of Windows. The MSM8960 from the Snapdragon family of mobile processors provides the first dual-core solution with an integrated multi-mode 3G/LTE modem and is designed to meet the multi-tasking requirements of the next version of Windows. The Snapdragon family of mobile processors will include dual and quad asynchronous CPU cores that can be independently controlled to deliver maximum performance at maximum efficiency.

“Windows 8 will enable customers to have the flexibility, connectivity and power that they expect from Windows today with new, touch-only devices like tablets. This will require high-performing, low-power processors like those from Qualcomm, with features like 3G and 4G wireless wide area network (WWAN) connectivity,” said Mike Angiulo, corporate vice president of Windows planning, hardware and PC ecosystem. “We collaborate with Qualcomm because Snapdragon-powered devices will help Windows 8 consumers experience more out of their Windows device and enable hardware manufacturers to try exciting new PC designs.”

Qualcomm will be showcasing the latest Snapdragon-powered tablets and smartphones at COMPUTEX TAIPEI 2011. For more information on Snapdragon processors, please visit www.qualcomm.com/snapdragon.

Qualcomm Atheros Announces Highly Integrated Connectivity Solution for Superior Performance in Smartphones and Tablets [May 31, 2011]

WCN3660 Combo Chip Brings Dual-band Wi-Fi, Bluetooth and FM Radio Connectivity to Qualcomm’s 28nm Snapdragon Family of Mobile Processors

Qualcomm Atheros Inc., the networking and connectivity subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced it has begun sampling its new WCN3660 combo chip, which is designed to bring expanded connectivity options to the Qualcomm Snapdragon™ family of mobile processors. Optimized for use in smartphone and tablet devices, the WCN3660 supports an extensive suite of advanced Wi-Fi connectivity options with multiple Wi-Fi standards. The WCN3660 chip also supports Bluetooth 3.0 and Bluetooth 4.0 and the worldwide FM radio frequency band. Designed to interface with Qualcomm’s 28nm Snapdragon mobile processors, the new WCN3660 is a highly integrated solution, enabling customers to provide enhanced connectivity in mobile devices, while reducing the board area required for Wi-Fi, Bluetooth® and FM radio support by up to 50 percentover existing solutions.

“With the launch of the WCN3660, Qualcomm Atheros is demonstrating its commitment to provide an extensive connectivity portfolio of discrete, combo and integrated platform solutions to our smartphone and tablet customers,” said Amir Faintuch, senior vice president and general manager, consumer business unit, Qualcomm Atheros. “Qualcomm Atheros is pleased to help enable a new generation of mobile devices that connect users to the growing array of must-have social, media and cloud applications.”

The WCN3660 chip features single-stream, 802.11n with dual-band (2.4 GHz and 5 GHz) operation to enhance mobile wireless multimedia applications. The chip also supports mobile hotspot functionality for up to 14 clients with industry standards-based Wi-Fi Direct™ for peer-to-peer wireless connections without an access point present. The WCN3660 also will support the emerging Wi-Fi Display™ standard for streaming video directly from a smartphone or tablet to a Wi-Fi-enabled display or television.

The WCN3660 chip has an integrated dual-band power amplifier, transmit antenna switch and on-chip matching circuit, which allows the chip to meet the most stringent carrier requirements while minimizing solution size and power consumption. Bluetooth standards supported by the WCN3660 chip include high-speed Bluetooth 3.0 for audio streaming and device connectivity, and low-power Bluetooth 4.0, which is designed to work with low-power sensors, health monitoring devices and other low data-rate applications. The FM radio capabilities of the WCN3660 include support for both FM receiver and transceiver functionality; worldwide FM band support (76 to 108 MHz); RDS support for Europe and RBDS support for the U.S.; autonomous search, seek and manual tuning; and active noise cancellation.

The WCN3660 chip is compatible and directly interfaces with Snapdragon devices manufactured in the 28nm process, including the MSM8960™, MSM8270™, MSM8x30™ and APQ8064™. It uses a fully calibrated, wafer-level package smaller than 15mm-squared for direct mounting to a PCB for ease of design and implementation. The WCN3660’s small size and low power consumption in both active and standby modes help provide excellent battery life in mobile devices. To minimize interference and provide high LTE data throughput and optimal audio quality, the WCN3660 interfaces directly with the centralized coexistence manager in the Snapdragon device to provide real-time, intelligent packet arbitration and scheduling, providing an LTE/ISM coexistence solution that is optimized beyond the capabilities of standard filtering approaches.

“Qualcomm Atheros is utilizing its systems expertise to deliver a highly innovative and integrated architecture for connectivity solutions in smartphones and tablets,” said David Favreau, vice president of product management, Qualcomm Atheros. “The new WCN3660 combo chip with the Qualcomm Snapdragon mobile processors provides a powerful solution for always-connected mobile devices that support WAN, WLAN and WPAN connections.”

The WCN3660 is optimized to work with a broad range of mobile operating systems including Android, next-generation Windows and Windows Phone, Palm® WebOS™ and QNX®. Samples of the WCN3660 chip are available now, with a commercial release scheduled for late 2011.

QDevNet | QDSP Access Program – Multimedia Optimization [March 23, 2011]

Qualcomm is helping device manufacturers to differentiate their smartphone and tablet offerings by providing them the tools, documentation and sample code to enable them to optimize their multimedia solutions running on our hardware. Device manufacturers can augment or modify the multimedia suite with their own features, or work with independent software vendors (ISVs) to customize their optimizations for execution on Qualcomm chipset audio-video acceleration hardware.

We will be making tools, documentation and sample code available for the following chipsets:

  • MSM8x60™
  • MSM8960™
  • MSM8270™
  • MXM8x55™
  • MSM7x30™
  • MSM7x27™

Qualcomm’s DSP Access Program Debuts [March 22, 2011]

Program Enables Manufacturers (OEMs) and Independent Software Vendors (ISVs) to Optimize Multimedia Solutions Utilizing Qualcomm Audio and Video Acceleration Hardware

… Both OEMs and ISVs can optimize the features and performance of their multimedia software for execution on Qualcomm chipset audio-video acceleration hardware. Qualcomm will offer software development tools that the OEM or ISV can utilize to compile (C/C++) or hand-code (assembly) their proprietary algorithms on Qualcomm’s optimized audio-video processor architectures. These tools are provided with training and support documentation to assist OEMs and ISVs with their audio/video programming on supported chipsets. Additional details on the Qualcomm Developer Network DSP Access Program are available on the Qualcomm Developer Network (http://developer.qualcomm.com/multimedia). …

Dual Cores—Is Anyone Really taking Advantage of Them? [By Liat Ben-Zur, July 8, 2011]

I recently spoke with Kevin Kwang of ZD Net Asia to discuss the state of mobile multi-core processors. I pointed out that while it’s exciting to see powerful, dual-core Snapdragon™ processors commercially available (in products like the HTC EVO™ 3D and HP TouchPad), if developers aren’t coding their applications with distinct APIs that take advantage of multiple cores, the power of the hardware is often underutilized.

ZDNet Asia: Lack of Software Expertise Dampens Multicore Use

The reality is that this technology trend of multi-cores can be somewhat confusing for most developers. Most are writing downloadable applications, which are only able to take advantage of the HLOS APIs exposed by the platform provider. Most developers are just not exposed to multiple core technology via the standard HLOS API sets that they use every day to build their applications.

Qualcomm recognizes this, and we’re spending a lot of time helping to bridge the gap between what the technology under the hood has the capability of doing with the actual user experiences that developers enable. We want to help expose the power of the system solution, help connect the dots between low-level hardware, high-level software and high-level apps. Qualcomm is focusing on heterogeneous multi processing [or asynchronous SMP, see earlier] as opposed to SMP which means the system can be extremely optimized based on the load. Of course this furthers the need for developers to understand how to take advantage of this flexibility. That’s why we spend so much time working with developers to optimize things like multimedia performance today.

For example, Qualcomm and its subsidiary Qualcomm Innovation Center, Inc. (QuIC) are investing more energy into middleware and web application frameworks that distribute loading of heavy tasks like WebKit, V8 and HTML5 features. Since roughly 70% of web pages are images, we have been working to make image decoding in WebKit to be asynchronousand multi-threaded (optimized for dual-core computing). In addition, Qualcomm works closely with many HLOS providers to make sure that effective APIs are being exposed that take advantage of the parallel processing capabilities of multiple cores.

Qualcomm and QuIC are also investing in optimizing LLVM and the relevant runtimes such as Android Renderscript today and longer term for OpenCL and Google’s PNaCL to better take advantage of our multi-core hardware.

The real differentiation for Qualcomm comes in how we enable the developer community to take advantage of our processors. We’re beyond simply marketing the “speeds and feeds” of our hardware specs. Qualcomm’s real differentiation comes in how we’re enabling the community to take advantage of all the possibilities of true mobile computing power.

MobileBeat Sponsor: What Qualcomm is doing for consumer [July 12, 2011]

At the 2011 MobileBeat conference, Qualcomm vice president of product management Raj Talluri discusses the chip maker’s focus on benefiting the end consumer.

What is the biggest challenge for Qualcomm in engaging the consumer?

For Qualcomm, to launch a product that the end consumer can enjoy, we must work with a laundry list of people. Using mobile payments as an example, we spend our time interacting with partners like Google that create secure operating systems. Next we work with the operator to launch the system. We engage service providers like Paypal or Citybank to enable financial transactions. And we collaborate with phone makers like HTC to launch the app on their phone. There is a lot of plumbing that we take care of before it can reach the consumer. We create the machine.

Today, 3G is pretty widespread, but what are you doing to move the needle toward 4G?

We launched the first 4G phone, the HTC Thunderbolt on Verizon, so we have the best 4G solution out there today. We focus on how to integrate, how to pull all these aspects together onto one chip. Put it together and you get lower costs, better power. We announced our integrated 4G plus apps processor called 8960, which will support Windows 8. The next generation of 4G phones that will come out in the first half of next year will all be using integrated 4G plus apps processor.

A theme of this year’s MobileBeat is mobile payments. How is Qualcomm working within this new sub-industry?

The issue with financial transactions on mobile is the limit on how much money you can move, given security parameters. We are spending time at Qualcomm to build an infrastructure that secures financial payments and lifts the limit. The infrastructure includes hardware inside the processor and software that allows applications to run inside a secure environment, which is authenticated with by a key mechanism. You’ll see products late this year or early next.

Are you partnering with anyone exciting for the consumer?

Scalado, a European company, came up with a really exciting technology that processes images in the JPEG domain very fast. We built the hardware inside our developer platform, Snapdragon, to take pictures at high speeds and compress them into the perfect shot. Scalado then built their application to complements our hardware. The app allows the user to choose a face from those high speed-taken photos and layers it smoothly on your end picture. It’s a total solution for mobile picture taking.

Qualcomm’s new partnership with Nokia

Follow-up:
Nokia Lumia (Windows Phone 7) value proposition [Oct 26, 2011]
Note: The “affordable” Nokia Lumia 710 is the one produced by Compal (the 800 is by Nokia itself). Snapdragon S2 MSM8255 @ 1.4GHz is used in both models.

From being an enemy to being a partner [China Daily, Aug 4, 2011]

Paul Jacobs, chairman and chief executive officer of Qualcomm Inc, said the biggest challenge for him since he took over the company in 2005 was to turn Qualcomm from an enemy disliked by many industry players to a popular and amiable partner.

The company, which was founded by his father, Irwin Jacobs, in the United States city of San Diego in 1985, had been known for providing support for a digital wireless technology named Code Division Multiple Access (CDMA).

Unlike his father, who closely focused on CDMA technology, the son has a much broader vision and he strongly believes in the upcoming mobile Internet, in which cell phones are going to be the devices that everybody uses and connects to the Internet.

The idea has driven Jacobs junior to expand his father’s business into two major parts – mobile phone chipset production and patent licensing. The patent licensing includes CDMA technology and European-adopted technology Wideband Code Division Multiple Access (WCDMA).

Jacobs said he has witnessed some critical changes in the past six years. Instead of being caught up in lawsuits concerning intellectual rights, which used to be a common occurrence, companies have begun to regard Qualcomm as a good partner.

“Partnership was the thing we were missing,” he said in an exclusive interview with China Daily. It was great that Qualcomm had been known for two thingsinnovation and execution– because the company would come up with new things and would deliver qualified chips on time.

However, many companies didn’t like Qualcomm because it imposed high intellectual property royalties on its products. “They felt like they were our hostages. They didn’t like us. They resented us,” Jacobs recalled.

So in the first all-hands meeting after the son took the helm in 2005, he got up and said: “We are going to be known for three thingsinnovation, execution, and partnership.”

The company seemed to benefit from the decision and win back partners. Qualcomm and Nokia Corp, the world’s biggest mobile phone maker by volume, had fought for years over intellectual property disputessince Jacobs started to act as CEO.

Now the two companies have settled the lawsuits and are working together in San Diego to develop Nokia’s first smart phone running on a Windows platform.

Nokia Corp’s chief executive officer, Stephen Elop, said Qualcomm would be “an important partner” as his company is about to enter the Windows phone era.

“But Nokia still has a general strategy that we would like to have multiple partners for critical components,” Elop said at the Nokia Connection 2011 event in Singapore in June.

Jacobs said he is “very excited about that opportunity”, as Nokia eventually paved the way to adopt Qualcomm’s chips. “Our relationships are good and I think they will be even better when the first batch of Nokia phones starts to come out.”

Currently, all nine Windows phone models in the world’s markets are powered by Qualcomm’s Snapdragon chips, said the company.

“Qualcomm has the lead position on Windows Phone and it will take its competitors time to get up to speed on that operating system,” Jon Erensen, research director of Gartner’s mobile handset and consumer electronic semiconductors, wrote in an email to China Daily.

Qualcomm also sees good partnerships growing in the Chinese market, as China contributed the biggest revenue share of 29 percent in the company’s 2010 fiscal year, surpassing South Korea.

In China, the most important strategic alliance for Qualcomm is China Telecom Corp Ltd, the smallest telecom carrier of the country. The operator took the 3G license in 2009and runs a CDMA network in China.

China’s CDMA industry chain has flourished since 2009. Wang Xiaochu, general manager of China Telecom Corp Ltd, said the toughest time for China’s CDMA terminal industry chain had passed, since the market volume grew to 41.9 million units in 2010 from 7.67 million mobile phones in 2008.

China Telecom expects to sell more than 60 million CDMA mobile phones in 2011 and, by mid-June, about 25 million units had already been shipped.

“China Telecom is really where the center of the CDMA universe is now. It used to be more North American focused. Now I think it’s much more about China and Asia,” Jacobs said.

Qualcomm could be one of the companies that benefits most from China’s booming CDMA industry, since the company dominates the world’s CDMA chip market.

Meanwhile, the company has also cooperated with China Unicom to help produce WCDMA handsets.

Qualcomm’s relationship with China Mobile Ltd, the world’s biggest telecom carrier with more than 600 million subscribers, was relatively weak in the past. China Mobile adopted GSM technology in the 2G era and home-grown TD-SCDMA technology in the 3G era. Qualcomm had few products supporting these standards.

But Jacobs said his company’s latest chips, such as dual-core MSM 8960, are about to support various international telecommunication standards, including TD-LTE technology, which China Mobile is actively promoting.

Since China is now the world’s biggest mobile phone production country and mobile phone market, Qualcomm would really like to build up its partnerships with Chinese carriers and mobile phone makers here, the CEO added.

Wang Yanhui, secretary-general of the China Mobile Phone Alliance, said Qualcomm had signed patent licensing agreements with more than 50 mainland handset manufacturers and is setting up a research and development team of roughly 1,000 people in Shanghai.

Domestic handset makers, such as Huawei Technologies Co Ltd and ZTE Corp, are all in good relationships with Qualcomm. Jacobs expected these Chinese companies to achieve a similar success with South Korea companies such as LG Corp and Samsung Electronics Co Ltd.

Jacobs said it was very interesting in China that because China issued 3G licenses relatively later than other countries, Chinese mobile phone makers had built up an export market first.

“Then they come back to China’s 3G market with rich experience. That’s going to help them to achieve a greater success.”

In addition to providing high-end chips, which run at a fast speed and have rich functionality, Qualcomm also focuses on low-end mobile chips aimed for the mass market.

“We are driving the price down at that low endto get the mass market smart phone because we really believe that providing mobile broadband very widely to a lot of people is important, not just because of the good business for us, but because it also improves people’s lives,” he added.

Qualcomm’s move to further cut the low-end mobile phone chips could apply more pressure on some Taiwan-based chip makers, such as MediaTek Inc, but the hundreds of small- and medium-sized mobile phone manufacturers in China would benefit from the competition.

Qualcomm’s global annual revenue rose to $11 billion in fiscal year 2010 from $7.53 billion in 2006. The company shipped 207 million MSM chips in fiscal year 2006, and the figure increased to 399 million in fiscal year 2010.

Qualcomm Signs MOU with China’s Ministry of Information Industry for CDMA [Dec 4, 2000]

The MOU confirms MII’s support of Qualcomm’s Framework Agreement with China Unicom dated January 28, 2000, pursuant to cooperation between China and Qualcomm in developing CDMA technologies. This MOU also supports the deployment in China of a nationwide network based on CDMA technology with continued migration to advanced CDMA technology supporting higher data rates. With over 70 million mobile communications subscribers, China has become the second-largest and fastest-growing mobile market in the world. Qualcomm’s MOU with MII has laid down the foundation of long-term cooperation between Qualcomm and China’s information industry.

Qualcomm Announces Signing of Commercial License for CDMA Network Products with Huawei Technologies [Nov 1, 2001]

Under the terms of the royalty-bearing license agreement, Qualcomm has granted Huawei a license under Qualcomm’s CDMA patent portfolio to develop, manufacture and sell cdmaOne™ and third-generation (3G) CDMA2000 1X/1xEV network equipment. The license grants Huawei the right to use Qualcomm’s patented technology and chipsets to make and sell cdmaOne and CDMA2000 1X equipment in China and worldwide.

Qualcomm Enters into CDMA Subscriber Unit and Infrastructure License Agreements with 11 Chinese Manufacturers [Jan 23, 2002]

… making a total of 17 domestic Chinese telecommunications equipment manufacturers that are now licensed by Qualcomm. Under the terms of the worldwide royalty-bearing license agreements, Qualcomm has granted these Chinese manufacturers licenses under Qualcomm’s CDMA patent portfolio to develop, manufacture and sell cdmaOne™ and third-generation (3G) CDMA2000 1X/1xEV-DO subscriber unit and/or infrastructure equipment.

China Unicom Announces the Signing of a Detailed Agreement with China Telecom on the Disposal of its CDMA Business [July 28, 2008]

Previously, on 2 June 2008, Unicom announced that it had entered into a CDMA Business Framework Agreement with China Telecom. On that same day, Unicom announced that it planned to merge with China Netcom Group Corporation (Hong Kong) Limited (“Netcom”) (HKSE: 0906, NYSE: CN).

The total consideration, payable in cash to Unicom by China Telecom, remains unchanged at RMB43.8 billion (approximately HK$50.1 billion [US$6.3B]) and Unicom expects to realise an estimated net gain before tax of approximately RMB37.6 billion (approximately HK$42.9 billion). The net proceeds from the disposal are expected to be used by Unicom for the expansion of its GSM network coverage, the improvement of GSM customer service and the enhancement of IT support systems and platforms for value-added services, in order to lay a solid foundation for the introduction of 3G services. The net proceeds will also fund the Unicom’s working capital and other general corporate purposes.

Upon completion of the Transaction, Unicom will focus on the operation of its GSM network and prepare for the introduction of 3G services. As of 30 June 2008, Unicom had 127.6 million GSM subscribers and 43.17 million CDMA subscribers. As part of the Transaction, 29.3% of Unicom’s employees will be transferred to China Telecom.

After that restructuring – however – Qualcomm had no China Telecom related press releases at all showing clearly that the company’s focus moved elsewhere on the China market (CDMA/EV-DO tech. manufacturing or other technologies), e.g. ZTE to Develop CDMA2000 Femtocells Based on Qualcomm System on Chip Solutions [March 23, 2010] or Qualcomm Now Demonstrating Products Based on LTE TDD Technology [Sept 8, 2010].

The Changes in the Nokia relationship

Qualcomm Initiates Patent Infringement Proceedings in the UK against Nokia [May 24, 2006]
Qualcomm Files Complaint Against Nokia with International Trade Commission [June 12, 2006]
Nokia’s Announced Plan to Ramp Down its CDMA2000 R&D and Manufacturing Will Not Impede the Continued Growth of CDMA2000 [June 23, 2006]
Qualcomm Responds to Nokia’s Latest Maneuver to Delay Judicial Determinations that Nokia’s GSM Handsets Infringe Qualcomm’s Patents [March 20, 2007]
Qualcomm Files Additional GSM Patent Infringement Suits Against Nokia [April 3, 2007]
Qualcomm Files Arbitration Demand Against Nokia to Resolve Dispute Over License Agreement [April 5, 2007]
Nokia and Qualcomm Enter Into a New Agreement [July 23, 2008]
Companies Agree to Settle All Litigation

Nokia (NYSE: NOK) and Qualcomm (Nasdaq: QCOM) today announced that they have entered into a new agreement covering various standards including GSM, EDGE, CDMA, WCDMA, HSDPA, OFDM, WiMAX, LTE and other technologies. The agreement will result in settlement of all litigation between the companies, including the withdrawal by Nokia of its complaint to the European Commission.

Under the terms of the new 15-year agreement, Nokia has been granted a license under all Qualcomm’s patents for use in Nokia mobile devices and Nokia Siemens Networks infrastructure equipment. Further, Nokia has agreed not to use any of its patents directly against Qualcomm, enabling Qualcomm to integrate Nokia’s technology into Qualcomm’s chipsets. The financial structure of the settlement includes an up-front payment and on-going royalties payable to Qualcomm. Nokia has agreed to assign ownership of a number of patents to Qualcomm, including patents declared as essential to WCDMA, GSM and OFDMA. The specific terms are confidential.

“We believe that this agreement is positive for the industry, enabling the market to benefit from innovation and new technologies,” said Olli-Pekka Kallasvuo, CEO of Nokia Corporation. “The positive financial impact of this agreement is within Nokia’s original expectations and fully reflects our leading intellectual property and market positions.”

“I’m very pleased that we have come to this important agreement,” said Dr. Paul E. Jacobs, CEO of Qualcomm. “The terms of the new license agreement, including the financial and other value provided to Qualcomm, reflect our strong intellectual property position across many current and future generation technologies. This agreement paves the way for enhanced opportunities between the companies in a number of areas.”

Nokia and Qualcomm Plan to Develop Advanced Mobile Devices [Feb 19, 2009]

Nokia and Qualcomm Incorporated (Nasdaq: QCOM) today announced that the two companies are planning to work together to develop advanced UMTS mobile devices, initially for North America. The companies intend for the devices to be based on S60 software on Symbian OS, the world’s most used software for smartphones, and utilize Qualcomm’s advanced Mobile Station Modem™ (MSM™) MSM7xxx-series and MSM8xxx-series chipsets for cutting-edge processing performance and ubiquitous mobile broadband capabilities. The first mobile devices based on this collaboration would be expected to launch in mid-2010 and be compatible with the forthcoming Symbian Foundation platform.

“Nokia is very pleased to be in discussions with Qualcomm around designing mobile devices that can benefit from the high level of integration found on MSM chipsets,” said Kai Oistamo, executive vice president, Devices, Nokia. “We are eager to demonstrate to the industry the possibilities that exist when innovative and open software is combined with advanced hardware solutions.”

“Nokia and Qualcomm are leaders in advanced wireless technologies, and this new level of cooperation would bring exceptional leaps in mobile performance to people around the world,” said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies. “We are very excited about the possibility of the substantial synergies between S60 software and MSM chipsets.”

Qualcomm Innovation Center Joins the Symbian Foundation [Oct 29, 2009]

Qualcomm Innovation Center, Inc. (QuIC) and the Symbian Foundation today announced that QuIC, a wholly-owned subsidiary of Qualcomm Incorporated, has joined the Symbian Foundation and has been appointed to the Symbian Foundation board of directors. QuIC will support the Symbian Foundation with active participation on the board of directors and each of the four councils that govern the development of the Symbian platform.

QuIC’s charter is to focus on optimizing open source software for use with Qualcomm technology. QuIC brings to the Symbian Foundation a wealth of knowledge and expertise in open source and, as a Symbian Foundation board member, QuIC is committed to working with its fellow board members for Symbian’s continued commercial success. QuIC joins wireless operators AT&T, Vodafone and NTT DOCOMO; silicon providers ST Microelectronics NV and Texas Instruments; and handset manufacturers Samsung, Sony Ericsson and Nokia on the Symbian Foundation board.

The Symbian platform comprises a complete, open source mobile operating system, user interfaces, middleware and key mobile applications used in more than 300 million smartphone devices worldwide. It includes the critical software elements a manufacturer or operator needs to build a mobile device. Symbian was built for mobile and enables mobile developers to use open SDKs to create compelling mobile applications that take full advantage of all Symbian-based handsets.

“QuIC joining the Symbian Foundation and the Symbian Foundation board demonstrates our commitment to provide expertise and to optimize technology with the Symbian platform,” said Rob Chandhok, president of QuIC. “High-level operating systems offer the potential to unleash tremendous innovation and we are excited to help advance that process on the Symbian platform. Working as part of the Symbian Foundation, QuIC looks forward to participating in technology innovation in areas such as multi-core CPU support, Web browser and application enhancement, and CDMA and LTE support.”

“The Symbian Foundation welcomes QuIC, whose membership and board participation brings us significant wireless technology expertise and whose leadership will act as an important catalyst for the growth of the Symbian ecosystem,” said Lee Williams, executive director of the Symbian Foundation. “On behalf of the Symbian Foundation board, we look forward to collaboratively evolving and rapidly expanding the Symbian open source software platform with QuIC.”

Qualcomm, HP, HTC and Nokia Executives to Keynote at Uplinq 2011 [April 28, 2011]

Qualcomm Incorporated (Nasdaq: QCOM), the leading developer and innovator of 3G and next-generation wireless technologies, products and services, today announced the general session keynote speakers for the Uplinq® 2011 conference, hosted by Qualcomm on June 1-2 at the Manchester Grand Hyatt in San Diego. Speakers will include Dr. Paul E. Jacobs, chairman and CEO of Qualcomm, Jon Rubinstein, senior vice president and general manager, Palm Global Business Unit, Hewlett-Packard Company, Peter Chou, CEO of HTC and Stephen Elop, CEO of Nokia.

Dr. Paul E. Jacobs will open the conference on June 1 with his keynote, “Mobile Computing: The Next Great Frontier,” which will focus on the continuing evolution of mobile and expanding opportunities for developers to take the mobile experience to new levels. In addition, Dr. Jacobs will share insights about how advances in mobile computing and other technology enablers are breaking down barriers for developers and empowering them to change the lives of people everywhere. HP’s Jon Rubinstein will follow Dr. Jacobs with a fireside chat on the opening day of Uplinq.

On June 2, the second day of Uplinq, HTC’s Peter Chou will give the opening keynote. Rounding out this lineup of wireless industry leaders will be Nokia’s Stephen Elop who will give the second keynote on Day Two of the conference.

Key message: transition from device-to-device battle to ecosystem-to-ecosystem battle

Uplinq 2011: Nokia Stephen Elop Keynote Highlights [June 17, 2011]

The Uplinq Daily Show on Qualcomm LIVE! Interview with Nokia’s Stephen Elop [June 2, 2011]

Cali Lewis interviews Stephen Elop, CEO of Nokia about his keynote and the importance of mobile ecosystems

Stephen Elop’s keynote at Qualcomm’s Uplinq [June 10, 2011]

… There is an opportunity for a third and competitive ecosystem to emerge. …

It is not just the device, or the software on that device. These ecosystems that I described are so much more than what you are holding in your hand. Nokia will be contributing mapping, navigation and various location-based services… and you know what… all the manufacturers of Windows Phone will be taking advantage of that… I want HTC and Samsung to be successful with Windows Phone because our principal competitor is not each other, but Android. So we are contributing service elements for the benefit of everyone in the ecosystem.

Equally, Microsoft is contributing a number of services and capabilities… for example: Bing, AdCenter, Xbox, Office productivity experience, unified communications (voice, video etc.) You will have heard about the acquisition of Skype ten days ago, clearly that will be part of the Windows Phone ecosystem.

Parts of the ecosystem, as well, are the chipset and other hardware contributors. Which is why Qualcomm, ourselves, Microsoft, are all working together to deliver the best experiences for this ecosystem.

How do we take the ecosystem beyond the mobile experience? We believe that, fundamentally, we are just at the beginning of the mobile revolution. The mobile platform, with a variety of sensors and capabilities associated with a device, is giving opportunities to create entirely new and extended experiences that are only possible on that mobile device. So we are only at the beginning of mobility and have an opportunity to extend the ecosystem in different directions to make that even more compelling.

Of course, this ecosystem is not just about mobility and the smartphone, it is also about tablets, it’s about television sets, gaming platforms, automobiles and all the different places where people expect to have a fully connected digital experience.

And so we at Nokia definitely recognise the importance of delivering on this broader promise of the larger connected digital experience.

Perhaps the first and most notable of these today relates to tablets. So there’s a lot of activity and hype about tablets in the marketplace. But the market conditions are not yet optimised… Say there are 201 tablets being sold today, only one of them is being sold out a furious rate… and being very successful. The other 200 tablets… are not really landing with consumers. For Nokia, when I get asked about our tablets strategy, the first thing I say is that I don’t just want to be tablets number 202. Because, really, if we cant differentiate from that pack… then we’re not going to be successful. So as we look at it, we believe we have to do something that is fundamentally differentiated. And we have some options to do that, given our market penetration, our strengths in emerging markets… so watch this space, you will see some interesting things.

We do have the ability to reach out to very large numbers of well identified consumers. With our existing smartphone operating system we have, today, over 200 million registered users, 60 million of whom are active in our apps and store environment on a [rolling] thirty day basis. … Around the world we have tremendous reach. It is today that we are adding 140,000 new registered users [every day]… and they are downloading 5 million items a day [now 6 million]

Now part of the reason, in many parts of the world, that this has been attractive is because of the focus we have had on monetisation enablers. I mentioned earlier the operator billing relationships – we are able to measure the uplift for developers in areas where there is operating billing, compared to those where there is not. You get a three and half times uplift in the volume of money you can make when we have an operating billing relationship. The reason is simple… it is much easier for consumers to just click the button.

A lot of other things we are doing for developers: removing the registration fees to participate in Windows Phone development, all sorts of thing to make it easier to publish and distribute your application. We are also hoping you will recognise the extended opportunity, even beyond Windows Phone, to monetise your application on other platforms [Symbian, Series 40] that reach into China, India and Russia.

Nokia picks Qualcomm for Windows phone, seeks others [Reuters, May 20, 2011]

Nokia said on Friday it was negotiating with several chipset suppliers for its future Windows Phone models after deciding to use Qualcomm in its first smartphones using Microsoft’s software.

Nokia announced in February it would use Microsoft’s Windows Phone software in all of its smartphones.

Microsoft Windows Phone operating system (OS) is available only on Qualcomm’s chips, but the U.S. software giant has said it was expanding the supplier base.

The first Nokias based on Windows Phone will have the Qualcomm chipset,” said a Nokia spokesman.

“Our aim is to build a vibrant ecosystem around Nokia and the Windows Phone OS and with that intent we are naturally continuing discussions with a number of chipset suppliers for our futureproduct portfolio,” he said.

He said one of the companies involved in the talks was ST-Ericsson.

Nokia To Use ST-Ericsson Chips For Windows Phone 8 Handsets [May 19, 2011]

In an interview at STMicroelectronics’ annual Analyst Day, [Carlo] Bozotti [the Chief Executive of the European semiconductor maker] told Forbes that ST-Ericsson will be one of two chip suppliers for Nokia’s upcoming Windows Phones.

The first ST-Ericsson chipset that will appear in a Nokia Windows Phone is the U8500, a sophisticated dual-core system-on-a-chip that has been favorably compared to Qualcomm’s Snapdragon line because it offers multiple wireless technologies like Wi-Fi, Bluetooth, GPS and a fast, built-in HSPA+ modem, all in a compact format. Some later Nokia Windows Phones – the company has previously said it is planning to release 12 Windows Phone devices over the course of 2012 – will run on future versions of the U8500, said Bozotti.

The 5-years long experience of close partnership with Microsoft

Microsoft and Qualcomm to Revolutionize the Next Generation of Smartphones [May 4, 2006]
Qualcomm’s Collaboration with Microsoft Reshapes the Smartphone Market [Oct 23, 2007]
Qualcomm [Snapdragon] Powers Next-Generation Windows Phones [Windows Mobile 6.5] Launching Around the Globe [Oct, 2009]
Qualcomm Becomes the First Chipset Company to Support Microsoft Windows® Phone 7 Series [Feb 15, 2010]

The Company is working with Microsoft and multiple device manufacturers on smartphones powered by its Snapdragon™ platforms and running Windows Phone 7 Series software, currently scheduled to begin launching in time for the 2010 holiday season. Snapdragon chipsets integrate high-performance, custom CPUs with 3G and powerful multimedia capabilities in a single chip.

The latest version of Windows Phone software, announced today, is distinguished by its smart design and delivery of truly integrated experiences. Combining the capabilities of Windows Phone 7 Series software and Qualcomm’s industry-leading chipset solutions will enable a new generation of devices that redefine the possibilities of mobile experiences.

“People’s lives are not a set of discrete tasks and their phones should not be either. Windows Phone 7 Series software offers a fresh approach that integrates the Web, applications and content and brings new services such as Zune and Xbox LIVE to the phone for the first time,” said Andy Lees, senior vice president, Microsoft. “We’ve worked closely with Qualcomm on Windows Phone 7 Series software and Qualcomm’s Snapdragon chipsets are an integral partof bringing to life the rich, integrated experiences on a Windows Phone in a way that conserves battery life and provides always-on connectivity.”

Qualcomm has a long history of working closely with Microsoft on Windows Phone, and we are continuing this collaboration to support the launches this year of exciting new Windows Phone 7 Series devices based on our Snapdragon chipsets,” said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies. “We are very excited about the next generation of devices that will leverage the synergy of our highly integrated system on a chip solutions and Microsoft’s Windows Phone 7 Series software.”

Qualcomm Snapdragon SoCs with a new way of easy identification

Follow-up: Next-gen Snapdragon S4 class SoCs — exploiting TSMC’s 28nm process first — coming in December [Aug 9 — Nov 16, 2011]

Update: Qualcomm Snapdragon S1-S2-S3 SoCs lineup in production as of 16-Nov-2011

Qualcomm Snapdragon S1-S2-S3 SoCs lineup in production as of 16-Nov-2011

End of Update

In the last 24 hours there has been an incredible barrage of posts about “rebranding Snapdragon”. These posts are providing a kind of summary of changes referring to Qualcomm as the source of the information but not linking to that. When one finally finds the Qualcomm source it comes out that there is no rebranding in the conventional sense just a new classification for existing SoCs. So the individual SoC identifiers are the same, there is just a possibility to refer to them by a higher level of indentification which is related to the class of systems they are targeted to.

Because this is much more important new information than the non-existant rebranding I am first copying here the Qualcomm source and then some additional important information regarding their Adreno graphics capabilities and Qualcomm’s latest strategic moves to enter mobile gaming in a very big way. A report of current assesment of that is also available: Qualcomm hopes to make game consoles obsolete [Aug 4, 2011] Anandtech has published the slides of the Qualcomm event: Qualcomm’s March into the Gaming Market [Aug 3, 2011] and draws attention to this particular slide:

Please note the “Wireless Display” option which comes via the WCN3660  companion chip to Snapdragon S4 class of SoCs from the recently acquired Atheros (now Qualcomm Atheros). That chip will support the emerging Wi-Fi Display standard (said not to be confused with Intel’s WiDi) for streaming video directly from a smartphone or tablet to a Wi-Fi enabled display or television. (See also Wireless Gigabit Alliance – WiGig where Atheros is a member which is competing with Wireless HD where one of the members is Intel)

A Simple Way to Identify Which Snapdragon System is Right for You [Tim McDonough Vice President, Marketing, Qualcomm QCT on Qualcomm’s blog: OnQ, Aug 3, 2011]

Today Qualcomm is introducing a new way for our customers, our industry colleagues and consumers to identify the Snapdragon chipset that fits their needs. Those of you who know us well know that our current Snapdragon family of processors has grown to encompass over 15 different chips with feature sets that target mass market smartphones all the way through high end smartphones and tablets. And, although our Snapdragon chips are called processors, they are really system on chip solutions. Inside each Snapdragon chip are multiple hardware subsystems including CPUs, GPUs, modems, multimedia processors, GPS, DSPs, sensors, as well as advanced management software.

And all of these components are integrated into a single small chip that is designed with mobile in mind. The result is that Snapdragon processors deliver outstanding performance and longer battery life. But with such a deep roadmap of chips, our customers and industry colleagues have told us that it has become increasingly difficult to quickly and easily identify which chips are best suited for different devices.

We have arrived at a simple solution. Now our Snapdragon processors are classified into three system classes, System 1 (S1), System 2 (S2) and System 3 (S3): Simple names which denote performance and feature set. Moving forward, we will continue to add new classes as our roadmap grows. Without further ado, I present you with the Snapdragon S1, Snapdragon S2 and Snapdragon S3.

Snapdragon S1: Mass Market Smartphones [note: Up to 3G HSPA]

Qualcomm Snapdragon S1 Mobile Processor -- 3-Aug-2011

Snapdragon S1 processors offer great performance and longer battery life for today’s mass market smartphones. Boasting CPU speeds of up to 1Ghz, Adreno 200 graphics and a 3G modem, Snapdragon S1 processors are powering some of today’s coolest devices.

“The HTC Wildfire S could be the darling of the affordable Android handsets……..The most important factor for us is that we’ve found the HTC Wildfire S capable to performing those core tasks without too much of a compromise.”
Pocket-Lint’s review of the HTC Wildfire S powered by the Snapdragon S1

The Snapdragon S2: High Performance Smart Phones & Tablets [note: 3G HSPA+]

Qualcomm Snapdragon S2 Mobile Processor -- 3-Aug-2011

The Snapdragon S2 processor is an excellent choice for high performance smartphones and tablets. The S2 class of processors have some of the same design foundations as the S1 class but with some key performance improvements including a single core Scorpion CPU that clocks to speeds of up to 1.4Ghz, the fastest single core mobile CPU in the market, and the Adreno 205 GPU, which is designed to provide a 2x performance boost over the Adreno 200 GPUs. Web browsing and multimedia performance gets a serious performance boost too. With just one CPU core, the Snapdragon S2 can offer smoother graphics than other solutions that use dual-core CPUs.

“You can see clearly in the video that Qualcomm’s 2nd generation, single-core processor chewed up YouTube’s 720p Flash content without a hitch while the others failed to keep up in a smooth fashion.”
Phandroid– (6/2011)

Snapdragon S3: Multi-tasking & Advanced Gaming [note: 3G HSPA+, 1440×900/1080p HD/Dolby 5.1, Stereoscopic 3D capture & playback]

Qualcomm Snapdragon S3 Mobile Processor -- 3-Aug-2011

Here’s where things really get kicked up a notch. Simply put, the Snapdragon S3 is designed to offer 2x the graphics performance of the S2 and 4x the graphics performance of the S1. The S3 class of processors also feature a dual core Scorpion CPU at speeds of up to 1.5Ghz per core. With a more powerful [Adreno 220] GPU and a fast dual core CPU, the things our customers are starting to do with the S3 are pretty incredible. Take the HTC EVO 3D, this smartphone features a front-facing camera for video calls, two cameras on the back to create 3D photos and a display that uses a parallax barrier so you can view 3D photos without 3D glasses!

This performance boost also allows our customers to create devices with bigger and sharper displays. The Snapdragon S1 and S2 are typically in devices with 3-4-inch displays that offer a resolution of 800×480. The Snapdragon S3 in the HTC EVO 3D drives a 4.3-inch display with a resolution of 960×540, while the HP TouchPad tablet uses a monstrous 10.1-inch with a resolution of 1024×768.

The Snapdragon S3 Mobile Processor and Your HDTV [Aug 2, 2011] [note the “extend that experience to a 40-inch display” both in the video and the attached caption]

The latest chip in Qualcomm’s Snapdragon family is the Snapdragon S3 mobile processor featuring a high-performance dual-core Scorpion CPUs up to 1.5Ghz and an Adreno 220 GPU. Any smartphone or tablet equipped with a Snapdragon S3 processor can not only deliver great battery life and stunning graphics on a 4-inch display but can even extend that experience to a 40-inch display [by plugging your smartphone into a 40″ TV via HDMI]. Web browsing, video playback and high-quality gaming will still remain fluid. You can find Snapdragon S3 mobile processors in the HTC EVO 3D, HTC Sensation 4G, T-Mobile myTouch 4G smartphones and the HP TouchPad tablet. For more information about Snapdragon: http://www.qualcomm.com/snapdragon

To maintain great battery life while also improving performance, Qualcomm designed the S3’s Scorpion CPU cores to be asynchronous, so each core can operate at different frequencies and voltages for superior performance at lower power. The S3 class of processors also support a host of video codecs and multimedia acceleration. You can learn more about the devices that use Snapdragon processors in our Snapdragon Showcase

“It (The Snapdragon S3) has arguably the best CPU and GPU in the dual-cores…The CPU being asynchronous can be a real battery saver… including NEON and has a 128-bit pipeline rather than 64 bit found in all other CPU thus a better speed…About multimedia, Its one of the best when it comes to multimedia… Qualcomm is also known for the stability of chipsets due to the fact that everything is on the chipset itself rather than making manufacturers add it.”
Droid Gamers—Beastly Dual-Core Android Devices: A Rundown on Each Chipset (5/2011)

Coming Soon: Snapdragon S4—Next Generation Devices

The Snapdragon S4 class will include the newest generation of Snapdragon processors and will feature a new CPU microarchitecture [Krait instead of the previous Scorpion] and integrated 3G/LTE multimode. The S4 will stay true to its roots by delivering exceptional battery power—a 65% decrease in power consumption, yet at the same time boost performance by 150%. This combo is going to create mobile products that offer graphics [Adreno 225 and up] that are comparable to current gaming consoles.

You’re also going to see Snapdragon S4 processors in new form factors and running a full blown desktop operating system. We’re currently working with Microsoft so the S4 can run the next version of Windows—Windows 8.

Stay tuned for big things. Or should we say small things?

Snapdragon™ Adreno 220 GPU Powers “Desert Winds” Game at MWC [Brent Sammons, Graphics Product Manager, Qualcomm QCT on Qualcomm’s blog: OnQ, March 1, 2011]

Attendees of Mobile World Congress 2011 got to see the newest generation of the Adreno GPU, Adreno 220, in action as part of the new Desert Winds game demo at Qualcomm’s booth. The graphics performance, new 3D effects, and level of graphical realism now possible with the dual-core Snapdragon MSM8660 chipset and its Adreno 220 GPU grabbed the attention of virtually all passing by the booth.

Snapdragon’s Adreno GPU – Desert Winds Game Demo [note the “console quality” differentiation in the attached text]

Check out the console-quality mobile 3D graphics available on Snapdragon’s Adreno GPU. Learn more about Snapdragon: http://www.qualcomm.com/snapdragon

Desert Winds was shown in stereoscopic and non-stereoscopic 3D via HDMI out to a 55-inch HD LCD display. As with Qualcomm’s other dual-core Snapdragon MSM8660 demos at the show, the new Desert Winds game was running on the Snapdragon Mobile Development Platform (MDP), which is a device available to developers who want early access to Snapdragon chipsets and Adreno GPUs. (Get more info on the Snapdragon MDP and how to purchase at www.bsquare.com.)

The Desert Winds game ran in interactive and non-interactive modes, giving users the ability to play the game and help the game’s heroine, Amira, slay the giant scorpion character, Alacran, and his army of scorpions.

Developed by Southend Interactive, the game showcases the console-quality 3D graphics and high-end effects made possible by the Adreno 220 GPU, such as:

  • Advanced particle physics and vertex skinning
  • Full-screen post-processing shader effects
  • Dynamic lighting with full-screen alpha blending
  • Real-time cloth simulation
  • Advanced shader effects like dynamic shadows, god rays, bump mapping and reflections
  • 3D animated textures

Qualcomm will continue to use the Desert Winds game to showcase the ever-evolving, advanced capabilities of the Adreno GPU, with more 3D effects, smoother stereoscopic HD gaming, market-leading performance, and industry leading power-efficient 3D graphics. Based on our research (*), the Adreno 220 GPU in Qualcomm’s dual-core Snapdragon MSM8660 offers twice the performance of the GPU in other leading dual-core ARM9-based chips.

With more Android devices based on Snapdragon and Adreno and with over 100 games optimized for Snapdragon and Adreno, it seems clear that the mobile industry is already well aware of the many advantages that Snapdragon and its Adreno GPU.

In my opinion, it was apparent at this year’s Mobile World Congress that Qualcomm is well-positioned to continue its strong momentum in providing OEMs and 3D game developers with a powerful and efficient graphics platform that brings more of the industry’s latest and best 3D games to more smartphones, tablets and laptops everywhere.

_____

(*) Source Qualcomm – Average of Industry benchmarks composed of Neocore, GLBenchmark, 3DMM and Nenamark

Anandtech’s reports are not contradicting that:
Hands on and Benchmarks of two MSM8x60 Phones – HTC Sensation 4G and HTC EVO 3D [June 3, 2011]
Dual Core Snapdragon GPU Performance Explored – 1.5 GHz MSM8660 and Adreno 220 Benchmarks [March 30, 2011]

GLBenchmark 2.0

… GLBenchmark 2.0 is the best example of an even remotely current 3D game running on this class of hardware–even then this is a bit of a stretch. GLBenchmark 2.0 is still our current go-to test as it is our best best for guaging real world performance, even across different mobile OSes. … Comparatively, the 1.5 GHz MSM8660 with Adreno 220 is 2.2x faster than the 1 GHz MSM8655 with Adreno 205.

Quadrant 3D and 2D

Last and definitely least (at least in my mind) on the list is Quadrant, which has unfortunately become something of a de-facto one stop shop for benchmarking Android devices, famously spitting out one easy to digest score.

… Adreno 220 shows anywhere from 2-5x performance gains over Adreno 205.

Final Words

When we first started looking at Qualcomm’s Snapdragon SoCs we were impressed by their CPU performance but largely put off by the performance of the Adreno 200 GPU. The 45nm Snapdragon with the Adreno 205 GPU changed things as it roughly doubled GPU performance. The Adreno 220 brings about another doubling in GPU performance. …

How Snapdragon is Changing the Mobile Gaming Industry [Brent Sammons, Graphics Product Manager, Qualcomm QCT, Feb 10, 2011]

Qualcomm Shows Strong Support of the Mobile 3D Gaming Ecosystem at GDC [Brent Sammons, Graphics Product Manager, Qualcomm QCT on Qualcomm’s blog: OnQ, March 18, 2011]

Qualcomm has been clearly demonstrating its support of the entire mobile 3D gaming ecosystem at recent conferences like this month’s Game Developers Conference (GDC) in San Francisco. This support showed up as a press release with Gameloft; a new video with Gameloft and NAMCO BANDAI Games America; joint marketing activities with Sony Ericsson around their new PlayStation Certified Xperia Playdevice; a GDC speaker session featuring presentations by leading mobile developers Southend Interactive and Polarbit; a new Snapdragon mobile 3D gaming ecosystem video and a very well-attended and well-received party at Ruby Skye!

In the press release Qualcomm announced its agreement with Gameloft to deliver an enhanced, Snapdragon-optimized experience for Gameloft’s premier HD mobile 3D game titles like “SpiderMan Total Mayhem HD,” “Real Football 2011 HD,” “GT Racing: Motor Academy HD” and “Modern Combat 2: Black Pegasus.” These will be optimized for current and future Snapdragon processors, such as the MSM8x55 with its Adreno 205 GPU (currently shipping), and the dual-core MSM8x60 with its Adreno 220 GPU.

In a video shot during GDC, Baudouin Corman (Vice President Publishing of Americas for Gameloft) and Dominic Lobbia (Senior R&D Director of NAMCO BANDAI Games America) speak to their game optimization efforts and the value that Snapdragon and Adreno bring to the table. They cite the strong adoption of Snapdragon by manufacturers of high-end Android and Windows Mobile 7 devices, the high quality and great performance of mobile 3D graphics powered by Snapdragon and Adreno, as well as the valuable graphical optimization and development tools Qualcomm offers like the Adreno Profiler. (For more information on the Adreno tools, go to http://developer.qualcomm.com/dev/gpu/tools.)

Game Developers Explain the Value of the Adreno GPU [March 18, 2011]

Gameloft and NAMCO BANDAI explain the value of Snapdragon’s Adreno for game optimization efforts.

Conference attendees also had the opportunity to get the whole story about Qualcomm’s mobile 3D gaming ecosystem support via a new video that was playing just outside the South Hall Expo Floor. The video features Qualcomm’s Vice President of Product Management, Raj Talluri, who explains that there is a huge ecosystem of Snapdragon game developers and games optimized to Snapdragon, that the majority of Android phones use the Snapdragon processor, and that all Windows Phone 7 products use the Snapdragon processor. Therefore, he explains, developers are able to reach a large audience of smartphone and tablet users.

Qualcomm’s Mobile 3D Gaming Ecosystem [March 20, 2011]

Raj Talluri, VP of Product Management, explains the Snapdragon game developers ecosystem.

“Hey, You Got Your Snapdragon Chipset in My Xperia™ PLAY” [Brent Sammons, Graphics Product Manager, Qualcomm QCT on Qualcomm’s blog: OnQ, May 27, 2011]

Unlike the chocolate and peanut butter in Reese’s chocolate peanut butter cups, it was no accident that Snapdragon and the Xperia PLAY found themselves together. This week Sony Ericsson launched the Xperia PLAY at Verizon, with Qualcomm’s Snapdragon MSM8255 mobile processor with Adreno 205 Graphics Processing Unit(GPU) inside.

It is the world’s first PlayStation-certified phone (and perhaps the world’s most gaming-centric smartphone). And Sony Ericsson chose Snapdragon and Adreno to power it. If you’re wondering why, check out this recently posted Qualcomm video, featuring Aaron Duke and Kim Ahlstrom from Sony Ericsson, talking about the Xperia PLAY with Snadragon’s Adreno GPU.

Snapdragon’s Adreno [205] GPU powers the Xperia PLAY [May 26, 2011]

Sony Ericsson explains the value of Snapdragon with Adreno in the Xperia PLAY for superior game play.

The Snapdragon MSM8255 chipset and Adreno 205 GPU together provide a fun and immersive gaming experience via the very device you will want to carry with you everywhere all the time – the new Xperia PLAY smartphone.

Not only does Snapdragon contain powerful graphics processing — enough to rival some in-home console systems — but it also has a lot of other valuable integrated features like video capture and playback, music playbackand a 1.4 GHz CPU.

The Xperia PLAY has a 4-inch 854×480 display, a 5 megapixel rear-facing camera, a VGA front-facing camera, 512 MB of RAM, and is based on Android 2.3 Gingerbread. Perhaps more importantly, the device comes with seven preloaded games. And you can download over 50 more games via Verizon’s VCAST apps store.

I would say that another big reason that Sony Ericsson chose to work with Qualcomm is that Qualcomm is really into mobile gaming!Keep your eyes peeled in the coming days for more details on just how big into gaming Qualcomm has become.

In the case of the Xperia PLAY, Qualcomm worked closely with Sony Ericsson not only to establish connections with some of the best mobile game developers and game titles around, but alsoto help game developers make sure that the games offered on the PLAY are the best they can be, using the Adreno graphics optimization tools.

We’re very pleased that Sony Ericsson chose Snapdragon for the Xperia PLAY device. We’re confident you will be, too. The Xperia Play may not be as tasty as a Reese’s peanut butter cup, but I’d say it’s a lot more fun and lasts a lot longer! For more information on commercially available Snapdragon-based devices and on the Adreno graphics optimization tools, check out our developer site at developer.qualcomm.com.

SoC’s for 2011: [ekin , Jan 23, 2011 >>> ]

(listed in what I believe is the best to the worse)
+ ARM Sparrow: Dual-core Cortex A9 @2.00GHz (on 32nm die), unspecified GPU
+ TI OMAP 4440: Dual-core Cortex A9 @1.5GHz, SGX 540 (90M t/s)
+ Apple A5 (iPad2): Dual-core Cortex A9 @0.9GHz, SGX 543MP2 (130M-150M t/s)
+ Qualcomm MSM8660 (Gen IV Snapdragon): Dual-core Cortex A9 @1.5GHz, Adreno 220 (88M t/s)
+ TI OMAP 4430: Dual-core Cortex A9 @1GHz, SGX 540 (90M t/s)
+ ST-Ericson U8500: Dual-core Cortex A9 @1.2GHz, ARM Mali 400 (50-80M t/s)
+ Samsung Orion: Dual-core Cortex A9 @1GHz, ARM Mali 400 (50-80M t/s)
+ Nvidia Tegra 2: Dual-core Cortex A9 @1GHz, nVidia ULP-GeForce (71M t/s)
+ Qualcomm Scorpion (Gen III Snapdragon): Dual-core Cortex A8 @1.2GHz, Adreno 220 (88M t/s)

Notes:
– The SGX530 is roughly half the speed as the SGX535. The SGX540 is twice as fast as the SGX535.
– The Adreno 205 (41M tri/sec) is supposedly faster than the SGX535 but slower than the SGX540 (thus, is likely to be in the mid).
– The Adreno 220 is twice the speed of the Adreno 205 but it is slightly slower than SGX540 (88M vs 90M tri/sec).
– Samsung claims ARM Mali 400 to be 5 times faster than its previous GPU (S3C6410 – 4M tri/sec), about on par (80M tri/sec) with the Adreno 220, but few leaks benchmarked it to be only slighlty faster than the SGX535 (40M tri/sec).
– The gpu used in the Nvidia Tegra2 has been quite contained (little known). I estimated the Tegra2 has 71M t/sec (Tegra 2 Neocore=27fps/55fps=Galaxy S Neocore, x62% disadvantage of screen resolution, x 90Mt/s of SGX540 = 71M t/s). And recently some inside rumors via fudzilla actually confirmed this exact figure, so therefore the gpu-chip inside the Tegra2 is roughly equivalent to the MALI 400.

All of these details are based on officially announced, rumors from trustworthy sources and logical estimations, so discrepancies can be existent.

Last thoughts:
As you can see there is some diversity in the next-gen chips (soon to-be current-gen), where the top tier (OMAP 4440) is roughly 1.5 times more powerful than the low tier (Tegra 2). However drivers and software will play a lead-role in determining which device could squeeze out the most performance. And this factor may alone favour the iPad2, Playbook or even MeeGo tablets to be better than the Honeycomb tablets which are somewhat bottleneck-ed by the lack of hardware accelaration and post-transcription through the Dalvik VM. I think we’ve hit the point where we could have some really impressive high definition entertainment, and even emulating the Dreamcast at decent/fullspeed.

edit2 [March 13]:  “ Just re-edited the post. Apple’s A5 details are added in, its looks to be one of the best chips for the year. If I had to choose between the OMAP4440 and A5, I probably would be reduced to a head-tail coin flip!”

Well, Apple’s been boasting over x9 the graphical performance over the original iPad. There are 2 articles on anadtech, one in Geekbench and a processor-specific details from imgtech (I dug up from 12months ago). It has been found that its a modified Cortex A9, 512MB RAM and the SGX543MP2. Everything points to the SGX543MP2 being significantly faster than the SGX540, and the given number was 133 Million Polygons per second (theoretical) for SGX543MP4 which is double SGX543MP2 performance. The practical figure is always less. Imgtech said the SGX540 is double the grunt of the SGX535, benchmarks show the SGX543MP2 is (on average) five times the grunt as the iPad (SGX535). So going by imgtech (the designer of sgx chips), the theoretical value that I list above, should be 70M t/sgoing by Apple’s claim it should be 200M t/sgoing by benchmarks it should be roughly 130 M t/s. Imgtech’s value is definently wrong since they claimed its faster than the SGX540 valued at 90M t/s. Apple’s claim also seems biased, they take only the best possible conditions and exaggerate it even more. It seems to be somewhere in between, and wouldn’t you know it, the average of the two “false” claims is equivalent to the benchmarked value

edit3 [April 3]: “Update. The benchmark results of the Snapdragon MSM8660 are in…. and it goes further to support the list. MSM 8660 = Dualcore A9 + Adreno 220 + Qualcomm modification (for better/worse).”

The benchmarks are out for the 4th-gen QSD, which confirms everything prior. It’s competing for top place against the 4440 and A5. I’ve changed the post (only updated chip’s name). If one were to choose between the processor of the A5 and the OMAP4440, they’d be really pressed to choose between more cpu grunt or more gpu grunt.

Qualcomm roadmap reveals quad-core, 2.5GHz ARM CPU [July 6, 2011]

MSM8960 [start shipping in Q4 2011]: Adreno 225 3D/2D 125 M tri./sec (DX9.3) – said to rival the GPU powering the Playstation Vita

MSM8930 [start shipping in Q3 2012]: Adreno 305 3D 80M tri./sec (DX9.3) – take us far beyond the possibilities of the Playstation Vita and more into the realm of the Xbox 360 or the Playstation 3

MSM8974 [start shipping in Q1 2013]: Adreno 320 3D 225M tri/sec (DX9.3)

While looking back one year: [Medion, Aug 19, 2010]

Samsung Galaxy uses PowerVR SGX540 (rated at 1 gigapixel fill-rate, and 28M triangles/sec)
Iphone 3GS/4 both use PowerVR SGX535 (1 gigapixel, 14M tri/sec)
Droid 2/Droid X use PowerVR SGX530 (500 megapixel, 14M tri/sec)
Droid uses underclocked PowerVR SGX530 (250 megapixel, 7M tri/sec)
Snapdragon uses Adreno 200 (133 megapixel, 22M tri/sec)

So when it comes to the GPU, the Galaxy S phones kill anything that uses a current Snapdragon. The fill-rate is what is what’s really holding back the Adreno.

As for the CPU, I’ll generalize here.

Snapdragon – ARMv7 based Scorpion core (NOT an A8 like some state). Advantages over A8 is 5% faster clock for clock, and ability to be used in a multi-core configuration. Basically, it’s more future proof.

TI OMAP – stock Cortex A8, but currently running at 45nm, so better on battery life than Snapdragon (this will change with the new Snapdragons coming out)

Hummingbird – modified Cortex A8, 10-20% faster multi-threaded performance, but also 45nm so with better battery life as well.

So in terms of CPU, it’s Galaxy > Snapdragon/OMAP (depends, do you want 5% more performance, or significantly better battery life?)

So in conclusion, the Galaxy phones have more horsepower than the Incredible. If you plan to root and run custom ROMs, it should be the platform of choice.

China Mobile repositioning for TD-LTE with full content and application aggregation services, 3G [HSPA level] is to create momentum for that

Follow-up: – Good TD-LTE potential for target commercialisation by China Mobile in 2012 [July 13, 2011]

See also: Mobile Internet (Aug’11) which is a total update on Aug 26, 2011 with a lot of additions to the original July 19, 2010 content on the following subjects:
– LTE and LTE Advanced — HSPA Evolved (parallel to LTE and LTE Advanced) — Heterogeneous networks or HetNets — Femtocells and Picocells — Qualcomm innovations in all that — Ericsson’s LTE Advanced demo — Current roadmaps on evolutions of current 3G+ broadband mobile networks

China Mobile to accelerate TD-LTE commercialization [June 10, 2011] (emphasis is mine)

China Mobile reportedly has decided to accelerate its investment in TD-LTE technology aiming to push the commercialization of TD-LTE networks one year ahead of its original schedule, according to industry sources.

The affects of poor sales on the commercialization of its 3G TD-SCDMA networks has pushed China Mobile to move forward into the 4G segment, the sources indicated.

The move by China Mobile has attracted attention from a number of chipset makers including Qualcomm, Sequans Communications, MediaTek and VIA Technologies as well as China-based Spreadtrum Communications, Hisilicon Technologies and Innofidei, as they have all been eyeing the 4G chipset market in China, the sources noted.

MediaTek has decided to expand its R&D team for the development of LTE and WiMAX chips in Taiwan and China, with plans to raid talent from other wireless chipmakers as well as from HTC, said the sources, noting that MediaTek also does not rule out the possibility of acquiring related LTE R&D teams at home and abroad later.

Global opportunities for LTE TDD [Ovum, February 2011]

Quite often, LTE TDD (also known as TD-LTE) is wrongly presented as a Chinese technology. … However, unlike TD-SCDMA, which was originally a Chinese technology that was subsequently adopted by 3GPP, LTE TDD has been part of the 3GPP standardization effort since its inception. … China Mobile learned at its cost with TD-SCDMA that being a 550 million customer mobile operator helps to attract vendor attention but is not enough to make a technology a global success. The operator consequently built a strategy to position LTE as the next GSM, making LTE the de facto global standard for mobile broadband – something most cellular operators would welcome for cost reasons.

China Mobile is facing several challenges with TD-SCDMA. One of the most acute relates to the smaller economies of scale associated with a weaker device ecosystem compared to UMTS/HSPA. This is why China Mobile quickly oriented its long-term mobile broadband strategy towards LTE TDD. … In terms of LTE TDD network expansion, we believe that it could be faster than TD-SCDMA as the network will leverage many aspects of the current TD-SCDMA network including cell site facilities, backhaul, and even parts of the base stations. … Despite the large scale of the trials, the drawback of a 1H12 launch is the impact it may have on the development of the LTE TDD ecosystem. Fortunately for the technology, another significant market, India, may launch commercial LTE TDD services before the end of 2011.

It is Ovum’s view that LTE TDD will become widely adopted in the global market, but this will take time, as exemplified by our forecasts. There will be a delay of 12–18 months between the take-off of the two LTE variants. For LTE FDD take-off should be around 2012–13, while it is expected that this will be around 2013–14 for LTE TDD. We forecast 89 million LTE TDD connections by 2015, representing roughly 25% of total LTE connections.

First Pre-commercial LTE TDD/FDD Uni-Mode Single Chipset USB Dongle to be Launched in June [June 9, 2011]

In June 2011, the world’s first pre-commercial LTE TDD/FDD uni-mode, multi-band, single chipset USB dongle supporting LTE TDD/FDD idle mobility (cell reselection) will be launched by Huawei Hisilicon. Successful completion of the IOT tests with all of the 10 infrastructure vendorsindicated that it had fully satisfied the Uu IOT and terminal test requirements of MIIT and CMCC.

Detailed  design parameters are as follows:

The TD-LTE USB Dongle makes an unprecedented advance in functionality, performance, form factor, and interoperability. Prior to the launch of this pre-commercial TD-LTE dongle, 3 other critical development stages were completed:

  1. The first release of TD-LTE single-mode USB dongle test samples were released at the Shanghai World EXPO in mid 2010. All the terminals were custom-designed for the trial/ demonstration with the 65nm chipset design. Most of them passed the IOT tests with 1-2 infrastructures.
  2. The first release of LTE TDD/FDD dual-mode Single Chipset USB (65nm design) dongle test samples were released at GSMA MWC 2011 in February 2011. The USB dongles provided by Huawei Hisilicon and Qualcomm can support TD-LTE and LTE FDD in a single chip. The dongle is designed to support TD-LTE or LTE FDD based on the software that is loaded.  IOT tests with 3-4 infrastructrues were passed during this phase.
  3. The pre-commercial TD-LTE single-mode multi-band USB dongles (45nm design) were launched during the GTI 1st workshop in April 2011. These were targeted for trial applications and installations. More than 20 TD-LTE USB dongles from ZTE provided problem free services during the two-day GTI workshop. The DL peak data rate reached 80Mbps and the average single user DL data rate reached 4Mbps. The dongle demonstrated the commercial readiness, stable performance and rapid development of the TD-LTE dongle.

The development quickly progressed from a 65nm test sample to a pre-commercial, Full IOT, Uni-mode, 45nm solution in less than a year. TD-LTE Large Scale Trials in China and commercial deployment in India and Japan will speed up its commercial readiness. The TD-LTE dongle will be commercially available in 2011.

Spreadtrum Communications Acquired Stake in MobilePeak Holdings, Ltd., a Leading UMTS/HSPA+ Modem Chipset Designer [June 9, 2011] (emphasis is mine)

Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that it has acquired approximately 48.44% of the total outstanding shares of MobilePeak Holdings, Ltd. (’MobilePeak’), a privately held fabless semiconductor company based in Shanghai and San Diego that specializes in the design of highly integrated UMTS/HSPA+ modem chipsets.

Spreadtrum acquired approximately 48.44% of MobilePeak’s total outstanding shares, and provided a short-term loan to MobilePeak for the repayment of MobilePeak’s outstanding convertible bridge loans, for an aggregate cash consideration of approximately US$32.58 million. Spreadtrum intends to purchase all of MobilePeak’s issued and outstanding shares, and expects to complete the acquisition in the third quarter of 2011. Thanks to MobilePeak’s efficient operations, Spreadtrum expects the acquisition to have a minor impact on its earnings per share in Q2 and the remaining quarters in 2011, and Spreadtrum maintains its Q2 2011 guidance in terms of revenue, gross margin, and operating expenses as a percentage of revenue.

Commenting on the transaction, Spreadtrum’s Chairman, President and CEO, Dr. Leo Li, said, ’We are very pleased and excited to welcome the MobilePeak team. The synergies between the two companies and the opportunities created by this transaction are clear. With MobilePeak’s complete UMTS/HSPA+ solution, we will broaden our portfolio of worldwide wireless handset technologies, and make inroads into the WCDMA feature phone, smart phone and tablet markets.

“Utilizing our advanced 40nm technology, mature GSM/GPRS/EDGE and TD-SCDMA platforms, and working closely with MobilePeak’s Shanghai and San Diego teams, we will be well equipped to expand our international market shares. These capabilities are also a solid foundation for developing the next generation multi-mode FDD-LTE/WCDMA and TDD-LTE/TD-SCDMA technologies over the next two years.”

Mr. Qiuzhen (Joe) Zou, Chairman and President of MobilePeak, said, ’ We are eager to work with the Spreadtrum team. Since MobilePeak’s inception in 2005, our team has developed world-class baseband chipsets with support for 3GPP Standard through Release 7, including HSPA+ technology up to Category 14 with 21Mbps maximum downlink speed and 11Mbps maximum uplink speed. MobilePeak has more than 100 patents granted or pending worldwide, and its solutions have passed GCF tests and top-tier handset makers’ strict in-house tests. We are confident to roll out the first 40nm HSPA+ solution platform for feature phones and smart phones by 2012.’Mr. Zou will assume the role of Chief Technology Officer at Spreadtrum.

Mr. Zou founded MobilePeak in 2005 and has since served as MobilePeak’s Chairman. He served as MobilePeak’s Chief Technology Officer from 2005 to 2010 and assumed the position of President in 2010. Mr. Zou has more than 18 years of experience in the wireless communications industry. From 1993 to 2003, Mr. Zou held various positions with QUALCOMM, Inc., where he became a Vice President of Engineering in 2000. At QUALCOMM, Mr. Zou led various semiconductor design projects, including multiple generations of CDMA baseband chipsets. Mr. Zou received a BSEE from Southeast University in Nanjing, China in 1992, followed by an MSEE from Stanford University in 1993.

China market: 3G network investment totals CNY289 billion [June 14, 2011]

China Mobile, China United Telecommunications and China Telecom have cumulatively invested a total of CNY289 billion (US$43 billion) in setting up 3G networks consisting of 697,000 base stations around China, China-based http://www.xinhua.com has cited Ministry of Industry and Information Technology officials as indicating.

The three carriers had 67.57 million 3G subscribers in total as of the end of April 2011, the report indicated.

Goal for domestic 3G network set at 50m users [June 9, 2011]

The Chinese government has set a target of achieving more than 50 million third-generation (3G) mobile users by the end of 2011 for its homegrown telecommunication standard, but analysts predict the technology may not be the biggest winner in the 3G era.

Zhao Bo, deputy director of the electronics and information department with the Ministry of Industry and Information Technology, said on Wednesday that China should continue to push forward its TD-SCDMA (Time Division-Synchronous Code Division Multiple Access) 3G technology.

“The TD-SCDMA technology should realize its strategic target of acquiring at least one-third of China’s market, and grab 50 million users by the end of this year,” Zhao said.

He said he is confident that China Mobile Ltd, the world’s biggest telecom carrier by users, will achieve the goal within the schedule.

China Mobile is building the TD-SCDMA 3G network in China, while its domestic rivals, China Unicom Ltd and China Telecom Corp Ltd, adopted the WCDMA and CDMA2000 3G technologies.

Ye Lin, an official from the technology department of the Ministry of Industry and Information Technology, said since the three Chinese telecom operators obtained 3G licenses in early 2009, China has made major progress in 3G network development.

The three carriers have invested a total of 289 billion yuan ($44.6 billion) in 3G network construction in the past three years, Ye said. More than 697,000 3G base stations have been set up in the same period, he added.

The ministry recently announced that the number of 3G users in China reached 67.6 million by April.

China Mobile topped the list with 29.4 million, and China Unicom followed with 20.4 million. The smallest telecom carrier, China Telecom, had 17.8 million by April.

The great leap forward: How the world’s largest operator aims to jump one generation [Ericsson Business Review, June 10, 2011] interview with Bill Huang, GM of the China Mobile Research Institute (emphasis is mine)

China Mobile is pushing the time division (TD) flavor of LTE hard. Why is it necessary to have more than one kind of LTE, and what benefits does TD offer end users?

To understand, you must look back at what caused this technology evolution. There was an understanding that to go digital we must have a global standard. There were many candidates but they fell apart. GSM was a very good effort and succeeded in becoming the first real global standard. Then came 3G. In retrospect, 3G was a questionable development. It optimized voice capacity and quality but data traffic was kind of an afterthought. GSM did the job just fine. The best example is China Mobile. We deployed the world’s largest GSM network with the lowest tariffs, and never saw the need for a better voice service. 3G was a solution looking for a problem. And indeed, WCDMA did not take off until HSPA was developed. So from a historical perspective, HSPA was the only killer application for WCDMA, and internet access is the only reason HSPA took off.

Mobile internet is the only growth area for mobile communicationLTE carries the heritage of GSM and WCDMA with it … the selection of TD technology as a strong candidate in the evolution of LTE gives us an internet advantage. Historically, mobile communication has been symmetrical, dominated by voice. Internet traffic is not symmetrical. Downlink is typically 10 times faster than uplink, and addresses this. TD is unique in the way you can adjust the uplink and downlink ratio. And that’s why TD has become very useful – not only does it allow operators to use spectrum more efficiently, it also offers consumers a better user experience and lower costs.

How will China Mobile use 3G?

We will accelerate. For China Mobile 3G is an important licensing issue, and we are building a 3G infrastructure to create the momentum [with 3G HSPA level?] with which we move towards 4G.

Isn’t that a long way off in the future? Don’t you need to develop mobile broadband now?

Completely wrong! We are targeting commercialization next year, not in five years. In fact, operators in India and Japan plan to go commercial this year, but we are not that aggressive. So you see: 4G is not being pushed by the vendors, like 3G was. 4G is being pushed by the carriers. LTE is the only standard in the industry where, if you have a product, people will buy it right away. It’s  the reverse of how things used to be, and very interesting. LTE is being developed fast, but not fast enough.

Instead of looking at data volume, we can charge for downloading a movie, regardless of size, or a song or a book. We have all of that already in place. But frankly I don’t think consumers are used to content based billing, so we need to educate them – in many cases. … China Mobile’s strategy is that we will be a content and application aggregator, therefore becoming a smart pipe – not a dumb pipe that just provides access without aggregating anything. So we become the Walmart of information.

Instead of charging for content or traffic we can create a club. People are familiar with that concept. You pay one monthly charge and everything is free. It’s very effective; Netflix is a good example of a subscription based service that I think has a very good future as a business model. At China Mobile we can do anything with scale, but we can’t do everything in a niched or personalized way. So, if we provide a club we get to leverage that scale. We have 600 million subscribers. If only 10 percent sign up, that’s already 60 million members. If just 1 percent sign up, that’s 6 million members.

How do you handle the threat from the over-the-top (OTT) players, the internet companies?

It is a very real threat: OTT services can now replace almost any communications service imaginable. ott services are usually free, so this business model is based on backward billing. … What we hope to entice the user with is the quality of service – that’s our most important competitive advantage. … we must also look to reduce the cost of our services, potentially making them free as well. If we use other ways to generate revenue – like advertising or the club concept, and the user subscribes to a bandwidth bundle – we could provide the voice club service for a fixed fee, while guaranteeing the quality. Then I think we could kill off OTT very easily.

What do you expect from the cloud?

For mobile internet we have established a three-front strategy: LTE; the smartphone (operating Ophone, which is based on Android plus); and cloud computing. Only by combining all three can we create a really competitive and successful mobile-internet business.

We believe the cloud is an infrastructure technology that can address the cost of computing, reduce energy consumption and become a common platform for society, consumers and companies. Historically telecom operators have been reluctant to embrace it, but this was a mistake. In the US, I think carriers have already given up. They allow Google, Amazon and Microsoft to run cloud computing. But there are opportunities for China Mobile. If anything, we can do infrastructure on a large scale, data centers and so on. We do not have to develop all of the internet services in the world to compete with Google or Facebook. What we could do is build a cloud-computing infrastructure and invite all the internet companies to partner with us.

The most important phenomenon that will drive change in the mobile communications industry today is the evolution of smart phones. What used to be a communications device is now an all-purpose computing device. Today, fewer than 20 percent of our subscribers use smartphones. We think that in three to five years over 80 percentof our subscribers will use smartphones.

Have tablets changed this picture?

No, I see them as just bigger smartphones. In fact, Microsoft and others have tried for many years to introduce tablets and failed. But when Apple introduced the iPad, which is just a big iPhone, everybody loved it. So, this proves that a successful tablet is a big smartphone. The look and feel is very similar to that of a phone.

How do you work with the app store concept?

We embraced it completely and the way we differ from Apple is that we support all operating systems – including iOS if Apple wants us to. … We hope to create a platform that is independent of operating systems. … The reason China Mobile chose Android was that we need the flexibility to differentiate. We need to add components, APIs and functionality to Android. That’s why we call it Android plus.

I don’t know if video is going to be a major revenue stream, but I am sure it’s going to be a major application. I say that because making video calls on IMS [IP Multimedia System]will become an internet application, so it depends on how we charge for it. It opens up the potential for more creative billing strategies. We would be able to deliver a level of quality that would be very difficult for an ott player to achieve.

We studied what kind of apps users download and you’d be surprised how similar people’s tastes are. The top 1,000 apps have a 99-percent share of the market. That’s very good news for operators. We are not very good at long tail, but we are definitely good at short tail.

We want a mobile phone to be able to transmit TV to a large screen – so you can watch the program on your phone’s small screen or your computer screen, but also take it with you when you visit someone and watch it together on a large screen, in high definition. You won’t need the DVD. The mobile becomes the set-top box. So China Mobile doesn’t need a three-screen strategy – we only need a one-phone strategy. We are working on a wireless multimedia transmission technology called WiMo for this, and expect it to be available in two to three years.

Are you ready for mobile banking?

To be frank, we have not figured out which technology’s the right one to get the credit card or the payment mechanism into the phone. The most viable one for phones would be near-field communication (NFC). We have already established our architecture for mobile commerce and an account system with connections to all the banks, so from a service point of view we already have everything in place. What we need right now is for more phones to have the capability to carry the mobile payment and transaction engine – the right chip and components to support it, along with NFC.

Is banking a comfortable area for operators?

We don’t necessarily have to compete with the banks. We can rather just be the wallet and charge a monthly fee for the service. In other words, the banks can issue the cards and put them into our phones. We will make our platform open for all the banks. We don’t have to issue our own cards; all we have to do is to become the channel for the credit cards. And then we can make money. It is a great service – to sign up you don’t have to fill in a lot of forms; we have all the customer data that is needed.

How China institutional changes influence industry development? The case of TD-SCDMA industrialization [May 25, 2011]

… in view of that China state capitalizing on different SOEs and accompanying institutional changes, we further break framework into two time-periods:
– During stage 1 (2002- 2008) that China central government started to support Datang Group, aiming to commercialize TD-SCDMA technology into products. State also assigned Datang to lead TDIA [TD-SCDMA Industry Alliance designed to function as the platform of TD-SCDMA development, involving the activities of setting standard, sharing IPR, organizing supply chain, and coordinating among members] for TD-SCDMA industrialization.
– In stage 2 (2009-present), China state turned to mandate China Mobile to promote TD-SCDMA, not only responsible for networking building and service providing, but also for organizing of mobile handset supply chain (Wang and Tsai, 2010).

The R&D capacity of Datang Group as a whole is questionable, despite that Datang set home-grown TD-SCDMA standard (interview ES1). Since 1992, CATT had received national grant to undergo the earliest home-grown standard (SCDMA, 2G), but failed to commercialize due to weak R&D capacity in commercialize large-scale system development (Chen, 2005; Soh and Yu, 2010)11. Second, Datang XiAn, founded in 1993 and specializing for telecommunication equipment manufacturing for digital automatic switching (SPC) product, can not compete with local minying enterprise Huawei and mixed enterprise ZTE since late 90’s to early 2000’s (Fuller, 2005: 201; Harwit, 2007; Liu, 2008).

… the Datang Group is state-owned enterprise spin off from CATT, and they didn’t directly confront market and no pressure for survival(interview ES1and IS1). Although state continuously channeled national resources to compensate the loss (cf. Table 1 2004 negative profit) from developing TD-SCDMA and that Datang Mobile indeed deployed on R&D and accomplish some patents, Datang Group as a whole can not develop innovation capacity in designing parts and testing whole TD-SCDMA network system. One of the reason is that Datang Group lacked of associated knowledge and experience before (Soh and Yu, 2010).

The same situation occurs in TD-SCDMA mobile terminal products. The joint ventures IC design firms of Datang and MNCs, such as T3G or Commit, launched none of TD-SCDMA products to the market and ended up merged by ST-Ericsson or bankrupted. Likewise, Datang Mobile fruited no complete TD-SCMDA handset, so the state turned to university and public-sector research institutes to support the development of TD-SCDMA (Liu, 2008, 2009).

TDIA also confronted frustration in knowledge sharing and organizing of supply network. There’s no patent license-out or cross-license among member (Sumtttier et al., 2006; Whalley et al., 2009), except occasional license out from Datang to ZTE and Putian (Soh and Yu, 2010). Theoretically, Datang supposed to invite and global companies, such as Huawei and ZTE, into the supply chain of TD-SCDMA and leverage on their experience. But Datang, as the father of TD-SCDMA, tried to protect and guard their child (interview ES1). On the other hand, the R&D capacity of Huawei and ZTE outperformed Datang, so Huawei and ZTE won’t bother to join Datang on patent sharing and further on TD-SCDMA technology/product (interview RS4 and RS6).

State pick winner [and looser] SOE as national team

By contrast to Datang, the state evolves to pick China Mobile as the new national team by assessing past performance as selection criteria. First, China Mobile has near 500 million (end of 2008) users, making it as the largest telecom operator worldwide (BMI, 2010). So it’s a feasible path to migrate most China users from 2G (GSM) to home-grown standard (Interview, ES1). Second, China Mobile is most profitable and potential operator in China that China Mobile had the capacity and capital to promote TD-SCDMA (Interview ES1, SS2, ES1).

… the state threatens China Mobile: TD-SCDMA or none of 3G licenses. Coupled with impact on Mr. Wang’s political career, China Mobile has no choice but to promote TD-SCDMA (Interview ES1). On the other hand, the state also subsidizes RMB$10 billion (SinoCast, 2009) to compensate for potential loss estimated RMB $30 billion each year (Interview RS5).

In short, China state changes institutional means of supporting core SOE by both subsidies and threat, rather than carrot without stick. The state also changes to assess SOE’s past performance for prospects of TD-SCDMA. Despite the mandatory mission, China Mobile indeed starts to recruit R&D staff with high salary (Interview RS5) and experiments several innovations on TD-SCDMA network deployment, mobile phone launch, and service package to users (Interview IS1).

For the particular case of TD-SCDMA development, this paper contributes to discover that China state experiments and adapts institutions, along with the mentality adjusted from ‘standard matters’ to ‘R&D capacity rules’. More, the macro-level institutional learning also leads to meso-level institutional adaptation in the telecommunication industry. China Mobile acts as a mediator between state and network of firms, with the resources re-distribution and demand for collective action through the whole supply chain. Therefore, China Mobile not only managed to offer users with innovative service and networking build through in-house R&D, but also to organize the preliminary formation of TD-SCDMA production networks.

China Mobile, as a customer rather than rival of equipment manufacturers, had invested RMB$148 billion during 2008 to 2010 through four stages bids of infrastructure construction (BMI, 2010; IEK, 2010). Both local and global firms, such as SOEs Datang and Putian, minying Huawei and MNCs Nokia-Siemens, all compete for TD-SCDMA network building (Wang and Tsai, 2010). The final winners are Huawei and ZTE, for their cheaper but good product quality than MNCs’ and SOEs’ (Interview ES2). It indicates that China Mobile also selects their cooperating partners basing on market performance as the foremost criteria. This is different from the previously protectionism signal that Datang sent, since the SOE was targeted to dominate China market under the umbrella of MIIT, and which formulated the national industrial policy.

China Mobile also realizes that the biggest problem of TD-SCDMA industrialization is the shortage of TD-SCDMA handsets in the market. Under the pressure from mission and profit, China Mobile urges their current partners (e.g. Nokia and Motorola) to produce TD-SCDMA products through replicating the same incentives tools that state imposed upon China Mobile. That is, China Mobile, basing on their market significance, threatens their main suppliers (e.g. Nokia and Motorola): TD-SCDMA products or none of other business (Interview IS1). On the other hand, China Mobile first offered RMB$ 600 million to three chipsets designers and nine handset suppliers, to induce these leading firms to offer cheap products to penetrate China market. Thus, Nokia, HTC, Samsung and some local firms started to launch TD-SCDMA handsets. Most of all, China Mobile plays as a coordinator to integrate the supply chain, from upstream IC design firms to downstream  manufacturers (Interview IS1).

China Mobile awards 12 companies TD-SCDMA research grants [May 17, 2009] (p. 4, emphasis is mine)

China Mobile will provide funding of RMB 600 million ($87.77 million) to 12 mobile phone and chip manufacturers for the research and development (R & D) of terminal devices based on the homegrown TD-SCDMA standard, China Mobile announced on May 17.

According to the announcement, the 12 companies include nine mobile phone manufacturers, namely Motorola Inc., Samsung Corp., Yulong Computer Telecommunication Scientific Co. Ltd., Dopod Communication Corp., LG Electronics (China) Co. Ltd., ZTE Corp., Hisense Group, Guangzhou New Postcom Equipment Co. Ltd. and Huawei Technologies Co. Ltd. along with three chip makers, namely T3G Technology Co. Ltd., MediaTek Inc., and Spreadtrum Communications Co. Ltd.

As China Mobile stipulated that chip makers and mobile phone manufacturers pair up in the R & D project, T3G will work with Motorola, Samsung, Dopod and Huawei while MediaTek will work with Yulong, ZTE and LG. Spreadtrum will collaborate with Hisense and New Postcom.

Motorola, Samsung, Yulong, Dopod and LG, together with their chip maker partners [T3G and MediaTek], will receive combined funding of RMB 310 million ($45.35 million) from China Mobile for R & D of high-end TD-SCDMA mobile phones. The remaining mobile phone manufacturers [Huawei, ZTE, Hisense and New Postcom], together with their chip maker partners [T3G, MediaTek and Spreadtrum], will be responsible for R & D of low-end TD-SCDMA mobile phones and will receive combined funding worth RMB 290 million ($42.42 million) from China Mobile, the announcement said.

China Mobile Reveals TD-SCDMA Handset Subsidy Bidding Results [May 17, 2009] (emphasis is mine)

On May 17, China Mobile (NYSE: CHL; 0941.HK) held a signing ceremony for subsidies targeted at joint TD-SCDMA handset R&D, with nine handset manufacturers and three chip manufacturers signing a “cooperative R&D” agreement. China Mobile will invest RMB 600 mln in the subsidies, driving total investment of over RMB 1.2 bln in TD-SCDMA R&D, with the remaining contributions coming from participating vendors.

6 joint bids won subsidies for China Mobile’s “Flagship Broadband Internet Handset” project: Motorola and 3G chip manufacturer T3G; Samsung and T3G; mobile handset manufacturer Yulong and TD-SCDMA chipmaker Leadcore Technology; Smartphone manufacturer Dopod and T3G; LG Electronics and Leadcore; and ZTE and Leadcore. China Mobile will invest approximately RMB 310 mln in the project.

For the “Low Cost 3G Handset” project, the five successful bids were ZTE and Leadcore; LG and Leadcore; Hisense and wireless baseband chipset provider Spreadtrum Communications (Nasdaq: SPRD); Guangzhou New Postcom and Spreadtrum; and handset manufacturer Huawei and T3G. China Mobile will provide approximately RMB 290 mln of funding for this project.

7 months later these 11 handsets were shown [as per China Mobile’s Dec 17, 2009 press release in Chinese

China Mobile‘s 200 Models of TD Mobile Phone Listing This Year [March 18, 2011]

Recenly Li Yue, president of China Mobile, attended the Results Announcement said that China Mobile has an adequate supply in the 3G mobile phones. Currently, 50 companies are available to TD phones, and another 200 models will be able to supply soon.

At the end of last year, China Mobile has conducted 6 million low-end TD mobile phones tender. And in February this year, China Mobile has conducted 12.2 million high-end TD mobile phones procurement, of which, about 150 million units flagship Internet terminals, 30 million units dual card dual standby terminals, 320 million units multimedia intelligent terminals, 400 million units fashion and entertainment terminals and 320 million units universal intelligent terminals.

Xue Taohai, vice president of China Mobile, said the group will control the handset subsidies in 17.5 billion yuan. It is reported that China Mobile set a new goal for 25 million 3G users this year, and the current 3G network has covered 656 cities.

China Mobile Changes Strategy in Terminal Procurement [April 22, 2011]

Foreign mobile phone makers that has been disappointed in the bidding invitation of China Mobile Ltd. (SEHK: 0941 and NYSE: CHL) for centralized procurement of 6 million TD-SCDMA terminals last year, have turned things around in this year’s first round of centralized procurement kicked off by the leading telecommunications carrier.

Reporters find out that foreign mobile phone makers have won more than half of the share in recent centralized procurement, indicating that China Mobile has adjusted its philosophy in terms of the development of TD-SCDMA terminals, pointed out an insider who declines to reveal his name, saying that the company is not satisfied about current situation for the distribution of TD-SCDMA mobile phones.

A top executive of China Mobile opens out that the sales volume of TD-SCDMA terminals is small, indirectly confirming the report, saying that TD-SCDMA mobile phones have bad quality and high prices.

In the opinion of a researcher of iSuppli, China Mobile has changed its strategy to snatch market share and enlarge user base through low-end TD-SCDMA terminals and will improve the brand influence and boost the sales volume of TD-SCDMA mobile phones through the promotion of flagship terminals.

At the end of 2010, a domestic TD-SCDMA chipmaker has begun preparing for the next year’s centralized procurement of TD-SCDMA mobile phones by China Mobile, since the distribution of TD-SCDMA terminals completely relies on telecom carriers.

The top management of the chipmaker has been determined to win the centralized procurement. However, in February 2011, the announcement of China Mobile about the result disappointed them.

China Mobile has focused on medium- and high-end mobile phones in this year’s first round of centralized procurement while bid winners were all domestic TD-SCDMA terminal makers last year.

The changing philosophy of China Mobile is unfavorable to domestic mobile phone makers, which are mostly oriented to the manufacturing of medium- and low-end TD-SCDMA terminals.

Take the example of upstream chipmaker Leadcore Technology Co., Ltd., its shipment of TD-SCDMA chips topped 13 million in 2010. In last year’s centralized procurement, the company took over half of the share.

In contrast, US IC designer Marvell Technology Group Ltd. (Nasdaq: MRVL) that is oriented to the medium- and high-end TD-SCDMA smart phone market is likely to snatch more than half of the share in the latest centralized procurement.

Whatever strategy China Mobile adheres to, its aim will not change. That is to attract more customers for TD-SCDMA mobile phones. A top executive of Leadcore Technology believes that high-end TD-SCDMA terminals will help China Mobile improve its brand influence. But, to boost sales volume, the company still has to rely on medium- and low-end mobile phones.

(1 USD = CNY 6.51) Source: http://www.nf.nfdaily.cn (April 22, 2011)

Muted group procurement result of TD smartphone in May, indicating backend loaded demand with low SP mix in 2011 [May 24, 2011]

Leadcore, Huawei, and Borqs indicated that China Mobile (CM) procured only 1.2mn TD smartphone (SP) with a minimum order of 200,000 for each model, well below the market expectation of 12mn units with minimum guaranteed order of 800,000 per model. CM has selected six models (three Ophone, two Android, and one feature phone) from Huawei, ZTE, Samsung, Lenovo, Motorola, and Coolpad. They attributed the disappointing central procurement result of TD smartphone to relatively poor quality of phones. That said, Leadcore believes that MIIT has required CM to add 30mn TD-SCDMA subs in 2011 and TD terminal or chipset shipment is likely to be 53mn in 2011. Leadcore is hopeful that feature phone and SP could represent most of the TD phones with fixed wireless terminals at only 3-4mn in 2011. Leadcore expects CM to shift to open channels, which also receives a subsidy through contracts with provincial or local CM subsidiaries; and we predict the mix of open channel and central procurement to increase from 30% and 70% in 2011 to 70% and 30% in 2012, respectively. Similarly, Spreadtrum also expects TD chipset market to reach 45-50mn in central procurement (fixed wireless 35%, feature phone 50%, smartphone 10-15%), and 60mn-70mn units in total (including the open channel). Spreadtrum has seen strong recent demand from open channel. We note that open channel tends to sell more feature phones and fixed wireless phones.

Leadcore and Spreadtrum aim to gain TD market share in 2011

Leadcore believes that it has 50% of TD market share together with Mediatek. Marvell has relocated some of its R&D resources to China and is getting support from OEM. CM would like to give 60% of its SP orders to Marvell. However, in a recent stability test by CM, Leadcore scored at 95% pass rate, with T3G at 93% and MRVL at only 65%.

Rumor: China Mobile Establishes National Handset Procurement Arm [May 27, 2011]

An industry source said recently that China Mobile (NYSE: CHL; 0941.HK) has circulated a memo internally announcing the establishment of a terminals center, to be announced officially in August, that will operate as a national-level handset procurement subsidiary. The operator is currently making necessary internal adjustments in order to transfer staff to the new center.

The new terminals center will be operated like a division of China Mobile, overseen directly by China Mobile headquarters, and will focus on terminal procurement and sales. The center will be comprised of several departments, including products, procurement, marketing, channels, systems support, general services, and finance. While it is being referred to internally as the “mobile terminals center,” externally it will operate like a company.

Previously, the source said, China Mobile’s headquarters had been separate from provincial-level procurement operations, which it will now unify under the new terminals center. If a handset manufacturer is not on the center’s supplier list, it will be unable to promote its handset through provincial subsidiaries.

Earlier reports claimed that China Mobile had planned to transform handset distributor Topssion, which it acquired in March, into a terminal sales subsidiary.

Borqs Unveils Latest OPhone Handsets at 14th China Beijing International High-tech Expo [May 20, 2011] (emphasis is mine)

With the coming of the World Telecommunications Day, the 14th China Beijing International High-tech Expo (the Expo) opened at China International Exhibition Center from May 18th to 22nd, 2011. This Expo was co-organized by several state departments of China, including the Ministry of Science and Technology, Ministry of Commerce, Ministry of Education, and Ministry of Industry and Information Technology. Many innovative enterprises participated into the Expo with their innovation achievements. Borqs, one of the members of China’s National Special Key Projects, were also invited and exhibited the new serial of TD smartphones running on OPhone OS 2.0 or higher.

From “Made in China” to “Created in China”, and then to “China Standards”, enterprises based in Zhongguancun have always been committed to innovation and development since their establishment. As technology advancement and industry transfer are seen everywhere around the world, China Mobile developed and launched the first 3G standard in China, TD-SCDMA, a decade plus ago. As of today, China Mobile has maintained 61.9 million 3G mobile users as well as 26.99 million TD-SCDMA users. Recently, Mr. Jianzhou Wang, the Chairman of China Mobile, pointed out that TD system was no longer a test network but a commercial one covering 656 cities around China with the joint efforts of China Mobile and its industry partners from within and outside the country. Especially, the TD-SCDMA industry chain has emerged in recent years,, consisting of near 50 telecommunication enterprises, including many manufacturers and providers of network, terminals and chips, in and outside China.

OPhone OS is closely related to TD. Up to now, OPhone smartphones account for 50% of TD smartphones. At the Expo, a wide range of TD terminals are exhibited, including many new OPhone-based models. Following its receiving recognition from the state officials at the prior 11th Five-year Plan Major Science & Technology Achievements Exhibition, OPhone OS continued to be all the rage and attracted many visitors at the Expo.

TD-LTE Industry Briefing – May 2011 by China Mobile [May 27, 2011]

TD-LTE Large Scale Trial in China Update –All 6 Cities Have Launched Base Stations

  • All 6 cities have launched base stations. The number of launched Base Stations has reached 20% of the planned ones.
  • The planning of continuous coverage in hot spot areas has been completed in all 6 cities. The constructions are under way:
    – 78% supporting facilities modification accomplished
    – 69% equipments arrived
    – 35% equipments installed
      • Transmission tests have been completed in several cities
      • EPC and Security tests initiated in several cities in April 2011
      • RANtests are planned to start in the end of May 2011TD

GTI Official Website: http://www.lte-tdd.org

The GTI official website was launched during the 1st GTI Workshop [on 27-28 April 2011 in Guangzhou, China]. The website shares the latest information about TD-LTE related News, Events, Reports and Statistics. GTI operators have the rights to access the Working Space on GTI website for technical presentations and further deliverables of GTI.

China Mobile Almost Finishes Pilot TD-LTE Network Deployment [June 7, 2011]

China Mobile, one of the Big Three telecom operators in the country, has completed deployment of a pilot TD-LTE network in most of the cities selected for a planned test, disclosed people familiar with the matter today.

Most of the system equipment makers have completed the first TD-LTE call in cooperation with the branches of China Mobile, according to one of the people, noting that additional telecom equipment makers are expected to make a presence in the program for an expansion of the test.

The TD-LTE network test, kicked off on March 24 with the releasing of document from the Ministry of Industry and Information Technology (MIIT), has been going on smoothly reflected by a group of telecom equipment makers’ success in TD-LTE call.

Huawei Technologies Co., Ltd., one of the top-ranking telecom equipment makers in the country, helped launch the first TD-LTE wireless connection in Shenzhen on April 6, facilitating the rollout of high-speed download service and high-definition video service based on the TD-LTE data card.

TD LTE to revolutionize wireless broadband [May 31, 2011] (emphasis is mine)

During the second international LTE conference held in New Delhi, the industry said that it has become imperative to deploy LTE technology to set standards. With numerous benefits of TD LTE, the industry is graping with deployment challenges while early availability of devices has become another area of concern. Bharti Airtel is conducting trial in Chandigarh. The deployment of TD LTE at right time as well as availability of devices will be a challenge, and it is coming out with a lot of hope.

Speaking at the event, J Gopal, Advisor (Technology), DoT said that they are looking forward for this technology to bridge digital divide and facilitate economic growth. With various consumer-centric advantages, TD LTE is becoming an important tool for every operator today while some of them have already begun trials.

“Eventually we see migration from WiMax to TD LTE and significantly there is a global initiative to promote it. India and China are the leading contenders of this technology, which is mature now,” said Sujit Bakre, head, 4G business development and product management (APAC), Nokia Siemens Networks. Large investments have already been done on 2G/3G and now we should leverage voice onto TD LTE, he added. Bakre reiterated that they bagged two commercial deals in Middle-East and Latin America but however couldn’t name the operators.

Puneet Garg, VP, Networks, Bharti Airtel said that TD LTE is a next step towards broadband wireless and is the fastest BWA technology and has become a realty now. “It will make high speed wireless broadband affordable to urban and rural consumers. This technology facilitate low TCO”, he added.

Rajan S Mathews, director general, Cellular Operators Association of India said that broadband is the single big imperative for the country. “As we are poised to be the largest economy by 2050, therefore we couldn’t afford to miss the broadband bus,” he said. Mathews said that the government is aggressively implementing the national policy on broadband and TD LTE is a great opportunity for the country to get into building standards.

20 Operators Have Joined GTI [May 19, 2011]

Following the 1st GTI Workshop, GTI has gained strong momentum. Till May 19th, 20 operators from Europe, Asia, America and Oceania have formally joined GTI.

These 20 GTI operators are:

Aero2, Belltell, Bharti Airtel, China Mobile, Clearwire, Datame, E-Plus, FarEastone, First International Telecom Corp,KT, Omantel, Nextwave, Packet One, Smoltelecom, SoftBank, Tatung Infocomm, Vividwireless, Vodafone, Voentelecom, Woosh.

GTI was formed to promote the TD-LTE ecosystem as a major standard in mobile broadband technology and drive the early development TD-LTE networks. Seven operators including Aero2, Bharti Airtel, China Mobile, Clearwire, E-Plus, Softbank Mobile and Vodafone jointly kicked off GTI activities in February during Mobile World Congress in Barcelona.

GTI objectives are:

1) Energizing the creation of a world-class and a growth-focused business environment;

2) Delivering great customer experience and bringing operational efficiencies;

3) Promoting convergence of TD-LTE and LTE FDD in order to maximize the economy of scale;

4) Facilitating multilateral cooperation between and/or among operators.

GTI has started preparing the 2nd Workshop and initiated the discussions on the technical areas which will be investigated among GTI operators.

Vividwireless joins global TD-LTE promotion initiative [May 19, 2011]

vividwireless a Seven Group Holdings Limited [media-related] company, owns and operates Australia’s first 4G wireless broadband network. vividwireless launched in Perth in March, 2010. The network has since been expanded to cover select parts of metropolitan Sydney and Melbourne, Adelaide, Canberra and Brisbane.

Vividwireless – which presently operates mobile WiMAX networks in capital cities – has joined the Global TD-LTE Initiative (time division long term evolution) launched at Mobile World Congress in Barcelona in February.
GTI, which held its first working meeting in Guangzhou earlier this month, was formed to promote the TD-LTE ecosystem as a major standard in mobile broadband technology and drive the early development TD-LTE networks. Its founding members were ChinaMobile, Bharti Airtel, Softbank Mobile, Vodafone, Clearwire, E-Plus, and Aero2. Vividwireless says it was invited to join at the launch.

Commenting on the launch of GTI at the time, Julien Grivolas, principal analyst at Ovum said: “A certain scale for LTE TDD was guaranteed by strong support from China Mobile, the largest operator in the world. However, as TD-SCDMA [China’s 3G mobile standard] proved to its cost, this is not necessarily enough to make LTE TDD technology a global success. China Mobile consequently considered it strategically vital to garner support from other key players.”

He added: “This LTE TDD evangelism started years ago, often behind the scenes, and finally came to fruition with the creation of the GTI. As a consequence, the main merit of the GTI announcement really lies in the official support for LTE TDD (and better harmonisation with LTE FDD) from a number of international players.

“With heavyweights such as China Mobile, Bharti Airtel, Softbank Mobile, and Vodafone Group – serving more than 1.1 billion subscribers in total at the end of 2010 – the GTI is certainly heading in the right direction. However, to further contribute to the virtuous cycle that the GTI aims to fuel, the organisation remains fully open to all operators and technology vendors interested in promoting LTE TDD.”

Vividwireless said that the GTI would “organise a series of activities to bring TD-LTE operators and vendors together to share development strategies and technology know-how, expediting the development of terminals and fostering global roaming and low-cost terminals.”

Vividwireless trialled LTE in Sydney earlier this year and says “The trials…demonstrated that TD-LTE can deliver wireless broadband that is faster than ADSL2+, with peak speeds as high as 128Mbps and consistent ‘real world’ speeds between 40 – 70Mbps.”

Following the trial the company said it was sufficiently impressed to consider using TD-LTE rather than WiMAX for its planned major east coast network rollouts. CEO Martin Mercer said “The technology is far more mature than we had expected. The Huawei SingleRAN solution [used in WiMAX mode in Vividwireless’ networks today] is basically ready to go today and is at a price point that would enable us to take service to market at prices comparable to what we offer today.

“We could deploy this technology in our east coast rollout and provide customers with services superior to those we provide today and equivalent prices. The question for us now based on the results of the trial is: do we rollout TD-LTE on the east coast…and do we deploy it in other markets as well?

vividwireless First To Trial 100Mbps Broadband TD-LTE In Australia [Nov 10, 2010] (emphasis is mine)

Leading 4G wireless broadband provider, vividwireless, today announced the first
Australian trial of superfast mobile wireless broadband – TD-LTE – (Time-Division
Duplex Long Term Evolution) which can deliver peak speeds of more than 100Mbps.
vividwireless CEO Martin Mercer said the trial with technology partner Huawei Australia
was part of the company’s continuing technology roadmap assessment.

“vividwireless is trialing the advanced TD-LTE technology to evaluate and determine the
very best mobile voice and broadband service to meet our customers’ future needs.
vividwireless is determined to ensure that it retains its ranking as Perth’s fastest wireless
broadband provider,” he said.

Huawei’s global experience with the technology has found TD-LTE can deliver wireless
broadband that is much faster than ADSL2+, with peak speeds of more than 100Mbps.
The trial will cover the market readiness of TD-LTE, including the technology’s capacity,
coverage and ‘real world’ performance.

“Demand for high speed wireless connectivity is increasing rapidly. Customers want fast,
reliable HD video streaming, gaming, communications, transactions and other
entertainment to be available wherever they are,” said Mr Mercer.

“Our current network satisfies this demand and this trial will help us to ensure that we
continue to be Australia’s leading wireless broadband provider,” he added.

The trial will commence in December 2010 in inner-city Sydney around Redfern, as well
as Western Sydney around Horsley Park. These locations will allow vividwireless to test
the performance of the technology in high demand, high density, inner city conditions
such as apartments and cafes, as well as suburban conditions.

Huawei Australia Chief Technology Officer Peter Rossi said, “Having worked with
vividwireless in rolling out its Perth network and the initial footprints in Sydney,
Melbourne, Adelaide, Canberra and Brisbane, we are delighted to be working on this
TD-LTE trial.

“Huawei’s SingleRAN solution allows vividwireless to make a smooth transition from
WiMAX to TD-LTE to suit its network requirements, and with Huawei holding the title of
the world’s number-one LTE essential patent holder
, vividwireless will always have a
cutting-edge mobile network,” he concluded.

Ovum encourages operators in developed countries to be pragmatic [May 6, 2011] (emphasis is mine)

Ovum has highlighted the potential of LTE TDD on many occasions, but has also pointed out the various challenges it faces. In particular we have highlighted that the current status of the device ecosystem may negatively impact the pace of rollout. Devices are always a crucial success factor for any kind of technology, but for LTE TDD they are even more important. This is largely due to the fact that most of the operators that have announced aggressive LTE TDD plans are based in emerging markets (China, India, and Russia).This means that low-cost devices will have to be made available quickly to serve these markets. In that sense, the creation of the Global TD-LTE Initiative at Mobile World Congress 2011 is a step in the right direction.

Launch of the GTI accelerates ecosystem development

In February 2011, China Mobile, Bharti Airtel, Softbank Mobile, Vodafone, Clearwire, E-Plus, and Aero2 officially launched the Global TD-LTE Initiative (GTI). The organization will focus on promoting the fast development of LTE TDD technology, promoting the convergence of LTE TDD and FDD modes to maximize economies of scale, and sharing the ecosystem with other TDD technologies, such as the Japanese eXtended Global Platform (XGP) technology.

In the mobile telecoms industry, scale is vital – something that WiMAX can testify to. A certain scale for LTE TDD was guaranteed by strong support from China Mobile, the largest operator in the world. However, as TD-SCDMA proved to its cost, this is not necessarily enough to make LTE TDD technology a global success. China Mobile consequently considered it strategically vital to garner support from other key players (as stated in our report TD-LTE, China Mobile’s long-term engagement with ‘TD’, OVUM051850). Attracting vendors’ interest was the easy part given China Mobile’s size, but making sure that other operators would consider the LTE TDD option required more imagination. This LTE TDD evangelism started years ago, often behind the scenes, and finally came to fruition with the creation of the GTI. As a consequence, the main merit of the GTI announcement really lies in the official support for LTE TDD (and better harmonization with LTE FDD) from a number of international players. With heavyweights such as China Mobile, Bharti Airtel, Softbank Mobile, and Vodafone Group – serving more than 1.1 billion subscribers in total at the end of 2010 – the GTI is certainly heading in the right direction. However, to further contribute to the virtuous cycle that the GTI aims to fuel, the organization remains fully open to all operators and technology vendors interested in promoting LTE TDD.

China Mobile will not be the first to launch commercial LTE TDD services

The GTI launch event in Barcelona confirmed what we expected (see the report Global opportunities for LTE TDD, OT00063-016): with a launch expected in 2012, China Mobile will not be the first operator in the world with commercial LTE TDD services. However, it is true that the operator’s large-scale trial networks to be deployed in seven cities in 2011 will be much bigger than the majority of LTE (TDD and FDD) commercial networks available at that time.

Among the LTE TDD frontrunners, the GTI event confirmed Aero2 from Poland as a candidate to become the first with commercial services, in as early as May 2011. The operator will use equipment from Huawei to construct a converged LTE FDD/TDD network. Softbank Mobile also unveiled plans to commercially launch LTE TDD services in Japan before the end of 2011. Like Aero2, the Japanese operator will use the 2.5GHz spectrum band. Softbank Mobile recognizes that the timeline set for its LTE TDD project is aggressive, but claimed that it has full confidence in vendors to overcome the various challenges. In Softbank’s opinion, LTE TDD is better suited to handle mobile data services. This is because the technology’s asymmetric nature fits well with mobile broadband data usage patterns and because of the greater technical efficiency of LTE TDD versus LTE FDD in terms of smart antenna systems. Finally, the official support of LTE TDD by Bharti Airtel means that there are now three 2.3GHz broadband wireless access spectrum owners committed to rolling out the technology in India. Speaking at the event, the CEO of Bharti Airtel, Sanjay Kapoor, stated that support from operators in India and China will ensure scale for LTE TDD and definitely signals the end of WiMAX’s hopes.

Ovum encourages operators in developed countries to be pragmatic

So far, operators have continued to favor the FDD variant of LTE, especially in developed markets. However, we recommend that these operators, which sometimes own unused TDD spectrum, closely monitor the development of the LTE TDD market. The reason is simple: given the rise of data traffic, all spectrum is valuable. They should continue to adopt a very pragmatic approach to LTE TDD. This consists of ensuring LTE FDD/TDD integration into network equipment now and into devices once the LTE TDD device ecosystem is sufficiently mature. If LTE TDD becomes widely adopted, by 2014-15 LTE FDD operators may well be tempted to leverage LTE TDD cost benefits to add extra capacity to their networks.

The E-Plus Group, China Mobile and ZTE sign a MOU for TD-LTE field trial in Germany [Feb 14, 2011]

The E-Plus Group, China Mobile Communications Corp. and ZTE will work together to launch a TD-LTE field trial in Germany in Q1 2011. The trial is based on 2.6 GHz spectrum that E-Plus acquired in the German spectrum auction. China Mobile, with its leading position and rich experience in the operation and maintenance of TDD networks, will empower this trial. ZTE will provide base stations developed on the advanced SDR platform and co-siting solution of LTE FDD/TD-LTE, which is a breakthrough in the industry.

The E-Plus Group is the third largest mobile network operator in Germany. The E-Plus Group has been one of the most innovative mobile operators during years. After revolutionizing the mobile voice market for larger user groups E-Plus is now opening the mobile data market for the masses with low-priced data tariff schemes and the roll-out of a HSPA+ network with speeds up to 21.6 Mbps. On top of the high speed mobile data network roll out, E-Plus will now test TD-LTE in the field. The E-Plus Group is one of the founding members of the Next Generation Mobile Networks (NGMN) Alliance.

The E-Plus Group and ZTE agreed and scheduled a field trial program for 2011 consisting of several streams to investigate the capabilities of ZTE’s commercial SDR equipment and best utilisation of the spectrum holdings of E-Plus in 1.8 GHz, 2.1 GHz and 2.6 GHz, both TD-LTE and LTE FDD.

China Mobile claims the largest number of mobile subscribers in the world. From TD-SCDMA to TD-LTE, China Mobile is devoted to promoting TDD industry being equipped with rich experience in TDD network deployment. Furthermore, China Mobile is pro-active in TDD technology globalization and convergence of TD-LTE and LTE FDD industry by seeking cooperation with overseas operators in Europe, Asia, America and Australia.

With joint effort of the E-Plus Group, China Mobile and ZTE, this trial will not only demonstrate the latest progress of TD-LTE/LTE FDD convergence in standards and industry development, but also lay an excellent ground for the full commercialization of TD-LTE.

About the E-Plus Group
The E-Plus Group is the challenger on the German mobile communications market. Simple services tailored to customer needs and a major reduction in call and data charges can be traced back to the initiative of the third-largest mobile network operator in Germany. After revolutionizing the voice market for larger user groups now the company opens the mobile data market for the masses by its massive network roll-out and highly attractive low-priced data tariff schemes. As a result of innovative business models, modern structures and strong partnerships the E-Plus Group was able to significantly strengthen its market position and show a more dynamic and profitable development than the market. Since 2005 E-Plus Mobilfunk GmbH und Co. KG has developed into a family of brands offering target group-specific services and thus breaks new ground in mobile communications in Germany. More than 20 million customers are using the network of the E-Plus Group to make calls and send text messages or data. The Group generates an annual revenue of €3.2 billion (2010) and employs more than 2,500 people (FTE) in Germany.

326 Million Dual-Mode 4G Devices to be Activated by 2016 [May 31, 2011]

326 Million Dual-Mode (3G + LTE) Devices will be Activated by 2016 according to Maravedis’ latest research titled “Global 4G Device Forecast 2011-2016”.

“All LTE devices activated during 2010, including USB data cards, modems and notebooks, were single-mode,” said Cintia Garza, author of the report. “However, LTE+3G smartphones have emerged during 2011 as more LTE operators begin to add LTE to their device offering, in particular smart phones whose adoption will be key to LTE uptake.”

In the United States, Sprint’s early success with WiMAX smart phones suggests a very promising uptake for LTE smart phones. Many other carriers around the world are also looking at introducing smart phones in their LTE device portfolio by the end of 2011, such as NTT DoCoMo (Japan), and Yota (Russia).

“By 2013, more than 50% of LTE devices activated worldwide will support both FDD and TDD duplex modes, once TD-LTE deployments consolidate in China, India, Malaysia, Korea and other APAC countries,” continued Garza. “On the other hand, 75% of the LTE devices will support legacy systems (2G/3G) and 9% will support WiMAX technology; these devices will mainly include smart phones, tablets and USB dongles”.
Tablets are also one of the most promising devices in the 4G device market. Maravedis’ report predicts tablet shipments will grow from 46 million in 2011 to nearly 150 million by 2016. Apple iOS is expected to remain the most popular tablet for the coming years, reaching 46% market share by 2016.

Additional Research Findings: 

  1. 260 million dual-mode (TD LTE + FDD LTE) devices will be activated by 2016
  2. Android will account for 48.5% of the smart phone market, Windows 21% and iPhone (iOS) 16.5% by 2016.
  3. APAC and Europe will account for the largest number of smart phones and tablets activated by 2016.
  4. By 2016, 95% of the tablet installed base will be 3G/4G enabled.

Source:Maravedis

LTE Subscriptions to Experience Growth of over 3,400% Between 2011 and 2015 [June 9, 2011]

Between mobile applications, data, voice, and streaming and broadcast video, global wireless bandwidth usage has increased ten-fold since 2008, and there are no signs of it stopping. This obsession to connect anywhere, any time, on any device, viewing any type of digital content is about to have a very real and sudden impact on the wireless world. In-Stat (www.in-stat.com) forecasts that LTE subscriptions will experience a 3,400% explosion of growth between 2011 and 2015.

“Although there are regional variations in the adoption of cellular services, due in part to current available technology, LTE will clearly be the 4G service of choice moving forward,” says Chris Kissel, Analyst.  “3G will remain the predominant service subscription, also with robust growth, but over the next 5 years things will trend toward LTE as 4G service availability is ramped up.”

Recent research by In-Stat found the following:

  • North American FDD-LTE subscriptions are set to increase roughly 2100% from 2011 to 2015. In 2015, the ratio of North American FDD-LTE subscribers to TDD-LTE subscribers will be almost 14 to 1.
  • 3G subscriptions remain dominant with WCDMA technology capturing 26% of 3G subscriptions.  CDMA Rev B will be the smallest segment of the 3G technologies based on subscriptions.
  • 2G service subscriptions will peak in 2012, then they will begin a slow decline during the remainder of the forecast period.
  • More than half of all new deployments are LTE.

Mobile broadband subscribers overtake fixed broadband [June 7, 2011] (“in the text” emphasis is mine)

Market research firm Infonetics Research today released excerpts from its latest Fixed and Mobile Subscribers market forecast report

ANALYST NOTE

“As we predicted, mobile broadband subscribers surpassed wireline broadband subscribers in 2010 (558 million vs. 500 million). Fixed-line services are not dead, though, especially with China giving a boost to the worldwide wireline broadband base with its massive fiber-based program led by the Chinese government, which has set a 20Mbps benchmark for all broadband subscribers, where most today receive 2Mbps to 3Mbps at best,” notes Stéphane Téral, Infonetics Research’s principal analyst for mobile infrastructure.

FIXED AND MOBILE SUBSCRIBERS MARKET HIGHLIGHTS

  • Infonetics forecasts the number of mobile phone subscribers to grow to 6.4 billion in 2015 (the current global population is 6.9 billion)
  • In 2010, Asia Pacific accounted for nearly half of all mobile subscribers
  • The number of cellular mobile broadband subscribers jumped almost 60% in 2010 to 558 million worldwide and should top 2 billion by 2015
  • Access lines (residential, business, and wholesale PSTN, POTS, and ISDN connections) are forecast to continue declining, falling to 759 million worldwide by 2015
  • As access lines disappear, new forms of wireline broadband continue to thrive; the number of wireline broadband subscribers (DSL, cable, PON, Ethernet FTTH, FTTB+LAN) hit 500 million worldwide in 2010
  • WiMAX, in high demand in many regions with inadequate wired infrastructure, remains modest in scale but not growth: despite the global recession, the number of WiMAX subscribers grew 75% in 2010, with more strong growth ahead, reaching 126 million in 2015
  • The number of VoIP subscribers (including VoIP over access lines and over other broadband lines, such as cable) is forecast to grow from 157 million in 2010 to 264 million in 2015
  • While growth in the number of video subscribers is being challenged by over-the-top (OTT) and free-to-air services, telco IPTV subscribers are forecast to triple between 2010 and 2015, and digital and satellite cable subscribers will see healthy annual growth as analog cable video subscribers continue their inevitable decline

REPORT SYNOPSIS

Infonetics’ report provides worldwide and regional market size and forecasts through 2015 for access lines and fixed and mobile subscribers, including cable broadband, DSL, PON and Ethernet FTTH, residential and SOHO VoIP, telco IPTV, cable video, satellite video, mobile (GSM, W-CDMA, TD-SCDMA, cdmaOne, CDMA2000), cellular mobile broadband (W-CDMA/HSPA, CDMA2000/EV-DO, LTE, WiMAX, phone-based, PC-based), WiMAX (802.16m, 802.16e, 802.16d), and IMS subscribers. See report prospectus for details.

The report includes customizable pivot charts and analysis comparing subscriber types, regional service provider subscriber highlights, fundamental drivers of the market, technology developments, excerpts from Infonetics’ service provider capex reports, and analysis of overall market conditions for service providers, enterprises, subscribers, and the global economy.

Acer repositioning for the post Wintel era starting with AMD Fusion APUs

Follow-Up (Aug 2, 2011):
Acer & Asus: Compensating lower PC sales by tablet PC push [March 29, 2011 with comprehensive update on Aug 2, 2011] which is showing serious technical and market problems with the original version of Honeycomb (particularly for Acer!) which are only now overcome

Acer reducing 2011 tablet PC shipment target by 50% [June 16, 2011]

Acer, on June 15, announced that the company has reduced its annual tablet PC shipment forecast from originally 5-7 million units to only 2.5-3 million units, a drop close to 50% and with brand vendors such as Motorola, RIM and Samsung Electronics all reportedly having reduced their tablet PC sales targets for 2011, concerns about whether Android-based tablet PCs will be able to compete against Apple’s iPad are starting to rise among market watchers.

At the company’s investors meeting on June 15, Acer chairman JT Wang pointed out that the company is currently in the middle of a great transition and the company’s current goal is to lower its retail channel inventory. The company expects to continue working on digesting its inventory throughout the third quarter with expectations to have an inventory level the same as 7-8 years ago. Although Acer will reduce its annual tablet PC shipments, Wang is still confident about the performance of Android-based tablet PCs.

Wang pointed out that all the things that the closed system can do will all be able to function in the open system, but if consumers use the former, they will need to follow everything the closed system designers says and have no choice for expansion, or run Flash, and will not be able to be their own master. Acer is trying to serve consumers who want to make their own decisions.

Wang noted that after taking a series of emergency measures, Acer is currently in a safer state than before and should reach its shipment goal for the second quarter of a sequential drop of 10%. For the future, Wang expects Acer’s third-quarter shipments to share a similar volume as in the second with a chance to be better. Its performance will bounce out of the button after the third quarter.

In addition to reducing inventory, the company is also working on reorganizing its employee management and is set to lay off about 300 employees in Europe, Africa and the Middle-East, while the US, Greater China and Asia Pacific markets will see no changes.

Acer president Jim Wong pointed out that the company already shipped 800,000 tablet PCs before the end of June and with the launch of its new 7-inch tablet PC, Acer’s tablet PC shipments in the third quarter will reach 800,000 units. Wong added that the estimated numbers are all retail channel sales and include no additional ‘push’.

Acer may fall out of the worldwide top-3 notebook ranking in 2Q11 [June 16, 2011]

As Acer is still working on resolving its notebook inventory issues and expects to suffer a sequential shipment drop of 10% in the second quarter, Lenovo, the fourth-largest global PC vendor, which is expected to see shipment growth in the quarter may surpass Acer and become the third-largest PC vendor worldwide.

In the first quarter of 2011, Acer shipped 9.01 million PCs and ranked the third-largest PC vendor worldwide with Lenovo behind with shipments of 8.18 million units, a gap of about 800,000 unit, according to data from IDC. If Acer sees shipments drop, while Lenovo enjoys an increase, the two firms may see their ranking switch in the third quarter.

In addition to strong PC demand in the China market, Lenovo’s acquisition of NEC’s PC business has successfully helped Lenovo to become the largest vendor in Japan, while its purchase of Germany-based brand Medion also significantly raised its visibility in Western Europe.

However, Acer president Jim Wong, at its investor conference on June 15, pointed out that Acer lost about 3% share in the EMEA market while clearing its inventory, but the situation already turned stable in May and Acer is expected to maintain its advantage in the market.

Acer decreases netbook shipments to focus on tablet PCs, say Taiwan makers [June 15, 2011]

Acer shipped 400,000-500,000 netbooks in May, 50% fewer than in April, and will maintain such decreased shipments in June and July, implying that Acer will not give up netbooks but will shift R&D and operational resources from the product line to tablet PCs, according to Taiwan-based makers in its supply chain.

With Acer’s tablet PC orders quickly rising to 200,000-300,000 units per month in May, the sources are optimistic about Acer’s strategy to turn its focus to the tablet PC as the profitability generated by netbooks is much lower than that of tablet PCs, and Acer’s upstream partners should all benefit from the higher gross margins of tablet PC products.

In addition to Acer, players such as Asustek Computer, Hewlett-Packard (HP) and Lenovo have all switched their focus to tablet PCs, although the players are still launching new netbook products, related marketing resources invested are rather low compared to before, as netbooks can be easily substituted by tablet PCs.

Although Acer is turning its focus to the tablet PC market, the company still launched its second-generation Aspire One Happy this month in the US and Europe.

Acer notebook shipments in retail channel expected to surpass 3 million in June [June 14, 2011]

Acer’s notebook shipments in the retail channel are expected to surpass three million units in June and if the company’s upstream partners such as Compal Electronics, Wistron and Quanta Computer all see increased shipments in the month, it will indicate that Acer has achieved a great advance in digesting its inventory and should return to its normal operation in near future, according to sources from the upstream supply chain.

Acer only shipped about 1.6-1.8 million notebooks to the retail channel in April and the volume increased close to 60% on month in May; however, notebook shipments of Acer’s upstream partners did not enjoy the same amount of growth in May, especially Compal, which only shipped 3.6-3.7 million notebooks including tablet PCs in both April and May. Compal even saw s shipment drop on month in May, indicating that Acer was still working of digesting its inventory.

The sources pointed out that Acer still has a high inventory level in Europe retail channel, but since the company has already seen improvements in both Southeast Asia and China, the company is now working aggressively to clear up its remaining inventory through its global logistic system with estimates of seeing shipments of 7.2-7.4 million notebooks in the second quarter.

Acer’s non-consolidated revenues in May grew 25.9% on month indicating that the company is seeing slow recovery in its operation, but since the company still has not yet provided its guidance for the third quarter, the sources expect Acer to have chance to release the related information at its investor conference on June 15.

Acer shareholders approve cash dividend and elect new board of directors [June 15, 2011]

Acer’s shareholders have approved the 2011 cash dividend of NT$3.60 (US$0.12) per share, and the reduction of employee bonuses for 2010 by 40%. Shareholders also elected a new board of directors and supervisors.

Acer announced in early June plans to lower channel inventory in Europe, Middle East and Africa (EMEA) by providing US$150 million in sales allowances and a one-time write off. The board and supervisors also voluntarily cut their remuneration by 50%. Today, the shareholders further approved plans to reduce employee bonuses by 40%, from NT$1.5 billion to NT$900 million. The cash dividend of NT$3.60 per share remains unchanged.

Shareholders elected a new board of directors and supervisors for the next three-year term. The newly elected seven-member board consists of JT Wang, Stan Shih, Hung Rouan Investment, Philip Peng, representing Smart Capital, Hsin-I Lin (former chairman of Industrial Technology Research Institute), Dr FC Tseng, and Sir Julian Horn-Smith. The supervisors are Carolyn Yeh and George Huang.

New to the board are the independent directors FC Tseng and Julian Horn-Smith. Acer expects to benefit from the knowledge and experience of Tseng and Horn-Smith, who are both globally distinguished talents. Their contribution from an independent standpoint to the company strategy, along with the board, will create a strong and well-rounded team to lead the corporation forward and enhance corporate governance, the company said.

Tsengco-founded Taiwan Semiconductor Manufacturing Company (TSMC) as a pioneer specializing in the foundry-only semiconductor manufacturing business. A core member of the TSMC management, he is also considered a veteran in the semiconductor industry. Horn-Smith was a founding member of Vodafone Group and is regarded as the principal architect in developing Vodafone’s international strategy. He retired from the Vodafone board in July 2006, where he held the title of deputy CEO.

What is an APU? [Jan 8, 2011]

With Fusion technology from AMD, the PC industry will be changed forever. AMD is incorporating multi-core CPU (x86) technology, a powerful DirectX®11-capable discrete-level graphics and parallel processing engine onto a single die to create the first Accelerated Processing Unit (APU). Learn how AMD is doing that here.

Computex 2011: AMD announces solution for tablet PC [June 2, 2011] (emphasis is mine)

AMD, at its press conference at Computex 2011, announced a new 40nm Z series APU codenamed Desna to target the tablet PC market, according to Rick Bergman, Senior Vice President and General Manager Products Group, AMD.

In 2012, the company will advance its Z series APU to a new structure with a codename Hondo. The Hondo-based Z series APU will have an even lower power consumption to allow it to become more suitable for tablet PC products.

Bergman pointed out that AMD’s tablet PCs will be deeply integrated with operating systems such as Windows to support HTML 5, Adobe Flash 10.2 and external screens, and will add enterprise-level security functions to make them suitable also for the enterprise market.

Bergman, at the conference, also displayed AMDs 28nm Trinity APU, which is set for mass production in 2012.

AMD also announced its 9-series chipset, a part of AMD’s new desktop Scorpius platform. In addition to the chipset, the Scorpius platform is formed with an eight-core Zambezi processor and Radeon HD 6000 series discrete graphics card.

The 9-series chipset supports AMD’s AM3+ CPU and is backward compatible with AM3-based CPUs. With native support for AMD’s CrossFireX, the chipset can support up to four Radeon graphics cards and through AMD’s OverDrive software, the chipset can also manage the clock speed of each card.

A New Visual Computing Experience for Tablets | Fusion – AMD Blogs [May 31, 2011]

While I’m not planning to edit or create any PowerPoint decks on a tablet anytime soon, I personally see value in a tablet that gives me both the ability to consume and create content. For example, one of the applications I use every day in my work and home life is the OneNote application in Microsoft Office. Being able to access it across multiple devices via Windows Live has been invaluable for me of late. When I tried to access this on a non-Windows device, you can see what the result was in this picture below:

This is why I’m looking forward to getting my hands on one of the new tablets based on the new Z series AMD Fusion APU, code-named “Desna”. At Computex earlier today, we announced these new AMD Fusion APUs as part of our 2011 AMD HD Tablet Platform targeted at the fast-growing number of Windows-based tablet designs coming to market. And since a press release can only tell part of the story, here’s what you can expect from tablets powered by the new 2011 AMD HD Tablet Platform:

  • AMD Z-01 APU with AMD Radeon™ HD 6250 discrete-class graphics. This APU features two 1 GHz “Bobcat” CPU cores and checks in at TDP of 5.9 watts.
  • Full intelligence and operability of the Windows® 7 OS
  • Consistency in user interface and applications from work to home
  • Full access to view and edit work and personal documents created in Microsoft Office and other leading applications
  • Free and automatic online Windows 7 OS updates to enable the most current features
  • Full compatibility with iPhone, Windows Phone, Blackberry and other leading mobile phones
  • Seamless connectivity with virtually any USB device
  • HDMI support to enable a full 1080p visual experience
  • Full compatibility with XBOX 360 Media Extender Functionality

The AMD Z-Series Fusion APUs are shipping today. MSI’s WinPad 110W is the first tablet announced by an OEM that leverages the new platform, giving consumers high-end performance graphics in a tablet that takes advantage of the Windows ecosystem –  the largest installed base of any client platform … by a wide margin.

One final thought, a company to keep your radar screen as you do your tablet research is BlueStacks. BlueStacks is helping to reshape the tablet ecosystem by essentially bridging the Windows and Android ecosystems together, thus opening up new application possibilities in the amazing clarity and detail that only an AMD Fusion APU-powered tablet can offer.

Look for a review of my experience on the MSI WinPad 110W in the coming weeks on our AMD Fusion blog.

Computex 2011: AMD Announces Bobcat-based Z Series APUs for Tablet Market [June 1, 2011]

While AMD does not have a true SoC to combat the likes of Intel, NVIDIA, and ARM, this doesn’t mean they’re completely ignoring the market for the type of devices SoCs normally go in. Announced today at Computex 2011 and shipping immediately will be AMD’z Z series APUs, AMD’s formal entry into the modern tablet market.

While at this time it’s nigh-on impossible to get into a phone without a SoC (just ask Intel), tablets can be more forgiving. With a larger device and a larger battery, such devices don’t necessarily have the same extreme integration requirements and battery life requirements as a phone, even if the processors used in such devices are often the same. As a result of AMD’s current resources and technologies, it’s the tablet market that they have decided to go after first.

The Z-series, codename “Desna”, currently has a single APU that is shipping immediately: the Z-01.

AMD APU Lineup
APU Model
Number of Bobcat Cores
CPU Clock Speed
GPU
Number of GPU Cores
GPU Clock Speed
TDP
AMD Z-01
2
1.0GHz
Radeon HD 6250
80
276Mhz
5.9W
AMD C-30
1
1.2GHz
Radeon HD 6250
80
280MHz
9W
AMD C-50
2
1.0GHz
Radeon HD 6250
80
280MHz
9W
AMD E-240
1
1.5GHz
Radeon HD 6310
80
500MHz
18W
AMD E-350
2
1.6GHz
Radeon HD 6310
80
500MHz
18W

The Z-01, as near as we can tell, is a power optimized version of AMD’s existing C-50 APU. It features the same dual-core CPU design, using a pair of Bobcat CPU cores running at 1GHz. The GPU meanwhile is a Radeon HD 6250, and while AMD hasn’t listed the clocks, we believe it’s clocked at the same 280MHz as in the C-50. We don’t have any information on whether AMD is using the same packaging for the Z-01 as they are the C series, but otherwise the available specifications are identical to the C-50 with one exception: TDP. While the C-50 is rated for 9W, the Z-01 is rated for 5.9W. Given the 33% power reduction, it’s a fair guess that AMD is binning Ontario chips to find ones that operate at the low voltages Z-01 would require.

Based on what we’ve seen with the C-50, the Z-01 should perform far above any other tablet processor. However the 5.9W TDP means that it’s not going to be in the same market as the likes of OMAP 4, Tegra 2, Apple’s A5, or even Intel’s Moorestown. All of these SoCs/platforms use well under 5.9W, and with the exception of Moorestown are all ARM based.

Ontario and Atom by Hans de Vries [Sept 16, 2010] [he is an industry and enthusiast community veteran]

Improved image with some benchmark info:

http://www.chip-architect.com/news/AMD_Ontario_Bobcat_vs_Intel_Pineview_Atom.jpg

[Such sensity is indicating that TSMC’s 40nm process is quite dense. If these numbers hold true that would mean Ontario is not only smaller than Atom, but also much higher performing. Note the amount of die area dedicated to graphics. This is going to be very good for entry level systems.]

Re: Welcome Llano! by Hans de Vries [March 13, 2011] (emphasis is mine)

Azazel wrote:
BTW, did you notice that top speed of mobile 4c Llano is just 1.8GHz when mobile 4c/8t SB lies in 2.2/2.3 GHz.
Why is that?

The “top-speed” part is made up by you……….

A 1.8GHz quad core AMD propus uses only 25W at 45nm.
Expect the power dissipation of the four 32nm Llano cores to reach far lower levels as that. It will get under 15W at 1.8GHz when the process matures.

Intel doesn’t have any quad core mobile processor running at less than 45 Watt, not even at 32nm. 45W is too much power dissipation especially if you also want a bit of reasonable (discrete) graphics in your very expensive notebook.

It’s seems we’ll have to wait until 2013 when Intel’s 22nm process matures enough to yield an economic quad core Ivy Bridge before we’ll see a quad core Intel mobile processor for the mainstream mobile market.

Regards, Hans

Acer Iconia Tab W500 Microsoft® Windows® 7 Tablet Delivers Ultimate Productivity for Customers in North America [April 21, 2011] (emphasis is mine)

Acer America today announced that the Acer Iconia Tab W500 – a 10.1-inch tablet running Microsoft® Windows® 7 – is available for sale now in North America.

The Acer Iconia Tab W500 is the ultimate productivity device for anyone who wants the flexibility and mobility of a tablet with the efficiency and familiarity of a Windows PC. It’s especially ideal for schools, small businesses, and for industries such as healthcare that need a tablet to be productive and stay in touch as they move around their work environment. In addition, customers can use the tablet to keep up with social networks and enjoy digital entertainment at work, at home and on the go.

The unique design centers on the high-resolution 10.1-inch multi-touch screen. Supporting multi-touch allows customers to interact intuitively with the display to check email, access websites, use cloud-based applications, and enjoy digital media. When it’s time to focus on productivity and creating content such as reports, spreadsheets and presentations, customers can get a true notebook PC experience with the system’s full-size chiclet docking keyboard.

“The Acer Iconia Tab W500 is the perfect tablet for people who want the touch capabilities that are so natural and efficient on the go, but also need a Windows environment to access productivity applications for work and school,” said Eric Ackerson, senior product marketing manager, Acer America. “So much of what we’re doing on the go is accessing information and consuming content in cloud-based applications, such as realtors and salespeople who need access to databases and Intranet sites. The Acer Iconia Tab W500 is the ultimate reflection of our lives – able to multitask between work and fun, and ready at a moment’s notice.”

“We’re pleased to see Acer continue to drive innovation that delivers new, exciting computing experiences to customers,” said Soren Lau, general manager of OEM Marketing, Microsoft Corporation. “The Acer Iconia Tab W500 combines the familiarity, security and portability of Windows 7 with entertainment and social connection features that allow customers to work and play on a single PC.”

Innovative Design Boosts Productivity
The combination of a responsive and intuitive touch experience with a dedicated docking keyboard makes the Acer Iconia Tab W500 a productivity booster. The full-size chiclet docking keyboard easily connects to the tablet via USB, holding it up at a comfortable viewing angle. The keyboard also provides docking station capabilities with extended connectivity of an Ethernet port for fast Internet connections, and a USB port for external devices. Plus, the docking keyboard features the Acer FineTrack™ pointing device with two buttons for convenient navigation.

When it’s time to transport the Acer Iconia Tab W500, the tablet deftly connects to the docking keyboard with quick-linking magnets, transforming it into an easy-to-store clamshell notebook. It easily fits in a briefcase or book bag. If users want to minimize travel weight, they can simply leave the keyboard behind; the tablet weighs only 2.14 pounds and measures 10.83(W) x 7.48(D) x 0.63(H) inches. The additional docking keyboard weighs 1.34 pounds and measures 10.83(W) x 7.48(D) x 0.43-0.77(H) inches.

The embedded Acer PowerSmart long-life 3260 mAh Li-polymer battery pack delivers up to four hours of unplugged HD video playback and six hours of Internet browsing.(1)

Configurations, Availability and Pricing
The Acer Iconia Tab W500 is available in two models: the W500-BZ467 with Windows® 7 Home Premium has a Manufacturer’s Suggested Retail Price (MSRP) of $549.99, while the W500P-BZ841 with Windows® 7 Professional has a MSRP of $619.00. Both models are ready to be used for productivity and creation with Microsoft® Office Starter 2010 and are now available for sale at select retailers and channel partners in the United States.

The Acer Iconia Tab W500-BZ607 with Windows® 7 Home Premium is available at select retailers and channel partners in Canada for a MSRP of $599 CAD. The Acer Iconia Tab W500P-BZ412 with Windows® 7 Professional has a MSRP of $649.00 CAD and will be available in the channel by end of June.

Meaningful Communication with Video, Voice, Internet
Staying in touch on the go is easy with the Acer Iconia Tab W500. Customers can connect to Wi-Fi networks with reliable Acer InviLink Nplify 802.11a/b/g/n Wi-Fi CERTIFIED wireless technology at home and on the go for Internet access, checking email, and staying current on everything from news and blog sites to their Twitter feed. They also have Bluetooth to connect to printers, keyboards and other Bluetooth devices.

Two Acer Crystal Eye 1.3MP webcams – one each on the front and back of the device – used with Acer Video Conference Manager, let customers engage in video conferencing, as well as record HD videos and then quickly share them on Facebook, YouTube and other sites. The tablet also delivers excellent audio with Acer PureZone technology with two built-in stereo microphones featuring beam forming, echo cancellation, and noise suppression technologies.

Entertainment and Fun on the Go with Latest Technology
Work seamlessly blends into entertainment in so many ways today, and the Acer Iconia Tab W500 can be used to handle productivity and fun simultaneously. Powered by an AMD C-50 processor and supported by 2GB of DDR3 memory, the tablet delivers fast and reliable mobile performance. It also boasts integrated ATI Radeon HD 6250 graphics for realistic, crisp visuals on movies, web video and games. It also supports Adobe Flash and comes installed with Adobe Flash 10.1.

The tablet is ready to play back high definition Internet content and 1080p video on the high resolution 1280×800 LED-backlit display. Plus, sound is vibrant and clear with Dolby® advanced audio v2. The models come with a 32GB solid state drive,(2) which provides incredibly fast data access while reducing weight and noise. The SD card reader can support SD cards up to 32GB in capacity.(2)

The ambient light sensor on the Acer Iconia Tab W500 allows it to be used in a range of environments. The integrated accelerometer provides auto-rotation between portrait and landscape modes for viewing presentations, documents, websites, movies, games and more in the most appropriate orientation.

Acer Ring Elevates Intuitive Touch Experience
Like all Acer Iconia products, the core of the Acer Iconia Tab W500 touch experience is the Acer Ring. Easy to launch with a simple grab gesture, it offers immediate access to special features and touch applications. By placing five fingers in a circular pattern, the Acer Ring appears to let consumers surf the web, capture screen images, post photos and status updates, watch movies and more, all in the manner most comfortable and natural to them.

Utilities in the Acer Ring include Clean Disk to manage and optimize disk space; Snipping Tool to quickly select, tag, and clip screen images; Device Control to fine-tune the tablet settings; Camera to launch Acer Crystal Eye Webcam; Calculator and Games.
The Acer Ring also features a series of AppCards that enhance everyday usage:

  • TouchBrowser provides a touch-optimized browsing experience to let customers search for, open, resize, and select content from the web.
  • SocialJogger connects three of the most popular social networking sites – Flickr, Facebook, and YouTube – in a single interface so that customers can connect with and update their networks holistically.
  • My Journal lets customers collect web clips that are dynamically updated to stay posted on news of interest.
  • Scrapbook is a convenient place to store, annotate and share website and photo images and other content.
  • TouchPhoto, TouchMusic and TouchVideo provide direct access to multimedia files stored on the tablet.

clear.fi for Digital Media Sharing
Acer clear.fi is the digital media sharing system that lets customers enjoy their digital media content across their home quickly and effortlessly. Clear.fi automatically connects all Acer devices on a network (smartphones, notebooks, desktops, HD media players and storage devices) and then gathers and organizes media files by type (video, music, photo, pre-recorded TV). Users can browse the categories and then drag and drop the media to any of the connected PCs or devices for playback. The HDMI port with HDCP support ensures a single cable for true HD audio and video output.

ICONIA FAQ 13 (emphasis is mine)

Q: Does a stylus work on the Acer Iconia TAB W500 or Acer ICONIA dual screen touchbook?

A: Yes, a stylus that is compatible with capacitive touch screens can function on the Acer Iconia TAB W500 or Acer ICONIA dual screen touchbook.

Specifications Part Number: ICONIATabW500 Acer ICONIA Tab W500 Tablet Series

Following are the specifications for the Acer ICONIA Tab W500.
Specifications are subject to change without notice or obligation.

Feature
Specification
Operating System
Genuine Windows® 7 Home Premium 32-bit
CPU and chipset1
AMD C-Series dual-core processor C-50 (1 MB L2 cache, 1 GHz, DDR3 1066 MHz, 9 W)
AMD A50M Fusion™ Controller Hub
Memory1, 2,
Up to 2 GB of DDR3 onboard system memory
Display1
10.1″ HD 1280 x 800 resolution, high-brightness (350-nit), 146 PPI Acer CrystalBrite™ LED-backlit TFT LCD with integrated multi-touch screen, supporting finger touch and image auto rotation
Wide viewing angle up to 80/80/80/80 degrees (up/down/left/right)
Mercury-free, environment-friendly
Graphics
AMD Radeon™ HD 6250 Graphics with 256 MB of dedicated system memory, supporting Unified Video Decoder 3 (UVD3), OpenGL® 3.1, OpenEXR High Dynamic-Range (HDR) technology, Shader Model 5.0, Microsoft® DirectX® 11
Dual independent display support
16.7 million colors
External resolution / refresh rates3:
  • VGA port up to 1920 x 1200: 60 Hz
  • HDMI™ port up to 1920 x 1080: 60 Hz
MPEG-2 DVD decoding
VC-1 and H.264 AVC decoding
MPEG-4 Part 2 DivX® decoding
HDMI® (High-Definition Multimedia Interface) with HDCP (High-bandwidth Digital Content Protection) support
Audio
Optimized Dolby® Advanced Audio® v2 audio enhancement, featuring Audio Optimizer, Audio Regulator, Volume Leveler, Volume Maximizer, and Surround Virtualizer (for built-in speakers) technologies4
High-definition audio support
Two built-in stereo speakers
MS-Sound compatible
Acer PureZone technology with two built-in stereo microphones, featuring beam forming, echo cancellation, and noise suppression technologies
Storage
Solid state drive
  • 32 GB or larger, with mini-SATA (mSATA™) interface connector1, 5,
2-in-1 card reader, supporting:
  • Secure Digital™ (SD) Card, MultiMediaCard™ (MMC)
  • Storage cards with adapter: miniSD™, microSD™, Reduced-Size Multimedia Card (RS-MMC)
Webcam
Acer Video Conference1, featuring:
  • Dual Acer Crystal Eye webcams with 1280 x 1024 resolution
  • Acer Video Conference Manager software, featuring Video Quality Enhancement (VQE) technology, supporting online video calls6
  • Acer PureZone technology
Wireless and networking
WLAN:1, 7, 8,
  • Acer InviLink™ Nplify™ 802.11b/g/n Wi-Fi CERTIFIED™
  • Acer InviLink™ 802.11b/g Wi-Fi CERTIFIED™ (available only in Russia, Pakistan, Ukraine)
  • Supporting Acer SignalUp™ wireless technology
WPAN:1 Bluetooth® 3.0+HS
LAN: Fast Ethernet on the dock
Dimensions and weight
Dimensions
275 (W) x 190 (D) x 15.95 (H) mm (10.83 x 7.48 x 0.63 inches) for the tablet
275 (W) x 190 (D) x 11/19.5 (H) mm (10.83 x 7.48 x 0.43/0.77 inches) for the dock
Weight
0.97 kg (2.14 lbs.)9 with 3-cell embedded battery for the tablet
0.61 kg (1.34 lbs.)9 for the dock
Power adapter and battery1
Product Safety Electric Appliance and Materials (PSE) certified for battery pack
Power adapter
2-pin 40 W Acer MiniGo AC adapter:
  • 93.2 (W) x 48 (D) x 32.2 (H) mm (3.66 x 1.88 x 1.26 inches)
  • 180 g (0.39 lbs.)9 with 250 cm DC cable
Embedded battery
  • Acer PowerSmart long-life battery, supporting up to 1,000 charge cycles10
  • 36 Wh 3260 mAh 3-cell Li-polymer embedded battery
Battery life: 6 hours11 for Internet browsing; 4 hours11 for 720p HD video playback
Input and control
84-/85-/88-key full-size Acer FineTip keyboard with international language support on the dock
Acer FineTrack™ with two FineTrack™ buttons
Dedicated Windows® key supporting single-press for Windows Start; single-press combined with power button for Ctrl+Alt+Del
Dedicated volume up/down keys
Rotation lock switch
Input and output
2-in-1 card reader (SD™, MMC)
Two USB 2.0 ports each on the tablet and the dock
HDMI® port with HDCP support
Headphone/speaker jack, supporting 3.5 mm headset with built-in microphone for Acer smart handhelds
Ethernet (RJ-45) port on the dock
DC-in jack for AC adapter
Sensors
Ambient light sensor
G-Sensor
Software16
Productivity
  • Acer Ring
  • Acer ePower Management
  • Adobe® Flash® Player 10.1
  • Adobe® Reader® 9.1
  • AUPEO! (US only)
  • Bing™ Bar
  • Device Control
  • Kobo™ (Canada only)
  • Microsoft® Office 2010 preloaded (purchase a product key to activate)13
  • Microsoft® Office Starter 201014
  • New York Times Reader (US only)
  • NOOK for PC (US only)
Security
  • McAfee® Internet Security Suite Trial15
Multimedia
  • Acer clear.fi
Gaming
  • WildTangent® Tablet Edition
Communication and ISP
  • Acer Crystal Eye for dual cameras
  • Acer Video Conference Manager1
  • Microsoft® Silverlight™
  • My Journal
  • SocialJogger
  • Skype™
  • TouchBrowser
  • Windows Live™ Essentials 20111
Web links and Utilities
  • Acer Identity Card
  • Acer Registration
  • Acer Updater
  • eBay® shortcut 2009 (Canada, France, Germany, Italy, Mexico, Spain, UK, US only)
  • Netflix shortcut (US only)
Ecocompliance
ENERGY STAR®, WEEE, RoHS, Mercury-free
Options and accessories
Optional:
  • Exclusive USB keyboard dock
  • 2-pin 40 W Acer MiniGo AC adapter
  • External USB HDD
  • External USB ODD
Warranty
One-year International Travelers Warranty (ITW)
Windows®. Life without Walls™. Acer recommends Windows 7.
  1. Specifications vary depending on model.
  2. Shared system memory may be allocated to support graphics, depending on system memory size and other factors. Actual system memory available to the operating system will be reduced by any memory used by the graphics solution and resources required by the operating environment.
  3. Resolution/refresh rates depend on display capability and color/depth settings.
  4. Dolby® is a registered trademark of Dolby® Laboratories. Dolby® Home Theater® is a trademark of Dolby® Laboratories.
  5. 1 GB is 1 billion bytes. Actual formatted capacity is less and may vary depending on preloaded materials and operating environment.
  6. Two VQE-enabled Acer notebooks with dual-core processors are required to enjoy the exclusive benefits and added performance of VQE.
  7. Actual throughput may vary depending on network conditions and environmental factors such as network traffic or overhead, building construction, and access point settings.
  8. Acer Nplify™, a high-throughput wireless solution, delivers superior performance and reliable connections while enabling emerging voice, video and data applications. Wi-Fi CERTIFIED™, it supports Acer SignalUp™ wireless technology and is compliant with 802.11a/b/g/n and 802.11b/g standards.
  9. Weight may vary depending on product configuration, vendor components, manufacturing variability, and selected options.
  10. The battery will hold up to 80% of its original capacity after as many as 1,000 recharges. A full recharge comprises a complete charge-and-discharge cycle, and does not always occur each time the notebook is plugged in to a power source, as several partial charges can add up to a full recharge.
  11. The listed battery life is based on the following test conditions: wireless on; 150-nit LCD brightness; 3G, light sensor, Bluetooth® off; McAfee® anti-virus program enabled; Windows® scheduled programs and Standby/Hibernation power states disabled. Battery life rating is for comparison purposes only. Actual battery life varies by model, configuration, applications, power management settings, operating conditions, and utilized features. A battery’s maximum capacity decreases with time and use.
  12. Bundled software may vary depending on hardware configuration, OS and regional availability.
  13. Purchase an Office 2010 product key to activate one of the following Office 2010 suites preloaded on this PC: Office Home and Student 2010, Office Home and Business 2010, Office Professional 2010.
  14. Includes limited-functionality Microsoft® Word and Excel with advertising; no PowerPoint or Outlook. Purchase Office 2010 to activate full-featured Office.
  15. Trial periods vary depending on the geographic region and specifications: 365-day trial for China, Taiwan, Hong Kong and Singapore (Simplified Chinese and Traditional Chinese OS models); 60-day trial for other regions.

Acer places orders for 80,000 Z series APUs from AMD for tablet PCs [June 9, 2011] (emphasis is mine)

Acer has recently placed orders for 80,000 Z series APUs from AMD for use in tablet PCs, targeting the enterprise market, according to sources from upstream component makers. However, both Acer and AMD did not confirm the orders.

In addition to Acer, Micro-Star International (MSI) is also developing tablet PC models using AMD’s APU.

Since Google Android 3.0 currently still has issues which need to be resolved, while the next-generation Android operating system codenamed Ice Cream Sandwich will not appear until the end of 2011, some tablet PC vendors have decided to launch Windows 7-based tablet PCs targeting the enterprise market to maintain their shipments.

Since Intel’s Oak Trail-based Atom processor is higher in both price and power consumption, several notebook vendors have already started considering AMD’s platform. In addition to Acer and MSI, some vendors have also started inquiring about AMD’s Z series APU.

AMD’s Z series APU is produced through Taiwan Semiconductor Manufacturing Company’s (TSMC’s) 40nm process and is already shipping, targeting the Windows-based tablet PC market, noted the sources adding that they expect shipments of Z series APUs to reach at least 500,000 units in the second half of 2011, creating strong pressure on Intel’s Oak Trail processor.

AMD announces details of a new generation of Fusion chips for 2011-2012 – slideshow [June 15, 2011]

AMD has now announced a complete line of series hybrid CPU + GPU Fusion chip designed for portable computers and mobile devices such as tablet (see previous news from the list of chips). In addition, AMD has presented information on the rest of the Fusion generation including processors that will compete with Intel’s Sandy Bridge generation – details can be seen on the slides.

AMD announces A series APUs for mainstream PCs [June 14, 2011]

AMD has announced the availability of the new high-performance AMD Fusion A series accelerated processing units (APUs) for consumer notebooks and desktops.

The AMD A series APUs combine up to four x86 CPU cores with an integrated DirectX 11-capable discrete-level graphics unit that features up to 400 Radeon cores along with dedicated HD video processing on a single chip. AMD A series APUs also support features such as gesture interfaces, multiple-monitors, 3D and real-time image stabilization.

The AMD A series APUs (Llano) are currently shipping and scheduled to appear in more than 150 notebooks and desktops from the global OEMs throughout the second quarter of 2011 and beyond. Delivering serial and parallel computing capabilities for HD video, 3D rendering and data-intensive workloads in a single-die processor, the AMD A Series APUs offer software developers unprecedented power and potential in an ever smaller package, said AMD.

The AMD A series APUs are capable of delivering more than 10.5 hours of battery life during idle mode, a more than 50% increase compared to AMD’s previous mainstream platform. Additionally, AMD dynamic switchable graphics optimize battery life on PCs featuring AMD dual-graphics solutions by intelligently managing power states on the APU and separate discrete AMD Radeon GPU.

TSMC wins orders for 28nm GPU from AMD, says paper [June 17, 2011] (emphasis is mine)

AMD reportedly has completed the tape-out of its next-generation GPU, codenamed Southern Islands, on Taiwan Semiconductor Manufacturing Company’s (TSMC) 28nm process with High-k Metal Gate (HKMG) technology, according to a Chinese-language Commercial Times report. The chip is set to expected to enter mass produciton at the end of 2011.

TSMC will also be AMD’s major foundry partner for the 28nmKrishna and Wichita accelerated processing units (APUs), with volume production set to begin in the first half of 2012, the report said.

TSMC reportedly contract manufactures the Ontario, Zacate and Desna APUs for AMD as well as the Northern Island family of GPUs. All of these use the foundry’s 40nm process technology.

TSMC was quoted as saying in previous reports that it had begun equipment move-in for the phase one facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products slated for the fourth quarter of 2011. The foundry previously said it would begin moving equipment into the facility in June, with volume production expected to kick off in the first quarter of 2012.

Foundry partners for next-generation AMD APU and GPU series
Product/Partner 2011 2012
Mainstream and high-end APU Llano Trinity
Foundry partners Globalfoundries 32nm SOI Globalfoundries 32nm SOI
Entry-level APU targeting tablets Ontario/ Zacate/ Desna Krishna/Wichita
Foundry partners TSMC 40nm TSMC 28nm HKMG, Globalfoundries 28nm HKMG
GPU Northern Islands Southern Islands
Foundry partners TSMC 40nm TSMC 28nm HKMG

Source: Commercial Times [Chinese language], compiled by Digitimes, June 2011

AMD Said to Contract TSMC, GlobalFoundries to Make 28nm Chips [June 20, 2011]

Advanced Micro Devices (AMD) is reportedly to designate Taiwan Semiconductor Manufacturing Co. (TSMC) as its primary contract supplier of 28nm Krishna/Wichita microprocessors early next year and GlobalFoundries as another contract source later in 2012, according to local media.

The report said that Krishna/Wichita are the next-generation versions of the low-end AMD Ontario/Zacate family. AMD has contracted TSMC, currently the world`s No.1 pure silicon foundry, to build its Ontario/Zacate processors and the Desna processors meant for tablet PCs using 40nm process technology.

Robust demand for Ontario/Zacate and Desna processors in developing economies has promoted AMD to ramp up contracts to TSMC.

Also, AMD Northern Island-family graphics processing units are under volume production at TSMC based on 40nm process. The graphics lineup`s next generation, the 28nm Southern Island family, has seen its tapeout completed by TSMC, which is expected to start contract manufacturing of the chips for AMD by the end of this year.

AMD`s 32nm Llano processors have entered into volume production at GlobalFoudries. The report also noted that GlobalFoundries will be also a major contract manufacturer of AMD`s Trinity processors, which are designed on 32nm SOI rule, in 2012. Trinity is developed for laptops and more efficient than Llano.

Globalfoundries names interim CEO, new key management appointments [June, 2011] (emphasis is mine)

The board of directors of Globalfoundries, along with its majority shareholder the Advanced Technology Investment Company (ATIC), has announced its new leadership.

Semiconductor industry veteran Ajit Manocha has been appointed interim CEO of Globalfoundries. James Norling will serve as executive chairman and Ibrahim Ajami will serve as VP of the company’s board of directors. All appointments are effective immediately.

Doug Grose, who has served as CEO of Globalfoundries since its inception, will transition to become senior adviser to Globalfoundries and ATIC with a focus on technology leadership and ensuring delivery of next generation technologies for competitive differentiation. COO Chia Song Hwee will remain with the company in that position until August 2011, when he will return to be part of Singapore’s business future, Globalfoundries indicated.

“Doug Grose and Chia Song Hwee formed the foundation of Globalfoundries, bringing together the world’s leading-edge manufacturing technology with the heritage of a full-service foundry partner,” said Norling. “This new leadership team will build on that foundation, as we increase investment in technology, capacity and talent while optimizing performance.”

Norling also said an executive search for a permanent CEO has already begun. Manocha’s focus is to work closely with top management and talent of the company to optimize performance, and continue progress on the capacity and technology roadmap.

Manocha has more than 30 years of global expertise in operations, general management and manufacturing. He was previously executive VP of Worldwide Operations at Spansion.

Norling is the former chairman of Chartered and also served as interim CEO of that company in 2002. He was previously with Motorola from 1965 to 2000 holding various positions.

“Globalfoundries, with the continuous support of ATIC, is in the middle of an intense, competitive ramp-up of manufacturing capacity and technology development,” said Ajami, who will also remain CEO of ATIC. “Under this new leadership team, investment in Globalfoundries will double over the next 18 months.”

Through end of May 2011, ATIC had invested over US$6 billion to acquire the former manufacturing assets of AMD in Dresden, Germany, and the assets of Chartered Semiconductor Manufacturing of Singapore, as well as an estimated US$1 billion to construct a new fabrication facility in upstate New York. Through the end of 2012, ATIC will invest another approximately US$6 billion in manufacturing capacity in Dresden, Singapore and New York with initial construction to begin in Abu Dhabi, Globalfoundries said in a statement.

AMD displaying next generation APU platform; adopts 28nm process in 2012 [June 16, 2011] (emphasis is mine)

AMD has displayed notebook models using its next-generation Trinity platform, based on Bulldozer at its Fusion Developer Summit (AFDS), and is set to launch the new platform in 2012 with enhanced performance and power consumption compared to its current Llano platform. The new platform’s parallel calculations are also estimated to perform 50% better, according to Rick Bergman, Senior Vice President and General Manager Products Group, AMD.

AMD’s APU product line is currently divided into several different segments:
G series CPUs, set to target embedded products;
C series CPUs designed for ultra-thin notebooks or tablet PCs;
Z series mainly targeting tablet PCs;
E series targeting ultra-thin notebooks or small form factor (SFF) desktop PCs; and
A series targeting mainstream notebooks, all-in-one PCs and desktop PCs.

Compared to Intel’s processors, Bergman believes AMD’s APU shares a similar concept as Intel’s Sandy Bridge, but Sandy Bridge is unable to provide parallel calculations as strong as AMD’s APU, and does not support the existing industry standards such as DirectX 11, Open GL 4.1 or OpenCL. In addition, Sandy Bridge is designed based on the application user interface of Windows Vista, while AMD’s APU is capable of fully supporting the application user interface of Windows 7, Bergman added.

As for the product design, Intel’s graphics technologies only account for a small proportion of the CPU product’s size, while AMD’s GPU design accounts for about 40% of the APU’s size. The company is even integrating a graphics solution with a performance level of discrete graphics chips to offer strong parallel calculations and Intel’s graphic solution, which is rather basic and simple, is not capable of competing against such advances, Bergman noted.

In addition, AMD’s Dual Graphics technology also allows its APU to coordinate with AMD’s discrete graphics cards to allow a graphics performance boost of 75%. With Intel’s graphics solution in Sandy Bridge, the integrated graphics is not used if an additional discrete graphics card is added to the platform, Berman pointed out.

The Trinity platform will still adopt 32nm process and AMD is set to launch Krishna with 28nm process in 2012, Bergman noted. Commenting on questions whether AMD will outsource its production to Globalfoundries or Taiwan Semiconductor Manufacturing Company (TSMC), Bergman only said that both firms will have the chance to produce the 28nm products for AMD.

Leaked Presentation Reveals AMD’s Fusion Strategy [May 27, 2011]

AMD APUs for 2012: 32nm Trinity, 28nm Krishna, 28nm Hondo. Not shown are 28nm Wichita, Weatherford and Richland

AMD Details Future Technical Roadmap for its Award Winning Fusion Architecture at Industry Developer Summit [June 14, 2011] (emphasis is mine)

AMD (NYSE: AMD) detailed to more than 700 developers and PC industry executives the roadmap for its Fusion System Architecture (FSA). The specific design features planned for future AMD products were presented in the opening keynote of the AMD Fusion Developer Summit. FSA describes AMD’s overarching design for having combinations of CPU and GPU processor cores operate as a unified processing engine that is both higher performance and much lower power than previous architectures. Many of the specific FSA enhancements discussed will be leveraged by newer programming languages, and interfaces like OpenCL™ and DirectCompute, making it easier for the software developer to fully exploit the unique capabilities of the AMD accelerated processing unit (APU).

“The first APUs from AMD dramatically increase processing performance while consuming less power and now we are building upon that achievement with our next generation of products” said Phil Rogers, AMD Corporate Fellow. “Future innovations are intended to make the different processor cores more transparent to programmers. They can then seamlessly tap into the gigaflops of power-efficient performance available on the APU and design even faster, more visually stunning applications on a wide range of form factors.”

Today’s APUs

Available since January of this year, AMD’s line-up of APUs are the first to integrate x86 CPU cores and DirectX™ 11-capable Radeon™ GPU cores on a single die and have been widely adopted by computing OEMs worldwide.  Being on the same chip reduces the system power and bill-of-materials, speeds the flow of data between the CPU and GPU through shared memory, and allows the GPU to function as both a graphics engine and an application accelerator in highly efficient compute platforms.

APUs of Tomorrow

Building on the success of the integration of CPU and GPU processing cores on the same chip, AMD is now focused on evolving the architecture to make it appear as a unified processing element to the software programmer.   That includes a number of evolutionary steps expected to continue through 2014 such as:

  • Support for C++ features that more fully leverage the GPU as a parallel processor
  • User-mode scheduling for lower latency task dispatch between CPUs and GPUs
  • Unified memory address space and fully coherent memory shared by the CPU and GPU so they operate seamlessly together

AMD also announced plans to publish a detailed specification on the features and functionality required to meet the requirements of the architecture.

Supporting Resources

  • A webcast replay of Phil Roger’s keynote will be available for 10 days
  • Access AMD’s Developer Central site for the latest tools and tutorials
  • Information on the AMD Fusion Family of APU processors

What’s next for AMD Fusion? [June 15, 2011] By Phil Rogers – Corporate Fellow at AMD (emphasis is mine)

What a year it has been already for AMD and its APU products – we have now announced top-to-bottom families of processors that support everything from low-power tablets to performance notebooks and desktops.   All of which integrate DirectX™ 11™-capable graphics with new “Bobcator 32nmStars” x86 CPU cores.   Bringing the GPU and the CPU together on a single chip was a critical step for AMD, and the resulting processors are finding a welcome home with OEMs and end-users.

We are just getting started.

At this week’s AMD Fusion Development Summit in Bellevue, Washington, I spoke to more than 600 attendees about where we plan to take the industry next with the AMD Fusion System Architecture (FSA).  The audience was primarily software developers, recognizing that they are critical to our success and that we want their participation during the development of the platform.  I have been developing 3D graphics and parallel computation software for more than 20 years, so I understand why total platform design is required to fully enable a programmer’s creativity and productivity.

In steering the architectural direction of FSA in my role as Corporate Fellow, my primary concern has been how to make heterogeneous (i.e., APU) programming easier, more natural and accessible to the largest possible community of software developers.

So what does that mean, really?  We aim to make the unprecedented parallel processing capability of the GPU on the APU as accessible to programmers as the CPU is today.  To do that there are a series of simplifying steps we plan to take that will improve on what is already a great foundation:

  • Add support for C++ features that more fully leverage the GPU as a parallel processor
  • Unify the memory address space shared by the CPU and GPU, and make it coherent, so they operate seamlessly together.
  • Add user mode scheduling, to dramatically reduce the time it takes for the CPU and GPU to dispatch work to each other.

There are others, but these are big ones, resulting in the biggest leap forward.  Once the AMD Fusion System Architecture is realized, the GPU is a true peer processor to the CPU, with direct access by software.

In the meantime, the benefits of the integration step are readily apparent:  dramatic improvements in battery life for AMD platforms; smaller form factors through reduction in the silicon footprint; acceleration of applications that leverage OpenCL and DirectCompute via the GPU, just to name a few.

I hope you will check back in to the AMD Fusion Blog from time-to-time to get updates on our progress!

A webcast replay of my keynote will be available for the next 10 days.

AMD Announces Thought Leaders from ARM and Microsoft to be Among Keynote Speakers at AMD Fusion Developer Summit [April 26, 2011] (emphasis is mine)

AMD (NYSE: AMD) today announced a distinguished line-up of keynote speakers as well as technical session topics for the inaugural AMD Fusion Developer Summit (AFDS), which will be held June 13-16, 2011 at the Meydenbauer Center in Bellevue, Washington.

Industry keynote presentations will be delivered by esteemed industry experts from AMD, ARM and Microsoft. In his keynote “Heterogeneous Parallelism at Microsoft” Herb Sutter, Microsoft principal architect of Native Languages, will showcase upcoming innovations to bring access to increasingly heterogeneous compute resources directly into the world’s most popular native languages.

Jem Davies, ARM fellow and vice president of Technology, Media Processing Division, will deliver a keynote about ARM’s long history of heterogeneous computing, its future strategy, and ARM’s support of standards, including OpenCL™.

The summit will open and close with AMD keynote presentations as well. AMD corporate fellow Phil Rogers will explore the programmer’s guide to Accelerated Processing Units (APUs), and Eric Demers, AMD corporate vice president and chief technology officer, Graphics, will deliver a keynote that chronicles the evolution of AMD’s graphics cores and discuss next-generation AMD graphics technology.

“The development experts we’ve chosen to share their work at AFDS are at the forefront of next-generation programming, and are working to harness the full processing power of heterogeneous computing technologies,” said  Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The AMD Fusion Developer Summit is the best place for developers, academics and innovators to collaborate around parallel programming and industry standards, helping the developer community to realize the promise of the latest computing methodologies, today and into the future.”

Technical sessions, tutorials, hands-on labs and keynote presentations at AFDS will cover a range of topics including heterogeneous and high-performance computing (HPC), next-generation user interfaces, parallel programming tools and industry-standard application programming interfaces (APIs) such as OpenCL™, OpenGL™, Java and Microsoft DirectCompute. The Session Catalog for the AMD Fusion Developer Summit lists more than 90 in-depth technology sessions to be presented by industry and academic experts.

Speakers will be in attendance from a range of industry companies, universities and government organizations. Session topics include:

  • Developer Tools
  • Enterprise Computing
  • High-Performance Computing
  • Multimedia Processing
  • Professional Graphics and Visual Computing
  • Programming Models
  • Security
  • User Interface and Media Experiences

Developers interested in the latest heterogeneous computing tools and training can register for AFDS on the event website and take advantage of a special low registration fee of $300 this inaugural year.

Resources

AMD Demonstrates Llano APU [Oct 18, 2010]

AMD’s Chris Cloran demonstrates the Llano APU in Taipei at the 6th annual AMD Technical Forum and Exhibition. In the first public demonstration of Llano, Chris demonstrates simultaneous HD video playback, multi-threaded Pi calculation, and N-Body simulation utilizing the CPU and GPU cores.

AMD Ushers in Next Generation of Computing with AMD A-Series APUs [June 14, 2011] (emphasis is mine)

AMD (NYSE: AMD) today announced the next generation in mainstream consumer computing with the availability of the new high-performance AMD Fusion A-Series Accelerated Processing Units (APUs). Enabling truly immersive computing experiences in consumer notebooks and desktops, the AMD A-Series APUs enable brilliant HD graphics, supercomputer-like performance and over 10.5 hours of battery life2.

In an increasingly digital and visually oriented world, consumers are placing ever-higher priorities on multitasking, vivid graphics, lifelike games, lag-free videos, and ultimate multimedia performance. To meet these needs, the AMD A-Series APUs combine up to four x86 CPU cores with powerful DirectX®11-capable discrete-level graphics and up to 400 Radeon™ cores along with dedicated HD video processing on a single chip. AMD A-Series APUs also allow for advanced capabilities such as gestural interfaces, multi-monitor support, 3D entertainment and real-time image stabilization3.

“The AMD A-Series APU represents an inflection point for AMD and is perhaps the industry’s biggest architectural change since the invention of the microprocessor,” said Rick Bergman, senior vice president and general manager, AMD Products Group. “It heralds the arrival of brilliant all-new computing experiences, and enables unprecedented graphics and video performance in notebooks and PCs. Beginning today we are bringing discrete-class graphics to the mainstream.”

The AMD A-Series APUs (previously codenamed “Llano”) are currently shipping and scheduled to appear in more than 150 notebooks and desktops4 from leading OEMs throughout the second quarter of 2011 and beyond. Delivering powerful serial and parallel computing capabilities for HD video, 3D rendering and data-intensive workloads in a single-die processor, the AMD A-Series APUs offer software developers unprecedented power and potential in an ever smaller package.

AMD AllDay™ Power: Battery Life that Lasts

The AMD A-Series APU delivers the power to match how consumers actually use their PCs: all day – without sacrificing performance. Delivering more than 10.5 hours of resting battery life – a more than 50 percent increase compared to the 2010 AMD Mainstream Platform – users can get their work done or watch multiple HD movies on a single charge5. Additionally, AMD dynamic switchable graphics optimize battery life on PCs featuring AMD dual-graphics solutions by intelligently managing power states on the APU and separate discrete AMD Radeon™ GPU.

“The battery life of the AMD A-Series APU is a huge leap forward and will surprise many consumers and commercial customers,” said Chris Cloran, Vice President and General Manager, Client Division, AMD. “And the supercomputer-like performance will give people some revolutionary capabilities, like real-time image stabilization –taking out all the shakes and jitters in those hand-held videos on the fly, while you’re watching.”

Brilliant HD: Every Pixel Matters

People are making, sharing and enjoying more digital content than ever on their PCs, and the AMD VISION Engine – cutting-edge hardware and software featured with every AMD A-Series APU that automatically helps digital content like videos, games and photos look their best. HD video is crystal clear through dedicated video playback technology and dynamic post-processing, and websites render faster with accelerated HTML5 and Direct2D performance. Editing, transferring and viewing HD content is fast and easy with support for advanced connection standards, including HDMI 1.4a, DisplayPort 1.1, and USB 3.0, along with native support for multiple monitors.

Also introduced with the AMD A-Series APU is a new feature called AMD Steady Video6 designed to stabilize videos during playback – making unsteady, jumpy content look steady and smooth. The AMD A-Series APU can also enables advanced capabilities like gestural interfaces, 3D gaming and 3D Blu-ray video entertainment – features that are now key to consumer PC experiences and expectations.

Every PC built with an AMD A-Series APU delivers brilliant HD by offering discrete-class DirectX® 11-capable graphics – with models available at virtually every price point. Only AMD Fusion APUs offer true AMD Dual Graphics, with up to 75 percent graphics performance boost, when paired with an AMD Radeon™ discrete graphics card7.  This faster, higher-quality, more vivid and lifelike delivery makes consumers feel fully present in their digital world, especially when gaming.

Personal Supercomputing: Ultimate Performance

Consumers are doing more than ever before with their PCs – from work to play – and with the AMD A-Series APU, even their laptops can keep up, delivering  next generation  parallel processing.  With up to 400 gigaflops for notebook, and up to 500 gigaflops for desktops8, AMD A-Series APUs ensure users have the horsepower needed to handle the most demanding applications such as video and image processing, facial recognition, gesture recognition and multitasking scenarios. For the most challenging environments, AMD Fusion A-Series APUs offer AMD Turbo Core Technology, which dynamically optimizes and boosts CPU and GPU performance to power-efficient levels depending on the applications being run.

The Growing AMD Fusion Ecosystem

AMD has seen great momentum in the software developer community since the launch of AMD Fusion APUs in January 2011, with more than 50 leading applications now accelerated by the family of AMD Fusion APUs and advanced browsers like Internet Explorer 9 delivering even more immersive, next generation web experiences when running on an AMD Fusion APU-powered PC. And, the inaugural AMD Fusion Developer Summit, running now through June 16 in Seattle, Washington, is providing a forum for developers, academics and innovators to collaborate around parallel programming and industry standards, like OpenCL™, helping the software ecosystem build on the promise of the latest computing methodologies.

Supporting Resources

AMD Fusion APU Llano in a Multi-Tasking Technology Demonstration [Feb 28, 2011]

AMD’s Fusion APU code-named Llano handles high definition graphics and video with ease and excellent power efficiency. In this demonstration, The Llano APU goes head-to-head in visually intense workloads against a system based on Intel Core i7-2630QM based on the Sandy Bridge architecture. CPU –

Configurations Employed In Video Demo
APU – AMD Accelerated Quad-Core Processor [A8-3510MX later coming out @1.GHz and 45W] Engineering Sample
Chipset – AMD Fusion Controller Hub Engineering Sample
Video Driver – 8.830.0.0
Screen Size – 14 inch Diagonal
Screen Resolution – 1366 X 768
Memory – 4 Gb 1333 DDR3Ram
Hard Drive – C300 128Gb SSD
OS – Windows 7 Professional 64 bit

CPU – Intel® Core™ i7-2630QM 2.0Ghz
Graphics – Intel® HD 3000 Graphics
Chipset – Intel® 6 Series/C200 series chipset family
Video Driver – 8.15.10.2279
Screen Size – 14 inch Diagonal
Screen Resolution – 1366 X 768
Memory – 4 Gb 1333 DDR3Ram
Hard Drive – C300 128Gb SSD
OS – Windows 7 Professional 64 bit

AMD Platform Innovations with ‘Sabine’ [A-Series] [June 9, 2011] (emphasis is mine)

I recently attended an AMD event in Abu Dhabi, UAE where we held a briefing of our upcoming “Sabine” notebook platform featuring our new APU, codenamed “Llano.  In AMD parlance, “Llano” is the “big iron”, that is, processors designed for performance first.  After I delivered my presentation, I had a chance to speak with some of the press to gauge their feedback.  One universal theme was the great impression that we made with our platform innovations, features, features outside of the core x86, graphics, video and compute functions.  Here is a brief summary of the great steps forward we have made with the platform features of “Sabine”.

Power

Systems based on AMD technology have long been criticized for having a shorter battery life than systems based on competing technology.  This is no longer the case with “Sabine.”  Yes.  In fact, internal testing demonstrates our “Sabine” platform will yield as good or better battery life than our competitor’s current platforms.  In our labs we were able to exceed our expectations in terms of battery life using the Windows 7 idle test on the very same platform that we sampled to the press. This battery life performance handily surpasses a competing platform that was purchased at retail.

This will be a shocker to many people including the competition.  As with any significantly disruptive product, the “Llano” APU is transformational across many vectors.  As if the nearly 500 Gigaflops or Quad Core x86 combined with a Discrete Class DirectX 11-capable GPU wasn’t enough, Llano has exceeded expectations is reducing our idle power consumption and increasing our power efficiency.

AMD has become increasingly religious about lowering power consumption over the past few years.  When we designed the “Llano” APU, power was of primary importance in our design goals.  It would be very convenient if there was just one area that consumed excessive power; what we found however was that cumulative savings came from many contributing factors and our engineering teams fought for every last mW of those savings. In the end we delivered enough power savings to enable us boost battery life dramatically over our prior platforms! How long exactly? You’ll have to wait until we launch in June for that info. But trust me, it will be worth the wait.

Ironically, we have engineers in the company who work on delivering the best performance available for a 300 watt graphics card — and those same engineers fought for 50 mW on other products.  50 mW is 1 6000th of 300 watts!

Our course, it is not just idle power where AMD has innovated.  With modern graphics based workloads, we really show “Llano’s” mettle.  As the video below demonstrates, the “Llano” APU enables several hours of intensive graphics active platform use, while on battery power, surpassing the capability of the competitive platform. This is a testament to AMD’s decision to use an extremely efficient and powerful graphics processor.

USB 3.0 Integration

With our new “Sabine” platform, AMD is the first company to integrate USB 3.0 into its core logic.  Because of this, we’re enabling the following benefits of USB 3.0 over USB 2.0:

  • 10X bandwidth allowing up to 5 Gbps transfer rates
  • Full Duplex and Asynchronous operation
  • More power available through the ports

Translation:  USB 3.0 enables the use of 1080p cameras!  This means a new level of realism for video conferencing and other forms of tele-presence.  We have been working with our partner, Point Grey who have developed a very small USB 3.0 based camera which they call “Flea3”.  This camera can stream uncompressed 1080p60 video. As you can see in the linked video <link>, while an AMD system using Flea3 is able to request and process the same frames per second rate as the Intel system, it’s also able to display up to 4x the Hz— enabling a much sharper, jolt-free visual experience.  There are other benefits to integrating USB 3.0 as well, including the availability of 4 ports instead of the current 2 found in most discrete solutions today.

AMD has really transformed itself over the past 4 years as “Llano” gestated.  As we get closer to the launch, more details will continue to trickle out.  AMD is extremely excited to finally deliver the “Big Iron” APU.  Personally, I cannot wait until I can get hold of one to call my own.

The art of the possible with Unilimited Realities [June 14, 2011]

You know when you see something that makes you say “Wow”. That was my reaction when I saw the work that New Zealand-based Unlimited Realities was doing in the area of touch-based consumer applications. And now, I’m pleased to be able to talk about our collaboration on the next generation of their Fingertapps suite of apps.

What is unique about Unlimited Realities is that they combine the latest technologies, like graphics acceleration with DirectX 11, with new ways of interacting with your PC, like touch, to create applications that appeal to a broad consumer base. Things like touch-based musical instruments, family activity apps and multi-player touch enabled games.

At AMD’s Experience Brilliance launch of the AMD A-Series APUs in Seattle last night, we showed off some of the work that the teams have been doing over the past few months to demonstrate what is possible when you combine software and hardware innovation. The new apps take advantage of the unique capabilities in the AMD Fusion APUs to give you an amazing visual experience not possible on previous generations of processors.

The AMD APU-optimized versions of Fingertapps are expected to be available later this summer.

Flirtatious Francois: AMD Fusion [June 8, 2011]

AMD’s line-up of APUs are the first to integrate x86 CPU cores and DirectX™ 11-capable Radeon™ GPU cores on a single die.

AMD Unveils New Software Tools Designed to Accelerate the Development of Brilliant Computing Experiences [June 13, 2011]

AMD (NYSE: AMD) today announced a new set of software development tools and solutions to enable developers to optimize their applications for OpenCL™ standards. These advanced tools create a foundation for software companies to realize the full potential of the AMD Fusion Family of Accelerated Processing Units (APUs), harnessing the combined compute power of AMD’s high-performance CPUs and GPUs across a wide array of heterogeneous computing platforms. As a result, developers can bring to life innovative experiences like HD video, 3D gaming, video conferencing and intuitive user interfaces, to truly differentiate their applications in the market.

“AMD is working closely with the developer community to make it easier to bring the benefits of heterogeneous computing to consumers, enabling next-generation system features like vivid video, supercomputer-like performance and enhanced battery life,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “Our advanced developer tools and solutions enable a new era of parallel programming that’s based on industry standards and focused on delivering innovative user experiences that span a variety of computing form factors.”

Among the new offerings is the gDEBugger™ product, which was created by experts from AMD’s new Israeli research center, based on AMD’s acquisition of startup company Graphic Remedy in October 2010. gDEBugger is an advanced OpenCL and OpenGL debugger, profiler and memory analyzer. The new AMD gDEBugger release provides developers with the ability to debug OpenCL kernels, running on AMD GPUs, and step through their source code while examining kernel variables and data. This product, which is a plug-in designed to work with Microsoft Visual Studio®, includes all of gDEBugger’s previous features and capabilities.

Additional developer solutions include a Parallel Path Analyzer (PPA), Global Memory for Accelerators (GMAC) and Task Manager tools, which are being developed by Multicoreware in collaboration with AMD. These new tools and solutions, expected to be available in Beta during Q3 of this year, are designed to make OpenCL GPU development easier and more efficient.

  • Parallel Path Analyzer (PPA) is an advanced profiling tool for developing applications that optimize both GPU and CPU load. The PPA visualizes data transfers and kernel execution, identifies system-wide critical paths and locates data dependencies.
  • The Global Memory for Accelerators (GMAC) API provides a framework in which a developer can create applications leveraging the immense compute capabilities of OpenCL, but without the overhead of having to explicitly manage multiple data buffers across the separate address spaces of GPU and CPU.
  • The Task Manager API provides a framework for managing compute tasks in a heterogeneous multi-core environment. OpenCL kernels can be automatically scheduled to execute on an available and task-appropriate device, providing dynamic load balancing, optimizing use of available compute resources and removing the burden of explicit schedule handling.
  • The new tools expand AMD’s robust line of developer solutions that are publicly available on the AMD Developer Central website, including software development kits, libraries, compilers, webinars and educational support. In addition, developers will be able to learn more about AMD’s comprehensive set of software tools and solutions at the AMD Fusion Developer Summit taking place this week in Bellevue, Washington. Summit participants will be able to engage in interactive sessions and hands-on labs to deepen their knowledge of advanced CPU and GPU programmability.

Resources

AMD Launches Contest for Developers to Create Heterogeneous Compute Applications [June 15, 2011]

AMD (NYSE: AMD) today announced the AMD OpenCL™ Coding Competition, being run by software development leader TopCoder. This contest is intended to encourage the creation of applications that take advantage of OpenCL™ as well as the award-winning AMD Fusion accelerated processing unit (APU) architecture. The OpenCL™ Coding Competition is open to software developers with great ideas, and up to $50,000 in prizes will be awarded to winning submissions.

“We’re at an inflection point in the computing industry with evolving chip architectures and the shift to common programming interfaces and industry standards, which enable developers to enable amazing new experiences,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The OpenCL Coding Competition is just the beginning of a new wave of application development by the software community as they embrace heterogeneous computing across multiple platforms.”

AMD Accelerated Parallel Processing (APP) technology (formerly ATI Stream) is a set of advanced hardware and software technologies that support OpenCL and enable highly parallel compute-capable GPUs to work in concert with a system’s CPU to accelerate applications beyond traditional x86 graphics and video processing. AMD Fusion APUs combine multi-core x86 technology with a discrete-level DirectX® 11-capable GPU in a single processor design, connected by a high speed link, to deliver up to 500 gigaflops of compute performance.1

Developers and students who choose to participate will be asked to submit an abstract that outlines how they plan to use the latest generation AMD APP software development kit (SDK) with OpenCL support to create an accelerated application for the AMD Fusion APU platforms.

Contestants can choose to create an application in any category including, but not limited to, the following:

  • Video Processing
  • Image Processing
  • Security
  • Human Computer Interface
  • Data Mining
  • Gaming
  • Physics processing
  • Social Networking / Communication
  • Other

“We see APU architecture continuing to be widely adopted for new computing designs, and believe that developers will want to build and optimize their applications around the high performance achieved with these new hardware platforms,” said Matt Murphy, TopCoder platform manager. “This technology shift signifies a sizeable opportunity for developers around the world who want to be early to embrace a new era of heterogeneous computing.”

In addition to the SDK, contestants will need the latest AMD Catalyst™ drivers that include the OpenCL runtime compiler. Released in May 2011, the latest AMD Catalyst drivers for Windows and Linux also bring new features, including expanded support for multi-display environments through AMD Eyefinity technology, which developers can leverage to create even more immersive experiences for end users.

For full details and a complete set of Official Rules for the AMD OpenCL™ Coding Competition, please visit http://community.topcoder.com/amdapp/

Resources

AMD and Academic Experts Collaborate with Morgan Kaufmann Publishers on OpenCL™ Book [June 15, 2011]

AMD (NYSE: AMD) today announced its   collaboration on a new book for developers, Heterogeneous Computing with OpenCL, to be published by Morgan Kaufmann, an imprint of Elsevier Science & Technology Books. The book provides hands-on OpenCL™ experience and details multiple device architectures and application programming interfaces (APIs), from multi-core CPUs, GPUs and fully integrated Accelerated Processing Units (APUs) like AMD Fusion APU technology, to fundamental parallel algorithms.

“This book is just one more example of how AMD enables the university and the developer communities with information and tools they need to embrace OpenCL and other common platforms,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The continued adoption of OpenCL will significantly expand the possibilities for software vendors and developers leading to a wide array of innovative applications and new experiences that benefit from massively parallel processing. There is a resultant need for education and training of the university community which this book will meet.”

“We are seeing increasing demand for reference resources about common APIs,” said Todd Green, senior acquisitions editor of Morgan Kaufmann. “Application development across the PC, tablet and smartphone markets are red hot in terms of reader interest. We thank AMD and Northeastern University for shedding light on the common platforms and parallel computing movement; it’s a must-read book for every developer.”

The book was co-authored by several industry and academic leaders from AMD and Northeastern University, including:

  • Benedict Gaster, OpenCL architect, AMD
  • Lee Howes, member of technical staff, AMD
  • David R. Kaeli, director of the Northeastern University Computer Architecture Research Laboratory (NUCAR), co-leader of the Northeastern University Institute for Information Assurance (IIA) and associate dean of Undergraduate Programs in the College of Engineering at Northeastern University
  • Perhaad Mistry, Ph.D Student, Department of Electrical and Computer Engineering, Northeastern University
  • Dana Schaa, Ph.D Student, Department of Electrical and Computer Engineering, Northeastern University

Heterogeneous Computing with OpenCL is expected to be available in print and electronic formats in August 2011 from many major booksellers. The book provides detailed examples that illustrate the power and elegance of OpenCL to handle image processing, web plugins, random number generation, video processing and more.

Resources

Hardware and Software Leaders Fulfill Promise of Brilliant Experiences and New PC Capabilities with AMD A-Series APU Technology [June 14, 2011]

AMD (NYSE: AMD) today announced growing support for the AMD Fusion Family of Accelerated Processing Units (APUs) with more than 50 leading applications now accelerated by AMD Fusion APUs. With today’s launch of the new AMD A-Series APUs, AMD unleashes unprecedented levels of performance in mobile and small form factors, with outstanding battery life. From software vendors and developers to motherboard suppliers, AMD’s APU ecosystem is basing hardware and software development on the new AMD A-Series APUs to help bring innovative new devices and applications to market. The APU is enabling new user experiences, for example, making video more life-like and enabling notebooks to achieve “supercomputer-like” performance.

“AMD’s APU architecture gives developers a new set of tools with which they can build exciting applications,” said Nathan Brookwood, research fellow at Insight 64. “Developers who best exploit these new capabilities will help position their organizations for dramatic success.”

“Our developer community is embracing the AMD Fusion APU platform with wonderful creativity and initiative,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “We’re only at the beginning of a wave of innovation that’s powered by our APU technology. With forward thinking from leading software developers and device manufacturers, we are creating the next generation of computing experiences.”

New, Differentiated Applications

Dozens of today’s most popular software applications are accelerated by AMD APU technology, many of which are being showcased this week at the AMD Fusion Developer Summit in Bellevue, Washington. These applications span a wide range of PC and tablet user scenarios, including multimedia, gaming, productivity, web browsing, facial recognition, video conferencing and more.

Following is a sample of leading software and online content providers offering vivid computing experiences that are accelerated by AMD A-Series APUs:

“Our customers expect the ultimate viewing experience from their Storm media player,” said Tom Yang, chief technology officer, BaoFeng, Inc. “We optimized our application with AMD Fusion APU technology to continue to deliver outstanding performance. Now, hundreds of millions of users receive just that – clear, smooth and incredibly vivid video from BaoFeng, a leading high-definition media player company in China with 180M users.”

Industry-Leading Infrastructure Partners

AMD motherboard partners are also continuing to innovate around AMD Fusion APUs, as leading original design manufacturers (ODMs), including ASUS, ASRock, Biostar, ECS, Foxconn (Hong Hai Precision), Gigabyte, Jetway, MSI and Sapphire, are either shipping or have announced integrated APU/motherboard products featuring AMD Fusion technology.

AMD Vision Engine Software

AMD VISION Engine Software uniquely differentiates AMD APU-based PCs. This exclusive software suite includes the AMD software driver that controls graphics and display, the AMD Vision Engine Control Center, and an OpenCL driver. AMD Vision Engine offers graphics and video features enabling DirectX11 gaming, dynamic contrast, edge enhancement and vibrant colors to help videos and visuals look more life-like. This software set also includes AMD Steady Video, enabling advanced image post processing technology to help stabilize shaky images during real-time playback of streaming videos1.

Resources

AMD Celebrates Innovation with VISIONary of the Year Award Winners [June 14, 2011]

AMD (NYSE: AMD) today announced the AMD OpenCL™ Coding Competition, being run by software development leader TopCoder. This contest is intended to encourage the creation of applications that take advantage of OpenCL™ as well as the award-winning AMD Fusion accelerated processing unit (APU) architecture. The OpenCL™ Coding Competition is open to software developers with great ideas, and up to $50,000 in prizes will be awarded to winning submissions.

“We’re at an inflection point in the computing industry with evolving chip architectures and the shift to common programming interfaces and industry standards, which enable developers to enable amazing new experiences,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The OpenCL Coding Competition is just the beginning of a new wave of application development by the software community as they embrace heterogeneous computing across multiple platforms.”

AMD Accelerated Parallel Processing (APP) technology (formerly ATI Stream) is a set of advanced hardware and software technologies that support OpenCL and enable highly parallel compute-capable GPUs to work in concert with a system’s CPU to accelerate applications beyond traditional x86 graphics and video processing. AMD Fusion APUs combine multi-core x86 technology with a discrete-level DirectX® 11-capable GPU in a single processor design, connected by a high speed link, to deliver up to 500 gigaflops of compute performance.1

Developers and students who choose to participate will be asked to submit an abstract that outlines how they plan to use the latest generation AMD APP software development kit (SDK) with OpenCL support to create an accelerated application for the AMD Fusion APU platforms.

Contestants can choose to create an application in any category including, but not limited to, the following:

  • Video Processing
  • Image Processing
  • Security
  • Human Computer Interface
  • Data Mining
  • Gaming
  • Physics processing
  • Social Networking / Communication
  • Other

“We see APU architecture continuing to be widely adopted for new computing designs, and believe that developers will want to build and optimize their applications around the high performance achieved with these new hardware platforms,” said Matt Murphy, TopCoder platform manager. “This technology shift signifies a sizeable opportunity for developers around the world who want to be early to embrace a new era of heterogeneous computing.”

In addition to the SDK, contestants will need the latest AMD Catalyst™ drivers that include the OpenCL runtime compiler. Released in May 2011, the latest AMD Catalyst drivers for Windows and Linux also bring new features, including expanded support for multi-display environments through AMD Eyefinity technology, which developers can leverage to create even more immersive experiences for end users.

For full details and a complete set of Official Rules for the AMD OpenCL™ Coding Competition, please visit http://community.topcoder.com/amdapp/

Resources

AMD and Leading Software Vendors Continue to Expand Offerings Optimized for OpenCL™ Standard  [June 8, 2011]

AMD (NYSE: AMD) today announced increasing industry adoption of the OpenCL™ standard across a broad range of innovative software applications. As a long-standing proponent of industry standards, AMD works closely with leading software companies to help optimize their applications across common platforms, while accelerating these solutions with the latest technology offerings, including AMD Fusion Accelerated Processing Units (APUs).

“Software developers can benefit significantly from working with common programming interfaces to harness the outstanding performance of innovative, heterogeneous technology like AMD Fusion APUs across platforms,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “The software industry continues to advance at breakneck speed with an ever increasing number of innovative applications that are coming to market, which are based on common platforms such as OpenCL, OpenGL and DirectCompute.”

As software developers embrace common application programming interfaces (APIs), the industry is seeing a groundswell of consumer and commercial applications built on the OpenCL standard, thanks to its inherent flexibility across platforms, operating systems and vendor hardware.

“Today’s creative professional needs a complete solution that delivers clear, crisp and stutter-free visuals that will allow them to edit, process and create content quickly and without interruption,” said Dave Chaimson, vice president of global marketing, Sony Creative Software. “New support has been added to Vegas Pro 10.0d for accelerated OpenCL based video rendering. We see this as a solid first step towards a faster production workflow for video professionals, and we are strongly committed to the OpenCL standard.”

HP Labs also is working with AMD to implement OpenCL acceleration of real-time imaging software for HP large-format, commercial and industrial printing solutions. “Innovative, leading-edge technology is key to providing the best possible support to HP’s commercial printing customers,” said I-Jong Lin, principal scientist, Print and Content Delivery, HP Corporate Research Laboratory. “The application of GPU acceleration in raster image processing has enabled a breakthrough in commercial printing solutions, and we anticipate replicating that success across market segments by porting our OpenPL library to OpenCL standards.”

Following is a sample of leading applications that already support OpenCL or will support it in the near future:

DVD/Media Players

  • ArcSoft, TotalMedia® Theatre – All-in-one video playback software
  • Corel WinDVD® – Blu-ray™ and DVD player software

Telepresence and Webcam Apps

  • ArcSoft, Webcam Companion® – Application bundle with HD and 3D support for web cameras
  • ViVu VuRoom – Multi-party desktop videoconferencing software
  • ViVu VuCast – Large-scale video webcast software

Video Creation/Editing Software

  • ArcSoft, ShowBiz® – Video editing software
  • Corel Digital Studio™ – integrated multimedia software suite
  • Corel VideoStudio® Pro – HD video-editing software
  • Cyberlink PowerDirector – Video editing software
  • Sony, Vegas Movie Studio HD – Home studio solutions for HD video editing
  • Sony, Vegas Pro – Professional solutions for HD video, audio and Blu-ray™ Disc creation

Video, Photo Effects, Imaging and Utilities

  • ArcSoft, Panorama Maker Pro – Photo and video stitch plus media manager
  • eyeon, Fusion® – Visual effects and compositing tool
  • HP Labs, “Every Page Is Different” raster image processing and giga-pixel real-time imaging for HP large-format, commercial and industrial printing solutions
  • Viewdle, Uploader® – Facial recognition software for photography formats
  • Viewdle, Video SDK – Facial recognition software kit for video development

Video Transcode Software

  • ArcSoft, MediaConverter – Multimedia file converter
  • Rovi, MainConcept® Transcoding Platform – Professional transcoding applications
  • Rovi, MainConcept® H.264/AVC OpenCL – Encoding Software Development Kit

Engineering Simulation Software

  • Altair Engineering, HyperWorks RADIOSS – Finite element analysis (FEA) solver for linear and non-linear simulations
  • Dassault Systemes, PLM (Product Lifecycle Management) – Simulation and CAD software
  • DEM Solutions, EDEM – Discrete element modeling software solutions for particle flow simulation
  • ESI Group, PAM-CRASH and PAM-STAMP 2G solvers – Digital simulation software for prototyping and manufacturing processes
  • MSC Software, MSC Nastran – General purpose finite element analysis solution
  • OPTIS, RTLab and VRLab – Real-time ray-tracing software solutions

A sampling of these applications will be demonstrated in the Experience Zone at the AMD Fusion Developer Summit to take place June 13-16 in Bellevue, Washington. Summit participants will be able to engage in interactive sessions and hands-on labs to deepen their knowledge of advanced CPU and GPU programmability, and gain a better understanding of how software applications can take full advantage of the parallel processing power of APUs, bringing supercomputer-like performance to everyday computing tasks.

Resources

AMD Fusion Accelerated Processing Units Win 2011 Best Choice of COMPUTEX TAIPEI Award [May 24, 2011]

MD (NYSE: AMD) is awarded today with the highest industry honor, “2011 Best Choice of Computex TAIPEI Award” for its Fusion Accelerated Processing Units (APUs) in the Computer & System category. The award is given by Taipei Computer Association, key player in IT industry and exhibition in Taiwan, and appraised by a panel of government representatives, academicians, research analysts, oversea media, editor-in-chiefs and industry experts.

AMD Fusion APUs offer a brand-new approach to processor design and better address users’ needs to handle more demanding workloads and visual computing in a small form factor device with long battery life. Only AMD Fusion APUs are engineered to deliver powerful CPU and GPU compute capabilities in a single-die processor for today’s HD video, 3D and data-intensive workloads for anyone looking for a richer visual computing experience whenever, wherever they want.

“We are honored to receive this prestigious award from the Taipei Computer Association, which is a manifestation of our efforts and excellence in AMD Fusion APUs,” said Andy Tseng, AMD Corporate Vice President and Taiwan General Manager. “AMD Fusion APUs are already widely recognized within the industry for being creative and innovative. This award proves the importance of listening to our customers and designing breakthrough products around their needs.”

Best Choice of COMPUTEX TAIPEI Award has recognized achievements in product design and technology innovation since 2002; it’s one of the important official events during COMPUTEX TAIPEI, the second largest ICT exhibition worldwide. Through reviews, the jury selected outstanding design and cutting-edge technology across 10 product categories.

AMD and other awarded products will be demonstrated at Best Choice Award Pavilion by Taipei Computer Association at the upcoming 2011 Computex Exhibition. In addition, AMD’s products showcase will be located at Booth# L0617 in the TWTC Nangang Exhibition Hall. For more information on AMD 2011 Computex, please visit our event portal.

For developers interested in learning more about APUs and heterogeneous computing, AMD will be holding its first AMD Fusion Developer Summit (AFDS) from June 13-16 in Bellevue, Washington. Summit participants will be able to engage in interactive sessions and hands-on labs to deepen their knowledge of advanced CPU and GPU programmability, and gain a better understanding of how software applications can take full advantage of the parallel processing power of APUs, bringing supercomputer-like performance to everyday computing tasks.

Additional Resources

AMD Fusion APU Receives “Best in Show” Award at Embedded Systems Conference [May 11, 2011]

AMD (NYSE: AMD) announced the AMD Embedded G-Series APU was named “Best in Show” for hardware at the Embedded Systems Conference by the industry analyst firm VDC Research, which has been presenting the Embeddy Awards at ESC for seven years running. The primary criteria for the hardware category are an enabling product that offers new innovation and new or significantly better functionality.

“We selected the AMD Embedded G-Series processor because it is an integrated circuit that combines a low-power CPU and a discrete-level GPU into a single embedded Accelerated Processing Unit (APU) for advanced graphics and multi-media integration,” said Richard Dean, program manager, VDC Research. “Among the benefits are the integration of the APU, which reduces the foot print size of a three-chip platform to two chips, and the overall reduction in costs across the product’s lifecycle.”

“Embedded Systems Conference showcases the best of the best in our industry and it’s very gratifying that a product we feel can change the dynamics of the industry has been recognized as the top hardware product this year,” said Buddy Broeker, director, Embedded Solutions, AMD. “The AMD Embedded G-Series platform represents a major advancement for the capabilities of embedded systems and yet still enables reduction of the key thresholds of power, area and costs. This is a trend that AMD expects to continue in the years to come.”

AMD is the only company in the industry today providing a complete roster of CPUs, chipsets, discrete GPUs, and APUs with the features and support to meet embedded system requirements.

Additional Resources

New AMD Embedded G-Series APUs Provide Thirty Nine Percent Power Reduction for Fanless Designs [May 23, 2011] (emphasis is mine)

AMD (NYSE: AMD) today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions1. The very low power consumption and small 361mm² package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 “Bobcat” CPU cores and a discreet class DirectX® 11-capable GPU on a single die.

“We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement,” said Buddy Broeker, director, Embedded Solutions, AMD. “System designers can now unleash their creativity without being constrained by heat or size issues.”

A fanless solution is crucial for many small embedded systems where the added cost for an active cooling system can be prohibitive or for environments where silent operation is a key requirement. Additionally, many embedded products are deployed in harsh environmental conditions where the presence of a fan represents a potential failure point for the system. The AMD Embedded G-Series platform provides enterprise-class features and performance with the reliability, cost- and power-efficiencies these systems require.

Systems based on the new low power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE. Additional customers are expected to bring new products to market in the coming quarters.

Additional Resources: