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AMD 2012-13: a new Windows 8 strategy expanded with ultra low-power APUs for the tablets and fanless clients
AMD Strategy Transformation Brings Agile Delivery of Industry-Leading IP to the Market [AMD press release, Feb 2, 2012]
At its annual Financial Analyst Day, AMD (NYSE: AMD) detailed a new “ambidextrous” strategythat builds on the company’s long history of x86 and graphics innovation while embracing other technologies and intellectual property to deliver differentiated products.
AMD is adopting an SoC-centric roadmap designed to speed time-to-market, drive sustained execution, and enable the development of more tailored customer solutions. SoC design methodology is advantageous because it is a modular approach to processor design, leveraging best practice tools and microprocessor design flows with the ability to easily re-use IP and design blocksacross a range of products.
“AMD’s strategy capitalizes on the convergence of technologies and devices that will define the next era of the industry,” said Rory Read, president and CEO, AMD. “The trends around consumerization, the Cloud and convergence will only grow stronger in the coming years. AMD has a unique opportunity to take advantage of this key industry inflection point. We remain focused on continuing the work we began last year to re-position AMD. Our new strategy will help AMD embrace the shifts occurring in the industry, marrying market needs with innovative technologies and become a consistent growth engine.”
Roadmap Updates Focus on Customer Needs
Additionally, AMD today announced updates to its product roadmaps for AMD Central Processing Unit (CPU) and Accelerated Processing Unit (APU) products it plans to introduce in 2012 and 2013. The roadmap modifications address key customer priorities across form factors including ultrathin notebooks, tablets, all-in-ones, desktops and servers with a clear focus on low power, emerging markets and the Cloud.
AMD’s updated product roadmap features second generationmainstream (“Trinity”) and low-power (“Brazos 2.0”) APUs for notebooks and desktops; “Hondo,” an APU specifically designed for tablets; new CPU cores in 2012 and 2013 with “Piledriver” and its successor “Steamroller,” as well as “Jaguar,” which is the successor to AMD’s popular “Bobcat” core. In 2012, AMD plans to introduce four new AMD Opteron™ processors. For a more in-depth look at AMD’s updated product roadmap, please visit http://blogs.amd.com.
Next-generation Architecture Standardizes and Facilitates Software Development
AMD also provided further details on its Heterogeneous System Architecture (HSA), which enables software developers to easily program APUs by combining scalar processing on the CPU with parallel processing on the Graphics Processing Unit (GPU), all while providing high bandwidth access to memory at low power. AMD is proactively working to make HSA an open industry standard for the developer community. The company plans to hold its 2nd annual AMD Fusion Developer Summitin June, 2012.
New Company Structure Strengthens Execution
In conjunction with announcing its restructuring plan in November 2011, AMD has strengthened its leadership team with the additions of Mark Papermaster as senior vice president and chief technology officer, Rajan Naik as senior vice president and chief strategy officer, and Lisa Su as senior vice president and general manager, Global Business Units. These executives will help ensure that sustainable, dependable execution becomes a hallmark of AMD.
Supporting Resources
- Visit the AMD Financial Analyst Day websitefor webcast replay, presentations, updated roadmap, and more
- Visit AMD Blogsfor more details on AMD’s product roadmap changes
- Follow AMD on Twitter at @AMD_Unprocessed
- Like AMD on Facebook
AMD started talking about ‘Trinity’ and ‘Hondo’ last summer. See in Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]
What AMD could definitely be proud of for 2011 is A “Brazos” Story: The Little Chip That Could (And Then Just Kept On Going) [AMD Fusion blog, Feb 1, 2012]:
In late 2010, AMD shipped its first-ever Accelerated Processing Units (APUs), internally codenamed “Brazos,”which combined the tremendous processing power of graphics and x86 on a single chip.
We had high expectations for the low-voltage “Brazos” APU: great computing, HD, long battery life and DirectX 11 capable graphics, all on a single chip. Yet still we were blown away by the initial industry reception. It was only a year ago we left CES with seven highly-sought after innovation and technology awardsfor the little product we ultimately named the C- and E-Series APUs, including:
- 2010 PC Magazine Technical Excellence Award
- CES 2011 Design & Engineering Innovations Award
- CHIP China 2010 Highlight Awards
- Computer World China Innovation Award
- Notebooks.com Best Innovation CES 2011
- Popular Mechanics Editors’ Choice Award
- Shopping Guide China Most Advanced Digital Product Award
After CES we should have re-nicknamed “Brazos” the “Little Chip That Could.” And all throughout 2011, “Brazos” kept on chugging. We added the “Best in Show” Award at Embedded Systems Conference and the “2011 Best Choice of Computex TAIPEI Award” to the list of accolades. In the second quarter we sold more than five million C- and E-Series APUs. What a tremendous start to a new way of processing for AMD and the industry.
But “Brazos” kept on impressing, showing up in a variety of form factors – notebooks, netbooks, small desktops and all-in-ones– from top global OEM partners.
So it was no surprise or mistake that we ended 2011 with more than 30 million APUs shipped. It all started with little “Brazos,” which has now earned its place in history as AMD’s fastest ramping platform ever.
John Taylor, Director of Worldwide Product Marketing at AMD
CES 2012 Consumer Showcase Tour [amd, Jan 11, 2012]
AMD Codename Decoder – November 9, 2010 [AMD Business blog]
APU
An APU is an accelerated processing unit, a new generation of processors that combine either low-power or high-performance x86 CPU cores with the latest GPU technology (such as DirectX® 11) on a single die.
Planned for introduction: Q1 2011
…
“Bobcat”
Market: Multiple devices, including notebooks ultrathins, HD netbooks and small form factor desktops.
What is it? A sub-one watt capable x86 CPU core that first comes to market in the “Ontario” and “Zacate” Accelerated Processing Units (APU) for mainstream, ultrathin, value, and netbook form factors as well as small form factor desktop solutions. “Bobcat” is designed to be an extremely small, highly flexible, out-of-order execution x86 core that easily can be scaled up and combined with other IP in SoC configurations.
Planned for introduction: Q1 2011
“Brazos”
Markets: Value Mainstream Notebooks, HD Netbooks and Small Form Factor Desktops
What is it? “Brazos” is AMD’s 2011 low-power platform, available with two APUs; “Zacate” – currently planned to be marketed as the E Series – is an 18-watt TDP APU for ultrathin, mainstream and value notebooks as well as desktops and all-in-ones. “Ontario” – currently planned to be marketed as the C Series – is a 9-watt
APU for netbooks and small form factor desktops and devices. Both “Brazos” platform APUs include a DirectX® 11-capable GPU.
Planned for introduction: Q1 2011
“Bulldozer”
Market: Server and Client
What is it? A multi-threaded high-performance x86 CPU core contained in the “Zambezi” processor for client PCs and “Interlagos” and “Valencia” processors for servers. Included in the “Scorpius” enthusiast desktop PC platform and “Maranello,” “Adelaide,” and “San Marino” server platforms, “Bulldozer” is designed to be a completely new, high performance architecture that employs a new approach to multithreaded compute performance for achieving advanced efficiency and throughput. “Bulldozer” is designed to give AMD an exceptional CPU option for linking with GPUs in highly scalable, single-chip APU configurations. “Bulldozer” offers AMD another exceptional CPU option for combining with GPUs in highly scalable, single chip APU configurations, beginning in 2012 APU designs.
Planned for introduction: Client (1H 2011); Server (2H 2011)
…
“Llano”
Market: Notebooks and Desktops
What is it? Part of the “Sabine” platform, “Llano” is a 32nm APU including up to four x86 cores and a DirectX® 11-capable GPU, primarily intended for performance and mainstream notebooks and mainstream desktops. “Llano” is engineered to deliver impressive visual computing experiences, outstanding performance with low power and long battery life.
Planned for introduction: Mid-2011
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“Ontario”
Market: Primarily ultrathin notebooks and HD netbooks
What is it? A 9W APU featuring dual or single “Bobcat” x86 cores currently planned to be marketed as the C Series, and primarily intended to serve the low power and highly portable PC markets for netbooks and small form factor desktops and devices.
Planned for introduction: Q1 2011
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“Zacate”
Market: Notebook/Desktop
What is it? “Zacate” is AMD’s 18W APU designed for the mainstream notebook and desktop market. Zacate will feature low-power “Bobcat” CPU cores and support DirectX 11 technology.
Planned for introduction: Q1 2011
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More information about 2011 AMD APU past on this blog:
– Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]
– Supply chain battles for much improved levels of price/performance competitiveness [Aug 16, 2011]
– Acer & Asus: Compensating lower PC sales by tablet PC push [March 29 – Aug 2, 2011]
– CES 2011 presence with Microsoft moving to SoC & screen level slot management that is not understood by analysts/observers at all [Jan 7, 2011]
– Changing purchasing attitudes for consumer computing are leading to a new ICT paradigm [Jan 5, 2011]
AMD 2012 APU, code name “Trinity” [amd, Jan 11, 2012]
AMD started talking about ‘Trinity’ last summer. See in Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]
Advanced Micro Devices’ CEO Discusses Q4 2011 Results – Earnings Call Transcript [Seeking Alpha, Jan 24, 2012]
We are seeing particularly strong customer interest in our expanded low-power APUs for 2012. The low-power versions of our next-generation chip, Trinity APU, delivers mainstream performance while using half the power of our traditional notebook processor. This processor fits into an ultrathin notebook design, as thin as 17 millimeters, providing industry-leading visual performance and battery life at very attractive price points. Trinity remains on track to launch for midyear.
…
We achieved record quarter client revenue driven by an increase in supply of Llano APUs. And in Q4 of 2011, APUs accounted for nearly 100% of mobile microprocessors shipped and more than 60% of the total client microprocessors shipped. Microprocessor ASP increased sequentially due to an increase in mobile microprocessor ASP and an increase in server units shipped.
There is no doubt that the customer acceptance of our APU architecture is quite strong. We’ve now shipped over 30 million of these APUs to date. And we’re seeing a strong uptake in terms of that architecture, what it means to the customer. They are looking for a better experience, and I think that’s a key reason why we’ve seen the momentum in our business and the ability to deliver on that. Our focus on execution around the APUs and around Llano is definitely paying off. And I think as we move forward, we should be able to continue to build on that momentum.
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We’ve actually increased our Llano 32-nanometer product delivery by 80% from the third quarter, and now Llano makes up almost 60% of the mobile microprocessing revenue. … We’re going to continue to build on the strong relationships that we’ve been developing with GLOBALFOUNDRIES as we move forward.
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The movement to thin and light is nothing new. Customers want mobility. And the idea of ultrathin is something that we’re very focused on. And if you think about it with our APU strategy that I mentioned, with the next-generation product, Trinity APU, we already are well ahead of the pace last year when we set a record-setting year for design wins with the Trinity product in 2012. With that product, we can deliver ultrathin in the range of 17 millimeters. And what’s really important and I think we have to all focus on is ultrathin and mobility, the ability for computing to reach customers across the planet. … And I’ll add that the improvements that we’ve made in Trinity in both our CPU and the GPU are really delivering outstanding results in performance per watt. So as well for the ultrathins being able to hit the 17-millimeter low-profile, we’re also getting a doubling of the performance per watt. So it’s an exciting application of our APU technology.
…
… as you think of the industry trends around consumerization, cloud and convergence, there’s no doubt, as we’ve seen these kinds of inflection points in the industry, there’s always a significant downward pressure in terms of the price points. So if you’re dragging huge asset base along with you and there comes pressure into the market around those price points, that could put pressure into their [Intel’s] — into a business model. … We think the emerging market and the entry — and the high-growth markets around entry and mainstream will be the hottest segment, and I think that’s playing to our hand. We’re going to emphasize this strategy. We want to embrace this inflection point that’s emerging. We want to accelerate it, because shift happens when there’s these inflecting points.
Of course, we see the investment of our competitor, but the fabless ecosystem is not sitting still. And if you look at the investments that are done on their — TSMC, at a GLOBALFOUNDRIES and a GLOBALFOUNDRIES and alliances level, then the numbers are very comparable. GLOBALFOUNDRIES and their partnership models invest about $9 billion this year. TSMC seeds around $6 billion, if I recall the number correctly. So this is, in terms of scale and absolute numbers, are very comparable to what Intel is putting on the table.
… I feel pretty good about where we are in terms of the transition around 32 nm. … And I want to emphasize, we’ve made real progress, but we’re not finished with that. And we need to continue to work every day with those tiger teams we’ve put in place. We’re tracking the test vehicles through the lines to make sure that we’re getting that consistent improvement, because that will reduce our consumption of wafers and give us far more flexibility in our supply chain. So while we have improved by 80% from the third quarter, we’re not all the way there yet … there’s more yield improvements possible on that 32-nanometer line. … And those same techniques and practices that the teams — the tiger teams applied on 32-nanometer, that momentum continues in the 28-nanometer. And so that poises us well going into the coming 2012.
… I think it’s fair to say from the improvements we have seen and the — and our foundry partners that we are not going to be supply-constrained in the first quarter. … I think the progress we have seen on Trinity has impressed us. And of course, all the learnings that have been done on 32-nanometer with the Llano product will be transferred to Trinity. So the start-off pace with Trinity is going to be significantly better from a yield perspective compared to where we were at Llano launch. So that makes us quite optimistic looking forward.
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Here are also a couple of illustrations highlighting that 2011 APU success with the details of new APU strategy additions from Lisa Su‘s (Senior Vice President and General Manager, Global Business Units) presentation for the 2012 Financial Analyst Day held on February 2, 2012 (see her full presentation in PDF):
APUs BRING LEADERSHIP GRAPHICS/COMPUTE IP TO MAINSTREAM [#10]
2011: AMD first to introduce heterogeneous computing to mainstream applications
“Llano” APU offers nearly 3X the performance in the same power envelope over conventional CPUs (2)
Fully leverages the growing ecosystem of GPU-accelerated apps
Source: AMD Performance labs
(1) Testing performed by AMD Performance Labs. Calculated compute performance or Theoretical Maximum GFLOPS score for 2013 Kaveri (4C, 8CU) 100w APU, use standard formula of (CPU Cores x freq x 8 FLOPS) + (GPU Cores x freq x 2 FLOPS). The calculated GFLOPS for the 2013 Kaveri (4C, 8CU) 100w APU was 1050. GFLOPs scores for 2011 A-Series “Llano” was 580 and the 2013 [2012] A-Series “Trinity” was 819. Scores rounded to the nearest whole number.
(2) Testing performed by AMD Performance Labs. Calculated compute performance or Theoretical Maximum GFLOPS score (use standard formula of CPU Cores x freq x 8 FLOPS) for conventional CPU alone in 2011 was 210 GFLOPs while the calculated GFLOPs for the 1st Gen APU using standard formula (CPU Cores x freq x 8 FLOPS) + (GPU Cores x freq x 2 FLOPS) was 580 or 2.8 times greater compute performance.
Related new codenames (from the AMD provided At-a-Glance Codename Decoder [Feb 2, 2012]):
“Trinity” APU (Traditional Notebooks, Ultrathin Notebooks and Desktops)
- “Trinity” is AMD’s second generation APU and improves the power and performance of AMD’s A-Series APU lineup for mainstream and high-performance notebooks and desktops. “Trinity” will feature next-generation “Piledriver” CPU cores and new, DirectX® 11-capable, second generation AMD Radeon™ HD 7000 series graphics.
- New for 2012, AMD will offer a BGA or pin-less format, low power “Trinity” APU specifically designed for ultrathin notebooks.
- Planned for introduction: Mid-2012
“Piledriver” Core Micro Architecture
- “Piledriver” is the next evolution of AMD’s revolutionary “Bulldozer” core architecture.
- The “Trinity” line-up of APUs will be the first introduction of “Piledriver.”
“Kaveri” APU (Notebooks and Desktops)
- “Kaveri” is AMD’s third generation APU for mainstream desktop and notebooks.
- These APUs will include “Steamroller” cores, and new HSA-enabling features for easier programming of accelerated processing capabilities.
- Planned for introduction: 2013
“Steamroller” Core Micro Architecture
- “Steamroller” is the evolution of AMD’s “Piledriver” core architecture.
AMD OPTERON™ FUTURE TECHNOLOGY [#26]
Additional new codename (from the AMD provided At-a-Glance Codename Decoder):
“Excavator” Core Micro Architecture
- “Excavator” is the evolution of AMD’s “Steamroller” core architecture.
APU ADOPTION: RECORD DESIGN WINS, STRONG END-USER DEMAND [#11]
Shipped > 30m APUs to date
11 of the world’s top 12 OEMs shipping AMD APU-based platforms
“Brazos” APUs shipped more units in its first year than any previous mobile platform in AMD history
“Llano” APUs ramped to represent nearly 60% of mobile processor revenue by Q4 2011
Additional new codenames (from the AMD provided At-a-Glance Codename Decoder):
“Southern Islands” Discrete Graphics
- Internal codename for the entire family of desktop graphics ASICs based on Graphics Core Next architecture and utilizing 28nm process technology.
- “Southern Islands” products include “Tahiti” (AMD Radeon™ HD 7900 series), “Pitcairn,” “Cape Verde” and “New Zealand.”
“Brazos 2.0” APU (Essential Desktop and Notebook, Netbook, All-In-One and Small Desktop)
- The “Brazos 2.0” family of APUs will follow “Brazos”, AMD’s fastest ramping platform ever.
- In addition to increased CPU and GPU frequencies, “Brazos 2.0” will offer additional features and functionality as compared to “Brazos”.
- Planned for introduction: H1 2012
“Hondo” APU (Tablet)
- “Hondo” is AMD’s sub-5W APU designed for tablets. “Hondo” will feature low-power “Bobcat” CPU cores and support DirectX® 11 technology in a BGA or pin-less format.
- Planned for introduction: H2 2012
AMD started talking about ‘Hondo’ (as well as ‘Trinity’) last summer. See in Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]

(3) Projections and testing developed by AMD Performance Labs. Projected score for 2012 AMD Mainstream Notebook Platform “Comal” on the “Pumori” reference design for PC Mark Vantage Productivity benchmark is projected to increase by up to 25% over actual scores from the 2011 AMD Mainstream Notebook Platform “Sabine”. Projections were based on AMD A8/A6/A4 35w APUs for both platforms.
(4) Projections and testing developed by AMD Performance Labs. Projected score for the 2012 AMD Mainstream Notebook Platform “Comal” the “Pumori” reference design for 3D Mark Vantage Performance benchmark is projected to increase by up to 50% over actual scores from the 2011 AMD Mainstream Notebook Platform “Sabine”. Projections were based on AMD A8/A6/A4 35w APUs for both platforms.
(5) Testing performed by AMD Performance Labs. Battery life calculations using the “Pumori” reference design based on average power draw based on multiple benchmarks and usage scenarios. For Windows Idle calculations indicate 732 minutes (12:12 hours) as a resting metric; 421 minutes (7:01 hours) of DVD playback on Hollywood movie, 236 minutes (3:56 hours) of Blu-ray playback on Hollywood movie, and 205 minutes (3:25 hours) using 3D Mark ‘06 as an active metric.
Projections for the 2012 AMD Mainstream Platform Codename “Comal” assume a configuration of “Pumori” reference board, Trinity A8 35W 4C – highest performance GPU, AMD A70M FCH, 2 x 2G DDR3 1600, 1366 x 768 eDP Panel / LED Backlight, HDD (SATA) – 250GB 5400rpm, 62Whr Battery Pack and Windows 7 Home Premium.
Additional new codenames (from the AMD provided At-a-Glance Codename Decoder):
“Sea Islands” Graphics Architecture
- New GPU Architecture and HSA Features
- Planned for introduction: 2013
“Kabini” APU (Essential Desktop and Notebook, Netbook, All-In-One and Small Desktop)
- The “Kabini” APU is AMD’s second generation low-power APU and follow-on to “Brazos 2.0.”
- In addition to new “Jaguar” cores, these APUs will be enhanced with new Heterogeneous Systems Architecture (HSA), enabling features for easier programming of accelerated processing capabilities.
- Planned for introduction: 2013
“Temash” APU (Tablet and Fanless Client)
- The “Temash” APU is AMD’s second generation tablet APU and follow-on to “Hondo.”
- In addition to new “Jaguar” cores, these APUs will be enhanced with new Heterogeneous Systems Architecture-enabling features for easier programming of accelerated processing capabilities.
- Planned for introduction: 2013
“Jaguar” Core Micro Architecture
- “Jaguar” is the evolution of AMD’s “Bobcat” core architecture for low-power APUs.
MOBILE MARKET PROJECTIONS [#29] AMD Direction:
Focus on true productivity and user experience in ultra-low power devices
Leadership graphics, web applications and video processing leveraging APUs
Agile, flexible SoC designs
Ambidextrous solutions across ISAs and ecosystems
Fanless, sealed designs
These APU related strategic moves have been summarized by the same John Taylor as Strengthening our Client Roadmap [AMD Fusion blog, Feb 2, 2012]:
Roadmaps signify our plans to customers and business partners, outlining the new products and technologies that we are bringing online. In an ideal world plans would never change. But in reality, change is a certainty in the tech industry – new form factors immerge, technologies and applications shift and consumer tastes remake technology plans.
Like any technology company, AMD desires to anticipate change in the industry. So we course-correct as we work with customers to ensure that we create products that address the optimal blend of timing, features and performance, cost and form factors.
Today at our Financial Analyst Day in Sunnyvale, AMD senior staff detailed how AMD will focus its investments in R&D and marketing going forward, including roadmaps for 2012-2013. As Phil Hughes summarized, the announced roadmaps are designed to extend platform longevity, accelerate time to market and enhance performance and features. These roadmaps strengthen AMD’s ability to make the most of shifting market dynamics, all the while giving stand-out experience across device categories through our graphics and video IP. This blog provides some insight into our 2012 and 2013 roadmaps – the words in quotes are the codenames for the particular AMD processor offerings discussed today.
2012 Client Roadmap
AMD’s “Brazos 2.0” Accelerated Processor Unit (APU) family will be used for essential desktop and notebook, netbook, tablet, all-in-one and small desktop form factors. This allows us to address a fast-growing segment of the PC market where we have proven success with the original “Brazos” line-up – the C-Series, E-Series and Z-SeriesAPUs. We will add plenty of new features to the “Brazos 2.0” APU family, including increased CPU and GPU performance, longer battery life, a bevy of integrated I/O options and improvements to AMD Steady Video technology. “Brazos 2.0” is scheduled to hit the market in the first half of 2012.
As we demoed at CES, AMD’s “Trinity” APU for desktop and notebook remains on track for introduction in mid-2012, with plans to pack up to four “Piledriver” CPU cores and next-generation DirectX® 11-capable graphics technology, together delivering up to 50% more compute performance than our “Llano” offerings, including superior entertainment potential, longer battery-life and an even more incredibly brilliant HD visual experience.
New for 2012, AMD will introduce a low voltage “Trinity” APU that will be ideal for the next-generation of ultrathin notebook. This “Trinity” APU matches the experience enabled by the AMD 2011 APU in up to half the TDP. As we said, “Trinity” is on track for introduction in mid-2012.
In 2012 we will also introduce the ultra-low voltage “Hondo” APU for tablets. These low-power (power maxes out at 5W TDP) APUs will have “Bobcat” CPU cores and support DirectX 11 technology in a BGA or pin-less, thin processor package. Look for these in the second half of 2012 – more details to come later.
On the desktop platform side of things, the “Vishera” CPU will replace the “Komodo” CPU for desktop. This change enables accelerated time to market for improved performance and next-generation CPU features while maintaining the existing AM3+ motherboards. The “Vishera” CPU ushers in many exciting updates, includes 8 “Piledriver” cores, and when compared with the previous generation, provides higher frequencies, improved instruction per clock performance, advanced instruction sets (thus increasing application performance), additional DDR3 memory support and next-generation AMD Turbo Core Technology. We plan to launch “Vishera” in the second half of 2012.
2013 Client Roadmap
2013 brings major evolution to the client roadmaps as the vision presented by Rory, Mark and Lisa today begin to manifest – including moving our low power APUs to a system on a chip (SoC) design with the AMD Fusion Controller Hub integrated right into a single chip design.
In the performance APU category our third-generation APU, “Kaveri,”will employ “Steamroller” (the evolution of AMD’s “Piledriver” core architecture) x86 cores for enhanced instructions per clock and power advantages. Applications that take advantage of GPU accelerate will give users an amazing experience thanks to our Graphics Core Next and new Heterogeneous Systems Architecture (HSA) enabling features for easier programming of accelerated processing capabilities.
In the low power category, the “Kabini” SoC APU takes over for “Brazos 2.0.” This second generation low power APU integrates “Jaguar” x86 cores for augmented performance and energy efficiency. These APUs will also benefit from select HSA features and functionality.
We keep on innovating for the ultra-low power space in 2013. Our second generation, ultra-low-power “Temash” SoC APU will follow “Hondo” for tablet and other fanless form factors. This APU will also leverage the “Jaguar” low-power x86 cores and HSA features.
We at AMD strongly believe these roadmap updates help us time new product introductions with customer design phases to hit key sales cycles across a range of form factors and experiences. We are moving with the market and on the path to deliver exceptional productivity and user experience in a wide array of form factors.
John Taylor, Director of Worldwide Product Marketing at AMD
He also provided the following answers to questions regarding how AMD spells out Windows 8 tablet strategy [CNET, Feb 2, 2012]:
…
Q: Before, we go to Windows 8, what is your smartphone strategy, if any?
Taylor: The smartphone market is eight, nine, ten, maybe a dozen players. [They have] lower ASPs (average selling price), lower [profit] margins, different competitive dynamic. So, there is no shift on the smartphone strategy.And Window 8?
Taylor: But you will see much more focus on tablets, the convertible or hybrid devices that fit between tablets and notebooks, very thin [designs].What chips exactly will get you there?
Taylor: For tablets, it will decidedly be the Hondo chip. We’re acknowledging that we still have a couple of watts to shave off to really be a more ideal tablet platform (to achieve optimal power efficiency). But we think that Temash gets us much, much closer to that in 2013.And Windows 8 convertibles?
A 17-watt [power consumption] is the lowest that we’ll offer. That’s called Trinity. It will be unmatched in that [17-watt design] space. Discrete graphics-like performance. All types of dedicated video processing capabilities, better battery life than the competition. And all of these ways that we’re driving the new generation of accelerated applications. If you think about the Web apps that are being built for Win 8, using HTML5 and the graphics enginethat drives that higher level experience.…
I will add to that the following two illustrations from the AMD Product and Technology Roadmaps[AMD FAD, Feb 2, 2012]:
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“Vishera” CPU (Desktop)
- The “Vishera” desktop CPU incorporates up to eight “Piledriver” cores, advanced instruction sets and other performance enhancing additions
- This next-generation CPU will maintain the AM3+ infrastructure.
- Planned for introduction: H2 2012
In addition to the above described expansion of the original APU strategy for the clients there is a kind of naming change with AMD Fusion System Architecture is now Heterogeneous Systems Architecture [AMD Fusion blog, Jan 18, 2012]
Since its introduction to the public in June 2011 at the AMD Fusion11 Developer Summit, the AMD Fusion System Architecture (FSA) has received widespread support and interest from our business partners and technology industry leaders. FSA was the blueprint for AMD’s overarching design for utilizing CPU and GPU processor cores as a unified processing engine, which we are making into an open platform standard. This architecture enables many benefits, including high application performance and low power consumption.
Our software partners are already taking advantage of the power and performance advantage of APU and GPU acceleration, with more than 200 accelerated applications shipped to date. The combination of industry standards like OpenCL and C++ AMP, alongside FSA, is ushering in the era of heterogeneous computing.
Together with these software partners, we have built a heterogeneous compute ecosystem that is built on industry standards. As such, we believe it’s only fitting that the name of this evolving architecture and platform be representative of the entire, technical community that is leading the way in this very important area of technology and programing development.
FSA will now be known as Heterogeneous Systems Architecture or HSA. The HSA platform will continue to be rooted in industry standards and will include some of the best innovations that the technology community has to offer.
Manju Hegde and I will be hosting a breakout session on HSA at AMD’s Financial Analyst Day on February 2nd 2012, which will be webcast live here. More information on the latest advances in HSA design will be released at a future date.
Also, if you haven’t already made plans to attend the AMD Fusion12 Developer Summit in June 2012 in Bellevue, Washington, I encourage you to save the date. Leaders from the technology and programming development communities will converge at the summit to discuss Heterogeneous Computing and the next-generation user experiences that are enabled by this platform.
Phil Rogers, corporate fellow at AMD.
From the Analyst Day breakout session presentation I will include the following illustrations here as the food for thoughts and further interests:
For Windows 8 related HSA, “C++ AMP” (indicated on the last illustration) is worth to expand on via Introducing C++ Accelerated Massive Parallelism (C++ AMP) [MSDN Blogs, June 15, 2011]
A few months ago, Herb Sutter told about a keynote he was to delivered today in the AMD Fusion Developer Summit (happening these days). He said by then:
“Parallelism is not just in full bloom, but increasingly in full variety. We know that getting full computational performance out of most machines—nearly all desktops and laptops, most game consoles, and the newest smartphones—already means harnessing local parallel hardware, mainly in the form of multicore CPU processing. (…) More and more, however, getting that full performance can also mean using gradually ever-more-heterogeneous processing, from local GPGPU and Accelerated Processing Unit (APU) flavors to “often-on” remote parallel computing power in the form of elastic compute clouds. (…)”
In that sense, S. Somasegar, Senior Vice President of the Developer Division made this morning the following announcement:
“I’m excited to announce that we are introducing a new technology that helps C++ developers use the GPU for parallel programming. Today at the AMD Fusion Developer Summit, we announced C++ Accelerated Massive Parallelism (C++ AMP). (…) By building on the Windows DirectX platform, our implementation of C++ AMP allows you to target hardware from all the major hardware vendors. (…)”
C++ AMP, as Soma tells in his post, is actually an open specification. Microsoft will deliver an implementation based on its Windows DirectX platform (DirectCompute, as Daniel Moth specifies in a later posta few minutes ago).
Daniel added that C++ AMP will lower the barrier to entry for heterogeneous hardware programmability, bringing performance to the mainstream. Developers will get an STL-like library as part of the existing concurrency namespace (whose Parallel Patterns Library –PPL and its Concurrency Runtime –ConcRT are also being enhanced in the next version of Visual C++ –check references at the end of this post for further details) in a way that developers won’t need to learn a different syntax, nor using a different compiler.
Update (6/16/2011): “Heterogeneous Parallelism at Microsoft”, the keynote where Herb Sutter and Daniel Moth introduced this technology with code and graphic demos is available for on-demand watching.
Update (6/17/2011): Daniel Moth’s session “Blazing-fast Code Using GPUs and More, with C++ AMP” is available as well! Beside, Dana Groff tells what’s new in Visual Studio 11 for PPL and ConcRT.
Pedal to the metal, let’s go native at full speed!
References:
- S. Somasegar’s announcement: http://blogs.msdn.com/b/somasegar/archive/2011/06/15/targeting-heterogeneity-with-c-amp-and-ppl.aspx
- Daniel Moth’s blog post: http://www.danielmoth.com/Blog/C-Accelerated-Massive-Parallelism.aspx
- Herb Sutter’s keynote at the AMD Fusion Developer Summit: http://channel9.msdn.com/Events/AMD-Fusion-Developer-Summit/AMD-Fusion-Developer-Summit-11/KEYNOTE
- Daniel Moth: Blazing-fast Code Using GPUs and More, with C++ AMP (session presented at AMD Fusion Developer Summit): http://channel9.msdn.com/Events/AMD-Fusion-Developer-Summit/AMD-Fusion-Developer-Summit-11/DanielMothAMP
- Announcing the PPL, Agents and ConcRT efforts for Visual Studio 11, by Dana Groff: http://blogs.msdn.com/b/nativeconcurrency/archive/2011/06/16/announcing-the-ppl-agents-and-concrt-efforts-for-v-next.aspx
- AMD Fusion Developer Summit Webcasts: http://developer.amd.com/afds/pages/webcast.aspx
With that in mind the upcoming 2012 AMD Fusion Developer Summit will definitely bring quite important updates as promised by the last breakout session illustration:
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More on that: Adobe and Cloudera among Keynotes at AMD Fusion12 Developers Summit [AMD Fusion blog, Feb 3, 2012]
Finally, regarding the ‘ambidextrous’ strategy mentioned in the first sentence of the press release:
- ‘ambidextrous’ generally means ‘very skillful and versatile’ coming from ‘able to use the right and the left hand with equal skill’
- it is described in the press release as:
-
… adopting an SoC-centric roadmap designed to speed time-to-market, drive sustained execution, and enable the development of more tailored customer solutions. SoC design methodology is advantageous because it is a modular approach to processor design, leveraging best practice tools and microprocessor design flows with the ability to easily re-use IP and design blocks across a range of products. …
- and detailed in Mark Papermaster‘s (Senior Vice President and Chief Technology Officer) presentation for the 2012 Financial Analyst Day held on February 2, 2012 (see his full presentation in PDF) via the following illustrations:
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as the Go-to-market approach together with ODM / OEM relationships
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specifically highlighting the differentiation with it for the datacenter
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related to MDC [Multi-DataCenter] workloads and HSA.
But also mentioning it in more generic terms as:
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”Flexible around ISA [Instruction Set Architecture]” and
“Flexible around combination of AMD IP and third party IP”
Which caused probably the biggest interest and questions among participating analysts what made even The Wall Street Journal to report as AMD Will Incorporate Others’ Technology in Its Chips [Feb 3, 2011]:
Advanced Micro Devices Inc., the microprocessor maker whose fortunes have long been closely tied to the same technology as bigger rival IntelCorp., is planning a more flexible future.
The company on Thursday said it may pursue what it calls an “ambidextrous” strategy that would allow it to offer chips that include circuitry developed by other companies as well as its own. One obvious option would be low-power microprocessor technology from ARM HoldingsPLC that now dominates chip markets for cellphones and tablet computers.
AMD Chief Executive Rory Read, at a meeting with analysts here and in a subsequent interview, stopped short of saying that AMD would definitely add ARM-based technology to its chips in the future. But he noted that the company is laying the technical groundwork for modular chips that could accept blocks of circuitry developed by ARM as well as other companies.
“We have a relationship with ARM, and we will continue to build on it,” Mr. Read said in an interview. “We will continue to evolve that relationship as the market continues to evolve.”
Such possibilities are a sign of how the exploding market for mobile devices is causing many companies to alter their strategies. The x86 design used by AMD and Intel is the foundation of virtually all personal and most server computers.
But the two companies have struggled to make headway in the mobile-device market, in large part because of the lower power consumption of ARM-based designs. Meanwhile, ARM licensees—which include Qualcomm Inc., Texas Instruments Inc. and Nvidia Corp.—are adding to the pressures by edging toward the PC market, as MicrosoftCorp. finishes development of a new operating system that supports ARM and x86 chips.
AMD’s management team, in a meeting with analysts here, took pains to dispute the notion that AMD may become marginalized as ARM-powered competitors enter the PC market. Rather, they argued, AMD’s strength in graphics and microprocessors—and a strategy of customizing chips for large customers—will expand AMD’s opportunities.
Indeed, Mr. Read argued, it is Intel’s outsize influence of the tech industry that will tend to decline. “We will see the breakdown of proprietary control points,” Mr. Read said.
Though Mr. Read didn’t commit to embracing ARM’s designs, others who heard his presentation said the direction is clear. “AMD was very deliberate today about their goal to integrate more third-party intellectual property,” said Patrick Moorhead, a former AMD vice president and now principal analyst at Moor insights & Strategy. “Nothing they communicated excluded the potential for ARM.”
AMD’s remarks also underscore an industry shift—driven largely by the mobile market—away from separate chips and toward multi-function products that the industry calls SoCs, for systems on a chip, which save space and power in mobile devices and other hardware.
Intel and AMD have begun offering SoCs for laptop computers. But AMD discussed extensive plans to create more such products at a faster rate, using a flexible design scheme that can accommodate technology submitted by other companies.
Mr. Read, who previously served as a senior executive at PC maker Lenovo GroupLtd., has recruited others that also worked at IBM and have experience with other chip technologies than x86.
One is Mark Papermaster, AMD’s senior vice president and chief technology officer, who worked at Apple Inc. and Cisco Systems Inc. after leaving IBM in 2008. Another is Lisa Su, a senior vice president and general manager of AMD’s global business units, who most recently worked at Freescale Semiconductor HoldingsLtd., an ARM user.
Ms. Su gave an updated road map for a series of future chips, including products that AMD expects to be used in tablets that are powered by Microsoft’s forthcoming Windows 8 operating system. But Mr. Read said AMD would likely stay away from trying to sell chips for smartphones soon, characterizing the market as too crowded with competitors.
Marvell’s SMILE Plug for the “Classroom 3.0” initiative
SMILE = Stanford Mobile Inquiry-based Learning Environment
and this is currently a smartphone based solution aimed at the digital classroom.
In this sense it is a kind of a newer (only 1+ year old) approach than the 6 years old OLPC.
(Read about Marvell’s OLPC involvement in:
– Marvell® ARMADA® PXA168 based XO laptops and tablets from OLPC with $185 and target $100 list prices respectively [Jan 8-11, 2012]
– Marvell ARMADA with sun readable and unbreakable Pixel Qi screen, and target [mass] manufacturing cost of $75 [Nov 4, 2010 – July 20, 2011])
Remark: Will be interesting to see OLPC related educational initiatives merged in some way with SMILE during 2012 as Marvell’s “Classroom 3.0” initiative is rolled out. An Argentinian report on SMILE success (see well below) notes that: “… pilot projects and programs, driven by governments in most cases by applying the model 1:1, or also known as OLPC (One Laptop per Child), … Unfortunately, no results have been achieved educational and cognitive testing. Moreover, assessments of international experts from various experiences of OLPC in the world are not the most encouraging. Most of these programs have focused primarily on an abundant supply of hardware, often with little support, but above all, without proper teacher training, which keeps pace with the massive deployment of equipment. On the other hand, the vast majority of digital content that are being used by several of these programs are not innovative and do not promote interactive learning and motivating children.”
No wonder Marvell is contributing to SMILE as well:
SMILE Plug at CES 2012 [Jan 25, 2012]
Marvell Showcases ‘Classroom 3.0’ Education Technology at CES 2012 [Jan 9, 2012]
ARMADA powered SMILE Plug and One Laptop per Child tablet transform traditional classroom activities with interactive, multimedia curricula for more engaging learning experience
Marvell (NASDAQ: MRVL), a worldwide leader in integrated silicon solutions, today announced new education solutions designed to enable “Classroom 3.0,” a connected, secure learning environment that simplifies and speeds the deployment of technology to students around the world. Marvell’s collaboration with Stanford Universityhas resulted in the Marvell® SMILE Plug, the first plug development kit designed to turn a traditional classroom into a highly interactive learning environment. Designed to engage students in critical reasoning and problem solving, the SMILE Plug creates a “micro cloud” within a classroom that is completely controlled by the teacher. Marvell also announced that it has extended its relationship with the One Laptop per Child Association (OPLC) on a number of new products, including the upcoming OLPC X0 3.0, a low cost, low power tablet designed for education.
“Marvell is driving a revolution in the classroom with technology that improves the education experience for students and teachers around the world. We’re deeply committed to improving education worldwide, and through our work with organizations like OPLC and Stanford University, we are helping to transform learning from a static one-way activity to an interactive experience brought to life with compelling content, engaging interactive multimedia and numerous new ways to collaborate,” said Weili Dai, Co-founder of Marvell. “Marvell’s SMILE Plug, the first ultra small server designed specifically for multi-modal curriculum delivery, combined with our affordable, easy-to-use and durable OLPC XO 3.0 tablet, are important additions to the world’s classrooms. It’s a matter of time before we leverage the power of Google TV and other smart screens in our daily lives to bring knowledge experts from around the globe to any local classroom.”
The Marvell SMILE Plug, powered by Marvell’s high-performance, low power ARMADA® 300 series SoC and Marvell Avastar™ 88W8764 Wi-Fi, creates a micro-cloud, eliminating the problem of inconsistent Internet access within a classroom and creating a safe and secure connectivity for up to 60 students. The SMILE plug also securely delivers digital content to a range of devices, including personal computers and handheld devices. Teachers and students can now tap into an unprecedented amount of open or premium digital content. The SMILE plug also allows teaches to control and run interactive classrooms with real-time feedback and analytics, deepening the learning experience.
In tandem with the Stanford Mobile Inquiry Based Learning Environment program, Marvell has developed an easy-to-manage access point for a wide array of SMILE learning applications and has created an administration API and user interface, Plugmin, which provides access to many additional SMILE programs. These tools provide teachers total control of the devices and content used within their classroom for better lesson planning and student evaluation.
Additionally, the SMILE Plug Computer features an open platform based on Arch Linux for ARM, the Plugmin administration app and the Stanford SMILE Junction Server. The SMILE Plug includes a 5V Lithium-Ion polymer battery for back-up power, making it ideal for learning environments where electrical power can be inconsistent.
Also at CES, Marvell and OLPC showcased the first prototype of the X0 3.0, a low cost, low power rugged tablet computer designed for education in emerging markets. Built on the Marvell ARMADA 618 processor and its Avastar 88W8686 wireless chip, the XO 3.0 tablet will feature unique capabilities that allow it to be charged by solar panels, hand cranks and other alternative power sources. Marvell and OLPC also announced that the XO 1.75 laptop will begin shipping in February, with initial orders benefiting education programs in Rwanda and Uruguay. For additional information on the XO 3.0 prototype or the XO 1.75 laptop, please see the related release, “Marvell and One Laptop per Child Unveil the Eagerly Anticipated XO 3.0 Tablet at CES.”
Availability
The SMILE Plug will be available in spring 2012; please visit http://www.marvell.com for more information. The One Laptop per Child XO 1.75 will be available in February; please visit http://one.laptop.org/action/donateif you’re interested in donating or for more information.
Marvell will also be demonstrating the its education solutions at the 2012 Consumer Electronics Show (CES) in its booth, No. 30542, located in South Hall 3 on the upper level. CES will be held Tuesday, Jan. 10 – Friday, Jan. 13, 2012, at the Las Vegas Convention Center (150 Paradise Road, Las Vegas).
Lesson 2: How Do I Use Inquiry-Based Learning with Youth? [national4H, July 20, 2011]
Creativity in Mathematics: Inquiry-Based Learning and the Moore Method [Aug 8, 2011]
Classroom 3.0: Why the promise of the Digital Classroom depends on technology addressing the human issues first. [Announced Departmental Seminar for Feb 3, 2012, UC Berkeley]
Jack Kang
Director, Application Processor Business Unit, MarvellClassroom 3.0: Why the promise of the Digital Classroom depends on technology addressing the human issues first.
Abstract:
In this talk, Mr. Kang will share his vision for what a digital, next generation “Classroom 3.0” looks like. Before that however, Mr. Kang will focus on the people and process issues that have to be overcome in order to fully realize the value of technology–issues that technologists and engineers often underestimate. Covering use cases both in the United States and in developing 3rd world countries, the session will end with a practical call to action, with an opportunity for students to immediately contribute to the Marvell SMILE Plug project, a revolutionary new product that will improve student lives today.Bio:
Mr. Kang joined Marvell in February, 2006 and is currently director of Marvell’s Application Processor Business Unit. He has been in the semiconductor business for more than seven years, holding previous positions in design engineering at several leading technology vendors. At Marvell, Mr. Kang manages multiple product lines from design conception to mass market implementation and adoption. These include the industry-leading ARMADA PXA processors, which are fueling today’s premier consumer devices. Additionally, he oversees various market segments, including education, eReaders, gaming, tablets and other connected consumer and embedded devices. Most recently, Mr. Kang was responsible for the processor design powering Microsoft’s gaming console, Microsoft Kinect. This gaming console shattered sales records and was named the fastest-selling tech gadget of all time by the Guinness Book of World Records – totaling more than 20 million units since its launch in November, 2010.Mr. Kang is currently driving the development of Marvell’s ‘Classroom 3.0’, a connected, secure learning environment that simplifies and speeds the deployment of technology to students around the world. A new device called the SMILE plug, central to Classroom 3.0, creates a ‘micro cloud’ within a classroom that is completely controlled by the teacher.
SMILE (Stanford Mobile Interactive Learning Environment) [Aug 4, 2011]
SMILE workshop (Stanford Mobile Interactive Learning Environment – open source mobile application and mobile interaction management system) engages participants to experience how the latest open source mobile learning environment helps teachers to engage students in generating mobile media-based inquiries and using the student-generated inquiries as tools to promote self-reflection among students and formative assessment for teachers. An Android-based mobile learning device will be provided for each participant for the hands-on workshop.
Description
It is generally acknowledged that student-created questions play an important role in the learning process (Dale, 1937; Dillon, 1990; Hunkins, 1976) and they have been demonstrated to improve student learning outcomes (Barak & Rafaeli, 2004; Commeyras, 1995; Dori and Herscovitz, 1999; Rothkopf, 1966). In posing questions themselves, students must revisit previous learning materials and reshape their thoughts relating to prior learning, thereby deepening their understanding (Marbach-Ad & Sokolove, 2000). Moreover, if students are made aware that they will be asked to create questions at a later time, they will actively monitor and attend to what they are learning during class in anticipation (Mosteller, 1989; Wilson, 1986). Despite these findings, though, student-created questions have remained consistently absent from the majority of teachers’ repertoires (Gall, 1970). Studies have reliably shown that only a very small portion of questions asked in a classroom are created by the students(Corey, 1940; Dillon, 1988), implying that a powerful pedagogical tool is being underutilized.
The affordances of mobile phones present a unique opportunity to reintegrate student-generated questions back into the classroom. More specifically, considering that students are already actively trying to communicate with each other during class on their mobile phones (Educational Digest, 2005; Gilroy, 2004), there is an opportunity to reorient this communication toward class material through student-created questions. Indeed, it is slowly being recognized and demonstrated that mobile phones are highly engaging tools to be taken advantage of, not prohibited (Kolb, 2008). For example, data collected by Swan et al. (2005) from four elementary and two middle-school classes indicated that the use of mobile phones in the classroom increased student motivation, improving their quality of work. With mobile phone ownership among children has increased byin the past five years (MRI report, 2010) and a current trend towards the consolidation of open-source mobile operating system platforms (Shuler, 2009), there could be no better time to take advantage of these affordances in order to increase the incidence of student-generated questions as an effective way to promote student learning and engagement in the classroom.
Therefore, a newly developed SMILE (i.e., Stanford Mobile Interactive Learning Environment – open source mobile application and mobile interaction management system) will be demonstrated in a hands-on workshop format. Each participant will be given an Android mobile device to participate in the workshop and two facilitators will coordinate the setup and lead the workshop. The mobile learning workshop basically engages all participants to quickly generate a variety of inquiries (Shown in Figure 1), reflect on the inquiries, and rate participants’ inquiries through a real-time mobile interaction network while the facilitator demonstrates how teachers might be able to monitor the progress of the inquiry generation process and types of inquiries participants generate.
There are several important features of SMILE that were deliberately designed to maximize its effectiveness. First, allowing students to include digital photos in their questions garners the learning benefits gained from the presentation of materials in multimedia (Mayer, 1997). Second, having students create multiple choice question items help the student thoroughly reflect on the learned principles while thinking critically in synthesizing learning concepts and generating inquiries that are logical and sound. Third, permitting students to rate each other’s questions provides feedback and incorporates an element of peer assessment, which has been demonstrated to be valuable to a majority of students (Williams, 1992). Fourth, allowing students to view who scored the highest may foster a “non-pressured,” yet ultimately competitive game playing-like learning environment, which has been demonstrated to maintain an optimally motivating learning atmosphere (Reeve & Deci, 1999). Finally, supplying the teacher with all of the students’ questions and responsesthrough the graphic user interface provides invaluable formative assessment information, which has been demonstrated to greatly improve student learning (Black & William, 1998; Cross, 1998). For all of these reasons, SMILE provides a particularly effective means of promoting student-generated questions and in the end it can encourage the participants to engage in real-time learning and assessment with a multimedia-rich interactive learning environment.
Contact Information
Paul Kim phkim@stanford.edu
Stanford University
SMILE (Stanford Inquiry-Based Learning Environent) Workshop
Stanford Mobile Inquiry-based Learning Environment (SMILE) is basically an assessment/inquiry maker which allows students to quickly create own inquiries or homework items based on their own learning for the day. SMILE workshop is designed to introduce SMILE to people in the world and help them take advantage of SMILE.
AECT 2011 workshop ::
Date: on November 9, 2-11 at 9AM ~ 12PM
Location: Jacksonville, FloridaThis workshop engages participants to experience how the latest open source mobile learning environment helps teachers to engage students in generating mobile media-based inquiries and using the student-generated inquiries as tools to promote self-reflection among students and formative assessment for teachers. An Android-based mobile learning device will be provided for each participant for the hands-on workshop.
… [Included: Instruction Manual For learners by Sunmi Seol, Presentation document, Survey (paper / on-line versions)] …
Stanford Mobile Inquiry-based Learning Environment (SMILE) [first published Feb 23, 2011, excerpted Jan 29, 2012]
“Stanford Mobile Inquiry-based Learning Environment (SMILE)” is the subproject of POMI in Education.
Introducing SMILE: Stanford Mobile Inquiry-Based Learning Environment [Nov 21, 2011]
Using student inquiries as learning objects and meta-evaluation vectorsSMILE turns a traditional classroom into a highly interactive learning environment by engaging students in critical reasoning and problem solving while enabling them to generate, share, and evaluate multimedia-rich inquiries.
Stanford Mobile Inquiry-based Learning Environment (SMILE) is basically an assessment/inquiry maker which allows students to quickly create own inquiries or homework items based on their own learning for the day.
Stanford Mobile Inquiry-based Learning Environment (SMILE) is basically an assessment/inquiry maker which allows students to quickly create own inquiries or homework items based on their own learning for the day. For example, students can freely take a photo (Shown in Figure 1) of a diagram or any other object from their own textbooks or any phenomena discovered in their school garden or lab and create a homework item.
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Figure 1. Students taking a photo of their textbookAll student-created multimedia inquiry items can be tagged by the generator, but rated by peers to indicate how relevant or useful the item is to their own learning. Obviously, teachers or facilitators could decide to review the student-generated homework items from the homework pool, weed out the ones that may not be relevant and leave only the ones that are highly useful or ones with highest student ratings (i.e., rules could be made at the local level).
The SMILE application enables homework generation, completion and competition game during class. It offers opportunity to review what students learned in class and organize them and create their own inquires from them. Moreover, all student-generated questions are instantly collected, passed out to the whole class and all students are supposed to take a quiz created by all students and also give rating to each question based on standard rule made by local level. After students’ answers are submitted, they can review their results immediately. Through creating own question and sharing it with peers, students are able to check their understanding of what they learned for the day and compensate their lack of learning from peers’ questions. The instant activity blocks students’ learning of the day from fading away and after activity a teacher can give more additional information and detailed explanations to the class which helps them improve their understandings a lot. Quiz activity is controlled by teacher’s application so that students can not get distracted and do other actions. The current prototype of this application supports group/classroom level but village/school level, or community/school district level will be supported soon. Also, it enables a facilitator or teacher to map each inquiry or homework item with appropriate learning standard classifications. The former application is inside the classroom activity and the latter one is outside the classroom activity. The latter application enables students or teachers freely have access to SMILE server regardless of time and place if they have mobile devices. Basically, all homework items created by students are saved on SMILE server, and students can create their own homework items and upload them to the server. Also, they are able to solve homework items connected to the server. Teachers can review all homework items and manage all items to be high quality by seeding out ones which are not relevant to subject or have low-rating by peers from the server. In-out school network system offers continuous learning to all students and then they can pay attention to their own learning saving time and effort, and finally, are more likely to get better understandings of what they learned inside and outside the classroom.
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Figure 2. Student-created inquiries incorporating own mobile photoThe immediate advantages of SMILE are in that it…
- involves the learners themselves in the reflection and generation of own learning stimuli and inquiries;
- makes it possible to have anytime/anywhere homework/inquiry generation possibility (where there is an opportunistic learning moment);
- empowers the learner to generate and incorporate mobile multimedia objects from own environment;
- allows the learn to rate peer-inquiries based on own assessment of the merit;
- enables a collective management of homework quality;
- enables any group or organization to track the academic performance of the learner at a granular (based on learning standards) level;
- makes it possible to conduct a variety of comparison analyses for benchmarking purposes;
- creates a competition or collaboration game environment.
SMILE is composed of teacher’s application and student’s application. Teacher’s application was developed using Java language and it works on web-based system which Java is installed in. To support ad-hoc network environment, XMPP server such as openfire and apache were installed at the server and both applications also include Junction library developed by Stanford Engineering School. All users connected to the server have same environment, in short all students are controlled do same action. Only teacher’s application can manage the each step of the activity happening at SMILE. On the contrary, student’s application can do action sent from teacher’s message.
1) Teacher’s Application
- GUI (Graphic User Interface)-based application and it works in any system which Java can be installed in such as desktop, laptop and net book.
- Server IP is fixed but it is changeable and a teacher can change the path of Apache directory if the path is different from the fixed one.
- This application supports two ways for a quiz activity: first one is to let students create their own inquires, share, solve and get the result of the quiz during class and other one is using saved questions. As for the latter one, a teacher can freely select the quiz set from the server and pass it out to the whole class.
- A teacher can use time-limit quiz way inserting time limit at the application (Optional).
- This activity is composed of four states: connection to the server, making question, solving questions and seeing the results. A teacher is able to see the current status from the activity flow and each state button is disabled after the state is over.
- At student status window, a teacher can check each student’s submission of the question and answers of the quiz, and final score. A teacher is also able to see total numbers of students joined the quiz, ones of students submit the question, and ones of students submit answers.
- Score board window shows each student’s final score and right answer, his/her answer and his/her rating about each question.
Figure 3a. Teacher’s application of SMILE in India
Figure 3b. Teacher’s application of SMILE in USA
- Top score window is for noticing top score winners. A teacher can see who get highest score at the quiz and who get highest rating on their own questions.
- Question status window includes the following information: as for each question, who created, how many students get right answers, and what ratings this question get. Moreover, if clicking each question, a teacher can see real question at question window. After getting result, more detailed information is added to original question.
- If clicking save questions, student-created questions are saved and they can be used for future class or other students.
2) Student’s Application
Figure4. Login Window Figure 5. Main Window Figure 6. Make your question
- To join this activity, students are supposed to insert their name and server IP which is usually fixed but if server IP is different from fixed one, change it to the right IP address. If clicking login button, this application connect to the junction server and all students’ applications are under same environment according to the teacher’s application.
Figure7a. Main Window in India Figure7b. Main Window in USA
- At main window, as shown in Figure 5 there are three buttons: Make your question, Solve questions, and See results. Each action button is automatically enabled so that students can not do different actions without a teacher’s direction.
- Each student’s application receives the message from teacher’s application, and action button is enabled and then each student goes to each action status by clicking the button. The first action is making own question.
- At making question state, students can generate their own inquires adding images related to the inquiry. At that time, students can use the pictures saved already or take a picture from their materials or everything around them. Currently, students can create multiple-choice question for supporting instant grading system. Using preview function, students can preview their own questions before submission.
Figure 8. Students are making questions
- If clicking post button, newly-created question is given to the server and the application comes back to the main window.
Figure 9. Main Window Figure 10. Solve Questions
- After getting message “Solve Questions” from the teacher’s application, the next button is enabled. All students are under solving questions state.
- Students can freely go to next or previous question and also check answer and rating. Before submitting answer sheet, students can not escape from this activity.
11a. The picture of solving questions in india
11b. The picture of solving questions in USAFigure 11. Students answering to questions made by their peers
- Accidental logoff may happen anytime but student’s application can join the activity is going on because the server is broadcasting the current state to all students’ application at regular interval.
Figure 12. Result Window Figure 13. Detailed Result Figure 14. Who’s the winner
- After all students submit their answer sheets, see result button is enabled and students can see their own result of quiz. As figure 9 shows, main result window includes total score and correct or wrong information for each question.
- If clicking detail button, students can check each question’s detailed information: correct answer, number correct people, average rating and my answer.
- Winner page has information about the winner with highest score at the quiz and the owner with highest average rating for their own-created question.
- If seeing the results is over, all activities of SMILE end.
Future Studies
Current SMILE will be expanded to an application which enables accessibility to quizzes outside the classroom. Anytime Homework application enables students and teachers have access to SMILE server regardless of the time and place. This application offers different access permission to both students and teachers. Students enjoy individual quiz activity by solving question items saved on the server and also they generate their own questions and upload them to the server anytime. A teacher is also able to have access to SMILE server and manage the quality of homework items saved on the server by removing the questions items with low rating or are less relevant to class-curriculum. Figure 15 represents next version of SMILE including Anytime homework and Junction quiz applications.
Figure 15. Next version of SMILE application
- Stanford Mobile Inquiry-based Learning Environment(SMILE): using mobile phones to promote student inquires in the elementary classroom
Sunmi Seol, Aaron Sharp, Paul Kim
Proceedings of the 2011 International Conference on Frontiers in Education: Computer Science & Computer Engineering, FECS 2011- Proceedings of WORLDCOMP’11: The 2011 World Congress in Computer Science, Computer Engineering, and Applied Computing – Download Paper
Faculty Research Assistant Research Assistant Research Assistant Student
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Dr. Paul, Kim Sunmi Seol Arafeh Karimi Rashid Ahwazian Aaron A. Sharp
Interview – Mr Paul Kim [Nov 18, 2009]
Stanford Mobile Inquiry-based Learning Environment (SMILE) [Google translation from Spanish, Sept 7, 2011]
Speaker: Claudia Muñoz-Reyes
(Stanford Inquiry-based Mobile Learning Environment – SMILE)
In this digital age, characterized by the rapid development of technologies, people who have less access and education opportunities will be reduced to be at greater risk of leaving the cycle of poverty. They will be increasingly difficult to be able to participate in the growing economies of information and knowledge societies, thereby increasing not only the digital divide-but also what is most important, the knowledge gap. The preferential commodities and value-added of the Century 21, are information and knowledge. Without an innovative intervention that addresses these effects of globalization and rapid technological advancement, the gap will grow more and more, excluding the communities of extreme poverty can not ensure their own survival.
It’s nothing new in Latin America and other developing countries have been taking several initiatives and attempts to introduce technology in public schools in the last 2 decades. In many of these countries, where in recent years have provided rural and suburban schools, old computers, today these “iron dinosaurs” were not only obsolete, but not used and only pollute our environment. Even in the last 6 years, have been giving greater emphasis to pilot projects and programs, driven by governments in most cases by applying the model 1:1, or also known as OLPC (One Laptop per Child), where Unfortunately, no results have been achieved educational and cognitive testing. Moreover, assessments of international experts from various experiences of OLPC in the world are not the most encouraging. Most of these programs have focused primarily on an abundant supply of hardware, often with little support, but above all, without proper teacher training, which keeps pace with the massive deployment of equipment. On the other hand, the vast majority of digital content that are being used by several of these programs are not innovative and do not promote interactive learning and motivating children.
The purpose of SMILE is to provide a pedagogical change in classrooms, through mobile technology. The pedagogical model used is the “Inquiry-based Learning Model” (Model-based Learning Questioning) and models of learning based on problem solving, which encourage creativity, critical thinking and scientific attitude collaborative work, the 21 st Century skills in our children today. Consequently, our dynamic innovative teaching to implement, through mobile devices, focus on the student as the star of the learning process and the teacher becomes more of a facilitator of this process. This tool and formats developed Android platform and IOS (iPhone, iPad) also provides a great opportunity for teachers to quickly assess learning and performance of children individually and in groups.
The first pilot of this innovative program were in India, Malaysia and the United States between January and March 2011 and last experience in August of this year has taken place in rural and suburban schools of Misiones, Argentina, with surprising results .
Short Video of the last experience with rural and suburban schools in Misiones and Buenos Aires, Argentina:
SeedsofEmpowerment [Aug 17, 2011]
Multiple photos and other videos from our pilot projects in Argentina, Malaysia and India using mobile devices (smartphones) and tablets:
SMILE (Stanford Mobile Inquiry-based Learning Environment) – Medical education [on slideshare, Nov 23, 2011]
SMILE-MedRIC Interview with Professors [Nov 21, 2011]
SMILE MedRIC-Part1: As part of SMILE project, Medical students in Chungbuk University used SMILE in their Medical Informatics class and created questions on HIV AIDS.
SMILE (Stanford Mobile Interactive Learning Environment)-MedRIC-Korea-Part1 [arafehkarimi, Nov 16, 2011]
Part 2 – Part 3 – Part 4 – Part 5 – Part 6 – Part 7 – Part 8
Note: MedRIC (Medical Research Information Center), a Ministry of Science and Technology funded organization in S. Korea, focusing on research and development in medical informatics, medical data visualization, telematics, Virtual Reality-based medical training, and health communication and promotion policies and programs.
Background
Plug Computers [Marvell site, Jan 9, 2012]
Whether the need is remote access to data on a home network or to turn an entire classroom into a highly interactive learning environment, the solution is simple, convenient, and inexpensive. With a small form factor server called a plug computer, network connectivity is right at a wall socket.
Simply insert the plug computer into an electrical outlet and add an external hard drive or a USB flash drive through a USB port (depending on the deployment, a router may also need to be connected into the plug) — just like that, you have a network attached storage device.
Powered by Marvell embedded processors, a plug computer is packed with enough processing power and network connectivity for managing and serving up digital media files. It also draws less than one tenth of the power consumed by its PC counterparts enabling always-on, always-connected, and environmentally friendly computing. With a gigahertz-class processor, memory and storage the plug computer has ample processing power and resources to run any embedded computing application.
Applications for a plug computer include:
- Media Server
- Home Automation
- Remote Access
- A micro cloud for the classroom
Smile Plug for Education
Powered by Marvell’s high-performance, low power ARMADA® 300 series SoC and Avastar™ 88W8764 Wi-Fi, the SMILE Plug creates a micro-cloud, eliminating the problem of inconsistent Internet access within a classroom and creating a safe and secure connectivity for up to 60 students. The SMILE plug also securely delivers digital content to a range of devices, including personal computers and handheld devices. Teachers and students can now tap into an unprecedented amount of open or premium digital content. The SMILE plug also allows teaches to control and run interactive classrooms with real-time feedback and analytics, deepening the learning experience.
Plug Computer Developer Community
Pioneered by Marvell, the plug computer is originally based on the ARM ultra-low power architecture and built on an Open Development Platform. To encourage manufacturers to create applications on the platform, Marvell founded PlugComputer.org, an online community where developers can discuss ideas and share code solutions.
Enabling Classroom 3.0: Marvell SMILE Plug [Marvell platform brief, Jan 5, 2012]
Enabling Classroom 3.0: Secure Content, Teacher Control
Product Overview
Marvell® is excited and proud to create Classroom 3.0 with SMILE Plug. The SMILE Plug is a revolutionary way to change how technology is used in the classroom, offering unprecedented access to secure digital content, a seamless delivery mechanism, and a simple teacher interface to fully control the classroom.
Marvell’s SMILE Plug enables education institutions to create a micro-cloud within a classroom, facilitating a simple, low-cost way to network classrooms. The SMILE Plug eliminates the problems of inconsistent Internet access within a classroom environment, safely and securely providing connectivity in the classroom. The SMILE Plug also securely delivers digital content to a range of devices, including personal computers and handheld devices. Teachers and students can now tap into an unprecedented amount of open or premium digital content. The SMILE Plug also allows teaches to control and run interactive classrooms with real-time feedback and analytics, deepening the learning experience.
The Marvell SMILE Plug is being developed in partnership between the Stanford® University School of Education and Marvell—both of whom share the vision of using technology to revolutionize and improve the way students learn and educators teach. The SMILE Plug, which is named and built with Stanford’s Mobile Inquiry Based Learning Environment (SMILE), will provide the ability to establish a local Wi-Fi network for up to 60 students. SMILE turns a traditional classroom into a highly interactive learning environment by engaging students in critical reasoning and problem solving while enabling them to generate, share, and evaluate multimedia-rich inquiries. In addition, this creates access to many more SMILE learning applications. To simplify deployment and management of the SMILE Plug, Marvell has developed a plug administration API and user interface called Plugmin.
Smile Plug Components
The SMILE Plug contains the Marvell Plug Computer, as well as all of the software tools needed to develop applications for the platform. I/0 interfaces include 2x Gigabit Ethernet, 2x USB, Wi-Fi, and SD card slot up to 32GB. The Plug Computer is an embedded computer that plugs into the wall socket and can run network-based services that normally require a dedicated personal computer. Featuring a Marvell ARM-based CPU running up to 2GHz CPU with 512MB of Flash memory and 512MB of DDR3 memory, the Plug Computer provides ample processing power and resources to run any embedded computing application. Network connectivity is via Gigabit Ethernet; peripheral devices can be connected using USB 2.0 and Wi-Fi.
• Software Tools
The SMILE Plug will be based on Arch LinuxTM for ARM and NODE.js, as well as a plug administration API and Stanford’s SMILE environment and software development kit (SDK). All components adhere to the open-source model, making the SMILE Plug an ideal platform on which to develop or port any additional learning applications. The Plugmin administration client runs on Android-based devices and enables easy administration of the SMILE Plug. Used in conjunction with the SMILE Junction Server Administration Client, the teacher can easily control or run interactive classroom learning experiences.System-on-Chip (SoC) Solutions
The SMILE Plug Computer incorporates two of Marvell’s industry-leading system-on-chip (SOC) solutions to drive unparalleled application performance and connectivity in online classroom environment:
• Marvell ARMADA 300 CPU SoC
This is a high-performance integrated controller. It integrates the Marvell developed CPU core that is fully ARMv5TE compliant with a 256KB L2 Cache. The Marvell ARMADATM 300 (88F6282) builds upon Marvell’s innovative family of processors, improves performance, and adds new features to reduce bill of materials (BOM) costs. The 88F6282 is suitable for a wide range of applications such as routers, gateway, media server, storage, thin clients, set-top box, networking, point of service and printer products. For product information, visit http://www.marvell.com/embeddedprocessors/armada-300/assets/armada_310.pdf• Marvell Avastar 88W8764 Wi-Fi SoC
This is a highly integrated 4×4 wireless local area network (WLAN) system-on-chip (SoC), specifically designed to support high throughput data rates for next generation WLAN products. The device is designed to support IEEE 802.11n/a/g/b payload data rates. The Marvell Avastar® 88W8764 provides the combined functions of DSSS, OFDM, and MIMO baseband modulation, MAC, on-chip CPU, memory, host interfaces, and direct-conversion WLAN RF radio on a single integrated chip. The device supports 802.11n beamformer and beamformee functionality, enabling a simplified, integrated solution. For product information, visit http://www.marvell.com/wireless/assets/Marvell-Avastar-88W8764-SoC.pdfKey Features and Benefits
…
Arch Linux, a lightweight and flexible Linux® distribution that tries to Keep It Simple.
Currently we have official packages optimized for the i686 and x86-64 architectures. We complement our official package sets with a community-operated package repositorythat grows in size and quality each and every day.
Our strong community is diverse and helpful, and we pride ourselves on the range of skillsets and uses for Arch that stem from it. Please check out our forums and mailing lists to get your feet wet. Also glance through our wiki if you want to learn more about Arch.
About Arch Linux [Dec 5, 2008]
Arch Linux is an independently developed, i686/x86-64 general purpose GNU/Linux distribution versatile enough to suit any role. Development focuses on simplicity, minimalism, and code elegance. Arch is installed as a minimal base system, configured by the user upon which their own ideal environment is assembled by installing only what is required or desired for their unique purposes. GUI configuration utilities are not officially provided, and most system configuration is performed from the shell by editing simple text files. Arch strives to stay bleeding edge, and typically offers the latest stable versions of most software.
Arch Linux uses its own Pacman package manager, which couples simple binary packages with an easy-to-use package build system. This allows users to easily manage and customize packages ranging from official Arch software to the user’s own personal packages to packages from 3rd party sources. The repository system also allows users to easily build and maintain their own custom build scripts, packages, and repositories, encouraging community growth and contribution.
The minimal Arch base package set resides in the streamlined [core] repository. In addition, the official [extra], [community], and [testing] repositories provide several thousand high-quality, packages to meet your software demands. Arch also offers an [unsupported] section in the Arch Linux User Repository (AUR), which contains over 9,000 build scripts, for compiling installable packages from source using the Arch Linux makepkg application.
Arch Linux uses a “rolling release” system which allows one-time installation and perpetual software upgrades. It is not generally necessary to reinstall or upgrade your Arch Linux system from one “version” to the next. By issuing one command, an Arch system is kept up-to-date and on the bleeding edge.
Arch strives to keep its packages as close to the original upstream software as possible. Patches are applied only when necessary to ensure an application compiles and runs correctly with the other packages installed on an up-to-date Arch system.
To summarize: Arch Linux is a versatile, and simple distribution designed to fit the needs of the competent Linux® user. It is both powerful and easy to manage, making it an ideal distro for servers and workstations. Take it in any direction you like. If you share this vision of what a GNU/Linux distribution should be, then you are welcomed and encouraged to use it freely, get involved, and contribute to the community. Welcome to Arch!
New Arch Linux ARM website! [June 22, 2011]
Welcome to the new Arch Linux ARM site! We hope you like the new layout, organization, and the brand new, unified effort from the PlugApps and ArchMobile teams.
For our existing PlugApps/Plugbox users, you have probably already got the new “rebranding” packages that renames much of PlugApps to Arch Linux ARM (ALARM for short), but beyond that, we’re still the same team members with the same goal in mind – to create an advanced but simple Linux distribution for ARM devices such as plug computers and newer ARM devices.
We’d love to hear your feedback on the change – post in the forums or get in touch with us in the Support menu.
Thanks for using Arch Linux ARM and you’ll be hearing a lot more from us as we go!
Welcome ArchMobile.org Visitors! [July 23, 2011]
You may not have noticed unless you came here looking for ArchMobile.org, but the domain now redirects to Arch Linux ARM.
ArchMobile was the first effort aimed at making Arch Linux run on ARM, with an emphasis on mobile phones such as the OpenMoko. PlugApps was the other effort, aimed at making Arch Linux for plug computers. They decided to join forces and create a new, unified effort, Arch Linux ARM, for all ARM devices. This redirect completes the move to Arch Linux ARM as the base for everyone’s work.
So, welcome! Post in the forums and join us on IRC!
Arch Linux ARM [June 26, 2011]
Arch Linux ARM is a distribution of Linux for ARM computers. We are aimed at ARMv5 platforms like plug computers, OXNAS-based ARMv6 PogoPlugs, Cortex-A8 platforms such as the BeagleBoard, and Cortex-A9 and Tegra platforms like the PandaBoard and TrimSlice. However, it can run on any device that supports ARMv5te or Cortex-A instruction sets. Our collaboration with Arch Linuxbrings users the best platform, newest packages, and installation support.
Arch Linux ARM is a full Linux distribution with all of the console, server, and desktop applications you’d find anywhere else. You can run many popular services, such as CUPS to print from networked computers; Apache, Lighttpd, Cherokee, and Nginx for web servers with full PHP and CGI support; FTP, NFS, AFP, Rendezvous, Windows and Time Machine-compatible Samba servers; or install a desktop environment (with a web browser, text editors, and more) accessible through VNC, DisplayLink, or HDMI displays.
The entire distribution is on a rolling-release cycle that can be updated daily through small packages instead of huge updates every few months. Most packages are unmodified from what the upstream developer originally released.
Platforms (exerpted as of Feb 1, 2012):
PlugApps maintains two software repositories specifically designed for the features available in each platform. The devices listed for each platform are those we officially support with precompiled kernels and root file systems tailored to their unique configurations.
However, just because a device isn’t listed doesn’t mean the software won’t run on it. Any ARM system with any of the architectures we compile for will be able to run the software, and any newer systems that are backwards compatible will be able to use the software as well.
Choose a platform from the menu above or in the list below to get started.
ARMv5
Processor
RAM
NAND
Ethernet
USB
SATA
Pogoplug Series 4
Marvell Kirkwood 800MHz
128MB
128MB
Gigabit
3
1
Pogoplug v2 (Pink/Gray)
Marvell Kirkwood 1.2GHz
256MB
128MB
Gigabit
4
Seagate DockStar
Marvell Kirkwood 1.2GHz
128MB
256MB
Gigabit
4
Seagate GoFlex Home
Marvell Kirkwood 1.2GHz
128MB
256MB
Gigabit
1
1
Seagate GoFlex Net
Marvell Kirkwood 1.2GHz
128MB
256MB
Gigabit
1
2
SheevaPlug
Marvell Kirkwood 1.2GHz
512MB
512MB
Gigabit
1
TonidoPlug
Marvell Kirkwood 1.2GHz
512MB
512MB
Gigabit
1
ARMv6
Processor
RAM
NAND
Ethernet
USB
SATA
Pogoplug Pro/Video/v3
PLX 7820 700MHz Dual-core
128MB
128MB
Gigabit
4
1
ARMv7
Processor
RAM
Ethernet
SD
USB
Wireless
BeagleBoard
TI OMAP 3530 720MHz
256MB
10/100
Full SD
1
BeagleBoard-xM
TI DM3730 1GHz
512MB
10/100
Micro SD
4
Gumstix Overo
TI OMAP 35xx 600/720MHz
512MB
10/100
Micro SD
Exp
B/G, Bluetooth v2.0 + EDR
PandaBoard
TI OMAP 4430 1GHz Dual-core
1024MB
10/100
Full SD
2
B/G/N, Bluetooth v2.1 + EDR
TrimSlice
NVIDIA Tegra 2, 1GHz Dual-core
1024MB
Gigabit
Full and Micro SD
4
Marvell SoCs to win both Microsoft and Nokia for Windows Phone and Windows 8 platforms (after the Kinect success)
Update: – Marvell licenses VeriSilicon DSP cores [Feb 13, 2012]
SAN FRANCISCO—Marvell Technology Group Ltd. has signed a licensing agreement for VeriSilicon Holdings Co. Ltd.’s ZSP G3 intellectual property cores, including the dual-MAC ZSP800M and ZSP880M synthesizable DSP cores, VeriSilicon said Monday (Feb. 13). Financial terms of the deal were not disclosed.
Marvell is also using VeriSilicon’s quad-MAC ZSP800 core and suite of HD-audio software solutions in the ARMADA 1000 HD media processor SoC and the recently introduced Marvell ARMADA 1500 media processor SoC, VeriSilicon (Santa Clara, Calif.) said. These chips are designed for applications such as Blu-ray players, digital media adapters, HD-STB and HDTVs.
According to VeriSilion, the dual-MAC ZSP architecture offers a balance of high performance, power efficiency and lower cost to support the increasing feature convergence in mobile and digital entertainment products and enable prolonged battery life. The company claims its products offer ease of use and strong customer support.
“We are quite impressed with the area and power efficiency of the dual-MAC ZSP800M core, combined with the ease of programming on the ZSP architecture,” said Ivan Lee, vice president of mobile products at Marvell, in a statement. “VeriSilicon’s ZSP-based HD-audio and voice software solutions will provide us with faster time-to-market advantages necessary to meet the growing demands of the mobile platform solutions for use in tablets and smartphones.”
Marvell’s Cutting-Edge Application Processors [Jan 10, 2012]
From [2:45] the so-called hybrid multiprocessing technology is mentioned with showing the above architecture. It was introduced back in September 2010 with ARMADA 628 (see: Marvell ARMADA beats Qualcomm Snapdragon, NVIDIA Tegra and Samsung/Apple Hummingbird in the SoC market [again] [Sept 23, 2010 – Jan 17, 2011]) at the time when Marvell was working on the earlier ARMADA 610 (see also in the indicated post) for the RIM Blackberry Playbook. Six month into the project RIM dumped the 610 for a TI SoC, but even with that was only able to deliver the stable version of its new QNX software on version 2, missing the crucial 2010 Holiday season. While rumors of that time blamed Marvell for that, according to a current view: “It appears that the failures are largely RIM’s, and often software related. The Marvell processors, when used, seem to work well.“
The first larger scale win for ARMADA 610 was the VIZIO VTAB1008 8″ tablet operating with Android, made available in August 2011 (see: Innovative entertainment class [Android] tablet from VIZIO plus a unified UX for all cloud based CE devices, from TVs to smartphones [Aug 21, 2011 – Jan 7, 2012]). This tablet is shown earlier in the above video (from [0:19] to [1:24]). The ARMADA 628 still has to arrive in a tablet which probably will happen only late in 2012 on Android (as “The company looks at the tablets market as ‘saturated’ and is avoiding it for the next couple quarters“, see below) and might happen in Q4 as the earliest on Windows 8 as hinted explicitly below by Marvell. This is just a possibility (but a very big opportunity for OEMs considering the obvious maturity of 628), nothing more, as any OEM engagement currently under way might end up in a market relased product, or not (as in the case of Playbook with ARMADA 610).
Note: in the above video instead of ARMADA the earlier PXA branding is used by Marvell’s Allen Leibovitch. Jack Kang in charge of the Application Processors business is also using the PXA branding, as you could read below.
After the First real chances for Marvell on the tablet and smartphone fronts [Aug 21, 2011 – Jan 19, 2012], so far in the Android, Google TV, educational (more edu) and OPhone spaces, here is the next large scale opportunity for the company. With the young and entrepreneurial Jack Kang in charge since H2CY2010, who has an excellent earlier track record with Microsoft via the hugely successfull Microsoft Kinect application SoC effort, there is a real chance for the company to conclude with platform wins the reported below new engagements with both Microsoft and Nokia in 2012:
Exclusive: Marvell Says it Will Find a Home in Chinese Windows Phones [DailyTech, Jan 31, 2012]
Marvell also hints at possible Windows 8 tablets/laptops
We had an interesting chat with the Marvell Technology Group, Ltd. (MRVL).
Marvell is perhaps best known as the company that took the Xscale ARM division off of Intel Corp.’s (INTC) hands in 2006. During the modern smartphone era, Marvell has been a quiet competitor, overshadowed by companies like Qualcomm Inc. (QCOM) and Samsung Electronics Comp., Ltd. (KS:005930) which have pushed the smartphone processing power envelope more aggressively.
By contrast Marvell has focused on budget smartphones. It is in most of Research in Motion, Ltd.’s (TSE:RIM) BlackBerry smartphones. These budget smartphones have led it to strong sales in Indonesia and China.
Marvell has done well in China, thanks to close ties with RIM and Nokia.
[Image Source: BlackBerry Rocks]Interestingly, the American company sees China as perhaps its most valuable market. Jack Kang, director of Marvell’s applications processor business unit states, “China was a very strategic investment.”
With Windows Phones set to land in China later this year in budget smartphones, Mr. Kang is making a bold prediction — “If there’s Windows Phones in China, there will probably be Windows Phones with Marvell in China.”
That would be a major market event as thus far Qualcomm has been the exclusive ARM chipmaker partner of Windows Phone. While Windows Phone has struggled in the U.S. where key Windows Phone partner Nokia Oyj. (HEL:NOK1V) has virtually no market share, in China Nokia is the top smartphone maker, so a switch to Marvell ARM cores would be quite a coup.
Nokia is the top phonemaker in China, thus it’s crucial that Marvell gets in Nokia’s new Chinese Windows Phones when it makes the shift later this year. [Image Source: M.I.C. Gadget]Mr. Kang feels his firm’s biggest strength is providing “quality low-cost devices”. While it doesn’t bake discrete Wi-Fi circuitry into some of its system-on-a-chip devices, it says this approach works in markets like Indonesia or rural China where there’s plentiful 3G but sparse Wi-Fi coverage.
Marvell current produces single and dual-core chips, with the smartphone-aimed ARMADA family. Despite competitors like Qualcomm and NVIDIA Corp. (NVDA) jumping to quad core, Marvell says that approach doesn’t make sense. Mr. Kang comments, “We don’t think quad core makes sense at 40 [nm] from a power perspective, from a price perspective.”
Marvell’s ARMADA series ARM CPUs power smartphones and mobile devices like the ARM OLPC variant. [Image Source: OLPC.tv]He says that Marvell is tentatively slotted to release quad-core designs when it hits 28 nm in mid-2013. The chipmaker uses Taiwan Semiconductor Manufacturing Comp., Ltd.’s (TPE:2330) third-party fabrication services. TSMC has struggled at the 28 nm node, delivering low yields and in turn higher costs — a combination that doesn’t work with Marvell’s business model — hence the delay.
Marvell feels that the fact that it takes its ARM license and build a unique core from the ground up using the ARM instruction set gives it an advantage over competitors like NVIDIA that simply take the core licensed from ARM Holdings plc (LON:ARM), but don’t do a complete redesign.
The company looks at the tablets market as “saturated” and is avoiding it for the next couple quarters, although it did seem distraught at losing RIM’s PlayBook to Texas Instruments Inc. (TXN), another U.S. chipmaker.
Mr. Kang hinted Marvell may jump on the tablet bandwagon or even release budget ARM laptops in Q4 2012 when Windows 8 arrives — and with it the first-ever ARM CPU support for a Windows main line operating system. He comments, “Microsoft already said Windows 8 will run on ARM. And we build ARM devices, so….”
Marvell hints it may be cooking up ARM Windows 8 tablets/laptops, too.
This move would make sense because Marvell has been involved with the One Laptop Per Child (OLPC) project in producing an ARM (Marvell) powered design. It has also played with low cost Linux laptops for years.
The company also showed off a (Android 3.2) “Honeycomb” television set, which it plans to target as an introduction to Internet TV in budget markets like China. This was a reference design, whereas Marvell would partner with a traditional TV maker for production designs.
The Honeycomb set uses Marvell’s latest dual-core chip, which contains an extra low-power core to conserve energy during simpler tasks. The power savings approach mirrors that found in Tegra 3. In that sense Marvell’s dual-core is technically a tri-core, much as NVIDIA’s quad-core is technically a penta-core.
There could indeed be a real 2012 opportunity for Marvell as Nokia CEO Stephen Elop highlighted in an answer to questions about the Quarter 4 results last week (Nokia Quarter 4 results 2011 webcast [Nokia, Jan 26, 2012]):
on China dynamics:
… The Chinese operators are increasingly, on accellerated basis entering into structures where there’s effectively retail rate plan bundling is going on at the store. The operators are driving very hard for the volume of 3G data subscribers. And this is not necessary an economic measure as it is driving volume on certain networks for certain technologies. I think those targets are probably set more broadly for all of the operators [he could mean: by the state, as all three operators are majority owned by the state]. And the impact of that is that they are discovering that with very low priced devices on certain radio technologies they can drive a lot of volume at those levels. And so we are seeing, for example, a very significant uptake in a number of low-priced devices that are on CDMA, there’s also a very significant focus on the Chinese technology TD-SCDMA, again all of the low levels ought to drive those volumes. My comment in the prepared remarks is that Symbian is not well positioned today against that. We do not have Symbian CDMA products at all, so we are not participating in that part of the market. So as that part of the market grows our addressable market has gone down because of that. In TD-SCDMA we do have some products in that space but not at the price points and configurations that is the real focus of this market. …
… We have not yet announced our specific products for the Chinese market but I will say that when we first announced our launch plans, I think all the way back in October, we did highlight that we would have CDMA based Windows Phone products and TD-SCDMA Windows Phone products. That thing said it is the case that we have work to do to successively drive the prices down further and further and further. That will take a bit of time but this is clearly the pattern you are going to see us on the months ahead. …
[I have a couple of deep and current analysis on that:
– The new, high-volume market in China is ready to define the 2012 smartphone war [Jan 6, 2012]
– China TD-SCDMA and W-CDMA 3G subscribers by the end of 2011: China Mobile lost its original growth momentum [Jan 21, 2012]
– China becoming the lead market for mobile Internet in 2012/13 [Dec 1, 2011]]
High performance SOC handles HD media [Jan 6, 2012]
The ARMADA 1500 HD media SOC decodes high-definition advanced multi-format video and audio using it’s dual ARMv7 compatible PJ4B 1.2 GHz processors with symmetric multi-processing and DSP accelerators. The chip targets IP/cable/satellite set-top boxes, advanced Blu-Ray players, digital media adapters, Google TV, and DTV applications.
The SOCs processors yield 6,000 DMIPS. It includes a secure boot ROM and USB, Fast Ethernet, HDMI, SATA, and SDIO interfaces, plus a 32-bit DDR3 at 800 MHz interface. The chips security engine handles OTP, RNG, AES/(3), DES, RSA, SHA-1, and MD5 and a comprehensive software development kit is available. (No price given – available now.)
See also my other posts regarding the other high volume opportunities for Marvell:
– Marvell® ARMADA® PXA168 based XO laptops and tablets from OLPC with $185 and target $100 list prices respectively [Jan 8, 2012]
– Google’s revitalization of its Android-based TV effort via Marvell SoC and reference design [Jan 5, 2012]
(the VIZIO VAP430 Stream Player, introduced below, is likely based on that)
– VIZIO’s two pronged strategy: Android based V.I.A. Plus device ecosystem + Windows based premium PC entertainment [Jan 11, 2012]
Background on Marvell’s relationship with Microsoft
A Cal ‘Kinect-ion’ [Innovations by UC Berkeley College of Engineering, Nov 9, 2011]
Some engineers wait a lifetime for a project like the one that Jack Kang (B.S.’04 EECS) landed when he was barely 26.
In the fall of 2008, Kang was settling into a new marketing position [Technical Marketing Manager] at Marvell, a Santa Clara-based semiconductor company, when Microsoft came knocking with a mysterious assignmentfor the company. Working on an undisclosed product, the computing giant needed a team to design a complex chip for manufacture on a massive scale.
“This project was very secretive,” recalls Kang, who had shifted from hands-on chip design to marketing management at Marvell. Marvell got the Microsoft contract, but “we didn’t really know what it was for,” says Kang. Many months into the development of a specialized microprocessor—often touted as a system’s “brains”—he got his answer. The mystery chip was destined for Kinect, Microsoft’s controller-free and immensely popular electronic game sensor device.
Introduced last November, Kinect uses sophisticated visual and voice recognition to run electronic games, movies and other entertainment. A companion to Microsoft’s Xbox 360 video gaming system, it became the fastest-selling consumer electronics gadget in history, selling 8 million devices in 60 days.
Kinect’s appeal came as no surprise to Kang. “It was a giant leap,” he says of the technology that lets users interact with media through body motions and voice commands. In fact, when Kang first learned about Kinect, he was so dazzled by the concept that he wondered if it could actually be pulled off.
His work on the Kinect chip spanned two years. Acting as the project champion in a “do-whatever-it-takes” capacity, Kang managed the effort from the earliest negotiations through a series of designs to manufacturing. In all, more than 100 Marvell chip designers, marketing representatives, software engineers and othersparticipated in a process that witnessed its share of evolutionary curveballs.
For the first six months, the Marvell team focused on what Kang believes would have been one of the most powerful mobile or consumer chips on the market. Shortly after the chip was completed, Microsoft asked for an even higher performing version. But the company soon switched course, deciding to put more of the computing functions into the Xbox instead of Kinect, Kang says.
Ultimately, Marvell engineers were asked to build a general purpose chip capable of controlling voice recognition and sending data to the Xbox. The team wound up modifying a chip already in development. That chip, as it turned out, was one that Kang had helped design in his earlier capacity as a Marvell engineer.
PHOTO BY ABBY COHN
Excited by his role in unleashing Kinect, Kang sees many possibilities for human-machine interaction. “We’re just at the tip of the iceberg of what this device can do,” he says, envisioning future Kinect systems that help the disabled and the elderly, and play a role in medical treatment and procedures.
Beyond Kinect’s intended use for home entertainment, the $150 system has already triggered a flood of creative applications for its cameras, 3-D sensing and other features. At UC Berkeley, graduate student Patrick Bouffard installed a Kinect on a small four-rotor robotic helicopter to enable it to sense its height above the floor and detect objects in its way. Other concepts have included video-conferencing, surveillance and a navigational aid for the blind.
With his boyish smile and animated personality, Kang, now 29, is at least a decade younger than most of his professional peers. He has developed 11 patents, mostly in the field of CPU (central processing unit) technology. “Everything I needed to know I learned in CS152!” he quips. Kang took that computer architecture and engineering class at Berkeley Engineering and became a teaching assistant his senior year.
Born in Taiwan and raised in the South Bay, Kang was drawn to a career at the intersection of engineering and business. “I felt you could have more of an impact,” he says. At Berkeley, he minored in business administration and was powerfully influenced by his experience as a TA. Hired as a Marvell engineer in February 2006, he was increasingly tapped to showcase company products in technical presentations for clients. “I had the mindset of marketing,” says Kang, who also enjoyed the social interaction that came with it.
Twice promoted since 2008, Kang now serves as director of Marvell’s application processor business unit. Today, with a 12-member staff, Kang manages Marvell product lines for e-readers, gaming, education, tabletsand other devices. Long gone is a work schedule with room for lunchtime volleyball and soccer games. “There’s always someone up in some time zone,” Kang observes.
Kang is eager for the next project of Kinect-like proportions to come his way. “Technology is always evolving,” he says. “I certainly hope I have something that beats it.”
Marvell: Lazard Says Buy On Kinect, TD-SCDMA Opportunities [Tech Trader Daily, June 20, 2011]
… Lazard Capital Markets analyst Daniel Amirraised the stock to Buy from Neutral …
Marvell’s sales of chips into China’s home-brewed TD-SCDMA cellular network standard, which is being developed by China Mobile (CHL), and backed by the government, is perhaps underestimated by the Street.
Marvell could produce $90 million in revenue this year from those chip sales, and $151 million next year, but it could actually go as high as $202 million next year, he thinks. The Street has just $80 million modeled for this year, on average.
Moreover, the company’s sales into Microsoft’s (MSFT) “Kinect” gaming accessory are “opening new doors” for Marvell in the mobile and wireless business, he thinks, which may help Marvell catch up after missing earlier tablet and smartphone bids. Kinect will probably produce $104 million in revenue for Marvell this year, up from $64 million last year, on Kinect units of 16 million, Amir thinks.
[Microsoft Reports Record Revenue of $20.9 Billion in Second Quarter [Microsoft press release, Jan 19, 2012]: “The Xbox 360 installed base now totals approximately 66 million consoles and 18 million Kinect sensors”]
…
Teardown: Kinect has processor after all [EE Times, Nov 15, 2010]
Despite Microsoft Corp.’s claims to the contrary, its new Kinect motion-gaming ad-on for the Xbox 360 uses a standalone applications processor marketed by Marvell Technology Group Ltd. , according to a teardown analysis of the Kinect performed by UBM TechInsights.
TechInsights’ teardown uncovered within Kinect a Marvell PXA 168 applications processor, a part usually found in notebook computers. In September, Microsoft reportedly said it decided not to use a dedicated processor in Kinect. Instead, the company reportedly said the peripheral would harness the power of the processor within the Xbox.
Microsoft (Redmond, Wash.) did not immediately respond to request for comment about the discrepancy.
TechInsights analysts concluded that Microsoft’s head fake means the company has bigger plans to make Kinect more of a platform for applications beyond gaming, or that the company was simply trying to prevent the device from being hacked. The Kinect has reportedly already been hacked multiple times.
The analysts also believe that Microsoft may have underestimated the resource demand on the 360 console processor and was forced into using a laptop-equivalent processor to integrate the imaging, sensing, motor-drive and control functions and orchestrate I/O and communications between the Kinect and Xbox 360. It’s also possible that the processor was required to support the spatial aspects of Kinect’s multiple microphones, they said.
“It’s difficult to identify exactly what the Marvell processor accomplishes on the Kinect as investigation on how the firmware and software manage all control and processing functions and how they could be localized/virtualized to the Xbox haven’t been investigated yet,” said Allan Yogasingam, a technical marketing manager at TechInsights. “Regardless, Microsoft has created a product that takes full advantage of all its components to provide an innovative gaming experience. The existence of this Marvell processor just opens the door for further innovation down the line and an extension of the Kinect from more than just a sensor-based gaming accessory.”
TechInsights also conducted further study on the sensor unit that works with Kinect’s image processor, made by PrimeSense Ltd. The firm discovered that the CMOS image sensors used were provided by Aptina Imaging (the die markings on the sensors still refer to Micron Imaging, which was spun off into Aptina in 2008). The infrared camera uses the MT9M001 sensor and RGB input from the color camera features the MT9M112 sensor, TechInsights said.
Close up of the Marvell PXA 168 applications processor found inside Kinect.
Source: UBM TechInsights.TechInsights’ recent teardown of Kinect found chips made by PrimeSense, Marvell, Texas Instruments Inc., STMicroelectronics NV and others. The firm estimates that Kinect carries a bill-of-materials of roughly $56 for the components, not including the the price of design, R&D and the $500 million Microsoft plans to spend to market the device.
Teardown of the Microsoft Kinect – Focused on Motion Capture [Chipworks, Dec 23, 2010]
…
Application processor An Armada Series 800 MHz application processor by Marvell was also inside the Microsoft Kinect. Interestingly, this device is typically aimed at the e-reader market
Marvell-88AP1-BJD2
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Why did MS dump Kinect processor? There was ‘no need’ for it [ComputerAndVideoGames.com, Sept 29, 2010]
Camera tracks fewer points than it did last year
It emerged in January that MS had ditched a standalone processor in the camera – which some have claimed has subsequently affected performance.
Kinect now relies on the processing power of the Xbox itself – although the platform holder has claimed that it uses “less than one per cent” of the 360’s motherboard.
“We didn’t know how much processing Kinect was going to take at the start of development,” Kinect creative boss Kudo Tsunoda told the new Xbox World 360.
“Obviously you don’t want to lose any of the things that are important to Xbox customers. Graphic fidelity is something that Xbox has always been known for, and you want to make sure that you still hit that level.
“Forza is a graphical showpiece, and we had Forza with Kinect at E3… the graphic fidelity has actually improved in some areas from what they shipped with Forza 3. It’s still running at 60 FPS and it’s supporting Kinect, so there’s just no need to have that extra processor.”
When asked why Kinect detected less points on the player’s body than it did last year, Tsunoda added:
“As you start building the stuff, you’re like: ‘Wow, to track everything in the human body we can do less points. That’s just normal game development. Anything you do with games, you want the processing power to be used as efficiently as possible to get the experience that you want.”
Kinect launches in the UK on November 10 and the US on November 4.
Microsoft drops internal Natal chip [Jan 7, 2010]
GamesIndustry.biz has learned that Microsoft has dropped a chip from its forthcoming Natal motion control system as the platform holder eyes accessible price points in the build-up to release later this year.
Kinect Downgraded To Save Money, Can’t Read Sign Language [Kotaku, Aug 11, 2010]
The patent for Microsoft’s motion-sensing camera Kinect suggested that the device could understand American Sign Language. Well, it can’t. At least, the version going on sale in November can’t.
Responding to the claims made in the patent, Microsoft has told Kotaku “We are excited about the potential of Kinect and its potential to impact gaming and entertainment. Microsoft files lots of patent applications to protect our intellectual property, not all of which are brought to market right away. Kinect that is shipping this holiday will not support sign language.”
So why did the patent suggest it could? Well, sources close to the evolution of Kinect’s development tell us it’s because the version of the hardware that’ll be available later this year isn’t as capable as was originally intended.
The original Kinect had a much higher resolution (over twice that of the final model’s 320×240), and as such, was able to not only recognise the limbs of a player as the current model version can, but their fingers as well (which the current version can’t). And when the hardware could recognise fingers, it would have been able to read sign language.
But that capability came at a cost, and while Microsoft had always intended Kinect to sell for $150, “dumbing down” the camera would have meant that Microsoft wouldn’t be losing as much money on each unit sold, an important point should Kinect prove to be a failure. So dumb it down they did, reducing the camera’s resolution (which in turn reduced the number of appendages it’d have to track) and placing the burden for some of the device’s processing on the console and not Kinect’s own hardware.
This probably isn’t the first time you’ve heard such a rumour, but this latest time at least explains why Kinect can’t read sign language!
We’ve reached out to Microsoft for comment on the matter, and will update if we hear back.
Background on Jack Kang
Jack Kang, Director, Application Processors at Marvell [LinkedIn profile, excerpted, Feb 1, 2012]
Current
- Director, Application Processors at Marvell Semiconductor, Inc.
Past
- Technical Marketing Manager at Marvell Semiconductor, Inc.
- Logic Design Engineer at Marvell Semiconductor, Inc.
- Design Engineer at Eureka Technology
Education
- University of California, Berkeley
- University of California, Berkeley – Walter A. Haas School of Business
Jack is currently director of Marvell’s Application Processor Business Unit. He has been in the semiconductor business for more than seven years, holding previous positions in design engineering at several leading technology vendors. At Marvell, Mr. Kang manages multiple product lines from design conception to mass market implementation and adoption. These include the industry-leading PXA168, PXA618 and PXA510 processors, which are fueling today’s premier consumer devices.
Additionally, he oversees various market segments, including education, eReaders, gaming, tablets and other connected consumer and embeddeddevices. Most recently, Mr. Kang was responsible for the processor design powering Microsoft’s gaming console, Microsoft Kinect. This gaming console shattered sales records and was named the fastest-selling tech gadget of all time by the Guinness Book of World Records – totaling more than 10 million units since its launch in November, 2010.
[Steve Ballmer, Houston Technology Forum, March 10, 2011: “We shipped those in November. We just announced that we’re over 10 million sold, in what amounts to about two-and-a-half months.”]
Outside of his work at Marvell, Mr. Kang also serves as a technical expert on CPU technology and has more than 11 patents pending in the field of CPU technology. He holds a degree in Electrical Engineering and Computer Science from the University of California, Berkeley, with an emphasis in Computer Architecture.
Jack Kang, Patents and Publications [LinkedIn page, excerpted, Feb 1, 2012]
Jack Kang’s Patents
- United States Patent 7,870,372
- Issued January 11, 2011
Inventors: Jack Kang, Hsi-Cheng Chu, Rich, Yu-Chi Chuang
Method and apparatus for idling and waking threads by a multithread processor
- United States Patent 7,904,703
- Issued March 8, 2011
Inventors: Jack Kang, Rich, Yu-Chi Chuang
MULTI-THREAD PROCESSOR WITH MULTIPLE PROGRAM COUNTERS
- United States Patent 7,941,643
- Issued May 10, 2011
Inventors: Jack Kang, Rich, Yu-Chi Chuang
Methods, apparatuses, and system for facilitating control of multiple instruction threads
- United States Patent 7,757,070
- Issued July 13, 2010
Inventors: Jack Kang, Hsi-Cheng Chu, Rich, Yu-Chi Chuang
Multithread processor with thread based throttling
- United States Patent 7,886,131
- Issued February 8, 2011
Inventors: Jack Kang
Instruction dispatching method and apparatus
- United States Patent 7,904,704
- Issued March 8, 2011
Inventors: Jack Kang, Rich, Yu-Chi Chuang
Methods and apparatus for handling switching among threads within a multithread processor
- United States Patent 8,032,737
- Issued October 4, 2011
Inventors: Jack Kang, Hsi-Cheng Chu
Event-based bandwidth allocation mode switching method and apparatus
- United States Patent 8,046,775
- Issued October 25, 2011
Inventors: Jack Kang, Rich, Yu-Chi Chuang
Jack Kang’s Publications
- Berkeley Innovations
- November 28, 2011
Authors: Jack Kang, Abby Cohn
Marvell’s processors for embedded systems – Discussion of the PXA510 processor and the D2Plug developer kit
Mr. Jack Kang of Marvell discusses the PXA510 ARM V7 based 800 MHz application processor with with 512 Kbytes of level 2 cache and it’s associated developer kit.
From Dewey to Digital [HigherEdTECH, Jan 6, 2011]
No more pencils?! No more books? No more teachers? On-demand digital content, do-it-yourself learning, new generation learning platforms, and new modes of assessment are disrupting traditional textbooks, grading, courses, and degrees. Is technology really a catalyst for change? Let us count the ways.
Moderator:
Kenneth C. Green, Founding Director, The Campus Computing ProjectPanel:
- Sean Devine, Chief Executive Officer, CourseSmart
- Felice Nudelman, Executive Director, Education, The New York Times Company
- William D. Rieders, Executive Vice President of Global New Media, Cengage Learning
- Jack Kang, Director, Application Processor Business Unit, Marvell
Video Records (~10 min each) of the From Dewey to Digital (Jan 6, 2011) panel discussion:
Marvell® ARMADA® PXA168 based XO laptops and tablets from OLPC with $185 and target $100 list prices respectively
CES: One Laptop Per Child – The New XO v3.0 [Jan 11, 2012]
The new OLPC XO v3.0 laptop is unveiled at CES 2012. Demoing at the Marvell booth (the company that developed the processor found on board the XO) Giulia D’Amico, Director of Business Development [at One Laptop per Child], talks about some of the features found on the new device.
Related information: Marvell’s SMILE Plug for the “Classroom 3.0” initiative [Feb 1, 2012]
One Laptop Per Child XO-3 [Yves Behar’s fuseproject news blog, Jan 9, 2012]
6 years of design development with Nicholas Negroponte and the non-profit organization he founded, One Laptop Per Child, has led to the next generation XO-3 tablet. More than 2.4 million children in 25 countries received the original XO Laptop, and these kids have been our inspiration to create the next generation of this educational tool.
One Laptop Per Child is a technology story about how to provide low-cost educational tools to millions of children. For those children, and for us, it is also a creative story about how to design specifically for young students. Every decision made by the OLPC engineering team and the design team at fuseproject has been about adapting technology to children’s needs at a cost that makes the tablet affordable for developing countries.
The first impression of the XO-3 is its extreme simplicity. The focus is on the screen, while the surrounding green rubber border provides a safe tactile grip for children’s hands. The back surface has a bumpy texture and integrates a rear-facing camera. The connectors, power switch and speakers are arranged on the bottom edge, facing the user. Our approach has been to minimize complexity, while delivering a high quality, and a heightened touch feel. There is playfulness in the way one can adapt the cover to different needs, while each design detail and material is chosen to deliver maximum value.
Fuseproject Unwraps The Third-Gen One Laptop Per Child: A $100 Tablet [Fastcompany’s Co.Design blog, Jan 10, 2012]
With the XO-3, OLPC unveils a design that will allow it to be customized for myriad markets.
Let’s get this out of the way. The OLPC XO-3, the $100 tablet addition to the One Laptop Per Child family, newly launched at CES 2012, is much thicker than the concept tablet, which they showed in 2009. Plus, it’s missing the ring!
The original XO-3 concept, featuring a slimmer design and that lovely ring.
See the earlier information on this blog here: Marvell ARMADA with sun readable and unbreakable Pixel Qi screen, and target [mass] manufacturing cost of $75 [Nov 4, 2010 – July 20, 2011]
“They’re still the ultimate goal,” says Yves Béhar, founder of fuseproject and OLPC Chief Designer. The key component that enables the thinness of the concept tablet is flexible color e-paper, and that has been slow to come to market. When it does, the OLPC team anticipates that the robustness and low power consumption will make for an ideal very thin and lightweight tablet.
…
Testing and getting back reports of usage on the ground is a core part of the OLPC design process. From their previous experience, they knew localization would be key for this product. For instance, one of the benefits of a tablet form factor is that keyboards and other interfaces are entirely done in software, so it’s easy to swap them out for different languages and milieus. Easier than doing it in hardware, anyway.
There is localization in the hardware as well. This is localization not for language but for the infrastructural conditions of the places where the tablets will be used. Every XO-3 comes with a removable cover. “The cover is the multiple personality side of the tablet,” says Béhar. They can be simple passive protection, but depending on the needs of a particular locale, other capabilities can be built in.
For example, one version of the cover comes with a solar panel on the inside along with a thin battery. When you are in school, using the machine, you can leave the cover out in the sun to power the battery. When you put the cover back over the tablet, the battery connects and recharges the machine. Béhar says they are also working on a version of the cover with antenna that will enable the tablet to communicate with satellites. There are more accessories to come. “We learned a lot with the original OLPC XO,” says Béhar.
Marvell and One Laptop per Child Unveil the XO 3.0 Tablet at CES
Also: The first Marvell ARMADA powered XO 1.75 laptop will begin shipping in March to school children in Uruguay and Nicaragua [Marvell press release, Jan 8, 2012]
Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, and One Laptop per Child, a non-profit organization whose mission is to help every child in the world gain access to a modern education, demonstrated a fully functional version of the much-anticipated XO 3.0 – a low-cost, low-power, rugged tablet computer designed for classrooms around the globe – at the 2012 International Consumer Electronics Show.
“We’re proud to introduce the XO 3.0 tablet, showcasing the design, durability and performance features that make it a natural successor for our current laptops, which have been distributed to more than 2.4 million children in 42 countries and in 25 languages,” said Edward McNierney, Chief Technology Officer of One Laptop per Child. “The XO 3.0 builds on many of the technology breakthroughs we made with the XO 1.75, including the use of the Marvell® ARMADA® PXA618 processor, resulting in a significant decrease in power consumption–a critical issue for students in the developing world.”
“Marvell is committed to improving education–and the human condition–around the world through innovative technology for Smartphones, tablets and a myriad of new cloud-delivered services. Partnering with One Laptop Per Child is one way we can deliver a revolution where it matters most–to benefit children in some of the poorest places on the planet,” said Tom Hayes, Vice President of Corporate Marketing at Marvell Semiconductor, Inc. and a member of the OLPC advisory board. “Marvell has been with One Laptop per Child from the start and we’re doing whatever it takes to help the organization realize its mission of providing meaningful educational opportunities to the 500 million school-aged children around the world.”
Marvell and One Laptop per Child also announced today that the XO 1.75 laptop will begin shipping to customers in March 2012. Over 75,000 units of the XO 1.75 have already been ordered by OLPC projects in Uruguay and Nicaragua. The XO 1.75 uses the Marvell ARM-based ARMADA PXA618 SOC processor, which compared to the earlier XO 1.5, maintains performance while using only half the power. The XO 1.75 features a sunlight-readable screen and all the other features and design characteristics of the two previous versions of the XO laptop.
The XO 3.0 tablet will also feature the Marvell ARMADA PXA618 SOC processor and Avastar Wi-Fi SOC. Other features include:
- Unique charging circuitry; the XO 3.0 is the only tablet that can be charged directly by solar panels [see that above as built into the internal side of the protecting cover], hand cranks and other alternative power sources
- Standard or [a somewhat more expensive] Pixel Qi sunlight-readable display
- Android and Linux operating system support
A First Look at the new XO 3.0 tablet from One Laptop Per Child [Jan 10, 2012]
A Look At OLPC’s XO 3.0 Tablet’s Solar And Kinetic Chargers [Forbes, Jan 8, 2012]
…
Due to the simplicity of the model, McNierney expects to see a lot of interest in the solar cover. Since the panel produces 4 watts of energy and the tablet uses 2 watts, one hour of solar charging should enable 2 hours of tablet run-time.
The hand crank charger is more experimental. Like the solar cover, it is separate from the core tablet but connects via a port. It also hearkens back to the first concept designs for OLPC which had built-in hand cranks on their sides. That feature was eventually dropped for structural weakness reasons.
That history may make OLPC customers leery of the new hand cranks. McNierney acknowledged that most customers may bypass the hand cranks but he insisted they are usable. (Six minutes of hand-cranking should produce an hour of run-time.) To test the feature, the organization took out the tablet batteries to see whether the devices could run just by hand crank. The test worked, said McNierney. “If something can generate DC power, we can use it,” he added.
OLPC isn’t specifying which energy source customers need to use. McNierney pointed out that different countries will have their own preferences, based on culture, climate or other factors.
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This effort goes back quite a time: Marvell ARMADA with sun readable and unbreakable Pixel Qi screen, and target [mass] manufacturing cost of $75 [a collection of information on this blog, Nov 4, 2010 – July 20, 2011]
One Laptop Gets $5.6M Grant From Marvell to Develop Next Generation Tablet Computer [Xconomy, Oct 4, 2010] [see that as built into the internal side of the protecting cover]
The One Laptop per Child Foundation and Santa Clara, CA-based semiconductor maker Marvell have cemented a partnership announced last spring, with Marvell agreeing to provide OLPC with $5.6 million to fund development of its next generation tablet computer, OLPC founder Nicholas Negroponte tells me. Negroponte says the deal, signed in the past week or so but not previously announced, runs through 2011.
“Their money is a grant to the OLPC Foundation to develop a tablet or tablets based on their chip,” he says. “They’re going to put the whole system on a chip.”
…
– One Laptop per Child and Marvell Join Forces to Redefine Tablet Computing for Students Around the World [Marvell press release, May 27, 2010]
– Marvell Joins ‘One Laptop Per Child’ Initiative [Marvell press release, May 8, 2006]
OLPC XO-1.75 Costs $185 and Starts Shipping in March [OLPC News, Jan 7, 2012]
…
With regard to the price I confirmed with OLPC Association’s CFO Bob Hacker that the XO-1.75’s list price will be $185. As with the XO-1 and XO-1.5 the exact price depends on a number of variables such as the specific hardware configuration (RAM and NAND flash for mass storage) and other details.
…
An interesting detail here is that it seems like Uruguay decided to go for 8GB of NAND flash for mass storage while Nicaragua opted for 4GB.
XO-1.75, XO-3, Nell? – What Will OLPC Show at CES 2012 Next Week? [OLPC News, Jan 8, 2012]
…
The XO-1.75 looks identical to the XO-1 and XO-1.5 from the outside yet its hardware guts are quite different as OLPC switched from an x86 architecture to an ARM platform. I had previously expressed doubts whether this move would really led to a much improved battery life. However reading an e-mail that Richard Smith (OLPC Foundation’s Director of Embedded Engineering) sent out in November it seems like my guesstimates where quite off as he mentions feeling…
“…safe in saying that regardless of what you do on the 1.75 you are going to get 3.5 hours of battery life. Period.”
Additionally he wrote:
An interesting data point is that the 1.75 is the first laptop of the XO series that has ran 100% from a solar panel for an extended period. During my solar testing I often swap in different batteries. The 1.75 can consistently survive battery removal under moderate solar conditions when connected to the OLPC 10W solar panel.
Aside of these promising power characteristics the XO-1.75 also includes a three-axis accelerometer which people like Bert Freudenberg and Saadia Husain Baloch have already used for some cool things such as this little eToys project or an “etch-a-sketch” program in Turtle Art.
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XO-1.75 [wiki page on laptop.org, Dec 12, 2011]
The XO-1.75 laptop is a refresh of the XO-1 and XO-1.5 laptops. In our continued effort to maintain a low price point, OLPC is again refreshing the hardware to take advantage of the latest component technologies. This design, while separate from the XO-3 tablet effort, uses the same very low power electrical design. It continues to use the same industrial design and batteries as XO-1. The design goal is to provide an overall update of the system within the same industrial design and external appearance. Overall, the target was to greatly improve the power consumption while reducing the purchase cost.
XO-1.75 machines will ship with a new software release based on Fedora 14, including both Sugar and GNOMEsoftware.
XO 1.75 C1 [wiki page on laptop.org, Dec 5, 2011]
XO-1.75 Laptop C test model 1, also known as C1.
The C1 are the last prototypes of the XO-1.75 built. Electrically, these are very similar to the B1 prototypes. A small number were made in September, 2011, for final testing.
These are the first XO-1.75 laptops marked as such. XO-1 laptops have a smooth hinge cover, and XO-1.5 laptops have three small raised dots inline on each side of the hinge cover. XO-1.75 laptops have seven small raised dots on the hinge cover, arranged in two rows.
While three version of C1 were built (SKUs 200, 201, and 202), testing out various alternate component suppliers, from a software and functionality point of view all versions should be identical. Unlike the B1 prototypes, all C1 laptops provide SDRAM for the DCON.
Photographs:
If you disassemble the laptop (instructions), you will see:
The XO-3 tablet debuts at CES [the official OLPC blog, Jan 7, 2012]
Our XO-3 prototype is debuting at CES this weekend, and will be shown off next week at the Marvell booth. …
If you are heading to CES, you can stop by and see it yourself! Ping Giulia to set up an appointment, or drop by the Marvell booth. Charbax of olpc.tvwill be on site as always, recording some video and interviews.
The XO-3 will sport a 1024×768 Pixel Qi screen, half-gig of RAM, and a Marvell Armada PXA618 chip. Some of the soft cover designs proposed so far include a built-in solar panel. More updates coming over the next week; for now, here is our CES press release.
The XO-3 is still planned to enter production at the end of this year.
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[debuting at CES >>>] The $100 OLPC Tablet Is Really Real [Gizmodo, Jan 7, 2012]
Building on its success with laptops designed for developing countries, the One Laptop Per Child project is set to unveil a long-awaited tablet at CES next week. Here’s what you get for $100.
The OLPC has been kicking around the idea of a super-affordable tablet for over a year. Originally known as the XO-3, but now dubbed the XO 3.0, the tablet will feature an 8-inch 1024×768 screen with some models also offering a PixelQi 3qi display that mimics E-paper. A Marvell Armada PXA618 chip and 512MB of RAM reside in the tablet’s ruggedized shell and will run either Linux Sugar or Android OS.
With a bare-bones feature set, the OLPC tablet should cost about $100 per unit—up from the original estimated price of $75, but still way cheaper than virtually any other tablet on the market.
The coolest feature that the XO 3.0 can be powered by hand-cranking—to the tune of 10 minutes of run time for every minute of work. Why isn’t this available on, well, everything? I’d gladly spin a handle for a few minutes if it meant I wouldn’t have to beg for outlet time at coffee shops, carry spare chargers, and constantly dread the “low battery” notification. [Electronista]
XO 3 A1 [wiki page on laptop.org, Dec 12, 2011]
XO-3 Tablet Alpha test model, also known as A-test or A1.
The A1 was the first prototype of the XO-3built. The bring up happened in early December 2011.The number of boards obtained was small, and distribution was limited to demonstrations, hardware testing, and UI development. Much of the software development is being done on XO-1.75 laptops, due to the similarities.
- Bare circuit board, no case or display
- Rev. A motherboard
Photographs:
Please understand that this motherboard is still in the process of slimming down, and despite being less than half the area of an XO-1.75 motherboard, will continue to get smaller in coming months. We also intend to restore an internal SD slot, allowing for storage expansion and repair of motherboards with failed eMMC devices. –wad
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Marvell ARMADA 618 Application Processor
1GHz, 1080p Encode/Decode, 16MP ISP, 45 MTPS 3D, Security Enabled
[Marvell product brief, May 3, 2010]
PRODUCT OVERVIEW
The ARMADA™ 618 processor is Marvell®’s latest application processor targeted for next generation, high-definition (HD)-capable smartphones. Featuring a gigahertz-class CPU, integrated full HD 1080p encode and decode, an integrated ISP capable of 16MP image capture, an integrated audio processing engine for extremely low power audio playback and exceptional high quality sound and advanced 3D graphics, the ARMADA 618 consumes extremely low power, while maintaining high processing performance at attractive price points. This allows manufacturers to deliver high-performing features in lightweight form factors, with the extended battery life that consumers look for in their smartphones.
The ARMADA 618 is based on a 1GHz Marvell-designed ARM v7-compatible CPU offering best-in-class performance. An integrated 3D engine renders 45M triangles-per-second for an immersive gameplay experience, via a complete floating point pipeline and unified vertex and fragment/pixel shading, to generate contrast-rich scenes in high definition resolution and color, ensuring complete compatibility with the most hotly anticipated mobile game titles.
With respect to video, the ARMADA 618 features Marvell’s award-winning Qdeo™ technology with an integrated video accelerator that can seamlessly encode and decode h.264 High Profile 1080p video at 30fps. In addition, the ARMADA 618 incorporates a complete Image Signal Processor which can capture high resolution color pictures as well as stream 1080p video at 30fps. This enables smartphones to access the latest HD content from the web, record and playback HD videos and capture high quality images previously only seen in SLR-class cameras.
The ARMADA 618 offers support for high performance LPDDR memory, a highly flexible display controller capable of four simultaneous displays at up to 2K x 2K resolution and a highly robust security subsystem that includes a secure execution processor. The ARMADA 618 also features support for the next generation of peripheral interfaces, through support for MIPI DSI display, MIPI CSI camera, MIPI HSI and MIPI SLIMbus. Additional peripheral interfaces supported include USB 2.0 HSIC, SD/SDIO/MMC, eMMC, HDMI w/PHY and a standard set of lower bandwidth peripherals. Legacy peripherals such as Parallel LCD and Parallel Camera interfaces are also supported. The ARMADA 618 offers optimized OS support for Linux, Android™, Windows Mobile and Flash® 10, as well as industry standard APIs. Available in both a 12x12mm POP and a 12x12mm Discrete package, ARMADA 618 customers will have one of the broadest, most flexible choices of platform in the industry to create truly innovative and marketable products.
BLOCK DIAGRAM
Fig 1. Marvell ARMADA 618 Application ProcessorAPPLICATIONS
The Marvell ARMADA 618 platform offers customers a development platform for creating ARMADA 618 based smartphones. The platform incorporates the ARMADA 618 processor, the Marvell Avastar™ 88W8787 for 802.11n Wi-Fi, Bluetooth 3.0 and FM tuner support as well as a Marvell 3G baseband for high speed cellular data and voice access. The platform demonstrates the full suite of Marvell technologies for smartphone applications in a compact form factor that is easy for developers to use with powerful expansion options for adding more platform capabilities.
Social Good Summit : Day 1 : Nicholas Negroponte [Sept 28, 2011]
One Laptop Per Child Redux [Jeff Shear on Miller-McCune, Dec 23, 2011]
Declared dead just two years ago, the plan to provide every child in the developing world with a computer shows signs of life.
The New York Times called it, “The Laptop That Will Save the World,” while the renowned Computer Graphics Laboratoryat Stanford University referred to it as “a monumental feat of engineering and design.”
Dressed up like a toy in a Kermit-the-Frog green and white plastic shell, this durable little computer was the progeny of the nonprofit organization, One Laptop Per Child.
When the laptops went into mass production in November 2007, OLPC’s ambitious plan aimed to place a free computer into the hands of the world’s 1 billion impoverished children. Education is the exit ramp off the endless road of poverty, the organization argues, and because young people naturally take to computers, the idea is to use them as a way to bridge the so-called “digital gap” between the haves and the have-nots. The little laptop is seen as both a virtual classroom and teacher, with playful software designed for self-learning and an Internet connection to the Internet Archive, which has a dedicated OLPC gateway to its 1.6 million book library.
But in 2009, Scrooge came knocking on the organization’s door, accompanied by One Laptop’s own three ghosts: rough economic times, soaring costs, and technical glitches. Tumbling financial markets crippled donations, while its skittish supporters, chiefly philanthropies and foundations, abandoned it for greener pastures. Desperate to stay afloat, it fired half its staff, and cut pay to the 32 who remained.
These days, the company has been reorganizing, rehiring, reinventing, and aggressively making its way into the developing world. As many as 3 million of the nonprofit’s laptops are now in the hands of children and educators in 46 countries spanning 25 different languages. The company has staffed back up to 53 employees, although some are temporary software writers.
And in early 2012, a new super-low cost tablet, the XO-3, will debut, with a promised price-point of $75 for the nonprofit. Significantly, the XO-3 will be available outside OLPC. One Laptop hopes to prod the big manufacturers into using their distribution channels for their own branded versions of the tablet.
This is a big change for OLPC, an acknowledgement that they aren’t the only kid on the cheap-computer block. While iPads, Kindles, and other low-cost computers and tablets are sweeping the market, none of them are designed specifically as educational devices for primary and secondary school students. Intel’s Learning Series does make the Classmate netbook, but even discounted it goes for $505.
How does a computer designed for education differ from one used for education? “A child can do anything to this software and never break it,” explains Walter Bender, a co-founder of OLPC and a former director of the MIT Media Lab that created Sugar, the XO’s user interface. “Why? When you make mistakes you’re learning. When you don’t, you’re being incremental. Yet if penalty is high for making mistakes, you stop taking risks, you stop learning. We try to give kids a safe place to do trial and error, to go out there and do it in a way they can’t screw up.”
OLPC turnaround has reignited its bravado and swagger, stunts included.
Next week, the company plans to drop XO-3 from a helicopter — Santa has gone high tech — into the hands of some the poorest 5-to-8-year-olds in the remotest regions of the world. (Sierra Leone, Tanzania, and Liberia are likely candidates ) In a recent interview appearing in New Scientist, the father of OLPC Nicholas Negroponte explained that the idea is to discover how much a child working on his own can learn from a computer with just “modest” intervention. In turn, OLPC will learn from the kids. After two years, trained researchers will return to the site to evaluate its effects.
• • • • • • • • • • • • • • •
Negroponte is recognized as one of the forefathers of the digital revolution. As chairman of MIT’s renown Media Lab, Negroponte announced the birth of the One Laptop Per Child project in January 2005 at the World Economic Forum. He carried around a prototype of a $100 laptop to meetings, and by the time he had packed his bags to fly home, he had collected letters of intent from several national leaders to buy as many as 9 million. That was very good news because the resulting economies of scale lowered costs to OLPC.
Negroponte soon sadly discovered that a letter of intent was a long way from a hard-boiled contract. Manufacturers who saw the original numbers and leapt on board to churn out laptops for $100 reversed themselves when actual orders came in for fewer than 800,000 machines, and their prices doubled.
The price hike hurt Negroponte’s grand design and also scuffed his reputation. He failed to deliver on his out-sized promises. At a well-attended technology conference in 2006, he told his audience his year-old operation — which had yet to begin mass production — would not launch without five to 10 million units in the first run. Further, he predicted that by 2008, OLPC would have 100 million to 200 million computers in place around the world.
Negroponte was both boastful and crotchety, a formula for making enemies. He was rude, too, scoffing at the idea of offering test runs to prospective countries. Speaking before a large audience, he said, “When people say we’d like to do three or four thousand [OLPC laptops] in our country to see how it works. [We say,] ‘Screw you. Go to the back of the line. …’”
And it wasn’t just Negroponte’s attitude that didn’t sit well with partners. A $100 computer selling for more than $200 looked to them like a raw deal. Some donors thought that the high cost of the laptop was eating up money better spent immunizing children from measles and providing mosquito netting to fight off malaria.
Even Miller-McCune piled on with a widely quoted story by Timothy Ogden titled “Computer Error,”which suggested that the downfall OLPC might be a blessing in disguise. Ogden argued that, “If the goal is improving education for children in the developing world, there are plenty of better, and cheaper, alternatives.”
In the world of foundations and philanthropies, charities with donations under seven-figures, view organizations like OLPC as a zero-sum game. A dollar spent here is a dollar unavailable to spend there, a large part of Ogden’s thesis. Holden Karnofsky, co-executive director of GiveWell, which evaluates charities says, “If someone only has $100,000 to donate, they’re not going to buy computers. They’re going to give to a proven global health program.”
Large foundations, however, don’t see giving as a zero-sum game. “They look for programs that work,” says Rob Reich, at the Center for Philanthropy and Civil Society at Stanford University. “To use a phrase from a different realm, they want to maximize their return on investment.”
And that’s exactly what Negroponte was trying to do as he pulled OLPC out of its 2009 tailspin. That September, he split OLPC into two nonprofits. One was a cutting-edge research foundation based in Cambridge, Massachusetts, which he chaired. The other was an association based in Miami and run by Rodrigo Arboleda Halaby, a longtime Negroponte associate and former classmate at MIT.
The business end of OLPC was left to Arboleda, whose mantra is, “OLPC is a mission and not a market.” OLPC has ever been out to make money. The association doesn’t talk about sales; it talks about “deployments.” A high-powered entrepreneur and former trustee of Save the Children, Arboleda made two significant changes to OLPC. First, he focused the association’s energies where it had its earliest and greatest successes: Eighty-percent of OLPC’s first million sales came from Latin America.
Arboleda also looked to Latin America to restaff. He hired Roberto Interiano, a former vice minister of foreign relations for El Salvador, to manage overseas operations. Dr. Antonio Battro, an Argentinian researcher in the field of “neuroeducation”became the association’s chief education officer. It was a good fit; OLPC already used his research, while Battro says, “We believe the computer gives the child access to higher levels of logical thinking.”
Arboleda’s second big move was to take OLPC off life support. “Our original financial model was devoted to donations,” he says. “You can’t go with hat in hand begging.” The association is now a contract-driven enterprise, working chiefly through governments.
And one more thing: the new tablet being introduced early next year aims square at Africa’s sweet spot. Rwanda has already deployed 110,000 OLPC laptops as part of an effort to create an industrial/service-based economyby 2020. Ten years into the program, its Ministry of Education claims nearly universal school enrollment and a dropout rate falling from 47 percent to 25 percent. Arboleda says he is thinking about dubbing 2012 the Year of Africa.
Matt Keller, OLPC’s “global advocate,” and his family will be moving to Addis Abbaba, Ethiopia, where he plans to make the Horn of Africa his base in the next nine months. “What we’re asking ourselves,” says the former legislative director of Common Cause and senior program officer for the U.N.’s World Food Program, “is whether children in non-literate communities with no access to schools can teach themselves to read by using the XO-3.”
A hundred million African children have no access to schools, let alone electric power. The back of the XO-3 tablet is a solar panel used for re-charging.
“The XO-3 is a world in a box that can be accessed by any child anywhere. My chief aim is to reach kids off the grid in remote sub-Saharan Africa,” he says of the project also being backed being backed by the artificial intelligence unit at MIT. “We want kids to be connected to other kids everywhere.
“It’s not a choice between mosquito netting, health and education,” he insists. “It’s not a zero-sum game. When kids are educated, good things happen. A generation of children who learn to think critically, analytically and rationally will change the status quo.”
Happy New Year! Reflections on OLPC in 2011 [the official OLPC blog, Dec 31, 2011]
As we prepare for 2012, here is a quick look back at the past year of OLPC. We distributed our two millionth laptop (now 2.5M), and our largest programs in Latin America (Peru) and Africa (Rwanda) grew steadily. Austria’s Julieta Rudich and Journeyman Pictures produced a fine documentary about Plan Ceibal in Uruguay (the world’s first complete olpcprogram), and Peru provided XOs and compatible robotics kits to all of their urban schools.
In East Africa, we expanded our work with African nations and donors to improve education for children across the continent. We were invited by both the African Union and the UN to open an OLPC office in Addis Ababa, Ethiopia. Addis is a major hub for African diplomacy, and the support there for our mission has been stunning. We have become a full partner of the East African Community in Tanzania, and our recent country report on Rwandahas driven further interest in the region.
A Rwandan student workshop in KigaliIn the Middle East, we continued working with the Palestinian Authority, Israel and the UN to provide thousands of Palestinian children with XO laptops, integrating them into schools. It took ten months to work the laptops through customs in Gaza. But at a forum in Ramallah in June, teachers from Bethlehem and Gaza showed how OLPC was helping to end isolation and to excite learning for their children. Third grade girls in refugee camps are teaching others and writing computer programs. The testimony of these women to the power of persistence was extraordinary.
In Afghanistan, we founded a regional OLPC Afghanistan office, and briefed General Petraeus on the project. We believe that one laptop per child and connectivity, across the country, will transform this generation and their communities. Today we are working with the Education Ministry to support four thousand children in 10 schools, and are looking into expanding in Herat Province.
On the technical side, we focused on driving down laptop power needs by switching over to ARM chips in the XO-1.75 and upcoming XO-3 tablet. The tablet should be chargable by a solar panel that could serve as its carrying-case. We are studying new waysto help children learn to read, including where there are no schools at all.
In society, the idea that every child should have access to their own computer and to the Web – as a basic part of learning, whatever their family income – continued to spread. In addition to ongoing national programs in Argentina, Portugal, and Venezuela (for secondary students), two full-saturation laptop programs for older students are developing in India – an inexpensive tablet is being distributed to university students, and in Tamil Nadudual-boot laptops from six different manufacturers are being provided to secondary students.
Reaching the least-developed countries in the world remains our goal and our most difficult challenge. While our largest deployments are funded directly by implementing governments, rural successes may be driven by foundations, NGOs, and individual donations. OLPC Rwanda, today one of the largest educational technology projects in Africa and part of a ten-year government plan, was seeded with ten thousand laptops given by Give One, Get Onedonors.
So to our supporters: thank youfor your development, contributions, and collaboration, your feedback from the field, and your encouragement! This is all possible thanks to you.
Happy New Year to all — may 2012 bring you inspiration and discovery. We have some excellent surprises planned for the new year. And we would love to hear your reflections as well — please share stories from your own school projects in 2011.
OLPC’s XO-3 Tablet to Debut at CES [IDG News, Jan 7, 2012]
One Laptop Per Child’s XO-3 tablet is ready to ship after years in the making, and working units will be shown next week at the Consumer Electronics Show in Las Vegas, OLPC founder and chairman Nicholas Negroponte said.
The tablet has an 8-inch screen and will be priced at less than US$100 as originally planned, Negroponte said via e-mail. Like OLPC’s XO-1 laptop, the XO-3 will be offered as an educational tool for children in developing countries. Negroponte declined to say if it will also be sold at retail.
The XO-3 was first announced in late 2009 with availability targeted for early 2012. At the time, skeptics questioned OLPC’s mission, accusing it of losing its educational focusin favor of designing hardware at unachievable price points.
The XO-3’s on-time release will help erase unpleasant memories of the XO-1 project, for which the laptop shipped late and at double the promised $100 price tag.
The XO-3 uses a Marvell chip with an ARM-based CPU running at 1GHz and will run Linux-based software such as Google’s Android or Chrome operating systems. It will be offered with optional technologies, such as a power-saving Pixel Qi screen and a solar charger for the battery.
“[The XO-3] price will be $100 or lower. But this time there are options, so we cannot guarantee the final price,” Negroponte said
The tablet provides about eight to 10 hours of battery life, though some audiences may choose a smaller battery capacity to reduce the purchase price, said Ed McNierney, chief technology officer at OLPC.
The internal batteries can be charged by “just about anything that produces DC power,” he said. The charging options include solar panels or hand cranks, and a study is under way to see if the battery can be detached and the tablet powered directly through a solar cell.
“Our ability to accept erratic, variable, noisy power inputs is extremely important to us, and something no other tablet has even attempted,” McNierney said.
The tablet is also available with a traditional LCD screen. But the optional Pixel Qi display absorbs ambient light to brighten the screen, reducing power consumption and extending battery life.
Eight inches is the right size for the display, McNierney said, because a 9.7-inch display is too big for children to handle, and 7 inches “seems too small to be usable.”
Microsoft’s Windows will not run on the device, only Linux-based OSes, Negroponte said. The nonprofit has abandoned its pursuit of Windows for tablets, even though Microsoft’s upcoming Windows 8 will work on ARM processors. Negroponte has said the tablet on display at CES will run Google’s Android OS.
OLPC didn’t share further specifics, but the tablet may include a camera and USB ports, according to some design details shared with IDG News Service in July, .
The XO-3 ultimately will replace the XO-1.75 laptops that are currently shipping, Negroponte said.
OLPC is not dependent on a specific manufacturer for the tabletand will work with “whomsoever wants to roll-out the tablet, for whatsoever purpose, at a very large scale,” Negroponte said, adding the objective is to see prices plummet.
As part of a two-year project to study educational development among young children in developing countries, researchers will collect data from XO-3 tablets used by three-to-eight-year-olds in India, Tanzania and Sierra Leone. Software on the tablets will record audio and video and adapt a reading platform to the needs of the children without human intervention. The project will study how children interact with the tablet and will aid in the study of tools for self-learning and critical thinking among children. One goal is to provide basic comprehension and reading, which is important in countries where teacher training is inadequate.
“In the reading experiment, where we ask can a child learn to read on his or her own, we imagine many hours of use per day, as many as six or eight. Frankly, the reading experiment may be the most important thing I have ever done….if it works,” Negroponte said.
The study will be run out of the MIT Media Lab and be conducted in partnership with Tufts University, Newcastle University, and OLPC.
OLPC XO-3 tablet delayed [networkworld, Nov 3, 2010]
OLPC XO-3 Tablet Delayed [IDG News, Nov 3, 2010]
Nicholas Negroponte, chairman of One Laptop Per Child said that the XO-3 tablet computer will debut sometime in February 2011, about 45 days later than originally planned.
Negroponte said that he wants the screen to be flexible so that it is more resistant to breaking, but that it doesn’t need to roll up.
“The issue has been really finding an unbreakable material, which may not be plastic, it may be glass or some flavor of glass,” he said during a video interview at MIT.
At first the XO-3 won’t be branded OLPC, rather made by Marvell, with the actual XO-3 to follow.
The tablet will eventually cost US$75 and during a May 2010 interview, Negroponte said hitting that mark wouldn’t be a problem.
Sitting in his sparse office in the MIT Media Lab, which he founded 25 years ago, Negroponte said that the job of the XO-3 is “pushing where normal market forces wouldn’t otherwise.”
“We’re going to push down on price, we’re going to push on non-breakable, we’re going to push particularly on power because we want to hand crank these things,” he said. “Our characteristics are ones that the market wouldn’t do normally, but that we will bring sooner or prove that can be done.”
Once the XO-3 tablet does debut, it will co-exist “for some time” along with the original laptop.
“It is unclear to us now both in the labs and imagining the future if the haptic version of the tablet keyboard is going to be sufficient to allow you to use it as a general purpose computer,” Negroponte said.
Nick Barber covers general technology news in both text and video for IDG News Service. E-mail him at Nick_Barber@idg.com and follow him on Twitter at @nickjb.
The new, high-volume market in China is ready to define the 2012 smartphone war
Follow-up: Boosting the MediaTek MT6575 success story with the MT6577 announcement [June 27, 2012]
– China TD-SCDMA and W-CDMA 3G subscribers by the end of 2011: China Mobile lost its original growth momentum [Jan 21, 2011]
Updates: China market: Local vendors to roll out CNY300 smartphones [DIGITIMES, July 13, 2012]
China-based handset makers are ready to begin volume shipments of smartphones priced at CNY300 (US$50) in the second half of 2012 compared to the previous focus on CNY600 models in the first half of the year, according to industry sources.
Competition among chipset solution vendors, promotions by telecom carriers, and the rise of new brands in China have contributed to the rapid decline in prices of smartphones in China, the sources revealed.
The top-3 telecom carriers had previously focused purchases on smartphones with a price tag of CNY1,000, but some local handset makers are now willing to offer quotes at around CNY500 in order to win orders, said the sources, adding that the pricing will serve as an indication for channel operators to follow.
While quotes for 2G smartphones in China have already dropped to below US$50, prices for 3G models currently range from US$60-80 and are expected to reach US$50 soon, the sources asserted.
Sub-CNY1,000 smartphones accounted for 21% of all smartphones sold in China in the first quarter of 2012, compared to a ratio of 12% a year earlier, according to IDC.
– China market: Nearly 195 million handsets shipped in 1H12 [DIGITIMES, July 10, 2012]
There were 194.913 million handsets shipped in the China market during the first half of 2012, consisting of 106.874 million (54.83%) 3G handsets in 801 models and 88.039 million (45.17%) 2G handsets in 1,298 models, according to statistics published by the China Academy of Telecommunication Research (CATR) under the Ministry of Industry and Information Technology (MIIT).
Of the shipment volume, 94.855 million or 48.67% were smartphones in 822 models of which 801 models or 97.44% were based on Android. China-based vendors accounted for 75.16% of the half-year shipment volume, and international vendors 24.84%.
The monthly shipment volume of smartphones exceeded that of feature phones for the first time in April 2012, with the corresponding proportion increasing to 56.9% in June.
China market: Breakdown of total handset shipment volume, 1H12 Generation Technology standard
Number of models
Shipment volume (m handsets)
3G WCDMA (China Unicom)
476
53.099
CDMA2000 (China Telecom)
174
28.197
TD-SCDMA (China Mobile)
151
25.578
2G GSM
1,272
81.915
CDMA1x
26
6.076
Source: CATR under MIIT, compiled by Digitimes, July 2012
– Second- and third-tier handset makers in China may not adopt Windows Phone 8 platform [DIGITIMES, July 5, 2012]
Microsoft has been eager to promote Windows Phone 8, Windows 8 and Windows RT. Despite having partners such as Nokia, Samsung, and HTC for Windows Phone 8, severe price competition in China will likely prevent second- and third-tier handset makers from switching from Google’s Android.
China-based handset makers have been aiming at customers switching from feature phones to smartphones for the first time and hence have little desire to adopt new platforms.
Industry sources indicated that competition in China’s smartphone market has been cutthroat. First-tier brands such as ZTE, Huawei, Coolpad and Lenovo have been introducing models at the price range of CNY1,000 (US$157). To increase market exposure, second-tier brands such as Haier and Konka have been introducing models below CNY500 in efforts to obtain cooperation with telecommunications service providers. The price difference is significant, said industry sources.
Microsoft hopes to increase market share in China’s smartphone market. However, Windows Phone 8 is unlikely to compete with Android in features such as localized applications and marketing resources, added industry sources.
Nevertheless, Microsoft has been adding new alliances such as Huawei and ZTE. Industry sources believe the two firms hope to generate more profits by providing products with different platforms.
– China smartphone market 2012: Trends and analysis [DIGITIMES Research, July 3, 2012]
Abstract
The China handset market has exhibited strong growth, with the total number of mobile users in the country reaching 980 million people according to figures from the Ministry of Industry and Information Technology (MIIT), an increase of 130 million over the 2010 figure. Digitimes Research estimates that mobile user numbers could top 1.13 billion in 2012.
Digitimes Research estimates that the China handset market reached some 390 million units in 2011, representing 16% growth on 2010; the market is likely to grow to 430 million units in 2012, representing further growth of 9%. Thanks to the expansion of 3G service coverage and further falls in budget smartphone prices, the share of the handset market accounted for by smartphones is likely to reach 32% or around 143 million units, 70% of which will be Android handsets.
Digitimes Research believes that market share rankings for the China smartphone market will change significantly during 2012. Samsung and Apple will take the top two places, while the big four China-based brands – Huawei, ZTE, Lenovo and Coolpad – will take third to sixth places, while Nokia will drop to seventh; these seven firms will collectively account for 85% of shipments.
In other words, the many other brands hoping to seize a share of the market will essentially be confined to competing for a potential market of just 15% of overall shipments or around 21 million handsets. Given such a situation, Digitimes Research projects that many of China’s best known smaller brands such as Xiaomi, TCL, Gionee, Tianyu, Oppo and BBK will see shipments of no more than a few million handsets.
– China-based white-box vendors expected to ship 200 million smartphones [DIGITIMES, April 17, 2012]
China-based white-box vendors, mainly due to the availability of inexpensive new chip solutions, have been increasing the production of smartphones, with the total shipment volume expected to reach 200 million units in 2012, according to industry sources in Taiwan.
Taiwan-based MediaTek is offering the makers its MT6575 a chip solution for use in entry-level smartphones in the first quarter of 2012 and will offer the MT6577, a solution for high-level smartphones, in the middle of the third quarter of 2012, the sources indicated. MediaTek will ship 50-70 million chips to China-based white-box vendors to account for nearly 30% of smartphones to be shipped by these vendors in 2012.
In addition, Qualcomm has strengthened its marketing in the China market by offering turn-key solutions to white-box vendors, with prices for a chips lowered to US$6, the sources cited eMedia Asia as indicating.
China-based white-box vendors sell more than 60% of their smartphone output to overseas markets, including 2.5G models for markets where deployment of 3G networks is not mature yet, the sources indicated. White-box vendors are expected to see larger market demand if their production costs for entry-, medium- and high-level smartphones drop to US$60, US$85 and US$130 respectively, the sources pointed out.
– China market: Handset makers upgrading hardware specifications of sub-CNY1,000 smartphone models [Feb 17, 2012]
China-based handset makers, including ZTE, Huawei Device, Lenovo and Coolpad, have continued to upgrade the hardware specifications of their sub-CNY1,000 (US$159) smartphone models due to intensifying competition in the segment, according to industry sources.
With the introduction of dual-core 1GHz CPUs for high-end models in 2011, the single-core 1GHz CPU is likely to become one of the standards for entry-level smartphones in China this year, the sources indicated.
Additionally, some vendors have also begun to adopt 4-inch displays for their sub-CNY1,000 models, instead of 3.5-inch displays used previously, the sources added.
Coolpad has recently launched a 4-inch model, the 7260, and saw sales of the model reach 30,000 units a month in the initial period, the sources revealed, adding that monthly shipments of the 7260 may top 100,000 units soon.
– China handset makers to push sales of sub-CNY1,000 smartphones to mature markets [Feb 16, 2012]
Having mass-produced smartphones with a price tag of around CNY1,000 (US$159) for the China market since 2011, China-based handset makers ZTE, Huawei Device, Lenovo and Coolpad plan to push the sale of sub-CNY1,000 smartphones to mature markets including North America and Taiwan, according to industry sources.
Sales of smartphones by Coolpad, Lenovo, ZTE and Huawei combined currently account for 30-40% of China’s smartphone market, with the ratio likely to surpass 50% by year-end 2012, the sources estimated.
In the Taiwan market, Coolpad has recently a WCDMA model with a suggested retail price of NT$5,990 (US$203). However, the company plans to launch more entry-level smartphones later and aims to take up a 3-5% share in the segment. Coolpad shipped about 270,000-280,000 CDMA models in Taiwan in 2011, the sources revealed.
– Chinese smartphone market sees explosive growth [Feb 16, 2012]
Judging from the structure of the smartphone market in 2011, Chinese smart terminals brands such as ZTE and Huawei seem to be on a trend of full-scale explosion. Having been suppressed by foreign brands for a long time, Chinese smartphones begin to take a solid footstep in the smartphone market by working closely with telecommunication operators and making full use of their “Chinese characteristics”, breaking the old pattern of market that has long been dominated by foreign brands. According to industrial participants, Chinese brands are rising in the 3G era.
According to media report, the Coolpad 7260, one of China Unicom’s 1000-Yuan smartphones, created a record sales of 110,000 units three days after it was put on the market, refreshing the shipment volume record of 1000-Yuan Chinese 3G smartphones, scoring a victory in its first battle. Also, this number gives the market more expectation for Unicom’s 8 new models of 4.0 series “WO 3G” 1000-Yuan smartphones that are co-launched by China Unicom and technology-intensive Chinese mobile phone manufacturers.
It is learned that these new 4.0 series 1000-Yuan phones boast three major features: big, fast, and HD. Big screens, previous 3.5-inch screens are replaced by 4-inch screens; fast processing speed, previous 600MHz CPUs are replaced by CPUs that are higher than 800MHz now; fast upload speed, supporting HSUPV; fast running speed, memory upgrades from 256M in the past to 512M now. High-definition picture taking, camera are required to increase from 2-3 million pixels to 3-5 million pixels.
According to person from China Unicom, the re-defined 1000-Yuan smart terminals introduced by China Unicom in May, 2011, and the numerous star terminals subsequently co-produced by China Unicom and Chinese mobile phones manufacturers have won excellent market response. Among these products, ZTE’s V880 scored daily sales of more than 10,000 units and monthly sales of more than 300,000 units. After months of promotion, the 1000-Yuan smartphones strategy remains effective, propelling the fast growth of China Unicom’s 3G subscribers.
In November, Unicom’s net growth of 3G subscribers was as high as 3.384 million with total 3G subscribers amounting to 36.534 million, making it the operator with the fastest 3G subscriber growth rate. This indicates that 1000-Yuan phones have accumulated significant subscriber base in the market and have established some brand effect. Presently, China Unicom makes use of the favorable conditions and defines the standards of 4.0 series 1000-Yuan smartphones, and offers high subsidy for the newly defined 4.0 series phones, with the purpose of making deployment in the middle-end market and grab a say of Chinese smart terminals in advance.
According to industrial participants, “users-friendly price and high-end experience” is the key to the success of China Unicom’s customized 1000-Yuan smartphones. Consumers’ favor for China Unicom’s customized terminals comes from its preferential subsidy policy, rather high-end configuration, and the user experience brought by the WCDMA network. Market research statistics show that the number of 3G subscribers worldwide in 2011 approached 1.3 billion, of which WCDMA subscribers accounted for 76 percent. In China, as per October 2011, WCDMA smartphones accounted for 69 percent of all 3G smartphones. Currently, China has become the largest smartphone market in the world, with nearly 70 percent of the phones being WCMDA. It is thus quite clear that WCDMA mobile phones are the mainstream in China and even all over the world.
Industrial participants point out that with the rapid development of smart terminals in the 3G era, the competition pattern of the mobile phone market will become even more complicated. In the meantime, the industry thinks positively of the marriage between domestic mobile phones and China Unicom’s WCDMA. Amidst the fierce competition of the terminal market globally, however, Chinese smartphones need to understand the market better, and puts more efforts in products R&D and brand image improvement, hoping to evolve from the “copycat” image to a national brand as soon as possible.
End of updates
The new high-volume smartphone market has been established by China Unicom with Lenovo and ZTE involvement from August 2011 on under the so called ‘RMB 1000’ [US$158] inititiative of the carrier.
As visible on the chart (see left) China Unicom was able to return to the previous 10% month/month growth rate of the 3G subscribers as the result of this approach. Unicom’s main rival the much bigger China Mobile was, however, unable to sustain that growth rate. One of the reasons is certainly the fact that China Unicom has so far been the only Chinese operator with official iPhone offerings. By looking to the enlarged picture of the chart for the August-November period one can nevertheless see that the gap in month/month growth rates of the two companies has been steadily growing. This cannot be explained in other ways than by this 1st stage of the ‘RMB 1000’ initiative. Since in the end of December the initiative has been extended to the RMB 1500 [US$238] price cap with not less than 8 models joing the offerings under this umbrella, this will define an obvious smartphone war for 2012.
The first stage of this initiative has already radically redefined the 3G smartphone market for W-CDMA customers in China:
– the ‘RMB 1000’ [US$158] Android phone (Lenovo A60) has slightly better graphics performance than either the 4.26x more pricey iPhone 3G S or the 1.62x more pricey best classic Android phone (Sony Ericsson WT19i)
– the Dhrystone performance of that phone is quite enough comparing to both (2/3d of the iPhone and 4/10th of the Sony Ericsson device)
| Smartphone and its availability (+ recent price) |
Lenovo A60
|
Sony Ericsson WT19i
|
Apple iPhone 3G S
|
| DMIPS | 812.5 | 2100 | 1200 |
GLBenchmark 2.1 Egypt High
|
|||
|
2787 (3174) | 2653 (4806) | 2714 (3352) |
|
2765 (3159) | 2653 (4806) | 2646 (2913) |
|
2757 (3155) | 2653 (4806) | 2646 (3257) |
| Screen size | 480 x 320 | 480 x 320 | 480 x 320 |
| SoC w/ core inside |
MediaTek MT6573 w/ 650MHz ARM11 |
Qualcomm MSM8255 w/ 1GHz Scorpion |
Samsung S5PC100 w/
|
| GPU inside the SoC |
PowerVR SGX 531 |
Adreno 205 |
PowerVR SGX 535 |
Note: For realistic graphics performance the results of the ‘High’ version of the GLBenchmark 2.1 are used here since this is showing how the GPU is performing in high-quality rendering with “multi-sample anti-aliasing and at least 24 bits of color- and Z-buffer depths”. Also the results are shown here for the so called ‘Egypt’ benchmark as it “tests OpenGL ES 2.0 and represents the newest and most demanding benchmark” according to Anandtech. To understand what we are talking about here is also a video demonstration of the 2.1 Egypt benchmark by the globally recognized and accepted creator of it, Kishonti Informatics Ltd:
Since China Unicom launched the second stage of its ‘RMB 1000’ in the end of December, when not less than 8 models with a higher, 1500 [US$238] price cap have been joining the offerings, we can safely argue that what is happening now in China will apply to the global markets as well. We have already shown in an earlier post that China becoming the lead market for mobile Internet in 2012/13 [Dec 1, 2011], so there is no question about that.
Please find below a collection of all related information. It is necessary to highlight here the fact that with the higher, 1500 [US$238] price cap we are already in the 1.0 GHz Cortex-A9 and A5 CPU performance territories which mean 2500 and 1570 DMIPS respectively. The screen is also larger, 4” as well as the resolution is 800×480.
Another thing that needs to be highlighted here is China Unicom’s very attractive contract plan, described below as:
Customers who select the RMB 96 [US$15] per month two-year contract plan can receive the handset for free with a RMB 1,599 prepaid deposit. Users who purchase a smartphone without a contract plan for RMB 1,299 can later select a two-year contract plan starting at RMB 46 [US$7.3] per month and receive free calling credit.
NOW THE DETAILED COLLECTION
China Unicom Releases Eight Low-cost 3G Smartphones [Marbridge Daily, Jan 4, 2012]
During a recent [Dec 26, 2011] event in Beijing, China Unicom (NYSE: CHU; 0762.HK; 600050.SH) unveiled eight new “RMB 1,000” smartphones with 4-inch displays and CPUs clocking up to 1 GHz, as well as announcing its 3G smartphone policy for 2012.
The eight phones, all priced under RMB 1,500 [US$238], including China Wireless Technologies (2369.HK) subsidiary Yulong’s Coolpad 7260, the Hisense (600060.SH) HS-U8, ZTE (0763.HK; 000063.SZ) V889D, Huawei U8818, Lenovo (0992.HK) A750, TCL Communication Technology (2618.HK) W989, Amoi N89, and Philips W635. The Coolpad 7260 and Hisense HS-U8 hit the market in late December 2011.
Unicom expects China’s RMB 1,000 smartphone market to reach 90 mln units sold in 2012, while 60 mln smartphones priced between RMB 1,000 and RMB 2,000 will be sold, including both well-known domestic and international brands. Unicom expects the iPhone to continue to be the carrier’s flagship strategic product in the high-end RMB 2,000 or more smartphone market, and Unicom will continue to strengthen its line-up of operator-customized Android smartphones as well as a range of Windows Phone handsets. Unicom will also push dual-mode, dual-standby, dual-SIM smartphones.
The WCDMA/GSM dual-SIM, dual-standby Coolpad 7260 features a 4-inch WVGA 16 mln color HD multitouch display, Android 2.3, and Coolpad’s secure cloud services. The Hisense HS-U8 WCDMA/GSM dual-SIM, dual-standby smartphone is 1.6 mm thick and features a 5 MP autofocus camera and 3 MP front-facing camera. Both are available with contract plans. Customers who select the RMB 96 [US$15] per month two-year contract plan can receive the handset for free with a RMB 1,599 prepaid deposit. Users who purchase a smartphone without a contract plan for RMB 1,299 can later select a two-year contract plan starting at RMB 46 [US$7.3] per month and receive free calling credit.
China Unicom’s 3G network already covers 341 cities and over 95% of county towns nationwide. HSPA+ peak downlink speeds reach up to 21 MB in 56 key cities. Nearly 20,000 Unicom service centers offer 3G services, as well as nearly 10,000 non-operator stores run by hundreds of major retail chains. Unicom 3G service is also available through mainstream e-commerce channels. According to a source within Unicom, non-operator channels contribute over 50% of China Unicom’s 3G growth.
According to an industry source, China has 900 mln handset users, 90% of whom have a handset priced under RMB 2,000.
Regarding the full contract plan the only available information is from the Chinese press release: China Unicom released eight new definition of thousands of intelligent machines new 4.0 series [translated by Google, Dec 26, 2011]
Attachment: Cool 7260, Hisense HS-U8 contract plans
(A) “Stored send phone calls” contract plan
(B) “purchase mobile phones to send calls” contract plan
China Unicom releases low-end smartphones to woo 3G users [Want China Times, Dec 28, 2011 ]
A China Unicom promotion offers free smartphones paired with 3G service packages.China Unicom, one of China’s three major state-run telecom operators, has teamed up with several local cell phone vendors to launch its latest low-end smartphone in a bid to attract more 3G users.
Along with eight handset vendors — including Hisense, ZTE and Huawei — China Unicom on Monday unveiled its latest low-end smartphone, marketed as the “1,000-yuan (US$158) smartphone 4.0.” The new smartphone is equipped with a 1GHz processor and 4.0-inch screen, an improvement over the 3.5-inch screen of an earlier model.
The launch is widely seen as a move to attract more phone users to 3G smartphones. The number of [W-CDMA i.e. China Unicom’s] 3G users in China has increased to over 36 million, just three years after 3G licenses were made available in 2009.
“(The phone) is a win-win situation for chip makers, cell phone manufacturers and distribution vendors, and the boost in the 3G business is attributable to inexpensive cell phones,” said China Unicom general manager Lu Yimin.
“The launch of the inexpensive 4-inch-screen phone signals that the battleground has shifted from high-end phones to mid- to low-end phones,” said Fu Liang, an independent analyst.
Telecom operators agree that lowering the prices of 3G smartphones will be key in bringing the technology to 2G subscribers, who mainly use mobile phones to make calls, the analyst said. They realize that a price tag of 1,000 yuan will be instrumental in initiating that shift, the analyst said.
The boost to business is most obvious among handsets jointly launched by Chinese electronics makers Lenovo and ZTE. The two companies currently lead the market for phones that use the WCDMA network standard, with Lenovo selling 340,000 of its A60 phones and ZTE selling 240,000 of its V880 handsets per month, according to an analyst. In 2012, the analyst estimated, the number of phones priced under 1,000 yuan will climb to 90 million, while those priced between 1,000 and 2,000 yuan (US$316) will number around 60 million.
China Unicom has seen its 3G subscribers rapidly increase since it partnered with cell phone vendors such as Huawei and Lenovo to roll out inexpensive models in China. According to data from the three major telecom operators in China — China Unicom, China Telecom and China Mobile — 3G subscribers using China Unicom’s network increased to by 3.38 million in November, while China Mobile and China Telecom saw their 3G users rise to by 2.68 million and 2.16 million, respectively.
China Unicom today released an upgraded version of the new definition of thousands of intelligent machines 4.0 [Google translation, Dec 26, 2011]
… The first listing contains the models are Coolpad 7260 [酷派 Yulong], Hisense [海信] HS-U8, ZTE [中兴] V889D, Huawei [华为] U8818, Lenovo [联想] A750, TCL A996, Amoi [厦新] N89 and Philips* W635 …
…
* Sang Fei [桑菲通信]:
Sang Fei is one of China’s biggest mobile communication enterprises with a large export market and a fast-emerging domestic brand presence. A core subsidiary of China Electronics Corporation (CEC) [a highly specialized contract manufacturer in Taiwan] and SED Group [Shenzhen SED Industry Co., Ltd., a state-owned enterprise, which contains 20 solely-funded enterprises and Joint Ventures enterprises, is a publicly listed company on the Shenzhen Stock Exchange [from: the staff is over 5000, the yearly turnover is over 1000 million of U.S Dollar]] …
…
Sang Fei has evolved into a multi-million mobile communications player on the international stage since it was established in 1996 as a joint venture between electronics giant Royal Dutch Philips Electronics Ltd and SED. In 2007, its official buyout of Philip’s global mobile phone businessof Philips, backed by decades of knowledge transfer from the Dutch company, marked the beginning of a new chapter in Sang Fei’s history.
Although it has retained the world-famous Philips brand for its mobile phone products, Sang Fei has stamped its own mark on the business. With an accumulated output exceeding tens of millions, its mobile phones are well recognized by both the industry and customers from home and abroad …
Platform Qualcomm Snapdragon S1 [Google translation, Dec 26, 2011]
… Five models are using Qualcomm Snapdragon S1
- Coolpad 7260
[MSM7227T based with 800 MHz ARM11 processor, 4” display],- Hisense HS-U8
[MSM7227A based with Cortex A5 processor],- ZTE V889D
[MSM7227A based with 1.0 GHz Cortex A5 processor, 4” display],- Huawei U8818 [MSM7227A based with 1.0 GHz Cortex A5 processor, 4” display] and
- Philips [Sang Fei] W635 [MSM7227A based with 1.0 GHz Cortex A5 processor, 4” display]. …
[i.e. Lenovo A750, TCL A996 and Amoi N89 are not:
- Lenovo A750 has MediaTek MT6575 SoC with a 1.0 GHz Cortex-A9 core and HSPA+ support, and 4” display
- Amoi N89 quite probably has MediaTek MT6575 SoC with a 1.0 GHz Cortex-A9 core … as well
- TCL A996, meanwhile has the following specifications:
- Network standard: GSM / WCDMA
- Size: 123 × 65.5 × 12.9mm
- Screen: 4.0 inch IPScapacitive screen resolution of WVGA (480 × 800)
- Battery Capacity: 1500mAh
- Standby time: 300 hours
- Talk time: 4 hours
- Operating System: Android 2.3
- Processor: [Broadcom ARM11-based] BCM 21552
- Memory: RAM 512MB/ROM 512MB, support Micro SD expansion (up to 32GB)
TCL increases smartphone sales 24x to over 1 mln units [Dec 9, 2011]
Chinese handset maker TCL shipped 1.1 million smartphones as part of the 39.15 million units of mobile phones and other products it sold in January-November, 24 times more than the 42,384 smartphones it shipped in the year-earlier period, when total product shipments stood at 39.15 million units. Due to the increasing popularity of handsets that carry social networking functions, the group continued to launch more Facebook phones, strengthening its brand reputation and expanding market share. In November, FrenchTelecom-Orange announced that it would launch the first of three new phones featuring a Facebook key, the Alcatel One Touch 908F. TCL said that the Alcatel phones with Facebook keys are set to be launched across Africa and Europe before the end of the year. TCL, which produced the Vodafone 555 Blue phone as a white-label product, expects its Alcatel One Touch branded phones to raise the product mix towards higher revenue-earning smartphones. TCL is also involved in future mobile technologies, including Terahertz spectrum (0.1-10THz). Still not fully utitilised, the band is being considered in China where TCL has produced a phone supporting THz communications, the Xianguyn A919.
Top TCL Executive Visits Taiwan’s Electronics Makers With Huge Procurement Hint [Dec 7, 2011]
Taipei, Dec. 7, 2011 (CENS)–TCL Corp. Chairman and Chief Executive Officer Li Dongsheng said his company will not limit spending on procurements of Taiwan’s electronics products when recently visiting some Taiwanese electronics heavyweights, including chip vendor MediaTek Inc.
TCL, currently the world’s 25th biggest producer of household appliances, plans to ship 12 million LCD TVs and 50 million mobile phones in 2012. Industry executives estimated the company to budget more than US$1 billion for sourcing Taiwan’s electronics products next year.
Among Taiwan’s contract suppliers on TCL’s outsourcing lists are MediaTek Inc., AU Optronics Corp. (AUO), and Chimei Innolux Corp. Li visited MediaTek’s and AUO’s Taiwan headquarters a few days ago. He said his talk with MediaTek Chairman M.K. Cai mainly focused on cooperation over smartphone development.
However, both AUO and MediaTek executives declined to comment on the meetings.
TCL is now MediaTek’s biggest customer, purchasing up to 30 million mobile phone chipsets from MediaTek in 2010. Li touted that TCL is already among the mainland’s first-tier handset makers, shipping around 45 million systems in 2011. The company shipped 36.2 million mobile phones in 2010.
Taiwan’s industry executives noted that TCL is also one of MediaTek’s major customers of TV chips. TCL has reportedly designed MediaTek MT6573 chip, MediaTek’s first 3.75G 3.5G smartphone chip unveiled early this year, into its mobile phones. MediaTek’s 3D TV chip launched early this year has also entered into TCL TVs.
Handset chips and TV chips have accounted for over 90% of MediaTek’s revenue.
Li pointed out that unlike tepid LCD TV demands in Europe and North America, the mainland’s LCD TV market will grow at least 10% in 2011. He estimated the mainland to turn out a total of 90 million LCD TVs throughout this year, with nearly half of which set aside for the mainland’s domestic market. Although TCL has secured supply of 30 million LCD panels with LCD maker BOE Co., Ltd. of the mainland, the volume is far short of its demand.
Li stressed that his company has entered into cooperation with LCD maker AUO and several Taiwanese LED makers to ensure steady supplies for its TVs.
Backend firms gearing up for new MediaTek solution [Dec 23, 2011]
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and substrate makers Unimicron Technology and Kinsus Interconnect Technology are all getting ready for the launch of MediaTek’s MT6575 single-chip solution, according to industry sources.
The upcoming MT6575 will run at 1GHz – an upgrade from 650MHz that the predecessor MT6573 has – targeting growing demand for low-cost smartphones. MediaTek adopts the advanced 40nm process for its MT6575 chip line, and uses wire bonding instead of flip-chip packaging in the products for cost reasons, the sources indicated.
[from: MediaTek MT6575 chips [are] using the new 40-nanometer process, compared with the previous generation chip [the] MT6573 [is] smaller, [the] single-wafer die production is up to 1,200 pieces, [which is] an increase of nearly 50%, [thus] help[ing to] reduce costs.]MediaTek has delivered samples of the new MT6575 solution for design-in to about 40 companies since December, the sources said. It expects to start shipping in volume to customers between January and February 2012, the sources noted. [from: first in December for a small amount of trial production, about 400,000 single month]
Shipments of MediaTek’s MT6575 solution are likely to top 1.5 million units in January, and further expand to three million in February, the sources estimated. The anticipated boost in shipments will buoy sales at its backend suppliers in the first quarter of 2012, the sources said.
ASE remarked at its most recent investors meeting that shipments would decrease 3-4% sequentially in the last quarter of 2011. Looking forward, fewer working days in January might affect the company’s sales performance, said ASE, without elaborating further.
Kinsus has estimated flat sequential growth in fourth-quarter sales. Sales for the first quarter of 2012 would slide as a result of seasonal factors, the company said.
From a MediaTek product document:
MT6573(ap+modem+pmu) + MT6162(rf) + MT662(wifi,gps,bt,fm)
MT6573: ARM11 AP, ARM9 Modem processor,HSPA。
MT6573: 8 Mega pixel camera, OpenGL ES2.0MediaTek MT6573 is a highly integrated 3G system-on-chip (SOC) which incorporates advanced features like HSPA R6 modem, 650MHz ARM11 CPU, 3D graphics(OpenGL|ES 2.0), 8M camera ISP, LPDDR 400MHz, FWVGA(854×480) video decoder. MT6573 can helps phone manufacturers build high performance 3G smart phone with PC-like browser, 3D gaming and cinema class home entertainment experience.
World-Leading Technology:
Based on MediaTek’s world-leading mobile chip SOC architecture and 65nm advanced process, the MT6573 is the grand new generation smart phone SOC. It integrates the MediaTek HSPA R6 modem, 650MHz CPU, 3D graphics, FWVGA video decoder and power management unit.
Rich Feature for High Valued Product:
To enrich camera feature, MT6573 equips a 8M camera ISP with advanced features like auto focus, anti-handshake, continuous video AF, face detection, burst shot, optical zoom, panorama view and 3D photo.
Incredible Browser experience:
The 650MHz CPU brings PC-like browser experience and help accelerate OpenGL|ES 2.0 3D Adobe Flash 10 rendering performance to an unbeatable level.
3G chip market opening price war or acceleration of intelligent mobile phone [Dec 15, 2011]
… With MT6573 scenery, MediaTek then released their latest MT6575, treatment efficacy faster, as high chip MSM7227A. Frequency up to 1GHz, using ARM CortexA9, support for HSPA+. By comparison, MT6573 is inferior many, the chip using ARM11 AP processor frequency is 650 MHz, modem support HSPA speed of 7.2Mbps / 5.76Mbps. …
MediaTek reiterates 4Q11 sales guidance [Dec 29, 2011]
Following a report regarding falling feature phone and smartphone demand in China, MediaTek has said its sales guidance for the current fourth quarter should remain on track. MediaTek expects fourth-quarter sales to fall somewhere between a decrease of 2% to an increase of 5% sequentially.
MediaTek’s consolidated revenues for October and November totaled NT$15.16 billion, already making up 62-66% of the company’s targeted NT$22.9-24.5 billion for the fourth quarter.
Industry sources were quoted in a recent report suggesting a recent slowdown in chip orders from China’s handset market would imply an early arrival of the low season. Many Taiwan-based handset chip suppliers, which rely heavily on the China market, might report 5-10% sequential decreases in December revenues, the sources were quoted as saying.
Qualcomm cuts chip prices for Chinese smartphones [Dec 25, 2011]
Deep price cuts in new dual-core chips produced by American telecom equipment manufacturer Qualcommand used in smartphones produced in China could intensify competition between the company and Taiwan-based integrated circuit designer MediaTek.
The move marks the beginning of a new round of price slashing, Gao Guiming, senior vice president of A’Hong Communication & Digital Information, told the Shanghai-based First Financial Daily.
The US$7 reduction in the price of Qualcomm’s new dual-core chips will pit the company in direct competition with MediaTek in the market for smartphones priced at around 1,000 yuan (US$158). Gao pointed out that MediaTek remains a follower in the smartphone market and that Qualcomm’s price cut will force the Taiwanese firm to follow suit in order to expand its market share in China.
Smartphone shipments in China reached 24 million units in the third quarter of 2011, surging 58% from the second quarter and leading the country to pass the US as the world’s biggest market for the devices, according to data compiled by research and consulting firm Strategy Analytics. Total sales volume in China is projected to expand to 153 million phones in 2012.
Qualcomm’s latest price cut signals its plan to supply smartphone manufacturers with “public boards” designed for common use by various producers to quickly develop low-cost handsets.
Qian Zhijun, product director at Qualcomm China, revealed at a summit on smartphones held in Shenzhen last month that his company’s new research and development center in Shanghai will help producers shorten the time needed to roll out new products. Qualcomm aims to use its QRD development platform to help producers put new models on the market within 30-60 days, compared with the more than six months required today.
Sources at MediaTek say there is still no news about the company’s possible plans to cut prices in response. MediaTek president Hsieh Ching-chiang stressed in November that providing customers with low-cost customized chips has long been the company’s forte and that the smartphone sector will see little change.
Hsieh implied that MediaTek still has an advantage over Qualcomm in terms of offering more comprehensive services to clients. He revealed that MediaTek has shifted most of its resources to the smartphone sector. Hsieh expects the company’s shipments of dual-core chips for intelligent handsets to double to 20 million sets in 2012.
Liu Wenquan, an industry analyst based in Shenzhen, says an intense price war is unlikely in the near future as aggressive promotion by Chinese telecom service carriers has brought about skyrocketing demand for low-cost smartphones. MediaTek’s MT6573 chips are still in short supply, he said.
Analysts said Qualcomm’s major targets in China are larger smartphone producers, not mobile phone copycats. Senior vice president Jeff Lorbeck stated that the QRD development platform will be open mainly to companies that have already won Qualcomm technology certification and authorization.
Further, Qualcomm’s price still hovers about US$10 higher than similar products from MediaTek, which maintains the advantage of higher flexibility as well as closer and smoother communication with Chinese smartphone manufacturers.
Gu Wenjun, an analyst at market research firm iSuppli, said the Chinese market is too big and diverse for any single chip supplier to maintain a dominant role. The best policy for Qualcomm and MediaTek is to take better care of their largest clients, he suggested. Smartphone manufacturers are expected to continue the policy of choosing two or even three core chip suppliers in order to produce a variety of smartphones to satisfy consumers’ tastes, added Gu.
ZTE Skate [V960] Review CNET [cnetuk, Nov 23, 2011]
In this video review, Amie Parker-Williams does a double take when she gets her mitts on the ZTE Skate, the identical twin of the Orange Monte Carlo. While the two phones may have been cast in the same mold in terms of design, the Skate thankfully comes without the Orange bloatware, and is better off for it. Hit play to take a closer look at this glossy Android blower.
China Unicom Hopes To Sell Cheaper Phones Next Year [Dec 20, 2011]
Chinese telecom operator China Unicom announced its strategic focus for 2012 and said it will focus on the sales of phones with the prices between CNY1,000 and CNY2,000.
On December 12, 2011, China Unicom and ZTE, the Chinese telecom equipment maker, jointly launched a customized phone named Skate V960, which is recognized as a strategic productby Yu Yingtao, general manager for the sales department of China Unicom.
Yu previously revealed during an interview that many manufacturers were developing phones with the prices between CNY1,000 and CNY2,000 and China Unicom will bring surprises to users in 2012. The company plans to introduce more cost-effective products then.
Following the launch of Skate V960, other Chinese and International makers such as Huawei, Motorola, HTC, and Samsung will provide more options in this price range, said Yu. Products of this price range hold a 20% share of the market in China, which means a user group of about 50 million people. Therefore, China Unicom will cooperate with first-class makers in China and the world to meet the demands of these consumers.
However, Yu pointed out that it does not mean the company will focus less on smartphones with prices lower than CNY1,000, because these products own 63% share of the market and more international brands expressed their intention to launch CNY1,000 smartphones. According to Yu, for the year 2011, China Unicom’s sales of CNY1,000 smartphones made by ZTE, Huawei, Lenovo, Coolpad, and Amoi is expected to be over 10 million units.
ZTE SKATE [V960], Smart Choice, Bright Life [ZTEGlobal, Sept 22, 2011]
ZTE Smartphone Sales Top 12M Units [Dec 13, 2011]
ZTE Corporation (000063, 0763.HK) has met its 2011 annual sales target of 12 million smartphones, reports 163.com, citing company vice president He Shiyou. The companysold three million smartphones last year.
He said ZTE is currently planning its 2012 sales target, and that there will be more than a doublingof the smartphone sales target.
ZTE and China Unicom (600050, 0762.HK) jointly launched the Skate V960 smartphone priced at 1,499 yuanon December 12.
The Skate V960 mobile phone was first rolled out in overseas markets, including Brazil, Spain, Hong Kong, Germany and the U.S., before its launch in the domestic market.
He said ZTE will continue to cooperate with operators in terminal sales, and will develop other sales channels as well.
ZTE Skate – Light your smart world [ZTEGlobal, Oct 13, 2011]
ZTE V960 [= Skate] product page[translated by Google, Sept 23, 2011]
- Frequency range GSM: 900/1800/1900 UMTS: 900/2100 HSDPA: 7.2Mbps DL
- Chipset Qualcomm MSM7227-T [800 MHz]
- Size 126.5 * 68 * 11.2mm
- Weight 140g (with battery)
- Antenna comes with built-in antenna modeling straight memory
- Memory: 200 MB of available space is greater than the available expansion card memory MicroSD memory card expansion (up to 32 GB)
- The main screen 800 * 480 pixels, 262K TFT color screen, 4.3-inch external screen without camera
- 5M pixel camera take a picture: up to 2560 * 1920,
- Shooting video: up to 640 * 480
- Digital zoom: 1.6 times
- Battery Standard battery: Li-ion 1400 mAh
- Side keys (volume keys) with the keyboard menu, home, back
- Touch-screen full-touch capacitive touch-screen interface,
- Bluetooth extension, MicroSD card, USB 2.0 Full Speed
- SIM card insertion, 3V, 1.8V
- Stereo headphones with a microphone headset hands-free speaker with charger 5pin Micro-USB
- Sensor support gravity sensor, light sensor, proximity sensor
China-based branded smartphone vendors to produce sub-US$100 models [Nov 3, 2011]
China-based branded handset vendors including Lenovo, ZTE and Huawei Technologies are expected to venture into the production of smartphone models with a price tag of around US$100 in 2012 – a move which will add pressure on white-box vendorsin China as well as on upstream parts and components suppliers, according to industry sources.
The China-based makers are responding to growing competition from foreign branded smartphones vendors including HTC, Apple and Samsung Electronics, which have recently expanded their product lineups for the entry-level and mid-range markets, the sources noted.
Although HTC has refuted market rumors that it plans to launch smartphones for the US$100 segment, the sources said HTC has been trying to reduce its production costs by introducing models with comparable hardware specifications but running on different operating systems.
Taking the HTC Titan and HTC Sensational XL for example, the hardware specifications of the two models are comparable, but the HTC Titan runs on Windows Phone platform, while the HTC Sensational XL is powered by Android 2.3.4.
Apple’s launch of 8GB iPhone 4 and iPhone 3GS is also a vivid indication of the vendor’s ambition to expand its share in the entry-level and mid-range smartphone segments, the sources commented.
Qualcomm competing with MediaTek in China market with price competition [Dec 6, 2011]
In view of increasing adoption of the MT6575, a 1GHz chip solution developed by Taiwan-based MediaTek for use in 3G handsets and smartphones, by several China-based vendors and white-box clients, Qualcomm has lowered its quotes by keeping them close to MediaTek in order to strengthen its price competitiveness, according to China-based white-box vendors.
Following selling the 650MHz chip MT6573 in the China market during early October peak sales period, MediaTek has begun offering the MT6575featuring mainstream a computing speed of 1GHz and four functions, GPS, FM, Bluetooth and Wi-Fi, in one chip. The specifications plus price and rich content available on MediaTek’s handset development platform have made M6575 strongly competitive in the China market, the sources indicated.
Qualcomm has had its MSM7727 and MSM7727Acompete with MediaTek’s MT6573 and MT6575 respectively, the sources noted.
Based on a general price level of about US$10 for a 3G handset chip, the MT6575 is competitive enough in price, the sources indicated. To be competitive, Qualcomm has to decrease prices because its quotes for 3G handset chip solutions are mostly higher than MediaTek by more than 20%, the sources pointed out.
The competition for 3G handset chip solutions between Qualcomm and MediaTek will extend from China to emerging markets in 2012, the sources indicated.
The new frontier in mobile computing: Q&A with Qualcomm EVP Steve Mollenkopf [May 31, 2011]
…
Q: Convergence has been talked about for years, why is now such a critical time in the evolution of the market?
A: If you look at the current market situation, there are there are three areas that have driven the industry to reach critical mass.
First of all, advancements in semiconductor designhave substantially increased the amount of computing power that you be put into the small thermal envelope needed to efficiently power a mobile phone or portable device. What this means is that you can now put the same processing power in a smartphone or another type of handheld device that used to be in a notebook, and that is really opening up the market to new designs and usage models.
The second thing that is shaping the current market is that the shift to next-generation mobile networkshas meant that a lot of data can be quickly delivered to – and enjoyed by – mobile devices, with multimedia and Internet content driving demand. High-speed 3G and 4G networks really enable an enormous amount of connectivity to occur with mobile devices.
The third area where the market is really evolving is that the dynamics of the software markethave changed a great deal. Most developers used to focus on the PC ecosystem, and a major priority driving software vendors in the past was making sure that they maintained backward compatibility for their applications. If you look at the market now, most people are developing for smartphone platforms and those platforms are migrating up. This has broken the link of being encumbered by legacy applications. This phenomena is only going to accelerate even more as we move into cloud computing and most user data and applications end up being positioned somewhere in the cloud.
So what this means is that currently there is a kind of perfect stormin the mobile environment that is bringing the best of all worlds together. It is really going to change the way mobile devices are used and it is also going to change the technology in them.
Q: While users are expecting more from their mobile devices, system providers have to deal with more complexity, making it harder to quickly deliver products to market. Can you explain how Qualcomm can help enable its partners in this area?
A: It’s true. What you see, particularly as you start moving into mobile computing is that the devices are very complex. For market players, this means that your solution needs to excel along many different vectors. It has to have a high-performing processor. It has to have a high-performing graphics engine. It has to have a high-performing modem. It has to be a high performing connectivity solution.
Moreover, all of those areas need to be blended together in an optimal manner. It doesn’t make sense for a device to simply be a collection of assets. All the areas need to work properly together for that system to be a success. What that means for semiconductor solution providers is that you need to have all of these assets in house in order to best enable your customers.
Really, when the complexity of the solution becomes quite high, it is going to be very difficult for many players to deliver that system solution efficiently and at the speed that is required in order to be competitive in the market. A lot of solution providers may excel in one area or another, but not really in all areas. This makes things more difficult for downstream system providers. What Qualcomm has endeavored to achieve is to try to excel across multiple vectors. We have been lucky in that we have had the scale to invest, to allow us to be successful.
Q: Can you tell us a bit about your hardware features, especially Snapdragon?
A: Referring back to Qualcomm being able to succeed across multiple vectors, the Snapdragon is a perfect example. One misconception many users have about Snapdragon is that it is a processor but Snapdragon is an integrated system. It doesn’t refer solely to the processor or to the graphics engine. It doesn’t refer to the connectivity assetsor the modem individually. It refers to all of them together in an integrated solution.
Looking back at the first Snapdragon we did, which was really the first 1GhHz processor in a mobile phone; that was when we really began enabling the market with a much differentiated product relative to what the market had seen before. We are now on our fourth generation productand we will continue investing heavily in the platform as we move forward.
In terms of processing on the ARM-based Snapdragon platform, we currently have a mix of the highest performance and lowest power mix in the industry with our 28nm versions of the device. On the network side, Qualcomm has always been known as a leading modem company and we integrate the modem into the processor. Together with the GPU, the SoC (system on chip) family of solutions delivers one of the most integrated solutions today. In addition to providing us with a leadership position, this is pretty important because it allows our partners to develop unique designs. For example, the first LTE smartphone from Verizon is built around our Snapdragon platform.
And it is not just about hardware. A solution provider needs to be able to deliver software support as well. For example, currently we deliver Android over multiple chipsets at the same time. This is important because there are many tiers of devices, from high-end tablets down to entry level smartphones. With Qualcomm being able to deliver solutions that cover all market segments, we enable our partners to be competitive with a full range of products as well.
We started talking about complexity and finished with integration, but integration is really just the ability to pull together many different types of technologies into one easily deliverable package, whether it is one physical package or one system solution tied together by one set of software. As the market progresses and becomes more complex, fewer companies can deliver on this. That is why Qualcomm is leading the way.
Q: How does this level of integration help you enable your partners?
A:Combining all the levels of integration in our family of solutions allows for more creativity for system houses. OEMs can spend their resources and investment in areas that help differentiate their products. It is a much more efficient way to deliver technology.
In addition, our highly integrated solution actually expands the market by enabling more partners to participate in system design. By providing so much to our partners, we don’t limit our customer base to companies with very large engineering teams only. Many more companies are able to go to market with our products.
…
Taiwan foundries cut prices 10-15% [Dec 30, 2011]
Taiwan-based foundry service providers have cut their prices for wafers built on mature node processes to reflect lower production costs, according to sources at IC design firm. The move is also aimed to encourage customers to build inventory, the sources said.
Some fabless IC firms tend to accept their foundry partners’ low-price offerings in consideration of their long-term relationships, the sources indicated.
Chip inventories throughout the supply chain have actually been lowered to safe levels, the sources said. However, companies hold a wait-and-see attitude rather than restocking because of an uncertain business outlook, the sources pointed out.
Inventories climbed to excessive levels between the end of the second quarter and the beginning of the third quarter, due to a combination of negative macroeconomic factors such as weak consumer confidence in the US and the European crisis.
In other news, despite slow demand for mature process manufacturing, Taiwan Semiconductor Manufacturing Company (TSMC) continues to see orders heat up for advanced 28nm technology, according to sources at non Taiwan-based chip suppliers.
Foundry orders losing momentum [Nov 22, 2011]
Foundry chipmakers have seen short lead-time orders lose momentum, according to industry sources. Short lead-time orders were a key factor contributing to their revenue growth in October and better-than-expected results in the third quarter.
A surge of short lead-time orders was previously expected to emerge around this time amid low inventories in the semiconductor supply chain, the sources pointed out.
But fabless IC clients are now unable to meet order estimates placed earlier with the foundries, and have requested delivery to be delayed until after the first quarter of 2012, the sources indicated.
Major foundry players including Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) might post double-digit sequential dips in revenues for the first quarter of 2012, due to a slowdown in orders, the sources said. Gross margin and operating margin for the quarter will also come under downward pressure along with their utilitzation rate declines, the sources added.
But starting from the middle of the second quarter, foundries are expected to see orders pick upwith clearer order visibility, the sources believe.
TSMC at its most-recent investors meeting estimated consolidated sales for the fourth quarter of 2011 would slip 1-3% sequentially. The firm reported higher-than-expected results for the third quarter driven short lead-time orders.
UMC has guided wafer shipments for the fourth quarter would decrease about 10% sequentially with ASPs up 5%. It did not provide a revenue guidance.
Both TSMC and UMC have not disclosed their revenue forecast for the first quarter of 2012.
China market: Handset demand weak [Dec 26, 2011]![]()
Demand for feature phones in China has turned weaker than expected since the middle of October, according to sources at Taiwan’s LCD driver IC design houses. Smartphone demand in China is also slowing down recently, bringing further adverse impact to some firms’ sales performance, the sources indicated.
The slowdown in orders reflects an early arrival of the low season, the sources observed.
Many of Taiwan’s handset chip suppliers which rely heavily on the China market are likely to report 5-10% sequential decreases in December revenues, the sources estimated, citing falling demand from the region. Sales might further decline 10% or more sequentially in the first quarter of 2012, as a result of fewer working days during the long Chinese New Year holiday and seasonality, the sources noted.
However, most of Taiwan’s handset chip designers will see their sales recover starting the second quarter of 2012 when China-based handset firms’ inventories will be low, the sources said.
MediaTek likely to post higher revenues in December [Dec 21, 2011]
Brisk orders from China-based smartphone vendors who are preparing for Lunar New Year sales campaignsare buoying MediaTek’s sales in December, according to industry sources. The IC design firm is expected to post sequential growth in consolidated revenues for the month, the sources said.
The sources estimated MediaTek’s December consolidated revenues at between NT$7.7 billion (US$255 million) and NT$9.2 billion [US$305 million].
MediaTek previously guided consolidated sales for the fourth quarter would be NT$22.9-24.5 billion, compared to NT$23.38 billion in the third quarter.
MediaTek accumulated NT$79.36 billion [US$2,628 million] in consolidated sales from January through November, a 24.8% decline from 2010.
MediaTek posts lower-than-expected sales in November [Dec 8, 2011]
MediaTek has reported consolidated revenues grew 1.2% sequentially to NT$7.63 billion (US$252.9 million) in November. The figure came below market watcher estimates of NT$8.5-9.5 billion.
MediaTek’s November sales were affected by its China-based white-box clients’ lower-than-expected smartphone shipments, according to industry sources. Shipments were disrupted by tight supplies of ambient light sensorsfrom Texas Advanced Optoelectronic Solutions (TAOS), the sources revealed.
TAOS’ back-end operations in Thailandhave been suspended causing disruptions to its ambient light sensor shipments to customers, which also include brand-name consumer electronics vendors such as Apple, HTC and Nokia, the sources indicated. With its ambient light sensor availability becoming tight, TAOS is giving priority to orders placed by the first-tier brands, at the expense of those from second-tier and China’s white-box companies, the sources said.
TAOS is unlikely to provide adequate supplies of its ambient light sensors by the end of 2011, which would continue to disrupt certain CE manufacturers’ deliveries, the sources noted.
Previous reports quoted industry sources saying MediaTek had enjoyed brisk demand for its solutions targeting low-cost smartphones, and an influx of short lead-time orders from clients in China after the country’s National Day holidays.
MediaTek sales to top NT$9 billion in November [Dec 5, 2011]
Buoyed by an influx of short lead-time orders from handset clients in China, MediaTek will report better-than-expected sales results for November 2011, industry sources have said.
MediaTek’s consolidated revenues are likely to top NT$9 billion (US$298 million) in November, hitting the highest monthly level for 2011, according to the sources. The company saw its sales decrease about 5% sequentially to NT$7.53 billion in October.
MediaTek reportedly has enjoyed brisk demand for its MT6573 smartphone solution – targeting low-cost smartphones. In particular, demand received a boost driven by orders from China during the country’s National Day holidays in Octonber, the sources observed. Next-generation MT6575 is scheduled to start shipping prior to Lunar New Year, the sources indicated.
The upcoming MT6575 single-chip solution will run at 1GHz, an upgrade from 650MHz that its predecessor has, the sources revealed. In addition to white-box handset makers, a number of brand-name firms targeting the China marketreportedly will adopt the solution from MediaTek, the sources indicated.
MediaTek previously reiterated that its sales estimate of NT$22.9-24.5 billion for the fourth quarter remains unchanged. The company posted consolidated revenues of NT$23.38 billion in the third quarter, up 11.4% sequentially but down 17.1% on year.
Motorola increasing orders to Taiwan production partners, say sources [Dec 6, 2011]
Motorola Mobility has been strengthening its ties with Taiwan-based handset ODMs and parts and components suppliers with procurements from those production partners to increase 10% sequentially in the second half of 2011 and to further expand by 10-15% in 2012, according to sources in the supply chain.
Motorola’s increased orders to Taiwan production partners reflect a steady integration process between Google and Motorola as well as the vendor’s stepped-up efforts to launch new models, including the Razr XT910 flagship model [(Dec) TI OMAP 4430 based, with dual Cortex-A9 @1GHz], the high-end Milestone 3, [ME883 (July), XT860 (Sept) and ME863 (Sept) – all OMAP 4430 based, with dual Cortex-A9 @1GHz], the DEFY+ [MB526 (Sept) OMAP 3620 based, with Cortex-A8 @ 720 MHz] social networking phone and the entry-level XT319 [XT319 (Oct) with Qualcomm MSM7227T @ 800 MHz], in the fourth quarter of 2011, revealed the sources.
Motorola’s ODM handset orders to Taiwan production partners are expected to total 11-13 million units in 2011, of which over 90% are feature phones, estimated the sources, noting that Taiwan ODMs may receive more orders for smartphones from the vendor in 2012.
Motorola’s ODM partners include Arima Communications, Compal Communications and Foxconn International Holdings (FIH), while parts and components suppliers include Merry Electronics and Chi Cheng Enterprise.
Merry has reported consolidated revenues of NT$880 million (US$29.1 million) for November, increasing 25.47% on month and 9.67% on year and representing the highest monthly figures in 47 months, according to a company filing with the Taiwan Stock Exchange (TSE).
MediaTek, Spreadtrum, MStar sharing China market of handset chips [Dec 13, 2011]
Taiwan-based IC design house MediaTek and MStar Semiconductor and China-based fellow company Spreadtrum Communications are sharing the market demand for handset chips, according to China-based white-box vendors of handsets.
MediaTek, following victorious sales of its 3G chip MT6573 during the peak sales period in early October 2011, has launched 1GHz 3G chip MT6575 and received good market response, the sources pointed out. MediaTek’s shipments of MT6575 are expected to peak prior to the 2012 Lunar New Year in late January, the sources indicated.
Spreadtrum has dominated the market segment of TD-SCDMA, China-developed 3G standard, chips, with shipments of TD-SCDMA chip SC8800G on the rise, the sources noted.
While MediaTek and Spreadtrum have shifted focus to 3G chip solutions, MStar has focused on marketing of 2.5/2.75G chips with many new products, the sources indicated. MStar’s monthly shipments of 2.5/2.75G chips have climbed to 5.0 million units, more than triple the level in the first half of 2011, the sources pointed out.
Currently, MediaTek has a market share of 60% for 2.5/2.75G chips, while Spreadtrum and MStar have those of 25% and 10% respectively, the sources noted.
MStar reports on-year revenue growth for November [Dec 9, 2011]
MStar Semiconductor has announced consolidated revenues of NT$3.25 billion (US$107.7 million) for November, down 4.4% on month but up 6.5% on year, according to a company filing the Taiwan Stock Exchange.
For the first 11 months of 2011, revenues amounted to NT$32.52 billion [US$1,077.7 million], increasing 3.5% from a year earlier.
MStar taping out 3.75G [?3.5G?] handset solutions in 4Q11 [Nov 9, 2011]
Taiwan-based IC design house MStar Semiconductor will begin to tape out 3.75G [?3.5G?] handset solutions supporting TD-SCDMA and CDMA technologies soon with end market devices to hit the market in the first quarter of 2012, according to company chairman Wayne Liang.
Shipments of handset solutions will increase 30-50% sequentially in the fourth quarter, pushing handset solution revenues to 15% of the company’s total revenues in the quarter compared to 10% in the third quarter, Liang predicted.
Fourth-quarter revenues are expected to top US$311-329 million, up or down in a range of 3% from the previous quarter, Liang said at an investors conference. Gross margin will range 40-42% in the fourth quarter compared to 42.1% in the last quarter.
Shipments of TV chips will drop slightly in the fourth quarter, and demand for TV chips is expected to continue growing in emerging markets in 2012, but the prospects in the US and Europe are still unclear, said Liang.
MStar posted net profits of NT$1.62 billion (US$53.8 million) in the third quarter, up 7.2% sequentially. Third-quarter earnings translated into an EPS of NT$3.06 compared to NT$3.73 posted by rival MediaTek, according to data from the companies.
China market: 2.5G handset chipset prices falling [Nov 24, 2011]
Prices for 2.5G handset chipsets have slipped more than 10% in the fourth quarter of 2011, and will continue to fall at the same rate in first-quarter 2012 due to continued oversupply in the market, according to sources at white-box handset makersin China.
With branded and white-box handset vendors shifting their focus to smartphones, demand for 2.5G feature phones in China is decelerating, the sources said. Taking sales during China’s National Day holidays last month as an example, supplies were tight for many top-selling smartphones while 2.5G devices were unremarkable, the sources indicated.
As end-market demand began to fall, chipmakers including MediaTek, MStar Semiconductor and Spreadtrum Communications decided to lower their prices for 2.5G solutionsto stimulate demand and protect their market shares, the sources pointed out.
Another cause of the intensified price competition is high similarity of products. MediaTek’s 40nm-made 2.5G chipset that comes with a high level of integration enabled the company to stand out from the crowd in the first half of 2011, when competition with rivals was less fierce, the sources said. However, with MStar and Spreadtrum both launching 40nm, highly-integrated solutions, competition has intensified leading prices to fall in the second half of the year, the sources noted.
In addition, MediaTek, MStar and Spreadtrum have stepped up R&D efforts for the development of 3G WCDMA and TD-SCDMA chipset solutions, according to the sources.
Motorola to adopt MediaTek solutions for WCDMA smartphones, says paper [Oct 14, 2011]
Motorola Mobility will adopt MediaTek’s MT6573 solutions for its WCDMA-enabled smartphones, the Chinese-language Commercial Timescited Daiwa Securities analyst Chen Hui-ming as indicating.
Motorola’s order volume to MediaTek is still unclear as it will depend on market demand during the upcoming Lunar New Year holidays as well as Motorola’s cooperation with China-based telecom carriers, Chen was quoted as saying.
In addition, China-based Huawei Technologies is also likely to adopt smartphone solutions from MediaTek in early 2012, said Chen, but added that Huawei is going to buy MediaTek’s new 3.75G solution, the MT6575, instead of the MT6573. Huawei previously purchased most of its handset solutions from Qualcomm.
MediaTek Pursuing Japan’s 4G Biz [Nov 30, 2011]
… MediaTek President C.J Hsieh touted that MediaTek chipsets are not inferior to Qualcomm’s. MediaTek MT6573, for instance, supports EDGE and WCDMA specifications with its Bluetooth, LAN, GPS and FM wireless designs.
The company plans to ship 20 million smartphone chipsets in 2012, 10 million more than its goal for 2011. Totally, the company will deliver 550 million chipsets for various types of handsets this year. The shipment increase comes against the backdrop of the forecast that global market penetration of smartphones will increase to 50% from 2011’s projected 30%.
Hsieh believed that his company’s smartphone chipsets will be quickly flowing into global markets along with its mainland Chinese customers striving to ship mobile phones to Europe and North America.
Orders for MediaTek 3.75G 3.5G smartphone chip soaring [Oct 13, 2011]
China’s brand-name handset vendors, including Lenovo, ZTE and TCL, have ordered more MT6573 3.75G 3.5G smartphone chips from MediaTek, according to industry sources. To meet the continued rising demand, the fabless IC firm has asked for additional foundry capacity equivalent to 6,000-8,000 12-inch wafers from United Microelectronics Corporation(UMC), the sources indicated.
Backend service providers including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), King Yuan Electronics (KYEC) and Sigurd Microelectronics are also pinpointed by the sources as beneficiaries of the increased orders.
MediaTek released additional orders to UMC as well as Taiwan Semiconductor Manufacturing Company (TSMC) for foundry services in August – equivalent to a combined 25,000 12-inch wafers – to satisfy brisk demand for its MT6573 solution, which is gaining acceptance from the company’s principal customers in China, the sources revealed.
MediaTek is expected to see monthly shipments of its MT6573 chipset solutions to reach 1-1.5 million units in October and November, and continue expanding to 3.5-4 million in December, the sources estimated. The growing shipments will boost the company’s sales in the fourth quarter of 2011, the sources said.
In addition, acknowledging the MT6573’s popularity, Huawei Technologies reportedly is asking MediaTek to accelerate development of the chip’s successor, the sources said. Dubbed the MT6575, the next-generation single-chip solution could start shipping as early as the first quarter of 2012, the sources indicated.
MediaTek shares closed up 2% at NT$336 (US$11.10) on the Taiwan Stock Exchange on October 13. The price scored the highest in eight trading days.
In other news, ASE, SPIL, KYEC and Sigurd are likely to see their revenues for the fourth quarter of 2011 stay flat sequentially, the best-case scenario amid a global economic downturn, according to the sources. Orders from MediaTek as well as the depreciation of the NT dollar are seen as the major contributing factors.
MediaTek asks for additional capacity from UMC due to increased orders for MT6573 chip [Aug 24, 2011]
Due higher than expected orders for its MT6573 3.75G smartphone chip, MediaTek has asked for additional foundry capacity equivalent to several thousands of wafers from United Microelectronics Corporation (UMC), according to industry sources.
MT6573 has been adopted by Lenovo and other China-based vendors because its FOB price of US$60-70is much lower than US$100-120 quoted by MediaTek’s competitors and functional performance is better, the sources said. Based on orders received, MediaTek will ship more than one million MT6573 chips in September 2011, with monthly shipments to increase to 2-3 million chips in November and December, the sources indicated.
Due to the additional orders for foundry services, UMC has offered a 10% discount for all orders from MediaTek, the sources indicated. Similarly, MediaTek has asked Advanced Semiconductor Engineering and Siliconware Precision Industries to offer a 10% discount on IC packaging and testing services for the fourth quarter in exchange for additional orders, the sources said.
MediaTek profits improve sequentially in 3Q11 [Oct 28, 2011]
MediaTek has announced net income of NT$4.07 billion (US$135.38 million) for the third quarter of 2011, an increase of 22.4% from the prior quarter, but down 41.6% from the year-ago quarter. Third-quarter EPS were NT$3.73, compared with NT$3.05 in the previous quarter and NT$6.39 of a year earlier.
Consolidated revenues amounted to NT$23.376 billion [US$777.6 million] in the third quarter, up 11.4% sequentially but down 17.1% from a year earlier. The on-quarter revenue growth was mainly driven by seasonality and the increase of handset sales volume.
Third-quarter gross margin was 45.1%, or 0.8pps and 7.1pps lower than the previous quarter and the same period of last year, respectively, due mainly to decreased handset chipset prices.
MediaTek 3.5G-chip shipments likely to hit 1 million mark in September [Sept 30, 2011]
Shipments of MediaTek’s MT6573 3.5G chipset solution approached one million units in August, and are likely to exceed the mark in September, according to industry sources. Shipments have been fueled by roll-outs of new 3G handsets in China.
Monthly shipments of MediaTek’s MT6573 chips are expected to reach 1.5 million units in the fourth quarter, and climb further to two million in 2012, the sources said.
However, MediaTek has internally estimated that its sales for September will decrease slightly from August levels, the sources indicated. The company also maintained its revenue guidance for the third quarter at NT$22-23 billion (US$721.5 million-754.3 million), the sources revealed.
The sources previously predicted that MediaTek’s September sales would post another on-month growth following the 16.3% sequential rise in August. But a number of clients in China had actually made advance orders, which constrained the company’s sales growth in September.
MediaTek’s sales for the fourth quarter are set to decline about 10% sequentially, due to generally low order visibility, the sources said. The company has not given its outlook for the quarter.
Lenovo places short lead-time 3G chipset solution orders with MediaTek, says paper [Sept 27, 2011]
Lenovo has placed short lead-time orders for MT6573 3G solutions with MediaTek recently as the first batch of 500,000 units of its A60 smartphone, priced at CNY1,000 (US$156), have nearly sold out since the device launched in August, according to a Chinese-language Commercial Timesreport.
Due to strong sales of the A60, other vendors in China, including ZTE, Huawei Technologies, and Beijing Tianyu Communication Equipment, plan to launch low-priced smartphones soon, with chipset solutions also coming from MediaTek, the paper said.
MediaTek’s shipments of MT6573 chips are expected to top 1.2-1.3 million units a month prior to the arrival of the Lunar New Year holiday, which begins on January 22, 2012, added the paper.
Short lead-time orders buoying TSMC sales [Sept 14, 2011]
Taiwan Semiconductor Manufacturing Company ((TSMC) has disclosed that its consolidated revenues for the third quarter of 2011 are expected to exceed its guidance given in July, thanks to some “rush” orders from customers.
Industry sources speculate that the short lead-time orders were placed by the foundry’s fabless clients including Qualcomm, Broadcom, MediaTek and MStarSemiconductor, which enjoyed rising demand for their smartphone solutions targeting China and other emerging markets.
However, demand for smartphones coming from the Europe, Japan and US markets remain sluggish, the sources indicated. The major chip providers actually are bracing for unusual weak demand during the Christmas and year-end shopping season, the sources added.
TSMC’s sales and utilization rate for the fourth quarter may come under downward pressure, as order visibility remains opaque, the sources said.
TSMC reported NT$37.64 billion (US$1.29 billion) in consolidated revenues for August 2011, up 6.2% sequentially. Consolidated sales for July and August totaled NT$73.08 billion, already making up 69-72% of the company’s targeted NT$102-104 billion for the third quarter.
LENOVO LePhone A60 [Sept 9, 2011]
Price: USD169.00
Specifications
- Features
Android 2.3 / Capacitive / Dual-SIM Dual-stanby- Network
GSM + GSM or GSM + WCDMA, WCDMA:900/2100, GPRS/EDGE:900/1800/1900- Processor
MTK MT6573 650MHz / GPU PowerVR SGX 531- RAM
256MB RAM- Flash Memory
512MB ROM- Expansion Memory
Extend Memory up to 32GB micro sd card- Operating System
Androind 2.3- Languages
Multi-language: English, Chinese- Screen
3.5 inch 320x480pixels, Capacitive Multi-Touch screen- Video
rm,.rmvb,rv,.wmv,.mp4,.3gp,.asf, .m4v,.avi,.mov,.mpg.mpeg,.flv,.f4v,.asf,.mkv- Audio
RA, AAC, AAC+, MP3, WMA, WAV, OGG, MIDI, AMR NB,AU,AIFF, M4A, F4A- Peripherals Support
3.5mm Stereo Interface, Micro USB v2.0- Wireless
802.11b/g, Bluetooth, FM radio- GPS
Yes- Camera
Front: 0.3MP, Back: 3.2MP- Color
Black / White- Battery
1500mAH, 3.7V- Size & weight
116.5×60×13.2mm, 135 grams- Package Content
110-230V USB Charger, Battery, USB cable, Earphone
MediaTek buoyed by rising demand for Lenovo smartphones [Sept 15, 2011]
Brisk sales of Lenovo’s A60-series smartphone in China has been boosting MediaTek’s shipments of its 3.5G solution, the MT6573, according to market sources. Order momentum is expected to remain strong to sustain the chip supplier’s sales growth in September and the third quarter.
The new Lenovo smartphone hit store shelves in China earlier in the third quarter, but has been selling well thanks to its rich feature set and affordable price point, the sources said. With demand outpacing supply, the A60 has been quoted at as high as CNY1,100 (US$172) by local channel operators, up about 30% from the just over CNY800 original priced, the sources indicated.
Meanwhile, in view of the Lenovo A60’s rising popularity, China’s channel operators have released more orders for the device prior to China’s National Day holidays, the sources observed. The booming demand will simultaneously push up MediaTek’s sales generated from the orders placed by Lenovo, the sources said.
MediaTek began to ship its MT6573 3.5G chipset solution to China in August. The company was quoted as saying in previous reports that it aims to ship 10 million 3G smartphone solutions in 2011.
MediaTek has estimated consolidated revenues at NT$22-23 billion (US$743-777 million) for the third quarter of 2011. Sales grew 16.3% sequentially to NT$8.31 billion in August, and are expected to post another sequential growth in September.
Market watchers now expect MediaTek to enjoy a more than 15% sequential increase in third-quarter sales, exceeding its guidance of 5-10% growth given previously.
Spreadtrum increases TD-SCDMA chip orders to TSMC, says paper [Sept 29, 2011]
China-based handset solution vendor Spreadtrum Communications will increase its orders for TD-SCDMA baseband chips to Taiwan Semiconductor Manufacturing Company (TSMC) in the fourth quarter of 2011, according to a Chinese-language Commercial Times report.
Spreadtrum has avoided directly competing with MediaTek in the 3G and 4G segments and instead focuses on TD-SCDMA chips in cooperation with China Mobile. Spreadtrum currently holds 56% of the TD-SCDMA chip market in China, the paper said.
The TD-SCDMA chips will be made on a 40nm process at TSMC, while Advanced Semiconductor Engineering (ASE) will handle the backend packaging and testing, said the paper.
Handset solution vendors competing neck and neck in 3G smartphone market in China [Sept 13, 2011]
Demand for smartphone solutions in emerging markets, particularly in China, is gaining momentum, pushing chipset vendors to compete neck and neck to grab a large piece for the growing market, according to industry sources.
Qualcomm and MediaTek are both targeting the WCDMA solution market in China, and the two companies have landed orders from some branded handset vendorsin China, the sources noted.
China-based chipset vendor Spreadtrum Communications has received orders for TD-SCDMA solutions from Samsung Electronics, while rival Taiwan-based MStar Semiconductor has ventured into the EDGE solution segment.
Qualcomm’s launch of QRD (Qualcomm reference design) in 2010 paved the way for the company to gain more 3G solution orders in 2011, and the US-based solution vendor is expected to further enhance its market leadership with the launch of its next generation QRD, said the sources.
HTC, a strong supporter of Qualcomm, also plans to strengthen its marketing in China in 2012which will also help Qualcomm expand its share in China’s smartphone market, the sources added.
MediaTek has continued to exert efforts to reduce its production costs through integration of hardware, software, firmware and even applications, said sources, noting that MediaTek also reportedly plans to cut the prices of 3G solutions by 10-20% at the end of the third quarter in order to compete with Qualcomm’s forthcoming second-generation QRD.
Meanwhile, MStar‘s shipments of EDGE solutions have reportedly reached over five million units a month recently and will soon become a growth driver for the company, the sources added.
Smartphones moving toward hardware competition [Aug 30, 2011]
The global market competition among iOS, Android, Windows Mango and BlackBerry platforms is expected to heat up in the fourth quarter as international vendors are going to launch flagship smartphone models, with hardware specifications expected to develop toward 1.5GHz dual-core processors, large screens over 4-inch, ultra-slim form-factors and supporting HSPA+download speeds of 21Mbps, according to Taiwan-based handset makers.
Given some mid-range smartphones have already adopted 1GHz processors, the new flagship high-end smartphones are trended towards processors clocking at 1.2-1.5GHz, the sources noted.
In addition to market speculation of dual-core A5 processors for Apple’s forthcoming iPhone 5, new flagship models from Samsung Electronics, HTC and Sony Ericsson will also be powered by dual-core CPUs, the sources added. However, Nokia and RIM (Research in Motion) are not expected to roll out dual-core models until 2012.
HTC, Samsung and LG Electronics (LGE) are also expected to roll out models with display sizes ranging from 4.3- to 4.5-, or even up 4.7 inch, the sources indicated.
Taiwan handset ODMs bracing for structural upheaval [Aug 23, 2011]
Taiwan-based handset ODMs are bracing for repercussions of structural upheaval to be brought by Google’s intention to buy Motorola Mobility and Hewlett-Packard’s (HP’s) plan to stop selling WebOS-based smartphones, according to sources at Taiwan’s handset industry.
Even before the announcements of the latest deals in the hectic smartphone industry, Taiwan-based handset ODMs have mostly failed to perform well due to lackluster sales of smarphones of their branded handset clients, including HP, Dell, Acer, Lenovo and even Motorola and Sony Ericsson, the sources noted.
Although Taiwan handset ODMs have diversified their product roadmapsto include models supporting Android, Windows Mobile and WebOS platforms, their operations would still be affected by Google’s and HP’s stunning announcements, said the sources, adding that Compal Communications and Foxconn International Holding (FIH) are expected to suffer the most.
While some handset ODMs have also ventured into the development of tablet PCs, shipment volume of tablets from those handset ODMs have been smaller than expected due to the dominance of the Apple iPad in the market, the sources pointed out.
Handset vendors reportedly cutting back chipset orders for 4Q11 [Aug 19, 2011]
Some handset solution suppliers have indicated that a number of handset vendors, including Apple and HTC, have scaled down their chipset orders for the fourth quarter as compared with the third on concerns of the global economy, according to sources at Taiwan-based chipset makers.
While most smartphone vendors are likely to reach their shipment targets for the third quarter, they have begun to reduce orders for parts and components for the fourth quarter in preparation for a possible impact from changing economic conditions, the sources noted.
HTC raised its internal shipment target for 2011 to 70 million units in the first quarter, from 50 million units it projected at the end of 2010. However, the company has recently revised downward the target to 50-60 million units, according to sources familiar with HTC’s roadmap.
Sources in the supply chain of iPhone have revealed that Apple has also scaled down its orders for handset parts and components to be shipped at the end of third quarter.
MediaTek to increase investment in 3G, says chairman [July 19, 2011]
MediaTek will further strengthen its deployment in the global 3G chipset market by pouring more capital and resources into the development of platform products and application software, according to company chairman Tsai Ming-kai.
Buoyed by rapid growth in applications for mobile connectivity, the 3G industry and market in China has been developing in a fast manner, and MediaTek aims to grow in tandem with China’s booming 3G industry, Tsai said at a WCDMA supply chain conference held by China Unicom in China recently.
MediaTek will also cooperate with the WCDMA operators and makers of the WCDMA supply chain in China on technology development and marketingto accelerate the advancement of the WCDMA industry in China.
MediaTek has offered its highly integrated MT6268 WCDMA solution plus multiple application software platforms to handset makers to develop and manufacture high performance WCDMA handsets.
MediaTek to ship 3G solutions in August [July 13, 2011]
MediaTek has confirmed that it will begin to ship its HSUPA solution, the MT6573, to clients in August, but the company declined to comment on market speculations that it has landed orders for a quantity of over one million units each from clients including Lenovo and ZTE.
The specifications and performance of the MT6573, which is set to run on Android 2.3.3 platform, are similar to those chips adopted by Apple’s iPhones and HTC’s 3G smartphones, indicating that MediaTek has begun to make inroads into the global 3G chipset market, commented industry sources in Taiwan.
Other China-based handset makers, including Ningbo Bird, China Tianx and Shanghai Ragentek Communication Technology, have also decided to adopt the MT6573 solutions, the sources added.
Qualcomm likely to slash 30% off entry-level 3G solutions in next 9-12 months, says paper [June 16, 2011]
Qualcomm is likely to slash its prices for 3G smartphone solutions by 30% in the next 9-12 months in order to prevent other chipset makers from grabbing its share in the entry-level 3G solution segment, the Chinese-language Commercial Times quoted Michael Chou, a semiconductor analyst with Deutsche Securities in Taipei, as indicating.
More first-tier branded handset vendors are likely to adopt Qualcomm’s solutions for the production of entry-level and mid-range 3G smartphones in the next 12 months as Qualcomm has migrated the production of its chipset solutions to a 40nm processat Taiwan Semiconductor Manufacturing Company (TSMC), Chou said.
Qualcomm’s price-cutting strategy will affect the performance of Asia-based chipset makers, including MediaTek and MStar Semiconductor. Deutsche Securities has recommended a sell rating on shares of MediaTek and a hold rating on MStar, said the paper.
MT6573 Innovative Platform for Mainstream Smartphones [Feb 11, 2011]
Overview
The MediaTek MT6573 platform incorporates a highly-integrated core chipset, a full range of connectivity solutions and supports the latest versions of the popular AndroidTM operating system. The MT6573 platform supports a quad-band, 3G/HSPA modem with mobile broadband rates of 7.2Mbps in the downlink and 5.76 Mbps uplink, as well as quad-band EDGE. The integrated applications processing system combines a 650 MHz dedicated ARM®11 subsystem for the Android operating system; support for advanced 3D graphics; multi-format video capture and playback up to FWVGA 30fps; high-resolution camera support to 8MP and a high-end FWVGA, touch-screen display. This platform chipset is completed with a full range of connectivity solutions for Bluetooth, WiFi, GPS, FM and Mobile TV from MediaTek.
Key Features
• The core chipset of the MT6573 integrates the modem, applications & multimedia subsystem and all necessary power management functions into a single SOC.
• Combined with a single-chip, multi-mode, multi-band transceiver, it enables extremely small footprints that allow for smaller, more innovative industrial designs and form-factors.
• Additionally, the integrated 3D graphics capability brings gaming and user interface capabilities that were previously available only to high-end smartphones.
• Finally, the platform provides for advanced camera and multimedia features that include smile and face detection, panorama and burst shot, as well as high-resolution video capture and playback.
• The platform can be delivered as a full system solution consisting of hardware reference design and fully-tested, compliant software suite that can improve design efficiency and speed time to market for customers in the rapidly changing smartphone market.
MediaTek’s newly announced MT6573 application processor integrates POWERVR graphics [March 8, 2011]
New SoC brings advanced graphics to mass-market smartphones
MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, and Imagination Technologies, a leading multimedia and communications technologies company, announce that MediaTek’s new application processor, features POWERVR graphics acceleration.
The MT6573 incorporates a POWERVR Series5 SGX GPU (graphics processing unit) from Imaginationto enable advanced smartphone graphics applications including gaming, navigation and location-based services, augmented reality and highly visual and dynamic user interfaces for the mainstream volume phone market.
MediaTek delivers innovative, feature-rich yet cost-effective solutions to meet consumer’s entertainment, communication and information needs. MediaTek is launching the MT6573 platform to address the accelerating demand for smartphones with features that can delight users at price points that meet the needs of operators in developed markets and consumers in emerging markets.
Says Hossein Yassaie, CEO, Imagination: “We are delighted that MediaTek has delivered this highly capable new mass-market application processor, which will enable its customers to address new levels of capabilities and meet emerging consumer demands for advanced performance in lower-priced smartphones. We look forward to building on our strategic relationship with this important semiconductor partner.”
Says Jeffrey Ju, General Manager of the Smartphone Business Unit at MediaTek: “MediaTek is committed to ensuring that wireless consumers across the globe can access the most advanced mobile technologies. Imagination delivers industry leading graphics technology and support, as well as an extensive and strong ecosystem of developers capable of utilising the technology. We are thrilled to have POWERVR graphics acceleration in MT6573, and the benefit of Imagination’s insight and experience as a strategic partner going forward.”
MediaTek announced the MT6573 platform for mainstream 3G smartphones [Feb 11] (emphasis is mine):
The MT6573 platform incorporates a highly-integrated, core chipset, a full range of connectivity solutions and supports the latest versions of the popular AndroidTM operating system. The MT6573 platform supports a quad-band [i.e.: all 4 GSM bands, the 850 and 1900 MHz bands – used in Americas – and 900/1800, used elsewhere], 3G/HSPA modem with mobile broadband rates of 7.2Mbps in the downlink and 5.76 Mbps uplink, as well as quad-band EDGE. The integrated applications processing system combines a 650 MHz dedicated ARM®11subsystem for the Android operating system; support for advanced 3D graphics; multi-format video capture and playback up to FWVGA 30fps; high-resolution camera support to 8MP and a high-end FWVGA, touch-screen display. The platform chipset is completed with a full range of connectivity solutions for Bluetooth, WiFi, GPS, FM radio and Mobile TV from MediaTek.
The core chipset of the MT6573 integrates the modem, applications, multimedia subsystem and all necessary power management functions into a single SOC. Combined with a single-chip, multi-mode, multi-band transceiver, it enables extremely small footprints that allow for smaller, more innovative industrial designs and form-factors. Additionally, the integrated 3D graphics capability brings gaming and user interface capabilities that were previously available only to high-end smartphones. Finally, the platform provides advanced camera and multimedia features that include smile and face detection, panorama and burst shot, as well as high-resolution video capture and playback. The platform can be delivered as a full system solution consisting of hardware reference design and fully-tested, compliant software suite that can improve design efficiency and speed time to market for customers in the rapidly changing smartphone market.
… The MT6573 platform is currently sampling to lead customers and will be in mass-production by mid 2011.
Google’s revitalization of its Android-based TV effort via Marvell SoC and reference design
Updates: Marvell and Google Transform TV [marvellmedia, Jan 10, 2012]
– Marvell GoogleTV – ARM at CES 2012 [Jan 11, 2012]
– Marvell licenses VeriSilicon DSP cores [Feb 13, 2012]
SAN FRANCISCO—Marvell Technology Group Ltd. has signed a licensing agreement for VeriSilicon Holdings Co. Ltd.’s ZSP G3 intellectual property cores, including the dual-MAC ZSP800M and ZSP880M synthesizable DSP cores, VeriSilicon said Monday (Feb. 13). Financial terms of the deal were not disclosed.
Marvell is also using VeriSilicon’s quad-MAC ZSP800 core and suite of HD-audio software solutions in the ARMADA 1000 HD media processor SoC and the recently introduced Marvell ARMADA 1500 media processor SoC, VeriSilicon (Santa Clara, Calif.) said. These chips are designed for applications such as Blu-ray players, digital media adapters, HD-STB and HDTVs.
According to VeriSilion, the dual-MAC ZSP architecture offers a balance of high performance, power efficiency and lower cost to support the increasing feature convergence in mobile and digital entertainment products and enable prolonged battery life. The company claims its products offer ease of use and strong customer support.
“We are quite impressed with the area and power efficiency of the dual-MAC ZSP800M core, combined with the ease of programming on the ZSP architecture,” said Ivan Lee, vice president of mobile products at Marvell, in a statement. “VeriSilicon’s ZSP-based HD-audio and voice software solutions will provide us with faster time-to-market advantages necessary to meet the growing demands of the mobile platform solutions for use in tablets and smartphones.”
– CES 2012: Samsung, LG plan to introduce Google TV [Jan 11, 2012]
Samsung Electronics and LG Electronics both indicated they plan to introduce Google TV products. However, LG noted that its own Netcast platform will account for 60% of all TV products. Samsung has not showcased Google TV products at CES 2012 but smart TV products that carry its own Samsung Apps are on display.
Industry sources believe the market has doubts on Google TV because the previous two generations lacked strong sales. Despite the fact that South Korea-based TV makers continue to dominate the market, the firms are unlikely to put all their eggs into one basket. It seems to be more beneficial for South Korea-based TV makers to bet on products that carry their own platforms. It is also possible for the firms to expand such platforms across their entire product lines into smartphones, and tablet PCs.
Samsung Apps has been increasing the diversity of its content with downloads reaching 20 million. Samsung Apps can also be used on Galaxy mobile and tablet devices. This is to compete with Apple’s iPad and iPhone products, which also have a unified platform.
Samsung indicated the development of Google TV is to add diversity to its product line and it plans the launch to take place in the second half of 2012.
Vizio’s Google TV delayed until early fall, now edge-lit [C|net, Jan 10, 2012]
LAS VEGAS–Google TV has a way of disappointing expectations, and one strong case in point is the Vizio’s VIA Plus platform for TVs.
At CES 2011 we named the VIA Plus models as our favorite TV product of CES. They used Google TV to deliver what the company described as interoperability between the TV and Android-equipped phones and tablets. Among other features, Via Plus was also said to support the OnLive gaming service. Those extras, along with the same kind of full-array local-dimming backlight we know and love, was enough to convince us that the so-equipped TVs were going to be pretty awesome.
Unfortunately, because of what Vizio describes as Google TV-related issues beyond its control, they never came out.
We asked about the VIA Plus sets during a pre-CES briefing with Vizio and were told they were still on the company’s product release roadmap. The new release date is “early fall.” They will have different model numbers and at least one change for the worse: that backlight is now an edge-lit affair. Vizio further specified that the new VIA Plus models would have a 240Hz refresh rate, passive 3D, and three screen sizes: 47-, 55-, and a new 65-inch option.
On the bright side, maybe having all that extra time to perfect VIA Plus will allow Vizio to do something really special with Google TV’s Honeycomb customizations. We’ll see.
End of updates
Google TV Demo [GoogleTV, Dec 12, 2011]
Eric Schmidt’s Le Web Keynote Video: “Android is Ahead Of The iPhone” [TechCrunch, Dec 7, 2011]
Google chairman Eric Schmidt spoke yesterday at Le Web in Paris, and now the entire interview is on YouTube.
…
At about 39 minutes in he makes this startling prediction: “By the summer of 2012, the majority of the televisions you see will have Google TV embedded in it. A similar strategy to what we did with Android. The price is free from Google, so you are only paying for the television.”
Marvell and Google Team up to Transform TV [marvellmedia, Jan 7, 2012]
Marvell and Google Team Up to Transform TV into the Command Center for the ‘Connected Lifestyle’ [Marvell press release, Jan 5, 2011]
Marvell’s new revolutionary ARMADA-based “Foresight Platform” powers new Google TV, offers best of television and multimedia experience for the new generation of Smart TVs, set-top boxes, Blue-ray players, and beyond.
Representing a major breakthrough in the convergence of TV, gaming, streaming video, popular web apps and social media, Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced that the new Foresight Platform, powered by the Marvell® ARMADA™ 1500 HD Media System-on-a-Chip (SoC), has been designed into the next generation of Google TVs debuting at CES 2012. Using Marvell’s award-winning Qdeo™ video processing technology, the ARMADA-based Foresight Platform is designed to deliver superior 3D video, impressively rich audio, striking 3D graphics and TV-friendly Web content.
“Marvell and Google have teamed up to change home entertainment forever – transforming the TV into the command center for our connected lifestyle. Marvell and Google are fundamentally changing the relationship between the producers and consumers of content – from Hollywood to Madison Avenue to publishing and major news networks – creating a dynamic, two-way experience featuring real-time global news, social network, entertainment and information,” said Weili Dai, Co-founder of Marvell. “I believe this is a major breakthrough movement and it’s just the beginning of our bigger vision. The same forces that are revolutionizing today’s television experience will transform numerous vertical applications for small businesses and large enterprises, enhancing the way we all work, connect with each other and collaborate globally.”
“The Google and Marvell teams have been working closely together to bring our combined software and chipset technologies to market to grow the Google TV ecosystem of manufacturers and devices. Marvell-powered Google TV solutions will enable powerful products to be brought to market at attractive prices,” said Mario Queiroz, VP, Product Management Google TV.
For consumers, today’s digital home offers an endless choice of devices and content. For OEMs and service providers, it’s an all-out sprint to create offerings that perform noticeably better than competitors and at mass-market prices. The Connected TV Marketing Association (CTVMA) estimates 123 million connected TVs will be sold worldwide in 2014. Those consumers will expect access to the services they love – Netflix, Pandora, YouTube, Picasa and many more – in a lightning-fast, crystal-clear and resource-friendly package.
Powerful, energy-efficient, ultra-scalable and immensely affordable, the ARMADA 1500 contains Marvell’s highest-performing ARM v6/7-compatible PJ4B SMP super-scalar dual-core CPU. The chip is designed to enable PC-like processing power to support Web browsing with support for Flash™ and other key technologies – with the aid of more than 6000 Dhrystone MIPS of computing horsepower, FPU v3.0, 512KB of L2 cache and WMMX2. The Foresight Platform is energy efficient and has advanced cell-phone like power management.
The ARMADA 1500 also contains Marvell’s award-winning Qdeo video processing for state-of-the-art HD and 3D video, including scaling, noise reduction, de-interlacing, low bit-rate internet video enhancement and FRC and color/contrast enhancement. The chip offers VMeta™, a multi-format video decoder/encoder/transcoder that can decode up to two simultaneous 1080p streamsas well as a host of other video formats and containers. These features make the Foresight Platform ideal for Google TV, which requires tremendous processing power for its numerous applications at a cost effective price point.
Related Links:
- Product information: http://www.marvell.com/digital-entertainment/armada-1500/
- Marvell media materials: http://www.marvell.com/company/press_kit/
More information on this blog:
– Marvell ARMADA beats Qualcomm Snapdragon, NVIDIA Tegra and Samsung/Apple Hummingbird in the SoC market [again] [Sept 23, 2010 – Jan 17, 2011]
Google TV: CES 2012 Video [GoogleTV, Jan 4, 2012]
But Marvell is not alone in this revitalization effort (note that MediaTek is there as well and LG is using its own chipset in the new line of Google TV powered TV sets):
From the Las Vegas Strip to your living room: Google TV partners at CES [the official Google TV blog, Jan 5, 2011]
Last October, we launched an update to Google TV: a simpler interface, a new way to discover great web and TV content, a more TV-like YouTube experience, and Android Market. Since launching the update, we’ve seen our activation rates more than double. New features and new apps are coming to the living room via Google TV almost every day. We now have more than 150 apps which developers have specifically built for TV with thousands more Android apps from the mobile world available to deepen your living room TV experience. We’ve also been working with our hardware partners to bring new Google TV-powered devices to consumers. Next week is the Consumer Electronics Show (CES) in Las Vegas. Here are some of the Google TV partners to look out for at CES and throughout 2012:
- LG – We’re thrilled to welcome global consumer electronics leader LG to the Google TV family. LG will showcase a new line of TVs powered by Google TV running on their own L9 chipset at CES.
- Marvell – Also new to the Google TV family this year is Marvell, an innovative worldwide leader in chipsets. Marvell will be showcasing a new generation of Google TV solutions which will help bring more products across more price points to consumers.
- MediaTek – We’re also excited to partner with MediaTek, the leading Taiwanese chipset designer. MediaTek chipsets will power yet another wave of Google TV devices.
- Samsung – We’re excited to work closely with Samsung to bring Google-TV powered Samsung devices to market in 2012.
- Sony – We’re happy to build on our partnership with Sony. At CES, Sony will unveil new devices for the US and plans to offer Google TV powered products in several countries around the world in 2012.
- Vizio – Last year we announced our partnership with Vizio at CES. This year we’re excited to join Vizio as they hold private demos at CES showcasing their new line of Google TV-powered products.
As we’ve said before, Google TV is about bringing new entertainment and innovation from the Web to TV and our team along with our partners are pleased to bring more Google TV powered products to more people, across more devices in more countries in 2012.
Record of the chat with Larry Yang — Google TV Product Manager [GoogleTV, Dec 11, 2011]
He is responsible for the platform and the partnerships.
MediaTek Releases World’s First 120Hz SoC Solutions for High-end Smart TV [MediaTek press release, Jan 5, 2012]
Next Generation Wi-Fi Display Technology Brings the “Living Room” Revolution to a New Level
MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions today announced the release of the world’s first 120Hz Smart TV supported single chip solution model. In addition to providing an unparalleled 3D viewing experience, the chip is also an industry leader in support for Wi-Fi display technology, which allow Smart TVs to synchronize with Wi-Fi network hubs without the use of external modems or Internet connection, ensuring that high definition content can be easily shared on TV screens anytime or anywhere. MediaTek’s groundbreaking solution is bringing the “living room” revolution to a new level, while creating a new generation of “smart homes.”
According to the Topology Research Institute’s most recent report, as more brands continue to release Smart TVs, worldwide shipments of Smart TVs in the next two years could double. In 2011 alone, 25.18 million Smart TVs were sold worldwide, accounting for 10.4% of overall TV sales. In 2012, that number is set to double to at least 52.85 million units. A yearly growth of 100% means that by the end of 2012, Smart TVs will account for 20% of overall TV sales. The report went on to say that as “smart” becomes the new catchword in electronics, the addition of 3D and LED innovative hardware features is set to bring about more explosive growth to the already red hot Smart TV market.
MediaTek’s new Smart TV single chip solution offers a number of highly integrated advanced applications. In addition to support for numerous high definition video image processing technologies, the chip also comes with MediaTek’s patented MDDiTM deinterlace solution, greatly enhancing the clarity of moving images and allowing support for 120 Hz MEMC (Motion Estimation, Motion Compensation) and 3D visuals, thus making images even more lifelike and giving consumers a smoother and more vivid viewing experience. As the first to support the next generation Wi-Fi Alliance Standard, MediaTek’s Wi-Fi display technology allows Smart TVs to be synchronized with one or more Wi-Fi stations, thus allowing simultaneous broadcast of content between the devices. Enjoying a new smart digital home experience, consumers can now easily share high definition video content with both friends and family.
In addition, MediaTek provides support for digital TV’s worldwide common platforms, as well as the customization of solutions, enabling customers to instead focus their resources on product differentiation and various application developments, thereby shortening the time to market for products. Mr. Joe Chen, General Manager of Digital TV BU at MediaTek Inc., said, “Compared with traditional TVs, Smart TVs offer Internet access and Internet service platforms which give consumers a more superior all around visual experience. Following the introduction of Smart TV technology, the traditional TV has been transformed into a digital home entertainment center; with interactive features available, as well as having built in a variety of different applications, this new generation of Smart TVs completely redefines the traditional role of the “living room TV”, and sets a new milestone for TV technology. By offering a Smart TV single chip solution that features high-performance, high integration and customizable features, MediaTek continues to help customers worldwide achieve global brand value.
LG to Introduce Google TV at CES 2012 [LG press release, Jan 6, 2012]
Combining Android OS with LG’s 3D and Smart TV Technologies, LG’s Google TV
Provides Consumers with a New and Attractive Home Entertainment Option
SEOUL, Jan. 6, 2012 -– LG Electronics (LG) will introduce its highly anticipated Google TV at the Consumer Electronics Show (CES) in Las Vegas. LG Smart TV with Google TV combines the familiarity of Google’s Android OS with the convenience and comfort of LG’s 3D and Smart TV technologies, offering consumers a new and attractive home entertainment option.
“LG has constantly strived to provide consumers with wider choices in home entertainment that bring the highest level of sophistication and convenience,” said Havis Kwon, President and CEO of LG Electronics Home Entertainment Company. “Through Google TV, LG has merged Google’s established Android operating system with LG’s proven 3D and Smart TV technologies, offering consumers a new and enthralling TV experience.”
LG’s Google TV’s most attractive feature is its ease of use, thanks to the combination of its Android-based user interface and the Magic Remote Qwerty designed by LG. LG’s Google TV’s user interface and main screen have been designed for convenient browsing and content selection. Multi-tasking is also possible, as the search, social networking and TV functions can be run simultaneously. The user interface can be accessed using the Magic Remote Qwerty which combine the user-friendly benefits of LG’s Magic Remote with a QWERTY keyboard.
Equipped with LG’s own CINEMA 3D technology, Google TV provides a home entertainment experience that is immersive, comfortable and convenient. Based on LG’s own Film Patterned Retarder (FPR) technology, CINEMA 3D glasses are battery-free, comfortable and lightweight. The glasses are also very affordable, making LG’s Google TV ideal for viewing by a large group of family and friends when used in 3D mode. And with a single click of the remote, any 2D program or movie can be viewed in 3D, thanks to the built-in 2D to 3D conversion engine.
Alongside Google TV, LG will continue to advance its own Smart TV platform based on NetCast, which will be available in more than 60 percent of LG’s flat panel TVs scheduled for introduction over the coming year. With a growing collection of content and services, LG’s Smart TV platform will continue to provide consumers with a unique user experience.
The first demonstration of LG’s Google TV will take place at the LG Electronics Press Conference on January 9.
Samsung Expands Blu-ray and Companion Box Lineup [Samsung press release, Jan 7, 2012]
New Blu-ray Player and Companion Box Enabling Google TV Unveiled at iCES 2011
LAS VEGAS, Jan 7, 2011—Today at the International Consumer Electronics Show, Samsung Electronics Co, Ltd. ., unveiled a new Blu-ray player and companion box enabling Google TV, as part of its ongoing smart TV product offerings.
As part of Samsung’s continued roll-out of smart TV products and services, Samsung’s new Blu-ray player and companion box enabling Google TV lets consumers surf the Internet on their TV screens just as they would on a computer including the ability to update social networks, track fantasy football scores, check e-mail and more.
Seamlessly integrating web content into a traditional TV watching experience, Samsung’s new Blu-ray player and companion box enabling Google TV feature an Android based platform, which will include a variety of Internet services for consumers. . In addition, a special Google TV remote control will provide users with a full QWERTY keypad and voice search supported through an internal microphone.
Sitting at the heart of Samsung’s smart TV home digital entertainment, the new Blu-ray player and companion box enabling Google TV will be on display at CES Booth #11033 throughout the show. The new devices are expected to be available at retail by 1st half, 2011.
For more information about Samsung’s technology lineup at CES 2011, and to track buzz during the show, visit www.samsungces2011.com.
Google TV: Update Video [GoogleTV, Oct 31, 2011]
This all is coupled with the second iteration of the Google TV software launched in October: Google TV, Take 2: Android Apps Join the Smart TV Party [Wired, Oct 28, 2011]
Google’s smart TV software platform, Google TV, is poised for its first significant overhaul since it launched in Logitech and Sony hardware a year ago. Via over-the-air updates that should begin streaming to hardware devices on October 30, Google TV users will find new TV-optimized Android Apps, an improved YouTube experience, and new features that provide easy, direct discovery of TV and movie content.
All this Googly goodness is wrapped up in a new user interface that aims to simplify a challenging information design — a design that’s left many Google TV customers with a persistent sense of yuck.
…
Well, all dreams of cord-cutting should be put to rest. As Rishi Chandra, director of product management, Google TV, told me, “There was a perception that we were a cord-cutting product, and that’s something that we didn’t do enough to dispel. Our point of view is that there’s new content coming, content that you just haven’t been able to access with your TV. Now we’re bringing that content, and adding the discovery experience on top of it.”
So, no, Google TV can’t be your all-in-one, zero-compromises, Internet-only video delivery system. But what it can do well — namely, deliver YouTube, Netflix and other web-based video to your HDTV — is about to get better. I recently traveled to Google’s headquarters for a hands-on demo of the new software, and what I saw is a substantial improvement over Google existing (however compromised) status quo.
Here are four key improvements you’ll see in the next version of Google TV. …
Improved User Interface
…
The new home screen, however, is defined by a simple menu bar at the bottom of your display (see screenshot above). It’s clean, simple, and simply more fashion-forward than its predecessor. Likewise, the new Google TV software features a revised view of your All Apps menu. The old view listed apps in a long, single-file list arrangement. The new view (see screenshot below) mimics an Android Honeycomb tablet interface. Apps are arranged in rows of four, and the arrangement is customizable.
These may not seem like big changes — unless you’re already using Google TV, and have spent the last year coping with a cluttered, “something’s sort of ‘off’ here” U.I . From what I saw in my hands-on demo, various key interface elements have been tweaked and finessed to do away with Google TV’s previously horsey (or at least user-antagonistic) design sensibility.
TV and Movie Discovery
…
Vastly Improved YouTube
…
A New Home For Android Apps
In the most significant Google TV update of all, Android Apps now have a home on your big-screen TV.
Obviously, not all the apps in Android Market would even work for TV-screen deployment. For example, those that reply on touch gestures or GPS just wouldn’t make sense for Google TV (at least not as the platform is currently deployed). But Chandra estimates some 1,500 existing apps are already Google TV-compatible, and these will appear in the “filtered” version of Android Market that appears in the new software interface.
The real app gems, however, will be found in Google TV’s “Featured For TV” section. These apps — 30 should be available at launch — have been expressly developed for big-screen deployment, and Google TV’s unique talents.
Sure, one app I saw demoed is nothing more than a wrapper for an HD yule-log video (see Classy Fireplace in the screenshot above). But others are game apps (yes, Google TV is now a tenable platform for casual games), and the best apps will likely be the ones that deliver premium video content.
It’s quite ingenious: Google TV’s new Android initiative allows video-savvy media companies to do an end-run around licensing and distribution deals with the cable and satellite networks. Whether your media company is an indie upstart or a blue-chip heavyweight, this holds promise.
Take, for example, the Wall Street Journal. “They’re a premium brand,” says Chandra, “and they have great content, but they don’t want to build a 24-7 news cycle. They don’t want to negotiate deals to get content on the air, and they don’t want to pay to get access to users. So what do they do? They build an app.”
The possibilities: Dizzying. The proof: It remains in the pudding.
But as Mario Queiroz, Google’s vice president of product management, told me, Google considers Google TV to be a marathon project, not a sprint.
“We ask, ‘How can we make the product better?’ instead of belaboring what’s being said,” Queiroz said. “We’ve tried to take what we could use constructively, and build a better product with version 2. As a Google mantra, we always launch early and iterate.”
And iterate they will. Google will soon announce new chipset partners for brand new Google TV hardware in 2012 (Samsung and Vizio are already on board). So, no, the story of Google TV does not begin and end with a single software version, or just a small collection of set-top boxes and TVs from Sony and Logitech.
Google TV is real and its ambition levels remain high. Stay tuned for hands-on reviews of the new version software and upcoming Google TV hardware.
Google TV Goes ARM with Marvell’s ARMADA 1500 [AnandTech, Jan 5, 2011]
It wouldn’t be far off the mark to call Google TV as one of the unmitigated disasters of 2010 – 2011. Through the failure of the Logitech Revue, it was responsible for Logitech’s below-par performance last year, and also for the stepping down of its CEO. Anand covered Intel’s winding down of the Digital Home Groupand it could be said that Google TV / Intel’s concept of Smart TV not taking off as expected was one of the reasons.
However, Google doesn’t give up on its efforts without a fight. With access to the Android market and an upgrade to Honeycomb, Google TV received some life support last October. However, pricing and device power consumption were the two other prime factors which needed to get addressed. The first generation Google TV devices were all based on the Intel’s CE4100. Despite being a highly capable platform, it suffered from a number of issues such as high silicon cost (leading to higher priced Google TV units) and unreasonably high power consumption. With Intel’s shuttering of the Digital Home Group, it was inevitable that Google and its partners would end up moving to an ARM based platform. Given that ARM has remained the architecture of choice for Android smartphones, this was also a move predicted by many.
We covered Marvell’s foray into the DMA (Digital Media Adapter) market with their ARMADA 1000 platform. Today, Marvell is officially launching the next generation ARMADA 1500 (88DE3010) SoC. They also announced their team up with Google and indicated that all the Google TV boxes at the 2012 CES would be powered by Marvell silicon.
The ARMADA 1500 (88DE3100) is the follow up to the ARMADA 1000 (88DE3010) introduced a couple of years back. The 88DE3010 is the same chip which is being used in the Nixeus Fusion XS which started shipping recently. It is also the chip used in some high end (in terms of cost) 3D Blu-ray players like the Kaiboer K860i and the Asus O!Play BD players (BDS-500 and BDS-700).
More details from Anandtech:
– Marvell’s ARMADA 1500: The 88DE3100
– Final Words: Where is Google TV Headed?
ARMADA 1500 (88DE3100) Features
The ARMADA 1500 is a powerful, all-in-one HD media SoC, ideal for driving the connected home entertainment system through blu-ray players, set-top boxes, and DTV platforms.
Features Benefits Hardware-accelerated, dual-stream multi-standard, video decode and audio decode Multi-format AV decode support enables adoption in a number of different platforms and allows playability of a wide range of content Low-power SoC Low-power consumption enables fanless design Award-winning Qdeo video processing Delivers an immersive viewing experience Integrated Marvell dual-CPU SMP cores at 1.2 GHz
[@ 1.2GHz, the PJ4B core is delivering 2.61 DMIPS/MHz performance (see below), while Cortex A9 core 2.5 DMIPS/MHz]Dual cores running in Symmetric Multi-Processing configuration for quick startup and loading times, as well as uncompromised performance for many networked, Java, and media applications Full suite of integrated peripherals (such as USB, Ethernet, HDMI, SATA, and SDIO) Allows for complete connectivity in DTV, BD, STB, and DMA applications Turnkey reference designs of connected applications Highly cost-effective products and fast time-to-market
Video content is being accessed, streamed, and viewed through more options than ever before, and streaming services like YouTube and Netflix deliver that content at various levels of quality–from D to HD. Regardless of the content source, viewers expect an immersive, high-definition viewing experience from their home entertainment system.
Marvell’s award-winning Qdeo video processing technology delivers consistently high-quality video despite the source. At the core of Marvell’s digital entertainment processors, Qdeo uses a suite of “quiet video” technologies to produce video at up to full high-definition 1080p resolution with superb clarity and accuracy. Conventional video processing can actually produce noise and distortion that are distracting on today’s high-quality displays. With Qdeo your video—from QVGA to 4K×2K—will be rendered clearer and more natural, without the typical noise and artifacts.
Benefits of Qdeo
Noise reduction:
- Per pixel compression artifact reduction removes artifacts inherent in digital video
- Per pixel video noise reduction removes noise inherent in digital video
Format conversion:
- Per pixel motion adaptive 3D de-interlacing prevents “jaggies” and eliminates feathering
- Non linear scaling enables optimal mapping to display of choice
Enhancement:
- Adaptive Contrast Enhancement (ACE) and Intelligent Color Remapping (ICR) render rich and vivid images
- Natural Depth Expansion (NDE) enhances details and sensation of depth for greater realism and super-resolution effect
- Qdeo True Color eliminates contouring seen when viewing typical 8-bit consumer video
ARMADA 1500 Software & Standards
Software Standards
Marvell’s connected home platform meets the following software standards for a complete home entertainment solution.
Broadcast
- ATSC
- DVB
- MHEG
- CI+
- ARIB
- Ginga
- Tru2Way, CableCard
Organizations
- ITU – International Telecommunication Union
- MPEG Industry Forum
- SMPTE
- Blu-Ray
- 3D @ Home
Formats
- Sensio
Protocols
- HLS
- DASH
- DLNA
- CEA-2014
- RVU
Application Programming Interfaces
- directFB
- OpenGLes
- OpenMax IL
Connected Applications
- Adobe Flash
- DivX
- DLNA
- Netflix
- Skype
- Hulu Plus
- Vudu
- Cinema Now
- Pandora
- YouTube
- Picasa
- Flickr
- OIPF
- YouView
- HbbTV
- iPlayer
- Android ICS
Software Architecture
Marvell provides a robust connected home platform to aid customers in their product development.
Marvell 88DE3100 High-Definition Secure Media Processor System-on-Chip (SoC) [product brief, Jan 4, 2012]
Product Overview
The Marvell® ARMADA™ 1500 (88DE3100) secure media processor system-on-chip (SoC) is a high-definition (HD) advanced multi-format video and audio decoder that includes two high-performance ARMv7 compatible PJ4B processors with symmetric multi-processing (SMP), a large L2 cache, and a complete set of peripherals. It decodes 2 full HD streams along with multi-channel audio and both 2D and 3D graphics pipelines that enable rich and sophisticated User Interfaces (UI) along with high performance gaming experience. It also provides support for the Blu-ray 3D specifications. The ARMADA 1500 has a dedicated secure processor that supports various DRM schemes and 4Kbit one-time-programmable memory and implements multiple crypto accelerators. Additionally, the
ARMADA 1500 integrates a video/image post-processing subsystem that implements Marvell’s award-winning Qdeo™ processing, performing per-pixel 3D noise reduction, 3D de-interlacing, scaling, natural depth expansion, intelligent color remapping, and adaptive contrast enhancement. An integrated audio post-processor enables advanced audio
algorithms such as Dolby®, DTS, and AEC for high-quality, multi-channel, and stereo audio output.Marvell’s ARMADA 1500 provides a high-performance and cost-efficient solution for IP/cable/satellite set-top boxes (STBs), feature-rich connected Blu-ray players, digital media adapters (DMAs), Google TV™, and DTV applications with 88DE6010 (Marvell’s DTV analog front-end companion chip).
Block Diagram
Fig 1. ARMADA 1500 (88DE3100) HD Media Processor SoC Block Diagram
Key Features and Benefits
FEATURES BENEFITS Hardware-accelerated, dual-stream multi-standard, video decode and audio decode Multi-format AV decode support enables adoption in a number of different platforms and allows playability of a wide range of content Low-power SoC Low-power consumption enables fanless design Award-winning Qdeo video processing Delivers an immersive viewing experience Integrated Marvell dual-CPU SMP cores at 1.2 GHz Dual cores running in Symmetric Multi-Processing configuration for quick startup and loading times, as well as uncompromised performance for many networked, Java, and Media applications Full suite of integrated peripherals (such as USB, Ethernet, HDMI, SATA, and SDIO) Allows for complete connectivity in DTV, BD, STB, and DMA applications. Turnkey reference designs of connected applications Highly cost-effective products and fast time-to-market
Applications
Marvell provides a complete go-to-market solution for IP/cable/satellite/terrestrial DTV, STB, DMA, and Blu-ray products:
- High-performance HD media processor
- Optical front-end, HDMI input, component input, tuner/demod, and wifi receiver companion chips
- Comprehensive software development kit enables fast development and customization:
– Both high-end Android-based and low-end Linux™-based solutions
– Android™ SDK
– Google TV
– Both connected applications and base TV software stacks
– DVD/VCD/CD-DA navigation
– HDMV, BD-J stack
– Ease of OSD customizationFig 4. Blu-ray Player System Diagram
THE MARVELL ADVANTAGE: Marvell chipsets come with complete reference designs which include board layout designs, software, manufacturing diagnostic tools, documentation, and other items to assist customers with product evaluation and production. Marvell’s worldwide field application engineers collaborate closely with end customers to develop and deliver new leading-edge products for quick time-to-market. Marvell utilizes world-leading semiconductor foundry and packaging services to reliably deliver high-volume and low-cost total solutions.
ABOUT MARVELL: Marvell is a leader in storage, communications, and consumer silicon solutions. Marvell’s diverse product portfolio includes switching, transceiver, communications controller, processor, wireless, power management, and storage solutions that power the entire communications infrastructure, including enterprise, metro, home, storage, and digital entertainment solutions. For more information, visit our Web site at http://www.marvell.com.
Marvell Smart TV Reference Platform [Jan 4, 2012]
Based on Google TV and Marvell ARMADA HD Media Processor
Product Overview
The Marvell® Smart TV reference platform, based on Google TV™ and Marvell’s ARMADA™ high-definition (HD) media processor system-on-chip (SoC), is available to OEMs and ODMs for designing network-connected televisions. The reference design includes Marvell’s HD media processor SoC, TV tuner, and Wi-Fi/Bluetooth connectivity chip. The HD media processor SoC is a highly integrated chip consisting of: dual high-performance (1 GHz+) ARM processors to support a PC-like web browsing experience; GPU for rendering HD graphics; secure demux engine for parsing and protecting high-value media content; multi-format HD AV decoder for decoding network AV streams; Qdeo™ processing, including automatic block/noise reduction for rendering best picture quality even for low bit-rate network content; customizable audio post-processor to support Dolby®/SRS audio post-processing routines; and peripherals such as USB, SDIO, and Ethernet. The reference hardware accepts legacy TV inputs such as RF terrestrial/cable, composite video, component video, and VGA and includes 4 HDMI v1.4 ports for capturing 3D video from BD players. One of the HDMI input port supports audio return channel to enable “one cable” connectivity with one home theater receivers. The video output from the platform can be directly connected to drive full-HD LCD panels. The platform supports multiple stereo audio inputs and outputs the processed audio to speakers or PCM/compressed audio to SPDIF/HDMI-ARC.
The package includes a DTV reference design PCB, ATSC/QAM/NTSC middleware, network applications including Google TV/Netflix®/YouTube®/Picasa®, a customizable reference user interface and documentation.
Key Features and Benefits
FEATURES BENEFITS
- Highest performing ARM v6/v7 compatible dual-CPU cores
- Fast application launch, PC-like web browsing
- Integrated with Marvell’s leading edge TV technologies:
– Clear RF
– Swift View
– Qdeo
- RF tuning performance matching legacy can tuners
- Fast switching between various analog/digital AV inputs
- High-resolution picture quality for HD, SD and low bit-rate content
- Inputs: RF, CVBS, Component, VGA, HDMI, USB, LR Audio
- Network: Wi-Fi/Bluetooth, Ethernet
- Output: LVDS, Speaker, Headphone Out, SPDIF
- Multiple AV Inputs for connectivity to legacy AV devices and to the network
- Reference design with field-proven Marvell connectivity ICs
- Lesser integration issues
- Google TV OS with marketplace support
- Network video-on-demand (Netflix, Amazon®)
- Worldwide DTV middleware support
- Customizable reference UI
- Complete system software to jump start Smart TV design and rollout products to market faster
Block Diagram
Figure 2. Marvell Smart TV System Block DiagramTHE MARVELL ADVANTAGE: Marvell chipsets come with complete reference designs which include board layout designs, software, manufacturing diagnostic tools, documentation, and other items to assist customers with product evaluation and production. Marvell’s worldwide field application engineers collaborate closely with end customers to develop and deliver new leading-edge products for quick time-to-market. Marvell utilizes world-leading semiconductor foundry and packaging services to reliably deliver high-volume and low-cost total solutions.
ABOUT MARVELL: Marvell is a leader in storage, communications, and consumer silicon solutions. Marvell’s diverse product portfolio includes switching, transceiver, communications controller, processor, wireless, power management, and storage solutions that power the entire communications infrastructure, including enterprise, metro, home, storage, and digital entertainment solutions. For more information, visit our Web site at http://www.marvell.com.
New Mobile and Communications Group (MCG) at Intel
Finally a single organizational structure to push the next year 32nm and 22nm SoC products, like the 32nm Medfield (see also an up to date collection about Medfield inside).
Updates: Intel to adopt TI, Broadcom wireless chips for Medfield, Clover Trail-W platforms [Dec 30, 2011]
Intel will adopt the Texas Instruments-developed (TI) WL1283 Wi-Fi/Bluetooth/GPS chips for its Medfield platform to be launched in the second quarter of 2012 and Broadcom-developed 4330/4751 Wi-Fi/Bluetooth/GPS chips for its Clover Trail-W platform to be launched in the fourth quarter of 2012, according to Taiwan-based notebook makers.
In addition to improved processor performance, the Medfield platform, which is designed specifically for Android 4.0, will also feature several unique technologies including Intel Wireless Display, Advanced Imaging and Connected Standby, with devices that adopt the platform to also see a thickness less than 0.85cm and a weight less than 1.5lb.
As for the Clover Trail-W, which is designed for Windows 8 operating system, Intel will also equip the platform with its latest technologies including Intel Wireless Display, Compute Continuum, PC Sync, One Tap NFC, Advanced Imaging and HW Enhanced Security.
In addition to the chips from TI and Broadcom, chips such as IMC’s IFX6260, Ericsson’s C5621gw and NXP’s PN65N are all being listed within Intel’s list of purchasing for tablet PCs, while the company will also adopt Sierra’s EM77x0 chip for its Clover Trail-W for the platform to support LTE technology.
– Intel to launch Medfield platform in 2Q12, Clover Trail-W platform in 4Q12 [Digitimes, Dec 29, 2011]
Intel plans to launch its Medfield platform running on Android 4.0 (Ice Cream Sandwich) OS in the second quarter of 2012 and then release its Clover Trail-W platform running on Windows 8 in the fourth quarter of the year.
As few tablet PC vendors have adopted its existing Oak Trail platform, which can pair Atom Z670 processor/SM35 chipsets with either Windows 7 or Android Honeycomb, Intel is aggressive in promoting Medfield hoping to turn the tide.
As for the Windows on ARM (WoA) platform, both Nvidia and Qualcomm will advance their processors to the quad-core generation in 2012 and still maintain the advantages of low power consumption. But as both are facing bottlenecks in their development of support for Windows 8 and shortages in R&D staff and resources, whether the platform can fend off Wintel’s competition remains uncertain.
– Intel’s Atom N2600, N2800 & D2700: Cedar Trail, The Heart of the 2012 Netbook [Anandtech, Dec 28, 2011]
…
While the original Atom and Pineview (Pine Trail’s Atom) were built on Intel’s 45nm process, Cedar Trail moves to 32nm. Cedar Trail’s SoC shrinks to 56mm2, finally making it smaller than AMD’s Zacate APU. The underlying CPU architecture hasn’t really changed, nor have cache sizes (512KB L2 per core) or clock speeds (1.66GHz and 1.86GHz parts available), so what this is really about is a reduction in power consumption.
There are three Atom CPUs being offered as a part of Cedar Trail: the N2600, N2800 and D2700. Just as before, the N-series are for netbooks while the D-series are for desktops. All of the Cedar Trail Atoms are dual-core parts, but they all slot into the same power envelope as the old single-core Pine Trial platforms (5 – 8W). The only exception is the D2700 which is a 10W platform. Note that this is the total TDP for the Atom SoC + the NM10 Express chipset (providing USB, LAN, PCIe, etc…).
The spec breakdown is below:
Given the same number of cores and the same clock speeds, CPU performance shouldn’t go up compared to Pine Trail. Since everything is now dual-core we should see a boost at the low end, but I wouldn’t expect to see CPU performance that’s better than Zacate.
Cedar Trail now supports DDR3-800 and 1066 (up from 667MHz max data rates before). The bigger change is the GPU. The GMA 3150 used in Pine Trail was an Intel Gen graphics derivative (45nm GMA 3100), however Cedar Trail now features a PowerVR SGX 545 sourced from Imagination Technologies. At 640MHz in the N2800, we’ve never seen the SGX 545 run at anywhere near this clock speed before so it’ll be interesting to see how well it performs. Intel is claiming a > 2x GPU performance improvement compared to the GMA 3150 in Pine Trail in 3DMark 06. The big question is Windows driver maturity, but we’ll find out soon enough as systems based on Cedar Trail are in production now and are expected to ship in early 2012. Expect to see Cedar Trail netbooks from ASUS, Acer, HP, Lenovo, Samsung and Toshiba for starters.
The new graphics block also includes support for H.264 video decode acceleration (we’re still digging for specifics) as well as Intel Wireless Display technology. Note that WiDi support will vary depending on the system and price point:
Intel is expecting the vast majority of Cedar Trail netbooks to be sold in the $199 – $229 price point. At $299 is where you’ll likely find features like WiDi as well as potentially fanless designs. Don’t expect any of those new form factors at $399 until the later part of next year, likely coinciding with Windows 8’s release.
Overall the addition of HD video decode support and lower power consumption are both nice features to have, but I’m skeptical as to whether this will be enough to carry Intel based netbooks throughout the majority of 2012. Atom is in dire need of an architecture update (something we’ll get in 2013) and the netbook as a platform is in need of a refresh. I do hope to see some manufacturers taking risks with slim, fanless Cedar Trail based designs next year but we’ll have to wait and see if they’re any good.
– Intel Begins Shipping New Intel® Atom™ Processors; New Features, Great Battery Life on Tap [IntelPR, Dec 28, 2011]
NEWS HIGHLIGHTS
SANTA CLARA, Calif., Dec. 28, 2011 – Intel Corporation today announced the availability of the latest mobile Intel Atom processor-based platform, formerly codenamed “Cedar Trail.” Designed to provide small, compact, on-the-go computing with great battery life at an affordable price, the latest platform adds several new features to netbook computers made popular by students, families, and those looking for light productivity and Internet browsing. These devices will be available in early 2012 [beginning in January starting at US$199] from major OEMs including: Acer*, Asus*, HP*, Lenovo*, Samsung*, and Toshiba*.
The new design’s dedicated media engine enables full 1080p high-definition playback of videos and Blu-Ray content and includes additional digital display and output options including HDMI and DisplayPort. The integrated Intel® Graphics Media Accelerator 3600/3650 combined with the integrated memory controller provides enhanced performance and system responsiveness, including an improvement in graphics performance up to 2X compared to the previous generation platform.
Systems based on the new Intel Atom processors may have up to 10 hours of battery life and weeks of standby, allowing for all-day use between charges. Additionally, Intel increased processor and overall system performance while reducing power consumption up to 20 percent compared to the previous platform.
Based on Intel’s leading-edge 32nm process technology, Intel incorporated several new features into the platform such as Intel® Wireless Display and Intel® Wireless Music. With these new features and wireless enabled devices, people can share videos or photos wirelessly from their netbooks to a television, or stream music through their home stereo speakers.
Additional features such as Intel® Smart Connect Technology allows users to have an instant Internet connection as soon as they open their netbook, and have email, Twitter* and RSS feeds automatically updated even in sleep mode. Intel® Rapid Start Technology enables fast resume from standby mode and helps conserve battery life.
The dual-core Intel Atom processor N2600 [runs at 1.6GHz and draws 3.5 watts of power] and Intel Atom processor N2800 [runs at 1.86GHz and draws 6.5 watts of power] are paired with the Intel® NM10 Express Chipset and feature a small form factor package size that saves system board real estate and enables thinner netbook designs. In addition to the mobile processors, Intel offers the Intel Atom processor D2500 and D2700 for entry-level desktop and all-in-one designs, as well as intelligent system solutions. The platform supports a range of operating systems including: Windows*, MeeGo*, and Tizen*.
New Features, Lower Power Have Broad Appeal
The new Intel Atom processors provide a lower thermal design power (TDP) and power management features such as Intel® Deeper Sleep and Intel® SpeedStep Technology that enable lower power designs, making it especially attractive for netbooks as well as intelligent systems including: healthcare equipment, retail systems and entry-level digital signage.In health care settings, the improved battery life and enhanced graphics means medical professionals can enhance patient care and bring infotainment services to a patient’s bedside. ARBOR* technology will release a new patient infotainment bedside terminal, based on the Intel Atom processor N2800 that helps clinicians improve workflow management and work efficiency, reduce human error, and enhance healthcare quality. Patients can also enjoy access to plenty of multi-media entertainment, hospital information and communication services on the system.
The always on, always connected capabilities are also ideal for entry-level point-of-sale systems with the ability to boot up instantly to serve customer’s at a moment’s notice. Point-of-sale terminals based on the Intel Atom processor D2700 and manufactured by NCR Corporation* will be installed in restaurant and retail locations throughout the U.S. beginning in the first quarter of 2012.
Intelligent system designs are offered 7-year lifecycle support, as well as support for Windows Embedded Standard 7*, Windows XP and XPe*, Windows Embedded Compact*, Yocto Project* and Wind River VxWorks* operating systems.
For more information, video, and photos visit www.intel.com/newsroom/atom and the Intel Atom Processor-based Platform for Mobile Computing press kit.
– Intel’s smartphone guru angles for smooth landing [Reuters, Dec 23, 2011]
…
[Mike] Bell [the head of new MCG], a mechanical engineering major whose resume includes a stint at Palm, hopes to reverse that. Within Intel, he is known as a “phone guy” with a good understanding of chips, rather than a “chip guy” trying to figure out phones.
Underscoring the urgency of his brief, Chief Executive Paul Otellini has given Bell carte blanche to draw on Intel’s assets. Bell has used that to rope experts from different departments into an autonomous group focused on integrating software like Android with Intel’s chip designs.
Intel for now is keeping most of its advances close to the vest. But in a field where power-efficiency ranks about as high as computing velocity, Bell believes Intel’s newest chip, the Medfield, is just about ready for prime time.
“Medfield is our first real foray into the space. We have no apologies to make in power or performance. It’s a fantastic first step for us,” the shaggy-haired executive said.
…
Some experts believe Intel’s proprietary architecture is ill-suited for mobile processors. Apple and other manufacturers rely on technology licensed by Britain’s ARM Holdings.
But Bell, who left Palm to join Intel more than a year ago, believes Medfield can hold its own against rival chips offered by the likes of Qualcomm Inc and Nvidia.
With processors also made by Texas Instruments Inc and Samsung stealing the show, his engineers have been laboring to adapt technology refined over decades for PCs to work better in handheld devices without quickly draining their batteries.
“Based on our own internal research, we think Medfield is going to be very competitive in the time frame that it ships against anything in the market,” he argued.
Bell has brought in talent from outside to propel his effort, including engineers from Apple and other smartphone makers. And he has leveraged an internal R&D machine that the chipmaker poured almost $7 billion into last year.
Intel will manufacture Medfield using a 32-nanometer process, which packs more transistors into the same space than rival chips made on wider line-width processes. It plans next year to shrink the process down to 22 nanometers.
“We already have the next three generations on the drawing board and in process,” Bell said.
His rapid ascent at Intel came at a time of turbulence. He began in July 2010 as a vice president in charge merely of building reference devices to show off chips to customers. Salesmen at the time wielded a brick-like device that could perform basic features — but sorely lacked panache.
To help his team and customers envision the experience, he designed a whole new Android smartphone, distributed to potential clients and internally to a thousand employees. Their feedback helped inform development.
In March, Bell and Dave Whalen took over the Ultra Mobility division after Intel veteran Anand Chandrasekher, who led Intel’s charge into netbooks, resigned. Some investors took his departure as a sign the company was struggling with its smartphone strategy.
Then a week ago, Intel consolidated four divisions into a mobile and communications unit led by Bell and ex-Infineon executive Hermann Eul. Both are general managers of the group, but Bell heads up processor development while Eul oversees connectivity chips including modems, Bluetooth and WiFi.
At Palm, Bell had led a team that created the Pre and Pixi. But he became one of many to jump ship after the struggling company was acquired by Hewlett Packard Co last year.
Before that, he spent 16 years at Apple, where he had a hand in developing the iMac, iPhone and Apple TV. One industry insider who had worked with him said Bell’s ace card is his ability to understand how to design and build phones and bring them to market. He sees how different parts work together, like software and hardware, instead of concentrating on chips.
…
– Intel Shows Off Its Smart Phone and Tablet for 2012 [Technology Review by MIT, Dec 21, 2011]
…
Last week, Technology Review tried out prototype smart phones and tablets equipped with Intel’s latest mobile chip, dubbed Medfield, and running the Android mobile operating system created by Google. “We expect products based on these to be announced in the first half of 2012,” says Stephen Smith, vice president of Intel’s architecture group.
Known as “reference designs,” the devices are sent out to inspire and instruct manufacturers interested in building products around Intel’s latest technology. “They can use as much or as little of the reference design as they like,” says Smith, who hinted that the upcoming Consumer Electronics Show in January could bring news of gadgets in which Intel’s chips will appear.
Intel’s Medfield is the latest in its “Atom” line of mobile chips. So far none of them have seriously threatened the dominance of ARM-based chips in mobile devices, in part because they are more power-hungry. However, the new chip represents a significant technological step toward lower power consumption.
Previous Atom designs spread the work of a processor across two or three chips, a relatively power-intensive scheme that originated many years ago in Intel’s PC chips. But now Intel has finally combined the core functions of its processor designs into one chunk of silicon. “This is our first offering that’s truly a single chip,” says Smith. The all-in-one design, known as a system on-a-chip, is a standard feature of the ARM chips so dominant in smart phones today.
The phone prototype seen by Technology Review was similar in dimensions to the iPhone 4 but noticeably lighter, probably because the case was made with more plastic and less glass and metal. It was running the version of Google’s operating system shipping with most Android phones today, known as Gingerbread; a newer version, Ice Cream Sandwich, was released by Google only about a month ago.
The phone was powerful and pleasing to use, on a par with the latest iPhone and Android handsets. It could play Blu-Ray-quality video and stream it to a TV if desired; Web browsing was smooth and fast. Smith says Intel has built circuits into the Medfield chip specifically to speed up Android apps and Web browsing.
One feature that stood out was the camera’s “burst mode,” which captures 10 full-size eight-megapixel images at a rate of 15 per second. Smith says that feature rests on a combination of image-processing circuits built into the Medfield chip and dedicated software tweaks on top, technology that comes in part from Intel’s acquisition of the Dutch image-processing company Silicon Hive earlier this year. This kind of hardware could help apps developed for augmented reality.
Intel’s reference tablet, which used the same Medfield chip as the phone, was running the latest version of Android, Ice Cream Sandwich. It had a slightly larger screen than the iPad 2 but was about the same in thickness and weight. A limited trial suggested that it was noticeably nicer to use than older tablets based on the abandoned Honeycomb version of Android.
…
It took time for engineers to find a way to compress their usual three-chip design into a single system-on–a-chip, says Smith, and to help Google make Android work on Intel chips. Now Intel finally has a chip that can match and even surpass established mobile chips. “Now we have this in place, we can accelerate,” Smith says. “We haven’t been able to show a production-grade design before.”
Intel has tested its reference handset against a handful of the leading phones on sale today. It says these tests show that Medfield offers faster browsing and graphics performance and lower power consumption than the top three, says Smith.
Linley Gwennap, an analyst with the Linley Group, says it’s very significant that Intel is finally offering a fully integrated system-on-a-chip. “It should make Intel more competitive—they’re kind of at the same level as anyone now,” he says. Gwennap adds that Medfield chips use more advanced technology than the established competition, which means the chip’s features are much smaller. That helps improve power consumption and processing power. “Medfield is based on 32-nanometer technology, while the biggest fabs making ARM-based processors are today shipping either 40 or 45 nanometers,” he says.
That lead is likely to disappear as ARM-based processors catch up in the next year, but Smith says that Intel will start making mobile processors using 22-nanometer technology in 2013. Manufacturers of ARM-based chips say they plan to make that jump in 2014. Gwennap says this next generation will give Intel its best hope of grabbing a significant chunk of a new market: “I expect they’ll get into a few phones with Medfield, and then it will be the 22-nanometer chip that really makes a difference.”
However, Gwennap notes that Intel could lag behind in other ways. Although it has caught up by integrating everything a processor needs into a single chip, established mobile chip makers like Qualcomm are already going a step further by incorporating the usually separate wireless modem chip, resulting in even further efficiency gains. Smith says Intel isn’t ready to talk about when it might also make that step.
End of updates
Related information:
– Intel: accelerated Atom SoC roadmap down to 22nm in 2 years and a “new netbook experience” for tablet/mobile PC market [April 17 – June 7, 2011]
– Intel’s SoC strategy strengthened by 22nm Tri-Gate technology [May 10 – Nov 30, 2011]
– Netbook prices starting $50 less at $200 via Intel MeeGo strategy [July 29 – Aug 17, 2011]
– Supply chain battles for much improved levels of price/performance competitiveness [Aug 16-19, 2011]
– More on supply chain battles for … [Aug 31, 2011]
– Be aware of ZTE et al. and white-box (Shanzhai) vendors: Wake up call now for Nokia, soon for Microsoft, Intel, RIM and even Apple! [Feb 21 – March 25, 2011]
– CES 2011 presence with Microsoft moving to SoC & screen level slot management that is not understood by analysts/observers at all [Jan 7–13, 2011]
– Microsoft’s next step in SoC level slot management [May 27 – June 2, 2011]
– Acer repositioning for the post Wintel era starting with AMD Fusion APUs [June 17, 2011]
– Acer & Asus: Compensating lower PC sales by tablet PC push [March 29, 2011, with comprehensive update on Aug 2, 2011]
– Intel’s industry position and prospects for years ahead [Dec 9, 2010 – March 21, 2011, with “Intel executive quits as smartphone biz falters”]
– Gartner: media tablets are the new segment next to mobile PCs and desktops, as well as web- and app-capable mobile phones [April 16 – June 13, , 2011]
– Intel Oak Trail to beat ARM with MeeGo specific prices [Nov 25, 2010]
– Windows 7 tablets/slates with Oak Trail Atom SoC in December [Nov 1 – Nov 24, 2010]
– Imagination Technologies becoming the multimedia IP leader for SoC vendors [Dec 16, 2011] from which “Intel relationship insert” inside contains a kind of comprehensive summary of mobile computing related SoC results by Intel. This can be represented here by the below table:
One thing is quite obvious from all that related information: it took 9 months to work out a new mobile computing business strategy after the March collapse of the previous one (i.e. when “Intel executive quits as smartphone biz falters”). Let see now what we know about that new strategy so far:
Intel combines divisions in bid to boost mobile [Reuters, Dec 14, 2011]
Chipmaker Intel is combining four divisions under a new mobile and communications unit in a bid to catch up in smartphones and tablets, where it has so far failed to gain traction.
The new division combines Intel’s netbook and tablets division, its ultra mobility division, the mobile communications division and the mobile wireless division, spokesman Robert Manetta told Reuters.
“The ultimate goal is we want to speed up and improve the development process,” he said.
Intel’s processors power 80 percent of the world’s PCs but the Santa Clara, California company so far has failed in the fast-growing smartphone and tablet market.
The new division will be headed by Mike Bell, who moved to Intel last year after playing a hand in the development of the iPhone at Apple, and by former Infineon executive Hermann Eul.
Eul had headed Intel’s mobile communications division, which included the cellphone technology business it bought from Infineon in January.
Intel’s mobile wireless groupis responsible for short-range networking like WiFi and the ultra mobility group has developed smartphone processors.
Intel has been adapting its PC chip architecture to be more suitable for mobile gadgets but it faces tough competition from rivals like Qualcomm and Texas Instruments.
They specialize in energy efficient chips — a big factor for devices that rally on batteries — using technology licensed from Britain’s ARM Holdings.
Manufacturers are expected to unveil smartphones using a new Intel mobile chip, codenamed Medfield, early next year.
(Reporting by Noel Randewich, editing by Bernard Orr)
Intel Reorganizes Mobile Business to Speed and Improve Development [IDG, Dec 15, 2011]
In a reorganization of its mobile business, Intel said Wednesday it has formed a new group, called the Mobile and Communications Group (MCG) that will focus on phones, tablets, and other mobile devices.
“This is a strategic move designed to provide clear differentiation for Intel-based mobile devices and to speed and improve development of mobile devices and components,” said Intel spokesman Robert Manetta in an email.
The new group is formed by combining four existing Intel groups in the areas of baseband communications, WLAN components, netbooks, tablets, and phones. The groups folded into MCG are Intel Mobile Communications, Mobile Wireless Group, Netbook and Tablet Group, and the Ultra Mobility Group.
The move comes as the company faces stiff competition in the mobile devices market. Although a dominant player in PCs, it is struggling in the mobile devices market where chips based on designs from ARM dominate.
Intel’s mobile business has seen significant changes previously. It announcedin March the resignation of Anand Chandrasekher, senior vice president and general manager of the Ultra Mobility Group.
Chandrasekher, who was said to have left “to pursue other interests”, led a group responsible for the development of low-power Atom chips for products such as smartphones, tablets and other handheld devices.
The new group announced this week is chartered with creating a “compelling user experience by providing optimal hardware, software, and connectivity ingredients as well as complete solutions”, such as form factor reference designs, Intel said.
Two current Intel executives, Hermann Eul and Mike Bell, will run the new group. Bell was appointed to co-manage the Ultra Mobility Group after Chandrasekher’s exit. Eul heads Intel Mobile Communications, and came to Intel after its acquisition of Infineon Technologies’ wireless division.
Michael Bell on Linked in before this:
Michael Bell’s Experience
Vice President and GM of Ultra Mobility Intel
Public Company; 10,001+ employees; INTC; Semiconductors industry
July 2010 – Present (1 year 6 months)Partner HALL Wines
Privately Held; 11-50 employees; Wine and Spirits industry
2011 – 2011 (less than a year)SVP, Product Development Palm
Public Company; 1001-5000 employees; PALM; Consumer Electronics industry
December 2007 – July 2010 (2 years 8 months)Vice President Apple Inc.
Public Company; 10,001+ employees; AAPL; Computer Software industry
1991 – 2007 (16 years)Michael Bell’s Education
University of Pennsylvania
Intel ‘Medfield’ chip ready for Ice Cream Sandwich [Dec 5, 2011]
The most recent version of the Google Android operating system, called Ice Cream Sandwich, is ready to run on devices powered by Intel’s ‘Medfield’ processor.
A spokesperson for Intel confirmed that Ice Cream Sandwich would be supported on upcoming Intel Atom Medfield-based devices on Monday.
“Google Android Ice Cream Sandwich will be supported on upcoming Intel ‘Medfield’ processor-based devices, and Intel continues to work closely with Google to optimise Ice Cream Sandwich for future smartphones and tablets based on Intel Atom processors,” an Intel spokesman confirmed.
While the spokesman could not give any release details of specific smartphones or tablets that will use the Medfield chip, he added that device manufacturers and app developers already have access to all the code they need to get started.
“Intel optimisations for Honeycomb and Ice Cream Sandwich are available today to ODMs (Original Design Manufacturer) and OEMs (Original Equipment Manufacturer) using the Intel Android BSP (Board Support Package), as well as developers working with us on NDK (Native Development Kit) apps in advance of Honeycomb and Ice Cream Sandwich-based x86 devices being available commercially,” he said.
The introduction of the Medfield chip will be vital to Intel’s mobile strategy which has so far failed to gain traction in the smartphone and tablet markets.
In May, Intel chief Paul Otellini said that Medfield phones would be reaching the market during 2012.
The 32nm Medfield processor is the successor to the 45nm Moorestown processor that found its way into a few notebooks, such as the Nokia Booklet 3G, but failed to make inroads on the smartphone segment.
The company hopes to reduce Medfield to a 22nm production process in 2013 and 14nm in 2014, which should reduce the amount of power the processor needs to work.
Intel Says Android 4.0 for Smartphones, Tablets Ready [IDG, Dec 2, 2011]
Intel on Friday said it has readied Android 4.0 for smartphones and tablets based on its upcoming Atom processor code-named Medfield, raising the possibility of Intel-inside handheld devices being released next year with the new OS.
The company had a version of Android 4.0 for Medfield up and running within a day of Google open sourcing the OS, and now packages for smartphones and tablets with Medfield drivers are available to device makers, said Alec Gefrides, head of the Google Program Office at Intel.
Intel is working with device makers to optimize and fine-tune the OS for specific platforms and products based on Medfield chips. While the OS is expected to be ready in time for the product releases, it will be up to the device makers to decide whether they want to implement the OS in smartphones or tablets.
“We’ll see products next year on Gingerbread, Ice Cream Sandwich and Honeycomb,” Gefrides said, referring to Android versions 2.3, 4.0 and 3.x. “Every OEM has to put a stake in the ground to get a product delivered.”
Paul Otellini Busts Some Myths About Intel [Nov 29, 2011]
Myth No. 2: Intel chips are too power-hungry for mobile devices.
…
Intel, Otellini says, has built its own demonstration Android smartphone to show off the upcoming Medfield generation of its Atom processor, due in 2012. When its power consumption during basic phone functions like things like standby, audio and HD video playback is measured, Intel isn’t the best, but it’s not the worst, either. It usually comes in second or third place when compared against smartphones already in the market, but ahead of others, though Otellini didn’t say which phones it beat and which ones it didn’t.
And on three computing performance benchmarks it beats the others hands down: When using a browser on a phone, the Intel chip smokes the others. It also wins on GLBench, a graphics metric, and SunSpider, a Java test.
Chip Shot: Medfield – The Next Generation of Tablets from Intel [Intel Chip Shot, May 31, 2011]
At Computex, Intel reiterated its Atom System on a Chip (SoC) roadmap, highlighting “Medfield,” which will be built using Intel’s 32nm high-k metal gate process technology. The purpose-built solution will provide lower power, a smaller footprint and more integration of features and performance for the tablet market. “Medfield” will enable sub-9mm tablets that weigh less than 1.5 pounds and provide all day battery life. The processors will be in production later this year for tablet designs in market the first half of 2012 and support a range of operating systems including Google Android (“Honeycomb”), Windows and MeeGo.
Intel to struggle to see general adoption of Medfield in 2H12, say Taiwan makers [Dec 16, 2011]
Intel will launch 32nm Medfield specifically for use in smartphones and tablet PCs in the first half of 2012, but will struggle to win general adoption of the platform by vendors which have offered smartphones, according to Taiwan-based makers.
Because Intel did not establish close partnerships with first-tier smartphone vendors, while notebook vendors, which have smartphone product lines, are conservative about the new platform because of the negative experience with Intel’s mobile Internet devices (MID), these factors are expected to pose strong difficulties for Intel to enter the smartphone market.
Intel has been working on improving its Atom SoC for smartphones and tablet PCs, and expects the new chip’s power consumption will drop below 10W with related manufacturing process to also advance to 32nm Saltwell and then 22nm Silvermont, followed by 14nm Airmont within the next three years.
Although Samsung Electronics reportedly will launch a smartphone adopting Medfield and Android 4.0, and will sell it through Sprint, the sources pointed out that the cooperation between the two firms is because Samsung does not want to be limited by a single platform and therefore is more aggressive in developing products with different platforms, but the same situation may not apply for other first-tier smartphone vendors.
Intel’s Medfield Based Android Smartphone Reference Design [Sept 13, 2011]
An App Developer View of IDF2011 [Intel blog, Sept 16, 2011]
Paul [Otellini , CEO of Intel] showed Intel Pair & Share and Intel Teleport Extender. These technologies allow content and communication to be integrated between a mobile device and an Ultrabook. Imagine having your phone in your pocket while you edit a video and getting an SMS sent to that phone, pop up on your screen. Or imagine displaying photos and video captured from multiple mobile devices instantly on your PC. This means applications written for one device can now have experiences that bridge devices.
…
More Android on Intel was shown. We saw a Medfield based Android tablet running Honeycomb. And we learned of a partnership with Google, that will ensure Intel chips will not only run Android but all future Android OSs will be optimized for Intel. It was then revealed to us that the phone used in the Pair & Share demo was Android running a Medfield processor.
…
Android* 3.2 on Intel® Architecture [Intel, Oct 19, 2011]
This article will provide a brief summary of the Android* 3.2 operating system platform on Intel® Architecture. Intel® Atom™ based devices create a powerful platform to develop high performance applications using exclusive features found only on Intel® Architecture-based devices.
…
The 32nm platform Medfield processor based tablet coming in 2012 will deliver enhanced performance and lower power consumption.
…
Highlights of Intel Executive Vice President Sean Maloney’s opening keynote @Computex 2011 [channelintel, June 2, 2011]
Updates on “Medfield,” (only [upto 00:48] ! ) Intel’s first purpose-built 32nm platform for smartphones and tablets. “Medfield” has been optimized for both low power and high performance and will deliver long use-time, rich media and gaming, and advanced imaging capabilities. According to Maloney: “Customers are evaluating the Medfield designs now. We expect products shipping in the next 6 to 9 months, based on these fully functional Medfield designs”.
Intel’s Maloney Talks Mobile Growth, Industry Opportunities at Computex [May 30, 2011]
Maloney also discussed “Medfield,” Intel’s first purpose-built 32nm platform for smartphones and tablets. “Medfield” has been optimized for both low power and high performance and will deliver long use-time, rich media and gaming, and advanced imaging capabilities. To illustrate this point in tablets, Intel showcased a “Medfield” design running Google Android* 3.0 (“Honeycomb”) for the first time. In production later this year, the platform will enable sub-9mm designs that weigh less than 1.5 pounds for tablet designs in market the first half of 2012. It will support a range of operating systems including Android and MeeGo.
Computing Becomes More Personal at Computex [June 7, 2011]
…
the Netbook and Tablet Group at Intel, made some exciting disclosures to help meet the varied expectations of the companion device market. One of those was “Keeley Lake,” a brand new, convertible design based on the upcoming Atom netbook platform, “Cedar Trail.” With its swivel and fold monitor design, “Keeley Lake” packs in the power and performance of a netbook and the functionality of a tablet.
It will have more than 10 hours of battery life and will include Rapid Start, Smart Connect and Intel Wireless Display for displaying content on TVs and PC Synch.
Intel also highlighted “Medfield,” its first purpose-built 32nm platform for smartphones and tablets. Optimized for low power, high performance and longer use-time, these processors will be in production later this year and you can see “Medfield”-based tablets out in the market in the first half of 2012.
Both “Keeley Lake” and “Medfield” will support a range of operating systems including Windows, Google Android and MeeGo.
Intel Expands Mobile Computing with New Silicon, Software and Connectivity Capabilities [Intel press release, Feb 14, 2011]
Expanding upon Intel’s silicon capabilities, the company announced that it is sampling its 32nm “Medfield” smart phone chip with customers. “Medfield” is scheduled for introduction this year and will extend the performance benefits of Intel architecture into a low-power solution specifically designed for the smart phone market segment.
Financial Times was reporting from the Barclay’s Capital event as Intel inside 35 tablets, no phone till H2 2011 [Dec 8, 2010]
Mr Otellini said the phone game represented a marathon not a sprint for Intel. It was tackling issues of certification, modem integration and the telecoms software stack. Its smartphone processor codenamed Medfield was currently being debugged for shipment in 2011 and 2012, he added.
Medfield is the successor to the Moorestown chip, launched in May, which still does not match the low-power capabilities of Arm-based phone processors and has not appeared in any smartphones this year, despite Intel’s high hopes expressed at the CES show in January.
Clover Trail-W
World’s lowest cost, US$40-50 Android smartphones — sub-$100 retail — are enabled by Spreadtrum
Updates: Spreadtrum selects CSR connectivity and Location for Smartphone reference designs [CSR press release, Feb 27, 2012]
CSR plc (LSE: CSR; NASDAQ: CSRE) today announced that Spreadtrum Communications, Inc. (NASDAQ: SPRD), a Chinese fabless semiconductor company, has chosen CSR plc to provide wireless connectivity and location technologies for the Spreadtrum® SC8805G TD-SCDMA and SC6810 EDGE/WIFI low cost smartphone reference designs in order to meet market demand in China and emerging markets for internet access, data transfer, and location. Specifically, CSR will provide its CSR6027™ Wi-Fi solution, the SiRFstarIV™ location platform and Bluetooth for the reference designs. This is an extension to CSR’s relationship with Spreadtrum on feature phone platforms on which CSR connectivity, location and Bluetooth technologies are already in volume shipment.
“Spreadtrum has been instrumental in helping Chinese manufacturers to capitalise on the smartphone revolution by offering low-cost, easy-to-integrate processors and reference designs that speed time-to-market for wireless communication products,” said Ahmet Alpdemir, senior vice president of CSR’s Mobile Business Group “We view this partnership as an excellent way to continue to expand our market presence in China and other emerging markets for cost effective smartphones.”
Part of CSR’s UniFi® product line, CSR6027/6030 is a WAPI-qualified version for the Chinese market of the CSR6026™ single-chip solution delivering Wi-Fi 802.11n support for mobile embedded devices such as smartphones. The product provides manufacturers with low-cost, high performance Wi-Fi support without compromising battery life or space. CSR6027 offers a PowerSave feature ensuring that mobile devices can achieve optimal battery life, and offers a very small system footprint and very low eBom (electronic bill of materials), enabling easy integration into mobile devices.
SiRFstarIV is the market-leading location platform, now deployed in hundreds of consumer products worldwide, offering high acquisition and tracking performance and accuracy, low battery consumption, and active jammer removal. These features will bring to consumers of SC8805G and SC6810-enabled devices the ability to get a position fix with optimal speed, in varying conditions such as under dense foliage or in urban canyons, with very low battery consumption.
About the SC8805G and SC6810
The SC8805G for TD-SCDMA and the SC6810 for EDGE/Wi-Fi both come with a hardware reference design and compliance-tested software, which will accelerate time to market. Both are based on an ARM-9 600MHz processor which supports Android 2.2, 2D graphics, camera support up to 5MP, MPEG4 decoder and encoder, an HVGA touch screen LCD display and a range of connectivity options including Wi-Fi, GPS, Bluetooth.
About CSR
CSR is a global provider of innovative silicon and software solutions for the location-aware, media-rich, cloud-connected world. Our platforms are optimised for the automotive navigation and infotainment, digital cameras and imaging, connected home infotainment and wireless audio markets. We provide solutions to complex problems in the audio-visual, connectivity and location technology domains across a broad range of markets, with a technology portfolio that includes GPS/GNSS systems, Bluetooth®, Wi-Fi®, FM, NFC, aptX® and CVC™ audio codecs, JPEG, MPEG, H.264 imaging, IPS printing, microcontrollers, DSPs and broadband receivers. CSR’s technology solutions and market platforms enable its customers to deliver a superior user experience and are adopted by leaders in the auto, computer, home and mobile markets. More information can be found at www.csr.com. Keep up to date with CSR on our blog, or follow us on Twitter at twitter.com/CSR_plc.
– Spreadtrum Introduces 1GHz Low-Cost Smartphone Platform For TD-SCDMA & EDGE/WiFi [Spreadtrum press release, Jan 4, 2012]
Delivers 1GHz Smartphone Performance to US$100 Handsets
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in 2G and 3G wireless communications standards, today introduced a 1GHz Android smartphone platform for TD-SCDMA (SC8810) and EDGE/WiFi (SC6820) and announced that both products are now sampling with customers. With these two new solutions, Spreadtrum is redefining the performance standard for low-cost smartphones, enabling OEMs to deliver 1GHz performance at US$100 retail prices.
“Our 1GHz Android platform sets a new bar for low-cost smartphone performance,” said Dr. Leo Li, Spreadtrum’s president and CEO. “The graphics and web browsing performance of the SC8810 and SC6820 compares favorably to one of the most popular smartphone models globally, delivering a high performance applications and gaming experience for consumers. This type of experience has previously been available only in mid- to high-end handset models and can now be delivered by OEMs in US$100 smartphone models. This will reshape the definition of and consumer expectations for a low-cost handset.”
Spreadtrum’s 1GHz platform is the most highly integrated, lowest power smartphone platform for the TD-SCDMA market. The solution delivers the lowest chip count with a multimode single-chip RF transceiver supporting TD-SCDMA, EDGE, GPRS and GSM and integrates power management. The platform’s Cortex A5 processor architecture delivers more than 40% lower power consumption compared to ARM11-based products and more than 70% lower power consumption than Cortex A9 products, delivering differentiated standby and talk time performance relative to other smartphone models.
Designed with 40nm CMOS silicon technology, the SC8810 and SC6820 baseband platforms are powered by a Cortex A5 1GHz processor and incorporate an advanced multimedia subsystem which includes a Mali GPU with 3D/2D graphics acceleration and supports high definition video playback, a 5 megapixel camera, a WVGA touch panel and connectivity features including Bluetooth, WiFi and GPS. The SC8810 supports TD-SCDMA with HSDPA at 2.8Mbps, HSUPA at 2.2Mbps as well as quad-band GSM/GPRS/EDGE with dual-mode auto handover, while the SC6820 supports quad-band EDGE/GPRS/GSM. Both products combine silicon hardware with turnkey Android software that reduce both the design time and design resources required to deliver new handsets to market.
Spreadtrum’s expansion of its smartphone platform coincides with rapidly increasing demand in China for smartphone products. Industry analysts expect the smartphone market in China to exceed 100 million units in 2012, leading global demand for smartphone products.
Spreadtrum Introduces Single-Chip MultiMode TD-LTE/TD-SCDMA/GSM Baseband Modem at CES 2012 [Jan 9, 2012]
Highly Integrated TD-LTE Platform Places Spreadtrum at Forefront of 4G Evolution in China
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company” ), a leading fabless semiconductor provider inChina with advanced technology in 2G, 3G and 4G wireless communications standards, today introduced its first TD-LTE baseband modem, the SC9610. Designed with 40nm CMOS silicon, the SC9610 integrates multiple communication standards into a single-chip design, including multiband TD-LTE and TD-SCDMA and quad-band EDGE/GPRS/GSM. The SC9610, which now expands Spreadtrum’s product portfolio to 4G standards, is sampling with customers who are evaluating the chip for use in high end smartphone and datacard designs.
“Our single-chip multi-mode TD-LTE solution is a highly integrated platform specifically designed for the communication standards in use inChina,” said Dr.Leo Li, Spreadtrum’s president and CEO. “We are launching our solution as China Mobile begins more extensive trials domestically. The depth of experience we bring in TD-SCDMA products, combined with our early leadership in China’s 4G network evolution, positionsSpreadtrumas a long-term leading provider of multimode baseband solutions.”
TD-LTE or “Time-Division Long-Term Evolution” is a 4G standard and the evolution path from 3G TD-SCDMA for China Mobile, China’s largest domestic operator with more than 640 million total subscribers and an expected 50 million 3G subscribers as of the end of 2011. China Mobile has begun trials and network investment in TD-LTE and will continue to do so until commercial licenses are granted by the China government, which has also required that TD-LTE handsets be backward compatible with TD-SCDMA. Spreadtrum’s leadership in the TD-SCDMA market and the maturity of its multimode technology for TD-SCDMA/EDGE/GPRS/GSM ensures strong performance across both TD-LTE and TD-SCDMA communications standards while the single-chip multi-mode design enables a more seamless handover experience than multi-chip solutions.
Spreadtrum’s SC9610 supports multiple bands, achieves downlink speeds of 100 Mbps and uplink speeds of 50 Mbps and supports 5, 10, 15 and 20 MHz channels and 2×2 MIMO. The SC9610 is currently progressing through field trials inChinain tandem with customer design-in activities.
End of updates
Competitive information:
– Huawei’s IDEOS U8150 smartphone for US$86 in Kenya: 350,000 units sold in 8 months [Aug 17 – 23, 2011] and that is an Android 2.2 smartphone based on Qualcomm SoC
– Blurring lines between smartphones and feature phones: the Muve Music Phone case from Cricket Communications [Dec 2, 2011] where the entry level, Qualcomm SoC based Android smartphone has an M.S.R.P. of $129.99 while on Amazon currently sold for $69.99
– OPhone 2.5 and beyond from Borqs for China Mobile [Dec 5, 2011] in which the current entry-level Ophone 2.5 (Android 2.2 compatible) TD-SCDMA smartphones (based on Marvell’s PXA918/920 SoC) have street price of ~$140
– First real chances for Marvell on the tablet and smartphone fronts [Aug 21 – Nov 23, 2011] where other Marvell related information is shown as well the fact is well illustrated that Marvell continues to be the only provider of a single-chip TD smartphone solution, the first to work with SoC customers to deliver $100 TD smartphones.
– High expectations on Marvell’s opportunities with China Mobile [May 28, 2011]
– ASUS, China Mobile and Marvell join hands in the OPhone ecosystem effort for “Blue Ocean” dominance [March 8, 2011]
Third Quarter 2011 Spreadtrum Communications Inc Earnings Conference Call [Transcript, Nov 11, 2011]
…
In the fourth quarter, Spreadtrum will be introducing a low-cost TD-SCDMA smartphone solution. This solution will be based upon 40 nanometer single core processor, running Android 2.2, that can enable a PCBA cost of less than $30. We believe that this low-cost solution will help to grow total smartphone volume next year.
We expect the TD-SCDMA market to grow significantly in volumes in 2012 and 2013. The TD network is continuing to improve, and China Mobile phase five deployment is now addressing the blind spots in cities and delivering nationwide coverage as well. The government has indicated that they do not plan to issue a commercial license for LTE until 2014. In the meantime, China Mobile needs to offload the voice and data traffic from the congested 2.5G network to the TD-SCDMA network, which has a greater capacity.
Consumers now have access to a wider portfolio of feature phones and smartphones, with the price and performance of TD-SCDMA feature phones close to the EDGE handset.We believe that in 2012 the TD-SCDMA market will grow to around 90 million units, up from the estimated 50 million units this year. We expect that 60 million units will be delivered through the China Mobile central and local channels. Another 30 million units will sell through the open channels.
…
With the 40 nanometer platform, we are now — is more than 50% of market share of total shipments of TD-SCDMA market. I hope we can maintain a dominant position moving next year, because continue with the 40 nanometers products.
On top of that, like I said in my script, we have introduced low-end smartphone platforms, so by the end of the year, to the TD-SCDMA market as well. So, in other words, we will be providing more products, a better portfolio to the TD-SCDMA market, so, hopefully, that we will still maintaining the leading position in TD-SCDMA market.
…
Bill Lu – Morgan Stanley – Analyst
I think you’re introducing some smartphone solutions right now. If we just focus on the EDGE solution, this is something that a couple of competitors have done in the past, and it hasn’t done very well, historically, right — the EDGE smartphone. I think part of it was maybe cost was too high. It sounds like you’re addressing that.
Your PCBA cost is quite low, but something that other people complain about is also the performance just isn’t good enough with a low velocity processor — that the whole thing is just too laggy. You’re going to do it with a single chip approach. I’m sure you’ve talked to many customers about this.What kind of feedback are you getting from customers, and how do you think (inaudible)?
… local kings and the brand names, operators in the emerging market. They all asked me the same question. They said, Leo, can you provide us with adequate performance? Not the best — not even say good performance — adequate, right? However, with the EDGE (inaudible), right? And the EDGE / WiFi, obviously, Android based.
Basically, the idea is it’s not necessary to say, hey, let’s, like, take more — customer away from high-end smartphones. Rather, I think this is to convert some of the high-end feature phone people to, say, affordable smartphones.
To address your first part of the question, you say, hey, Leo, why the competitors have a similar solution, and they’re not as successful as we think. There — you said one reason is the cost is not low enough. Second, we also compare our performance, which is 40 nano, about 600 megahertz, and on the same — the Android 2.2, right, what we found was the better or improved performance on our chip.
On top of that, one of the main things, also, is the 40 nano brings down the current consumption — power consumption, right. That also helps a little bit. However, yes, this is the first introduction to the market. I think it has the usage. I said it my script also.
If you want to say use WCDMA based smartphones, right. So, in addition to more expensive baseband chips, on top of that, you have to pay also the IP royalty to others, and that which is like a 6% to 7% of handset price, that is very, very high. So — and in the emerging market, the WCDMA signals is not that great. Coverage is very poor, so it’s no point to use the WCDMA.
Rather, if you have one of the faster communication, use WiFi, and then, the rest of the day, just use EDGE. So it seems to be attractive product.The feedback from customers, by the way, on this one, is very positive.
… could talk about your [smartphone] targets …
What I said in my script, with low-end introduction, 600 megahertz, single core. However, I think, around Q1 next year, we will be introducing a one gigahertz TD-SCDMA smartphone chip to the market, and also, 900 to one gig EDGE/WiFi Android 2.2 and Android 2.3 platforms to the market. Yes.
I think the smartphone is very important to everyone, so we also kind of try to speed up the smartphone development. So, the first ones are 600 megahertz, like I said, TD-SCDMA and EDGE/WiFi to both market.
…
Qin Zhang- JP Morgan – Analyst
I just have a follow-up question on this. So, for instance, my understanding is that Marvell actually has over 50% market share in the TD smartphone segment in the fourth quarter. I just wonder, like, what is the target market share that you think Spreadtrum can get in the TD smartphone space?
Yes. In Q3, even early part of the Q4, obviously, we do not have a low-end smartphone solution.Yes, the other people who had a solution enjoyed the show there. However, I think, next year, when we introduce the low-end 600 megahertz — and we will be introducing one gig in — like, an Android 2.3 product to the market. I mean, the cost will be very competitive, and yes, the performance will be attractive to regular consumers — a better performance. That’s my point.
I think we definitely can take market share away from the competitors — to exactly what number, obviously, the higher the better for us. However — my — the general point, really, is with the smartphone solution, we definitely will be able compete better — I mean, next year — a better position to compete next year.
Qin Zhang- JP Morgan – Analyst
Got it. And my second question is also on — it’s also on the timeline of the Android product. So, I just wonder, like, let’s say, for the fourth quarter, when we launch the TD-SCDMA, as well as EDGE Android platforms, how many months do we have to wait until we see these products in the retail market?
I think you should be able to see that in Q1, hopefully, on the — unfortunately, Q1, there is China — Chinese New Year, right — a delay, somewhat, for the action. I think, generally, the — in Q1 and early Q2, there definitely will see the product introduced to the market, both for TD and for EDGE/WiFi. And then, also, that — we’re talking about the one we introduce by the end of this year, Android 2.2. And then, I think, around Q2 timeframe, yes, we should be introducing 2.3 to the market as well. So we are addressing smartphones segment next year.
…
Bill Lu – Morgan Stanley – Analyst
… your EDGE smartphone … I think you have mentioned that this solution is including WiFi. Is that your own WiFi, or are you buzzing somebody else’s WiFi?
… I do not have my WiFi solution yet. I think that we will work with a partner. …
[they have selected CSR6027™ Wi-Fi solution for that, which was announced by CSR just on Feb 27, 2012 on MWC, but the decision should have been much earlier]…
Jessica Chang – Deutsche Bank – Analyst
Thanks. Hi, Leo and Shannon. Congrats on your good results again. I have a few questions. First, can you share with us how many TD smartphone customers have you been working with right now?
Five to six clients. … entering mass production … Q1 next year. … with the Android 2.2 platform.
Jessica Chang – Deutsche Bank – Analyst
And how about your — the EDGE/WiFi smartphone? How many clients do you have right now?
I have more clients. Maybe eight to ten customers.Yes. I think the introduction to the market will be also in Q1 timeframe.
…
Jessica Chang – Deutsche Bank – Analyst
… you have so many new products and different platform, different geometry and clock space. Can you help us to maybe rank your growth driver for next year — maybe, like, your first three, by the (inaudible)?
Yes, we have quite a few products, which will be — introduced or will be introduced to the market. That’s why I spent so much money in R&D. Anyway, I think the first one will be smartphones introduced to the market, like, 600 megahertz, right — clock speed wise.
And then, the second quarter, or Q3, will be one gigahertz, or 900 megahertz, smartphones solution to the market.The second, also, in next year — I think, around summertime next year, most of — almost all of our products will be 40 nano based, which is very good.
Thirdly, also, the driving factor will be — in the summer, or Q3, will be first to hopefully introduce a WCDMA solution to the market. That is revenue I never had before. Okay? So, it would be nice to have some new additional revenue. In other words, the driving factors, from technology product point of view, are smartphones and 40 nano based and thirdly,Ws.
Jay Srivatsa – Chardan Capital Markets – Analyst
Yes. Thanks for taking my question, Leo. There’s been a lot of questions on TD. Let me ask a question on WCDMA. As you look to next year to roll out your WCDMA solution, obviously, there’s a large incoming player there. How do you hope to be able to penetrate that market successfully with your solution?
The WCDMA position product — first of all, we’re going to use our 40 nano based platform to do the design, so that, not only the die size will be fairly small, right. Second, the current consumption will be fairly good, and also, in same time, to enhance the performance of WCDMA products. So — and also, with the — like, HSPA+ type of WCDMA, combined with the 2.5G platform of Spreadtrum’s, I think our products will be fairly competitive and attractive.
I know the WCDMA is a relatively mature — more mature market than TD. There’s more competitors out there. However, with a more advanced platform, and then, with the — with — so, with the turnkey solutions, and there’s some business models, and also, closeness to the handset makers that in China, and I think we are confident to compete in that area as well.
Jay Srivatsa – Chardan Capital Markets – Analyst
You’ve talked about Android quite a bit. Can you — and the other hardware development you’ve got coming. Can you talk a little bit on the software side? What is your plan to go after Windows Mobile or other operating systems, as you look ahead to some of the other products out there?
We have a plan also to engage with Windows. I think, maybe, not this year. Maybe — hopefully, we’ll start the next year.You can see the clear trend. Nokia and Microsoft, I think, want a more massive introduction to the market — the Windows — Window based — Windows 7, right? I think it started with 7. Maybe year after next year, it end up with 8.Who knows?
But, yes, I think that’s one of the things that we will catch up with. However, at the moment, for open market, the Android, free of charge — still a nicer thing to the customers.
Spreadtrum Introduces World’s Lowest Cost Android Smartphone Platform for TD-SCDMA and EDGE/WiFi, Reaffirms Q4 Guidance [Spreadtrum press releases, Dec 8, 2011]
Solutions Define New Entry Level for Smartphones, Increasing Affordability for China and Emerging Market Consumers
SHANGHAI, Dec. 8, 2011 /PRNewswire-Asia-FirstCall/ — Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced the commercial availability of two low-cost Android smartphone platforms, the SC8805G for TD-SCDMA and the SC6810 for EDGE/WiFi. The two 40nm-based 600MHz solutions are based on a low power, cost efficient architecture that lower total phone cost to US$40-50, well below currently available smartphones and easily within reach of sub-$100 retail prices. This entry point can accelerate the overall footprint for smartphones in China and emerging markets by appealing to consumers who might otherwise choose a high end feature phone and by expanding smartphone distribution beyond operator channels to the open market.
“The SC8805G and SC6810 mark Spreadtrum’s entry into the smartphone category [via Android],” said Dr. Leo Li, Spreadtrum’s president and chief executive officer. “We have combined our expertise in 40nm baseband platforms [meaning SC88xx and SC68xx series of SoCs require an additional application processor chip as well] and highly integrated systems to deliver a low-cost solution in a new price segment that will make smartphone devices more accessible to consumers in China and emerging markets.”
Spreadtrum also reaffirmed previously-released Q4 revenue guidance of US$188 million – US$194 million and gross margin guidance of approximately 41%. Dr. Li added, “Our smartphone solutions for TD and EDGE/WiFi are now commercially available and have started shipping. Demand in our 2G and 3G business lines remains healthy and we are on track to meet or exceed our Q4 revenue outlook.”
The SC8805G and the SC6810 are based on Spreadtrum’s turnkey platform, which consists of a hardware reference design and compliance-tested software suite that reduces the engineering requirement and accelerates time to market for handset manufacturers. The two solutions incorporate an ARM-9 600MHz processor, integrate power management and support Android 2.2, 2D graphics, camera support up to 5MP, MPEG4 decoder and encoder, an HVGA touch screen LCD display, as well as connectivity and broadcast functions including Wi-Fi, GPS, Bluetooth, FM and mobile TV.
The SC8805G targets China’s growing demand for low-cost smartphones, supporting China Mobile’s TD-SCDMA standard. China Mobile estimates that next year more than 30 million TD-SCDMA smart phones will be sold to consumers, most in the low-cost segment. The SC6810 is designed for emerging markets, where 3G rollouts are still in development and EDGE/WiFi provides consumers interested in a smartphone experience with the best coverage available.
The two platforms have been designed into models by more than a dozen handset manufacturers, with the first models expected to ship this month. Designs with Spreadtrum’s SC8805G have passed China Mobile’s qualification testing, paving the way for product launch.
About Spreadtrum Communications
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum”) is a fabless semiconductor company that develops baseband and RF processor solutions for the wireless communications market. Spreadtrum combines its semiconductor design expertise with its software development capabilities to deliver highly integrated baseband processors with multimedia functionality and power management. Spreadtrum has developed solutions based on an open development platform, enabling its customers to develop customized wireless products that are feature-rich to meet their cost and time-to-market requirements. For more information, visit www.spreadtrum.com.
Earlier comprehensive information about Spreadtrum: Marvell beaten by Chinese chipmakers in sub 1,000 yuan handset procurement tender of China Mobile [Nov 15, 2010]

Hisense N52 is a feature phone (with CMMB etc.) as New Postcom N332 and T-Smart Q1 are.
Also in the follow-up: Marvell’s single chip TD-SCDMA solutions beaten (again) by two-chip solutions of Chinese vendors [July 11, 2011]
Currently available, related products:
3G Series Baseband Chips:
– SC8800D : TD-SCDMA/GSM/GPRS Multimedia Baseband Chip with ARM926EJ-S® core, clock speeds up to 100MHz
– SC8800S : HSDPA/TD-SCDMA/GSM/GPRS/EDGE Baseband Chip with ARM926EJ-S® core, speeds up to 200MHz: can be used to develop the solutions of Feature phone and Smart phone; and it also can be applied for the PC data card solutions.
– SC8800G : TD-HSPA/TD-SCDMA/GSM/GPRS/EDGE Baseband Chip with ARM926EJ-S® core, clock speeds up to 400MHz:
>>> the world’s first 40nm low power TD-HSPA/TD-SCDMA dual mode communication baseband processor
>>> can be applied to develop the solutions of Feature phone and Smart phone at extremely low cost.2G Series Baseband Chips (all with ARM7TDMI® at either 78/80/104/192/200MHz) : SC6600D / SC6600H / SC6600I / SC6600L6 / SC6600L7 / SC6600R / SC6800D / SC6800H / SC6610/SC6620
Previous products:
SC8800H : HSDPA/TD-SCDMA/GSM/GPRS/EDGE Baseband Chip with ARM926EJ-S® core, speeds up to 200MHz: for enabling handset manufacturers and operators to offer powerful 3G applications.
Comparison of H, S and G baseband chips of the SC8800:
In more detail from SPRD Annual and Transition Report on EDGARonline [April 6, 2011]
The SC8800 series of baseband semiconductors was first commercially released in October 2005 and is designed for value multimedia and mid-range multimedia wireless terminals that support TD-SCDMA/HSPA and GSM/GPRS/EDGE. The SC8800 baseband semiconductors support dual mode functionality, which enables wireless terminals to support 2G, 2.5G, 2.75G, 3G and 3.5G technologies, and incorporate integrated power management. The SC8800 series supports up to 2.8Mbps HSDPA and 2.2Mbps HSUPA features. Additionally, the SC8800 series supports a digital still camera with a resolution of up to 5 mega-pixels. The SC8800 series incorporates multimedia functionality, which includes streaming video, video telephony, digital audio playback that supports MP3 and other music formats such as AAC and AAC+ and MPEG4 digital video playback, and 64-channel polyphonic ringtone playback.
Model Number Date of Initial Commercial Release • Target Wireless Handset
SC8800D October 2005 • Value TD-SCDMA handsets
[but developed SC880A as “world’s first single chip dual-mode TD-SCDMA/GSM baseband chip” in Apr, 2004 – see below]
- GSM/GPRS Class12, TD- SCDMA Downlink 384kbps
- ARM926EJ core.
- 16K I-Cache,16K D-Cache
- AMR-NB/Midi/ ADPCM/AAC
- Integrated with SDIO I/F
- Integrated touch panel driver
SC8800S September 2009 • Multimedia handsets [like the Lenovo O1 smart phone which also has a 624 MHz Marvell PXA310 application processor] [but developed SC8800H Feb, 2007 – see below]
- GSM/GPRS Class12, Edge class10 Quad-band; TD-SCDMA/ HSDPA 1.6Mbps Dual-band
- ARM926EJ 160MHz
- AMR-NB/Midi/ ADPCM/AAC/AAC+
- MPEG4/H.263 QVGA Decoding 25fps
- 2M YUV I/F, 5M JPEG I/F
- Integrated touch panel driver
SC8800H February 2010 • Videophone handsets [like the Hisense N51 or T-Smart Q1 feature phones] [but developed SC8800H Feb, 2007 – see below]
- GSM/GPRS Class12, Edge class10 Quad-band; TD-SCDMA/ HSDPA 1.6MbpsDual-band
- ARM926EJ 200MHz
- MPEG4/H.263 QCIF Codec 15fps
- 2M YUV I/F, 5M JPEG I/F
- Integrated touch panel driver
SC8800G December 2010 • CMMB handsets [rather for high-end feature phones [like the Hisense T36 and T39] – see the below CEO statement in Oct’11]
- GSM/GPRS Class12, Edge class10 Quad-band; TD-SCDMA/ HSDPA 2.8Mbps/HSUPA 2.2MbpsDual-band
- ARM926EJ 400MHz
- AMR-NB/Midi/ ADPCM/AAC/AAC+
- MPEG4/H.263 CIF Decoding 30fps
- H.264 QVGA Decoding 30fps
- 2M YUV I/F, 5M JPEG I/F
- Integrated touch panel driver
SC8801G December 2010 • Ultra Low-cost handsets [rather for low-end feature phones [like the Huawei T2011 or Hisense T30 TD, T11 and T51] – see the below CEO statement in Oct’11]
- GSM/GPRS Class12, Edge class10 Quad-band; TD-SCDMA/ HSDPA 2.8MbpsDual-band
- ARM926EJ 256MHz
- AMR-NB/Midi/ ADPCM/AAC/AAC+
- MPEG4/H.263 CIF Decoding 30fps
- MPEG4/H.263 QCIF Codec 15fps
- 2M YUV I/F
- Integrated touch panel driver
SC8802G December 2010 • TD Modem
- GSM/GPRS Class12, Edge class10 Quad-band; TD-SCDMA/ HSDPA 2.8Mbps/HSUPA 2.2MbpsDual-band
- ARM926EJ 192MHz16K I-Cache,16K D-Cache
- AMR-NB/Midi/ ADPCM
[SC8805G is for the Android smart phones – see the below CEO statement in Oct’11. ]
Related Milestones :
2001. Jul. Spreadtrum’s wholly-owned subsidiary established in Shanghai, China.
Apr. Spreadtrum incorporated in the Cayman Islands and its wholly owned subsidiary established in California, USA.2004. Apr. Developed the SC8800A, the world’s first single chip dual-mode TD-SCDMA/GSM baseband chip.
2007. Feb. Successfully developed the SC8800Hchip, a TD-SCDMA Chip that supports HSDPA.
2008. Jan. Acquired US-based RF designcompany – Quorum Systems, Inc.
2009. Feb. Spreadtrum launched the world’s first single-chip RF transceiverto support TD-SCDMA/HSDPA/EDGE/GPRS/GSM standards.
2011. Jan. Successfully launched the world’s first commercial 40nm TD-HSPA/TD-SCDMA multi-mode baseband processor-SC8800G.
My own additions:
The ARM926EJ-S® core is faster than the ARM7TDMI® one. But keep in mind that:
– The entry level ZTE smartphones (one of the leaders on the entry market) are using the Qualcomm MSM7627 chip which has Dual cores: the main one being a higher performing ARM1136EJ-S at 600MHz, and the second core is a 400MHz ARM926EJ-S processor dedicated to modem duties. See: Blurring lines between smartphones and feature phones: the Muve Music Phone case from Cricket Communications [Dec 2, 2011]
– The same is true for the Marvell 918/920/920H single-chip based TD-SCDMA phones introduced by a number of vendors on the Chinese market (ASUS, Coolpad, Hisense, Huawei, Guangdong Mobile, Lenovo, Motorola, RIM, Samsung, Sharp, Sony Ericsson, Yulong and ZTE) with its on-chip dedicated, Marvell-designed ARM9 Modem core and an associated Modem DSP core as well.
– The DMIPS/MHz values of other ARM cores used today is even much higher (in addition to their higher max frequencies for current low power versions shown beneath the DMIPS/MHz values):
ARM7 |
ARM9 |
ARM11 |
Marvell PJ1 Sheeva |
ARM Cortex A8 |
Marvell PJ4 Sheeva |
Qualcomm Scorpion |
ARM Cortex A9 |
0.94 |
1.1 |
1.25 |
1.46 |
2.0 |
2.5 |
2.1 |
2.41 |
200 |
600 |
1000 |
1000 |
1200 |
1200 |
1500 |
1500 |
Spreadtrum Communications, Inc. Announces Third Quarter 2011 Financial Results [Spreadtrum press releases, Nov 11, 2011]
…
BUSINESS HIGHLIGHTS:
Commenting on the results, Spreadtrum’s Chairman and CEO, Dr. Leo Li said, “We exceeded revenue guidance in 3Q 2011 as quarterly revenue grew in both our 3G and 2.5G product lines. In the TD-SCDMA market, we continued to gain market share with global and domestic handset manufacturers as a result of our breakthrough standby and talk time and high level of integration. Our basebands are powering the TD-SCDMA version of the Samsung Galaxy S II*, which launched in the third quarter and was well received by consumers. The overall TD-SCDMA market has continued to grow at a good pace given the combination of continuously improving network coverage and compelling portfolio of low-cost feature phones and smartphones that are now available to consumers. In the fourth quarter, we are on track to introduce our low-cost 40nm-based smartphone solutions for both TD-SCDMA and EDGE/WiFi, which we believe will drive further growth in both markets going into 2012. Through improvement in product mix, we have been able to mitigate ASP pressure in low-end feature phones. Looking ahead to 4Q 2011, with continuing growth vectors in both the TD-SCDMA and 2.5G markets, we expect revenue to be in the range of US$188 million – US$194 million with a gross margin of approximately 41%.”
Key business highlights include:
- Expanded Beyond 50% Market Share in TD-SCDMA: Spreadtrum expanded its market footprint with more than 30 customers with 72 handset models, including both global and domestic tier-1 handset manufacturers, by the end of September 2011. In the third quarter, Spreadtrum achieved a dominant market share position in both the feature phone and fixed wireless handset markets and entered the smartphone market with the Samsung Galaxy S II* launch.
- Increased Product Footprint at Samsung to Basebands: The TD-SCDMA version of the Samsung Galaxy S II launched in China in the third quarter and is powered by Spreadtrum’s RF and baseband solutions. This is Spreadtrum’s first entry in the TD-SCDMA smartphone market as well as its first shipping baseband design win with a global tier-1 OEM. The successful engagement with Samsung lays the foundation for Spreadrum to engage with other global tier-1 manufacturers.
- Mitigated Price Pressure in 2.5G Markets with Improved Product Mix: With higher ASP products such as the ARM9-based SC6800H and TD product portfolio, Spreadtrum has been able to mitigate price pressure in the 2.5G feature phone market and maintain revenue growth and margin stability.
- Completed Majority Acquisition of WCDMA Vendor MobilePeak: Spreadtrum completed the acquisition of a majority 85.6% ownership stake in MobilePeak, in preparation for delivery of WCDMA/HSPA+ solutions by mid-2012.
(*) Samsung Galaxy S II TD-SCDMA version (i9108) has a Samsung S5PV310 Exynos 4210 dual-core ARM Cortex A9 1.2GHz application processor as well. Its street price currently is ¥ 3100 (US$ 489) vs. ¥ 3750 (US$ 592) list price.
Strategically important, other information regarding Spreadtrum:
Spreadtrum and Sohu.com Partner to Deliver an App Store for Feature Phones [Spreadtrum press releases, Nov 3, 2011]
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company” ), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced a strategic partnership with Sohu.com Inc., China’s leading online media, search, gaming, community and mobile service group. Through this partnership, Sohu has developed a mobile app store for Spreadtrum’s WRE (“Windows Runtime Environment”) platform for feature phones. Sohu will also use the app store, which supports applications both from Sohu and other mobile developers, to deliver rich Internet applications and services to China consumers.
Spreadtrum’s WRE platform is middleware for feature phones that enables dynamic loading and updating of applications post-sale, providing the same experience to consumers as smartphone handsets. Sohu has leveraged Spreadtrum’s platform to deliver a complete app store solution, including its related server-side operations. Spreadtrum’s WRE platform with Sohu’s app store solution has been rolled out in volume by one of China’s top ten design houses and is now integrated into Spreadtrum’s standard feature phone platform solution.
“Sohu.com has more than ten years of experience in delivering applications to more than one hundred million users, and is a leading provider of online applications and games in China,” said Dr. Leo Li, Spreadtrum’s president and CEO. “By partnering with Sohu.com, we bring together their core competency in Internet services with our strength in feature phone platforms, bringing smartphone and app store capability to the highest volume phone segment in China and emerging markets. This expands Sohu’s and other application developers’ reach to a larger mobile user base and transforms the traditional definition of feature phones.”
Dr. Charles Zhang, Sohu.com Inc’s Chairman and CEO, said: “The strategic cooperation with Spreadtrum is far-reaching in impact to the mobile internet industry. As a global top five mobile phone chip supplier, Spreadtrum’s customers reach a large user base interested in the mobile Internet experience. By cooperating with Spreadtrum, we can provide a variety of mobile internet services to this group of users, including web, video, microblogging, search, maps and other applications.”
Spreadtrum’s WRE platform with Sohu.com’s app store is now shipping in volume with Spreadtrum’s SC6800H chip to one of China’s top ten design houses. Spreadtrum expects shipments to grow over the coming quarters.
About Spreadtrum Communications, Inc.
…
About Sohu.com, Inc.
Sohu.com Inc. is China’s premier online brand and indispensable to the daily life of millions of Chinese, providing a network of web properties and community based/web 2.0 products which offer the vast Sohu user community a broad array of choices regarding information, entertainment and communication. Sohu has built one of the most comprehensive matrices of Chinese language web properties and proprietary search engines, consisting of the mass portal and leading online media destination. Sohu corporate services consist of online brand advertising on its matrix of websites as well as bid listing and home page on its in-house developed search directory and engine. Sohu also offers wireless value-added services such as news, information, music, ringtone and picture content sent over mobile phones. Sohu’s online game subsidiary, Changyou.com and its subsidiaries currently operate over 10 online games that includes in-house developed MMORPGs, such as Tian Long Ba Bu, one of the most popular online games in China, and Duke of Mount Deer, as well as Web-based games such as DDTank. Sohu.com, established by Dr. Charles Zhang, one of China’s internet pioneers, is in its fifteenth year of operation.
Spreadtrum Introduces First TD-Dual-SIM Dual-Standby Solution for TD-SCDMA [Spreadtrum press releases, Oct 11, 2011]
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced the introduction of the industry’s first dual-SIM dual-standby technology for TD-SCDMA mobile phones. Spreadtrum’s TD-SCDMA dual-SIM technology allows consumers to receive calls and texts, or browse data, on either number while the phone is turned on.
For consumers, dual-SIM TD-SCDMA provides flexibility in the choice of voice or data plan, allowing them to retain or use different China Mobile subscriptions for different purposes. Dual-SIM provides the added convenience of allowing for two “local” numbers, enabling users to place local-rated calls while traveling between provinces, without carrying two phones. And, it enables users to use phone and data functions from two different SIMs simultaneously, allowing users to optimize their voice or data usage to a preferred plan. Consumers are able to use the dual-SIM capability across both the 3G TD-SCDMA and the 2G GSM/GPRS/EDGE networks and use SIMs from different carriers in the same phone.
Spreadtrum’s dual-SIM dual-standby feature is the latest in its series of innovations for the China TD-SCDMA market, following the introduction of its SC8800G seriesof basebands on an advanced 40nm platform whose low power consumption delivers breakthrough standby and talk time performance relative to other solutions available in the market. Spreadtrum currently commands greater than 50% market share of TD-SCDMA baseband shipments, and its wireless communications solutions are being used in fixed wireless, feature phone and smartphone handsets sold by both global and domestic tier-1 brands.
“Dual-SIM enabled by a single baseband is a technology innovation that Spreadtrum was the first to develop for the 2.5G market,” said Leo Li, Spreadtrum’s president and chief executive officer. “Now, by bringing dual-SIM to TD-SCDMA, we are simplifying the 3G handset purchase decision by allowing consumers to take on new subscriptions while retaining their existing plans. We believe this attractive feature will contribute to further growth in TD-SCDMA handset shipment volumes.”
Dual-SIM dual-standby will be available as an option on Spreadtrum’s SC88xx series of TD-SCDMA basebands as well as future products, beginning in 4Q11.
Spreadtrum Completes Majority Acquisition of WCDMA Provider MobilePeak [Spreadtrum press releases, Oct 3, 2011]
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that it has completed a majority acquisition of WCDMA solutions provider MobilePeak Holdings, Ltd. (“MobilePeak”) on September 30, 2011.
The acquisition of MobilePeak allows Spreadtrum to enter the global 3G and LTE markets with WCDMA/HSPA+ technology. MobilePeak’s 3G technology combined with Spreadtrum’s advanced 40nm baseband platform will enable Spreadtrum to deliver low-cost, high-performance WCDMA solutions for the global market and serve as a foundation for the Company’s next-generation multi-mode 3G/4G solutions. MobilePeak’s technology supports 3GPP standards through Release 7, including a full-rate 384Kbps modem and HSPA+ technology up to Category 14 at 21Mbps maximum downlink speed and 11Mbps maximum uplink speed. Spreadtrum anticipates that its first WCDMA baseband platform introduction leveraging MobilePeak’s technology will be in the first half of 2012, targeting consumers in emerging markets as well as 3G subscribers on the China Unicom network.
Spreadtrum increased its equity ownership in MobilePeak to approximately 85% as a result of the acquisition. Spreadtrum expects to purchase the remaining outstanding shares by year end. Spreadtrum expects the total cash consideration for the ordinary shares, including shares purchased on September 30, 2011 and shares that remain to be purchased, to be approximately US$5 million. Spreadtrum may also pay additional cash and grant restricted share units to MobilePeak team members as they meet certain product development milestones.
Li Liyou: Spreadtrum push WCDMA Smartphone chips next year [Oct 17, 2011]
(updated from Leo Li, Spreadtrum, WCDMA, smart phone chip, LTE as well)
Spreadtrum, Chairman and CEO of Li Liyou revealed, Spreadtrum launch [of] WCDMA Smartphone chips [is] planned for 2012, and will push the TD+WCDMA dual-mode chips [as well]. At the same time, Spreadtrum will from 2012 [do] research and development [of] 28-nanometer LTEchip products.
Prior to [this,] Spreadtrum launches [of] chip products are [were] mainly concentrated in the area of GSM and TD.
It is understood that, since 2003, [as the] Spreadtrum TD chip [was] put into research and development, and in 2005 developed the industry’s first TD-chip, nearly half of the existing R & D efforts [were] in the development of TD-related products.
Currently, Spreadtrum series chips and solutions [are] including: SC8800G for high-end feature phones and SC8801G for low-end feature phones, as well as the Modem chip SC8802G and SC8805G for the Android smart phones. The SC8800G, launched by Spreadtrum in early 2011, was the world’s first 40 nanometer TD baseband chip, this chip will enhance the development of telecommunications technology capabilities to the forefront of the industry. It is reported that shipments of this 40 nm chip were more than 10 million.
Push the TD+WCDMA dual-mode chips
Leo Li introduced [that] in the domestic TD field Spreadtrum’s market share has reached about 50%, its chip product line has been adopted by international brand mobile phone manufacturers, for example, Samsung GALAXY S II has the TD Spreadtrum baseband chip SC8802G.
Continue to increase input of the field of TD, Spreadtrum also plans to enter the field of WCDMA. Li Liyou revealed that “next year will have WCDMA Smartphone chip shipments. ”
“I communicate with overseas operators found that the other party want to have more expensive to call WCDMA handsets.” Li Li, Yu explained that in addition to better use of data services in addition, 3G networks are often ignored, another a little – a very high efficiency of call, the network capacity is much higher than 2.5G networks.
Based on this demand, that Leo Li, TD + WCDMA chip solution Spreadtrum will also become the mainstream of future product launches. In fact, Spreadtrum has recently introduced the industry’s first TD dual card dual standby mobile phone program to meet the users a mobile phone and TD, GSM / WCDMA networks twenty-two switch.
Based on this market demand, Li Liyou believes that TD+WCDMA chip solution will become the mainstream of of future product launches. In fact, Spreadtrum has recently launched the industry’s first TD dual card dual standby mobile phone program, [which] can meet the userusing a cell phone and switch between TD and GSM/WCDMA networks.
Plan to research and develop 28-nm LTE chips
Leo Li introduced the [plans for] products in the future planning. Spreadtrum will invest more in the field of smart phones. In addition, Spreadtrum also plans to launch in 2012 baseband and radio frequency in one single chip, and in the future to support TD-LTE/FDD LTE / TD-SCDMA / GSM [in a] multi-mode single-chip.
“The current 40-nanometer chips may not be able to meet the LTE network computation, therefore, Spreadtrum will from 2012 commence product research and development of 28-nanometer chips to meet future demand for the use of LTE products.” Li Liyou believes that world’s first 40 nm TD baseband chip has made the launch of Spreadtrum technology to go beyond the traditional European and US companies, but research and development [of] 28-nanometer chips will remain a major challenge [for] Spreadtrum.
“LTE’s development will also have some time [to happen]. Before this the way to ease pressure on the GSM network is to promote TD-SCDMA network.“ Li Liyou stressed that ”China Mobile has more than 600 million users, [with] an average of about two years for a machine there is nearly 200 million of replacement, [so] the market potential is huge. ”
It is understood that Spreadtrum TD-chip products are currently used in custom machines [by] operators and open market, and custom machines accounted for one third of the total market. “I hope that operators will cancel subsidies for customizing machine, and use this money as phone bill, subsidies to purchase TD cell phone users, allowing consumers to select the end product.” Li Liyou believes that this approach would eliminate a number of mobile phones, to make the healthy development of the community channel, and thus accelerate the TD in the open market instead of GSM phones.
Spreadtrum Meets Milestone for China Mobile TD-SCDMA Grant [Spreadtrum press releases, Sept 30, 2011]
Shipment growth continues with more than 50% market share and technology leadership in TD-SCDMA, with 40nm single-chip with TD-SCDMA/EDGE/GPRS/GSM, multi-media and power management features
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that in 3Q 2011 it has met the last major milestone of a TD-SCDMA research and development grant awarded by China Mobile to the Company in 2009. This marks successful completion of the project and will enable the Company to recognize more than US$8 million in research and development grantsas an offset to operating expenses in the third quarter of 2011, including subsidies recognized from both the China Mobile and other government projects. Spreadtrum’s TD-SCDMA customers include more than 30 global and domestic tier-1 manufacturers and design houses who have introduced more than 72 feature phone and smartphone models in 2011 using Spreadtrum’s baseband solutions.
Spreadtrum now commands more than 50% market share of TD-SCDMA shipment volumes. Dr. Leo Li, Spreadtrum’s president and CEO commented, “We are the clear leader in the feature phone and fixed wireless segments of the TD-SCDMA market, which account for the majority of industry shipments so far this year. Our 40nm-based single-chips with TD-SCDMA/EDGE/GPRS/GSM, multi-media and power management features have enabled customers building handsets on our platform to achieve breakthrough standby and talk times, at a retail price point that is attractive to 3G handset buyers. We further expect to expand our footprint in the smartphone segment following the launch of our low-cost single-chip smartphone product.”
Dr. Li added, “In addition to today’s news and in response to recent shareholder inquiries, we would like to provide additional clarification on our corporate structure. Our primary operations in China are conducted through a wholly foreign owned enterprise (WFOE), distinct from the variable interest entity (VIE) structures that are common in the China Internet sector and that have been the subject of recent press speculation with regards to possible PRC or US government review. There is no active investigation that we are aware of by either the China government or the US Department of Justice of our corporate structure or accounting practices, which adhere to conservative interpretation of US GAAP.”
Samsung Taps Spreadtrum as Baseband Supplier for High Performance TD-SCDMA Smartphone [Spreadtrum press releases, Sept 2, 2011]
Spreadtrum’s SC8802 Shipping in Newest Samsung GALAXY SII Smartphone for China Mobile Subscribers
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company” ), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that its newest TD-SCDMA baseband chip, the SC8802G, is shipping in Samsung’s top-of-the-line GALAXY S II smartphone targeting China Mobile subscribers.
Designed with 40nm CMOS silicon technology, the SC8802G is the newest chip in Spreadtrum’s SC88xxG series for the TD-SCDMA market. Spreadtrum’s advanced 40nm platform delivers groundbreaking levels of performance and integration while simultaneously reducing power consumption, delivering standby and talk times that are a first in TD-SCDMA 3G. Spreadtrum’s SC8802G enables TD-HSUPA, TD-SCDMA as well as GSM, GPRS and EDGE operation and supports TD-HSDPA at 2.8Mbps, TD-HSUPA at 2.2Mbps. In combination with Spreadtrum’s RF transceiver, the SR3200LS, which is also shipping in the Samsung GALAXY S II, the SC8802G achieves a small modem footprint of less than 530mm2 enabling slim, sleek designs.
“We are honored to be selected by Samsung as a TD-SCDMA baseband chip supplier,” said Dr. Leo Li, Spreadtrum’s president and CEO. “We are seeing accelerating growth in the TD-SCDMA market as handset features and performance and network coverage align with consumer preference and expectations. Handsets such as Samsung’s GALAXY S II will raise the bar in terms of what consumers can expect from a 3G experience.”
Spreadtrum Secures Leadership Position in TD-SCDMA Market [Spreadtrum press releases, Aug 23, 2011]
Spreadtrum Achieves More than 50% Market Share, Sets New Standard for Standby and Talk Times in TD-SCDMA
Spreadtrum Communications, Inc., (Nasdaq: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that it has achieved a leadership position in China’s TD-SCDMA market. TD-SCDMA is the China 3G standard adopted by China’s largest telecom operator China Mobile. Spreadtrum’s low-cost, high performance baseband solutions based on its advanced 40nm platform have enabled the Company to secure design wins with both tier-1 OEM handset manufacturers and independent design houses serving this market, with significant growth in the first half of 2011 resulting from shipments in the feature phone segment.
“In the first half of 2011, Spreadtrum secured more than 50% market share of TD-SCDMA shipments,” said Kevin Wang, Director, China Research of analyst firm IHS iSuppli. Spreadtrum expects TD-SCDMA uptake to accelerate in the second half of 2011, bringing the overall market from 34 million units shipped in 2010 to more than 50 million units shipment this year.
“Our advanced 40nm platform enables us to deliver a superior 3G experience on handsets,” said Dr. Leo Li, president and CEO of Spreadtrum. “The low power consumption of our TD-SCDMA baseband solutions enables up to 15 hours talk time and 17 days standby time off of 1000mAh batteries.”
Spreadtrum further expects that shifts in China Mobile’s purchasing strategy will help drive faster growth. As more phone models have become available, China Mobile’s purchasing has shifted from central procurement tenders, in which the head office negotiates for certain models and volumes, to purchasing through local distribution channels. “Local purchasing enables regions to order handset models that are best matched to local consumer preferences, price points and styles,” added Dr. Li. “The ability of consumers to purchase 3G handsets with an attractive user experience, feature set and design, at close to EDGE handset prices, is accelerating market uptake of TD-SCDMA handsets.”
Spreadtrum Acquires Telegent Systems [Spreadtrum press releases, July 19, 2011]
Acquisition expands patent and product portfolio with advanced mobile TV technology
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that it has signed a definitive agreement to purchase Telegent Systems, Inc. (“Telegent”), a provider of semiconductor and software solutions for the reception of live, broadcast television on mobile phones. Spreadtrum does not expect significant impact to either its cash position or operating expenses as a result of the transaction.
“Broadcast mobile TV is a popular feature with consumers in emerging markets, which is a target market segment for Spreadtrum and one in which we are experiencing rapid growth,” said Dr. Leo Li, president and chief executive officer of Spreadtrum. “The acquisition of Telegent enhances the value proposition we can deliver to the supply chain serving this market segment from handset manufacturer to end market brand and accelerates our international footprint.”
Telegent’s technology portfolio delivers more than 70 patents granted or pending and a product line consisting of analog mobile TV ICs, hybrid analog/digital mobile TV ICs, mobile TV internal antenna technology, TV player software, and entertainment services software that enables the delivery of applications and advertising to handsets post-sale. Telegent’s newly introduced product line, the TLG12xx series, introduces new innovations to the mobile TV market, including integrated internal antenna technology and a single-chip analog mobile TV receiver with the lowest power consumption and the lowest external bill of materials. Following the acquisition, Spreadtrum will explore integration opportunities with the basebandthat deliver further performance and cost benefits.
In connection with the acquisition, approximately twenty hardware and software engineers from Telegent’s Shanghai office will join Spreadtrum. The transaction has been approved by the Spreadtrum and Telegent boards of directors and is subject to customary closing conditions, including the approval of Telegent stockholders.
Questions and answers regarding Spreadtrum’s acquisition of Telegent can be found at: http://phx.corporate-ir.net/External.File?item=UGFyZW50SUQ9MTAwMTk3fENoaWxkSUQ9LTF8VHlwZT0z&t=1
About Telegent Systems, Inc.
Telegent Systems is a fabless semiconductor company that enables the reception of live, free-to-air analog and digital broadcast television in mobile handsets and other portable consumer devices. Telegent’s television-on-a-chip solutions solve the long-standing technical challenges that have precluded mobile reception of analog broadcast TV, enabling manufacturers and operators to benefit from the convergence of broadcast TV with mobile and portable devices. Telegent’s products are the most widely sold broadcast television solutions for mobile handsets in the world. For more information, visit www.telegent.com.
Spreadtrum Announces High Performance Multimedia Mobile Phone Solution [Spreadtrum press releases, July 19, 2011]
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced the introduction of a high performance multimedia mobile phone solution based on ARM9 CPU processor, the SC6800H. This product, which features enhanced application and multimedia processing capabilities, is designed to meet customers’ growing demand for video, photo, music, games and other entertainment requirements within the mid-end multimedia mobile phone market.
The SC6800H is more than twice as fast as ARM7 based chips, and its ARM9EJ-S processor core with multimedia and GPU engine provides an enhanced user experience in mid-end feature phone. The solution supports JAVA, Internet access, GPS navigation, mobile stocks, MSN/QQ and many other popular applications in addition to a High-definition video player, and a 5 megapixel camera. It enables HVGA screen resolution with a fashionable user interface, such as the 3D UI and Flash UI, further improving the user experience. In terms of communication, the SC6800H integrates multi-SIM card engine and controller, which enable Dual-SIM standby, Triple-SIM standby and Quad-SIM standby solutions in a set of baseband and RF chipset. Furthermore, the SC6800H provides interfaces for a number of mainstream peripheral components such as Wi-Fi, GPS, Bluetooth, and analog TV.
Dr. Leo Li, Spreadtrum’s President and CEO said, “In line with our commitment to delivering innovative technology in order to help customers differentiate their products, the SC6800H provides handset manufacturers a powerful and stable mobile phone solution that we believe will be an attractive and essential platform for the emerging mobile business. Along with our other pipeline products that offer enhanced multimedia features, the SC6800H is accelerating the growth of feature phone market, enabling our customers to launch more products with unique features to capitalize on increasing demand for mobile handset business, mobile internet applications, and mobile games/entertaining business.”
Spreadtrum and TSMC Achieve 3G TD-SCDMA Baseband Processor Milestone [Spreadtrum press releases, Jan 27, 2011]
First 40nm baseband chip to support China’s 3G standard
Spreadtrum Communications, Inc. (Nasdaq: SPRD; “Spreadtrum”) and TSMC (TWSE: 2330, NYSE: TSM) today unveiled their achievement on the first commercialized 40nm Time Division – Synchronous Code Division Multiple Access (TD-SCDMA) basebandprocessor. First time silicon success for this baseband processor was achieved by the two companies jointly optimizing design, process and manufacturing. The chip is in initial production at Fab 12, one of TSMC’s GIGAFAB(TM) facilities in Taiwan.
The new processor supports TD-SCDMA and other telecommunication 3.75G to 2G specifications including High-Speed Uplink Packet Access (HSUPA), Enhanced Data GSM Environment (EDGE), General Packet Radio Service (GPRS) and Global System for Mobile Communications (GSM). It also features up to a 2.8Mbps bandwidth that is more than one hundred times faster than the 2G standard.
The baseband processor leverages TSMC’s 40nm low power (40LP) process technology to extend battery lifetime in mobile telecommunication. The 40LPprocess also supports other leakage-sensitive applications such as application processor, portable consumer and wireless connectivity devices.
Dr. Leo Li, Spreadtrum’s President and CEO said, “40nm process technology is a critical element to Spreadtrum’s next-generation product portfolio. The success of the world’s first commercialized 40nm baseband processor demonstrates our design and time-to-production ability to deliver the cutting-edge technology in the 3G communication industry. TSMC is the clear foundry leader in 40nm process technology. With its excellent technical advantages and strategic support for Spreadtrum since 2003, TSMC ensures the quality and performance of our chips, which allows us to provide stable and superior products to our customers.”
“Spreadtrum is to be commended for bringing to production the first 40nm 3G baseband chip to meet China’s TD-SCDMA specification,” said Jason Chen, senior vice president of worldwide sales and marketing. “The achievement of this milestone underscores TSMC’s ongoing role as the foundation for logic IC innovation, including that of China’s IC design companies.”
Spreadtrum Announces the World’s First Commercial 40nm Low Power TD-HSPA /TD-SCDMA Multi-mode Communication Baseband Processor [Spreadtrum press releases, Jan 18, 2011]
Spreadtrum Communications, Inc. (Nasdaq: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced the world’s first 40nm low power TD-HSPA/TD-SCDMA multi-mode communication baseband processor, the SC8800G. The new product was announced during a technology forum jointly held by Spreadtrum, China Semiconductor Industry Association, Qingdao Hisense Communication Co., Ltd., HuaweiDevice Co., Ltd. and Shenyang New Postcom Equipment Co., Ltd. at the Great Hall of the People, Beijing, China. At the forum, Spreadtrum successfully demonstrated its latest commercial mobile handsets based on the SC8800G.
Designed with 40nm CMOS silicon technology, the SC8800G achieves groundbreaking levels of performance and integration while simultaneously reducing power consumption, lowering overall costs and meeting the need for next generation communication experience. Spreadtrum SC8800G enables TD-HSUPA, TD-SCDMA, GSM, GPRS and EDGE operation and supports TD-HSDPA at 2.8Mbps, TD-HSUPA at 2.2Mbps. This product will enable the price of TD-SCDMA mobile terminals to be close to that of 2.5G products. At the same time, it will offer a reliable platform for various 3G services and will play an integral role in driving the development of TD-SCDMA, TD-LTE and 4G technology. The TD-HSPA/TD-SCDMA multi-mode mobile phones developed based on SC8800G have already passed the network access testing of Telecommunication Bureau of Ministry of Industry and Information Technology and the market entry testingof China Mobile, meeting all commercial standards.
SC8800G achieves great speed advancement while significantly reducing power consumption. The chip is an ideal solution for customers to develop competitive low power consumption mobile handsets. Furthermore, this world’s first commercial 40nm low power TD-HSPA/TD-SCDMA multi-mode communication baseband processor will contribute to the development of Intelligent City, Internet of Things, Mobile Internet and the integration of telecommunications networks, cable TV networks and Computer network in China.
Dr. Leo Li, Spreadtrum’s President and CEO said, “As the inventor of the world’s first commercial 40nm low power TD-HSPA/TD-SCDMA multi-mode communication baseband processor, we are proud of our cutting-edge technology in 3G communication standards, our design capability in advanced technology and our world-class engineering team. The commercial TD-HSPA/TD-SCDMA mobile phones developed based on the SC8800G are representative of the progression from ‘made in China’ to ‘invented in China’. China’s IC design companies are presented with tremendous opportunities as the country undergoes a major upgrade in industry and economy development. Spreadtrum is dedicated to the continuous technology innovation in order to capitalize on these opportunities and play an instrumental role in the growth of China’s IC industry.”
Spreadtrum and Hisense Jointly Launched the World’s First Affordable TD-SCDMA Phone Supporting CMMB Digital TV [Spreadtrum press releases, Jan 10, 2011]
Spreadtrum Communications, Inc., a leading fabless semiconductor company that develops baseband and RF processor solutions for the wireless communications market (hereinafter referred to as “Spreadtrum”, Nasdaq Stock code: SPRD), and Qingdao Hisense Communication Co., Ltd., a subsidiary of a world leading provider of flat panel TVs, household appliances and mobile communications (hereinafter referred to as “Hisense Communication”), jointly launched the world’s first TD-SCDMA feature phone — Hisense N51 — with retail price below 1000 RMB. Hisense N51 is the only affordable TD-SCDMA mobile phone that supports CMMB digital TV among all existing 3G phones that are available through China Mobile’s “TD-SCDMA Terminal Special Incentive Fund Project” program. With the increasing demand for affordable 3G phones in the Chinese market, the launch of Hisense N51 will greatly accelerate the adoption of the TD-SCDMA platform and further enrich TD-SCDMA terminal products and services.
Hisense N51 was jointly developed by Spreadtrum and Hisense in a highly collaborative technical partnership. Executive Vice President of Hisense Communication, Ms. Wenlin Yang, said: “Hisense and Spreadtrum share a long history of co-operation. Partnering with Spreadtrum, we successfully won the bid of ‘thousand-yuan 3G mobile phones’ project of China Mobile’s ‘TD-SCDMA Terminal Special Incentive Fund Project.’ Through our six-month joint effortsand Spreadtrum’s very competitive TD-SCDMA and CMMB solutions, the Hisense N51 was introduced. The excellent localized technical support and quick customer service response from Spreadtrum’s team have not only greatly shortened the time to launch Hisense N51, but also ensured that Hisense TD-SCDMA products will be competitive in the 3G phone market. Hisense has always been at the forefront of the TD-SCDMA industry. At present, China Mobile has completed the construction of a national network, by investing huge resources to support the end-products, especially affordable G3 handsets. Compounded with its huge customer base and mature terminal operating experience, I believe, in 2010, China’s TD users will show explosive growth and our partnership with Spreadtrum will move further in the next level.”
President and CEO of Spreadtrum Communications, Inc., Dr. Leo Li, said: “We are very pleased to be working with Hisense to develop affordable TD-SCDMA products targeting China’s 3G market. Hisense has an extensive research and development experience and leading technology, as well as a close partnership with Spreadtrum. Spreadtrum provides highly integrated TD-SCDMA/HSDPA/GSM/GPRS/EDGE baseband chip SC8800H and RF chip QS3200, which effectively reduce the cost of development and manufacturing of Hisense Communication products. Therefore, Hisense Communication is able to introduce cost-effective handsets such as N51 by targeting the Chinese 3G market quickly to meet the needs of consumers. Spreadtrum CMMB mobile TV chip SC6600Vprovides Hisense N51 with vast application space. Particularly, Hisense N51 is currently the world’s only 1000 RMB level TD-SCDMA phone that supports CMMB.”
Chief Scientist of Spreadtrum Communications, Inc., Dr. Xiaojian Dong, also remarked: “Spreadtrum has maintained a close cooperative partnership with mobile terminal manufacturers during the implementation process of China Mobile’s ‘TD-SCDMA Terminal Special Incentive Fund Project.’ Under the guidance of China Mobile, we jointly overcame difficulties and achieved our goals. Hisense N51 has successfully passed China Mobile’s testing, which marked Spreadtrum’s great leap forward in phone platform, TD-SCDMA/GSM wireless performance and 2/3G mutual operation and stability. The outstanding results fully confirmed that the performance and maturity of Spreadtrum’s TD-SCDMA solutions is at the forefront of its industry.
About Hisense N51:
Hisense N51 uses Spreadtrum’s highly integrated SC8800H-baseband, QS3200-RF and SC6600V-CMMB chips to support TD-SCDMA/HSDPA/GSM/GPRS/EDGE and mobile TV functionality. Hisense N51 is based on a slim design with a thickness of only 13.3mm and comes with a 2.4-inch screen and a 2 million pixel (HD) camera. Furthermore, Hisense N51 supports TD-SCDMA/HSDPA high-speed data services, TD-SCDMA/GSM dual-mode, WWW/WAP browser for fast Internet access, and has built-in Fetion, music player, cell phone securities, mobile maps, MMS, DM, and PIM, etc. Hisense N51 has a maximum downlink speed of up to 1.6Mbps and uplink speed of up to 384Kbps. For the function of CMMB mobile digital TV, Hisense N51 can receive and send TV broadcasting and communications signals simultaneously without mutual interference and provides maximum TV viewing experience with TD-SCDMA mobile digital TV service.
About CMMB:
For more information on China Mobile Multimedia Broadcasting, please visit http://www.cmmb.org.cn .
Spreadtrum’s TD-SCDMA Chip Adopted in the World’s First 3G OPhone Lenovo O1 [Spreadtrum press releases, Dec 14, 2009]
Lenovo Mobile Communication Technology Co., Ltd. (hereinafter referred to as “Lenovo Mobile”) launched the world’s first TD-SCDMA standard-based OPhone smart phones – Lenovo O1, with immediate sales in all local markets in mainland China. The phone is based on Spreadtrum Communications, Inc. (hereinafter referred to as “Spreadtrum”, Nasdaq: SPRD) TD-SCDMA solution, and supports China Mobile OPhone OS smart phone operating system.
Spreadtrum and Lenovo Mobile, in a highly collaborative technical partnership, jointly developed Lenovo O1. This new handset runs on the China Mobile led developed Intelligent Terminal software platform – the OPhone platform. Lenovo 01 uses Spreadtrum’s TD-SCDMA/HSDPA / GSM / GPRS / EDGE baseband chip SC8800S and radio frequency (“RF”) chip QS3200. It is currently the first 3G OPhone-based smart phone that supports TD-SCDMA, combining China Mobile’s integrated applications, openness, comprehensive entertainment, business applications and other major features for the mobile Internet. Lenovo O1 is a leading example of successful partnerships among key corporations targeting China’s TD-SCDMA market.
As the world’s first TD-SCDMA OPhone-based smart phone, Lenovo O1 adopted Spreadtrum TD-SCDMA chip technology to support GSM / GPRS / EDGE / HSDPAand meets the demand for convergence of video, interactive e-mail and web browsing among others. The introduction of TD-SCDMA OPhone-based smart phones, represented by Lenovo O1, should greatly push forward the development cycle for China’s TD-SCDMA devices.
Regarding Lenovo O1, Spreadtrum President and CEO, Dr. Leo Li said: “The newly introduced Lenovo O1 is an integration of advanced technology and in-depth research work and an outstanding achievement of the intensive cooperation between Lenovo Mobile and China Mobile. Spreadtrum provides highly integrated TD-SCDMA/HSDPA/GSM/GPRS/EDGE baseband chips SC8800S and RF chip QS3200, which fully meets the functional and business needs of the operators, while effectively reducing product development and manufacturing costs. Leveraging Lenovo Mobile’s excellent technology platform, O1 products possess an outstanding industrial design with an attractive look and feel at a far smaller thickness than other current available smart phone products. We believe that Lenovo O1 has undoubtedly opened the highly potential Chinese 3G market for future and further developments. The personalization and openness features of OPhone will set the standards for mainstream development of future mobile phones.”
Lenovo Mobile president and CEO Yan Lv, said: “We are very happy to work with Spreadtrum. Lenovo O1 is the result of complete independent research and development by Chinese companies. Spreadtrum provides Lenovo O1 a very competitive TD-SCDMA solution in both baseband and RF, with highly integrated features at an outstanding cost structure. Additionally, the localized services of Spreadtrum team greatly shortened the time for Lenovo O1 to enter the market. Leveraging Lenovo Mobile’s core business product development and methodology, O1 seamlessly integrates features of PC and cell phone. Its introduction will propel the China Telecommunication Industry towards the new 3G mobile Internet era. We also believe that, fully utilizing the 3G wireless Internet network, Lenovo O1, after its entrance into the market, will deliver enhanced mobile Internet user experience to end consumers.”
About OPhone OS:
OPhone OS uses Linux as its system kernel and Google Android as its reference. It is compatible with Google Android platform, integrating flexible and efficient Java application framework. OpenGL ES, SGL and other advanced 3D/2D graphics processing system has been applied in its design, as well as powerful multimedia systems based on PacketVideo’s and the open-source Webkit browser engine. OPhone OS fully draws on good user experience of mainstream operating system, providing a complete set of telephony solutions and a variety of mobile data operation solutions.
About Lenovo Mobile:
Lenovo Mobile Communication Technology Ltd. (hereafter referred to as “Lenovo Mobile”), established in 2002, is a well known player in the Chinese mobile phone industry that specializes in the R&D, production and marketing of mobile phones. Lenovo Mobile is dedicated to provide “Stylish, Simple Innovative & High Quality” products value-added service which will satisfy the personalized needs and enhance the joy of mobile communication. Relying on its independent R&D and powerful sales channels, Lenovo Mobile has become a fundamental influence in the Chinese handset industry. For more information, please visit www.lenovomobile.com
Samsung Exynos 5250
Samsung Exynos Processor [Nov 30, 2011]
Update: Samsung First With Cortex-A15 [The Linley Group, Dec 19, 2011]
Samsung Electronics recently began sampling the Exynos 5250, a dual-core application processor based on ARM’s Cortex-A15. Using Samsung’s 32nm high-k metal-gate (HKMG) process, the CPU is designed to operate at 2.0GHz. The company has thus won the race to sample the first Cortex-A15 products that system developers can evaluate for tablets and other high-end mobile systems scheduled for production in 2H12. Texas Instruments isn’t far behind, reaffirming that its 2.0GHz OMAP5 will sample this month. ST-Ericsson’s A15-based NovaThor LP9600 targets 2.5GHz, but the company is aiming to sample in early 2012.
The Exynos 5250 incorporates several system-level enhancements to support tablet designs. Compared with the Exynos 4212, memory bandwidth doubles to 12.8GB/s, neatly tracking the increase in CPU performance and allowing the Exynos 5250 to support WQXGA (2,560´1,600) displays. The new chip integrates an Embedded DisplayPort (eDP) interface with support for panel self-refresh (PSR) technology, allowing the video subsystem to reduce power for static frames. The chip also provides HDMI 1.4 output and integrates a video engine to enable recording and playback at 1080p full-HD resolution. The Exynos 5250 includes other tablet interfaces, such as SATA and USB 3.0.
Samsung specifies a “more than four-fold” improvement in 3D-graphics performance for the Exynos 5250 compared with the Exynos 4212. The 4212 is supposed to deliver 50% better performance than the currently shipping Exynos 4210, which already delivers better GLBenchmark performance than any mobile processor other than Apple’s A5 chip. To produce a 4x performance boost, the Exynos 5250 must use a new high-end graphics core. Although ARM’s Mali-T604 could meet this performance goal, we believe the Exynos 5250 incorporates the PowerVR SGX MP from Imagination Technologies, which Samsung recently announced it has licensed.
Samsung’s external chip business faces marketing challenges as the company works to establish a unique value proposition that can overcome the perceptions of channel conflict. To offset these challenges, Samsung must deliver a sizable technical advantage over competitors, but the Exynos 5250 specifications do not appear to do so. Even if it does not attract third-party designs, however, the new chip will help Samsung extend the high end of its own smartphone and tablet lineup.
Samsung Announces Industry First ARM Cortex-A15 Processor Samples for Tablet Computers [press release, Nov 30, 2011]
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, announced today the industry’s first dual-core processor samples based on the ARM™ Cortex-A15 core. Designed specifically for high-end tablets, Samsung’s newest 2GHz dual-core Exynos 5250 utilizes 32nm high-k metal gate low-power process technology and will offer system-level designers an exciting new solution intended to meet the graphic-intensive, power-efficient requirements of these next-generation mobile products.
“The ARM Cortex-A15 brings unparalleled performance to our Exynos processor family and the exploding mobile marketplace,” said Dojun Rhee, vice president of System LSI marketing, Device Solutions, Samsung Electronics. “Designers need an application processor platform that delivers full high definition multimedia capabilities, fast processing speed and high performance graphics to meet end users’ expectation for a connected life on the go. The advanced low-power, high-performance processor technology of the new Exynos 5250 continues to deliver an unprecedented level of performance for users to enjoy a completely new mobile experience.”
Samsung’s new dual-core ARM Cortex-A15 based application processor, the Exynos 5250, is capable of processing 14 billion instructions per second (DMIPS, Dhrystone million instructions per second) at 2.0GHz, nearly doubling the performance over a current state of the art Cortex-A9-based dual core processor running at 1.5GHz capable of 7,500 DMIPS.
In particular, the Exynos 5250 design was architected to drive up to an industry leading 2560 x 1600 (WQXGA) display which reflects the significance of advanced display technology transitioning toward ever higher and sharper resolutions. These leading-edge features enable users to enjoy crisper video images on their mobile devices and deliver readability equivalent to real paper for an ultimate electronic reading experience.
To maximize power efficiencies at the system level, the Exynos 5250 has an embedded DisplayPort (eDP) interface that is compliant with panel self-refresh technology (PSR) applied to the timing controller (T-CON). The embedded PSR technology enables static images to be refreshed directly from the frame buffer memory incorporated in the T-CON, resolving the need for regular display refresh instructions to be made by the application processor in cases such as reading static web pages or e-books.
The 3D graphics processing capabilities, enhanced by more than four-fold over the 1.5GHz Cortex-A9 dual-core processor, and a stereoscopic 3D feature raise the bar of user experience on high-specification 3D gaming, user-interfacing and stereoscopic 3D video playback.
Moreover, the Exynos 5250 features a doubled memory bandwidth of 12.8 Gigabytes per second (GB/s) compared to current dual-core processors that support a maximum of 6.4GB/s to enable fast data processing features, superb 3D graphics and high-resolution display. This memory bandwidth is a key requirement for a processor to support WQXGA resolution displays.
Samsung’s Exynos 5250 offers a host of peripheral functions including an embedded image signal processor enabling 8 Megapixel resolution images at 30 frames per second, a full HD 60 frame per second video hardware codec engine for high resolution 1080p video recording and playback, a HDMI 1.4 interface for sharp and crisp multimedia content transmission, along with a diverse scope of embedded booting device interfaces such as SATA, UART, USB and external ports such as USB3.0, eMMC4.5 and eSD3.0.
The Exynos 5250 is currently sampling to customers and is scheduled for mass-production in the second quarter of 2012.
See also:
– Samsung’s Exynos site
– Realizing the ARM Cortex-A15: What does the road to 2.5GHz look like? [Nov 9, 2011]
– ST-Ericsson NovaThor SoCs for future Windows Phones from Nokia [Nov 3-24, 2011] (availability: 2H 2012 but at 2.5 GHz)
– Not Just a Faster Horse: TI’s OMAP™ 5 Platform Transforms the Concept of ‘Mobile’ [press release, Feb 7, 2011]: “… 28 nanometer … TI’s OMAP 5 platform is expected to sample in the second half of 2011, with devices on the market in the second half of 2012.” (“OMAP 5, which, according to Talla [TI’s general manager of mobile computing], will feature the industry’s first Cortex A15 mobile processor. This model will come to market at the end of 2012.” From: Texas Instruments: ‘Tablets could become the centre of computing convergence’ [Nov 23, 2011])
– OMAP™ 5 mobile applications platform [product bulletin, July 13, 2011]
– ARM 15 White Paper [Brian Carlson, OMAP 5 Product Line Manager, May 24, 2011]
























































