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Intel’s biggest flop: at least 3-month delay in delivering the power management solution for its first tablet SoC

This is all despite the fact that Intel had already the following slides back in April on the IDF2012 in Beijing:

imageimage
image

i.e. the slide on the left was explicitly stating these Mobility Features:
9+ Hours Battery Life
~30 Days Standby
as well as among the Experience Features:
Connected Standby 
The last two features are still (Dec 20) not met even for available Acer & Samsung devices!Source of the slides: Developing for Microsoft Windows 8 on Intel Architecture Based Tablets and Hybrids [Intel Developer Forum 2012 in Beijing, April 11, 2012]

In my Windows 8 gaining smartphone like “connected standby” capability [this same ‘Experiencing the Cloud’ blog, Nov 12, 2011] post I summarized the feature as:

New power state called “Connected Standby”

  • Windows coalesces all the timer and network requests, turns the radio on periodically to satisfy them, then goes back to very low power consumption.
  • But because app requests are getting satisfied they are up to date as soon as you press “ON”

Microsoft was clear as early as in 2011 in its Building a power-smart general-purpose Windows [Building Windows 8, Nov 9, 2011] post that:

For Windows 8, we’ve built a new device power framework that allows all devices to advertise their power management capabilities and integrate them with a special driver called the Power Engine Plug-in or PEP, designed for SoC systems. The PEP is provided by the silicon manufacturer and knows all of the SoC-specific power management requirements. This allows device drivers like our USB host controller or a keyboard driver to be built once, and still deliver optimal power management on all platforms from SoC-based PCs to datacenter servers.

We are hard at work with all of our ecosystem partners to deliver the low-power and long battery life technologies we all want in our Windows 8 PCs.

In Collaborating to deliver Windows RT PCs [Building Windows 8 blog, Aug 14, 2012] post Microsoft was even reporting that for ARM based Windows products:

The following chart shows some of the measurement ranges we are seeing as we test early production PCs for the connected standby and power scenarios.

The measurements are based on firmware still undergoing final optimizations, and the just released Windows RT RTM code, and will only improve as the PCs move towards manufacture. To provide context on the significance of the measurement, it is important to understand how the scenario was measured. In this case, the PC was playing back in full screen a local HD video at full resolution with a screen brightness of 200 nits. It was also configured for one email account using the Microsoft network. Finally, these numbers are also influenced by the different PC form factors themselves, which include both tablets and laptops, screen sizes that vary from 10.1” to 11.6”, and battery sizes spanning 25 Whr to 42 Whr.

Scenario

Early production range

HD Video Playback

8 hours to 13 hours of scenario run time

Connected Standby

320 hours to 409 hours of scenario run time

Then in NVIDIA Powers Amazing Windows 8 Experiences [NVIDIA press release, Oct 25, 2012] the number for connected standby on the Windows RT delivery was reported as:

Windows RT marks the first time that PCs have been able to take advantage of incredibly efficient ARM-based processors like Tegra 3, enabling two weeks of connected standby time. The majority of Windows RT devices at launch use NVIDIA Tegra 3, including the ASUS Vivo Tab RT, Lenovo IdeaPad Yoga 11 and Microsoft Surface RT.

Note: For Android tablets similar results are available, if any. The Chinese made V971 tablet from Onda with an AML8726-MX SoC (dual Cortex-A9 CPU cores at 1.5GHz and dual core Mali 400 GPU), for example, has a “longest standby time” (最长待机时) of 360 hours. So even relatively unknown SoC vendors, like in this case Amlogic, in cooperation with Google were able to meet similar kind of power efficiency results in connected standby terms as Microsoft was able to meet with its selected ARM SoC partners, NVIDIA, Qualcomm and Texas Instruments for the new Windows release.

Nevertheless almost a year later than the original public information about Windows 8 gaining smartphone like “connected standby” capability [this same ‘Experiencing the Cloud’ blog, Nov 12, 2011], in September 2012 Bloomberg reported that:

Intel Corp. (INTC) Chief Executive Officer Paul Otellini told employees in Taiwan that Microsoft Corp. (MSFT)’s Windows 8 operating system is being released before it’s fully ready, a person who attended the company event said.

Improvements still need to be made to the software, Otellini told employees at a company meeting in Taipei yesterday, said the person, who asked not to be identified because the meeting was private.

Then despite an Intel Statement in Response to Unsubstantiated News Reports [Sept 26, 2012] Bloomberg BusinessWeek soon reported that Intel Software Snag Said to Hamper Windows Apple Response [Oct 1, 2012]

Intel Corp. (INTC)’s delayed delivery of software that conserves computer battery life is holding up development of some tablets running the latest version of Microsoft Corp. (MSFT)’s Windows operating system, a person with knowledge of the matter said.

Microsoft hasn’t yet approved any tablets featuring an Intel processor code-named Clover Trail because the chipmaker hasn’t produced necessary power-management software, said the person, who asked not to be named since the process is private.

ZDNet clarified the issue as:

Clover Trail introduces two new power management states, called S0i1 and S0i3. S0i1 is described as an “active” sleep state that kicks in when the user stops using the device but hasn’t yet put it to sleep, while the S0i3 sleep state is called a “connected” sleep state [rather: Windows 8 connected standby] and this allows the device to enter a state where it consume microwatts of power but can still wake up in a matter of milliseconds.

These new sleep states mean that the standby battery life of Z2760-powered hardware can be as much as three weeks.

Here we are talking about the driver programming for two power management units, each with its own microcontroller, as shown on the Clover Trail block diagram below:

image

which is related to new ultra low power states introduced into this next-generation Atom SoC:

image
which look like under thermal imaging as follows:
image  imageimage  image
Source of the slides: Tablet Platforms with Next Generation Intel® Atom™ Processors and Microsoft* Windows* 8 [IDF2012 San Francisco, Sept 12, 2012] by Joseph Nielsen,Tablet Platform Marketing Engineer, Intel Corporation and Mark Ewert, Tablet SoC Si Architect, Intel Corporation.

From Microsoft point of view, in addition to the already referred post, there is a follow-up Improving power efficiency for applications [Building Windows 8, Feb 8, 2012] post as well  which summarizes the Windows 8 SW part as:

Connected standby and sleep-capable machines

By the time Windows 8 is released, there will be a broader range of PCs available than ever before. Many of these will have similar power options to those running Windows 7 today. Besides turning off completely, they will be able to go into a “sleep” state, either on demand, or after a period of inactivity. During sleep, all system activity is completely suspended.

image

The chart above shows how, as the PC idles just prior to sleep, desktop apps continue to run in the same way as they have in prior versions of Windows, while Metro style apps run in the managed way I described earlier. When the PC goes to sleep, both desktop apps and Metro style apps are fully suspended. This is great for battery life—when the machine is asleep, it consumes very little power. It’s not as great for a data-freshness though, since when the machine is asleep, it isn’t getting live tile updates, downloading new mail, or getting ready to alert you with alarms or other notifications.

As Pat covered in his post [i.e. in Building a power-smart general-purpose Windows [Building Windows 8, Nov 9, 2011] referred earlier], we’ve enabled a new smartphone-like power state for a new class of PCs that rarely get turned off completely. Typically based on “System on Chip” (SoC) architectures, these PCs are interesting because instead of turning off during periods of inactivity they go into a very low power state while still running. This new state is referred to as “connected standby.” This enables some great connected scenarios, such as always having email up-to-date, and being able to receive instant messages or phone calls, while still delivering amazing battery life. The chart below shows behavior for both desktop and Metro style apps during connected standby. For this to really work effectively though, we had to consider both Metro style apps (which, as you saw earlier, we can very effectively ensure are conservative with system resources), as well as desktop applications, which presented a tougher challenge because they have been designed over the years to expect either full access to system resources (when running in the fore or background) or no access (when the PC is asleep.)

image

To this end, we have added a new component to Windows 8 called the “Desktop Activity Moderator,” which only runs on these new connected standby-capable platforms. This component is designed to help reduce the resource utilization of desktop apps when the device goes into connected standby. If we allowed apps to continue running unchecked in this low-power mode, the PC would run down the battery more quickly. Instead, we suspend desktop applications, stopping their resource use and maximizing battery life. From the applications’ perspective, it will appear as if the PC has simply been put to sleep. When the PC is woken from connected standby, the app will resume as if the PC had been woken from a sleep state.

However, there are actually several components on the system that are required for connected standby, which we cannot suspend. These include drivers, some inbox and 3rd party services, and of course, the Metro style apps that use the background features mentioned earlier. Many of these provide functionality such as responding to user input when you return to your device, or providing network functionality. We enable these to run in connected standby after careful evaluation to ensure they do not have a significant impact on battery life. In addition, there are a set of processes that need to run in response to activity on the system. These processes are throttled to only run for short periods of time until a background activity is initiated, at which point they are allowed to run unimpeded. A great example of this is an antivirus product, which is often scanning in response to activity on the system. When there is background activity occurring such as receiving an incoming email via the background affordances, antivirus can run unimpeded during this time. But during the majority of the time when incoming network activity is not occurring, there is very minimal activity and therefore these components will be throttled to minimize their impact on battery life.

More about that see:
Windows 8: Connected Standby [Jerry Nixon, Microsoft Developer Evangelist, April 17, 2012]
Introduction to Connected Standby [Microsoft whitepaper, Oct 5, 2012] from which it is worth to include here the following definition of the value as measured by Microsoft:

Systems that support Connected Standby must meet the Connected Standby Windows Hardware Certification Kit (HCK) requirement for battery life. This requirement specifies that all Connected Standby systems must drain less than 5% of system battery capacity over a 16-hour idle period in the default shipping configuration. A certification test for this can be found in the Windows Hardware Certification Kit (HCK).

which means a 320 hours connected standby time as a minimum to pass the certification test.

So Microsoft did its job as well demonstrated by ARM based Windows RT tablets, such the Microsoft Surface. This cannot be said about Intel even two months after the Windows 8 launch.

It is also notable for this whole story that the ultra low power consumption to be achieved by the above hardware+driver software solution was indicated as one of the most important feature of Intel® Atom™ Processor Z2760: Tablets that Move as Fast as We Do [channelintel YouTube channel, Sept 27, 2012], that is right, back in September when the Z2760 platform was officially announced by Intel:

From Sandor Nacsa: This video was published when Intel announced the Clover Trail Atom as Z2760. It is remarkable that the first two testimonials are from Sansung and Acer, then there are other two testimonials from ZTE and Lenovo, whose Z2760-based tablets are still not on the market as of Dec 19, 2012. There are still no answers about their availability from the vendors.

Now we are close to Christmas and Dell and HP hit by Windows 8 tablet delays; Clover Trail could be the problem [Dec 19, 2012]

The first Intel Atom and Clover Trail Windows 8 tablets from Dell and HP were slated to launch in late 2012, but now look set to arrive as late as the end of January 2013.

News broke as Dell pushed back the shipping date of its Latitude 10 Windows 8 Pro tablet more than a month to January 22 with HP in turn now expecting its Envy x2 tablet to reach customers by December 21 at the latest.

Dell announced the delay by tweaking the availability date on its website but rumors had been flying around the availability beforehand, with a Dell customer telling InformationWeek that he had been informed the Latitude 10 was delayed.

HP, meanwhile, informed tech website CNET that its convertible Envy x2 Windows 8 Pro tablet, initially set to launch on November 14, will reach customers in time for Christmas.

“Customers can expect to receive an Envy x2 in January, if they order today,” said a customer representative, in an email to the source.

“Customers who ordered their units on Dec. 3 or prior are expected to receive their PC by Dec. 21 at the latest. HP expects additional units to ship in January.”

The exact cause of the problem is unclear, although the InformationWeek report suggests that PC makers are struggling to build Clover Trail drivers stable enough to pass Microsoft’s Windows Hardware Quality Labs testing (WHQL). Devices must pass this certification before being offered for sale.

Talking of Intel-powered Windows 8 tablets and the status of Lenovo’s own ThinkPad 2 also looks unclear.

The tablet has twice been delayed from its original launch date of October 26 but did pass FCC two weeks ago. The slate is listed on the Microsoft Store but its availability is not listed.

TabTimes has reached out to Lenovo for a comment on the matter but is yet to hear back from the Taiwanese PC maker.

Intel-based Windows 8 tablets see spotty availability [CNET, Dec 18, 2012]

Overall availability of Intel-based Windows 8 tablets and hybrids is spotty. While products based on the Intel Z2760 from Samsung (ATIV Smart PC 500T) and Acer (W510) are already available, others from Lenovo, Dell, and HP aren’t.

They are available indeed (note that those tablets corresponf to Intel’s refernce design):
http://www.provantage.com/acer-nt-l0kaa-001~AACEN1KA.htmimage

Acer Iconia W510-1422 vs. SamsungATIV Smart PC 500T [CE Arena, Nov 29, 2012]

The Acer Iconia W510-1422 and the Samsung ATIV Smart PC-500T are two of the more serious contenders of ASUS’s Transformer Pad series. They both feature the same processing unit, the brand new  Intel® Atom™ Z2760, which is running on the Clover Trail platform – specially designed for mobile devices running Windows 8 on a 32-bit architecture. Thus, performance wise, there are literally no differences between the two tablets: same RAM size, same storage space, same graphics unit, etc. However, minor fault lines start to appear when we take into consideration screen size, battery life and portability. That’s all there is between the two gadgets. Also, they essentially cost the same: $750 at the time of this review.

http://www.excaliberpc.com/621516/samsung-ativ-smart-pc-500t.htmlimage

However, in terms of the mobility and experience features mentioned in the introduction even these devices are not ready for the market! Here are quotes supporting that statement for the Samsung device* (as this was under more scrutiny because of higher expectations):
* for the other available Z2760 based device see: Acer Iconia W510 Win 8 Tablet gets 7/10 and 16hrs in Full Test [UMPCPortal, Dec 6, 2012]

Battery Life
[from here, but a lot of other sites contain this initial specification from Samsung, curiously now removed from the Samsung site, but originally was there according to this 3d party webcache]

  • Browsing (8Hrs), Video Playback (11Hr), Charging Time (320Min), Standby Time (600min [i.e. 10 hours]) [vs. Intel’s target of ~30 Days Standby]

BATTERY 
[From Microsoft Store, note that for Acer Iconia W510 there only “up to 9 hours”]
| 2-cell lithium-polymer (up to 14.5 hours)*

Samsung Ativ Smart PC 500T: Don’t Expect Any Miracles [Gizmodo UK, Nov 15, 2012]

The battery performance varied. When using it strictly as an RT tablet, the 500T was pretty efficient, making it through a whole day. But when using a bunch of browser tabs and apps in desktop mode, it drained a lot faster.

Samsung ATIV Smart PC 500T [Review] [CNET, Dec 4, 2012]

Pros

Great battery life! 8-10 hours easily,
Full sized USB port, mini HDMI port, micro SD memory port
Great screen, S pen digitizer, stereo speaker placed well, and sounds great, Windows 8 very responsive, Very peppy dual core Atom processor, yes peppy!.

Cons

Once in a while when coming out of sleep mode I have to refresh the wireless connection since it stalls with a limited connection. Windows network diagnostic handles that as well. Screens a finger print magnet, but aren’t all touch screens?

Hands-on Review: Samsung ATIV Smart PC 500T [Marketnews Canada, Dec 17, 2012]

Battery life is rated at 10 hours. In practice, it seemed very good. A single charge got me through most of my testing, and didn’t dissipate over many hours of idle ‘sleep’ time.

One other oddity: the 500T doesn’t come on instantly, like an Android or iOS tablet. Instead, there’s about a ten-second pause while Windows 8 resumes from Sleep [vs. the ms level latency from connected standby given in September by Intel, as could have seen above].

Customer Reviews for Samsung ATIV Smart PC 500T [Samsung US]

Nov 19, 2012 … Cons: Poor quality, Did not meet expectations, dock is unusable as it constantly disconnects, glitchy drivers = frozen pc = reboot often

Nov 29, 2012:

I was very excited to finally be able to buy this x86 Win8 tablet.
Unfortunately, the tablet has a WiFi problem that occurs after waking from sleep or a power on. Basically, it can’t connect to WiFi for about 2-3 minutes. Usually, you have to turn on/off AirPlane mode to get WiFi to work again.
For 2 weeks, I was installing every Samsung update but the issue was never fixed.
Other users have reported problems with the keyboard dock (I only had the tablet).
So, unless you want to go through a lot of frustration, wait for Samsung to resolve these issues before purchasing.

 

Dec 3, 2012 … Problems:
When I press the sleep button the tablet decides to automatically turn its self off completely. So basically I have to save everything before I turn the screen off expecting to have to turn it on from cold again. The only reason I’m not returning it because of this is how fast it boots up, but if its not fixed by the time my return date gets close it will go back.

Samsung ATIV Smart PC 500T [Softpanorama, Dec 15, 2012]

The tablet is way too fresh and, unless you are a beta addict, it might be beneficial to wait a couple of months and give time to Samsung [rather Intel] to fix the bugs. So buying it in the second quarter of 2013 is better then in 2012. Currently if you want just the Samsung tablet, go for it. But avoid the tablet + keyboard combo till Q2 of 2013.

CONTINUED: Intel-based Windows 8 tablets see spotty availability [CNET, Dec 18, 2012]

Intel-based Windows 8 tablets and hybrids from the world’s two largest PC vendors, Lenovo and Hewlett-Packard, have been experiencing delays.

A tablet from Hewlett-Packard running the full version of Windows 8 is expected to finally ship to customers, though a full Win 8 tablet doesn’t appear to be imminent from Lenovo.

HP’s Envy x2 laptop-tablet hybrid “convertible” was originally slated for November 14 availability but is now expected to reach customers soon, HP said.

“Customers can expect to receive an Envy x2…in January, if they order today. Customers who ordered their units on Dec. 3 or prior are expected to receive their PC by Dec. 21 at the latest,” an HP representative told CNET via e-mail.

“HP expects additional units to ship in January,” the representative added.

The Envy x2 uses a new power-efficient dual-core “Clover Trail” Z2760 system-on-a-chip from Intel that can run the full 32-bit Windows 8. This sets it apart from Windows RT devices, such as Microsoft’s Surface RT tablet, that run a limited version of Windows 8 and are not compatible with older Windows 7 software.

Overall availability of Intel-based Windows 8 tablets and hybrids is spotty. While products based on the Intel Z2760 from Samsung (ATIV Smart PC 500T) and Acer (W510) are already available, others from Lenovo, Dell, and HP aren’t.

HP, for instance, is also prepping an ElitePad tablet using the Intel Z2760 and the full 32-bit Windows 8, but that won’t be available until late January.

And Lenovo’s ThinkPad 2 Tablet — also based on the Intel Z2760 — has been delayed since October.

A Lenovo representative told CNET in November that the ThinkPad 2 Tablet would ship to consumers during the first week of December. But that doesn’t appear to be happening. For instance, the Microsoft Store’s ThinkPad 2 Tablet page gives no indication of availability.

And calls to Microsoft Store representatives today yielded two responses. One rep said the unit wouldn’t ship until January 31 and another said there is no shipment date at all.

As of this afternoon PT, Lenovo had not responded to a request to clarify the shipment date for the ThinkPad 2 Tablet.

Dell’s Latitude 10, also built around the Intel Z2760, lists an “estimated ship date” of January 21.

Dell, HP Windows 8 ‘Atom’ Tablets Delayed Until 2013 [InformationWeek, Dec 19, 2012]

Dell Latitude 10 among Windows 8 systems not yet available, as tablet makers struggle with drivers for energy-efficient Intel Clover Trail chip.

Dell and other vendors have pushed back until January the launch of Windows 8 tablets that use a new, energy-efficient Intel chip that was supposed to put Windows devices on an even footing with the iPad and Android tablets in terms of performance and battery life, but which is apparently causing big headaches for system builders.

Dell’s Latitude 10, which runs Intel’s Atom Z2760, or “Clover Trail” chip, was, as of early Wednesday, not available for shipping until Jan. 22nd, according to the company’s Web site. Only a month ago, Dell had been advertising a pre-Christmas ship date of Dec. 12. The tablet starts at $649, features Windows 8 Pro, and is aimed at business users.

A Dell customer who contacted InformationWeek said company representatives told him last week that the Latitude 10 is delayed. The customer, who asked not to be identified, originally placed his order on Nov. 28, paid for two-day expedited shipping, and was given a mid-December delivery date. Now, Dell is telling him the system won’t be available until January.

“Dell Latitude 10 is not officially launched. As soon as it will be launched it will be sent to you,” a Dell rep told the customer via live chat on Dec. 11, according to a transcript of the session. Dell’s Web site is continuing to accept orders for the Latitude 10, and does not indicate it is available only as a preorder. A Dell spokesman did not respond to a request for comment.

Dell isn’t the only vendor having trouble with Windows 8 systems built around Intel’s Clover Trail chip. Hewlett-Packard’s site shows that its Envy x2 convertible is not available until Jan. 8. The company originally said it would ship in November, within weeks of Windows 8’s launch on Oct. 26.

ASUS and Lenovo have not announced specific launch dates for their Clover Trail systems, the VivoTab Smart and ThinkPad Tablet 2, respectively. Of the top 5 PC makers, only Acer’s W510 Clover Trail tablet is available for immediate purchase, but it can only be had in limited quantities from Amazon and Microsoft’s online store.

Intel designed Clover Trail to take full advantage of Windows 8’s capabilities, including a key feature called Connected Standby. Connected Standby is supposed to give tablet users a smartphone-like experience by ensuring that their devices are always up to date with new e-mails, messages and other data, even when their systems are powered down. Clover Trail also promises all-day battery life.

But PC makers are having trouble building Clover Trail drivers that are stable enough to pass Microsoft’s Windows Hardware Quality Labs (WHQL) testing, sources say. Under Microsoft’s licensing terms, Windows systems must receive WHQL certification before they can be offered for sale. Intel has not responded to repeated inquiries about the situation.

Cindy Shaw, an analyst with research firm DISCERN, said the delay could hurt PC makers that specialize in enterprise sales. “HP and Dell are conceding they’ve given up on the consumer, so missing the holiday season is not that big of a deal. They’re not missing that magical time of the year,” said Shaw. “But the longer it takes for businesses to get their hands on evaluation units, the longer it’s going to take to translate into enterprise sales.”

Most PC makers currently offer Windows 8 systems, such as the Dell XPS 12, that use Intel’s older Core architecture instead of Clover Trail. Microsoft’s Surface RT tablet also runs an Intel Core chip. Core packs more power than Clover Trail, but does not support Connected Standby and consumes batteries more quickly. A Microsoft spokesperson said the company could not immediately offer a comment.

The future of the semiconductor IP ecosystem

December 13 Report:
– Intel’s next-gen SoC manufacturing process will be able to deliver the next Bay Trail Atom only for 2014 products (with higher end Haswell for H2 2013), and it is just a 26nm process in terminology used by the foundry industry not a 22nm one touted by Intel

Lesson from that: Intel may speak about its “22 nm SoC process” but given the late entry of its 32nm SoC process Atom product (Cover Trail) it would be better to assume that with Windows 8 tablets based on that it will affect only the 2014 tablet market, not earlier. This is what the latest leaks are suggesting as well. Meanwhile expect a low-power Haswell ULT based tablet PC push in the H2 2013 as described already in my Intel Haswell: “Mobile computing is not limited to tiny, low-performing devices” [Nov 15 – Dec 11, 2012] post. As for the next year the real question is Can VIA Technologies save the mobile computing future of the x86 (x64) legacy platform? [this same blog of mine, Nov 23, 2012] For this watch what Allwinner vis-à-vis HTC on 2013 International CES [this same blog of mine, Dec 11, 2012] could bring in that respect, something much more than what is described in Allwinner A31 SoC is here with products and the A20 SoC is coming [USD 99 Allwinner blog of mine, Dec 10, 2012] or in $99 Android 4.0.3 7” IPS tablet with an Allwinner SoC capable of 2160p Quad HD and built-in HDMI–another inflection point, from China again [this same blog, Dec 3, 2012].    

– end of life of planar transistor and need to move to FinFET, but meanwhile FD-SOI to the rescue
– ARM Physical IP division via its upcoming IP is preparing with its foundry partners (TSMC, GLOBALFOUNDRIES and Samsung) an easier transition to FinFET

September 27 report:
– TSMC’s View of the Semiconductor IP Ecosystem
– Overall semiconductor IP market overview
– The CEVA case
– When sticking with the “Goliath”: ARM Holdings Plc
– When sticking with a “David”: CAST Inc.

Note: I am not discussing at all the most important development of the 64-bit ARM introductions as will devote to it a separate composite trend-tracking post on this blog.

Warning: These two reports are rather comprehensive and extensive on the given subject. When you will read these through your reward will be a deep and wide ranging understanding of this most actual issue for understanding the upcoming very dramatic changes in the further development of the whole ICT industry. To illustrate only some of the most related topics here is a copy of tags for this post:
14 nm, 14nm, 20 nm, 20nm, 22 nm, 22nm, 28 nm, 28nm, 3D devices, Allwinner, AndesCore, ARM Artisan IP, ARM Holdings, ARM Physical IP division, Artisan Physical IP Platform,Atom, BA22-AP, Bay Trail, Beyond BA22, big.LITTLE Processing, bulk CMOS, CAST Inc., CAST IP, CEVA, choice IP partner, Cortex A15, Cortex-A7, EnSilica eSi-3250, Fastec Imaging Corporation, Fastec TS3, FD-SOI, finFET,foundries, foundry and IP business model, foundry business, Freescale, Freescale ColdFire, general-purpose foundry business, GlobalFoundries, Haswell, Haswell-ULT, in-house IP blocks, inflection points, Intel, Intellectual Property, interface products, Internet of Things, IOT, IP suppliers, Kinetis, LEON3, licensable IP blocks, Lincroft, logic products, mainstream CMOS, Mali, MarketsandMarkets, MediaTek, memory compilers, MIPS32, mobile computing,Motomic, MT6588, MT6589, OpenRISC, planar transistor, POP, prime IP partners, Processor Optimization Pack,reusable subsystems, Samsung, semiconductor design, semiconductor intellectual property market, semiconductor IP, semiconductor IP ecosystem, semiconductor IP market, semiconductor IP revenue, silicon IP market, SoC manufacturing process, SoC process, Sodaville, SOI, standard cells, standard industry IP blocks, STMicroelectronics,system IP, tablet PC, transistor designs, Tri-Gate, Tri-Gate transistor, TSMC, TSMC IP Alliance, TSMC IP portfolio,TSMC Soft-IP Alliance, UMC, VIA Technologies, Z670


December 13 Report

– Intel’s next-gen SoC manufacturing process will be able to deliver the next Atom only for 2014 products (with higher end Haswell for H2 2013), and it is just a 26nm process in terminology used by the foundry industry not a 22nm one touted by Intel

Intel progressing in development of 14nm technology, says CTO [DIGITIMES, Dec 5, 2011]

Intel CTO Justin Rattner on December 4 said that Intel’s development of 14nm technology is on schedule with volume production to kick off in one to two years and development of 18-inch wafers is under way through cooperation with partners.

Rattner also noted that Intel’s aggressiveness over technology advancement will allow Moore’s Law to extend for another 10 years.

At the end of 2013, Intel will enter the generation of 14nm CPUs (P1272) and SoCs (1273), while expanding its investments at its D1X Fab in Oregon, and Fab 42 in Arizona, the US and Fab 24 in Ireland, and will gradually enter 10nm, 7nm and 5nm process generations starting 2015.

As for Intel’s competitors, Samsung is already set to enter 20nm in 2013 and is already working on its 14nm node, while Taiwan Semiconductor Manufacturing Company’s (TSMC) 20nm process [planar, i.e bulk CMOS, see below] will enter small volume production in the second half of 2013 with the first 3D-based FPGA chips to also start.

Globalfoundries has previously announced its 14nm FinFET process will start pilot production at the end of 2013 and enter mass production in 2014.

As for 18-inch wafers, Intel has invested in Holland-based ASML for its EUV technology, and related technologies are expected to start entering production in 2017.

Intel Has No Process Advantage In Mobile, says ARM CEO [Mannerisms on Electronics Weekly, Oct 24, 2012]

Intel has no advantage in IC manufacturing when it comes to manufacturing processes used for mobile ICs, Warren East, CEO of ARM, tells EW.

“This time last year there was a lot of noise from the Intel camp about their manufacturing superiority,” says East, “we’re sceptical about this because, while the ARM ecosystem was shipping on 28nm, Intel was shipping on 32nm. So I don’t see where they’re ahead.”

Furthermore, with the foundries accelerating their process development timescales, it looks increasingly unlikely that Intel will be able to find any advantage on mobile process technology in the future.

“We’re supporting all the independent foundries,” says East. That includes 20nm planar bulk CMOS and 16nm finfet at TSMC; 20nm planar bulk CMOS and 14nm finfet at Samsung and 20nm planar bulk CMOS, 20nm FD-SOI and 14nm finfet at Globalfoundries.

It gives the ARM ecosystem a formidable array of processes to choose from. “I’m no better equipped to judge which of these processes will be more successful than anyone else,” says East, “our approach is to be process agnostic.”

The important thing is that the foundries’ process roadmap is on track to intersect Intel’s at 14nm.

14nm will be the first process at which Intel intends to put mobile SOCs to the front of the node i.e. putting them among the first ICs to be made on a new process.

Asked if the foundries were prepping their next generation processes with the intention of putting mobile SOC at the front of the node, East replies: That’s the information we’re seeing from our foundry partners.”

Globalfoundries intends to have 14nm finfet in volume manufacturing in 2014, the same timescale as Intel has for introducing 14nm finfet manufacturing.

In fact, GF’s 14nm process may have smaller features than Intel’s 14nm process because, says Mojy Chian senior vp at Globalfoundries, because “Intel’s terminology doesn’t typically correlate with the terminology used by the foundry industry. For instance Intel’s 22nm in terms of the back-end metallisation is similar to the foundry industry’s 28nm. The design rules and pitch for Intel’s 22nm are very similar to those for foundries’ 28nm processes.”

Jean-Marc Chery, CTO of STMicroelectronics points out that the drawn gate length on Intel’s ˜22nm” process is actually 26nm.

Furthermore Intel’s triangular fins, which degrade the advantages of finfet processing could underperform GF’s rectangular fins which optimise the finfet advantage.

At the front of the GF 14nm finfet node will be mobile SOCs says Chian. GF has been working with ARM since 2009 to optimise its processes for ARM-based SOCs.

At TSMC the first tape-out on its 16nm finfet process is expected at the end of next year. That test chip will be based on ARM’s 64-bit V8 processor.

Using an ARM processor to validate its 16-nm finfet process should give TSMC’s ARM-based SOC customers great confidence.

Asked about the effects of finfets on ARM-based SOCs, East replies: “There’s no rocket science in what you get out of it. The question is does it deliver the benefits at an acceptable cost? You don’t get something for nothing. How much does it cost to manufacture? How good is the yield? And that, of course, affects cost.”

And so on goes Intel beating its head against the wall to get into the low-margin mobile business.

Recently Intel  said it expected its Q4 gross margin to drop 6% from Q3’s 63% to 57%. Shock, horror said the analysts

But if Intel succeeds in the mobile business, its gross margin will drop a lot more than that.

It’s a funny old world.

The Truth About Intel [Mannerisms on Electronics Weekly, Dec 5, 2012]

The darndest things are being said about Intel. The departure of its CEO is unexplained though I heard one person say it was voluntary.

Some people think Apple will put x86 in the iPad.

Others think Apple will drop x86 from iMacs so as to unify its processors across Phone, Pad and Mac.

Sure as eggs are eggs, both can’t happen

Some think Intel is going to become a foundry in a major way starting with Apple’s business – though it’s said the production cost of an Intel wafer is 3x that of a TSMC wafer.

Others say Intel may make wafers for a few customers but will not enter an industry servicing thousands of customers with hundreds of thousands of mask-sets.

Intel is to borrow $6 billion to buy its own shares something it has been doing for some time. I am too financially unsophisticated to understand why it does this but, even before this latest borrowing, Intel’s debt was already pretty high at over $7 billion and its cash rather low – for a cash generative, capex-gobbling company – at $10.5 billion.

The divi is generous – but the purpose of the generosity is to keep the share price up, then generosity hasn’t worked – Intel’s share price is under $20, unchanged in a decade.

The strategy of getting x86 into mobile phones seems mistimed when Apple and Samsung and now LG are designing their own mobile phone processors. This morning Samsung said it will start mass-roducing its own-brand 28nm processors for mobile devices early in 2013.

Intel’s fab situation at 22nm looks tough with 50% utilisation. A $500 million charge for this is expected to be taken in Q4.

Intel’s claim to have a manufacturing advantage looks unconvincing when its 22nm process turns out to have a drawn gate length of 26nm – virtually the same as volume processes at  leading foundries.

Where it matters, i.e. in the mobile market, Intel has no process advantage at all because Intel hasn’t yet put its mobile SOCs on its latest process at the start of a node. Intel’s mobile SOCs won’t enjoy early access to a new process node until the 14nm generation.

And was finfet the right bet?  20nm planar may still be made to work, while FD-SOI could turn out to be a better route than finfet

Meanwhile CEO Paul Otellini won the 2012 Open-Mouth-Insert-Foot Award by some spectacular boo-boos:

  • Saying Windows 8 wasn’t ready just before its launch, provoked Microsoft’s riposte that Intel’s power management software wasn’t ready for the launch of Surface, Microsoft’s Windows 8 tablet.
  • And endorsing Governor Mitt Romney in the recent US presidential elections probably irked the White House just as Otellini was earning some brownie points by sitting on a Presidential committee. They were much needed brownie points after Intel’s pasting from the FTC for ‘stifling innovation.’

And all the while and worst of all, the PC industry starts to contract and Intel has won few slots in the successor to the PC industry – the mobile device industry.

All in all a pretty rotten year for Intel despite taking in over $50 million in revenues and earning over $12 billion in profits.

Even silver linings can have clouds.

So the war is on as per: IBM, Intel face off at 22 nm [EE Times, Dec 10, 2012]

SAN FRANCISCO – Intel and IBM went head-to-head with their latest 22-nm technologies in back-to-back papers at the International Electron Devices Meeting (IEDM) here Monday (Dec. 10). Separately, a top Intel fab executive commented on increasing wafer costs and the company’s foundry business.

IBM said it is prototyping server processors in a new 3-D ready, 22-nm process technology it hopes will deliver 25 to 35 percent boosts over its 32-nm node. Intel retains an edge with several 22-nm chips already in volume production, and disclosure at IEDM of a variant of the process for SoCs for a wide range of applications.

The Intel paper showed support for “high drive current across the spectrum of leakage and a full suite of SoC tools,” Mark Bohr, head of Intel’s process technology development group, said in a brief interview. The process is geared for a much wider array of designs than that of IBM, he added.

Bohr said Intel’s 22-nm FinFET process is cost effective, contradicting report it is 30 to 40 percent more expensive than TSMC’s 28-nm planar process. The addition of FinFET adds only 3 percent to the cost of the process. Its use of 80-nm minimum feature sizes can be made with a single pass of 193-nm lithography tools, making it cost effective.

Projections from an IMEC keynote that 14-nm wafers will be 90 percent more expensive than 28-nm parts due to the lack of EUV lithography are inaccurate, Bohr asserted. The cost increase for 14-nm wafers at Intel “is nowhere near that,” he said.

“Cost per wafer has always gone up marginally each generation, somewhat more so in recent generations, but that’s more than offset by increases in transistor density so that the cost per transistor continues to go down at 14 nm,” Bohr said.

Separately, Bohr said Intel does have a growing foundry business that may include some higher volume applications than its current announced customers like FPGA startup Achronix. However, “we don’t intend to be in the general-purpose foundry business…[and] I don’t think the [foundry] volumes ever will be huge” for Intel, he said.

Intel’s paper laid out characteristics of Intel’s 22-nm process variation for SoCs (see chart below). It outperforms Intel’s 32-nm planar process by 20 to 65 percent and covers four orders of magnitude in leakage current, said co-author C.H. Jan.

image

The process provides 51 to 56 percent improvements in high voltage performance used for fast interfaces such Ethernet, HDMI and PCI Express. That’s more than twice the 20 percent boost typical in this area for a new Intel node, Jan said.

In addition, analog performance went up three-fold after declines in the past three nodes. Intel offers a small library of analog circuits tailored to the process including precision resistors, metal-in-metal capacitors and high Q inductors.

The process supports high and standard performance options as well as low and ultra low power ones. It also includes SRAM designs optimized for density, power and performance some of which now hit 2.6 GHz at 1V, up from 1.8 GHz at 32 nm.

Finally, Intel created two new transistor designs specifically for the 22-nm SoC variant. One is focused on low power and the other on high voltage for mixed-signal and analog circuits (see chart above).

image

For its part, IBM described its 22-nm process using partially depleted silicon-on-insulator. IBM “has prototyped a number of server processors” in the node that achieve latency below 1.5 ns and 750 MHz random clock cycles, said IBM researcher S. Narasimha.
Narasimha declined to give specifics of what IBM might achieve with the 22-nm node. However he did say the goal was to provide 25 to 35 percent boosts of the previous node which delivered server processors running up to 5.5 GHz and others with up to 80 Mbytes embedded DRAM.
IBM created an SRAM cell that measures 0.026 mm2 using the process. It also power supplies at 1.2V across a 550 mm2 die area, he said.
The process provides up to 15 levels of metal. The lowest five levels use 80-nm features, similar to the Intel process, and the top two levels support through-silicon vias for 3-D stacks with memory chips.
IBM will deliver a separate paper Wednesday on its 3-D stacking work.

Before that it was that Intel describes 22-nm SoC process, not chips [EE Times, Sept 13, 2012] 

Intel provided the first look at the system-on-chip variant of its 22-nm process technology in a talk at the Intel Developer Forum here Thursday (Sept. 13). However, it declined to provide details on the Atom-based SoCs for tablets and smartphones that will be made in that process.

“It’s fair to say Intel didn’t have much of a focus four or five years ago on SoCs, but that’s changed,” said Mark Bohr, director of Intel’s technology and manufacturing group in a process technology talk. “The success of Medfield [Intel’s 32-nm smartphone platform] shows we are learning to do it right, and I think we will have a technology advantage at 22 nm,” he said.

Intel showed at IDF six smartphones and four Windows 8 tablets using the Medfield SoC, made in an SoC variant of its 32-nm process. “There’s a lot more in the pipeline,” said Ticky Thakkar, a lead Atom designer in a separate talk on the mobile chips.

The company is already shipping to OEMs a 2-GHz version of Clover Trail, a follow on 32nm dual-core processor with boosted graphics. A 1.8-GHz version for tablets is also in the works.

Next up is Bay Trail, Intel’s first 22-nm SoC for tablets and smartphones, expected to debut at IDF Beijing [April 10-11, 2013 as per the IDF page of Intel]. “You’ll have to wait until next year to hear about it,” said Thakkar.

In a separate talk, Bohr described P1271, the 22-nm SoC process to be used for Bay Trail. It differs from the 22-nm CPU process now used for Intel’s Ivy Bridge processors by offering lower leakage logic transistors, higher voltage I/O transistors, denser upper layer interconnects and a set of precision resistors, capacitors and inductors.

image

“It’s not one set of features, but a menu of feature options—transistors, I/O, interconnects, passive elements and embedded memory,” Bohr said. “The [SoC] transistors go down to much lower leakage levels, but give up some performance,” he said.

image

The process has significantly better analog characteristics than Intel’s current 32-nm planar process. Designs make heavy use of 80-nm pitch features in lower metal layers, because they are the smallest features Intel can make at 22 nm without needing double patterning, he added.

Intel is running the process at three fabs, two in the U.S. and one in Israel. It will ramp soon in two other fabs.

Reminders: Silicon Technology for 32 nm and Beyond System-on-Chip Products [IDF 2009 presentation by Mark Bohr, Sept 23, 2009]

image     image

image   image

image

Products (Formerly Lincroft) [Intel page]
– Number of Products: 5
– Launch Range: Q2’11 – Q2’10
– Max TDP: 1.3W (Z600) – 3W (Z670)
Z600 (512K Cache, 1.20 GHz)
Z670 (512K Cache, 1.50 GHz)

while the first SoC product was the Sodaville which had no real market success (even specs are not listed on the ark.intel.com), and as such was not continued:
Intel Unveils 45nm System-on-Chip for Internet TV  [press release, Sept 24, 2009]

Intel Corporation today unveiled the Intel® Atom™ processor CE4100, the newest System-on-Chip (SoC) in a family of media processors designed to bring Internet content and services to digital TVs, DVD players and advanced set-top boxes.

The CE4100 processor, formerly codenamed “Sodaville,” is the first 45nm-manufactured consumer electronics (CE) SoC based on Intel architecture. It supports Internet and broadcast applications on one chip, and has the processing power and audio/video components necessary to run rich media applications such as 3-D graphics.

Intel® Atom™ Processor CE4100
The CE4100 processor can deliver speeds up to 1.2GHz while offering lower power and a small footprint to help decrease system costs. It is backward compatible with the Intel® Media Processor CE 3100 and features Intel® Precision View Technology, a display processing engine to support high-definition picture quality and Intel® Media Play Technology for seamless audio and video. It also supports hardware decode of up to two 1080p video streams and advanced 3-D graphics and audio standards. To provide OEMs flexibility in their product offerings, new features were added such as hardware decode for MPEG4 video that is ready for DivX* Home Theater 3.0 certification, an integrated NAND flash controller, support for both DDR2 and DDR3 memory and 512K L2 cache. The CE SoC contains a display processor, graphics processor, video display controller, transport processor, a dedicated security processor and general I/O including SATA-300 and USB 2.0.

Lincroft is mentioned in my Windows 7 tablets/slates with Oak Trail Atom SoC in December [Nov 1-24, 2010] post as:

Intel “is aiming to mass produce its Oak Trail platform for its Sleek Netbook segment targeting the tablet PC market in December 2010. The Oak Trail platform is a combination of Intel’s Lincroft (Atom Z6xx series) processor with Whitney Point chipset.”

The Oak Trail platform will sell at about US$25 with MeeGo [which was terminated as Nokia exited that joint effort 3 months later], and the price for Oak Trail and Microsoft’s Windows 7 will be higher.

so it was Intel’s first attempt to compete against the ARM-based tablet business, including the already successful iPad. As such it ended nowhere in terms of volumes. So adjustment followed as early as noted in my Intel: accelerated Atom SoC roadmap down to 22nm in 2 years and a “new netbook experience” for tablet/mobile PC market [April 17, 2012] despite that fact that products based on Z670 Atom from Lenovo and Fujitsu, as the big names, and Evolve, Motion Computing, Razer and Viliv, as much lesser names, appeared on the market from April, 2011 on (you could find information about them in the post itself). The price was too high: e.g. $729 for the Evolve III Maestro C.

The next Atom based on Intel’s 32nm SoC process appeared in fact just recently, first appeared in Acer Iconia W510: Windows 8 Clover Trail (Intel Z2760) hybrid tablets from OEMs [Oct 28, 2012] priced little lower, from $499 and up which is still overpriced relative to the ongoing 10” Android tablets. Moreover, it became available on in the second half of November and appeared on the Microsoft store to celebrate Cyber Monday (Nov 26) discounted to $399, which is the only competitive price. Now it is back to $499.

Lesson: Intel may speak about its “22 nm SoC process” but given the late entry of its 32nm SoC process Atom product (Cover Trail) it would be better to assume that with Windows 8 tablets based on that it will affect only the 2014 tablet market, not earlier. This is what the latest leaks are suggesting as well. Meanwhile expect a low-power Haswell ULT based tablet PC push in the H2 2013 as described already in my Intel Haswell: “Mobile computing is not limited to tiny, low-performing devices” [Nov 15 – Dec 11, 2012] post. As for the next year the real question is Can VIA Technologies save the mobile computing future of the x86 (x64) legacy platform? [this same blog of mine, Nov 23, 2012] For this watch what Allwinner vis-à-vis HTC on 2013 International CES [this same blog of mine, Dec 11, 2012] could bring in that respect, something much more than what is described in Allwinner A31 SoC is here with products and the A20 SoC is coming [USD 99 Allwinner blog of mine, Dec 10, 2012] or in $99 Android 4.0.3 7” IPS tablet with an Allwinner SoC capable of 2160p Quad HD and built-in HDMI–another inflection point, from China again [this same blog, Dec 3, 2012].

End of Reminders


– end of life of planar transistor and need to move to FinFET, but meanwhile FD-SOI to the rescue

FinFETs or FD-SOI? [SemiMD (Semiconductor Manufacturing and Design), Dec 11, 2012]

By Ed Sperling
STMicroelectronics yesterday unveiled the results of its 28nm production silicon chips using fully depleted silicon on insulator technology, which it claims offers a 30% improvement in speed over bulk CMOS while using less power.

The debate over FD-SOI and FinFETs has been notching up over the past few months. While FinFETs and FD-SOI both promise improvements in controlling leakage current, the FinFETs are more difficult to design. FD-SOI uses the same design flow, although it does use a different SPICE model with better characteristics than the one used for bulk CMOS.

ST also used an ultra thin body and box (UTBB) and body biasing to boost performance, according to Joel Hartmann, the company’s executive vice president of front-end manufacturing and process R&D. Hartmann presented his results at an SOI Consortium-sponsored event at the IEDM show last night.

“We are using body bias to boost performance,” Hartmann said. “You can do that with FD-SOI. We also decreased the Vdd of the device by applying body biasing.”

What’s particularly attractive about FD-SOI is that is can be implemented at the 28nm node for a boost in performance and a reduction in power. The mainstream process node right now is 40nm. And while Intel introduced its version of a finFET transistor called Tri-Gate at 22nm, TSMC and GlobalFoundries plan to introduce it at the next node—whether that’s 16nm or 14nm. That leaves companies facing a big decision about whether to move all the way to 16/14nm to reap the lower leakage of finFETs, whether to move to 20nm on bulk, or whether to stay longer at 28nm with FD-SOI.

Hartmann said ST has seen improvements in analog running on FD-SOI, and for memory where the minimum voltage required is lower. He said ST’s road map calls for FD-SOI all the way down to 10nm, with voltages dropping from 0.9v at 28nm to 0.8v at 14nm and 0.7v at 10nm.

One of the sticking points in adopting FD-SOI has been market acceptance. Despite the promise of improved performance and/or lower power, bulk CMOS has been extended using a variety of techniques such as strain engineering and FD-SOI is considered more expensive. At 28nm and beyond, however, bulk has run out of steam, which is why Intel has opted for finFETs.

Still, FinFETs are more difficult to design and manufacture, and they potentially can add significantly to the cost of an SoC. FD-SOI, in contrast, uses the same design tools and reduces the number of masks and metal layers. ST is the first large fab-lite company to adopt FD-SOI and to move beyond just test chips. It remains to be seen which path the rest of the industry takes—and how quickly.

Increasing Levels Of Risk [SperlingMediaGroup YouTube channel, Dec 11, 2012]

Semiconductor Manufacturing & Design sits down with Mentor Graphics’ Jean-Marie Brunet to talk about double patterning, FinFETs, design rules at advanced nodes and why design for manufacturing (DFM) has suddenly become so popular.

Inflection Points [SperlingMediaGroup YouTube channel, Aug 14, 2012]

Semiconductor Manufacturing and Design talks with Paul Boudre, chief operating officer at Soitec, about FinFETs, industry inflection points, the end of life for planar transistors, bulk CMOS vs. SOI, the differences between fully depleted and partially depleted SOI, and the FD-SOI ecosystem.

See also: ST’s FD-SOI Tech Available to All Through GF [SemiMD (Semiconductor Manufacturing and Design), Oct 8, 2012]


– ARM Physical IP division via its upcoming IP is preparing with its foundry partners (TSMC, GLOBALFOUNDRIES and Samsung) an easier transition to FinFET

2012 ARM TechCon John Heinlein Interview [chipestimate YouTube channel, Dec 4, 2012]

Sean O’Kane, Producer/Host ChipEstimate.TV John Heinlein, VP Marketing, Physical IP Division at ARM

TSMC OIP 2012 – Sit down with John Heinlein, ARM [chipestimate YouTube channel, Dec 4, 2012]

Sean O’Kane, Producer/Host ChipEstimate.TV interviews at TSMC OIP 2012

An introductory type video for the roundtable video which is the next:
ARM 16/14nm FinFET Manufacturing Leadership [Charbax YouTube channel, Nov 1, 2012]

John Heinlein, Vice President of Marketing, Physical IP Division at ARM talks about the 14nm FinFET ARM Processor manufacturing technology that is being developed and that is starting to be manufactured next year.

 

ARM TechCon 2012 Executive Roundtable: Manufacturing [ARMflix YouTube channel, Nov 14, 2012]

Embedded in the beginning of this roundtable video there is a [4:19] minutes long Investing in FinFET Technology Leadership Presented by ARM [ARMflix YouTube channel, Nov 12, 2012] video in which Dr. Rob Aitken, R&D Fellow at ARM, discusses the need for new transistor technologies and how FinFET may be a solution. The embedded video is starting at [00:39] of the roundtable video. From this I will transcribe here the following part showing ARM’s commitment and strategy for FinFET in its Physical IP Division:

[02:30] ARM is taking a leadership position in FinFET IP development to accelerate the availability of FinFET IP in ARM partnership. We are working closely with foundry partners to develop prototype FinFET physical IP early in the process lifecycle. Using this prototype physical IP ARM is currently developing two different FinFET test chips both taping out in Q3 2012. These efforts continue ARM’s commitment to early development of silicon testing to reduce risk and time to market. Through our early engagement and prototyping work we actively provide feedback to our foundry partners to assure that FinFET technology is well suited to the requirements of energy efficient SoCs. ARM is further contributing to the technical community by publicly releasing fully pre-authorized FinFET transistor model based RTRs roadmap and is extending these models to more advanced FinFET designs. Internally we are modeling proprietary foundry technologies in support of the development work on those processes. This is just the beginning of ARM’s commitment to FinFET IP leadership. [03:46]

This ARM TechCon panel included the following speakers: Moderator: Dr. John Heinlein VP, Marketing, Physical IP Division ARM Panelists: Simon Segars EVP and GM, Processor and Physical IP Divisions ARM Gregg Bartlett SVP & CTO GLOBALFOUNDRIES Dr. Jong-Shik Yoon SVP, Logic Technology Development, Semiconductor R&D Samsung Dr. Shang-yi Chiang EVP & Co-COO TSMC

There are a number of other ARM specific information about its FinFET efforts in the September 27 report which is in the following major section. Now additional ones from its foundry partners:

Breathing New Life into the Foundry-Fabless Business Model [ARM’s SoC Design blog, Aug 21, 2012]

Early last week, GLOBALFOUNDRIES jointly announcedwith ARM another important milestone in our longstanding collaboration to deliver optimized SoC solutions for ARM® processor designs on GLOBALFOUNDRIES’ leading-edge process technology. We’re extending the agreement to include our 20nm planar offering, next-generation 3D FinFET transistor technology, and ARM’s Mali™ GPUs.
Our collaboration with ARM goes back many years, and its evolution parallels some of the critical developments in the larger semiconductor industry during the same timeframe. ….

This early and deep collaboration has resulted in several significant milestones, including the world’s first foundry optimized Cortex-A9 processor, POP™ IP for the Cortex-A9 processor operating at 1.6GHzon our 28nm-SLP technology, and a demonstration of more than 2GHzon our 28nm high-performance technology. This platform builds on the existing ARM Artisan® physical IP platforms for GLOBALFOUNDRIES processes at 65nm, 55nm and 28nm.

Now we are extending this collaboration to include true joint optimization for 20nm technologies and beyond, as well as a new focus on GPUs, which are becoming increasingly important in today’s smart mobile devices. The TQV strategy has already been scaled to 20nm and is an integral part of our process development, with a 20nm test chip implementation currently running through our Fab 8 in Saratoga County, N.Y.

And while we are seeing great dividends from this collaboration, the real hard work is only just beginning. We are now leveraging historical synergies from 28nm and 20nm planar technology to enable a smooth migration to next-generation, three-dimensional FinFET technology. One of the well publicized benefits of FinFET technology is its superior low-power attributes. The intrinsic capability of the 3D transistor to operate at a lower Vdd translates to longer battery life, which is heavily sought after in performance-hungry mobile computing applications. Our collaboration is focused tightly on this sweet spot in the market, where designers are looking for the optimum combination of performance, power-consumption, area, and cost. Our co-development work with ARM will enable a faster time to FinFET SoC solutions for customers using ARM’s next generation of mobile SoC IP for both CPUs and GPUs.

So clearly the foundry-fabless business model is not collapsing, but rather adapting to meet the challenges of today. Success will be a result of much closer joint development at the technology definition level, early engagement at the architectural stage, and a more integrated and cooperative ecosystem – precisely the kind of collaboration that we’re demonstrating with our valued partner ARM.

Guest Partner Blogger:

Attached ImageMike Noonen is Executive Vice President, Worldwide Marketing and Sales, for GLOBALFOUNDRIES. In this role, he is responsible for global customer relationships as well as all marketing, sales, customer engineering and quality functions.

GLOBALFOUNDRIES at ARM Techcon 2012 [Charbax YouTube channel, Oct 30, 2012]

Talking about the fabrication of ARM Processors, from 28/32nm HKMG to 20nm to upcoming FinFET 14nm process technologies with Subramani Kengeri, Vice President, Technology Architecture, Office of the CTO, Paul Colestock, Director, Strategic Marketing and Srinivas Nori, Director, Marketing, SoC Innovation at GlobalFoundries at ARM Techcon 2012.

If interested in the GLOBALFOUNDRIES Fireside Chat mentioned here watch the separate video GLOBALFOUNDRIES Fireside Chat at ARM Techcon 2012 [Charbax YouTube channel, Oct 31, 2012] with the following content:

“The insatiable need for functional and feature integration on to Mobile SoCs, coupled with ever increasing performance demands has challenged the Foundries and Fabless Semiconductor companies alike. While the diminishing geometries of the process technologies have kept pace to address this challenge, the solutions for leakage power dissipation continued to fall behind threatening to thwart the advances in Mobility. The ground-breaking FinFET technology is the right low-power solution and will serve as an inflection point to further enable SoC-level integration and technological advances in this exciting era of Extreme Mobility. The panel will discuss how the next generation of FinFET technology will change the mobile revolution again.”

Speakers

Dean Freeman, Research VP, Gartner Research
Bruce Kleinman, VP, Product Marketing, GLOBALFOUNDRIES
Subramani Kengeri, Vice President, Technology Architecture Office of the CTO, GLOBALFOUNDRIES
Srinivas Nori, Director. SOC Innovation, GLOBALFOUNDRIES
Dipesh Patel, Deputy General Manager of the Physical IP Division, ARM

TSMC’s information about collaboration with ARM in FinFET space was already included in the second major section (September 27 Report) beginning from ARM and TSMC Collaborate to Optimize Next-Generation 64-bit ARM Processors for FinFET Process Technology [ARM press release, July 23, 2012] part in the text. As an update to that I will include here:  TSMC Accelerates finFET Efforts [SemiMD (Semiconductor Manufacturing and Design), Oct 16, 2012]

In response to its foundry rivals, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has updated and accelerated its process roadmap. The world’s largest silicon foundry has accelerated its 16nm finFET efforts by one quarter and added a 10nm finFET technology to the roadmap.

TSMC also plans to take the “modular fin” approach for its 16nm finFET. It is also looking at 450mm fabs at the 10nm node, according to a TSMC executive, who also stressed that collaboration is a key to success. Customers must collaborate earlier in the design cycle and “at a new level,” said Mark Liu, executive vice president and co-chief operating officer at TSMC, during a keynote at the company’s Open Innovation Platform Ecosystem Forum in San Jose, Calif. on Tuesday (Oct. 16). “We need to align strategically.”

At present, TSMC is ramping up its 28nm process technology. The next process on the roadmap, dubbed CLN20, is a 20nm planar technology. The reference flow for CLN20 is ready and the process is due out in 2013.

[See: TSMC 20nm and CoWoS™ Design Infrastructure Ready [TSMC press release, Oct 9, 2012]

Then, as previously announced, TSMC will enter the finFET transistor era. The company’s initial finFET process, dubbed CLN16FF, is being targeted and branded for the 16nm node. TSMC’s 16nm finFET process is slated for risk production in November of 2013, Liu said. Risk production has been accelerated from February of 2014 to November of 2013.

In an interview after the keynote, Liu said TSMC will take a “modular fin” approach in finFETs. TSMC will marry a 16nm fin with a 20nm backend. “It has 20nm design rules,” he said.

TSMC will also implement a triple-patterning strategy for 16nm finFETs. The company is also keeping its options open. It is exploring 193nm immersion extensions, extreme ultraviolet (EUV) lithography and multi-beam. “At this point, we have both (193nm extensions and EUV) under development,” he said. “Maybe multi-beam will save the day.”

TSMC’s 16nm finFET design solutions, including the EDA tools and IP, will be ready by the first quarter of 2013.  “We have pulled in our design enablement solutions,” said Cliff Hou, senior vice president of TSMC, during a separate keynote at the event. The first version of the design solutions, dubbed V0.1, is slated for introduction in January. The second version, V1.0, is due out in October of 2013.

Meanwhile, during his keynote, Liu presented a slide that denoted CLN10FF, which is a second-generation finFET for the 10nm node.  TSMC’s 10nm finFET process is expected to move into risk productionclose to the end of 2015,” he said.

Also at 10nm, TSMC is looking to enter the 450mm fab era. It is likely TSMC will have a 450mm fab or pilot line in the second phase of 10nm. “There are no show stoppers,” he said. “All of the equipment companies are developing 450mm.”

Other foundries have also accelerated their finFET roadmaps. For example, GlobalFoundries Inc. recently rolled out its finFET technology for the 14nm node. GlobalFoundries is taking a “modular fin” approach with its bulk finFET offering, dubbed 14nm-XM. The 14nm-XM combines a 14nm-class fin with its 20nm back-end-of-line (BEOL) interconnect flow.

By taking the modular approach, the company has accelerated its process roadmap by a year. Early process design kits (PDKs) are available, with customer product tape-outs expected in 2013. Production, which is slated for 2014, will take place within GlobalFoundries’ new 300mm fab in New York.

Another foundry vendor, United Microelectronics Corp. (UMC), is taking a similar modular finFET approach. UMC licensed finFET technology from IBM. Samsung Electronics Co. Ltd. has yet to elaborate on its finFET strategy.  Meanwhile, Intel Corp. is already ramping up its 22nm process, which is based on finFET transistors. Intel is providing foundry services for select customers, who plan to ship products based on finFETs.

 


September 27 Report

In my role, I serve as one of the members of the Global

Semiconductor Alliance (GSA) Steering Committee on Intellectual Property, where we work to share best practices and continue to improve the IP ecosystem for the benefit of the entire semiconductor industry. As part of this role, I’ve observed a trend in the news speculating on the future of the foundry and IP industry, and I recently posted my thoughts on the GSA blog site, and I’d like to share them with you here as well.

In 1897, after a journalist erroneously reported the passing of famed author and humorist Mark Twain, Twain replied in his typical wit with the now famous retort: “the rumor of my death has been greatly exaggerated.”  Like the then very alive author, recent reports have speculated on the demise of the foundry and IP business model.  I similarly think such talk is pure nonsense.  Across many metrics the foundry and IP space is alive and well and providing unprecedented capabilities to semiconductor companies. [his factual argumentation for that you can find much below, in the <<sticking with the “Goliath”>> section]

Dr. John Heinlein, Vice President, Marketing, ARM Physical IP Division on May 16, 2012


imageTSMC’s View of the Semiconductor IP Ecosystem 

To understand the semiconductor IP ecosystem one should first understand it via the IP related efforts of far the biggest and most influential foundry, TSMC (as their success most heavily depends on a vibrant and quality IP ecosystem):

ChipEstimate.com DAC 2012 IP Talks presenter Dan Kochpatcharin on TSMC OIP and IP Quality [chipestimate YouTube channel, June 26, 2012]

Dan Kochpatcharin, Deputy Director, IP Portfolio Marketing, TSMC. IP Talks presenter with ChipEstimate.com at DAC 2012 in San Francisco. TSMC OIP (Open Innovation Platform alliance ecosystem) and IP Quality. For more information about TSMC , go to: http://www.chipestimate.com/tsmc/

There are 41 IP partners in the semiconductor IP specific TSMC IP alliance program of TSMC OIP (Open Innovation Platform alliance ecosystem) and also have 20-25 IP partners directly supported but not part of the IP alliance program.

image

Among those the winners of the 2011 TSMC IP Partner Award of Year were:

Note that for such an IP excellency the organisations behind are not big at all. Dolphin Integration SA is a 190 people company. eMemory employs around 200 people as per the award news release. While ARM Holdings Plc had 2,253 full-time employees alltogether at June 30, 2012, considering their Physical IP Division (PIPD) having just 11% of the overall revenue the number of employees there would probably not exceed 300. Artisan Components Inc. (US) acquired by ARM Holdings for not less than 1 billion US$ in Dec 2004 (because of “collaboration between the two companies on ARM’s next-generation MPU core, code-named “Tiger”, in 2005 becoming Cortex-A8) had 72 employees in 1997, so it is likely from historical point of view as well (considering even ARM’s heavy investment later on).

As far as Synopsys is concerned, 9 months ago it had ~6800 employees, but its portfolio is rather large (implementation, verification, IP, manufacturing and FPGA solutions), and in addition to the Interface IP the company has Analog IP and Memories and Logic Libraries as well in the overall DesignWare IP portolio. To understand that split let’s take the following “Top Interface, Analog, and Embedded Memory IP Vendor” presentation slide from Synopsis Investor Day 2011 presentation, referring to a Gartner, March 2011 report, which is indicating $104.1M interface IP revenue for 2010:image
which is ~ 7.5% of the overall revenue of Synopsis (having $1.38B for the fiscal year 2010 ending Oct 31, 2010 when it had 6707 employees) which could mean ~500 employees related to Interface IP activities taken proportionally to the revenue.

And here are the number of titles in TSMC IP portfolio also vs. other foundries:

image

See also:
TSMC Extends Open Innovation Platform™ [TSMC press release, June 7, 2010]
TSMC Expands IP Alliance to Include Soft IP [TSMC press release, Oct 5, 2010]
Atrenta and TSMC IP Quality Initiative Gains Broad Industry Acceptance [Atrenta press release, March 5, 2012]: “10 intellectual property (IP) providers have qualified their soft IP for inclusion in the TSMC 9000 IP library using the Atrenta IP Handoff Kit. Those companies, part of TSMC’s Soft-IP Alliance Program, include Arteris, Inc.; CEVA; Chips&Media, Inc.; Digital Media Professionals Inc. (DMP); Imagination Technologies; Intrinsic-ID; MIPS Technologies, Inc.; Sonics, Inc.; Tensilica, Inc.; and Vivante Corporation. The participating companies are able to provide quantitative information to TSMC’s customers regarding the robustness and completeness of their soft or synthesizable semiconductor IP that is part of the TSMC 9000 IP library.
Imagination Technology Forum: Advanced SoC solutions in cooperation with TSMC [detailed DIGITIMES report, June 28, 2012]: “Not only will we be introducing our latest graphics processing IP, we will also talk about video, displays, multi-threaded cores [Meta SoC Processors], and wireless processors [Ensigma Universal Communications Core Processors (UCCPs)]. We hope that industries can further understand that Imagination is a company that provides complete SoC solutions.
TSMC Open Innovation Platform® Ecosystem Forum, Technical Presentation Abstracts image[TSMC, Oct 18, 2011]
ARM Physical IP Overview [ARM presentation, Sept 9, 2011]
Leveraging Advanced Physical IP to Deliver Optimized SoC Implementations at 40nm and below [ARM presentation, Nov 19, 2010] [Meta SoC Processors]
ARM Announces Processor Optimization Pack [ARM press release, Nov 9, 2010]

ARM today announced the immediate availability of the ARM® Cortex™-A9 Processor Optimization Packs (“POPs”).  Processor Optimization Packs leverage ARM Artisan® physical IP to enable customers to achieve technology leading performance or power targets on their Cortex-A9 implementations in the shortest time to market. A silicon-proven POP is available now TSMC(R) 40nm G process technology.  The Cortex-A9 POP on TSMC 40nm LP process technology will be available to customers in January 2011.
The Cortex-A9 Processor Optimization Packages contain three elements: ARM Artisan optimized logic and memory physical IP for a specific process technology, supported by implementation knowledge and ARM benchmarking.  Combined together the POP allows SoC designers to optimize Cortex-A9 designs for maximum performance, lowest power or to develop customized solutions balancing power and performance for their specific application.

– Overall semiconductor IP market overview

The key players listed by the market researcher MarketsandMarkets (with ChipEstimate.com links wherever possible, where “Prime IP Partners” are highlighted in bold) are the following companies:

ARM Holdings Plc (UK)
Atmel Corporation
CAST Inc.
CEVA Inc. (Israel, Choice IP Partner)
Coreworks S.A. (Portugal), but see Homepage, Technologies, Products, Rapidity
Dolphin Integration Inc.
Imagination Technologies Inc.
Lattice Semiconductor, but see its IP website
Mentor Graphics, Inc.
MIPS, Inc., but see Processor Cores, Interconnect IP, and MIPS Alliance
MoSys, Inc., but see unparalleled bandwidth performance for next gen networking systems
NXP Semiconductors N.V
Rambus, Inc.
Silicon Image, Inc.
Synopsys, Inc.
Tensilica, Inc. (Choice IP Partner)
Triad Semiconductor, Inc., but see Mixed Signal ASIC, Engagement ModelIP Catalog, ARM Powered VCAs
VeriSilicon, Inc. (Choice IP Partner)
exited: Wipro-NewLogic, Inc., but see RivieraWaves (France) as a successor
 
Notes:
  1. ChipEstimate.com Chip Planning Portal Overview
    The ChipEstimate.com chip planning portal is an ecosystem comprised of over 200 of the world’s largest semiconductor design and verification IP suppliers and foundries. These companies all share in the common vision of helping the worldwide electronics design community achieve greater profitability and success. To date, a diverse global audience of over 27,000 users has joined the ChipEstimate.com community and has collectively performed over 100,000 chip estimations. ChipEstimate.com is a property of Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation.
  2. Reasons for missing Coreworks S.A, Lattice Semiconductor, Mentor Graphics, Inc., MIPS, Inc., and MoSys, Inc. on the ChipEstimate.com portal are quite diverse. You can find them via the additional linked explanations, typically marked as “but see”.

Overall the summary of the Semiconductor Intellectual Property Market, Silicon IP Market (2012-2017): Global Forecasts & Analysis [MarketsandMarkets, April 2012] states that:

The growth trend of the Semiconductor IP market revenue can be observed by the CAGRs over various time periods. The CAGR of the Semiconductor IP market from 1997 to 2002 was 17.82% while the value from 2002 to 2007 stood at 11.54%. Post 2007, the market again picked up growth and the forecasted CAGR from 2012 to 2017 is estimated to be 14.47%. In 2012, the global Semiconductor IP market is estimated to be $2.90 billion. The percentage share of Semiconductor IP industry in the global revenue for semiconductors was approximately between 0.3% and 1.0% over the years; stood at 0.71% in 2011, and is estimated to increase to 0.85% by the end of 2012 and 0.99% by the end of 2017.

In the Analyst Briefing Presentation of the same report it is stated that:

Coming to the statistics, in 2011, the global Silicon IP Market stood at $2.25 billion, while the global semiconductor industry revenue was at $315 billion. Both these markets are estimated to reach $2.90 billion and $340 billion respectively by the end of 2012.

which means that while the global semiconductor industry is expected to grow just 6.3% this year the Semiconductor IP Market is estimated to grow by 28.9% ! So the latter is quite healthy although still a tiny part of the whole industry.

Gartner presented last year the following, revenue based Semiconductor IP Market view:image
Source: Synopsis Investor Day 2011 presentation, referring to a Gartner, March 2011 report

Note that the $231.6M semiconductor IP revenue was just ~15% of the CY2010 overall revenue (~1.5B estimated at max) of Synopsis where Core EDA (Electronic Design Automation) was and is the bulk of the revenue by far: Core EDA revenue was $959M in FY2010 and $980.7M in FY2011. Relative to that the overall Semiconductor IP segment was and is a double digit growth area for Synopsis. Since the company is following a strong “M&A strategy to broaden TAM and provide incremental revenue growth” in non-Core EDA areas the semiconductor IP revenue will probably grow at the same pace in the coming years. Therefore its #2 position will be maintained on this market, especially as it has almost no competitors (only Mentor Graphics IP) among Top 10 (those companies having not less than 71.1% share of market), while the #3 Imagination Technologies’ strongest competitor is the #1 ARM Holdings, as well as the strongest competitor of the #4 MIPS Technologies is the same #1 ARM Holdings.

So overall the market is quite mature, with well established and strong leaders already having the most of the business for themselves. The #1 ARM Holdings is also having a strong ecosystem of its own, which is providing opportunities for not less than 53 small silicon IP vendors outside the Top 10 as well. See: SoC IP [providers in ARM Connected Community Program].

I’ve edited a more descriptive list of that in PDF, which you can download from here. Below I’am providing an excerpt from that, with strongest players in ARM’s own ecosystem in the sense of relying on ARM’s Artisan Physical IP via the IPNet Partner Program (denoted by +) and/or TSCM IP Alliance Program (denoted by *):

Analog Bits*: the leading supplier of low-power, customizable analog IP for easy and reliable integration into modern CMOS digital chips. Our product range includes precision clocking macros such as PLL’s & DLL’s, programmable interconnect solutions such as multi-protocol SERDES/PMA and programmable I/O’s as well as specialized memories such as high-speed SRAMs and T-CAMs.
Low Power Wide Range PLL – Common Platform 32LP
Arteris*: Arteris invented Network on Chip technology, offering the world’s first commercial solution in 2006. Arteris connects the IP blocks in semiconductors from Qualcomm, Samsung, TI, and others, representing over 50 System on Chip devices. … Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech.
C2C™ Chip to Chip Link™ Inter-chip Connectivity IP
FlexNoC Network-on-Chip Interconnect IP
FlexWay Interconnect IP
Aurora VLSI, Inc. +: provides AMBA specification-based SoC/ASIC IP components, peripherals, subsystems, and platforms. … Aurora provides a full set of popular communications and SoC IP cores for ARM and AMBA Bus-based SoCs.
AMBA Peripherals- Ethernet, PCI, USB, IEEE1394, memory and flash controllers, interrupt controller, timers, counters, GPIOs, etc 
AMBA SOC Platform (Configurable)
AuthenTec*: a leading provider of mobile and network security. … AuthenTec’s products and technologies provide security on hundreds of millions of devices, and the Company has shipped more than 100 million fingerprint sensors for integration in a wide range of portable electronics including over 15 million mobile phones. Top tier customers include Alcatel-Lucent, Cisco, Fujitsu, HBO, HP, Lenovo, LG, Motorola, Nokia, Orange, Samsung, Sky, and Texas Instruments.
SafeXcel™ IP-06 KASUMI Crypto Core Family
SafeXcel™ IP-115 HDCP2 Content Protection Crypto Module
SafeXcel™ IP-123 Secure Platform Crypto Module
SafeXcel™ IP-154 Public Key Infrastructure Cores
SafeXcel™ IP-16 3DES Crypto Core Family
SafeXcel™ IP-160 MACsec Security Engine w/ Classifiers
SafeXcel™ IP-18 CAMELLIA Crypto Core Family
SafeXcel™ IP-197 Inline Security Packet Engine
SafeXcel™ IP-28: Public Key Accelerator Cores
SafeXcel™ IP-3X AES Crypto Core Family
SafeXcel™ IP-46 SNOW 3G Crypto Core Family
SafeXcel™ IP-48 ZUC Crypto Core Family
SafeXcel™ IP-57 HASH/HMAC Core Family
SafeXcel™ IP-60 MACsec Frame Engine
SafeXcel™ IP-62 MACsec/IPsec GCM Packet Engine
SafeXcel™ IP-76 True Random Number Generator
SafeXcel™ IP-97 Look-Aside Security Packet Engine
CEVA, Inc.*: the leading licensor of digital signal processor (DSP) cores, multimedia and storage platforms to leading semiconductor and electronics companies worldwide. … This portfolio includes a family of programmable DSP cores, DSP-based subsystems and application-specific platforms including multimedia, audio, Voice over Packet (VoP), Bluetooth, Serial ATA (SATA) and Serial Attached SCSI (SAS).
Application Platforms: for Mobile Multimedia Applications
The Only Silicon-proven Programmable Solution Supporting H.264 codec up to D1 resolution! … Complete, Low-Cost Audio Solution … Complete, Single Processor VoIP Solution
DSP Cores: The CEVA-X family of cores is based on CEVA’s latest pioneering DSP architecture. This architecture offers best-in-class performance, scalability, and lowest cost-of-development for DSP deployment … CEVA-TeakLite Architecture DSP core.
System Platforms: Broad set of DSP peripherals extendible through APB … tailored for specific cores of the CEVA-X architecture framework … High performance multimedia platform … CEVA-TeakLite Architecture DSP subsystems
Chips&Media,Inc. *: video codec technologies cover the full line-up of video standards such as MPEG-2, MPEG-4, H.263, H.264/AVC and VC-1 from CIF to HD resolution.
BODA7Series-HD Video Decoder IP
BODA9Series-Dual HD Video Decoder IP
CODA7Series-HD Video Codec IP
CODA9Series-Dual HD Video Codec IP
Denali Software, Inc. +: Databahn™ products provide optimal control and data throughput for external DRAM (DDR2, DDR3, LPDDR1, LPDDR2) and Flash memory devices.
Databahn NAND Flash Controller
Databahn(TM) PCI Express Controller IP Core
Databahn(TM) SDR/DDR1/DDR2/DDR3/LPDDR2 Solutions
eMemory Technology Inc. *: focused on the development of logic embedded non-volatile memory (NVM) such as OTP, MTP, and Flash. eMemory has published 186 patents. There are over 120 companies who have implemented our technologies and IP’s worldwide.
NeoBit
NeoFlash
Intrinsic-ID *: semiconductor IP and embedded software products based on Hardware Intrinsic Security. Our solutions revolve around patented Physically Unclonable Function (PUF) technology, where a secret key is extracted like a silicon biometric or fingerprint from silicon hardware directly and only when required.
Attackers have nothing to find because no key is stored nor present in the power down state. … Headquartered in Eindhoven, The Netherlands, Intrinsic-ID was founded in 2008 as a spin-out of Royal Philips Electronics and has been deployed in Philips’ production environment.
AES
HMAC-SHA-256
iRNG
Quiddikey™ in Hardware
SHA-256
Kilopass *
XPM: embedded, one-time programmable (OTP) non-volatile memory (NVM). … Over 70 customers have integrated XPM™ in over 200 designs from 180nm to 40nm. Applications range from a few hundred bits for unique ID to prevent cloning to multiple instances of 1Mb for program code storage.
PLDA, Inc. *: a leading provider of semiconductor intellectual property (IP) specialized in high-speed interconnect protocols and technologies.
AMBA 2 AHB to PCI Bridge
AMBA 2 AHB to PCI Express Bridge
AMBA 2 AHB to USB 3.0 Device
AMBA 2 AHB to USB 3.0 Host
AMBA 3 AXI to PCI Express Bridge
PCI Express IP Core with AXI interface
Rambus Inc. *: one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures.
XDR Memory: architecture … proven in high-volume, cost-competitive applications. Operating at 3.2Gbps, XDR DRAM provides 6.4GB/s of peak memory bandwidth with a single, 2-byte wide device.
Renesas Technology America, Inc. *
Renesas Application Specific Products: SoC Architecture for Multimedia Controller Chip. Features: Multiple ARM 9 cores, Graphic Controller on chip, USB on chip, Memory Card Interface, Standard high-performance MCU peripherals, JTAG. Easy to customize with proven architecture and IP.
Sidense Corp. *: Sidense Corp. provides secure, dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes, with no additional masks or process steps required and no impact on product yield. Sidense’s patented one-transistor 1T-Fuse™ architecture  provides the industry’s smallest footprint, most reliable and lowest power Logic Non-Volatile Memory IP solution and offers an alternative solution to Flash, mask ROM and eFuse in many applications.
SiPROM
SLP:
ULP
Silicon Image GmbH *+
Multimedia Platform IP: complete system solutions for Mobile Communication including MPEG-4 Encoding and Decoding for video chat and video conferencing applications. For Multimedia the offering incudes solutions for DVD Players and Set Top Boxes. Other leading edge technologies include a broad portfolio of security IPs and IP cores of professional networking applications.
Silicon Interfaces +
Silicon Cores – Core to the Intelligent Systems(TM): 12+ IP cores targeted to areas such as Networking, Wireless, Communication and Interconnect, and around 5+ Verification IPs using Industry standard Verification Methodology
Sonics, Inc. *+:  a pioneer of network-on-chip (NoC) technology and today offers SoC designers the largest portfolio of intelligent, on-chip communications solutions.
MemMax AMP: an intelligent Dynamic Random Access Memory scheduler designed for use with any AMBA AXI compliant bus fabric and memory controller.
MemMax Scheduler: an intelligent Dynamic Random Access Memory scheduler designed for use with an OCP compliant memory controller.
SonicsGN: Sonics’ 4th generation, configurable, on-chip network enabling the design of advanced SoC communications networks using a high-speed scalable fabric topology structure. As the industry’s highest frequency NoC available today, SGN allows SoC designers to deliver high-performance, simultaneous application processing for smart phones, mobile video and tablets.
SonicsLX: On-chip Network contains a high performance advanced fabric with data flow services for the development of complex SoCs.
SonicsMX: an actively decoupled, non-blocking, intelligent internal interconnect that enables designers to implement multiprocessor SoC architectures using combinations of similar or heterogeneous processing elements.
SonicsSX: On-chip Network contains a high performance, advanced fabric and a comprehensive set of data flow services for the development of complex, multicore and multi-subsystem SoCs.
Synopsys *+:  world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design, verification and manufacturing. … Synopsys is headquartered in Mountain View, California, and has more than 70 offices located throughout North America, Europe, Japan, Asia and India.
DesignWare Cores: Synopsys is a leading provider of high-quality, silicon-proven interface and analog IP solutions for system-on-chip designs. Synopsys’ broad IP portfolio delivers complete interface IP solutions consisting of controllers, PHY and verification IP for widely used protocols such as USB, PCI Express, DDR, SATA, Ethernet, HDMI and MIPI IP including 3G DigRF, CSI-2 and D-PHY. The analog IP family includes Analog-to-Digital Converters, Digital-to-Analog Converters, Audio Codecs, Video Analog Front-Ends, Touch Screen Controllers and more.
DesignWare System-Level Library: a portfolio of tool-independent transaction-level models (TLMs) for the creation of virtual platforms. Virtual platforms are fully functional software models of complete embedded systems enabling pre-silicon software development and software-driven system validation.

As one could there 18 silicon IP vendors with very strong (Artisan and/or TSMC IP Alliance) ties in ARM’s own ecosystem, and out of them 5 (AuthenTec, CEVA, Rambus, Silicon Image and Syopsys) are in the Top 10 group of providers.

With that we could finish the overall semiconductor IP market overview.


– The CEVA case

A lot of Silicon IP vendors are highly focussed. Probably the most successful among them is CEVA Inc. (Israel, Choice IP Partner):

CEVA DSP – Company Introduction [cevadsp YouTube channel, Aug 4, 2011]
CEVA, Inc. Announces Second Quarter 2012 Financial Results [CEVA press release, July 31, 2012]
… Total revenue for the second quarter of 2012 was $13.6 million, a decrease of 6% compared to $14.4 million for the second quarter of 2011. Licensing revenue for the second quarter of 2012 was $5.4 million, an increase of 3% compared to $5.2 million reported for the second quarter of 2011. Royalty revenue for the second quarter of 2012 was $7.6 million, compared to $8.3 million reported for the second quarter of 2011. Revenue from services for the second quarter of 2012 was $0.6 million, compared to $0.9 million reported for the second quarter of 2011.
Gideon Wertheizer, Chief Executive Officer, stated: “The second quarter was the strongest licensing quarter in more than three and a half years, driven by a strategic licensing agreement with a tier 1 handset OEM for a range of LTE handsets and the first agreement for our newest DSP, the CEVA-XC4000 for LTE- Advanced. These latest agreements bring the total LTE design wins for CEVA DSPs to date to more than 20, and form the foundation for future royalty growth. Finally, while the competitive 2G market is experiencing pricing pressure, our volume growth in the lucrative 3G market during the quarter significantly outpaced that of the overall 3G space, as low and mid-range 3G smartphones gain traction.” …
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA’s IP was shipped in over 1 billion devices and powers handsets from every top handset OEM, including HTC, Huawei, LG, Motorola, Nokia, Samsung, Sony and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
LTE-A Ref.Architecture [part of the Ceva-XC4000 product page, Feb 20, 2012]
CEVA-XC4000 multi-mode LTE-Advanced reference architecture
Based on multiple CEVA-XC4000 processors, CEVA offers a complete multimode LTE-Advanced reference architecture targeting LTE-A Rel-10 Cat-7. The reference architecture was developed together with mimoOn, a member of the CEVA-XCnet partner program and addresses the entire PHY layer requirements.
Reference architecture highlights:
    • A complete LTE PHY system architecture addressing the entire PHY layer requirements of multiple standards in software including: TD-LTE-A, HSPA+ Rel-9, TD-SCDMA, WiMAX and more
    • Built around CEVA-XC4000 processors with minimal complementary hardware accelerators
    • Offers industry’s most competitive SDR platform in terms of both cost and power consumption
    • Supports maximal throughput of LTE-A Rel-10 CAT-7 UE FDD (DL: 300Mbps, UL: 100Mbps) with up to 8×4 MIMO and carrier aggregation of up to two carrier components to a total of 40MHz channel
    • High operating margins enabling customer differentiation by software
    [See also the related press release, as well as the  CEVA Continues to Dominate DSP IP Market with 90% Market Share [May 14, 2012] press release]

    CEVA is also a best case for the trend determining the future of the semiconductor IP ecosystem, especially with the above “small print” example of a reusable LTE Advanced subsystem. More about the formation of such a trend you can find in the <<sticking with the “Goliath”>> section below.


    – When sticking with the “Goliath”: ARM Holdings Plc

    Then there are a number of vendors with an ecosystem of surrounding IP partners such as ARM Holdings Plc on the higher end (which we’ve already presented in the earlier, “Market Overview” section) and CAST Inc. on the lower one.

    Let’s examine the future of the semiconductor IP ecosystem through the eyes of these two companies. What they can offer strategically to their customers? Why customers are selecting the smaller and much less influential offerings from CAST against the “industry behemoth” ARM? What does it mean for a customer sticking with one against the other?

    Making IP work and getting the right SoC! [Global Semiconductor Alliance (GSA) Intellectual Property blog, July 18, 2012]

    Jack Browne, Vice President, Marketing, Sonics, Inc.

    Designers defining the next generation SoCs are adding more cores in pursuit of the ever increasing user experience. Whether for pacesetting smart phones, WiFi routers, or personal medical devices, making all this IP work as intended in the SoC requires system IP.  System IP includes the on-chip network, performance analysis tools, debug tools, power management and memory subsystems necessary for best in class SoCs. Whether used by the architect in the initial definition of the SoC or the layout engineer finalizing timing for place and route closure, system IP is critical to the design insuring that the capabilities of the SoC will meet the required end user experiences.

    For complex SoCs over 100 IP blocks may be included in a design.  Choices can be tough, with over a hundred IP vendors offering solutions, each with multiple products.  The System IP eases the design burden by supporting both IP blocks and subsystems with the necessary broad range of interface protocols, widths, frequency domains and power domains.

    System IP eases the challenges of maintaining a common software platform over multiple generations of SoC’s, built with varying IP cores and subsystems. Market research firm Semico, forecasts subsystem functions for computing, memory, video, communications, multimedia, security and system resource management. The increased abstraction from subsystems gives productivity benefit (leveraging use of commercial IP blocks) as well as differentiation through the integration of in-house IP blocks with standard industry IP blocks into reusable subsystems. A computing subsystem example would be ARM’s big.LITTLE CPU clusters where ARM does most of the integration ahead of time with the designer doing final configuration of features and/or number of coresAnother example would be faster communication subsystems like LTE advanced subsystems [we have already shown CEVA’s LTE-A Ref.Architecture above as the best example for that]. By customizing a 4G LTE advanced subsystem solution with internal technology, SoC design teams can differentiate from standard IP blocks using their internal expertise while leveraging the shared R&D benefits of merchant 4G IP subsystems.

    With the increasing cost of today’s SoCs, many are designed for multiple markets where not all of the functionality of the SoC is in use.  Many also have multiple usage scenarios within a given market, e.g. music playback on our smartphone. With the importance of battery life, managing the power of a SoC, including the ability to power off unused blocks, gives the best battery life.  Today’s 28nm SoCs are using dozens of power domains and even more clock domains to meet the performance and battery life requirements. By moving to system IP supporting hardware centric control of power transitions, end users will make more use of Dark Silicon (normally powered off) for better battery life as compared to interrupt centric software power management control.

    When starting a new SoC design, your choice of system IP is a key early decision as you have now selected the on-chip network, performance analysis tools, debug tools, power management and memory subsystems available for your design.  Making the right choice can provide a 2x benefit over other choices with regard to performance, power and cost, so make an informed choice.

    Foundry and IP Business Model: Alive and Well [Global Semiconductor Alliance (GSA) Intellectual Property blog, May 16, 2012]

    Dr. John Heinlein, Vice President, Marketing, ARM Physical IP Division

    … The IP ecosystem … is diverse and vibrant, with today’s IP providers offering many IP types, spanning a wide range of power, performance and area tradeoffs.  As an example, at 45 and 40nm various industry databases list between 450-620 licensable IP blocks available.  Furthermore, the latest IP developments at 45nm and 28nm include extensive power management capabilities, cost tradeoffs and implementation options that give designers choices for their chip.  Only through this ecosystem diversity can we have the rich and competitive landscape to address the many market segments the industry serves.

    Major technology investments are occurring across the foundry space, with new leading-edge R&D investments in fundamental process technology being made.  These investments span major companies like IBM, TSMC, Samsung, GLOBALFOUNDRIES, research consortia like IMEC and even new entrants like SuVolta, all of which are driving for aggressive technologies.  Today, 32 and 28nm products are in production and many more ramping to production.  Following that, there is a range of solutions already announced at 20nm that deliver the next node of planar bulk CMOS scaling.  Furthermore, the industry has clearly shown its commitment to investing in the next wave of 20nm and 14nm solutions beyond bulk ranging from FinFET to fully depleted SOI. …

    Clean Sweep at 28nm for ARM Artisan Physical IP [GSA Intellectual Property blog, Oct 11, 2011]

    John A. Ford, Director of Product Marketing, Physical IP Division, ARM

    On October 6th, UMC announced the selection of the ARM® Artisan® Physical IP Platform for the UMC foundry sponsored IP program. This new platform for UMC’s 28nm high-K metal gate (HKMG) process is a natural continuation of the long standing relationship between ARM physical IP division and UMC. ARM Artisan IP has been successfully used in millions of SoCs produced at UMC for more than 10 years on 180nm, 130nm, 90nm, 65nm and 55nm process technologies. The addition of UMC to ARM’s family of 28nm Physical IP platforms has a larger meaning than just a high quality set of IP on a technology-leading process. ARM Artisan IP is now the only physical IP platform available at all four of the 28nm commercial foundries in the world: TSMC, UMC, GLOBALFOUNDRIES, and Samsung.

    This makes good sense considering ARM’s expertise in physical IP optimization and years of establishing early foundry engagement on advance node IP development. ARM started work on physical IP for HKMG processes way back in 2008 with test chips and process qualification chips for IBM’s 32nmLP process. 32nmLP process was the first commercially available HKMG process and is now in high volume production at Samsung for smart phone, tablet and other applications. With millions of production SoCs at 32nm, 28nm is actually the 2nd generation of HKMG IP from ARM and includes all the critical design technique learning from 32nm development and production. ARM is deploying a full platform of standard cells, logic products, memory compilers and interface products at 28nm. Customers can benefit from being able to use consistent IP at all four foundries for the development of their SoC. With ARM’s exhaustive silicon validation process, customers have the assurance, peace of mind and confidence that only comes for using ARM IP.

    We’re not stopping there. ARM is now actively developing 20nm physical IP at both IBM and TSMC, with 5 test chips taped out starting in 2009 and several more planned for 2012 and 2013. By engaging early with foundries and developing IP in parallel with the process development, ARM ensures that designers can achieve the full entitlement of the technology, with a high degree of manufacturability. Foundries engage with ARM as a partner for early physical IP because of the long experience we have in developing physical IP on advanced process including CMOS SiON, CMOS HKMG and SOI. …

    ARM big LITTLE processing: Saving Power through heterogeneous multiprocessing and task content migration [chipestimate YouTube channel, June 18, 2012]

    Brian Jeff Product Manager at ARM. IP Talks speaker with ChipEstimate.com at DAC 2012 in San Francisco. ARM big LITTLE processing: Saving Power through heterogeneous multiprocessing and task content migration.
    From: Enabling Mobile Innovation with the Cortex™-A7 Processor [ARM whitepaper for TechCon 2011 by Brian Jeff, Oct 15 2011]
    Market requirements for high-end mobile
    High-end smartphones require high performance applications processors and graphics processors, but instantaneous performance requirements are highly elastic. During web browsing, for example, peak performance is required when pages are first rendered, but much lower levels of processor performance are required when reading or scrolling down a page. Similarly, applications have varying levels of performance requirements, typically requiring very high performance during launch, and low to moderate levels of required performance during at least some portion of runtime. For voice calls, the level of performance required by the applications processor is quite low, even on a high-end smartphone.
    Given the wide range of required performance, it would be ideal if the phone could use a very power efficient CPU some of the time, and migrate the context to a high performance CPU at other times. ARM has been researching this idea for several years, and has specifically designed the Cortex-A7 CPU not only to ideally fit all but the high-end performance requirements of a high-end smartphone, but also to be able to connect tightly with the larger and higher performance Cortex-A15 CPU in a coherent system. When connected together through AMBA Coherency Extension (ACE) interface a Cortex-A15 CPU cluster can be connected with a cluster of Cortex-A7 CPUs in a processor complex with a single memory map, hardware managed cache coherency, and the ability to run workloads on the large CPU cluster or small CPU cluster depending on instantaneous performance requirements. This concept created by ARM is called big.LITTLE processing.

    image

    big.LITTLE Processing
    Big.LITTLE refers to the coherent combination of High Performance and Power Efficient ARM CPUs A platform that contains both Cortex-A15 (big) and Cortex-A7 (LITTLE) can execute across a wider performance range with better energy efficiency than a single processor. Hardware coherency between Cortex-A15 and Cortex-A7 enables distinct big.LITTLE use models, either migrating context between the big and little clusters, or OS aware thread allocation to the appropriately sized CPU or CPUs. The CCI-400 cache coherent interconnect enables an extremely fast context migration between the big and little CPU clusters. Finally, software views the big and LITTLE CPU clusters identically, and transitions are managed automatically by OS power management or directly by the OS. The Net result of big.LITTLE power management is a platform with the peak performance of the Cortex-A15, and average power consumption closer to the Cortex-A7. This enables significantly higher performance at lower power than today’s high-end smartphones. The concept of big.LITTLE processing is only briefly introduced here; a more complete description of the ardware, software, and system implementation of big.LITTLE processing is covered in other TechCon resentations.
    From: Big.LITTLE Processing with ARM Cortex™-A15 & Cortex-A7 [ARM whitepaper by Peter Greenhalgh, Sept 15 2011]
    In general, there is a different ethos taken in the Cortex-A15 micro-architecture than with the Cortex-A7 micro-architecture.  When appropriate, Cortex-A15 trades off energy efficiency for performance, while Cortex-A7 will trade off performance for energy efficiency.  A good example of these micro-architectural trade-offs is in the level-2 cache design.  While a more area optimized approach would have been to share a single level-2 cache between Cortex-A15 and Cortex-A7 this part of the design can benefit from optimizations in favor of energy efficiency or performance.  As such Cortex-A15 and Cortex-A7 have integrated level-2 caches.
    Table 1 illustrates the difference in performance and energy between Cortex-A15 and Cortex-A7 across a variety of benchmarks and micro-benchmarks.  The first column describes the uplift in performance from Cortex-A7 to Cortex-A15, while the second column considers both the performance and power difference to show the improvement in energy efficiency from Cortex-A15 to Cortex-A7.  All measurements are on complete, frequency optimized layouts of Cortex-A15 and Cortex-A7 using the same cell and RAM libraries. All code that is executed on Cortex-A7 is compiled for Cortex-A15.
      Cortex-A15 vs Cortex-A7 Performance Cortex-A7 vs Cortex-A15 Energy Efficiency
    Dhrystone 1.9x 3.5x
    FDCT 2.3x 3.8x
    IMDCT 3.0x 3.0x
    MemCopy L1 1.9x 2.3x
    MemCopy L2 1.9x 3.4x

    Table 1 Cortex-A15 & Cortex-A7 Performance & Energy Comparison

    It should be observed from Table 1 that although Cortex-A7 is labeled the “LITTLE” processor its performance potential is considerable.  In fact, due to micro-architecture advances Cortex-A7 provides higher performance than current Cortex-A8 based implementations for a fraction of the power.  As such a significant amount of processing can remain on Cortex-A7 without resorting to Cortex-A15.

    big.LITTLE Task Migration Use Model
    In the big.LITTLE task migration use model the OS and applications only ever execute on Cortex-A15 or Cortex-A7 and never both processors at the same time.  This use-model is a natural extension to the Dynamic Voltage and Frequency Scaling (DVFS), operating points provided by current mobile platforms with a single application processor to allow the OS to match the performance of the platform to the performance required by the application.
    However, in a Cortex-A15-Cortex-A7 platform these operating points are applied both to Cortex-A15 and Cortex-A7.  When Cortex-A7 is executing the OS can tune the operating points as it would for an existing platform with a single applications processor.  Once Cortex-A7 is at its highest operating point if more performance is required a task migration can be invoked that picks up the OS and applications and moves them to Cortex-A15.
    This allows low and medium intensity applications to be executed on Cortex-A7 with better energy efficiency than Cortex-A15 can achieve while the high intensity applications that characterize today’s smartphones can execute on Cortex-A15.

    image

    An important consideration of a big.LITTLE system is the time it takes to migrate a task between the Cortex-A15 cluster and the Cortex-A7 cluster.  If it takes too long then it may become noticeable to the operating system and the system power may outweigh the benefit of task migration for some time.  Therefore, the Cortex-A15-Cortex-A7 system is designed to migrate in less than 20,000-cycles, or 20-microSeconds with processors operating at 1GHz.
    big.LITTLE MP Use Model
    Since a big.LITTLE system containing Cortex-A15 and Cortex-A7 is fully coherent through CCI-400 another logical use-model is to allow both Cortex-A15 and Cortex-A7 to be powered on and simultaneously executing code.  This is termed big.LITTLE MP, which is essentially Heterogeneous MultiProcessing.  Note that in this use model Cortex-A15 only needs to be powered on and simultaneously executing next to Cortex-A7 if there are threads that need that level of processing performance.  If not, only Cortex-A7 needs to be powered on.
    big.LITTLE MP is compelling because it enables threads to be executed on the processing resource that is most appropriate.  Compute intensive threads that require significant amounts of processing performance, as their output is user visible, can be allocated to Cortex-A15.  Threads that are I/O heavy or that do not produce a result that is time critical to the user can be executed on Cortex-A7.
    A simple example of a non-time critical thread is one associated with e-mail updates.  While web browsing the user will want email updates to continue, but it does not matter if they are done at CortexA15 performance levels or Cortex-A7 performance levels.  Since Cortex-A7 is a more energy efficient processor it makes more sense to take a LITTLE longer, but consume less battery life.
    Finally, as a fully coherent system can create a significant volume of coherent transactions, Cortex-A15, Cortex-A7 and CCI-400 have been designed to cope with worst case snooping scenarios.  This includes the case where a Mali™-T604 GPU is connected to one of the I/O coherent CCI-400 ports and every transaction is snooping Cortex-A15 and Cortex-A7 at the same time as Cortex-A15 and Cortex-A7 are snooping each other.
    From Combining large and small compute engines – ARM Cortex-A7 [by Brian Jeff on ARM SoC Design blog, Oct 19, 2011]
    The fourth and final thing is to ensure these engines work with a regular transmission.
    We needed to ensure there was a simple software approach to controlling the big.LITTLE switch consistent with power management mechanisms already in place. Current smartphones and tablet devices make use of Dynamic Voltage and Frequency Scaling (DVFS) and multiple idle modes for individual CPU cores and IP blocks in the application processor SoC. Our implementation of big.LITTLE modifies the back end of the driver which controls the processor’s DVFS operating point (for example cpu_freq in Linux/Android). Instead of three or four DVFS operating points, the driver now is aware of two CPU clusters each potentially with three or four independent voltage and frequency operating points, extending the range of performance tuning that existing smartphone power management solutions use. A big.LITTLE CPU cluster can be operated in a pure switching mode, where only one CPU cluster is active at a time under control of the DVFS driver, or a big.LITTLE heterogeneous multiprocessing mode where the OS is explicitly controlling the allocation of threads to the big or little CPU clusters and is thus aware of the presence of the different types of cores.

    ARM Cortex-A7 launch — Intro Simon Segars, President ARM Inc [US] [ARMflix YouTube channel, Oct 19, 2011]

    image

    ARM Cortex-A7 launch — Presentation, Mike Inglis, EVP & GM ARM Processor Division [ARMflix YouTube channel, Oct 19, 2011]

    The efficiency of the ARM architecture is the reason why ARM processors use less power and occupy a smaller footprint. The Cortex-A7 processor occupies less than 0.5mm2, using 28nm process technology, and provides compelling performance in both single and multicore configurations. Used as a stand-alone processor, the Cortex-A7 will deliver sub-$100 entry level smartphones in the 2013-2014 timeframe with an equivalent level of processing performance to today’s $500 high-end smartphones.

    image

    imageCortex-A7: Redefining Energy-Efficiency (DMIPS/mW)

    • Most energy-efficient applications processor
      ƒ- 5x the energy efficiency of mainstream phones
    • ƒPerformance to handle common workloads
      ƒ- >2x the performance of mainstream phone
    • Feature set and software compliant with Cortex-A15
      ƒ- Full backward compatibility
      ƒ- Scalable and extensible
    • Up to 20% more performance while consuming 60% less power

    From: Enabling Mobile Innovation with the Cortex™-A7 Processor [ARM whitepaper for TechCon 2011 by Brian Jeff, Oct 15 2011]
    The Cortex-A7 processor was designed primarily for power-efficiency and a small footprint. The design team based the pipeline on the extremely power efficient Cortex-A5 CPU, then added microarchitecture enhancements to increase performance and architectural enhancements to deliver full software compatibility with the Cortex-A15 CPU. These architectural enhancements include support for virtualization and 40-bit physical address space, and AMBA® 4 bus interfaces. Virtualization and large address space are unusual features for so small a CPU, but are critical to present a software view of the Cortex-A7 that is identical to the Cortex-A15 high-end CPU.
    Like the Cortex-A5, Cortex-A9, and Cortex-A8 processors that came before it, the Cortex-A7 processor is a full ARM v7A CPU, with support for the Thumb®-2 instruction set, optional 32-bit/64-bit floating point acceleration and optional NEON™ 128-bit SIMD architectural blocks. The Cortex-A7 also includes support for TrustZone® to enable secure operating modes which are increasingly important in modern mobile OEM designs. To bring higher scalability, the Cortex-A7 is also configurable as a multicore processor, supporting 1-4 cores in a coherent cluster.
    The Cortex-A7 is a simple in-order pipeline with significant but not complete dual-issue capability; however the careful choice of design features has enabled the performance of a single Cortex-A7 core to outperform the full dual-issue Cortex-A8 CPU on some important benchmark tests like web browsing, while consuming up to 60% less power.

    image

    Cortex-A7 Microarchitecture
    The roadmap below shows the legacy of Cortex-A class CPU designs, beginning with the Cortex-A8. In that design, ARM introduces the NEON SIMD architectural extension, and implemented a 2-way superscalar CPU that brought significant performance enhancements over the single-issue ARM11™. The Cortex-A9 extended the Cortex-A8 by bringing in MPCore capability for 1 to 4 CPU’s with cache coherency managed efficiently by a snoop control unit. The Cortex-A9 also introduced performance enhancements inside the core that brought a 20-30% performance increase over Cortex-A8 for a single core.
    image
    Cortex-A7 makes use of a simple 8-stage in-order pipeline, extended to include dual-issue capability on a reduced range of data-processing and branch instructions. Increased dual-issuing coupled with other microarchitectural improvements allow the Cortex-A7 to reach very good levels of performance with very low power consumption.
    image
    Other performance enhancing features include an integrated L2 cache, which reduces latency to L2 memory and external memory. The integrated L2 cache simplifies OS support as it uses system mapped registers and can be managed using CP15 operations rather than the memory mapped registers needed for an external L2 cache. Integrating the L2 cache controller also reduces the amount of area consumed by an external controller and enables a tighter integration of the controller with internal bus structures.
    The L2 cache controller itself was designed with low power in mind. The mechanism for looking up tags in the cache RAM includes consecutive tag followed by data lookup; similarly, the associativity is fixed at 8-way to balance performance against lookup energy. External requests are triggered on an L2 miss, rather than on speculative requests, to reduce energy.
    There are branch prediction improvements as well: the branch target instruction cache (BTIC) caches fetches after a direct branch and hides the branch shadow on tight loops.
    There are several improvements in memory system performance. The Load-Store path has been increased to 64-bits from the 32-bit path in the Cortex-A5. The external bus structure has been upgraded to 128-bit AMBA4 to improve bandwidth and introduce support for coherency extension beyond the 1-4 SMP cluster using AMBA 4 ACE.
    Energy Efficiency Features of the Microarchitecture
    There are several features of the L1 Memory system which reduce the power consumption of the CPU or the system. The merging Store-buffer after the write stage reduces data cache lookups. The 2-way set associative instruction cache trades off the slightly improved hit rate of a 4-way set associative cache for the reduced power on each lookup.
    Memory System Tuned to Minimize memory latency
    There are several performance optimizing features in the memory system. The address generation unit is shifted one stage back in the pipeline to enable a single cycle load-use penalty. The design team increased TLB size to 256 entries, up from 128 entries for the Cortex-A5 and Cortex-A9; this reduces page walks saving power and significantly improves performance for large workloads like web browsing with large data sets that span a large number of pages. Also, page tables entries can be cached in L1, improving the speed of page table walks on TLB misses. The bus interface unit has support for multiple outstanding read and write transactions. Finally, the physically indexed caches enable efficient OS Context switching.

    ARM Cortex-A7 launch — big.LITTLE demonstration, Nandan Nayampally, Director, Product Marketing [ARMflix YouTube channel, Oct 19, 2011]

    ARM Expands Processor Optimization Pack Solutions for TSMC 40nm and 28nm Process Variants [ARM press release, April 16, 2012]
    A Processor Optimization Pack solution is composed of three elements necessary to achieve an optimized ARM core implementation. First, it contains ARM Artisan® Physical IP logic libraries and memory instances that are specifically tuned for a given ARM core and process technology.
    This Physical IP is developed through a tightly coupled collaboration with ARM processor engineers in an iterative process to identify the optimal results. Second, it includes a comprehensive benchmarking report to document the exact conditions and results ARM achieved for the core implementation. Finally, it includes a POP Implementation Guide that details the methodology used to achieve the result, to enable the end customer to achieve the same implementation quickly and at low risk.
    “A single POP product can be applied to energy-efficient mobile, networking or even enterprise applications, providing a wide range of flexibility for ARM SoC partners to optimize performance and energy-efficiency while reducing risk in their designs,” said Simon Segars, executive vice president and general manager, Processor and Physical IP Division, ARM. “Only ARM can offer a complete roadmap of Processor Optimization Pack implementation solutions so deeply integrated and tightly aligned with ARM processor development activities now and into the future.”
    The summary below describes the existing and newly announced POP products for TSMC processes. ARM also incorporates the POP optimizations in hard macros of Cortex cores.
    POP availability by process technology
    TSMC 40LP
    TSMC 40 LP high speed options
    TSMC 40 G
    TSMC 28 HPM
    TSMC 28 HP
    ARM Cortex™-A5 Existing
    Cortex-A5
    New
         
    Cortex-A7
    New
    Cortex-A7
    New
     
    Cortex-A7
    New
     
    Cortex-A9 Existing
    Cortex-A9
    New
    Cortex-A9 Existing
    Cortex-A9
    New
    Cortex-A9
    New
         
    Cortex-A15
    New
    Cortex-A15
    Upcoming

    ARM Announces Cortex-A15 Quad-Core Hard Macro [ARM press release, April 17, 2012]
    Power-optimized implementation of quad-core hard macro on leading 28nm process
    ARM today announced the availability of a high performance, power-optimized quad-core hard macro implementation of its flagship ARM® Cortex™-A15 MPCore™ processor.  
    The ARM Cortex-A15 MP4 hard macro is designed to run at 2GHz and delivers performance in excess of 20,000DMIPS, while maintaining the power efficiency of the Cortex-A9 hard macro. The Cortex-A15 hard macro development is the result of the unique synergy arising from the combination of ARM Cortex processor IP, Artisan® physical IP, CoreLink™ systems IP and ARM integration capabilities, and utilizes the TSMC 28HPM process.
    The low leakage implementation, featuring integrated NEON™ SIMD technology and floating point (VFP), delivers an extremely competitive balance of performance and power and is ideal for wide array of high-performance computing applications for such as notebooks through to power-efficient, extreme performance-orientated network and enterprise devices. 
    The hard macro was developed using ARM Artisan 12-track libraries and the recently announced Processor Optimization Pack™ (POP) solution for the Cortex-A15 on TSMC 28nm HPM process. This follows the recent announcement of a broad suite of POPs for all Cortex-A series processors (see ARM Expands Processor Optimization Pack Solutions for TSMC 40nm and 28nm Process Variants, 16th April 2012)
    Full configuration and implementation details will be presented at the Cool Chips conference (18-20 April) in Yokohama, Japan. Further information is contained in an accompanying blog.
    “For SoC designers looking to make a trade-off between the flexibility offered by the traditional RTL-based SoC development strategy and a rapid time to market, with ensured, benchmarked power, performance and area, an ARM hard macro implementation is an ideal, cost-effective solution,” said Jim Nicholas, vice president of Marketing, processor division, ARM. “This new Cortex-A15 hard macro is an important addition to our portfolio and will enable a wider array of partners to leverage the outstanding capabilities of the Cortex-A15 processor.”
    See also:
    Squaring the circle – Optimizing power efficiency in a Cortex-A15 processor [Haydn Povey on SoC Design blog of ARM, April 17, 2012]
    Simplifying SoC’s with Hard Macros – New solutions for old problems [Haydn Povey on SoC Design blog of ARM, Oct 20, 2011]: “For me, the most important aspect of this talk was the public announcement of the availability of a new Cortex™-A5 Hard Macro for the TSMC 40nm Low Power node (40LP) which can achieve a whopping speed of over 1GHz in a tiny footprint of just 1mm2. … there will always be partners who need the full flexibility of RTL and POPs, but there is also a group for whom having a pre-integrated and hardened ready to run solution out of the box is the best route to market.”
    –  Hard Macro Processors [ARM product page, April 17, 2012]
    The ARM Hard Macro portfolio offers performance and power optimized hard macrocell implementations of the Cortex™-A series processors. For SoC designers looking to make a trade-off between the multifaceted flexibility offered by the traditional RTL based SoC development strategy and the significant costs and efforts it involves, the ARM Hard Macro portfolio is an exciting alternative that enables higher profitability through benchmarked PPA (Performance, Power, and Area), design risk reduction and faster time to market.

    ARM Hard Macros are available in a number of different implementation options with more being added.
    Currently the following options are available.
    Processor TSMC 40LP TSMC 40G TSMC 28HPM
    Cortex-A5 Single-core X    
    Cortex-A9 Dual-core   X  
    Cortex-A15 Quad-core     X
    Processor Optimization Pack™ (POP) solutions targeting ARM Cortex™ processors [ARMflix YouTube channel, April 16, 2012]
    ARM Artisan Physical IP Delivers Optimized Performance and Energy-Efficiency for ARM® Cortex™-A5, Cortex -A7, Cortex-A9 and Cortex-A15 cores.

    ARM Holdings Management Discusses Q2 2012 Results – Earnings Call Transcript [Seeking Alpha, July 25, 2012]

    If I look at physical IP, the story here is our physical IP is being used right across the different sectors that ARM’s processors are used in. We’re continuing with the processor optimization package activity. It was a record quarter for POPs. The best quarter we’ve had. So total of over 32 POPs sold now, still about a 50% attach rate with Cortex-A licensees, so that’s good in terms of generating royalty for the future.

    image

    [Note that here are only 13 companies shown out of those 32 POP licensees.]

    And also good in terms of generating royalty for the future is that this quarter, we had 4 new fabless semiconductor companies adopting ARM physical IP for their 28nm designs and beyond. So that is good for royalty growth going forward.

    Note: On the very first “Q2 2012 Highlights” slide one could see the following overall split:

    image

    The overall 77% share of processor division comprised of 31% licensing (the lighter blue)and 47% of royalties. So that is a pretty mature part of the business overall, although the Mail GPU part of it is still developing:

    Let’s — I should just highlight, we’ve got on the slide, of course, millions now of Mali devices as well, are going into those Cortex-A-based chips. And as far as Mali is concerned, then we are very much on track for the 100 million-plus units that we expect to deliver this year.

    as around 180 million Cortex-A units were shipped in the first half alone (see the graph in the next exerpt from the earnings call).

    The “Revenue Split Analysis” slide from the Appendix, however, is showing that due to the steadily growing application processor business (simply indicated Processor Division, PD) the share of the Physical IP business (simply indicated Physical IP Division, PIPD) was not growing for the last four years:

    image

    With extremely high interest in upcoming technologies of 28nm and beyond more and more Cortex licensees will (should) exploit the POP opportunity. Here is the low-end SoC market leader, MediaTek (Taiwan) example of its upcoming flagship products which should definitely use PoP as well for such a tight delivery schedule (considering the just 10 months availability of Cortex-A7 for licensing, i.e. ~15 months relative to Jan’13 SoC delivery vs. 2-3 years which were required previously):

    MediaTek a product roadmap leaked: Quad-core code-named MT6588 [MTK Smartphones Network (MTK手机网), July 27, 2012]
    Update: later was renamed and came to market as MediaTek MT6589 quad-core Cortex-A7 SoC with HSPA+ and TD-SCDMA is available for Android smartphones and tablets of Q1 delivery [this same blog, Dec 12, 2012]

    From a recently obtained electronic forum information abroad we see that the MT6585 code communicated earlier for the quad-core MediaTek smartphone chipset is wrong. The true model code is MT6588. It is built on the 28nm process in order achieve higher performance level than the dual-core MT6577 technology.
    MT6588 has a 4-core CPU [Cortex-A7 (!), see on the second slide below] clocked at 1GHz [1.XGHz rather, see the included slides below, as well the latest rumor about that being 1.7GHz or 1.5GHz], supports dual-channel at maximum 1066Mbps, has an integrated multimode modem for WCDMA [+ it is delivering HSPA+ WCDMA performance (!) vs just HSPA with MT6577/75, see the first slide below] and TD (!), that is it can support both Unicom [latest upgrade to HSPA+ service, see here] and China Mobile 3G network, supports an up to 13 MP camera and 1080P video playback. It finally has a GPU upgrade with SGX544, doubles the resolution to 1280×800 HD level, and has 32KB L1 cache and 1MB L2 secondary cache.
    Along the MT6588 there is a 28nm dual-core version, MT6583 on the MediaTek 2012 product roadmap. From the chipset parameters it is evident that MT6583 is a scaled down version of MT6588. It has 2 cores less, the camera support is 8MP, the video decoder is of 720P level, and the resolution is down to 854×480.
    It is understood that MT6588 and MT6583 will be in production in the first quarter of 2013, early next year the fastest.

    The MediaTek product roadmap

    MTK MT6588 chip Introduction

    MediaTek to launch quad-core smartphone solutions in 1Q13, says paper [DIGITIMES, Aug 6, 2012]

    MediaTek is expected to launch its first quad-core smartphone solution, the MT6588, in the first quarter of 2013, according to a Chinese-language Liberty Times report. The MT6588 features a quad-core 1.5GHz or 1.7GHz Cortex-A7 CPU, supporting WCDMA and TD-SCDMA technologies.

    The MT6588, which features a 13-megapixel camera, also supports 1080p video playback and a display resolution of 1280 by 800 pixels. The chip will be built using a 28nm process, the paper said.

    Additionally, MediaTek will also roll out a 28nm dual-core solution, the MT6583, during the same quarter. While the dual-core CPU of the MT6853 will also run at 1.5GHz or 1.7GHz, the chip will support a resolution of 854 by 480 pixels targeting a segment different from that of the MT6588, the paper indicated.

    Back to: ARM Holdings Management Discusses Q2 2012 Results – Earnings Call Transcript [Seeking Alpha, July 25, 2012]

    imageOne thing we are seeing is the value coming through in mobile, generally, the increasing number of smartphones, and within the smartphones themselves, an increasing number of Cortex-A products. And you can see a little histogram halfway down the slide, the top bar there is the ARM11. So ARM11 is still accounting for 40%, roughly, of the apps processors. And the Cortex-A is accounting for, roughly, 60% of the apps processors. But within that Cortex-A, you can see dual-core Cortex-A increasing significantly if you compare the situation with a year ago. And that’s good news from a value point of view for ARM as royalty, because typically these chips are more expensive. So single-core moving to dual-core and quad-core is a good trend for us. And note also, the underlying growth in sheer volume of our apps processors in smartphones. Don’t forget, with all this gloom and doom around, smartphones continues to be an area of significant growth for the business, and we’re looking forward to 30% thereabout growth in smartphones year-on-year so — for the year as a whole.
    ARM in MCU and Internet of Things
    imageGrowing standardisation around ARM in Microcontrollers
    – More than 100 companies have now licensed Cortex-M class processors mainly for microcontrollers, smart sensors and smartcards
    – Cortex-M0+ is ARM’s most energy efficient processor for microcontrollers
    Collectively, if you look at the line cards from the ARM partners, there are over 1,400 different ARM microcontroller products that you can go out and buy from ARM partners today. And that’s going to be a much bigger number by the time we’re all of that licensing that we’ve been doing gets into Silicon production.
    Earlier this year, we launched the Cortex-M0+ product … And again, at the Freescale technology forum, we saw an excellent demonstration of that power efficiency, where they literally had an ARM-powered charger, crank it up with a crank handle, charged a few capacitors up in the range of different microcontrollers and of course, the Cortex-M0+ went on and on and on. So that’s a great product.
    As far as the range of opportunities is concerned, it’s huge, and we’re starting to get design ins and as we start to get design ins, so more and more semiconductor companies are jumping onto the ARM-based microcontroller party. And they’re making these decisions in order to position themselves for the Internet of Things way.
    imageInternet of Things brings new opportunities
    – Combining radio technology with ARM-based microcontrollers and sensors
    – Huge range of applications, billions of opportunities
    – New products announced from Freescale, NXP and Toshiba in Q2

    In terms of volume shipments, at the moment then we saw another great quarter, where if we look year-on-year on microcontroller shipments up about 20% compared with industry shipments, up about 8%.

    Freescale: History & Future of “Internet of Things” – Design West (ESC) 2012 [ARMflix YouTube channel, March 28, 2012]
    Jim Trudeau, Solutions Technical Marketing from Freescale on the Cortex-M0+, the Internet of Things and Freescale’s Kinetis L Series
    See more: The Internet of Things, the ultimate mashup [Jim Trudeau on Software Meets Silicon blog of Freescale, April 17, 2012], published on ARM blog as “The Internet of Things, a Triad of Partners, and the Singularity of Change
    Implementing connectivity is where a company like Motomic Software comes into play. They bring Human Machine Interface (HMI) capability to a new arena. With connectedness comes the need for HMI to get smarter, to display what we really need to know when we need to know it in better ways. Take the lowly thermostat – as simple as its task, a traditional digital thermostat UI is typically confusing to use. A modern, simple UI in a “learning” thermostat can be quite simple. The contrast in complexity is startling as shown in Figure 1.
    Attached Image
    Figure 1: Contrasting Digital Thermostat UI
    Motomic Embedded Software Tools for IOT – Design West (ESC) 2012 [ARMflix YouTube channel, March 28, 2012]
    Motomic tells us about embedded software tools for applications focusing on Internet of Things, plus a demo of an embedded browser and media grid. http://www.motomicsoftware.com/
    See more: A Face for the Internet of Things [Mike Gee, CEO of Motomic Software, Inc. as a guest blogger on Embedded blog of ARM, June 11, 2012 ]
    … Motomic has created two browsers. Both browse and render HTML/CSS. Motomic’s µButterfly “microbrowser” runs in as little as ~320 KB Flash and 109 KB RAM. The Butterfly “minibrowser” is based on Qt, it supports features such as TrueType fonts, anti-aliasing and alpha blending. It requires 6+ MB of Flash. The RAM requirement depends on screen size and content requirements, starting around ~1 MB.
    Attached Image
    Both leverage the very low power requirements and very small footprints of ARM’s Cortex-M0+ and Cortex-M4 microprocessors that are too small to run a web browser such as WebKit, Chrome, Mozilla, etc. These small processors can now accurately render HTML/CSS content previously reserved for higher-end processors.
    Qt on Future’s WVGA display [MotomicSoftware YouTube channel, July 9, 2012]
    Nokia Qt for Freescale’s MQX real-time operating system on Kinetis K70 @ Future Electronics’ WVGA (800×480) PIM (Passive Intermodulation http://en.wikipedia.org/wiki/Intermodulation#Passive_Intermodulation) displays …. By adding Qt to MQX, you can: develop Qt-based applications for MQX, begin with the latest prebuilt, prevalidated, preintegrated Qt version, ready for your first deployment on one or more hardware platforms—you don’t need to build Qt, add splash screens with the world’s fastest animations, deploy Qt applications to your embedded devices automatically, leverage hardware optimizations and future-proof your hardware platforms. Motomic also lets you add media to MQX, for example advertisements or instruction videos. You can add social networking, games and browser functionality to your applications and products. Motomic helps you distribute your Qt application across networks.
    Development for the IoT is also being boosted by the Embedded Software Store. Motomic’s browsers and hundreds of other components for developing embedded software are accessible. Pre-built components allow solutions to be assembled more rapidly and with lower project risk. Complex systems can now be built rapidly by adding pre-built components.
    Innovative solutions like the Embedded Software Store (source of pre-built components for embedded developers), Motomic’s browsers, and ARM’s range of processors are allowing the creativity of developers to envision and build highly innovative solutions for the Internet of Things.
    ARM Embedded Software 2.0 [chipestimate YouTube channel, June 19, 2012]
    Will Tu, Director of Business Development at ARM. IP Talks speaker with ChipEstimate.com at DAC 2012 in San Francisco.
    See more:
    Advances in technology create new problems for today’s embedded developers [Will Tu on Software Enablement blog of ARM, Oct 12, 2011]
    Solving the Challenge of Software Complexity for Today’s Embedded Developer [Will Tu on Software Enablement blog of ARM, Oct 26, 2011]
    Avnet Electronics Marketing and ARM Launch Embedded Software Store [ARM press release, Oct 26, 2011]
    … Users can choose from a broad array of reputable embedded software vendors, including ARM, CMX Systems, Inc., DSP Concepts, Micrium, Motomic, YaSSL, and others. New software vendors are invited to join the initiative on an ongoing basis. The site also offers a quick download delivery system and preview of all license agreements in advance of purchase. Users are encouraged to participate in the Embedded Software Store’s online community to create a strong ecosystem of software support for ARM technology. … The site is fully operational and accessible at www.embeddedsoftwarestore.com

    AvnetEMA and ARM Launch Embedded Software Store [AvnetEMA YouTube channel, Nov 1, 2012]

    Watch a demo of the new Embedded Software Store

    Kinetis L Series & Energy Efficiency: FTF Keynote Demo [freescale YouTube channel, July 31, 2012]

    Freescale Debuts Kinetis L Series, World’s Most Energy-Efficient Microcontrollers [Freescale press release, Jun 19, 2012]

    Freescale Semiconductor (NYSE: FSL) is now offering alpha samples of its Kinetis L series, the industry’s first microcontrollers (MCUs) built on the ARM® Cortex™-M0+ processor. Kinetis L series devices are on display this week at the Freescale Technology Forum (FTF) Americas and were demonstrated during the event’s opening keynote address.
    As machine-to-machine communication expands and network connectivity becomes ubiquitous, many of today’s standalone, entry-level applications will require more intelligence and functionality. With the Kinetis L series, Freescale provides the ideal opportunity for users of legacy 8- and 16-bit architectures to migrate to 32-bit platforms and bring additional intelligence to everyday devices without increasing power consumption and cost or sacrificing space. Applications, such as small appliances, gaming accessories, portable medical systems, audio systems, smart meters, lighting and power control, can now leverage 32-bit capabilities and the scalability needed to expand future product lines – all at 8- and 16-bit price and power consumption levels.
    The ARM Cortex-M0+ processor consumes approximately one-third of the energy of any 8- or 16-bit processor available today, while delivering between two to 40 times more performance. The Kinetis L series supplements the energy efficiency of the core with the latest in low-power MCU platform design, operating modes and energy-saving peripherals. The result is an MCU that consumes just 50 µA/MHz* in very-low-power run (VLPR) mode and can rapidly wake from a reduced power state, process data and return to sleep, extending application battery life. These advantages are demonstrated in the FTF demo, which compares the energy-efficiency characteristics of the Kinetis L series against solutions from Freescale competitors in a CoreMark benchmark analysis.
    *Typical current at 25C, 3V supply, for Very Low Power Run at 4MHz core frequency, 1MHz bus frequency running code from flash with all peripherals off.
    Features common to the Kinetis L series families include:
      • 48 MHz ARM Cortex-M0+ core
      • High-speed 12/16-bit analog-to-digital converters
      • 12-bit digital-to-analog converters
      • High-speed analog comparators
      • Low-power touch sensing with wake-up on touch from reduced power states
      • Powerful timers for a broad range of applications including motor control
        The first three Kinetis L series families:
          • Kinetis L0 family – the entry point into the Kinetis L series. Includes eight to 32 KB of flash memory and ultra-small 4mm x 4mm QFN packages. Pin-compatible with the Freescale 8-bit S08P family. Software- and tool-compatible with all other Kinetis L series families.
          • Kinetis L1 family – with 32 to 256 KB of flash memory and additional communications and analog peripheral options. Compatible with the Kinetis K10 family.
          • Kinetis L2 family – adds USB 2.0 full-speed host/device/OTG. Compatible with the Kinetis K20 family.
            The Kinetis L series is pin- and software-compatible with the Kinetis K series (built on the ARM Cortex-M4 processor), providing a migration path to DSP performance and advanced feature integration.
            Availability and pricing
            Kinetis L series alpha samples are available now, with broad market sample and tool availability planned for Q3. Pricing starts at a suggested resale price of 49 cents (USD) in 10,000-unit quantities. The Freescale Freedom development platform is planned for Q3 availability at a suggested resale price of $12.95 (USD).
            For more information about Kinetis L series MCUs, visit www.freescale.com/Kinetis/Lseries.

            Kinetis L Series MCUs Built on the ARM Cortex-M0+ Core: What is the Plus For? [freescale YouTube channel, May 4, 2012]

            http://www.freescale.com/kinetis/lseries – This informative video will address what is new with the Kinetis L Series MCUs built on the ARM(R) Cortex(TM)-M0+ and what the plus really means.

            World’s Most Energy-efficient Processor From ARM Targets Low-Cost MCU, Sensor and Control Markets [ARM press release, March 13, 2012]

            RM today announced the ARM® Cortex™-M0+ processor, the world’s most energy-efficient microprocessor. The Cortex-M0+ processor has been optimized to deliver ultra low-power, low-cost MCUs for intelligent sensors and smart control systems in a broad range of applications including home appliances, white goods, medical monitoring, metering, lighting and power and motor control devices.
            The 32-bit Cortex-M0+ processor, the latest addition to the ARM Cortex processor family, consumes just 9µA/MHz on a low-cost 90nm LP process, around one third of the energy of any 8- or 16-bit processor available today, while delivering significantly higher performance.
            The Internet of Things will change the world as we know it, improving energy efficiency, safety, and convenience,” said Tom R. Halfhill, a senior analyst with The Linley Group and senior editor of Microprocessor Report. “Ubiquitous network connectivity is useful for almost everything – from adaptive room lighting and online video gaming to smart sensors and motor control. But it requires extremely low-cost, low-power processors that still can deliver good performance. The ARM Cortex-M0+ processor brings 32-bit horsepower to flyweight chips, and it will be suitable for a broad range of industrial and consumer applications.”
            The new processor builds on the successful low-power and silicon-proven Cortex-M0 processor which has been licensed more than 50 times by leading silicon vendors, and has been redesigned from the ground up to add a number of significant new features. These include single-cycle IO to speed access to GPIO and peripherals, improved debug and trace capability and a 2-stage pipeline to reduce the number of cycles per instruction (CPI) and improve Flash accesses, further reducing power consumption.
            The Cortex-M0+ processor takes advantage of the same easy-to-use, C friendly programmer’s model, and is binary compatible with existing Cortex-M0 processor tools and RTOS. Along with all Cortex-M series processors it enjoys full support from the ARM Cortex-M ecosystem and software compatibility enables simple migration to the higher-performance Cortex-M3 and Cortex-M4 processors.
            Early licensees of the Cortex-M0+ processor include Freescale and NXP Semiconductor. … The Cortex-M0+ processor is ideally suited for implementation with the Artisan® 7-track SC7 Ultra High Density Standard Cell Library and Power Management Kit (PMK) to fully capitalize on the ground-breaking low power features of the processor.
            The Cortex-M0+ processor is fully supported from launch by the ARM Keil™ Microcontroller Development Kit, which integrates the ARM compilation tools with the Keil µVision IDE and debugger. Widely acknowledged as the world’s most popular development environment for microcontrollers, MDK together with the ULINK family of debug adapters now supports the new trace features available in the Cortex-M0+ processor. By utilizing these tools, ARM Partners can take advantage of a tightly coupled application development environment to rapidly realize the performance and ultra low-power features of the Cortex-M0+ processor.
            The processor is also supported by third-party tool and RTOS vendors including CodeSourcery, Code Red, Express Logic, IAR Systems, Mentor Graphics, Micrium and SEGGER.

            Module 1: Kinetis-L Introduction and Overview of Features [AvnetEMA YouTube channel, Aug 3, 2012]

            Avnet Electronics Marketing presents a short overview of the ultra-low power, scaleable, feature-rich and easy — Cortex M0+ based Kinetis-L Series (32-bit ARM functionality with 8-bit ease-of-use)

            Module 2: Kinetis-L Ultra Low-Power Features [AvnetEMA YouTube channel, Aug 3, 2012]

            image

            More information:
            ARM Cortex-M0+: More than a low-power processor [Thomas Ensergueix on Embedded ARM blog, June 19, 2012]: “The Cortex-M0 MCU was quite unique when launched in 2009, offering a subtle mix of low-power, 32-bit performance and optimized code size, all of this packed in a very low gate count processor. … The new implementation of the very same ARMv6-M architecture with a 2-stage pipeline in Cortex-M0+ has given us 9% more performance while reducing the power consumption by around 30%.
            Introducing the ARM Cortex-M0+ processor: The Ultimate in Low Power [ARM whitepaper by Joseph Liu, May 4, 2012]
            ARM Cortex-M0+ Takes Flight on the Wings of Freescale’s Kinetis L Series [Danny Basler from Freescale as a guest partner blogger on Embedded ARM blog, March 14, 2012]
            FTF 2012 and Everything ARM [Drew Barbier on ARM Embedded blog, Aug 1, 2012]
            The Freedom Board [Erich Styger on Software Meets Silicon blog of Freescale, July 27, 2012]: “… my Freescale Kinetis L series Freedom board arrived. … The board will be available at Element 14/Farnell. It is expected to be publicly available by the end of September 2012, and you can pre-order now. The United States Element 14 site will have the board available for a suggested resale price of $12.95 (USD). In Europe it will be about 10 Euro. …
            Freescale ARM technology powerhouse in action [The Embedded Beat (all posts) blog of Freescale, June 19, 2012]: “Freescale has become an ARM technology powerhouse, offering the most unique and massively broad portfolio on the market today. It starts with our Kinetis portfolio, and the new Kinetis L series based on the ARM Cortex™-M0+ core, extends to the new Vybrid controller solutions [featuring a unique dual core ARM Cortex-A5 + Cortex-M4 architecture that handles both MCU and MPU tasks on a single chip] that enable rich apps in real time,  and stretches to the ultimate multimedia and display solution – the scalable i.MX 6 series [based on the ARM® Cortex™-A9 architecture].

            Continuing with the ARM Holdings Management Discusses Q2 2012 Results – Earnings Call Transcript [Seeking Alpha, July 25, 2012]

            We now have nearly 900 licenses, and so that continues to grow. The pool of licenses that are out there to generate royalties for the future. If I look at just quarter on its own, 23 licenses in total, collection of Cortex-A licenses, including our 12 big.LITTLE licensee. So we’ve now got 12 partners signed up for big.LITTLE. At the other end of this scale, the microcontroller end, I was just talking about the Internet of Things, yes, more licensing of our Cortex-M products.

            image
            And our new architecture, the v8 architecture, the 64-bit stuff, we’ve now got 9 v8 licensees, including the latest architecture licensee. And we’ve got this rather, it’s with — rather ill-defined horizontal axis of time going along the slide here. We are at the stage where we’ve done a lot of lead licensing now. We are approaching the first Silicon, the product launch type phase and so the 64-bit program is on track. And the interesting thing about our 64-bit architecture, it is not just about high-end computing and servers, it’s actually people talking about using it and the mobile as well, talking about using it in infrastructure applications, some of the networking applications that I talked about a moment or 2 ago.

            ARM in Networking and Servers

            • imageLeading networking companies choosing ARM processor technology
              – Another v8 architecture licensee for intelligent networking applications
              – Freescale announced their first ARM-based chip for infrastructure applications
              – HiSilicon, LSI, TI and Xilinx have already announced ARM-based chips for networking
            … these smartphones, computers and everything, they have — they communicate and that communication means that they’re getting data from somewhere or they’re sending data somewhere. They’re sending over some data handling infrastructure. And the explosion in smartphones and more mobile computing and prevalence of the Internet is generating much more data. Some study suggests as much as 20x as much data over the sort of 10-year period from 2010 to 2020. And clearly, if that data is handled with the existing architecture, it’s going to consume 20x as much power, which is not a very sustainable situation. If you look at all the electricity generated in the world, then IT equipment accounts for about 10% of it, and if that is going to increase by a factor of 20, then we’ll going to have to build a lot more power stations. So that isn’t going to happen. People are going to look for more power efficient ways of designing this stuff, and here is the opportunity for ARM in networking. And so you see, as I mentioned a moment ago, a new v8 architecture licensee engaged in ARM in networking.
            Freescale, I wasn’t there, Freescale technology forum a few weeks ago. Freescale busy announcing their extensive networking product range, switching to adopt the ARM architecture. We’ve seen similar indications from HiSilicon, LSI, TI, Xilinx and so on. Everybody is realizing that in order to get more power efficient products here, then ARM is a great solution. imageAnd it’s the same power efficiency story, which is behind ARM’s activity in servers.
            • Servers bringing new opportunities
              – Dell launches ARM-based server with 48 quad-core chips by Marvell
              – Calxeda demonstrated 15x power/performance improvement
              – Canonical announces server grade software for ARM-based chips

            ARM Holdings Management Discusses Q2 2012 Results – Earnings Call Transcript, Question-and-Answer Session [Seeking Alpha, July 25, 2012]

            Unknown Analyst … you’ve been talking about 64-bits sort of v8 architecture taping out relatively soon. Maybe you could — if you could give us a bit more details on what type of products would come on the market in the next 12 months for these 64-bit, if it’s only servers and other things.

            D. Warren A. East

            … On the second question, about 64-bits, then as I said in the presentation, it’s being used across a range of different applications, including mobile and computing. Servers is a very visible application area, where as we’ve said before, our penetration in the server market is limited until such time as we deploy 64-bit solutions. And I think it’s well known that one of our early 64-bit architecture licensees is targeting server applications and so probably, you’ll see that Silicon fairly early on. If we move along and move back.

            Unknown Analyst I think, Calxeda provided some interesting milestones this quarter in terms of the server progress. I’m just wondering, whether you can talk to how you feel the progress is going there in terms of actual sort of processing. Secondly, I just wondered whether — part of interesting slide just on the multi-core effect in the quarter, I just wondered, whether you have a sense of how much of your units shipped in mobile today is actually on quad-core based devices, versus dual-core, so the impact of quad-core presumably is still to come.
            D. Warren A. East
            Okay. On Calxeda and the server activity, I really don’t have anything else to say. We’re very pleased with the progress. The data that’s coming out suggests that all the experiments that we did before and all the simulation that we did before is being proven in Silicon. And bear in mind, this first Calxeda Silicon is actually Cortex-A9 based. And so I think I said Cortex-A9 was a core we developed very much with mobile in mind. Calxeda have added System-on-Chip infrastructure to turn into a server chip but it’s still a microprocessor core that was designed for mobile. When you put that server infrastructure around the microprocessor core that’s been a bit more designed with server applications in mind, like for instance, Cortex-A15, or moving onto v8, then you’re going to see even better performance at these levels of power consumption. But we’re very pleased with the data that’s come out so far. We’re also pleased to see other ARM Silicon partners starting to get a bit more public with their activity on the servers. The dual-core, quad-core, I don’t know that I can talk specifically about numbers, but I’ll just point you to shows like Mobile World Congress and CES, where what tends to happen is that you sort of have an announcement about products 1 year, and they turn into reality the next year. And we saw in the 2011 season, a load of dual-core devices being announced and they’ve now sort of materialized into phones. And it was about a year later at these shows that we saw the quad-core products announced and so we’d expect that sort of trajectory to continue. Over and above that, some people have gone a little bit further ahead with the quad-core and they’re using it as a sort of marketing tool and saying that the quad is better than dual. It’s a bit of a marketing thing. And it’s up to us semiconductor partners to see what performance they can actually — for what performance for a given level of power consumption they can actually achieve. We put it up on the slide as multi-core, and put the 2 together, because that’s really how we view it.

            Kai Korschelt – Deutsche Bank AG, Research Division
            … just on a like-for-like perspective, if you could remind us maybe of the potential royalty premium for a 64-bit versus 32-bit, please?

            D. Warren A. East

            … On 64-bit premium for — or sort of royalty premium for 64-bit, I mean this is a continuation of the trend we’ve been on for a while, where, basically, if there’s more value in the microprocessor, they royalty comes through with a higher rate. And we’ve talked about Cortex-A being sort of typically in the sort of 1.5% to 2% range, compared with preCortex-A being more in the sort of 1% to 1.5% range. And that trend will continue with our v8 architecture, so it’s going to be at the higher-end of that range.

            ARM Holdings Management Discusses Q2 2012 Results – Earnings Call Transcript [Seeking Alpha, July 25, 2012]

            64-bit, Physical IP and FinFET

            • TSMC and ARM announce collaboration to optimise ARM’s 64-bit processors and Physical IP and TSMC’s FinFET technology
              – Optimization of ARM’s next generation processors and TSMC’s state of the art process technology
              – Companies’ joint work will accelerate the adoption of SoC optimized FinFET technology
              – Allows ARM’s and TSMC’s partners to develop market leading products for high-performance and low-power applications like mobile and enterprise

            Now looking ahead to a more leading edge technologies, as I said, we had an announcement earlier this week with TSMC, and this is ARM and the biggest independent semiconductor wafer fab or foundry company in the world getting together to actually continue work that’s been ongoing together for quite a long time, in terms of optimizing their process technology, working with physical IP division to optimize our physical IP on their new FinFET process, and using our new 64-bit processor as a vehicle for that development. So it’s world leading companies getting together to work from transistors right through its microprocessors to enable our joint partners to produce world leading products.

            ARM Holdings Management Discusses Q2 2012 Results – Earnings Call Transcript, Question-and-Answer Session [Seeking Alpha, July 25, 2012]

            Unknown Analyst

            … So on the FinFETs with TSMC, can you give us, maybe a bit more comments about this? How do you think it compares with Intel 3D, or whatever they call it? And how involved your PIPD team is involved trying [ph] to transistors characteristics, absorbs transistors? And also, I think the timing has been brought forward by 1 year, I think. So that’s the first question. …

            D. Warren A. East
            Dealing with the FinFETs first. A year or so ago, when Intel took technology, we said yes. So this is something which has been around in the semiconductor industry for the last decade or more. It’s one of the ways of making transistors more efficient, but it comes with a load of associated challenges that are actually making this stuff and making them yield and that sort holds back the semiconductor industry from taking that step. Intel took the step and announced that they’ve taken the step. They were the first ones over the gate, announcing that they were doing this. Of course, everybody else has been the same, researching it and playing with it for the best part of the last decade. And TSMC had their plans in place. They just were not choosing to go public on FinFET until they were choosing to go public. And we’ve been working with TSMC on their next-generation processes for some time. We always stood here and done presentations and talked about tape outs on 20nm, the first ARM tape out on 20nm was well over a year ago. We’ve taped out first 40nm designs already with some of these players and its R&D activity. As and when the foundry wants to make some of these things public, then they will, and that’s what TSMC have chosen to do this week. And they chose to, I guess, communicate particularly with their customers who are ARM partners by saying, “Not only are we doing some process development in the back room, but we’re also thinking about how you’re going to take this technology to market, the sort of products you’re going to built with it. You’re probably going to build ARM-based products with it, and so we’ve been working with ARM and ARM’s physical IP division to make sure that their physical IP, their microprocessors and our semiconductor process technology, works well together. And that’s all there is to it.”

            Janardan Menon – Liberum Capital Limited, Research Division
            Two questions. One is on the FinFET agreement with the TSMC, it’s on 64-bit. So I’m just wondering what plans you have on moving the 32-bit, Cortex-A15 kind of products to FinFET? DO you have another agreement with them which we don’t know about and will the timing of the introduction of that be roughly the same as the 64-bit signed?

            D. Warren A. East

            Okay. Well, let’s answer the first one. The FinFETs, yes, the announcement is, with our 64-bit processor because just as we want to work with TSMC’s most advanced process technology, they want to work with our most advanced microprocessor, making a 20nm FinFET and later, a 16nm FinFET implementation so that our 32-bit processors will form naturally out of that development activity. We’re optimizing our physical IP to build microprocessors. We just happen to be using our new 64-bit processor as the vehicle for it. The same physical IP will be very easily used to implement our 32-bit processors.
            Janardan Menon – Liberum Capital Limited, Research Division
            And with your — as part of the timescale of introductions, is that a 2014 introduction or is it ’15?
            D. Warren A. East
            Well, we have to stick with the announcements for now. And I think as and when TSMC want to make more comments on when these things are available, then they’ll make more comments. As I said, from a development point of view, we’re taping out stuff all the time. …
            Sumant Wahi – Redburn Partners LLP, Research Division
            … The second question has to do with the FinFET again. Am I doing — most of the foundries are sort of offering different known transition and in between, I assume, a FinFET would be, an option in between 20nm and probably 16nm. So my question really was that, would you be licensing FinFET technologies separately as well, or is this an exclusive collaboration with TSMC? And then is there a royalty increase coming from products based on FinFET, PIPD, so to speak? …
            D. Warren A. East
            Okay. Next question was about FinFET and whether it’s essentially a different physical IP product from ARM. And the answer is, well, it’s a different flavor. We have different flavors of our physical IP for each semiconductor process. And so a low-power version of a given note is a different physical IP bundle than a high-profile version. And the FinFET is another flavor again. So it would be an incremental licensing opportunity. But the fact that our physical IP is used, would generate the royalty opportunity. But it’s not an incremental royalty opportunity. The fact that it’s FinFET, it’s just another flavor. So if we’re going to have a 20nm low-power plainer flavor and the FinFET flavor, and the chips are going to be made out of one process technology, and so the royalty opportunity is the same. …

            ARM and TSMC Collaborate to Optimize Next-Generation 64-bit ARM Processors for FinFET Process Technology [ARM press release, July 23, 2012]

            TSMC (TWSE: 2330, NYSE: TSM) and ARM today announced a multi-year agreement extending their collaboration beyond 20-nanometer (nm) technology to deliver ARM processors on FinFET transistors, enabling the fabless industry to extend its market leadership in application processors.  The collaboration will optimize the next generation of 64-bit ARM® processors based on the ARMv8 architecture, ARM Artisan® physical intellectual property (IP), and TSMC’s FinFET process technology for use in mobile and enterprise markets that require both high performance and energy efficiency.  

            … The ARMv8 architecture extends ARM low-power leadership with a new energy-efficient 64-bit execution state to meet the performance demands of high-end mobile, enterprise and server applications. The 64-bit architecture has been designed specifically to enable energy-efficient implementations. Similarly, the 64-bit memory addressing and high-end performance are necessary to enable enterprise computing and network infrastructure that are fundamental for the mobile and cloud-computing markets. 
            TSMC’s FinFET process promises impressive speed and power improvements as well as leakage reduction.  All of these advantages overcome challenges that have become critical barriers to further scaling of advanced SoC technology.  ARM processors and physical IP will be able to leverage these attributes to maintain market leadership, while the companies’ mutual customers can benefit from these improvements for their new, innovative SoC designs. …

            ARM and TSMC Sign Long-Term Strategic Agreement [ARM press release, July 20, 2010]

            ARM and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today jointly announced a long-term agreement that provides TSMC with access to a broad range of ARM processors and enables the development of ARM physical IP across TSMC technology nodes. This agreement supports the companies’ mutual customers to achieve optimized Systems-On-Chip (SoC) based on ARM processors and covers a wide range of process nodes extending down to 20nm. …

            ARM and TSMC Tape Out First 20nm ARM Cortex-A15 Multicore Processor [ARM press release, Oct 18, 2011]

            ARM and TSMC (TWSE: 2330, NYSE: TSM) today announced that they have taped out the first 20nm ARM® Cortex™-A15 MPCore™ processor. The two companies completed the implementation from RTL to tape out in six months using TSMC’s Open Innovation Platform® (OIP) 20nm design ecosystem.

            Building on this tape out, ARM will optimize its physical IP technology to specific TSMC 20nm process technologies for Power, Performance and Area (PPA), driving the specification of the Cortex-A15 Processor Optimization Pack (POP). TSMC’s 20nm process provides more than a 2X performance increase over preceding generations.

            FINFET: Has its time finally come for a sub – 20nm 3D device? [Jean Luc Pelloie Fellow Director of SOI Technology on the ARM SoC Design blog of ARM, Dec 21, 2011]

            … As we move to 20nm and beyond process technology, Fin-FET design may earn its place as the technology path of the future. … Fin-FET or tri-gate may be implemented on either bulk or SOI wafers.  … There is still work to be done, i.e. variability is expected to be different between SOI and bulk versions and needs to be quantified; … However, 3D devices are clearly on the road for sub-20nm nodes…and Fin-FET’s time may finally be here.

            Firms Rethink Fabless-Foundry Model [SemiMD (Semiconductor Manufacturing and Design), July 31, 2012]

            TSMC, for one, plans to accelerate its finFET efforts. Originally, TSMC planned to introduce finFETs at 14nm by late 2014. Now, the company has no plans to brand its finFETs at 14nm, but rather it will introduce the technology at 16nm. TSMC’s finFET “risk production” is slated for the end of 2013 or early 2014, with production scheduled for the second half of 2015, Chang said.

            Taiwan Semiconductor’s CEO Discusses Q2 2012 Results – Earnings Call Transcript [Seeking Alpha, July 19, 2012]

            … our 20 nanometer SoC, we believe, is fully competitive with industry leaders, other companies’ 22 nanometer for the served available markets that we serve. For our markets, we believe our 20 SoC is fully competitive with anyone’s 20 nanometer or 22 nanometer offering.
            And, one important point to make is that our 20 nanometer has the industry’s leading metal pitch of 64 nanometers. Our leading competitors have 80 nanometer metal pitch. That allows an advantage in the device’s density and die size.
            Now, as for the timing, we expect our 20 nanometer technology to be qualified by the end of this year and will be ready to support customers (inaudible) in Q1 of 2013.
            Now today, last time I mentioned that we will have a FinFET product after 20 SoC. And today, I’m glad to say that we have been planning the 16 nanometer FinFET. Right after our 20 nanometer (inaudible), which is the 20 SoC, we will offer FinFET at 16 nanometer for significant active power reduction. We expect to achieve speed and density, speed and logic density levels comparable to industry’s leading players 14 nanometer FinFET.
            So, we expect our 20 SoC to be competitive with competitors’ 22 nanometer or 20 nanometer products and we expect our 16 nanometer FinFET to be competitive with our competitors’ 14 nanometer FinFET products. You might ask why are we calling it 16. The only reason, in fact, until two days ago, we were undecided on whether to call it 14 or 16 FinFET. Now the only reason we decided to call it 16 FinFET is first, we want to be somewhat modest; second, we are told quite a few major customers ask the 16 FinFET, that designation and we didn’t want to confuse our customers by now switching to 14. But we expect it to be competitive with other people’s 14 nanometer offerings.
            Now 16 nanometer FinFET, our 16 nanometer FinFET, is expected to deliver about 25% speed gain given the same standby power over the 20 nanometer SoC. It is expected to give 25% to 30% power reduction at the same speed and the same standby power, and for mobile products, it is expected to give 10% to 20% speed gain at the same total power. As for timing, we expect it to be about one year after 20 SoC namely it should be ready for risk production at the end of 2013 or early 2014, about one year later than the 20 SoC.
            [from Q&A session]
            20-SoC which is 20-nanometer will ramp in 2014. And we believe that the 16 FinFET will ramp in, perhaps the second half of 2015. …

            – When sticking with a “David”: CAST Inc.

            Decreasing Risk When Selecting Third-Party Semiconductor IP (49th DAC) [castcores YouTube channel, July 17, 2012]

            In this presentation captured live at the 49th DAC (June 4, 2012), CAST president Hal Barbour describes ways electronic circuit and system designers can help ensure project success through careful selection of IP cores. Specific examples in the talk are drawn from CAST’s 18 years of semiconductor IP experience and include 8051 MCUs, H.264 and JPEG 2000 compression, and effective customer support for IP users. See more of CAST’s low-risk ASIC and FPGA IP product line and learn about the company at http://www.cast-inc.com. Or jump to these cores mentioned in the talk: • 8051 MCU – http://www.cast-inc.com/ip-cores/8051s/r8051xc2/index.html • H.264 Video – Encoder http://www.cast-inc.com/ip-cores/video/h264-mp-e/index.html • J2K Encoder – http://www.cast-inc.com/ip-cores/images/jpeg2k-e/index.html

            Leapfrogging The Competition Through Smart IP Selection [GSA Intellectual Property blog, March 30, 2012]

            Nikos Zervas, VP of Marketing, CAST, Inc.

            The adoption of a reliable design reuse methodology, proliferation of high-quality IP products, and shake-out of the most untrustworthy IP vendors creates a situation offering a huge potential advantage to system integrators and product designers looking to jump ahead of their competition.

            Instead of choosing the same big-vendor, star IP that most competitors may pick by default, smarter firms will seek out and commit to what might be technically-superior IP products from smaller vendors/partners who will offer both deeper and broader service and support.

            A good example is regarding microprocessors and controllers, the heart of most systems and usually the first, most critical system design choice.

            Consider a deeply embedded system that needs the power of a 32-bit processor. Much like that saying from the 1980′s that when choosing PCs “nobody gets fired for buying an IBM,” choosing a processor from the leading processor company is probably the easiest, safest choice, and it’s certainly an undeniably fine product with an extremely effective ecosystem. But making this choice might mean missing an opportunity for differentiation in a competitive market where every advantage is required for success.

            The IP portal sites list many 32-bit processor core options beyond the leading processor company, with Chip Estimate and Design and Reuse each returning nearly 300 results for such a search. More significantly, I count almost 30 different providers of these products. Certainly some of these vendors offer a product, support, or licensing terms—or perhaps even all three—that could give the smart designer a critical edge.

            Six of these stand out as being especially popular based on my recent visits with designers in California and Asia:

            • the AndesCore from Andes Technology,
            • the BA22 developed by Beyond Semiconductor and available from CAST, Inc. (disclosure: I work for CAST),
            • the ColdFire from IPextreme
            • the eSi-3250 from EnSilica,
            • the LEON3 from Aeroflex Gaisler, and
            • the MIPS 4KS and others from MIPS Technologies.
            How can you determine if options like these have sufficient benefits to outweigh the risk of not going with the leading processor company? Comparisons can be tricky, but there are a few key points to start with.
            The technical suitability and potential advantages of course depend on the detailed needs of your system. A good IP sales team will help you articulate the relevant characteristics of your project and make sure their product will work well before selling it to you.
            Quick comparisons of the performance and operating characteristics is made easier through the publication of well accepted power consumption and speed measures, like the CoreMark performance and CSiBC code density standards. Be sure, however, to look deeper to fully understand the specific configuration and technology details behind each vendor’s figures compared to that of your own target system.
            Ecosystems for programming and system development aids are a hot processor marketing topic. Be sure that the basics are covered: effective software programming tools such as the GNU tool chain, JTAG debugging, and ports of the RTOS or OS you want to use. A graphical IDE, support from tool vendors like Keil or Lauterbach, and eval/dev board kits are extras that can help further accelerate development.
            Licensing terms and actual costs can vary dramatically. For example, some vendors rely on royalty streams for their profits, while others have simpler up-front licensing fees with no royalties. What’s best for you depends on your specific product and market plans.
            Finally, credibility of the processor and the vendor are both crucial. For the former, look to successful use by other customers with applications similar to your own. For the latter, look for business longevity and general reputation, backed by your own experiences with the provider’s sales and engineering people. Try to extrapolate from a vendor’s pre-sale support how effective their integration help and other technical support services will be after you purchase from them.

            The examples of 32-bit processor alternatives I listed earlier all compare favorably with the leading processor company’s products in these factors; any might be the one to give you the extra technical, timeframe, or cost edge you need to make your product more competitive.

            The same is true of most other areas of semiconductor IP. Now that our industry embraces the use of third-party IP, the smartest designers will get a major payback from putting up-front effort into investigating the very best IP for their specific needs, whether that initially seems like the “safe” choice or not.

            (Note: all trademarks and registered trademarks mentioned here are the property of their respective owners.)
            About Nikos Zervas
            Nikos is the VP of Marketing for CAST, Inc. Before joining CAST in 2010, Nikos was a co-founder, chairman, and CEO of video/image SIP vendor Alma Technologies, SA [Pikermi, Greece]. He has been a member of the board for the Hellenic Silicon Industry Association since 2009, and he is a senior member of IEEE. Nikos holds BA and PhD degrees in Electrical and Computer Engineering from the University of Patras, Greece, and has published over forty papers in referenced journals and international conferences.
            Additional information:
            AndesCore™ from Andes Technology (founded in Taiwan in 2005) with AndeStar™ ISA:
            AndeStar is a patent-pending 16-bit/32-bit mixed-length instruction set to achieve optimal system performance, code density, and power efficiency.
            Freescale™ ColdFire Architecture IP
            Our extensive collection of ColdFire IP gives you the flexibility to choose the best solution for your cost/performance requirements while benefiting from the huge ecosystem of development resources available for the ColdFire architecture. Deployed in over 500 million devices worldwide, ColdFire is one of the world’s most widely-used 32-bit processor architectures. And the modern implementations of the ColdFire architecture, proven in devices from Freescale Semiconductor and available as synthesizable IP from IPextreme, provide performance and reliability that rival any similarly featured 32-bit processor IP.
            All ColdFire cores feature a variable-length RISC architecture for compact code and are supported by an extensive collection of development systems, tools, libraries, and operating systems from Freescale and several third-party commercial and open-source providers.
            Beyond BA22 Processor [Beyond Semiconductor web page, Dec 17, 2007] from privately held Slovenian fabless semiconductor IP company Beyond Semiconductor sold, supported, and built within platforms by CAST Inc. worldwide:
            Beyond BA22 Processor is the first implementation of Beyond BA2 Architecture processor. It’s main design goal was to minimize code size, gate and flip-flop count while obtaining similar performance as Beyond BA12 processor. The processor is extremely configurable, allowing for variety of size/performance trade-offs.
            Note: more Beyond BA22 related information is given later on as part of the CAST-related information
            eSi-3250 – 32-bit, high-performance CPU [EnSilica (UK) web page, Oct 11, 2009]
            EnSilica’s eSi-3250 CPU IP core is a high-performance processor ideal for integration into ASIC and/or FPGA designs with off-chip memories. The eSi-3250 is suited to a wide range of applications including running complex operating systems such as Linux.
            Scalability
            ImageFor applications that require do not require off-chip memory, the smaller eSi-3200 is available. For even simpler applications that do not require 32-bit performance or more than 64kB of memory, the eSi-1600 16-bit processor can be used. All of the eSi-RISC processors RTL and toolchains share a common code base, resulting in an easy migration path for both software and hardware developers, should the demands of an application change.
            LEON3 Processor [Aeroflex Gaisler (Sweden’s Gaisler acquired by US based Aeroflex) webpage, March 28, 2005]
            The LEON3 is a synthesisable VHDL model of a 32-bit processor compliant with the SPARC V8 architecture. The model is highly configurable, and particularly suitable for system-on-a-chip (SOC) designs. The full source code is available under the GNU GPL license, allowing free and unlimited use for research and education. LEON3 is also available under a low-cost commercial license, allowing it to be used in any commercial application to a fraction of the cost of comparable IP cores.
            MIPS32® 4KS™ Family [MIPS web page, Feb 28, 2003]
            The MIPS32® 4KSd™ secure data core is a high-performance processor that meets the needs of emerging secure data applications and the stringent power, security and size requirements for smart cards. This core has the performance required to implement software programmable cryptography without the need of a coprocessor, reducing SoC size and power consumption. The 4KSd core is the most secure, licensable, 32-bit processor available.
            End of additional information

            ChipEstimate.com DAC 2012 IP Talks presenter Nikos Zervas [chipestimate YouTube channel, June 21, 2012]

            Nikos Zervas, VP of Marketing, CAST. IP Talks presenter with ChipEstimate.com IP Talks at DAC 2012 in San Francisco. Leapfrogging Your Competition Through Smart IP Selection. For more information about CAST, go to: http://www.chipestimate.com/prime-partner/140/CAST-IP-Catalog

            Additional information:

            Meet Our New VP of Marketing [IP Notes from CAST, Inc., Sept 9, 2010]
            We’re very pleased to announce our new Vice President of Marketing, Nikos D. Zervas.
            Why did you join CAST?
            CAST has an industry reputation for being an IP vendor customers can really trust, with solid products and great support. Solving difficult technical challenges still excites me, of course, but my nine years working alongside CAST have shown me that having a passionate drive to help customers then earning the satisfaction of seeing those customers succeed can be just as rewarding.
            When the opportunity rose to join the impressive team at CAST, help grow the company, and further the ideal of easier design through IP, it seemed like the right time in my career for just such a move.
            What trends do you see for the IP market over the next year?
            Design reuse was become accepted for reducing risk and minimizing time to market. With this acceptance—and the fast-increasing rates of design complexity growth and design cycle shrinkage—I believe designers will move beyond specific functional cores to seek broader IP systems and complete solutions, like CAST’s recent H.264 Reference Design System. I think CAST is well positioned to supply this need, and that I can help them succeed with this next stage of growth.

            CAST Interview at DesignCon 2012 [castcores YouTube channel, Feb 14, 2012]

            EDACafe’s Graham Bell interviews CAST VP of marketing Nikos Zervas. Nikos discusses the new BA22 32-bit processor (http://bit.ly/ba22-32bit)—subject of a successful design seminar and booth demos at the show—as well as other recent new cores and the firm’s extreme commitment to customer support. Learn more about CAST at http://www.cat-inc.com.
            Fast JPEG Encoder Core from CAST Used in Fastec TS3 High-Speed Camera [CAST press release, March 6, 2012]
            Fastec Imaging Corporation has incorporated a JPEG Encoder IP Core from CAST, Inc. in its groundbreaking TS3™ line of handheld, high-speed digital cameras.
            ts3-shoot2-01 2 640x425.jpgSourced from long-time CAST partner Alma Technologies SA, the JPEG-E Encoder Core is one of the fastest-available baseline JPEG compression cores. This enables extremely competitive functionality for Fastec’s TS3 high-speed digital cameras, including capture of 1280 x 1024 pixel images at 500 frames per second, or 800 x 600 at 1,250 fps.
            “The quality of the core plus CAST’s ts3-shoot2-22.jpgdetermination to see us succeed were both instrumental in bringing our groundbreaking handheld high-speed camera, the TS3, to market on time and on spec.,” said Bob Sefton, principal FPGA design engineer at Fastec. “The JPEG encoder’s features and excellent performance were as specified, and the system integration was so easy I didn’t need CAST’s technical support services.”
            ts3-shoot2-302.jpgThe encoder core supports the Baseline Sequential DCT mode of the JPEG standard and is suitable for still-image or motion-JPEG capture. This third-generation core offers very fast JPEG compression—up to 750 MSamples/sec in a 65nm technology—yet is compact enough to fit low-cost FPGA devices.
            A bit-rate control option further benefits bandwidth-limited applications. “We envisioned demanding customer applications like Fastec’s when designing the JPEG encoder,” said Spyros Theoharis, vice president of products and technology at Alma Technologies. “It’s exciting to see yet another customer release of such a remarkable product using our technology and CAST’s support.”
            The JPEG-E core is part of a comprehensive family of image and video IP cores offered by CAST.

            A First look at the Fastec TS3 Camera [FastecImaging YouTube channel, May 30, 2012]

            TS3 slow motion nature footage shot at 720p at 718fps. Footage includes moving water, falling rocks and leaves in slow motion. Filmed and edited by Tom Guilmette.

            Butterflies caught on High Speed Camera [FastecImaging YouTube channel, May 30, 2012]

            Beautiful slow motion footage of colorful Butterflies caught on the Fastec TS3 High Speed Camera by Tom Guilmette at a local greenhouse

            Mentos and Diet Coke Geyser in Slow Motion [FastecImaging YouTube channel, July 6, 2012]

            Mentos and Diet Coke geyser shot with a Fastec TS3 100 High Speed Camera at 700 frames per second.
            The New Handheld TS3 100 High-Speed Camera [Fastec Imaging press release, July 10, 2012]
            Fastec Imaging, a leading global manufacturer of digital high-speed video cameras has, once again, taken the high-speed imaging world by storm with the release of the revolutionary new TS3 100 handheld high-speed camera. This portable, affordable, battery operated camera puts all the power of a high end, high-speed camera, in the palm of your hand!
            “We wanted to create a high-speed camera that was going to be easy to use, versatile and very portable, unlike many of the other cameras in this field,” explains Steve Ferrell, President of Fastec Imaging. “The TS3 combines the power, speed, resolution and light sensitivity of our renowned HiSpec camera line with the portability and ease of use of our previous handheld ‘point and shoot’ high speed cameras. The result is a completely portable and intuitive high-speed camera with the ease of use of a DSLR.”
            The TS3 100 captures 500 frames per second (fps) at 1280 x 1024 pixels and over 20,000 fps at reduced resolutions, making it the perfect high-speed camera for broadcast, research and industrial applications. Featuring a built-in 7’’ high resolution touchscreen LCD, the TS3 allows for instant playback of footage out in the field.  Combine that with an industry leading 4 hour battery, and it is easy to see why the TS3 100 is quickly becoming so popular.
            Unlike any other high speed camera on the market today, the TS3 100 offers unmatched versatility.  Not only is it an intuitive point- and-shoot handheld camera, but it can also be controlled over Gigabit Ethernet via a PC or MAC, or even over the Internet using a standard web browser for long distance control. The TS3 also features both USB ports and SD ports allowing users to easily download images to thumb drives, SD cards, or portable hard drives. Additionally, an optional built-in SSD, (Solid State Drive), provides for up to 256GB of non-volatile internal storage. This allows for shooting all day long without having to download to a computer.
            “The response to the TS3 has been overwhelming”, says Ferrell. “Its ease of use and affordability makes the TS3 one of the most accessible high-speed video cameras on the market and a perfect solution for researchers and manufacturers as well as TV and film producers.”
            For more information about the TS3 and other Fastec products, visit the web site at www.fastecimaging.com.

            Beyond BA22 Processor [Beyond Semiconductor webpage, Dec 17, 2007] from privately held Slovenian fabless semiconductor IP company Beyond Semiconductor:
            Beyond BA22 Processor is the first implementation of Beyond BA2 Architecture processor. It’s main design goal was to minimize code size, gate and flip-flop count while obtaining similar performance as Beyond BA12 processor. The processor is extremely configurable, allowing for variety of size/performance trade-offs.
            Embedded Processor Cores [Beyond Semiconductor webpage, May 7, 2007]

            ARM9™, ARM11™, ARM Cortex™-A9 and ARM Thumb®-2 are registered trademarks of ARM Holdings PLC.
            OpenRISC [Beyond Semiconductor webpage, Sept 1, 2007]
            Product Status – Obsolete
            OpenRISC was an open source hardware RISC CPU designed by Damjan Lampret, one of the contributors of OpenCores, released under the GNU Lesser General Public License. The OpenRISC OR1000 and OR1200 are no longer under active development, and are not recommended for new products.
            Beyond Semiconductor can provide commercial support for OR1000 and OR1200 processors.
            The Beyond BA12 Embedded Processor is an up-to-date, fully supported commercial version of OpenRISC, including many enhancements, integrated software development tool suite, development platforms and software debug tools.
            CAST and Beyond Semiconductor enter 32-bit Processor Core Partnership [joint press release, June 3, 2011]
            CAST to sell, support, and build platforms around the BA22 processor IP core from Beyond Semiconductor
            San Diego, CA – June 3, 2011, 48th DAC – Semiconductor intellectual property (IP) provider CAST, Inc. has reached an agreement with Beyond Semiconductor by which CAST will provide Beyond Semiconductor’s BA22 processor core worldwide.
            The BA22 is a fast, compact, power-saving, 32-bit RISC processor that CAST will offer without royalties. These capabilities plus easy development and integration features make the processor an excellent step up for CAST’s large base of 8-bit 8051 customers who need more processing power. In fact, the BA22’s programming code is so efficient that systems using it may require less silicon area than an 8051 with its respective code and memory.
            CAST will package the affordable BA22 with peripheral controllers and other essential IP. The initial focus is on deeply embedded systems; later platforms will exploit the processor’s scalability and performance potential to support broader applications.
            The platform approach gives customers a ready-to-use processor subsystem, and eases the transition to 32-bit processing for designers accustomed to similarly configured 8051 IP cores.
            The 8051 is still a good choice for many chips, but our experience with customers incorporating data-intensive functions like touch-based interfaces and high-res video makes it clear they really need a good 32-bit embedded processor,” said Bill Finch, CAST’s senior vice president for sales. “The silicon-proven BA22’s performance, tiny code footprint, and mature development tools make it a great choice for many new systems, while our 15 years of microprocessor IP experience and very attractive business model make CAST a great 32-bit processor provider.”
            “CAST has a long track record as a smart, effective, customer-focused IP team that makes them a perfect match for our products,” said Matjaz Breskvar, chief executive officer of Beyond Semiconductor. “Working with them will enable us to bring highly customizable Beyond BA22 to new designers across the world while providing ease of use and excellent customer support.”
            Limited availability of the BA22 from CAST begins now, with a full product roll out in the next quarter. IP integration services are also available.
            Learn more by visiting http://www.cast-inc.com/beyond or emailing beyond@cast-inc.com. Participants in the 48th DAC in San Diego, June 5–8, are welcome to stop by CAST’s booth (2217) to see a demo and discuss the advantages of the BA22.
            About Beyond Semiconductor
            Beyond Semiconductor is a privately held fabless semiconductor IP company. Its comprehensive product offering features 32-bit embedded RISC/DSP processors with the highest code density in the industry. For more information, visit http://www.beyondsemi.com.
            About CAST, Inc.
            CAST, Inc. is a privately held company that provides semiconductor IP products and services. The company features advanced image/video processing and microcontroller IP families, plus the memory controllers, high-speed buses, peripherals, and other functions needed to build complete systems. Learn more at http://www.cast-inc.com/.

            Background information:

            CAST IP for ASICs and FPGAs: Introduction and Overview [CAST presentation on SlideShare, July 2002], only images for certain slides are included below

            imageimage

            image

            imageimage

            imageimage

            BA22-AP: BA22 32-bit Application Processor [CAST datasheet, June 20, 2012]
            Implements a 32-bit RISC processor for demanding embedded applications that use offchip instruction and data memories and that may need to run a real-time operating system (RTOS) or a full operating system such as Linux or Android. Part of the royalty-free BA22 family, this processor core is extremely competitive in terms of high performance and low power consumption, and has best-in-class code density.
            The core has Instruction and Data Memory Management Units (MMUs) and Caches, dedicated buses for on-chip instructions and data memories, and an AMBA® AHB™ or Wishbone system bus interface. Optional floating point, divider and multiply–accumulate units benefit DSP applications. The core includes up to 32 general purpose registers (GPRs), a tick-timer (TTimer), a programmable interrupt controller (PIC), an advanced power management unit (PMU), and an optional debug unit (DBGU). Additional microcontroller peripherals may be ordered for pre-integration and delivery with the core, individually or in a complete platform. IP Integration Services are also available to help integrate any BA22 processor configuration with memory controllers, image compression, or other CAST IP cores.
            The processor’s BA2 instruction set is relatively simple and extremely compact. Programing is facilitated with the included C/C++ tool chain; Eclipse IDE; architectural simulator; and ported C libraries, RTOSs, and OSs.
            The BA22-AP synthesizes to 35k gates in a 90nm technology, can be clocked with more than 450MHz in a 65nm technology and provides as many as 1.59 DMIPS/MHz. The core is delivered, with a complete software development environment under Eclipse IDE, and its users get access to already ported real operating systems (Linux, Android, eCOS and uClinux) and libraries.
            The BA22 family of processors has been designed for easy reuse and integration, has been rigorously verified, and is production proven. Contact CAST Sales for details.
            Applications
            Internet, networking and telecom
            Portable and wireless
            Home entertainment consumer electronics
            Automotive

            Deliverables
            The core is available for ASICs in synthesizable HDL, and includes everything required for successful implementation:
            • Verilog RTL source code
            • Verilog Testbench
            • Silicon-proven Reference SoC/ASIC Design
            • Software development tools for Cygwin on Windows and Linux, with Eclipse IDE interface
            • Operating systems and board support package
            A reference design board running Linux and FPGA versions of the core are also available; contact CAST Sales for information.

            STMicroelectronics and Texas Intruments are exiting the mobile market as there is no chance to compete with aggressive SoC vendors from PRC and the market #2 MediaTek from Taiwan

            STMicroelectronics sees no future for itself in ST-Ericsson’s strategy of Fundamental repositioning for modem, APE and ModAps spaces as it announces new strategic plan [Dec 10, 2012]

            “Today we are announcing the new ST, aligned with the new market environment,” said Carlo Bozotti, President and CEO of ST. “Based on that, we have made the decision to exit ST-Ericsson after a transition period. We will continue to support ST-Ericsson as their supply-chain partner, advanced process-technology partner and application-processor IP provider.” 

            “Our new strategy is centered on leadership in sense and power and automotive products, and in embedded-processing solutions,” continued Bozotti. “Our specific focus is on five product areas: MEMS and sensors, smart power, automotive products, microcontrollers, and application processors including digital consumer. 

            In Embedded Processing Solutions the company will focus on the core of the electronics systems rather than on wireless broadband access. The Embedded Processing Solutions segment includes microcontrollers, imaging products, digital consumer products, application processors and digital ASICs. 

            As a consequence of the major changes that occurred in the dynamics of the wireless market, ST has taken the decision to exit ST-Ericsson after a transition period and is currently in negotiations on exit options. This disengagement process has started, with the transition expected to end during the third quarter of 2013. While no further details can be provided at this time, any option taken will be in line with the new financial model as presented by ST today.

            Ericsson, ST’s partner in joint venture, meanwhile reinforced its commitment to the modem part of the business with Ericsson starts negotiations on ownership of ST-Ericsson [Dec 10, 2012]

            ST-Ericsson announced its strategic plan in April 2012 and is in the middle of executing on company transformation aiming at lowering its break-even point and introducing new technologies.

            Ericsson continues to believe that the modem technology, which it originally contributed to the Joint Venture, has a strategic value for the wireless industry. For Ericsson, a key priority in this process is a successful market introduction of the new LTE modems that it is certain will be very competitive and needed in the market.

            During the process Ericsson will not speculate on the possible outcomes, timelines, and future ownership structures of ST-Ericsson.

            This led to ST-ERICSSON CONFIRMS STRATEGIC DIRECTION [Dec 10, 2012]

            ST-Ericsson confirmed today its strategic direction announced in April and continuing industrial and technology relationships with STMicroelectronics and Ericsson, following ST’s decision to disengage from ST-Ericsson after a transition period.

            “ST-Ericsson set a new strategic direction in April this year to develop competitive system solutions either directly or with partners. We have been executing steadily and aggressively on our strategy and delivered on our commitments,“ said Didier Lamouche, President and CEO of ST-Ericsson. “We have started to deliver integrated ModAp platforms to our lead customers and testing in-the-field of our cutting-edge LTE modem, as well as introducing a disruptive technology for the mobile market as we committed earlier this year.”

            ST-Ericsson continues its cooperation with Ericsson in the field of advanced wireless telecommunications to bring innovative and competitive modem solutions to the market.

            ST-Ericsson has started to work with customers and operators on testing its innovative LTE modem which is the core of its next NovaThor and Thor platforms. This follows extensive interoperability testing with Ericsson’s advanced network infrastructure as well as other network vendors.

            ST-Ericsson continues its cooperation with ST as its supply chain partner, advanced process technology partner and application processor IP provider.

            A NovaThor single chip modem and application processor based on ST’s advanced process technology has been sampled and confirms the breakthrough nature of the technology in terms of performance boost and ultra-low power consumption. Results of this cooperation will be demonstrated next month, with ST-Ericsson’s next generation NovaThor ModAp, at the upcoming Consumer Electronics Show in Las Vegas.

            ST-Ericsson will continue to work on delivery on its next generation technology and continuity in execution on customer commitments and supply.


            OMAP line being discontinued. What does this mean for the DM8148 family? [Answer from OMAP Embedded/EEE Marketing Manager on TI E2E Community, Nov 20, 2012]

            First let me clarify the OMAP product line is not being discontinued. We are changing the business strategy with OMAP moving away from smartphone/tablet/mobile market and focussing primarily on Embedded (including Automotive). This is consistent with communications earlier the quarter refer here [2012 Embedded Processing & Wireless investor meeting, Sept 25, 2012], In addition the announced actions [see below] to reduce costs is a implementation of the previously announced strategy to enable us to focus investment and resources and serve the embedded & automotive markets. In addition, consistent with our announced startegy to focus on embedded we announced at Electronica [see below next] with several module partners – OMAP 5 System on modules to enable embedded designs around OMAP.  OMAP processors will continue to ship and be supported for customer for years to come and will evolve around the strategy to focus on embedded & automotive.

            Texas Instruments will pull back its wireless business and retreat from smartphones and tablets, refocuses on embedded processing [The Dallas Morning News, Sept 25, 2012]

            A top Texas Instruments executive today said the company is pulling back its wireless business to refocus on new embedded processing products.

            Greg Delagi, head of TI’s embedded processing and wireless division, noted that the use TI’s chips in smartphones and tablets are “less attractive” given the emergence of a few large players and vertical supplier trends in those markets. That’s something other TI officials have been talking more about in the last several weeks.

            As a result, TI is “re-profiling its investments” in embedded processing and wireless because the research and development “needs to look different,” Delagi said.

            His comments came in a webcast of a TI meeting with financial analysts and investors in New York.

            Delagi said the company  plans to shift its focus — and R&D investments — into new embedded processing products, such as using its OMAP and other processors in industrial, automotive and home appliance applications.

            He wasn’t ready to disclose other details or a time frame yet, but noted that TI has shifted its investments before as it saw products become commoditized or other trends.

            The Dallas-based chipmaker combined its embedded [and] wireless businesses into one division in May.

            Although TI is a supplier to the latest Kindle Fire HD tablet, it has recently lost out to rivals on new Apple and Samsung smartphones.

            From TI reports financial results for 3Q12 [Oct 22, 2012]

            … Rich Templeton, TI’s chairman, president and CEO.  “Our core businesses of Analog and Embedded Processing each grew revenue by 2 percent.  Our operations were disciplined, with expenses and inventory levels both down, and our core businesses grew profit faster than revenue.”

            Regarding TI’s business model, which is focused on Analog and Embedded Processing, Templeton said, “These two core businesses now comprise 70 percent of our revenue.  The importance of this strategy shows in the strong cash that we generate even in weak markets and in our ability to return that cash to shareholders.  In the third quarter, our free cash flow exceeded $1 billion, and we returned more than 75 percent of it through dividends and share repurchases.  Our confidence in the long-term sustainability of our business model drove the dividend increase of 24 percent that we announced in the quarter.” 

            3Q12 segment results 

             
            3Q12
            3Q11
            Change
            2Q12
            Change
            Analog:
                     
                  Revenue
            $ 1,843
            $ 1,557
            18%
            $ 1,800
            2%
                  Operating profit
            $    460
            $    414
            11%
            $    437
            5%
            Embedded Processing:
                     
                  Revenue
            $    520
            $    539
            -4%
            $    509
            2%
                  Operating profit
            $      63
            $    113
            -44%
            $      51
            24%
            Wireless:
                     
                  Revenue
            $    325
            $    580
            -44%
            $    342
            -5%
                  Operating profit (loss)
            $    (53)
            $      78
            n/a
            $     (51)
            -4%
            Other:
                     
                  Revenue
            $    702
            $    790
            -11%
            $    684
            3%
                  Operating profit*
            $    370
            $    209
            77%
            $    161
            130%

            *  Includes Acquisition charges and Restructuring charges/other.

            Wireless: (includes OMAPapplications processors, connectivity products and baseband products)

            • Compared with both the year-ago and prior quarters, revenue declined primarily due to baseband productsRevenue from connectivity products also declined while revenue from OMAP applications processors increased.
            • Operating profit from the year-ago quarter became an operating loss due to lower gross profit.  The operating loss increased from the prior quarter due to lower revenue and the associated gross profit.

            TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets [Nov 14, 2012]

            Consistent with previously stated strategic plans, Texas Instruments(TI) (NASDAQ: TXN) announced today it will reduce costs and focus investments in its Wireless business on embedded markets with greater potential for sustainable growth. Cost reductions include the elimination of about 1,700 jobs worldwide.

            TI previously outlined intentions to focus its OMAP processors and wireless connectivity solutions on a broader set of embedded applications with long life cycles, instead of its historical focus on the mobile market where large customers are increasingly developing their own custom chips. These changes require fewer resources and less investment.

            “We have a great opportunity to reshape our OMAP processor and wireless connectivity product lines to concentrate on embedded markets. Momentum is already building with new embedded applications and a broad set of customers, and we are accelerating our efforts in these areas,” said Greg Delagi, senior vice president of Embedded Processing. “These job reductions are something we do with a heavy heart because they impact people we care deeply about. We will work closely with all employees affected by these changes to provide a range of assistance related to compensation, benefits and job search.”

            As a result of these actions, the company expects annualized savings of about $450 million by the end of 2013. Total charges will be about $325 million, most of which will be accounted for in the current quarter. TI’s fourth-quarter outlook, published on October 22, did not comprehend these restructuring charges.

            New OMAP™ 5 processor-based modules spur easier, faster industrial designs [Nov 12, 2012]

            Modules bring dual-core ARM® Cortex™-A15 prowess to systems that demand high-performance processing, rigorous real-time time control, advanced graphics, and fanless low power

            Expanding the OMAP™ processor footprint in embedded applications, Texas Instruments Incorporated (TI) (NASDAQ: TXN), together with six leading system-on-module (SoM) vendors, today introduced OMAP 5 processor-based modules designed to simplify and speed industrial development. Based on a dual-core ARM® Cortex™-A15 architecture which is complemented by an integrated DSP, dual Cortex-M4 cores and various on-chip accelerators, TI’s OMAP 5 platform supports next-generation industrial applications such as point of service, portable data terminals and more. Select modules are on display this week at Electronica, in TI’s booth (#420 in Hall A4).

            TI is committed to the expansion of OMAP processors into industrial applications that require long product life cycles, extended temperature and reliability, and real-time control and communication,” said Debasish ‘Ron’ Nag, manager of TI’s OMAP industrial business. “Our OMAP 5 processors meet rigorous industrial requirements and come backed by a support model that ensures protection and longevity of customers’ investments, solidified by our commitment to ship devices for 10 years following production. We are proud to work with top SoM vendors to ease and speed industrial designs.”

            The new OMAP 5 processor-based modules build on TI’s more than 50 years of industrial experience, and optimized solutions based on Sitara™ ARM Cortex-A8, OMAP 4 and multicore processors, all of which are designed into industrial applications today. With the new OMAP 5 processor-based modules, industrial developers now have a greater range of ARM-based development options for solutions that require high-performance processing, real-time time control, advanced graphics, and fanless low power.

            OMAP 5 processors: Higher performance for industrial systems
            The OMAP 5 architecture keeps power levels low to decrease utility costs and brings the best of ARM’s Cortex-A15 performance to advanced industrial systems, delivering:

            • Dual ARM Cortex-A15 MPcores for high-performance application processing
            • Dual Cortex-M4 cores for efficient task offloading and power optimization  
            • Integrated DSP for flexible, high-performance, real-time processing analytics and control
            • On-chip accelerators for vision, full-HD video (1080p) and 2D/3D graphics
            • Industrial temperature qualification (40 to +85°C)

            New OMAP 5 processor-based modules
            The new OMAP 5 processor based modules are expected to be available to select customers in first quarter 2013 from TI’s SoM vendors. For sales information and complete details, please visit the following links:

            Each leveraging unique features and benefits, the space-optimized OMAP 5 processor modules meet the industrial field’s tight security and design implementations, and are optimized to work with TI’s analog, connectivity and embedded solutions for more robust designs. Support and engineering resources available through TI’s SoM vendors help manufacturers focus on design differentiation to quickly deploy game-changing industrial offerings.

            UPDATE Aug’13: Xiaomi $130 Hongmi superphone END MediaTek MT6589 quad-core Cortex-A7 SoC with HSPA+ and TD-SCDMA is available for Android smartphones and tablets of Q1 delivery

            Formerly known as MT6588 but recently renamed as MT6589. About that history see my earlier post: Boosting the MediaTek MT6575 success story with the MT6577 announcement  – UPDATED with MT6588/83 coming early 2013 in Q4 2012 and 8-core MT6599 in 2013 [June 27, July 27, Sept 11-13, Sept 26, Oct 2, 2012]

            Although MediaTek is claiming that MT6589 is the first quad-core Cortex-A4 SoC, it is not true as the Allwinner A31 SoC is here with products [my other ‘USD 99 Allwinner’ blog, Dec 10, 2012]. It should also be noted that Qualcomm quad-core Cortex-A7 SoCs with Adreno 305 and 1080p coming for the high-volume global market and China [this same ‘Experiencing the Cloud’ blog, Dec 9, 2012] with customer sampling by 2Q 2013. Therefore MediaTek will have at least several months advantage over Qualcomm in this respect, as according to MediaTek’s press release

            the first models based on this new chipset are expected to ship commercially in Q1 2013.

            Updates: MediaTek quadcore Cortex-A7 superphones go higher frequency and lower end in H2 CY2013

            According to Maybank Kim Eng in its MediaTek Closing In Fast [July 17, 2013] report:

            image

            From this Xiaomi selected the current highest-frequency MT6589T (Turbo) MediaTek quad-core SoC for its own entry-level superphone:
            The list price is as low as ¥ 799 i.e. $130 in order to challenge Apple’s entry  

            imagehttp://www.xiaomi.com/hongmi: 红米手机 [Hongmi] Red Rice phone [July 31, 2013] as translated by Google

            image

            Size, weight, colorimage

            Basic parameters
            • CPU frequency 1.5GHz quad-core
            • CPU model MTK MT6589T
            • GPU Imagination PowerVR SGX544
            • Keyboard type virtual QWERTY keyboard
            • Input MethodTouch
            • System MIUI V5 system, support Android 4.2
            • Call pair Mai noise
            Capacity
            • Memory 1GB
            • Speed ​​Flash 4GB
            • Maximum memory expansion 32GB
            Network
            • Network standard mobile version: TD-SCDMA/GSM dual card dual standby
            • Network frequency GSM 900/1800/1900
            • TD-SCDMA 1900/2100
            • Data services GSM / GPRS / EDGE / TD-SCDMA / HSDPA / HSUPA
            • GPS GPS + AGPS
            • Bluetooth BT4.0LE + BT3.0HS
            • WIFI WIFI Direct
            Battery
            • Capacity 2000mAh replaceable lithium-ion polymer battery
            Screen
            • Screen size 4.7 inches [with Corning Gorilla 2 glass]
            • Screen material IPS [Retina] screen [up 312PPI]
            • Resolution 1280×720
            • Touch screen multi-touch capacitive screen
            Photograph
            • Rear camera 8 million pixels
            • Front camera 1.3 million pixels
            • Sensor type back-illuminated
            • Flash LED flash
            • Aperture F2.2 large aperture
            • ISO sensitivity mode supports optional
            • WB supports optional
            • Focus mode supports optional
            • Focus area supports optional
            • Autofocus support
            • Shooting scene supports optional
            • Wide Angle 28mm
            • Continuous function 8 frames per second continuous shooting
            • Other features zero shutter lag, face recognition, high dynamic range (HDR), real-time filters
            Camera
            • Video capture
              • Rear camera supports 1080p (1920×1080) HD video
              • Front camera supports 720p (1280×720) high-definition video standard
            Multimedia Player
            • Music player supports mp3, acc, amr, ogg, m4a, mid, wma, flac, ape, aac, wav and other formats
            • Video player supports 1080p (1920×1080, 30 frames / sec) video playback
            • Support mp4, h.263, h.264, rmvb, flv720p
            • Photo playback supports JPEG, PNG, GIF, BMP and other formats
            • Flash Player Support
            • Radio Support
            Sensors
            • Gyroscope Support
            • Light sensor Support
            • Gravity sensor Support
            • Distance sensor Support
            • Electronic compass Support

            Xiaomi shifts into low end of mobile sector [China Daily, August 1, 2013]

            The company officially offers the first batch of products on Aug 12
            Chinese smartphone manufacturer Xiaomi Corp launched a sub-brand “Hongmi” (red rice) on Wednesday that targets the country’s entry-level smartphone buyers.

            With rumors circulating that Apple Inc will introduce cheaper iPhones for Chinese clients in the second half, Beijing-based Xiaomi aims to beat its rival to the punch in the lower-end market.

            Xiaomi released the Hongmi smartphone, priced at 799 yuan ($130), at a Beijing newsbriefing on Wednesday.
            Hongmi has a 4.7-inch screen, Android-based device equipped with MediaTek Inc’s 1.5-gigahertz quad-core processor. The dual-card handset supports China Mobile Ltd’s second-generation (2G) and third-generation (3G) networks.
            Lei Jun, founder and chief executive officer of Xiaomi, said the launch of the Hongmi signifies Xiaomi’s first attempt to explore the nation’s affordable (below 1,000 yuan)smartphone market.
            “I believe the Hongmi is the best product among all 1,000-yuan smartphones” in China,Lei said. “Xiaomi does not care much about sales or shipments, but we strive toproduce the finest devices” for our costomers, Lei said at the event.

            Since Apple is hatching a plan to slash its iPhone price and garner more Chinese buyers, some Xiaomi officials said the “birth” of Hongmi is a preparation for the looming price-cut trend.

            “People will pay more attention to cheaper but capable smartphones,” one said.

            Apple’s Chief Executive Officer Tim Cook was in Beijing again, said officials at ChinaMobile Ltd on Wednesday.

            Xi Guohua, China Mobile’s chairman, met with Cook on Tuesday to discussion cooperation, said Li Jun, spokesman of China Mobile, via a text message.

            Analysts said Cook might have come to China to discuss Apple’s shrinking sales.

            There’s no doubt that Hongmi will open more doors for Xiaomi. Compared with the middle and high ends of the smartphone market, where Xiaomi has been operating, the entry-level market boasts many more potential buyers.
            According to data from Alibaba Group Holding Ltd, China’s biggest e-commercecompany by sales, 61 percent of the mobile phones sold on the Taobao marketplace and the business-to-customer platform Tmall.com were priced below 1,000 yuan. About one-fifth of the mobile phones sold cost 1,000 yuan to 2,000 yuan, while only 18 percent cost more than 2,000 yuan.
            “The entry-level smartphone market is definitely the market offering the most consumers,” said Li Yanyan, an analyst with Beijing-based research firm Analysys International.
            Domestic telecom operators have actively promoted and launched market campaigns for affordable smartphones, which help raise consumer awareness, she pointed out.
            Sandy Shen, an analyst with Gartner China, said the launch of the Hongmi also fills avoid for Xiaomi in cooperation with the nation’s biggest mobile operator, China Mobile.
            “Previously, Xiaomi partnered with both China Unicom and China Telecom, but we never heard any information about cooperation with China Mobile,” Shen said.
            China Mobile, although struggling in the domestic 3G competition because it adopted a relatively inferior 3G technology, has gradually got on track to catch up with rivals inrecent months.
            China Mobile sold more than 59 million mobile phones for its 3G network in the first half of this year, said Ma Jingxin, vice general manager of China Mobile Terminal Co, during the same event. Ma added the figure was close to China Unicom’s 3G mobile phone shipments.
            The Hongmi smartphone is available for pre-orders on Tencent Holdings Ltd’s Qzone, a social-networking platform with more than 60 million users. On Aug 12, Xiaomi will officially offers the first batch of products.
            Although Chinese media have reported that Tencent was about to invest in Xiaomi,officials at Xiaomi have denied any such plan.
            “Qzone is China’s biggest social-networking website and it closely aligns with Xiaomi’s targeted clients,” Li Wanqiang, vice-president of Xiaomi, said.
            “Social-networking platforms are the major battlefield (for Xiaomi marketing and sellingits products),” Li added.

            While the MT6589 based smartphones were targeted to the mid-range market so far:

            imageCLICK HERE to get a clickable PDF version of the above “picture document” if needed. Note that the previous hit SoC from MediaTek, the MT6577 has only slightly more, 74 devices listed in this device database since July 2012, but only 47 if taking a similar period. So with 61 devices already MT6589 has a much greater market success. To compare with MT6577 see Boosting the MediaTek MT6575 success story with the MT6577 announcement – UPDATED with MT6588 [later renamed 6589]/83 coming early 2013 in Q4 2012 and 8-core MT6599 in 2013 [‘Exp. the Cloud’, June 27, July 27, Sept 11-13, Sept 26, O0ct 2, 2012] and MT6577-based JiaYu G3 with IPS Gorilla glass 2 sreen of 4.5” etc. for $154 (factory direct) in China and $183 internationally (via LightTake) [‘Exp. the Cloud’, Sept 13, 2012].

            The first product was delivered from Micromax, the leading local brand in India (now world’s 3d largest smartphone market) with 19.3% smartphone market share in the January-April period (24.3% in April), #2 behind Samsung (which had 40.7% share out of the 9.4 million units in total). The 5” IPS 1280×720 8MP/2MP Micromax A116 Canvas HD went on sale starting February 14 for Rs. 13,990 [$236], and 1 million unit sales were achieved by April 24. It was followed by the 5” IPS 480*854 8MP/2MP A110Q Canvas 2 plus entry model from May 22 for Rs. 12,100 [$204], and then by the 5” IPS 1280×720 13MP/5MP Canvas 4 top model from July 8 for Rs. 17,999 [$303]. As other Micromax products they were manufactured in China by unknown white-label vendor(s).

            Other Indian brands of similar kind were close to Micromax’s footsteps. I will add just the next two local brands: the #3 Karbonn with 8.6% smartphone market share, and Lava International which is aggressively targeting the smartphone market this year with $169M planned sales, 50% of the overall phone revenue plan. Note that overall phone revenue of Karbonn in the fiscal year ended June 30 was $408M, and for the next fiscal year its plan is $675M according to Karbonn Mobiles eyeing Rs 4,000 crore turnover in FY 2014.

            The 4.5” IPS 540×960 5MP/VGA S1 Titanium model from Karbonn appeared February 16 on its website for pre-booking at Rs. 10,999 [$185], then came the 5.5” IPS 1280×720 13MP/5MP S9 Titanium top model announced on July 5 (in order to gain attention before Micromax Canvas 4) at Rs. 19.990 [$337] and to be released in the 2nd week of August. Note that two other quadcore Titanium models the S2 and the S5 are based on Snapdragon SoCs from Qualcomm, as well as a rumored S6 model.

            Lava International’s subsidiary Xolo was starting the sales of its 4.5” IPS 540×960 8MP/1MP Q800 model from March 10 for Rs 12,499 [$211], the 4.5” IPS 540×960 5MP/VGA Q700 model from May 13 for Rs. 9999 [$169], the 5” IPS 720×1280 8MP/1.2MP Q1000 top model from May 22 for 14,990 [$253], the latest 4.5” 854×480 5MP/VGA Q600 entry model of the Q series from July 1 for Rs 8,499 [$143].

            From announcement point of view the first one was the Alcatel One Touch Scribe HD (announced at the CES 2013 in January) but it was delivered only from March, although with subsequent rollouts worldwide. Here is the WMC 2013 presentation of it:

            Building a Better Smartphone Experience: MediaTek Dual-SIM Platform 
            [mediateklab YouTube channel, June 23, 2013]

            MediaTek’s strength lies in optimizing system design, perfectly integrating hardware and software to offer users an uninterrupted and always connected dual SIM experience. In addition, MediaTek dual-SIM platform does not suffer from the battery draining effects typically associated with having two SIM cards on standby. By using highly refined algorithms to reduce the number of hardware operations, MediaTek provides the most power-efficient mobile device solutions to date.

            MediaTek: April EDM [newsletter, April 26, 2013]

            New MediaTek-driven products revealed

            imageMediaTek chipsets have found their way into several new products of late, many of which have since enjoyed widespread media coverage.

            Alcatel‘s One Touch Scribe HD, which leverages MediaTek’s quad-core technology to deliver top of the line, HD720p picture was recently featured in CNET.

            imageLenovo meanwhile generated its own share of CNETand Engadget buzz with the release of its trio of new tablets. The company’s ten-inch IdeaPad S6000 and seven-inch A3000 were widely praised for their value proposition – Both devices, despite being priced for the mid-market, house a MediaTek 1.2 GHz quad-core processor, making them a viable contender in any tablet category. Likewise, Lenovo’s entry-level model, the A1000, is also said to punch well above its weight class.
            imageSimilarly, Micromax and BLU Products have achieved advances in their Canvas and BLU LIFE lines respectively, both of which are powered by the MT6589 processor. Both brands have garnered extensive local and international media coverage, including a glowing TECH2AUTO for Micromax. Interest for the new offerings by BLU Products has also been tracked across media such as Engadget and SlashGear .

            How MediaTek reduces power consumption  [3 video episodes in a playlist on mediateklab YouTube channel, CPU: Feb 24 – Display: March 12 – Multimedia: March 12, 2013]

            Lenovo S6000 and A3000 hands-on [TheVerge YouTube channel, Feb 24, 2013]

            MediaTek Powers Lenovo’s Premium Multimedia IdeaTab S6000 Tablet [and two other] [press release, Feb 25, 2013]

            End of Updates

            MediaTek Strengthens Global Position with World’s First Quad-Core Cortex-A7 System on a Chip – MT6589 [MediaTek press release, Dec 12, 2012]

            MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, announced the launch of the MT6589, the world’s first commercialized quad-core System on a Chip (SoC), available for mid to high-end Android smartphones and tablets worldwide. The new quad-core SoC integrates MediaTek’s advanced multi-mode UMTS Rel. 8/HSPA+/TD-SCDMA modem, a power-efficient quad-core Cortex™-A7 CPU subsystem from ARM, PowerVR™ Series5XT GPU from Imagination Technologies, and is delivered in 28nm process technology. As a leader in Dual-SIM technology, the MT6589 is also the world’s first HSPA+ smartphone platform supporting Dual-SIM, Dual-Active functionality to address increasing multi-SIM demand around the world.  The integration of these compelling features makes the MT6589 a universal platform that delivers premium multimedia capabilities with extremely low power consumption for an outstanding user experience.  It also enables handset makers to reduce time to market, simplify product development and manage product differentiation in a more cost effective way, for any market worldwide.

            “The ARM Cortex™-A7 is the most power-efficient applications processor ever developed by ARM. We are pleased MediaTek is the first company to combine a quad-core Cortex-A7 and leading edge 28nm manufacturing with TrustZone® for system-level security. The MT6589 system-on-chip brings the performance and features associated with high-end mobile devices to mass-market smartphones and tablets,” said Laurence Bryant, director of mobile solutions, ARM.

            image

            The MediaTek MT6589 quad-core solution supports 1080p 30fps/30fps low-power video playback and recording, a 13MP Camera with Integrated ISP, up to FHD (1920×1080) LCD displays, and enhanced picture processing for DTV-grade image quality.  In addition, the MT6589 also supports MediaTek’s “Cool 3D” suite, which includes support for stereo 3D cameras and displays, real-time 2D-to-3D conversion and an optimal 3D user interface. Leveraging MediaTek’s established 3D technologies from the DTV and Digital Home markets, this suite helps create an optimal stereo 3D display with a custom-tailored 3D interface, providing an extremely flexible platform for product differentiation.

            Tony King-Smith, Vice President Marketing, Imagination Technologies, said, “Today’s smart device users have very high expectations for graphic quality and performance. The MT6589 gives Imagination a great opportunity to show the abilities of the PowerVR™ Series5XT GPU, which delivers around twice the performance of previous generation devices while maintaining the lowest possible power and silicon area. We are delighted to contribute to this impressive, highly integrated solution, which demonstrates the benefits of our ongoing close strategic relationship with MediaTek.”

            The MT6589 also supports Miracast™ technology for multi-screen content sharing and pre-integrates MediaTek’s leading 4-in-1 connectivity combo, which supports 802.11n Wi-Fi, BT4.0, GPS and FM.

            Jeffrey Ju, GM of the smartphone business unit at MediaTek, said, “As the world’s first quad-core SoC, the MT6589 is a strong proof point of MediaTek’s growing global presence and ambition to drive the democratization of the smartphone and reshape the mid to high-end device market.  Having built a solid reputation for quality and reliability over the last 15 years, we’ve created a one-of-a-kind achievement with the MT6589 platform—marrying blazing performance and flexibility with surprising affordability and simplicity.  It’s an innovative solution that accelerates product development, simplifies differentiation, and offers the best possible experience that mid to high-end smart device owners desire.”

            “The demand for a Smartphone SoC that can be delivered anywhere in the world has never been greater, which is why the MT6589 is so important to our business,” said Dr. Ji-Yang Wang, COO at TCL Communications Technology/Alcatel One Touch. “As the first truly universal platform it is designed with the customer in mind to give us a crucial competitive edge. The MT6589 will make the life of our customers and partners easier, allowing them to bring the best possible experience to mid-to high-end users in multiple markets in the most timely and affordable manner, and most importantly, without compromising its performance.”

            The MediaTek MT6589 is currently being incorporated into smart devices by MediaTek’s leading global customers, and the first models based on this new chipset are expected to ship commercially in Q1 2013.

            For GPU related information see:
            A brief history of the PowerVR Series5XT GPU family [Imagination, Nov 5, 2012]

            MediaTek Launching Quad-Core MT6589 CPU’s Today [Gizchina.com, Dec 10, 2012]

            Although we have been hearing alot about MT6589 powered phones already, Mediatek will only offiicially launch their low-cost quad-core CPU later today!

            MediaTek took the smartphone market by storm this year with the single core MT6575 CPU and later the dual-core MT6577 and MT6577T processors which have found their way in to phones from local Chinese firms and larger international manufacturers.

            The new quad-core MT6589 CPU, which will be launched later today in Shenzhen, will build on the company’s low-cost, high performance reputation, but could bring with it a new lower price. Rumour from earlier this year claimed the quad-core chip could cost less to manufacture than current dual-core MT6577 CPU’s, however this is not to say we are going to find $100 quad-core phones launching anytime soon.

            According to most companies already testing the MT6589, they hope to launch higher end phones with larger screens, in an attempt to take on the higher price range Android phones from big brands such as Samsung, HTC and Sony. Typical specifications for MT6589 phones current offer 5 inch 1920 x 1080 displays, 2GB RAM, and 12-13 mega-pixel cameras.

            Currently Oppo, ZTE, Huawei, Lenovo, Gionee and even Sony have confirmed to be working on phones using the new quad-core CPU, with prices from some smaller brands expected to start at around $200.

            MediaTek launches ‘world’s first’ quad-core Cortex-A7 SoC, we go hands-on (video) [engadget, Dec 11, 2012]

            image

            There’s a new player in the quad-core SoC game and it’s called the MT6589. MediaTek announced today that it’s launching the “world’s first” quad-core Cortex-A7 SoC and gave us the opportunity to take it for a spin — in prototype form, of course. The MT6589, which includes the aforementioned quad-core Cortex A7 1GHz+ CPU, also features a PowerVR Series5XT GPU, high-performance multimedia support (13MP / 3D camera, 1080p video and display, Miracast) and a built-in 42Mbps HSPA+ / TD-SCDMA-capable dual-SIM dual-active radio. By combining competitive performance with high thermal efficiency and low power consumption in an affordable package, MediaTek’s new chip is well suited for a wide-range of smartphones and tablets running Jelly Bean and beyond. The MT6589 will be available in devices starting Q1 2013. Check out the gallery and hit the break for our impressions and benchmarks plus MediaTek’s videos and PR.

            image

            We played with two devices equipped with the new chip — a generic handset with branding covered up by MediaTek stickers and an upcoming Alcatel smartphone with a 1.2GHz MT6589, five-inch HD display, 8MP 1080p camera, dual-SIM 42Mbps HSPA+ connectivity, Miracast support and a 2500mAh battery. While our hands-on time was extremely limited we managed to run some benchmarks on Alcatel’s prototype — namely Quadrant, Vellamo 2 and AnTuTu 2 / 3. As you can see in the table above, the scores are generally lower than the competition, but the results are still decent enough. Both handsets felt snappy despite neither using final software or hardware. What’s more impressive is how efficient the MT6589 appears to be in MediaTek’s videos below, both in terms of heat dissipation and power management. We’ll reserve judgement until we’re able to test a production device equipped with the company’s new quad-core Cortex-A7 SoC, but it sure looks like 2013 is going to be an interesting year in the chip business.

            From the gallery:

            image image

            image

            Replaced with equivalent: MT6589 – The Coolest Quad-Core SoC Platform – Thermal Benchmark [mediateklab YouTube channel, Dec 28, 2012]

            MediaTek MT6589 -The World’s First Commercialized Quad-Core Cortex-A7 SoC Available for Mid to High End Smartphone and Tablets Market.

            Replaced with equivalent: MT6589 – The Coolest Quad-Core SoC Platform – Low Power Benchmark  [mediateklab YouTube channel, Dec 28, 2012]

            MT6589 is an advanced smart device platform delivering leading power efficiency without compromising performance

            Jiayu G4 redefines thousands of quad-core smart phone! [JiaYu product page, Dec 12, 2012] as translated by Google with manual edits

            December 12, 2012, immediately following the MTK 6589 quad-core chip release, Yiayu Mobile will launch next-generation flagship smartphone – the Yiayu G4 redefines thousands Yuan quad-core smartphone!

            image

            The best domain the G4 main performance parameters are as follows:

            1, CPU: MT6589 1.2Ghz quad-core; the GPU: SGX544

            2, 4.7 inch IPS screen resolution of 1280×720 HD (MIPI interface), the the OGS whole fitting process (single glass program)

            thickness of the dual-battery design, thin electric 1800 mA, 3000 mA thick power for the different needs of the user selects.

            4, gyroscope \ distance \ light \ Gravity \ magnetic sensor \ double wheat Noise Reduction \ WIFI \ Bluetooth \ FM \ GPS galore!

            5, body measurements: thin electrical about 130 × 63.5 × 8.1 (mm) thick power 130 x 63.5 x 10 (mm), a larger screen, a shorter, narrower, thinner body!

            6, higher definition camera configuration, specific parameters be announced separately.

            as translated by Bing with manual edits

            On December 12, 2012, released along with the MTK 65,894 core chips, Yiayu Mobile will launch a new generation of flagship Smartphone—”Yiayu G4″ redefines the thousands of quad-core smart phone!

            G4 major performance parameters are as follows:

            Quad-Core 1, CPU:MT6589 1.2Ghz; GPU:SGX544
            IPS,

            2 inch screen, resolution 1280×720 HD (MIPI interface), using OGS laminating technology (single glass scheme)

            3, thickness double batteries design, thin 1800 Ma, thick by 3,000 Ma, for different needs of users.

            4, gyro \ \ \ distance light gravity \ \ magnetic sensor dual noise-canceling Bluetooth \FM\GPS \WIFI\ MAK-everything!

            5, body measurements: thin about 130×63.5×8.1 (mm), thick 130×63.5×10 (mm), a large screen, a shorter, narrower and thinner body!

            6, HD camera configuration, specific parameters be announced separately.

            Jiayu G4 Is Unveiled With MT6589 Quad-core Processor [GizmoChina, Dec 11, 2012]

            Today is all concerned with MediaTek smart phone chip friend who’s big day, including manufacturers, including, has always been a cost-effective smartphone known for the Jiayu taking advantage of MediaTek released MT6589 4-core of the occasion, the official website released a long-awaited the quad-core smartphone – Jiayu G4.

            The information revealed in succession before Jiayu G4 hardware parameters with consistent, the Jiayu G4 will equip MediaTek MTK6589 quad-core processor, clocked at 1.2GHz, built-in PowerVR SGX 544 graphics processor. The 4.7 inch IPS screen resolution of 1280 * 720 HD level. There are two different versions of the battery with body size, the the thick version of the body measurements of 133 * 65 * 10 mm, with a capacity of 3000 mA battery, thin version of body size of 133 * 65 * 8.2 mm, The battery capacity of 1800 mA. In addition, support for commonly used Bluetooth, FM, GPS and WIFI, and built-in gyroscope distance light Gravity magnetic sensors and other common sensing devices, and supports dual-microphone noise reduction technology.

            See also: MT6577-based JiaYu G3 with IPS Gorilla glass 2 sreen of 4.5” etc. for $154 (factory direct) in China and $183 [on this same blog, Sept 13, 2012]

            Allwinner vis-à-vis HTC on 2013 International CES

            image

            From Allwinner:

            Allwinner has launched its latest quad-core application processor A31 in December 2012 and will create another legend in the consuming world.

            If you would like to know more about A31, please schedule a meeting with us at CES 2013 via Eva.wu@allwinnertech.com.

            Booth No:MP40016

            Booth Map:http://www.mapyourshow.com

            You could already have all the necessary information from my special posts given in a newly created blog about the ‘Allwinner phenonmenon’:
            Allwinner A31 SoC is here with products and the A20 SoC is coming [Dec 10, 2012]
            Is low-cost enough for global success? [Dec 5, 2012]
            The upcoming Chinese tablet and device invasion lead by the Allwinner SoCs [Dec 4, 2012]
            $40 entry-level Allwinner tablets–now for the 220 million students Aakash project in India [Dec 4, 2012] from this alone 220 million additional tablets would have been delivered from 2013 to 2016
            USD 99 Allwinner [Nov 30, 2012]
            It’s a Strategic Inflection Point [Dec 1, 2012]

            This is the most dramatic disruption in the whole history of ICT, what I am calling the ‘ALLWINNER PHENOMENON’ (or ‘Allwinner et al phenomenon’ sometimes when including Allwinner’s internal mainland China competitors such as Rockchip into account as well). EVERYBODY SHOULD BE AWARE of the fact, however, that even in the latest forecasts by bigname ICT market researchers the ‘Allwinner phenomenon’ is not taken into account at all. The two very recent reports from IDC given as updates in my Boosting both the commodity and premium brand markets in 2013 with much more smartphones and tablets while the Windows notebook shipments will shrink by 2% [this ‘Experiencing the Cloud’ blog, Nov 20 – Dec 10, 2012] are the latest examples of that fact. So, keep that in mind as the ‘Allwinner phenomenon’ will add hundreds of millions to those forecasts starting as early as in 2013. Especially the numbers for the tablets will be affected.

            I personally would be most curious about the Windows 8 (rather Windows RT obviously) support on the Allwinner A31 SoC as already indicated on the A31 product page. Maybe HTC will be the first company bringing out a product based on that?

            I would not be surprised at all if HTC will bring out double, x86/64 and ARM platform based products for the portable PC and the tablet markets (using IDC terminology) by marrying the A31 SoC with VIA Technologies current 40nm VIA Nano X2 dual-core x86/64 chip, based on the still state-of-the-art (that is much better than the current Atom) Isaiah/CN micro architecture CPU core from its subsidiary Centaur Technology. You can find all related information about the latter in my earlier post on this blog:
            Can VIA Technologies save the mobile computing future of the x86 (x64) legacy platform? [Nov 23, 2012]

            Qualcomm quad-core Cortex-A7 SoCs with Adreno 305 and 1080p coming for the high-volume global market and China

            With Qualcomm’s this week announcement (see below in the details section) the company is expanding the high-volume Play tier of its S4 class SoCs for aggressive competition with Taiwan (especially MediaTek, see in the details) and mainland China based competitors, as well as NVIDIA (see in the details) and Marvell:  

            image
            Note: the greyed boxes contain the number of available or announced products based on that particular SoC as of end of September, 2012.

            As with it Qualcomm’s Krait based dual-core offerings came into a kind of performance overlap with the new quad-core Cortex-A7 SoCs (not according to Qualcomm obviously but easily recognizable from the above table) the company intensively emphasized in the last month the upcoming Krait v3 upgrade, officially called Krait 300, for the 2013 market. I will provide that information as well, after the MSM8x26 related information.

            Finally Qualcomm published a new video about its strategic partnership with Dell in which Jeff Clarke, vice chairman & president of Global Ops and End User Computing at Dell is stating:

            [1:13] Our strategic ARM partner is Qualcomm. Our strategic LTE partner is Qualcomm. Our wireless wins strategic partner is Qualcomm. [1:21]

            Next week at Dell World 2012, Dell is bringing together top industry leaders and tech pundits to discuss how a new category of devices will benefit every aspect of computing, particularly the business environment. As a tech visionary, Qualcomm will share its visions on how it can help valued partners like Dell bring to market devices that are always connected while lasting days on a single charge.

            As there is a special indication in the notes to that video about the Dell World 2012 (Dec 11-13, 2012), where Steve Mollenkopf, President and Chief Operating Officer of Qualcomm is listed among the 16 most distinguished speakers and Qualcomm is a Gold sponsor of the event, we may expect further details regarding both the MSM8x26 and Krate 300.

            In order to have a complete and actual picture of Qualcomm’s SoC business I will also add some other information, particularly for the Adreno 300 series, along and after the MSM8x26 and Krate 300 related parts.

            Before the details I will highly recommend to read my previous post Qualcomm decided to compete with the existing Cortex-A5/Krait-based offerings till the end of 2012 [Sept 30, 2012] as well.


            The details

            Qualcomm Announces S4 Play MSM8x26 and WTR2605 – Quad Core ARM Cortex A7 [AnandTech, Dec 5, 2012]

            Yesterday, Qualcomm announced a new SoC for its Snapdragon S4 Play category, the MSM8x26, and alongside it a new transceiver, WTR2605. The announcement was a little light on detail and I waited until confirmation of a few details, but now know more about these two new parts geared at the growing entry-level Chinese handset market.

            First off, MSM8x26 is a 28nm SoC consisting of four ARM Cortex A7 CPUs running at (1.2 GHz) alongside an Adreno 305 GPU. This is to my knowledge the first Qualcomm SoC using a Cortex A7 for CPU, previously we’ve seen a lot of Cortex A5 use at Qualcomm in parts like MSM8x25 (dual A5s), MSM8x25Q (quad A5s), and also onboard baseband as an optional AP for managing things like a router. MSM8x26 is the spiritual successor to MSM8x25Q, which was again quad core ARM Cortex A5s at 45nm with Adreno 203 graphics. MSM8x26 should bring a nice jump in performance on both CPU and GPU over that part, in addition to supporting 1080p video encode and decode, and support for 13 MP cameras. MSM8x26 will come in two flavors, 8226 with UMTS and TD-SCDMA, and 8626 with UMTS, CDMA, and TD-SDCMA, consistent with Qualcomm’s part numbering scheme. 

            The other part of the story is the new transceiver, WTR2605, whose name suggests a wafer-level package (W for wafer) and includes necessary improvements to accommodate dual SIM active and standby modes (DS-DS operation) popular in the entry level Chinese market MSM8x26 is geared at. I don’t know anything further about the WTR2605 or how it compares in terms of RF ports to WTR1605L, which is Qualcomm’s current flagship transceiver, but suspect it’s an evolution of that design with changes to accommodate the dual SIM modes. We’ll have a piece ready later in the week about WTR1605 and the state of Qualcomm’s modem portfolio.

            Qualcomm Technologies Expands Line of Qualcomm Snapdragon S4 Processors with Quad-Core CPUs for High-Volume Smartphones [Qualcomm press release, Dec 4, 2012]

            — MSM8226, MSM8626 and Reference Design Counterparts Add Depth to Qualcomm Snapdragon S4 Roster and Incorporate New WTR2605 Multimode Radio

            Qualcomm Incorporated (NASDAQ: QCOM) today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., is adding two chipsets to the Qualcomm Snapdragon™ S4 family of mobile processors, the MSM™8226 and MSM8626 chipsets, along with Qualcomm Reference Design versions of both. These Qualcomm Snapdragon S4 processors with quad-core CPUs will bring premium multimedia and connectivity features to high-volume 3G handsets. Featuring the powerful Adreno™ 305 GPU, 1080p capture and playback, and up to a 13 megapixel camera, the MSM8226 and MSM8626 processors are optimized to deliver visually stunning graphics and exceptionally long battery life to high-volume smartphones. Both processors will be ready for customer sampling by the second quarter of 2013 for UMTS, CDMA and TD-SCDMA.

            Building on Qualcomm Technologies’ previous quad-core offering, both the MSM8226 and MSM8626 processors are fabricated using the 28nm technology node and will continue to support multi-SIM capabilities with Dual SIM, Dual Standby; and Dual SIM, Dual Active. In addition to quad-core CPU processing power, these chipsets incorporate the new WTR2605 multi-mode radio transceiver, optimized to address China specific requirements such as support for TD-SCDMA, CDMA 1xAdv and HSPA+. The WTR2605 transceiver comes with an integrated, high-performance GPS core with GLONASS and Beidou support. Optimized for low power consumption, the WTR2605 transceiver offers 40 percent power savings and 60 percent smaller footprint compared to previous generations.

            “The expansion of our Qualcomm Snapdragon S4 family extends our leadership in performance and low power for the high-volume smartphones,” said Cristiano Amon, executive vice president and co-president of mobile and computing products, Qualcomm Technologies. “This expanded roadmap provides our customers with a differentiated feature set upon which to build compelling smartphones for budget-conscious consumers.”

            Qualcomm Technologies will also be releasing Qualcomm Reference Design (QRD) versions of both MSM8226 and MSM8626 processors. The QRD program provides device manufacturers with comprehensive handset development resources and access to an ecosystem of hardware and software vendors, whose components and applications have been tested and validated for QRD-based devices. QRD customers are offered everything they need to rapidly deliver differentiated smartphones to the mass market. There have been more than 100 public QRD-based product launches to date in collaboration with more than 40 OEMs, and there are currently more than 100 designs in progress. The QRD versions of these particular Qualcomm Snapdragon processors—the QRD8226 and QRD8626—will also be available for sampling by the second quarter of 2013.

            Windows RT on Snapdragon Processors [QUALCOMMVlog YouTube channel, Nov 16, 2012]

            Watch as Steve Horton, Director of Product Management, explains how Qualcomm and Microsoft collaborated to bring together power, connectivity, graphics, security, and multimedia to ensure that Qualcomm’s Snapdragon SoC best optimizes tablets running WindowsRT. To learn more about Snapdragon go to:http://www.qualcomm.com/snapdragon or visit Qualcomm at http://www.qualcomm.com You can also connect with us at: http://www.facebook.com/qualcomm, http://www.youtube.com/qualcomm and Twitter@Qualcomm.

            Nvidia Tegra 3 under strong pressure from S4 Pro, say Taiwan makers [DIGITIMES, Dec 7, 2012]

            Snapdragon S4 Pro series processors developed by Qualcomm have brought increasing competitive pressure on Nvidia’s Tegra 3 because of its superior overall performance-cost ratio, according to Taiwan-based handset supply chain makers.

            Although Nvidia successfully landed orders for Google’s Nexus 7 and Microsoft’s Surface RT in 2012, with Microsoft reportedly planning to adopt Qualcomm’s platform for its next-generation Surface RT, while Tegra-based smartphones have only had average sales performance, Nvidia may find it difficult to continue achieving strong growth in 2013 like in 2012.

            In 2012, Nvidia received Tegra orders for smartphones including the HTC One X, LG Electronics Optimus 4X H, ZTE Era, K-Touch Treasure V8 and Fujitsu’s devices.

            Qualcomm is expected to start fierce competition against MediaTek and China-based handset chipmakers in China’s mid-range to entry-level smartphone market in the first quarter of 2013, challenging Nvidia’s plans of releasing a solution for CNY1,000 smartphones (US$160), while ualcomm’s aggressiveness over striving orders from tablet players with its reference design, which is set to release in the first half of 2013, also places strong pressure on Nvidia, the sources noted.

            From this you could see that Qualcomm and MediaTek is in a kind of mouse and cat game: MediaTek to bring forward launch date of MT6589 quad-core solutions [DIGITIMES, Dec 3, 2012]

            MediaTek reportedly has decided to move forward the launch date of its quad-core smartphone solution, the MT6589, to December instead of January 2013 in order to meet market demand during the upcoming Lunar New Year holiday season, according to industry sources.

            In addition to China-based smartphone makers, Motorola Mobility, Sony Mobile Communications and LG Electronics are also likely to be among the first wave of vendors taking deliveries of quad-core solutions from MediaTek, the sources indicated.

            Smartphones powered by MediaTek’s quad-core chips are expected to hit the market in the first quarter of 2013 at the earliest, added the sources.

            MediaTek November revenues dip to 5-month low [DIGITIMES, Dec 10, 2012]

            MediaTek saw its consolidated revenues slide 17.5% sequentially to a five-month low of NT$8.65 billion (US$297 million) in November, according to company data. The monthly figures were up 13.4% from a year earlier.

            Accumulated revenues for the first 11 months of 2012 amounted to NT$91.68 billion, increasing 15.5% from a year ago.

            MediaTek will give a presentation for its quad-core MT6589 smartphone solution as well as a low-priced version MT6589M to clients on December 11 and to the media on December 13, according to a Chinese-language Economic Daily News (EDN) report.

            Krait 300: The AnandTech Podcast: Episode 12 [Dec 3, 2012] from Brian Klug
            (see also the Qualcomm’s Quad-Core Snapdragon S4 (APQ8064/Adreno 320) Performance Preview [AnandTech, July 24, 2012] where Krait v3 is already mentioned as well as Adreno 320 improvements with all detailed slides about the new GPU)

            [51:44] … all current Kraits are Krait v2 (Krait v1 was a sort of internal thing we never saw) … soon will get Krait v3 and [MSM]8960T … T stands for Turbo … strait IPC [Instructions Per Cycle] increase of about 15% … additionally increased clocks from 1.5 GHz to 1.7 GHz … expect 20 to 30% higher overall performance … more power efficiency … more out-of-order capability … better branch prediction … there is Krait 400 at some point but don’t know about that … expect devices with MSM8960T shipping early next yearAdreno 320 GPU is coming with 8960T … [57:58]

            CPU Leadership Now and into Next Generation:
            Highest Performance at the Lowest Power

            image
            Most widely presented on Qualcomm Analyst Day, Nov 15, 2012 (slide #90) but taken from IAR_Americas_Summit_2012_Industry_Leadership_Anand_Chandrasekher (1)
            Note from ExtremeTech:

            The x86 SoC above is obviously Intel’s Medfield, while the 40nm competitor in green is almost certainly Tegra 3. The yellow line is Samsung’s dual-core Exynos Cortex-A15 CPU. The first magenta line presumably refers to the dual-core Snapdragon S4 designs …

            … Cortex-A15 is primarily a server/netbook chip, but that doesn’t mean Samsung can’t build smartphones around it.

            Snapdragon CPU Performance [QUALCOMMVlog YouTube channel, Aug 21, 2012]

            Travis Lanier, director of CPU product management, discusses in detail what goes inside Snapdragon processors and sets them apart from the competition. This video sheds light on the thought that Qualcomm puts into its designs—from thermal management, power efficiency and extending device term battery life to asymmetrical loading, multiple cores and more—resulting in a highly optimized chip. For more information on Snapdragon go to:http://www.qualcomm.com/snapdragon For more information on Qualcomm go to: http://www.qualcomm.com For more Qualcomm videos go to: http://www.youtube.com/qualcomm

            How Snapdragon processors stack up against the competition [QUALCOMMVlog YouTube channel, Sept 20, 2012]

            With so many devices launched every day, what claims to be new may not always be up to speed with current technology. In this video, you’ll see how a Qualcomm Snapdragon processors compare to the competition’s latest processor. For more information on Snapdragon please go to: http://www.qualcomm.com/snapdragon To learn more about Qualcomm visit http://www.qualcomm.com or connect with us at: http://www.facebook.com/qualcomm, http://www.youtube.com/qualcomm and Twitter@Qualcomm.

            Current Krait v2/200 SoCs see in the table below (with actual devices as end of Sept):
            taken from my earlier core post: Qualcomm decided to compete with the existing Cortex-A5/Krait-based offerings till the end of 2012 [Sept 30, 2012]. Note that the newer SoCs with quadcore  S4 Pros (not even in this table) are not shown. About them see:
            HTC Droid DNA Rocks First 1080p Display [Qualcomm Insider Blog, Nov 13, 2012]
            Google Nexus 4 [Qualcomm product page]
            LG AND GOOGLE ANNOUNCE NEXUS 4 [LG press release, Oct 30, 2012]

            Sleek, New Smartphone Combines LG’s Best-in-Class Hardware with the Best of Google

            SEOUL, Oct. 30, 2012 -– Designed collaboratively by LG and Google, Nexus 4, the newest smartphone in the Nexus line-up from Google, was announced today for availa bility starting next month in select markets. With a sophisticated hardware design from LG, your favorite Google Apps, and the latest version of Android™, Nexus 4 puts the best of Google in the palm of your hand.

            “LG  is  proud  and  excited  to  play  this  role  in  helping  build  the  latest  Nexus smartphone,” said Dr. Jong-seok Park, President and CEO of LG Electronics Mobile Communications Company. “Users will be delighted by the perfectly balanced combi nation of form and function with the latest generation of Android.”

            “This is the first time we collaborated with LG to build a Nexus device,” said Andy Rubin, Senior Vice President of Mobile and Digital Content at Google. “They brought an extraordinary amount of talent to the project, and the result is a feature-packed device that feels great in your hand, and blazingly fast under the hood.”

            Capture and share your world

            Nexus 4 comes with a high-performance 8MP camera and takes stunning Photo Sphere images, letting you capture every detail of the world around you. Up, down and all around you, it’s like no camera you’ve ever seen; with Nexus 4, you can snap pictures in every direction that come together into incredible, immersive Photo Spheres that put you right inside the scene. Plus, photos upload themselves with Instant Upload so you’ll never lose a shot.

            All of this comes to life with stunning clarity and crisp, natural color on the vibrant 1280-by-768 4.7-inch True HD IPS Plus display supported by Zerogap Touch technology. Gently curved glass edges allow your finger to slide smoothly on and off the 320ppi screen, while cutting edge display technology means you feel like you’re touching every pixel, protected by scratch resistant Corning® Gorilla® Glass 2.

            Built for speed

            Nexus 4 comes with a cutting-edge Qualcomm Snapdragon™ S4 Pro processor, so you’ve got speed and power to spare. Zip around the web, experience rich 3D graphics and gameplay, and effortlessly switch between multiple apps without ever missing a beat. With 2GB of RAM and the fastest version of Android ever, Nexus 4 is the snappi est Nexus smartphone yet.

            Information at your fingertips

            Nexus 4 comes with the latest Google apps, putting the best of Google in the palm of your hand. The latest version of Google Now is built-in, which keeps you even more organized -– get reminders about upcoming flights, restaurant reservations, hotel confir mations and even nearby photo opportunities -– when and where you need them.

            Get to the places you care about quickly and easily with Google Maps™ for Android. With turn-by-turn GPS navigation, live traffic info, and integrated driving, walking and public transit directions, getting from A to B has never been easier. 3D Maps and rich satellite imagery give you a more realistic sense of what’s around you while features like Street View and Indoor Maps make sure you always know what’s in front of you.

            Nexus 4 is sold unlocked and is GSM/HSPA+ compatible so it will operate on more than 200 network providers worldwide. Just pop in a supported SIM card and be up and running in no time. It will be available to purchase in both an 8GB version and a 16GB version on Google Play™ starting November 13 in the US, UK, Canada, Germany, France, Spain and Australia. Offline availability in Europe, Central/South Americas, Asia, CIS and the Middle East will begin from the end of November.

            Key specifications

            • Chipset: Qualcomm Snapdragon™ S4 Pro processor with 1.5GHz Quad-Core Krait CPUs
            • Operating System: Android 4.2, Jelly Bean
            • Network: 3G (WCDMA), HSPA+
            • Display: 4.7-inch WXGA True HD IPS Plus (1280 x 768 pixels)
            • Memory: 8GB / 16GB
            • RAM: 2GB
            • Camera: 8.0MP rear / 1.3MP HD front
            • Battery: 2,100mAh Li-Polymer (embedded) / Talk time: 15.3 hours / Standby: 390 hours
            • Size: 133.9 x 68.7 x 9.1mm
            • Weight: 139g
            • Other: Wireless charging, NFC

            “As with any sales process, LG supplies product quantities against partners’/customers’ (ie retailers, operators etc) forecasts,” Andy Coughlin, head of mobile at LG UK, told CNet, adding that, “demand via the Play Store has been very high in this instance.”

            Adreno 320 GPU Leads in Power-Efficient Performance:
            Latest GPU Architecture – Higher Parformance, Lower Power

            image
            Most widely presented on Qualcomm Analyst Day, Nov 15, 2012 (slide #93) but taken from IAR_Americas_Summit_2012_Industry_Leadership_Anand_Chandrasekher (1)

            Graphics Benchmarking [QUALCOMMVlog YouTube channel, Sept 26, 2012]

            Watch how the graphics performance of Qualcomm’s quad-core Snapdragon S4 (APQ8064) with integrated Adreno 320 GPU compares with a competitor quad-core platform. Kishonti Informatic’s GLBenchmark 2.5, the newest and highest-end 3D graphics benchmark available today, plays noticeably more smoothly with Snapdragon and Adreno. To learn more about Snapdragon go to: http://www.qualcomm.com/snapdragon To learn more about Qualcomm visit http://www.qualcomm.com or connect with us at: http://www.facebook.com/qualcomm, http://www.youtube.com/qualcomm and Twitter@Qualcomm.

            GPU Demonstration: Fortress [QUALCOMMVlog YouTube channel, Sept 19, 2012]

            Snapdragon S4 Pro™ quad-core processor and its integrated, custom-built Adreno 320 GPU. This demo showcases how the quad core processor and GPU work seamlessly to deliver efficient, powerful graphics processing and high-end graphics features like real-time shadows and per fragment lighting, real-time reflection and refraction, lens flare, cloth simulation, water simulation, and God rays. To learn more about Qualcomm visit http://www.qualcomm.com or connect with us at: http://www.facebook.com/qualcomm, http://www.youtube.com/qualcomm and Twitter@Qualcomm.

            Adreno Graphics for Snapdragon [Qualcomm Industry Analyst Relations, Sept 7, 2012]

            Adreno GPUs are custom-built by Qualcomm and exclusively integrated within Snapdragon processors. They provide the level of computational processing power needed for the high-end 3D gaming, complex UIs, super-responsive web browsing and rich navigation experiences that today’s savvy mobile users demand.

            The newest generation of Adreno GPUs, the Adreno 300 series, integrated in Snapdragon S4 Prime (MPQ8064) and S4 Pro (APQ8064, MSM8960T) processors, lead the market in power-efficient graphical processing capacity, capabilities and quality. The first GPU in the series, Adreno 320, delivers over three times the computational performance of the previous Adreno GPU, Adreno 225. Adreno 320 also provides the API support needed to enable not only high-end, connected 3D gaming experiences, but also to assist the CPU with computationally intensive use cases like imaging and video enhancement.

            • Snapdragon and Adreno have strong global adoption, as evidenced by the fact that Qualcomm shipped more GPUs in 2011 than any other mobile silicon provider.
            • Adreno GPUs enable today’s advanced graphical use cases with industry leading performance and power efficiency.
            • Adreno GPUs are uniquely designed to dynamically adjust to shader loads, minimizing processing power and boosting application performance by eliminating wasted cycles.
            • Qualcomm’s newest GPU, Adreno 320, introduces support for the latest graphics APIs like OpenGL ES 3.0, as well as the latest compute APIs like OpenCL 1.2 that enable GPGPU acceleration of advanced computational camera and video effects.
            • Qualcomm’s Adreno graphics solution includes support of leading game engines and valuable tools that save developers time and money.

            Snapdragon GPU Technology [QUALCOMMVlog YouTube channel, Aug 6, 2012]

            What is Qualcomm’s integrated Adreno GPU technology for Snapdragon all about? What types of use cases is it enabling in today’s market and how? This video answers these questions and more. For those new to Adreno and for those who want to know what the latest and greatest features of the new Adreno 300 series GPUs are, this video provides helpful answers. To learn more about Qualcomm visit http://www.qualcomm.com or connect with us at: http://www.facebook.com/qualcomm, http://www.youtube.com/qualcomm and Twitter @Qualcomm.

            Adreno Profiler & SDK [QUALCOMMVlog YouTube channel, Oct 1, 2012]

            Qualcomm’s Adreno Graphics solution includes much more than their high performance Adreno GPUs. In this clip you’ll get a glimpse of the Adreno Profiler tool and also hear about the Adreno SDK, both of which are valuable graphics development and optimization tools that save developers time and development costs. These tools and additional information are available on developer.qualcomm.com. To learn more about Qualcomm visit http://www.qualcomm.com or connect with us at: http://www.facebook.com/qualcomm, http://www.youtube.com/qualcomm and Twitter@Qualcomm.

            $99 Android 4.0.3 7” IPS tablet with an Allwinner SoC capable of 2160p Quad HD and built-in HDMI–another inflection point, from China again

            [This is a huge, compiled collection basically finished in September, 2012. Contains updates till November, 2012. It was published in early December, 2012. A new USD 99 Allwinner blog was launched on Nov 30, 2012 based on this compilation. Please read the two entry posts of that as well: The upcoming Chinese tablet and device invasion lead by the Allwinner SoCs and $40 entry-level Allwinner tablets–now for the 220 million students Aakash project in India in order to understand very quickly that  It’s a Strategic Inflection Point of enourmous consequences, and not only for the ICT industry.]
            Or it is first time that we can see globally that China is on a different, significantly more effective price/performance/functionality trajectory of its own than anybody else. Even the latest challengers to the already fading Wintel empire will be affected by this. We should therefore understand: 1. The new challenge—2. The learnings from similar fundamental shifts in the history of ICT—3. The current market for this new industry trajectory—4. The initial advantage that made possible this trajectory—5. The most significant new customer value which will assure its global victory in the end—6. The current way of thinking of the established client device players.—7. Possible further hardware advances sustaining this new trajectory.
            Inside PRC the situation is even more dramatic. Below you could see 3 market leading products on the mainland China market as was indicated on Sept 25 by vast and quite sophisticated marketplace information of PConline, the largest portal in the PRC specialising in IT product-related content, in terms of advertising revenue. The type of SoC used in those products is shown in blue ink. A13 and A10 are from Allwinner Technology, while RK3066 is from Fuzhou Rockchip Electronics. Both are quite successful SoC companies founded in China. Information about these tablets will be given in section 3. The Teclast & Window tablets shown below are also available globally for $120 and $215 respectively.

            image

            Update: All three tablets essentially have kept their position up to now (Dec 3). The price of Teclast P75D even went down to ¥499 i.e. $80 at one of the dealers, three of the dealers have price between ¥594 and ¥599, i.e. between $95 and $96, while 5 others still selling it for ¥699 i.e. $112 by today’s exchange rate. This is showing clearly that the $99 pricing for the HAIPAD i7 is realistic even in terms of the hottest tablet of such kind on the mainland China market which has ¥646 i.e. $104 across all of its dealers on PConline.
            At the same time the unchanged ¥259 i.e. $41.5 price of Andorra A713 clearly shows the fact that for a non-IPS 7” tablet with the Allwinner A13 SoC, essentially a constrained to 512M RAM version of A10 with no HDMI output, there is a well established entry-level price in China. Note that the A713 tablet has a capacitive multi-touch (5-point touch) screen, so it is not a kind of cheap resistive screen variety of tablets.
            This whole story will end in section 7. with the even more dramatic development of a PCMCIA card (or as was renamed PC Card) format package called EOMA-68 (see: Embedded Open Modular Architecture), which contains a whole computer with an Allwinner A10 SoC, 1GB of RAM, 1 to 16 GB of NAND Flash etc. All this for a target price of $15. Almost all interfaces available of the Allwinner A10 SoC have been made available on the 55x85mm credit-card-sized card, including both Transport Streams, SIM Card, PATA, the 24-pin Camera Interface, both 24-pin LCD Interfaces, VGA, Composite Video (CVBS), SPDIF, AC97, I2S, GPS, CAN-Bus, Infrared, and many more. This is in addition to the standard EOMA-68 Interfaces of Ethernet, I2C, SATA, LCD 24-pin RGB/TTL, USB2 and 16 GPIO pins.
            While this is a FLOSS-related initiative rooted in UK, the hardware part is fully based on mainland China companies, including Allwinner Technology. What is the benefit for the FLOSS-people could be much more for the Chinese industry network already moving along a much faster and more effective trajectory than the outside world. To me it can go as far as a SoC vendor like Allwinner Technology will be able to produce these type of cards as well which will significantly enhance the possibilities and worldwide competitiveness of the hundreds of independent manufacturers is Shenzhen, Zhuhai and elsewhere in PRC. As a consequence the consumer equipment prices could go down even more and/or functionaly, as well as quality, could be risen even more.
            Meanwhile the SoC and subsequent Android tablet competition is intensifying very-very fast inside PRC as evidenced by this latest Overview of the latest/best 7″ Tablets out of Shenzhen China [Charbax YouTube channel, Oct 28, 2012]:
            Here’s my overview video showing some of the latest best value 7″ Android tablets that I have found in Shenzhen on this trip. At least the samples that I was able to buy. [IN BULK PRICES, i.e. in 1K orders at least:] $40 A13 800×480, $65 RK3066 1024×600, $80 Nufront NS115 1024×600 IPS, and there’s also the sub-$50 VIA 8850 (which can run a Windows RT clone UI on top of Android), and I compare these with the $199 Kindle Fire HD
            Finally there is an even stronger newcomer, Nufront already on the Chinese SoC market, also posing the greatest challenge to Allwinner for the next year as it stands on Nov 1. We are talking about the Taishan platform with:
            The NS115 mobile computing chip, a dual-core ARM Cortex™-A9 MPCore™ processor up to 1.5GHz and Mali™-400 MP GPU implementation, features 1080P HD encode/decode and support of Android 4.0
            which justifies a whole section of its own to describe the whole strength of:
            8. The Nufront challenge coming from inside

            All those finding are compiled into this very large composite post on my trend-tracking blog here, which has the following sections with final names reflecting better the individual section contents as:

              1. The new challenge
              2. A proper recollection of what happened to Intel’s memory business
              3. The market and industry situation reflecting this new inflection point
              4. The Allwinner advantage 全志
              5. The wireless display and 2160p (“Quad HD”/4K) outlook
              6. Are the established client device players recognizing this strategic inflection point or not?
              7. Possible further hardware advances sustaining this new trajectory
              8. The Nufront challenge coming from inside

                Please go through those compiled sections at least by reading the emphasized texts which I’ve put everywhere to make fast reading possible.

                Note as well that section 2. is also on a new blog of mine, USD 99 Allwinner, as an expanded version standing on its own and made accessible from every post there via It’s a Strategic Inflection Point page.

                Finally, on this new blog you will find the USD 99 Allwinner page as well which, besides providing the rationale for the naming and the existence of that blog, will summarize my current (Dec. 1) opinion about the mobile device market for 2013, especially the threat which may force Microsoft and Intel to adjust their current strategies radically.


                1. The new challenge

                HAIPAD I7 IPS 1024*600 Multitouch Screen with Android 4.0 Dual Camera 1080P HDMI [Merimobiles.com, Sept 10, 2012]

                List Price: $269.99   Your Price: $99.99  [with free shipping worldwide]
                [when it became available in April’12 it was briefly $137.99 already]
                [more tablets of this kind coming to the market too, e.g. the $99 Dragon]

                Haipad i7 Android ICS 7” capacitive IPS Thin Tablet Review – Allwinner A10 Merimobiles ColonelZap [SchlumpfiHB YouTube channel, April 15, 2012]
                The only cons are that the cameras are “really, really bad”

                TECH SPECS:

                Warranty:
                – 1 Year, click here for details
                CPU:
                Allwinner A10 1.2 GHz
                OS:
                – Android 4.0.3
                Memory:
                1GB DDR3 Ram, 8GB Nandflash built in
                – Extend Memory up to 32GB via micro sd card
                Screen:
                – 7 inch IPS 5 points Capacitive Multitouch
                – 1024*600
                Audio:
                – Stereo Speaker
                – 3.5MM headphone jack
                – Supports: AAC, AAC+, eAAC+, AMR-NB, AMR-WB, QCP, MP3, WMA, WAV, MIDI, M4A
                Video:
                1080P,WMV/ASF/MP4/
                3GP/3G2M4V/AVI/MJPEG/RV10/DivX/
                VC-1/MPEG-2/
                MPEG-4/H.263/H.264
                – 1280*720P HD 30 fps, 1080P,720*480 D1 30fps
                – Real-time Video decode
                Camera:
                Front 0.3MP camera,
                back 2.0MP
                Battery:
                – 3600mAh
                Features and highlights: – Allwinner A10
                – 8GB Nandflash
                – 3D G- Sensor
                – 802.11b/g,support WAPI
                – Capacitive touching panel multi-point( 5 point touch)
                – OTG and host expand
                – USB2.0 data transfer
                – Micro 5pin USB
                – Supports mouse, external keyboard
                HDMI output
                – Multilanguage support
                – Excellent Ebook reader
                – Weather on line
                – Web Browser
                – Slim body
                – Sound Card:AC97
                – 196.3*122.3*8.5mm
                – standby time:36 hours
                – working time:4~5hours (play video online)
                Package Content:
                  • HAIPAD I7
                  • Earphone
                  • USB Cable
                  • Charger
                  Color:
                    • Gray
                    Language:
                    • English
                    Regarding the multimedia capabilities I will suggest to go through a review of a similar tablet: MPMan MID74c (NATPC Primatab 7″) tablet review part 3: multimedia and HD video playing capabilities (Boxchip Allwinner A10) [ARCHTABLET NEWS, May 25, 2012]. Two videos are included there as well!

                    As you can see this process was well visible much earlier, in the beginning of Q2 2012 at the latest. Besides the September milestone of reaching the $99 cost with such a high-quality IPS tablet, another impetus for me to write this post was a last Sunday’s article titled Hardware is dead [VentureBeat, September 15, 2012]:

                    I go to China every four or five months for work. I have to visit all the corporate headquarters in Beijing and Shanghai, but the highlight of every trip is the day I spend at Hua Qiang Road North in Shenzhen. Pretty much every piece of electronics we use today is sourced and manufactured within 100 miles of Shenzhen, and Hua Qiang is the city’s electronics shopping district.
                    On my last trip, in July, I met a ‘procurement’ consultant, and he told me which of the 50 mega malls in the area to visit to buy tablets.
                    In the US, when we talk about tablets we usually mean the iPad and increasingly the Kindle devices, but beyond that there is not much else in the market. I had heard that tablets in China had already reached low price points. You can buy a reasonable Android phone for $100 retail, and I wanted to see if I could find a $150 tablet. This consultant pointed me to a mall filled with hundreds of stalls selling nothing but tablets. I walked into the middle of the scrum to a random stall. I pointed to one of the devices on display and asked, “How much for this one?” 300 kuai. My Mandarin is a bit rusty, so I had to ask again. Slowly, the stall owner repeated renminbi 300 yuan.
                    If this were a movie, the lights would have dimmed and all the activity in the room frozen. 300 renminbi is US $ 45. And that was the initial offer price given to a bewildered foreigner in China, no haggling. I felt a literal shock.
                    I bought the device and did some more research. This was a 7-inch tablet, Wi-Fi only with all the attributes of a good tablet. Capacitive touchscreen. Snappy processor. Front facing camera. 4GB of internal memory and an expandable memory slot.
                    I later found out that these devices are now all over the supply chain in Shenzhen. At volume, say 20,000 units, you can get them for $35 apiece. My device ran full Android 4.0 Ice Cream Sandwich and had access to the full Google API, including Gmail, Maps, YouTube and Google Play (not quite sure how that works either).
                    Once my heart started beating again, the first thing I thought was, “I thought the screen alone would cost more than $45.” My next thought was, “This is really bad news for anyone who makes computing hardware.”
                    My contacts in the supply chain tell me they expect these devices to ship 20 million to 40 million units this year. Most of these designs are powered by a processor from a company that is not known outside China — All Winner [Allwinner]. As a result, we have heard the tablets referred to as “A-Pads.”
                    When I show this tablet to people in the industry, they have universally shared my shock. And then they always ask “Who made it?.” My stock answer is “Who cares?” But the truth of it is that I do not know. There was no brand on the box or on the device. I have combed some of the internal documentation and cannot find an answer. This is how far the Shenzhen electronics complex has evolved. The hardware maker literally does not matter. Contract manufacturers can download a reference design from the chip maker and build to suit customer orders. If I had 20,000 friends and an easy way to import these into the US, I would put my own name on it and hand them out as a business cards or Chanukah gifts.
                    I think this leads to an important conclusion: No one can make money selling hardware anymore. The only way to make money with hardware is to sell something else and get consumers to pay for the whole device and experience.
                    Postscript
                    I thought discovering the A-Pad was pretty exciting. So I was dismayed to find that the week after I got back from China, a device that looks a lot like my A-Pad was on sale at Fry’s Electronics for $79. No brand listed. The process has already begun.
                    Jay Goldberg is a financial analyst with an investment bank. He has been working with tech companies for ten years. Prior to that he lived and worked in China for almost 10 years.

                    A morale of this story is not the one written in the title of the article, i.e. it is not true at all that “hardware is dead”, rather we are witnessing again an old phenomenon first discovered by Intel’s Andy Grove back in the 80’s and coined with a term “[strategic inflection point]”. With no proper representations in places like Wikipedia (don’t confuse with mathemetical concept only included there) you better search the web with the phrase:

                    “Andy Grove” “inflection point” Japanese “memory chips”

                    For me the best quote for my initial purposes here is from the permitted excerpt of Andy Grove’s famous Only the Paranoid Survive [Sept 1, 1996] book, reformatted for more immediate recognition of the intended meanings as follows:

                    I’ll describe what a strategic inflection point is a bit later in this book. For now, let me just say that a strategic inflection point is a time in the life of a business when its fundamentals are about to change.  That change can mean an opportunity to rise to new heights.  But it may just as likely signal the beginning of the end.
                    You can be the subject of a strategic inflection point but you can also be the cause of one. Intel, where I work, has been both
                      • In the mid-eighties, the Japanese memory producers brought upon us an inflection point so overwhelming that it forced us out of memory chips and into the relatively new field of microprocessors.
                      • The microprocessor business that we have dedicated ourselves to has since gone on to cause the mother of all inflection points for other companies, bringing very difficult times to the classical mainframe computer industry
                        Having both been affected by strategic inflection points and having caused them, I can safely say that the former is tougher.

                        Next I should give a brief explanation for “changing fundamentals of a business”. As is obvious from the recollection given below (section 2.) there were certain assumptions on which Intel’s original DRAM business was based upon. These assumptions were questioned by its Japanese competitors entering the lucrative DRAM market, first time winning against Intel in 1979 with better manufacturing yields and then by 1982 in terms of overall manufacturing competence as well. Equally important was that Intel was not able to remedy the situation although the symptoms were well recognized and seemingly effective actions were taken as well.

                        Please study that recollection first and then the sections which follow after that and which describe the observable facts about this very latest strategic inflection point. You will be able to both understand the current situation properly (unlike the investment analyst quoted above) as well as to predict the possible outcome of this inflection point for the ICT industry as whole (with the highest probability possible at all). I wish you good reading!

                        From the brief understanding of the new challenge as given above I should also paraphrase my remaining points of study as:

                        2. A proper recollection of what happenned to Intel’s memory business
                        3. The market and industry situation reflecting this new inflection point
                        4. The Allwinner advantage
                        5. The wireless display and 2160p (“Quad HD”/4K) outlook
                        6. Are the established client device players recognizing this strategic inflection point or not?
                        7. Possible further hardware advances sustaining this new trajectory


                        2. A proper recollection
                        of what happened to Intel’s memory business

                        Exerpts about the factual evidence are taken from the following scientific article:
                        A PROCESS MODEL OF STRATEGIC BUSINESS EXIT: IMPLICATIONS FOR AN EVOLUTIONARY PERSPECTIVE ON STRATEGY [Robert A. Burgelman, Strategic Management Journal, Vol. 17, 193-214 (1996)] (available here for download)

                        Table 1. Key events in the evolution of DRAMs at Intel: 1970-85
                        1970
                        E1. Intel introduced the first 1K (kilobit) dynamic random access memory (DRAM) in volume. The product used the new metal-oxide semiconductor (MOS) process technology. This process technology was relatively slow but less power consuming than the standard bipolar process technology. Intel was the first successful mover in DRAMs.
                        1972-74
                        E2. Intel introduced 4K DRAMs. Intel captured more than 80% of the 4K DRAM market in 1974.
                        E3. The first competitive challenge came from Mostek, a new startup. Mostek focused on user-friendliness of DRAMs in the 4K DRAM generation.
                        1976-77
                        E4. Intel introduced a standard 16K DRAM. Intel captured more than 35% of the 16K DRAM market in 1976.
                        E5. The competitive challenge from Mostek and others continued. By 1979, Intel’s market share in standard 16K DRAM was less than 5%.
                        E6. High demand for EPROMs created a shortage in Intel’s manufacturing capacity. For the first time, DRAM manufacturing capacity was shifted toward the higher-margin EPROM products.
                        1979
                        E7. Intel introduced the first 5-volt ‘single-power-supply’ 16K DRAM. Single-power supply greatly simplified the user’s design and production tasks. In 1979, Intel was the only supplier of single-power-supply 16K DRAMs and captured a price premium of double the industry average for three-power-supply 16K DRAMs.
                        E8. Intel expected the 64K DRAM generation to be introduced later and to be based on single power supply. Fujitsu introduced a standard 64K DRAM in 1979 and captured a large market share.
                        E9. The single-power-supply 16K DRAM remained a small-niche product.
                        E10. Intel fell behind in manufacturing yields relative to top Japanese producers of DRAMs (Prestowitz, 1988: 46).
                        1982
                        E11. Intel’s 64K DRAM with ‘redundancy’ entered production. Redundancy involves adding an extra column of memory elements so that, in the event of a process-induced defect, the auxiliary column could be activated. This allows a defective memory chip (at testing) to be reprogrammed before shipment and to increase yields. Intel expected that ‘redundancy’ would help overcome its disadvantage in manufacturing yields relative to the Japanese, and that the 256K DRAM generation would be based on the redundancy process technology.
                        E12. However; Fujitsu and Hitachi entered with a standard 256K DRAM in 1982 and captured a large market share.
                        E13. Intel was now far behind in manufacturing competence relative to the Japanese.
                        March 1985
                        E30. COO Andy Grove felt strongly that the burgeoning logic (microprocessor) business needed to get more resources
                        Summer 1985
                        E34. The General Manager of the Components Group stepped down and was reassigned to another business area. Andy Grove assumed direct operational control over the DRAM exit process. He assigned two senior managers to immediately and fully implement the DRAM exit decision.
                        October 1985
                        E35. The decision was reached to close Fab 5 for DRAM production. Fab 5 was to be transformed into a process technology site for microprocessors. Animosity and mistrust between manufacturing and process technology personnel flared at Fab 5.
                        E36. Andy Grove went to Portland to speak to the group: ‘Welcome to the Mainstream Intel’. That is, Intel the ‘microcomputer company’.

                        Intel’s initial success in the 1K (kilobit) DRAM (1971-73) was due to the ability of its technologists to come up with a process technology that allowed production yields sufficiently high to beat magnetic core memory, which was the industry standard of the day, in the market (E1). Process technology was therefore viewed by Intel management as the firms’ ‘distinctive competence’ (Selznick, 1957) on which its ability to differentiate its products and get a premium price depended (E7, E11, E18, E22). Having maintained leadership in the 4K DRAM generation (1972-76) (E2, E3), Intel’s process technologists came up with the first 5-volt single-power-supply 16K DRAM in 1979. Intel process technologists decided to focus on the single-power-supply 16K DRAM because they projected a relatively long life cycle for the 16K generation due to the technological challenges posed by the 64K generation (E18). They also believed that the single-power-supply process would eventually dominate the memory industry. They considered it too risky to tackle both the 64K DRAM generation and the single power supply in the same product.
                        While it is usually difficult to observe distinctive competence independent of the successful product with which it is associated, and the risk of tautology is high, Intel’s pattern of strategic actions offers the opportunity to make independent observations. When changes in the DRAM industry structure shifted the basis of competition from process technology to largescale precision manufacturing, Intel continued to rely on process technology to compete in four successive product generations. The first independent observation concerned the 16K DRAM generation. But, as documented below, inertial deployment of process technology competence was also observed in the 64K, 256K, and 1 Meg (megabit) product generations. Paradoxically, the distinctive competence that provided Intel with its initial competitive advantage became a source of failure later on.
                        Falling behind reinforces the impetus process
                        Falling behind in the market made it difficult for the DRAM business managers to compete with Intel’s other businesses for resources. Business managers had tried to reposition Intel’s single power-supply 16K DRAM as a niche product that would fetch a higher unit price (‘2x’). They had expected that eventually the whole 16K market would have to go for single-power-supply. This did not happen for the 16K generation, however, and further impetus for exit was gained when the strategy to reposition Intel’s DRAMs as niche products failed (E9; Cogan and Burgelman, 1990).
                        Repositioning
                        Intel was already late in the 64K generation and Japanese companies had entered the DRAM market in 1979. In addition, Intel’s 64K product design was flawed and expected to result in uncompetitive low manufacturing yields (E10). The DRAM process technology group responded by introducing a new process technology called ‘redundancy’, as a way to overcome the low yield problem (E11). This new process, however, had a major defect which showed up late in its development. Intel introduced its 64K DRAM with redundancy only in 1982. These delays were fatal for Intel’s strategic position in the 64K generation. A former General Manager of the Memory Components Division (during the early 1980s) said that he took a 1-week trip to see the Intel sales engineers and explain that Intel would be late. He said (Cogan and Burgelman, 1990: 15):
                        The sales force was very disappointed in the company’s performance. Any sales force wants a commodity line. It’s an easy sell and sometimes it’s a big sell. That trip was perhaps the most difficult time in my whole career. When I announced we would be late with the product, the implication was that Intel would not be a factor in the 64K generation.
                        Having assessed that they were behind in the 64K generation, the DRAM process technology group took another gamble. They had come up with yet another innovative process technology—complementary metal-oxide semiconductor (CMOS)—which was to eventually supersede the standard n-channel MOS (NMOS) technology. They decided to apply the CMOS technology to a new 64K DRAM product as well as in the 256K generation (E16). This raised the difficult question for the memory components division about how to effect the transition from NMOS to CMOS. The NMOS products had been made at the Chandler (Arizona) facility, but that capacity had been shifted to microcontrollers based on the maxmize margin-per-wafer start rule. In early 1984, the decision was made to phase out the NMOS line (E17).
                        The former General Manager of the Memory Components Division (during the early 1980s) said that the new business strategy was to reposition Intel in DRAMs. The idea was to create a niche market with premium pricing for 64K and 256K CMOS products, so that Intel could maintain a memory presence while accelerating back into an overall leadership position at the 1 Meg (Megabit) generation. But for both the 64K and 256K DRAM products, the innovative solution did not produce competitive advantage. The large majority of customers for the 64K generation were looking for standard products of high quality (few defect devices) at low prices. Japanese companies provided what customers wanted at very low prices. The Japanese had introduced standard 256K DRAMs in 1982 (E12), and Intel had fallen far behind the Japanese in manufacturing yields (E13). Intel entered with its CMOS 256K product only in 1984, and it remained a small niche product. The former General Manager of the Memory Components Division (during the early 1980s) said that standard DRAMs were being sold at less than half of the price Intel was asking, and the improved performance of the CMOS chips just wasn’t worth it to most customers. Intel’s repositioning effort resulted in completely losing strategic position in the DRAM market. Intel’ s market share shrunk from more than 80 percent in the 4K DRAM generation in 1974 to less than 1 percent in the 256K DRAM generation in 1984 (Cogan and Burgelman, 1990). Repositioning thus failed to reestablish Intel as a key player in the industry. Also, prices for the niche products were lower than expected, making it harder for DRAMs to compete with other products for Intel’s scarce manufacturing resources.
                        The Director of Technology Development observed that Intel’s DRAM business had entered a ‘death spiral’. In the face of strong competition from Japanese manufacturers, business managers’ focus on the more profitable products and technology development’ s preoccupation with leading-edge processes contributed to missing the
                        DRAM mainstream market. This led to cutbacks in manufacturing capacity and budgets which made it even more difficult to compete. This manager, in an interview in October 1988, anticipated a similar vicious circle (‘death spiral’) for EPROMs, which had also become a commodity product, and correctly foresaw the decision to exit from EPROM manufacturing, which happened in 1991.
                        Strategic context
                        For Intel’s top management, the strategic context of DRAMs had always been very clear. DRAMs had very strong legitimacy. DRAMs was the business that ‘made Intel’, as one senior manager put it, and some top managers, including the CEO, viewed DRAMs as a core business and one that served as technology driver on which the learning curve of the company depended. It was not easy for top management to admit that the legitimacy of DRAMs was vanishing. And it was difficult to decide to exit from DRAMs even though objective analysis seemed to suggest that this was the appropriate course of action in light of Intel’s strategic alternatives.

                        3. The market and industry situation
                        reflecting this new inflection point

                        Let’s see first the latest market data by one global analyst companies, IDC:image 
                        Source: IDC Expects Smart Connected Device Shipments to Grow by 14% Annually Through 2016, Led by Tablets and Smartphones [IDC press release, Sept 26, 2012]

                        According to the latest information from China the tablet market is quite underestimated by IDC:

                        How many tablets does China make, how big is the Chinese market?
                        80 percent of media tablets made in China are exported
                        Unit: Million of units
                        S
                        ource: Chinese industry estimates

                        as China alone will be delivering 50 million tablets this year and the overall Chinese estimate is 155 million units vs. 120 million per IDC:

                        By volume, the Android tablet sector has grown to an estimated 80 million units, outpacing the 75 million iPads sold by Apple thus far, according to estimates by Rockchip [marketing] vice president Feng Chen.

                        as reported by Junko Yoshida, ex-editor in chief of EE Times who now has a strong emphasis on China as “a roving reporter”: 

                        in China Fabless: Rockchip rattled by Android tablet wars [Sept 25, 2012]
                        Just nine months ago, Fuzhou Rockchip Electronics, a developer of apps processor for tablets, looked almost invincible. …
                        … since then, the Android-based media tablet market has gotten far more competitive. By volume, the Android tablet sector has grown to an estimated 80 million units, outpacing the 75 million iPads sold by Apple thus far, according to estimates by Rockchip [marketing] vice president Feng Chen.
                        At the beginning of 2012, the target price of a 7-inch capacitive screen media tablet featuring Cortex-A8 was $99. That price has since dropped to around $65, due largely to Allwinner, a red-hot Chinese fabless company that has flooded the tablet market with its own turnkey system. … Rockchip’s situation vividly illustrates the challenges most Chinese fabless chip companies now face.

                        During a recent interview with EE Times here, Rockchip’s Chen said, “This is a new world war we’re fighting.” … Indeed, nearly every apps processor [sic, SoC] vendor here is in a rough spot because “the time-to-market requirement has gotten much shorter,” he noted. “Worse, catching the market rhythm or cycle — at the right time – has become much harder.”

                        “… now, as end-product cycles get shorter, we do everything from designing a chip to developing a board and software that goes around the hardware — literally within a couple of months,” he explained. In March, for example, Rockchip started to design its RK3066, a dual-core Cortex A9 chip with a quad-core Mali-400 GPU. By April [15], it hustled to showcase sample tablets based on the chip at the Hong Kong Electronics Fair. By May, the company began shipping the new apps processor to its customers.

                        Note regarding the timing of RK3066 SoC development:
                        – The initial version of RK3066 datasheet brief is dated Oct 30, 2011. the 1.0 version of it February 15, 2012.
                        – The RK30xx platform was announced on Feb 27, 2012 with information that “Dual-core ARM Cortex-A9 processor with up to 1.4GHz speed, implemented with Artisan Processor Optimization Pack (POP)” and that “Samples of the Rockchip RK30xx platform will be available in March 2012.”

                        Unlike other startups here, Rockchip has been profitable from the start. But as the tablet battle heats up, it also needs to find a way to move to the next level. “We are fighting a world war. We need the world’s top talent.”
                        The company also needs access to capital. Without it, Rockchip can’t even think about mergers or acquisitions. Organic growth alone won’t get it to the next level, Chen acknowledge, saying he expects consolidation in the Chinese fabless sector but “no Chinese companies want to give up.” 
                        Lastly, Chen said, “We need to be clear on the market” so that Rockchip can choose its battles.

                        Another of her observation:

                        Yoshida in China: How Nokia failed, MediaTek won [Sept 26, 2012]

                        Earlier this month when I sat down for breakfast here with Feng Chen, vice president of China fabless company Rockchip, he abruptly asked if I knew the “80-3-2 rule.” I had never heard of it.
                        The subject came up as we were discussing the global media tablet market. Chen, who noted that this is his personal theory, not Rockchip’s, explained: If you design a system (or chip) with performance of at 80 percent compared to the best-in-class product on the market, and if you offer it at one-third the price, you can double the sales volume of your system (chip).
                        Chen used the media tablet market as an example. Many Android-based tablets with relatively less performance than Apple’s iPad, will eventually exceed sales of iPad in volume, he argued.
                        In other words, don’t over-engineer it.
                        Android, along with outsourcing and faster product turnarounds are the key elements that make the 80-3-2 rule possible. The rule also offers a mechanism for getting products in the hands of consumers.
                        Source: IHS iSuppli
                        Does the 80-3-2 rule make sense? Sort of.
                        The chart above illustrates the theory’s flaw: While Apple gets all the profits generated by the iPad, sales revenue for the Android camp is divvied up by many me-too Android tablet and chip suppliers.  Presumably those companies, all subscribing to the 80-3-2 rule, are fiercely undercutting one another, further reducing their margins.
                        So, the 80-3-2 rule is simplicity itself, but it doesn’t look sustainable to me.
                        Chen’s theory reminded me of something else. The Economist carried a story about “frugal innovation.” The article cited companies like General Electric and India’s Tata Consultancy Services (TCS) that developed new products like a hand-held electrocardiogram (by GE) and a water filter (TCS).
                        “Instead of adding ever more bells and whistles, they strip the products down to their bare essentials,” embarking on “frugal innovation,” or as it is sometimes called, “reverse innovation,” the Economist explained.
                        According to the Economist, “Frugal innovation is not just about redesigning products; it involves rethinking entire production processes and business models. Companies need to squeeze costs so they can reach more customers, and accept thin profit margins to gain volume….”
                        Therein are the dots we can use to connect to Chen’s theory. His 80-3-2 rule also addresses the issue of how a company finds a way to develop a product and a business process to squeeze costs, gain volume and reach millions of new customers.
                        (Full disclosure here. The Economist article was first pointed out to me by a U.K.-based engineering executive who works for Taiwan’s chip giant MediaTek. He was explaining how MediaTek’s recent success has a lot to do with “frugal innovation.” MediaTek, virtually unknown 10 years ago, is now a power house with huge market share in the Chinese smartphone  and media tablet markets.)
                        MediaTek has fundamentally changed the playbook for the chip industry here, especially for smartphones and tablets. More chip suppliers for smartphones and tablets who are competing with MediaTek are now expected to provide similar “turnkey systems” that MediaTek delivers, rather than just reference designs.
                        Technology development, especially in the electronics industry, has historically been one-dimensional. It all pretty much comes down to how your engineering team makes a system operate faster, run more apps and features, while consuming less power.
                        Frugal, or reverse, innovation and the 80-3-2 rule both suggest that it’s time to rethink innovation in more in multi-dimensional terms.
                        I can think of two good examples for how ignoring reverse innovation costs companies. … Nokia … Japanese LCD TV manufacturers like Sharp …

                        Her latest report continues with Yoshida in China: ‘Shanzhai’ clouds tablet data [EE Times, Nov 8, 2012]

                        NEW YORK – The global tablet market may be a lot bigger — perhaps as much as 50 percent bigger — than previously thought depending on how you measure the increasing numbers of “Shanzhai” tablets produced in China.
                        Loosely translated, “Shanzhai” means white box, as in, no label. These tablets manufactured in China are distinguished from “knockoff” products, which the original Chinese term “Shanzhai” suggests.
                        Earlier, I wrote about the global market for tablets during the third quarter of this year. According to estimates, shipments reached 27.8 million units.
                        Several industry sources based in Beijing and Shenzhen responded with notes  saying that the math behind the industry estimates didn’t add up. The Chinese observers argue that most estimates ignore the size of the white box tablet market. 

                        Factoring in the number of apps processors shipped by Chinese fabless companies and tablet displays from its panel vendors, the number of white box tablets made in Shenzhen during the third quarter could total as high as 18 million units, Chinese sources claimed. 

                        Add those to the branded tablets sold by Apple, Samsung, Amazon, Asus and Lenovo and the global tablet market in the third quarter jumps to 42.5 million units. That’s 52 percent more than the global total estimated by IDC in 3Q.
                        This huge gap makes me wonder what other Chinese consumer electronics products are uncounted or under-counted.

                        One thing to take into account is Chinese fabless chip company Allwinner Technology — how it operates and and how it has taken advantage of the growing white box market.

                        The  applications processor vendor has substantially expanded its market share over the last 18 months, primarily based on the strength of its turnkey system that has been described as “super easy to use” by Chinese industry sources. The solution allegedly makes it a snap for practically any white-box vendor to make media tablets and ramp up production in a Shenzhen minute.

                        According to sources in Shenzhen, Allwinner holds as much as 60 percent of the white box market and shipped 3.5 million apps processors in August alone. Allwinner is said to have shipped 5 million apps processors in October, generating $30 million revenue (at a $6 average selling price). If true, wow!

                        The momentum behind white box tablet production in Shenzhen is building. Chinese sources now believe shipments have climbed from 6 million units in August to 9 million in October.

                        Who’s buying all these tablets?

                        A source in Beijing describes them as “tablets shipped by no-name brands at about $50.” The end market is not necessarily China, but “mostly emerging economies including Southeast Asia, the Middle East, Eastern Europe, South America and Africa, etc.” He added that Chinese consumers “have similar tastes and demands as those living in the developed world. They don’t really buy these low-end tablets. They buy iPad or Samsung.”

                        If true, we may need to rethink not just the size of the booming tablet market, but the consumer revolution triggered by the tablet market well beyond China’s border.
                        The lack of recognizable brand names makes it that much harder to track unit shipments. Plus, chip shipment figures can be inflated or double-counted. Then there is China’s vast gray market.
                        Even taking all of those factors in account, the explosion of tablets in emerging markets is no mirage – and it might be spreading much faster than any one imagined.
                        For example, one source in Shenzhen estimates that  annual shipment of white box tablets this year could hit 50 million units.

                        With all that she (Junko Yoshida) came closest from the West to understand the new ICT phenomenon rooted in China. Now let’s look at what others have come to so far:

                        The overall tablet market trend is illustrated by IHS iSuppli via the tablet display shipments as follows: 

                        image

                        then it is described in Global Tablet Display Shipments to Soar by 56 Percent in 2012 [IHS iSuppli press release, Sept 17, 2012] as:

                        … [the first part of the press release is essentially giving information which is represented by the diagram above] …

                        LG and Samsung Dominate Tablet Display Shipments
                        LG Display and Samsung Display were the main suppliers of tablet displays in the first quarter with 42 percent and 38 percent shipment market share, respectively. Both are market leaders because they make the liquid crystal display (LCD) panels that are used in the iPad, which continued to dominate the media tablet space with a commanding 58 percent of all tablets shipped in the first quarter.
                        [LG Display holds 70% of iPad panel shipments [DIGITIMES, Sept 20, 2012]: while Samsung Electronics, Sharp and Chimei Innolux (CMI) have all been seeing decreasing shipments … CMI will make up less than 5% of overall iPad panel shipments by the end of the third quarter in 2012.]
                        Aside from supplying Apple, LGD also furnishes display panels to Amazon and Barnes & Noble, while Samsung provides panels to its internal tablet division. Investments are being made by the two major tablet panel suppliers in capacity allocation and technological improvements to supply high-performance tablet panels and to develop wide-viewing-angle technologies like in-plane switching (IPS) and fringe-field switching (FFS). Both LGD and Samsung Display are also looking to convert amorphous-silicon fabs into making oxide silicon panels to help improve tablet panel resolution, power consumption and overall performance.
                        Panel Manufacturers Enter the Tablet Panel Fray
                        Other LCD panel suppliers also are jumping into the fast-growing tablet market. In particular, Japanese suppliers such as Sharp, Japan Display and Panasonic are actively targeting the tablet panel market by dedicating capacity at their Generation 6 and Generation 8 fabs in order to make tablet panels.
                        Together the capacity allocation this year for small and medium displays by the Japanese is expected to increase 164 percent from last year’s levels, reaching 5.5 million square meters in 2012. Of particular interest is the oxide silicon capacity at Sharp, which has been supplying panels from its G8 fab for the latest iteration of the iPad—also called the new iPad. Another company, Panasonic, is likely to produce 7.x-inch and 8.x-inch tablet panels during the second half of this year.

                        For their part, LCD suppliers based in Taiwan, such as AU Optronics and ChiMei Innolux, reportedly are adjusting their business models—some to focus on tablets for the education sector, and others to supply tablets for the white-box market in China.

                        It is believed that AUO may be one of the suppliers qualified to supply the smaller iPad’s 7.85-in panels.

                        But unlike Tier 1 tablet display makers LGD and Samsung Display, Taiwanese panel suppliers primarily target the Chinese market that is geared more toward lower-priced tablets. To meet lower price points, display specifications are usually dialed down compared to Tier 1 products. Displays targeted at the white-box tablet market in China mainly employ the more basic twisted nematic (TN) LCD, not the wide-viewing-angle LCD technologies of IPS and FFS.

                        Regardless of the display technology and market segment, display suppliers are making sure they align their strategies to serve this fast-growing market.

                        Chimei Innolux to Win 40%-50% Share of White-brand Tablet PC Touch-panel Market [CENS, Aug 15, 2012]

                        Chimei Innolux Corp., the largest thin film transistor-liquid crystal display (TFT-LCD) panel manufacturer in Taiwan, is expected to win a 40% to 50% share of the global market for white-brand tablet PC applications, according to the company.

                        Some 40 million to 60 million white-brand tablet PCs are expected to be shipped this year, similar to the total shipments of Apple`s iPad.

                        Major market research firm DisplaySearch recently forecast that some 121 million tablet PCs would be shipped worldwide this year, and the annual volume would increase to 416 million units in 2016, in conjunction with a compound annual growth rate (CAGR) of 28% over next five years. Apple would continue to be the market leader in next five years with a market share of 60%, while white-brand counterparts are expected to enjoy high growth due to their advantageous pricing.
                        Jeff Hsu, Chimei Innolux`s vice president, pointed out that demand for white-brand tablet PCs from emerging markets has been quite strong this year. In addition to sales in China, many Chinese white-brand tablet PC makers also export products to other nations. So, the annual demand for touch panels for white-brand tablet PCs this year is expected to reach some 60 million units, with 7-inch models as the mainstream and followed by 10-inch ones. Chimei Innolux aims to ship more than 25 million touch panels for white-brand tablet PCs, accounting for 40% to 50% of the application market, Hsu said.
                        Hsu also added that this year, the mainstream touch-panel type in tablet PC application has shifted from resistor to capacitive, which is expected to benefit many Taiwanese suppliers with more advanced technology. Jtouch Corp. of Taiwan, for example, is stepping up boosting production capacity of its new touch-panel factory in Hunan Province of China. The firm`s large-sized touch panels are expected to account for more than 20% of its revenue this year. Mutto Optronics Co., Ltd. recently also won big-ticket orders for tablet PC touch panels, and expected to see a 30% sequential revenue growth in the third quarter.
                        Google recently pushed its Nexus 7 tablet PC priced for only US$199, and the company immediately sold out one million units. A white-brand tablet PC with 7-inch screen is often priced for about US$100 only, and such more affordable device has won very hot market responses in Latin America, Southeast Asia etc. Currently, monthly tablet PC shipments in China are between three million and four million units.

                        However in Tablet PCs will have good sales in the third quarter [Micdigi from China, July 19, 2012], from a knowledgeable source in Shezhen:

                        In the first quarter of 2012, the manufactures have good business, but in the second quarter they have so worse business.
                        As they have produced so many products in the first quarter, they have large stock of goods that they have to mark down price to sell them.
                        In the second quarter of 2011, the tablet PCs has good sales. But in this year, it is so cold.
                        In the third quarter, tablet market will rebound.
                        VIA chips was the winner in all the chip manufactures last year.
                        But in this year, Allwinner with high cost/performance chips gets the winner.
                        Most of Shenzhen tablet manufactures export to other countries. Because Chinese do not like knock off tablet PCs or SurperPad tablet PCs, they like brand ones.
                        In the third quarter, the tablet market will rebound and the fourth quarter will be the boom season.
                        I think the manufactures must get ready for the fourth quarter.
                        They had better prepare products with high cost performance.

                        This is one of the reasons why Nexus 7 not yet allowed to enter China market [Sept 11, 2012]:

                        While the Nexus 7, the tablet co-developed by Google and Taiwan-based vendor Asustek Computer, has been witnessing booming sales in major markets around the world, it is difficult for the model to be available for sale in the China market because the China government has not yet approved its import, according to industry sources in Taiwan.
                        The China government’s negative attitude is interpreted as a response to Google’s announcement of withdrawing from the China market in March 2010, the sources pointed out. It is difficult for the Nexus 7 to enter the China market, even through sale of Asustek’s marketing network there, the sources indicated.
                        Without the Nexus 7 in the market, China-based white-box vendors of tablets are under much less competitive pressure, the sources indicated. This is because the Nexus 7 has the advantage of Google’s and Asustek’s brand image with commensurate product quality and is expected to be strongly competitive with 8GB Android 4.0 tablet models in the 7- to 9-inch range launched by China-based white-box vendors, including Ainol, Onda, Teclast and Cube, at US$149, the sources pointed out. In addition, the Nexus 7 will bring competitive pressure on tablet PC models of equal specifications offered by Samsung Electronics and China-based vendors Lenovo and Hasee Computer in the China market, the sources indicated.
                        Without the China market, the cumulative global sales volume of Nexus 7 will reach an estimated 3.5 million units at the end of 2012, the sources noted.

                        Tablet Shipments to Surpass Notebook Shipments in 2016 [NPD DisplaySearch press release, July 3, 2012]

                        Total Mobile PC Shipments Exceed 800M Units by 2017
                        Tablet PCs, such as Apple’s iPad, are expected to be the growth driver for the mobile PC market over the next few years. Tablet shipments will surpass notebook shipments in 2016, according to the latest NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report. Overall mobile PC shipments will grow from 347M units in 2012 to over 809M units by 2017.
                        While notebook PC shipments are expected to increase from 208M units in 2012 to 393M units by 2017, tablet PC shipments are expected to grow from 121M units to 416M units in this period, for a compound annual growth rate of 28%. A key driver for tablet PC growth is adoption in mature markets (including North America, Japan and Western Europe), which will account for 66% of shipments in 2012 and remain in the 60% range throughout the forecast period. Tablet PC shipments into mature markets will grow from 80M units in 2012 to 254M units by 2017.
                        Figure 1: Worldwide Mobile PC Shipment Forecast (000s)

                        Source: NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report
                        “Consumer preference for mobile computing devices is shifting from notebook to tablet PCs, particularly in mature markets,” said Richard Shim, senior analyst at NPD DisplaySearch. “While the lines between tablet and notebook PCs are blurring, we expect mature markets to be the primary regions for tablet PC adoption. New entrants are tending to launch their initial products in mature markets. Services and infrastructure needed to create compelling new usage models are often better established in mature markets.”
                        Figure 2: Emerging and Mature Market Tablet Shipments (000s)

                        Source: NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report
                        Building upon convenience-oriented features including instant-on capability, long battery life and extreme portability, tablet PCs are expected to evolve in form factor and performance, making them a compelling alternative to notebook PCs. Tablet PCs are expected to incorporate multi-core processors, increasingly stable operating systems, growing app libraries and higher resolution displays.
                        In addition, notebook PCs are also evolving to meet the challenge from tablet PCs. Thinner form factors, higher resolution displays and touch functionality features are expected to increase. The notebook PC market will remain the largest part of the mobile PC market during the forecast period, accounting for 60% of mobile PC shipments in 2012, declining to 49% by 2017.

                        Digitimes Research: China tablet SoC developers enjoy robust shipment growth in 2012 [DIGITIMES Research, Nov 20, 2012]

                        There has been a surge in demand for tablet-use SoC solutions in the China market thus far in 2012, benefiting local IC design companies such as Allwinner Technology, Rockchip Technology and Amlogic, according to Digitimes Research. The tablet-IC market in China is dominated by local SoC developers, which mainly adopt the ARM architecture enabling a low-cost and easy-to-design platform.

                        Shipments of China makers’ branded and white-box tablets destined for the local market are forecast to reach about 15 million units in 2012, while those destined for overseas will climb to as high as 44.15 million, Digitimes Research said. In total, shipments of China makers’ branded and white-box tablets are estimated at nearly 60 million units in 2012, Digitimes Research indicated.

                        China’s white-box tablet companies will account for 81% of the overall units shipped in 2012, Digitimes Research said. Shipments of China’s brand-name tablet companies are set to reach only about five million units in 2012, Digitimes Research added.

                        Europe, the Middle East, Southeast Asia and South America are the key markets which China-based tablet exporters will target in 2012, Digitimes Research noted. The exporters, mainly white-box makers, have their products sold through local distributors and telecom carriers in the target markets. [8%]

                        Allwinner will unseat Rockchip as the top developer of tablet SoCs in 2012. Allwinner is forecast to ship a total of 22 million chips in 2012 [37%], while Rockchip‘s shipments will total 12.5 million units [21%], Digitimes Research said. Amlogic will rank third with shipments of 5.5 million units [9%],  followed by Taiwan-based VIA Technologies with 4.5 million units [8%], according to Digitimes Research.
                        Source: Digitimes Research, November 2012

                        Non-Apple tablets to drop to US$150-200 upon release of upcoming 7.85-inch iPad [DIGITIMES, Sept 18, 2012]

                        Tablets priced US$199-400 are expected to drop in price to US$150-200 in order to help non-Apple tablet makers stay competitive when Apple releases its reported 7.85-inch iPad, according to industry sources.
                        The sources are predicting that Apple will have a big influence on the 7-inch tablet market just like it currently has with its 9.7-inch iPad series and competitors will need to drop their tablet prices as well as provide more value-added features for the devices, said the sources.
                        If major tablet makers were to drop product prices they would most likely not incur losses as many makers make a substantial amount of profits from 3G plans with telecommunication providers, added the sources.
                        The sources still haven’t confirmed an exact release date for Apple’s 7.85-inch iPad but are expecting it will be early in the fourth quarter.

                        MediaTek’s Q3 sales expected to beat company’s guidance [Focus Taiwan, Sept 16, 2012]

                        … Bill Lu, a Morgan Stanley analyst in Hong Kong, expected MediaTek to ship over 200 million smartphone chips in 2013 by offering a more complete solution to Chinese handset. …

                        Another upside factor for MediaTek is growing interest in “white-box” tablets in emerging markets, which could approach 100 million to 150 million units in 2013 and drive up MediaTek’s revenue if the company can tap into the supply chain, Lu said.

                        A white-box tablet is a model without a registered brand name, which is usually sold more cheaply than branded tablets to gain traction among price-sensitive consumers.

                        Global shipments of white-box tablet PCs to reach 40 million units in 2012, say chip designers [DIGITIMES, July 25, 2012]

                        Forecast global shipments of white-box tablet PCs in 2012 have been upward adjusted from 30 million units originally to 40 million units due to growing demand in emerging markets including China, India, Thailand and Latin America, according to Taiwan-based design houses of ICs used in tablet PCs.

                        An estimated 10 million white-box tablet PCs were shipped globally in 2011, and shipments increased to 18 million units in the first half of 2012, the sources indicated.

                        Vendors/makers of white-box tablet PCs currently cluster in Shenzhen and Dongguan, southern China, the sources noted. A large portion originally made netbooks and have stepped into tablet PCs as chips and the Android operating systems have matured, the sources said.

                        White-box tablet PCs are primarily competitive in price with models launched by own-brand vendors, with retail prices standing at US$59 for 7-inch models and US$149 for 10.1-inch models, the sources indicated.

                        China white-box vendors showcase tablets at HK fair [DIGITIMES, April 16, 2012]

                        Many China-based white-box vendors are showcasing 7.0-inch tablet PC models at shipment prices of US$65-80 and 10.1-inch models at US$100-110 at the 2012 Hong Kong Electronics Fair (Spring Edition) taking place during April 13-16.
                        These white-box vendors include Dream Technology, Aocos, PCTX, HKC, Onn and Onda.
                        These tablet PC models are equipped with chipset solutions mostly developed by China-based Allwinner Technology, Android 4.0, Wi-Fi modules, 4GB built-in memory, 800×480 or 1,024×600 16:9 touch screens, plastic casings. In addition, 9.7-inch tablet PCs equipped with IPS touch screens and metal casings are priced at US$130-140.
                        If these tablet PC models are also equipped with 3.5G modules, shipment prices will increase by US$45 on average, according to white-box vendors.
                        White-box vendors indicated that they have reached combined shipments of three million tablet PCs a month.

                        China-based white-box tablet PC makers ramping up shipments, say sources [DIGITIMES, April 13, 2012]

                        China-based white-box tablet PC makers have ramped up their combined shipments to three million units a month recently, and total shipments of tablet PCs by all makers are expected to top 50 million units in 2012, market research firm eMedia Asia has estimated.
                        In Guangdong province alone, hundreds of small- and medium-size businesses have entered the development and production of tablet PCs on an OEM, ODM or OBM basis, according to industry sources.
                        With the availability of Android 4.0 platform, white-box makers have rolled out tablets in 7-, 8-, 9.7- and 10.1-inch sizes with specifications catered to customer’s demand, said the sources, adding that the models target markets in the Middle East, Southeast Asia and Latin America.
                        The white-box makers are able to deliver a 10.1-inch model, which runs on Android 4.0 and has a display resolution of 1024 by 600 and 4GB built-in storage, at FOB prices of about US$100-110, indicated the sources.
                        Shipments of tablet PCs by China-based makers totaled 14 million units in 2011, eMedia Asia said.

                        Suggested further reading: Here is a recent set of briefing documents produced by Seasize Technology Co., Ltd, formed in 2007 in Shenzhen China with roots in trading of electronic goods for export as early as 2005, see: Support [Seasize, Aug 20, 2012] 

                        Download Free
                        CHINA TABLET PC SOURCING GUIDE (English) [Aug 8, 2012]
                        This is a guide to purchasing (“sourcing”) from China, and working with Chinese factories. It will probably be most helpful to people like me – entrepreneurs developing a new product or starting a new business that need to obtain parts and raw materials from China. It is written humorously, but hopefully there is some useful advice.
                        CHINA TABLET PC WHOLDSALES MARKET 2012(English) [Aug 7, 2012]
                        This article is provided by Seasize Technology- professional tablet PC manufacturer in Shenzhen,China, exclusively to customers. You may share this information to your friends and colleagues. Seasize should not be held responsible for any information that may be misleading or incorrect.
                        CHINA TABLET SOLUTIONS INTRODUCTION(English) [Aug 8, 2012]
                        This article is provided by Seasize Technology- China popular tablet pc solutions:chips company&chips introduction. The performance of a tablet model is determined by the tablet solution. To select and source the right tablet products, you have to know the difference among tablet solutions and identify the right tablet designers and manufacturers.
                        which are giving a kind of industry insider’s view into the complex world of the Chinese ICT goods market.
                        How relevant is it? A year earlier Company Introduction [Sept 5, 2011] described Seasize Technology’s business as:
                        After years of development, Seasize technology already has a strong domestic procurement and export capacities. We are committed to provide affordable and quality digital video and GPS navigation products. Our company persist the principle of: Customer first, quality first not only meets the needs of customers and has been recognized by customers.
                        Since its inception, the company mainly engaged in two major product lines: digital audio playback systems and GPS navigation devices,
                        Digital audio and video aspects of the products covered MP3/MP4/MP5 players, digital TV set-top box, digital television etc.
                        GPS navigation devices contain : GPS navigator, GPS tracker, networking version of GPS, GPS navigation and digital TV combo products, and the recently launched GPS navigation function with Internet personal terminal device (MID).
                        Based on trade in the same time, has been developing its own brand and own technology products, after years of effort, the company has filed multiple patents in the country, and has registered the brand. Dependent on many years of trading experience and technology accumulation Seasize Technology already has more advanced ability to enter  this industry. It can be  expected in the near future that we will get a place in the relevant fields, and access to long-term development.
                        Its new profile [May 27, 2012] stated a subsequently changed description as:
                        After years of development, we have grown up into a strong company which enjoys many advantages from procurement, production and export. We have passed ISO9001:2008 certificate in year 2011 and established a standard quality system that will ensure our delivery of quality product to our customers. Our product lines include two areas: digital audio&video products and GPS-related products. We are committed to provide our customers with cost-effective solutions, whose value has been seriously balanced against its prices.
                        and then there is a SOURCING GUIDE-Android Tablet pc,tablet pc,wifi tablet pc,google tablet pc,tablet pc review,wholesale tablet pc [Aug 8, 2012] page which was quite probably the marketing campaign page for the above documents with leads generated via registrations for each, with more direct indication of the China Tablet Solutions Introduction [Aug 8, 2012] as well as another one of Risks of Doing Business in China.
                        Seasize therefore is definitely trying to expand its purchasing business as well, so its documents could be valuable, even sufficiently authentic for those people who are potential partners of Seasize. As such these documents might describe the purchasing situation over there for everybody else as well. For Seasize’s track record of activities see: Seasize Technology Co., Ltd.: Newsletter Archive [May 31, 2011 – Aug 7, 2012 and beyond].

                        4. The Allwinner advantage 全志

                        image珠海 Zhuhai 全志科技 Allwinner Technology (150 ~ 499 employees) — 148 campus hirees only for 2013 (click here for a full content) recruited with a roadshow held in:
                        – 西安 Xi’an: at 西安交通大学 Xi’an Jiaotong University (XJTU) on Sep 18; at 西安电子科技大学 Xidian University on Sept 21
                        – 哈尔滨  Harbin: at 哈尔滨工业大学 Harbin Institute of Technology on Sept 25
                        – 武汉 Wuhan: at 华中科技大学 Huazhong University of Science & Technology (HUST) on Sept 22.
                        – 广州 Guangzhou: at 华南理工大学 South China University of Technology (SCUT) on Sept 17, at 中山大学 Sun Yat-sen University TBD
                        – 成都 Chengdu: at 电子科技大学 University of Electronic Science and Technology of China (UESTC) on Oct 11.

                        image

                        From jobyun.com:
                        = US$ 1,113

                        Company Overview of AllWinner Technology Co., Ltd.
                        [Bloomberg Businessweek]

                        AllWinner Technology Co., Ltd. engages in mixed-mode SOC technology research and VLSI design. The company’s products are used in high-definition television and digital photo frame markets. It also provides support services. The company was founded in 2007 and is based in Zhuhai [Guangdong province], China.

                        From: AllWinner Technology Selects ARM Cortex CPU and Mali GPU Technologies To Bring Integrated SoC To Android OS-Based, Connected Consumer Devices [ARM press release, April 12, 2011]

                        AllWinner Technology Co., Ltd was founded in 2007, and is engaged in mixed-mode SOC technology research and VLSI design.  AllWinner Technology is dedicated to be the major leader in the HD media field, to excel in low-power VLSI design, advanced technology and innovative architecture; to be the pulse of the consumer market, with a unique understanding of self-developed core technologies.  Through functionality, performance and cost advantages of integrated products and the industrialization of the operational capabilities of the market to provide customers with leading designs and services from SOC products to comprehensive solutions. 

                        From: Zhuhai sez daily: Gan Lin investigated in high-tech zones “two little two two high” enterprise [Allwinner press release, June 10, 2010]

                        Gan LinParty Secretary of Zhuhai city … accompanied by director of the CMC Qiu Shi, successively investigated the Kingsoft Park (Jinshan Software Park) project site, Xuan Garment Co., Ltd. Design Center, BOXlight (Po Wright) Medical Technology Inc., Tin Shui Power Technology Limited, Allwinner Technology Co., Ltd. and Bioenergy Limited. …
                        Zhuhai Allwinner Technology Limited is committed to becoming a leader of application requirements in the area of key technologies for HD multimedia and communication networks, radio and television networks, and the Internet “triple play”; specializes in low power VLSI design capacity of independent research and development of core technologies, has completely independent intellectual property rights. According to the General Manager [Chairman and CEO] of the company, Zhang Jianhui (张建辉), the Allwinner company was established in 2007. In the first two years to April 2009, the company had been working hard on technology R & D and did not earn a penny, then launched two categories for the introduction of a series of nine full HD network integrated smardescriptiont chips in order to become one of the leading manufacturer of ultra-large-scale system-on-chip and embedded software technology.

                        The roots of the Allwinner Technology:

                        May I ask [about] Zhuhai [珠海] Victory Technology [全胜 科技] – How can I like it? [http://laoyaoba.com in Chinese, Oct 23, 2010]  

                        Looking for a job, this company has come to our school, a little want to go, but I don’t know how on Earth is this company, [since there is] almost no information on the Internet, looking for an insider look, appreciate it!

                        The entrepreneurial team of Zhao Guangmin[赵广民先]’s [Zhuhai] Actions Semiconductor Co., Ltd. was brought over after Zhao’s unfortunate, untimely death. The Zhang Jianhui[张建辉]-led team, however, is still very strong in the Chinese semiconductor industry. It began to grab the PMP [Personal Media Player >>> MP3 etc.] market share last year, and it is estimated that [its] revenue this year should be around $ 30 million ….

                        The life and spiritual heritage of the legendary Chinese IC design industry leader Zhao Guangmin [Baidu in Chinese, Aug 27, 2007]

                        … In early 2006, Zhao Guangmin left Actions, where had been working for a number of years, and with a number of like-minded partners co-founded Victory (Zhuhai) Microelectronics Co. as chairman with aspirations to win a new peak. …

                        Actions pass the sudden departure of founder, investors have been excluded [VentureData.org, April 4, 2006], the picture of Zhao Guangmin below is from this source which is the Chinese origin of this material below:

                        Led the company successfully landed on the Nasdaq after 4 months, founder of Zhuhai Actions Semiconductor Co., Ltd. (hereinafter referred to as “Actions”), Zhao Guangmin [then vice chairman of the company] suddenly announced his resignation.

                        Zhao Guangmin the early 1980s graduated from Xi’an Jiaotong University, has a number of Semiconductor companies in the office. Zhao Guangmin founded in December 2001 and served as general manager [not CEO] of Actions. Actions a total investment of $ 10 million, primarily engaged in the development of VLSI design and test production. Taiwan-funded by the holding of shares in which Zhao Guangmin unknown.
                        Under Zhao Guangmin leadership, relying on keen to capture the opportunity to MP3 chips, Actions to achieve rapid development. In 2002, Actions Semiconductor sales only 1.08 million yuan [US$ 130K]; in 2003 sales increased to 4,000 million [US$ 4.3 million – see the chart later]; in 2004 sales soared to more 460 million [US$ 55.5 million], net profit up 200 million yuan [US$ 24.1 million].
                        At the same time, Actions also introduced more than a dozen proprietary chip. In 2004, the company was selected as the China Semiconductor Industry Association, the annual top ten IC design companies. To the fourth quarter of 2004, Actions in the global chip market share in the first MP3.
                        November 30, 2005, to Actions as the main Action Semiconductor Co.Ltd (Nasdaq: ACTS) in the U.S. Nasdaq market, the first phase of financing $ 72 million. Since listing, the market responded well to the Actions, and there have been investment banking analyst cut its rating to “buy.”
                        Actions with the same period of rapid development and to the patent dispute. Zhao Guangmin issue in the mail two days before departure, the U.S. International Trade Commission a preliminary ruling, Actions part of the audio processor infringes two U.S. SigmaTel’s patents. SigmaTel is the world’s leading mobile phones and digital audio players, chip vendors, the company early last year to the U.S. District Court in Austin, sued Actions Semiconductor infringed its patents.
                        “Now I can not say anything, but to leave and certainly nothing to do with the lawsuit.” Zhao Guangmin side of the phone hesitantly.
                        Zhao reasons for leaving, Actions official answer is “retired.” One of the company staff responsible for media relations, said, “Although less than the retirement age, but Zhao fame in this industry has made the decision to retreat is also very natural.”
                        However, close to Zhao Guangmin the industry does not think so. He said that Zhao’s departure and the investors.
                        The source said, as early as Actions Prior to listing, to facilitate investment in the idea of ​​a replacement company executives. Public information, Zhao Guangmin general manager of the term of Actions of August 2005, is the company going public push. Zhao’s successor as general manager, is working with many years experience in the semiconductor industry, China Taiwan nationals Yenan Hong.
                        On this course, after listing a media interview, Zhao Guangmin stunned: “In order listed, and sometimes take their cut first!”
                        According to Zhao said, in order to make more in line with investors Actions taste, Actions update prior to listing a number of board members and executives. Most of these people in the chip industry has a deep background and is familiar to foreign investors, including former vice president of operations SMIC Chiu Tsz Wan.
                        Interestingly, in the Actions of the prospectus, as the founder of Zhao Guangmin not appear in the list of shareholders, executives, Zhao’s team did not name.

                        Further explanation is given here, only two sentences are important to quote (the picture of Zhao Guangmin below is from this source which is the Chinese origin of this material below):

                        … [Till] June 2005 Zhao Guangmin has been Actions’ general manager, [then] since June to become vice president, and in November the company officially listed [that] Zhao Guangmin had [been] transformed into a vice chairman. … In fact, although Zhao Guangmin since 1993 as was general manager of Zhuhai Actions, but he has had no control of the company, the company has had been in a firm grip on the hands of equity investment in Taiwan.

                        Note that Actions is a still existing company keeping its description as under Zhao Guangmin’s leadersip: About Actions [Sept 6, 2005]

                        … Actions has successfully put into market some products, such as digital audio/video SOC chip and its total solution, a series of IC for digital potential meter, SOC chip for TV entertainment products and its total solution, … etc, since the first day it was found. All Actions’ products are under the protection of intellectual property law, and have been gradually showing their competitive power after directly joining the international market.

                        With management and techniques accumulated, high-tech and product positioning, precise market position, strong innovative power, Actions sustains fast improvement and development. In 2003, Actions was identified as one of the top 10 fastest growing IC design companies within the China area by the China semiconductor association; the same situation will happen again in 2004 as well.

                        Actions’ latest product developed under his leadership: Actions Introduces New Video Technology — Advanced Media Video (AMV) [Actions press release, April 10, 2006]

                        … provides comprehensive mixed-signal system-on-a-chip solutions for portable consumer electronics, today introduced a new generation of video technology, Advanced Media Video-AMV3.0.  This new technology supports a higher degree of picture resolution (QCIF i.e. 176 x 144), a better display of motion picture than the AMV1.0 and 2.0 technologies, and is capable of converting SWF files and other regular movie formats.  This technology was developed specifically to be the video engine for Actions’ new 9 series SoCs.
                        The history of Actions’ audio and video technology can be traced back to 2004, when Actions introduced two video technologies, MTV1.0 and MTV2.2, ahead of a majority of its competitors. This breakthrough innovation of Actions had risen the technology playing field of the entire digital music industry to a higher level.
                        “Although our current 9 series SoCs require conversion software to enable playback, our next generation of SoC products, embedded with a MIPS core, will support direct streaming video playback.  With the benefits of a MIPS core, the data processing speed will be much faster,” continued Mr. [John] Lee [Senior Product Manager of the company].
                        “The advancement of our MIPS core technology will remain consistent with our development in AMV4.0.  Furthermore, based on the MIPS platform, both the design house and the manufacturer will be able to freely take full advantage of their expert technology, thus providing them with a favorable position in a fiercely competitive market,” concluded Mr. Lee.
                        Here is the “Proven Management Experience and Expertise” slide (#11) from the May 2006 Corporate Overview of Actions presentation. Note that this was immediately after the departure of Zhao Guangmin and there were three managers from the original founding team, neither of them with executive power (as evidenced by EDGAR submissions), and only Shao Chuan (Shawn) Li is still with Actions as a director of the board (since September 2005) but more importantly as Chief Technology Officer (since the establishment of Actions in December 2001), while Zhang Jianhui was the head of Multimedia Division and as such he was the topmost manager with core innovation competency, and it was no surprise that he left Actions when Zhao Guangmin established his next venture, Victory (Zhuhai) Microelectronics Co. which after his death became the current Allwinner managed by Zhang Jianhui. (There is no information about Gong Hui.) Note as well that at the time of that presentation Actions had 280 employees; 210 engineers with IC, system, and software capabilities.
                        image
                        imageIt is quite remarkable that after Zhao Guangmin’s departure Actions went into decline as visible from the chart showing the revenues generated by the company. With $150M in 2005 Actions was the second-largest China-based fabless company. Employing not less than 280 people in 2006 the new Taiwanese executive duo of Nan-Horng Yeh as CEO and David Lee as CFO (both educated in the United States) have completely failed. This is all despite of their strategy to move into midrange products by developing mobile TV SoCs via licensing core technology from U.S.-based Mavrix Technology. See: SoC firm finds fertile ground in China [EDN, Aug 22, 2006]. This licensing decision led only into an industry sideline with stronger external reliance on MIPS processor cores (originally selected by Zhao Guangmin in July 2005 as the vice president, but for fast internal development) and a subsequent, necessary acquisition of Mavrix as licensee in 2010. Paradoxically Mavrix’s CEO, Dr. Zhenyu Zhou became even the CEO of Actions in December 2011. Only David Lee has still a high-level position with the company as chairman of the board. The future outlook for Actions is also rather uncertain as only a single analyst had any interest in the company’s Q2 2012 Results Call [Aug 7, 2012].

                        What a contrast with Zhao Guangmin’s new company which became after his death today’s Allwinner. Here is the Commemorate [what] Zhao insisted: a win-win situation, team together and do things realistic [Aug 24, 2007] by his deputy (??) and effective successor in charge of his Victory Microelectronics Co., Ltd., Zhang Jianhui:

                        Zhao went away from us, the circle of friends chatted about Zhao, and so far we are still unable to accept that this is a fact. Remembered Zhao, in addition to in the legendary entrepreneurial experience at Actions, we talk about the most, is the insistence of Zhao and low-key.
                        Speaking of the insistence of old Zhao, when Zhao won the Zhuhai Special Economic Person of the Year in 2004, in an interview he said: “As long as you choose the right direction, be sure to persist in walking, did not insist on was not successful.” It is this insistence on belief and perseverance of action which created Zhao’s unusual success story.
                        First, Zhao insisted on the concept of win-win, through the development of core IC products to add value for the customer, and industry chain downstream supporting enterprise vertical and horizontal, building win-win business model among enterprises, resulting in overall lead between the company and the customer.
                        Zhao served as general manager of Actions by virtue of more than 10 years accumulated of IC design and enterprise operating management experience. He led there a well-trained professional operating team to share common goals, to carry out efforts with hard work, to get global semiconductor industry attention via achievements. This made Actions from an unknown small company, in just a few years, China IC design industry’s  first to become a globally known enterprise. The MP3 multimedia master chip R & D accounted for more than 50% of the world market share. This led to billions of dollars via the quick formation of the MP3 industry chain in China, prompting mainland China to become world’s major export base of MP3 which has brought tremendous development and benefits to the consumer electronics industry [here].
                        This was for the first time as a mainland China IC design company established itself in the field of global consumer electronics products, mastered and mass provided the core technology products with international advanced level. Actions’ operating income grew significantly from a few million yuan in 2002 to 1.2 billion yuan in 2005, [thus] creating rapid growth of more than 100 times for the Actions Semiconductor in three years only, and [then] eventually prompting the success of Actions to be listed on NASDAQ.
                        Second, Zhao insisted on the need to uphold the integrity of the fundamental values [which] can be established between the team and the customer, [on the] long term sustainable growth of business culture, [that] the strength of the team is always greater than the power of any individual.
                        In the early venture days of Actions Zhao personally wrote a column for the internal publications, talked about the issues of development ideas and the reform of corporate culture, and also to encourage other executives to write articles for publication. Fixed each Wednesday [?his?] commuting leadership talked about the exchange of business issues, to develop common thinking habits and language of communication – because every time before this would open, the kitchen will cook a pot of noodles as participants of dinner, affectionately called “noodles will”.
                        This will sometimes be open until two o’clock at night, and the truth is argued more and more out; companies and departments use the monthly regular meeting with employees face-to-face communication. After a year passed, not only everyone has made great progress, but he also formed a fully functional teamwork of high degree of homogeneity and quality, great combat effectiveness of entrepreneurial backbone of the team, and subsequently laid a very good foundation to the success of the company.
                        Third, Zhao insisted on doing anything seriously, down-to-earth. He used to say that a 99.99% working IC is still not working. Design paradoxes are in place, it is where the BUG. In 1995 I and old Zhao did cooperative research and development projects for the first time. I was responsible for the system design, Zhao for the circuit design. There was no RTL coding method as now, the circuit was built by human hand structures. Zhao’s design adhered to repeated scrutiny and carefully optimized design logic based on clear, simple drawing. Sometimes he explained to me where is the circuit of the collar, which is the heart of the circuit and the limbs, old Zhao could meander, and the favorite circuit design is input ready.
                        It is quite unfortunate that China’s IC design industry has lost an outstanding leader, and friends lost an honest, down-to-earth best friend. However, true to Zhao’s spirit, I believe in increasing prosperity and burgeoning growth of Chinese IC design, offering useful lessons and inspirations, and I believe this will also correspond to Zhao’s heartfelt wishes and expectations.
                        Mr. Zhao Guangmin may rest [in peace] .
                        Author: Zhang Jianhui, Victory Microelectronics [全胜] Co., Ltd. (Zhuhai), general manager, for the friends and colleagues of Zhao Guangmin years
                        For more information see Mr. Zhao Guangmin Memorial page [Aug 29, 2007] of eMedia Asia Global resources. Note from there that he entered the university in 1977 which is the first year of entry after the Cultural Revolution when only exceptional people were able to enter the universities. More explanation about that phenomenon see in Yoshida in China: Cultural rev survivors leap forward [EE Times, Oct 1, 2012]

                        Allwinner’s close cooperation with ARM Holdings started with Victory Technology selects ARM processor for ultra-low-power high-definition network video applications [joint press release available only in Chineese on eetrend.com and elsewhere, Feb 9, 2010]

                        ARM926EJ-S processor to achieve high-definition video processing while reducing power consumption by up to 50%.
                        Zhuhai Victory Technology Co., Ltd. (referred Victory Technology) and ARM [(LSE: ARM); (Nasdaq: ARMH)] today jointly announced: Victory Technology licensed the ARM926EJ-S ™ processor for its IC design for ultra-low-power high-definition network video applications. These applications include: home Internet video streaming via the Internet, cable television and wireless network high-definition video player and other network video equipment.applications include: home video streaming via the Internet, cable television and wireless network high-definition video player and other video devices on the network.
                        Victory CEO Zhang Jianhui said: “In addition to the well known high-performance and low-power characteristics, another important feature of the ARM ® processors is versatility, they can bring better scalability, reducing the workload and difficulty of development, and shorten time to market. These features help us design IC products for the fast-changing Internet video applications, and are very important. ARM has always spared no effort to promote innovation through its strong product planning, which provides an opportunity for us to further cooperation in the future. The resources required to design the system is very rich around the ARM ecosystem, and we are very confident in each other’s cooperation capability that it will be successful.”
                        With more and more Chinese consumers having broadband access at home or on the move, China’s Internet video applications market is developing very rapidly. With rich experience in the field of video processing technology, as well as a deep understanding of the market, combined with ARM’s top high-performance, low-power processor technology Victory Technology has the capability to meet the standards and local consumer demand to develop IC products for the high-definition Internet video equipment. Through the use of excellent performance at low power consumption of ARM926EJ-S processor as well as Victory Technology’s ultra-low-power design techniques, the company hopes that its new chip can achieve 50% of energy consumption savings versus the similar products on the market, without sacrificing performance needed for HD video streaming on the Internet.

                        Brief English content appearing about the same on Sept 26, 2012:
                        Gan Lin, Party Secretary of Zhuhai, Visited Allwinner Technology

                         

                        全志科技

                        全志科技

                        Gan Lin, Party Secretary of Zhuhai, accompanied by several other leaders, visited Allwinner Technology on June 10, 2011.
                        During the visit, Gan gave Allwinner Technology credit for its independent R&D and spirit of leadership in technology. He pointed out that Allwinner Technology should continue embracing innovation to boost its competitive edge and accelerate the development of strategic emerging industry.

                        A10 won “The Most Promising Award” on the Sixth “China Chip” Ceremony [Allwinner press release, in Chinese: Dec 31, 2011, reproduced in English: Sept 26, 2011]

                        Allwinner Technology A10, xPad SoC of High Integration and High Definition, has won “The Most Promising Award” in China IC Industry Promotion Conference 2011, also the sixth “China chip” ceremony held in Jinan on December 16th.
                        The China Chip hosted by the Software and Integrate Circuit Promotion center (CSIP) of Information Industry Ministry, is a rather influential ceremony among domestic IC enterprises, experts, as well as other manufacturers involved in the industry chain. More than three hundreds enterprise representatives attended this ceremony.
                        On the basis of striking video codec technology, DVFS, multi-core multiplexing technology, and advanced 55nm process, A10 outruns other competing solutions in its high integration, and outstanding multimedia and network processing capability. It supports 3D video playback, 2160P ultra-HD video decoding and 1080P HD H.264 video encoding, multi-screen, and integrates full-format audio codec engine, rich A/V outputs such as HDMI, LVDS, VGA, TVOUT, etc, and memory interfaces such as DDR3, DDR2, LPDDR1, NAND flash, etc, plus its edge in BOM and power consumption, it becomes one of the most favored solutions after marketing for several months, and is honored “the most promising” solutions in this ceremony.
                        Zhang Jianhui, General Manager of Allwinner Technology, said that this award bears testimony to the efforts Allwinner has made in the past few years, and will definitely encourage Allwinner to come up with better solutions to meet customer demand, and carry forward the IC industry.

                        Allwinner Technology and ARM working together to get to market quicker [ARM’s Multimedia blog, June 19, 2012in Chinese on Oct 4, 2012]

                        Attached ImageThe dynamics of the mobile device industry can be seen in the rise of tablets and in particular the growth in Android based tablets. This new form factor has grown to an expected 100M shipping volume in 2012 with this being projected to exceed 200M by 2016 – when Android tablet shipments is expected to be over 50% (Source: IDC). This new form factor and pace of change have opened up opportunities for new companies to offer specific System on Chip (SoC) businesses a chance to address this market. Allwinner Technology Co., Ltd.is one of these. Over the last 12 months Allwinner Technology has become one of the major China Android tablet SoC chip vendors, with many of the Android tablet OEM system makers adopting our chip and system solution. A key industry analyst in China expects 40M Android tablets to ship in the China grey market in 2012, and it is expected that 60% of the share will be from Allwinner Technology.
                        Attached ImageThis rapid time to market has been achievable through the close working relationship and usage of ARM Intellectual Property (IP). Allwinner Technology uses a combination of the ARM CortexTM-A8 and ARM MaliTM-400 MP. This combination enables Allwinner Technology to balance the required performance needs for tablet applications with the power consumption boundaries of a mobile device. By working with ARM for both CPU and GPU elements Allwinner Technology have been able to maximize the benefits of both high performance with low power consumption that ARMs years of knowledge in the mobile device market brings to new entrants to the market.
                        Allwinner Technology has gone from the licensing [in April 2011] of the Mali-400 to production silicon in 7 months . This speed of execution has been enabled by the close linkage between the CPU and GPU from a design perspective, the RVDS [toolchain, the legacy solution for software development on older ARM processors replaced by the new ARM Development Studio 5, DS-5] and ARM DS-5TM toolchain [comprises tools such as the best-in-class ARM C/C++ Compiler, a powerful Linux/Android™/RTOS-aware debugger, the ARM Streamline™ system-wide performance analyzer and real-time system model simulators, all conveniently packaged in a user friendly integrated development environment (IDE) based on the Eclipse] and the out-the-box quality software drivers which are all supported by localised support teams. All these elements combined have enabled Allwinner Technology to move swifter and in an agile way to address the needs of this market and we look forward to working with ARM going forward.
                        Attached Image
                        Guest Partner Blogger:
                        Jack Lee, CMO, Allwinner Technology Co., Ltd.

                        ARM gaining traction in GPU IP market [DIGITIMES, June 22, 2012]

                        … ARM has expanded its GPU licensee base at a fast pace, according to Kevin Smith, VP of strategic marketing at the firm’s media processing division. Taking the China market as an example, ARM’s Mali GPUs are currently shipping in over 70% of graphics-enabled digital TVs, 50% of Android tablet PCs and 20% of Android phones, said Smith.
                        ARM’s partners are forecast to ship more than 100 million Mali GPUs in 2012, up over 100% from 2011 levels, Smith indicated. The anticipated shipment rise – driven by brisk demand for Android smartphones and tablets, and China’s growing smart-TV market – will boost ARM’s presence significantly in the global GPU-IP market this year, Smith added.
                        ARM’s Mali GPUs are targeted at smart TVs, handsets and tablets, which require high-definition graphics and higher picture fluency, Smith stated. The product line has been enhanced to meet various customer needs such as high-resolution images, multi-game offerings and energy saving, Smith said.

                        Combining with ARM’s CPU platform, the Mali GPU technology comes with additional features such as power efficiency, Smith noted. The combination is able to generate a complete multi-IP solution, Smith said.

                        In addition, Smith indicated that ARM’s solutions are able to help system customers speed up time-to-market. For example, it took less than half a year for both China-based AllWinner Technology and Rockchip Electronics to launch their integrated CPU-GPU SoC solutions targeting the local tablet PC market, Smith said.

                        New ARM DS-5 v5.9 Toolchain Provides Developers With an Integrated Processor and GPU Software Optimization Platform For Mobile Gaming [ARM press release, March 5, 2012]

                        ARM today released the latest edition of the ARM Development Studio 5 (DS-5™ v5.9) toolchain with additional support for graphics analysis on ARM Mali Graphics Processing Units (GPUs). The toolchain can be downloaded by developers today, enabling them to achieve integrated optimization across the whole system, including both the applications processor and GPU. The ARM DS-5 v5.9 toolchain provides significant benefits to semiconductor suppliers and OEMs, as well as mobile application and game developers, by enabling improved system visibility and decreased time-to-market. In particular, the ARM Streamline™ Performance Analyzer, within the DS-5 toolchain, allows developers to design more interactive interfaces and immersive game play for end users whilst extending battery life. This will enable next generation user experiences for use on smartphones, tablets, smart-TVs and set-top boxes.
                        The launch of the updated toolchain addresses the increasing demand for high-performance graphics development. Such advanced visual computing capabilities will deliver next generation smartphone and tablet applications where console-like gaming graphics, 3D User Interfaces (UI) and Augmented Reality (AR) will be the norm. Multicore systems, such as these, benefit from optimization of intensive tasks where integrated applications processor, GPU and memory subsystem designs can be configured to achieve the highest levels of performance and energy-efficiency.
                        By using the ARM DS-5 v5.9 toolchain, developers can quickly and easily locate system performance bottlenecks across the Cortex processors, Mali GPUs and System IP, enabling the creation of faster applications and accelerating the software development cycle.
                        … [additional information: Developing Top Performing Graphics Applications for Android Made Easy [ARM’s Software Enablement blog, March 7, 2012] and

                        ARM Launches Free Toolkit For Android Application Developer Community [ARM press release of the DS-5 Community Edition, Nov 28, 2011]]

                        The first Allwinner A10 tablets came to the market from a number of vendors in November 2011. See just these reports by Micdigi from China:

                        In December more tablets of that kind came to the Chinese market as Micdigi reported:

                        The tablet based on Allwinner A10 processor and 5-point touch capacitive screen [Dec 7, 2011]

                        Recently, Allwinner tablet PCs are so popular. 7-inch capacitive screen tablet based on Allwinner [Cortex-]A8 solution sells for only $80.

                        Now I will introduce a tablet based on Allwinner A10 from Shenzhen HongYuXing.

                        Based on Allwinner A10 processor, Q780 is launched [Dec 8, 2011]

                        Allwinner A10 has so good cost performance that it is the most suitable chip for entry level tablet PCs.

                        Q780 from Shenzhen Xlong is launched.

                        Allwinner A10 tablet—PC741 [from Shenzhen Inote] [Dec 12, 2011]

                        Now the tablet chips are like a hundred flowers in bloom, like ten thousand horses galloping ahead. Allwinner A10 appeared late in the market but they came back. At present most of the tablet PCs from China are based on Allwinner A10 chips.

                        Q701 based on Allwinner A10 [Dec 16, 2011]

                        With cheap price and powerful performance for video playback, Allwinner A10 processor is popular in the world.

                        Q701 is introduced Allwinner A10 processor.

                        Then the events unfolded as follows:

                        Based on high cost performance, Allwinner A10 has good sales after the Spring Festival. The chips with high cost performance are welcome.

                        AMLogic based on A9 core is a high-end chip, which is introduced by SONY and Philips.

                        RockChip chips became cheaper and cheaper since Allwinner released A10.

                        As the first chip of Allwinner, A10 is released with cheap price, which makes it has good sales. Allwinner is a famous company in MP3 times so that Allwinner has a strong customer base.

                        In addition, A10 has few bugs since it is released. The performance of other chips is not stable in the beginning, such as RK2808 and VIA8505.

                        The agents who have ordered VIA chips go to order Allwinner A10. VIA will release VIA8850 next month [but mass production just started in June, see later] which is based on A9 core. The performance is not different from A10. It means that it does not have any advantage.

                        VIA8850 will be cheaper than Allwinner A10. Allwinner will release A13 to compete with VIA8850 so that VIA will get in a difficult position. [Was more expensive the the A13 when  mass production started in June, see later]

                        MTK will release MTK6575 which is the upgraded version of MTK6573, based on dual-core, 1GHz frequency and A9 core. The chip with excellent call function is mainly introduced by smart phone. It is also suitable for tablet PCs.

                        AMLogic will release AMLogic M6 and RockChip will release RK30XX. They are all dual-core chips.

                        [for RK30XX  and the earlier RK29XX and RK28XX see MWC 2012: Fuzhou Rockchip Electronics [this same ‘Experiencing the Cloud’ blog, March 13, 2012] where it is stated: Samples of the Rockchip RK30xx platform will be available in March 2012]

                        At present, there are few new products in the market, but many new products will be released in May.

                        As Allwinner A10 solution is so cheap, it is introduced by most of Chinese tablet PCs.

                        The Allwinner A10 PCBA from Shenzhen Crownho sells for about $27.

                        With this PCBA, the cost price of the tablet will be less than $64, such as DA701 [tablet] based on capacitive screen, which sells for about $63.5.


                        INSERT ABOUT THE CURRENT AND FUTURE SoC COMPETITION

                        Competitive SoCs from Chinese vendors that were available in March’12 or came soon after March’12:
                        Amlogic 8726-MX (dual core), 8726-M3; Rockchip RK3066(dual core), RK2918Source: http://www.eeworld.com.cn/xfdz/2012/0725/article_14042.html
                        (A10 $7, A13 $5)image

                        Among those competitors the Rockchip RK3066 (dual core) became a market leader in China on its own as was already shown in the very beginning by the example of Window N90 Dual Core II 2 (16G) leading the dual core market in China:

                        No surprise therefore that this is also a kind of leading product on the global market as shown by Merimobiles:
                        List Price: $399.99 Your Price: $214.99 (with shipping)

                        First Review – Window N90 Dual Core II 2 – RK3066 IPS – Purchase at: Merimobiles.com [MrTasselhof YouTube channel, May 24, 2012]

                        while the Benchmarks Review – Window N90 Dual Core II 2 – RK3066 IPS – Purchase at: Merimobiles.com [MrTasselhof YouTube channel, May 24, 2012] is:

                        Window N90 II – Dual Core – SlateDroid Forum: – http://www.slatedroid.com/forum/337-window-n90-ii-dual-core/ Window N90 Dual Core II – WiFi Benchmark Results – http://www.slatedroid.com/topic/33590-benchmarks-window-n90-dual-core-ii-wifi&#8230; Window N90 Dual Core II – Internal Components Pictures – http://www.slatedroid.com/topic/33614-window-n90-dual-core-ii-teardown-compon&#8230;

                        and the global dual-core competition represented by Merimobiles as follows:

                        Window N90 Dual Core 1.6GHz RK3066 9.7 Inch Comparison Chart

                        imageNote that for the 1.5GHz Windows N70 (as opposed to the above 1.6GHz version available globally) the AnTuTu v2.4 benchmark on the PConline is on the right (see also: AnTuTu Benchmark):

                        Since a multiple core Cortex ARM based Allwinner SoC will come just after those SoCs (“processors” – as named wrongly) shown in the table above, given the credentials of Allwinner presented in this post I dare to predict that the next-generation in the “A series” SoCs from Allwinner will beat the Rockchip RK3066 (or RK30XX in general) and others. There was just one concrete rumor recently: Ampe Allwinner Cortex-A7 Quad-core Tablet is Coming [ChinaEshops.com, July 12, 2012]

                        Rockchip and AMLogic dual-core tablet come out to snatch the tablet PC market while AllWinner dual-core tablet keeps in silence. Although Allwinner A10 & A13 still hot in the middle-low end market. Rockchip RK3066 and AMLogic AML8726-MX has already listed for two months from the beginning of May. Now these two chip still mainly occupy the china dual-core tablet PC market. Freescale’s quad-core tablet PCs begin to launch, even Tegra3 quad-core.  Obviously, allwinner may it is late for launch dual-core, but it doesn’t mean that Allwinner will give up dual-core tablet.  Allwinner will launch Quad-core chips in August. Latest news report that AMPE will launch a new 10.1 Inch IPS Tablet PC equipped with allwinner quad-core processor.
                        According to latest report the allwinner quad-core is using ARM Cortex-A7 structure. …
                        max says: August 8, 2012 at 8:43 pm
                        any news on this.
                        chinaeshops says: August 31, 2012 at 5:11 pm
                        Sorry, it is coming soon
                        .

                        As a matter of fact the Cortex-A7 was meant to be a companion ship for the Cortex-A15, all targeted for 28nm TSMC technology which is in extremely tighty supply at least till the end of the year. On the Cortex-A7 Processor—Related Products page we can find (among other things) that:

                        Physical IP

                        ARM Physical IP Platforms deliver process optimized IP, for best-in-class implementations of the Cortex-A7 processor at 40nm and below. A set of high performance Processor Optimization Packs (POPs) containing advanced ARM Physical IP for 28nm technologies to enable rapid development of leadership physical implementation supports the Cortex-A7 processor. ARM is also working early to assure a roadmap to 20nm optimizations. Optimization packs support ARM’s strategy of offering specifically targeted Physical IP to enable Partners to achieve tuned implementations of ARM cores. ARM is uniquely able to design the optimization packs in parallel with the Cortex-A7 MPCore processor architecture, enabling the processor and physical IP combination to deliver workstation class performance in a mobile power envelope while facilitating rapid time-to-market.

                        But according to the later ARM Expands Processor Optimization Pack Solutions for TSMC 40nm and 28nm Process Variants [ARM press release, April 16, 2012] Cortex-A7 PoP became available for both “TSMC 40LP” and “TSMC 40 LP high speed options” type of process technologies (where LP stands for “Low Power”). This practically means that Allwinner can indeed deliver by this time its next-gen SoC at 40nm.

                        Breaking news:

                        1. Quad-core tablets large chaos department: Allwinner quad-wide prototype will debut in November [Bolopad.com, Oct 3, 2012]

                        Before beginning I have to say to you: “I’m sorry”. Because last week we happily told everyone interested in quad-core prototype that it appeared in September, and it is not far from the days of mass production. But yesterday your editor suddenly received a mysterious call to be informed that the Allwinner quad-core prototype can’t come in September, it is estimated to be out in November to meet with you. I really wanted OOXX to be cursed to death (thought better of course).

                        2. Exclusive: Allwinner quad-core processors code-named A15X coming soon [Bolopad.com, Sept 18, 2012]

                        All right, now that the product finally appeared, we at Bolopad are also excited and highly interested in the quad-core chip code-named A15X (don’t get me wrong, this A15X has nothing to do with Apple A15 [rather Cortex A15 wrongly percieved by many to be in the A6 SoC of the iPhone 5]). Now the related PCBA layout began to take shape, the chip samples came out and so on. Last reportedly bounced because the Allwinner quad-core is dependent on [Cortex] A7 architecture build, but as 40nm and 32nm was short of the desired effect, the 28nm tapeout eventually came in to achieve the desired results.

                        END OF THE INSERT ABOUT THE CURRENT AND FUTURE SoC COMPETITION


                        NOW BACK TO THE CADENCE OF
                        ALLWINNER A10-RELATED EVENTS & INFORMATION:

                        An even bigger market push started when Allwinner A10 with the Android 4.0.3 Software Development Kit was officially launched on March 10, 2012. From the press release:

                        TSMC’s 55 nanometer “half generation” derivative of the 65-nanometer process technology directly miniatures 90%, including input/output and analog circuits, for customer provides competitive advantage with single die cost significantly reduced, while can also save power consumption by 8% at the same speed of operation.

                        As it was reported later in Taiwan: Allwinner Technology Introduces New SoC Platform on TSMC 55nm Process [CENS, March 29, 2012]

                        Allwinner Technology Co., Ltd., a leading supplier of high-definition media semiconductor solutions headquartered in Shanghai [Zhuhai, as the contact address is: Block 1 Software Park, Zhuhai City, Guangdong Province, B6, four], recently released a new system-on-chip (SoC) platform based on Taiwan Semiconductor Manufacturing Co.’s (TSMC’s) 55nm process technology.
                        The platform, codenamed A10, employs advanced SoC design technology to integrate central processing unit, graphic processing unit, high-definition multi-frame video engine, 3D multi-screen engine, and high-speed video interface module on a chip.
                        Equipped with Allwinner’s Android 4.0.3 Software Development Kit, A10 consumes fewer energy to achieve higher computing efficiency on mobile devices.
                        Using TSMC’s 55nm process technology, A10 is able to deliver quality dynamic voltage frequency scaling (DVFS) performance and brand new video management capability on mobile computing devices, and extend battery lifespan of the devices.
                        TSMC’s 55nm process shrinks geometry of integrated circuits, including I/O, on chips by 90% as compared with chips with 65nm process, considerably cutting down cost of every single chip and saving electricity on a chip by 8% relative to competing chips.
                        Allwinner General Manager Zhang Jianghui pointed out that TSMC has been a reliable partner supporting Allwinner in product production, quality and lead time.

                        Allwinner Technology-A10 [product page, April 13, 2012]    The full Jifh A10 chip

                        In A10 Allwinner used 55nm technology, the integrated chip has four times full HD [i.e. the 2160p “Quad HD”] video decoding technology, smart power management system CoolFlex, HD multi-screen display processing and output, efficient and high-speed system architecture, mixed analog-digital high-speed signal design and integration of advanced technology, and integrated, smart power balance, and more items of leading technology. A10 is mainly used in tablet PCs, high-definition players, smart phones, network set-top boxes, smart TV machines.
                        With A10, Allwinner Technology will drive SoC into a brand new era of connected Smart HD which can enhance the application of connected HD SoC as well as user experience of electronic multimedia products. A10 is offering MULTI-CHANNEL decoding and 1080p encoding, MULTI-CHANNEL display with independently developed advanced frame, as well as MULTI-CHANNEL Analog TV Decoder Interfaces. What’s more, power consumption can be much lower than its competitors during 1080p decoding process.
                        Features
                        • VPU
                          HD Video Decoding (Super HD 2160P/3D Film)
                          – Support all popular video formats, including VP8, AVS, H. 264 MVC, VC-1, MPEG-1/2/4, …
                          HD Video Encoding (H.264 High Profile) [datasheet: 1080p@60fps]
                          – Support encoding in H.264 format
                          [datasheet: 720p@100fps]
                        • Rich Connectivity
                          – USB2.0 Port
                          – CSI, TS
                          – SD Card3.0
                          10/100 Ethernet controller
                          CAN Bus, Built-in SATA2.0 Interface
                          I2S, SPDIF and AC97 audio interfaces
                          PS2 , SPI , TWI and UART
                        • DPU
                          MULTI-CHANNEL HD displays
                          Built-in HDMI
                          – YPbPr, CVBS, VGA
                          – LCD interfaces: CPU, RGB, LVDS up to Full HD
                        • Boot Devices
                          – NAND FLASH
                          – SPI NOR FLASH
                          – SD Card
                          – USB

                        • Powerful Acceleration
                          – Graphic( 2D/3D)
                          – VPU(Super HD)
                          – APU
                          – E-reader

                        Benefits
                          • High-performance processing and multimedia capabilities
                          • Outstanding Super HD 2160p/3D Film video decoder makes bunds of creative application possible
                          • High level of integration enables you to launch products in less time, with less effort and at a lower total system cost
                          • Further development Kits, including OS BSP( Android2.3.4, Linux2.6,WinCE6.0)
                          Typical Application

                          Pad
                          Integrated Smart TV
                          Internet Player
                          Vehicle Multimedia Center
                          HDMI Dongle
                          Projector

                          2160p [Wikipedia, excerpted on Sept 18, 2012]

                          2160p is the shorthand name for 4K UHDTV, a video mode planned to appear in future HDTV products.[1] It has a resolution of 3840×2160 (8.3 megapixels in the 16:9 aspect ratio) and is one of the levels of Ultra-high-definition television.[2][3][4][5] The number 2160 stands for 2,160 lines of vertical display resolution, while the letter p stands for progressive scan or non-interlaced. In a progressive image, the lines of resolution of the image go from the top of the screen to the bottom.
                          2160p is also called “Quad HD” since it displays four times the number of pixels of the highest HDTV standard resolution, 1080p (a standard which is also known as “Full HD“). The only planned higher definition format for television is 8K UHDTV.
                          Phillips has made a 3D Quad HDTV with a native resolution of 2160p.[6]
                          In June 2012, Toshiba launched the world’s first 3D TV without glasses with 9 parallax images which passed through special lenticular lenses to deliver 3D effect with glasses-free on a 55″ Toshiba Regza RZ1 Quad Full HD TV, 3840x2160p resolution.[7] Due to delivered 9 parallax images at the same time, so the 3D image will only be seen as HD 720p (1280×720) —> 3840×2160 = 9x1280x720.
                          Sony plans Quad HD TV to launch between 2012 and 2020. Holographic Versatile Discs and Blu-ray Disc may be used for 2160p video, since it theoretically has a storage capacity of up to 10 Terabytes.[citation needed]

                          The AllWinner A10 System on Chip Specifications [the alternative allwinner.com product page, July 20, 2012]

                          Overview

                          Using 55nm technology, Allwinner Technology’s A10 SoC chip integrates full HD video decoding technology, multi-screen display processing, various analog-digital I/O interfaces, and a high-speed efficient ARM core with intelligent power management. The A10 is used in a number of consumer products such as tablet PCs, high-definition players, smart phones, network set-top boxes and mobile media hubs but with the availability of excellent development tools, the A10 is positioned to expand that list.

                          Key Features

                          VPU
                          HD Video Decoding (Super HD 2160P/3D Film)
                          Support all popular video formats, including VP8, AVS, H. 264 MVC ,VC-1, MPEG-1, 2,4, …
                          HD Video Encoding (H.264 High Profile)
                          Support encoding in H.264 format
                          1080p @ 60 fps
                          720p @ 100 fps
                          DPU
                          MULTI-CHANNEL of HD displays
                          Built-in HDMI v1.3/v1.4
                          YPbPr, CVBS,VGA
                          LCD interfaces: CPU, RGB, LVDS up to Full HD
                          Rich Connectivity
                          THREE USB2.0 Port (OTG/HOST/UTI)
                          UTI Digital TV(TS over USB)
                          CSI(2), TS(2)
                          SD Card3.0(4)
                          10/100 Ethernet controller
                          CAN Bus, Built-in SATA2.0 Interface
                          • I2S, SPDIF and AC97 audio interfaces
                          PS2 (2), SPI (4), TWI (3) and UART (8)
                          Boot Devices
                          On board NAND FLASH
                          SPI NOR FLASH
                          SD Card
                          USB
                          Powerful Acceleration
                          Graphic( 2D/3D, Mali400 MP)
                          VPU(Super HD 2160P/3D)
                          APU
                          E-reader
                          Support text in EPUB, PDF, FB2, PDB, CHM, HTML, TXT
                          Support coding format in ANSI/ASCII, UTF-8, UTF16-BE, UTF16-LE, GB2312, EUC-KR, SHIFT-JIS, Windows-1250/1251, Support Chinese, English, French, Italian, Spanish, Dutch, Russian, Japanese, and Korea
                          CPU/GPU
                          ARM Cortex-A8 at 1.2 Ghz without cooling
                          • 32KB I-Cache/32KB D-Cache
                          256KB L2 Cache
                          MALI 400 MP GPU
                          ARM NEON general-purpose SIMD engine
                          Memory
                          DDR3 SDRAM, 32-bit 16G bits Memory Capacity
                          • SLC/MLC/TLC/DDR NAND
                          8 flash chips, ECC 64bits
                          Memory Capacity up to 64GB/chip
                          Security
                          Trustzone Technology and DRM
                          Supports DES, 3DES AES encryption/decryption
                          Support SHA-1, MD5 message digest
                          hardware 64-bit random generator
                          128-bit EFUSE chip ID
                          PMU
                          Flexible built-in power options
                          Intelligent Power Select allocates power safely and transparently among USB, external AC adapter, Li-battery and application loads
                          adaptive and USB-compatible PWM charger
                          Benefits
                          • Very high performance processing and multimedia capabilities
                          • Hardware acceleration enables very low power consumption for HD video and graphics
                          • High level of integration makes you can launch product in less time, with less effort and at a lower total system cost
                          • Optimized Standard Operation Procedure (SOP) creates high First Pass Yield (FPY) in mass production
                          • OS Board Support Packages for Android, Linux and WinCE

                          AllWinner A10 Datasheet V1.0

                          NEW Allwinner Technology-A10s [product page, Sept 26, 2012]

                          全志科技 A10s 芯片

                          Allwinner Tech has expanded its processor lineup to include a new ARM Cortex-A8 chip A10s which is even more competitive for HDMI Dongle with higher performance (ManyCore Structure), better compatibility of Streaming Video Protocol/local multimedia formats, lower power consumption, and lower total system cost. As the brains of Android 4.0.4, A10s makes multitasking smoother, apps loading more quickly, and anything you use responds instantly. What’s more important, A10s is available in BGA336 package with Audio Codec, and HDMI integrated.
                          Features
                          • CPU / GPU
                            – ARM Cortex-A8 Core
                            – 32KB D-Cache / 32KB I-Cache
                            – 256KB L2 Cache
                            – Mali-400 3-D Engine
                          • VPU
                            – HD Video Decoding
                            – 1920 * 1080 @ 30fps
                            – Support VP8/6, H.264/H.263, WMV9/VC-1, WMV7/8, MPEG-4/2/1, Xvid, etc
                            – HD Video Encoding
                            – Support encoding in H.264 format up to 1920 * 1080 @ 30fps
                          • HDMI
                            HDMI 1.4
                            1080P Output
                          • Boot Devices
                            – NAND Flash
                            – SPI Nor Flash
                            – SD Card
                            – USB
                          • Ultra-low System Power Consumption
                            15 ~ 20% lower than competitors
                          • DPU
                            – LCD Interfaces: CPU, RGB
                          • Memory
                            – DDR2/DDR3: Up to 533MHz
                            – 16 bits/32 bits Data Bus
                            – MLC / TLC / SLC / EF-NAND
                            – ECC 64-bit
                            – Support NAND of 4xnm, 3xnm, 2xnm …
                            – Support NADN of Samsung, Toshiba, Hynix …
                          • Peripherals
                            – USB2.0 OTG, USB2.0 HOST (OHCI / EHCI)
                            – SD Card V.3.0, eMMC V.4.2
                            – SPI, TWI and UART
                            TS Port
                            EMAC
                            – CSI
                            IIS
                          • Audio Codec
                            – integrated Audio Codec
                            – MIC/FM/LINEIN Input
                          • Powerful Acceleration
                            – Graphic (3D, Mali400 MP)
                            – VPU (1080P)
                            – APU
                          • Package
                            BGA336, 14mm*14mm
                          Benefits
                          Optimum multimedia and processing abilities
                          Lower power consumption of HD videos and graphics due to hardware acceleration
                          Lower power consumption of HD videos and graphics due to hardware acceleration
                          Total solution, including OS BSP (Android 4.0.4 UP)
                          Typical application

                          HDMI Dongle
                          Homlet (Android Box)

                          And A10s is definitely coming to the market as per this [Sept, 21, 2012] discussion thread

                          Today I found a seller on on a website selling new model of Android TV stick, it claims adopting new A10S chip & support DLNA function that is just what I want, is that a good deal?

                          Allwinner Technology-A13 [product page, April 13, 2012]

                          The full Jifh A13 chip

                          Allwinner Technology has expanded its processor lineup to include a new ARM Cortex-A8 chip A13 which is even more competitive for Android tablets with higher performance (ManyCore Lite), lower power consumption, and lower total system cost. As the brains of Android 4.0. 3, A13 makes multitasking smoother, apps loading more quickly, and anything you touch responds instantly. What’s more important, A13 is available in eLQFP176 package with Audio Codec, and 2 Points R-TP integrated.

                          Features

                          • CPU / GPU
                            – ARM Cortex-A8 Core
                            – 32KB D-Cache / 32KB I-Cache
                            – 256KB L2 Cache
                            – Mali-400 3-D Engine
                          • VPU
                            – HD Video Decoding
                            – 1920 * 1080 @ 30fps
                            – Support H.264, H.263, VC1, Mpeg1/2/4, Divx 3/4/5/6, Xvid, VP6 / 8, AVS etc
                            – HD Video Encoding
                            – Support encoding in H.264 format up to 1920 * 1080 @ 30fps

                          • Boot Devices
                            – NAND Flash
                            – SPI Nor Flash
                            – SD Card
                            – USB
                          • Ultra-low System Power Consumption
                            15 ~ 20% lower than competitors
                            – Smart Backlight: auto adjust backlight acc. to the image display

                          • DPU
                            – LCD Interfaces: CPU, RGB
                          • Memory
                            – DDR2/DDR3: Up to 533MHz
                            – 16 bits Data Bus
                            Memory capacity up to 512MB
                            – MLC / TLC / SLC / EF-NAND
                            – 2 flash chips, ECC 64-bit
                            – Support NAND of 5xnm, 4xnm, 3xnm, 2xnm …
                            – Support NADN of Samsung, Toshiba, Hynix …
                          • Peripherals
                            – USB2.0 OTG, USB2.0 HOST (OHCI / EHCI)
                            – SD Card V.3.0, eMMC V.4.2
                            – SPI, TWI and UART
                            – integrated Audio Codec
                            – CSI
                          • R-TP Controller
                            – 4-wire resistive TP interface
                            2 points and gesture detection
                          • Powerful Acceleration
                            – Graphic (3D, Mali400 MP)
                            – VPU (1080P)
                            – APU
                            E-Reader
                          • Package
                            eLQFP176

                          Benefits
                            • Optimum multimedia and processing abilities
                            • Lower power consumption of HD videos and graphics due to hardware acceleration
                            • Much faster, easier and cost efficient product launch due to the high integration
                            • Further development kits, including OS BSP (Android 4.0.3 UP)
                            Typical application

                            Pad
                            E-BOOK

                            Note that Allwinner is operating in a world-class environment as you could easily see from the below picture of their office building taken from their brief intro page [April 13, 2012]:

                            Jifh Southern Software Park Zhuhai

                            全志科技 Allwinner Technology has been committed to the IC design industry, is one of a handful of domestic enterprise engaged in system-level ultra-large-scale mixed analog-digital chip design the SoC and intelligent power management. Our main products are intelligent terminal application processor chip, smart power management chip.
                            With excellent R & D team and technical strength, the company’s products to achieve industry-leading levels of high-definition video codec, a high level of integration, low power consumption, rapid market expansion, has become a domestic Tablet PC application processor chip, high-definition player application processor chip as well as one of the mainstream supplier of intelligent power management chip market, has a clear lead.

                            New content replacing the above on Sept 26, 2012:

                            Allwinner Technology, one of the domestic companies in integrated circuit design industry, is dedicated to the design of mixed analog-digital VLSI SoC and smart power management SoC.

                            Depending on its excellent R&D capability, Allwinner Technology has been led the industry in terms of its HD video codec, high integration and low power consumption, etc. As a result, it is gaining more market share, and has become one of the domestic mainstream suppliers of tablet processors, HD player processors, as well as smart power management SoC.

                            Note therefore that Allwinner’s roots are in the video (multimedia) related chips as also shown by their latest pre-A10 SoC product (introduced in August’11) for that market, the F1C100 (another SoC, the more focussed F20 introduced in August’11 for portable video players, living room computers etc. has even better, 1080p full HD decode technology; as well as the very latest F10 introduced in April’12 for HD players and lower end –relative to A10—car multimedia), described on its product page as:
                            With advanced independently developed video decoding technique, F1C100 becomes the ONLY processor in the market that can decode video in all formats based on ONLY 4MB NOR FLASH and 16MB SDRAM. In the mass production of final products, NOR bootloader burning is much easier and faster compared with NAND FLAHS ‘. Last but not least, F1C100 supports two-point touch which can improve the using experience of end-users.

                            New F10 content replacing the above on Sept 26, 2012:

                            The F10 is an advanced HD video CODEC processor with unparalleled competitive edges in integration, video compatibility and cost efficiency, which have been widely verified by mass production of dozens of applications. End-users are overwhelmed by its capability to serve banquet for the eyes.

                            Typical Application

                            HD PMP
                            Student Computer
                            HD Media Player
                            Car MP5
                            HD AD Player

                            F1C100’s datasheet [initial version, March 31, 2011] is providing the following, more precise description:

                            image

                            and for the video engine of their own design in particular:

                            image

                            image

                            With this intellectual property they were able to upscale to a market leading 2160p functionality in the A10 (vs. the 720p in the above F1C100) while using a less upscaled IP for the 1080p in A13. So they can even have a scaleable video engine IP of their own.

                            In the A10 datasheet or here [initial version, Aug 22, 2011] the following description is giving some hint regarding the company’s strategic intent to remain in the forefront of video acceleration technology:

                            image

                            It is quite notable that neither on the product page nor in this datasheet Allwinner is giving further information about their video engine. Even in the functional block diagram of datasheet the video engine (VE) is simple put into a central box with Cartex-A8 and the Mali GPU:

                            image

                            The only available information is the CedarX wiki page [July 14 – Sept 16, 2012] on linux-sunxi wiki:

                            CedarX is Allwinner’s multimedia decoding technology. It is composed of several parts, including:

                              1. A hardware video decoding unit
                              2. Proprietary libraries to communicate with the hardware unit
                              3. Glue code to use those libraries on an actual system with video playback capabilities (e.g. Android)
                              Benefits
                                • Efficient use of system resources when decoding multimedia.
                                • Allows small ARM systems to playback high resolution/bitrate multimedia content, which wouldn’t be possible using software-only decoding.
                                    Disadvantages
                                      • The proprietary libraries have no clear usage license.
                                      • The android glue code is implemented as a “media player” (parallel to stagefright) instead of as OMX components.
                                      • This media player has limitations when it comes to playing back content pointed to by Android URIs and some web-based content.
                                      • There is no glue code for any other multimedia frameworks on GNU/Linux systems. The use of OMX would’ve rendered this a non-issue, with existing projects like GstOpenMAX.
                                          Integration
                                          Reverse Engineering
                                          On June 15 2012 Iain Bullard started reverse engineering the proprietary libraries.
                                          Some leading tablets (single core) as of April, 2012  per Merimobiles (with an office in Canada)
                                          (Haipad I7 is now $99, the price of Ployer Momo9 is unchanged, see: HAIPAD I7 IPS 1024*600 Multitouch Screen with Android 4.0 Dual Camera 1080P HDMI [Merimobiles.com, Sept 10, 2012],  Haipad’s latest 7-inch ICS tablet Haipad i7 gets FCC clearance [Merimobiles blog, March 6, 2012], from Shenzhen Haina Electronic Co., Ltd “founded in 2003 as a high-tech company specializing in laptops and other digital mobile devices”)

                                          comparison-chart-haipad-i7.png

                                          The Allwinner A10 based tablets came to the global market from quite a number of vendors as shown by the following table (=50) compiled from two related threads from SlateDroid.com (note that global arrival of A10-based product started in Jan’12):

                                          Comprehensive List of Allwinner A1X/A10 devices on SlateDroid.com, as of April 18, 2012 (first version: Feb 26, 2012)
                                          A10 Tablets with less than 1GB memory („1st generation”):
                                          AllDro Speed
                                          Ainol: Novo 7 Advanced, Novo 7 Advanced II
                                          OEM Novo 7 Advanced
                                          Allview AllDro Speed
                                          Audemars Piguet PC741 (w/ bluetooth)
                                          Aura LY-F1
                                          BRONCHO A710
                                          Bmorn: V9 plus, V11
                                          Dropad A8HD
                                          Eken: MB1001, T01A, t10a
                                          Eneoze 7 inch or 10 inch
                                          Hyundai A7
                                          ICOO: D70W, D90W
                                          LY-F1 (Netpad A10, TPGA-7AWN, A710)
                                          Leoxsys Leopad i7-1500
                                          Moonpad2
                                          Onda: VX610W, Vi20W, Vi10 deluxe edition, Vi20W deluxe (the original Vi20W is RK2918-based), Vi30W deluxe, Vx610w, VX580W Deluxe Edition (5” tablet)
                                          Ployer: Momo8 (8″ screen 800×600), Momo9 (C, Enhanced, etc), Momo15 (10” screen)
                                          Rexing V7
                                          Sanei N70 N71 N72 N73 N80 N81 (N7x is 7” and N8x is 8”)
                                          Saycool A710
                                          Scroll Excel
                                          Sigotech V700 (resistive touch)
                                          Skypad Alpha 2
                                          Teclast: P76 Resistive, P76ti
                                          Tracer OVO
                                          WoPad A7 (upcoming)
                                          „2nd generation” A10 tablets (with 1 GB or more):
                                          Ainol: Novo Elf, Novo Aurora
                                          Bmorn V11 Extreme
                                          Ampe A90
                                          Gemei: G9, Gemei G2
                                          Eken A90
                                          Ployer Momo11 Bird
                                          newman P81
                                          Onda: Vi40 (8g, 16g, 32g/ 10” screen), Vi10 elite, 1GB Ram, 8 GB Flash, 1024×600 LCD
                                          Teclast: P85 (8″ screen), A10
                                          Later/OTHER devices (not verified, just put on the thread, THOSE WITH LINKS are from the Adding new Allwinner A10 CPU Devices THREAD [Jan 19-Sept 17, 2012]):
                                          Ampe: A80, A85, A10
                                          Andtai FG-A97
                                          Benyi M8
                                          Coby Kryos 7042
                                          Gemei G3
                                          Haipad i7
                                          HKC M701
                                          ICOO: D50 deluxe edition, D80W
                                          iNote: V4, A8, A8-2, A-8-3
                                          Kliver MB9703
                                          MyAudio 908A
                                          Naviatec MD710
                                          Onda Vi40 Flagship
                                          Polaroid PMID701C
                                          Shimaro M5
                                          Sinvigo M7
                                          Sysbay s-mp99
                                          Treq A10C
                                          Trio Stealth Pro 7
                                          VISTURE 3
                                          Zonge M90
                                          Yarvik Xerios TAB464
                                          Xtouch X716
                                          Woxter Tablet PC 97

                                          Note that there were only couple of Chinese vendors with multiple Allwinner A10-based tablet offerings, namely: Ainol, Ampe, Bmorn, Eken, Gemei, ICOO, iNote, Onda, Ployer, Sanei, Teclast (i.e. just 11 out of 50).

                                          There is a much shorter and later started list of Allwinner A13-based tablets on SlateDroid.com, see: List of Allwinner A13 CPU Devices [from Aug 1, 2012]

                                          Then from April to August there were the following events unfolding in China as per Micdigi reports:

                                          A13 is cheaper than A10 with only 512M memory and 800×600 resolution but without Bluetooth and HDMI. Allwinner A13 can be only used for 7-inch tablet PC and 8-inch tablet PC, it does not support 10-inch tablet PC.

                                          Contrasted with VIA8850 and RK2906, A13 with low cost will have strong market competitive capability. The price of 7-inch tablet with A13 and capacitive screen will be less than $48 in May.

                                          Rockchip has released RK2906 chip to defeat Allwinner A10. The chip is not different from RK2918 but it can only used for 7-inch tablet and 8-inch tablet.

                                          The tablet based on RK2906 comes from Shenzhen DavidMid.

                                          The two sample tablet PCs from SMIT are based on slot-in screen and flat screen. The price of the slot-in screen is less $8 than the price of the flat screen.  

                                          The price of the PCBA sells for about $19, the tablet PC based on A13 solution, slot-in screen and capacitive control sells for about $47.

                                          … The slot-in screen does not have external glass and interaction sets that it is cheaper. But the experience is not different from the flat screen. …

                                          Remark: Embedded Touchscreen Technology and Market Analysis [Displaybank, March, 2010]

                                          The embedded touch technology is divided into In-cell and On-cell technologies. Conventionally, only the In-cell technology which was exclusively developed by panel makers drew attention, but it entailed issues in technology and cost regarding a mass production by satisfying the touch function demanded by customers and market. The on-cell technology lies at a grafting point between the conventional touch industry infra and LCD panel industry that it tends to mutually supplement the two industries in terms of performance and function.
                                          The embedded touch technology which includes above On-cell and In-cell technologies is ideal since it reduces thickness and weight as well as it overcomes shortcomings of the conventional add-on type: reduced transmittance, lowered readability due to contrast ratio decrease, and thick bezel width. Based on above advantages, related makers continue with the technology development. The market is yet insignificant, but it is expected to show high growth rate comparable to the Touch market’s growth.

                                          Latest info:
                                          On-cell Touch Screen Panel Slims Down Mobile Displays [Electronic Design, June 10, 2012]
                                          TOUCH TECHNOLOGY IN SMARTPHONES EXPLAINED [FlatpanelsHD, Sept 19, 2012]

                                          VIA8850 based on Cortex-A9 core is powerful than VIA8650. VIA8650 is so worse that some famous manufactures in China have not made their tablet PCs to introduce VIA8650 chip, such as Ramos, Window and TOBE.

                                          VIA8850 will come with cheap price and powerful performance. It will be mainly used for SuperPad tablet PCs. It is said that VIA will release another chip for big-brand companies.

                                          Actually it is same with VIA8850, but it has different name.

                                          As VIA8650 chip is so worse, Infotmic [X200] 7-inch chip, Allwinner A10, Allwinner A13 have got most of the market share.

                                          Could VIA8850 chip get more market share in this year?

                                          1.  There are so many Allwinner A10 tablet PCs that the competition is so fierce. Some manufactures do not make any money. They will not continue to release A10 tablet PCs. Maybe they will release VIA8850 tablet PCs.

                                          2.  VIA8850 based on Cortex-A9 core is [more] powerful than Allwinner A10 based on A8 core and A13 based on A8 core. With the resource of HTC, the system optimization of the VIA8850 tablet PC is excellent. It not only has powerful performance but also has cheap price.

                                          3. VIA is a famous chip company in the world. They have good marketing channel.

                                          Allwinner has released the A10 chip for about half a year. They have earned so much money including the investment cost and the profit.

                                          VIA must do their best to earn the investment cost. The cost of VIA8850 is [more] expensive than Allwinner A13.

                                          Allwinner has advantage in the price war.

                                          Configurations: Infotmic solution, 256M memory, 4G storage, 7-inch resistive screen with 800×480 resolution, front facing camera, Android2.3 OS.

                                          Infotmic X200 series are based on ARM11, 1GHz frequency, supports 1080P video decode.

                                          Recent examples of tablets:

                                          $39 AllWinner A13 Tablet (100K bulk) by Hott at IFA 2012 [Charbax YouTube channel, Sept 2, 2012]

                                          Hott presents one of their latest cheapest tablet to manufacture and they also have a new cheap bluetooth and cabled speaker.

                                          $46 AllWinner A13 by OMG at IFA 2012 [Charbax YouTube channel, Sept 2, 2012]

                                          I show a range of the latest tablets by OMG of Shenzhen China. $46-$48 (if buying 500) AllWinner A13, $55 VIA Cortex-A9 [VIA/WM8850], $110 AllWinner A10 with 3G modem (likely Huawei).

                                          $99 3G Allwinner A10 Eken G70 at IFA 2012 [Charbax YouTube channel, Sept 1, 2012]

                                          Here’s a sub-$100 (in bulk) 3G-connected Allwinner A10 7″ capacitive tablet.

                                          And here is an earlier $55 AllWinner Boxchip A13 Tablet Factory Tour [Charbax YouTube channel, May 27, 2012] to understand why and how the workforce is able to assembe the tablets at such a cheap price:

                                          See how they are assembling the $55 (soon $49) AllWinner Boxchip A13 7″ Capacitive tablet. This Shenzhen factory assembly line cranks out about 4000 such tablets in a day’s work. If you like this video, you should also watch my Shenzhen Speakers Factory video (http://www.youtube.com/watch?v=3fcmbHMnqbo) that I posted last month. I think that they are treated better than Apple/Foxconn workers, I think they make better money, they have better working conditions (for example they may wear their own clothes), they probably have more flexibility and the work may be less monotonous. Yet, of course I think working conditions can be improved for all Chinese consumer electronics factory workers. My suggestion is that consumers must have the choice to buy “vouchers that go 100% to the workers that made the devices”, for example, decide to pay $5 extra for your tablet, and know that the $5 goes 100% to the factory workers that build it meaning you double their salary (if 50% of all consumers decide to give an average of $5 each per device).

                                          AAPPAA Shenzhen JinPinXing Tablets [Charbax YouTube channel, Sept 2, 2012]

                                          Here they’re showing [on IFA 2012 in Berlin] their PCB and Tablet casing designs. They claim to have the worlds thinnest 9.7″ IPS tablet at 8.9mm.

                                          Some important information mentioned in the video:

                                          MID-971:
                                          – World’s Thinnest 9.7” [IPS] Pad
                                          – Only 8.9 mm
                                          – Built-in 3G (can be also without it)
                                          – WiFi + Bluetooth
                                          VIMICRO??? or Longcheer 2918/3066
                                          – the WiFi only version is US$115-120 depending on quantity

                                          MID-803:
                                          – 8” Pad
                                          – Built-in 3G
                                          – Dual Camera
                                          Rockchip 3066 dual core
                                          – US$172 with 8GB and 3G

                                          ?MID-973?: a 9” tablet with Allwinner A13 is said to cost US$73-74
                                          30K tablets sold per month, can sell upto 50K per month
                                          On their product microsite (see below) the tablets shown currently have the following SoCs and parameters:
                                          Allwinner A10 (Cortex A8@1.5GHz): MID-501 and MID-702 (both 512MB DDR3 and 7” 800×480 with Android 4.0.4)
                                          Allwinner A13 (Cortex A8@1.0GHz): MID-438 (7” 262×480 and Android 4.0.3), MID-703 (7” 800×480 and Android 4.0.4) both with 512MB DDR3
                                          VIMICRO882 (Cortex A8@1.0GHz): MID-706 (512MB DDR3 and 7” 800×480 with Android 4.0)
                                          – all the those are with capacitive touch screens, NAND FLASH 4GB/8GB/16GB / 32GB (optional), AMD graphics acceleration, full support for OpenGL ES2.0 (AMD Z340) and h.264 720P HD 1080i

                                          Jinpin Xing Technology Co., Ltd., Shenzhen – Tablet PC – Products – [as of Sept 18, 2012]
                                          深圳市金品兴科技有限公司 – 平板电脑 – 产品介绍


                                          MID-702


                                          MID-438

                                          MID-971


                                          MID-973


                                          MID-708


                                          MID-706


                                          MID-501


                                          MID-1001


                                          MID-703

                                          AAPPAA –About us [Aug 19, 2011]

                                          AAPPAA, founded in 2005, is an established manufacture of smart digital products with super perfect design in MP3/4/5, Mini Speaker products field. We design and produce super perfect quality products, many of them are original which we ship to wholesale customers all over the world. Given the wide array of geographic regions across which we distribute product, we work closely with our customers and retail partners to ensure the AAPPAA team remains innovative and competitive in a constantly evolving market sector.

                                          AAPPAA’s Success: AAPPAA’s success can be attributed to close collaboration with our global set of customers and partners combined with internal efforts to continually improve our productivity, design creativity and quality management initiatives. Through the years, AAPPAA has experienced tremendous growth while also enhancing the personal lives of our customers, and the well being of our loyal employee base. AAPPAA employs 60+ people with an average employment tenure of nearly 3 years a fantastic achievement amidst China’s explosive growth that has offered a continuous list of new opportunities of a young, energetic workers.
                                          AAPPAA’s Manufacturing Capacity: AAPPAA’s 1500 square meters of manufacturing space and 60+ workers are based in Shenzhen China. We operate multiple production lines with SMT machines, hot plastic packing machines as well as high & low temperature age and vibration testing units. Production capacity exceeds 110,000 units per month. In addition, AAPPAA’s products are CE, FCC, RoHS certified.
                                          Address: 5F, Nankeng No.2 Industrial Park Abuilding, Bantian Town, Longgang District, ShenZhen City 518129, China
                                          Tel : +86-755-83579180    Fax:+86-755-83579189    E-mail: sales@aappaa.com

                                          5. The wireless display and 2160p (“Quad HD”/4K) outlook

                                          Wi-Fi CERTIFIED Miracast™: Your Content – Now Showing on Screens Everywhere [WiFiAlliance YouTube channel, Sept 18, 2012]

                                          Wi-Fi CERTIFIED Miracast™ is a groundbreaking solution for seamlessly displaying video between devices, without cables or a network connection. Users can do things like view pictures from a smartphone on a big screen television, share a laptop screen with the conference room projector in real-time, and watch live programs from a home cable box on a tablet. Miracast connections are formed using Wi-Fi CERTIFIED Wi-Fi Direct™, so access to a Wi-Fi® network is not needed — the ability to connect is inside Miracast-certified devices. Miracast is an industry-wide solution, so the technology works well across devices, regardless of brand. Connections are easy to set up and use since the devices choose the appropriate settings automatically. Miracast supports premium content—like Blu-ray feature films, live television shows and sports, or any other copy-protected premium content—allowing you to watch what you want, where you want.

                                          What that means practically is currently best shown by a non-Chinese tablet SoC vendor:
                                          NVIDIA Tegra 3 Enhances Miracast Wireless Display [nvidia YouTube channel, July 26, 2012]

                                          Watch how NVIDIA’s Tegra 3 can enhance the experience of the WiFi Alliance’s new open standard for wireless display called Miracast. From the same organization that established the ubiquitous Wi-Fi standard, comes the ability to wirelessly beam the display contents of your mobile phone or tablet directly to the large HDTV screen in your home without a wireless router. See how the performance of Tegra 3 can deliver the ultimate Miracast experience by bringing super clear HD videos and console quality game play with Tegra Zone games

                                          What you see here is the Hardware + software optimization done by NVIDIA for Miracast. Since Allwinner is using its own video processing unit (VPU) which is said to be the fastest relative to the video engines of its Chinese SoC competitors (e.g. Amlogic) we can expect a similar to the NVIDIA’s kind of software optimization for the Allwinner VPU. (Take also into consideration “the company’s strategic intent to remain in the forefront of video acceleration technology” as it was proven in the “Allwinner Advantage” section before.)

                                          In other respect a separate 3d party WiFi chip is coming into the play, and there is already quite a number of those chips already to be designated Wi-Fi CERTIFIED Miracast:

                                          Easy-to-use, multi-vendor wireless display has arrived: Wi-Fi Alliance® launches Wi-Fi CERTIFIED Miracast™ [Wi-Fi Alliance press release, Sept 19, 2012]

                                          Wi-Fi Alliance® today announced the launch of the Wi-Fi CERTIFIED Miracastcertification program. Miracast devices provide simplified discovery and setup, so users can quickly transmit video content from one device to another. Industry analysts predict annual shipments of Miracast-certified devices to exceed one billion units within the next four years.
                                          Miracast users can do things like view pictures from a smartphone on a big screen television, share a laptop screen with the conference room projector in real-time, and watch live programs from a home cable box on a tablet. Miracast connections are formed using Wi-Fi CERTIFIED Wi-Fi Direct, so access to a Wi-Fi® network is not needed – the ability to connect is inside Miracast-certified devices.
                                          “Wi-Fi users around the world want to experience multimedia on the device of their choice – no matter what brand – and Miracast is the breakthrough they have been waiting for,” said Edgar Figueroa, CEO of Wi-Fi Alliance. “We have been delighted with the level of enthusiasm and support among our member companies for this new offering.”
                                          Miracast supports protected content streaming, enabling devices to stream feature films and other copy-protected materials. To protect premium content, Miracast uses a wireless adaptation of the trusted content protection mechanisms widely used today for cabled interfaces like HDMI® and DisplayPort. In addition, the latest WPA2™ security protections are automatically enabled on every device, making the transport of all multimedia content private.
                                          “Miracast builds on Wi-Fi Direct with a compelling application,” said Brian O’Rourke from IHS iSuppli Research. “This is a big step forward in a market migration from single-vendor display solutions, into an offering from a wide array of vendors. With more than 1.5 billion Miracast devices expected to ship in 2016, the program is poised to have broad adoption.”
                                          The technology underlying Miracast was developed in Wi-Fi Alliance by a diverse group of mobile and consumer electronics manufacturers and silicon vendors to standardize methods for simplified video sharing. Based on the Wi-Fi Alliance Display Specification, products bearing the Miracast brand interoperate across vendors, making it easy to enjoy video on screens throughout the home or office.
                                          The first products to be designated Wi-Fi CERTIFIED Miracast, and which form the test suite for the certification program, are:
                                            • Broadcom Dualband 11n WiFi
                                            • Intel® WiDi
                                            • Marvell Avastar USB-8782 802.11n 1×1 Dual-band Reference Design
                                            • MediaTek a/b/g/n Dualband Mobile Phone Client, MT662X_v1 and DTV Sink, MV0690
                                            • Ralink 802.11n Wireless Adapter, RT3592
                                            • Realtek Dual-band 2×2 RTL8192DE HM92D01 PCIe Half Mini Card and RTD1185 RealShare Smart Display Adapter
                                              The first consumer products certified since testing opened to vendors include the LG Optimus G smartphone, Samsung Galaxy S III smartphone and Samsung Echo-P Series TV.
                                              More information, including a list of Wi-Fi CERTIFIED Miracast products, the Wi-Fi Alliance Display technical specification, white paper, and more is available at www.wi-fi.org/miracast.  
                                              Broad industry support for Wi-Fi CERTIFIED Miracast
                                              “As a Wi-Fi market leader, Broadcom is honored to be one of the primary certification solutions for the Wi-Fi Alliance Miracast™ program and is committed to driving new Wi-Fi standards,” said Dino Bekis, Senior Director, Wireless Connectivity Combo Group at Broadcom. “The standardization of this technology will enable consumers to easily and seamlessly share content across the ever-growing landscape of connected devices.”
                                              “Users clearly expect that they should be able to move their content and applications freely at home, at work, in the classroom, and on the go,” said Joe Van De Water, Director of Consumer Product Marketing at Intel. “Intel has seen tremendous user enthusiasm for Intel® WiDi, and as a member of the Wi-Fi Alliance, we support enabling this usage more broadly and are excited to announce WiDi as one of the first Wi-Fi CERTIFIED Miracast solutions.’’
                                              “We celebrate the launch of the Wi-Fi CERTIFIED Miracast program,” said Hyunghoon Oh, Head of LG Mobile Communication R&D Division. “Miracast brings an exciting advancement in the way devices deliver display applications.”
                                              “The Wi-Fi Alliance’s Miracast certification program will allow for easy sharing of video content, regardless of vendor,” said Bart Giordano, Director, Wireless Marketing at Marvell Semiconductor, Inc. “We have included Miracast in our solutions, and are honored to have been selected for the program’s test bed.”
                                              “The video streaming applications enabled by Wi-Fi CERTIFIED Miracast™ are key to the growth of the Wi-Fi ecosystem encompassing Consumer Electronics, Personal Computing, and Mobile devices.” said Mr. SR Tsai, General Manager of Wireless Connectivity & Networking Business Unit at MediaTek. “We are honored to have our Android mobile platforms, Digital TV, as well as our connectivity solutions for Windows platforms selected for the Miracast test bed.”
                                              “Miracast on NVIDIA Tegra will bridge the distance between mobile devices and high-def TVs, providing customers a rich – and cable-free – multimedia experience,” said Matt Wuebbling, Director of Product Marketing at NVIDIA. “We have embraced Miracast and are working with our OEM partners to bring its amazing possibilities to market.”
                                              “We are happy to have been involved in developing the Miracast program and to be one of the first companies to receive certification,” said Jessy Chen, Vice President and Spokesman at Realtek. “The solution will greatly expand the market for easy-to-use interoperable wireless display connectivity.”
                                              “As a leader in N-screen technology, Samsung has introduced AllShare Cast (based on Miracast), which is incorporated into most of Samsung’s high-end smart mobile devices including the GALAXY S III, GALAXY Note 10.1, and GALAXY Note II, “ said Hankil Yoon, Senior Vice President of Product Strategy Team, Samsung’s Mobile Communication Business. “We will continue to support the program, and plan to offer more Miracast-certified devices to our customers going forward.”
                                              “Sony Mobile is pleased to support the Wi-Fi CERTIFIED Miracast™ certification program. We continuously strive to deliver new exciting user experiences and Miracast™ technology will enhance our ability to offer consumers seamless connectivity to move their content freely between smartphones and other screens,” says Nikolaus Scheurer, Director Marketing Planning for Sony Mobile Communications.
                                              “Miracast will play an important role in enabling true seamless media streaming, gaming and content sharing between mobile screens and large displays,” said Ram Machness, director of marketing, Wireless Connectivity Solutions, Texas Instruments Incorporated. “Our OMAP™ platform, DaVinci™ video processors and WiLink™ connectivity products will offer Miracast-certified source and sink solutions to provide a rich experience for our customers’ end products.”
                                              About the Wi-Fi Alliance®
                                              www.wi-fi.org
                                              The Wi-Fi Alliance is a global non-profit industry association of hundreds of leading companies devoted to seamless connectivity. With technology development, market building, and regulatory programs, the Wi-Fi Alliance has enabled widespread adoption of Wi-Fi worldwide.
                                              The Wi-Fi CERTIFIED™ program was launched in March 2000. It provides a widely-recognized designation of interoperability and quality and it helps to ensure that Wi-Fi-enabled products deliver the best user experience. The Wi-Fi Alliance has completed more than 15,000 product certifications, encouraging the expanded use of Wi-Fi products and services in new and established markets.
                                              Wi-Fi®, Wi-Fi Alliance®, WMM®, Wi-Fi Protected Access® (WPA), the Wi-Fi CERTIFIED logo, the Wi-Fi logo, the Wi-Fi ZONE logo and the Wi-Fi Protected Setup logo are registered trademarks of the Wi-Fi Alliance. Wi-Fi CERTIFIED™, Wi-Fi Direct™, Wi-Fi Protected Setup™, Wi-Fi Multimedia™, WPA2™, Wi-Fi CERTIFIED Passpoint™, Passpoint™, Wi-Fi CERTIFIED Miracast™, Miracast™, Wi-Fi ZONE™ and the Wi-Fi Alliance logo are trademarks of the Wi-Fi Alliance.
                                              All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

                                              For Chinese vendors the WiFi-related MediaTek chips are the most accessible and affordable, so I am including the additional MediaTek press release as well:

                                              MediaTek Interlinks Mobile Devices and TVs for Wireless Display MiracastTM Applications [MediaTek press release, Sept 19, 2012]

                                              MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced that its 802.11a/b/g/n Dual-band Mobile Phone Client (MT662X), 802.11n Wireless Adapter (RT3592) and DTV Sink solutions (MV0690) have all been selected as part of the Wi-Fi CERTIFIED MiracastTM test bed. As the benchmark to drive interoperability testing for the newest Wi-Fi program, MediaTek’s Miracast-certified solutions allow mobile devices to wirelessly stream multimedia content, such as video and games, onto big screen DTVs without a connection to an access point.
                                              “We congratulate MediaTek on achieving selection to the Wi-Fi CERTIFIED MiracastTM test bed,” said Wi-Fi Alliance CEO Edgar Figueroa. “MediaTek’s participation in the development of this program has been instrumental in the achievement of industry-wide certification.”
                                              In a typical MiracastTM usage scenario, one device acts as the source (the transmitting device sending out the content) while the other becomes a sink (a receiving device displaying the content). Thanks to the new Wi-Fi test program and MediaTek’s proven technologies, interoperability and user experience of Miracast applications can be guaranteed.
                                              “We are partnering with MediaTek to provide consumers with high-performance, affordable smartphone solutions that incorporate the latest Miracast Wi-Fi display technology for the home and on the go, “ said Dr. Ji-Yang Wang, COO at TCL Communications Technology. “MediaTek’s industry-leading technologies, cross-platform advantages across home and mobile, and ‘hands-on’ approach to design and support, are essential in creating products that helps us deliver a compelling user experience and differentiated offering.”
                                              “The video streaming applications enabled by Wi-Fi CERTIFIED MiracastTM are key to the growth of the Wi-Fi ecosystem encompassing Consumer Electronics, Personal Computing, and mobile devices.” said Mr. SR Tsai, General Manager of MediaTek’s Wireless Connectivity & Networking Business Unit. “Having our Android Smartphone, Digital TV, as well as our connectivity solutions for Windows platforms selected for the MiracastTM test bed is a strong testament to the breadth and quality of MediaTek’s Wi-Fi technology.”
                                              MediaTek offers a broad portfolio of high-performance SoC and wireless connectivity solutions for the proliferation of smartphones, tablets, PCs, DTVs, Blu-ray players and AP/routers. The Wi-Fi CERTIFIED MiracastTM MediaTek solutions included in the test bed are:
                                              MT662X a/b/g/n Dual-band Mobile Connectivity Combo
                                              RT3592, Ralink 802.11n Wireless Adapter
                                              MV0690 DTV Sink
                                              The Wi-Fi CERTIFIED MiracastTM MediaTek solutions have entered mass production and are shipping in commercially launched devices.
                                              * Windows is a registered trademark of Microsoft Corporation in the United States and other countries.

                                              See also:
                                              Wi-Fi CERTIFIED Wi-Fi Direct™: Personal, portable Wi-Fi® that goes with you anywhere, anytime [Wi-Fi Alliance, Aug 15, 2010]

                                              As far as the 2160p (“Quad HD” or 4K) technology is concerned, which is already on our footsteps, I would first recommend to watch the below demo video available on YouTube in QUAD HD resolution. You should “simply” select the “Original” quality in full screen viewing mode, and if your monitor has sufficient resolution than you could get the proper experience (do not forget that your Internet connection should be sufficiently fast in terms of guarranteed dowload speed as well). If not than correspondingly less:

                                              IT005 QUAD HD 4K – Italy travel guide Bird watching [VOXLIBERTUM YouTube channel]

                                              Birdwatching in 4K on the River Adda. Natural Reserve maintained by Pro loco Villa D’adda – Footage courtesy by http://www.iris32.com – This 4K video is posted in original QUAD HD resolution. It has been produced with RED 16×9 HD with 4096 x 2304 pixel resolution. The color grading was done with REDCINE PRO X. It was mastered in FCP 7 with 4444 PRORES and than downscaled to 3840 x 2160 (QUAD HD) in PRORES 422 (LT) to reduce the file size under 20 GB. All original sequences used in this video are available on http://www.iris32.com. Should you require the 4444 PRORES original for maximum quality, please go to the IRIS32 website and mail a request. I hope you enjoy this little piece of birdwatching on the River Adda. Copyright 2012 – Frederick von Sulle, VOXLIBERTUM

                                              Then please watch another video which is showing what the leader in this TV technology, Toshiba was showing on the recent IFA 2012 fair in Berlin:
                                              Toshiba 4K Quad-HD 3840×2160 TVs with CEVO Engine upscaling/processing from 55″ to 84″ [Charbax YouTube channel, Aug 30, 2012]

                                              Toshiba is ramping up the production of their awesome Quad-HD screens, the 2D-only 55″ is awesome, but only for sale in Japan for now. But this year and the next, Toshiba is going to ramp up the manufacturing of these, I hope they lower the price of 55″ Quad-HD to sub-$2000 as soon as possible! The slideshows of 8 megapixel photos and 4K videos filmed with the Red camera videos look awesome on it!

                                              The reporter (Nicolas Charbonnier alias Charbax) did an excellent job with this video, as well as the Toshiba guy showing him around. Even his English is very good and enjoyable. Note that from [02:10] and “Glassless 3D” is shown and explained quite extensively, then highly zoomable Google Maps in 3D etc. Charbonnier is doing during all this an excellent job zooming with camera so one can really grasp the 4K and 3D experience quite well even in a normal viewing environment of your monitor. THANKS!

                                              More information:
                                              Toshiba unveils the first large-screen glasses-free 3D TV in Asia
                                              [Toshiba Singapore press release, May 3, 2012]
                                              Toshiba Brings New Generation of TVs and PCs to the Philippines Announces New Brand Ambassador [Toshiba Philippines press release, June 20, 2012]
                                              RZ1 SERIES NEW! Glasses-Free 3D TV [Regza Asia microsite, June 4, 2012]
                                              Toshiba Regza RZ1 [Toshiba Regza YouTube channel, May 31, 2012]

                                              Toshiba Regza RZ1 3D TV Review [gadgetguruindia YouTube channel, Aug 6, 2012]

                                              You can also watch Charbonnier’s shorter report about Sony 84″ 4K TV KD-84X9005 with 4K X-Reality Pro [Charbax YouTube channel, Sept 2, 2012] which came after Toshiba to the market and said to be widely available for Christmas.

                                              Finally: Status of the TV Display industry by Paul Gray, Director of European TV Research for DisplaySearch [Charbax YouTube channel, Aug 31, 2012]

                                              Here’s a 10-minute overview of the TV Display industry by Paul Gray, Director of European TV Research for DisplaySearch. Talking about Samsung, LG, Panasonic, Sharp, AUO, CMI, how they are losing money, how they are trying to bring new technologies like 3D and hopefully as soon as possible 4K to the market.

                                              6. Are the established client device players
                                              recognizing this strategic inflection point or not?

                                              Decide for your yoursel, dear reader:

                                              Ballmer trumpets Microsoft’s ‘epic year’ [The Seattle Times, Sept 15, 2012]

                                              Q: The iPad has the largest share of the tablet market, but its soft spot, it seems to me, is the price.With the Surface, are you planning to compete with the iPad on price or on features?
                                              A: We haven’t announced pricing. I think we have a very competitive product from the features perspective. …
                                              I think most people would tell you that the iPad is not a superexpensive device. … (When) people offer cheaper, they do less. They look less good, they’re chintzier, they’re cheaper.
                                              If you say to somebody, would you use one of the 7-inch tablets, would somebody ever use a Kindle (Kindle Fire, $199) to do their homework? The answer is no; you never would. It’s just not a good enough product. It doesn’t mean you might not read a book on it….
                                              If you look at the bulk of the PC market, it would run between, say, probably $300 to about $700 or $800. That’s the sweet spot.
                                              Q: Where do you see Microsoft’s position in five years, 10 years?
                                              A: First of all, I’d say: pre-eminent technology company. I think that in a back-looking view, people would say we were a software company. That’s kind of how we were born.
                                              I think when you look forward, our core capability will be software, (but) you’ll probably think of us more as a devices-and-services company. Which is a little different. Software powers devices and software powers these cloud services, but it’s a different form of delivery….
                                              Doesn’t mean we have to make every device. I don’t want you to leap to that conclusion. We’ll have partners who make devices with our software in it and our services built in. … We’re going to be a leader at that.

                                              Supply chain estimates x86 Surface Price at US$500-700 and RT below US$399 [DIGITIMES, Sept 18, 2012]

                                              Microsoft’s own-brand Surface tablets are expected to launch at the end of October with the related supply chain players estimating that the Surface RT’s hardware cost is at around US$300-400 and the end price will be less than US$399. However, the pricing is not confirmed by Microsoft.
                                              Microsoft’s pricing strategy for its own-brand tablets will relatively affect PC brand vendors’ pricing strategy and sales projections for their Windows 8 tablets. As the launch time at the end of October is approaching, PC brand vendors are keeping a close eye on Microsoft’s actions. With the related Surface pricing speculations having been floating around the market, Surface RT was previously rumored to be priced at only US$199, leaving the PC brand vendor in a cold sweat.
                                              Since CEO Steve Ballmer in a recent interview pointed out that a price level between US$300-800 will be the sweet spot for PC sales, some market watchers have interpreted the statement as a hint for Surface pricing.
                                              The sources revealed that the hardware cost of Surface RT is at US$300-400 and US$400-500 for the x86 version. Since the devices will not need to pay the licensing fee for the operating system. The RT version will be priced below US$399, while the x86 version is estimated to be US$100-200 higher based on hardware costs and priced at US$500-700.
                                              The PC brand vendors also pointed out that they will not be absent from launching x86-based Windows tablet products since Windows still has leadership position in the global enterprise market. If the x86 Surface’s end user price is at US$500-700, although they will feel the pressure from competition, the product line would still be profitable.

                                              Acer, Asustek Windows 8 tablet prices may be to high to attract consumers [DIGITIMES, Sept 20, 2012]

                                              Acer and Asustek Computer’s Windows 8 tablets are reportedly to be priced at above US$800, about the same price as the New iPad with the highest specifications, and market watchers are concerned that the high price may drag down consumer demand and impact the vendors’ performance.

                                              Although PC brands including Acer, Toshiba, Dell, Lenovo, Asustek, Samsung and Sony, have mostly unveiled or showcased their Windows 8 tablets publicly, their prices and specifications are still not yet to be officially revealed. However, some websites have recently leaked information about Acer and Asustek’s tablets including prices and specifications.

                                              Asustek is reportedly to release three Windows 8 tablet models and the 11.6-inch Vivo Tab will be priced at US$799.

                                              Acer reportedly will release two sizes of Windows 8 tablet – the 10.1-inch 64GB Iconia Tab W510 with Wi-Fi support only and priced at NZD999 (US$827), a keyboard accessory will raise the price to about US$993; and the 11.6-inch 128GB Iconia Tab W700 with Wi-Fi support only at NZD1,799 (US$1,490), and with a Bluetooth keyboard, the machine’s price will go up to about US $1,570.

                                              However, Acer and Asustek have both declined to comment on the leaked prices and only pointed out that they will host product launches in the near future. Intel has also recently sent out media invitations and will host a Windows 8 tablet conference on September 27 in the US to showcase tablets and convertibles from Acer, Asustek, HP, Lenovo, Dell, Samsung and ZTE to promote for the launch of Windows 8.

                                              Acer and Asus to Launch Windows 8 Tablet PCs in Q4 [CENS, Aug 22, 2012]

                                              Eying business opportunities created by the new Windows 8 operating system (OS), scheduled for release in October, Taiwan-based personal computer (PC) vendors Acer and Asus will soon launch Win 8 tablet PC models.

                                              Acer plans to launch two Windows 8 tablet PCs supporting keyboard input, and will soon launch several Android smartphone models, including the A9- and C-series in September. Acer`s CA and C1 smartphones will be demonstrated in pan-European market in the fourth quarter possibly in cooperation with some telecom carriers.

                                              Industry sources said that Asus` new tablet PC TF500T will be priced between its lower-end Transformer Pad TF300 and high-level model Transformer Pad Infinity TF700.

                                              Some institutional investors deem that after the Windows 8 products go to market, consumer response will decide how intensive PC vendors will promote compatible models.

                                              Lenovo has also announced to launch price-competitive Windows 8 tablet models priced from US$200 to US$300, with its IdeaPad Yoga notebook PC also to be announced in October.

                                              According to PC part and component suppliers, all major international vendors, including Dell, HP, Lenovo, Samsung, Acer and Asus, are actively developing Windows 8 products, leading to parts suppliers` revenue peaks in the fourth quarter.

                                              Compal Electronics Inc., a major contract notebook PC assembler, is reportedly developing Windows 8 notebook PC models for HP, which plans to unveil the new models in the fourth quarter to boost sales in the Christmas season.

                                              Acer to Keep Launching Netbook PCs: Chairman Wang [CENS, Sept 18, 2012]

                                              In the face of tablet PCs encroaching on sales of netbooks worldwide, J.T. Wang, chairman of Acer Inc., a Taiwanese, globally leading brand vendor of PCs, stated that his company will keep launching netbook models in the future.
                                              Since the launch of Apple Inc.’s iPad in 2010 ignited the market for tablet PCs, such emerging electronic devices have rapidly eaten into market shares of netbook PCs over the past few years. This forces most PC vendors, including Samsung, Dell and Lenovo, to consider giving up the diminishing market.
                                              Acer’s Taiwanese counterpart Asustek Computer Inc., which once rode on netbook PCs to achieve bigger shares of the global laptop market, also confirmed earlier that it will retire netbook PC production lines starting in the fourth quarter of this year, since such products, the company’s CEO Jerry Shen said, have already fulfilled tasks for the development of the global PC industry.
                                              Another factor prompting PC vendors to exit the netbook market is the lack of support from Microsoft and Intel. Accordingly, Microsoft doesn’t launch any starter edition of Windows 8 for netbook PCs, while Intel will focus the development of its Atom processors on tablet PCs and smartphones. This has made netbook PCs even more unworthy of development.
                                              But, Acer’s chairman Wang is still optimistic about the market for netbook PCs. He said that consumer demand for such devices will continue growing in emerging countries, not to mention that netbook sales in developed countries still make up a majority of the global total at present. Therefore, Wang said promotion of netbook PCs will remain part of his company’s product strategy in the short term.
                                              The latest statistics issued by International Data Corp. (IDC), a global PC market researcher, show that global sales of netbook PC totaled 8.913 million units in the first half of this year, with 26.2% of which supplied by Acer. The sales volume is estimated to reach between 15 million and 16 million units for the whole year.
                                              With most of its peers jumping out of the market, Acer, backed by strong brand recognition and huge outlets, is expected to take over most of the shares that they will leave to dominate this segment.

                                              Shares by Top 5 Brands in Global Market for Netbook PCs in Q2

                                              Ranking

                                              Brand

                                              Sales Volume

                                              Market Share

                                              1

                                              Acer

                                              1.182 million units

                                              26.2%

                                              2

                                              Asus

                                              1.019 million units

                                              22.6%

                                              3

                                              HP

                                              413,000 units

                                              9.2%

                                              4

                                              Samsung

                                              407,000 units

                                              9.0%

                                              5

                                              Canaima

                                              293,000 units

                                              6.5%

                                              Source: International Data Corp.

                                              Contract Manufacturers Make About Nine Out of 10 Media Tablets in 2012 [IHS iSuppli press release, Sept 21, 2012]

                                              Although your new media tablet may sport the logo of a familiar brand name like Apple or Amazon, there’s a 90 percent chance the device was actually made by a company with a much less famous moniker, such as Hon Hai or Quanta.
                                              That’s because the vast majority of tablets—including the iPad and Kindle Fire—actually are made by contract or outsourced manufacturers based in Asia, according to an IHS iSuppli Global Manufacturing & Design Report from information and analytics provider IHS. (NYSE: IHS). The percentage of tablets made by outsourced manufacturers is set to rise this year and beyond as brands seek to minimize operational risks and reduce costs.
                                              Outsourced manufacturers in 2011 were responsible for 87.5 percent of tablet production, compared to 12.5 percent that were made in-house. The percentage of outsourced tablets this year is expected to increase to 89.2 percent, with the portion claimed by in-house production projected to decline to 10.8 percent, as shown in the figure below. The years after that will see the share by outsourced manufacturing of tablets remain in the low 90 percent range, hitting a high of 91.1 percent by 2015 before settling back down at 90.4 percent in 2016.
                                              “The high percentage of outsourced manufacturing of tablets reflects the choice among tablet brands and original equipment manufacturers—even ones as big as Apple—to refrain from in-house production,” said Jeffrey Wu, senior analyst for OEM at IHS. “Tablet brands use outsourcing for many reasons, including faster time to market; the leveraging of capabilities, especially for firmware development and hardware integration; and asset flexibility that translates into reduced corporate expenditures and lower headcount.”
                                              Hon Hai Dominates Tablet Contract Manufacturing
                                              The biggest contract manufacturer of tablets is Apple partner Hon Hai, of Taiwan, also known as Foxconn. Hon Hai accounted for 62 percent of tablet shipments last year. The company’s position in the tablet space is unique—not only because it accounts for the majority of tablet shipments in 2011, but also because of its close relationship with Apple.
                                              Hon Hai is an EMS provider, a type of outsourced manufacturer that generally does not participate in designing product but simply offers manufacturing and supply chain management services. EMS providers for the most part control a smaller piece of the outsourced manufacturing space for computing products like notebook PCs—traditionally dominated by a rival group of makers known as original design manufacturers (ODM), which enjoy an advantage over EMS providers by being able to design products and offer manufacturing services alike. In the tablet production space, however, ODMs are the underdogs.
                                              This is because Hon Hai, with Apple as its main client, holds the coveted right to make the iPad, the industry’s best-selling tablet by a wide margin. The ODMs have then been left to scramble for what remains of the tablet market—making rival devices for the likes of Barnes & Noble, Amazon and Asus, none of whose product offerings matches the iPad’s soaring sales and unequalled clout.
                                              Android and Windows Power Rise of ODMs in Tablet Market
                                              With the emergence of Android—and soon, Windows-based tablets—ODMs will have a better chance of breaking Hon Hai’s near-impregnable hold on the market. If the Android and Windows tablets prove successful, ODMs could see their share of the tablet outsourcing market grow, expanding to as much as 53 percent by 2016, on the assumption that consumers will embrace iPad alternatives.
                                              Nonetheless, concerns for ODMs and Hon Hai alike could be in store.
                                              Currently sidelined in much of the dynamic tablet space, ODMs also have concerns about their prospects in future tablet production. Most ODMs make notebook PCs as well, and choosing to produce tablets for other clients could mean endangering their own stake in the PC market—much as tablets are now eating into the share traditionally enjoyed by notebook computers among consumers. However, strengthening their foothold in the tablet space is inevitable for ODMs, especially as tablets continue to gain momentum at the expense of notebook computers.
                                              ODMs also face potentially higher operating expenses and risks with the emergence of more tablet platform options—signified by the rise of Android and Windows—which would involve additional research and development costs in order for ODMs to maintain technical capabilities on those fronts.
                                              Hon Hai, the current champion among tablet producers, is likewise not entirely free of peril. Should Apple shift some of its tablet production to other contract manufacturers in an effort to diversify its contract manufacturing base, Hon Hai could suffer a blow.
                                              For other tablet brands like Samsung and Motorola that choose in-house production, their share of tablet manufacturing is not expected to exceed the 12.5 percent that the collective in-house space saw in 2011. Share of in-house production in the years ahead will stay in the 9 to 10 percent range, IHS  predicts, as ODMs and EMS providers battle fiercely among themselves for an increasing stake in the hotly contested tablet business.

                                              7. Possible further hardware advances
                                              sustaining this new trajectory.

                                              The current and already mature value proposition in brief is:

                                              the rhombus tech initiative, along with the EOMA-68 standard, has been designed to tackle the very problems that RockChip and other SoC vendors face. our strategy is very straightforward:

                                              a) invite SoC vendors to release EVBs in a standardised modular form which can go straight into mass-production, needing only a very simple 2 to 4 layer PCB for the main I/O of any matching product.

                                              b) standardise and therefore greatly simplify the software development. the advantage of having standard I/O boards (products into which the CPU Modules can fit) is that the software for those products will already have been written. porting a CPU Card to work in a range of existing hardware products is far, far simpler than forcing everyone to design complete products from scratch (including the software).

                                              the cost savings and time savings should be evident, and this is absolutely critical and will only become more so as the prices are driven down further by 28nm and beyond, as well as the product lifecycles becoming shorter and shorter.

                                              it’s quite complex to explain initially but very straightforward once it’s fully understood, and very exciting as well. would you be so kind as to mention to Mr Chen that we would love to work with him, especially to help introduce RockChip CPUs properly into the Free Software Community, which will result in considerable engineering cost saving for RockChip, apart from anything else? i am easy to find on the internet but here is my email address anyway: lkcl@lkcl.net

                                              Comment on 10/1/2012 by Luke Kenneth Casson Leighton, CTO at Rhombus Tech entered for China Fabless: Rockchip rattled by Android tablet wars [EE Times, Sept 25, 2012] 

                                              Latest information: A10 EOMA-68 CPU Card [luke.leighton | 24 Nov, 2012]

                                              hi folks, small update: wits-tech detected an ambiguity in how the usb
                                              interfaces work, which needed clarification from allwinner as well as
                                              a PCB layout alteration.  we'll have more details as-and-when they're
                                              available to us and as-and-when knowledge of the solution has been
                                              shared with is.  usual china "save face" thing is going on at the
                                              moment i.e. don't share details of the problem until a full solution
                                              has been found.
                                              
                                              what this translates into is at least another 2 weeks whilst the new
                                              PCB layout's done and the new sample PCBs are printed.  obviously
                                              that's an estimate, as it's beyond our control.

                                              Note: wits-tech = Shenzhen WITS Technology Co.,Ltd

                                              The original concept of a year ago:

                                              Embedded Open Modular Architecture/EOMA-68 [Embedded Linux Wiki, Sept 23, 2012]
                                              earlier: Embedded Open Modular Architecture/PCMCIA [Embedded Linux Wiki, Sept 5, 2011 – March 11, 2012]

                                              The Obligatory Tablet – a simple tablet motherboard which could potentially be developed as a very low cost single-sided 2-layer PCB. Components are chosen to reduce development cost and risk, as well as reduce manufacturing cost.

                                              Embedded Open Modular Architecture/EOMA-68/Tablet [Embedded Linux Wiki, Sept 21, 2011],
                                              note that what is excerpted below had not essentially been changed till Feb 12, 2012, the last date of change for this wiki page

                                              The Tablet Motherboard

                                              Popular by decree, but only successfully-sold when the price is stunningly low yet the feature-set rich, tablets are the “must-have” for all ODMs and OEMs who aspire to a chunk of the large apple pie. Key goals for this motherboard are therefore to be small, slim, low component count and based on a low-risk development strategy. Thanks also to the modular design, the board is sufficiently simple that it may even be possible to do as a single 2-layer PCB, thus reducing costs even further.

                                              Connectors and Components

                                              The connectors required are:

                                              • 1x USB2
                                              • PCMCIA Connector “inline” (signals conforming to EOMA/PCMCIA Standard)
                                              • 5V Power
                                              • 1x PCI Express “inline” (supporting USB Wifi, not PCI-e Wifi, such as RT2070 and RT8191)
                                              • 1x Stereo Speakers and Microphone
                                              • 1x RGB/TTL LCD Output (with LED Backlight)
                                              • 2x Battery Connectors

                                              Major components are:

                                              • An STM32F103RBT6 Embedded Controller (same as in the Micro Engineering Board)
                                              • A 4-port USB-2 High-speed Hub (e.g. FE11
                                              • 12.5Mhz XTAL (for the USB Hub)
                                              • Power Management ICs (Buck Converters for 3.8v Lithium to 5.0v; 3.3v LDOs)
                                              • Step-up DC-DC Converter for the LCD Backlight AP3029
                                              • An I2C EEPROM
                                              • An RT2070, RT8191 or Atheros ath9k USB-compliant MiniPCIe WIFI Module
                                              • An Antenna for the WIFI Module
                                              • A 7in LED-backlit LCD (e.g. AT070TN93)
                                              • A resistive or capacitive touchpanel (resistive: low-cost; capactive: expensive, often more expensive than the LCD)
                                              • A slim-line PCMCIA Ejector Assembly

                                              The estimated BOM is therefore around the $30 to 35 mark [Sept 21, 2011 !], excluding the EOMA/PCMCIA-compliant CPU Card, and including the batteries, case and WIFI module. The most expensive component is the LCD Panel, whilst the 2nd most expensive one is the batteries.

                                              Diagram of Tablet Motherboard Layout

                                              From this diagram, it can be seen that there is very little involved. Like the Odroid, it’s possible to have a product where the connectors and buttons define the size of the PCB more than the ICs and discrete components. In this case, many of the major connectors (such as USB-OTG, HDMI, Micro-SD and Headphones) will already be on the EOMA/PCMCIA-compliant CPU Card, leaving nothing left for the motherboard than to provide USB2 and Power connectors! An alternative revision is also shown which takes a USB 3G Modem, in PCI-e form-factor.

                                              image

                                              Diagram of Tablet Construction

                                              image

                                              Others:     Laptop                                               LCD Monitor (TV)

                                              File:A10 eoma pcmcia laptop.pngFile:EOMA Lcd tv motherboard.png

                                              Embedded Open Modular Architecture/EOMA-68 [Embedded Linux Wiki, Sept 23, 2012]
                                              earlier: Embedded Open Modular Architecture/PCMCIA [Embedded Linux Wiki, Sept 5, 2011 – March 11, 2012],
                                              note that the excerpts below are essentially as of Sept 21, 2011, image: Jan 16, 2012

                                              EOMA-68 Specification

                                              This page describes the specification of EOMA-68. The number of pins on the interface is 68; the physical form-factor is the legacy PCMCIA.

                                              Re-purposing of the PCMCIA interface and form-factor has been chosen to create portable Embedded Computing Modules (Computer on Module). Mass-volume “Lowest Common Denominator” interfaces have been chosen, all of which have existed for over a decade, but are low-power enough to be standard across virtually all mass-produced powerful Embedded CPUs.

                                              The interfaces are:

                                              • 24-pin RGB/TTL (for LCD Panels)
                                              • I2C
                                              • USB (Low Speed, Full Speed, optionally Hi Speed/480 Mbit/s and optionally USB3)
                                              • 10/100 Ethernet (optionally 1,000 ethernet)
                                              • SATA-II (optionally SATA-III)
                                              • 8 pins of General-purpose Digital I/O (GPIO).

                                              These interfaces are NOT OPTIONAL for CPU Cards. All CPU Cards MUST provide all interfaces. I/O Boards on the other hand are free to implement whichever interfaces are required for the device. For example: whilst all CPU Cards must have an SATA interface, devices such as tablets or laptops into which CPU Cards are plugged are not required to have an SATA hard drive.

                                              Future Versions

                                              … At the time of writing (2011), the interfaces in the 1.0 Specification are “Lowest Common Denominator” yet are still present across the majority of 2011’s powerful embedded SoCs (OMAP4440, Enyxos4210, Tegra 3, iMX53 etc.) However, in the future, the “Lowest Common Denominator” could well comprise MIPI instead of RGB/TTL, 2 lane PCI-express (or its successor), and USB-3 instead of USB-2 (perhaps even a faster version of ULPI).

                                              As of 2011 however, the total number of Embedded CPUs supporting all these newer interfaces and still keeping to a 1.5 watt budget is precisely zero. Support for these high-speed interfaces will therefore be re-evaluated in 2 to 3 years time, and a future version of this standard created when a large proportion of available embedded CPUs have these or other high-speed interfaces that are available at the time.

                                              The project had been initiated by a Crowd funding proposal [Rhombus Tech, Dec 25, 2011],

                                              note that Rhombus Tech website rhombus-tech.net started on Nov 18, 2011 as well as there was an earlier low-cost EOMA-PCMCIA CPU Card initiative (allwinner cortex a8) e-mail by Luke Kenneth Casson Leighton <lkcl@lkcl.net> on Dec 14, 2011
                                              To: opensuse-arm@opensuse.orglinaro-dev@lists.linaro.org, arm@lists.fedoraproject.orgmeego-community@meego.com,ubuntu-server-arm@lists.ubuntu.com,   maemo-developers@maemo.org, gentoo-embedded@lists.gentoo.orggeneral@lists.tizen.org,
                                              ARM <debian-arm@lists.debian.org>
                                              Cc: Linux on small ARM machines <arm-netbook@lists.phcomp.co.uk>

                                              Aim: Small (Free as in Speech) Linux device which can be upgraded

                                              In particular, a small CPU card which:-

                                              • Complies with GPL (Free as in Speech)
                                              • Powerful
                                              • Upgradeable
                                              • Cheap

                                              For example I can buy a tablet, after a few years the display, touch-screen and memory will be perfect. After a few years I may want to upgrade the CPU, or fix a software bug, or both – at the moment this is not possible.

                                              We are aiming for this CPU Card will have full GPL Source Code publicly available and will be suitable for many purposes including use as a Freedom Box, or as an embedded computer, or in the future to drive products such as Tablets, Laptops, IPTVs and Desktop PCs simply by plugging it in. These devices can then run a nice GNU/Linux distribution like Debian, Ubuntu or similar.

                                              Current Situation
                                              Not many tablets or small devices run a nice GNU/Linux distribution like Debian, Ubuntu or similar. They are either low powered, closed source, GPL violating or not cheap.
                                              The problem that if you want low-cost mass-produced hardware, you normally have to go with GPL-violating product. We then spend the majority of our time reverse-engineering before getting something useful. By the time we are done, the product is usually end-of-life: thus if it breaks, we are back to square one. If there is a security bug in the kernel supplied – again we are back to square one.
                                              The reason for the GPL violations is that the low-cost China-based Factories simply have zero software skill and a chain of about five business relationships between the seller and manufacturer. The manufacturer has got their money at this stage, so at this point we are asking the manufacturer for more effort in return for no extra income. Thus, we logically concluded that the only way to get non-GPL-violating product out there is to go directly to the factories and be the supplier of their software.
                                              Aim of this Funding Round
                                              To get funding, to deliver a stable CPU on a card:-
                                                • GPL: Full source code available.
                                                • Powerful: 1.5ghz
                                                • Upgradeable: A standard layout, which will allow the card to be ejected and replaced.
                                                • Cheap: Stable version at $30
                                                  Long Term Aim
                                                  High-volume production, then the costs will be $15. Yes $15 for GPL-Loving, powerful, packaged CPU Card.
                                                  So put this with :-
                                                    • 2000mAh battery $8,
                                                    • 7in 800×600 LCD $15,
                                                    • resistive touchpanel $5,
                                                    • main motherboard including WIFI module about $8,
                                                    • Case about $3

                                                      Total of $39. yes, really – $39. So basically, you can see that a mass-volume retail cost of about $80 for a 7in tablet with the Allwinner A10 and a resistive touchpanel would be quite reasonable. Running Debian, with a CPU upgrade only costing $15.

                                                      Progress So Far
                                                      Rhombus Tech has been established to serve Free Software Developers, entrepreneurs, enthusiasts and Engineers with access to affordable, modern and importantly GPL-compliant hardware. It is a Community interest company – designed for social enterprises that want to use their profits and assets for the public good.
                                                      Over the past two years we been contacting and vetting China-based factories, directly, to find at least one which is prepared to work with us. We found one.

                                                      We have also found an absolutely great CPU, called the Allwinner A10, which in mass-volume quantities is only about $7: that means that a PCB similar to the raspberrypi with similar features can be made for about $15 (not $25) and, because the Allwinner CPU is an ARM Cortex A8 not an ARM11 it is at least three times quicker than the raspberrypi’s CPU. (A 400-pin highly feature-rich 1.5ghz ARM Cortex A8 with a MALI400 GPU. )

                                                      We have full support of the Board of Directors of the Allwinner CPU: they released full source code to us in advance. We have made it available and found it to compile successfully.

                                                      We have selected a standard layout, which will fit within 55mm, which large number of pins can be removed by the user without damage. Which will be the cases are already available and which will have a trivial cost in low-volumes. A PCMCIA format.
                                                        • Complies with GPL – Yes
                                                        • Powerful – Yes
                                                        • Upgradeable – Yes
                                                        • Cheap – Not yet.
                                                          Next Steps
                                                          The primary reason for using a Community Interest Company for the sale of GPL-compliant products to Free Software Developers is that profits from sales will be re-invested directly into development of further products, with a primary focus of serving the Free Software Community yet at the same time leveraging mass-volume sales opportunities.
                                                          But this needs a kick-start. Then the end-product will get cheaper, then profits are re-invested and end-products get cheaper still. The snowball needs a little magic snow to get it started.
                                                          Magic Snow required: $13,500
                                                          To fund the three stages:-
                                                            • Unstable (Also know as Sid for all Debian lovers) : $3,500
                                                            • Testing Stage: $4,000
                                                            • Stable: $6,000
                                                            • Long Term Support: Self-funding
                                                              Unstable
                                                              5 CPU cards available at a cost of $3,500
                                                              A initial cost of $2000 per “board development change”. This is the non-recurring expense. This sets up the PCB tooling so further changes cost about $1500. The aim is to have a development board, tweak then have a second set of development boards.
                                                              This gives us the hardware only – about 5 development boards available. Time for the 15 Debian developers, already on board to start coding. (Bootloader, Kernel and main software).
                                                              Timeframe – AA months
                                                              Rhombus Tech to loan the boards to the developers, free as in beer, in return for help with coding.
                                                              Testing
                                                              100 CPU cards available at a total cost of $4,000 Timeframe – AA + BB months
                                                              We have a board, the bootloader work and the kernel is okay. No full Distribution images as yet. If you are a software developer and are basically happy to get involved doing u-boot, debian-installer, ubuntu images a board is suitable to play with at this point. Hard, but not impossible.
                                                              Rhombus Tech to loan half (50) CPU cards to developers, free as in beer, in return for help with coding. The other half of the board to be sent as premium rewards.
                                                              Stable
                                                              250 CPU cards available at a total cost of $6,000 Timeframe – AA + BB + CC months
                                                              Rhombus Tech to give 50 boards to developers, free as in beer who helped with coding. The remainder of CPU cards to be sent as rewards.
                                                              Long Term Support (Just for Ubuntu lovers)
                                                              Timeframe – AA + BB + CC + DD months CPU Cards at less than $30
                                                              The CPU cards can then be produced in mass-volume. Sold through Rhombus Tech, with profits used to seed further CPU upgrades.
                                                              Rewards
                                                              Total funds required for Unstable, Testing and Stable stages: $13,500
                                                                • Testing CPU Cards – $50 (Aiming for 50 = $2,500)
                                                                • Stable CPU Cards, with working OS image – $50 (Aiming for 50 = $2,500)
                                                                • Stable CPU Cards – $35 (Aiming for 200 = $7,000)
                                                                  Special Rewards
                                                                    • A Rhombus Tech Sticker sent world wide – $5 ($1.50 profit per sticker)
                                                                    • Mention in the source code – $5
                                                                    • A certificate mentioning your contribution to the Small (Free as in Speech) Linux device which can be upgraded. – $10
                                                                    • A testing CPU Card, with your choice of Debian Packages loaded by a Debian Developer – $250
                                                                    • You select the code name for the Unstable Board (legal, ethical names only) – $250
                                                                    • You select the code name for Testing CPU Card (legal, ethical names only) – $500
                                                                    • You select the code name for Stable CPU Card (legal, ethical names only) – $1,000

                                                                    Then more information came in the for of FAQ [Rhombus Tech, March 25, 2012]

                                                                    What’s the goal, again?
                                                                      • To create a synergy between the ultra-low-cost Factories and SoC vendors of China with their expertise in Hardware, and Software (Libre) Developers with their expertise in GNU/Linux and other OSes, with a view to leveraging the combination to create affordable and desirable mass-volume products that are GPL-compliant before they hit the Retail Hypermarket shelves;
                                                                      • For those products to be modular, versatile and open, so that they can be upgraded without the environmental waste of throwing away an entire device; for Retailers, Factories and users to be able to keep up with the rapid and increasing pace of technological development;
                                                                      • For anyone to be able to use the products for their original purpose as well as for Educational purposes, Research, Engineering and more.
                                                                        How will this goal be achieved?
                                                                        Very carefully, in small steps, having learned from the experiences of the OpenMoko and OpenPandora projects.
                                                                          1. Produce very simple EOMA-68-compliant CPU modules which can act as stand-alone computers in their own right (powered via USB-OTG) so that Software (Libre) Developers have something to start working on.
                                                                          2. Start designing IO boards.
                                                                          3. Software (Libre) Developers help develop the software to run on the products.
                                                                          4. Products go to market.
                                                                          5. Profit.
                                                                          6. Use profits to repeat the process, to the benefit of all parties, including the Software (Libre) Developers.
                                                                            And… a CIC? really? But those are for Social Clubs!
                                                                            The rules for CICs are “to not make a loss”, which makes sense for any business. There is no limit on the profitability of a CIC: it’s just that, at the end of each Financial Year, the profits have to be allocated to a charitable cause, or they have to have been ploughed back into the business. A Community Interest Company simply does makes more sense in the context of the goals of bringing Software (Libre) Developers together into this exciting technological area that has previously been dominated by vertical market sales strategies.
                                                                            Why is the price of the Allwinner A10 EOMA-68 Card $15?
                                                                            It damn well isn’t! We are getting a massive amount of misunderstandings about this. We have reported that based on estimates from the Reference Board supplied by the Manufacturer of the SoC that the MATERIALS COST is APPROACHING $15 in MASS VOLUME quantities of 100,000 units.
                                                                            That is excluding a case, power supply (which as the unit can be powered by USB-OTG is not needed), packaging, tax, customs duty, shipping and, most importantly, a profit margin.
                                                                            Any company has to make a profit, and a CIC is no different. Charities and Not-for-Profit Foundations can get away with not making a profit, but Rhombus Tech is not a Charity.
                                                                            Profits made will be used to fund Free Software Developers, as well as future CPU Cards and the creation of Reference Design Products: Laptops, Routers and so on, all of which will be done in an Open fashion.
                                                                            What is EOMA?
                                                                            It stands for “Embedded Open Modular Architecture”. The concept of modular architecture isn’t new: many companies have divided out CPUs into separate PCBs or modules, but it just hasn’t been done recently, not on a mass-volume scale and not on a user-controllable basis. See the elinux.org EOMA page for more information.
                                                                            Why re-use PCMCIA??
                                                                            It’s legacy – nobody makes PCMCIA cards any more: it’s all changed to the PCIe-based “PCI express” aka “ExpressCard” thing. However, it turns out that Satellite TV “Conditional Access Modules” are in PCMCIA form-factor, meaning that the connectors, housings and assemblies are all still mass-produced. So there’s less risk of having someone destroy their CPU card if they force-break the mechanical barriers (see specification for details) but the pricing on parts is still good in mass-volume quantities.
                                                                            What’s so special about the interfaces on EOMA-68?
                                                                            The interfaces that have been picked happen to have been around for at least a decade, and the number of pins, including 16 pins of GPIO and including enough GND pins to separate each of the high-speed signals, by a jammy coincidence comes to exactly 68 pins.
                                                                              • RGB/TTL: 28 pins
                                                                              • USB2: 2 pins
                                                                              • I2C: 2 pins
                                                                              • 10/100 Ethernet: 4 pins
                                                                              • SATA-II: 4 pins
                                                                              • GPIO: 16 pins
                                                                              • 5V Power: 2 pins @ 0.5A per pin
                                                                                The total comes to 58 pins, and there are 5 groups of GND pins to separate each group. Grand total: 68 pins. jammy or what? More information is available here.
                                                                                Whoa, wait, PCMCIA is 100ohms approximately!
                                                                                Yes, we know. It’s not all bad. By a coincidence, SATA-II is 100 ohms and USB-2 is 90 ohms. We think that’s close enough. Absolute absolute last resort: both SATA-II and USB-2 can be ramped down in speed. This would be a bugger, but at least product would work. Other than that: yes it is possible to adjust impedance through careful placement of tracks and ground planes etc.
                                                                                Bottom line: we’ll just have to pick the right PCMCIA connector supplier, that’s all.
                                                                                Why is the first CPU that RHT picked a China-based one?
                                                                                Cost and features – pure and simple. Consumers do not care about Software Freedom – they just don’t. Only Software (Libre) Developers care about Software Freedom. However, GPL Compliance is very very important to RHT, because we do not wish to be liable for GPL violations, and we do not wish our mass-volume Retail Hypermarket Clients to be liable for GPL Violations, either. So, RHT has spent the past two years negotiating with SoC vendors to find one that has the three critical factors of: 1) Cost 2) features 3) GPL Compliance. Amazingly, it was a China-based Fabless Semiconductor Company that first met the requirements. Yes we are looking for more.
                                                                                Which CPUs have you analysed so far, and why were they rejected?
                                                                                We have analysed dozens of CPUs. With the exception of the Allwinner A10, none of them really fulfil all of the criteria. This section turned out to be so large that it was moved to its own page: Evaluated CPUs.
                                                                                So what FSF Hardware-Endorseable options are there?
                                                                                  • The Ingenic MIPS jz4760 (700mhz) – $USD 7 in mass-volume
                                                                                  • The 600mhz ARM Cortex A8 OMAP 3503 ($19, 1k volumes)
                                                                                  • The 720mhz ARM Cortex A8 AM3357 – ($14, 1k volumes and $5 in 100k)
                                                                                    Sadly, none of these CPUs however fulfil the mass-volume criteria of being able to do 3D Graphics or 1080p video. Some of them can do 720p, but that is not enough for commercial mass-volume purposes: it really does have to be 1080p now. 4 years ago, 720p was acceptable: now it isn’t.
                                                                                    These CPUs are listed on the Evaluated CPUs page.
                                                                                    Is this an “Open Hardware” Project i.e. can I get the full schematics?
                                                                                    This is a misleading question: here’s some clarification. The EOMA-68 initiative is an “Open Specification. That means that anyone can create either CPU cards or motherboards that conform to it. Thus, it is possible for anyone to create an “Open Hardware” compliant CPU card or motherboard.
                                                                                    Rhombus Tech has chosen to work with a small, dynamic factory in China that loved the idea of the “we’ll do the software if you do the hardware” deal. It would be rather a different proposition for us to then ask them to release the full schematics.
                                                                                    Also in development is a 8mm-high (Type III) EOMA-68 CPU card with a AMD 64-bit x86 APU with Dual-core CPU, integrated Radeon 3D Graphics, with full Free Software support.
                                                                                    Bari also has an initiative to turn the Beaglebone or any other ARM SOC or AMD Fusion APU into an EOMA-68 CPU card, if enough people show interest in this happening. Given that the Beaglebone (and other systems like it such as the IMX53QSB, Origen, Pandaboard etc.) schematics are available under an Open Hardware License, the Beaglebone EOMA-68 CPU Card will be “Open Hardware”.
                                                                                    Additionally, given that the Leaflabs Maple is an “Open Hardware” Project, there exists the possibility for the creation of EOMA-68-compliant Motherboards based around the adaption of Leaflabs Maple Boards.
                                                                                    Summary of the above: it’ll happen. (update: 10jan12 – sooner than anticipated!schematics being developed here).

                                                                                    Rhombus-Tech/ allwinner a10/ news

                                                                                    24 Jul 2012: Casework for EOMA-68 CPU Card

                                                                                    Titoma Design is delighted to be involved with the EOMA-68 project and has a preliminary design for the first EOMA-68 CPU Card, using the Allwinner A10 SoC. Titoma Design specialises in casework and full product design, and will be more than happy to assist clients to develop products based around the time and cost saving benefits of the EOMA-68 upgradeable design strategy.

                                                                                    28 Jul 2012: GPIO and Expansion Headers for EOMA-68 CPU Card

                                                                                    A rework of the GPIO and Expansion Headers for the first Qimod EOMA-68 CPU Card has been carried out. Almost all interfaces available of the Allwinner A10 CPU have been made available on the 55x85mm Credit-card-sized CPU Card, including both Transport Streams, SIM Card, PATA, the 24-pin Camera Interface, both 24-pin LCD Interfaces, VGA, Composite Video (CVBS), SPDIF, AC97, I2S, GPS, CAN-Bus, Infrared, and many more. This is in addition to the standard EOMA-68 Interfaces of Ethernet, I2C, SATA, LCD 24-pin RGB/TTL, USB2 and 16 GPIO pins.

                                                                                    The rework involved adding an extra optional 45-pin FPC, which is in addition to the optional 44-pin FPC. The orders page has been updated to reflect the full pinouts, as well as the finalised selection for the 16 EOMA-68 GPIO pins.

                                                                                    The most current product information therefore is available on Preorders [Rhombus Tech, July 28, 2012, but preorders are listed from Dec 12, 2011 to Sept 23, 2012]

                                                                                    This is the preorders page for EOMA-68-compliant Allwinner Cortex A8 CPU modules. This product will have full GPL Source Code publicly available, and will be suitable for many purposes including Educational and R&D purposes, a USB-OTG-powered Thin Client, use as a Freedom Box, or as an embedded computer, or in the future to drive products such as Tablets, Laptops, IPTVs and Desktop PCs simply by plugging it in. Some options for hardware that is on the roadmap are described as example motherboards on the EOMA-68 page.

                                                                                    Features

                                                                                    The Allwinner EOMA-68-compliant module will have the following features:

                                                                                    • Approximately Credit-card size format (56mm x 90mm)
                                                                                    • An Allwinner A10, 1.2ghz ARM Cortex A8
                                                                                    • 1gb of RAM
                                                                                    • at least 1gb of NAND Flash (possibly up to 16gb)
                                                                                    • Operation as a stand-alone computer (USB-OTG powered)
                                                                                    • 2160p (double 1080p) Video playback
                                                                                    • MALI 400MP 3D Graphics, OpenGL ES 2.0 compliant.
                                                                                    • HDMI, Micro-SD, Headphones Socket,
                                                                                    • EOMA-68-compliant interfaces (RGB/TTL, I2C, USB2, SATA-II, 10/100 Eth)
                                                                                    • Expansion Header (similar to Beagleboard, IMX53QSB, Origen etc.)

                                                                                    These are the available interfaces on the 44-pin [Expansion Header’s interfaces] DIL:

                                                                                    • 2pins: 1x USB-2
                                                                                    • 8pins: 5-pin AC97 shared with 8-pin I2S Signals.
                                                                                    • 2pins: PWM0 (PB2)
                                                                                    • 4pins: TV-Out, VGA-Out
                                                                                    • 4pins: 4-wire Resistive Touchscreen
                                                                                    • 10pins: LVDS0 (multiplexed with LCD0)
                                                                                    • 10pins: LVDS1 (multiplexed with LCD0)
                                                                                    • 5V and 3.3V power

                                                                                    Due to multiplexing on the Allwinner A10, the following interfaces are also available on the PCMCIA connector via the 24-pin RGB/TTL pins (WARNING: non-EOMA-compliant).
                                                                                    • IDE (PATA)
                                                                                    • 24-bit Camera Sensor
                                                                                    • 20 External Interrupts
                                                                                    • 8×8 Keypad Interface
                                                                                    • 2 full UARTS with RX,TX,CTS,RTS
                                                                                    • CAN-bus
                                                                                    • 2 PS/2 interfaces
                                                                                    • SD/MMC 3.0 Ultra-High-Speed Class, UHC-I
                                                                                    Further multiplexing also allows the I2C interface to be switched over to two extra GPIO pins (WARNING: non-EOMA-compliant).
                                                                                    Also, the pins on the Micro SD/MMC interface can also be switched over to JTAG and a UART. With a special PCB with a Micro SD/MMC slot on the end it is possible to perform debugging of the device, live, without opening it up.
                                                                                    The Infrared Interface on the expansion header supports the following data formats:
                                                                                    • MIR FIR IrDA 1.1
                                                                                    • 0.576 Mbit/s 1.152 Mbit/s Medium Infrared (MIR)
                                                                                    • 4 Mbit/s FIR IrDA 1.4
                                                                                    • CIR
                                                                                    These are being considered:
                                                                                    • 2pins: 3.8v Battery Connection, on separate connector
                                                                                    • 3pins: Reset and Power, on separate connector
                                                                                    • 3pins: u-boot select, on separate connector
                                                                                    Pricing
                                                                                    Regarding pricing: the hardware NREs from the factory are $USD 2,000. Therefore, based on the number of committments so far (23 as of 2011Dec12), pricing looks set to be around $100. By the time the number of preorders reaches 30, that will be around $75 (30 reached as of 2011Dec17). (Update: as of 2012Mar01 the alpha units have reached 141 and it’s down to $41 per unit assuming NREs of $2,000 and component costs of $30. Please note: we do not yet know the unit cost! this is entirely preliminary!).
                                                                                    The mass-volume (100k units) cost will be somewhere around $15: the more committments received, the closer the price will get to that. One expression of interest has been received for 1,000 (stable) units: a pricing evaluation request is outstanding with the factory and will be reported as soon as it is received.
                                                                                    Please note: this cost excludes a case, power supply, packaging, shipping, tax, customs and import duty. and profit.
                                                                                    Software Freedom Information
                                                                                    Regarding Software Freedom: the caveat regarding this CPU is that it requires ARM-proprietary libraries for the 3D Graphics (as does virtually every single suitable consumer-grade embedded SoC on the planet with the almost exclusive sole exception of the Ingenic jz4760 and some of the TI ARM Cortex OMAP and Sitara SoCs). However, simply not using the proprietary MALI 3D GPU does not impact any other functionality in any way.
                                                                                    (update: MALI 400MP is being reverse-engineered)
                                                                                    Yet to be determined is how to program the proprietary 2160p MPEG decoder, but through a preliminary examination of the GPL Source Code it would appear that the drivers are publicly available. However, this CPU does have NEON, so can be used for Software Decode of Open CODECs.
                                                                                    Overall: if this module is not for you, an AM3357 module may be more suitable.

                                                                                    [committments so far:
                                                                                    – 23 as of Dec 12, 2011
                                                                                    – 30 as of Dec 17, 2011
                                                                                    – 141 alpha units as of Mar 01, 2012
                                                                                    large (=5 or more) number of units on preorder after Mar 01:
                                                                                    215= 43×5
                                                                                    762=9×10+1×15+1×18+3×20+1×30+1×49+2×50+4×100
                                                                                    3466=1000+1000+1000+466
                                                                                    75000=15000+50000+10000
                                                                                    so the whole project looks quite feasible from the point of view of achieving the $15 unit cost for which 100K units should be on order
                                                                                    ]

                                                                                    Rhombus-Tech/ allwinner a10/ news

                                                                                    6 Sep 2012: PCB design completed for EOMA-68 CPU Card

                                                                                    Many thanks to Wits Tech for completing the PCB design: the board layout and GERBER files are done. This brings the A10 EOMA-68 CPU Card one step closer to reality. The next stage is to get initial samples made up, the first script.fex created and a first boot completed.

                                                                                    [Wits Tech with products such as: MID and PCBA, e-book, smart MP4, 1080P high-definition MP4, 768P, 1080P harddisk player, IPTV, Google TV-BOX and so on]

                                                                                    Following on very very quickly from this, and driving a rather fast development schedule, is a commission from a client to convert an existing x86 laptop (1280×800) over to using the new A10 EOMA-68 CPU Card, and to provide 25 working prototypes for a Trade Show. Luckily, as the CPU Card is completely independent of the I/O Board, separate teams can focus on the development tasks.

                                                                                    Other news coverage:

                                                                                    Marketing Strategy [Rhombus Tech, May 1, 2012]

                                                                                    • TTM – Time to market lead
                                                                                    • Open versatile Common Platform
                                                                                    • EOMA One

                                                                                    Three ways EOMA helps to bring new products to market faster and save money

                                                                                    EOMA – From month to weeks TTM reduction
                                                                                    ODM
                                                                                    One platform, many Distros: Vanilla GNU/Linux, Android etc.
                                                                                    Software comes pre-flashed by default
                                                                                    One module, many applications
                                                                                    Instant upstream compatibility with Linux GIT tree
                                                                                    OEM
                                                                                    Need for software expertise is removed from OEM side
                                                                                    BOM reduction X 5
                                                                                    Access to bigger market platform
                                                                                    Readapting the design is as easy as changing one module
                                                                                    System Integrators
                                                                                    Quick access to many ODM designs
                                                                                    Plug and play
                                                                                    LOW TTM and high flexibility
                                                                                    Update process is made trivial and faster
                                                                                    Reasoning behind the Marketing Strategy
                                                                                    EOMA is platform for the whole industry that benefits the whole “food chain”.
                                                                                    Its good for ODM because they will have upstream support and they will be able to support their own clients better.
                                                                                    For OEMs the benefit is that they will no longer need to deal with software by themselves, it simplifies production and logistics, lowers production run times thus less cost of capital.
                                                                                    For integrators, the benefit is less obvious, but its also lower time to market, increased ability to reuse existing designs.
                                                                                    In general, the idea is that EOMA uses open source principles to increase efficiency across the industry. EOMA will be doing to computer hardware market the same thing what linux has done to server OS market.

                                                                                    Rhombus Tech Presentation [Rhombus Tech, March 12, 2012]

                                                                                    • what is the project.
                                                                                        EOMA is an initiative to separate the platform from the widget
                                                                                        EOMA module is System-On-Module that will come in standardized 68 pin package
                                                                                        It can utilize most of low cost SoC of your choice. At current stage, Allwinner A10 is the favoured chip.
                                                                                        The first EOMA-68 CPU Card is Cortex A8 based design
                                                                                        Module provides I2C, USB, Ethernet, SATA, 8 bit ttl rgb (display), and gpio on remaining pins
                                                                                        At current stage Rhombus plans to reinvest all profits into platform development and improvement
                                                                                        • what is the advantage and scenarios.
                                                                                            Rhombus facilitates upstream integration with linux and other major OSS projects.
                                                                                            OEMs receive standard platform that greatly reduces time-to-market.
                                                                                            OEMs no longer need to contract ODMs or have extensive software expertise to make a worthwhile product.
                                                                                            • what is the latest status of this project.
                                                                                                Rhombus is in process of getting pre-orders
                                                                                                lkcl [Luke Kenneth Casson Leighton] is working with manufacturers to start production

                                                                                              See also: Embedded Open Modular Architecture

                                                                                              This slideshow could not be started. Try refreshing the page or viewing it in another browser.


                                                                                              More background: British company looks to create cheap, open platforms [iTWire [Australia], Jan 10, 2012]

                                                                                              Luke LeightonA British community interest company, Rhombus Tech, is part of the way towards developing a micro-computer on a circuit board, much like the Raspberry Pi.
                                                                                              The man behind the effort, Luke Kenneth Casson Leighton, says his product will be much more powerful, having an ARM Cortex A8 CPU, which is 3x times faster than the 700mhz ARM11 used in the Raspberry Pi. The mass-volume cost target being aimed for is $US15 and it will be available for educational purposes as well as being a part of a retail product line.
                                                                                              Leighton (pictured above), who is a free software developer, is also attempting to bring together FOSS developers with Chinese hardware makers, so that each can use the other’s creation and benefit from doing so.
                                                                                              He has ambitious plans for Rhombus Tech to help build a number of devices, including a tablet, using the same method – harnessing the effort of free software developers and Chinese hardware manufacturers.
                                                                                              One thing he sees as a plus in the tablet effort is that it will create an Android system that conforms to the norms of the GPL and be easier for FOSS developers to deal with. At present, there is a plethora or tablets and many of the manufacturers, who are the vendors as well, are unaware of GPL requirements or else do not care.
                                                                                              “We are acting as the catalyst to invite other people to make such products by inviting them to participate, through the EOMA-PCMCIA initiative – simplified modular upgradeable hardware – and putting them in touch with Software (Libre) Developers,” Leighton says.  
                                                                                              “We’re not funding the products, we’re doing deals with factories and with SoC fabless semiconductor companies, offering them free access to free software developers, asking them in return that they not charge us for their hardware engineering time.”
                                                                                              Leighton says the efforts he is making are both altruistic and profit-oriented. “The fundamental principles behind Software (Libre) are more important to me than profit, but no profit gets you nowhere, so we’re setting out to do something rather unusual: merge both worlds.
                                                                                              “I’ve learned the lesson: you can’t make money from selling software (Libre) as a service in a world which has been Pavlov-trained to pay for boxed product and zero for the service. Patronage is dead – I’m the lead developer of – or have been the lead developer of – quite a number of free software projects, and the amount of money I’ve received through donations since 1996 is under $1000 in total. That’s under $65 per year, despite saving hundreds of thousands of businesses vast sums of money in proprietary software licence fees.
                                                                                              Instead, we’ve made the decision to profit from sales of hardware, with GPL-compliant software (Libre) pre-installed that actually does the job, masquerading as ‘yet another mass-volume product’ and beating the (GPL-violating) competition on price, convenience and usefulness.”
                                                                                              Leighton has been at this game for nearly eight years. “I started contacting companies to get the source code of Linux phones – the Shanghai-based E28 smartphone, for example – back in about 2004,” he says.
                                                                                              “It was a complete failure. I just had to let the GPL violations go. Instead I focused on reverse-engineering HTC’s smartphones. Then Android came along, some years later, and the situation has clearly got worse, not better.”
                                                                                              But there are some upsides to the plethora of Android devices out in the market. “At least the cost of hardware came tumbling down. However, because of Android and because of the endemic GPL violations surrounding Android, this fantastic hardware, which could potentially be used for so much more than it is, is basically stuck in dead-end roles such as ‘browsing uh few web pagiz’, ‘wotchin uh film’ and ‘playing a few gamez like angry burds’.”
                                                                                              Leighton has had some interesting early experiences trying to achieve his goal, learning through his own mistakes. “As the very first experimental ARM11 (non-x86) Linux-based (non-Android), laptop (non-tablet) hardware began to make its way out of China-based R&D companies, we reached out to them. The first was the Chitech CT-PC89E which turned out to be a complete nightmare, but an important learning curve.”
                                                                                              “Over the course of several months, and after 18 months of thinking about what the hell went wrong, empirical evidence tends to suggest that the development of the CT-PC89E was PRC Government-funded, and was supposed to be used for monitoring of PRC citizens, in a hardware-locked fashion, running an ARM-based PRC-Government-funded port of Red Flag Linux.”
                                                                                              Leighton says that he was “naively” intending to sell this ARM-based laptop in Europe and asked for versions of the laptop that would support European-based EDGE/3G modems. All that he was offered were China Telecom WCDMA modems that would only work in China.
                                                                                              Since source code could not be obtained, he took recourse to reverse-engineering. “We reverse-engineered the Linux kernel (discovering some very poorly-designed ‘security’ measures along the way), installed Debian on it, and an associate of ours took it along to their office and presented one of their machines running Debian/Lenny to them. They went extremely quiet.
                                                                                              “The poor girls at the Chitech factory in China, who have absolutely no software engineers but just ‘make hardware’, were so scared of what they learned, through us, that they pulled the product from their portfolio. We were the first – and last – people to ever order samples. That was over two years ago, now.”
                                                                                              Leighton was not put off, however, and persisted in trying to make headway. Next we decided that this was a ridiculous situation, and began a process of contacting more than 200 factories in China to find one that was willing to do a deal. Two years later, we found one. It actually took going over to China and having face-to-face meetings with over 30 companies even to find that one factory.”
                                                                                              His deal with the factory basically boils down to “we won’t charge you for software engineering if you won’t charge us for hardware engineering“.
                                                                                              “As these factories often have to pay large sums of cash upfront for BSPs (board support packages) and then have to also pay to have them customised so that the factory at least has ‘some’ unique selling point and they ‘still’ end up with a GPL-violating binary-only firmware blob, it’s a good deal for them,” he says.
                                                                                              The problems Leighton has faced make for interesting reading – though they were anything but interesting at the time when he encountered them.
                                                                                              “We’ve bought samples from factories, shipped some of them to potential clients, requested the GPL source code and been denied access to it, in direct violation of the GPL,” he says. “Often we were told that we had to place orders for 20,000 units in order to be given the source code; we told them absolutely not, why the hell would we place such a massive order for an untested product that didn’t do the job that the client needed? In the cases where product was shipped to potential clients prior to non-receipt of the GPL source code, this was incredibly embarrassing for us.”
                                                                                              What he has learned is that there is a long chain of people involved, with communication breakdowns and GPL violations in some cases beginning right at the start of the chain.

                                                                                              “The SoC (system on a chip) manufacturer provides a reference design including a BSP. The reference design is bought by original design manufacturers (ODMs), usually under NDA (which is the first GPL violation). The ODMs license their modifications to factories and give them binary-only distributions, a second GPL violation.

                                                                                              “The factories have absolutely no software engineers. They do not even know what source code is, let alone what an ‘Apache’ (licence) or a ‘GPL’ is. The factories sell product to importers; they in turn sell to wholesalers who sell to retailers and from there it is sold to end-users.”

                                                                                              Leighton says it is absolute hell to chase a GPL violation back through this chain, fighting ignorance and arrogance across international boundaries every step of the way. “After trying to be patient with this process, several times, we have concluded that it is a complete waste of time to pursue GPL violations just to do a deal, selling hardware product that is GPL-compliant: it’s too late by then.”

                                                                                              Instead, he has decided to do things a different way. “We are looking to work with the factories and with the SoC vendors, being involved right down the chain, keeping software (Libre) developers involved and informed along the way as well, such that the products, when they reach the shelves in Europe for example, are fully GPL-compliant before they even get there.
                                                                                              “That involves finding a SoC company, a factory and software (Libre) developers who will trust us, as well as finding a hypermarket retail store in Europe that will trust us!”
                                                                                              Despite all these issues, light is visible at the end of the tunnel. “We’re at a critical phase where we’ve managed to convince our first China-based factory of the value of a ‘we won’t charge you for software engineering time if you won’t charge us for hardware engineering time’ deal. The CPU that we’ve found is an ARM Cortex A8, it runs at up to 1.5ghz, it’s an absolute corker, and it’s only $7 in mass-volume. That means that a PCB that’s equivalent to the Raspberry Pi in size and features could be manufactured for a whopping 40 per cent less money – only around $15 instead of $25, and yet it would be at least 3 times faster than the Raspberry Pi (which uses only a 700mhz ARM11),” Leighton says.
                                                                                              We have the full support of the SoC fabless semiconductor company, Allwinner: they’ve given us full access to the GPL source code and the complete BSP; from a small-scale series of announcements (we’ve kept it to the debian-arm mailing list so far) we have more than 30 software (Libre) developers interested in buying first alphas of the ‘bare-bones’ EOMA-PCMCIA-compliant CPU card using Allwinner’s CPU card.”
                                                                                              While Rhombus Tech’s first product will be just a credit-card-sized PCMCIA CPU card that can run as a USB-OTG-powered computer, Leighton says that, provided there are sufficient advance orders, “for a 10-inch laptop, with Android, we’re looking at mass-volume pricing of around £90, retail, in the UK (and about £125 for a 12in one). For a 7-inch tablet (with the lower-quality but lower-priced resistive touch screen), we’re looking at around £50 retail.”
                                                                                              He says the only reason this is achievable is because there was no £250,000 to £500,000 up-front cost on development of the product – not on the cost of the hardware, and not on the cost of the software. The products will all be fully GPL-compliant.
                                                                                              “What’s even better is that when a new, or faster, or cheaper (or all three) CPU comes along, then rather than force people to throw away the entire device, we will be in a position to pay a factory to get a new EOMA-PCMCIA-compliant CPU card out in record time, and then just sell that through the same channels, as a user-installable ‘upgrade’ to their ‘existing’ laptop, tablet, desktop, internet TV, whatever it is that’s been designed to take EOMA-PCMCIA-compliant CPU cards at the time.
                                                                                              “With the embedded computing market moving so rapidly, we want to give both factories and users the opportunity to keep up-to-date without feeling guilty about land-fill. And, the GPL compliance and involvement of the free software community means that the devices will always be ‘unlocked’, and will serve both their original purpose as well as being a low-cost open educational and R&D platform.”
                                                                                              Rhombus Tech has just five people involved, all operating on a commissions-only basis. The relationships between the five go way back, with the company being set up just two years ago.
                                                                                              Luke Kenneth Casson Leighton, CTO at Rhombus Tech [LinkedIn]
                                                                                              Current: Rhombus Tech [since Nov 2011], Pyjamas, VizzEco Inc.
                                                                                              Previous: NC3A, iYonderBZflag
                                                                                              Education: Imperial College London

                                                                                              I’m a free software advocate, technology specialist and technology researcher.
                                                                                              My vocation is to seek out, understand, document and then explain all the archaic, esoteric and obscure technologies i come into contact with. So far, that has led me to network-reverse-engineering of Windows NT 4.0 Domains; reverse-engineering the High Tech Corporation’s Wince Mobiles in order to run Linux on them just for fun; Adopting Python as a core programming skill before it became fashionable; Writing an XML-based programming language before _that_ became fashionable.
                                                                                              The upshot of all this is that there really isn’t very much in Computing Technology that I would particularly find difficult – or if it _is_ difficult, I’ll be able to tell you why; and if I’ve not encountered a technology before, I’ll tell you so, up-front, and then go find out about it for you. So if you need advice on what technology can do for you, or if you need to know if something is possible, you only have to ask.
                                                                                              Also, I am able to advise on best working practices in Software Development, as I have done a significant amount of Software Engineering and Project Management in Free Software. Free Software leadership is a little different from traditional Project Management, in that the people you’re leading don’t actually have to listen to you! So if there is a delicate situation that needs handling, and your current approaches simply aren’t working and you still need to get results, you might want to consider asking for my help and advice.

                                                                                              Rhombus Tech preparing to launch a PCMCIA-sized computer module for tablets, notebooks, more [Liliputing, Sept 8, 2012]

                                                                                              Rhombus Tech is working on a project to develop a computer module that supports open source software and which can be used in a variety of devices.
                                                                                              The idea is that you’ll have a PC-on-a-board that works a bit like a Raspberry Pi or MK802 mini PC. But instead of using this as a standalone computer, you’ll be able to slot it into a wide range of devices including tablets and notebooks.
                                                                                              So instead of replacing your laptop when the CPU starts to feel outdated, you’ll be able to pull out the module containing the CPU and other vital components and slide in a newer model.
                                                                                              The first Rhombus Tech design is called the A10 EOMA-68, and it’s expected to be a PCMCIA card-sized PC module powered by an Allwinner A10 ARM Cortex-A8 processor.
                                                                                              That’s the same chip used in the Mela A1000, MK802, Mini X, and a number of other inexpensive Android tablets, TV boxes, and other devices.
                                                                                              In fact, members of the Rhombus Tech team were responsible for the first builds of Ubuntu Linux that were able to run on the Mele A1000… which led to a number of developers porting Ubuntu, Fedora, Puppy, and other Linux-based operating systems to run on Allwinner A10 devices such as the MK802.
                                                                                              Right now the A10 EOMA-68 is still in the planning stages, but Rhombus Tech announced that there’s now a PCB design in place, and the next step is to produce samples that can be used for testing and demonstration purposes.

                                                                                              Tom Cubie’s role in the initiative and elsewhere:

                                                                                              Tom Cubie’s Public Profile – Ushi

                                                                                              Tom Cubie cubieTech co-founder
                                                                                              China’s Mainland
                                                                                              Guangdong – Zhuhai >>>>>>>>>
                                                                                              Industry: Semi-conductor

                                                                                              Work Experience

                                                                                              嵌入式软件工程师 [Embedded software engineer]
                                                                                              珠海全志科技 [珠海Zhuhai全志科技Allwinner Technology] (100 ~ 499)

                                                                                              June 2011 – Present (1 year 3 months)
                                                                                              ARM Linux BSP 内核开发[Kernel development]

                                                                                              [Software] Design Engineer
                                                                                              Imagination Technologies Ltd.
                                                                                              August 2010 – June 2011 (10 months)

                                                                                              Education:
                                                                                              HUST [Huazhong University of Science and Technology]

                                                                                              CUBIETECH LIMITED or in more detail
                                                                                              方糖科技有限公司

                                                                                              Domicile: Hong Kong
                                                                                              Type: Private, ltd by shares
                                                                                              Formed: 29-Aug-2012
                                                                                              HK companies registry: 1793090

                                                                                              websites: 1. www.cubietech.com  2. http://cubieboard.org but the content is the same at the moment

                                                                                              Zhuhai [Wikipedia]

                                                                                              Zhūhǎi (Chinese: 珠海) is a prefecture-level city on the southern coast of Guangdong province in the People’s Republic of China. Located in the Pearl River Delta, Zhuhai borders Jiangmen to the northwest, Zhongshan to the north, and Macau to the south. Zhuhai was one of the original Special Economic Zones established in the 1980s. Zhuhai is also one of China’s premier tourist destinations, being called the Chinese Riviera.
                                                                                              Zhuhai became a city in 1979, a year before it was named as one of the first Special Economic Zones (SEZ). The neighboring city of Shenzhen became the first Special Economic Zones of the Special Economy Zone in 1978. The implementation of this policy is logical as Zhuhai is located on the strategic position facing Macau, in the identical fashion by which Shenzhen faces Hong Kong. This enabled the Chinese Central Government to open another “window” in front of Macau. Even though the city is situated at the southern end of the Pearl River Delta area, Zhuhai acts as one of the central cities in the Pearl River Delta according to the new general urban plan approved by the State Council. The implementation of Special Economy Zone means that the city will grow as a powerful modern port city, science and education city, scenic and tourism city, and as a regional hub for transportation.

                                                                                              Introducing the MK802 FreedomStick [FreedomBoxBlog, ]

                                                                                              Recently a whole range of cheap Android devices have become available, all powered by the Allwinner A10 SOC. Thanks to the way A10 devices boot they are very easy to hack. All that is needed is a bootable SD card. How to make such a card is no big secret, and there are now multiple SD card images available. You can boot for example Lubuntu or Debian instead of Android. One A10 device, the MK802 stick computer, is almost ideal for a small home server. I bought one to examine its potential for the FreedomBox.
                                                                                              What A10 devices are available?
                                                                                              The A10 is used in a whole range of products, from tablets to TV multi media boxes to stick computers. The most popular devices are:
                                                                                              The $70 Mele A1000. This is a complete computer. Some specs: 512 Mb RAM, SD slot, support for SATA Hard-disks, connectors for multiple types of monitor (VGA/HDMI/Analog video), 10/100 Ethernet connector, WIFI, Audio out and two USB host ports.
                                                                                              The $65 MK802. This is a stick sized computer (0.47 x 3.46 x 1.38 inch) that has (of course) less connectors than the Mele A1000. The specs are: 1024 MB RAM (older versions 512 MB), microSD slot, HDMI video out, WIFI, one USB host port and one USB-OTG port.
                                                                                              You will probably agree with me that the $70 Mele is a better deal – the MK802 is overpriced. It would not surprise me if the MK802 drops in price to about $40 in the near future.
                                                                                              Links.
                                                                                              Here are some links to start with if you are interested in A10 devices:
                                                                                              Much pioneering work on the A10 was done by Luke Kenneth Casson Leighton. Luke is the one behind Rhombus Tech. A Community Interest Company, which is developing an open hardware Computer-on-Module that uses the A10. Lots of info can be found at:
                                                                                              http://rhombus-tech.net/allwinner_a10/

                                                                                              A good place to buy an A10 device is “The Cubies hacker shop” at:
                                                                                              http://www.aliexpress.com/store/511685

                                                                                              from HERE: Tom Cubie Jul 15, 2012 +3 
                                                                                              Hi, i am Tom Cubie, i have a shop on aliexpress selling allwinner powered devices. I am also the developer who ported u-boot to A10 and contribute to the A10 kernel source code. Welcome to my shop: http://www.aliexpress.com/store/511685
                                                                                              Mele A1000 70$(A10, 512MB, 4G)
                                                                                              Mele A2000 75$(A10, 512MB, 4G)
                                                                                              Smallart uHost 70$(A10, 1GB, 4G)
                                                                                              [these are set-top boxes]

                                                                                              Tom Cubie (alias hipboi) is very actively involved in getting GNU/Linux working on the A10. Just like Luke he is planning to release open hardware based on the A10.
                                                                                              http://cubieboard.org/

                                                                                              Both the SD card images i used come from the miniand.com website. Miniand sells A10 devices and has a busy forum at:
                                                                                              https://www.miniand.com/forums/
                                                                                              MK802 images are available at:
                                                                                              https://www.miniand.com/forums/forums/development/topics/mk802-guides-and-images
                                                                                              Another company that sells the MK802 and other A10 devices is Rikomagic.
                                                                                              http://www.rikomagic.co.uk/
                                                                                              forum:
                                                                                              http://www.rikomagic.co.uk/forum/viewforum.php?f=2&sid=3c3ef83dd83af61f8af6a82c6b28cf47
                                                                                              Someone named gnexus has a very interesting site about A10 devices:
                                                                                              http://a10linux.org/
                                                                                              Last but not least – i enjoyed the info at Jeff Doozan’s site.
                                                                                              http://forum.doozan.com/list.php?6
                                                                                              Android-powered Cubieboard is already sold out [TG Daily, Sept 11, 2012]
                                                                                              We first covered [Sept 3, 2011 – bit the first public info was available from CNXSoft on Aug 31, 2012] the Android-powered Cubieboard – which is targeted at devs and modders – last week.
                                                                                              The uber-mini developer board is priced at a rather sweet $49, so one really can’t avoid drawing comparisons  between this little device and the wildly popular Raspberry Pi.
                                                                                              However, the little Cubieboard boasts a faster processor, more memory and integrated storage. The first Cubieboard prototypes were offered for $49 plus shipping (from China) on  AliExpress – but have already sold out. [e-mail address be given on a cubieboard page]
                                                                                              Here’s a quick rundown of the Cubieboard specs if you missed it the first time around last week. The device is powered by a a 1 GHz Allwinner A10 ARM Cortex-A8 processor paired with Mali 400 Graphics. Cubieboard also features 512 MB of RAM and 4 GB integrated flash storage. Unsurprisingly, a souped-up version of the board is reportedly in the works and will be loaded with a total of 1 GB of RAM.
                                                                                              The dev board is also equipped with an HDMI output, dual USB ports, an SD card slot for memory expansion, and other expansion pins and connectors for adding peripherals. Although the Cubieboard does sport an integrated Ethernet jack it lacks integrated Wi-Fi. As such, one of the available USB ports will have to be given up for a dongle – if wireless access is required. Soldering is a must if you want to use any of those header pins for additional accessories.
                                                                                              Originally, there was no indication that the bare-bones Cubieboard was equipped with 4 GB of flash storage,  a feature which will make the already attractive system even more appealing to devs and modders.
                                                                                              Cubieboard is capable of running Android (2.3 and 4.0), as well as multiple flavors of Linux.

                                                                                              There is a Cubieboard wiki page [Aug 4 – Sept 24, 2012] on linux-sunxi wiki from June 30, 2012. This wiki is:

                                                                                              dedicated to all software and documentation related to hacking sunxi based devices and to thedevices themselves and is maintained by the arm-netbook community.
                                                                                              sunxi represents the family of ARM SoCs made by Allwinner Tech. in Zhuhai (Guangdong, China). The most popular sunxi SoC model is the Allwinner A10 (aka sun4i) and the Allwinner A13 (aka sun5i). Their predecesor was an ARM9 named Boxchip F20 (sun3i) and their successor whose specs are currently unknown, will be the sun6i.
                                                                                              Main components of the A10 / A13:
                                                                                                The A13 is a cheaper version of the A10. It lacks HDMI and SATA and is primarily targeted towards tablets.[1]
                                                                                                Featured Community Hardware
                                                                                                EOMA68-A10

                                                                                                RhombusTech aims to create an Open Hardware EOMA68 compliant CoM with an Allwinner A10 CPU inside to be the user replaceable heart of different devices.
                                                                                                cubieboard

                                                                                                A mini (10x6cm), hacker friendly, extendable and very low-cost while powerful ARM board with A10.
                                                                                                Open Source Hardware
                                                                                                A13-OLinuXino

                                                                                                Open Hardware SBC with an Allwinner A13 CPU inside developed by Olimex with 512MB RAM, 4GB NAND Flash, VGA, Audio In/Out, WIFI, 3x USB Hosts, USB-OTG, LiPo, SD-card, 72 GPIOs, 6-16VDC power input

                                                                                                A10-OLinuXino

                                                                                                Open Hardware SBC with an Allwinner A10 CPU inside developed by Olimex with 1GB RAM, 4GB NAND Flash, VGA, HDMI, RS232, JTAG, SATA, 100MBit Ethernet, SD and micro-SD cards, 2x USB hosts, USB-OTG, LiPo, 132 GPIOs, 6-16VDC power input

                                                                                                CedarX wiki page [July 14 – Sept 16, 2012] on linux-sunxi wiki:

                                                                                                CedarX is Allwinner’s multimedia decoding technology. It is composed of several parts, including:
                                                                                                  1. A hardware video decoding unit
                                                                                                  2. Proprietary libraries to communicate with the hardware unit
                                                                                                  3. Glue code to use those libraries on an actual system with video playback capabilities (e.g. Android)
                                                                                                  Benefits
                                                                                                    • Efficient use of system resources when decoding multimedia.
                                                                                                    • Allows small ARM systems to playback high resolution/bitrate multimedia content, which wouldn’t be possible using software-only decoding.
                                                                                                        Disadvantages
                                                                                                          • The proprietary libraries have no clear usage license.
                                                                                                          • The android glue code is implemented as a “media player” (parallel to stagefright) instead of as OMX components.
                                                                                                          • This media player has limitations when it comes to playing back content pointed to by Android URIs and some web-based content.
                                                                                                          • There is no glue code for any other multimedia frameworks on GNU/Linux systems. The use of OMX would’ve rendered this a non-issue, with existing projects like GstOpenMAX.
                                                                                                              Integration
                                                                                                              Reverse Engineering
                                                                                                              On June 15 2012 Iain Bullard started reverse engineering the proprietary libraries.

                                                                                                              Allwinner A10 devices [XBMC Wiki for collaborative documentation of XBMC Media Center and related topics, May 19 – Sept 6, 2012]

                                                                                                              Set-top boxes

                                                                                                              Mele A1000/A2000
                                                                                                              Mele A2000.jpg
                                                                                                              Mele A1000 is the same hardware and specs as the Mele A2000. The case design is slightly different, and the A1000 only has 2GB of internal flash formatted, but still has 4GB of internal flash total (should be able to be reformatted to use full 4GB).
                                                                                                              The Mele units appear to have the most ports available of all the Allwinner A10 set-top/TV boxes, including SATA (normally accessible from a top “dock” for 2.5 HDDs, but can also be accessed from plugging an SATA cable to the main board inside.)
                                                                                                                Mele A100
                                                                                                                Same as the A1000/A2000, but lacks an SATA dock/connector.
                                                                                                                MK802
                                                                                                                MK802.jpg
                                                                                                                Some units have 512MB of RAM, while others have 1GB of RAM. Has a female mini HDMI port, but comes with a short miniHDMI to full sized HDMI cable. One USB B port, and one USB mini OTG port that can also act as a USB host port with included adapter, or be powered by the mini USB port. DC power connector. Internal wifi. MicroSD card slot.
                                                                                                                DX.com has a listing for a “AK802” that appears to be an identical unit to the 1GB RAM version.
                                                                                                                  Mini X
                                                                                                                  Pineriver H24.jpg
                                                                                                                  Might be called Mini X, H24, or even the Mini Xplus (for legal reasons, apparently). All three are the exact same hardware. Has HDMI and analog video (composite?), two USB ports, one microSD card slot, IR sensor (most should come with a remote), removable wifi antenna, DC power connector (5 volts). Can be powered by included DC adapter, USB to DC cable (not included) or a male-to-male USB cable on the USB OTG port. Similar to the MK802, some units have 512MB of RAM, while others have 1GB of RAM.
                                                                                                                    Smallart UHOST
                                                                                                                    Smallart UHOST.jpg
                                                                                                                    Comes with a motion activated remote. Male HDMI port is directly on device. Size: 120mm x 50mm x 13mm. 1GB RAM. Built-in wifi b/g/n. Has one USB host port, and another microUSB port that turns the device into a USB drive. This microUSB port also seems to provide power to the device. Micro SD card slot. Mic jack and what seems to be an on-board mic (?).
                                                                                                                    Also sold as “Oval Elephant” from Oval Elephant.

                                                                                                                      Other

                                                                                                                      Gooseberry Board
                                                                                                                      Gooseberry.jpg
                                                                                                                        HackBerry
                                                                                                                        Hackberry.jpg
                                                                                                                        1 GB RAM, 4GB internal flash, SDHC slot, 2 USB 2.0 ports, 10/100Mbit ethernet, wifi: 802.11 b/g/n, HDMI video out, composite video out, audio in minijack, audio out minijack, IR sensor.
                                                                                                                          Cubieboard
                                                                                                                          1G ARM cortex-A8 processor, NEON, VFPv3, 512KB L2 cache, Mali400, OpenGL ES GPU, 1GB DDR3 @480MHz, HDMI 1080p Output, 100M Ethernet, 4GB Nand Flash 2 USB Host, 1 MMC slot, 1 SATA, 1 ir, 96 extend pin including i2c, spi, lcd, sensors, ..

                                                                                                                          MeLE website: http://www.mele.cn/ (Chinese) or http://en.mele.cn/ (English)

                                                                                                                          Congratulation to Mele’s 8th Anniversary [Mele press release, Sept 4, 2012]

                                                                                                                          About Mele [Dec 20, 2012]:

                                                                                                                          Shenzhen Mele Digital Technology Ltd. is a global leader for design and manufacturing of internet High Definition (HD) multimedia terminals and a system solution provider for customers worldwide.
                                                                                                                          Shenzhen Mele has been leading the trend of introducing multimedia internet devices and applications into living rooms. Shenzhen Mele’s forward-looking market research, proven technological expertise and acumen, mature and efficient development process, ever-expanding manufacturing capacity and capability, rigorous quality assurance measures, enables Shenzhen Mele to win competitions by product innovation, feature differentiation, and time to market. Shenzhen Mele has a long history of successful track records of providing Original Product-planning Manufacturing (OPM) services and Original Design Manufacturing (ODM) services to our premium brand customers globally, and providing internet multimedia terminals with Shenzhen Mele’s own brand to our consumers in China.
                                                                                                                          Shenzhen Mele’s multimedia terminal products manifest the direction of digital evolution of future home. Shenzhen Mele’s products integrate internet applications, local area network (LAN) content browsing and sharing, data storage, data transport, HD multimedia playback and recording, HD digital TV playback and recording, multimedia home theater system, multimedia player and DVD combo, SoundBar multimedia player, camera and mobile phone etc. Shenzhen Mele’s system solutions include remote content distribution, device configuration and management, and product and feature customization for service providers, and remote data transport and content management service for end customers.
                                                                                                                          Shenzhen Mele is devoted to Complete Customer Satisfaction (CCS). We provide 7×24 around the clock services. We always solve customer issues by investigating root causes and addressing source of a problem. We strive for daily improvement and continuous progress in our course of pursuing perfectionism. Our corporate vision, our corporate social responsibility, and our down-to-the-earth working style of “starting from me” motivate our staff to work harder and smarter everyday. We sincerely believe that Innovations Enriches Quality Life.

                                                                                                                          8. The Nufront challenge coming from inside

                                                                                                                          Information about the latest tablet SoC contender Nufront, also posing the greatest challenge to Allwinner for the next year as it stands now (as of Nov 1, 2012):
                                                                                                                          Nufront Announces Taishan Platform Targeting Mobile Devices Market [Nufront press release, May 7, 2012]: “The NS115 mobile computing chip, a dual-core ARM Cortex™-A9 MPCore™ processor up to 1.5GHz and Mali™-400 MP GPU implementation, features 1080P HD encode/decode and support of Android 4.0.
                                                                                                                          NUFRONT NS115 dualcore chipset – ARM at Computex 2012 [ARMflixYouTube channel, June 14, 2012]
                                                                                                                          $81 Nufront NS115 ARM Cortex-A9 Dual-core 7″ 1024×600 IPS Tablet by Xusit [Charbax YouTube channel, Oct 28, 2012]
                                                                                                                          Nufront and ARM Extend Partnership to Provide OEMs with Competitive Solutions for Next-Generation Smartphones, Tablets and Smart-TVs [joint ARM and Nufront press release, Sept 24, 2012]: “Nufront licenses latest ARM Cortex-A15 Processor and Mali-T658 GPU technology to drive innovation and address consumer demand for advanced features
                                                                                                                          Nufront licenses cores from Ceva, Vivante [EE Times, Sept 8, 2011]
                                                                                                                          Interview with Nufront: “Windows RT will take away market share from notebooks” [ITProPortal, Oct 17, 2012]: “When do you expect Nufront to bring out (a) its first Cortex-A15/Mali Midgard products (b) products based on your Vivante/Ceva license? We are targeting the end of 2013.
                                                                                                                          Why is it that Nufront is not as popular as rivals such as AllWinner, VIA, Mediatek, Rockchip especially at the lower end of the market? We started from dual core system-on-chips, and dual core SoCs are going down to low end but not yet, it’s still single Cortex-A8 everywhere, while we believe the dual core A9 will go to the low end by the end of this year, and we will definitely be there, we are ready.”
                                                                                                                          ARM Technologies Power Nufront’s First Computer System Chip To Reshape Laptop Market [Nufront press release, Sept 14, 2010]: “NuSmart™ 2816 is the world’s first chip to integrate a 2GHz dual-core ARM Cortex-A9 processor, a multi-core 2D/3D graphics processor, 64bits DDR2/3-1066 memory controller, 1080p multi-format video engine, SATA2 controller, USB2, Ethernet, together with general I/O controllers. By leveraging the multi-layer hybrid interconnection technology, multi-level fine grain power management technology and advanced 40nm manufacture process, NuSmart™ 2816 is very energy efficient consuming less than 2 Watts when running at 1.6GHz.
                                                                                                                          Ubuntu Adds Sparkle to Nufront Laptops at CES [PCWorld, Jan 7, 2011]
                                                                                                                          – From ARM.com: POP™ IP > Cortex-A9: “Nufront was the first company to produce an SoC with the Osprey hard macro running at 2.0 GHz (typical conditions).” … Osprey: ARM Announces 2GHz Capable Cortex-A9 Dual Core Processor Implementation [ARM press release, Sept 16, 2009]: “The Cortex-A9 hard macros and the corresponding optimized physical IP used to develop the speed-optimized and power-optimized implementations are available for license today with delivery in the fourth quarter of 2009.” … Partnership in action > Nufront CSC: Vince Zhou, General Manager at NUFRONT CSC on their adoption of ARM’s Cortex-A9 processor and Mali multi-core graphics processor technology, and high-performance Physical IP “... For 2011, we have set a target that $250 laptops will be widely available in China and rest of the world, based on the NuSmart 2816. Together with our partners we have an opportunity to create low-cost laptops with low-energy chips that drive the new computing era.
                                                                                                                          ARM announces ‘Osprey’ A9 core as Atom-beater [EE Times, Sept 16, 2009]
                                                                                                                          Nufront released the second generation of NuSmart2816 series chip – NuSmart2816M [Nufront press release, Feb 13, 2012]
                                                                                                                          Nufront at Computex 2012 [Charbax YouTube channel, June 8, 2012] where both the 2nd gen NumSmart2816M and the 3d gen NS115 are shown, the latter introduced as a LP (Low Power) and improved architecture implementation with 40% less power consumption than the NS2816M, also targeted for the smartphone market (in the video also their baseband chip is shown to be shipped in 2-3 months) and to be shipped a month later. Towards the end they acknowledge that their big hope for the NS2816 and NS2816M didn’t become a reality, because the laptop market remained a niche one (I would add it was due to overwhelming success of Android in the tablet space vs. the envisaged by them Ubuntu on the laptops), so they are refocusing on the tablet market. They also acknowledge trying to work with Microsoft on the Windows RT opportunity (but Microsoft is NOT shown as a partner). It is also said that they have almost 700 people working for them. To the last question they say that they have been living so far on mobile TV systems for China only [not true considering that they lost the battle against CMMB in China as shown in the following]. Note from their website: “Our superior, patented T-MMB (Terrestrial- Mobile Multimedia Broadcasting) system” (see also the T-MMB Q&A), Enhanced Ultra-High Throughput (EUHT) SuperWlanUHT (Ultra-high Throughput Wireless LAN) and NUHT (Next UHT), and probably video search by “NuVideoTM supports hundreds of TV channels anywhere, anytime in any situation with real time catalog, automatic high-speed editing and processing.” as well.
                                                                                                                          – From Nufront’s own sponsored content on DIGITIMES [June 6, 2012]: “… Nufront was established in June 2004 with its first office located in Bejing, China. Through support from the government, Nufront began R&D of T-MMB systems. By 2006, Nufront’s T-MMB system had passed field tests conducted by the government. By November 2007, the firm had announced success in developing the first T-MMB chip called NF9001. In 2009, Nufront added two new branches, Beijing Pu Ji Xin Technology and Beijing Nufront Mobile Communication Technology. … The firm stated its goal is to become a comparable firm to Qualcomm and MediaTek. Nufront aims to create a unified platform that consists of both telecommunication and PC functions to meet the needs of various types of mobile smart products.
                                                                                                                          China Digital TV Transmitter Market Report, 2012 [Reportlinker.com press release, Oct 30, 2012]: “With respect to mobile devices, T-MMB was adopted as the national standard on April 3, 2008, but denied by the State Administration of Radio, Film and Television (SARFT) which has been actively promoting CMMB (China Mobile Multimedia Broadcasting) network construction. With investment in digital TV transmitter reaching approximately RMB600 million in 2010 and not less than RMB800 million in 2011, CMMB has become the major player with respect to signal coverage and user group.
                                                                                                                          2011 Mobile TV Development Report [Zhang Rui on Sina blog, Oct 15, 2012]: “.. by the end of 2011, CMMB network covered more than 336 prefecture-level cities, 885 economically developed county-level cities with signal coverage rate reaching 98.22%, covering a population of nearly 800 million, and as such CMMB has become the world’s largest mobile radio and TV coverage network. … as of the end of 2011, CMMB nationally more than 35 million users, paying subscribers reached 16 million. In 2011, through the widespread cooperation with China Mobile, they jointly promoted the development of 11.29 million bi-directional end users, creating a precedent for the conversion rate of mobile data services with a 73.3% conversion rate; with new users the one-way terminal user base increased in 2011 to 6 million. …” Note: CMMB… is based on the Satellite and Terrestrial Interactive Multiservice Infrastructure (STiMi), developed by TiMiTech, a company formed by the Chinese Academy of Broadcasting Science. Announced in October 2006, it has been described as being similar to Europe’s DVB-SH standard for digital video broadcast from both satellites and terrestrial repeaters to handheld devices. …
                                                                                                                          Mobile TV: at least three years to take to maturity, preliminary [coming in 20]08 [XINHUANET.COM, Aug 14, 2006]: “<nicely and broadly covering the STiMi story then TMMB as well: > … T-MMB standard was developed under the auspices of the Ministry of information industry, which is Korea DMB standard as the basis for in-depth research and development of a standard, part of independent intellectual property rights. It is a broadcast system, is also a one way system. T-MMB advantages: first, compatibility, compatible Korea T-DMB technology easier to implement roaming. …
                                                                                                                          – which is really shown by the below illustration from this Aug’11 Norvegian research paper:

                                                                                                                          – Then 3 years later came Tug of war [China Daily, April 14, 2008] between SARFT and MIIT: “The format (T-MMB) was not strictly tested or undergo necessary trials and the standardization was manipulated by a small group of people,” claims Wang Xiaojie, head of SARFT’s Science and Technology Department. “The result is not relevant to us and we will not adopt the standard.” which resulted in the current situation when still the old NF9001 is the only T-MMB chip and Nufront is not listed even as a mobile TV chip provider while some other providers are covering now several standards with a single chip. The current best example is DiBcom whose “Octopus2s [launched on Sept 5, 2012] … single die System-On-Chip … supports all the active digital TV formats available in the World such as ISDB-T one-seg, full-seg, and sb for Japan and South America; DVB-T for Europe, Africa, South East Asia and Columbia; DAB/DAB+ digital radio for Europe; T-DMB for Korea, CMMB and CTTB for China; ATSC and ATSC M/H for North America.
                                                                                                                          – Media report published on the Nufront website: Nufront: Technological innovation-oriented computing and communications develop simultaneously [April 27, 2012]: “… “In fact, as early as in 2005, began in-depth study of wireless LAN technology, developed a new generation of ultra-high-speed wireless LAN technology EUHT before the 802.11n standard in data throughput, spectrum efficiency and economy have done better than the existing WiFi technology, “said Yang Yuxin. Outdoor communications 3G/4G network in the room it will rely on the ultra-high-speed local area network. “The mentioned EUHT He is a new generation of communications technology specifically for the short-range wireless communication environment specifically optimized design can short distance (100 m coverage, expandable to 500 m) to support a large number of high-speed connection, and to ensure the business real-time requirements, the physical layer peak rates up to 3.86Gbps, about 90% of the efficiency of the system can be widely used in the Internet of Things, digital applications in the home, digital city, has obvious advantages compared with existing wireless LAN technology. …Note: MIIT in China announced on February 13, 2012 that it has approved the UHT/EUHT standard specification (click for Chinese announcement). The announcement reads that MIIT has finalized the previously discussed UHT and EUHT layer standards; the document for download is simply a table naming the two finalized standards. The actual text of the standards will be published by the Peoples’ Post and Telecoms Publishing House.

                                                                                                                          And the latest report about Nufront: China fabless: Nufront ventures beyond tablet chips [EE Times, Nov 6, 2012]

                                                                                                                          … Where Nufront differs from other up and comers, though, is that the company, founded in 2004, has already been around the block. Its eight years in the industry have cemented closer ties with the Chinese government agencies. With that comes government funding. Not everything has worked out in its favor, though, and the company has a few scars to show for it.
                                                                                                                          A case in point is China’s mobile TV standard. Nufront, in the mid-2000’s, dabbled with the nascent digital mobile TV market, throwing itself behind one of China’s home-grown mobile TV standards, Terrestrial-Mobile Multimedia Broadcasting (T-MMB). However, just before the Beijing Olympics, China’s State Administration of Radio, Film and Television (SARFT) ended up supporting — and institutionalizing — a rival standard, China Mobile Multimedia Broadcasting (CMMB).
                                                                                                                          Nufront is also known for its deep involvement in developing China’s national wireless technology, called Enhanced Ultra-High Throughput (EUHT) WLAN. With government funding, Nufront has been working on the national standard for more than several years. While the world is yet to see EUHT commercialized, Rock Yang, vice president of marketing at Nufront, stressed that the project is still on, and its ultra-high throughput wireless technology – 1.2Gbit per second throughput – will be deployed in China’s vertical market in 2013.
                                                                                                                          Nufront today has about 700 employees, with a team of 400 engineers. Two hundred are software engineers, while 150 are working on hardware systems, and 50 are specifically focused on chipsets, according to the company.
                                                                                                                          Nufront’s strategy doesn’t stop at the apps processor. The company is rolling out its first-generation GSM/WCDMA 3G baseband chip, TeLink 7619. Calling it a “dual-modem platform,” the new chip incorporates digital RF, power management and baseband, according to the company. How this will fare against other GSM/WCDMA baseband chips from competitors is unknown. But Nufront hopes to offer a “complete smartphone solution” in 2013, by adding its baseband chip to NS115.
                                                                                                                          Yang made it clear that Nufront, during the second quarter this year, acquired some essential IPRs on WCDMA. The Chinese company paid $9.0 million to InterDigital, a company with broad wireless patent portfolio. However, it remains unclear what exactly Nufront got. InterDigital only confirms the deal in vague terms: “We did enter into a set of agreements with Nufront, and those agreements included the transfer of a certain number of patents as well as other elements.” InterDigital’s spokesman added, “Our practice is not to offer any comment on the specifics of patent transfers with partners.”
                                                                                                                          Separately, in June, Intel cut a deal to buy about a host of wireless technology patents from InterDigital for $375 million.
                                                                                                                          The “Internet of Things” is also in Nufront’s sights. The company believes its 3G modules could be particularly useful in the vertical market for Internet of Things applications.

                                                                                                                          Can VIA Technologies save the mobile computing future of the x86 (x64) legacy platform?

                                                                                                                          UpdateThe Third x86-based SoC Player: VIA & Centaur’s Isaiah II [PC Perspective, July 11, 2014]

                                                                                                                          … VIA, through their Centaur Technology division, is expected to announce  [on Sept 1, 2014] their own x86-based SoC, too. Called Isaiah II, it is rumored to be a quad core, 64-bit processor with a maximum clock rate of 2.0 GHz. Its GPU is currently unknown. VIA sold their stake S3 Graphics to HTC back in 2011, who then became majority shareholder over the GPU company. That said, HTC and VIA are very close companies. The chairwoman of HTC is the founder of VIA Technologies. The current President and CEO of VIA, who has been in that position since 1992, is her husband. I expect that the GPU architecture will be provided by S3, or will somehow be based on their technology. I could be wrong. Both companies will obviously do what they think is best.

                                                                                                                          It would make sense, though, especially if it benefits HTC with cheap but effective SoCs for Android and “full” Windows (not Windows RT) devices.

                                                                                                                          Or this announcement could be larger than it would appear. Three years ago, VIA filed for a patent which described a processor that can read both x86 and ARM machine language and translate it into its own, internal microinstructions. The Centaur Isaiah II could reasonably be based on that technology. If so, this processor would be able to support either version of Android. Or, after Intel built up the Android x86 code base, maybe they shelved that initiative (or just got that patent for legal reasons). …

                                                                                                                          UpdateVIA Isaiah II Gives Intel and AMD Reasons to Worry with Low-power CPUs [techPowerUp, July 7, 2014]

                                                                                                                          Only the third active licencee of Intel’s x86 machine architecture, VIA Technology, is readying its first x86 processor in years, codenamed Isaiah II. This chip is based on a brand new 64-bit x86 core design by VIA and the engineering team it acquired from Centaur Technology, another erstwhile x86 licencee, and features modern instruction sets such as AVX 2.0. VIA began sampling a quad-core processor based on Isaiah II, which was put to live test by the company, at its InfoComm 2014 booth. It was compared to Intel’s “Bay Trail” Atom and AMD’s “Kabini” Athlon chips. It turns out that the Isaiah II is pretty good, if it comes out soon enough.

                                                                                                                          The Isaiah II based quad-core chip, featuring 2.00 GHz clock speeds, and 2 MB of L2 cache, was put through SANDRA. The BGA chip was running on a VIA-made motherboard, with its own VIA VX11H chipset. It was compared to AMD Athlon 5350 (quad-core “Jaguar” with 2.05 GHz clocks), and Intel Atom Z3770 (quad-core “Silvermont” with 2.40 GHz clocks). The results are tabulated below. At 2.00 GHz, armed with the latest multimedia and cryptography instruction-sets, VIA’s chip is faster than Intel’s in most tests, despite lower clocks. It trades blows – and wins – against AMD’s chip, in most tests. VIA is expected to launch the first chips based on Isaiah II in late-August, 2014. VIA is hedging its bets with efficient compact PCs, kiosks, and digital signage, with its new chip.

                                                                                                                          Update: VIA reportedly moving x86 CPU resources to new joint venture in China [DIGITIMES, Feb 19, 2014]

                                                                                                                          VIA Technologies is rumored to have started shifting its x86 CPU technologies and related personnel to its newly formed IC design joint venture with a China government-owned investment firm, according to market watchers, adding that VIA recently notified clients that it will stop supplying x86 processors temporarily. VIA declined to comment about market rumors and pointed out that its x86 CPU business is still operating. The joint venture was announced in early 2014 with VIA owning a 20% stake in the company. The market watchers pointed out that if the rumor is true, it would mean VIA’s x86 processor platform has officially walked into history, and the China government will be able to get hold x86 technologies to develop related products. VIA has been pushing its CPU products in China for many years, mainly targeting the white-box market. With the new move, VIA may no longer release processors under its name and will instead use the name of the joint venture in the future, the market watchers said. Because VIA’s x86 CPU business is licensed by Intel, moving related resources to a new joint venture is expected to attract Intel’s attention. However, the chip giant may not be able to do much because Intel reached an agreement with the US’s Fair Trade Commission (FTC) in 2010 to not interfere with competition in the CPU and chipset markets, and extend its licensing of PCI Express to VIA by at least another six years. Intel is also unlikely to wish to offend the China investment firm, which has support from the China government, the market watchers analyzed.

                                                                                                                          End of updates

                                                                                                                          After Urgent search for an Intel savior [this same blog, Nov 21, 2012] this [Can VIA Technologies save … x86 (x64) legacy platform?] is a quite legitimate and important question.

                                                                                                                          Watch Cher Wang, the founder and still the chairman of the VIA Technologies (also HTC), speaking about the enterpreneurship just February this year. One of the most important traits she considers important for the success is perseverance (as she is telling at [28:50] in the Q&A session starting at [22:37]). Looking at the current, moderate by any means success of VIA, one can clearly see this attribute of her which is helping to keep VIA still afloat. One cannot resist a suspicion that she sees great opportunity for the company to come out of its current troubles of decreasing revenue. She might quite well count on the expected failure of Intel to compete effectively in the mobile computing. As the x86 (rather the 64-bit x64) is still quite important for the transition of hundreds of millions of PCs into a full mobile computing era VIA Technologies x64 chips with their very competitive Isaiah cores, as much as 4 in a package and of sufficiently low-power and low-price might indeed become the kind of saviors of that legacy hardware platform for the year 2013 and beyond. Do not forget VIA Technologies is an extremely streamlined organisation which is using the same fabless semiconductor manufacturing model as all of the ARM ecosystem.

                                                                                                                          While Intel used the Bonnell microarchitecture for its Atom processors a significantly smaller competitor, VIA Technologies (Via Technologies Inc (2388.TW)) was relying on the processor design and development work of its 100 people subsidiary, Centaur Technology to compete with the giant, using its same time introduced Isaiah microarchitecture. Both microarchitectures were developed BTW for quite a long period of 5 years* and introduced in products in 2008. * The Bonnell story you could read in Intel’s Atom Architecture: The Journey Begins [AnandTech, April 2, 2008]

                                                                                                                          Note that Atom-powered Windows 8 tablets will use Intel’s new Clover Trail SoC, the follow-up from Medfield. Clover Trail is effectively a dual-core version of Medfield (using Saltwell core, while Saltwell contains a 32 nm shrink of the original Bonnell), but with a souped up GPU (a dual-core SGX 544MP2 rather than a single SGX 540). It’s still 32nm — but next year we’ll see the process-shrunk and rearchitected Silvermont-based [also the code-name of the new micro-architecture after Bonwell] Valleyview SoC, which technologically will be very exciting indeed. The “only” question mark is the price which I would think could not go below $50 as the latest (Q1’12 intro, with the same 32nm litography) traditional Atom model D2550, having price indication publicly available, has a published tray price (i.e. for 1K units) of $47. Intel’s whole business model is standing on those extraordinary high prices by today’s standards, and these will become unsustainable in the year 2013. Here comes VIA Technologies with its x64 foundation as described here.image (As it is a May 17, 2011 Investor Meeting slide we already know that the 22nm “Future Product” in the upper row is “Haswell”, and also that Silvermont will be incorporated into the same “Shark Bay” client platform as Haswell).

                                                                                                                          Let’s see first how VIA Technologies presented itself one and a half year ago in its VIA Embedded Intro Video [VIAMKT YouTube channel, June 9, 2011]

                                                                                                                          VIA Embedded round-up video of silicon platform products and solutions

                                                                                                                          Then as an update see Where is VIA? An interview with Christian Caldarone [Tom’s Hardware German Edition, Aug 30, 2012]

                                                                                                                          … My name is Christian Caldarone, born in 1972, and am currently in Germany as a company spokesperson for VIA Embedded. In addition, I am also responsible for the channel business [as Europe Business Account Manager]. TH: Our younger readers may know VIA only as a manufacturer of audio chips or Firewire controllers. So could you briefly introduce the company? CC: VIA was founded in 1987 in California. In 1992 the company moved its headquarters to Taipei, Taiwan. Towards the end of the 1990s it came to the acquisition of the processor manufacturer Cyrix / Centaur, and on the basis of purchased know-how we developed over the following years the C3 CPUs. In 2002 the VIA Embedded Platform Division was established. Since we are focusing increasingly on the embedded market [ VIA EPIA embedded platform, editor’s note]. In terms of the requirements of the future one has to primarily identify VIA for low power, high performance per watt, fanless and quiet design, and miniaturization. The synthesis of these factors from the manufacturer’s perspective can be found in the developed by VIA Mini-, Nano- and Pico-ITXdesigns. … <to be continued after the following short insert explaining these designs>


                                                                                                                          Embedded Boards [VIA Embedded microsite, Sept 5, 2012]

                                                                                                                          VIA Embedded Boards enable a new vision for the digital lifestyle, boasting low power consumption and rich integration on ultra compact form factors. Aimed at driving fast-emerging markets for smart connected devices, from stylish digital entertainment systems and feature-rich commercial embedded devices to mobile applications such as robotics and telematics, VIA embedded boards provide the ultimate platform for systems where size, low profile and power efficiency can be combined with a rich entertainment experience. VIA Embedded Boards EPIA Embedded Platform Innovative Architecture VIA EPIA® embedded boards are the embodiment of VIA’s feature rich and power efficient platform technologies. EPIA® boards come in a variety of flavors and form factors. A mix of low-power embedded processors, core logic, networking, connectivity and multimedia components make up the wide selection of available Mini-ITX, Nano-ITX, Pico-ITX and Pico-ITXe embedded boards.

                                                                                                                          Epan Wu discuss the past and future of the [10 years old] Mini-ITX Platform [VIAMKT YouTube channel, Dec 4, 2011]

                                                                                                                          Head of the VIA Embedded Platform Division Epan Wu discusses the past and future of the 10 years old Mini-ITX Platform

                                                                                                                          The Mini-ITX was recognized as an industry open standard for small footprint embedded systems. The Nano-ITX and Pico-ITX received the same popularity for even smaller dimension embedded designs.

                                                                                                                          2002: Mini-ITX VB Series for emerging segment markets 2002: Mini-ITX Desktop Series for a wide range of uses including home media centers, PCs, and file servers 2002: EPIA Mini-ITX Series a flexible, cost effective platform for an almost unlimited variety of applications
                                                                                                                          2004: EPIA Nano-ITX Series the ideal building block for a wide variety of applications requiring even smaller dimensions March 2009: Em-ITX Series with flexible and easy to extend functionality and I/O ports for a specific vertical application end of 2009: NOW END OF LIFE EPIA Mobile-ITX Series only 6 cm x 6 cm — enabling x86 processing power in handheld system designs*
                                                                                                                          2007: EPIA Pico-ITX Series to enable x86 architecture for embedded systems where it was previously impractical for space reasons. 2012: ARM-based VAB Series ready-to-use platforms based on Pico-ITX form factor which feature ultra low power consumption, easy system integration, rich I/O and flexible software capabilities

                                                                                                                          * The EPIA Mobile ITX form factor was the smallest existing COM (Computer-on-module) form factor in the world. The total height of the board-to-board connectors was only 3 mm. It was meant to be used in areas of implementation such as: military, medical, robotics, industrial automation, transportation segments, and handheld devices. VIA_ITX_mainboards_Form_Factor_Comparison1 VIA ITX Mainboards Form Factor Comparison 3000_3210_assy-1 A technical drawing of Em-ITX board and expansion module.

                                                                                                                          A video showing you how Em-ITX can be assembled in a fanless configuration, using a specially designed chassis.

                                                                                                                          now continue with Where is VIA? An interview with Christian Caldarone [Tom’s Hardware German Edition, Aug 30, 2012]

                                                                                                                          VIA currently employs about 2000 people worldwide. The majority of them work in the Embedded Division and in chipsets/CPUs. TH: For a while, VIA chipsets were considered as viable alternatives to offerings from AMD, Intel and Nvidia. Today the company is no longer represented in this segment away from its own platforms, and also happens rather insignificant when compared to the product cycles of the above competitors. Has VIA been getting nowhere? CC: No, VIA again and again presents innovations as well, such as the recently announced QuadCore processor. It runs at 1.2 GHz, supports 64-bit instruction sets, uses adaptive overclocking, and achieved a TDP of only 27.5 watts thanks to its low-power design. In addition, it is an out-of-order architecture. Unlike the products of some competitors there are four real cores, and systems stuck with QuadCore Processor + Vx11 can handle up to 16 GB of RAM. The Vx11 chipset also includes a DirectX 11-compatible GPU called VIA Chrome 645. TH: Is VIA currently working on new x86 CPUs? The Nano/Nano X2 is now at least 5 years old [NOT TRUE as only the 65nm-based Nano is 5 years old, while the 40nm-based Nano X2 was introduced only in Q1 2011, see later] and is manufactured in 40 nm, and also the QuadCore processor is really just a variation of this design – two Nano X2 on one die. [NOT TRUE as 4 cores on 2 dies with access to the same FSB (Front-Side Bus) are integrated together on a carrier package, see later] CC: Of course, there will be new, further developed and improved processors, which is consequential, but currently there is nothing to announce. Our current products can compete well in their segment. [Note: In the article Skirmishes on the desktop: Nettop platforms compared [Tom’s Hardware German Edition, March 29, 2012] VIA’s Nano X2 beat in fact very well Intel’s current at that time Atom D2700, and in several cases could clearly outpace it.] Our customers appreciate not only our portfolio but also the long product life cycle of five to seven years. Therefore, in order to maintain pin compatibility and to support the appropriate longevity of the platform, it is not possible, for example, to perform a simple die-shrink. It sounds so simple: “The structure size is refined.” But the fact is that a die-shrink would require much reworking of the platforms.

                                                                                                                          … <to be continued later on>


                                                                                                                          Now see an Introduction To Centaur [Patrick Roberts YouTube channel, July 30, 2012]

                                                                                                                          Introduction To Centaur Technology … 400 million transistors are in their current processor design …

                                                                                                                          with the very recent Processor Whispers: About Austin powers and patents [Andreas Stiller on “The H”, Nov 5, 2012]

                                                                                                                          Austin is not only the capital of Texas and home to Dell’s headquarters, but also a hub of processor development. After all, processors from Intel (Atom), AMD and Apple are designed here. But there is another company… It’s been all but forgotten that, next to the big ones mentioned, you will also find a smaller processor company in Austin, the third of the remaining threesome of x86 developers: Centaur Technologies Inc. For 13 years now, the company has belonged to the Taiwanese chip manufacturer VIA technologies. … the chief of the centaurs, Glenn Henry, was expecting me. … In spite of dramatically poor financial figures for VIA – with around $86 million, the numbers for the first three quarters of 2012 are 23 per cent below the ones from last year – the 70-year-old is optimistic: “We don’t cost much, so even a single per cent of the x86 cake is sufficient. Also, we have interesting new markets in China and increasingly in Brazil too.” For years, the number of employees at his company – just below 100 – has remained mostly constant. And, ultimately, VIA boss Wenchi Chen is one of the richest citizens of Taiwan, with sufficiently deep pockets. Currently, work is being done on the CN-R, a small quad-core processor designed for TSMC’s 28nm process. About a year ago, Centaur released a processor called VIA QuadCore, internally referred to as CN-Q, which is divided onto two chips, in a similar way as the Pentium D was. Each single chip is a VIA Nano X2 manufactured in 40nm that was well able to compete with other chips of its class, like the Atom D510 and the AMD E-350. It is compatible with the classic Eden boards and a quad-core solution for mini-ITX boards was released a few weeks ago, the VIA EPIA P910. Centaur still doesn’t have an integrated memory controller, for external communication they are still using the VIA V4 bus with 1333MHz, which is mostly identical to the bus of the Pentium 4. It serves as a link to the much bigger companion chip from VIA with north and south bridge. However, according to Henry, there are plans to integrate the chips into a SoC. But first, the CN-R is supposed to hit the market in the classic format with clock speeds between 1.2 and 2GHz around mid-2013. Which market that’s going to be, Henry doesn’t know yet: tablets seem likely, the netbook market is all but dead, but there’s still a niche market for small desktop PCs [“mini PCs”] and mini-servers as well as the embedded sector. A few highlights could make the chip stand out among the competition: AVX2 and an advanced PadLock unit with new cryptography operations– Atom and Bobcat/Jaguar don’t offer either. In contrast to Intel’s Haswell processor, however, CN-R will neither support fused multiply-add nor offer a transactional memory extension, as the effort would have been too expensive. Just a few hours before I had arrived, another economically motivated cut had been decided: instead of the initially planned central L3 cache with 4MB, Centaur chose to go down to 2MB in order to save space, costs and, above all, energy. Centaur has to work on the latter in particularto be able to compete with the big players in the business. …


                                                                                                                          And here is the continuation of Where is VIA? An interview with Christian Caldarone [Tom’s Hardware German Edition, Aug 30, 2012]

                                                                                                                          Chipsets are passé, embedded products are the future … Chipsets in the traditional sense, such as Northbridge, Southbridge, LPC, etc., are now almost extinct. … This development has to do with the current situation. All manufacturers are increasingly focused on the platform. The idea also makes sense: when everything comes from a single source, the individual components ideally suit each other – and demands are implemented as you wish. Eventually AMD has decided with the acquisition of ATI, to develop their own solutions and to focus only on AMD platforms. The goals of AMD and VIA were simply too different: for AMD it was important to keep up in performance, while VIA’s vision was more of energy efficient platforms. VIA currently has no concrete plans for the return to the chipset division. This is however not a complete rejection. A renewed commitment to the chipset segment is possible and also necessary if customer and partner needs are pronounced strongly enough. TH: You repeatedly called the Embedded Division as VIA’s primary area of operation. The term “embedded” is often equated with tablets, industrial PCs and control systems. What is VIA’s definition of “embedded”? CC:That’s right, the term “embedded” in fact can be interpreted very differently. An early definition is that the CPU is directly soldered and a GPU is integrated. TH: According to this definition, even AMD and Intel build  “embedded” systems with GPU and other integrated components. What sets VIA apart? CC:VIA has offered such designs earlier. The unique selling proposition was also lower energy consumption, allowing a higher performance per watt. Here comes the platform approach to the game again, and AMD and Intel are just gone in the direction that VIA had already taken. There are products of higher integratin in the future, so there is a change to the name and the approach. One hears again and again: “The desktop is dead.” If you look at the current trends, we can see that everywhere. The classic desktop is ousted, various other devices take over its role. Requirements such as Always on the Move, Cloud Computing and Desktop Virtualization are put forward, thus other devices are needed and also user behavior is changed. In the thin-client area VIA is traditionally represented strong. The reason for not so clearly connecting VIA with this segment is because this is not so strongly coming from the brand. The device (as a platform) must work. … TH: How VIA currently defined (and future) its market. Formerly the most visible products are gone – which wants to make money and grow? What is the strategy? Hurts the discontinuation of Windows / PC market (in the old scale)? CC: This is a regional issue: Europe is an important market, and we are committed to continue in the embedded space. Other countries and regions specially for us are less strong on the radar. Then there is again the BRICS region [Brazil, Russia, India, China, South Africa, note by the editor], where it first comes to ever affordable PCs, namely to provide classical desktops. One element of this is the recently introduced APC [ a mini-PC platform with a 800 MHz ARM CPU from VIA and Android 2.3 operating system, editor’s note ]. In addition to these ARM based devices, of course x86-based Mini-PCs for the desktop market continue to play a role in our strategy. Here our ARTiGO product series is to be specially mentioned. The VIA ARTiGOs are indeed classic Mini-PCs for the desktop market, but they also have some embedded features and are therefore also suitable for the semi-embedded sector. In addition to the combination of ARTiGO with Windows XP and Windows 7, we were also able to test the ARTiGO A1150 and A1200 successfully with Windows Server 2008. Besides the various Windows versions Ubuntu and SuSE are also officially supported by VIA. TH: Where VIA will surprise us in the future? The fields that are particularly prominent? Where does the company see its biggest opportunities?

                                                                                                                          Published on Sep 13, 2012 by VIAMKT. VIA Embedded was in attendance at the 2012 Digital Signage Workshop in Taipei, showcasing their range of complete package solutions for dynamic digital signage including the latest VIA Magic Box and 3D Holographic display.

                                                                                                                          CC: Our products will still be much smaller, we will consume even less electric power, and we will put even more features in an even smaller space. We see special opportunities in Digital Signage, Medical Computing and Thin Clients. Here, the thin client must be understood as a device with which to connect to the cloud. … Thin Clients with a VIA CPU offer here a special advantage for security because our own integrated PadLock Security Co-processor can take over the encryption of data. Hardware encryption is classified as 100 times more secure than pure software-based encryption, loading the CPU significantly less, and this saves even more power here. Downright secure on-the-fly encryption can be seen as an essential component of cloud computing, and thus corresponds to the requirement of the customers. … … TH: Tablets are a growing market. Will VIA in this segment offer a suitable (processor) solution? Does VIA has an ARM license? If not, would an x86 design for Win8 tablets be possible? … In China, many manufacturers are already using [ARM] solutions from VIA. Exactly these markets are targeted by our subsidiary Wonder Media with the WonderMedia PRIZM SoC [an ARM-compatible, integrated processor, editor’s note]. … There are other products – medical devices or instruments based on ARM designs. What they need is often enough to have a well-adjusted SoC. It is not always clear that there is a VIA-solution. As with the display and other components it is subject to special requirements (moisture, shock, heat, etc.). These customers also appreciate the long product life cycles. In the consumer sector, it is the opposite, since latest features require short product life cycles. We will definitely have platforms for Windows 8 in the portfolio, for whatever kind of application. So you see, VIA Technologies could theoretically have both an ARM-based Win8 tablet and one driven on the x86-base. … TH: How VIA stands for low-power servers? After all, AMD has just bought SeaMicro, and HP and other companies are now using ARM chips in servers. CC: This segment is one of the more interesting for VIA, and we expect a good chance. An ARM-based solution here would be particularly attractive and allow the clients to realize an effective and efficient platform. Linux versions and also Android run now everywhere, providing nothing in the way of the usage itself. An ARM-based server solution is limited by the performance and in scope – so to say, the usage is very specific to the application. Therefore x86 is also important for the foreseeable future. And also with our x86 CPUs we see good opportunities. There are efforts to use them as power-saving CPUs in all data centers of the world. We have even more advantages with our quad processor alongside the low power consumption: CPU virtualization, the just mentioned security co-processor, and a large L2 cache by which it can compete quite well in performance with server processors of the competitors. In terms of cache throughput in so-called heavy-lifting tasks, such as database applications, for example, there is only seven percent difference to the Xeon 5110. I had already mentioned another benefit as well: the VX11 chipset and the QuadCore processor can manage up to 16 GB memory. With Intel’s Atom CPUs it is 4 GB. Virtualization is a really exciting skill – not least for the administration. It is possible, for example, to measure the average power consumption per virtual machine and to measure the system accordingly. As the first choice it is advisable to use our platform together with the KVM [Kernel-based Virtual Machine] hypervisor since it is also officially supported by VIA. KVM is a very serious virtualization solution that for some time now is tightly integrated into the Linux kernel. The decision of the major Linux distributions Ubuntu and SuSE, to use KVM as their preferred hypervisor, has once again to be underlined. Another advantage arises also through the availability and development of the appropriate administrative and conversion tools, extensive cloud/IaaS and orchestrator solutions (see http://www.linux-kvm.org/page/Management_Tools), which have also helped to pave the way in professional, commercial use of KVM. The combination of the VIA QuadCore and the KVM hypervisor currently has the best virtualization per watt ratio in the x86 market. Extrapolating 8 virtual machines per VIA QuadCore (27.5 watts TDP), the average per VM incurred is only 3.44 Watt, while for 10 VMs it takes only 2.75 watt. The long product life cycle of the VIA platform also enables a consistently homogeneous landscape, in which, for example, only a single hypervisor OS image is required, which can then be loaded from a central point to any number of platforms. But not everything can be virtualized. A good example are services such as VoIP. So one needs additionally a small server that will work then in the most cost efficient and energy saving way. And in this context, a long product life cycle and high reliability are important. Especially for the latter making electromechanical parts unnecessary is useful as well. An unnecessary fan for VIA Eden just could not fail.


                                                                                                                          Now look at

                                                                                                                          the current business situation of the VIA Technologies:

                                                                                                                          Intel’s market share was 83.3 percent in the third quarter [of 2012], growing from 80.6 percent in the same quarter the previous quarter. AMD’s market share was 16.1 percent, falling from 18.8 percent. VIA Technologies, which largely makes chips for low-cost PCs, had a 0.6 percent market share. [Mercury Research via IDG News Service]

                                                                                                                          For the full year 2011, Intel earned 80.1% overall worldwide unit market share, a loss of 0.6% compared to 2010. In 2011, AMD earned 19.7%, a gain of 0.7% compared to 2010. VIA Technologies earned 0.2%, a loss of 0.1%. [IDC]

                                                                                                                          In the full year 2010, Intel earned 80.7% unit market share, a gain of 1.1%, AMD earned 19.0%, a loss of 1.1%, and VIA Technologies earned 0.3%. [IDC]

                                                                                                                          VIA Announces October Sales Results [VIA Technologies press release, Nov 2, 2012]

                                                                                                                          Table 1: VIA October Sales Revenue In thousands of US dollars

                                                                                                                          Net Sales 2012 2011 Y-on-Y Change (%)
                                                                                                                          October 8,816 9,112 -3.25%
                                                                                                                          January through October 97,455 124,510 -21.73%

                                                                                                                          The company is selling a lot of products to the embedded market, also as boards (see: Nano based, Nano X2 based, Eden X2 based, and Quadcore E based), as well as some of its products are appearing in 3d party end-user products sold in volume globally. Below we could see some volume offerings in the end-user category which came to the market in the last 12 months. Examples of the 3d party thin client/mini PC products: Based on Nano and VX900 chipset (MSP): – Devon IT Launches Dual DVI VIA-Based TC5V Thin Client [Jan 18, 2012] where Devon IT is a U.S. based company with offices in London, Shanghai and Bangalore, selling globally. The TC5VX comes with Windows Embedded Standard 7 and the Devon IT Thin Client – TC5VX – 2 GB RAM – 1.3 GHz – 0 GB HDD is currently sold in 7 stores for $438 and up; while the TC5VL with DeTOS 7 (a Linux based thin client operating system developed by Devon IT and including RDP 7.1 and offering Microsoft RemoteFX functionality for Windows Server 2008 R2) and the Devon IT Thin Client – TC5VL – 1 GB RAM – 1.3 GHz – 0 GB HDD is currently sold in 13 stores for $281 and up. Based on Nano X2 and VX900H chipset (MSP): – ZOTAC Launches Affordable Palm-Sized ZBOX nano VD01 Series mini-PCs [Oct 6, 2011] where ZOTAC is a Macau based manufacturer of graphics cards, mini-ITX motherboards and mini-PCs sold in all continents around the globe, and with over 6,000 workers and a combined 100,000 square-meters of factory space. ZOTAC ZBOX nano – VD01 PLUS – 2 GB RAM – 1.2 GHz – 320 GB HDD with Windows 7 is currently sold in 79 stores for $230 and up or you can buy ZOTAC ZBOX nano – VD01 – 0 MB RAM – 1.2 GHz – 0 GB HDD with Windows 7 selling for $160 and up from 28 stores. Based on Eden X2: – HP Introduces Thin Clients with Unprecedented Security, Exceptional Flexibility and Performance [Feb 13, 2012]: “… the powerful new HP t610 Flexible Series Thin Client and HP t510 Thin ClientThe HP t610 features a dual-core AMD G-series processor with integrated discrete-class AMD Radeon graphics … at 1.65 GHz … The HP t510 also features the VIA Eden X2 U4200 1GHz dual-core CPU”. The HP Flexible Thin Client – T510 – 2 GB RAM – 1 GHz – 0 GB HDD is currently sold in 70 stores for $217 and up or you can the same HP Flexible Thin Client – T510 – 2 GB RAM – 1 GHz – 0 GB HDD for $195 and up from 55 stores. The HP t510 Thin client is pre-configured with one of the following: – Genuine Windows® Embedded Standard 7 – Genuine Windows® Embedded Standard 2009 – HP ThinPro – HP Smart Zero Client Service Example of a 3d party POS terminal: Based on Nano: – Product Launch Notice-KS-6715 series [Dec 7, 2011] from the Taiwanese Posiflex Technology focusing on POS Terminals and peripherals with 350 employees and selling globally through subsidiaries in China, Malaysia, India, Germany, USA and Argentina. The Posiflex Fan-Free – KS6715 – 2 GB RAM – 1.6 GHz – 160 GB HDD (a touch based POS terminal) with Windows Embedded POSReady7 is currently sold in 12 stores for $781 and up. Windows 8: only driver support is available as follows

                                                                                                                          VIA has released Windows 8 drivers for the VX11 Media System Processor, available through the driver portal. The VX900 drivers for Windows 7 do also support Windows 8 and VIA is working with Microsoft to have them re-classified as Windows 8 drivers. Until then, the VX900 drivers for Windows 7 can be used as a solution for Windows 8, available through the driver portal. Older VIA chipsets (than the VX900 and VX11) can run Windows 8 using the default drivers built into Windows 8, but some graphical features of Windows 8 may not be supported and it is not recommended.

                                                                                                                          (+ drivers for Windows 8 for the VIA HD audio chips)


                                                                                                                          Now it is time to have

                                                                                                                          a deep insight into the latest technology advances

                                                                                                                          made by VIA Technologies:

                                                                                                                          VIA EPIA-P910 Pico-ITX Motherboard with a cassette tape for comparison

                                                                                                                          VIA EPIA-P910 Pico-ITX Motherboard with a cassette tape for comparison

                                                                                                                          VIA_EPIA P910 45 with logo L_original_VIA EPIA-P910 Pico-ITX board (measuring 10 cm x 7.2 cm) combining a 1.0GHz VIA QuadCore E-Series processor (the 2 chips on the “smaller brown” carrier on the right) and the latest VIA VX11H MSP (single chip on the “big brown carrier” on the left) for superior performance and outstanding display capabilities.

                                                                                                                          VIA EPIA-P910 board essential block diagramm from the datasheet

                                                                                                                          The essential block diagram of the VIA EPIA-P910 board from the datasheet

                                                                                                                          VIA Announces First QuadCore Pico-ITX Board with 3D Display Capabilities [VIA Technologies press release, Sept 6, 2012]

                                                                                                                          VIA EPIA-P910 features new VIA VX11H media system processor with DX11 support for immersive display environments Taipei, Taiwan, 6th September, 2012 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA EPIA-P910 Pico-ITX board, the first VIA board to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-Series processor. Providing superior performance and outstanding display capabilities, the VIA EPIA-P910 Pico-ITX provides the ideal platform for a wide array of next-generation ultra compact devices for applications in health-care, logistics, fleet management and other vertical market segments. The VIA EPIA-P910 Pico-ITX is the first VIA board to include the VIA VX11H MSP which provides the latest in graphic capabilities, including DirectX 11 support, for richer textures as well as 3D stereoscopic display. In combination with a 1.0GHz VIA QuadCore E-Series processor, the VIA EPIA-P910 offers high performance computing in an ultra compact, low power design with today’s latest connectivity options including HDMI and USB 3.0. “The VIA EPIA-P910 features the most advanced technology from VIA with the latest VIA VX11H MSP and VIA QuadCore E-Series processor,” said Epan Wu Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “It provides superior computing performance and the richest display capabilities allowing embedded system designers to innovate for immersive embedded environments.” About VIA EPIA-P910 Pico-ITX Based on the incredibly compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA EPIA-P910 Pico-ITX combines a 1.0GHz VIA QuadCore E-Series processor and the latest VIA VX11H MSP to offer superior computing performance for ultra compact systems. The VIA EPIA-P910 Pico-ITX supports up 8GB of 1333MHz DDR3 memory, HD audio, HDMI, VGA and LVDS display connectivity as well as a high performance hardware HD video decoder in the shape of the latest VIA Chromotion 5.0 video processor. On board pin headers and an extension board to board connector provide support for an additional 6 USB 2.0 ports, an LPC connector, SMBus connector, PS/2 support, audio jacks, LVDS, 4 pairs of DIO and two UART ports. Rear I/O includes one HDMI port, one VGA port, 2 USB 3.0 ports and 1 GigaLAN port. For more information about the VIA EPIA-P910 please visit: http://www.viaembedded.com/en/products/boards/1950/1/EPIA-P910.html For more information about the VIA VX11H MSP, please visit: http://www.viaembedded.com/en/products/processors/1951/1/VX11_(Single-Chip).html

                                                                                                                          VIA EPIA-P910 Pico-ITX Motherboard in a hand VIA EPIA-P910 Pico-ITX Motherboard VIA_vx11_and_vx11H_blkdiagram_original_ VIA VX11 (and VX11H) Media System Processor (MSP) [“chipset” on a single chip] block diagram

                                                                                                                          VIA VX11 Media System Processor: Breathing Life into 3D and High Definition Video Playback [VIA Chipsets, Sept 5, 2012]

                                                                                                                          The VIA VX11 media system processor (MSP) family is designed for next generation desktop, small form factor and all-in-one PCs, offering a world-class HD multimedia platform for media-intensive applications. The VIA VX11 features the VIA Chrome 640\645, a genuine DirectX11 graphics processor that offers richer visual and 3D contentsfor immersive environments. The VIA VX11 DX11GPU is designed to leverage the power of parallel processing and provides support for sophisticated shading and texturing techniques such as tessellation for smoother 3D animation and more lifelike graphics. Including Shader 5.0 to integrate cohesive post graphic processing, DirectCompute 11 for scalable GPGPU computing, as well as better multithreading and control for parallel computing, the VIA VX11 MSP provides enhanced graphic capabilities for today’s media intensive applications and has been designed to support OpenCL™. The VIA VX11 MSP has received SuperSpeed USB certification from USB-IF and supports up to 3 USB 3.0 ports for data transfer speeds up to ten times faster than USB 2.0 with optimized power efficiency. The VIA VX11 MSP features the high-performance and versatile VIA Chromotion 5.0 video processor, providing ultra smooth decoding of MPEG-4, H.264, MPEG-2, and VC-1. It offers advanced filtering and cutting edge post-processing. Support for the latest connectivity standards includes Display Port, HDMI, DVP, VGA and LVDS. The VIA VX11 MSP supports up to 16GB of the latest DDR3 system memory at speeds of up to 1600MHz and is compatible with the VIA QuadCore, VIA Nano™, and VIA Eden™ processor families. Integrating all the features of a traditional North and South bridge solution into a 33mm x 33mm single chip package and leveraging the 40nm advanced manufacturing process, the VIA VX11 is a single chip solution that reduces overall silicon footprint and lowers system power consumption. VIA VX11 Media System Processor: Key Features

                                                                                                                          • High Performance Hardware HD Video Decoder:Smooth hardware acceleration for MPEG-4, H.264, MPEG-2, and VC-1 for advanced browser streamed video technologies
                                                                                                                          • Advanced Display Connectivity:Supports the latest display standards including DisplayPort, HDMI, DVI and VGA in multi-display configurations
                                                                                                                          • DX11 Graphics Performance:TheVIA Chrome 640/645integrated graphics processor is fully DirectX 11 certified and includes a 128-bit 2D engine
                                                                                                                          • SuperSpeed USB Certification:Has received SuperSpeed USB certification form the USB-IF and supports up to 3 USB 3.0 ports
                                                                                                                          • HD Audio support:VIA Vinyl HD Audio controller supports up to eight high definition channels with a 192kHz sampling rate, delivering a richer all-round digital media experience
                                                                                                                          • Memory Support:Memory controller technology supports the lower power, high-bandwidth DDR3 memory modules with speeds up to 1600MHz
                                                                                                                          • Fully Integrated technology support: Supports the low power device interfaces of SDIO 3.0, UART, SPI, LPC as well as six USB 2.0 ports

                                                                                                                          VIA Chromotion 5.0 The VIA Chromotion 5.0 is a high performance video processor supports stereoscopic decoding in MVC format bringing 3D content to life. Also boasting hardware acceleration of the H.264 HD encoding technology that is driving today’s advanced online HD video streaming services, the VIA Chromotion 5.0 video processor brings crisp, smooth 1080p HD video contentto life without hogging key system resources or resorting to an additional third party decoder. The Chromotion 5.0 video processor supports the latest video codecsincluding full Blu-ray support at true HD screen resolutions, including dual 1080p HD decode and playback of MPEG-2, MPEG-4, WMV9, VC-1 and H.264 content. Additional enhancements include H.264 HD encoder, motion compensation, transform, de-blocking, full VLD support, and AVS support. Full frame rate playback of MPEG-2, H.264 and Windows Media Video-based codecs, including VC-1 at full 1080p resolutions, is assisted by hardware acceleration assistance and includes Advanced Profile level 4 support on WMV/VC-1 content and High Profile level 4.1 for H.264-based content. Advanced Display Connectivity Integrated display support includes a dedicated CRT interface, integrated LVDS transmitter, a multiplexed display interface for DisplayPort and HDMI and parallel digital video output port (DVP) to external HMDI/LVDS/DVI transmitter. The VIA VX11 MSP provides multi-monitor extended desktop support where two independent display engines can display different content at different resolutions, pixel depths and refresh rates. VIA Vinyl HD Audio As the PC platform increasingly becomes the central device for home entertainment, the HD Audio codecs provide home theatre quality performance with support for the latest high definition audio content in Blu-ray and other popular HD audio formats. The VIA Vinyl HD audio codec is a low power, high-fidelity 8-channel high definition audio codec designed for desktop PC audio systems, supporting QSound, DTS Connect, Dolby1 Digital Live, Dolby PCEE program, SRS Lab and Creative technologies. HD DVD Audi Content protection is also supported for full-rate lossless DVD audio, and HD DVD audio content playback.

                                                                                                                          VIA_VX11 Chip_original_ The VIA VX11 chip (the VX11H looks the same) on its carrier VIA_VX11_internal_block_diagram VIA VX11 internal block diagram Note that it has Windows 8 support and the graphics and video capabilities in the VIA VX11 and VX11H are based on S3 Graphics technology about which we should know that VIA Technologies Announces Sale of Stake in S3 Graphics [VIA Technologies press release, July 6, 2011]:

                                                                                                                          Taipei, Taiwan, July 6, 2011 – VIA Technologies, Inc. (“VIA”) today announced the signing of definitive agreement to sell all of its shareholding in S3 Graphics Co., Ltd. (“S3 Graphics”) to HTC Corporation (“HTC”). S3 Graphics is a leading provider of innovative graphics visualization technologies used in PCs, game consoles and, more recently, mobile devices.
                                                                                                                          VIA acquired S3 Graphics in 2001 with the intention to accelerate integration of graphics capabilities with its processor and chipset products. S3 Graphics became undercapitalized in 2005, and VIA introduced WTI Investment International, Ltd. (“WTI”) as a new investor to help fund the operations and R&D initiatives. WTI is a private investment company, in which Cher Wang, Chairman of VIA, is a significant shareholder.
                                                                                                                          Under terms of the agreement with HTC, total consideration for all outstanding shares of S3 Graphics will be US$300 million. Of which, VIA will receive US$147 million; and WTI will receive US$153 million. VIA will recognize a capital gain of US$ $37 million and paid-in-capital of US$ 115 million in this transaction.

                                                                                                                          Note that this $300M acquisition of S3 Graphics by HTC was based on an ongoing lawsuit against Apple by S3 Graphics to be used in negotiating with Apple. This was lost in November last year but nevertheless could have figured positively for HTC’s recent settlement with Apple (as only HTC was able to negotiate a settlement with Apple so far) in which Apple To Get $6-$8 Per Phone Fee From HTC, Analyst Says [Forbes, Nov 12, 2012]:

                                                                                                                          Apple will receive an estimated $6-$8 per phone licensing fee from HTC under the patent litigation settlement the two companies announced on Saturday, Sterne Agee analyst Shaw Wu said in a research note this morning.
                                                                                                                          “Financial terms were not disclosed but we believe AAPL is likely getting a net licensing fee due to its much stronger patent portfolio and we think position as undisputed inventor of the modern smart phone with touchscreen,” he writes. “We view this as a positive and the big question is whether Samsung and Motorola will also reach settlement agreements.”
                                                                                                                          He estimates that at $6-$8 per HTC phone sold, the company will generate an additional $180 million to $200 million annual revenue; he says that is lower than the range that Apple initially proposed. Wu notes that there have been previous reports that HTC pays Microsoft $5 per phone running Android.
                                                                                                                          The bottom line, he notes, is that the deal is basically immaterial to Apple. “For a lot of companies, $180-280 million in annual licensing revenue from one vendor is material but for AAPL it will likely be immaterial to its financials given its large revenue base of $193 billion and $48 billion in net income that the investment community is forecasting for FY 2013,” he writes.

                                                                                                                          World’s Smallest x86 Quad Core System, VIA ARTiGO A1250 [VIA Technologies press release, Oct 31, 2012]

                                                                                                                          ARTiGO A1250_comparison_L_medium.jpg Features USB 3.0, stereoscopic 3D and HD video support, for an immersive multimedia experience Taipei, Taiwan, 31st October, 2012 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the world’s smallest x86 quad core system, the VIA ARTiGO A1250 slim system, featuring a 1.0GHz VIA QuadCore processor and the latest VIA VX11H media system processor (MSP), in chassis the size of a paperback novel. The ultra-compact VIA ARTiGO A1250, is suitable for a myriad of applications in the home or office, including home server, home automation, hotel management, media streaming, digital signage and surveillance as well as medical and healthcare applications. The VIA ARTiGO A1250 leverages the VIA VX11H MSP to deliver an immersive multimedia experience complete with 3D stereoscopic and HD display support in a low power envelope, which a typical power consumption of a mere 32W TDP. The VIA ARTiGO A1200 can fit easily into any environment, whether it is behind a monitor or on the wall with a 10 x 10 cm VESA mount or placed alongside other home media devices. For system developers, VIA provides third party software security through a unique hardware/software design. “By leveraging the ultra compact Pico-ITX form factor, the VIA ARTiGO A1250 is able to deliver a powerful x86 quad core computing experience in the smallest system design on the market,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA ARTiGO A1250 boasts the latest technology with 3D stereoscopic display and USB 3.0 support for an unparalleled ultra compact computing experience, making small truly beautiful.” VIA ARTiGO A1250 ARTiGO A1250_with mount_L_medium.jpg The VIA ARTiGO A1250 is the slimmest full featured quad core system on the market today with an ultra low-profile design measuring a mere 17.7cm x 12.5cm x 3.0cm (W X D X H), a full ten percent smaller than the VIA ARTiGO A1150 series. A power efficient 1.0GHz VIA QuadCore E-Series processor is combined with the latest highly integrated all-in-one VIA VX11H MSP which features the integrated VIA Chromotion 5.0 video processor with DX11 support for richer textures and 3D stereoscopic display. The VIA ARTiGO A1250 delivers an exceptional multimedia experience with advanced filtering and cutting edge post-processing to perform ultra smooth decoding of H.264, MPEG-2, VC-1, and WMV9 for smooth playback of the most demanding multimedia titles at resolutions up to 1080p without incurring a heavy CPU load. The unique dual-sided I/O coastline interface includes one HDMI and one VGA display port, one GigaLAN Ethernet port, two USB 3.0 and two USB 2.0 ports, audio jacks (Line-in/out and mic-in) and 12V DC-in power. For more information about the VIA ARTiGO A1250 please visit: http://www.viaembedded.com/en/products/systems/1990/1/ARTiGO_A1250_(Pico-ITX).html

                                                                                                                          Here is an introductory video looking at the VIA ARTiGO A1250. The World’s smallest x86 quad core system on the market to date. The size of the new system is compared to the A1150 (as in the press release) and the previous generation A1200 model with fanless slim design.

                                                                                                                          Current ARTiGO pricing can be checked on E-ITX.com:

                                                                                                                          VIA ARTiGO A1250 for $320 with VX11H MSP (for a configuration with 0 GB RAM, 0 ODD, 0 GB HDD, no IEEE802.11b/g/n WiFi Kit, no OS, no system testing and assembly) and up (when the missing things indicated are added), delivery is promised for DecemberVIA ARTiGO A1150 for $259 with [VX900H MSP] Chrome9 HD DX9 3D/2D Video Processor w/HDMI & VGA Display Outputs (for a configuration with 1 GB RAM, 0 ODD, 0 GB HDD, no 802.11b/g Wireless LAN Module Kit, no Antennas for Wireless LAN Module Kit, no OS, no system testing and assembly) and up (when the missing things indicated are added), next day shipment – VIA ARTiGO A1200 for $319 with VX900 MSP (for a configuration with 0 GB RAM, 0 ODD, 0 GB HDD, no Wireless LAN or 3G WAN Network, no WiFi Antennas, no OS, no system testing and assembly) and up (when the missing things indicated are added), next day shipment – Windows operating system prices (w/OEM License [and DVD]):

                                                                                                                          • Win7 Home Premium 64-bit: $120
                                                                                                                          • Win7 Professional 64-bit: $160
                                                                                                                          • Win7 Ultimate 64-bit: $200
                                                                                                                          • Win XP Pro 32-bit with OEM License ONLY: $185

                                                                                                                          CPUs used:

                                                                                                                          VIA Eden X2 Unveiled at Embedded Word 2011, World’s Most Power-Efficient Dual Core Processor [VIA Technologies press release, March 1, 2011]

                                                                                                                          VIA Eden X2 processors bring unrivalled power efficiency and fanless stability to embedded markets without compromising on performance Taipei, Taiwan, 1 March, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA Eden X2 processor, the industry’s lowest power dual-core processor, optimized for fanless implementation in a broad range of industrial and commercial embedded systems. VIA Eden X2 will debut at Embedded World 2011, Nuremberg, Hall 12, Booth No. 574 VIA Eden X2 processors combine VIA’s signature ‘Eden’ fanless design principles, in a highly optimized, power-efficient dual-core architecture. This guarantees rock-solid stability for mission critical embedded systems without compromising on performance or features. With a component longevity guarantee of 7 years, VIA Eden X2 processors are guaranteed to extend the reach of fanless system design for years to come. “Eden X2 shows how once again VIA is setting the pace when it comes to highly optimized, power-efficient processing,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Embedded developers will relish the opportunity to integrate a native 64-bit, dual-core processor in passively cooled, ultra stable systems.” VIA_Eden_X2_processor_Front_and_back_medium.jpg VIA Eden X2 – Dual-Core Processing on a Fanless Power Budget Leveraging the latest 40nm manufacturing process, VIA Eden X2 processors combine two 64-bit, superscalar VIA Eden cores on one die, offering enhanced multi-tasking and superb multimedia performance on a rigidly low power budget. VIA Eden X2 processors are the most power-efficient processors on the market, designed to offer the ideal solution for fanless system design. VIA Eden X2 processors bring additional features that include VIA VT virtualization, a technology that allows legacy software and applications to be used in virtual scenarios without impacting on performance. The unique VIA AES Security Engine offers hardware-based data encryption on the fly, and essential tool in content protection and system security. VIA Eden X2 processors are natively 64-bit compatible, facilitating an essential transition for the future of the embedded industry as 64-bit operating systems such as Windows® Embedded Standard 7 allow for vastly improved data throughput per clock cycle. This makes it easier to manipulate large data sets and improves overall performance. VIA Eden X2 processors are also fully compatible with Windows CE and Linux operating systems. VIA Eden X2 processors are based on the latest 40nm manufacturing process using a VIA NanoBGA2 package of 21mm x 21mm with a die size of 11mm x 6mm. All VIA Eden X2 processors and are fully pin-to-pin compatible with VIA Eden, VIA C7 and VIA Nano E-Series processors. Product Highlights

                                                                                                                          • Industry-leading power-efficient architecture
                                                                                                                          • 7 year longevity guarantee
                                                                                                                          • Advanced multi-core processing
                                                                                                                          • Native support for 64-bit operating systems
                                                                                                                          • High-performance superscalar processing
                                                                                                                          • Out-of-order x86 architecture
                                                                                                                          • Most efficient speculative floating point algorithm
                                                                                                                          • Full processor virtualization support
                                                                                                                          • Advanced power and thermal management
                                                                                                                          • VIA AES hardware security features
                                                                                                                          • Pin-to-pin compatibility with VIA processors range

                                                                                                                          VIA cProcessors are sampling now to project customers. Systems and boards featuring the VIA Eden X2 will be available in Q2 2011. For information about VIA Eden X2 processors, please visit: http://www.via.com.tw/en/products/processors/edenX2/


                                                                                                                          Basic RGB

                                                                                                                          VIA Announces VIA Nano X2 Dual-Core Processor [VIA Technologies press release, Jan 4, 2011]

                                                                                                                          Brings advanced multi-core performance to energy-efficient PCs without raising the heat Taipei, Taiwan, 4 January 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest VIA Nano X2 processor for mainstream PC markets. Based on a 40 nanometer fabrication process, the VIA Nano X2 delivers better computational performance and improved multi-tasking ability without consuming more power. “The VIA Nano X2 processor arrives at a time when software architectures are now optimized to for multi-thread computing,” commented Richard Brown, VP International Marketing, VIA Technologies, Inc. “Improvements in semi-conductor fabrication means we can now double the number of processor cores while maintaining the same low energy consumption levels that our customers are used to.” VIA Nano X2 processors are targeting a range of PC products that include desktop, all-in-one and mobile notebook designs while extending the reach of VIA’s processor portfolio into multitasking and performance-oriented segments. VIA Nano X2 processors offer end-users the most optimized, power-efficient computing experience on the market today. VIA Nano X2 Processor VIA Nano X2 processors are built using the advanced 64-bit, superscalar ‘Isaiah’ architecture that powers previous single-core VIA Nano processors, adopted worldwide for a growing number of market-leading mini-note, small form factor desktop, and energy-efficient server designs. Featuring two out-of-order x86 cores, VIA Nano X2 processors deliver up to double the performance on multi-thread optimized applications and also come with SSE4, native 64-bit support, VT CPU virtualization technology, and VIA PadLock™ hardware security features. VIA Nano X2 processors are also pin-to-pin compatible with previous VIA Nano, VIA C7, VIA C7-M and VIA Eden processors, facilitating easy upgrades of existing designs. Product Highlights

                                                                                                                          • Advanced multi-core processing
                                                                                                                          • Power-efficient out-of-order x86 architecture
                                                                                                                          • Full support for 64-bit operating systems
                                                                                                                          • High-performance superscalar processing
                                                                                                                          • Most efficient speculative floating point algorithm
                                                                                                                          • Full processor virtualization support
                                                                                                                          • Advanced power and thermal management
                                                                                                                          • VIA PadLock™ hardware security features
                                                                                                                          • Pin-to-pin compatibility with other VIA processors

                                                                                                                          VIA Nano X2 processors are also compatible with all VIA media system processors and digital media chipsets including the latest VIA VX900 and VIA VN1000. VIA Nano X2 Availability VIA Nano X2 processors samples are currently available for OEMs and motherboard vendors, with systems featuring the processors expected to arrive in Q1 2011.

                                                                                                                          VIA Small Form Factor Solutions in Multi-Core [VIAMKT YouTube channel, Oct 19, 2011]

                                                                                                                          VIA Embedded discusses the role multi core processors will play in the future embedded market and how VIA is strongly positioned to fulfill the industries needs of tomorrow through our comprehensive platform solutions. Discussed are the Eden X2 platform providing the lowest power consumption with dual core in embedded, and VIA Quadcore & VIA Nano X2 platform providing competitive performance to the other solution in embedded.

                                                                                                                          VIA Nano™ X2 E-Series Dual Core Processors Debut at Embedded System Conference [VIA Technologies press release, April 29, 2011]

                                                                                                                          VIA Nano X2 E-Series processors deliver highly-optimized power-efficient dual core solution for advanced 64-bit x86 embedded system design applications Taipei, Taiwan, 29 April, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that it will unveil its new family of low power dual core VIA Nano X2 Series processors at the Embedded System Conference, held at the McEnery Convention Center, San Jose from 2 – 5 May. The VIA booth is located at No 2032. VIA Nano X2 E-Series processors combine a highly optimized, power-efficient dual-core architecture with advanced performance for the most demanding 86-bit x86 embedded system design applications. Available in two models running at speeds of 1.2+ GHz and 1.6+ GHz, VIA Nano X2 E-Series Processors also come with a component longevity guarantee of 7 years. “The VIA Nano X2 E-Series demonstrates how VIA continues to lead the way in bringing highly optimized, power-efficient 64-bit x86 processors to the embedded market,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “With their advanced performance, these processors provide developers with exciting new embedded system design options.” VIA Nano X2 E-Series Leveraging the latest 40nm manufacturing process, VIA Nano X2 E-Series processors combine two 64-bit, superscalar VIA Nano cores on one die, offering enhanced multi-tasking and superb multimedia performance on a low power budget. VIA Nano X2 E-Series processors bring additional features that include VIA VT virtualization, a technology that allows legacy software and applications to be used in virtual scenarios without impacting on performance. The unique VIA AES Security Engine offers hardware-based data encryption on the fly, an essential tool in content protection and system security. VIA Nano X2 E-Series processors are natively 64-bit compatible, facilitating an essential transition for the future of the embedded industry as 64-bit operating systems such as Windows® Embedded Standard 7 allow for vastly improved data throughput per clock cycle. This makes it easier to manipulate large data sets and improves overall performance. VIA Nano X2 E-Series processors are also fully compatible with Windows CE and Linux operating systems. VIA Nano X2 E-Series processors are based on the latest 40nm manufacturing process using a VIA NanoBGA2 package of 21mm x 21mm with a die size of 11mm x 6mm. They are also fully pin-to-pin compatible with VIA Eden, VIA C7 and VIA Nano E-Series, and VIA Eden X2 processors. Product Highlights

                                                                                                                          • Industry-leading power-efficient architecture
                                                                                                                          • 7 year longevity guarantee
                                                                                                                          • Advanced multi-core processing
                                                                                                                          • Native support for 64-bit operating systems
                                                                                                                          • High-performance superscalar processing
                                                                                                                          • Out-of-order x86 architecture
                                                                                                                          • Most efficient speculative floating point algorithm
                                                                                                                          • Full processor virtualization support
                                                                                                                          • Advanced power and thermal management
                                                                                                                          • VIA AES hardware security features
                                                                                                                          • Pin-to-pin compatibility with VIA processors range

                                                                                                                          VIA Nano X2 E-Series Processors are sampling now to project customers. Systems and boards featuring VIA Nano X2 E-Series processors will be available in Q2 2011.

                                                                                                                          … The VIA EPIA-M900 and VIA EPIA-M910 are the first two Mini-ITX boards to feature the 1.2GHz VIA QuadCore E-Series processor, offering enhanced multi-tasking and superb multimedia performance on the lowest quad core power budget for next generation embedded products. The VIA QuadCore E-Series processor features a highly optimized, energy efficient multi-core architecture, which is natively 64-bit compatible and comes with a host of additional performance features including Adaptive Overclocking. To meet the low power demands of the embedded market, the VIA QuadCore E-Series processor offers industry-leading energy efficiency, with the VIA QuadCore E-Series 1.2+ GHz processor delivering a thermal design power (TDP) of only 27.5W. The distributed power of the VIA QuadCore E-Series processor makes it ideal for handling the most demanding HD video formats for immersive multi-display applications and environments. “The VIA QuadCore E-Series processor delivers world class performance in the industry’s leading power efficient package,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The high performance of the VIA QuadCore E-Series processor makes it the perfect platform for the creation of next generation digital signage displays and embedded projects.” … From: VIA Announces World’s First Quad Core Mini-ITX Boards [VIA Technologies press release, Feb 23, 2012] VIA_QuadCore_E-Series_Processor_Angle_medium.jpg

                                                                                                                          VIA Announces New VIA QuadCore Processor [VIA Technologies press release, May 12, 2011]

                                                                                                                          World’s lowest power quad core x86 processor sets the new baseline standard for the next generation of mainstream PCs and notebooks Taipei, Taiwan, 12 May, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of the VIA QuadCore processor, the lowest power quad core processor on the market today. Featuring a highly optimized, energy-efficient multi-core architecture, the VIA QuadCore processor delivers awesome multi-threaded performance across the board for multi-tasking, multimedia playback, productivity and internet browsing in a low power envelope. The distributed performance of the VIA QuadCore also makes it ideal for making the most of multi-display environments. With a TDP (Thermal Design Power) of only 27.5 watts, the 1.2+ GHz VIA QuadCore processor is 21% more energy efficient than the nearest competitor and ideal for a wide range of desktop PC, notebook, small form factor PC, all-in-one PC, and mini-server system design applications. “As a result of the rapid proliferation of high definition multimedia content and increasingly demanding multithreaded applications, a four core processor is the new baseline for today’s mainstream PC user,” said Epan Wu, Head of Processor Platforms, VIA Technologies, Inc. “The VIA QuadCore processor meets that need with the industry’s most power efficient architecture.” VIA QuadCore Processor VIA QuadCore processors combine four ‘Isaiah’ cores on two dies, offering enhanced multi-tasking and superb multimedia performance on a low power budget. Initially available at a speed of 1.2+GHz, VIA QuadCore processors are natively 64-bit compatible and come with a host of additional performance features including Adaptive Overclocking, 4MB L2 cache, and the 1333MHz V4 Bus. TDP is 27.5 watts. Other advanced features include VIA VT virtualization, a technology that allows legacy software and applications to be used in virtual scenarios without impacting on performance, and VIA PadLock with the Advanced Cryptography Engine which delivers the world’s fastest AES encryption. This hardware-based security feature offers data encryption on the fly, an essential tool in content protection and system security. VIA QuadCore processors are manufactured using the latest 40nm process, and feature a VIA NanoBGA2 package of 21mm x 21mm with a die size of 11mm x 6mm. They are also fully pin-to-pin compatible with VIA Eden, VIA C7 and VIA Nano E-Series, and VIA Eden X2 processors. Product Highlights

                                                                                                                          • Power-efficient architecture
                                                                                                                          • High-performance superscalar processing
                                                                                                                          • Out-of-order x86 architecture
                                                                                                                          • Efficient floating point unit (2 clock SP multiplies)
                                                                                                                          • Advanced multi-core processing
                                                                                                                          • Native support for 64-bit operating systems
                                                                                                                          • Hardware virtualization support
                                                                                                                          • Advanced power and thermal management
                                                                                                                          • AES hardware security features
                                                                                                                          • Secure Hash Algorithm: SHA-1, SHA-256, SHA-384, SHA-512
                                                                                                                          • Pin-to-pin compatibility with VIA processor range

                                                                                                                          VIA QuadCore processors will be on display at the VIA booth at Computex (Taipei International Convention Center, Room 201D) from May 31st to June 4th, and will begin volume shipments in Q3 2011. To go to the product page for the VIA QuadCore processor, please click here.


                                                                                                                          Next look at

                                                                                                                          the preceding technology level with the Isaiah core and the companion MSPs

                                                                                                                          when they were first born “At the same power we moved the performance up with this architecture … tried to double the performance at the same power”: Glenn Henry Introduces the VIA Isaiah Architecture [VIAMKT YouTube channel, Jan 8, 2008]

                                                                                                                          Glenn Henry, president of VIA subsidiary Centaur Technology Inc. discusses the brand new VIA Isaiah Architecture for the next generation of x86 processors with the best performance per watt for the mobile internet.

                                                                                                                          and some more details are in the VIA’s New Isaiah / CN Processor [frgmstr YouTube channel, Jan 23, 2008] video:

                                                                                                                          Glenn Henry, president of Centaur technology talks about the performance of the new CN processor and compares it to Intel’s Silverthorn [Atom Z5xx with 45 nm technology released in April 2008].

                                                                                                                          See also: – the description of the he first silicon version of the new VIA Isaiah Architecture: The VIA Isaiah Architecture [Centaur Technology, Inc., January 2008] – VIA Unveils Next-Generation Isaiah x86 Processor Architecture [VIA Technologies press release, Jan 24, 2008 ]

                                                                                                                          New architecture provides substantial increases in performance and functionality with leading power efficiency to enable next generation “Small is Beautiful” computing devices Austin, Texas, US, 24 January 2008 – VIA Technologies, Inc, a leading innovator of x86 silicon and platform technologies, today announced details of the VIA Isaiah Architecture, a new x86 processor architecture that will deliver significant boosts to the functionality and performance of desktop, mobile and ultra mobile PCs while minimizing power requirements, saving on battery life and enabling ultra compact system designs. Designed from the ground up by the company’s US-based processor design subsidiary, Centaur Technology Inc., the VIA Isaiah Architecture combines all the latest advances in x86 processor technology, including a 64-bit superscalar speculative out-of-order microarchitecture, high-performance multimedia computation, and a new virtual machine architecture. The first generation of Isaiah-based products will be pin-compatible with the VIA C7 processor family, enabling a smooth transition for system builders and providing them with an easy upgrade path for current designs. The first processors implementing the VIA Isaiah Architecture will use proven 65 nanometer technology for greater power efficiency, which, combined with new enhanced power and thermal management capabilities, will ensure the best performance per watt on the market and help drive the rapidly emerging categories of green, silent and small form factor desktop PCs and home media centers, and ultra thin and light notebooks and mini-notes. “Today is an exciting day for everyone at Centaur,” commented Glenn Henry, President, Centaur Technology Inc. “With a team of less than one hundred first-class engineers, we have created from scratch the world’s most power-efficient x86 processor architecture with state of the art features, outstanding performance, and flexible scalability for the future.” “The introduction of the new VIA Isaiah Architecture is an extremely significant milestone in VIA’s processor business,” commented Wenchi Chen, President and CEO, VIA Technologies, Inc. “In achieving these new levels of functionality and performance, it provides the ideal complement to our industry-leading family of low power VIA C7 processors and will enable us to further extend our growing presence in the global x86 processor market.” Optimized for a World of “Small is Beautiful” Devices With its unique blend of high performance and low power consumption, the VIA Isaiah Architecture has been specifically optimized to meet the rapidly growing demand for smaller, more functional, and more stylish mobile and desktop computing and personal electronics devices that will allow people to fully enjoy the rich media content and interactivity of the broadband Internet lifestyle. These devices range from easily portable slim and light notebooks and pocket-sized Ultra Mobile PCs and Ultra Mobile Devices with rich multimedia and wireless broadband capabilities to Small Form Factor Green PCs and Digital Entertainment Centers that combine space saving designs with minimal energy consumption. VIA Isaiah Architecture Highlights The VIA Isaiah Architecture has been specifically designed to deliver all the performance and features necessary for running the most demanding computing, entertainment, and connectivity applications on today’s and tomorrow’s Internet, including high-definition video, 3D games, imaging, and virtual worlds, within a very low power and thermal envelope that makes it ideal for small form factor mobile devices such as Mini-Notebooks and Ultra Mobile Devices. Its key highlights include the following: – 64-bit Superscalar Speculative Out-Of-Order MicroArchitecture The VIA Isaiah Architecture comprises a host of advanced architectural features, including a superscalar and out of order architecture, macro-fusion and micro-fusion functionality, and sophisticated branch prediction, that significantly improve processor efficiency and performance. In addition, it also features a full and unrestricted 64-bit instruction set with plenty of headroom to support 64-bit operating systems and applications as they become available, and a new virtual machine architecture for running systems more securely and efficiently in virtual environments. – High-Performance Computation and Media Processing As well as support for clock speeds of up to 2GHz in initial products and a high-speed, low power Front Side Bus scalable from 800MHz up to 1333MHz, the VIA Isaiah Architecture also has a highly-efficient cache subsystem with two 64KB L1 caches and 1MB exclusive L2 cache with 16-way associativity for more effective memory optimization. For further enhanced multimedia performance, the VIA Isaiah Architecture also integrates the world’s fastest x86 processor Floating Point Unit (FPU) with the ability to execute four floating point adds and four multiplies per clock and also featuring a new algorithm that minimizes latency. Support for new SSE instructions and a 128-bit wide integer data path further boost multimedia performance. – Advanced Power and Thermal Management To minimize energy consumption and reduce heat, the VIA Isaiah Architecture utilizes new low power circuit techniques and in addition to aggressive management of active power includes support for the new “C6” power state, in which power is turned off to the caches. Extensive Adaptive PowerSaver™ Technology features further reduce power consumption and improve thermal management, including the unique TwinTurbo™ dual-PLL implementation, which acts like automatic transmission in permitting smooth transitions between activity states within one clock cycle, ensuring always-on service and minimize latency, as well as new mechanisms for managing the die temperature. – Scalable Upgrade to VIA C7™ Processor The VIA Isaiah Architecture is pin-to-pin compatible with the current VIA C7 processor family, enabling OEMs and motherboard makers to transition to the new architecture smoothly, and to fulfill a wider range of market segments with a single board or system design. – VIA PadLock™ Hardware Security Features– To enhance the confidentiality, integrity, and authenticity of electronic data, the VIA Isaiah Architecture incorporates industry-leading on-die hardware cryptographic acceleration features within the VIA PadLock Security Engine, including the world’s best random number generator (RNG), an AES Encryption Engine, SHA-1 and SHA-256 hashing for secure message digests for data integrity, and a new specialized “secure execution mode” that includes features such as a secure on-chip memory area and encrypted instruction fetching. VIA Isaiah Architecture Product Availability Processors implementing the VIA Isaiah Architecture are expected to start shipping in the first half of 2008 and will be manufactured using an advanced, low power 65 nanometer process.

                                                                                                                          VIA_Isaiah_Architecture_die_plot_original_ VIA Isaiah Architecture die plot

                                                                                                                          VIA Launches VIA Nano Processor Family [VIA Technologies press release, May 29, 2008]

                                                                                                                          Power efficient processors based on ‘Isaiah’ architecture designed for optimized performance for mainstream PC markets and new device types Beijing, China, 29th May 2008 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA Nano processor family based on the VIA Isaiah Architecture. Building on the market-leading energy efficiency of the VIA C7 processor family, the VIA Nano processor family offers as much as four times the performance within the same power range to extend VIA’s performance per watt leadership, while pin compatibility with VIA C7 processors will ensure a smooth transition for OEMs and motherboard vendors, and provides them with an easy upgrade path for current system or board designs. The first 64-bit, superscalar, speculative out-of-order processors in VIA’s x86 platform portfolio, VIA Nano processors have been specifically designed to revitalize traditional desktop and notebook PC markets, delivering truly optimized performance for the most demanding computing, entertainment and connectivity applications, including Blu-ray Disc™ HD video playback and the latest PC games, such as Crysis™. The VIA Nano processor family leverages Fujitsu’s advanced 65 nanometer process technology for enhanced power efficiency, and augments that with aggressive power and thermal management features within the compact 21mm x 21mm nanoBGA2 package for an idle power as low as 100mW (0.1W), extending the reach of power efficient green and silent PCs, thin and light notebooks and mini-notes around the world. “VIA Nano processors represent the next generation of x86 technology, providing the fundamental building blocks for a new genre of optimized computing solutions,” said Wenchi Chen, President and CEO, VIA Technologies, Inc. “‘Small is Beautiful’ is more than a design strategy; it’s our vision of where the PC market is heading and our new processors will help the market realize that dream.” VIA’s ‘nano’ association also extends to VIA’s signature silicon and platform design characteristics of power efficiency and form factor size reduction, as demonstrated by VIA’s ultra compact Nano-ITX boards and the nanoBGA2 processor packaging used for the current VIA C7 processor family and the first generation of VIA Nano processors. About the VIA Nano Processor Family Initially to be launched in two skus, the VIA Nano L-series processors for mainstream desktop and mobile PC systems and the ultra low voltage U-series for small form factor desktop and ultra mobile devices such as mini-notes:

                                                                                                                          Product & Model Name Clock Speed VIA V4 Bus Maximum Power (TDP Max)
                                                                                                                          VIA Nano L2100 processor 1.8GHz 800MHz 25W
                                                                                                                          VIA Nano L2200 processor 1.6GHz 800MHz 17W
                                                                                                                          VIA Nano U2400 processor 1.3+GHz 800MHz 8W
                                                                                                                          VIA Nano U2500 processor 1.2GHz 800MHz 6.8W
                                                                                                                          VIA Nano U2300 processor 1.0GHz 800MHz 5W

                                                                                                                          The VIA Nano processor family boasts the highly efficient VIA V4 bus interface and brings a host of technology firsts to VIA’s processor platform line-up, including:

                                                                                                                          • 64-bit Superscalar Speculative Out-Of-Order MicroArchitecture: Supports a full 64-bit instruction set and provides for macro-fusion and micro-fusion functionality, and sophisticated branch prediction for greater processor efficiency and performance.
                                                                                                                          • High-Performance Computation and Media Processing: The high-speed, low power VIA V4 Front Side Bus starting at 800MHz, plus a high floating point unit, support for new SSE instructions, and two 64KB L1 caches and 1MB exclusive L2 cache with 16-way associativity gives a big boost to multimedia performance.
                                                                                                                          • Advanced Power and Thermal Management: Aggressive management of active power includes support for the new “C6” power state, Adaptive PowerSaver™ Technology, new circuit techniques and mechanisms for managing the die temperature, reducing power draw and improving thermal management.
                                                                                                                          • Scalable Upgrade to VIA C7™ Processor: Pin-to-pin compatibility with current VIA C7 processors enables a smooth transition for OEMs and mainboard vendors, enabling them to offer a wider range of products for different markets with a single board or system design.
                                                                                                                          • Greener Technology: In addition to full compliance with RoHS and WEEE regulations, product manufacturing will be halogen-free and lead-free at launch, helping to promote a cleaner environment and more sustainable computing.
                                                                                                                          • Enhanced VIA PadLock™ Security Engine: Industry-leading on-die hardware cryptographic acceleration and security features, including dual quantum random number generators, an AES Encryption Engine, NX-bit, and SHA-1 and SHA-256 hashing.For more detailed information about the VIA Nano processor family, please read the introductory white paper here:http://www.via.com.tw/en/downloads/whitepapers/processors/WP080529VIA_Nano.pdfVIA Nano Processor AvailabilityVIA Nano processors are available now for OEMs and motherboard vendors, while systems featuring VIA Nano processors are expected to market in Q3 2008.For further information on the VIA Nano processor family, please visit the VIA website at: http://www.via.com.tw/en/products/processors/nano/

                                                                                                                          The VIA Isaiah Architecture [VIA Technologies, May 29, 2008]

                                                                                                                          … Initial production versions of the 1.0 GHz VIA Nano ULV processor will have a maximum Thermal Design Power (TDP) of just 5 watts (and an idle power of just 100mW), scaling up to 25 watts for the 1.8 GHz VIA Nano processor (500mW idle power). …

                                                                                                                          VIA Introduces New VIA Nano 3000 Series Processors [VIA Technologies press release, Nov 3, 2009]

                                                                                                                          VIA’s fastest and most power efficient processors yet deliver richest mobile and all-in-one desktop computing experience Taipei, Taiwan, 3 November 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today introduced its new VIA Nano 3000 Series processors, bringing enhanced digital media performance and lower power consumption to Windows 7 thin and light notebook and all-in-one desktop PC markets. Based on the 64-bit superscalar ‘Isaiah’ architecture, VIA Nano 3000 Series processors deliver the most compelling thin and light notebook computing experience with their rich HD entertainment capabilities, including support for flawless playback of high bit-rate 1080p HD video, as well as low power consumption resulting in longer battery life. With a host of advanced features including 64-bit support, advanced CPU virtualization technology, SSE4 for enhanced multimedia processing, and the industry-leading encryption and security capabilities integrated in the VIA PadLock™ Security Engine, VIA Nano 3000 Series processors also provide a secure, high-performance solution for emerging cloud-based computing environments. “With the VIA Nano 3000 Series, we are launching our fastest and most power-efficient processors yet,” commented Richard Brown, VP International Marketing, VIA Technologies, Inc. “Coupled with our market-leading digital media chipsets, they enable the richest experience across a broad range of mobile and all-in-one system designs.” VIA Nano 3000 Series VIA Nano 3000 Series processors are built on the successful 64-bit, superscalar architecture that powers the VIA Nano 1000 Series and 2000 Series processors, which have been adopted by leading OEMs worldwide for a growing number of market-leading mini-note, small form factor desktop, and energy-efficient server designs. Available at speeds from 1.0GHz to 2.0GHz, VIA Nano 3000 Series processors deliver up to 20% higher performance using up to 20% less power than current VIA Nano processors and boast a number of new features including support for the SSE4 multimedia instruction set and VIA VT virtualization technology. Fully compatible with all Microsoft operating systems, including the new Windows 7, as well as all popular Linux distributions, the VIA Nano 3000 Series processors use the NanoBGA2 package, making them pin-to-pin compatible with VIA Nano 1000 Series, VIA Nano 2000 Series, VIA C7, VIA C7-M and VIA Eden processors for easy upgrades of existing designs. VIA Nano 3000 Series Availability VIA Nano 3000 Series processor samples are currently available for OEMs and motherboard vendors, and will enter mass production in Q1 2010. VIA Nano 3000 processors will be available in the following product skus:

                                                                                                                          Product Name Speed VIA V4 FSB Idle Power
                                                                                                                          L3100 2.0GHz 800MHz 500mW
                                                                                                                          L3050 1.8GHz 800MHz 500mW
                                                                                                                          U3200 1.4GHz 800MHz 100mW
                                                                                                                          U3100 1.3+GHz 800MHz 100mW
                                                                                                                          U3300 1.2GHz 800MHz 100mW
                                                                                                                          U3500 1.0GHz 800MHz 100mW

                                                                                                                          For further information on the VIA Nano processor family, please visit the VIA website at: http://www.via.com.tw/en/products/processors/nano/

                                                                                                                          VN1000_blkdiagramVIA VN1000/VT8261 Chipset Block Diagram

                                                                                                                          VIA Brings Enhanced Windows 7 Desktop to Life with World’s Most Power Efficient DX10.1 Chipset [VIA Technologies press release, Dec 10, 2009]

                                                                                                                          VIA VN1000 boasts Blu-ray playback, DX10.1 graphics and DDR3 memory support and coupled with VIA Nano 3000 Series processors offers the ultimate multimedia experience on next generation all-in-one PCs Taipei, Taiwan, 10 December 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VN1000 digital media chipset for next generation desktop and all-in-one PCs, offering a world-class HD multimedia entertainment platform compatible with the advanced desktop features of Microsoft Windows 7. The VIA VN1000 is the most power efficient DX10.1 digital media chipset available today, making it the perfect solution for next generation small form factor and all-in-one Windows 7 PCs that focus on entertainment, multimedia and touch screen capabilities. The DirectX 10.1 hardware environment provided by the VIA Chrome 520 IGP means Windows 7 users can enjoy a more fluid and visually enhanced desktop experience as well as the latest gaming titles. The VIA VN1000 digital media chipset features the ChromotionHD 2.0 video processor to guarantee smooth playback of the latest Blu-ray titles with superb hardware acceleration of the most demanding H.264, WM9 and VC1 codecs over the latest display technologies, including Display Port and HDMI. “The VIA VN1000 leverages our optimized VIA Nano 3000 Series processors, creating the most balanced, power-efficient, multimedia-focused desktop platform on the market today,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “Supporting the latest system memory, graphics and entertainment standards, the VIA VN1000 takes the VIA processor platform to new heights of power-efficient visual sophistication.” At the core of the VIA VN1000 lies a DirectX 10.1 graphics engine, a necessary requirement for users who want to enjoy the enhanced features of the Windows 7 desktop environment. The DirectX 10.1 engine means that Windows 7 can employ Microsoft’s advanced Windows Desktop Driver Model 1.1, bringing significant gains in system memory efficiency, overall desktop responsiveness and an improved visual experience compared to WDDM 1.0. VIA VN1000 Product Highlights Paired with the new VIA VT8261 south bridge, the VIA VN1000 represents the most power-efficient DX10.1 compliant digital media chipset on the market, consuming up to 12 watts for both north and south bridges, making it a perfect choice for Windows 7 based mini desktop and all-in-one desktop PCs designs. Offering a feature-rich specification with significant emphasis on graphics and HD video playback, the VIA VN1000 features the VIA Chrome 520 IGP, combining a DirectX 10.1 graphics engine, with support for Shader Model 4, OpenGL 3.0 graphics and OpenCL 1.0 for next-generation GPGPU applications. The high-performance ChromotionHD 2.0 video processor offers advanced filtering and cutting edge post-processing to perform ultra smooth decoding of MPEG-4/AVC, H.264, MPEG-2, VC-1, WMV-HD, and AVS video for Blu-ray content. The home theatre experience also encompasses support for the latest connectivity standards, including dual channel support for Display Port, HDMI, DVP, VGA and LVDS/TMDS. The VIA VN1000 supports DDR3 system memory at speeds of up to 1066MHz, one x8 lane and four x1 lane PCI Express II expansion slots, up to five PCI slots and a VIA Vinyl HD 8 channel audio codec. An IDE controller, support for up to four S-ATA II drives, SD/MMS/MMC card reader support and 12 USB 2.0 ports are supplemented with support for PS/2, SPI, GPIO and LPC technologies. The VIA VN1000 Digital Media IGP Chipset is fully compatible with all VIA Nano, VIA C7, VIA C7-M and VIA Eden processors and supports all Microsoft Windows platforms and popular Linux distributions. For more details regarding the VIA VN1000 digital media chipset, please visit: http://www.via.com.tw/en/products/chipsets/v-series/vn1000/index.jsp To learn more about the new VIA VT8261 south bridge, please visit: http://www.via.com.tw/en/products/chipsets/southbridge/vt8261/index.jsp

                                                                                                                          http://www.via.com.tw/en/products/processors/nano/ VIA Nano™ Processor [VIA Technologies, Nov 3, 2009]

                                                                                                                          … Here are some benchmarks comparing VIA Nano, VIA Nano 3000 and Intel Atom. Atom N270 1.6 GHz

                                                                                                                          VIA Nano DC Platform [VIA product page, Nov 2, 2010] DC = Dual Core, when it came out in January 2011 was renamed into Nano X2

                                                                                                                          Brings Blu-ray playback, DirectX 10.1 graphics and DDR3 memory support to next-generation small form factor and all-in-one desktop PCs The VIA Nano DC platform is a forthcoming processor platform from VIA – combining the latest dual core VIA Nano DC processor and the VN1000 digital media chipset to create a feature-rich, low power, high performance processor platform highly suited for today’s small form factor, all-in-one, and traditional desktop PCs. The VIA Nano DC Platform is the first truly low power processor platform that offers excellent multitasking performance, great HD media support and a casual 3D gaming experience way beyond that of competing solutions.

                                                                                                                          VIA Nano DC Processor Twice the cores, twice the performance, same energy efficiency… The VIA Nano DC processor is the first dual-core processor from VIA and will take advantage of the very latest 40nm fabrication technology to deliver up to twice the performance of VIA Nano 3000 series processors within the same rigid thermal envelope. The VIA Nano DC offers improved application multitasking by doubling the core count, bring a 100% increase in many of today’s applications that are that are now multi-thread optimized. Product Highlights

                                                                                                                          • Advanced multi-core processing
                                                                                                                          • Power-efficient out-of-order x86 architecture
                                                                                                                          • Full support for 64-bit operating systems
                                                                                                                          • High-performance superscalar processing
                                                                                                                          • Most efficient speculative floating point algorithm
                                                                                                                          • Full processor virtualization support
                                                                                                                          • Advanced power and thermal management
                                                                                                                          • Leading-edge VIA PadLock™ hardware security features
                                                                                                                          • Pin-to-pin compatibility provides natural upgrade path from other VIA processors

                                                                                                                          VIA VN1000 Digital Media Chipset The IGP that casual 3D gamers have been waiting for... As well as delivering a rich suite of network connectivity, storage, HD audio and peripheral support that you would expect from any VIA digital media chipset, the VN1000 offers one crucial element that has eluded mainstream desktop PC users since the inception of the PC itself – true 3D gaming performance. The Chrome 520 Graphics Core The VIA Chrome 520 integrated graphics processor (IGP) is an industry leading, fully programmable DirectX 10.1 graphics engine that makes light of competing IGP solutions, offering playable frame rates for both new and classic 3D games. The VIA Chrome 520 has 32 stream processors and 4 sampling units, supports Shader Model 4, OpenGL 3.0 and OpenCL 1.0 for next-generation GPU applications. The VIA VN1000 has a 128-bit 2D graphics enginewith GDI/GDI+ acceleration, hardware 2D rotation, true color hardware cursor with 256-level blending. Here are some benchmarks that demonstrate the 3D gaming superiority of the VIA Nano DC platform. With full support for Windows Desktop Driver Model 1.1 in Windows 7, the VIA VN1000 offers a visually superior experience compared to competing IGP platforms. ChromotionHD 2.0 – Effortless HD Video The VIA VN1000 chipset also offers an excellent media playback experience with the ChromotionHD 2.0 video engine, which offers hardware accelerated video playback of the latest video codecs including full Blu-ray support at true HD screen resolutions and HDTV resolution playback of MPEG-2, WMV-HD, VC-1 and H.264 content.

                                                                                                                          The VIA Nano DC platform will be featured in a variety of desktop systems from Q1 2011. More images related to the VIA Nano DC Platform can be found here. Media Previews Read what the leading PC hardware websites are saying about the VIA Nano DC processor platform: http://www.tomshardware.co.uk/chrome-520-nano-dc-vn1000,review-32034.html

                                                                                                                          Preview: VIA VN1000 And Nano DC Platform: An IGP With Game? [Tom’s Hardware, Oct 29, 2010]

                                                                                                                          … With a pre-production CPU clocked at 1.80 GHz, the Nano DC (dual-core) platform that arrived in our lab is more a testament to the company’s ingenuity than a representation of production-ready hardware. Yet, VIA is confident in the CPU’s performance as it waits on its manufacturer to supply a die-shrunk version. Moreover, it wanted us to see what it’s doing with IGP graphics. Today’s article isn’t just proof-of-concept for a CPU, but an entire platform with a DX10.1 integrated GPU expected to lay waste to low-energy competitors. … VIA’s chipset might be ready for production, but its new CPU still needs some manufacturing tweaks. Rather than make us wait for the 40 nm part that’ll be included when this platform ships, the company previewed us with a functional 65 nm version of the CPU to show off its finished VN1000 northbridge. … Conclusion We have to admit that we were a little curious about VIA’s re-asserted interest in entry-level gaming from an IGP. After all, it had been a while since we’d tested anything from S3. But our skepticism proved justified when we threw a few of the games in our benchmark suite at it. As the IGP stands right now, many modern games won’t hit playable frame rates, even dialed down to the lowest possible quality/detail settings. Could the Chrome IGP be a viable solution in the most entry-level games? Perhaps. There remains driver work to be done before any sort of 3D is ready for prime time, though. The greater problem (and this is something even Intel will face with its upcoming Sandy Bridge design) is that games evolve at a rate that IGP technology simply can’t match, so that even this latest attempt comes up short. Putting this in historical perspective, the Chrome 520 IGP is probably more powerful than a TNT2, so entry-level gaming could simply be a matter of using older games. Of course, gaming is not what low-energy platforms are designed to do, and the Nano DC does low-energy tasks like media playback and light-duty office work very well. It even outpaces Intel’s Atom clock-for-clock, even when the Atom is complemented by Nvidia’s Next-Generation ION platform. Thus, what we have in the Nano DC is a high-performance, low-power platform that, like all low-power platforms, can’t really compete with mainstream desktop parts, as much as VIA would probably like it to. Nevertheless, it’s much more likely that the even-more-miserly production version of this platform will make a strong showing in media-oriented PCs and netbooks in the coming months. Perhaps the real question for VIA is: when, exactly, might this platform be ready for prime time? The company announced its VN1000 chipset nearly one year ago. It’s still waiting for a process shrink. And then it needs to announce design wins. This would have been a killer little platform back when it was announced (before ION 2 and before Core i3). A year later, we’re still impressed with that the solution can do. Now we just need to button it up, polish the software, and make this platform available.


                                                                                                                          Finally check

                                                                                                                          VIA Technologies’ latest embedded product direction which will define its future in the upcoming IoT (Internet of Things) “explosion” of the market:

                                                                                                                          First a market analyst opinion about the future of VIA Technologies legacy standard for the boards: An xITX Standards Question Answered [VDC Research: Embedded Microprocessor, Board & Systems Market Blog, Aug 13, 2010]

                                                                                                                          An important question with any standard computer architecture is what comes next? Any standard or family of standards that hopes to remain relevant must continually reinvent itself through new iterations. This can happen in various forms – reducing the board size, adding higher speed interconnects/switch fabrics, reducing power, etc. At the same time some standard families offer multiple paths forward in the form of multiple new standards and not all of these are always well adopted. In these instances where there are multiple iterations there are always question marks about whether all of them will gain enough market traction to be relevant and which ones will be the successful ones.

                                                                                                                          In the case of Mini-ITX, the extremely successful embedded motherboard form factor first created by VIA Technologies, VIA has done a very good job of providing a future road map for the standard and keeping it relevant by turning out a family of xITX standards. Since Mini-ITX VIA has added Nano-ITX, Pico-ITX, and Mobile-ITX – all smaller versions of Mini-ITX to address the constant need for ever smaller form factors in embedded applications.

                                                                                                                          However, a big question mark around these smaller xITX form factors was which would become the most successful? Our latest research on the embedded motherboards market seems to provide some insight.

                                                                                                                          Our numbers indicate that Pico-ITX is gaining the most traction throughout the market and will likely become the next most successful member of the xITX family after Mini-ITX. By 2012 total market dollar volume shipments of Pico-ITX are projected to be nearly double those of the slightly older Nano-ITX standard.

                                                                                                                          It appears that both Pico-ITX and Nano-ITX will have a place in the embedded motherboards market and both are important in offering customers a range of choices through the xITX family of form factors, but Pico-ITX is becoming more widely adopted in both suppliers’ product portfolios and by customers.

                                                                                                                          The competitiveness of VIA Technologies” own industry standard Pico-ITX form factor against that of 3d party ones (COM Express, QSeven and ETX) was well proven when just recently came the news that VIA Announces First Embedded ARM Based Pico-ITX Board, VIA VAB-800 [VIA Technologies press release, July 24, 2012]

                                                                                                                          Ultra low power ruggedized design ideal for a broad range of industrial and in-vehicle applications

                                                                                                                          VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-800 Pico-ITX embedded ARM board. Featuring a choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor, the VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications.
                                                                                                                          Based on the industry standard 10 cm x 7.2 cm Pico-ITX form factor created by VIA, the VIA VAB-800 Pico-ITX board combines a rich I/O set with superb multimedia performance, supporting playback of the most demanding video formats in resolutions up to 1080p. Leveraging VIA’s hardware design expertise, the VIA VAB-800 delivers the highest I/O integration on the Pico-ITX form factor for an ultra compact yet highly flexible platform for the latest embedded devices.
                                                                                                                          The extremely ruggedized VIA VAB-800 Pico-ITX supports a wide operating temperature range from -20 to 70 degrees Celsius in an ultra low TDP envelope of only 5W and is backed with a minimum seven years longevity support.
                                                                                                                          Customers can take advantage of VIA’s worldwide embedded software development expertise to quickly create customized designs for a fast time to market approach and is available as a hardware starter kit with board support packages (BSPs) for the Android, Ubuntu and Windows Embedded Compact 7 operating systems.
                                                                                                                          “The VIA VAB-800 extends our industry leading range of Pico-ITX embedded platforms,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “As a leader in hardware and software support, VIA can tailor our new ARM based offerings for customers to create systems through starter kits, customization support or offering complete systems for different applications.”

                                                                                                                          VIA VAB-800 Pico-ITX Based on the ultra compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA VAB-800 combines the choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor with two independent, fully integrated GPUs for a power efficient platform with a max TDP of a mere 5W. The two integrated GPUs provide support for dual independent displays along with 3D/2D graphics acceleration to deliver full HD playback support for the most demanding video formats in resolutions up to 1080p.

                                                                                                                          Rear I/O includes one Mini HDMI and one VGA display port, two USB ports and one 10/100 Ethernet port. On-board features include up to 64GB eMMC Flash memory, 1GB DDR3 SDRAM, support for one SATA port, two single channel LVDS display ports, two COM ports, CAN Bus, front pin headers for line-in/out and MIC-in, a further two USB 2.0 ports, an SDIO pin header and eight GPIOs.
                                                                                                                          For more information about the VIA VAB-800 Pico-ITX, please visit: http://www.viaembedded.com/en/products/boards/1930/1/VAB-800.html
                                                                                                                          For images related to this release, please visit: http://www.viagallery.com/Products/via-vab-800-pico-itx-board.aspx
                                                                                                                          Availability
                                                                                                                          Sample units of the VIA VAB-800 Pico-ITX board are available at the time of this release.

                                                                                                                          Embedded Computers / Compact: choosing an ARM or x86 processor in a SOC [SiliconNews (Spain), Oct 23, 2012] a raw translation by Google:

                                                                                                                          Cliff Moon, Senior Director of Product Marketing, VIA Technologies, reflects on the choices and challenges facing embedded systems designers. Embedded system designers are often caught by the CPU design choices they made ​​years ago, since switching costs can be astronomical. The development often involves hardware interface chips plate designs and specific processors. It is possible that the software switching costs are even higher still, since acquiring needed CPU architectures and development tools require custom software. However, some industry trends have opened CPU platforms , and system designers are increasingly able to mix and match CPU providers, or even modify the instruction set of the CPU, to optimize the products in a wider range of applications. As usual, the semiconductor integration technology trends drives, as more functions are included in fewer chips system. While many high-volume markets may end up by having a system on a chip (SOC), most embedded designs have unique requirements to which it responds best, an integrated processor connected to general purpose hardware components specific system design.To enjoy more flexibility in these low volume products, many system designers have turned to computer technology in a Module (COM) that allows a design with a single carrier plate to serve a variety products and facilitate rapid adoption of new technologies by CPU daughter cards based on standards. The trend towards higher levels of integration has advanced peripherals standardized regarding technology high-speed interconnect, allowing COM latest standards including multichannel PCI Express, SATA, Gigabit Ethernet, USB, HDMI and DisplayPort. COM interfaces have broad support from the industry and share technical characteristics for interconnection of packet-based high level, with a hardware abstraction layer above the layer bus architecture physical and link the past. Whether the data is processed with ARM or x86, as COM interfaces are connected to a standard data transferand are compatible with a variety of types of CPU. Most COM standards still include support for E / S for general use and allow some type PC functionality. Future trends point to greater uniformity If these trends continue in the sector in terms of semiconductor integration and abstraction of hardware / software, Where will we end up? Obviously integration possibilities end when the content of silicon is in a single chip.However, history has shown that every market integration peripherals and interfaces need slightly different. Only the highest-volume markets will have their own SOC, leaving most of the designs as currently integrated with a general purpose CPU and application specific hardware. While there may be some attempt by the industry to create a common package and pinout for suppliers of silicon integrated CPU, COM approach offers technical advantages and should have a greater adoption. Even if the silicon content of COM device is reduced to a single chip, the same semiconductor chip can be used for several different COM pinouts (similar to the multiple types of connectors on COM Express). In embedded applications reduced production, it is likely that greater flexibility to reuse designs providing a replaceable module remains the main factor that overcomes most of the advantages provided by a CPU soldered to the motherboard. Since the CPU will continue to be easily replaceable, the costs of change should continue to decline as standard interfaces have greater adoption and continue software abstraction. To avoid uniformity, CPU manufacturers will face increased pressure to develop new essential functions, while trying to beat the competitors in performance and power consumption. For designers of embedded systems, the prospects are excellent, as competition in the CPU sector will drive growth and provide opportunities to create entirely new types of products.

                                                                                                                          More on that: Computer-on-Modules: new standards allow more CPU options By J. Scott Gardner, Advantage Engineering LLC [Boards & Solutions Magazine, November 2011]

                                                                                                                          With the broad adoption of new standards, such as COM Express Rev. 2.0, embedded system designers have now been decoupled from the CPU-specific legacy interfaces.
                                                                                                                          … look no further than Kontron’s announcement of broad support for ARM processors. As the market leader in COM Express, Kontron has primarily supported CPUs from its strategic partner Intel. However, the industry trends have opened an opportunity for this company to supply COM boards incorporating ARM-based CPUs from Texas Instruments. The company has also announced broader support for COM Express boards with AMD CPUs. It will compete with dozens of other COM board suppliers offering standards-based support for CPUs from all three x86 CPU vendors. Many of these COM board suppliers already deliver ARM-based products using the Qseven COM standard to take advantage of a legacy-free architecture for mobile applications. While Intel still covers the widest range of features and performance, the growth of these COM standards allows system designers to tailor each product to incorporate the CPU module that delivers the best optimization of performance, power and cost. Intel will need to accelerate innovation to keep up with these new competitive threats.

                                                                                                                          With standards-based modules and competitive pressure from AMD, VIA and ARM, Intel has less ability to restrict features to higher-priced CPUs. In the past, an Intel-based embedded systems company would need to move up to a higher-priced Intel CPU (and chipset) to access features like faster memory, 64-bit processing, virtualization, advanced power management, hardware encryption, etc. Most of these features are designed into the CPU and then turned off to allow price separation. As long as most embedded systems companies remain based on Intel, the pricing strategy affects everyone equally. However, the industry trends are opening up every COM Express and Qseven socket to competition, and other CPU vendors may offer high-end features without charging the same premium as Intel. While VIA Technologies has supplied x86 CPUs to embedded markets for over a decade, its Nano architecture should be well-positioned to take advantage of the industry trends that reduce CPU switching costs and allow VIA to compete for COM Express and Qseven sockets. For VIA, the technical advantage stems from the ability to deliver high-performance features that are only available in high-end Intel CPUs.

                                                                                                                          As an example, Intel uses the Atom architecture to address price-sensitive embedded markets, while reserving Intel Core and Xeon processor families for higher-priced applications. However, the available Atom CPUs are currently limited to only 800 MHz memory, so VIA Nano-based systems have 33% more memory bandwidth using 1066 MHz memory. The Atom comparison is further strained by the difference in the microarchitecture, since Atom dual-issue, in-order architecture puts it at a disadvantage against VIA Nano 3-issue, out of-order design. While Intel has kept VIA Nano at bay by using dual-core and hyper-threading, the newest VIA CPUs offer both dual- and quad-core versions. VIA has published a white paper with SPEC CPU2000 results that show up to a 40% performance difference at the same thermal design power of 13 watts(http://www.via.com.tw/en/products/processors/nanoX2/whitepaper.jsp). To find an Intel based COM Express module that gets better performance than modules based on VIA Nano X2 or VIA QuadCore processors, a system designer would need to move up to Intel Core. However, the power consumption increases dramatically over Atom, unless the number of cores, clock rate and memory speed are constrained – reducing the performance advantage over the VIA-based module.
                                                                                                                          Hardware encryption has become one of the high-end features that Intel reserves for its premium CPUs. Intel supports encryptionthrough AES NI (new instructions), but the Intel embedded product list appears to only offer this feature for Core i5 and higher. From its earliest CPUs, VIA has promoted hardware encryption as a must-have feature and even had its Padlock implementation validated by the US National Institute of Standards and Technology (NIST). Hopefully, Intel support for hardware encryption will encourage more system designers to improve security features, since software-based techniques have been less secure and consumed too much power. Competitive pressure from VIA may help make hardware encryption a standard feature that Intel enables for all of its CPUs.

                                                                                                                          VIA System-on-Modules [VIA microsite, June 8, 2012] (SOM which actually is another name for the Computer-on-module concept)

                                                                                                                          Many products in the VIA Embedded portfolio employ a modular design strategy that allows our customers the freedom to easily customize and modify existing designs creating new and exciting devices in much faster design cycles, using fewer resources.

                                                                                                                          Features:

                                                                                                                          • COTS designs that can be tailored to specific requirements and applications
                                                                                                                          • Full breadth of CPU performance range including multi-core readiness
                                                                                                                          • Availability of starter kits, embedded APIs, tools, technical documentation and SDKs
                                                                                                                          • Optimized to address SWaP-C (Space, Weight, Power, and Cost) requirements
                                                                                                                          • Comprehensive supports of RTOS and GPOS

                                                                                                                          To understand COM Express go to Computer-on-Modules Industrial Group – Welcome to COM-IG! where you find the below illustration for the evolution of standards by this group:image >> nanoETXexpress now automatically redirects to COM Express microsite of PICMG >> COM Express Extension redirects to the same COM Express microsite of PICMG >> ETX Industrial Group to its own home page Note that the leading companies of that standardization were two large embedded companies (much larger that VIA Technologies) from Germany (Kontron) and Taiwan (Advantech), according to Advantech and Kontron unite to transform ETX®-IG into the COM-IG and unveil the COM Express Extension [joint press release, June 5, 2007]. VIA is still not a member of that effort.

                                                                                                                          COM Express® defines standardized footprints and pin-outs for Computer-on-Modules. With the new Revision 2.0, PICMG® added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are now integrated. The new Pin-out Type 10 in COM Express® Revision 2.0 supports perfectly modules in the ultra footprint (85×55 mm).

                                                                                                                          Kontron as one of the largest suppliers of embedded computing products has a well defined strategic view introduced in From Modules up to Application Ready Platforms [Boards & Solutions Magazine, November 2011] as:

                                                                                                                          The automotive industry set the example: vehicle manufacturers no longer have a large number of small suppliers for individual parts, but a small group of suppliers organized in partnerships. These deliver complete functional units and cover a large and growing spectrum of the supply chain. A similar concentration is taking place in outsourcing in the embedded computer industry, a trend that is happening at Kontron too.
                                                                                                                          According to the customer’s needs, the company offers services in the extended supply chain, i.e. from the module to the customerspecific carrier board right up to the application-ready system, including the necessary hardware-related software. Why are companies choosing to purchase larger and increasingly more valuable functional units from external sources? The answer is to be found in the growing pressure in the market to specialize.
                                                                                                                          OEMs have to focus on their core competence in order to stay competitive in their specific markets. For example: designing GUIs for HMIs. Neither the hardware running in the background, nor the operating system, reflects the core competence of the OEM. A userfriendly, function-safe operating and display concept are the USP of a company and the key to their economic success. Consequently this is where OEMs need to concentrate their development resources.
                                                                                                                          Rising end-user demands present a further reason for outsourcing the development of computer hardware, as the latest hardware is required to deliver powerful computing performance, improved energy efficiency, and all this housed in a space-saving form factor. On top of this there are high expectations in quality and price which are essential factors for success.
                                                                                                                          Companies not specialized in computing technology find it almost impossible to fulfil these demands within justifiable technical and commercial reason. In order to stay competitive, the move for OEMs to efficiently outsource the upstream supply chain processes is more or less inevitable.

                                                                                                                          Read also from that Magazine issue: – Taking the concept behind COM Express to high levels of ruggedizationThe benefits of COM-based single board computers

                                                                                                                          Recent discussions have debated the advantages of COMs, such as COM Express, versus stackable SBCs, such as PC/104. Here’s how to get the benefits of both at the same time.

                                                                                                                          Before we proceed further we should understand VIA Technologies’ view on that from Embedded Building Blocks – A Modular Approach [VIA Technologies presentation by Cliff Moon, Oct 11, 2011] (excerpts):

                                                                                                                          SFF (Small Form Factor) Market Trend ~ Modularized Designimage

                                                                                                                          Caveats for Stackable Computerimage

                                                                                                                          What is Computer-on-Module image

                                                                                                                          When to use

                                                                                                                          Stackable Computer

                                                                                                                          COM Express

                                                                                                                          • Applications demand different Standard I/O
                                                                                                                          • Fast Time to Market
                                                                                                                          • Modest QTY for Configuration-to-Order Service
                                                                                                                          • No board designers in house
                                                                                                                          • Existed design migration
                                                                                                                          • Cost-effective for EAUs for 1K to 5K
                                                                                                                          • For applications with unique I/Os (not popular I/O module)
                                                                                                                          • Near-perfect I/O optimization
                                                                                                                          • Board designer in house
                                                                                                                          • Consistent I/O and CPU upgradability(more than time to market)
                                                                                                                          • Protect the IP of the carrier board

                                                                                                                          Which approach is better?

                                                                                                                          • Stackable Computer are optimized for flexibility and I/O expandability
                                                                                                                          • COMs are optimized for cost, short height, CPU upgradeability, and minimal cabling
                                                                                                                          • COMs and Stackables will both continue – Very little overlap – distinct choices – ‘Capitalizing’ versus ‘Expensing’ a design (own/rent) – Business cost analysis becomes part of decision

                                                                                                                          image image See also head of VIA Embedded interviewed about Why VIA Embedded for COM Express Module [Embedded News TV, April 15, 2012] VIA introduced the externally defined COM form factors very cautiosly and very gradually:

                                                                                                                          1. COM Express

                                                                                                                          For background see: COM Express [Wikipedia] First for the COM Express Basic Form Factor:

                                                                                                                          VIA Moves into COM Express™ Embedded Module Market [VIA Technologies press release, April 14, 2008] which introduced the VIA C7 / VIA Eden based COME7N80 COM Express module:

                                                                                                                          VIA to introduce first COM Express™ modules with VIA processor platform, enabling cost effective, flexible customization and faster time to market

                                                                                                                          VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the extension of embedded board portfolio to include COM Express™ modules that will be the first to harness the power and thermal advantages of VIA’s processor platforms.
                                                                                                                          Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, graphics, and Ethernet, through board-to-board connectors to an I/O baseboard.
                                                                                                                          Leveraging VIA’s signature low heat, power-efficient platform silicon, the new fanless VIA COM Express modules will be powered by VIA Eden™ or VIA C7® processors ranging from 500MHz right up to 2GHz. Support for a comprehensive feature set of I/O implementations through VIA’s versatile digital media IGP chipsets, while the option of onboard system memory provides vibration resistance for in-vehicle or heavy plant environments.

                                                                                                                          VIA COM Express modules are targeted at industrial PC and large OEM customers focused on dynamic application segments, including gaming, healthcare and industrial automation. Customers can take advantage of a proprietary multi-I/O baseboard for evaluation purposes, or can utilize VIA’s extensive technical support in developing a custom baseboard.

                                                                                                                          “With over six years of experience in small form factor board design and development, our entry into the embedded module market is a natural evolution for us,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Flexible and modular solutions are an essential expansion of VIA’s embedded platform range, strengthening our commitment to all sectors of the embedded industry.”
                                                                                                                          The first samples of the VIA COM Express modules are available now for industrial PC and larger OEMs only; for more details, please send an email to the VIA Embedded team at: embedded@via.com.tw

                                                                                                                          The first Nano CPU COM Express module: VIA_COME8X801 The First Nano CPU COM Express module VIA Nano E-Series Processor Powers COM Express™ Module [VIA Technologies press release, Aug 4, 2010] which was the first Nano E-Series based COM Express module, still available in the portfolio

                                                                                                                          VIA expands COM Express module range with the VIA COME8X80, brings optimized 64-bit performance to COM Express with the VIA Nano E-Series processor

                                                                                                                          VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the addition of the VIA COME8X80 module to its COM Express™ portfolio; the world’s first COM Express type product to take advantage of the high performance, 64-bit VIA Nano E-Series processor.
                                                                                                                          “The VIA COME8X80 module harnesses the power of VIA Nano platform to offer a uniquely integrated and performance-optimized COM Express product,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COME8X80 also demonstrates our long-term commitment to bringing our leading processor technologies to the COM Express form factor.”
                                                                                                                          The VIA COME8X80 is targeted at IPC and larger OEM customers in a range of embedded segments including gaming, healthcare and industrial automation. Customers can also take advantage of a specially developed mutli-I/O baseboard for evaluation purposes, as well as VIA’s technical assistance in developing custom baseboard designs.

                                                                                                                          VIA COME8X80: Optimized Performance and Assured Longevity The VIA COME8X80 is available with a choice of either 1.3+GHz or 800MHz VIA Nano E-Series processors, combining native 64-bit and virtualization support with a high-performance superscalar architecture in a uniquely low power thermal envelope. The VIA COME8X80 also integrates the unified VIA VX800 media system processor, bringing VIA Chrome9 integrated graphics, support for VGA and dual channel LVDS displays, video acceleration for MPEG-2, MPEG-4, WMV9 and VC1 video formats, plus a VMR capable HD video processor. All VIA components have a guaranteed longevity of seven years. Product Highlights:

                                                                                                                          • High performance, 64-bit VIA Nano E-Series processor
                                                                                                                          • 18/24-bit dual channel LVDS plus VGA support
                                                                                                                          • 3 PCI, and one x4 plus two x1 PCIe slots
                                                                                                                          • Up to 2GB of DDR2 SO-DIMM memory
                                                                                                                          • 10/100Mbps Fast Ethernet
                                                                                                                          • Up to six USB 2.0 ports
                                                                                                                          • Up to two SATA devices plus 1 IDE
                                                                                                                          The VIA COME8X80 is available to OEM and ODM customers now. For more details including a technical data sheet, please go to: http://www.via.com.tw/en/products/embedded/ProductDetail.jsp?productLine=1&id=1271&tabs=1
                                                                                                                          An image kit related to this product announcement is available here: http://www.viagallery.com/index.php?option=com_flickr4j&Task=sets&Set=72157624643775464&Page=1
                                                                                                                          About the COM Express Form Factor
                                                                                                                          Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O baseboard.
                                                                                                                          VIA also offers the VIA C7 / VIA Eden based COME7N80 COM Express module [which is End Of Life already]. For more details please visit: http://www.via.com.tw/en/products/embedded/ProductDetail.jsp?productLine=1&id=1270&tabs=1

                                                                                                                          With Nano X2 E-Series came other COM Express additions: – in the COM Express Basic Form Factor: VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90 [VIA Technologies press release, Feb 24, 2012]

                                                                                                                          Join VIA at Embedded World 2012 for the first glimpse of the VIA COMe-8X90 module

                                                                                                                          VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2GHz VIA Nano™ X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.
                                                                                                                          Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.
                                                                                                                          Along with the VIA COMe-8X90 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.

                                                                                                                          “Embedded modules are ideal for creating highly tailored solutions with a short time to market approach,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COMe-8X90 module provides customers with an easily customizable platform with power efficient processing and rich I/O options, allowing them to quickly create optimized products for their target markets.”

                                                                                                                          The VIA COMe-8X90 module will be on display at the VIA Embedded booth in Hall 1 of the Embedded World 2012 Exhibition and Conference, which is being held in Nuremberg, Germany from February 28th to March 1st, 2012. In addition, VIA will be presenting the latest embedded Android and x86 multi-core solutions for next generation embedded applications.

                                                                                                                          VIA COMe-8X90 Module Available in the industry standard COM Express form factor of 95mm x 125mm, the VIA COMe-8X90 module includes a 1.2GHz VIA Nano X2 E-Series dual core processor and a VIA VX900H MSP, which features the VIA ChromotionHD 2.0 video engine, boasting hardware acceleration of the most demanding video formats, including MPEG-4, H.264, MPEG-2, VC-1, WMV and Blu-ray support, for incredibly smooth playback of multimedia titles at resolutions up to 1080p. The VIA COMe-8X90 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS, VGA, Display Port and HDMI.

                                                                                                                          Onboard I/O includes two SATA II ports, one GigaLAN port, one USB client port, four USB 2.0 ports, SDIO, expansion buses for one PCIe X4 and one PCIe x1 and the VIA Labs VL800 USB 3.0 host controller which offers support for four USB 3.0 ports. System memory support includes two slots for up to 8GB of SODIMM DDR3 RAM.
                                                                                                                          For more information about the VIA COMe-8X90 module please visit: http://www.viaembedded.com/en/products/boards/productDetail.jsp?productLine=1&id=1571&tabs=1
                                                                                                                          For images related to this release please visit: http://www.viagallery.com/index.php?option=com_flickr4j&Task=sets&Set=72157629433520789&Page=1

                                                                                                                          – in the COM Express Compact Form Factor: VIA Announces Two New System-on-Module Solutions to the Growing VIA Modular Solutions Portfolio [VIA Technologies press release, March 22, 2012]

                                                                                                                          VIA COMe-8X92 and QSM-8Q90 modules allow for rapid development and application-specific customization

                                                                                                                          Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). The VIA COMe-8X92 module combines a 1.2GHz VIA Nano™ X2 E-Series dual core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.
                                                                                                                          “The modular approach offers Embedded customers the ideal platform for creating highly tailored solutions with a short time to market approach,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COMe-8X92 and VIA QSM-8Q90 modules further extend the VIA modular solution portfolio offering VIA customers a wider range of options to quickly create optimized products for their target markets.”

                                                                                                                          VIA COMe-8X92 Module Available in the industry standard COM Express Compact form factor of 95mm x 95mm, the VIA COMe-8X92 module pairs a 1.2GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H MSP, which features the VIA ChromotionHD 2.0 video engine, boasting hardware acceleration of the most demanding video formats, including MPEG-4, H.264, MPEG-2, VC-1, WMV and Blu-ray support, for incredibly smooth playback of multimedia titles at resolutions up to 1080p. The VIA COMe-8X92 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS, VGA, Display Port and HDMI.

                                                                                                                          Onboard I/O includes two SATA II ports, one GigaLAN port, one USB client port (shared with one of four USB 2.0 ports), four USB 2.0 ports, SDIO, expansion buses for one PCIe X4 and one PCIe x1 and the VIA Labs VL800 USB 3.0 host controller which offers support for four USB 3.0 ports. System memory support includes one slot for up to 4GB of SODIMM DDR3 RAM.
                                                                                                                          For more information about the VIA COMe-8X92 module please visit: http://www.viaembedded.com/en/products/boards/productDetail.jsp?productLine=1&id=1790&tabs=1
                                                                                                                          For images related to the VIA COMe-8X92 please visit: http://www.viagallery.com/index.php?option=com_flickr4j&Task=sets&Set=72157629588824145&Page=1

                                                                                                                          – in the COM Express Mini Form Factor: VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91 [VIA Technologies press release, May 3, 2012] VIA_COMe-8X91_Angle

                                                                                                                          Credit-card sized COM module allows for rapid development of ultra-small customized embedded solutions

                                                                                                                          VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.
                                                                                                                          Measuring 84mm x 55mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA Eden™ X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.
                                                                                                                          In addition, with the VIA COMe-8X91 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.
                                                                                                                          “The COM Express Mini form factor provides embedded customers the ideal platform for creating highly tailored solutions where real estate is at a premium,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COMe-8X91 delivers an extremely ruggedized, power efficient solution for the creation of ultra compact embedded devices with a short time to market approach.”

                                                                                                                          VIA COMe-8X91 Module Available in the industry standard COM Express Mini form factor of 84mm x 55mm, the VIA COMe-8X91 module pairs an 800MHz VIA Eden X2 dual core processor and the VIA VX900 MSP for a low power, high performance platform. The VIA COMe-8X91 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS and either one displayport or one HDMI port (without HDCP).

                                                                                                                          Onboard I/O includes two SATA II ports, one GigaLAN port, eight USB 2.0 ports shared with one USB client port, one HD audio digital interface and two serial ports. System memory includes 1GB of onboard DDR3.
                                                                                                                          For more information about the VIA COMe-8X91 module please visit: http://www.viaembedded.com/en/products/boards/productDetail.jsp?productLine=1&id=1710&tabs=1
                                                                                                                          For images related to the VIA COMe-8X91 please visit: http://www.viagallery.com/Products/via-come-8×91-module.aspx

                                                                                                                          2. QSeven

                                                                                                                          Note: QSeven is a new standard that has been released in the past two years. The Q Seven specification is hosted by the independent Q Seven Consortium of which VIA Technologies is a supporting member. It is freely available at the consortium’s web site. Q Seven is a computer-on-module small form factor board that can be used much like an integrated circuit component. It is smaller than other computer-on-module standards such as COM Express, ETX or XTX and is limited to very low power consuming CPUs. The idea here is that processor boards and IO boards would slide into a backplane via edge connectors. This is a smaller footprint than the traditional 3U cPCI.

                                                                                                                          Seco Q7 OMAP4 dual-core module [Charbax YouTube channel, Jan 6, 2011]

                                                                                                                          This is the first OMAP4430 dual-core module for the embedded form factor market for the industrial environment for the mobile and automotive markets. Thanks to Seco’s pression on the q7 consortium, people can now swap the x86 module for an ARM architecture, it works for Windows, Android and Linux OS. Find more information at http://www.seco.it/

                                                                                                                          SECO QSeven products: An interview with Gianluca Venere at Embedded World 2012 [SECOEmbedded YouTube channel, March 30, 2012]

                                                                                                                          Gianluca Venere presents the newest Qseven products. QSeven has been launched 3 years ago as the first cross platform and modular solution that uses the same carrier board for two different architectures. New Qseven products include: Carma DevKit, the new Freescale i.MX6 processor Qseven module and module based on TI OMAP4 and for the x86 world, the new module based on AMD Qseven G series APUs. http://www.seco.com/en/itemlist/qseven/

                                                                                                                          QSeven® Series [VIA Technologies sub microsite]

                                                                                                                          With advantages of its compact size, integrated thermal solution and low cost connectors, VIA QSeven is the ideal for building block for various low power and mobile application. VIA QSeven series is a small form factor standard that is designed for low-power and mobility applications. It supports up to 12W of maximum delivered power and provides legacy free interfaces for embedded applications along with a comprehensive set of graphical interfaces such as DisplayPort, HDMI and dual channel LVDS.

                                                                                                                          See also: QSeven [Wikipedia] Image of the VIA QSM-8Q90 module on carrier board with QSeven Logo: VIA_QSM_8Q90_Module_on_Carrier_Board_with_QSeven_Logo VIA_QSM_8Q90_Module_with_QSeven_Logo Image of the VIA QSM-8Q90 module with QSeven Logo. VIA Announces Two New System-on-Module Solutions to the Growing VIA Modular Solutions Portfolio [VIA Technologies press release, March 22, 2012]

                                                                                                                          VIA COMe-8X92 and QSM-8Q90 modules allow for rapid development and application-specific customization

                                                                                                                          The VIA QSM-8Q90 module measures just 70mm x 70mm and is based on the new embedded QSeven™ form factor developed to meet the demands of various low-power and mobile applications. Featuring a VIA 1.0GHz VIA Nano E-Series processor and the VIA VX900 MSP, the VIA QSM-8Q90 module is the ideal building block for power constrained handheld application segments, including medical, advanced gaming, military and test and measurement equipment.
                                                                                                                          “The modular approach offers Embedded customers the ideal platform for creating highly tailored solutions with a short time to market approach,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COMe-8X92 and VIA QSM-8Q90 modules further extend the VIA modular solution portfolio offering VIA customers a wider range of options to quickly create optimized products for their target markets.”

                                                                                                                          VIA QSM-8Q90 Module Based on the new QSeven embedded form factor of 70mm x 70mm, the VIA QSM-8Q90 module is available with a 1.0GHz VIA Nano E-Series processor and also integrates the unified VIA VX900 media system processor, featuring the VIA ChromotionHD 2.0 video engine which boasts hardware acceleration of the most demanding video formats for incredibly smooth playback. On board system memory includes 1GB of DDR3 RAM as well as support for two 1-lane PCIe expansion and an18/24-bit LVDS connector with resolutions up to 1366 x 768.

                                                                                                                          For more information about the VIA QSM-8Q90 module, please visit: http://www.viaembedded.com/en/products/boards/productDetail.jsp?productLine=1&id=1572&tabs=1
                                                                                                                          For images of the VIA QSM-8Q90 module, please visit: http://www.viagallery.com/index.php?option=com_flickr4j&Task=sets&Set=72157629616539713&Page=1

                                                                                                                          3. ETX

                                                                                                                          From ETX-8X90:

                                                                                                                          Measuring 114mm x 95mm, ETX (Embedded Technology eXtended) is a highly integrated and compact industry standard computer-on-module form factor used in design application much like an integrated circuit component. The ETX specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O baseboard. Targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, test and measurement, industrial automation and transportation, customers can take advantage of a proprietary start-up kit including a multi-I/O baseboard reference, or can utilize VIA’s extensive technical support in developing a custom baseboard.

                                                                                                                          IA Announces First ETX® Module, VIA ETX-8X90 [VIA Technologies press release, March 22, 2012]

                                                                                                                          Industry leading performance and VxWorks RTOS support for embedded applications VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ETX-8X90 module which features a 1.2GHz VIA Nano™ X2 E-Series dual core processor and the VIA VX900 media system processor (MSP), providing industry leading performance in a power efficient design. The VIA ETX-8X90 module provides a highly integrated and compact platform for embedded applications in medical, test and measurement, industrial automation and transportation. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles enabling customers to rapidly develop new and innovative devices. Customers can take advantage of a proprietary start-up kit including a multi-I/O baseboard reference, or can utilize extensive technical support from VIA in developing a custom baseboard. In addition to support for the embedded industry leading VxWorks RTOS, the VIA ETX-8X90 runs a wide range of Windows and Linux based operating systems. “We continue to broaden the range of our Computer-on-Module portfolio with the addition of the ETX legacy form factor,” said Epan Wu Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA ETX-8X90 module provides industry leading processing performance in the shape of the VIA Nano X2 E processor allowing existing ETX customers to quickly scale to today’s requirements.” About the VIA ETX-8X90 Module Measuring 114mm x 95mm, the VIA ETX-8X90 module is based on the industry standard ETX (Embedded Technology eXtended) legacy form factor and combines a 1.2GHz VIA Nano X2 E-Series dual core processor with the VIA VX900 MSP, providing hardware acceleration of the most demanding video formats including VC1, WMV9, MPEG-2 and H.264.

                                                                                                                          The VIA ETX-8X90 offers support for up to 4GB of DDR3 memory as well as the latest display connectivity standards including 18/24-bit dual-channel LVDS, one VGA port with resolutions up to 2560 x 1600, four USB 2.0 and two mini USB ports, two PCI and one ISA bus, one SATA port, one IDE and two COM ports as well as one 10/100 Ethernet on module.
                                                                                                                          For more information on the VIA ETX-8X90, please visit: http://www.viaembedded.com/en/products/systemonmodules/1970/1/ETX-8X90.html
                                                                                                                          For images related to this release, please visit: http://www.viagallery.com/Products/via-etx-8×90-module.aspx

                                                                                                                          For background see: ETX (form factor) [Wikipedia] And finally an Embedded World Report: SGet receives mixed reactions [EmbeddedNews.co.uk, April 18, 2012] is showing how further standardization for ARM-based embedded solutions is proceeding:

                                                                                                                          As reported in the past three issue of Micro Technology Europe, the new European standards body was formally introduced and dominated the front page of the first show daily. Called the Standardisation Group for Embedded Technologies (SGet), reaction to it was a little mixed. Some felt that they had to be on board, while others were being more cautious and there were those who were not interested at all. In the last of those categories fell Taiwanese board make Aaeon. “We are not involved with SGet yet,” said Volkmar Kaufmann, sales team manager at Aaeon. “In the embedded market there are hundreds of standards, so are they standards really?” On top of that, he said, customers wanted customisation and this meant that the standards were not really standards but more of a reference. “So one reason we haven’t joined is we are talking with our customers to find the best solution and that may be based on a standard or it may not be,” he said. “They will want connectors in different positions and so on. There are so many different requirements from customers who demand their own solutions. They don’t care what the standard is, they just want it to do what they want. They just want the performance.” But Dirk Finstel, chief technology officer for Kontron, one of the founders of SGet, defended the organisation: “It always takes three to four years to make something an official standard,” he said. “Our customers ask why this takes so long. The embedded board vendors are trying to drive technology in the market and with the new body we can do that with less bureaucracy.” Howard Lin, European managing director for Advantech, one of the first companies to join the group, acknowledged that there were a lot of standards already in the market, but said that was a reflection of the speed in which technology was developing. “Yes, there are many standards today, but these follow the new technology,” said Lin. “Some of the older standard can’t follow the changing technology, se we need new standards. The pace is increasing and we need to increase the pace of standards.” He said Advantech decided to join the group because “we are a global leader and so we should work with other vendors to define the standards”. Q Seven will be one of the first form factors to go through the SGet standardisation process and this will be followed by ULP-Com, a form factor for Arm and SoC modules announced by Kontron at the show. Adlink has already shown support for the form factor as have Fortec and Greenbase. ULP-Com uses a 314-pin connector and is 413mm high. There are two planned module footprints of 82 by 50mm and 82 by 80mm. Finstel said he expected it to take two to three months for the standard to be ratified by SGet. “Only a few people will work on the specification to drive it rather than with Picmgwhere you have a lot of people all with their own interests,” he said. “We expect ULP-Com to be ratified by the end of April.” Another founder, Congatec, was also ready to defend the decision. The company’s Christian Eder said: “Why do we need a new consortium when there is Picmg, Vita and what not? With Picmg, things take forever with lots of politics involved and interests. We are trying to freshen that up.” He said ten to 15 companies had signed upby the start of the show and expected that to grow as the show progressed. As to the silicon vendors, he said he wanted them to be involved but did not want them having such an influence that standards would be based on particular products. “It is very important to have the silicon vendors in there,” he said. “They provide the technology. But we don’t want standards that are fixed to one chip vendor. We want it open.” He said that chip vendors, like connector companies, would be on board but would not have voting rights. “Otherwise, they could block directives,” he said. Bernhard Andretzky, product marketing manager for one of the group’s founding companies MSC, said: “We see potential for the new organisation to create the standards that will be successful in the future.” Though not one of the founders, Adlink has become involved with SGet following its joint work with Kontron on the ULP-Com specification. “We were looking for the right form factor for Arm designs,” said Henk van Bremen, Adlink’s product director. “They say you can do Arm and x86 on Q Seven, but it doesn’t really work because of the lack of pins. You can’t do all the native Arm interfaces. The new form factor is going to SGet, which is why we are interested in this and have joined.” As for Via Technologies, assistant vice president Epan Wu said: “We have someone looking at the SGet consortium. We are not one of the original ones but we are looking at it and we do want to comply with industry standards and be involved with what is going on.” And Taylor Chow, managing director of Portwell, said: “We are seriously thinking of joining SGet. We need SGet because of the problems with Q Seven for Arm.”

                                                                                                                          From more information see: – http://www.sget.org/ and its Facebook siteA New COM Standard and a New Organization to Oversee It [VDC Research: Embedded Microprocessor, Board & Systems Market Blog, Sept 11, 2012] Kontron Low Power Embedded Solutions – EW 2012 [ARMflix YouTube channel, Feb 29, 2012]

                                                                                                                          Norbert Hauser of Kontron tell us about their ultra low power embedded solutions and support of various operating systems.

                                                                                                                          Kontron ULP-COM: the new ARM Computer-on-Modules Standard [KontronVideos YouTube channel, Sept 25, 2012]

                                                                                                                          The Ultra Low Power Computer-on-Modules with no moving parts are a perfect solution for small, mobile and fan less ARM applications. The form factor has a size of 82x50mm and, with the MXM 3.0 connector, a design less than 7 mm height with Memory and Flash Storage onboard is given.

                                                                                                                          Urgent search for an Intel savior

                                                                                                                          Update: Third-generation ultrabooks may be able to achieve 40% of notebook shipments, say players [DIGITIMES, Dec 11, 2012]

                                                                                                                          As Intel failed to achieve its goal of having ultrabooks account for 40% of total notebook shipments with its Ivy Bridge platform, and the proportion only reached about 10%, sources from notebook players believe the goal may be achievable with the upcoming Haswell platform, which is set to launch at the end of second-quarter, 2013.

                                                                                                                          The sources pointed out that compared to Ivy Bridge, Haswell’s stronger performance and cheaper price, plus the expectation that Windows 8 should become more standardized by then, should mean ultrabooks have a chance to account for 40% of total notebook shipments by the end of 2013.
                                                                                                                          Although vendors have released ultra-like notebooks with prices around US$699-899 as alternatives, since these devices lack attractiveness in terms of design and weight, while ultrabook models with specifications similar to the MacBook Air have prices a lot higher than the MacBook Air, most consumers have turned to purchase Apple’s product instead, the sources noted.

                                                                                                                          Chips are down for Intel’s CEO [Euronews YouTube channel, Nov 19, 2012]

                                                                                                                          The head of the computer chip giant Intel is to retire next year. Paul Ottelini has been CEO since 2005. The company that dominates personal computers has been struggling recently, mainly due to the consumer’s new love-affair with smart-phones and tablets, technology where Britain’s ARM Holdings is king. Intel, which is known for finding chief execs from within the company, said they would also consider external candidates.

                                                                                                                          After what I’ve described in Steven Sinofsky, ex Microsoft: The victim of an extremely complex web of the “western world” high-tech interests [Nov 13, 2012], Intel Haswell: “Mobile computing is not limited to tiny, low-performing devices” [Nov 15, 2012] and Boosting both the commodity and premium brand markets in 2013 with much more smartphones and tablets while the Windows notebook shipments will shrink by 2% [Nov 20, 2012] the news that Intel has an urgent need to find a new CEO is not a surprise for me at all.

                                                                                                                          Quite obviously Intel’s long-time business model suddenly looks like as unsustainable for the year 2013 (which also happens to be its fiscal year) not only for me as:
                                                                                                                          From: Intel CEO Paul Otellini to Retire in May [Intel press release, Nov 19, 2012]

                                                                                                                          … Paul Otellini, has decided to retire as an officer and director at the company’s annual stockholders’ meeting in May, starting an orderly leadership transition over the next six months. …

                                                                                                                          The board of directors will conduct the process to choose Otellini’s successor and will consider internal and external candidates for the job.

                                                                                                                          In addition, the company also announced that the board has approved the promotion of three senior leaders to the position of executive vice president: Renee James, head of Intel’s software business; Brian Krzanich, chief operating officer and head of worldwide manufacturing; and Stacy Smith, chief financial officer and director of corporate strategy.

                                                                                                                          From: Intel Corporation Hoped Otellini Would Stay Another Year As CEO [ValueWalk, Nov 20, 2012]

                                                                                                                          Andy Bryant, chairman of the board of Intel Corporation (NASDAQ:INTC) hoped Paul Otellini could stay one more year as chief executive officer (CEO) of the company. During an Interview with Barron’s yesterday, Bryant admitted that he was surprised last week when Otellini  told him that he will retire by May next year.

                                                                                                                          “I did everything I can think of to buy myself another year [of Otellini’s leaderhip]. We were targeting further out for this,” said Bryant.

                                                                                                                          During the interview with Barron’s, Bryant said the mobile market is still a big challenge for the company. According to him,”After almost 40 years at Intel, and the Intel CEO job for 8 years, which is a really hard job, he felt it was time to move to the next generation of leadership. We do have big issues in front of us, moving to the tablet and phone markets, and he was ready to let the next generation lead those battles.”

                                                                                                                          According to him, finding a replacement for Otellini is another challenge. Intel will search for the next CEO inside and outside the company. He is considering five senior executives as candidates for the position, including Renee James, the head of software; Brian Krzanich, head of manufacturing; Stacy Smith, chief financial officer; Dadi Perlmutter, head of mobile efforts; and Arvind Sodhani, president of Intel Capital.

                                                                                                                          Ambrish Srivastava, PhD, an analyst at BMO, said it is interesting to know that Intel is willing to hire a CEO outside the company, since the company has a deep rooted internal culture, few came from outside and succeeded.

                                                                                                                          There was an immediate negative response on the stock market showing that even without any meaningful explanations given by either board or Otellini himself the outlook for Intel turned into a one with less expectations about future performance:

                                                                                                                          image

                                                                                                                          And this was only “due to uncertainty with the CEO transition” as was explained by UBS after Intel was downgraded from a “Buy” to “Neutral” by it

                                                                                                                          There is nevertheless much more behind of this sudden change, as even Intel’s Q3 report had a few question marks hanging in the air, more notably:
                                                                                                                          From: CFO Commentary on Third-Quarter 2012 Results [Intel, Oct 16, 2012]

                                                                                                                          Q4 2012 Outlook

                                                                                                                          Revenue

                                                                                                                          Revenue is expected to be $13.6B, plus or minus $500M in the fourth quarter. The midpoint of this range would be an increase of 1% from the third quarter. This slight increase in revenue in the fourth quarter reflects the caution we are seeing in the order patterns of our customers as a result of concerns about the global economic environment, ongoing consumer softness in mature markets, and a slowing enterprise market segment.

                                                                                                                          Gross Margin

                                                                                                                          Gross margin in the fourth quarter is expected to be 57%, plus or minus a couple points, down 6.3 points from the third quarter. In response to the reductions in our demand forecast we are significantly reducing factory loadings in the fourth quarter, resulting in a forecast of approximately $500M in underutilization charges.

                                                                                                                          Related information from: Intel Corporation’s CEO Discusses Q3 2012 Results – Earnings Call Transcript [Oct 16, 2012]

                                                                                                                          JoAnne Feeney – Longbow Research

                                                                                                                          And then as a follow-up, Stacy could you let us know what happened with units versus ASPs in PCs versus servers last quarter?

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          Yeah, it’s actually in the CFO commentary JoAnne, but in general we saw PC units up 1% versus the prior quarter and datacenter units were also up 1%. This is a quarter-on-quarter compare.

                                                                                                                          JoAnne Feeney – Longbow Research

                                                                                                                          Sorry, and the ASPs?

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          The PC ASPs were down 1% and the server ASPs were down 7% based on the mix kind of things that I have been talking about.

                                                                                                                          And in the Q&A part of that call Otellini himself said that:

                                                                                                                          … we do believe that when the numbers are all in, the PC consumption did grow in Q3 at about half the normal seasonal rate and will also grow in Q4 about half the normal seasonal rate. How much of that happening is macroeconomic versus the timing of the Windows 8 builds and the share of wallet, war for tablets versus PCs is TBD, and we’ll know a lot more about that 90 days from now after the Windows 8 launch, after we see Intel based tablets start shipping, when people start playing with the operating system and have all the touch based Ultrabooks out there. We’ll know a lot more. So we’ll try to quantify that a bit more for you in 90 days, but right now it’s a bit of each. …

                                                                                                                          I was just in China a week and a half ago, so there is a fairly current view. I see the same situation. China as a manufacturing center is reflecting the comments that we had in our commentary which is that the OEMs are being very cautious with their inventory comments at this point in time for all the reasons we’ve discussed and it’s as lean as we’ve seen it in normal times without the shortage of let’s say their hard drives of last year.

                                                                                                                          In terms of the channel inventory, there really isn’t very much. I went into Tier 3 city, you don’t see things stocked up or sacked up on pallet and stuff. People are generally — I think most of our customers worldwide spent a lot of Q3 thinning out their Windows 7 inventory, so they wouldn’t have an overhang at the launch. And that accounts for a lot of this inventory shipped of our billings versus the consumption that we’ve been talking about. And now with the launch of Windows 8 coming in a week or so, you’ll see a new round of build and hopefully consumption.

                                                                                                                          In terms of demand stimulation, a lot of what we are doing is really to make sure that the feature set of this season’s Ultrabooks are really consistent with where the market is, that’s why we’ve been so focused on working with our customers and the ecosystem just, for example, bring the touch SKUs in. So six to eight months ago that we did not have line of sight to 40 out of a 140 SKUs of Ultrabooks being touch enabled, it was probably five or 10; we are up to 40 now, and that’s just going to get bigger as we go into 2013. So working with the vendors and the glass manufacturers to bring the cost of touch as an increment down has been one of the key things we think we can do to drive demand.

                                                                                                                          The inventory, I thing is straight forward. The work-in-process and finished goods that we’re expecting to come down over this quarter are our Ivy Bridge products which is the mainstream high-end product we have today. And as the market picks up, Windows 8 launches, Ultrabooks pick up and so forth then that just consumes that inventory. And as I said earlier, in my comments and Stacy’s, our OEMs are running very lean right now. So any kind of demand blip would cause us to be able to reduce that even more perhaps.

                                                                                                                          In terms of the mix, there is really not much more to add than we put in our pre-release and in the comments today which is that the U.S. and Western Europe PC markets remained soft in terms of consumers. The change that we have seen and we talked about at the pre-announcement was that the enterprise PC market has gone relatively flat now and I think that’s just a reflection of large corporations making hard decisions on CapEx versus people, and where they want to put their investments and now that seems to have spilled over from the client side of the enterprise also the data center server part of the enterprise. And you know I think we will see how that sorts out over the next quarter or so as CEOs and CIOs make their next round of decisions.

                                                                                                                          In terms of China, the slowdown there was – it’s principally a notebook business and the slowdown there was in consumer notebooks.

                                                                                                                          China is in their own macroeconomic cycle slowing down, I mean the GDP forecast for the year have come down for next have come down. There is also a reasonable amount of anxiety around the change in government and that tends to put a little bit of nervousness into the system and what I don’t know is how much of that clarifies after they change, because it’s not so much they don’t know who is coming in. The issue is what are the policies, in terms of stimulus and taxation and so forth. They have been pretty generous the last year or so, a year or two rather, in terms of stimulating domestic consumption and the question is will those polices continue or not.

                                                                                                                          This earlier information given by Otellini himself and the current “supply chain” point of view collected in my post Boosting both the commodity and premium brand markets in 2013 with much more smartphones and tablets while the Windows notebook shipments will shrink by 2% [Nov 20, 2012] are definitely pointing to the following true reasons behind Otellini’s sudden departure, as reported by just very few media sources only:
                                                                                                                          Otellini Exits Intel, With Windows 8 Fate Uncertain [InformationWeek, Nov 20, 2012]
                                                                                                                          Intel chief logs off as rest of the world leaves PCs behind [The Times, Nov 20, 2012]
                                                                                                                          ‘Old hands lack skills to lead Intel into mobile age’ [Bloomberg via BusinessReport, Nov 21, 2012]
                                                                                                                          Intel CEO Paul Otellini to leave company in major shake-up [Computeractive, Nov 20, 2012]

                                                                                                                          And here is a quite sarcastic but also quite true reporting:
                                                                                                                          While the Intel board was firing Paul Otellini they should have fired themselves, too [Cringely on technology, Nov 20, 2012]

                                                                                                                          So in reality it is an absolutely inevitable thing what is going now with Intel. Here is the only video comment properly reflecting that:
                                                                                                                          Intel Could Use CEO With Mobile Skills, Wang Says [Bloomberg YouTube channel, Nov 20, 2012]

                                                                                                                          Nov. 20 (Bloomberg) — Patrick Wang, an analyst at Evercore Partners Inc., talks about Intel Corp. Chief Executive Officer Paul Otellini’s plan to retire in May and the outlook for his replacement. Wang speaks with Jon Erlichman, Pimm Fox and Stephanie Ruhle on Bloomberg Television’s “Market Makers.” (Source: Bloomberg)

                                                                                                                           

                                                                                                                          Background information in the full:

                                                                                                                          Intel CEO Paul Otellini to Retire in May [Intel press release, Nov 19, 2012]

                                                                                                                          Intel Corporation today announced that the company’s president and CEO, Paul Otellini, has decided to retire as an officer and director at the company’s annual stockholders’ meeting in May, starting an orderly leadership transition over the next six months. Otellini’s decision to retire will bring to a close a remarkable career of nearly 40 years of continuous service to the company and its stockholders.

                                                                                                                          “Paul Otellini has been a very strong leader, only the fifth CEO in the company’s great 45-year history, and one who has managed the company through challenging times and market transitions,” said Andy Bryant, chairman of the board. “The board is grateful for his innumerable contributions to the company and his distinguished tenure as CEO over the last eight years.”

                                                                                                                          “I’ve been privileged to lead one of the world’s greatest companies,” Otellini said. “After almost four decades with the company and eight years as CEO, it’s time to move on and transfer Intel’s helm to a new generation of leadership. I look forward to working with Andy, the board and the management team during the six-month transition period, and to being available as an advisor to management after retiring as CEO.”

                                                                                                                          The board of directors will conduct the process to choose Otellini’s successor and will consider internal and external candidates for the job.

                                                                                                                          In addition, the company also announced that the board has approved the promotion of three senior leaders to the position of executive vice president: Renee James, head of Intel’s software business; Brian Krzanich, chief operating officer and head of worldwide manufacturing; and Stacy Smith, chief financial officer and director of corporate strategy.

                                                                                                                          During Otellini’s tenure as CEO — from the second quarter of 2005 through the third quarter of 2012 — Intel:

                                                                                                                          • Generated cash from operations of $107 billion
                                                                                                                          • Made $23.5 billion in dividend payments
                                                                                                                          • Increased the quarterly dividend 181 percent from $0.08 to $0.225

                                                                                                                          From the end of 2005 through the end of 2011, Intel achieved record revenue and net income. During this period, annual revenue grew from $38.8 billion to $54 billion, while annual earnings-per-share grew from $1.40 to $2.39.

                                                                                                                          In addition to financial performance, Intel, under Otellini’s leadership, achieved notable successes in areas of strategic importance. During this period, the company:

                                                                                                                          • Transformed operations and the cost structure for long-term growth
                                                                                                                          • Achieved breakthrough innovations, including High-K/Metal gate and now 3-D Tri-gate transistors; and dramatic improvement in energy efficiency of Intel processors
                                                                                                                          • Reinvented the PC with Ultrabook™ devices
                                                                                                                          • Greatly expanded business partnerships and made strategic acquisitions that expanded Intel’s presence in security, software and mobile communications
                                                                                                                          • Delivered the first smartphones and tablets for sale with Intel inside
                                                                                                                          • Grew the vast network of cloud-based computing built on Intel products

                                                                                                                          Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available atnewsroom.intel.com and blogs.intel.com.

                                                                                                                          Intel, the Intel logo and Ultrabook are trademarks of Intel Corporation in the United States and other countries.

                                                                                                                          *Other names and brands may be claimed as the property of others.

                                                                                                                          Intel Corporation’s CEO Discusses Q3 2012 Results – Earnings Call Transcript [Oct 16, 2012]

                                                                                                                          In the coming months consumers will see tremendous form factor and industrial design innovation. There will be more than 140 Core based Ultrabooks, more than 40 of which will have touch. This will include more than a dozen convertibles that combine the productivity of the laptop with the convenience of a tablet.

                                                                                                                          Many of the Ultrabook SKUs will hit the mainstream $699 price point with some Burst SKUs well below even that number. Q4 will see more than 20 Atom based tablets from six or more leading OEMs using Clover Trail. Clover Trail is a brand new SoC that will enable tablets as thin as 8.5 millimeters and as light as 1.5 pounds.

                                                                                                                          With three weeks of connected standby battery life and all of the compatibility that Windows users and Intel customers have come to expect, I am excited about the these products and the capabilities they bring to consumers and the enterprise.

                                                                                                                          Last month at IDF, we shared details of our next-generation Core processor codenamed Haswell. Originally targeted at 15 watts, we have made significant advancements in micro-architecture and process technology that will allow us to move Haswell down into the 10 watt envelope fostering even more innovation in form factor as well as new usage models like gesture computing and voice recognition.

                                                                                                                          John Pitzer – Credit Suisse

                                                                                                                          Paul, how do you assess how much of what’s going on in the PC market right now; is macro, timing of Windows 8 versus kind of the more structural bearish view that tablets and smartphones are just plain and simple eating into PC TAM. How do you think about those dynamics?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          I think it’s a bit of each and I would be reticent to quantify it John. Clearly, we saw a softening in the consumer segments. We talked about that when we did the pre-announcement about a month ago and the surprise there was that China which had been very strong in those current week on us on top of continuing weakness in the mature markets of U.S. and Western Europe.

                                                                                                                          However, having said that, we do believe that when the numbers are all in, the PC consumption did grow in Q3 at about half the normal seasonal rate and will also grow in Q4 about half the normal seasonal rate. How much of that happening is macroeconomic versus the timing of the Windows 8 builds and the share of wallet, war for tablets versus PCs is TBD, and we’ll know a lot more about that 90 days from now after the Windows 8 launch, after we see Intel based tablets start shipping, when people start playing with the operating system and have all the touch based Ultrabooks out there. We’ll know a lot more. So we’ll try to quantify that a bit more for you in 90 days, but right now it’s a bit of each.

                                                                                                                          David Wong – Wells Fargo

                                                                                                                          Thanks very much. You commented on Clover Trail tablet; are you seeing many Ivy Bridge tablet designs in addition to the Microsoft Surface and can you give us some idea of how many tablet makers you are currently working with on Haswell tablets for the future?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          I can help you on the former, not the latter. On Ivy Bridge, you know, there is, I would say, a handful, five to eight, something like that that I’ve seen off the top of my head. And for Haswell, it’s too soon to tell, I mean we have, when you start seeing an Ultrabook with a detachable touch screen, is it a tablet and it’s based on Haswell, so the tablet is an Ultrabook or is it a convertible, you know, I don’t know; lots of inventive names for these things as we go along. What I can tell you is that the level of innovation there is really unbounded; I haven’t seen this in a long time.

                                                                                                                          But, I think in terms of, just little bit near term selling season, there are some Ivy Bridge ones. They tend to be skewed more towards to the enterprise, where our customers believe that their customers, the CIOs of the world want a high performance tablet that is compatible, that is secure and that runs all their enterprise software. So I think that’s where you’ll see those migrate versus I think Clover Trail stuff which was going to be a bit more consumer centric.

                                                                                                                          David Wong – Wells Fargo

                                                                                                                          Great. And, you said you expect to qualify Haswell in the March quarter, will Haswell be appearing in systems in the March quarter or should we look for that a bit later in the year?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          The first half.

                                                                                                                          Christopher Danely – JPMorgan

                                                                                                                          Thanks guys. So Paul can you just give us maybe just your take on what you think is going to take to pull the PC industry out of this slunk? And do you think that with the advent of tablets cannibalizing notebooks that we’re never going to see the growth in PCs we used to; is it going to be something lower than what we have been used to?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          Again, since we don’t know how much of the flatness that we’re seeing this year in PCs as a function of which of those variables that we talked about earlier, it’s pretty hard to say that in good economic cycles that we wouldn’t return to normal growth. But, what I get back to as I lookout here, I don’t think and I said this to you guys before, I don’t think that the tablet as we’ve seen it evolve over the last several years is the end state of computing.

                                                                                                                          The innovation is going to start pouring in now that you have widely available SKUs on a widely distributed operating system that will come from multiple vendors that can unleash their creativity. And, what I can’t predict is what form factor is going to win here, but I do think that some of these things that have sort of the best of both worlds, the performance and the capability of a laptop and the form factor and convenience of a tablet, are likely to be the things that are most high volumes earners, but we honestly won’t know for 12 months.

                                                                                                                          CJ Muse – Barclays

                                                                                                                          Yeah, thank you for taking my question. I guess just as a follow-up on the inventory side. Can you discuss what you have seen downstream particularly in China and then also as part of the healthy days, my math suggest exiting December at roughly 75 days. Is that kind of the new normal we should think about for you guys in a lower PC growth rate environment or do you think that you need to be some thing lower?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          Let me try the China one CJ, and Stacy will come to the inventory.

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          And I’ll do the second. Yeah.

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          I was just in China a week and a half ago, so there is a fairly current view. I see the same situation. China as a manufacturing center is reflecting the comments that we had in our commentary which is that the OEMs are being very cautious with their inventory comments at this point in time for all the reasons we’ve discussed and it’s as lean as we’ve seen it in normal times without the shortage of let’s say their hard drives of last year.

                                                                                                                          In terms of the channel inventory, there really isn’t very much. I went into Tier 3 city, you don’t see things stocked up or sacked up on pallet and stuff. People are generally — I think most of our customers worldwide spent a lot of Q3 thinning out their Windows 7 inventory, so they wouldn’t have an overhang at the launch. And that accounts for a lot of this inventory shipped of our billings versus the consumption that we’ve been talking about. And now with the launch of Windows 8 coming in a week or so, you’ll see a new round of build and hopefully consumption.

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          Yeah and in terms of the inventory targets, the number you threw out is in the 70s is where we’re planning to get to in Q4. Just to put that in perspective maybe two other comments on what we’re doing. One is we are taking down utilization in the factories down to sub 50%, again to take inventory out and free up the opportunity to move both space and equipment and redirect that to 14-nanometer. So it’s a pretty significant series of actions. And I also want to point to the inventory that we have in place while it’s in terms of units more than I want to hold. It’s on the order of 70% Ivy Bridge, so it’s our freshest stuff. I am not worried about the salability of the inventory, but I do want to bring the Ivy Bridge inventory levels down. It’s just healthy for us to have less.

                                                                                                                          Daniel Berenbaum – MKM Partners

                                                                                                                          When you talk about clearing inventory, does pricing come into play in any fashion on the PC, just talk about pricing a little bit on the Data Center side, clearing inventory on either the consumer side or the enterprise side, is that helping? And then follow-up also a little bit on an earlier question, is there anything else that Intel can be doing to spur demand? We’ve already seen sort of Microsoft take matters a bit into their own hands with some of the designs that they are trying to sell; is pricing help you spur demand or is there something else that you can do?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          The short answer to your question is no on pricing. We do forward pricing with our customers. It’s priced I think aggressively to move into the mainstream price points in terms of the stuff I talked about. If you look at our PC group numbers quarter-over-quarter, the ASP was about flat year-over-year. It was down a bit, mobile was down a bit. What that reflects was really us going after some incremental share at the bottom of the market, so didn’t really change pricing but it changed the mix, and we thought it was time we could do some of that and we did it opportunistically. That’s more the driver on that side.

                                                                                                                          In terms of demand stimulation, a lot of what we are doing is really to make sure that the feature set of this season’s Ultrabooks are really consistent with where the market is, that’s why we’ve been so focused on working with our customers and the ecosystem just, for example, bring the touch SKUs in. So six to eight months ago that we did not have line of sight to 40 out of a 140 SKUs of Ultrabooks being touch enabled, it was probably five or 10; we are up to 40 now, and that’s just going to get bigger as we go into 2013. So working with the vendors and the glass manufacturers to bring the cost of touch as an increment down has been one of the key things we think we can do to drive demand.

                                                                                                                          Daniel Berenbaum – MKM Partners

                                                                                                                          And related to pricing, you’ve obviously got a wounded competitor out there now. Are you seeing that competitor get aggressive on pricing, especially in this environment? Your competitor talked about a big inventory write-down in its negative preannouncement; are you seeing lower pricing there and is that in any way impacting you?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          I think you would have to ask them their strategy for pricing. As Paul said, we had last quarter and this quarter, we believe, we’ve won some share at the lower end of the market; that’s our strategy here. So you’ve got to ask them the question about their pricing strategy.

                                                                                                                          JoAnne Feeney – Longbow Research

                                                                                                                          Yeah, I was hoping you can elaborate a little bit more on what you are seeing and what you saw last quarter and what you expect this quarter in terms of the mix of demand, both across consumer and enterprise geographically and then PC, you know, notebooks, desktops; just some more color if you would on what kind of mix you are seeing out there and where you expect it to go and what you’re relying on to get those inventories clear say by the beginning of 2013?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          Well, let me start with the last part. The inventory, I thing is straight forward. The work-in-process and finished goods that we’re expecting to come down over this quarter are our Ivy Bridge products which is the mainstream high-end product we have today. And as the market picks up, Windows 8 launches, Ultrabooks pick up and so forth then that just consumes that inventory. And as I said earlier, in my comments and Stacy’s, our OEMs are running very lean right now. So any kind of demand blip would cause us to be able to reduce that even more perhaps.

                                                                                                                          In terms of the mix, there is really not much more to add than we put in our pre-release and in the comments today which is that the U.S. and Western Europe PC markets remained soft in terms of consumers. The change that we have seen and we talked about at the pre-announcement was that the enterprise PC market has gone relatively flat now and I think that’s just a reflection of large corporations making hard decisions on CapEx versus people, and where they want to put their investments and now that seems to have spilled over from the client side of the enterprise also the data center server part of the enterprise. And you know I think we will see how that sorts out over the next quarter or so as CEOs and CIOs make their next round of decisions.

                                                                                                                          In terms of China, the slowdown there was – it’s principally a notebook business and the slowdown there was in consumer notebooks.

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          And I’ll just add in the DCG, we saw strength in the Cloud customers and over the course of the quarter weakening in the large enterprise purchases of server chips. So the mix there was more towards the Cloud.

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          Mix had been strong in the first half.

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          Mix had been strong in the first half, yeah.

                                                                                                                          JoAnne Feeney – Longbow Research

                                                                                                                          And then as a follow-up, Stacy could you let us know what happened with units versus ASPs in PCs versus servers last quarter?

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          Yeah, it’s actually in the CFO commentary JoAnne, but in general we saw PC units up 1% versus the prior quarter and datacenter units were also up 1%. This is a quarter-on-quarter compare.

                                                                                                                          JoAnne Feeney – Longbow Research

                                                                                                                          Sorry, and the ASPs?

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          The PC ASPs were down 1% and the server ASPs were down 7% based on the mix kind of things that I have been talking about.

                                                                                                                          Patrick Wang – Evercore Partners

                                                                                                                          Great, thanks so much. First question, I want to see if we can go back to China and Paul may be kind of recap some of the feedback you are hearing from those meetings you did have, because it seems like the slowdown in China is really impacting global PC demand and weakness out there. So just curious what the latest you are hearing?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          Well, what I don’t know is how much of this is and China is in their own macroeconomic cycle slowing down, I mean the GDP forecast for the year have come down for next have come down. There is also a reasonable amount of anxiety around the change in government and that tends to put a little bit of nervousness into the system and what I don’t know is how much of that clarifies after they change, because it’s not so much they don’t know who is coming in. The issue is what are the policies, in terms of stimulus and taxation and so forth. They have been pretty generous the last year or so, a year or two rather, in terms of stimulating domestic consumption and the question is will those polices continue or not.

                                                                                                                          Patrick Wang – Evercore Partners

                                                                                                                          I want to talk quickly about Data Center. The trend that we’re seeing in ASPs right now are down since the last quarter; I am just kind of curious how you see that over the next couple of years, because when we take a lot at your Cloud segment, you’re forecasting pretty robust growth there. You talked about 50% growth last quarter. As that continues to really outstrip growth from your more traditional server customers, what kind of impact does that do to your blended ASPs?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          Well, I think the better comparison for us the Data Center is year-on-year, for which the ASP was up a bit, up 1%. The down a bit was really a big shift in the mix between what would be normal enterprise growth and of slowing in the enterprise growth. In general, for storage, for networking and I think for some aspects of the internet data center the mix was actually quite good. Sometimes they – two way machines versus four way machines, but they tend to be fairly high mix and one of the fastest growing elements of the business is high performance computing which buyers buys at the top of the line of our skews. As those product lines get flushed out more and more, I really don’t see the mix shifting away from where it’s been in the first half of this year; I see the current mix being a bit of an anomaly as a result of the softness of corporate datacenter server purchases.

                                                                                                                          Glen Yeung – Citi

                                                                                                                          Stacy, maybe the first question for you. As you sort of think about your capacity for 2013 and you are obviously taking action now, what kind of PC environment are you notionally targeting and maybe just in up or down is sufficient unless you want to be more specific?

                                                                                                                          Stacy Smith – SVP, CFO & Director, Corporate Strategy

                                                                                                                          Yeah, I am going to be less specific. If you wanted the other, yeah either up or down; hold off on triangulating on a capital forecast or on a unit growth until we get to next quarter. The CapEx number as I said is going to be really be dependent on where we think unit growth is in ‘13 and ‘14 and right now we’re fighting through Q4. There is a lack of visibility on the current quarter; I want to have the 90 days to really think about what we want to put in place.

                                                                                                                          Glen Yeung – Citi

                                                                                                                          And then Paul maybe next question for you. Notionally, we won’t expect to see when we have an operating transition like we’re seeing a spark to PC demand and yet we don’t seem to be seeing that and I wonder if you could just give us your thoughts as to why you think this time that’s not happening?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          Yeah, I don’t think, we know it’s not happening yet. I am very excited about this new operating system. As I said earlier, it brings touch into the mainstream for the first time and we know that in the last couple of years the tablets have changed the paradigm for people to use computers, they like touch, they like to make the photos get larger with their fingers and everything else is good about that. And so I think we haven’t had a chance to really judge how the consumers will embrace this in the mainstream PC space or not.

                                                                                                                          I am very optimistic as we’ve been playing with these things and we see the products being built and we take them out for testing to consumer and we’ve now on test on Windows 8, touch enabled Ultrabooks in number of the major cities around the world, across multiple demographics. The feedback is universally positive. So I think we’re just too soon to tell. The designs aren’t even launched yet and we’ll know a lot more about this 90 days from now.

                                                                                                                          Intel Reports Third-Quarter Revenue of $13.5 Billion [Intel press release, Oct 16, 2012]

                                                                                                                          Intel Corporation today reported quarterly revenue of $13.5 billion, operating income of $3.8 billion, net income of $3.0 billion and EPS of $0.58. The company generated approximately $5.1 billion in cash from operations, paid dividends of $1.1 billion and used $1.2 billion to repurchase stock.

                                                                                                                          Our third-quarter results reflected a continuing tough economic environment,” said Paul Otellini, Intel president and CEO. “The world of computing is in the midst of a period of breakthrough innovation and creativity. As we look to the fourth quarter, we’re pleased with the continued progress in Ultrabooks and phones and excited about the range of Intel-based tablets coming to market.”

                                                                                                                          Q3 2012 Key Financial Information and Business Unit Trends (GAAP, unless otherwise stated)

                                                                                                                          • PC Client Group revenue of $8.6 billion, flat sequentially and down 8 percent year-over-year
                                                                                                                          • Data Center Group revenue of $2.7 billion, down 5 percent sequentially and up 6 percent year-over-year
                                                                                                                          • Other Intel® architecture group revenue of $1.2 billion, up 6 percent sequentially and down 14 percent year-over-year
                                                                                                                          • Gross margin of 63.3 percent, 1.3 percentage points above the midpoint of the company’s updated expectation of 62 percent.
                                                                                                                          • R&D plus MG&A spending $4.6 billion, unchanged.
                                                                                                                          • Tax rate of 24 percent, below the company’s expectation of approximately 28 percent.

                                                                                                                          Business Outlook

                                                                                                                          Intel’s Business Outlook does not include the potential impact of any business combinations, asset acquisitions, divestitures or other investments that may be completed after Oct. 16.

                                                                                                                          Q4 2012 (GAAP, unless otherwise stated)

                                                                                                                          • Revenue: $13.6 billion, plus or minus $500 million.
                                                                                                                          • Gross margin percentage: 57 percent and 58 percent Non-GAAP (excluding amortization of acquisition-related intangibles), both plus or minus a couple of percentage points.
                                                                                                                          • R&D plus MG&A spending: approximately $4.5 billion.
                                                                                                                          • Amortization of acquisition-related intangibles: approximately $75 million.
                                                                                                                          • Impact of equity investments and interest and other: approximately $75 million.
                                                                                                                          • Depreciation: approximately $1.6 billion.
                                                                                                                          • Tax Rate: approximately 27 percent.
                                                                                                                          • Full-year capital spending: $11.3 billion, plus or minus $300 million.

                                                                                                                          For additional information regarding Intel’s results and Business Outlook, please see the CFO commentary at:www.intc.com/results.cfm.

                                                                                                                          Status of Business Outlook

                                                                                                                          Intel’s Business Outlook is posted on intc.com and may be reiterated in public or private meetings with investors and others. The Business Outlook will be effective through the close of business Dec. 14 unless earlier updated; except that the Business Outlook for amortization of acquisition-related intangibles, impact of equity investments and interest and other, and tax rate, will be effective only through the close of business on Oct. 23. Intel’s Quiet Period will start from the close of business on Dec. 14 until publication of the company’s fourth-quarter earnings release, scheduled for Jan. 17, 2013. During the Quiet Period, all of the Business Outlook and other forward-looking statements disclosed in the company’s news releases and filings with the SEC should be considered as historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.

                                                                                                                          Risk Factors

                                                                                                                          The above statements and any others in this document that refer to plans and expectations for the fourth quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company’s expectations.

                                                                                                                          • Demand could be different from Intel’s expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters.
                                                                                                                          • Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel’s products; actions taken by Intel’s competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products.
                                                                                                                          • The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets.
                                                                                                                          • The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
                                                                                                                          • Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments. The majority of our marketable equity security portfolio balance is concentrated in ASML Holding, N.V, and declines in value could result in impairment charges, impacting gains or losses on equity securities.
                                                                                                                          • Intel’s results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
                                                                                                                          • Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel’s products and the level of revenue and profits.
                                                                                                                          • Intel’s results could be affected by the timing of closing of acquisitions and divestitures.
                                                                                                                          • Intel’s results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel’s SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

                                                                                                                            Earnings Webcast

                                                                                                                            Intel will hold a public webcast at 2 p.m. PDT today on its Investor Relations website at www.intc.com. A webcast replay and MP3 download will also be available on the site.

                                                                                                                            Intel plans to report its earnings for the fourth quarter of 2012 on Jan. 17, 2013. Immediately following the earnings report, the company plans to publish a commentary by Stacy J. Smith, senior vice president and chief financial officer, atwww.intc.com/results.cfm. A public webcast of Intel’s earnings conference call will follow at 2 p.m. PDT at www.intc.com.

                                                                                                                          Intel Haswell: “Mobile computing is not limited to tiny, low-performing devices”

                                                                                                                          Update: Intel releases updated Haswell CPU roadmaps to production partners, say sources [DIGITIMES, Jan 18, 2013]

                                                                                                                          Intel reportedly has provided its production partners with updated roadmaps of its 22nm Haswell CPUs, which will be available in June, according to sources from the upstream supply chain.

                                                                                                                          The first wave of Haswell processors to be launched in the second quarter of 2013 will include Core i7-4770K, i7-4770, i7-4770S, i7-4770T, i7-4765T, i5-4670K, i5-4670, i5-4670S, i5-4670T, i5-4570, i5-4570S, i5-4570T, i5-4430 and i5- 4430S, the sources revealed.
                                                                                                                          […K, …T and …S are all desktop processors just as the i5-4430; when the Haswell mobile processors with …M, …U and …Y will be available?]

                                                                                                                          Haswell-based Core i3-series CPUs [the Haswell mobile processors with …M, …U and …Y will be available here?] and high-end Ivy Bridge E processors will not be released until the third quarter, the sources added.

                                                                                                                          Along with the upcoming 22nm Haswell processors, Intel will also launch its Lynx Point 8-series chipsets, including the Z87, H87 and H81 for desktops and the Q87, Q85 and B85 for business platforms, said the sources.

                                                                                                                          Intel set to announce Haswell processors at Computex 2013 [[DIGITIMES, Jan 21, 2013]

                                                                                                                          Intel is set to host a conference prior to Computex 2013 in June announcing its upcoming Haswell series processors jointly with downstream partners, according to sources from PC players.

                                                                                                                          The sources noted that the new CPUs will appear on June 2 and related PC products will be showcased at Computex, hosted from June 4-8.

                                                                                                                          Intel also internally forecasts the new CPU platform to account for 14-16% of its total CPU shipments in the third quarter, the sources noted.

                                                                                                                          Since consumer demand for Windows 8 is expected to start rising after the operating system has been launched for eight months, with the launch of the new CPU platform, the sources expect the PC market to start recovering in the third quarter.

                                                                                                                          Update: Third-generation ultrabooks may be able to achieve 40% of notebook shipments, say players [DIGITIMES, Dec 11, 2012]

                                                                                                                          As Intel failed to achieve its goal of having ultrabooks account for 40% of total notebook shipments with its Ivy Bridge platform, and the proportion only reached about 10%, sources from notebook players believe the goal may be achievable with the upcoming Haswell platform, which is set to launch at the end of second-quarter, 2013.

                                                                                                                          The sources pointed out that compared to Ivy Bridge, Haswell’s stronger performance and cheaper price, plus the expectation that Windows 8 should become more standardized by then, should mean ultrabooks have a chance to account for 40% of total notebook shipments by the end of 2013.

                                                                                                                          Although vendors have released ultra-like notebooks with prices around US$699-899 as alternatives, since these devices lack attractiveness in terms of design and weight, while ultrabook models with specifications similar to the MacBook Air have prices a lot higher than the MacBook Air, most consumers have turned to purchase Apple’s product instead, the sources noted.

                                                                                                                          Update: Intel progressing in development of 14nm technology, says CTO [DIGITIMES, Dec 5, 2012]

                                                                                                                          Intel CTO Justin Rattner on December 4 said that Intel’s development of 14nm technology is on schedule with volume production to kick off in one to two years and development of 18-inch wafers is under way through cooperation with partners.

                                                                                                                          Rattner also noted that Intel’s aggressiveness over technology advancement will allow Moore’s Law to extend for another 10 years.

                                                                                                                          At the end of 2013, Intel will enter the generation of 14nm CPUs (P1272 [process: a shrink from the previous P1270 22-nm process as well as a reduction in power consumption]) and SoCs (1273), while expanding its investments at its D1X Fab in Oregon, and Fab 42 in Arizona, the US and Fab 24 in Ireland, and will gradually enter 10nm, 7nm and 5nm process generations starting 2015.

                                                                                                                          As for Intel’s competitors, Samsung is already set to enter 20nm in 2013 and is already working on its 14nm node, while Taiwan Semiconductor Manufacturing Company’s (TSMC) 20nm process will enter small volume production in the second half of 2013 with the first 3D-based FPGA chips to also start.
                                                                                                                          Globalfoundries has previously announced its 14nm FinFET process will start pilot production at the end of 2013 and enter mass production in 2014.
                                                                                                                          As for 18-inch wafers, Intel has invested in Holland-based ASML for its EUV technology, and related technologies are expected to start entering production in 2017.

                                                                                                                          Mobile computing is not limited to tiny, low-performing devices”. That was Intel’s battle cry two months ago when its next-generation core, aka Haswell was introduced, see at the very end of this video report:

                                                                                                                          IDF 2012: Intel shows new Haswell chips [networkworld YouTube channel, Sept 11, 2012]

                                                                                                                          Intel’s David (Dadi) Perlmutter showed demonstrations of systems running on its new Haswell processor, due in 2013, at the Intel Developer Forum in San Francisco on Sept. 11. … The technology demo of Haswell vs the 3d generation Ivy Bridge shows the same core performance but running at less then half the power … “Next year we are going to fit the best performing graphics and media capabilities on mother earth that will fit into extremely thin, extremely nice, extremely sneak form factor. So mobile computing is not limited to tiny, low-performing devices”.

                                                                                                                          A detailed analysis published 2 days ago (Nov 13)  concluded:

                                                                                                                          Intel’s Sandy Bridge core served as an impressive starting point, with unmatched performance in the x86 ecosystem. Haswell builds on this foundation, with powerful ISA extensions and a substantially more aggressive execution core and cache hierarchy. Moreover, Haswell is the first Intel core that will take full advantage of the 22nm FinFET process technology. While the Ivy Bridge graphics architecture is new, the CPU core was mostly unchanged. More importantly, the circuit design was focused on a low-risk and faster migration to a new process, rather than achieving peak performance, efficiency or density.

                                                                                                                          Overall, we estimate that a Haswell core will offer around 10% greater performance for existing software, compared to Sandy Bridge. For workloads using the new extensions, the gains could be significantly higher. In theory, AVX2 and FMA can boost performance by 2×, but the impact on most vectorizable workloads will be much lower. Research from AMD has shown that lock elision gains 30% for the right workloads, although the benefits depend strongly on the actual concurrency.

                                                                                                                          Haswell will be the first big x86 core to compete against ARM-based cores in tablets. While the performance will be dramatically higher, the power budgets are very different. Haswell SoCs will reach 10W, while competing solutions are often closer to 4W. The real question is the relative efficiency of Haswell SoCs, and the advantage of the massive x86 software ecosystem. Fortunately, Windows 8 provides an opportunity to accurately measure performance and efficiency. The results will inject some hard data into discussions that have been otherwise vacuous and largely driven by marketing.

                                                                                                                          For details see the whole Intel’s Haswell CPU Microarchitecture [Real World Tech, Nov 13, 2012] article.

                                                                                                                          The next-generation Haswell was presented at the Intel Developer Forum in San Francisco as (source):

                                                                                                                          • 4th Generation Intel Core Microprocessor, built on 22 nm process technology
                                                                                                                          • Next Generation Intel HD Graphics with Microsoft DirectX 11.1, Open GL 4.0, OpenCL 1.2 support
                                                                                                                          • Significant 3D and media performance improvement
                                                                                                                          • Three Simultaneous Display, HDMI, DisplayPort, with high-resolution up-to 4Kx2K
                                                                                                                          Abbreviations: PEGPCI Express Graphics; IMCIntegrated Memory Controller; LLCLast Level Cache; DMIDirect Media Interface; DDR3L (2 channels) – Double Data Rate type THREE (3) synchronous dynamic random access memory Low-voltage; 4Kx2K4096 x 2160 native resolution corresponding to the highest LCD Monitor resolution such as the 36.4″ (92 cm) DuraVision FDH3601, the highest resolution of the Digital cinema, as well as 4K UHDTV (also called 2160p).

                                                                                                                          Then it goes into different type of client platforms, code named Shark Bay as follows (leaked by a Chinese “bigpao007” user information):

                                                                                                                          which means the following incorporation varieties of the Haswell into the various Shark Bay client platforms:

                                                                                                                          • The standard voltage (SV) quad-core Haswell-QC with GT3/GT2 graphics core
                                                                                                                          • The standard voltage (SV) dual-core Haswell-DC with GT2/GT1 graphics core
                                                                                                                          • and the Lynx Point-H PCH (Platform Controller Hub) separate chip for both of them 
                                                                                                                          • The ultra low voltage (ULV now renamed ULT – probably for ULTra) dual-core Haswell ULT with GT3/GT2/GT1 graphics core and Lynx Point-LP PCH (Platform Controller Hub) within the same Multi-Chip Package (MCP, also called MCM – Multi-Chip Module)
                                                                                                                          • Wireless networking modules code-named Wilkins Peak with the top level “Wilkins Peak 2” supporting 2T2R (2 Transmitter, 2 Receiver) 802.11ac and Bluetooth. Intel should also support 2.4GHz and 5GHz dual-band, and the theoretical peak speed is 1750Mbps (1300Mbps +450 Mbps). The new module will be backward compatible with the current 802.11b/g/n.
                                                                                                                          • Gigabit Ethernet LAN controller chips code-named Clarkville specifically Clarkville-LM for which no more information known yet

                                                                                                                          Which means the following essential difference:

                                                                                                                          Skyrim running @ 1080p on 4th gen Intel core with Intel HD Graphics “GT3” (codename) [channelintel YouTube channel, Oct 18, 2012]

                                                                                                                          Missed IDF SFO 2012? Check out Skyrim running @ 1080p on new level of Intel Graphics (code name “GT3”) on 4th gen core based mobile PC (reference platform)

                                                                                                                          From The Elder Scrolls V: Skyrim Wikipedia article:

                                                                                                                          The Elder Scrolls V: Skyrim is an action role-playing open world video game developed by Bethesda Game Studios and published by Bethesda Softworks. It is the fifth installment in The Elder Scrolls action role-playing video game series, following The Elder Scrolls IV: Oblivion. Skyrim was released on November 11, 2011 for Microsoft Windows, PlayStation 3 and Xbox 360. … Skyrim is powered by Bethesda’s own Creation Engine, a new engine created prior to Skyrim‘s release.[25][26]

                                                                                                                          Intel Corporation’s CEO Discusses Q3 2012 Results – Earnings Call Transcript [Seeking Alpha, Oct 16, 2012]

                                                                                                                          Last month at IDF, we shared details of our next-generation Core processor codenamed Haswell. Originally targeted at 15 watts, we have made significant advancements in micro-architecture and process technology that will allow us to move Haswell down into the 10 watt envelope fostering even more innovation in form factor as well as new usage models like gesture computing and voice recognition.

                                                                                                                          … we expect an increase in inventory reserves as we start production on our next-generation micro-architecture product codenamed Haswell which we expect to qualify for sale in the first quarter of 2013.

                                                                                                                          Q: … you said you expect to qualify Haswell in the March quarter, will Haswell be appearing in systems in the March quarter or should we look for that a bit later in the year?

                                                                                                                          Paul Otellini – President & CEO

                                                                                                                          The first half.

                                                                                                                          Intel’s David (Dadi) Perlmutter talks Haswell, perceptual computing [EE Times YouTube channel, Sept 12, 2012]

                                                                                                                          Intel’s general manager of architecture talks about the firm’s upcoming fourth generation core microprocessor, Haswell, and some of the new functionality it will enable on upcoming ultrabooks, including gesture and voice recognition.

                                                                                                                          Intel CPO Talks About Haswell Progress and More in IDF Keynote [Intel® Premier IT Professionals, Sept 11, 2012]

                                                                                                                          What’s a CPO?
                                                                                                                          Chief Product Officer. And at Intel that is Dadi Perlmutter who is also an executive vice-president.
                                                                                                                          He delivered today’s opening keynote at the Intel Developer Forum (IDF) on Collaborating to Shape the Future from Datacenter to Devices. So while developers are the key focus on this conference, there are topics that are of interest to IT professionals as well.
                                                                                                                          Instead of the rah-rah of some of the previous IDFs, Perlmutter began with a subdued acknowledgment of the 9/11 anniversary. That subdued approach carried over to much of the rest of his presentation as there were no big new product unveilings…only a progress report on offerings Intel has already announced.

                                                                                                                          Briefly, here’s the status report:

                                                                                                                            • The 4th generation Intel Core, aka Haswell, is on track for launching next year. It is designed with mobility in mind, based on 22 nm technology, will have 20X [reduced] connected standby power [over the 2nd generation, and initially operating at about 10 watts], and delivers demonstrably smoother graphics.

                                                                                                                            • New Ultrabooks based on the 4th generation processor will be thinner and faster, and will include Windows 8 in detachable, convertible, clamshell and other innovative form factors.

                                                                                                                            • Intel is making progress on interactive PC experiences with a natural conversation beta using Nuance Dragon this year and moving into production in Q1 2012. Dragon runs native on the platform because it requires the high-performance of the CPU.
                                                                                                                            • There are 20+ Atom Cloverdale chip tablets design wins coming with or shortly after the Windows 8 launch.
                                                                                                                            • Smartphones based on the Intel Atom have launched with five partners and Intel says they are making steady progress with a competitive roadmap for smartphones.
                                                                                                                                As usual, there were some cool demos.
                                                                                                                                  • Gary Flood, President Global Products and Services of MasterCard demonstrated the company’s PayPass Wallet utilizing Intel Identity Protection Technology in conducting a secure traction using Near Field Communications (NFC) on an Ultrabook.
                                                                                                                                  • Dadi showed a new intelligent Coca-Cola machine with a QR Reader, microphone, camera, and wifi. Designed by SIA, the intelligent system utilizes the Core i7.
                                                                                                                                  • Gesture recognition with a 3D camera connected via USB showed natural hand and finger movements.
                                                                                                                                      Dadi didn’t even use the term “compute continuum” this year—which was the focus of CEO Paul Otellini’s keynote last year. But, in what was probably the biggest news for the developer audience, he announced a $1 million Perceptual Computing Developer Challenge. “Perceptual computing” is all about ways you can interact with a computer beyond the keyboard and mouse, like voice, gesture, facial analysis, and more. Details for the contest and a free copy of the Intel Perceptual Computing SKD 2013 Beta are at intel.com/software/perceptual.

                                                                                                                                      Note that the below article is based on the June 5, 2012 BIOS Enabling Rev 1.0 presentation from the BIOS Application Engineering Team of the Ultrabook for Shark Bay Platform Enabling (put online on the German 3Dcenter.org on Nov 9, 2012):
                                                                                                                                      Intel Haswell ULT Processors Power Saving Features and Lynx Point-LP Chipset Detailed [WCCF Tech, Nov 12, 2012]

                                                                                                                                      Intel’s Haswell ULT (Low Power) processors would be featuring new and improved features which would help them maintain a low power draw without sacrificing much of their performance. These features have been detailed along with the Lynx Point-LP chipset which would support the Haswell ULT Mobile processors.

                                                                                                                                      Haswell ULT Low Power – 24 MHz BCLK and C9/C10 Support

                                                                                                                                      Back at IDF 2012, Intel demonstrated an Haswell chip which was capable of running an Unigine Heaven demo with a power draw of only 7.5 Watt. That is one significant improvement in power efficiency compared to its 22nm Ivy Bridge architecture. What helps Haswell ULT maintain such a lowerdraw, the answer is support for a new 24 MHz BCLK which will put the CPU at a standby operating frequency of 192 MHz at idle mode, once the user puts the CPU back in working mode the Haswell ULT chip would be restored to normal settings through software correction.

                                                                                                                                      Haswell ULT CPUs would also arrive with new C-State modes – C8, C9, C10. All three of which would only be available on ULT chips and not the desktop or normal mobile variants. In this state, the Haswell ULT would trigger Off state for VccIO and in C9/C10 state, the voltage would go down to 0V minimizing power draw to the max limit.

                                                                                                                                      Haswell and Lynx Point Cross Thermal Management

                                                                                                                                      Since Haswell ULT is a complete SOC (System On Chip), the Lynx Point-LP chipset and the CPU would be cross connected for easier thermal management between both. For instance, if the Lynx Point-LP exceeds its Tjmax limit, a signal would be sent to the Haswell-ULT issuing PCHHOT warning signal. Lynx Point-LP, to increase power efficiency gets rid of CPU overclocking, SATA IDE mode and DMI/FDI/PECI controllers. Lynx Point-LP upto 6 PCI-e 2.0 x16 lanes but doesn’t offer support for PCI-e 3.0. VGA output have been removed from the PCH, so you would have to rely on either DVI or HDMI for display connectivity. Connectivity on the Lynx Point-LP chipset includes 8 USB 2.0 ports, 4 USB 3.0 ports, 3 SATA III ports and integrated HD Audio.

                                                                                                                                      Overall, Haswell ULT and Haswell is looking as a nice improvement to Ivy bridge when it comes to power efficiency and graphics improvement. The Haswell ULT and Haswell U Processors arrive in Q2 2013 whereas the desktop Haswell processors along with the 8 Series Lynx Point Motherboards are expected to debut in April 2013.

                                                                                                                                      Preliminary roadmap information given out under NDA by Intel at the same time was also 3 days ago put  on the German 3Dcenter.org online from the June 5, 2012 Shark Bay Haswell ULT/Lynx Point-LP -Intel® ME 9.5 FW Features Overview Rev 1.1 presentation:

                                                                                                                                      In August there was the following roadmap leak as well which seems to be less than the above one: Intel’s Fourth Generation Haswell Mobile Processors to Launch in Q2 2013, New Ivy Bridge Mobile Chips in Q4 2012 [WCCF Tech, August 7, 2012]

                                                                                                                                      The latest Intel roadmap leak has confirmed that Haswell M-Series (Mobile) processors would launch in 1H of 2013 along with newer Ivy Bridge mobile chips in Q4 2012 and Q1 of 2013.

                                                                                                                                      The roadmap shows that Intel’s fourth generation processors known as Haswell would launch in Q2/Q3 2013 featuring a new 22nm Tri-gate architecture which would bring improved IPC performance over Ivy Bridge.