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Eight-core MT6592 for superphones and big.LITTLE MT8135 for tablets implemented in 28nm HKMG are coming from MediaTek to further disrupt the operations of Qualcomm and Samsung
Updates
Update: The Power of 8: MediaTek True Octa-Core [mediateklab YouTube channel, July 29, 2013]
Update: MT6592—The world’s first true octa-core SOC with scalable eight-core processing [product page, March 13, 2014]
Overview
MediaTek MT6592 is the world’s first heterogeneous computing SOC with scalable eight-core processing for superior multi-tasking, industry-leading multimedia features and excellent performance-per-watt. Based on 28nm HPM (High-Performance Mobile) process technology, MT6592 has eight CPU cores, each capable of clock speeds up to 2GHz.
Features
- ARM® Cortex®-A7 processor (1.7GHz or 2GHz)
- 28nm HPM process technology
- MAGE 3D graphics engine
- UMTS / HSPA+ R8 / TD-SCDMA / EDGE / LTE
- 801.11a/b/g/n, Bluetooth, GPS, FM tuner
- 16MP camera image signal processor
- Full HD H.265 / VP9 and Ultra HD H.264 video playback
- ARM Mali™ GPU (700MHz)
- MediaTek ClearMotion™ video enhancement
Update: [€147.18] Cubot X6 OctaCore MT6592 Phone Ultimate Slim Design 5″ OGS HD Retina [arif rachman YouTube channel, March 1, 2014]
Cubot X6 OctaCore MT6592 Ultimate Slim Design
Please follow the link below to see the full specification
http://bit.ly/CubotX6This is the latest phone from Cubot. Well.. the phone has the latest MT6592 1.7GHz processor. 28nm process, with quad core mali 450 GPU. Frequency is up to 700MHz. It supports full HD video with wide screen decoding format.
The true eight core processor can run simultaneously through advanced scheduling algorithm, dynamic temperature control and power management technology to optimize workload distribution to each core. When handling multiple tasks and heavy duty needs, achieve the peak performance of full eight core. At light load, you can turn off the core, the ultimate energy saving idle. It means substantial increase in cell phone battery life.
The Mali 450 graphics processor, overall performance is up to twice of the previous Mali 400. It supports full-HD 60fps. The triangles per second and render is 152M 2.8G pixels. Should be easy to run 3D games, smooth playback of 1080 HD videos. It also has a built in powerful MAGE 3D engine.
The front camera is 5 mega pixels while the back camera is 8 mega pixels. The camera is equipped with five pieces of high precision glass structure, which can effectively filter infrared blue glass. This is to achieve the level of professional SLR camera. Far better than ordinary lenses. The phone uses Sony sensor with latest 13Mega-Pixel CMOS Image Sensor.
In a week, the phone will be available at banggood for only $184.99 with free shipping worldwide! That’s an octa core phone below 200$ price tag! Not cheap enough?
Leave your email to get referred and get 10$ discount! Cheapest price out there!
Please follow the link below to see the full specification
http://bit.ly/CubotX6
IllusionMage [Wikipedia, excerpted on March 15, 2014]
IllusionMage is a paid for 3D modeling, animation, and rendering software packages comprising the core engine of Blender, an open-source, 3D software suite, and bundled with materials related to Blender.
Other names this bundle has gone under are IllusionMage3D, 3DMagix, and 3DMagixPro.[1]
All materials and software included are freely available from other sources. The marketing of this program includes images that were stolen from other sources, often created with competing 3D applications. The image of the alleged creator of the software, Seth Avery, is a random stock photo.[2]
Criticism
IllusionMage has come under fire by many prominent Blender news sites and figures, including Ton Roosendaal, the founder of the Blender Foundation[3][4]
Related
“Illusion Mage & 3D Magix Pro (affiliate) domain names” Topic: Illusion Mage & 3D Magix Pro *is* a scam. KatsBits Forum. Retrieved 2 October 2011.
“Handsome young man isolated over white”. Laflor Photography via iStockPhoto. Retrieved 8 May 2012.
January 2011 Blender Foundation Press Release
“3DMagix and IllusionMage, scam or open source leeches?”. BlenderNation. Retrieved 30 September 2011.
Update: 联发科平板四核心MT8135 官方成绩曝光 (MediaTek MT8135 quad-core tablet exposure Official Results) [ 驱动之家 (MyDrivers.com), July 29, 2013]
Update: MediaTek’s Quad-core Tablet SoC MT8135 : Performance Benchmark [mediateklab YouTube channel, July 19, 2013]
Update: MediaTek Introduces Industry Leading Tablet SoC, MT8135 [press release, July 29, 2013]
TAIWAN, Hsinchu – July 29, 2013 – MediaTek Inc., (2454: TT), a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets. The quad-core solution incorporates two high-performance ARM Cortex™-A15 and two ultra-efficient ARM Cortex™-A7 processors, and the latest GPU from Imagination Technologies, the PowerVR™ Series6. Complemented by a highly optimized ARM® big.LITTLE™ processing subsystem that allows for heterogeneous multi-processing, the resulting solution is primed to deliver premium user experiences. This includes the ability to seamlessly engage in a range of processor-intensive applications, including heavy web-downloading, hardcore gaming, high-quality video viewing and rigorous multitasking – all while maintaining the utmost power efficiency.
In line with its reputation for creating innovative, market-leading platform solutions, MediaTek has deployed an advanced scheduler algorithm, combined with adaptive thermal and interactive power management to maximize the performance and energy efficiency benefits of the ARM big.LITTLE™ architecture. This technology enables application software to access all of the processors in the big.LITTLE cluster simultaneously for a true heterogeneous experience. As the first company to enable heterogeneous multi-processing on a mobile SoC, MediaTek has uniquely positioned the MT8135 to support the next generation of tablet and mobile device designs.
“ARM big.LITTLE™ technology reduces processor energy consumption by up to 70 percent on common workloads, which is critical in the drive towards all-day battery life for mobile platforms,” said Noel Hurley, vice president, Strategy and Marketing, Processor Division, ARM. “We are pleased to see MediaTek’s MT8135 seizing on the opportunity offered by the big.LITTLE architecture to enable new services on a heterogeneous processing platform.”
“The move towards multi-tasking devices requires increased performance while creating greater power efficiency that can only be achieved through an optimized multi-core system approach. This means that multi-core processing capability is fast becoming a vital feature of mobile SoC solutions. The MT8135 is the first implementation of ARM’s big.LITTLE architecture to offer simultaneous heterogeneous multi-processing. As such, MediaTek is taking the lead to improve battery life in next-generation tablet and mobile device designs by providing more flexibility to match tasks with the right-size core for better computational, graphical and multimedia performance,” said Mike Demler, Senior Analyst with The Linley Group.
The MT8135 features a MediaTek-developed four-in-one connectivity combination that includes Wi-Fi, Bluetooth 4.0, GPS and FM, designed to bring highly integrated wireless technologies and expanded functionality to market-leading multimedia tablets. The MT8135 also supports Wi-Fi certified Miracast™ which makes multimedia content sharing between devices remarkably easier.
In addition, the tablet SoC boasts unprecedented graphics performance enabled by its PowerVR™ Series6 GPU from Imagination Technologies. “We are proud to have partnered with MediaTek on their latest generation of tablet SoCs” says Tony King-Smith, EVP of marketing, Imagination. “PowerVR™ Series6 GPUs build on Imagination’s success in mobile and embedded markets to deliver the industry’s highest performance and efficient solutions for graphics-and-compute GPUs. MediaTek is a key lead partner for Imagination and its PowerVR™ Series6 GPU cores, so we expect the MT8135 to set an important benchmark for high-end gaming, smooth UIs and advanced browser-based graphics-rich applications in smartphones, tablets and other mobile devices. Thanks to our PowerVR™ Series6 GPU, we believe the MT8135 will deliver five-times or more the GPU-compute-performance of the previous generation of tablet processors.”
“At MediaTek, our goal is to enable each user to take maximum advantage of his or her mobile device. The implementation and availability of the MT8135 brings an enjoyable multitasking experience to life without requiring users to sacrifice on quality or energy. As the leader in multi-core processing solutions, we are constantly optimizing these capabilities to bring them into the mainstream, so as to make them accessible to every user around the world,” said Joe Chen, GM of the Home Entertainment Business Unit at MediaTek.
The MT8135 is the latest SoC in MediaTek’s highly successful line of quad-core processors, which since its launch last December has given rise to more than 350 projects and over 150 mobile device models across the world. This latest solution, along with its comprehensive accompanying Reference Design, will like their predecessors fast become industry standards, particularly in the high-end tablet space.
Update: Optimized big. LITTLE – MediaTek [MediaTek, July 29, 2013]
Multi-core system-on-chip (SoC) design has brought tremendous benefits to mobile device users by offering seamless engagement in rigorous multitasking. To overcome the issue with high energy consumption and thermal readings, MediaTek is deploying an advanced scheduler algorithm, combined with adaptive thermal and interactive power management to maximize the performance and energy efficiency benefits of the ARM big.LITTLE™ architecture. The technology will allow applications software to simultaneously access all the processors in the big.LITTLE™ cluster for a true heterogeneous experience, activating both of its CPU clusters concurrently for extreme performance.
Optimized big. LITTLE™
ARM big.LITTLE™ processing is designed to address the energy and thermal issues associated with multi-core system-on-chip (SoC) solutions. It allows for the creation of dual-cluster SoCs, with one more powerful (big) cluster for processing intensive tasks and a less powerful (LITTLE) cluster for executing routine functions. MediaTek is among the first SoC designers to have adopted this ground-breaking technology. Unlike its counterparts, however, the company has done so in a manner that affords device users the utmost energy and thermal efficiency rates.
Enabling Heterogeneous Multi-Processing
Of the three big.LITTLE™ software models that can be integrated, for example, MediaTek chose the Heterogeneous Multi-Processing [developed and named by ARM as Global Task Scheduling (GTS), also known earlier as big.LITTLE MP, see in the last section of this post in detail] approach, which unlike the other two methods – Cluster- [as was implemented in Galaxy S4 by Samsung with Exynos 5 SoC having 4xA7+4xA15 configuration] and CPU-Migration [IKS (In Kernel Switcher) developed by Linaro, see in the last section of this post in detail] – allows for individual cores to be activated as and when needed for maximum efficiency.
However, use of the most versatile model isn’t MediaTek’s only advantage. In line with its reputation for creating innovative, market-leading platform solutions, MediaTek has deployed an advanced scheduler algorithm, combined with adaptive thermal and interactive power management to maximize the performance and energy efficiency benefits of the ARM big.LITTLE™ architecture.
The technology will allow applications software to simultaneously access all the processors in the big.LITTLE™ cluster for a true heterogeneous experience, activating both of its CPU clusters concurrently for extreme performance.
In comparison, the current octa-core SoC solution, utilizes one of the more inferior big.LITTLE™ software models. As a result, the processor is not as efficient as it otherwise might be.
As the first company to enable Heterogeneous Multi-Processing on a mobile SoC in the form of its MT8135 Reference Design, MediaTek is uniquely positioned to support the next wave of tablet and mobile devices.
Update: Optimized ARM big.LITTLETM – MediaTek Enables ARM big.LITTLETM Heterogeneous Multi-Processing Technology in Mobile SoCs [MediaTek Position Paper in PDF, July 29, 2013]
MediaTek MT8135 brings PowerVR Series6 GPUs to a mobile device near you [With Imagination Blog, July 29, 2013]
Over the years, our close partnership with MediaTek has resulted in the release of some very innovative platforms that have set important benchmarks for high-end gaming, smooth UIs and advanced browser-based graphics-rich applications in smartphones, tablets and other mobile devices. Two recent examples include:
- MT8125/MT8389, an extension of MediaTek’s highly successful quad-core portfolio which integrates power-efficient PowerVR Series5XT graphics that deliver compelling multimedia features and sophisticated user experiences
- MT8135, the first in a series of PowerVR Series6-based mobile chipsets that are due to be announced in the second half of this year
MediaTek has been steadily establishing itself as an important global player for consumer products like smartphones, tablets and smart TVs, with a strong foothold in Latin America and Asia, and a rapidly growing presence in Europe and North America. Earlier this year, MediaTek introduced MT8125, one of their most successful tablet chipsets for high-end multimedia capabilities.
While MT8125 has been extremely popular with OEMs including Asus, Acer or Lenovo, MT8135 has the potential to consolidate Mediatek’s existing customer base and open up exciting new opportunities thanks to the advanced feature set provided by Imagination’s PowerVR ‘Rogue’ architecture.
MT8135 is a quad-core SoC that aims for the middle- to high-end tier of the tablet OEM market. It supports a 4-in-1 connectivity package that includes Wi-Fi, Bluetooth 4.0, GPS and FM radio, all developed in-house by MediaTek. Miracast is another important addition to the multimedia package, enabling devices using MT8135 to stream high-resolution content more easily to compatible displays, over wireless networks.
MT8135 incorporates a PowerVR G6200 GPU [from the block diagram corresponds to the PowerVR G6230] from Imagination that enables advanced mobile graphics and compute applications for the mainstream consumer market, including fast gaming, 3D navigation and location-based services, camera vision, image processing, augmented reality applications, and smooth, high-resolution user interfaces.
As MT8135-powered mobile devices start appearing in the market, developers will have access to new technologies and features introduced by our PowerVR Series6 family such as:
- our latest-generation tile based deferred rendering (TBDR) architecture implemented on universal scalable clusters (USC)
- high-efficiency compression technologies that reduce memory bandwidth requirements, including lossless geometry compression and PVRTC/PVRTC2 texture compression
- scalar processing to guarantee highest ALU utilization and easy programming
Thanks to the PowerVR G6200 GPU inside the MT8135 application processor, MediaTek brings high-quality, low-power graphics to unprecedented levels by delivering up to four times more ALU horsepower compared to MT8125, its PowerVR Series5XT-based predecessor. PowerVR G6200 fully supports a wide range of graphics APIs including OpenGL ES 1.1, 2.0 and 3.0, OpenGL 3.x, 4.x and DirectX 10_1, along with compute programming interfaces such as OpenCL 1.x, Renderscript and Filterscript.
By partnering up with Imagination, MediaTek has access to our industry-leading PowerVR graphics, worldwide technical support, and a strong ecosystem of Android developers capable of making the most of our technology. We look forward to shortly seeing our brand-new PowerVR Series6 GPUs in the hands of millions of consumers, and see MediaTek as one of our strategic partners for our latest generation PowerVR GPUs moving forward.
End of Updates
This report consists of the following parts:
- The latest MediaTek roadmap, high-end and OS strategy
- News reports about MT6592 and its first application
Update: MediaTek True Octa [MediaTek, July 23, 2013]
Efficient video playback:
When on decoding mode, the battery used for decoding HEVC (H.265) FHD video
can be reduced by up to 18 percent compared to current quad-core solutions
(from MediaTek True Octa-Core Position Paper [MediaTek, July 23, 2013])- What is new vs. my earlier The state of big.LITTLE processing [‘Experiencing the Cloud’, April 7, 2013] report
For the preceding smartphone SoC in the current roadmap see MediaTek MT6589 quad-core Cortex-A7 SoC with HSPA+ and TD-SCDMA is available for Android smartphones and tablets of Q1 delivery [‘Experiencing the cloud’, Dec 12, 2012]. For smartphone SoCs before that see Boosting the MediaTek MT6575 success story with the MT6577 announcement – UPDATED with MT6588/83 coming early 2013 in Q42012 and 8-core MT6599 in 2013 [‘Experiencing the cloud’, June 27, July 27, Sept 11-13, Sept 26, Oct 2, 2012]. Note that MT6588 was renamed MT6589 when was launched, as MT6599 would be renamed MT6592 now.
The latest MediaTek roadmap, high-end and OS strategy
Maybank Kim Eng just published in its MediaTek Closing In Fast [July 17, 2013] report the following two SoC roadmaps:
GPU for MT6592 smartphone SoCs (and presumably for MT6588 as well) will be Mali according to Zhu Shangzu (朱尚祖), MediaTek Global Smartphone General Manager in the [Part 2] MediaTek to push 8 small cores, the mystery [ESM 国际电子商情 (International Electronic Business), July 18, 2013] exclusive interview.
According to 28nm Technology [TSMC, June 21, 2011] description: The 28nm technology node of the TSMC foundry (which is used for manufacturing by MediaTek) has a high performance (HP) process as the first option to use high-k metal gate (HKMG) process technology. The 28nm low power with high-k metal gates (HPL) technology, as the second option, adopts the same gate stack as HP technology while meeting more stringent low leakage requirements with a trade of performance speed. Explanation: From about 10 µm (1971) to below 0.1 µm (100 nm) conventional silicon oxynitride as the gate insulator with polysilicon gate, so called poly/SiON gate stack, was used for CMOS technology. It was typically possible to scale down to 45 nm (2008), only TSMC was able to scale it down further to 28 nm in which most of the current 28nm SoCs from TSMC are produced.
While Intel (and IBM) had to introduce high-K dielectric as the gate insulator with metal gate, so called High-k / Metal Gate stack, for the performance of their 45 nm products in 2008 (in order to continue with the Moore’s law in their realm) as you could see on the right (taken from Life With “Penryn” [DailyTech, Jan 27, 2007] interview with Mark Bohr, Intel Senior Fellow, and Steve Smith, Intel Vice President DEG Group Operations), TMSC could introduce that only on the 28nm node as described above. The HKMG based 28nm SoCs are much higher performance (or higher performance still with low power by HPL) as you could see from the 2GHz clockrate of the MT6592 (above) or MT8315 (below) vs. that of the convential poly/SiON counterparts, MT6589 and MT8389 with 1.2GHz.
Complementary post reminder: H2CY13: Upcoming next-gen Nexus 7, the ASUS MeMO Pad HD 7 “re-incarnation” at reduced by $50 price, dual/quad-core mid-range tablets from white-box vendors starting from $65 [‘Experiencing the Cloud’, July 5, 2013] in which there is plenty of information regarding the non high-end tablet SoCs, from MediaTek (MediaTek MT8125, MediaTek MT8377 and MediaTek MT8389) as well as competition from Allwinner and Rockchip. The pre-eminent ASUS MeMO Pad™ HD 7 described in detail there is using the MT8125 SoC, while the new Nexus 7 (to be announced before the ending of July) the Qualcomm Snapdragon 600 Quad Core SoC. In that sense we got with that post not only a complete H2 competitive tablet market picture for mid-range but some information regarding the new Qualcomm high-end as well.
For the upcoming MT8135 tablet SoC it is known from the part 3 of the Zhu Shangzu interview that the quad-core configuration will be 2xA15+2xA7, which means a big.LITTLE architecture and quite probably the already mature ‘In Kernel Switcher’ (IKS) scheduler initially GTS with MediaTek’s “advanced scheduler algorithm, combined with adaptive thermal and interactive power management” and called Heterogeneous Multi-Processing (HMP) by MediaTek (see in the updates in front of the original post). But as As ARM already decided on the architecture of the other, more general ‘Global Task Scheduling’ (GTS) solution (see much below) I would assume that the proper hardware underpinnings for GTS will already be built in (unlike in the Samsung’s Exynos 5 SoC released before), so when the scheduler software will be mature enough it will run well on MT8135. The inclusion of just two cores of each (unlike in Exynos 5) is a very strong proof-point of that. As far as the GPU is concerned we know from Zhu Shangzu interview that an Imagination GPU will be used, therefore I will leave the next-generation SGX6XX (PowerVR Series6 or ‘Rogue’) indication in the above table. Update: It is the PowerVR G6200 GPU [from the block diagram corresponds to the PowerVR G6230] as you could see from Imagination block post published on the MT8135 announcement (July 29), and included here in front of the original post.
with the following commentary:
Strong fundamentals intact. Having exceeded its 2Q13 guidance so significantly, we believe MTK will continue to ride the strong momentum in 3Q13, perhaps growing its revenue by low-to-mid-teens QoQ or 30% YoY to chalk up another record high of TWD36-38b [US$1.2-1.27B]. Importantly, a better product mix and cost structure would help lift its profitability to ±44%. We expect MTK to ship 70-72m units of smart devices, up 25-30% QoQ, with quad-core APs and tablets making up nearly 50% of total shipment. The benefits of operating leverage should drive OPM past 20%, the highest since 3Q10. MTK is set to report its 2Q13 results in late July or early August and we forecast net profit of TWD6.8b [US$227M] (EPS: TWD5.02; Street: TWD6.3b), up over 80% QoQ and 100% YoY. GM is also likely to meet the high end of its guidance, ie, 43.5%, on richer mix and improved cost structure. Reported revenue of TWD33.3b, up almost 40% QoQ and 42%YoY, is already well ahead of guidance (TWD30-32b). However, we cut our FY13/14 earnings forecasts by 3% each to factor in the delay in merger with MStar and potential inventory correction in 4Q13/1Q14. MTK remains a key BUY in our tech space.
Closing in fast on QCOM. MTK has spared no efforts to enhance its smart device portfolio since 2H12 and further signs of acceleration are evident. It is introducing two high-end APs in 4Q13 – MT6588 and MT6592 – using 28nm HKMG and advanced graphic features. While the former is a quad-core AP operating at 1.7GHz, the latter is capable of running at 2GHz (when all eight core engines are turned on). In the absence of full details, we estimate MT6592 may perform closer to Qualcomm Snapdragon 600 AP (used in Galaxy S4 and HTC One), while MT6588 should outshine Snapdragon 400. MTK has won several international OEMs with MT6589 and with MT6588/6592, its chances of penetrating tier-1 OEMs have increased significantly. In addition, it will sample its high-end 4G/LTE/LTE-TDSCDMA modem chipset in anticipation of the launch of 4G network in China later this year. As for tablets, MTK’s latest APs MT8125/8389 were well-received and it is set to deliver the high-end MT8135 (big.Little design) in 3Q13. We expect its smartphone/tablet shipments to reach 200-225m/25m units in 2013.
In the same part of the interview Zhu Shangzu explained MediaTek’s high-end strategy as follows (as translated by Google and Bing with manual edits):
… I think the future of high-end smartphones innovation will focus on the expansion of big screen multimedia applications, and this is our direction. …
Judging from the current situation, customers of high-end flagship phones are still using the products of the competitors, but there is flagship in our quad-core case as well, and OPPO, Vivo and GiONEE and other quad-core phones are also very popular. Our next goal is to get the customers of flagship machines using our platform via helping customers to achieve stronger performance on the big screen multimedia.
Therefore, the 8-core MT6592 can be regarded as our first bugle call for moving towards the high-end market. Our mission is that one day customers can also recognize MediaTek as doing high-end flagship products. MT6592 is the first step, strictly speaking, it is not the most high-end platform, next we will move step by step towards the higher end.
Q: Why will MediaTek use eight small A7 cores as a generation of high-end platform, but did not choose to use four large A15 cores or four big and four small ones as a way to achieve the goal? This is also a question for the industry as there are many controversial issues with this.
For power, or performance per watt, we did a lot of investigation. Eight A7 cores is currently the best solution, and as through a process we designed to boost peak frequency of the A7 to 1.9-2Ghz, performance is also very strong.
Currently we chose a small core, because under the existing process, the larger the chip die size, the larger is the standby leakage, resulting in higher standby power consumption. For example, the A15 is the strongest core currently, but not in run-time power cosumption. Even if its frequency is pushed down to very low levels, there is still a larger leakage. Therefore, the larger is the area of a single-core, the larger is the overhead energy efficiency, and as long as the poweris on, there will be a greater leakage.
In addition, the 8-core CPU is just one aspect of improving the mobile multimedia experience. In fact, as we have been doing MediaTek digital TV for a long time, we will extend that digital TV competency here – some strong move for the smartphones. This is what other platform vendors can not do. In the 6592, for example, the latest HEVC codec will be integrated. [HEVC is a video compression standard, a successor to H.264/MPEG-4 AVC]
…
Although our MT6592 GPU is also using a ‘Deluxe’ Mali quad-core GPU, but in order for content developers to achieve better compatibility, our HEVC is a software solution via the 8-core CPU, it is not using a GPU- based software solution. Because there are some strong content developers who will use their own HEVC decode. Currently the ‘Deluxe’ quad-core GPU on 6592 is mainly used to perform large-scale games and to do some advanced UI.
[Part 3] How to plan the future in the tablet market?
Q: I do note that the MT6592 is now using a quad-core Mali GPU, while before the MediaTek mainstream used Imagination GPU. How would you rate these two companies’ products?
The Imagination company has been doing GPUs long time in its history, the architecture design is beautiful, more artistic. The initial architecture of Mali [from ARM] would be more rough, and therefore area and power consumption will be worse. But after nearly three years of time, Mali has made a lot of progress, both are learning from each other, and by now the levels of these two are equal. The future perspective is that ARM’s overall resources are somewhat more fully available.
Q: This year we have seen MediaTek to attack the tablet market, what is the plan for the future in the tablet market?
A: Our current strategy is to carry out a mobile phone product line extension.
At the end of July the launch of a tablet chip is expected: the MT8135, with 2xA15 +2xA7, still using an Imagination GPU [Update: It is the PowerVR G6200 GPU (from the block diagram corresponds to the PowerVR G6230) as you could see from Imagination block post published on the MT8135 announcement (July 29), and included here in front of the original post], and mainly targeting the high-end tablet market. A small reminder, our MT6572 is not suitable for tablet computers as the original definition did not take into account the application of flat-screen.
…
[Part 6] If Google Android OS will be converged how MediaTek will respond?
Q: There is also a very large concern, as the industry is worried that after doing their own hardware next year (e.g. Xphone, watches, glasses, etc.) whether Google will close the Android OS, i.e. to do a Pure Android later on, and don’t let OEMs to change it? MTK will also have a very big impact, what do you think? What is the MTK attitude on other free OS’s?
A: If Google OS will be closed and converged that will have a huge impact on us. But from what we observe and communicate with Google, they will not close the OS or converge it. Google’s profitability does not depend on OS, he is relying on the service for profit. By doing hardware Google also aims to promote his services, he is very happy to use someone else’s machine on their home services.
Of course, we will also be prepared, as we comprehesively examine and take into account the prevailing factors. We will use Windows as a second priority, while using Firefox [OS] and HTML5 as a secondary backup, by keeping track of them. Because we judge that the [Android] OS convergence from Google profitability point of view is very low, therefore our vote for these two emerging open OS’s is in the ‘not so urgent’ category, in addition to and outside of Android. The other focus is again on Windows Phone 8. For the moment, however, WP8 hardware configuration requirements are still higher (mainly memory), power consumption – after optimizing the gap with Android – is not too large.
…
News reports about MT6592 and its first application
Update: MediaTek True Octa [MediaTek, July 23, 2013]
Update: MediaTek True Octa [MediaTek, July 23, 2013]
Efficient video playback:
When on decoding mode, the battery used for decoding HEVC (H.265) FHD video
can be reduced by up to 18 percent compared to current quad-core solutions
(from MediaTek True Octa-Core Position Paper [MediaTek, July 23, 2013])
July 18 this information appeared on the English http://en.v5zn.com/ website of the related smartphone vendor as well: MediaTek MT6592’s first eight-core mobile phone exposure makes you believe [July 15, 2013] as translated by Google and Bing with manual edits
MediaTek so-called true eight-core processor MT6592 was announced not long ago, it is expected the first models equipped with processors to surface. It broke the news, that the domestic mobile phone manufacturer brand named after the 19th-century French writer Jules Verne [凡尔纳] has been determined to launch a flagship model “V8” quipped with the MT6592 processor.
Verne’s current main product is the “V5” model, equipped with a quad-core MediaTek MT6589, and a 5-inch 720p OGS full lamination screen, 1GB of RAM, 4GB storage, 8-megapixel back-illuminated camera, 2400 mAh Battery, with a list price of 999 yuan [$166].
V8 has not yet announced the exact configuration bit it is estimated to have about 5.5 inch 1080p screen, 2GB RAM, 32GB storage, 13 million pixels Sony stacked camera, higher capacity battery, etc., without these natural shot himself embarrassed flagship.
It looks like that cooperation between MediaTek and the domestic Shanzhai vendors remains close. As MT6589 has rocked the Main Street, MT6592 will soon become a standard, and “an eight-core” promotion will be overwhelming.
Incidentally recap: MT6592 uses eight Cortex-A7 architecture cores, clocked at up to 2.0GHz, with TSMC 28nm manufacturing, Antutu run is known as close to 30,000, but the graphics core has not been confirmed,
PowerVR SGX 544MP4/554MP4 are likely[it will be Mali, as communicated by MediaTek, see above].The marketing of the processor has begun to customers, but mass production will be in November, so if recent high profile publicity is to be fulfilled, certainly we will have a large sale early next year.
Company introduction [Jules Verne mobile phone, January 16, 2013] as translated by Google and Bing with manual edits
Shenzhen MINDRAY Platinum Communication Technology Ltd. is is specialized in products development, production, sales and service of intelligent mobile terminals of high-tech companies. Under the “Jules Verne VOWNEY” brand the company is to create a mobile intelligent terminal brand.
MINDRAY Platinum company with “intelligent life” as the brand mission, is to “enhance the user experience, to help people grasp the development opportunities” as the goal, trying to make Jules Verne a trustworthy, continuous innovation and smart moves life guide. Every effort, just as long as you!
Jules Verne mobile phone network direct sales, stripping agents layers, increases direct benefits to consumers. We are committed to allow more consumers to have a better quality of life with an intelligent terminal.
The “Jules Verne VOWNEY ” brand aspires to be able to improve the quality of life for mobile users intelligent terminal INITIATIVE persons.
is to become quality of life can improve the user moves Smart The Terminal Guide. Lead you into “Slide 5.0”.
“Verne VOWNEY “brand aspires to be able to improve the quality of life for mobile users intelligent terminal INITIATIVE persons. I lead you into the “Slide 5.0″era.
Brand interpretation
Jules Verne: a derivative of intelligent life???
English explanation : VOWNEY
V : value— Value
O : opportunity— Opportunity
W : worth— It is worth
N : new— New
E : e— Mobile Internet
Y : you— YouJules Verne is to ” create a new life guided smart” as the goal, and strive to become a trusted, sustainable and innovative mobile phone brand, all efforts, just because of you!
Mediatek MT6592 8 core processors coming by the end of July! [Gizchina.com]
Reports out of Taiwan state that Mediatek will launch the MT6592 8-core processor by the end of July.
There was word that Mediatek were working on an 8 core chipset late last year, but like many we believed it had been placed on the back burner while they prepared their LTE chip. This seems to be wrong though as sources in Taiwan claim that Mediatek’s 8-core processor will arrive before the end of this month!
The MT6592 chip will be made up of 8 Cortex-A7, 28nm processor clocked at a frequency of up to 2Ghz! Early tests have the 8 core MT6592 scoring up to 30,000 points in Antutu which is more than Samsung’s 8 core Exynos 5410 processor.
The first batch of these new processors will be ready for manufacturers to begin development by the end of July, while Mediatek are preparing full-scale manufacture for November!
If everything goes to plan we can expect powerful 8 core phones from Tier 1 Chinese phone manufacturers by December!
MediaTek to launch true 8-core, 2GHz MT6592 chipset in November? [Engadget, July 2, 2013]
Samsung may already have its 8-core Exynos 5 Octa offering, but the original “big.LITTLE” implementation means only up to four cores work together at any time — either the Cortex-A15 quartet or its lesser Cortex-A7 counterpart. In other words, we’d rather rename the chipset range to something like “Exynos 5 Quad Dual.” But according to recent intel coming from Taipei and Shenzhen, it looks like Taiwan’s MediaTek is well on its way to ship a true 8-core mobile chipset in Q4 this year.
The first mention of this 2GHz, Cortex-A7 MT6592 chip came from UDN earlier today. The Taiwanese publication claims MediaTek started introducing its first octa-core product to clients last week, and it’s expected to enter mass production using TSMC’s 28nm process in November. The first mobile devices to carry this hot piece of silicon may hit the market in early 2014 — hopefully just in time for the Chinese New Year shopping rush.
UDN adds that the MT6592 scored close to 30,000 on AnTuTu, which is pretty high but still some distance behind Qualcomm’s 2.2GHz quad-core Snapdragon 800. Of course, chances are MediaTek’s offering will be much cheaper, as evidenced by all the affordable MediaTek-powered devices in China these days.
In a separate article from last week, UDN pointed out that judging by over a hundred job openings released by MediaTek last month, the company is clearly putting an emphasis on 4G LTE technology, alongside GPU and Android development. The publication also quoted chairman Tsai Ming-kai saying he will launch an LTE solution in Q4 this year, by which point MediaTek will only be one or two years behind its competitors.
The second piece of info came from HQ Research analyst Pan Jiutang, who posted an alleged spy shot of MediaTek’s upcoming roadmap (pictured left). There the octa-core MT6592 is listed with a clock speed of 1.7GHz to 2GHz, along with 1080p 30fps video decoding support. There’s also a quad-core 1.7GHz MT6588 accompanying its octa-core sibling in the same period on the timeline, though it appears to be just a faster version of the current 1.2GHz MT6589.
For the sake of phone manufacturers, both new chipsets will apparently be pin-to-pin compatible with the quad-core 1.3GHz MT6582 due Q3 this year, thus lowering R&D costs. Better yet, the roadmap also states that the MT6290 LTE modem — as teased by Tsai above — will be compatible with these three chipsets.
With MediaTek quickly catching up ahead of China’s eventual TD-LTE launch, Qualcomm will need to tread carefully to keep its Chinese QRD partners happy.
[Thanks, Ryan!]
Update: It’s worth noting that ARM’s eventual “big.LITTLE MP” implementation will allow all eight cores to run simultaneously, but the Exynos 5 Octa currently doesn’t support this. Thanks, UncleAlbert!
SOURCE: Sina Weibo (login required), UDN (1), (2)
What is new vs. my earlier
The state of big.LITTLE processing [‘Experiencing the Cloud’, April 7, 2013] report
Power scheduler design proposal [by Morten Rasmussen from ARM on Linux kernel mailing list, July 9, 2013]
This patch set is an initial prototype aiming at the overall power-aware scheduler design proposal that I previously described <http://permalink.gmane.org/gmane.linux.kernel/1508480>.
The patch set introduces a cpu capacity managing ‘power scheduler’ which lives by the side of the existing (process) scheduler. Its role is to monitor the system load and decide which cpus that should be available to the process scheduler. Long term the power scheduler is intended to replace the currently distributed uncoordinated power management policies and will interface a unified platform specific power driver obtain power topology information and handle idle and P-states. The power driver interface should be made flexible enough to support multiple platforms including Intel and ARM.
This prototype supports very simple task packing and adds cpufreq wrapper governor that allows the power scheduler to drive P-state selection. The prototype policy is absolutely untuned, but this will be addressed in the future. Scalability improvements, such as avoid iterating over all cpus, will also be addressed in the future.
Thanks,
Morten
From <http://permalink.gmane.org/gmane.linux.kernel/1508480>
…
+-----------------+ | | +----------+ current load | Power scheduler |<----+ cpufreq | +--------->| sched/power.c +---->| driver | | | | +----------+ | +-------+---------+ | ^ | +-----+---------+ | | | | | | available capacity | Scheduler |<--+----+ (e.g. cpu_power) | sched/fair.c | | | +--+| +---------------+ || ^ || | v| +---------+--------+ +----------+ | task load metric | | cpuidle | | arch/* | | driver | +------------------+ +----------+…
Linux Kernel News – June 2013 [by Shuah Khan in Linux Journal , July 9, 2013]
As always the Linux kernel community has been busy moving the Linux mainline to another finish line and the stable and extended releases to the next bump in their revisions to fix security and bug fixes. It is a steady and methodical evolution process which is intriguing to follow. Here is my take on the happenings in the Linux kernel world during June 2013.
Mainline Release (Linus’s tree) News
Linus Torvalds released Linux 3.10. You can read what Linus Torvalds had to say about this release in his release announcement athttp://lkml.indiana.edu/hypermail/linux/kernel/1306.3/04336.html
Two notable features in this release are improved SSD caching and better Radeon graphics driver Power Management.
…
Power efficient scheduling design
Ingo Molnar (Red Hat, x86 maintainer), Morten Rasmussen (ARM, power mgmt.), Priti Murthy (IBM, scheduler), Rafael Wysocki (Intel, Linux PM, and Linux ACPI maintainer) and Arjan van de Ven discussed the proposed power-aware or power-efficient scheduler design and what’s the best way to integrate it into the kernel.
Power management and the ability to balance performance and power efficiency is important and complex. It is not just about scheduler or cpus. It spans I/O devices that transition into lower-power states and how costly it is to bring them back to fully active state when needed. There is latency involved in these transitions. As always, Linux developers reach consensus to solve complex problems such as these and come up with path to get to the goal taking small steps towards that goal. Here is another example of that process at work.
Power-efficient scheduler work has been active for a few months now. Several RFC patches have been floated and discussed. This work is being pursued very actively in x86 space by IBM and in ARM space by ARM. The premise is that, if scheduler could pack tasks on a few cores and keep these cores fully utilized and, transition other cores to low power states, when the scheduling goal is power savings over performance. In other words, instead of keeping all the cores active, scheduler could consolidate tasks on a few cores and transition other cores to low-power states for better power efficiency.
It is easier said than done. Scheduler is at a higher level and would not be the best judge of making decisions on transitioning CPUs to idle states and deciding on the ideal frequency they should be running at. These decisions are better left to platform drivers that have the specific knowledge of the platform and architecture as they are complex and very hardware specific. In other words, power aware scheduler tuned to run well on x86 platforms will not work as well or could fail miserably on ARM platforms.
Scheduler has to accomplish load balancing as well as power balancing in a way to meet performance and power goals and do it well on all platforms. A generic scheduler doesn’t have to control and drive low-power state decisions on a platform. However, the goal of power-efficient scheduler is to set higher level abstracted policies that would work on all platforms. After a long and productive discussion, there is a consensus and here is the summary:
- A new kernel configuration option CONFIG_SCHED_POWER to enable/disable the power scheduler feature. Power scheduler is totally inactive, when CONFIG_SCHED_POWER is disabled, and fully active when CONFIG_SCHED_POWER is enabled. The important goal is evolving the power scheduler feature without disrupting and destabilizing the current scheduler.
- Work on a generic power scheduler with hardware and platform abstractions that will work well on big little ARM, x86, and other platforms. Avoid platform specific power policies that could lead to duplication of functionality in platform specific power drivers.
Please check the Linux Foundation site for presentations made at the Linux Collaboration Summit back in April 2013 on this topic. Here is the link to Jonathan Corbet’s blog on this topic.
http://www.linux.com/news/featured-blogs/200-libby-clark/715486-boosting……
From: big.LITTLE Software Update [by George Grey on Linaro Blog, July 10, 2013]
There are also two software models now available, that ARM and Linaro have developed to enable control of workloads, performance, and power management on big.LITTLE SoCs.
The first is the IKS [In Kernel Switcher, also known as CPU Migration]software, developed by Linaro, that treats each pair of Cortex-A7 and Cortex-A15 cores as a single ‘virtual’ core. On a multicore SoC each pair is treated as 1 of n virtual symmetric cores by the Linux kernel.
Core Software Configuration for IKS (4+4)
Using existing mechanisms in the Linux kernel for each pair the cpufreq driver controls whether the Cortex-A7 is active (for low power) or the Cortex-A15 is active (for maximum performance). Overall maximum performance and throughput on a 4+4 core SoC is from 4 Cortex-A15s. The key attribute of IKS is that it relies on existing well-understood mechanisms in the Linux kernel and it is easy to implement, test and characterize in a production environment.
The second is the Global Task Scheduling (GTS) [also known as big.LITTLE MP or Heterogeneous Multi-Processing (HMP)] software developed (and now named) by ARM. This is known in Linaro as big.LITTLE MP. Using GTS all of the big and LITTLE cores are available to the Linux kernel for scheduling tasks. We are very proud that Linaro has contributed to ARM’s development of the GTS software, and that it is now publicly available in Linaro builds. ARM and Linaro recommend GTS for new products, and Linaro members are actively planning product deployments using this solution.
Core Software Configuration for GTS (4+4)
…
The big.LITTLE MP patch set creates a list of Cortex-A15 and Cortex-A7 cores that is used to pick the target core for a particular task. Then, using runnable load average statistics, the Linux scheduler is modified to track the average load of each task, and to migrate tasks to the best core. High intensity tasks are migrated to the Cortex-A15 core(s) and are also marked as high intensity tasks for more efficient future allocations. Low intensity tasks remain resident on the Cortex-A7 core(s).
IKS and GTS are now publicly available in Linaro monthly engineering releases for the ARM TC2 Versatile Express hardware, and in Linaro’s interim Long Term Supported Kernel (LSK) build. Both will also be incorporated into the first full Linaro LSK, which will be based on the next Linux Foundation, Greg Kroah-Hartman designated, Long Term Supported (LTS) kernel.
…
Until GTS functionality is fully upstream, ARM is supporting the big.LITTLE MP patch set for its licensees, leveraging Linaro’s public monthly and Linaro LSK builds, so that it is available to all ARM licensees for product integration and deployment. Linaro also expect to provide a topic branch for the latest work available on the upstream GTS implementation for interested developers.
… ARM and Linaro now recommend product development and deployment to be based on the GTS solution. However, there are some cases where hardware limitations or a requirement for the traditional Linux scheduler (for example in some embedded applications) may lead to IKS still being required.
Future Work
Power management software in Linaro is worked on by the Power Management Working Group. Other activities within the Group will enable additional power savings on ARM multi-core devices. One current project worth highlighting is the work being done by Vincent Guittot on small-task packing. Normally the Linux kernel will spread running tasks over all the available CPU cores. On a handset in standby, or even when being used with low activity, there may be a number of housekeeping and other small tasks that run in the background or relatively infrequently and therefore keep cores active unnecessarily. If “small” tasks can be migrated to one core, then the other cores could be made idle or even turned off completely, potentially resulting in significant power savings. This feature is expected to offer improved power management to systems based on symmetric multi-core SoCs (for example dual or quad-core Cortex-A7 or Cortex-A15 parts), as well as big.LITTLE SoCs.
While the current big.LITTLE efforts are focused on Cortex-A15 and Cortex-A7, the techniques being implemented today for 32-bit systems are already being run on 64-bit models. We therefore expect to see the GTS software running on 64-bit Cortex-A57 and Cortex-A53 based big.LITTLE SoCs as soon as they become available.
Real Life Results
ARM has published further information on big.LITTLE configurations and performance in a blog entry here [Ten Things to Know About big.LITTLE [Brian Jeff on SoC Design blog of ARM, June 18, 2013]].
The first commercial products based on big.LITTLE are certain international versions of the latest Galaxy S4 phone from Linaro member, Samsung. Samsung-LSI provide an ‘Octa-core’ 4+4 big.LITTLE chip for this phone. As has been publicly noted, the current generation of hardware cannot yet take full advantage of the IKS or the GTS designs because the hardware power-saving core switching feature is implemented on a cluster basis rather than on a per-core or a per-pair basis. Even so, the first big.LITTLE implementation produces performance and power consumption on a par with the latest Qualcomm multi-core Snapdragon processor according to reviews from Engadget, PocketNow and others. Often first implementations of new technology never see the light of day – it is a tribute to Samsung’s engineers that the Exynos 5 is already seeing the Cortex-A15 level of performance with the power saving of the Cortex-A7s in a mass market handset in the very first big.LITTLE iteration.
We look forward to seeing what improvements full use of GTS will bring when used on future production devices from Samsung and others.
More information: Power Management with big.LITTLE: A technical overview [by Steven Willis in SoC blog of ARM, June 20, 2013]
Why all this sudden attention on the Linux Scheduler? [LCE13, Linaro Connect Europe]
12:00 PM – 13:00 PM on Monday, Jul 8, 2013 (IST)
Description
The Linux scheduler is getting a lot of attention in the ARM ecosystem these days. Come to this discussion to find out why.
Several people working on the scheduler or interested in changes to the scheduler will be invited to talk about their requirements, what is the state of their work, who will benefit from it, etc.
Minutes of the above discussion
Determinism: problems
———————* Preemption: interrupts, locking
* Latency
* Scheduling overhead
* Realtime processingMost of the requirements are coming from LEG/LNG.
Solutions:
– PREEMPT_RT
– Adaptive NO_HZ (merged in 3.10)Came out of high-performance computing. When there is just one
task, the scheduler is switched off for that CPU. Results in
zero scheduler overhead. When the only task finishes – the CPU
will get into scheduling/idle again.There is still once-per-second tick for scheduling. There
is a patch removing that last remaining bit to make it fully
tickless.We’re not sure yet if all the possible limitations are found –
there still might be some scheduler overhead left.
If interrupt handling is offloaded to other cores, caching
related issues will still affect performance (e.g. serving IO
interrupts for the task on a different core will require the
dedicated core to cache the date once again).– Deadline
Physical process isolation: none addresses
– Needed for KVM.
Temporal isolation: all three (with some limitations)
No scheduling overhead: ADAPTIVE NO_HZ only.
Firm/Hard Real-time PREEMPT_RT only
Complexity:
high for PREEMPT_RT
low for the restRequirements:
all of the abovePower efficiency: history
————————-
* sched-mc (got removed)
* big.LITTLE MP patches implementing GTS (ARM)
* Packing Small Tasks (Linaro/ARM)
Pack all small background tasks on as little number of small cores
as possible to conserve power.Intel approach does not care about which core is selected as the
best one (Turbo Mode is effectively converting the core into a BIG
core, while all the other cores are becoming little ones). Task
migration is expensive – this approach helps avoiding it.* Power aware scheduling (Intel)
Discussions were lasting for a while and then Ingo Molnar requested
an integral solution (not a set of independent bits).He made a good point. What we have an SMP legacy implementation.
Are we starting from scratch because of that?
It is going to be a significal change. We need to re-think as it’s
not SMP case anymore. b.L is not a new architecture – Intel already
does that but differently.The task is to find the most efficient way of performing the work
needed. The best place to make those decisions is the scheduler.Power officiency – proposal (from ARM)
————————————–Separate process and power scheduler (ARM). This is the first step
to get to the fully integral scheduler in the future. Helps fighting
with the complexity at hand. In this case there are certain
limitations – one of the schedulers will be leading while the second
one will be limited.That doesn’t work well for Intel CPUs (no pre-configured small/BIG
cores).Issues:
– Topology
Missing:
– Frequency domains, which CPUs are affected. That would be
useful for the scheduler.– Idle + DVFS
Missing:
– information about the cost of using a certain core at certain
DVFS operation point to perform a certain amount of work.– Thermal
The idea is to keep an eye on the temperature trend to avoid
cases when whole cores are needed to be temporarily shut down to
cool them down.GPU contribution into the thermal budget should also be
considered.Trying to control DVFS from the scheduler. Patches are expected very
soon.Q: How much of the improvements are we looking for (power wise)?
A: Something that will get upstream. 😀
Linux 3.10 [by Linus Torvalds on Linux kernel mailing list, June 30, 2013]
Linux kernel 3.10 arrives with ARM big.LITTLE support [Engadget, July 1, 2013]
Thanks to Linus Torvalds’ figurative stroke of the pen, the Linux kernel 3.10 is now final — paving the way for its inclusion in a bevy of Linux distributions, and even offshoots such as Android and Chrome OS. The fresh kernel brings a good number of changes, such as timerless multitasking, a new caching implementation and support for the ARM big.LITTLE architecture. In simplistic terms, the new multitasking method should help improve performance and latency by firing the system timer only once per second — rather than 1,000 times — when tasks are running. Meanwhile, users with both traditional hard drives and SSDs will find performance benefits from bcache, which brings writeback caching and a filesystem agnostic approach to leveraging the SSD for caching operations. Also of significance, Linux kernel 3.10 enhances ARM supportby including the big.LITTLE architecture, which combines multiple cores of different types — commonly the Cortex-A7 and Cortex-A15 — that focus on either power savings or performance. The full list of improvements is rather lengthy, but if you feel like nerding out with the changelog, just grab a caffeinated beverage and get to it.
Linaro 13.06 Released! [by Amber Graner on Linaro Blog, June 27, 2013]
The Linaro 13.06 release is now available for download!
…
It’s been a very active cycle for the Builds and Baselines team, reporting that the Continuous Integration (CI) loop for the Linaro Stable Kernel (LSK) Android proof of concept which is based on 3.9.6 kernel version was set up and includes the big.LITTLE IKS and MP patches (also called beta patchset). Support for Kernel CI loop with Android filesystem was added to android-build and CI loop was set up to track the ARM Landing Team (LT) integration tree. The HiSilicon member build with complete CI loop was set up and now tracks the LT kernel tree.
…
H2CY13: Upcoming next-gen Nexus 7, the ASUS MeMO Pad HD 7 “re-incarnation” at reduced by $50 price, dual/quad-core mid-range tablets from white-box vendors starting from $65
(while entry level will start from $40) … with that there would be tremendous pressure on low-volume tablet supliers (branded or white-box alike), as well as Samsung and Apple. Meanwhile China strengthens its position as the world leading PC Market.
Complementary post reminder:
Eight-core MT6592 for superphones and big.LITTLE MT8135 for tablets implemented in 28nm HKMG are coming from MediaTek to further disrupt the operations of Qualcomm and Samsung [‘Experiencing the Cloud’, July 20, 2013] from which the following excerpts I will include here as the ones directly related to the content given here as well:
At the end of July the launch of a tablet chip is expected: the MT8135, with 2xA15 +2xA7, still using an Imagination GPU, and mainly targeting the high-end tablet market. If Google OS will be closed and converged that will have a huge impact on us.
… We will use Windows as a second priority, while using Firefox [OS] and HTML5 as a secondary backup, by keeping track of them. Because we judge that the [Android] OS convergence from Google profitability point of view is very low, therefore our vote for these two emerging open OS’s is in the ‘not so urgent’ category, in addition to and outside of Android. The other focus is again on Windows Phone 8. For the moment, however, WP8 hardware configuration requirements are still higher (mainly memory), power consumption – after optimizing the gap with Android – is not too large.
End of the complementary post reminder
Rumor: New Nexus 7 specs, features and launch details mentioned in chat with Asus rep [Android Authority, June 30, 2013]
AE: The Tablet should be released before the ending of Q2
C: when exactly is before Q2?
AE: That will be before the ending of July…
AE: There has not been confirmed specification as yet, but here is some basics specification , that you can look at:
7 inch LED with 1980*1200 resolution
Qualcomm Snapdragon 600 Quad Core CPU / Snapdragon APQ8064 CPU
2GB of RAM
32GB internal storage
5Mpx rear camera and 1.2Mpx front camera
Android 4.3
4000mAh battery
Wifi a/b/g/n,Bluetooth 4.0 and NFC enabled
LTE / WCDMA / GSM supportThis is not confirmed specifications but you can review it
vs. the first one: Nexus 7: Google wanted it in 4 months for $199/$245, ASUS delivered + Nexus Q (of Google’s own design and manufacturing) added for social streaming from Google Play to speakers and screen in home under Android device control [‘Experiencing the Cloud’, June 28, 2012] which already has an ASUS only “reincarnation:
Experience MeMO Pad HD 7 [asus YouTube channel, June 16, 2013]
- 7-inch HD [1280 x 800] tablet with a wide-view angle IPS display for stunning visuals
- Rear 5MP and front 1.2MP dual cameras to capture the moments
- Dual stereo speakers with Sonicmaster Technology for incredible sound effect.
- Ultra light, weighs only 302g
- Up to 10 hrs battery life to make it through your day
ASUS Announces MeMO Pad HD 7 and MeMO Pad FHD 10 Tablets [press release, June 3, 2013]
ASUS MeMO Pad™ HD 7 — the value tablet for mobile entertainment
ASUS MeMO Pad™ HD 7 has a quad-core processor and 1GB RAM for smooth and responsive performance with apps of all kinds. The 7-inch display has a 1280 x 800 native resolution for crisp text and images, and IPS technology for accurate, vibrant colors with 170-degree wide viewing angles. MeMO Pad™ HD 7 also features high-quality stereo speakers with enhanced sound, courtesy of ASUS SonicMaster audio technology.MeMO Pad™ HD 7 has a 1.2-megapixel front-facing HD camera that can capture 720p HD videos and models are also available with a rear 5-megapixel camera. Just 10.8mm thick and 302g, the feature-packed MeMO Pad™ HD 7 has a lithium polymer battery that lasts for up to 10 hours with 720p video playback. Models are available in four colors — black, white, pink and green.
MeMO Pad™ HD 7 has 16GB of storage and a MicroSD card slot, plus 16GB ASUS WebStorage free for one year. Together with the ASUS WebStorage Office, users can view, create, edit and share Microsoft Office documents online.
AVAILABILITY & PRICING
ASUS MeMO Pad™ HD 7 has an MSRP of US$129 for 8GB capacity and US$149 for 16GB [a “follow up” to the $199 Nexus 7 tablet developed jointly by Google and ASUS and announced a year ago], and will be available starting in July 2013.
Asustek and HP enter China tablet market with entry-level models [DIGITIMES, July 1, 2013]
Asustek Computer and Hewlett-Packard (HP) are both set to enter the China tablet market with new cheap tablet models: the Asustek 7-inch 8GB MeMO Pad HD 7, priced below CNY999 (US$163) and HP Slate 7, priced at CNY999 [$163], according to sources from channel retailers.
Asustek’s 8GB MeMO Pad HD 7 will be supplied to the China market exclusively and is expected to appear later in July.
Prior to Asustek and HP, Acer already offered its 7-inch Iconia B1-A71 tablet [1.2GHz dual-core MT8317T based] at CNY699 [$114], while Lenovo is pushing its A1000 for a price of CNY999 [$163].
Compared to first-tier vendors, most China-based white-box tablet players are offering their products at prices between CNY299-500[$49-81.5], giving them advantages in pricing, but first-tier vendors still outmatch white-box players in product quality, specifications and after-sales service, the sources said.
Currently this is the best 7” quad-core offering from purely mainland China technology:
7” quad-core Allwinner A31s based Onda tablets for $65 (v701s) and $81 with IPS (v711s) in China, while for $89 and $99 outside [‘USD 99 Allwinner’, June 22, 2013] for which here is the Onda V711s Quad Core A31s 7″ IPS Tablet PC In-depth Review [dealsprime YouTube channel, June 24, 2013]
With and 1280×800 resolution Onda V712 quad-core version is available from April 8, 2013. The current price for Onda V712 Quad Core RAM 2GB 7 Inch IPS Screen Android Tablet 16GB outside China is $139 (699 yuan, $114 inside). It has 0.3MP front and 2MP back camera (vs. 1.2MP front and 5MP rear on ASUS MeMO Pad HD 7), but its video capability is 4K.
Meanwhile the cheapest dual-core mid-range tablet from white-box vendors is the new ICOO D70PR03 for 399 yuan i.e $65. This is with 1.2GHz Allwinner A20 SoC and 1024×600 IPS screen.
China white-box tablet players seeing success in landing government procurement orders [DIGITIMES, July 1, 2013]
China-based white-box players are gaining the upper hand in the competition with first-tier brand vendors for tablet procurement orders from Asia Pacific governments due to their advantages in pricing, while improved product quality and stability also helped the white-box players to narrow their gap with first-tier players, according to sources from tablet players.
The government in Thailand recently released procurement orders for 1.6 million education-purpose tablets which were mostly taken by a China-based white-box player, and first-tier vendors are having trouble competing due to considerations about profitability, the sources noted.
The sources pointed out that the white-box maker landed orders for a total of 800,000 tablets from the Thailand government worth NT$1.57 billion (US$52.35 million), equivalent to a price of NT$1,900-2,000 [US$63-67] for each device.
However, even with such a low price, the sources believe the white-box maker is still profiting from the orders.
Currently, an entry-level 7-inch tablet from a China white-box player is priced at about US$50 and can go up to US$70-90 in the retail channel, giving them strong advantages in price competition.
Although first-tier brand vendors are also aggressively trying to enter the entry-level tablet market, white-box players are still expected to achieve shipments of 120 and 170 million units in 2013 and 2014, respectively.
Thailand school kids get tablet computers [Aljazeera via AussieNews1 YouTube channel, Aug 23, 2012]
Surprise auction winners [Bangkok Post, June 29, 2013]
Dark horses Shenzhen Yitoa Intelligent Control Co of China and Supreme Distribution (Thailand) won yesterday’s bidding for the second phase of the One Tablet per Child scheme to supply 1.22 million tablets, beating out Shenzhen Scope Scientific Development.
The Chinese firm clinched the bid for the first and second zones, while the Thai company won the contract for the third zone.
The Office of the Basic Education Commission (Obec) held an e-auction for the tablets yesterday seeking bidding winners to supply 1.63 million tablets.
Education Minister Phongthep Thepkanchana said Shenzhen Yitoa won a bid to supply 431,105 tablets for Prathom 1 students worth 842 million baht for the first zone in central and southern provinces.
The company offered a price of 1,953.12 baht [$63] per tablet, 28.2% lower than the median price set at 2,720 baht each.
According to earlier information: “The tablet will have government specifications of a seven-inch display with a camera resolution of 1024×600 pixels, a minimum 1.5-gigahertz dual-core processor unit, one gigabyte of RAM, eight gigabytes of storage memory, 3,600 milliampere hours of lithium polymer battery life, and continuous Wi-Fi internet access for at least three hours.”
The Chinese firm also won the bid to supply 373,637 tablets for Prathom 1 students worth 786 million baht for the second zone in the northern and northeastern provinces.
The company offered 2,103.64 baht [$67.5] per unit, 22.7% below the median price.
Supreme Distribution, meanwhile, proposed the lowest price for tablets in the third zone, covering Mathayom 1 students in the central and southern provinces, at 2,908.24 baht [$93], down slightly from the median price of 2,920 baht.
The Thai computer assembly firm will supply 426,683 tablets worth 1.24 billion baht.
Obec postponed the bid for the fourth zone – covering some northern and northeastern provinces – to July, as Shenzhen Yitoa was the only bidder in the auction. The conditions require at least two bidders in competition.
Mr Phongthep said purchasing contracts are expected to be sealed in the week ahead. All winners are obliged to deliver their tablets within 90 days of signing contracts.
Panuwat Khantamoleekul, the managing director of Supreme Distribution, said the company could not offer a sharp rate cut since Mathayom 1 specifications are higher than those for Prathom 1.
He said his company will build its own factory in Thailand to assemble materials sourced from China.
It set up a local office here two decades ago and also won an earlier bid to supply tablets in Russia.
Shenzhen Yitoa Digital Appliance Co. Ltd [Global Sources, April 14, 2013]
Offering a Wide Range of Electronic Products
Shenzhen Yitoa Digital Appliance was founded in 2007, which is affiliated to Shenzhen Yitoa Intelligent Control Co., Ltd. We are a nationally known enterprise designing, developing, manufacturing and selling intelligent controllers of digital equipment. Our main products include e-book readers, MIDs, tablet PCs and other devices.Releasing Three New Products Monthly
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Leading Tablet PC Brands Reduce 2013 Targets [DisplaySearch blog, June 27, 2013]
We recently pointed out [Smaller Tablets to Get Even More Popular in the Second Half of 2013 [DisplaySearch blog, June 18, 2013]] that 2013 would be the year in which smaller tablet PC shipments (especially 7” and 8”) would surpass larger tablet PC shipments (such as 9.7” and 10.1”). Tablet PCs are starting to overlap with larger smart phones, as well as with ultra-slim notebook PCs.
Our latest forecast for the tablet PC market in the Quarterly Mobile PC Shipment and Forecast Report is for 67% Y/Y growth – from 153.6M in 2012 to 256.5M in 2013. Within this growing market, the share held by the top 12 brands, including Apple, HP, Acer, Dell, Lenovo, ASUS, Samsung, Toshiba, Sony, Amazon, Google, and Microsoft, is falling because the whitebox market [iPad-sized Tablets No Longer Driving Panel Growth Momentum [DisplaySearch blog, June 27, 2013]], especially in China, is growing faster. We estimate that the top brands, which shipped a combined 104.2M units in 2012, have reduced their 2013 shipment plans from 172M forecast in April to 167M forecast in June.
Apple’s iPad series accounted for 67M units in 2012 and remains the market leader, but is also the leading example of this trend. We estimate that Apple originally planned to ship 88M iPads in 2013, has reduced its target to 74M, including 31M iPads and 43M iPad minis.
We estimate that Samsung’s total tablet PC and phablet business plan is nearly 50M units in 2013, a big jump from 15.6M in 2012. Samsung plans include 39.5M tablet PCs, and 10M Galaxy Mega series (5.8” and 6.3”; while Samsung defines these as phablets, we classify them as smart phones).
Other tablet PC brands expect to grow their business in 2013. Among them, Lenovo, Microsoft, HP, and Acer are the most aggressive. Lenovo has two product lines for its tablet PC – X86 and ARM series. In 2013, Lenovo is planning for 3M X86 and 8M ARM.
Tablet PCs and Touch Adoption Expected to Drive Mobile PC Shipments Through 2017, According to NPD DisplaySearch [press release, May 6, 2013]
SANTA CLARA, CALIF., May 6, 2013—The mobile PC market is expected to increase from 367.6 million units shipped in 2012 to 762.7 million globally by 2017, driven by touch-enabled form factors, according to the NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report. The majority of this shift will come as tablet PCs begin to replace notebook PCs this year as the dominant mobile PC form factor, and touch becomes a key feature in mobile PC adoption.
“The mobile PC industry is undergoing significant change this year,” said Richard Shim, senior analyst with NPD DisplaySearch. “The rapid rise and establishment of white box tablet PCs (tablets made by small local brands, mainly in China) is putting pressure on traditional notebook PCs. These low-cost tablets are reaching further into emerging regions where notebook PC penetration rates have remained low, resulting in cannibalization by tablet PCs.”
Tablet PC shipments are forecast to increase 67% Y/Y to 256.5 million in 2013, and reach 579.4 million by 2017. White box tablet PCs accounted for one-third of tablet PC shipments in 2012 and will maintain at that level for the next several years.
Notebook PC shipments are expected to decline 10% over the next four years, from 203.3 million in 2013 to 183.3 million in 2017, but there will be pockets of growth. Shipments of notebooks with touch capabilities are expected to grow 48% Y/Y in 2014. In the notebook category, touch will be used mainly in ultra-slim PCs, which includes Intel-specified Ultrabooks, the MacBook Air, and other slim form factor notebooks. Ultra-slims, which are at the premium end of the notebook market, are forecast to account for two-thirds of touch-enabled notebooks in 2013. By 2017, they will be 80%. Intel’s recent mandate that third-generation Ultrabooks (using the company’s next generation Haswell processors) must include touch will also help adoption.
Figure 1: Global Mobile PC Shipments, 2012-2017
Source: NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report
New operating systems such as Windows 8 are unlikely to be a major driver of touch adoption. Rather, penetration of touch in notebook PCs will be driven by a reduction in cost and new form factors, such as hybrids, sliders, and convertibles.
“Thus far, Windows 8 has had a limited impact on driving touch adoption in notebook PCs, due to a lack of applications needing touch and the high cost of touch on notebook PCs,” added Shim. “Form factors aimed at differentiation from standard clamshell notebooks will help to drive consumer adoption of touch-enabled notebook PCs, starting in the second half of 2013.”
The NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report covers the entire range of mobile PC products shipped worldwide and regionally. With analysis of global and regional brands, the Quarterly Mobile PC Shipment and Forecast Report provides an objective, expert view of the market with insight into historical shipments, revenues, forecasts, and more. For more information about the report, please contact Charles Camaroto at 1.888.436.7673 or 1.516.625.2452, e-mail contact@displaysearch.com or contact your regional NPD DisplaySearch office in China, Japan, Korea or Taiwan for more information.
About NPD DisplaySearch
NPD DisplaySearch, part of The NPD Group, provides global market research and consulting specializing in the display supply chain, including trend information, forecasts and analyses developed by a global team of experienced analysts with extensive industry knowledge. NPD DisplaySearch supply chain expertise complements sell-through information from The NPD Group, thereby providing a true end-to-end view of the display supply chain from materials and components to shipments of electronic devices with displays to sales of major consumer and commercial channels. For more information, visit us at http://www.displaysearch.com/. Read our blog at http://www.displaysearchblog.com/ and follow us on Twitter at @DisplaySearch.
About The NPD Group, Inc.
The NPD Group provides global information and advisory services to drive better business decisions. By combining unique data assets with unmatched industry expertise, we help our clients track their markets, understand consumers, and drive profitable growth. Sectors covered include automotive, beauty, consumer electronics, entertainment, fashion, food/foodservice, home, luxury, mobile, office supplies, sports, technology, toys, and video games. For more information, visithttp://www.npd.com/ and npdgroupblog.com. Follow us on Twitter: @npdtech and @npdgroup.
China [branded] smartphone vendors to foray into tablet segment [DIGITIMES, July 1, 2013]
China-based smartphone vendors, including Huawei, ZTE, Lenovo and Xiaomi Technology, all will step up their efforts to penetrate the tablet market, according to industry sources.
Huawei plans to launch a new 7-inch tablet in the third quarter of 2013, and together with a 10.1-inch model released in early 2013, Huawei is sourcing about two million flat panels from China-based Truly Opto-electronics currently, the sources indicated.
Meanwhile, Huawei also purchases a portion of displays used in its new tablets from Innolux. However, the Taiwan-based flat panel maker declined to comment on orders from individual clients.
Lenovo also unveiled its Windows 8-based tablet, the Lenovo Miix10, recently. The Lenovo Miix, which is expected to hit the market in the third quarter, is equipped with a 10.1-inch 1366 by 768 IPS display and is power by an Intel dual-core Atom processor.
Xiaomi reportedly will step into the tablet segment by unveiling its first tablet in mid-August, the sources revealed, adding that Xiaomi will utilize tablet chipset solutions from MediaTek.
White-box vendors expected to lower prices for entry-level 7-inch tablets to US$40 in 2H13 [DIGITIMES, June 7, 2013]
The market for 7-inch tablets is seeing intense competition and white-box vendors are expected to further reduce prices for entry-level models to US$40 in the second half of 2013, according to Taiwan-based supply chain sources.
Entry-level white-box tablets are expected to continue selling well in markets such as China, and supply chains are able to increasingly decrease pricing for entry-level components, said the sources.
Meanwhile, Digitimes Research predicts that 254 million tablets will be sold in 2013, up 63.9% on year.
China-based white-box 2013 tablet shipments likely below forecasts [DIGITIMES, June 14, 2013]
China-based white-box tablet vendors’ shipments in 2013 were originally forecast at 120 million units, but actual shipments may fall short due to strong competition from inexpensive models launched by brand vendors, according to supply chain sources.
In addition to brand vendors, the white-box tablet vendors also face increasing competition from entry-level large-size smartphones, the sources said, adding that smartphones sized 5.7- to 6-inch are posing some of the biggest challenges.
Pricing for both the inexpensive brand models and entry-level large-size smartphones are becoming more similar to white-box tablet vendors’ products and that trend is expected to continue, causing the shipments to be less than expected in 2013, the sources added.
Digitimes Research: China mobile AP market to expand in 2013 [press release, June 14, 2013]
The China mobile application processor (AP) market will expand over 60% in 2013 to 506 million units, with smartphone-use APs accounting for 77.4% of total shipments, Digitimes Research said in its new report.
The market for smartphone APs in China climbed to 241.5 million units in 2012, up significantly from 69 million in 2011, according to Digitimes Research. The number will increase to 391.7 million units in 2013.
Shipments of China-made smartphone APs are forecast to account for 34% of the global smartphone AP market in 2013, compared to 26% in 2012 and around 10% in 2011, Digitimes Research noted.
As for China-made tablet APs, the market will reach a size of 115.2 million units in 2013, compared with a mere 10.5 million units [in 2011], Digitimes Research indicated.
Dual-core processors will overtake single-core chips to become the mainstream spec for tablets produced by China’s brand and white-box companies in the second half of 2013, while the penetration of quad-core powered tablets will also expand substantially, Digitimes Research pointed out.
China-based mobile AP vendors will ship a combined 506 million units in 2013, while the global mobile AP market will come to a size of 958 million units, Digitimes Research projected.
Prices of smartphone and tablet solutions to drop 10-20% in 2H13 [DIGITIMES, June 18, 2013]
Prices of chipset solutions for smartphones and tablets are expected to decline 10-20% sequentially in the second half of 2013 due to competition between MediaTek and Qualcomm, according to industry sources.
Qualcomm is scheduled to host its annual QRD (Qualcomm reference design) forum in Shenzhen on June 20, which is expected to attract participants from China-based branded as well as white-box smartphone and tablet vendors, the sources noted.
While showcasing its new solutions for the second half of the year, the forum also aims to grab smartphone and tablet solution orders from MediaTek, which has been prevailing in China’s solution market using a variety of reference designs, said the sources.
Qualcomm said earlier that over 40 OEMs have launched more than 200 new smartphones and tablets in 14 countries recently, mounting increasing pressure on MediaTek, said the sources.
China-based solution vendors such as Spreadtrum Communications have also joined the price competion, driving the unit price of quad-core smartphone solutions to below US$10 in China recently, the sources revealed.
China market: White-box tablet makers approaching MediaTek for quad-core solutions [DIGITIMES, May 27, 2013]
China-based white-box tablet makers are reportedly approaching MediaTek for the purchase of the chipmaker’s integrated MT8125 and [the upcoming] 8135 [to be based on A15 + A7 “big.LITTLE” architecture] quad-core application processors for tablets, according to industry sources.
The move by the white-box tablet makers comes after branded tablet vendors in China and Taiwan have begun using the MT8125 and 8135 solutions for tablets targeting the US99-149 segment, the sources noted.
White-box tablet makers currently purchase quad-core solutions mainly from China-based IC vendors including Allwinner Technology and Rockchip Technology, while buying Wi-Fi and Bluetooth chips from Realtek Semiconductor and RDA Microelectronics.
The 28nm quad-core solutions from Allwinner and Rockchip are priced at US$4-5, or about 50% lower than the comparable quad-core chips offered by MediaTek, since the chips offered by Allwinner or Rochchip do not support voice communications, said the sources.
In order to compete effectively in China and other emerging markets and differentiate products, white-box tablet makers have been forced to adopt MediaTek’s quad-core solutions, commented the sources.
MediaTek Introduces New Quad-Core Application Processor for Fast-Growing Tablet Market [pres release, May 29, 2013] used in ASUS MeMO Pad HD 7 shown earlier
TAIWAN, Hsinchu – 29 May, 2013 – MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced the availability of the new quad-core application processor – MT8125 designed for the fast growing global tablet markets. The new tablet platform is an extension of the company’s highly successful quad-core portfolio, it integrates a power-efficient quad-core Cortex™- A7 CPU subsystem with speed up to 1.5GHz, PowerVR™ Series5XT Graphics that delivers compelling multimedia features and sophisticated user experiences. To simplify product design and speed time-to-market, the MT8125 supports 3G HSPA+, 2G EDGE and Wi-Fi versions, all of which are pin-to-pin compatible, allowing device manufacturers to easily expand their portfolios with a full range of tablets by leveraging the existing or planned design requiring no additional rework.
Inheriting MediaTek’s technology breakthrough of quad-core SoC platform and high-end multimedia capabilities, the MT8125 incorporates premium multimedia features, supporting up to Full HD 1080p video playback and recording, 13MP camera with integrated ISP and Full HD (1920 x 1200) displays. The new tablet SoC also delivers ground breaking visual quality powered by the leading picture quality technology – MiraVisionTM, derived from MediaTek’s extensive experience in the Digital TV market.
The MT8125 includes full support for MediaTek’s leading 4-in-1 connectivity combo that converges Wi-Fi, Bluetooth 4.0, GPS and FM, bringing highly integrated, best-in-class wireless technologies and expanded functionality to high-performance multimedia tablets. The MT8125 also provides support for Wi-Fi certified Miracast™ which makes multimedia content sharing between devices easier.
“During the last two years, application processors used in tablets have taken a fast evolution from single-core 1GHz to quad cores, clocking over 1.5GHz. Competition will force chipset vendors to maintain pace – by implementing more advanced features while reducing the system cost by increasing the level of integration*,”said Gartner Research Director Roger Sheng.
“MediaTek’s team has worked closely with Lenovo to integrate their solutions into our design process, helping us accelerate the development and introduction of new, innovative tablets. In turn, this allows us to fulfill our commitment to delivering the outstanding user experience our customers demand. The tablet market is moving fast, and Lenovo aims to be at the forefront of tablet innovation. MediaTek helps us do that,” commented Wayne Chen, vice president and head of mobile business unit for Lenovo.
“We’re confident that our comprehensive reference designs will be the industry benchmark, particularly benefiting the mid-to-high-end tablet market. It is an innovative, cost-effective and definitely faster time-to-market solution.” said Joe Chen, GM of Home Entertainment Business Unit, MediaTek. “By taking advantage of our strengths in the multimedia field, mobile communications and multi-screen technologies, we offer a complete multi-core processor family for smartphones and tablets, enabling a significant difference in performance and power efficiency – all while ensuring seamless streaming performance across the array of devices when users are consuming entertainment and information. ”
The MediaTek quad core tablet SoC is now being widely adopted by MediaTek’s global customers including Lenovo IdeaTab S6000 series.
Lenovo S6000 10.1″ MediaTek MT8389 [Charbax YouTube channel, March 4, 2013]
Note:
1. According to LinuxGizmos.com “It appears, however that Lenovo’s 10-inch, quad-core S6000 Android tablet uses a scaled down, 1.2GHz version of the MT8125 called the MT8389. … The MT8389 also appears to have a lesser PowerVR SGX GPU, according to All-RSS.com. As a result, the Lenovo S6000 has more limited 1280 x 800-pixel resolution and a 5-megapixel camera.”
2. Quad-core SoC competition in as per this:
MT8125 / 8389
Quad-Core Cortex-A7 1.5GHz + CPU Tablet Platform [May 29, 2013]
Overview
MT8125/8389 is an extension of MediaTek’s highly successful quad-core portfolio, it integrates a power-efficient quad-core Cortex™- A7 CPU subsystem with speed up to 1.5GHz, PowerVR™ Series5XT Graphics that delivers compelling multimedia features and sophisticated user experiences.
Features
High-end Multimedia Capabilities
• Supporting up to Full HD 1080p video playback and recording, 13MP camera with integrated ISP and Full HD (1920 x 1200) displays
• Delivering ground breaking visual quality powered by the leading picture quality technology – MiraVisionTM, derived from MediaTek’s extensive experience in the Digital TV market.
Best-in-class Connectivity Technology
• Including full support for MediaTek’s leading 4-in-1 connectivity combo that converges Wi-Fi, Bluetooth 4.0, GPS and FM, bringing highly integrated, best-in-class wireless technologies to tablets
• Providing support for Wi-Fi certified Miracast™ which makes multimedia content sharing between devices easier
Supports 3G HSPA+, 2G EDGE and Wi-Fi
• MT8125/ 8389 supports 3G HSPA+, 2G EDGE and Wi-Fi versions, all of which are pin-to-pin compatible, allowing device manufacturers to easily expand their portfolios with a full range of tablets by leveraging the existing or planned design requiring no additional rework.
MT8377
1 GHz Dual-Core Tablet Platform [May 29, 2013]
Overview
The MediaTek MT8377 features a dual 1GHz Cortex™-A9 application processor from ARM, a PowerVR™ Series5 SGX GPU from Imagination Technologies, MediaTek’s proven 3G/HSPA/Edge modem, and runs the Android 4.0 “Ice Cream Sandwich”. y integrating a dual-core application processor architecture widely deployed in the majority of today’s premium tablets, the MT8377 boosts application and browser performance by up to 40% compared to single-core platform.
Features
Richest Multimedia Features
• Providing rich multimedia features including a 8MP camera and high-definition 1080p video playback
• Supporting high-resolution displays of up to HD720 (1280×720) resolution
• Integrating built-in stereo 3D panel support and DTV-grade display picture quality
Best-in-class Connectivity Technology
• Including full support for MediaTek’s leading 4-in-1 connectivity combo that converges Wi-Fi, Bluetooth 4.0, GPS and FM
MediaTek allocating more resources for development of tablet solutions [DIGITIMES, June 10, 2013]
MediaTek is relocating its tablet solution unit from its wireless communications group to the home entertainment group, meaning that the Taiwan-based top IC design house is looking to put more of its hardware and software resources into developing chips for tablet applications, according to industry sources.
The move echoes company president Hseih Ching-chiang’s statement that MediaTek aims to roll out new chips for tablet applications on a quarterly basis in the next few years.
The emphasis on the development of chips for tablets indicates that MediaTek believes that tablets will become the next-generation killer application and that the global tablet market is likely to continue to grow robustly in the coming years, commented the sources.
Meanwhile, MediaTek has adopted a strategy to push sales of its tablet solutions to non-Apple branded vendors in China and Taiwan, which have been focusing on promoting mid-range tablets for the US$99-199 segment, the sources indicated.
Given the high price/performance ratio and reliability of MediaTek’s chipset solutions, more and more entry-level tablet vendors in China are likely to queue up for table solutions from MediaTek, said the sources.
MediaTek is expected to ship a total of 20 million chipsets for tablets in 2013, accounting for 15% of the global non-iPad tablet market, estimated the sources.
MediaTek 2Q13 performance beats guidance [DIGITIMES, July 5, 2013]
MediaTek has reported consolidated revenues of NT$9.77 billion (US$323.52 million) for June, down 10.6% sequentially but up 24.6% on year.
MediaTek’s second-quarter revenues totaled NT$33.28 billion [US$1.1B], increasing 38.8% sequentially and surpassing the company’s guidance of NT$30-31.6 billion set for the quarter.
For the first half of 2013, revenues amounted to NT$57.25 billion [US$1.9B], up 33% from a year earlier.
Digitimes Research: China mobile AP shipments rise in 2Q13 [press release, June 24, 2013]
The China mobile application processor (AP) market is forecast to reach a total of 114.5 million units in the second quarter of 2013, up 9.6% sequentially and 88.6% from the 60.7 million units shipped a year ago, Digitimes Research said in its new report. Smartphone-use APs continued to account for the majority of total shipments.
The market for smartphone APs in China will amount to 92.3 million units in the second quarter, representing a 16% increase compared to 79.6 million units in the first quarter, whereas that for tablet-use APs declined 10.8% on quarter to 22.2 million units, according to Digitimes Research.
The China mobile AP market, which consists of smartphone- and tablet-use APs, is set to total 219 million units in the first half of 2013, said Digitimes Research. The top-5 suppliers – MediaTek, Qualcomm, Spreadtrum Communications, Allwinner Technology and Rockchip Electronics – contributed as high as 192 million units, or 87.7%, to the overall shipments, Digitimes Research indicated.
MediaTek has enjoyed robust growth in its SoC shipments for smartphones and tablets with shipments for the first half estimated at 84 million units, while Qualcomm‘s shipments to China’s mobile AP market are set to total about 42.7 million units, Digitimes Research predicted. Meanwhile, Spreadtrum with its low-price strategy is expected to ship 38 million units in the first half of 2013, Digitimes Research said.
Specializing in tablet-use SoCs, Allwinner and Rockchip will both report significant on-year growth in their shipments for the first half of 2013, Digitimes Research indicated. Allwinner‘s shipments will climb to 18 million chips in first-half 2013 from only 4.7 million units a year earlier, while Rockchip‘s shipments for the same period will reach 10 million chips compared with the 5.5 million units shipped in the first half of 2012.
Note: Out of 47.1 million units used in tablets for H1CY13 28 million came from Allwinner and Rockchip, which is almost 60%. 38% belongs to Allwinner, 21% to Rockchip.
Digitimes Research: TSMC expanding in China [press release, June 20, 2013]
Taiwan Semiconductor Manufacturing Company (TSMC) has significantly expanded its presence in China’s IC industry, as the foundry’s technology advantages and manufacturing capabilities help it ride the wave of smartphone and tablet growth in the local market, according to Digitimes Research.
TSMC has received a pull-in of orders from a number of China-based IC design houses, which specialize in mobile SoCs such as application processors and place a heavy emphasis on demand domestically. Their booming businesses have boosted TSMC’s sales coming from the China market, said Digitimes Research.
TSMC saw sales generated from the total orders placed by its China-based clients climbed to US$820 million in 2012 from US$510 million in 2011, an about 61% increase. Sales are set to rise further to top US$1.4 billion in 2013, Digitimes research forecast.
China-based Semiconductor Manufacturing International (SMIC) has also enjoyed growth in its sales coming from the local market, Digitimes Research indicated. Sales generated from orders placed by SMIC’s local China-based clients arrived at the highest quarterly level for a third consecutive quarter in the first quarter of 2013, Digitimes Research said.
In addition, Digitimes Research noted that China’s IC design sector has entered a new phase of development. The number of China-based IC design companies exceeded 500 in 2012 with their combined output value ranked third worldwide.
IHS Boosts Tablet Panel Shipment Forecast as White-Box Products Storm the Market [press release, July 2, 2013]
EL SEGUNDO, Calif.(July 2, 2013)—Boosted by orders from unbranded, white-box Chinese manufacturers, global demand for tablet panels is exceeding expectations, spurring IHS to increase its forecast for displays by 6 percent for 2013.
A total of 262 million displays for tablets are forecast to be shipped in 2013, compared to the previous forecast of 246 million, according to the May Edition of the “LCD Industry Tracker—Tablet” report from information and analytics provider IHS (NYSE: IHS). This will represent 69 percent growth from 155 million in 2012, as presented in figure 1 attached.
“Competitive dynamics in the tablet market have changed dramatically this year as Chinese white-box smartphone makers have entered the tablet market in droves,” said Ricky Park, senior manager for large-area displays at IHS. “These companies are producing massive quantities of low-end tablets that appeal to consumers in China and other developing economies. Because of this, the white-box manufacturers are driving up demand for tablet panels, particularly smaller displays using the older twisted nematic (TN) technology, rather than the newer screens using in-plane switching (IPS).”
Unbranded tablet makers purchased 40 percent of all tablet panels in April, up from just 17 percent in the first quarter of 2012, as presented in figure 2 attached.
Partly because of the rise of white-box makers, shipments of smaller 8- and 9-inch tablet displays will rise by nearly 200 percent in 2013. In contrast, larger displays in the 9-, 10- and 11-inch range will suffer a 5 percent decline.
The boom in white-box tablets is being driven the introduction of turnkey designs offered by processor makers. The designs make it easy for new, inexperienced market entrants to offer tablet products.
The Chinese white-box manufacturers hold certain advantages over the major incumbent tablet manufacturers. The white-box manufacturers are able to produce tablets at lower cost, more quickly and with greater flexibility in production. These companies also have the capability to manufacture both unbranded tablets, and make products for the major brands on a contract manufacturing basis.
Such white-box players also have been agile enough to take advantage of the current high availability and low-cost of tablet panels. Makers of displays for the shrinking PC market have switched over to the tablet market, spurring a glut that has depressed pricing. As prices have fallen, the white-box makers have demonstrated enough flexibility to boost production of low-cost tablets.
“Playing to their strengths, the white-box manufacturers are set to continue to increase their presence in tablets and propel the expansion of the overall tablet market,” Park said.
IHS believes the strong growth of tablet panel demand continued in the second quarter. The arrival of more turnkey tablet design solutions will drive up demand for 7- and 8-inch panels throughout the year.
The 8-inch panels are becoming an increasingly large segment of the tablet market, with a display area more appealing to users than the 7-inch size. In all, the 8-inch panels accounted for 11 percent of panel shipments in April, with Samsung and Acer having recently launched new tablets in that size. With more introductions likely coming in the third quarter, IHS expects a substantial market share for the 8-inch by the end of this year.
The market for larger-sized, 10-inch and bigger tablet panels may begin to enjoy a recovery in shipments with the launch of the new Intel Corp. Atom microprocessor, code-named Bay Trail. This new device could help reduce the cost of x86 microprocessor-based tablets and improve battery life. Bay Trail also could generate opportunities for hybrid-form tablets that include keyboards.
The x86 tablets, with Microsoft Corp.’s new Windows 8 operating system, would have functionality better suited to the needs of the commercial and business worlds than either the Google Android- or the Apple iOS-based tablets, which are designed with the consumer in mind.
About IHS (www.ihs.com)
IHS (NYSE: IHS) is the leading source of information, insight and analytics in critical areas that shape today’s business landscape. Businesses and governments in more than 165 countries around the globe rely on the comprehensive content, expert independent analysis and flexible delivery methods of IHS to make high-impact decisions and develop strategies with speed and confidence. IHS has been in business since 1959 and became a publicly traded company on the New York Stock Exchange in 2005. Headquartered in Englewood, Colorado, USA, IHS is committed to sustainable, profitable growth and employs 6,700 people in 31 countries around the world.
Flexible Display Market to Reach Nearly 800 Million Unit Shipments by 2020 [IHS press release, June 5, 2013]
EL SEGUNDO, Calif. (June 5, 2013)—Demand for flexible displays is set to undergo massive growth during the next seven years, with a broad variety of applications—ranging from smartphones to giant screens mounted on buildings—driving a nearly 250 times expansion in shipments from 2013 through 2020.
Global shipments of flexible displays are projected to soar to 792 million units in 2020, up from 3.2 million in 2013, according to a new IHS report entitled “Flexible Display Technology and Market Forecast” . Market revenue will rise to $41.3 billion, up from just $100,000 during the same period, as presented in the attached figure.
“Flexible displays hold enormous potential, creating whole new classes of products and enabling exciting new applications that were impractical or impossible before,” said Vinita Jakhanwal, director for mobile and emerging displays and technology at IHS. “From smartphones with displays that curve around the sides, to smart watches with wraparound screens, to tablets and PCs with roll-out displays, to giant video advertisements on curved building walls, the potential uses for flexible displays will be limited only by the imagination of designers.”
Generation flex
IHS classifies flexible displays into four generations of technology. The first generation is the durable display panels that are now entering the market. These panels employ a flexible substrate to attain superior thinness and unbreakable ruggedness. However, these displays are flat and cannot be bent or rolled.
Second-generation flexible displays are bendable and conformable, and can be molded to curved surfaces, maximizing space on small form-factor products like smartphones.
The third generation consists of truly flexible and rollable displays that can be manipulated by end users. These displays will enable a new generation of devices that save space and blur the lines separating traditional product categories, such as smartphones and media tablets.
The fourth generation consists of disposable displays that cost so little that they can serve as a replacement for paper.
Starting small
With their thin, light and unbreakable nature, flexible displays initially are expected to be used in smaller-sized products, such as mobile phones and MP3 players. However, once large-size displays are available, flexible technology will be used in bigger screen-size platforms, such as laptops, monitors and televisions.
The largest application for flexible displays during the next several years will be personal electronic devices. This segment will be led by smartphones, with shipments climbing to 351 million units by 2020, up from less than 2 million this year.
Flexible stars at SID
Flexible displays were a major topic at the Society for Information Display (SID) Display Week event in Vancouver in May.
During an SID keynote address, Kinam Kim, president and CEO of Samsung Display Co., discussed his company’s flexible organic light-emitting diode (OLED) display technology. Kim said that the technology will be suitable for wearable electronics devices like Google Glass.
Also at SID, LG Display showed a 5-inch OLED panel constructed out of plastic that was both flexible and unbreakable.
Furthermore, Corning at SID showed its Willow Glass, which can be used as with both OLEDs and liquid-crystal displays (LCD) in mobile devices such as smart phones, tablets and notebook PCs. Because of its thinness, strength and flexibility, Willow Glass could enable future displays to be wrapped around a device or a structure.
IHS predicts OLEDs will be the leading flexible display technology during every year for the foreseeable future, accounting for 64 percent of shipments in 2020.
How Intel Can Enable a Successful $200 PC in the Age of the Media Tablet [IHS press release, May 20, 2013]
Vancouver, British Columbia (May 20, 2013)—Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?
The astounding answer seems yes—if microprocessor Intel Corp. is willing to cut the price of its semiconductor components to PC makers, according to a PC Dynamics Market Brief from information and analytics provider IHS (NYSE: IHS).
Speaking at the IHS/SID 2013 Business Conference, held May 20 in Vancouver, Canada, Zane Ball, Intel vice president and general manager, Global Ecosystem Development, is presenting his company’s plan to empower the PC industry to produce low-cost notebooks incorporating touch technology. Craig Stice, senior principal analyst for compute platforms at IHS, believes Intel has a shot at success.
“A price point that low seems far-fetched considering the mobile PC prices of today, with Ultrabooks and other ultrathins going as high as $1,000 or more,” Stice said. “However, the small laptops known as netbooks saw their prices reach down into the $200 range at the height of their popularity a few years ago, and a cost analysis of netbooks shows how such a low level of pricing can be used to support a no-frills type of ultrathin PC.”
The cost estimate for a standard netbook, based on the IHS Compute Systems Cost Analyzer that calculates the major components of a netbook on a third-quarter 2013 timeline, comes out to $207.82, as shown in the attached table.
“Hitting this kind of price point is not impossible for the PC industry, already a cutthroat market accustomed to razor-thin margins,” Stice said. “Such a possibility was stated by outgoing Intel CEO Paul Otellini, who during Intel’s first-quarter earnings call in April made the bold prediction that touch-enabled, ultrathin Intel-based notebooks using non-core processors could be available by the end of this year.”
Intel holds the cards
The key factor that could make this happen is Intel, which can control up to 33 percent of the total bill-of-materials cost for the PC through the central processing unit (CPU) and motherboard. If Intel decides to provide a price break for just these components, PC original equipment manufacturers could see their margins improve, allowing them to drive down prices for the retail market. With PC competition so fierce, it takes only one PC manufacturer to find a price point that sells—and others are bound to follow suit shortly afterward.
Intel could also be instrumental in introducing an even more powerful ultrathin-type mobile PC than netbooks, which have now been overtaken by media tablets and are on their way out of the market altogether.
Intel’s next-generation Atom processor, called Bay Trail, has the potential to deliver a performance boost that will clearly separate the traditional netbooks of old from the new generation of mobile and ultrathin PCs.
Avoiding netbooks’ fate
While netbooks had limited computing power and were regarded more as devices for content consumption, the new and much more economical ultathins, in contrast, would possess considerably more power and be categorized as content-creation devices. Such a perceptible enhancement could increase their chances of survival in the marketplace, unlike the short-lived netbooks.
Much depends on Bay Trail, which Intel says will move from two processing cores to four to provide beefed-up performance. Along with Bay Trail, Intel’s own high-definition embedded graphics and an extended battery life for improved power will yield a processor bearing similar performance to the chipmaker’s renowned family of Core processors. All these traits could be part of the new, less expensive ultrathin being projected.
What PC manufacturers also must do
What these developments portend for the PC industry is significant. If the PC industry is able to get down to the $200 price point, and Intel’s Bay Trail processor delivers what it claims to do, then the PC market will have its much-needed shot in the arm. Such a turn of events could then spark the mobile PC market, which has been losing steam to flashier rivals like smartphones and tablets.
Besides Intel’s willingness to cut its own price point to make chips available at a lower cost to customers, a second important factor involves the PC makers themselves. For their part, PC manufacturers also need to find a way of getting to the magic price point of $200—and possibly sacrifice even more margin in exchange for the greater amount of volume that they seek.
All told, the scenario above—merely hypothetical at this point—is not entirely out of reach. A strong second half is already being forecast for PCs this year: add in the potential for lower-priced next-generation ultrathin systems, and the PC industry may finally have a valid competitor to lower-priced media tablets.
China Becomes World’s Leading PC Market in 2012 [IHS press release, April 29, 2013]
EL SEGUNDO, Calif. (April 29, 2013)—China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS (NYSE: IHS).
PC shipments in 2012 to China amounted to 69 million units, exceeding the 66 million total reached by the United States. Only a year earlier in 2011, the United States was the leading global destination for PCs.
Beyond its large size, China’s PC market exhibits distinct characteristics that set it apart from the computer trade elsewhere, possessing a vast untapped rural market and unique consumer-purchasing patterns. While desktop PC shipments lagged notebooks around the world, the two PC segments were on par in China in 2012, with an even 50-50 split, as shown in the attached table.
“The equal share of shipments for desktops and notebooks in China is unusual, since consumers in most regions today tend to prefer more agile mobile PCs, rather than the bulky, stationary desktops,” said Peter Lin, senior analyst for compute platforms at IHS. “The relatively large percentage of desktop PC shipments in China is due to huge demand in the country’s rural areas, which account for a major segment of the country’s 1.34 billion citizens. These consumers tend to prefer the desktop form factor.”
The market will change gradually as desktop PCs face rising competition from the high value proposition presented by notebooks. Notebooks will then surpass desktops in the country by 2014, tracking more closely with the worldwide desktop-to-notebook PC ratio of 36 to 64 percent.
The desktop vs. notebook pattern of consumption in China is only one example of the distinctive hallmarks of the country’s dynamic PC market. In another indicator, China also has approximately a 50-50 proportion in consumer vs. commercial PCs, compared to the 65-35 percent ratio for the rest of the world.
A third pattern unique to the China PC market is the preferred notebook display size of 14 inches, which accounts for more than 70 percent of notebook PC shipments in the country. For the rest of the world, the 14-inch makes up less than 30 percent.
A fourth pattern of note is the attach rate of PCs with a pre-installed operating system, especially for notebooks. While mature PC markets in other parts of the world claim a 90 percent attach rate, the proportion for China comes out to lower than 50 percent, with the ratio even lower in the desktop PC market.
Despite such exclusive behavior, the China PC space shares one common trait with the worldwide PC market. Like the rest of the world, demand in China remains weak as consumers migrate to using mobile devices like cellphones. China’s PC market is projected to grow only by 3 to 4 percent this year.
Even so, a vast market opportunity continues to exist for PCs in the country, in the form of potential first-time buyers mostly residing in the countryside. The government already plans this year to invest some 40 trillion yuan—equivalent to some $6.4 trillion—to build rural infrastructure in the next 10 years, and PC original equipment manufacturers can take advantage of the initiative to build out and expand from the cities, IHS believes.
China is also on track to retain its position as the largest PC market in the world for the foreseeable future unchallenged and alone—further providing PC brands a rare opportunity for expansion, counter to the myriad travails they face in the rest of the world.
Spreadtrum is to be acquired by a Chinese high-tech investment enterprise owned by the state and also belonging to the leading Tsinghua University with microelectronics research interests
The top 10 SoC design enterprises of Mainland China had US$3.8B revenue in 2012. Out of that Spreadtrum had US$725.2M which is not less than 19%. On the ‘Experiencing the Cloud’ I’d reported extensively on the reasons:
- Lowest H2’12 device cost SoCs from Spreadtrum will redefine the entry level smartphone and feature phone markets [July 26 – Aug 16, 2012]
- $48 Mogu M0 “peoplephone”, i.e. an Android smartphone for everybody to hit the Chinese market on November 15 [Nov 9, 2012]
- China: Entry-level dual core IPS WVGA (480×800) smartphones $65+ now, quad-core $70+ in June [April 29, 2013]
It is also notable that this (together with MediaTek offerings) lead to Qualcomm’s SoC business future is questioned first time [May 1, 2013].
Update: TrendForce: Mediatek and Spreadtrum Advance in China Market while Qualcomm’s Chip Usage Declines [press release, June 27, 2013]
Mediatek has been making an impressive run lately; not only is the Taiwan-based chip manufacturer commanding its way in the mid-to-high end smartphone space, it has also successfully penetrated the 4G mobile market thanks to its recently announced 4G chip. According to the latest statistical data compiled by TrendForce, a global market research firm, Mediatek’s processors have been used by over 50% of China’s branded smartphones since the MT6575 chip was introduced in 2012. Due in large part to factors such as high pricing and the lack of hardware and software compatibility with various Chinese-made devices, Qualcomm’s chip usage rate has been gradually declining in China, and shrunk to as low as 33% in 2013. With Qualcomm and Mediatek both devoting their attention towards the mid to high end smartphone consumer segment, much of the low-end smartphone space has been left to Spreadtrum, which has recently unveiled a processor intended for low end hardware devices. In 2013, Spreadtrum’s chip usage rate in the Chinese market grew to approximately 11%.
Figure-1 2013 Smartphone processor market share in China’s smartphone market
Source: DRAMeXchange, June, 2013 Despite being an indisputable leader in the high end smartphone market, Qualcomm’s MSM8X30, MSM8X26, and MSM8X25Q processors are still facing a lot of stiff competition in the low-to-mid end mobile sectors. A way Qualcomm may reverse its struggles in China is by taking advantage of the country’s rapidly growing 4G/LTE developments. The company will have a good chance of emerging as a major LTE market leader should China’s 4G business opportunities appear early next year.Although Mediatek has generally been known to promote two new items on an annual basis, this year the Taiwan-based company has chosen to break away from tradition by announcing a total of four different products. The first –the MT6589– was announced during 1H13, and is intended for the mid-to-high end smartphone market; the remaining three products—all of which are smartphone chips—are expected to be introduced at some point during 2H13. Among the new processors, the duo core, Cortex A7-based MT6572 chip stood out as particularly noteworthy given its potential to exert a lot of impact on the low end smartphone market. The said chip is unique in that it supports China’s TD SCDMA system, is priced in a notably affordable range, and sports a good degree of compatibility with various low cost components (which could help push manufacturing costs down to as low as $US 40). All in all, this chip provides a perfect opportunity for Mediatek to compete against the low-end smartphone chips that are designed by Spreadtrum. The MT6575 is expected to become popular within the mid-to-low end smartphone market and should help Mediatek cement its position within the low end sector.
Following the release of the MT6589 chip, which is expected to open up new opportunities in the mid-to-low end market, Mediatek aims to introduce the quad core MT6580 and MT6582 in 2H13. MT6582 is considered a more affordable version of MT6589, and supports both qHD resolution and 8MP camera. These features are expected to help the company redefine the boundaries of a mid-end smartphone as well as increase its overall consumer appeal. The MT6580, on the other hand, is intended to be a viable alternative to a Qualcomm chip. Other than supporting 1.5Ghz speed, HD resolution, and 13MP camera, the chip is able to work with the kinds of high-quality hardware that are typically compatible with Qualcomm processors. According to TrendForce, if Mediatek is indeed successful in enhancing its presence in the high end market, a price war involving high-end processors is likely to ensue. Should this happen, both consumers and smartphone manufacturers will benefit, and the boundaries among high end smartphone devices will become less and less clear.
With China’s recent plans to expand the TD-LTE coverage for its 500 million users by 2020, and with the 4G industry growing at a tremendously rapid pace, the LTE ecosystem in China is set to become more and more mature in the foreseeable future. Qualcomm is very likely to benefit from such a trend given its priority on the 4G/LTE business. Following the high end chip pricing war, the 4G/LTE market will likely become next battlefield for chip makers.
End of the update
Tsinghua University investment arm makes buyout offer for Spreadtrum [Asian Venture Capital Journal, June 24, 2013]
Spreadtrum [展讯] Communications [处在], a Chinese mobile chip manufacturer backed by NEA, has received a [non-binding] buyout offer from a unit of Tsinghua Holdings, an investment entity controlled by Beijing-based Tsinghua University. The offer values Spreadtrum at $1.35 billion.
According to a regulatory filing, Tsinghua Unigroup will pay $28.50 in cash for all outstanding American Depository Shares – a 20% premium on the stock’s previous closing price. Spreadtrum’s stock jumped more than 16% in response to the announcement, closing Friday at $25.91.
As of year-end 2012, NEA owned 10.4% of the company, having initially participated in the $19.8 million Series B round in 2002. Spreadtrum went public on NASDAQ in 2007, raising $124.6 million. Silver Lake bought a 13% stake for $40 million in 2010 but exited the following year.
In 2011, Spreadtrum also came under fire from short-seller research firm Muddy Waters over alleged accounting discrepancies. The company denied any wrongdoing.
“We believe that an Acquisition by Tsinghua Unigroup [紫光集团有限公司], which is majority-owned by Tsinghua University, a central player in China’s technology and R&D sectors, would provide compelling strategic synergies and position the company for additional value creation in key wireless communications markets in China and elsewhere going forward,” Unigroup CEO Weiguo Zhao said in a letter to shareholders.
Tsinghua Holdings has committed to guarantee full equity or debt funding up to the total purchase price of $1.5 billion.
Spreadtrum was founded in 2001 and develops mobile chipset platforms for 2G, 3G and 4G wireless communication standards. Customers include handset manufacturers selling into China and other emerging markets. The company posted a net income of $92.4 million for 2012, down from $134 million the previous year, although revenues jumped 7.6% to $725.2 million.
Tsinghua Holdings is a state-owned company responsible for managing the majority of Tsinghua University’s commercial assets. As of year-end 2012, Tsinghua Holdings had approximately RMB70.4 billion ($11.5 billion) in assets and a net income of RMB1.45 billion. Unigroup focuses on high-tech, biotech, real estate and urban infrastructure investments.
Tsinghua Science Park Venture Capital, which also ultimately falls under the control of Tsinghua Holdings, participated in Spreadtrum’s Series A and B rounds.
Note that this shows the strong determination by the Chineses State because:
我国大陆IC产业发展面临三大障碍 Mainland China IC industry is facing three major obstacles [Hexun.com, June 22, 2013] as translated by Google and Bing with manual edits
Summary:
What are the essential elements in the development of the IC industry or power? The industry generally believes that strong government support, pragmatic policies and systems, building good infrastructure and abundant human resources, are the key elements how the IC industry in developing countries and regions may come from behind.
…
The operating efficiency of the Innovation Alliance, of the official mechanisms for collaboration, research, and industry R&D is not high, which is one of the significant factors restricting the rapid development of mainland China’s IC industry.
Mainland China’s IC industry in recent years gained rapid development, and some of the advantages of the competitiveness of enterprises began to appear. Taking the fastest-growing design industry as an example, in 2011 the overall IC design industry sales continued to maintain a high growth rate, reaching 47.374 billion yuan [US$7.7B], an increase of 30.2% year on year. In 2012, total sales for the top 10 design enterprises in China reached 23.117 billion yuan [US$3.8B], an increase of 2.97 billion yuan [US$484M] over the previous year. 10 companies accounted for 33.97% of total industry sales, 2.21% increase over the 31.76% in the previous year. First business sales reached $ 1.183 billion.
Spreadtrum Communications [展讯通信], RDA [锐迪科], HiSilicon [海思], Zhuhai Allwinner [珠海全志] and so on, i.e. the SoC enterprises have made great achievements in the field. But compared with Taiwanese and Korean enterprises there is still relatively slow development, the products are low-tech, and the competitiveness of the enterprises is weak. Price is also the company’s main business strategy, “design” is still not a mainstream, the situation of slow building of the base capability had not improved. Industry-wide sales may also be less than the sum of the sales of the world’s top-ranked design firms.
Note that out of the US$3.8B revenue of the top 10 design enterprises in 2012 Spreadtrum had US$725.2M which is not less than 19%. This data alone shows how important is the Spreadtrum acquisition in order to speed up the further development of the IC industry by putting the company together with the Tsinghua University which has a Research Institute of Circuits And Systems as well as an Institute of Microelectronics (IMETU), see here and here:
IMETU, the Institute of Microelectronics of Tsinghua University, was founded in 1980 on the basis of the Semiconductor Research Division, which was a research division of the Department of Electronic Engineering established in 1957. The mission of IMETU is to educate top level professionals and deliver scientific innovations in the domain Micro/Nano-electronics. During the past 30 years, IMETU has made significant contributions and key achievements for the development of China’s semiconductor and integrated circuit industry. Its faculty members and students won 8 national awards, more than 20 province or ministry level awards, as well as 136 granted patents. The institute consists of four divisions, Solid-State Devices and Integration Technologies, IC & System Design, Micro/Nano Devices and Systems, and CAD Technology. Up until March 2012, IMETU has 94 faculty and staff members, among which there are 14 professors and 46 associate professors. After 30 years of development, IMETU has been China’s leading research and education base in the area of Micro/Nano electronics. It has established a high-quality research infrastructure for microelectronics comprising of two major research directions, Micro/Nano electronics and IC & System Design. Meanwhile, alumni of IMETU have become the backbone of China microelectronic industry.
which is also the premier university partner of The Institute of Microelectronics of Chinese Academy of Sciences.
Major shareholders of Spreadtrum (with more than 5%): source Annual Reports
March 15, 2008 |
March 15, 2009 |
March 31, 2010 |
Feb 28, 2011 |
Feb 29, 2012 |
Feb 28, 2013 |
|
Scott Sandell [also includes New Enterprise Associates 11, Limited Partnership shares] |
15.42% |
15.71% |
14.92% |
14.4% |
10.9% |
10.4% |
Entities affiliated with New Enterprise Associates 11, Limited Partnership |
15.36% |
15.61% |
14.76% |
14.2% |
10.7% |
10.1% |
Entities affiliated with Fortune Venture Investment Group |
6.31% |
6.29% |
||||
Entities affiliated with Pacific Venture Partners |
5.21% |
5.30% |
||||
Entities affiliated with Silver Lake Partners |
12.47% |
5.8% |
||||
The Bank of New York Mellon Corporation |
5.45% |
5.2% |
||||
FMR LLC and Edward C. Johnson 3d |
5.3% |
|||||
FMR LLC |
9.9% |
|||||
Waddell & Reed Group |
5.3% |
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source: Yahoo! Finance SPRD Major Holders
Tsinghua Unigroup Announces Offer to Buy Spreadtrum Communications [press release, June 21, 2013]
BEIJING–(Marketwired – Jun 21, 2013) – Tsinghua Unigroup Ltd. (“Unigroup”) today confirmed that it has made a non-binding offer to acquire Spreadtrum Communications, Inc. (NASDAQ: SPRD) (“Spreadtrum” or the “Company”) for $28.50 in cash per American Depositary Share (the “Transaction”). Spreadtrum is a leading fabless semiconductor provider in China with advanced technology in 2G, 3G and 4G wireless communications standards. The offer represents a premium of 20.1% over the closing price of the Company’s shares on June 19, 2013, the day preceding the delivery of the offer and 44.3% over the volume weighted closing price of the Company’s shares for the 30 trading days preceding the delivery of the offer.
Unigroup is an operating subsidiary of Tsinghua Holdings Co. Ltd., a solely state-owned limited liability corporation funded by Tsinghua University, one of the most prestigious universities in the world. Tsinghua Holdings owns and manages a substantial majority of the commercial assets of Tsinghua University. As of December 31st, 2012, Tsinghua Holdings had total assets of approximately 70.4 billion RMB [$11.45B], EBITDA of approximately 4.07 billion RMB, and net income of approximately 1.45 billion RMB for fiscal year 2012. Tsinghua Holdings’ corporate credit rating is AA+ according to CCXI, the Chinese domestic JV partner of Moody’s and the leading credit rating agency in China. Additional information about Tsinghua Holdings can be found at (http://www.thholding.com.cn/english/simpleindex.aspx).
According to the preliminary non-binding proposal letter, Tsinghua Holdings has committed to guaranteeing the aggregate purchase price, which may be funded through a combination of equity and debt financing.
Unigroup is excited about the proposed acquisition of Spreadtrum and the strategic opportunity this Transaction provides given the strength of this leading China-based business. Mr. Zhao Weiguo, the Chairman and CEO of Unigroup, commented, “We are enthusiastic about Spreadtrum’s business and market position globally and here in China, and we see Spreadtrum as an excellent strategic fit with Unigroup’s overall commercial objectives. We look forward to working together on the details of our proposed acquisition.”
Unigroup’s proposal is non-binding and is subject to, among other things, satisfactory due diligence with respect to Spreadtrum and the execution of acceptable definitive agreements. There can be no assurance that Spreadtrum will support the Transaction, that any definitive binding offer will be made by Unigroup with respect to the Transaction, that any agreement with respect to the Transaction will be executed, that any conditions, including with respect to regulatory approval, will be satisfied, or that this Transaction or any other transaction, on the proposed terms or on any other terms, will be approved or consummated. Unigroup does not undertake any obligation to provide any updates with respect to this Transaction or any other transaction, except as required under applicable law.
About Tsinghua Unigroup Ltd.
Tsinghua Unigroup Ltd. (“Unigroup”) is an operating subsidiary of Tsinghua Holdings Co. Ltd., a solely state-owned limited liability corporation funded by Tsinghua University in China. Tsinghua Holdings Co. Ltd. is the controlling shareholder of Unigroup. Unigroup’s business lines include high-technology, bio-technology, science park development, and urban infrastructure construction.
About Spreadtrum Communications, Inc.
Spreadtrum Communications, Inc. (NASDAQ: SPRD) (“Spreadtrum”) is a fabless semiconductor company that develops mobile chipset platforms for smartphones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards. Spreadtrum’s solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. Spreadtrum’s customers include global and China-based manufacturers developing mobile products for consumers in China and emerging markets around the world. For more information, visit www.Spreadtrum.com.
This press release does not constitute an offer to sell or the solicitation of an offer to subscribe for or buy any security, nor is it a solicitation of any vote or approval in any jurisdiction, nor shall there be any sale, issuance or transfer of the securities referred to in this press release in any jurisdiction in contravention of applicable law.
Note that with June 27, 2007 Spreadtrum IPO on Nasdaq the company had $125.9M initial market capitalization which a year later became $209.41M; the quarterly revenue at IPO time was US$38.6M:
Data is in US$
Spreadtrum Closes $35.2 Million Series C funding [press release, June 4, 2004]
Sunnyvale, California – June 4, 2004 – Spreadtrum Communications Inc., a leading fabless semiconductor company developing and marketing innovative digital wireless communications products, today announced the completion of $35.2 million Series C financing led by New Enterprise Associates (NEA) with additional participation from existing investors, Fortunetech Investment Fund, Pacific Venture Group, Vertex, Legend Capital, HuaHong International and more.
“Proceeds from this financing will be used primarily to expand operations and to develop new product offerings,” said Dr. Ping Wu, President of Spreadtrum. ‘Spreadtrum has gained customers acceptances in the GSM/GPRS markets and is now gaining traction in the 3G area. We are very pleased to be working with these experienced venture capital firms. With their industry knowledge and resources, we are confident we will expand our global reach.
“Spreadtrum has all the components we look for when making an investment,” said Scott Sandell, NEA general partner and Spreadtrum board member. “With its experienced management team and superior technology, Spreadtrum is poised to emerge as one of the world-class fabless semiconductor companies. They continue to demonstrate their ability to develop and market their products while gaining traction in this large, explosive market.”
Spreadtrum is currently shipping GSM/GPRS baseband chipset SC6600 families and GSM/GPRS module SM5100 families. The SC6600 is a highly integrated GSM/GPRS single baseband mixed signal chip containing all digital and analog functionality for a GSM/GPRS wireless phone. The SM5100 provides both voice and data functions, and can be used in GSM/GPRS tri-band cell phones, data modems and other mobile terminal devices. Reference designs for a complete GSM/GPRS handset terminal are available. Spreadtrum also has single and dual CPU solutions for various market demands. More information about Spreadtrum products is available via email at info@spreadtrum.com.
New Enterprise Associates Participates in $20 Million Series D for Spreadtrum Communications [Baltimore Citybizlist. Oct 31, 2006]
Spreadtrum Communications Inc., a Sunnyvale, Calif.-based maker of wireless chipsets, has secured $10 million of a $20 million Series D round, according to a regulatory filing. Return backers include Fortune Venture Group and New Enterprise Associates. The company has several offices in China. www.spreadtrum.com
About Spreadtrum
Spreadtrum Communications was founded in 2001 by a group of innovative entrepreneurs with determination to face any challenge in the future. Under Dr. Ping Wu’s leadership, Spreadtrum successfully set up offices in Silicon Valley and several different cities in China. It grew rapidly within the past a few years and became a raising star in the IC and wireless communications industry. Spreadtrum’s products became the choice of many Chinese and international clients. Spreadtrum focuses on the development and sales of the new generation wireless IC, provides fast-to-market, cost-effective and high-performance solutions for wireless terminal manufactures and design houses.
Our core competitive products are:
2G/2.5G/3G baseband IC: High integration, high performance, great functionalities
Communication software: validity, stability, customizability
Wireless platform: differentiated value-added open platform, reduced development time, increased product competitive edge
Wireless module: Customizable, flexibility, high quality
Spreadtrum not only has complete wireless terminal core chip series and related software and platform solutions that cover from high-end to low-end handset markets, but also has successfully developed world’s first single TD-SCDMA/GSM/GPRS(3G/2.5G) dual mode baseband chip as well as world’s first single integrated multimedia GSM/GPRS baseband chip. By utilizing Spreadtrumer’ expertise and newest design methodology in the industry, Spreadtrum single chips solution possesses the characteristics of higher integration, smaller size, lower power consumption and higher performance and therefore greatly reduces system BOM cost. Spreadtrum is the first IC designs company to develop its own software protocols. Its open platform allows customers to customize their products in order to differentiate themselves among competitors. Spreadtrum provides its customers with warm-hearted support and fast response time to reduce their development cycle and shorten their time-to-market.
Spreadtrum Communications [InsideChips, 2006]
Based in Sunnyvale, Calif., with most of its engineering operations in China, Spreadtrum Communications is developing chips for China’s large and rapidly growing domestic cellular market. The company is developing single-chip solutions for GSM/GPRS and TD-SCDMA/GSM/GPRS mobile devices, and has integrated all of the analog, digital and power-management functions as well as a full set of multimedia features and interfaces into the chips.
Founded only five years ago, Spreadtrum has already grown to 450 employees. CEO Ping Wu and CTO Datong Chen founded Spreadtrum with Renyong Fan (VP of operations) and Jin Ji in July 2001. The company raised $6.5 million in Series A funding at the time of founding, followed by a $20 million Series B round in Nov. 2002 and a $35 million Series C round in April 2004. The company has more than 30 investors, with the largest including New Enterprise Associates (NEA), Fortunetech Investment Fund, Pacific Venture Group, Vertex, Legend Capital and HuaHong International.
Spreadtrum offers three chip products:
SC6600M GSM/GPRS baseband chip – In addition to baseband functionality, the 6600 also supports a number of functions typically implemented separately on different chips. These include support for a 1.3-megapixel digital camera with video recording and playback, 64-polyphonics with stereo sound, MP3 player, USB interface and USB removable memory. Analog I/F features include a wide-range RF interface and power management on chip.
Spreadtrum began volume shipments of the SC6600 in June 2003, primarily to domestic handset makers including TCL, Ningbo Bird, Amoi Electronics, Hisense and Putian Capitel.
SC8800 Single-chip TD-SCDMA/GSM/GPRS dual-mode baseband chip – Powered by the CEVA-Teak DSP core, the SC8800 enables dual-mode 2G/3G phones that operate transparently over China’s TD-SCDMA and GSM networks. As with the SC6600, the chip integrates analog, digital and power management functions on a single chip.
SC6800 GSM/GPRS multimedia baseband IC – The SC6800 integrates an ARM9 processor and TeaKLite DSP, 5-megapixel camera controllers, auto-focus controllers, MPEG4 accelerator and MP3 player, and supports TV out and other multimedia application-processing functionalities.
Spreadtrum also offers a wireless module, the SM5100B, which incorporates the baseband chip, RF chipset, combo flash and software. Intended for applications such as wireless desktop phones, mobile phones, remote monitoring and remote meter reading, the module provides all the required functionality for full-featured GSM/GPRS terminals.
Spreadtrum provides its customers with IP and application software, and developed its own protocol stack software. The open platform enables customers to perform high-level development to implement their own IP and value-added features.
Compared with the Europe-initiated WCDMA and U.S.-backed CDMA 2000 3G standards, China’s homegrown 3G standard, TD-SCDMA, arrived late to the game. We even heard that Chinese telecom operators were reluctant to use TD-SCDMA due to that fact. Nevertheless, the Chinese Ministry of Information Industry formally approved TD-SCDMA on Jan. 20, 2006, as the national technology standard for 3G mobile communications.
Spreadtrum projects that shipments of 3G mobile phones in China will grow to 9.5 million units by 2007, up from 3.3 million units in 2004. The Industrial Technology Information Services (ITIS), a unit of Taiwan’s Ministry of Economic Affairs (MOEA), projects subscriptions for 3G services in China will increase from 15 million in 2006 to 80 million by 2008.
However, according to market research firm ABI Research, the establishment of a national 3G network will not greatly change the existing mobile landscape. The Chinese government will provide strong policy support to help TD-SCDMA operators gain time and establish a price lead over other 3G technologies, says ABI, but GSM will continue to be the dominant technology in China over the next five to eight years.
China is conducting its final TD-SCDMA trials in select cities between March and June. These latest trials follow three earlier rounds of tests, and should be the last before commercial use.
Spreadtrum will be competing with fellow TD-SCDMA chipmakers such as Commit (a joint venture involving Nokia, Texas Instruments, LG, Putian, DBTEL and Datang), Chongyou Information Technology, T3G (a joint venture of Datang, Philips and Samsung), Analog Devices and others.
The number of Chinese IC startups has been rapidly growing over the last few years, although many appear to have relatively simple technology, few people, little cash and fairly modest expectations. But a few – such as Spreadtrum – have set their sights higher and are establishing themselves as significant technology companies. We are impressed with Spreadtrum’s high level of integration in its products, as well as its ability to attract major investors and the early establishment of a global presence. We believe the company has a good chance for continued growth and success in China’s telecom market.
Spreadtrum Communications Announces Receipt of Acquisition Proposal [press release, June 21, 2013]
SHANGHAI, June 21, 2013 /PRNewswire-FirstCall/ — Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company“), a leading fabless semiconductor provider in China with advanced technology in 2G, 3G and 4G wireless communications standards, today announced that its Board of Directors has received a preliminary non-binding proposal letter, dated June 20, 2013, from Tsinghua Unigroup Ltd. (“Unigroup“), an operating subsidiary of Tsinghua Holdings Co. Ltd., a solely state-owned limited liability corporation funded byTsinghua University in China, pursuant to which Unigroup proposes to acquire the Company (the “Transaction“) for S$28.50 in cash per American Depositary Share (each American Depositary Share represents three ordinary shares of the Company). A copy of the proposal letter is attached hereto as Appendix 1.
The Company’s Board of Directors is reviewing and evaluating Unigroup’s proposal and cautions the Company’s shareholders and others considering trading in its securities that the Board of Directors has just received the Unigroup proposal, and has not yet made any decisions with respect to the proposed Transaction, or the Company’s response to the proposed Transaction. There can be no assurance that any definitive offer will be made, that any agreement will be executed or that this or any other transaction will be approved or consummated. The Company does not undertake any obligation to provide any updates with respect to this or any other transaction, except as required under applicable law.
About Spreadtrum Communications, Inc.
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum“) is a fabless semiconductor company that develops mobile chipset platforms for smartphones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards. Spreadtrum’s solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. Spreadtrum’s customers include global and China-based manufacturers developing mobile products for consumers in China and emerging markets around the world. For more information, visit www.spreadtrum.com.
Appendix 1
Acquisition Proposal Letter
June 20, 2013
The Board of Directors
Spreadtrum Communications, Inc.
Spreadtrum Center, Building No. 1
Lane 2288, Zuchongzhi Road
Zhangjiang, Shanghai 201203
People’s Republic of ChinaLadies and Gentlemen:
Tsinghua University, through its subsidiary Tsinghua Unigroup Ltd. (“Unigroup“) is pleased to submit this preliminary non-binding proposal to acquire Spreadtrum Communications, Inc. (the “Company,” and such transaction the “Acquisition“).
We believe that our proposal as outlined below will provide a very attractive alternative to the Company’s shareholders. Our proposal represents a premium of 20.10% to the Company’s closing price on June 19, 2013 and a premium of 44.3% to the volume-weighted average closing price during the last 30 trading days.
In addition to the premium that our proposal would deliver to Spreadtrum shareholders, we believe that an Acquisition by Tsinghua Unigroup Ltd., which is majority owned by Tsinghua University, a central player in China’stechnology and R&D sectors would provide compelling strategic synergies and position the Company for additional value creation in key wireless communications markets in China and elsewhere going forward.
The terms and conditions upon which we are prepared to pursue the Acquisition are set forth below. We are confident in our ability to consummate an Acquisition as described in this letter.
1. Purchase Price. The consideration payable for each American Depositary Share of the Company (“ADS,” each representing three (3) ordinary shares) will be U.S. $28.50 in cash.
2. Financing. We may finance a portion of the aggregate purchase price with debt. Tsinghua Holdings Co. Ltd., our controlling shareholder, has provided us with a Letter of Support, dated June 20, 2013, a copy of which is attached hereto as Exhibit A, pursuant to which Tsinghua Holdings has committed to guarantee full funding for any equity or debt financing that may be required for the Acquisition, as set forth therein. For the avoidance of doubt, while we may seek to finance a portion of the acquisition with debt financing, Tsinghua Holdings has agreed to provide equity funding up to the total purchase price of $1.5 billion if satisfactory debt financing is not available.
3. Due Diligence. We will be in a position to commence our due diligence for the Acquisition immediately upon receiving access to the relevant materials.
4. Definitive Agreements. We are prepared to negotiate and finalize definitive agreements (the “Definitive Agreements“) concurrently with our due diligence review. This proposal is subject to execution of Definitive Agreements. These documents will provide for representations, warranties, covenants and conditions customary for transactions of this type.
5. Confidentiality. Other than the announcement of this offer letter, we are confident you will agree with us that we have a shared interest in proceeding in an otherwise confidential manner, unless otherwise required by law, until we have executed Definitive Agreements or terminated our discussions.
7. Further Information About Tsinghua Holdings and Tsinghua Unigroup. Unigroup is an operating subsidiary ofTsinghua Holdings, a solely state-owned limited liability corporation funded by Tsinghua University that is responsible for managing a substantial majority of Tsinghua University’s commercial assets. As of December 31st, 2012, Tsinghua Holding’s total assets approximated 70.4 billion RMB and Tsinghua had EBITDA of approximately4.07 billion RMB and net income of approximately 1.45 billion RMB for fiscal 2012. Tsinghua Holdings’s corporate credit rating is AA+ according to CCXI, the Chinese domestic JV partner of Moody’s and the leading credit rating agency in China. Additional information about Tsinghua Holdings can be found at (http://www.thholding.com.cn/english/simpleindex.aspx). Other shareholders include Beijing Jiankun Investment Group Co. Ltd. and Beijing Tourism Group. Unigroup’s business lines include high-technology generally, bio-technology, real estate and urban infrastructure construction.
8. No Binding Commitment. This letter constitutes only a preliminary indication of our interest, and does not constitute any binding commitment with respect to an Acquisition. Such a commitment will arise only upon execution of Definitive Agreements, and in such case will be on the terms provided in such documentation.
In closing, we would like to personally express our commitment to working together in bringing this Acquisition to a successful and timely conclusion. We look forward to hearing from you regarding our proposal at your earlier convenience and kindly request that you notify us by June 28, 2013 should you desire to engage in further discussions about our proposal.
Very truly yours,
Tsinghua Unigroup Ltd.
By: /s/ Zhao Weiguo
Name: Zhao, Weiguo
Title: Chairman and President
Exhibit A
TSINGHUA HOLDINGS LETTER
From:
Tsinghua Holdings Co., Ltd.
25F, Building A, S.P Tower
Tsinghua Science Park
Beijing 100084, P.R. ChinaJune 20th, 2013
To:
Chairman Zhao Weiguo of Tsinghua Unigroup Ltd.
10/F, Unis Plaza, Tsinghua Science Park
Beijing, 100084, P.R. ChinaSubject: Tsinghua Holdings Co. Letter of Support and Agreement to Guarantee Full Funding for the Acquisition ofSpreadtrum Communications, Inc. by Tsinghua Unigroup Ltd.
Dear Mr. Zhao,
This letter (our “Letter of Support“) is to confirm our official endorsement and commitment to support Tsinghua Unigroup Ltd (“You“) in your bid to acquire Spreadtrum Communications, Inc. (NASD: SPRD) (the “Target” and such transaction, the “Project“) at the price of U.S. $28.5 per ADS for up to USD $1.5 billion (the “Support Amount“) and to guarantee any equity or debt financing that may be required for the Project.
As you know, we own and manage a substantial majority of the commercial assets of Tsinghua University, one of the most prestigious universities in the World. As of December 31st, 2012, our total assets approximated 70.4 billion RMB with 2012 EBITDA of approximately 4.07 billion RMB and 2012 net income of approximately 1.45 billion RMB. Tsinghua Holdings Co.’s corporate credit rating is AA+ according to CCXI, the Chinese domestic JV partner ofMoody’s and the leading credit rating agency in China. Our corporate website contains further background information about Tsinghua Holdings, and can be found at (http://www.thholding.com.cn/english/simpleindex.aspx).
As the manager of the commercial affairs of the University, we are the parent company to Tsinghua Unigroup Ltd and own 51% of its outstanding capital shares. We have officially approved the Project and have decided to fully support the Project to facilitate its rapid completion. Although we have sufficient resources to fund the Project up to the full Support Amount from our own balance sheet, we understand that You may elect to utilize debt financing to fund a portion of the purchase price for the Target. In any such case, we intend to assist You in obtaining any such debt financing on favourable terms. In furtherance thereof, we will provide a corporate parent guarantee of such financing up to the Support Amount minus the amount of any equity contribution for the Project (and subject to any applicable government approvals). In furtherance thereof, we will execute any bank or third-party guarantees and other related documents requested by you in form and substance reasonably acceptable to us and to any lender providing such funding.
At your discretion, this Letter of Support can be shared with parties with whom you are discussing the Project.
This Letter of Support and our agreement to provide a guarantee is a commitment of our broad financial enterprise, and credit support for purposes of the Project.
Yours faithfully,
Tsinghua Holdings Co., Ltd.
By: /s/ Xu Jinghong
Print Name: Xu, Jinghong
Title: Chairman of Tsinghua Holdings Co., Ltd.To see a full copy of the signed version of these letters, click here:
http://www.prnasia.com/sa/attachment/2013/06/20130621172830287567.2 – Acquisition Offer Letter and Funding Support Letter.pdf
SOURCE Spreadtrum Communications, Inc.
Diana Jovin, ir@spreadtrum.com, +1 650-308-8148
ARM Cortex-A12 CPU cores and Mali-T622 GPU cores with Process Optimization Packs (POPs), plus Mali-V500 video block for mid-range mobile devices of the end of 2014
in order to cover (very competitively) the hole existing in ARM-based SoCs so far:
AnandTech’s judgement about the Cortex-A12 announcement:
… The Cortex A9 is too slow to compete with the likes of Intel’s Atom and Qualcomm’s Krait 200/300 based SoCs. The Cortex A15 on the other hand outperforms both of those solutions, but at considerably higher power and die area requirements. … The Cortex A15 island in Samsung’s Exynos 5 Octa occupies 5x the die area as the A7 island, and consumes nearly 6x the power. In exchange for 5x the area and 6x the performance, the Cortex A15 offers under 4x the performance. It’s not exactly an area or power efficient solution, but a great option for anyone looking to push the performance envelope. Today, ARM is addressing that hole with the Cortex A12. …
AnandTech’s judgement about Mali-T622 and Mali-V500 announcements:
… The Mali-T622 is a 2-core implementation of the 2nd generation Mali-T600 GPU architecture that we first learned about with the 8-core T628. Each shader core features two ALUs, an LSU and a texture unit. … On the video front, the Mali-V500 video encode/decode block is a multi-core engine used for all video acceleration. The V500 allegedly supports up to 100Mbps High Profile H.264, although details are scarce on more specifics. ARM claims support for up to 120 fps 4K video decode with an 8-core V500 implementation. Mali-V500 also features a protected video path, necessary for gaining content owner support for high-bitrate/high-resolution video decode. The V500 also supports ARM’s Frame Buffer Compression (AFBC), a lossless compression algorithm that can supposedly reduce memory bandwidth traffic by up to 50%. There’s presently no frame buffer compression in Mali GPUs today, but ARM expects to eventually roll AFBC out to Mali GPUs as well.
Announcement information from ARM:
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ARM Targets 580 Million Mid-Range Mobile Devices with New Suite of IP [press release, June 3, 2013]
News Highlights:
- Faster time to market and less design risk with suite of IP including:
ARM Cortex-A12 processor, Mali-T622 GPU, Mali-V500 video solution and POP IP technology;- 580 million mid-range smartphones and tablets are forecast to be sold in 2015
- Cortex-A12 processor delivers 40 percent more performance than Cortex-A9 and brings premium features such as virtualization to the mid-range mobile device market; efficiency profile also makes it ideal for DTV and home networking;
- Cortex-A12 processor brings optimum performance and maximum efficiency of big.LITTLE processing to mid-range smartphones and tablets;
- Mali-T622 GPU offers an efficient and qualified OpenGL ES 3.0 solution and smallest Full Profile GPU Compute solution, putting even greater compute power into the hands of more mobile users;
- Mali-V500 video IP solution reduces system bandwidth and power, while enabling the protection of premium video content with TrustZone support.
The essence is that the first Cortex-A12 based SoCs are expected by mid-2014
– for mid-range devices (smartphones and tablets) in the $200 … $350 price range by late 2014 to early 2015
– with Cortex-A7/A15 architectural compatibity, thus in big.LITTLE configurations with either core, supporting 40-bit addressing (up to 1 TB) and virtualization
– plus providing the highest efficiency in pairing with Cortex-A7 core
– as the follow-up with +40% performance to the current SoCs for mid-range devices based on Cortex-A9 SoCs
The SoC ramp-up of about one year or so is compared to not less than two years ramp-up for Cortex-A9 based SoCs. This is the result of significant progress with Process Optimization Pack technology of ARM which was first time developed along with the processor and GPU cores themselves. It is available now for TSMC 28HPM process technology for lead partners. Six of them are already starting their SoC design. Moreover it will also be available at GLOBALFOUNDRIES 28-SLP HKMG process technology in Q4 2013. So it is also first time as such complete sourcing from two foundries will be available for SoC vendors so early on. GLOBALFOUNDRIES is even going to achieve up to 70 percent higher performance in comparison to a Cortex-A9 processor core using 40nm process technology. Competition between those 2 foundries will understandably be very strong as the 2015 mid-range smartphone and tablet market is expected to be not less than 580 million units.
In comparison the Cortex-A9 core was announced in October 2007 and released in 2008
– now contributes to approximately one-third of all smartphone shipments worldwide
– real development opportunities began in H2 2009 with possibility to go even against Intel Atom (source: Computex 2009 – Warren East Presentation [ARM Holdings, June 1, 2009]):

with improving Cortex-A9 performance on 45nm process achieved through:
– 56% improvement from processor and physical IP optimisations
– 44% improvement from other techniques
The first SoC products based on 45nm technology came in 2011, namely:
– NXP PNX 847x/8x/9x set-top box SoCs sampling in January 2010. However a month later the business related to these products was sold to Trident Microsystems (see the PNX8490/PNX8491 datasheet of February 2010) and as Trident had experienced continuing operating losses it filed for bankruptcy in January 2012. Its set-top box SoC business had been taken over by Entropic Communications, Inc. in April 2012. Although only the PNX8475 is currently offered by Entropic the original Cortex-A9 related SoC know-how is flourishing quite well there (see also: 1, 2, 3 and 4).
– Samsung Orion application processor, later renamed into Samsung Exynos 4210 then further into Exynos 4 Dual, announced in September 2010 for sampling in Q4 2010 and mass production in H1 2011. It first came out with the Samsung Galaxy S II smartphone announced in February 2011 for May 2011 delivery. Other Samsung smartphone and tablet products then followed.
– Texas Instruments OMAP 4430 and OMAP 4440 (later renamed OMAP 4460) application processors announced in February 2009 for sampling in H2 2009 and expected production by the second half of 2010, but actually debuted a year later in February 2010 with sampling available and expected production in H2 2010. The first product based on OMAP 4430 was the BlackBerry PlayBook tablet announced in September 2010 for early 2011 availability but becoming available in June 2011 only. Smartphone products from Motorola (a lot, also a few tablets) and LG (a few) followed that, as well as a number of tablet products from Archos and most notably the Kindle Fire from Amazon, and the Nook from Barnes & Noble.
ARM is representing and projecting the evolution of the market since then as follows:![]()
More information about that was provided in:
Cortex-A12: Diversification in the Mobile Market – Serving the Mid-Range [ARM Smart Connected Devices blog, June 3, 2013]
Mobile devices have become indispensable in North America, Europe, and much of Asia, and are becoming the primary compute platforms for people in emerging markets. We are entering a new era of computing, the post-PC era. ARM® technology has been at the heart of the mobile revolution for over twenty years and continues to be the bedrock of all innovation and change in this space.
Mobile devices, such as smartphones and tablets, are connecting billions of people. In 2013, we are expecting:
– Over 1 billion smartphones forecasted to ship*
– Smartphones for <$50 and Tablets >$800
– Tablets out-ship notebook PCsWhat becomes clear when looking at mobile devices is that we are seeing segmentation into multiple markets, which is an opportunity for growth for ARM partners:
– Premium devices: Price range > $400
– Mid-range devices: Price range between > $200 and < $350
– Entry-level devices: Price range up to $150Source: Mixture of ARM and Gartner Estimates
Premium smartphones and tablets receive a great deal of attention, but it is the entry-level and mid-range markets are expected to grow the fastest over the next years. ARM delivered the Cortex®-A7 processorin the fourth quarter of 2011, and it is now shipping in large volumes in low-cost, quad-core devices. It will be followed by the Cortex-A53 processor, which is soon to be released to lead partners. Both are high-efficiency processors, that are efficient by simple in-order eight stage pipelines which are highly efficient and tuned to deliver very good performance for their size. In the mid-range mobile device market, the industry had tremendous success with devices based on the higher-performance Cortex-A9 processor, which uses a partially out-of-order, nine stage pipeline to achieve high performance tuned to the power constraints of smartphones. The Cortex-A9 processor was released in 2008 and now contributes to approximately one-third of all smartphone shipments worldwide.
The market segmentation is driving the diversification in mobile and resulting in many different requirements needed to achieve the highest performance and lowest power within a sustained thermal envelope. These requirements make it mandatory to provide the functionality previously available only in premium devices, but within the power budgets of mid-range devices. Looking at how to serve those markets, it is clear that one size does not fit all anymore.
Today ARM is introducing the Cortex-A12 processor, the highest performance mid-range CPU that is specifically designed for the next-generation mid-range mobile market. The Cortex-A12 processor brings its own mix of high performance and energy efficiency to 2014 SoC designs: more performance than the Cortex-A9 processor with the same mobile-tuned power efficiency. The Cortex-A12 processor is designed to deliver the best mobile experience:
– Highest performance at lowest power consumption and cost
– Highest efficiency within mid-range thermal envelopes, i.e. achieve highest performance at uncompromised area
– Premium feature set in mid-range mobileThe Cortex-A12 processor is the successor to the Cortex-A9 processor and increases single-thread performance by 40 percent, while matching the best-in-class energy efficiency. Measured in 28nm, the Cortex-A12 processor is about 30 percent smaller in area compared to the Cortex-A9 processor in 40nm technology using the same configuration. Additionally, the Cortex-A12 processor brings today’s premium smartphone features into the mid-range, allowing new use cases and great mobile experiences. Some key added features include:
– big.LITTLE™ processing enables the extension of the dynamic range of the Cortex-A12 processor with the addition of the Cortex-A7 processor
– Virtualization and TrustZone® security support enabling new use cases like BYOD (bring your own device)
– 1TB addressable memory, providing close to no boundaries on memory spaceThe Cortex-A12 processor extends the performance capability in mid-range devices without sacrificing energy efficiency when combined with the Cortex-A7 processor as a big.LITTLE CPU subsystem. big.LITTLE processing provides a highly efficient, high-performance processing solution that can scale to many different use cases. The first iterations of big.LITTLE processing featured the Cortex-A15 and Cortex-A7 processors for high-end solutions. Now, the Cortex-A12 processor is bringing big.LITTLE processing to increase the dynamic range of the mid-range by enabling SoC designers to push the Cortex-A12 processor further while using the Cortex-A7 processor to reduce power well below levels of the Cortex-A9 Processor. This results in an ideal combination of compute resource for efficient workload distribution, running lightweight tasks on the Cortex-A7 processor and high-performance tasks on the Cortex-A12 processor. Early results show up to 2x increased efficiency.
Even though it is designed for mid-range smartphone and tablet devices, the Cortex-A12 processor leads with an excellent efficiency profile, making it an ideal fit for other use cases like home networking, residential gateway and auto infotainment systems.
ARM has also designed the Cortex-A12 processor to work efficiently with a complimentary family of high performance, low power ARM CoreLink™ System IP components:
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The system diagram shown above illustrates the system IP components that will typically support the Cortex-A12 processor in a mobile SoC. To deliver effortless 1080p30 graphics with 1080p encode/decode the system also features a Mali™-T622 GPU supporting OpenGL/ES 3.0 and a Mali-V500 video accelerator.
The CoreLink CCI-400 cache coherent interconnect provides an IO coherent channel with Mali and opens up a number of exciting possibilities for offload and acceleration of tasks. When combined with a Cortex-A7 processor (not shown) on the ACE port, CCI-400 also allows big.LITTLE operation with full L2 cache coherency between the Cortex-A12 and Cortex-A7 processors. Efficient voltage scaling and power management is enabled with the CoreLink ADB-400 enabling efficient DVFS control of the Cortex-A12 processor.
CoreLink MMU-500 provides a hardware accelerated, common memory view for all SoC components and minimizes software overhead for virtual machines to get on with other system management functions. In this system, the Cortex-A12 processor also enjoys a secure, optimized path to memory to further enhance its market-leading performance with the aid of CoreLink TZC-400 TrustZone address space controller and DMC solution. All interconnect components and the ARM DMC guarantee bandwidth and latency requirements by utilizing in-built dynamic QoS mechanisms.
ARM POP™ IP supports the physical implementation of the Cortex-A12 processor and Mali GPU to enable best power, performance, and area so critical to success in the highly competitive mid-range SoC market. ARM CoreSight™ debug and trace on-chip hardware, coupled with the ARM DS-5™ software development toolchain, enable the debug of random, time-related software bugs, and the non-intrusive analysis of critical areas of software. The ARM Development Studio 5 (DS-5TM) toolchain also makes use of performance counters embedded in the processor, graphics processor and interconnect to enable system-wide optimization.
The ARM Cortex-A12 processor is the highest-performance, mid-range CPU. It is specifically designed for the mid-range mobile market, and is broadly supported by a range of other ARM technology IP including ARM system IP, POP IP and development tools to enable ARM Powered® solutions that contribute to the very best user experience in terms of responsiveness and battery life. At the same time, it allows ARM partners to accelerate time to market for mid-range SoCs, while freeing development time to add their own differentiation. The Cortex-A12 is a highly tuned processor that will bring the performance of high-end mobile devices into mid-range smartphone and tablets, as well as into other great market opportunities we haven’t even considered.
* Source: Bank of America
Related Blogs:
ARM and GLOBALFOUNDRIES to Optimize Next-Generation ARM Mobile Processors for 28nm-SLP Process Technology [press release, June 3, 2013]
New ARM POP technology provides core-hardening acceleration for Cortex-A12 and Cortex-A7 processors
Milpitas, Calif. and Cambridge, UK, June 3, 2013 – In conjunction with the launch of the ARM® Cortex®-A12 processor, ARM and GLOBALFOUNDRIES today announced new power, performance and cost-optimized POP™ technology offerings for the ARM Cortex-A12 and Cortex-A7 processors for GLOBALFOUNDRIES 28nm-SLP High-K Metal Gate (HKMG) process technology. The Cortex-A12 processor was introduced by ARM today as part of a suite of IP targeting the rapidly growing market for mid-range mobile devices.
The companies will combine ARM’s next-generation mobile processor and POP IP with GLOBALFOUNDRIES 28nm-SLP HKMG process solution, enabling a new level of system performance and power efficiency with the optimum economics necessary to serve the mid-range mobile device market. The new initiative builds on the existing robust ARM Artisan® physical IP platform and POP IP for the Cortex-A9 processor already available on GLOBALFOUNDRIES 28nm-SLP, signifying another milestone in the multi-year collaboration between ARM and GLOBALFOUNDRIES.
Central to this increase in functionality for mid-range mobile devices is the new ARM Cortex-A12 processor. The Cortex-A12 processor provides a 40 percent performance uplift and direct upgrade path from the incredibly successful Cortex-A9 processor, while matching the energy efficiency of its predecessor. The Cortex-A12 processor provides best-in-class efficiency as a standalone solution, but additionally supports the innovative big.LITTLE™ processing technology with the Cortex-A7 processor, bringing this energy-efficient technology to the mid-range. GLOBALFOUNDRIES 28nm-SLP process technology and associated ARM POP IP for the Cortex-A12 processor enables up to 70 percent higher performance (measured single-thread performance) and up to 2x better power efficiency in comparison to a Cortex-A9 processor using 40nm process technology. Designers can achieve even higher performance by trading off for lower power efficiency, depending on their application needs. Click here for more information on the Cortex-A12 processor.
The newest POP technology enables customers to accelerate core-hardening of Cortex-A12 and Cortex-A7 processors on GLOBALFOUNDRIES 28nm-SLP HKMG process. POP IP for Cortex processors has successfully enabled ARM-based SoCs with more than 30 different licenses since being introduced over three years ago. POP IP is composed of three elements necessary to achieve an optimized ARM processor implementation: core-specific tuned Artisan physical IP logic libraries and memory instances, comprehensive benchmarking reports, and implementation knowledge that detail the methodology used to achieve the result, to enable the end customer to achieve the same implementation quickly and at low risk.
“With 580 million mid-range smartphones and tablets forecast to be sold in 2015[i], consumers are increasingly looking for the right combination of performance, low power and cost effectiveness,” said Dr. Dipesh Patel, executive vice president and general manager, Physical IP Division at ARM. “With the Cortex-A12 processor and suite of IP announced today, ARM is delivering an optimized system solution leveraging the most innovative technologies available for this market. The POP IP solution on GLOBALFOUNDRIES 28nm-SLP helps designers balance the performance, power and cost tradeoffs to achieve their targets for this growing market.”
GLOBALFOUNDRIES 28nm-SLP technology is ideally suited for the next generation of smart mobile devices, enabling designs with faster processing speeds, smaller feature sizes, lower standby power and longer battery life. The technology is based on GLOBALFOUNDRIES’ “Gate First” approach to High-K Metal Gate (HKMG), which has been in volume production for more than two years. The technology offers a combination of performance, power efficiency and cost that is ideally suited for the mid-range mobile market.
“GLOBALFOUNDRIES is committed to a deep relationship with ARM to enable best-in-class solutions for our mutual customers. Our collaboration on the ARM Cortex-A12 processor implementation is a direct result of this focus and collaboration,” said Mike Noonen, executive vice president of Marketing, Sales, Design and Quality at GLOBALFOUNDRIES.
GLOBALFOUNDRIES’ next-generation 14nm-XM FinFET technology is expected to bring another dimension of enhanced power, performance and area for ARM mobile processors. A Cortex-A9 processor implemented on 14nm-XM technology, using 9-track libraries, is projected to enable a greater than 60 percent increase in frequency at constant power, or a decrease of more than 60 percent in power consumption at constant performance, when compared to implementation on 28nm-SLP technology using 12-track libraries. Similar results are expected for Cortex-A12 processor implementations. Click here for more details on GLOBALFOUNDRIES’ 14nm-XM FinFet technology.
For further discussions about GLOBALFOUNDRIES process technologies or ARM IP offerings please visit the companies’ respective exhibits at the Design Automation Conference (DAC), June 3-5, 2013 in Austin, Texas. ARM is located in booth 931, and GLOBALFOUNDRIES can be found at booth 1314.
China: Entry-level dual core IPS WVGA (480×800) smartphones $65+ now, quad-core $70+ in June
China market: Qualcomm, Spreadtrum cutting quad-core processor prices [DIGITIMES, April 25, 2013]
Qualcomm and Spreadtrum Communications have both cut prices for their quad-core products to better compete against MediaTek, which controls half of the smartphone-chip market in China, according to industry sources.
Qualcomm recently quoted its quad-core solutions at less than US$10, slightly cheaper than MediaTek’s offerings, the sources indicated. Meanwhile, Spreadtrum has lowered its quad-core processor prices to similar levels. Both firms are trying to gain market share through aggressive pricing, the sources said.
Monthly shipments of MediaTek’s smartphone chips have topped 15 million units recently, and even approached the 20 million level, the sources revealed. The booming shipments already lifted MediaTek’s share of China’s smartphone-IC market to 50%, the sources said.
MediaTek’s quad-core solutions reportedly have attracted orders from Coolpad, Huawei, Lenovo and ZTE.
In other news, MediaTek has reported higher-than-expected sales for the first quarter of 2013. The firm has scheduled an investors meeting on May 6 to discuss its performance in the first quarter, and business outlook.
Remark: the inserted slides are from 1Q13 Investor Roadshow Presentation [Feb 26, 2013] from Spreadtrum
And as $48 Mogu M0 “peoplephone”, i.e. an Android smartphone for everybody to hit the Chinese market on November 15 [Nov 9, 2012]
now Mogu S2 went on sale today [China Smartphones, April 22, 2013]
A leader in the production of super cheap smart phones, the Chinese company Mogu, today held a preliminary sales of its new budget smartphone Mogu S2. The official price of the unit is 399 yuan, or about $65. Today, the sale was put on a limited batch of 5000 smartphones at the price of 299 yuan ($48).
Mogu S2 is running the 2-core processor with a clock speed of 1.2 Ghz, and used 4-inch screen with a resolution of WVGA [480×800] to display the information. In addition there is 512 MB RAM, 4GB of ROM and a 5-megapixel camera. A nice addition is its support for two SIM cards, modules, WIFI, Bluetooth, and GPS. The operating system is installed MOGO OS (Android 2.3 Gingerbread).
Additional key information from the company’s product page [MOGU蘑菇手机, April 20, 2013]: i.e. IPS display and the Spreadtrum SC8825 or SC6825 SoC
We’ve seen the effect of the earlier SC6820 SoC leading to Temporary Nokia setback in India [‘Experiencing the Cloud’, April 28, 2013]. This is how Spreadtrum presented this situtation recently:
The two new SoCs are the same to the maximum as SC8825 has only the following additional functionality:
TD-SCDMA standards (3GPP R7), 2010~2025MHz / 1880~1920MHz/2300~2400MHz
and prospects for that additional functionality (internal to China) were presented as exceptionally bright by the company:
Spreadtrum Announces Commercial Launch of Dual-Core Smartphone Chipsets for TD-SCDMA and EDGE [press release, April 2, 2013]
SC8825 (TD-SCDMA) and SC6825 (EDGE) set new standard for dual-core smartphone chipset cost and performance with high level of integration, standout graphics performance and best-in-class TD-SCDMA technology
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider inChina with advanced technology in 2G, 3G and 4G wireless communications standards, today announced the commercial availability of its dual-core 1.2GHz smartphone chipsets for TD-SCDMA (SC8825) and EDGE (SC6825), following the successful qualification of its platform by China Mobile.
“With our new dual-core chipsets, Spreadtrum has leveraged our expertise in system design to deliver the lowest-cost dual-core platform in combination with high end graphics performance for the TD-SCDMA and EDGE markets,” said Dr. Leo Li, chairman and CEO of Spreadtrum. “This combination of low-cost architecture, standout graphics performance, and best-in-class TD-SCDMA technology provides smartphone designers with unprecedented value in bringing high end features to low-cost devices.”
Spreadtrum’s SC8825, which supports dual-mode TD-SCDMA/HSPA & EDGE/GPRS/GSM and the SC6825, which supports EDGE/GPRS/GSM, are based on a highly efficient multi-core architecture delivering the lowest cost platform available for dual-core TD-SCDMA and EDGE smartphone products. The single-chip chipsets integrate a dual-core 1.2GHz Cortex-A5 core processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators for differentiated performance and user experience. Both chipsets are further paired with a single-chip mutimode RF transceiver for a high level of integration and are pin-to-pin compatible, enabling handset makers to leverage a common handset development effort for products shipping to China as well as to emerging markets.
In addition to their high level of integration and low-cost architecture, Spreadtrum’s chipsets further deliver standout graphics performance. The solutions’ powerful graphics processing capability enhances the user experience for games and other graphics-rich applications, and enables Spreadtrum to bring high end features such as the larger screen sizes more commonly found in premium smartphones to low-cost devices.
“The benchmark results we are achieving for our dual-core solution, measured by popular benchmark programs such as AnTuTu and GLBenchmark 2.5, significantly outperform other commercial dual-core products,” added Dr. Li. “This powerful processing capability provides our customers with an even more cost-effective and power-efficient way to deliver high end features in low-cost smartphones.”
Other features of Spreadtrum’s SC8825 and SC6825 chipsets include support for HD 1280×720 LCD display, H.264 720p video playback, up to 8 megapixel RGB camera and dual-SIM, dual-standby capability. The chipsets ship with turnkey Android and systems software, reducing the engineering time and resources required by handset makers to bring devices to market, with reference implementations available for both 4-layer and 6-layer PCB layouts.
The SC8825 and SC6825 are commercially available now. The chipsets have already been incorporated by leading China handset makers into smartphone models that are expected to ship commercially during 2Q 2013.
About Spreadtrum Communications, Inc.
Spreadtrum Communications, Inc. (NASDAQ:SPRD; “Spreadtrum”) is a fabless semiconductor company that develops mobile chipset platforms for smartphones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards. Spreadtrum’s solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. Spreadtrum’s customers include global and China-based manufacturers developing mobile products for consumers in China and emerging markets around the world. For more information, visit www.spreadtrum.com.
SC8825 TD-HSPA+/TD-SCDMA/GSM/GPRS/EDGE Baseband Chip [product site, April 2, 2013]
Spreadtrum’s SC8825 is a highly integrated mixed signal baseband processor for dual-mode TD-SCDMA/HSDPA/HSUPA/HSPA+ and GSM/GPRS/EDGE applications. SC8825 integrates a dual-core 1.2GHz ARM Cortex-A5 processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators in a highly efficient system architecture that brings differentiated performance and user experience to low-cost smartphones. SC8825 is coupled with Spreadtrum’s single-chip tri-band TD-SCDMA/quad-band EDGE/GPRS/GSM RF transceiver for small footprint, and ships with turnkey Android systems software for rapid time to market and efficiency in handset design.
SC8825 Baseband Chip Diagram
SC8825 Key Features
Core Description
- ARM Cortex-A5 dual-core, clock speeds up to 1.2GHz
- 32KB I-Cache, 32KB D-Cache
- 32KB I-Cache, 32KB D-Cache
- 128bit FP data path
Communication Features
- GSM/GPRS/EDGE standards, GSM850/EGSM900/DCS1800/PCS1900
- EGPRS Class 12
- TD-SCDMA standards (3GPP R7), 2010~2025MHz / 1880~1920MHz/2300~2400MHz
- HR, FR, EFR, AMR-NB
- HSPA+ 4.2 Mbps,HSUPA 2.2 Mbps
Multimedia Support For
- Mali 400 GPU MP2, 40MTri/s, 700Mpix/s, OpenGL ES 1.1/2.0
- Decoder: MPEG4/H.263 720p@30fps; H.264 720p@30fps ; VP8 720p@30fps
- Encoder:H.263/H.264/MPEG4 D1@30fps
- Video Streaming: MPEG4/H.263/H.264 720p@30fps
- 3G-324M Video Telephony
- 8 MP Camera Sub-system JPEG decoder/encoder
- Support MP3/AAC/AAC+/MIDI/AMR-NB/WAV format
- Audio codec included
LCD Display Features
- Support up to HD resolution
- Built-in LCD Controller,touch panel controller
- MIPI and RGB @60fps
- Support OSD / Rotation / Scaling
Memory I/F Support For
- NAND flash(8bit and 16 bit devices)
- HW ECC, multi-bit ECC
- 2G byte SDR/LPDDR1/LPDDR2 (16bit and 32bit devices)
- eMMC(4.4.1) boot
Peripheral I/F Support For
- HS USB 2.0
- 4 x UART
- 3 x SPI interface , 3-wire SPI,4-wire SPI, synchronous SPI
- 4 x I2C interfaces
- 2 x I2S and PCM interface
- 3 x SDIO interfaces
- 1 x eMMC interfaces
- 2 x SIM/USIM interfaces
- 4 x PWM outputs
- ETM port
- More than 100 GPIO pins
- 8*8 keyboard interfaces
Other Features
- Operating ambient temperature range: -45 to +95 degrees centigrade
- 12.1mm×12.1mm 517-ball, 0.4mm ball pitch
SC6825 GSM/GPRS/EDGE Baseband Chip [product site, April 2, 2013]
Spreadtrum’s SC6825 is a highly integrated mixed signal baseband processor for GSM/GPRS/EDGE applications. SC6825 integrates a dual-core 1.2GHz ARM Cortex-A5 core processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators in a highly efficient system architecture that brings differentiated performance and user experience to low-cost smartphones. SC6825 is coupled with Spreadtrum’s single-chip quad-band EDGE/GPRS/GSM RF transceiver for small footprint, and ships with turnkey Android systems software for rapid time to market and efficiency in handset design.
SC6825 Baseband Chip Diagram
SC6825 Key Features
Core Description
- ARM Cortex-A5 dual-core, clock speeds up to 1.2GHz
- 32KB I-Cache, 32KB D-Cache
- 256KB L2 Cache
- 128bit FP data path
Communication Features
- GSM/GPRS/EDGE standards, GSM850/EGSM900/DCS1800/PCS1900
- EGPRS Class 12
- HR, FR, EFR, AMR-NB
Multimedia Support For
- Mali 400 GPU MP2, 40MTri/s, 700Mpix/s, OpenGL ES 1.1/2.0
- Decoder:MPEG4/H.263 720p@30fps; H.264 720p@30fps ; VP8 720p@30fps
- Encoder:H.263/H.264/MPEG4 D1@30fps
- Video Streaming: MPEG4/H.263/H.264 720p@30fps
- 3G-324M Video Telephony
- 8 MP Camera Sub-system JPEG decoder/encoder
- Support MP3/AAC/AAC+/MIDI/AMR-NB/WAV format
- Audio codec included
LCD Display Features
- Support up to HD resolution
- Built-in LCD Controller,touch panel controller
- MIPI and RGB @60fps
- Support OSD / Rotation / Scaling
Memory I/F Support For
- NAND flash(8bit and 16 bit devices)
- HW ECC, multi-bit ECC
- 2G byte SDR/LPDDR1/LPDDR2 (16bit and 32bit devices)
- eMMC(4.4.1) boot
Peripheral I/F Support For
- HS USB 2.0
- 4 x UART
- 3 x SPI interface , 3-wire SPI,4-wire SPI, synchronous SPI
- 4 x I2C interfaces
- 2 x I2S and PCM interface
- 3 x SDIO interfaces
- 1 x eMMC interfaces
- 2 x SIM/USIM interfaces
- 4 x PWM outputs
- ETM port
- More than 100 GPIO pins
- 8*8 keyboard interfaces
Other Features
- Operating ambient temperature range: -45 to +95 degrees centigrade
- 12.1mm×12.1mm 517-ball, 0.4mm ball pitch
TSMC’s 16nm FinFET process to be further optimised with Imagination’s PowerVR Series6 GPUs and Cadence design infrastructure
OR After CPU level optimisation With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology [‘Experiencing the Cloud’ April 3, 2013] the world #1 foundry decided to further optimise its crucial 16nm FinFET process with the most demanding from implementation point of view PowerVR Series6 GPUs for graphics and compute applications
Update: TSMC 16nm FinFET to enter mass production within one year after 20nm ramp-up, says Chang [DIGITIMES, April 18, 2013]
TSMC’s 16nm FinFET process will enter mass production in less than one year after ramping up production of 20nm chips, company chairman and CEO Morris Chang said at an investors meeting today (April 18).
Chang indicated that TSMC already moved its 20nm process to risk production in the first quarter of 2013. As for 16nm FinFET, the node will be ready for risk production by the year-end, Chang said.
While stepping up efforts to bring newer nodes online, TSMC has revised upward its 2013 capex to US$9.5-10 billion. The foundry previously set capex for the year at US$9 billion.
In addition, Chang reiterated his previous remark that production of TSMC’s 28nm wafers and revenues generated from the process in 2013 will triple those of 2012. The node technology will continue to play the major driver of TSMC’s revenue growth in 2013, said Chang, adding that the foundry’s share of the 28nm foundry market will remain high this year.
The essence:
- Cadence and TSMC Strengthen Collaboration on Design Infrastructure for 16nm FinFET Process Technology [press release, April 8, 2013]
- Imagination and TSMC Strengthen Technology Collaboration [press release, March 25, 2013] TSMC optimising 16nm FinFET design flows using PowerVR GPUs to drive mobile performance
… As part of this new phase of their relationship, Imagination will work closely with TSMC to develop highly optimised reference design flows and silicon implementations using Imagination’s industry-leading PowerVR Series6 GPUs combined with TSMC’s advanced process technologies, including 16-nanometer (nm) FinFET process technology.
Imagination and TSMC R&D teams will also work together to create fully characterised reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology capability to demonstrate new levels of system performance and capabilities while retaining all the essential characteristics of power, silicon area and small package footprint demanded by high volume mobile SoCs. …
… “Just as memory drove silicon processes in the ‘80s and ‘90s, and CPUs drove processes further in the late ‘90s and ‘00s, high performance mobile GPUs for graphics and compute applications are one of the major drivers for our most advanced process technologies,” says Dr. Cliff Hou, TSMC Vice President, R&D. “We’re pleased to be working with Imagination, an established leader in mobile and embedded GPU IP, to understand how best to use PowerVR GPUs to work with us to optimize future generations of our most advanced process technologies, and advanced system design techniques.” …
This close cooperation will significantly help TSMC to reach mass production at 16nm node in H2 2014 at the latest, as shown by the advanced technology ramp-up information at TSMC given below:
Back in November it was reported that TSMC 16nm FinFET rollout to come earlier than expected, says Digitimes Research analyst [Nov 8, 2012]:
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to ramp up 20nm production ahead of schedule, and also put its 16nm FinFET process into production far earlier than expected, according to Digitimes Research analyst Nobunaga Chai.
Chai indicated that information revealed by TSMC at its most-recent investors meeting clearly shows that the foundry has made significant progress in the development of advanced process technology, especially its first FinFET process that will be at 16nm. TSMC’s 16nm FinFET process should be able to enter mass production in less than one year after ramping up production of 20nm chips, Chai predicts.
Speculation has been circulating that TSMC’s 20nm process will help the foundry attract its first orders for application chips from Apple. Chai said that he expects TSMC’s 16nm FinFET process to play an important role in Apple’s “breakthrough” product. TSMC’s 20nm process is likely to grab orders for Apple’s next processor, which could be merely an upgrade of the existing A6 version.
During a Q&A session at TSMC’s recent investors meeting, company CFO Lora Ho revealed that the foundry’s 20nm process has received around 50 product tape-outs – about one-fifth of TSMC’s previous tape-outs using 28nm process. Ho added that actual production at the newer node will not kick off until 2014.
As for 16nm FinFET, TSMC chairman and CEO Morris Chang disclosed that the company expects to start “risk” production of the process in November 2013, followed by mass production a year later.
and a few days ago came the news that TSMC to install 20nm fab equipment ahead of schedule, says report [DIGITIMES, April 2, 2013]
Taiwan Semiconductor Manufacturing Company (TSMC) plans to begin installing production equipment at its 20nm-capable facilities on April 20, about two months ahead of schedule, according to a Chinese-language Economic Dailys News (EDN) report.
Following the equipment move-in, TSMC is expected to tape out SoC products at 20nm around the end of the second quarter with initial capacity of 5,000 12-inch wafer starts per month, the report cited unnamed fab tool suppliers as indicating. The new technology node is set to enter volume production in the third quarter with monthly capacity reaching more than 10,000 wafer starts, the report said.
TSMC internally set a target of growing its capacity for 20nm products to 30,000-40,000 wafer starts monthly by the end of the first quarter, 2014, the report noted.
TSMC in April 2012 disclosed that its 20nm technology would begin volume production at Phase 6 of its Fab 12 wafer fab (Hsinchu, northern Taiwan) in 2013, and Phase 5 of Fab 14 (Tainan, southern Taiwan) will be the foundry’s second 20nm-capable fab, which is scheduled to enter volume production in early 2014.
TSMC also began construction on Phase 3 of Fab 15 (Taichung, central Taiwan) in September 2011. The module will be TSMC’s second gigafab equipped for 20nm process technology. The foundry has not provided a timeframe to volume produce 20nm products at Phase 3 of Fab 15, but already set the initial capacity at 40,000 wafer starts per month.
The evolution which led to the crucial TSMC-Imagination-Cadence collaboration at the 16nm node was:
TSMC OIP 2012 – David Harold (Director of PR, Imagination Technologies) interview [chipestimate YouTube channel, Oct 26, 2012]
Implementing and Optimising Graphics IP in SoCs [Imagination Technologies presentation at TSMC OIP 2012, Oct 16, 2012] by Steven Riddle
Abstract
As major IP blocks such as GPUs increasingly dominate the area, power and performance of next generation SoCs, traditional “Soft IP” fully synthesisable, process-neutral solutions need to be re-evaluated to maintain the optimum balance between maximum portability and maximum performance. In this paper, we will discuss the techniques being used by Imagination and its partners to address some of the highest performance corners of this envelope, and how the characteristics of the latest processes such as 28HPM and beyond are being taken increasingly into account when designing future Soft IP high performance solutions.
Imagination highlights how GPUs are driving silicon performance and SoC innovation [press release, Oct 16, 2012]
Imagination’s engineers to present paper on GPU Optimisation Techniques at TSMC’s Open Innovation Platform Forum
San Jose: Imagination Technologies, a leading multimedia and communications technologies company, observes that the growth in performance of mobile GPUs, such as its PowerVR IP cores, is driving future generations of silicon process and packaging technologies, as well as SoC (system on chip) processing performance across a growing range of markets.
The GPU’s ability to deliver unprecedented processing horsepower (measured in GFLOPS) whilst also delivering amazing graphics performance per mm2 and per mW, means that GPU capabilities are becoming the dominant force driving heterogeneous processing performance in everything from mobile phones through to TVs, in-car information and entertainment, games consoles and even cloud computing.
Recognising this trend, Imagination is further developing its roadmaps, architectures and support to ensure its partners can select IP solutions optimized for the latest silicon process and SIP (System in Package) technologies, enabling them to realise the full potential of what GPUs can deliver in SoCs, both for graphics and compute capabilities.
To help its partners, Imagination is already working with leading silicon foundries to implement high performance mobile GPU-based systems delivering unheard-of levels of memory bandwidth, using the latest PowerVR Series6 GPUs combined with wide I/O memory and advanced 3DIC assembly and process technologies. Imagination is also working with foundries and EDA vendors to ensure that licensees of all of Imagination’s IP (intellectual property) cores can benefit from well-defined tool flows and optimized libraries to achieve the most aggressive speed, area and power consumption targets.
Reflecting closer ties to key foundries, Imaginations’ engineers will be speaking at the TSMC Open Innovation Platform Forum 2012 in San Jose, CA, on ‘Implementing and Optimising Graphics IP in SoCs’. Imagination will also be demonstrating its latest PowerVR GPU and VPU (video processor) as well as Ensigma RPU (radio processor) and Meta CPU IP technologies at the event (booth 201).
Says Tony King-Smith, VP marketing, Imagination: “Just as memory drove silicon processes in the ‘80s and ‘90s, and CPUs drove these in the late ‘90s and ‘00s, mobile GPUs are now becoming the most demanding on-chip function driving tomorrow’s advanced SoCs and silicon processes. We see our strengthening relationships with leading foundries, EDA vendors and library providers, as well as strategic activities with industry standards bodies such as HSA Foundation and Khronos Group, as key to ensuring we continue to drive and deliver the leading edge capabilities our customers have come to expect from us.”
More information:
– Imagination Technologies will boost mobile graphics performance through customization [VentureBeat, Oct 15, 2012]
… Imagination usually gives a “synthesizable core,” or a ready-to-go finished design, to its chip licensee partners. The partners take that core and incorporate it in their chips and take it to a foundry partner, which makes the chip. The change now will be that Imagination will optimize its cores for a particular foundry’s factory, such as a 28-nanometer manufacturing line at TSMC, so that the resulting chip will be faster and use less power.
“We’re doing this because our customers are asking for it,” said Tony King-Smith (pictured), vice president of marketing at London-based Imagination Technologies, at a press briefing in San Jose, Calif. “They say they want a chip tuned to a particular foundry.”
King-Smith said the result would be faster and lower power chips, but he couldn’t quantify how much. …
– Imagination tools graphics cores for 28 nm [EETimes, Oct 15, 2012]
…
Imagination is working with EDA tool and library developers as well as foundries to help optimize the physical layout of its GPUs. However, the company currently has no plans to sell hardened macros.
New capabilities will span a broad range of chip design areas including standard cell libraries, voltage scaling in process nodes and clock-tree optimization, Tony King-Smith, vice president of marketing at Imagination, said here the day before the opening of the TSMC event. “People are asking us to do more process tuning,” said King-Smith. “We will not deviate from our IP being fully synthesizable, however we will complement it more and more with tuned libraries and tool flows.”
“We are making the design more aware of the process with hints in the design database itself—most library vendors with an open mind will be talking with us,” King-Smith added.
Hard macros are rarely used because “no one has the same [chip] floor plan, so it’s better to tune up the flows and libraries so people can harden the designs themselves more effectively,” he added.
The extent of improvements in reduced power consumption, area or increased performance will vary greatly among design teams, depending on the time they put into the optimizations, he said, declining to provide any hard figures.
Foundries as well as SoC designers are driving the demand for more optimization, he said. Most of the effort is now going on at the 28-nm node, but programs have started at 20- and 14/16-nm nodes using FinFETs, he added.
“The foundries are coming to us when characterizing 28- or 20-nm nodes looking for reference designs for what will push their processes,” said King-Smith. “Historically, it has been memory and processors [in that role but] now GPUs are consuming the most area and power on the chip,” he said.
…
Imagination Optimizes its IP Capabilities with TSMC on Latest Silicon Process Technologies [press release, June 14, 2012]
Imagination Technologies, a leading multimedia and communications technologies company, announced its collaboration with TSMC to ensure that licensees of all of Imagination’s IP (intellectual property) cores can optimize speed, area and power consumption on TSMC’s most advanced 28nm and below processes.
By bringing together engineers from both companies, this collaboration aims to improve power, performance, and area by co-optimising TSMC process technologies and foundation IPs with Imagination’s most advanced IP cores, including its latest PowerVR GPUs.
Imagination, a member of TSMC’s Soft-IP Alliance program, is making this announcement as part of a closer relationship with TSMC. Imagination intends to validate its IP cores through the TSMC Soft-IP Alliance program.
Imagination’s IP core families in this collaboration include:
PowerVR graphics, the de facto standard for mobile, embedded and computing graphics
PowerVR video and display, the comprehensive and widely adopted range of multistandard decoder, encoder and enhancement cores for applications from mobile to ultra-HD
Ensigma communications, the multi-standard programmable communications and connectivity technology for TV, radio, Wi-Fi and Bluetooth
Meta processors, the advanced 32-bit hardware multi-threaded processor architecture that delivers the best in both general purpose and signal processing performance
Imagination is one of the world’s leading semiconductor IP suppliers, with cores which can be synthesised for a broad range of silicon processes. As more customers use Imagination’s IP cores to deliver the key high performance processing on their SoCs (System on Chip), Imagination plays a key role in the semiconductor IP segment to deliver the levels of performance demanded by leading edge customers.
Says Tony King-Smith, VP marketing, Imagination: “Many of our licensees rely on TSMC to provide them with leading edge low power, high performance silicon foundry capabilities. This strengthening of our relationship with TSMC reflects our determination to deliver the best possible SoC solutions on the latest silicon processes for our SoC IP licensing partners. We believe this initiative will ensure that Imagination’s licensees to continue to push the boundaries of what is possible for future generations of advanced SoCs.”
Says Mark Dunn, VP of IMGWorks, Imagination’s SoC implementation group: “The characteristics of the latest processes such as 28HPM and beyond have to be taken increasingly into account when designing future high performance IP-based solutions. As major blocks such as GPUs increasingly dominate the area, power and performance of next generation SoCs, design flows need to be tuned to maintain the optimum balance between maximizing IP portability and achieving the best possible performance. We believe this extensive engineering partnership will greatly benefit all of our IP partners.”
“We are delighted to be working with Imagination to deliver the full benefits of TSMC’s latest and most advanced processes for mobile and embedded applications,” says Suk Lee, Senior Director of Design Infrastructure Marketing Division, TSMC. “By leveraging Imagination’s leadership position in the market, we can help our customers to ship the most highly optimised SoCs.”
Imagination and TSMC Strengthen Technology Collaboration [press release, March 25, 2013]
TSMC optimising 16nm FinFET design flows using PowerVR GPUs to drive mobile performance
Kings Langley and Hsinchu – March 25, 2013 – TSMC (TWSE: 2330, NYSE: TSM) and Imagination Technologies (LSE: IMG.L), a leading multimedia, processor, communications and cloud technologies company, today announced the next phase of their technology collaboration.
As part of this new phase of their relationship, Imagination will work closely with TSMC to develop highly optimised reference design flows and silicon implementations using Imagination’s industry-leading PowerVR Series6 GPUs combined with TSMC’s advanced process technologies, including 16-nanometer (nm) FinFET process technology.
Imagination and TSMC R&D teams will also work together to create fully characterised reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology capability to demonstrate new levels of system performance and capabilities while retaining all the essential characteristics of power, silicon area and small package footprint demanded by high volume mobile SoCs.
As GPUs increasingly dominate the area, power and performance of next generation SoCs and the options available to designers using advanced silicon processes become more complex, design flows and libraries need to be optimally tuned to enable design teams to achieve the best possible performance, power consumption and silicon area in ever more demanding timescales. To address these challenges, Imagination and TSMC are investigating how the characteristics of the latest processes, such as 16FinFET, influence the design of high performance IP-based SoCs.
Says Hossein Yassaie, CEO of Imagination: “Many of our licensees rely on TSMC to provide them with leading edge low power, high performance silicon foundry capabilities. Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products. We are delighted to announce our strengthening relationship with TSMC, and look forward to seeing the fruits of these projects benefiting our many mutual customers.”
“Just as memory drove silicon processes in the ‘80s and ‘90s, and CPUs drove processes further in the late ‘90s and ‘00s, high performance mobile GPUs for graphics and compute applications are one of the major drivers for our most advanced process technologies,” says Dr. Cliff Hou, TSMC Vice President, R&D. “We’re pleased to be working with Imagination, an established leader in mobile and embedded GPU IP, to understand how best to use PowerVR GPUs to work with us to optimize future generations of our most advanced process technologies, and advanced system design techniques.”
Imagination IP cores for next generation SoCs
Imagination is a member of TSMC’s Soft-IP Alliance program, through which it has begun to validate all of its major IP core families so that TSMC’s customers can take full advantage of the results of this collaboration. Imagination’s IP portfolio is unrivalled in its breadth, including:
• PowerVR GPU (graphics processor) Series5, 5XT and 6 (‘Rogue’): the most widely shipped for mobile and embedded graphics and GPU Compute
• PowerVR VPU (video processor) Series3 and 4: the industry’s most widely deployed range of multi-standard video decoder and encoder cores for applications from mobile to ultra-HD
• Ensigma RPU (radio processor) Series3 and 4: the multi-standard programmable communications and connectivity technology for TV, radio, Wi-Fi and Bluetooth
• MIPS CPU and embedded processors: advanced processor architectures featuring hardware multi-threading that deliver class-leading performance from high end Android-based applications processors down to small yet highly efficient embedded processors
Cadence and TSMC Strengthen Collaboration on Design Infrastructure for 16nm FinFET Process Technology [press release, April 8, 2013]
Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications. The deep collaboration, beginning earlier in the design process than usual, will effectively address the design challenges specific to FinFETs – from design analysis through signoff – and will deliver the infrastructure necessary to enable ultra low-power, high-performance chips.
FinFETs help deliver the power, performance, and area (PPA) advantages that are needed to develop highly differentiated SoC designs at 16 nanometers and smaller process technologies. Unlike a planar FET, the FinFET employs a vertical fin-like structure protruding from the substrate with the gate wrapping around the sides and top of the fin, thereby producing transistors with low leakage currents and fast switching performance. This extended Cadence-TSMC collaboration will produce the design infrastructure that chip designers need for accurate electrical characteristics and parasitic models required for advanced FinFET designs for mobile and enterprise applications.
“The FinFET device requires greater accuracy, from analysis through signoff, and that is why TSMC is teaming with Cadence on this project,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. “This collaboration will enable designers to use the new process technology with confidence earlier than ever before, allowing our mutual customers to meet their power, performance and time-to-market goals.”
“Producing the design infrastructure necessary for these types of complex, groundbreaking processes requires close collaboration between foundries and EDA technology innovators,” said Chi-Ping Hsu, senior vice president, Silicon Realization Group at Cadence. “In joining with TSMC, a leader in FinFET technology, Cadence brings unique technology innovations and expertise that will provide designers with the FinFET design capabilities they need to bring high-performance, power-efficient products to market.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.