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Eight-core MT6592 for superphones and big.LITTLE MT8135 for tablets implemented in 28nm HKMG are coming from MediaTek to further disrupt the operations of Qualcomm and Samsung

Updates

Update: The Power of 8: MediaTek True Octa-Core [mediateklab YouTube channel, July 29, 2013]

MediaTek is the first in the world to optimize and adopt True Octa-Core technology for the perfect balance of power and performance. Unlike existing octa-core solutions in the market, which can only activate half of their CPU cores at once, MediaTek True Octa-Core allows for all eight of its cores to run simultaneously, offering the ultimate combination of performance and power-efficiency. *Learn about MediaTek True Octa-Core Solution: http://www.mediatek.com/_en/Event/201307_TrueOctaCore/tureOcta.php

Update:  MT6592—The world’s first true octa-core SOC with scalable eight-core processing [product page, March 13, 2014]

Overview

MediaTek MT6592 is the world’s first heterogeneous computing SOC with scalable eight-core processing for superior multi-tasking, industry-leading multimedia features and excellent performance-per-watt. Based on 28nm HPM (High-Performance Mobile) process technology, MT6592 has eight CPU cores, each capable of clock speeds up to 2GHz.

Features

  • ARM® Cortex®-A7 processor (1.7GHz or 2GHz)
  • 28nm HPM process technology
  • MAGE 3D graphics engine
  • UMTS / HSPA+ R8 / TD-SCDMA / EDGE / LTE
  • 801.11a/b/g/n, Bluetooth, GPS, FM tuner
  • 16MP camera image signal processor
  • Full HD H.265 / VP9 and Ultra HD H.264 video playback
  • ARM Mali™ GPU (700MHz)
  • MediaTek ClearMotion™ video enhancement

Update: [€147.18] Cubot X6 OctaCore MT6592 Phone Ultimate Slim Design 5″ OGS HD Retina [arif rachman YouTube channel, March 1, 2014]

Cubot X6 OctaCore MT6592 Ultimate Slim Design
Please follow the link below to see the full specification
http://bit.ly/CubotX6
This is the latest phone from Cubot. Well.. the phone has the latest MT6592 1.7GHz processor. 28nm process, with quad core mali 450 GPU. Frequency is up to 700MHz. It supports full HD video with wide screen decoding format.
The true eight core processor can run simultaneously through advanced scheduling algorithm, dynamic temperature control and power management technology to optimize workload distribution to each core. When handling multiple tasks and heavy duty needs, achieve the peak performance of full eight core. At light load, you can turn off the core, the ultimate energy saving idle. It means substantial increase in cell phone battery life.
The Mali 450 graphics processor, overall performance is up to twice of the previous Mali 400. It supports full-HD 60fps. The triangles per second and render is 152M 2.8G pixels. Should be easy to run 3D games, smooth playback of 1080 HD videos. It also has a built in powerful MAGE 3D engine.
The front camera is 5 mega pixels while the back camera is 8 mega pixels. The camera is equipped with five pieces of high precision glass structure, which can effectively filter infrared blue glass. This is to achieve the level of professional SLR camera. Far better than ordinary lenses. The phone uses Sony sensor with latest 13Mega-Pixel CMOS Image Sensor.
In a week, the phone will be available at banggood for only $184.99 with free shipping worldwide! That’s an octa core phone below 200$ price tag! Not cheap enough?
Leave your email to get referred and get 10$ discount! Cheapest price out there!
Please follow the link below to see the full specification
http://bit.ly/CubotX6

IllusionMage [Wikipedia, excerpted on March 15, 2014]

IllusionMage is a paid for 3D modeling, animation, and rendering software packages comprising the core engine of Blender, an open-source, 3D software suite, and bundled with materials related to Blender.

Other names this bundle has gone under are IllusionMage3D, 3DMagix, and 3DMagixPro.[1]

All materials and software included are freely available from other sources. The marketing of this program includes images that were stolen from other sources, often created with competing 3D applications. The image of the alleged creator of the software, Seth Avery, is a random stock photo.[2]

Criticism

IllusionMage has come under fire by many prominent Blender news sites and figures, including Ton Roosendaal, the founder of the Blender Foundation[3][4]

Related

References

  1. “Illusion Mage & 3D Magix Pro (affiliate) domain names” Topic: Illusion Mage & 3D Magix Pro *is* a scam. KatsBits Forum. Retrieved 2 October 2011.
  2. “Handsome young man isolated over white”. Laflor Photography via iStockPhoto. Retrieved 8 May 2012.
  3. January 2011 Blender Foundation Press Release
  4. “3DMagix and IllusionMage, scam or open source leeches?”. BlenderNation. Retrieved 30 September 2011.

Update: 联发科平板四核心MT8135 官方成绩曝光 (MediaTek MT8135 quad-core tablet exposure Official Results) [ 驱动之家 (MyDrivers.com), July 29, 2013]

image

Update: MediaTek’s Quad-core Tablet SoC MT8135 : Performance Benchmark [mediateklab YouTube channel, July 19, 2013]

MediaTek introduces industry leading tablet SoC -MT8135, which integrates ARM’s big.LITTLE™ processing subsystem and a PowerVR™ Series6 GPU from Imagination Technologies. MediaTek MT8135 fulfills the most demanding CPU and GPU usage scenarios, whether it is heavy web downloading, hardcore gaming, high-quality premium video viewing or rigorous multitasking, while maintaining the utmost power efficiency. In this video, you’ll see how MediaTek MT8135 outperforms today’s tablet solutions.
Update: MediaTek Introduces Industry Leading Tablet SoC, MT8135 [press release, July 29, 2013]
TAIWAN, Hsinchu – July 29, 2013 – MediaTek Inc., (2454: TT), a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets. The quad-core solution incorporates two high-performance ARM Cortex™-A15 and two ultra-efficient ARM Cortex™-A7 processors, and the latest GPU from Imagination Technologies, the PowerVR™ Series6. Complemented by a highly optimized ARM® big.LITTLE™ processing subsystem that allows for heterogeneous multi-processing, the resulting solution is primed to deliver premium user experiences. This includes the ability to seamlessly engage in a range of processor-intensive applications, including heavy web-downloading, hardcore gaming, high-quality video viewing and rigorous multitasking – all while maintaining the utmost power efficiency.
In line with its reputation for creating innovative, market-leading platform solutions, MediaTek has deployed an advanced scheduler algorithm, combined with adaptive thermal and interactive power management to maximize the performance and energy efficiency benefits of the ARM big.LITTLE™ architecture. This technology enables application software to access all of the processors in the big.LITTLE cluster simultaneously for a true heterogeneous experience. As the first company to enable heterogeneous multi-processing on a mobile SoC, MediaTek has uniquely positioned the MT8135 to support the next generation of tablet and mobile device designs.
“ARM big.LITTLE™ technology reduces processor energy consumption by up to 70 percent on common workloads, which is critical in the drive towards all-day battery life for mobile platforms,” said Noel Hurley, vice president, Strategy and Marketing, Processor Division, ARM. “We are pleased to see MediaTek’s MT8135 seizing on the opportunity offered by the big.LITTLE architecture to enable new services on a heterogeneous processing platform.”
“The move towards multi-tasking devices requires increased performance while creating greater power efficiency that can only be achieved through an optimized multi-core system approach. This means that multi-core processing capability is fast becoming a vital feature of mobile SoC solutions. The MT8135 is the first implementation of ARM’s big.LITTLE architecture to offer simultaneous heterogeneous multi-processing.  As such, MediaTek is taking the lead to improve battery life in next-generation tablet and mobile device designs by providing more flexibility to match tasks with the right-size core for better computational, graphical and multimedia performance,” said Mike Demler, Senior Analyst with The Linley Group.
The MT8135 features a MediaTek-developed four-in-one connectivity combination that includes Wi-Fi, Bluetooth 4.0, GPS and FM, designed to bring highly integrated wireless technologies and expanded functionality to market-leading multimedia tablets. The MT8135 also supports Wi-Fi certified Miracast™ which makes multimedia content sharing between devices remarkably easier.
In addition, the tablet SoC boasts unprecedented graphics performance enabled by its PowerVR™ Series6 GPU from Imagination Technologies. “We are proud to have partnered with MediaTek on their latest generation of tablet SoCs” says Tony King-Smith, EVP of marketing, Imagination. “PowerVR™ Series6 GPUs build on Imagination’s success in mobile and embedded markets to deliver the industry’s highest performance and efficient solutions for graphics-and-compute GPUs. MediaTek is a key lead partner for Imagination and its PowerVR™ Series6 GPU cores, so we expect the MT8135 to set an important benchmark for high-end gaming, smooth UIs and advanced browser-based graphics-rich applications in smartphones, tablets and other mobile devices. Thanks to our PowerVR™ Series6 GPU, we believe the MT8135 will deliver five-times or more the GPU-compute-performance of the previous generation of tablet processors.”
“At MediaTek, our goal is to enable each user to take maximum advantage of his or her mobile device.  The implementation and availability of the MT8135 brings an enjoyable multitasking experience to life without requiring users to sacrifice on quality or energy. As the leader in multi-core processing solutions, we are constantly optimizing these capabilities to bring them into the mainstream, so as to make them accessible to every user around the world,” said Joe Chen, GM of the Home Entertainment Business Unit at MediaTek.
The MT8135 is the latest SoC in MediaTek’s highly successful line of quad-core processors, which since its launch last December has given rise to more than 350 projects and over 150 mobile device models across the world. This latest solution, along with its comprehensive accompanying Reference Design, will like their predecessors fast become industry standards, particularly in the high-end tablet space.
Update: Optimized big. LITTLE – MediaTek [MediaTek, July 29, 2013]
Multi-core system-on-chip (SoC) design has brought tremendous benefits to mobile device users by offering seamless engagement in rigorous multitasking. To overcome the issue with high energy consumption and thermal readings, MediaTek is deploying an advanced scheduler algorithm, combined with adaptive thermal and interactive power management to maximize the performance and energy efficiency benefits of the ARM big.LITTLE™ architecture. The technology will allow applications software to simultaneously access all the processors in the big.LITTLE™ cluster for a true heterogeneous experience, activating both of its CPU clusters concurrently for extreme performance.
Optimized big. LITTLE™
ARM big.LITTLE™ processing is designed to address the energy and thermal issues associated with multi-core system-on-chip (SoC) solutions. It allows for the creation of dual-cluster SoCs, with one more powerful (big) cluster for processing intensive tasks and a less powerful (LITTLE) cluster for executing routine functions. MediaTek is among the first SoC designers to have adopted this ground-breaking technology. Unlike its counterparts, however, the company has done so in a manner that affords device users the utmost energy and thermal efficiency rates.
Enabling Heterogeneous Multi-Processing
imageOf the three big.LITTLE™ software models that can be integrated, for example, MediaTek chose the Heterogeneous Multi-Processing [developed and named by ARM as Global Task Scheduling (GTS), also known earlier as big.LITTLE MP, see in the last section of this post in detail] approach, which unlike the other two methods – Cluster- [as was implemented in Galaxy S4 by Samsung with Exynos 5 SoC having 4xA7+4xA15 configuration] and CPU-Migration [IKS (In Kernel Switcher) developed by Linaro, see in the last section of this post in detail] – allows for individual cores to be activated as and when needed for maximum efficiency.
However, use of the most versatile model isn’t MediaTek’s only advantage. In line with its reputation for creating innovative, market-leading platform solutions, MediaTek has deployed an advanced scheduler algorithm, combined with adaptive thermal and interactive power management to maximize the performance and energy efficiency benefits of the ARM big.LITTLE™ architecture.
The technology will allow applications software to simultaneously access all the processors in the big.LITTLE™ cluster for a true heterogeneous experience, activating both of its CPU clusters concurrently for extreme performance.
imageIn comparison, the current octa-core SoC solution, utilizes one of the more inferior big.LITTLE™ software models. As a result, the processor is not as efficient as it otherwise might be.
As the first company to enable Heterogeneous Multi-Processing on a mobile SoC in the form of its MT8135 Reference Design, MediaTek is uniquely positioned to support the next wave of tablet and mobile devices.
Update: Optimized ARM big.LITTLETM – MediaTek Enables ARM big.LITTLETM Heterogeneous Multi-Processing Technology in Mobile SoCs [MediaTek Position Paper in PDF, July 29, 2013]

MediaTek MT8135 brings PowerVR Series6 GPUs to a mobile device near you [With Imagination Blog, July 29, 2013]

Over the years, our close partnership with MediaTek has resulted in the release of some very innovative platforms that have set important benchmarks for high-end gaming, smooth UIs and advanced browser-based graphics-rich applications in smartphones, tablets and other mobile devices. Two recent examples include:

MediaTek has been steadily establishing itself as an important global player for consumer products like smartphones, tablets and smart TVs, with a strong foothold in Latin America and Asia, and a rapidly growing presence in Europe and North America. Earlier this year, MediaTek introduced MT8125, one of their most successful tablet chipsets for high-end multimedia capabilities.

image

While MT8125 has been extremely popular with OEMs including Asus, Acer or Lenovo, MT8135 has the potential to consolidate Mediatek’s existing customer base and open up exciting new opportunities thanks to the advanced feature set provided by Imagination’s PowerVR ‘Rogue’ architecture.

MT8135 is a quad-core SoC that aims for the middle- to high-end tier of the tablet OEM market. It supports a 4-in-1 connectivity package that includes Wi-Fi, Bluetooth 4.0, GPS and FM radio, all developed in-house by MediaTek. Miracast is another important addition to the multimedia package, enabling devices using MT8135 to stream high-resolution content more easily to compatible displays, over wireless networks.

image

MT8135 incorporates a PowerVR G6200 GPU [from the block diagram corresponds to the PowerVR G6230] from Imagination that enables advanced mobile graphics and compute applications for the mainstream consumer market, including fast gaming, 3D navigation and location-based services, camera vision, image processing, augmented reality applications, and smooth, high-resolution user interfaces.

image

As MT8135-powered mobile devices start appearing in the market, developers will have access to new technologies and features introduced by our PowerVR Series6 family such as:

  • our latest-generation tile based deferred rendering (TBDR) architecture implemented on universal scalable clusters (USC)
  • high-efficiency compression technologies that reduce memory bandwidth requirements, including lossless geometry compression and PVRTC/PVRTC2 texture compression
  • scalar processing to guarantee highest ALU utilization and easy programming

Thanks to the PowerVR G6200 GPU inside the MT8135 application processor, MediaTek brings high-quality, low-power graphics to unprecedented levels by delivering up to four times more ALU horsepower compared to MT8125, its PowerVR Series5XT-based predecessor. PowerVR G6200 fully supports a wide range of graphics APIs including OpenGL ES 1.1, 2.0 and 3.0, OpenGL 3.x, 4.x and DirectX 10_1, along with compute programming interfaces such as OpenCL 1.x, Renderscript and Filterscript.

image

By partnering up with Imagination, MediaTek has access to our industry-leading PowerVR graphics, worldwide technical support, and a strong ecosystem of Android developers capable of making the most of our technology. We look forward to shortly seeing our brand-new PowerVR Series6 GPUs in the hands of millions of consumers, and see MediaTek as one of our strategic partners for our latest generation PowerVR GPUs moving forward.

End of Updates

This report consists of the following parts:

  • The latest MediaTek roadmap, high-end and OS strategy
  • News reports about MT6592 and its first application

  • Update: MediaTek True Octa [MediaTek, July 23, 2013] imageEfficient video playback:
    When on decoding mode, the battery used for decoding HEVC (H.265) FHD video
    can be reduced by up to 18 percent compared to current quad-core solutions
    (from MediaTek True Octa-Core Position Paper [MediaTek, July 23, 2013])
  • What is new vs. my earlier The state of big.LITTLE processing [‘Experiencing the Cloud’, April 7, 2013] report
For the preceding smartphone SoC in the current roadmap see MediaTek MT6589 quad-core Cortex-A7 SoC with HSPA+ and TD-SCDMA is available for Android smartphones and tablets of Q1 delivery [‘Experiencing the cloud’, Dec 12, 2012]. For smartphone SoCs before that  see Boosting the MediaTek MT6575 success story with the MT6577 announcement  – UPDATED with MT6588/83 coming early 2013 in Q42012 and 8-core MT6599 in 2013 [‘Experiencing the cloud’, June 27, July 27, Sept 11-13, Sept 26, Oct 2, 2012]. Note that MT6588 was renamed MT6589 when was launched, as MT6599 would be renamed MT6592 now.


The latest MediaTek roadmap, high-end and OS strategy

Maybank Kim Eng just published in its MediaTek Closing In Fast [July 17, 2013] report the following two SoC roadmaps:

image

GPU for MT6592 smartphone SoCs (and presumably for MT6588 as well) will be Mali according to Zhu Shangzu (朱尚祖), MediaTek Global Smartphone General Manager in the [Part 2] MediaTek to push 8 small cores, the mystery [ESM 国际电子商情 (International Electronic Business), July 18, 2013] exclusive interview.
According to 28nm Technology [TSMC, June 21, 2011] description: The 28nm technology node of the TSMC foundry (which is used for manufacturing by MediaTek) has a high performance (HP) process as the first option to use high-k metal gate (HKMG) process technology. The 28nm low power with high-k metal gates (HPL) technology, as the second option, adopts the same gate stack as HP technology while meeting more stringent low leakage requirements with a trade of performance speed. Explanation: From about 10 µm (1971) to below 0.1 µm (100 nm) conventional silicon oxynitride as the gate insulator with polysilicon gate, so called poly/SiON gate stack, was used for CMOS technology. It was typically possible to scale down to 45 nm (2008), only TSMC was able to scale it down further to 28 nm in which most of the current 28nm SoCs from TSMC are produced. imageWhile Intel (and IBM) had to introduce high-K dielectric as the gate insulator with metal gate, so called High-k / Metal Gate stack,  for the performance of their 45 nm products in 2008 (in order to continue with the Moore’s law in their realm) as you could see on the right (taken from Life With “Penryn” [DailyTech, Jan 27, 2007] interview with Mark Bohr, Intel Senior Fellow, and Steve Smith, Intel Vice President DEG Group Operations), TMSC could introduce that only on the 28nm node as described above. The HKMG based 28nm SoCs are much higher performance (or higher performance still with low power by HPL) as you could see from the 2GHz clockrate of the MT6592 (above) or MT8315 (below) vs. that of the convential poly/SiON counterparts, MT6589 and MT8389 with 1.2GHz.

image

Complementary post reminder: H2CY13: Upcoming next-gen Nexus 7, the ASUS MeMO Pad HD 7 “re-incarnation” at reduced by $50 price, dual/quad-core mid-range tablets from white-box vendors starting from $65 [‘Experiencing the Cloud’, July 5, 2013] in which there is plenty of information regarding the non high-end tablet SoCs, from MediaTek (MediaTek MT8125, MediaTek MT8377 and MediaTek MT8389) as well as competition from Allwinner and Rockchip. The pre-eminent ASUS MeMO Pad™ HD 7 described in detail there is using the MT8125 SoC, while the new Nexus 7 (to be announced before the ending of July) the  Qualcomm Snapdragon 600 Quad Core SoC. In that sense we got with that post not only a complete H2 competitive tablet market picture for mid-range but some information regarding the new Qualcomm high-end as well.
For the upcoming MT8135 tablet SoC it is known from the part 3 of the Zhu Shangzu interview that the quad-core configuration will be 2xA15+2xA7, which means a big.LITTLE architecture and quite probably the already mature ‘In Kernel Switcher’ (IKS) scheduler initially GTS with MediaTek’s “advanced scheduler algorithm, combined with adaptive thermal and interactive power management” and called Heterogeneous Multi-Processing (HMP) by MediaTek (see in the updates in front of the original post). But as As ARM already decided on the architecture of the other, more general ‘Global Task Scheduling’ (GTS) solution (see much below) I would assume that the proper hardware underpinnings for GTS will already be built in (unlike in the Samsung’s Exynos 5 SoC released before), so when the scheduler software will be mature enough it will run well on MT8135. The inclusion of just two cores of each (unlike in Exynos 5) is a very strong proof-point of that. As far as the GPU is concerned we know from Zhu Shangzu interview that an Imagination GPU will be used, therefore I will leave the next-generation SGX6XX (PowerVR Series6 or ‘Rogue’) indication in the above table. Update: It is the PowerVR G6200 GPU [from the block diagram corresponds to the PowerVR G6230] as you could see from Imagination block post published on the MT8135 announcement (July 29), and included here in front of the original post.

with the following commentary:

Strong fundamentals intact. Having exceeded its 2Q13 guidance so significantly, we believe MTK will continue to ride the strong momentum in 3Q13, perhaps growing its revenue by low-to-mid-teens QoQ or 30% YoY to chalk up another record high of TWD36-38b [US$1.2-1.27B]. Importantly, a better product mix and cost structure would help lift its profitability to ±44%. We expect MTK to ship 70-72m units of smart devices, up 25-30% QoQ, with quad-core APs and tablets making up nearly 50% of total shipment. The benefits of operating leverage should drive OPM past 20%, the highest since 3Q10. MTK is set to report its 2Q13 results in late July or early August and we forecast net profit of TWD6.8b [US$227M] (EPS: TWD5.02; Street: TWD6.3b), up over 80% QoQ and 100% YoY. GM is also likely to meet the high end of its guidance, ie, 43.5%, on richer mix and improved cost structure. Reported revenue of TWD33.3b, up almost 40% QoQ and 42%YoY, is already well ahead of guidance (TWD30-32b). However, we cut our FY13/14 earnings forecasts by 3% each to factor in the delay in merger with MStar and potential inventory correction in 4Q13/1Q14. MTK remains a key BUY in our tech space.

Closing in fast on QCOM. MTK has spared no efforts to enhance its smart device portfolio since 2H12 and further signs of acceleration are evident. It is introducing two high-end APs in 4Q13MT6588 and MT6592 – using 28nm HKMG and advanced graphic features. While the former is a quad-core AP operating at 1.7GHz, the latter is capable of running at 2GHz (when all eight core engines are turned on). In the absence of full details, we estimate MT6592 may perform closer to Qualcomm Snapdragon 600 AP (used in Galaxy S4 and HTC One), while MT6588 should outshine Snapdragon 400. MTK has won several international OEMs with MT6589 and with MT6588/6592, its chances of penetrating tier-1 OEMs have increased significantly. In addition, it will sample its high-end 4G/LTE/LTE-TDSCDMA modem chipset in anticipation of the launch of 4G network in China later this year. As for tablets, MTK’s latest APs MT8125/8389 were well-received and it is set to deliver the high-end MT8135 (big.Little design) in 3Q13. We expect its smartphone/tablet shipments to reach 200-225m/25m units in 2013.

In the same part of the interview Zhu Shangzu explained MediaTek’s high-end strategy as follows (as translated by Google and Bing with manual edits):

image

… I think the future of high-end smartphones innovation will focus on the expansion of big screen multimedia applications, and this is our direction. …

Judging from the current situation, customers of high-end flagship phones are still using the products of the competitors, but there is flagship in our quad-core case as well, and OPPO, Vivo and GiONEE and other quad-core phones are also very popular. Our next goal is to get the customers of flagship machines using our platform via helping customers to achieve stronger performance on the big screen multimedia.

Therefore, the 8-core MT6592 can be regarded as our first bugle call for moving towards the high-end market. Our mission is that one day customers can also recognize MediaTek as doing high-end flagship products. MT6592 is the first step, strictly speaking, it is not the most high-end platform, next we will move step by step towards the higher end.

Q: Why will MediaTek use eight small A7 cores as a generation of high-end platform, but did not choose to use four large A15 cores or four big and four small ones as a way to achieve the goal? This is also a question for the industry as there are many controversial issues with this.  

For power, or performance per watt, we did a lot of investigation. Eight A7 cores is currently the best solution, and as through a process we designed to boost peak frequency of the A7 to 1.9-2Ghz, performance is also very strong.

Currently we chose a small core, because under the existing process, the larger the chip die size, the larger is the standby leakage, resulting in higher standby power consumption. For example, the A15 is the strongest core currently, but not in run-time power cosumption. Even if its frequency is pushed down to very low levels, there is still a larger leakage. Therefore, the larger is the area of a ​​single-core, the larger is the overhead energy efficiency, and as long as the poweris on, there will be a greater leakage.

In addition, the 8-core CPU is just one aspect of improving the mobile multimedia experience. In fact, as we have been doing MediaTek digital TV for a long time, we will extend that digital TV competency here – some strong move for the smartphones. This is what other platform vendors can not do. In the 6592, for example, the latest HEVC codec will be integrated. [HEVC is a video compression standard, a successor to H.264/MPEG-4 AVC]

Although our MT6592 GPU is also using a ‘Deluxe Mali quad-core GPU, but in order for content developers to achieve better compatibility, our HEVC is a software solution via the 8-core CPU, it is not using a GPU- based software solution. Because there are some strong content developers who will use their own HEVC decode. Currently the ‘Deluxe’ quad-core GPU on 6592 is mainly used to perform large-scale games and to do some advanced UI.

[Part 3] How to plan the future in the tablet market?

Q: I do note that the MT6592 is now using a quad-core Mali GPU, while before the MediaTek mainstream used Imagination GPU. How would you rate these two companies’ products?

The Imagination company has been doing GPUs long time in its history, the architecture design is beautiful, more artistic. The initial architecture of Mali [from ARM] would be more rough, and therefore area and power consumption will be worse. But after nearly three years of time, Mali has made a lot of progress, both are learning from each other, and by now the levels of these two are equal. The future perspective is that ARM’s overall resources are somewhat more fully available.

Q: This year we have seen MediaTek  to attack the tablet market, what is the plan for the future in the tablet market?

A: Our current strategy is to carry out a mobile phone product line extension.

At the end of July the launch of a tablet chip is expected: the MT8135, with 2xA15 +2xA7, still using an Imagination GPU [Update: It is the PowerVR G6200 GPU (from the block diagram corresponds to the PowerVR G6230) as you could see from Imagination block post published on the MT8135 announcement (July 29), and included here in front of the original post], and mainly targeting the high-end tablet market. A small reminder, our MT6572 is not suitable for tablet computers as the original definition did not take into account the application of flat-screen.

[Part 6] If Google Android OS will be converged how MediaTek will respond?

Q: There is also a very large concern, as the industry is worried that after doing their own hardware next year (e.g. Xphone, watches, glasses, etc.) whether Google will close the Android OS, i.e. to do a Pure Android later on, and don’t let OEMs to change it? MTK will also have a very big impact, what do you think? What is the MTK attitude on other free OS’s?

A: If Google OS will be closed and converged that will have a huge impact on us. But from what we observe and communicate with Google, they will not close the OS or converge it. Google’s profitability does not depend on OS, he is relying on the service for profit. By doing hardware Google also aims to promote his services, he is very happy to use someone else’s machine on their home services.

Of course, we will also be prepared, as we comprehesively examine and take into account the prevailing factors. We will use Windows as a second priority, while using Firefox [OS] and HTML5 as a secondary backup, by keeping track of them. Because we judge that the [Android] OS convergence from Google profitability point of view is very low, therefore our vote for these two emerging open OS’s is in the ‘not so urgent’ category, in addition to and outside of Android. The other focus is again on Windows Phone 8For the moment, however, WP8 hardware configuration requirements are still higher (mainly memory), power consumption – after optimizing the gap with Android – is not too large.


News reports about MT6592 and its first application
Update: MediaTek True Octa [MediaTek, July 23, 2013]

Efficient video playback:
When on decoding mode, the battery used for decoding HEVC (H.265) FHD video
can be reduced by up to 18 percent compared to current quad-core solutions
(from MediaTek True Octa-Core Position Paper [MediaTek, July 23, 2013])

July 18 this information appeared on the English http://en.v5zn.com/ website of the related smartphone vendor as well: MediaTek MT6592’s first eight-core mobile phone exposure makes you believe [July 15, 2013] as translated by Google and Bing with manual edits

MediaTek so-called true eight-core processor MT6592 was announced not long ago, it is expected the first models equipped with processors to surface. It broke the news, that the domestic mobile phone manufacturer brand named after the 19th-century French writer Jules Verne [凡尔纳] has been determined to launch a flagship model “V8” quipped with the MT6592 processor.

Verne’s current main product is the “V5” model, equipped with a quad-core MediaTek MT6589, and a 5-inch 720p OGS full lamination screen, 1GB of RAM, 4GB storage, 8-megapixel back-illuminated camera, 2400 mAh Battery, with a list price of 999 yuan [$166].

V8 has not yet announced the exact configuration bit it is estimated to have about 5.5 inch 1080p screen, 2GB RAM, 32GB storage, 13 million pixels Sony stacked camera, higher capacity battery, etc., without these natural shot himself embarrassed flagship.

It looks like that cooperation between MediaTek and the domestic Shanzhai vendors remains close. As MT6589 has rocked the Main Street, MT6592 will soon become a standard, and “an eight-core” promotion will be overwhelming.

Incidentally recap: MT6592 uses eight Cortex-A7 architecture cores, clocked at up to 2.0GHz, with TSMC 28nm manufacturing, Antutu run is known as close to 30,000, but the graphics core has not been confirmed, PowerVR SGX 544MP4/554MP4 are likely [it will be Mali, as communicated by MediaTek, see above].

The marketing of the processor has begun to customers, but mass production will be in November, so if recent high profile publicity is to be fulfilled, certainly we will have a large sale early next year.

Company introduction [Jules Verne mobile phone, January 16, 2013] as translated by Google and Bing with manual edits

Shenzhen MINDRAY Platinum Communication Technology Ltd. is is specialized in products development, production, sales and service of intelligent mobile terminals of high-tech companies. Under the “Jules Verne VOWNEY” brand the company is to create a mobile intelligent terminal brand.
MINDRAY Platinum company with “intelligent life” as the brand mission, is to “enhance the user experience, to help people grasp the development opportunities” as the goal, trying to make Jules Verne a trustworthy, continuous innovation and smart moves life guide. Every effort, just as long as you!
Jules Verne mobile phone network direct sales, stripping agents layers, increases direct benefits to consumers. We are committed to allow more consumers to have a better quality of life with an intelligent terminal.
The “Jules Verne VOWNEY ” brand aspires to be able to improve the quality of life for mobile users intelligent terminal INITIATIVE persons.
is to become quality of life can improve the user moves Smart The Terminal Guide. Lead you into “Slide 5.0”.
“Verne VOWNEY “brand aspires to be able to improve the quality of life for mobile users intelligent terminal INITIATIVE persons. I lead you into the “Slide 5.0″era.
Brand interpretation
Jules Verne: a derivative of intelligent life???
English explanation : VOWNEY
V : value— Value
O : opportunity— Opportunity
W : worth— It is worth
N : new— New
E : e— Mobile Internet
Y : you— You
Jules Verne is to ” create a new life guided smart” as the goal, and strive to become a trusted, sustainable and innovative mobile phone brand, all efforts, just because of you!

Mediatek MT6592 8 core processors coming by the end of July! [Gizchina.com]

Reports out of Taiwan state that Mediatek will launch the MT6592 8-core processor by the end of July.

There was word that Mediatek were working on an 8 core chipset late last year, but like many we believed it had been placed on the back burner while they prepared their LTE chip. This seems to be wrong though as sources in Taiwan claim that Mediatek’s 8-core processor will arrive before the end of this month!

The MT6592 chip will be made up of 8 Cortex-A7, 28nm processor clocked at a frequency of up to 2Ghz! Early tests have the 8 core MT6592 scoring up to 30,000 points in Antutu which is more than Samsung’s 8 core Exynos 5410 processor.

The first batch of these new processors will be ready for manufacturers to begin development by the end of July, while Mediatek are preparing full-scale manufacture for November!

If everything goes to plan we can expect powerful 8 core phones from Tier 1 Chinese phone manufacturers by December!

MediaTek to launch true 8-core, 2GHz MT6592 chipset in November? [Engadget, July 2, 2013]

Samsung may already have its 8-core Exynos 5 Octa offering, but the original “big.LITTLE” implementation means only up to four cores work together at any time — either the Cortex-A15 quartet or its lesser Cortex-A7 counterpart. In other words, we’d rather rename the chipset range to something like “Exynos 5 Quad Dual.” But according to recent intel coming from Taipei and Shenzhen, it looks like Taiwan’s MediaTek is well on its way to ship a true 8-core mobile chipset in Q4 this year.

The first mention of this 2GHz, Cortex-A7 MT6592 chip came from UDN earlier today. The Taiwanese publication claims MediaTek started introducing its first octa-core product to clients last week, and it’s expected to enter mass production using TSMC’s 28nm process in November. The first mobile devices to carry this hot piece of silicon may hit the market in early 2014 — hopefully just in time for the Chinese New Year shopping rush.

UDN adds that the MT6592 scored close to 30,000 on AnTuTu, which is pretty high but still some distance behind Qualcomm’s 2.2GHz quad-core Snapdragon 800. Of course, chances are MediaTek’s offering will be much cheaper, as evidenced by all the affordable MediaTek-powered devices in China these days.

In a separate article from last week, UDN pointed out that judging by over a hundred job openings released by MediaTek last month, the company is clearly putting an emphasis on 4G LTE technology, alongside GPU and Android development. The publication also quoted chairman Tsai Ming-kai saying he will launch an LTE solution in Q4 this year, by which point MediaTek will only be one or two years behind its competitors.

The second piece of info came from HQ Research analyst Pan Jiutang, who posted an alleged spy shot of MediaTek’s upcoming roadmap (pictured left). There the octa-core MT6592 is listed with a clock speed of 1.7GHz to 2GHz, along with 1080p 30fps video decoding support. There’s also a quad-core 1.7GHz MT6588 accompanying its octa-core sibling in the same period on the timeline, though it appears to be just a faster version of the current 1.2GHz MT6589.

For the sake of phone manufacturers, both new chipsets will apparently be pin-to-pin compatible with the quad-core 1.3GHz MT6582 due Q3 this year, thus lowering R&D costs. Better yet, the roadmap also states that the MT6290 LTE modem — as teased by Tsai above — will be compatible with these three chipsets.

With MediaTek quickly catching up ahead of China’s eventual TD-LTE launch, Qualcomm will need to tread carefully to keep its Chinese QRD partners happy.

[Thanks, Ryan!]

Update: It’s worth noting that ARM’s eventual “big.LITTLE MP” implementation will allow all eight cores to run simultaneously, but the Exynos 5 Octa currently doesn’t support this. Thanks, UncleAlbert!

SOURCE: Sina Weibo (login required), UDN (1), (2)


What is new vs. my earlier
The state of big.LITTLE processing [‘Experiencing the Cloud’, April 7, 2013] report

Power scheduler design proposal [by Morten Rasmussen from ARM on Linux kernel mailing list, July 9, 2013]

This patch set is an initial prototype aiming at the overall power-aware scheduler design proposal that I previously described <http://permalink.gmane.org/gmane.linux.kernel/1508480>.

The patch set introduces a cpu capacity managing ‘power scheduler’ which lives by the side of the existing (process) scheduler. Its role is to monitor the system load and decide which cpus that should be available to the process scheduler. Long term the power scheduler is intended to replace the currently distributed uncoordinated power management policies and will interface a unified platform specific power driver obtain power topology information and handle idle and P-states. The power driver interface should be made flexible enough to support multiple platforms including Intel and ARM.

This prototype supports very simple task packing and adds cpufreq wrapper governor that allows the power scheduler to drive P-state selection. The prototype policy is absolutely untuned, but this will be addressed in the future. Scalability improvements, such as avoid iterating over all cpus, will also be addressed in the future.

Thanks,
Morten

From <http://permalink.gmane.org/gmane.linux.kernel/1508480>

                        +-----------------+
                         |                 |     +----------+
         current load    | Power scheduler |<----+ cpufreq  |
              +--------->| sched/power.c   +---->| driver   |
              |          |                 |     +----------+
              |          +-------+---------+
              |             ^    |
        +-----+---------+   |    |
        |               |   |    | available capacity
        | Scheduler     |<--+----+ (e.g. cpu_power)
        | sched/fair.c  |   |
        |               +--+|
        +---------------+  ||
           ^               ||
           |               v|
 +---------+--------+  +----------+
 | task load metric |  | cpuidle  |
 | arch/*           |  | driver   |
 +------------------+  +----------+

Linux Kernel News – June 2013 [by Shuah Khan in Linux Journal , July 9, 2013]

As always the Linux kernel community has been busy moving the Linux mainline to another finish line and the stable and extended releases to the next bump in their revisions to fix security and bug fixes. It is a steady and methodical evolution process which is intriguing to follow. Here is my take on the happenings in the Linux kernel world during June 2013.
Mainline Release (Linus’s tree) News
Linus Torvalds released Linux 3.10. You can read what Linus Torvalds had to say about this release in his release announcement athttp://lkml.indiana.edu/hypermail/linux/kernel/1306.3/04336.html
Two notable features in this release are improved SSD caching and better Radeon graphics driver Power Management.

Power efficient scheduling design
Ingo Molnar (Red Hat, x86 maintainer), Morten Rasmussen (ARM, power mgmt.), Priti Murthy (IBM, scheduler), Rafael Wysocki (Intel, Linux PM, and Linux ACPI maintainer) and Arjan van de Ven discussed the proposed power-aware or power-efficient scheduler design and what’s the best way to integrate it into the kernel.
Power management and the ability to balance performance and power efficiency is important and complex. It is not just about scheduler or cpus. It spans I/O devices that transition into lower-power states and how costly it is to bring them back to fully active state when needed. There is latency involved in these transitions. As always, Linux developers reach consensus to solve complex problems such as these and come up with path to get to the goal taking small steps towards that goal. Here is another example of that process at work.

Power-efficient scheduler work has been active for a few months now. Several RFC patches have been floated and discussed. This work is being pursued very actively in x86 space by IBM and in ARM space by ARM. The premise is that, if scheduler could pack tasks on a few cores and keep these cores fully utilized and, transition other cores to low power states, when the scheduling goal is power savings over performance. In other words, instead of keeping all the cores active, scheduler could consolidate tasks on a few cores and transition other cores to low-power states for better power efficiency.

It is easier said than done. Scheduler is at a higher level and would not be the best judge of making decisions on transitioning CPUs to idle states and deciding on the ideal frequency they should be running at. These decisions are better left to platform drivers that have the specific knowledge of the platform and architecture as they are complex and very hardware specific. In other words, power aware scheduler tuned to run well on x86 platforms will not work as well or could fail miserably on ARM platforms.
Scheduler has to accomplish load balancing as well as power balancing in a way to meet performance and power goals and do it well on all platforms. A generic scheduler doesn’t have to control and drive low-power state decisions on a platform. However, the goal of power-efficient scheduler is to set higher level abstracted policies that would work on all platforms. After a long and productive discussion, there is a consensus and here is the summary:
  • A new kernel configuration option CONFIG_SCHED_POWER to enable/disable the power scheduler feature. Power scheduler is totally inactive, when CONFIG_SCHED_POWER is disabled, and fully active when CONFIG_SCHED_POWER is enabled. The important goal is evolving the power scheduler feature without disrupting and destabilizing the current scheduler.
  • Work on a generic power scheduler with hardware and platform abstractions that will work well on big little ARM, x86, and other platforms. Avoid platform specific power policies that could lead to duplication of functionality in platform specific power drivers.

Please check the Linux Foundation site for presentations made at the Linux Collaboration Summit back in April 2013 on this topic. Here is the link to Jonathan Corbet’s blog on this topic.
http://www.linux.com/news/featured-blogs/200-libby-clark/715486-boosting…

From: big.LITTLE Software Update [by George Grey on Linaro Blog, July 10, 2013]

There are also two software models now available, that ARM and Linaro have developed to enable control of workloads, performance, and power management on big.LITTLE SoCs.

The first is the IKS [In Kernel Switcher, also known as CPU Migration]software, developed by Linaro, that treats each pair of Cortex-A7 and Cortex-A15 cores as a single ‘virtual’ core. On a multicore SoC each pair is treated as 1 of n virtual symmetric cores by the Linux kernel.

Core Software Configuration for IKS (4+4)

image

Using existing mechanisms in the Linux kernel for each pair the cpufreq driver controls whether the Cortex-A7 is active (for low power) or the Cortex-A15 is active (for maximum performance). Overall maximum performance and throughput on a 4+4 core SoC is from 4 Cortex-A15s. The key attribute of IKS is that it relies on existing well-understood mechanisms in the Linux kernel and it is easy to implement, test and characterize in a production environment.

The second is the Global Task Scheduling (GTS) [also known as big.LITTLE MP or Heterogeneous Multi-Processing (HMP)] software developed (and now named) by ARM. This is known in Linaro as big.LITTLE MP. Using GTS all of the big and LITTLE cores are available to the Linux kernel for scheduling tasks. We are very proud that Linaro has contributed to ARM’s development of the GTS software, and that it is now publicly available in Linaro builds. ARM and Linaro recommend GTS for new products, and Linaro members are actively planning product deployments using this solution.

Core Software Configuration for GTS (4+4)

image

The big.LITTLE MP patch set creates a list of Cortex-A15 and Cortex-A7 cores that is used to pick the target core for a particular task. Then, using runnable load average statistics, the Linux scheduler is modified to track the average load of each task, and to migrate tasks to the best core. High intensity tasks are migrated to the Cortex-A15 core(s) and are also marked as high intensity tasks for more efficient future allocations. Low intensity tasks remain resident on the Cortex-A7 core(s).

IKS and GTS are now publicly available in Linaro monthly engineering releases for the ARM TC2 Versatile Express hardware, and in Linaro’s interim Long Term Supported Kernel (LSK) build. Both will also be incorporated into the first full Linaro LSK, which will be based on the next Linux Foundation, Greg Kroah-Hartman designated, Long Term Supported (LTS) kernel.

Until GTS functionality is fully upstream, ARM is supporting the big.LITTLE MP patch set for its licensees, leveraging Linaro’s public monthly and Linaro LSK builds, so that it is available to all ARM licensees for product integration and deployment. Linaro also expect to provide a topic branch for the latest work available on the upstream GTS implementation for interested developers.

ARM and Linaro now recommend product development and deployment to be based on the GTS solution. However, there are some cases where hardware limitations or a requirement for the traditional Linux scheduler (for example in some embedded applications) may lead to IKS still being required.

Future Work

Power management software in Linaro is worked on by the Power Management Working Group. Other activities within the Group will enable additional power savings on ARM multi-core devices. One current project worth highlighting is the work being done by Vincent Guittot on small-task packing. Normally the Linux kernel will spread running tasks over all the available CPU cores. On a handset in standby, or even when being used with low activity, there may be a number of housekeeping and other small tasks that run in the background or relatively infrequently and therefore keep cores active unnecessarily. If “small” tasks can be migrated to one core, then the other cores could be made idle or even turned off completely, potentially resulting in significant power savings. This feature is expected to offer improved power management to systems based on symmetric multi-core SoCs (for example dual or quad-core Cortex-A7 or Cortex-A15 parts), as well as big.LITTLE SoCs.

While the current big.LITTLE efforts are focused on Cortex-A15 and Cortex-A7, the techniques being implemented today for 32-bit systems are already being run on 64-bit models. We therefore expect to see the GTS software running on 64-bit Cortex-A57 and Cortex-A53 based big.LITTLE SoCs as soon as they become available.

Real Life Results

ARM has published further information on big.LITTLE configurations and performance in a blog entry here [Ten Things to Know About big.LITTLE [Brian Jeff on SoC Design blog of ARM, June 18, 2013]].

The first commercial products based on big.LITTLE are certain international versions of the latest Galaxy S4 phone from Linaro member, Samsung. Samsung-LSI provide an ‘Octa-core’ 4+4 big.LITTLE chip for this phone. As has been publicly noted, the current generation of hardware cannot yet take full advantage of the IKS or the GTS designs because the hardware power-saving core switching feature is implemented on a cluster basis rather than on a per-core or a per-pair basis. Even so, the first big.LITTLE implementation produces performance and power consumption on a par with the latest Qualcomm multi-core Snapdragon processor according to reviews from Engadget, PocketNow and others. Often first implementations of new technology never see the light of day – it is a tribute to Samsung’s engineers that the Exynos 5 is already seeing the Cortex-A15 level of performance with the power saving of the Cortex-A7s in a mass market handset in the very first big.LITTLE iteration.

We look forward to seeing what improvements full use of GTS will bring when used on future production devices from Samsung and others.

More information: Power Management with big.LITTLE: A technical overview [by Steven Willis in SoC blog of ARM, June 20, 2013]

Why all this sudden attention on the Linux Scheduler? [LCE13, Linaro Connect Europe]

12:00 PM – 13:00 PM on Monday, Jul 8, 2013 (IST)

Description

The Linux scheduler is getting a lot of attention in the ARM ecosystem these days. Come to this discussion to find out why.

Several people working on the scheduler or interested in changes to the scheduler will be invited to talk about their requirements, what is the state of their work, who will benefit from it, etc.

Video record of the Why all this sudden attention on the Linux Scheduler? dscussion

Minutes of the above discussion

Determinism: problems
———————
* Preemption: interrupts, locking
* Latency
* Scheduling overhead
* Realtime processing
Most of the requirements are coming from LEG/LNG.
Solutions:
    – PREEMPT_RT
    – Adaptive NO_HZ (merged in 3.10)
        Came out of high-performance computing. When there is just one
        task, the scheduler is switched off for that CPU. Results in
        zero scheduler overhead. When the only task finishes – the CPU
        will get into scheduling/idle again.
        There is still once-per-second tick for scheduling. There
        is a patch removing that last remaining bit to make it fully
        tickless.
        We’re not sure yet if all the possible limitations are found –
        there still might be some scheduler overhead left.
        If interrupt handling is offloaded to other cores, caching
        related issues will still affect performance (e.g. serving IO
        interrupts for the task on a different core will require the
        dedicated core to cache the date once again).
    – Deadline
Physical process isolation: none addresses
    – Needed for KVM.
Temporal isolation: all three (with some limitations)
No scheduling overhead: ADAPTIVE NO_HZ only.
Firm/Hard Real-time PREEMPT_RT only
Complexity:
    high for PREEMPT_RT
    low for the rest
Requirements:
all of the above
Power efficiency: history
————————-
* sched-mc (got removed)
* big.LITTLE MP patches implementing GTS (ARM)
* Packing Small Tasks (Linaro/ARM)
    Pack all small background tasks on as little number of small cores
    as possible to conserve power.
    Intel approach does not care about which core is selected as the
    best one (Turbo Mode is effectively converting the core into a BIG
    core, while all the other cores are becoming little ones). Task
    migration is expensive – this approach helps avoiding it.
* Power aware scheduling (Intel)
    Discussions were lasting for a while and then Ingo Molnar requested
    an integral solution (not a set of independent bits).
    He made a good point. What we have an SMP legacy implementation.
    Are we starting from scratch because of that?
    It is going to be a significal change. We need to re-think as it’s
    not SMP case anymore. b.L is not a new architecture – Intel already
    does that but differently.
    The task is to find the most efficient way of performing the work
    needed. The best place to make those decisions is the scheduler.
    Power officiency – proposal (from ARM)
    ————————————–
    Separate process and power scheduler (ARM). This is the first step
    to get to the fully integral scheduler in the future. Helps fighting
    with the complexity at hand. In this case there are certain
    limitations – one of the schedulers will be leading while the second
    one will be limited.
    That doesn’t work well for Intel CPUs (no pre-configured small/BIG
    cores).
    Issues:
    – Topology
        Missing:
        – Frequency domains, which CPUs are affected. That would be
          useful for the scheduler.
    – Idle + DVFS
        Missing:
        – information about the cost of using a certain core at certain
          DVFS operation point to perform a certain amount of work.
    – Thermal
        The idea is to keep an eye on the temperature trend to avoid
        cases when whole cores are needed to be temporarily shut down to
        cool them down.
        GPU contribution into the thermal budget should also be
        considered
.
    Trying to control DVFS from the scheduler. Patches are expected very
    soon
.
Q: How much of the improvements are we looking for (power wise)?
A: Something that will get upstream. 😀

Linux 3.10 [by Linus Torvalds on Linux kernel mailing list, June 30, 2013]
Linux kernel 3.10 arrives with ARM big.LITTLE support [Engadget, July 1, 2013]

Thanks to Linus Torvalds’ figurative stroke of the pen, the Linux kernel 3.10 is now final — paving the way for its inclusion in a bevy of Linux distributions, and even offshoots such as Android and Chrome OS. The fresh kernel brings a good number of changes, such as timerless multitasking, a new caching implementation and support for the ARM big.LITTLE architecture. In simplistic terms, the new multitasking method should help improve performance and latency by firing the system timer only once per second — rather than 1,000 times — when tasks are running. Meanwhile, users with both traditional hard drives and SSDs will find performance benefits from bcache, which brings writeback caching and a filesystem agnostic approach to leveraging the SSD for caching operations. Also of significance, Linux kernel 3.10 enhances ARM supportby including the big.LITTLE architecture, which combines multiple cores of different types — commonly the Cortex-A7 and Cortex-A15 — that focus on either power savings or performance. The full list of improvements is rather lengthy, but if you feel like nerding out with the changelog, just grab a caffeinated beverage and get to it.

Linaro 13.06 Released! [by Amber Graner on Linaro Blog, June 27, 2013]

The Linaro 13.06 release is now available for download!

It’s been a very active cycle for the Builds and Baselines team, reporting that the Continuous Integration (CI) loop for the Linaro Stable Kernel (LSK) Android proof of concept which is based on 3.9.6 kernel version was set up and includes the big.LITTLE IKS and MP patches (also called beta patchset). Support for Kernel CI loop with Android filesystem was added to android-build and CI loop was set up to track the ARM Landing Team (LT) integration tree. The HiSilicon member build with complete CI loop was set up and now tracks the LT kernel tree.

H2CY13: Upcoming next-gen Nexus 7, the ASUS MeMO Pad HD 7 “re-incarnation” at reduced by $50 price, dual/quad-core mid-range tablets from white-box vendors starting from $65

(while entry level will start from $40) … with that there would be tremendous pressure on low-volume tablet supliers (branded or white-box alike), as well as Samsung and Apple. Meanwhile China strengthens its position as the world leading PC Market.

Complementary post reminder:
Eight-core MT6592 for superphones and big.LITTLE MT8135 for tablets implemented in 28nm HKMG are coming from MediaTek to further disrupt the operations of Qualcomm and Samsung [‘Experiencing the Cloud’, July 20, 2013] from which the following excerpts I will include here as the ones directly related to the content given here as well:

At the end of July the launch of a tablet chip is expected: the MT8135, with 2xA15 +2xA7, still using an Imagination GPU, and mainly targeting the high-end tablet market. If Google OS will be closed and converged that will have a huge impact on us.
We will use Windows as a second priority, while using Firefox [OS] and HTML5 as a secondary backup, by keeping track of them. Because we judge that the [Android] OS convergence from Google profitability point of view is very low, therefore our vote for these two emerging open OS’s is in the ‘not so urgent’ category, in addition to and outside of Android. The other focus is again on Windows Phone 8.  For the moment, however, WP8 hardware configuration requirements are still higher (mainly memory), power consumption – after optimizing the gap with Android – is not too large.
End of the complementary post reminder

Rumor: New Nexus 7 specs, features and launch details mentioned in chat with Asus rep [Android Authority, June 30, 2013]

AE: The Tablet should be released before the ending of Q2
C: when exactly is before Q2?
AE: That will be before the ending of July

AE: There has not been confirmed specification as yet, but here is some basics specification , that you can look at:

7 inch LED with 1980*1200 resolution
Qualcomm Snapdragon 600 Quad Core CPU / Snapdragon APQ8064 CPU
2GB of RAM
32GB internal storage
5Mpx rear camera and 1.2Mpx front camera
Android 4.3
4000mAh battery
Wifi a/b/g/n,Bluetooth 4.0 and NFC enabled
LTE / WCDMA / GSM support

This is not confirmed specifications but you can review it

vs. the first one: Nexus 7: Google wanted it in 4 months for $199/$245, ASUS delivered + Nexus Q (of Google’s own design and manufacturing) added for social streaming from Google Play to speakers and screen in home under Android device control [‘Experiencing the Cloud’, June 28, 2012] which already has an ASUS only “reincarnation:

Experience MeMO Pad HD 7 [asus YouTube channel, June 16, 2013]

The MeMO Pad HD 7 is a stylish and portable 7-inch value tablet with a [1.2GHz] quad-core [MediaTek MT8125] processor, stunning HD IPS panel. It has dual cameras and stereo speakers.

Some specs:

  • 7-inch HD [1280 x 800] tablet with a wide-view angle IPS display for stunning visuals
  • Rear 5MP and front 1.2MP dual cameras to capture the moments
  • Dual stereo speakers with Sonicmaster Technology for incredible sound effect.
  • Ultra light, weighs only 302g
  • Up to 10 hrs battery life to make it through your day

ASUS Announces MeMO Pad HD 7 and MeMO Pad FHD 10 Tablets [press release, June 3, 2013]

ASUS MeMO Pad HD 7 — the value tablet for mobile entertainment
ASUS MeMO Pad™ HD 7 has a quad-core processor and 1GB RAM for smooth and responsive performance with apps of all kinds. The 7-inch display has a 1280 x 800 native resolution for crisp text and images, and IPS technology for accurate, vibrant colors with 170-degree wide viewing angles. MeMO Pad™ HD 7 also features high-quality stereo speakers with enhanced sound, courtesy of ASUS SonicMaster audio technology.MeMO Pad™ HD 7 has a 1.2-megapixel front-facing HD camera that can capture 720p HD videos and models are also available with a rear 5-megapixel camera. Just 10.8mm thick and 302g, the feature-packed MeMO Pad™ HD 7 has a lithium polymer battery that lasts for up to 10 hours with 720p video playback. Models are available in four colors — black, white, pink and green.
MeMO Pad™ HD 7 has 16GB of storage and a MicroSD card slot, plus 16GB ASUS WebStorage free for one year. Together with the ASUS WebStorage Office, users can view, create, edit and share Microsoft Office documents online.
AVAILABILITY & PRICING
ASUS MeMO Pad™ HD 7 has an MSRP of US$129 for 8GB capacity and US$149 for 16GB [a “follow up” to the $199 Nexus 7 tablet developed jointly by Google and ASUS and announced a year ago], and will be available starting in July 2013.

Asustek and HP enter China tablet market with entry-level models [DIGITIMES, July 1, 2013]

Asustek Computer and Hewlett-Packard (HP) are both set to enter the China tablet market with new cheap tablet models: the Asustek 7-inch 8GB MeMO Pad HD 7, priced below CNY999 (US$163) and HP Slate 7, priced at CNY999 [$163], according to sources from channel retailers.

Asustek’s 8GB MeMO Pad HD 7 will be supplied to the China market exclusively and is expected to appear later in July.

Prior to Asustek and HP, Acer already offered its 7-inch Iconia B1-A71 tablet [1.2GHz dual-core MT8317T based] at CNY699 [$114], while Lenovo is pushing its A1000 for a price of CNY999 [$163].

Compared to first-tier vendors, most China-based white-box tablet players are offering their products at prices between CNY299-500[$49-81.5], giving them advantages in pricing, but first-tier vendors still outmatch white-box players in product quality, specifications and after-sales service, the sources said.

Currently this is the best 7” quad-core offering from purely mainland China technology:
7” quad-core Allwinner A31s based Onda tablets for $65 (v701s) and $81 with IPS (v711s) in China, while for $89 and $99 outside [‘USD 99 Allwinner’, June 22, 2013] for which here is the Onda V711s Quad Core A31s 7″ IPS Tablet PC In-depth Review [dealsprime YouTube channel, June 24, 2013]

Onda V711s 7-inch IPS screen Android 4.2.2 Tablet PC with quad core Allwinner A31 CPU review. We check out the pre-installed apps and do some web browsing. Check out full specs and where to buy here: http://dealsprime.com/onda-v711s-quad-core-android-4-1-1-tablet-pc-7-ips-1024-600-a31s-1-5ghz-8gb.html

With and 1280×800 resolution Onda V712 quad-core version is available from April 8, 2013. The current price for Onda V712 Quad Core RAM 2GB 7 Inch IPS Screen Android Tablet 16GB outside China is $139 (699 yuan, $114 inside). It has 0.3MP front and 2MP back camera (vs. 1.2MP front and 5MP rear on ASUS MeMO Pad HD 7), but its video capability is 4K.

Meanwhile the cheapest dual-core mid-range tablet from white-box vendors is the new ICOO D70PR03 for 399 yuan i.e $65. This is with 1.2GHz Allwinner A20 SoC and 1024×600 IPS screen.

China white-box tablet players seeing success in landing government procurement orders [DIGITIMES, July 1, 2013]

China-based white-box players are gaining the upper hand in the competition with first-tier brand vendors for tablet procurement orders from Asia Pacific governments due to their advantages in pricing, while improved product quality and stability also helped the white-box players to narrow their gap with first-tier players, according to sources from tablet players.

The government in Thailand recently released procurement orders for 1.6 million education-purpose tablets which were mostly taken by a China-based white-box player, and first-tier vendors are having trouble competing due to considerations about profitability, the sources noted.

The sources pointed out that the white-box maker landed orders for a total of 800,000 tablets from the Thailand government worth NT$1.57 billion (US$52.35 million), equivalent to a price of NT$1,900-2,000 [US$63-67] for each device.

However, even with such a low price, the sources believe the white-box maker is still profiting from the orders.

Currently, an entry-level 7-inch tablet from a China white-box player is priced at about US$50 and can go up to US$70-90 in the retail channel, giving them strong advantages in price competition.

Although first-tier brand vendors are also aggressively trying to enter the entry-level tablet market, white-box players are still expected to achieve shipments of 120 and 170 million units in 2013 and 2014, respectively.

Thailand school kids get tablet computers [Aljazeera via AussieNews1 YouTube channel, Aug 23, 2012]

It is only a matter of time before tablet computers replace text books in school classrooms.

Surprise auction winners [Bangkok Post, June 29, 2013]

Dark horses Shenzhen Yitoa Intelligent Control Co of China and Supreme Distribution (Thailand) won yesterday’s bidding for the second phase of the One Tablet per Child scheme to supply 1.22 million tablets, beating out Shenzhen Scope Scientific Development.
image
The Chinese firm clinched the bid for the first and second zones, while the Thai company won the contract for the third zone.
The Office of the Basic Education Commission (Obec) held an e-auction for the tablets yesterday seeking bidding winners to supply 1.63 million tablets.
Education Minister Phongthep Thepkanchana said Shenzhen Yitoa won a bid to supply 431,105 tablets for Prathom 1 students worth 842 million baht for the first zone in central and southern provinces.
The company offered a price of 1,953.12 baht [$63] per tablet, 28.2% lower than the median price set at 2,720 baht each.
According to earlier information: “The tablet will have government specifications of a seven-inch display with a camera resolution of 1024×600 pixels, a minimum 1.5-gigahertz dual-core processor unit, one gigabyte of RAM, eight gigabytes of storage memory, 3,600 milliampere hours of lithium polymer battery life, and continuous Wi-Fi internet access for at least three hours.
The Chinese firm also won the bid to supply 373,637 tablets for Prathom 1 students worth 786 million baht for the second zone in the northern and northeastern provinces.
The company offered 2,103.64 baht [$67.5] per unit, 22.7% below the median price.
Supreme Distribution, meanwhile, proposed the lowest price for tablets in the third zone, covering Mathayom 1 students in the central and southern provinces, at 2,908.24 baht [$93], down slightly from the median price of 2,920 baht.
The Thai computer assembly firm will supply 426,683 tablets worth 1.24 billion baht.
Obec postponed the bid for the fourth zone – covering some northern and northeastern provinces – to July, as Shenzhen Yitoa was the only bidder in the auction. The conditions require at least two bidders in competition.
Mr Phongthep said purchasing contracts are expected to be sealed in the week ahead. All winners are obliged to deliver their tablets within 90 days of signing contracts.
Panuwat Khantamoleekul, the managing director of Supreme Distribution, said the company could not offer a sharp rate cut since Mathayom 1 specifications are higher than those for Prathom 1.
He said his company will build its own factory in Thailand to assemble materials sourced from China.
It set up a local office here two decades ago and also won an earlier bid to supply tablets in Russia.

Shenzhen Yitoa Digital Appliance Co. Ltd [Global Sources, April 14, 2013]

Offering a Wide Range of Electronic Products
Shenzhen Yitoa Digital Appliance was founded in 2007, which is affiliated to Shenzhen Yitoa Intelligent Control Co., Ltd. We are a nationally known enterprise designing, developing, manufacturing and selling intelligent controllers of digital equipment. Our main products include e-book readers, MIDs, tablet PCs and other devices.
Releasing Three New Products Monthly
Every year, we invest $800,000 in our R&D department to innovate and renew users’ digital life. This gives our 100 experienced engineers the resources they need to add up to three new products a month. Simply send us your OEM/ODM requirements, and we’ll complete a sample for you in as fast as one week. Now our company cooperates with Aigo, Newsman, Skyworth and other national famous companies.
Recipient of International Certifications and Recognitions
With a 16,000-square-meter factory, 100 engineers, 1,600 workers and 25 assembly lines, our monthly capacity is over 1 million pieces. For your assurance, all of our products carry CE, CQC, CCC, UL and VED approvals, and are manufactured under ISO 9001:2000 and ISO 14001:2004 guidelines. Moreover, we have been recognized as a hi-tech enterprise in 2004, one of the top 100 Shenzhen Software Enterprises in 2005, and one of the top 20 Shenzhen Software Export Enterprises in 2006.

Leading Tablet PC Brands Reduce 2013 Targets [DisplaySearch blog, June 27, 2013]

We recently pointed out [Smaller Tablets to Get Even More Popular in the Second Half of 2013 [DisplaySearch blog, June 18, 2013]] that 2013 would be the year in which smaller tablet PC shipments (especially 7” and 8”) would surpass larger tablet PC shipments (such as 9.7” and 10.1”). Tablet PCs are starting to overlap with larger smart phones, as well as with ultra-slim notebook PCs. 

Our latest forecast for the tablet PC market in the Quarterly Mobile PC Shipment and Forecast Report is for 67% Y/Y growth – from 153.6M in 2012 to 256.5M in 2013. Within this growing market, the share held by the top 12 brands, including Apple, HP, Acer, Dell, Lenovo, ASUS, Samsung, Toshiba, Sony, Amazon, Google, and Microsoft, is falling because the whitebox market [iPad-sized Tablets No Longer Driving Panel Growth Momentum [DisplaySearch blog, June 27, 2013]], especially in China, is growing faster. We estimate that the top brands, which shipped a combined 104.2M units in 2012, have reduced their 2013 shipment plans from 172M forecast in April to 167M forecast in June.

Apple’s iPad series accounted for 67M units in 2012 and remains the market leader, but is also the leading example of this trend. We estimate that Apple originally planned to ship 88M iPads in 2013, has reduced its target to 74M, including 31M iPads and 43M iPad minis.

We estimate that Samsung’s total tablet PC and phablet business plan is nearly 50M units in 2013, a big jump from 15.6M in 2012. Samsung plans include 39.5M tablet PCs, and 10M Galaxy Mega series (5.8” and 6.3”; while Samsung defines these as phablets, we classify them as smart phones).

Other tablet PC brands expect to grow their business in 2013. Among them, Lenovo, Microsoft, HP, and Acer are the most aggressive. Lenovo has two product lines for its tablet PC – X86 and ARM series. In 2013, Lenovo is planning for 3M X86 and 8M ARM.

Tablet PCs and Touch Adoption Expected to Drive Mobile PC Shipments Through 2017, According to NPD DisplaySearch [press release, May 6, 2013]

SANTA CLARA, CALIF., May 6, 2013—The mobile PC market is expected to increase from 367.6 million units shipped in 2012 to 762.7 million globally by 2017, driven by touch-enabled form factors, according to the NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report. The majority of this shift will come as tablet PCs begin to replace notebook PCs this year as the dominant mobile PC form factor, and touch becomes a key feature in mobile PC adoption.   

“The mobile PC industry is undergoing significant change this year,” said Richard Shim, senior analyst with NPD DisplaySearch. “The rapid rise and establishment of white box tablet PCs (tablets made by small local brands, mainly in China) is putting pressure on traditional notebook PCs. These low-cost tablets are reaching further into emerging regions where notebook PC penetration rates have remained low, resulting in cannibalization by tablet PCs.”

Tablet PC shipments are forecast to increase 67% Y/Y to 256.5 million in 2013, and reach 579.4 million by 2017. White box tablet PCs accounted for one-third of tablet PC shipments in 2012 and will maintain at that level for the next several years.

Notebook PC shipments are expected to decline 10% over the next four years, from 203.3 million in 2013 to 183.3 million in 2017, but there will be pockets of growth. Shipments of notebooks with touch capabilities are expected to grow 48% Y/Y in 2014. In the notebook category, touch will be used mainly in ultra-slim PCs, which includes Intel-specified Ultrabooks, the MacBook Air, and other slim form factor notebooks. Ultra-slims, which are at the premium end of the notebook market, are forecast to account for two-thirds of touch-enabled notebooks in 2013. By 2017, they will be 80%. Intel’s recent mandate that third-generation Ultrabooks (using the company’s next generation Haswell processors) must include touch will also help adoption.

Figure 1: Global Mobile PC Shipments, 2012-2017

image

Source: NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report

New operating systems such as Windows 8 are unlikely to be a major driver of touch adoption. Rather, penetration of touch in notebook PCs will be driven by a reduction in cost and new form factors, such as hybrids, sliders, and convertibles.

“Thus far, Windows 8 has had a limited impact on driving touch adoption in notebook PCs, due to a lack of applications needing touch and the high cost of touch on notebook PCs,” added Shim. “Form factors aimed at differentiation from standard clamshell notebooks will help to drive consumer adoption of touch-enabled notebook PCs, starting in the second half of 2013.”

The NPD DisplaySearch Quarterly Mobile PC Shipment and Forecast Report covers the entire range of mobile PC products shipped worldwide and regionally. With analysis of global and regional brands, the Quarterly Mobile PC Shipment and Forecast Report provides an objective, expert view of the market with insight into historical shipments, revenues, forecasts, and more. For more information about the report, please contact Charles Camaroto at 1.888.436.7673 or 1.516.625.2452, e-mail contact@displaysearch.com or contact your regional NPD DisplaySearch office in China, Japan, Korea or Taiwan for more information.
About NPD DisplaySearch
NPD DisplaySearch, part of The NPD Group, provides global market research and consulting specializing in the display supply chain, including trend information, forecasts and analyses developed by a global team of experienced analysts with extensive industry knowledge. NPD DisplaySearch supply chain expertise complements sell-through information from The NPD Group, thereby providing a true end-to-end view of the display supply chain from materials and components to shipments of electronic devices with displays to sales of major consumer and commercial channels. For more information, visit us at http://www.displaysearch.com/. Read our blog at http://www.displaysearchblog.com/ and follow us on Twitter at @DisplaySearch.
About The NPD Group, Inc.
The NPD Group provides global information and advisory services to drive better business decisions. By combining unique data assets with unmatched industry expertise, we help our clients track their markets, understand consumers, and drive profitable growth. Sectors covered include automotive, beauty, consumer electronics, entertainment, fashion, food/foodservice, home, luxury, mobile, office supplies, sports, technology, toys, and video games. For more information, visithttp://www.npd.com/ and npdgroupblog.com. Follow us on Twitter: @npdtech and @npdgroup.

China [branded] smartphone vendors to foray into tablet segment [DIGITIMES, July 1, 2013]

China-based smartphone vendors, including Huawei, ZTE, Lenovo and Xiaomi Technology, all will step up their efforts to penetrate the tablet market, according to industry sources.

Huawei plans to launch a new 7-inch tablet in the third quarter of 2013, and together with a 10.1-inch model released in early 2013, Huawei is sourcing about two million flat panels from China-based Truly Opto-electronics currently, the sources indicated.

Meanwhile, Huawei also purchases a portion of displays used in its new tablets from Innolux. However, the Taiwan-based flat panel maker declined to comment on orders from individual clients.

Lenovo also unveiled its Windows 8-based tablet, the Lenovo Miix10, recently. The Lenovo Miix, which is expected to hit the market in the third quarter, is equipped with a 10.1-inch 1366 by 768 IPS display and is power by an Intel dual-core Atom processor.

Xiaomi reportedly will step into the tablet segment by unveiling its first tablet in mid-August, the sources revealed, adding that Xiaomi will utilize tablet chipset solutions from MediaTek.

White-box vendors expected to lower prices for entry-level 7-inch tablets to US$40 in 2H13 [DIGITIMES, June 7, 2013]

The market for 7-inch tablets is seeing intense competition and white-box vendors are expected to further reduce prices for entry-level models to US$40 in the second half of 2013, according to Taiwan-based supply chain sources.

Entry-level white-box tablets are expected to continue selling well in markets such as China, and supply chains are able to increasingly decrease pricing for entry-level components, said the sources.

Meanwhile, Digitimes Research predicts that 254 million tablets will be sold in 2013, up 63.9% on year.

China-based white-box 2013 tablet shipments likely below forecasts [DIGITIMES, June 14, 2013]

China-based white-box tablet vendors’ shipments in 2013 were originally forecast at 120 million units, but actual shipments may fall short due to strong competition from inexpensive models launched by brand vendors, according to supply chain sources.

In addition to brand vendors, the white-box tablet vendors also face increasing competition from entry-level large-size smartphones, the sources said, adding that smartphones sized 5.7- to 6-inch are posing some of the biggest challenges.

Pricing for both the inexpensive brand models and entry-level large-size smartphones are becoming more similar to white-box tablet vendors’ products and that trend is expected to continue, causing the shipments to be less than expected in 2013, the sources added.

Digitimes Research: China mobile AP market to expand in 2013 [press release, June 14, 2013]

The China mobile application processor (AP) market will expand over 60% in 2013 to 506 million units, with smartphone-use APs accounting for 77.4% of total shipments, Digitimes Research said in its new report.

The market for smartphone APs in China climbed to 241.5 million units in 2012, up significantly from 69 million in 2011, according to Digitimes Research. The number will increase to 391.7 million units in 2013.

Shipments of China-made smartphone APs are forecast to account for 34% of the global smartphone AP market in 2013, compared to 26% in 2012 and around 10% in 2011, Digitimes Research noted.

As for China-made tablet APs, the market will reach a size of 115.2 million units in 2013, compared with a mere 10.5 million units [in 2011], Digitimes Research indicated.

Dual-core processors will overtake single-core chips to become the mainstream spec for tablets produced by China’s brand and white-box companies in the second half of 2013, while the penetration of quad-core powered tablets will also expand substantially, Digitimes Research pointed out.

China-based mobile AP vendors will ship a combined 506 million units in 2013, while the global mobile AP market will come to a size of 958 million units, Digitimes Research projected.

image

Prices of smartphone and tablet solutions to drop 10-20% in 2H13 [DIGITIMES, June 18, 2013]

Prices of chipset solutions for smartphones and tablets are expected to decline 10-20% sequentially in the second half of 2013 due to competition between MediaTek and Qualcomm, according to industry sources.

Qualcomm is scheduled to host its annual QRD (Qualcomm reference design) forum in Shenzhen on June 20, which is expected to attract participants from China-based branded as well as white-box smartphone and tablet vendors, the sources noted.

While showcasing its new solutions for the second half of the year, the forum also aims to grab smartphone and tablet solution orders from MediaTek, which has been prevailing in China’s solution market using a variety of reference designs, said the sources.

Qualcomm said earlier that over 40 OEMs have launched more than 200 new smartphones and tablets in 14 countries recently, mounting increasing pressure on MediaTek, said the sources.

China-based solution vendors such as Spreadtrum Communications have also joined the price competion, driving the unit price of quad-core smartphone solutions to below US$10 in China recently, the sources revealed.

China market: White-box tablet makers approaching MediaTek for quad-core solutions [DIGITIMES, May 27, 2013]

China-based white-box tablet makers are reportedly approaching MediaTek for the purchase of the chipmaker’s integrated MT8125 and [the upcoming] 8135 [to be based on A15 + A7 “big.LITTLE” architecture] quad-core application processors for tablets, according to industry sources.

The move by the white-box tablet makers comes after branded tablet vendors in China and Taiwan have begun using the MT8125 and 8135 solutions for tablets targeting the US99-149 segment, the sources noted.

White-box tablet makers currently purchase quad-core solutions mainly from China-based IC vendors including Allwinner Technology and Rockchip Technology, while buying Wi-Fi and Bluetooth chips from Realtek Semiconductor and RDA Microelectronics.

The 28nm quad-core solutions from Allwinner and Rockchip are priced at US$4-5, or about 50% lower than the comparable quad-core chips offered by MediaTek, since the chips offered by Allwinner or Rochchip do not support voice communications, said the sources.

In order to compete effectively in China and other emerging markets and differentiate products, white-box tablet makers have been forced to adopt MediaTek’s quad-core solutions, commented the sources.

MediaTek Introduces New Quad-Core Application Processor for Fast-Growing Tablet Market [pres release, May 29, 2013] used in ASUS MeMO Pad HD 7 shown earlier

TAIWAN, Hsinchu – 29 May, 2013 – MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced the availability of the new quad-core application processor – MT8125 designed for the fast growing global tablet markets. The new tablet platform is an extension of the company’s highly successful quad-core portfolio, it integrates a power-efficient quad-core Cortex™- A7 CPU subsystem with speed up to 1.5GHz, PowerVR™ Series5XT Graphics that delivers compelling multimedia features and sophisticated user experiences.  To simplify product design and speed time-to-market, the MT8125 supports 3G HSPA+, 2G EDGE and Wi-Fi versions, all of which are pin-to-pin compatible, allowing device manufacturers to easily expand their portfolios with a full range of tablets by leveraging the existing or planned design requiring no additional rework.
Inheriting MediaTek’s technology breakthrough of quad-core SoC platform and high-end multimedia capabilities, the MT8125 incorporates premium multimedia features, supporting up to Full HD 1080p video playback and recording, 13MP camera with integrated ISP and Full HD (1920 x 1200) displays. The new tablet SoC also delivers ground breaking visual quality powered by the leading picture quality technologyMiraVisionTM, derived from MediaTek’s extensive experience in the Digital TV market.
The MT8125 includes full support for MediaTek’s leading 4-in-1 connectivity combo that converges Wi-Fi, Bluetooth 4.0, GPS and FM, bringing highly integrated, best-in-class wireless technologies and expanded functionality to high-performance multimedia tablets. The MT8125 also provides support for Wi-Fi certified Miracast™ which makes multimedia content sharing between devices easier.
“During the last two years, application processors used in tablets have taken a fast evolution from single-core 1GHz to quad cores, clocking over 1.5GHz. Competition will force chipset vendors to maintain pace – by implementing more advanced features while reducing the system cost by increasing the level of integration*,”said Gartner Research Director Roger Sheng.
“MediaTek’s team has worked closely with Lenovo to integrate their solutions into our design process, helping us accelerate the development and introduction of new, innovative tablets. In turn, this allows us to fulfill our commitment to delivering the outstanding user experience our customers demand. The tablet market is moving fast, and Lenovo aims to be at the forefront of tablet innovation. MediaTek helps us do that,” commented Wayne Chen, vice president and head of mobile business unit for Lenovo.
“We’re confident that our comprehensive reference designs will be the industry benchmark, particularly benefiting the mid-to-high-end tablet market. It is an innovative, cost-effective and definitely faster time-to-market solution.” said Joe Chen, GM of Home Entertainment Business Unit, MediaTek. “By taking advantage of our strengths in the multimedia field, mobile communications and multi-screen technologies, we offer a complete multi-core processor family for smartphones and tablets, enabling a significant difference in performance and power efficiency – all while ensuring seamless streaming performance across the array of devices when users are consuming entertainment and information. ”
The MediaTek quad core tablet SoC is now being widely adopted by MediaTek’s global customers including Lenovo IdeaTab S6000 series.

Lenovo S6000 10.1″ MediaTek MT8389 [Charbax YouTube channel, March 4, 2013]

Note:
1. According to LinuxGizmos.comIt appears, however that Lenovo’s 10-inch, quad-core S6000 Android tablet uses a scaled down, 1.2GHz version of the MT8125 called the MT8389. … The MT8389 also appears to have a lesser PowerVR SGX GPU, according to All-RSS.com. As a result, the Lenovo S6000 has more limited 1280 x 800-pixel resolution and a 5-megapixel camera.
2. Quad-core SoC competition in as per this:

image

MT8125 / 8389
Quad-Core Cortex-A7 1.5GHz + CPU Tablet Platform [May 29, 2013]

Overview
MT8125/8389 is an extension of MediaTek’s highly successful quad-core portfolio, it integrates a power-efficient quad-core Cortex™- A7 CPU subsystem with speed up to 1.5GHz, PowerVR™ Series5XT Graphics that delivers compelling multimedia features and sophisticated user experiences.
Features
High-end Multimedia Capabilities
•  Supporting up to Full HD 1080p video playback and recording, 13MP camera with integrated ISP and Full HD (1920 x 1200) displays
• Delivering ground breaking visual quality powered by the leading picture quality technology – MiraVisionTM, derived from MediaTek’s extensive experience in the Digital TV market.
Best-in-class Connectivity Technology
•    Including full support for MediaTek’s leading 4-in-1 connectivity combo that converges Wi-Fi, Bluetooth 4.0, GPS and FM, bringing highly integrated, best-in-class wireless technologies to tablets
•   Providing support for Wi-Fi certified Miracast™ which makes multimedia content sharing between devices easier
Supports 3G HSPA+, 2G EDGE and Wi-Fi
•   MT8125/ 8389 supports 3G HSPA+, 2G EDGE and Wi-Fi versions, all of which are pin-to-pin compatible, allowing device manufacturers to easily expand their portfolios with a full range of tablets by leveraging the existing or planned design requiring no additional rework.

MT8377
1 GHz Dual-Core Tablet Platform [May 29, 2013]

Overview
The MediaTek MT8377 features a dual 1GHz Cortex™-A9 application processor from ARM, a PowerVR™ Series5 SGX GPU from Imagination Technologies, MediaTek’s proven 3G/HSPA/Edge modem, and runs the Android 4.0 “Ice Cream Sandwich”. y integrating a dual-core application processor architecture widely deployed in the majority of today’s premium tablets, the MT8377 boosts application and browser performance by up to 40% compared to single-core platform.
Features
Richest Multimedia Features
•   Providing rich multimedia features including a 8MP camera and high-definition 1080p video playback
•   Supporting high-resolution displays of up to HD720 (1280×720) resolution
•   Integrating built-in stereo 3D panel support and DTV-grade display picture quality
Best-in-class Connectivity Technology
•    Including full support for MediaTek’s leading 4-in-1 connectivity combo that converges Wi-Fi, Bluetooth 4.0, GPS and FM

MediaTek allocating more resources for development of tablet solutions [DIGITIMES, June 10, 2013]

MediaTek is relocating its tablet solution unit from its wireless communications group to the home entertainment group, meaning that the Taiwan-based top IC design house is looking to put more of its hardware and software resources into developing chips for tablet applications, according to industry sources.

The move echoes company president Hseih Ching-chiang’s statement that MediaTek aims to roll out new chips for tablet applications on a quarterly basis in the next few years.

The emphasis on the development of chips for tablets indicates that MediaTek believes that tablets will become the next-generation killer application and that the global tablet market is likely to continue to grow robustly in the coming years, commented the sources.

Meanwhile, MediaTek has adopted a strategy to push sales of its tablet solutions to non-Apple branded vendors in China and Taiwan, which have been focusing on promoting mid-range tablets for the US$99-199 segment, the sources indicated.

Given the high price/performance ratio and reliability of MediaTek’s chipset solutions, more and more entry-level tablet vendors in China are likely to queue up for table solutions from MediaTek, said the sources.

MediaTek is expected to ship a total of 20 million chipsets for tablets in 2013, accounting for 15% of the global non-iPad tablet market, estimated the sources.

MediaTek 2Q13 performance beats guidance [DIGITIMES, July 5, 2013]

MediaTek has reported consolidated revenues of NT$9.77 billion (US$323.52 million) for June, down 10.6% sequentially but up 24.6% on year.

MediaTek’s second-quarter revenues totaled NT$33.28 billion [US$1.1B], increasing 38.8% sequentially and surpassing the company’s guidance of NT$30-31.6 billion set for the quarter.

For the first half of 2013, revenues amounted to NT$57.25 billion [US$1.9B], up 33% from a year earlier.

Digitimes Research: China mobile AP shipments rise in 2Q13 [press release, June 24, 2013]

The China mobile application processor (AP) market is forecast to reach a total of 114.5 million units in the second quarter of 2013, up 9.6% sequentially and 88.6% from the 60.7 million units shipped a year ago, Digitimes Research said in its new report. Smartphone-use APs continued to account for the majority of total shipments.

The market for smartphone APs in China will amount to 92.3 million units in the second quarter, representing a 16% increase compared to 79.6 million units in the first quarter, whereas that for tablet-use APs declined 10.8% on quarter to 22.2 million units, according to Digitimes Research.

The China mobile AP market, which consists of smartphone- and tablet-use APs, is set to total 219 million units in the first half of 2013, said Digitimes Research. The top-5 suppliersMediaTek, Qualcomm, Spreadtrum Communications, Allwinner Technology and Rockchip Electronics – contributed as high as 192 million units, or 87.7%, to the overall shipments, Digitimes Research indicated.

MediaTek has enjoyed robust growth in its SoC shipments for smartphones and tablets with shipments for the first half estimated at 84 million units, while Qualcomm‘s shipments to China’s mobile AP market are set to total about 42.7 million units, Digitimes Research predicted. Meanwhile, Spreadtrum with its low-price strategy is expected to ship 38 million units in the first half of 2013, Digitimes Research said.

Specializing in tablet-use SoCs, Allwinner and Rockchip will both report significant on-year growth in their shipments for the first half of 2013, Digitimes Research indicated. Allwinner‘s shipments will climb to 18 million chips in first-half 2013 from only 4.7 million units a year earlier, while Rockchip‘s shipments for the same period will reach 10 million chips compared with the 5.5 million units shipped in the first half of 2012.

image

Note: Out of 47.1 million units used in tablets for H1CY13 28 million came from Allwinner and Rockchip, which is almost 60%. 38% belongs to Allwinner, 21% to Rockchip.

Digitimes Research: TSMC expanding in China [press release, June 20, 2013]

Taiwan Semiconductor Manufacturing Company (TSMC) has significantly expanded its presence in China’s IC industry, as the foundry’s technology advantages and manufacturing capabilities help it ride the wave of smartphone and tablet growth in the local market, according to Digitimes Research.

TSMC has received a pull-in of orders from a number of China-based IC design houses, which specialize in mobile SoCs such as application processors and place a heavy emphasis on demand domestically. Their booming businesses have boosted TSMC’s sales coming from the China market, said Digitimes Research.

TSMC saw sales generated from the total orders placed by its China-based clients climbed to US$820 million in 2012 from US$510 million in 2011, an about 61% increase. Sales are set to rise further to top US$1.4 billion in 2013, Digitimes research forecast.

China-based Semiconductor Manufacturing International (SMIC) has also enjoyed growth in its sales coming from the local market, Digitimes Research indicated. Sales generated from orders placed by SMIC’s local China-based clients arrived at the highest quarterly level for a third consecutive quarter in the first quarter of 2013, Digitimes Research said.

In addition, Digitimes Research noted that China’s IC design sector has entered a new phase of development. The number of China-based IC design companies exceeded 500 in 2012 with their combined output value ranked third worldwide.

IHS Boosts Tablet Panel Shipment Forecast as White-Box Products Storm the Market [press release, July 2, 2013]

EL SEGUNDO, Calif.(July 2, 2013)—Boosted by orders from unbranded, white-box Chinese manufacturers, global demand for tablet panels is exceeding expectations, spurring IHS to increase its forecast for displays by 6 percent for 2013.

A total of 262 million displays for tablets are forecast to be shipped in 2013, compared to the previous forecast of 246 million, according to the May Edition of the “LCD Industry Tracker—Tablet” report from information and analytics provider IHS (NYSE: IHS). This will represent 69 percent growth from 155 million in 2012, as presented in figure 1 attached.

image

“Competitive dynamics in the tablet market have changed dramatically this year as Chinese white-box smartphone makers have entered the tablet market in droves,” said Ricky Park, senior manager for large-area displays at IHS. “These companies are producing massive quantities of low-end tablets that appeal to consumers in China and other developing economies. Because of this, the white-box manufacturers are driving up demand for tablet panels, particularly smaller displays using the older twisted nematic (TN) technology, rather than the newer screens using in-plane switching (IPS).”

Unbranded tablet makers purchased 40 percent of all tablet panels in April, up from just 17 percent in the first quarter of 2012, as presented in figure 2 attached.

image

Partly because of the rise of white-box makers, shipments of smaller 8- and 9-inch tablet displays will rise by nearly 200 percent in 2013. In contrast, larger displays in the 9-, 10- and 11-inch range will suffer a 5 percent decline.

The boom in white-box tablets is being driven the introduction of turnkey designs offered by processor makers. The designs make it easy for new, inexperienced market entrants to offer tablet products.

The Chinese white-box manufacturers hold certain advantages over the major incumbent tablet manufacturers. The white-box manufacturers are able to produce tablets at lower cost, more quickly and with greater flexibility in production. These companies also have the capability to manufacture both unbranded tablets, and make products for the major brands on a contract manufacturing basis.

Such white-box players also have been agile enough to take advantage of the current high availability and low-cost of tablet panels. Makers of displays for the shrinking PC market have switched over to the tablet market, spurring a glut that has depressed pricing. As prices have fallen, the white-box makers have demonstrated enough flexibility to boost production of low-cost tablets.

“Playing to their strengths, the white-box manufacturers are set to continue to increase their presence in tablets and propel the expansion of the overall tablet market,” Park said.

IHS believes the strong growth of tablet panel demand continued in the second quarter. The arrival of more turnkey tablet design solutions will drive up demand for 7- and 8-inch panels throughout the year.

The 8-inch panels are becoming an increasingly large segment of the tablet market, with a display area more appealing to users than the 7-inch size. In all, the 8-inch panels accounted for 11 percent of panel shipments in April, with Samsung and Acer having recently launched new tablets in that size. With more introductions likely coming in the third quarter, IHS expects a substantial market share for the 8-inch by the end of this year.

The market for larger-sized, 10-inch and bigger tablet panels may begin to enjoy a recovery in shipments with the launch of the new Intel Corp. Atom microprocessor, code-named Bay Trail. This new device could help reduce the cost of x86 microprocessor-based tablets and improve battery life. Bay Trail also could generate opportunities for hybrid-form tablets that include keyboards.

The x86 tablets, with Microsoft Corp.’s new Windows 8 operating system, would have functionality better suited to the needs of the commercial and business worlds than either the Google Android- or the Apple  iOS-based tablets, which are designed with the consumer in mind.

About IHS (www.ihs.com)

IHS (NYSE: IHS) is the leading source of information, insight and analytics in critical areas that shape today’s business landscape. Businesses and governments in more than 165 countries around the globe rely on the comprehensive content, expert independent analysis and flexible delivery methods of IHS to make high-impact decisions and develop strategies with speed and confidence. IHS has been in business since 1959 and became a publicly traded company on the New York Stock Exchange in 2005. Headquartered in Englewood, Colorado, USA, IHS is committed to sustainable, profitable growth and employs 6,700 people in 31 countries around the world.

Flexible Display Market to Reach Nearly 800 Million Unit Shipments by 2020 [IHS press release, June 5, 2013]

EL SEGUNDO, Calif. (June 5, 2013)—Demand for flexible displays is set to undergo massive growth during the next seven years, with a broad variety of applications—ranging from smartphones to giant screens mounted on buildings—driving a nearly 250 times expansion in shipments from 2013 through 2020.

Global shipments of flexible displays are projected to soar to 792 million units in 2020, up from 3.2 million in 2013, according to a new IHS report entitled “Flexible Display Technology and Market Forecast” . Market revenue will rise to $41.3 billion, up from just $100,000 during the same period, as presented in the attached figure.

image

“Flexible displays hold enormous potential, creating whole new classes of products and enabling exciting new applications that were impractical or impossible before,” said Vinita Jakhanwal, director for mobile and emerging displays and technology at IHS. “From smartphones with displays that curve around the sides, to smart watches with wraparound screens, to tablets and PCs with roll-out displays, to giant video advertisements on curved building walls, the potential uses for flexible displays will be limited only by the imagination of designers.” 

Generation flex

IHS classifies flexible displays into four generations of technology. The first generation is the durable display panels that are now entering the market. These panels employ a flexible substrate to attain superior thinness and unbreakable ruggedness. However, these displays are flat and cannot be bent or rolled.

Second-generation flexible displays are bendable and conformable, and can be molded to curved surfaces, maximizing space on small form-factor products like smartphones.

The third generation consists of truly flexible and rollable displays that can be manipulated by end users. These displays will enable a new generation of devices that save space and blur the lines separating traditional product categories, such as smartphones and media tablets.

The fourth generation consists of disposable displays that cost so little that they can serve as a replacement for paper.

Starting small

With their thin, light and unbreakable nature, flexible displays initially are expected to be used in smaller-sized products, such as mobile phones and MP3 players. However, once large-size displays are available, flexible technology will be used in bigger screen-size platforms, such as laptops, monitors and televisions.

The largest application for flexible displays during the next several years will be personal electronic devices. This segment will be led by smartphones, with shipments climbing to 351 million units by 2020, up from less than 2 million this year.

Flexible stars at SID

Flexible displays were a major topic at the Society for Information Display (SID) Display Week event in Vancouver in May.

During an SID keynote address, Kinam Kim, president and CEO of Samsung Display Co., discussed his company’s flexible organic light-emitting diode (OLED) display technology. Kim said that the technology will be suitable for wearable electronics devices like Google Glass.

Also at SID, LG Display showed a 5-inch OLED panel constructed out of plastic that was both flexible and unbreakable.

Furthermore, Corning at SID showed its Willow Glass, which can be used as with both OLEDs and liquid-crystal displays (LCD) in mobile devices such as smart phones, tablets and notebook PCs. Because of its thinness, strength and flexibility, Willow Glass could enable future displays to be wrapped around a device or a structure.

IHS predicts OLEDs will be the leading flexible display technology during every year for the foreseeable future, accounting for 64 percent of shipments in 2020.

How Intel Can Enable a Successful $200 PC in the Age of the Media Tablet [IHS press release, May 20, 2013]

Vancouver, British Columbia (May 20, 2013)—Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?

The astounding answer seems yes—if microprocessor Intel Corp. is willing to cut the price of its semiconductor components to PC makers, according to a PC Dynamics Market Brief from information and analytics provider IHS (NYSE: IHS).

Speaking at the IHS/SID 2013 Business Conference, held May 20 in Vancouver, Canada, Zane Ball, Intel vice president and general manager, Global Ecosystem Development, is presenting his company’s plan to empower the PC industry to produce low-cost notebooks incorporating touch technology. Craig Stice, senior principal analyst for compute platforms at IHS, believes Intel has a shot at success.

“A price point that low seems far-fetched considering the mobile PC prices of today, with Ultrabooks and other ultrathins going as high as $1,000 or more,” Stice said. “However, the small laptops known as netbooks saw their prices reach down into the $200 range at the height of their popularity a few years ago, and a cost analysis of netbooks shows how such a low level of pricing can be used to support a no-frills type of ultrathin PC.”

The cost estimate for a standard netbook, based on the IHS Compute Systems Cost Analyzer that calculates the major components of a netbook on a third-quarter 2013 timeline, comes out to $207.82, as shown in the attached table.

image

“Hitting this kind of price point is not impossible for the PC industry, already a cutthroat market accustomed to razor-thin margins,” Stice said. “Such a possibility was stated by outgoing Intel CEO Paul Otellini, who during Intel’s first-quarter earnings call in April made the bold prediction that touch-enabled, ultrathin Intel-based notebooks using non-core processors could be available by the end of this year.”

Intel holds the cards

The key factor that could make this happen is Intel, which can control up to 33 percent of the total bill-of-materials cost for the PC through the central processing unit (CPU) and motherboard. If Intel decides to provide a price break for just these components, PC original equipment manufacturers could see their margins improve, allowing them to drive down prices for the retail market. With PC competition so fierce, it takes only one PC manufacturer to find a price point that sells—and others are bound to follow suit shortly afterward.

Intel could also be instrumental in introducing an even more powerful ultrathin-type mobile PC than netbooks, which have now been overtaken by media tablets and are on their way out of the market altogether.

Intel’s next-generation Atom processor, called Bay Trail, has the potential to deliver a performance boost that will clearly separate the traditional netbooks of old from the new generation of mobile and ultrathin PCs.

Avoiding netbooks’ fate

While netbooks had limited computing power and were regarded more as devices for content consumption, the new and much more economical ultathins, in contrast, would possess considerably more power and be categorized as content-creation devices. Such a perceptible enhancement could increase their chances of survival in the marketplace, unlike the short-lived netbooks.

Much depends on Bay Trail, which Intel says will move from two processing cores to four to provide beefed-up performance. Along with Bay Trail, Intel’s own high-definition embedded graphics and an extended battery life for improved power will yield a processor bearing similar performance to the chipmaker’s renowned family of Core processors. All these traits could be part of the new, less expensive ultrathin being projected.

What PC manufacturers also must do

What these developments portend for the PC industry is significant. If the PC industry is able to get down to the $200 price point, and Intel’s Bay Trail processor delivers what it claims to do, then the PC market will have its much-needed shot in the arm. Such a turn of events could then spark the mobile PC market, which has been losing steam to flashier rivals like smartphones and tablets.

Besides Intel’s willingness to cut its own price point to make chips available at a lower cost to customers, a second important factor involves the PC makers themselves. For their part, PC manufacturers also need to find a way of getting to the magic price point of $200—and possibly sacrifice even more margin in exchange for the greater amount of volume that they seek.

All told, the scenario above—merely hypothetical at this point—is not entirely out of reach. A strong second half is already being forecast for PCs this year: add in the potential for lower-priced next-generation ultrathin systems, and the PC industry may finally have a valid competitor to lower-priced media tablets.

China Becomes World’s Leading PC Market in 2012 [IHS press release, April 29, 2013]

EL SEGUNDO, Calif. (April 29, 2013)—China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS (NYSE: IHS).

PC shipments in 2012 to China amounted to 69 million units, exceeding the 66 million total reached by the United States. Only a year earlier in 2011, the United States was the leading global destination for PCs.

Beyond its large size, China’s PC market exhibits distinct characteristics that set it apart from the computer trade elsewhere, possessing a vast untapped rural market and unique consumer-purchasing patterns. While desktop PC shipments lagged notebooks around the world, the two PC segments were on par in China in 2012, with an even 50-50 split, as shown in the attached table.

image

“The equal share of shipments for desktops and notebooks in China is unusual, since consumers in most regions today tend to prefer more agile mobile PCs, rather than the bulky, stationary desktops,” said Peter Lin, senior analyst for compute platforms at IHS. “The relatively large percentage of desktop PC shipments in China is due to huge demand in the country’s rural areas, which account for a major segment of the country’s 1.34 billion citizens. These consumers tend to prefer the desktop form factor.”

The market will change gradually as desktop PCs face rising competition from the high value proposition presented by notebooks. Notebooks will then surpass desktops in the country by 2014, tracking more closely with the worldwide desktop-to-notebook PC ratio of 36 to 64 percent.

The desktop vs. notebook pattern of consumption in China is only one example of the distinctive hallmarks of the country’s dynamic PC market. In another indicator, China also has approximately a 50-50 proportion in consumer vs. commercial PCs, compared to the 65-35 percent ratio for the rest of the world.

A third pattern unique to the China PC market is the preferred notebook display size of 14 inches, which accounts for more than 70 percent of notebook PC shipments in the country. For the rest of the world, the 14-inch makes up less than 30 percent.

A fourth pattern of note is the attach rate of PCs with a pre-installed operating system, especially for notebooks. While mature PC markets in other parts of the world claim a 90 percent attach rate, the proportion for China comes out to lower than 50 percent, with the ratio even lower in the desktop PC market.

Despite such exclusive behavior, the China PC space shares one common trait with the worldwide PC market. Like the rest of the world, demand in China remains weak as consumers migrate to using mobile devices like cellphones. China’s PC market is projected to grow only by 3 to 4 percent this year.

Even so, a vast market opportunity continues to exist for PCs in the country, in the form of potential first-time buyers mostly residing in the countryside. The government already plans this year to invest some 40 trillion yuan—equivalent to some $6.4 trillion—to build rural infrastructure in the next 10 years, and PC original equipment manufacturers can take advantage of the initiative to build out and expand from the cities, IHS believes.

China is also on track to retain its position as the largest PC market in the world for the foreseeable future unchallenged and alone—further providing PC brands a rare opportunity for expansion, counter to the myriad travails they face in the rest of the world.

Spreadtrum is to be acquired by a Chinese high-tech investment enterprise owned by the state and also belonging to the leading Tsinghua University with microelectronics research interests

The top 10 SoC design enterprises of Mainland China had US$3.8B revenue in 2012. Out of that Spreadtrum had US$725.2M which is not less than 19%. On the ‘Experiencing the Cloud’ I’d reported extensively on the reasons:

It is also notable that this (together with MediaTek offerings) lead to Qualcomm’s SoC business future is questioned first time [May 1, 2013].

Update: TrendForce: Mediatek and Spreadtrum Advance in China Market while Qualcomm’s Chip Usage Declines [press release, June 27, 2013]

Mediatek has been making an impressive run lately; not only is the Taiwan-based chip manufacturer commanding its way in the mid-to-high end smartphone space, it has also successfully penetrated the 4G mobile market thanks to its recently announced 4G chip. According to the latest statistical data compiled by TrendForce, a global market research firm, Mediatek’s processors have been used by over 50% of China’s branded smartphones since the MT6575 chip was introduced in 2012. Due in large part to factors such as high pricing and the lack of hardware and software compatibility with various Chinese-made devices, Qualcomm’s chip usage rate has been gradually declining in China, and shrunk to as low as 33% in 2013. With Qualcomm and Mediatek both devoting their attention towards the mid to high end smartphone consumer segment, much of the low-end smartphone space has been left to Spreadtrum, which has recently unveiled a processor intended for low end hardware devices. In 2013, Spreadtrum’s chip usage rate in the Chinese market grew to approximately 11%.
imageFigure-1 2013 Smartphone processor market share in China’s smartphone market
Source: DRAMeXchange, June, 2013

Despite being an indisputable leader in the high end smartphone market, Qualcomm’s MSM8X30, MSM8X26, and MSM8X25Q processors are still facing a lot of stiff competition in the low-to-mid end mobile sectors. A way Qualcomm may reverse its struggles in China is by taking advantage of the country’s rapidly growing 4G/LTE developments. The company will have a good chance of emerging as a major LTE market leader should China’s 4G business opportunities appear early next year.  

Although Mediatek has generally been known to promote two new items on an annual basis, this year the Taiwan-based company has chosen to break away from tradition by announcing a total of four different products. The first –the MT6589– was announced during 1H13, and is intended for the mid-to-high end smartphone market; the remaining three products—all of which are smartphone chips—are expected to be introduced at some point during 2H13. Among the new processors, the duo core, Cortex A7-based MT6572 chip stood out as particularly noteworthy given its potential to exert a lot of impact on the low end smartphone market. The said chip is unique in that it supports China’s TD SCDMA system, is priced in a notably affordable range, and sports a good degree of compatibility with various low cost components (which could help push manufacturing costs down to as low as $US 40). All in all, this chip provides a perfect opportunity for Mediatek to compete against the low-end smartphone chips that are designed by Spreadtrum. The MT6575 is expected to become popular within the mid-to-low end smartphone market and should help Mediatek cement its position within the low end sector.
Following the release of the MT6589 chip, which is expected to open up new opportunities in the mid-to-low end market, Mediatek aims to introduce the quad core MT6580 and MT6582 in 2H13. MT6582 is considered a more affordable version of MT6589, and supports both qHD resolution and 8MP camera. These features are expected to help the company redefine the boundaries of a mid-end smartphone as well as increase its overall consumer appeal. The MT6580, on the other hand, is intended to be a viable alternative to a Qualcomm chip. Other than supporting 1.5Ghz speed, HD resolution, and 13MP camera, the chip is able to work with the kinds of high-quality hardware that are typically compatible with Qualcomm processors. According to TrendForce, if Mediatek is indeed successful in enhancing its presence in the high end market, a price war involving high-end processors is likely to ensue. Should this happen, both consumers and smartphone manufacturers will benefit, and the boundaries among high end smartphone devices will become less and less clear.    
With China’s recent plans to expand the TD-LTE coverage for its 500 million users by 2020, and with the 4G industry growing at a tremendously rapid pace, the LTE ecosystem in China is set to become more and more mature in the foreseeable future. Qualcomm is very likely to benefit from such a trend given its priority on the 4G/LTE business. Following the high end chip pricing war, the 4G/LTE market will likely become next battlefield for chip makers.

End of the update

Tsinghua University investment arm makes buyout offer for Spreadtrum [Asian Venture Capital Journal, June 24, 2013]

Spreadtrum [展讯] Communications [处在], a Chinese mobile chip manufacturer backed by NEA, has received a [non-binding] buyout offer from a unit of Tsinghua Holdings, an investment entity controlled by Beijing-based Tsinghua University. The offer values Spreadtrum at $1.35 billion.

According to a regulatory filing, Tsinghua Unigroup will pay $28.50 in cash for all outstanding American Depository Shares – a 20% premium on the stock’s previous closing price. Spreadtrum’s stock jumped more than 16% in response to the announcement, closing Friday at $25.91.

As of year-end 2012, NEA owned 10.4% of the company, having initially participated in the $19.8 million Series B round in 2002. Spreadtrum went public on NASDAQ in 2007, raising $124.6 million. Silver Lake bought a 13% stake for $40 million in 2010 but exited the following year.

In 2011, Spreadtrum also came under fire from short-seller research firm Muddy Waters over alleged accounting discrepancies. The company denied any wrongdoing.

“We believe that an Acquisition by Tsinghua Unigroup [紫光集团有限公司], which is majority-owned by Tsinghua University, a central player in China’s technology and R&D sectors, would provide compelling strategic synergies and position the company for additional value creation in key wireless communications markets in China and elsewhere going forward,” Unigroup CEO Weiguo Zhao said in a letter to shareholders.

Tsinghua Holdings has committed to guarantee full equity or debt funding up to the total purchase price of $1.5 billion.

Spreadtrum was founded in 2001 and develops mobile chipset platforms for 2G, 3G and 4G wireless communication standards. Customers include handset manufacturers selling into China and other emerging markets. The company posted a net income of $92.4 million for 2012, down from $134 million the previous year, although revenues jumped 7.6% to $725.2 million.

Tsinghua Holdings is a state-owned company responsible for managing the majority of Tsinghua University’s commercial assets. As of year-end 2012, Tsinghua Holdings had approximately RMB70.4 billion ($11.5 billion) in assets and a net income of RMB1.45 billion. Unigroup focuses on high-tech, biotech, real estate and urban infrastructure investments.

Tsinghua Science Park Venture Capital, which also ultimately falls under the control of Tsinghua Holdings, participated in Spreadtrum’s Series A and B rounds.

Note that this shows the strong determination by the Chineses State because:
我国大陆IC产业发展面临三大障碍 Mainland China IC industry is facing three major obstacles [Hexun.com, June 22, 2013] as translated by Google and Bing with manual edits

Summary:

What are the essential elements in the development of the IC industry or power? The industry generally believes that strong government support, pragmatic policies and systems, building good infrastructure and abundant human resources, are the key elements how the IC industry in developing countries and regions may come from behind.

The operating efficiency of the Innovation Alliance, of the official mechanisms for collaboration, research, and industry R&D is not high, which is one of the significant factors restricting the rapid development of mainland China’s IC industry.

Mainland China’s IC industry in recent years gained rapid development, and some of the advantages of the competitiveness of enterprises began to appear. Taking the fastest-growing design industry as an example, in 2011 the overall IC design industry sales continued to maintain a high growth rate, reaching 47.374 billion yuan [US$7.7B], an increase of 30.2% year on year. In 2012, total sales for the top 10 design enterprises in China reached 23.117 billion yuan [US$3.8B], an increase of 2.97 billion yuan [US$484M] over the previous year. 10 companies accounted for 33.97% of total industry sales, 2.21% increase over the 31.76% in the previous year. First business sales reached $ 1.183 billion.

Spreadtrum Communications [展讯通信], RDA [锐迪科], HiSilicon [海思], Zhuhai Allwinner [珠海全志] and so on, i.e. the SoC enterprises have made great achievements in the field. But compared with Taiwanese and Korean enterprises there is still relatively slow development, the products are low-tech, and the competitiveness of the enterprises is weak. Price is also the company’s main business strategy, “design” is still not a mainstream, the situation of slow building of the base capability had not improved. Industry-wide sales may also be less than the sum of the sales of the world’s top-ranked design firms.

Note that out of the US$3.8B revenue of the top 10 design enterprises in 2012 Spreadtrum had US$725.2M which is not less than 19%. This data alone shows how important is the Spreadtrum acquisition in order to speed up the further development of the IC industry by putting the company together with the Tsinghua University which has a Research Institute of Circuits And Systems as well as an Institute of Microelectronics (IMETU), see here and here:

IMETU, the Institute of Microelectronics of Tsinghua University, was founded in 1980 on the basis of the Semiconductor Research Division, which was a research division of the Department of Electronic Engineering established in 1957. The mission of IMETU is to educate top level professionals and deliver scientific innovations in the domain Micro/Nano-electronics. During the past 30 years, IMETU has made significant contributions and key achievements for the development of China’s semiconductor and integrated circuit industry. Its faculty members and students won 8 national awards, more than 20 province or ministry level awards, as well as 136 granted patents. The institute consists of four divisions, Solid-State Devices and Integration Technologies, IC & System Design, Micro/Nano Devices and Systems, and CAD Technology. Up until March 2012, IMETU has 94 faculty and staff members, among which there are 14 professors and 46 associate professors. After 30 years of development, IMETU has been China’s leading research and education base in the area of Micro/Nano electronics. It has established a high-quality research infrastructure for microelectronics comprising of two major research directions, Micro/Nano electronics and IC & System Design. Meanwhile, alumni of IMETU have become the backbone of China microelectronic industry.

which is also the premier university partner of The Institute of Microelectronics of Chinese Academy of Sciences.

Major shareholders of Spreadtrum (with more than 5%): source Annual Reports

 
March 15, 2008
March 15, 2009
March 31, 2010
Feb 28, 2011
Feb 29, 2012
Feb 28, 2013
Scott Sandell [also includes New Enterprise Associates 11, Limited Partnership shares]
15.42%
15.71%
14.92%
14.4%
10.9%
10.4%
Entities affiliated with New Enterprise Associates 11, Limited Partnership
15.36%
15.61%
14.76%
14.2%
10.7%
10.1%
Entities affiliated with Fortune Venture Investment Group
6.31%
6.29%
       
Entities affiliated with Pacific Venture Partners
5.21%
5.30%
       
Entities affiliated with Silver Lake Partners
   
12.47%
5.8%
   
The Bank of New York Mellon Corporation
   
5.45%
 
5.2%
 
FMR LLC and Edward C. Johnson 3d
     
5.3%
   
FMR LLC
         
9.9%
Waddell & Reed Group
         
5.3%

image
source: Yahoo! Finance SPRD Major Holders

Tsinghua Unigroup Announces Offer to Buy Spreadtrum Communications [press release, June 21, 2013]

BEIJING–(Marketwired – Jun 21, 2013) – Tsinghua Unigroup Ltd. (“Unigroup”) today confirmed that it has made a non-binding offer to acquire Spreadtrum Communications, Inc. (NASDAQ: SPRD) (“Spreadtrum” or the “Company”) for $28.50 in cash per American Depositary Share (the “Transaction”). Spreadtrum is a leading fabless semiconductor provider in China with advanced technology in 2G, 3G and 4G wireless communications standards. The offer represents a premium of 20.1% over the closing price of the Company’s shares on June 19, 2013, the day preceding the delivery of the offer and 44.3% over the volume weighted closing price of the Company’s shares for the 30 trading days preceding the delivery of the offer.

Unigroup is an operating subsidiary of Tsinghua Holdings Co. Ltd., a solely state-owned limited liability corporation funded by Tsinghua University, one of the most prestigious universities in the world. Tsinghua Holdings owns and manages a substantial majority of the commercial assets of Tsinghua University. As of December 31st, 2012, Tsinghua Holdings had total assets of approximately 70.4 billion RMB [$11.45B], EBITDA of approximately 4.07 billion RMB, and net income of approximately 1.45 billion RMB for fiscal year 2012. Tsinghua Holdings’ corporate credit rating is AA+ according to CCXI, the Chinese domestic JV partner of Moody’s and the leading credit rating agency in China. Additional information about Tsinghua Holdings can be found at (http://www.thholding.com.cn/english/simpleindex.aspx). 

According to the preliminary non-binding proposal letter, Tsinghua Holdings has committed to guaranteeing the aggregate purchase price, which may be funded through a combination of equity and debt financing. 

Unigroup is excited about the proposed acquisition of Spreadtrum and the strategic opportunity this Transaction provides given the strength of this leading China-based business. Mr. Zhao Weiguo, the Chairman and CEO of Unigroup, commented, “We are enthusiastic about Spreadtrum’s business and market position globally and here in China, and we see Spreadtrum as an excellent strategic fit with Unigroup’s overall commercial objectives. We look forward to working together on the details of our proposed acquisition.” 

Unigroup’s proposal is non-binding and is subject to, among other things, satisfactory due diligence with respect to Spreadtrum and the execution of acceptable definitive agreements. There can be no assurance that Spreadtrum will support the Transaction, that any definitive binding offer will be made by Unigroup with respect to the Transaction, that any agreement with respect to the Transaction will be executed, that any conditions, including with respect to regulatory approval, will be satisfied, or that this Transaction or any other transaction, on the proposed terms or on any other terms, will be approved or consummated. Unigroup does not undertake any obligation to provide any updates with respect to this Transaction or any other transaction, except as required under applicable law.

About Tsinghua Unigroup Ltd.

Tsinghua Unigroup Ltd. (“Unigroup”) is an operating subsidiary of Tsinghua Holdings Co. Ltd., a solely state-owned limited liability corporation funded by Tsinghua University in China. Tsinghua Holdings Co. Ltd. is the controlling shareholder of Unigroup. Unigroup’s business lines include high-technology, bio-technology, science park development, and urban infrastructure construction.

About Spreadtrum Communications, Inc.

Spreadtrum Communications, Inc. (NASDAQ: SPRD) (“Spreadtrum”) is a fabless semiconductor company that develops mobile chipset platforms for smartphones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards. Spreadtrum’s solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. Spreadtrum’s customers include global and China-based manufacturers developing mobile products for consumers in China and emerging markets around the world. For more information, visit www.Spreadtrum.com.

This press release does not constitute an offer to sell or the solicitation of an offer to subscribe for or buy any security, nor is it a solicitation of any vote or approval in any jurisdiction, nor shall there be any sale, issuance or transfer of the securities referred to in this press release in any jurisdiction in contravention of applicable law.

Note that with June 27, 2007 Spreadtrum IPO on Nasdaq the company had $125.9M initial market capitalization which a year later became $209.41M; the quarterly revenue at IPO time was US$38.6M:

image

image

Data is in US$

Spreadtrum Closes $35.2 Million Series C funding [press release, June 4, 2004]

Sunnyvale, California – June 4, 2004 – Spreadtrum Communications Inc., a leading fabless semiconductor company developing and marketing innovative digital wireless communications products, today announced the completion of $35.2 million Series C financing led by New Enterprise Associates (NEA) with additional participation from existing investors, Fortunetech Investment Fund, Pacific Venture Group, Vertex, Legend Capital, HuaHong International and more.

“Proceeds from this financing will be used primarily to expand operations and to develop new product offerings,” said Dr. Ping Wu, President of Spreadtrum. ‘Spreadtrum has gained customers acceptances in the GSM/GPRS markets and is now gaining traction in the 3G area. We are very pleased to be working with these experienced venture capital firms. With their industry knowledge and resources, we are confident we will expand our global reach.
“Spreadtrum has all the components we look for when making an investment,” said Scott Sandell, NEA general partner and Spreadtrum board member. “With its experienced management team and superior technology, Spreadtrum is poised to emerge as one of the world-class fabless semiconductor companies. They continue to demonstrate their ability to develop and market their products while gaining traction in this large, explosive market.”
Spreadtrum is currently shipping GSM/GPRS baseband chipset SC6600 families and GSM/GPRS module SM5100 families. The SC6600 is a highly integrated GSM/GPRS single baseband mixed signal chip containing all digital and analog functionality for a GSM/GPRS wireless phone. The SM5100 provides both voice and data functions, and can be used in GSM/GPRS tri-band cell phones, data modems and other mobile terminal devices. Reference designs for a complete GSM/GPRS handset terminal are available. Spreadtrum also has single and dual CPU solutions for various market demands. More information about Spreadtrum products is available via email at info@spreadtrum.com.

New Enterprise Associates Participates in $20 Million Series D for Spreadtrum Communications [Baltimore Citybizlist. Oct 31, 2006]

Spreadtrum Communications Inc., a Sunnyvale, Calif.-based maker of wireless chipsets, has secured $10 million of a $20 million Series D round, according to a regulatory filing. Return backers include Fortune Venture Group and New Enterprise Associates. The company has several offices in China. www.spreadtrum.com

About Spreadtrum
Spreadtrum Communications was founded in 2001 by a group of innovative entrepreneurs with determination to face any challenge in the future. Under Dr. Ping Wu’s leadership, Spreadtrum successfully set up offices in Silicon Valley and several different cities in China. It grew rapidly within the past a few years and became a raising star in the IC and wireless communications industry. Spreadtrum’s products became the choice of many Chinese and international clients. Spreadtrum focuses on the development and sales of the new generation wireless IC, provides fast-to-market, cost-effective and high-performance solutions for wireless terminal manufactures and design houses.
Our core competitive products are:
  • 2G/2.5G/3G baseband IC: High integration, high performance, great functionalities
  • Communication software: validity, stability, customizability
  • Wireless platform: differentiated value-added open platform, reduced development time, increased product competitive edge
  • Wireless module: Customizable, flexibility, high quality
Spreadtrum not only has complete wireless terminal core chip series and related software and platform solutions that cover from high-end to low-end handset markets, but also has successfully developed world’s first single TD-SCDMA/GSM/GPRS(3G/2.5G) dual mode baseband chip as well as world’s first single integrated multimedia GSM/GPRS baseband chip. By utilizing Spreadtrumer’ expertise and newest design methodology in the industry, Spreadtrum single chips solution possesses the characteristics of higher integration, smaller size, lower power consumption and higher performance and therefore greatly reduces system BOM cost. Spreadtrum is the first IC designs company to develop its own software protocols. Its open platform allows customers to customize their products in order to differentiate themselves among competitors. Spreadtrum provides its customers with warm-hearted support and fast response time to reduce their development cycle and shorten their time-to-market.

Spreadtrum Communications [InsideChips, 2006]

Based in Sunnyvale, Calif., with most of its engineering operations in China, Spreadtrum Communications is developing chips for China’s large and rapidly growing domestic cellular market. The company is developing single-chip solutions for GSM/GPRS and TD-SCDMA/GSM/GPRS mobile devices, and has integrated all of the analog, digital and power-management functions as well as a full set of multimedia features and interfaces into the chips.

Founded only five years ago, Spreadtrum has already grown to 450 employees. CEO Ping Wu and CTO Datong Chen founded Spreadtrum with Renyong Fan (VP of operations) and Jin Ji in July 2001. The company raised $6.5 million in Series A funding at the time of founding, followed by a $20 million Series B round in Nov. 2002 and a $35 million Series C round in April 2004. The company has more than 30 investors, with the largest including New Enterprise Associates (NEA), Fortunetech Investment Fund, Pacific Venture Group, Vertex, Legend Capital and HuaHong International.

Spreadtrum offers three chip products:
  • SC6600M GSM/GPRS baseband chip – In addition to baseband functionality, the 6600 also supports a number of functions typically implemented separately on different chips. These include support for a 1.3-megapixel digital camera with video recording and playback, 64-polyphonics with stereo sound, MP3 player, USB interface and USB removable memory. Analog I/F features include a wide-range RF interface and power management on chip.

    Spreadtrum began volume shipments of the SC6600 in June 2003, primarily to domestic handset makers including TCL, Ningbo Bird, Amoi Electronics, Hisense and Putian Capitel.

  • SC8800 Single-chip TD-SCDMA/GSM/GPRS dual-mode baseband chip – Powered by the CEVA-Teak DSP core, the SC8800 enables dual-mode 2G/3G phones that operate transparently over China’s TD-SCDMA and GSM networks. As with the SC6600, the chip integrates analog, digital and power management functions on a single chip.
  • SC6800 GSM/GPRS multimedia baseband IC – The SC6800 integrates an ARM9 processor and TeaKLite DSP, 5-megapixel camera controllers, auto-focus controllers, MPEG4 accelerator and MP3 player, and supports TV out and other multimedia application-processing functionalities.
Spreadtrum also offers a wireless module, the SM5100B, which incorporates the baseband chip, RF chipset, combo flash and software. Intended for applications such as wireless desktop phones, mobile phones, remote monitoring and remote meter reading, the module provides all the required functionality for full-featured GSM/GPRS terminals.
Spreadtrum provides its customers with IP and application software, and developed its own protocol stack software. The open platform enables customers to perform high-level development to implement their own IP and value-added features.
Compared with the Europe-initiated WCDMA and U.S.-backed CDMA 2000 3G standards, China’s homegrown 3G standard, TD-SCDMA, arrived late to the game. We even heard that Chinese telecom operators were reluctant to use TD-SCDMA due to that fact. Nevertheless, the Chinese Ministry of Information Industry formally approved TD-SCDMA on Jan. 20, 2006, as the national technology standard for 3G mobile communications.
Spreadtrum projects that shipments of 3G mobile phones in China will grow to 9.5 million units by 2007, up from 3.3 million units in 2004. The Industrial Technology Information Services (ITIS), a unit of Taiwan’s Ministry of Economic Affairs (MOEA), projects subscriptions for 3G services in China will increase from 15 million in 2006 to 80 million by 2008.
However, according to market research firm ABI Research, the establishment of a national 3G network will not greatly change the existing mobile landscape. The Chinese government will provide strong policy support to help TD-SCDMA operators gain time and establish a price lead over other 3G technologies, says ABI, but GSM will continue to be the dominant technology in China over the next five to eight years.
China is conducting its final TD-SCDMA trials in select cities between March and June. These latest trials follow three earlier rounds of tests, and should be the last before commercial use.
Spreadtrum will be competing with fellow TD-SCDMA chipmakers such as Commit (a joint venture involving Nokia, Texas Instruments, LG, Putian, DBTEL and Datang), Chongyou Information Technology, T3G (a joint venture of Datang, Philips and Samsung), Analog Devices and others.
The number of Chinese IC startups has been rapidly growing over the last few years, although many appear to have relatively simple technology, few people, little cash and fairly modest expectations. But a few – such as Spreadtrum – have set their sights higher and are establishing themselves as significant technology companies. We are impressed with Spreadtrum’s high level of integration in its products, as well as its ability to attract major investors and the early establishment of a global presence. We believe the company has a good chance for continued growth and success in China’s telecom market.

Spreadtrum Communications Announces Receipt of Acquisition Proposal [press release, June 21, 2013]

SHANGHAI, June 21, 2013 /PRNewswire-FirstCall/ — Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company“), a leading fabless semiconductor provider in China with advanced technology in 2G, 3G and 4G wireless communications standards, today announced that its Board of Directors has received a preliminary non-binding proposal letter, dated June 20, 2013, from Tsinghua Unigroup Ltd. (“Unigroup“), an operating subsidiary of Tsinghua Holdings Co. Ltd., a solely state-owned limited liability corporation funded byTsinghua University in China, pursuant to which Unigroup proposes to acquire the Company (the “Transaction“) for S$28.50 in cash per American Depositary Share (each American Depositary Share represents three ordinary shares of the Company).  A copy of the proposal letter is attached hereto as Appendix 1.

The Company’s Board of Directors is reviewing and evaluating Unigroup’s proposal and cautions the Company’s shareholders and others considering trading in its securities that the Board of Directors has just received the Unigroup proposal, and has not yet made any decisions with respect to the proposed Transaction, or the Company’s response to the proposed Transaction. There can be no assurance that any definitive offer will be made, that any agreement will be executed or that this or any other transaction will be approved or consummated. The Company does not undertake any obligation to provide any updates with respect to this or any other transaction, except as required under applicable law.

About Spreadtrum Communications, Inc.

Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum“) is a fabless semiconductor company that develops mobile chipset platforms for smartphones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards. Spreadtrum’s solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. Spreadtrum’s customers include global and China-based manufacturers developing mobile products for consumers in China and emerging markets around the world. For more information, visit www.spreadtrum.com.

Appendix 1

Acquisition Proposal Letter

June 20, 2013
The Board of Directors
Spreadtrum Communications, Inc.
Spreadtrum Center, Building No. 1
Lane 2288, Zuchongzhi Road
Zhangjiang, Shanghai 201203
People’s Republic of China
Ladies and Gentlemen:
Tsinghua University, through its subsidiary Tsinghua Unigroup Ltd. (“Unigroup“) is pleased to submit this preliminary non-binding proposal to acquire Spreadtrum Communications, Inc. (the “Company,” and such transaction the “Acquisition“).
We believe that our proposal as outlined below will provide a very attractive alternative to the Company’s shareholders.  Our proposal represents a premium of 20.10% to the Company’s closing price on June 19, 2013 and a premium of 44.3% to the volume-weighted average closing price during the last 30 trading days.
In addition to the premium that our proposal would deliver to Spreadtrum shareholders, we believe that an Acquisition by Tsinghua Unigroup Ltd., which is majority owned by Tsinghua University, a central player in China’stechnology and R&D sectors would provide compelling strategic synergies and position the Company for additional value creation in key wireless communications markets in China and elsewhere going forward.
The terms and conditions upon which we are prepared to pursue the Acquisition are set forth below. We are confident in our ability to consummate an Acquisition as described in this letter.
1. Purchase Price. The consideration payable for each American Depositary Share of the Company (“ADS,” each representing three (3) ordinary shares) will be U.S. $28.50 in cash.
2. Financing. We may finance a portion of the aggregate purchase price with debt. Tsinghua Holdings Co. Ltd., our controlling shareholder, has provided us with a Letter of Support, dated June 20, 2013, a copy of which is attached hereto as Exhibit A, pursuant to which Tsinghua Holdings has committed to guarantee full funding for any equity or debt financing that may be required for the Acquisition, as set forth therein.  For the avoidance of doubt, while we may seek to finance a portion of the acquisition with debt financing, Tsinghua Holdings has agreed to provide equity funding up to the total purchase price of $1.5 billion if satisfactory debt financing is not available.
3. Due Diligence. We will be in a position to commence our due diligence for the Acquisition immediately upon receiving access to the relevant materials.
4. Definitive Agreements. We are prepared to negotiate and finalize definitive agreements (the “Definitive Agreements“) concurrently with our due diligence review. This proposal is subject to execution of Definitive Agreements. These documents will provide for representations, warranties, covenants and conditions customary for transactions of this type.
5.  Confidentiality.  Other than the announcement of this offer letter, we are confident you will agree with us that we have a shared interest in proceeding in an otherwise confidential manner, unless otherwise required by law, until we have executed Definitive Agreements or terminated our discussions.
7. Further Information About Tsinghua Holdings and Tsinghua Unigroup. Unigroup is an operating subsidiary ofTsinghua Holdings,  a solely state-owned limited liability corporation funded by Tsinghua University that is responsible for managing a substantial majority of Tsinghua University’s commercial assets.  As of December 31st, 2012, Tsinghua Holding’s total assets approximated 70.4 billion RMB and Tsinghua had EBITDA of approximately4.07 billion RMB and net income of approximately 1.45 billion RMB for fiscal 2012.  Tsinghua Holdings’s corporate credit rating is AA+ according to CCXI, the Chinese domestic JV partner of Moody’s and the leading credit rating agency in China.  Additional information about Tsinghua Holdings can be found at (http://www.thholding.com.cn/english/simpleindex.aspx).  Other shareholders include Beijing Jiankun Investment Group Co. Ltd. and Beijing Tourism Group. Unigroup’s business lines include high-technology generally, bio-technology, real estate and urban infrastructure construction. 
8.  No Binding Commitment. This letter constitutes only a preliminary indication of our interest, and does not constitute any binding commitment with respect to an Acquisition. Such a commitment will arise only upon execution of Definitive Agreements, and in such case will be on the terms provided in such documentation.
In closing, we would like to personally express our commitment to working together in bringing this Acquisition to a successful and timely conclusion.  We look forward to hearing from you regarding our proposal at your earlier convenience and kindly request that you notify us by June 28, 2013 should you desire to engage in further discussions about our proposal.
Very truly yours,
Tsinghua Unigroup Ltd.
By: /s/ Zhao Weiguo
Name: Zhao, Weiguo
Title: Chairman and President

Exhibit A
TSINGHUA HOLDINGS LETTER
From:
Tsinghua Holdings Co., Ltd.
25F, Building A, S.P Tower
Tsinghua Science Park
Beijing 100084, P.R. China
                                                                                                 June 20th, 2013
To:
Chairman Zhao Weiguo  of Tsinghua Unigroup Ltd.            
10/F, Unis Plaza, Tsinghua Science Park
Beijing, 100084, P.R. China
Subject:  Tsinghua Holdings Co. Letter of Support and Agreement to Guarantee Full Funding for the Acquisition ofSpreadtrum Communications, Inc. by Tsinghua Unigroup Ltd.
Dear Mr. Zhao,
This letter (our “Letter of Support“) is to confirm our official endorsement and commitment to support Tsinghua Unigroup Ltd (“You“) in your bid to acquire Spreadtrum Communications, Inc. (NASD: SPRD) (the “Target” and such transaction, the “Project“) at the price of U.S. $28.5 per ADS for up to USD $1.5 billion (the “Support Amount“) and to guarantee any equity or debt financing that may be required for the Project.
As you know, we own and manage a substantial majority of the commercial assets of Tsinghua University, one of the most prestigious universities in the World. As of December 31st, 2012, our total assets approximated 70.4 billion RMB with 2012 EBITDA of approximately 4.07 billion RMB and 2012 net income of approximately 1.45 billion RMB. Tsinghua Holdings Co.’s corporate credit rating is AA+ according to CCXI, the Chinese domestic JV partner ofMoody’s and the leading credit rating agency in China.  Our corporate website contains further background information about Tsinghua Holdings, and can be found at (http://www.thholding.com.cn/english/simpleindex.aspx).
As the manager of the commercial affairs of the University, we are the parent company to Tsinghua Unigroup Ltd and own 51% of its outstanding capital shares.   We have officially approved the Project and have decided to fully support the Project to facilitate its rapid completion.  Although we have sufficient resources to fund the Project up to the full Support Amount from our own balance sheet, we understand that You may elect to utilize debt financing to fund a portion of the purchase price for the Target.  In any such case, we intend to assist You in obtaining any such debt financing on favourable terms.  In furtherance thereof, we will provide a corporate parent guarantee of such financing up to the Support Amount minus the amount of any equity contribution for the Project (and subject to any applicable government approvals).  In furtherance thereof, we will execute any bank or third-party guarantees and other related documents requested by you in form and substance reasonably acceptable to us and to any lender providing such funding.
At your discretion, this Letter of Support can be shared with parties with whom you are discussing the Project.
This Letter of Support and our agreement to provide a guarantee is a commitment of our broad financial enterprise, and credit support for purposes of the Project.
Yours faithfully,
Tsinghua Holdings Co., Ltd.
By: /s/ Xu Jinghong
Print Name: Xu, Jinghong
Title: Chairman of Tsinghua Holdings Co., Ltd.
To see a full copy of the signed version of these letters, click here:
http://www.prnasia.com/sa/attachment/2013/06/20130621172830287567.2 – Acquisition Offer Letter and Funding Support Letter.pdf
SOURCE Spreadtrum Communications, Inc.
Diana Jovin, ir@spreadtrum.com, +1 650-308-8148

Microsoft betting on boosting Windows RT demand with top level ARM SoCs from its SoC partners, Windows 8.1 enhancements, Outlook addition to the Office 2013 RT and very deep tactical discounts to its OEM partners for tablet offerings of more value and capability

… especially valuable for small businesses, and even enterprises of different, larger sizes thanks to new enhancements in manageability, networking, and security announced at TechEd North America 2013 (see “Cloud first” from Microsoft is ready to change enterprise computing in all of its facets [this same ‘Experiencing the Cloud’ blog, June 4, 2013]).

Relevant excerpts from Nick Parker, Tami Reller, Antoine Leblond and Steve Guggenheimer: COMPUTEX 2013 Keynote Transcript [Microsoft, June 5, 2013]

The full record of the keynote from Notebookitalia which contains the below excerpts between [10:49] and [19:50] as indicated.

Tami Reller, Chief Marketing Officer and Chief Financial Officer, Windows:

[10:49] Bringing the power of Windows to tablets is a really big part of the vision of Windows 8 and of Windows RT, really a new class of tablets that offers more value and capability than today’s tablets. […]

[15:00] Windows tablets are an important part of the Windows 8 vision, and Windows tablets do more.

Completing that promise of do more, I’m pleased to announce that starting with the back-to-school lineup, and in some cases even earlier, Windows x86 tablets will come with Office. That’s Word, that’s Excel, PowerPoint, and OneNote in the box. We’re making that possible through new OEM offerings that were introduced earlier this spring.

Even with the value of Office built-in to these Windows tablets, these new offerings are going to allow our partners to build opening price point tablets, as well as great premium tablets.

Additionally, we’ve opened up support for small tablets with Windows 8, and we’ll do more with Windows 8.1. You’ve seen the first of those tablets here at COMPUTEX. Congratulations to Acer on their announcements earlier this week.

And coming with 8.1, building on our support for small tablets, we’re really committed to completing the scenario, including full portrait support.

One of the top requests from Windows RT customers has been Outlook. I’m very pleased to announce that with the Windows RT 8.1 update Microsoft Outlook will be in-box.

With 8.1 we’re again embracing the very latest technology, and the very latest on the silicon roadmap. Specifically this includes Bay Trail-T, Qualcomm 8974 [one of Snapdragon 800 SoCs coming in commercial devices of H2 2013, see more details in Snapdragon 800 Product Brief], and NVIDIA T40 [or Tegra 4 first in the already announced HP SlateBook x2 to be available in August 2013].

And we’re expanding our ARM program to provide more component flexibility, creating more opportunities for partners to build competitive ARM tablets running Windows. [17:15 …]

[19:10] Windows 8.1 is easy for our customers to get. It’s free to Windows RT and Windows 8 customers so that whether a customer has Windows 8 today or is buying a PC or a tablet or any other device in the near future, it will be one click away and very easy to get Windows 8.1. We’ll deliver it through the Windows Store, including the preview, which will come at the end of June. And the final product will be available later this calendar year. [19:50 …]

New ecosystem opportunities, Windows 8.1 updates shared at Computex [Blogging Windows from Microsoft, June 5, 2013]

Antoine Leblond, corporate vice president of Windows program management joined Tami and other top Microsoft executives on stage to give our very first public demo of the upcoming Windows 8.1 update – touching upon many of the exciting improvements Antoine highlighted in his blog post from last week. You can see some of the highlights of what to expect in Windows 8.1 for yourself in this short demo video featuring Jensen Harris from the Windows User Experience Team:

Jensen Harris from the Windows Team shows some highlights of what to expect in Windows 8.1 coming later this year as a free update for Windows 8 customers. http://bit.ly/10OM2Th

Additionally, Tami announced that Outlook 2013 RT will be coming to Windows RT tablets as part of Windows 8.1. Windows running on ARM architectures has enabled an exciting new category of mobile-first, instant-on tablets that are thin and lightweight, with amazing battery life. We know that the addition of Outlook for those using ARM-based Windows devices such as the Surface RT, Dell XPS 10, Lenovo Yoga 11, and ASUS VivoTab RT as well as new tablets to come in the future has been a popular request from consumers and businesses alike. As Tami said in her keynote address, we’ve listened and Outlook will be joining the other Office applications currently available on Windows RT, including Word, Excel, PowerPoint, and OneNote.

Our commitment to Windows on ARM doesn’t stop with the addition of Outlook 2013 RT. We announced a number of other enhancements with Windows 8.1, earlier this week at TechEd North America, including new manageability, networking, and security capabilities that will make Windows RT an even more compelling option for enterprises.

Eight questions about Windows 8 for Microsoft manufacturing chief Nick Parker [PCWorld, June 5, 2013] 

IDG: So you just announced you’ll be including Outlook with the next version of Windows RT, what was the thinking behind that?

NP: Outlook is one of those apps people love, and when you start thinking about RT in the small business environment, or for heavy email users, Outlook is one of those high value solutions. That was the one we got the most feedback about.

IDG: The reception for Windows RT has been a bit lukewarm, what are some of the reasons for that and to what extent will adding Outlook will improve the situation?

NP: If you look at what we did with RT—it’s completely new silicon, a new hardware platform, and Windows 8 is a new OS. So first you just have a natural growth curve when you’re starting at zero. Then you start seeing new apps appear, the killer apps that people want, like Outlook. And the ecosystem gets more familiar with it—they learn how to code to it and how to certify parts for it.

We get so used to the tremendous success we’ve had on PCs for years, you just think you can flip a switch and the platform’s going to change. I think it’s just the incremental growth of a new platform. And we should be a bit humble about how we go to market and talk about the new capabilities. I think we could maybe have inspired people a bit more with some of the RT devices and some of our marketing.

IDG: There’s a lot of downward pressure on tablet pricing—Asus showed an Android tablet this week for $129. Do you expect to see Windows 8 tablets getting down to those sort of prices?

NP: That’s a question to ask our OEMs [original equipment manufacturers, or basically PC makers]. I think people are prepared to pay for value and we see tablets with higher price points having better capabilities and features. I think buyers are getting smart about what’s good quality. But OEMs will choose their own prices.

imageThe Acer Iconia W3-810 tablet

IDG: We saw the first 8-inch Windows tablet launch this week from Acer. What are some of the things you’re doing to provide a better Windows experience on those smaller devices?

NP: For any device you can hold in one hand, one of the things you need is portrait mode—so, the ability for the apps to work in the same way, to move and to flow nicely. And for our OEMs, we’re giving them the ability to have buttons on the side of the device, because when you’re holding it in one hand you might want to push a button on the side. You have to make the OS extensible. So those are the types of things.

IDG: Will that all be part of Windows 8.1?

NP: Yes, we talked about that today.

IDG: I’ve never thought of Windows as being designed for smaller screens; the netbook experience wasn’t particularly great. What are you doing to improve the software experience?

NP: In terms of how the display scales up and down, and in terms of the zooming capabilities—as soon as the preview [of Windows 8.1] comes out you should play with it.

IDG: There’s a tremendous variety of form factors out there right now—all kinds of laptops and tablets and convertibles. When you look ahead a few years, do you expect them to coalesce around a few winning designs or will there always be that much variety?

NP: In terms of capabilities, I think touch is going to be the new standard. People aren’t going to want to carry around hundreds of devices. You’ll have a phone, and I think the phablet is an interesting space. But for two-in-one detachables—I’m seeing the interest in those ramp. People want the best of both worlds. You can have a tablet and sit there and surf, then you plug it into a keyboard and you’re off working.

IDG: Is the keyboard here to stay, or will people eventually get used to typing on touchscreens?

I think the keyboard is here to stay, you’ve got that physical feedback. You may see a lot of innovation around keyboards but I think they’re here to stay.

Google search on “Computex Windows ARM discount” between June 5 and 6 was yielding the following items:
One year after debut, Windows RT is a Computex no-show | The Verge | OSNews | I4U News
New ecosystem opportunities, Windows 8.1 updates shared at Computex | Blogging Windows [from Microsoft]
Microsoft to include Outlook app with update to Windows 8 RT | ARN [Australia]
Microsoft Aims to Lure More Users to Windows | WSJ.com
Microsoft To Give More Tablet Makers Windows 8 Discounts | NASDAQ.com | 4-Traders | Capital.gr
Microsoft to Offer Discounted Windows and Office for Small Tablets | AllThingsD | CELLIFONE.com
AMD breaks from Windows exclusivity, adopts Android and Chrome OS | Facepunch.com
Forget Haswell: Why tablet processors mean more to Intel at Computex | The USA News Online 
Computex 2013: low-cost tablets, high-res laptops steal the show | Techgoondu
Microsoft says Outlook is coming to Windows RT this year | ZDNet
Microsoft demonstrates Windows as a platform for small tablets, touch and mobility at Computex 2013 | Virtualization Journal [replica of Microsoft press release]

Windows RT is a Computex no-show:

Three days into Computex Taipei, Asia’s biggest computer show, not a single manufacturer has announced a Windows RT device. … The Computex show floor has been dominated by devices running Windows 8 on Haswell and other chips from Intel, but ARM-powered units have been conspicuous in their absence.

However, the upcoming Windows 8.1 update and its RT counterpart could provide a shot in the arm to the fledgling OS. Qualcomm has pledged support for RT 8.1 with its new Snapdragon 800 processor, which president and COO Steve Mollenkopf described in a presentation today as offering “about 75 percent better performance than the S4 Pro.”

The Verge has heard that manufacturers may be holding back RT devices for Qualcomm’s new chip and the 8.1 update, which is also designed to improve the experience on smaller-screened devices.

include Outlook app with update to Windows 8 RT:

Outlook will be included with version 8.1 of Windows RT, previously dubbed Windows Blue, Microsoft announced at the Computex trade show in Taipei on Wednesday. The 8.1 update is scheduled for release later this year as a free update to Windows 8.

“We’re always listening to our customers and one piece of feedback was that people want the power of Outlook on all their Windows PCs and tablets,” Microsoft said. […]

Support for RT from hardware makers has been limited, however, with several PC makers, such as Acer, Asustek Computer and Hewlett-Packard, not yet supporting the OS.

Microsoft hopes to change that by addressing one of the criticisms of Windows RT — that it doesn’t include a version of its popular Outlook email client. Nvidia CEO Jen Hsun Huang has been vocal about the importance of adding Outlook to RT.

“If Outlook were to show up on RT, my life would be complete,” he said recently, lamenting the slow sales of Windows RT tablets. “I am one Outlook away from computing nirvana. Outlook god, please…”

Lure More Users to Windows:

Until now, people with Windows RT devices—which use different kinds of computer chips than those common in personal computers—have only been able to use a new type of email app that has been panned by users.

A Microsoft executive, speaking at the Computex computer trade show in Taiwan, also acknowledged the company is cutting the prices it charges computer makers for Microsoft software.

The executive, Nick Parker, didn’t detail the size of the software discounts. But people familiar with Microsoft’s pricing strategy have said for Windows RT devices, Microsoft is cutting by two-thirds the cost to license Windows and Office software, or roughly $100 before marketing rebates Microsoft offers to PC makers.

Microsoft’s discounts apply to tablets smaller than 10.1 inches, Mr. Parker said. The company said it started offering discounts to some tablet makers in April.

The discounts and addition of Outlook underscore how hard Microsoft is trying to boost the appeal of devices that run Windows RT, a product whose development marked a major break from company tradition. […]

“This is an exciting development that we believe will deliver a much more robust and full-featured experience to Windows RT users,” wrote Mark Aevermann, an Nvidia product manager, in a blog post.

Microsoft executives have said they would push harder to bolster sales by explaining more clearly the attributes of Windows RT and ARM chips.

We are very committed to ARM,” said Tami Reller, the Windows chief financial officer and chief marketing officer, in an interview last month.

Windows executives also recently suggested Windows RT devices might in the future lose the dual modes that have been a polarizing feature of the new Windows.

Windows 8 and Windows RT devices operate in both a traditional Windows “desktop” and a new mode that looks and functions more like a smartphone screen. The Windows executives, Jensen Harris and Antoine Leblond, suggested in a May interview that it might be appropriate to junk desktop mode entirely on Windows RT devices.

Windows 8 Discounts:

Nick Parker, vice president of Microsoft’s OEM division, said at the Computex trade show in Taipei Wednesday that the Redmond, Wash. company is now expanding its discount program to include tablets that run on Windows RT, a version of Windows 8 running on ARM Holdings PLC (ARMH, ARM.LN) chips. The discount will also apply to an upgraded version of its Windows 8 system dubbed Windows 8.1. The discounts will only apply on tablets that are between 7 and 10.1 inches. The executive declined to comment on the size of the discounts but Mr. Parker said they will come in the form of a cut in licensing fees and free Office software for hardware makers.

Microsoft said it started offering discounts to some tablet makers in April and there is no specific time frame for when the discounts might end.

The Wall Street Journal reported in early March, citing people familiar with the situation, that Microsoft had been offering price breaks on its Windows 8 and Office software to help spur the development of small, touch-enabled laptop computers.

In the latest discount program, tablets with screens bigger than 10.1 inches will not be eligible for the discount, Mr. Parker said. But he didn’t elaborate.

Analysts said the discounts could help bring down retail prices of smaller Windows tablets and help Microsoft better compete with Apple Inc. (AAPL) and Google Inc. (GOOG).

Discounted Windows and Office for Small Tablets:

Second, Microsoft is cutting some sort of deal with computer makers that want to bundle Windows 8 and Office Home and Student onto a seven- or eight-inch tablet. Microsoft isn’t going into detail on what it is charging PC manufacturers, but it is clearly low enough to enable some pretty inexpensive tablets.

The first of these tablets to be announced, Acer’s Iconia W3, has a $379 sticker price. That’s pretty darn cheap for a machine that includes full-blown Windows and Office.

Microsoft isn’t saying which other computer makers may also be working on small tablets, but with the PC market struggling, it seems reasonable to think we will see a number of such tablets in short order.

And while Microsoft’s bundle program appears limited to small tablets, one could conceivably hook up the tiny tablet to a monitor and keyboard and use it as a home PC.

low-cost tablets, high-res laptops steal the show:

Since Amazon’s Kindle Fire and Asus’ Nexus 7 came out last year, the idea of a cheap, small tablet has taken hold like few expected. This year, the cheap is going to get cheaper, with Asus’ MeMo Pad HD7 starting from just US$129 for an 8GB version.

image

Now, this may not be as cheap as some models you’d find in Shenzhen, but this model from Asus will win over many users looking for an affordable but well-made tablet.

The new MeMo Pad HD7 also seems like an updated version of the successful Nexus 7. There is the 1,280 x 800 screen, now coupled with a quad-core Arm Cortex A7 CPU, and a microSD card slot to pop in memory cards, which the Nexus 7 did not have. No idea of when this is coming, but expect to save some money for a budget tablet this holiday season. […]

An interesting idea, which may not turn out to be a major trend, is small Windows tablets. Acer surprised many visitors with its 8-inch Windows 8 tablet, probably the first such mobile option.

The Iconia W3 runs an Intel Atom chip, has 2GB RAM and either 32GB or 64GB storage. The 1,280 x 800 resolution is not too bad on the small screen.

image

What’s a little hard to see is the Windows desktop, when you fire up your traditional Windows programs, like Excel. During a quick hands-on, I can tell that the screen was too small for serious editing. Don’t even think of sharing programs on the screen. It’s just too small.

Which leaves you in mostly the Metro touch interface on Windows 8. Sadly, there aren’t many apps here yet, compared to either an Apple iPad mini or an Android tablet.

Not just that, while the US$379 asking price isn’t unreasonable for the hardware, the question is on usage. If you’re using the machine mainly as a small tablet, Android tablets are getting cheaper all the time, as Asus’ MeMo Pad HD7 shows.

Outlook is coming to Windows RT:

Owners of existing RT devices will receive the updates for free.

Despite weak sales of its own ARM-powered Surface and even more tepid support from hardware partners, Microsoft doesn’t appear to be backing away from Windows RT. The addition of Outlook will undoubtedly convince some previously recalcitrant business buyers that Windows RT tablets make sense, as will the announcement at the Tech-Ed conference this week of management tools that allow greater control over Windows RT devices. And Microsoft also announced support for additional types of Virtual Private Networks (VPNs) on Windows RT.

But there are still dealbreakers that stand in the way of widespread deployments of Windows RT. Office 2013 RT has many of the same features as its x86/x64 counterpart, but it lacks the ability to handle custom macro code. In addition, some features are missing from the RT programs, including the ability to embed audio and video in OneNote notebooks.

And Office is the only desktop app that Microsoft has officially ported to Windows RT. Third-party developers don’t have that option, which means any business that requires a third-party desktop app or a browser plugin other than Adobe Flash is out of luck. Likewise, Windows RT still doesn’t support some widely used third-party VPN clients.

There’s also the pesky issue of licensing. The version of Office included with Windows RT is Office Home and Student 2013, which is licensed for noncommercial use only. If you want to stay in the good graces of Microsoft’s licensing agreement, you need to add commercial use rights, through a volume license or by way of a subscription to a business edition of Office 365.

Today’s announcement is also noticeably silent on the question of when Microsoft plans to release native tablet versions of its Office programs, for both Windows 8.1/RT as well as alternative platforms like the iPad and Android tablets. The fact that the desktop version of Outlook is a key part of this fall’s update suggests that Office for tablets won’t appear until 2014, and one recent rumor says late 2014 is the likely target date for those apps.

Windows as a platform for small tablets [Microsoft press release replicated]:

“We want to be the best partner to all hardware manufacturers, from the way we engage and invest on new product designs to the experience we jointly deliver to customers,” Parker said. “This new wave of Windows devices from our partners, combined with our software, apps and services, reflects that commitment.”

Most notable of the devices Parker showed were the new 7-inch and 8-inch Windows tablets: the Acer Iconia W3 that launched on June 3 in Taipei, and three other small tablets from top original device manufacturer (ODM) and original equipment manufacturer (OEM) partners expected to ship for the holiday season. These small tablets provide a Windows experience with Office Home & Student 2013 delivering even more options to experience all that Windows can offer in a smaller form factor. […]

Tami Reller, chief financial officer and chief marketing officer of Microsoft’s Windows Division, joined Parker onstage … “Windows 8.1 furthers the bold vision of Windows 8 by responding to customer feedback and adding new features and functionality that advance the touch experience and mobile computing’s potential,” Reller said.

As part of this commitment, Reller announced that Outlook 2013 RT will be available on Windows-based ARM tablets with the Windows 8.1 update later this year. “Windows on ARM is a core part of our strategy today and moving forward, and the addition of Outlook further enriches this world of new on-the-go opportunities for partners and customers,” Reller said.

ARM Cortex-A12 CPU cores and Mali-T622 GPU cores with Process Optimization Packs (POPs), plus Mali-V500 video block for mid-range mobile devices of the end of 2014

in order to cover (very competitively) the hole existing in ARM-based SoCs so far:

Arm unveiled the Cortex A12 processor during a news conference at Computex in Taipei on June 3, 2013.

AnandTech’s judgement about the Cortex-A12 announcement:

… The Cortex A9 is too slow to compete with the likes of Intel’s Atom and Qualcomm’s Krait 200/300 based SoCs. The Cortex A15 on the other hand outperforms both of those solutions, but at considerably higher power and die area requirements. … The Cortex A15 island in Samsung’s Exynos 5 Octa occupies 5x the die area as the A7 island, and consumes nearly 6x the power. In exchange for 5x the area and 6x the performance, the Cortex A15 offers under 4x the performance. It’s not exactly an area or power efficient solution, but a great option for anyone looking to push the performance envelope. Today, ARM is addressing that hole with the Cortex A12. …
Asked at a Taipei news conference about the future of Intel’s x86 architecture, rival Arm said it still sees life in the platform.

AnandTech’s judgement about Mali-T622 and Mali-V500 announcements:

… The Mali-T622 is a 2-core implementation of the 2nd generation Mali-T600 GPU architecture that we first learned about with the 8-core T628. Each shader core features two ALUs, an LSU and a texture unit. … On the video front, the Mali-V500 video encode/decode block is a multi-core engine used for all video acceleration. The V500 allegedly supports up to 100Mbps High Profile H.264, although details are scarce on more specifics. ARM claims support for up to 120 fps 4K video decode with an 8-core V500 implementation. Mali-V500 also features a protected video path, necessary for gaining content owner support for high-bitrate/high-resolution video decode. The V500 also supports ARM’s Frame Buffer Compression (AFBC), a lossless compression algorithm that can supposedly reduce memory bandwidth traffic by up to 50%. There’s presently no frame buffer compression in Mali GPUs today, but ARM expects to eventually roll AFBC out to Mali GPUs as well.

Announcement information from ARM:

image
POP IP for the Cortex-A12 processor core 
– The only implementation solution that is co-developed along with the processor itself
– The processor RTL and the POP implementation feed off each other and are thoroughly co-optimized
– Lower the risk to end customers and those designers starting from scratch with a new processor core
– Save months of effort optimizing the implementation
POP IP for Mali-T622 GPU core 
– Eliminates the iterative guess work required to find the most optimal implementation
– Enables best-in-class PPA and frames per second metrics coupled with highly flexible implementation
More information: POP IP for the Cortex-A12 Processor: Enabling the Next Billion Smartphones [June 3, 2013]

image
New ground-up design for mid-range mobile
– OoO, Dual-Issue, 11 stage dynamic length pipeline
– Tightly integrated, high-performance NEON and FPU units
Perfectly balanced design for best efficiency
– Highly optimized L1 and L2 memory sub-system
– Ideal for current and upcoming mobile workloads
Flexible interface options to adapt for use-case
– 128-bit AMBA ACE – System coherency with CPUs or GPUs
– Accelerator Coherency Port (ACP) – I/O coherency with DMA
– Peripheral Port – For low-latency peripherals elmiminating DDR traffic congestion
More information: Cortex-A12: Diversification in the Mobile Market – Serving the Mid-Range [June 3, 2013]

image
Smallest GPU Compute solution in the market
– Renderscript Compute and OpenCL 1.1 Full Profile
50% energy-efficiency improvements over Mali-T600 series
Richest user experience with OpenGL ES 3.0
More information: Mali-T622 – Bringing Full Profile GPU Compute to mid-range devices [June 3, 2013]

image 
1080p60 HD encode/decode
Optimized for lowest cost and power
– AFBC gives 50% lower memory bandwidth
TrustZone secure video path
– Premium content protection
More information: A new branch for the Mali family tree: Mali Video, featuring the Mali-V500  [June 3, 2013]

ARM Targets 580 Million Mid-Range Mobile Devices with New Suite of IP [press release, June 3, 2013]

News Highlights:

  • Faster time to market and less design risk with suite of IP including: 
    ARM Cortex-A12 processor, Mali-T622 GPU, Mali-V500 video solution and POP IP technology;
  • 580 million mid-range smartphones and tablets are forecast to be sold in 2015
  • Cortex-A12 processor delivers 40 percent more performance than Cortex-A9 and brings premium features such as virtualization to the mid-range mobile device market; efficiency profile also makes it ideal for DTV and home networking;
  • Cortex-A12 processor brings optimum performance and maximum efficiency of big.LITTLE processing to mid-range smartphones and tablets;
  • Mali-T622 GPU offers an efficient and qualified OpenGL ES 3.0 solution and smallest Full Profile GPU Compute solution, putting even greater compute power into the hands of more mobile users;
  • Mali-V500 video IP solution reduces system bandwidth and power, while enabling the protection of premium video content with TrustZone support.

The essence is that the first Cortex-A12 based SoCs are expected by mid-2014
– for mid-range devices (smartphones and tablets) in the $200 … $350 price range by late 2014 to early 2015  
– with Cortex-A7/A15 architectural compatibity, thus in big.LITTLE configurations with either core, supporting 40-bit addressing (up to 1 TB) and virtualization
– plus providing the highest efficiency in pairing with Cortex-A7 core
– as the follow-up with +40% performance to the current SoCs for mid-range devices based on Cortex-A9 SoCs

The SoC ramp-up of about one year or so is compared to not less than two years ramp-up for Cortex-A9 based SoCs. This is the result of significant progress with Process Optimization Pack technology of ARM which was first time developed along with the processor and GPU cores themselves. It is available now for TSMC 28HPM process technology for lead partners. Six of them are already starting their SoC design. Moreover it will also be available at GLOBALFOUNDRIES 28-SLP HKMG process technology in Q4 2013. So it is also first time as such complete sourcing from two foundries will be available for SoC vendors so early on. GLOBALFOUNDRIES is even going to achieve up to 70 percent higher performance in comparison to a Cortex-A9 processor core using 40nm process technology. Competition between those 2 foundries will understandably be very strong as the 2015 mid-range smartphone and tablet market is expected to be not less than 580 million units.

In comparison the Cortex-A9 core was announced in October 2007 and released in 2008
now contributes to approximately one-third of all smartphone shipments worldwide
real development opportunities began in H2 2009 with possibility to go even against Intel Atom (source: Computex 2009 – Warren East Presentation [ARM Holdings, June 1, 2009]):
image
with improving Cortex-A9 performance on 45nm process achieved through:
– 56% improvement from processor and physical IP optimisations
– 44% improvement from other techniques
The first SoC products based on 45nm technology came in 2011, namely:
NXP PNX 847x/8x/9x set-top box SoCs sampling in January 2010. However a month later the business related to these products was sold to Trident Microsystems (see the PNX8490/PNX8491 datasheet of February 2010) and as Trident had experienced continuing operating losses it filed for bankruptcy in January 2012. Its set-top box SoC business had been taken over by Entropic Communications, Inc. in April 2012. Although only the PNX8475 is currently offered by Entropic the original Cortex-A9 related SoC know-how is flourishing quite well there (see also: 1, 2, 3 and 4).
Samsung Orion application processor, later renamed into Samsung Exynos 4210 then further into Exynos 4 Dual, announced in September 2010 for sampling in Q4 2010 and mass production in H1 2011. It first came out with the Samsung Galaxy S II smartphone announced in February 2011 for May 2011 delivery. Other Samsung smartphone and tablet products then followed.
Texas Instruments OMAP 4430 and OMAP 4440 (later renamed OMAP 4460) application processors announced in February 2009 for sampling in H2 2009 and expected production by the second half of 2010, but actually debuted a year later in February 2010 with sampling available and expected production in H2 2010. The first product based on OMAP 4430 was the BlackBerry PlayBook tablet announced in September 2010 for early 2011 availability but becoming available in June 2011 only. Smartphone products from Motorola (a lot, also a few tablets) and LG (a few) followed that, as well as a number of tablet products from Archos and most notably the Kindle Fire from Amazon, and the Nook from Barnes & Noble.

ARM is representing and projecting the evolution of the market since then as follows:image
More information about that was provided in:
Cortex-A12: Diversification in the Mobile Market – Serving the Mid-Range [ARM Smart Connected Devices blog, June 3, 2013]

Mobile devices have become indispensable in North America, Europe, and much of Asia, and are becoming the primary compute platforms for people in emerging markets. We are entering a new era of computing, the post-PC era. ARM® technology has been at the heart of the mobile revolution for over twenty years and continues to be the bedrock of all innovation and change in this space.
Mobile devices, such as smartphones and tablets, are connecting billions of people. In 2013, we are expecting:
– Over 1 billion smartphones forecasted to ship*
– Smartphones for <$50 and Tablets >$800
– Tablets out-ship notebook PCs
What becomes clear when looking at mobile devices is that we are seeing segmentation into multiple markets, which is an opportunity for growth for ARM partners:
– Premium devices: Price range > $400
– Mid-range devices: Price range between > $200 and < $350
– Entry-level devices: Price range up to $150image
Source: Mixture of ARM and Gartner Estimates
Premium smartphones and tablets receive a great deal of attention, but it is the entry-level and mid-range markets are expected to grow the fastest over the next years. ARM delivered the Cortex®-A7 processorin the fourth quarter of 2011, and it is now shipping in large volumes in low-cost, quad-core devices. It will be followed by the Cortex-A53 processor, which is soon to be released to lead partners. Both are high-efficiency processors, that are efficient by simple in-order eight stage pipelines which are highly efficient and tuned to deliver very good performance for their size. In the mid-range mobile device market, the industry had tremendous success with devices based on the higher-performance Cortex-A9 processor, which uses a partially out-of-order, nine stage pipeline to achieve high performance tuned to the power constraints of smartphones. The Cortex-A9 processor was released in 2008 and now contributes to approximately one-third of all smartphone shipments worldwide.
The market segmentation is driving the diversification in mobile and resulting in many different requirements needed to achieve the highest performance and lowest power within a sustained thermal envelope. These requirements make it mandatory to provide the functionality previously available only in premium devices, but within the power budgets of mid-range devices. Looking at how to serve those markets, it is clear that one size does not fit all anymore.
Today ARM is introducing the Cortex-A12 processor, the highest performance mid-range CPU that is specifically designed for the next-generation mid-range mobile market. The Cortex-A12 processor brings its own mix of high performance and energy efficiency to 2014 SoC designs: more performance than the Cortex-A9 processor with the same mobile-tuned power efficiency. The Cortex-A12 processor is designed to deliver the best mobile experience:
– Highest performance at lowest power consumption and cost
– Highest efficiency within mid-range thermal envelopes, i.e. achieve highest performance at uncompromised area
– Premium feature set in mid-range mobile
The Cortex-A12 processor is the successor to the Cortex-A9 processor and increases single-thread performance by 40 percent, while matching the best-in-class energy efficiency. Measured in 28nm, the Cortex-A12 processor is about 30 percent smaller in area compared to the Cortex-A9 processor in 40nm technology using the same configuration. Additionally, the Cortex-A12 processor brings today’s premium smartphone features into the mid-range, allowing new use cases and great mobile experiences. Some key added features include:
big.LITTLE™ processing enables the extension of the dynamic range of the Cortex-A12 processor with the addition of the Cortex-A7 processor
Virtualization and TrustZone® security support enabling new use cases like BYOD (bring your own device)
– 1TB addressable memory, providing close to no boundaries on memory space
The Cortex-A12 processor extends the performance capability in mid-range devices without sacrificing energy efficiency when combined with the Cortex-A7 processor as a big.LITTLE CPU subsystem. big.LITTLE processing provides a highly efficient, high-performance processing solution that can scale to many different use cases. The first iterations of big.LITTLE processing featured the Cortex-A15 and Cortex-A7 processors for high-end solutions. Now, the Cortex-A12 processor is bringing big.LITTLE processing to increase the dynamic range of the mid-range by enabling SoC designers to push the Cortex-A12 processor further while using the Cortex-A7 processor to reduce power well below levels of the Cortex-A9 Processor. This results in an ideal combination of compute resource for efficient workload distribution, running lightweight tasks on the Cortex-A7 processor and high-performance tasks on the Cortex-A12 processor. Early results show up to 2x increased efficiency.
Even though it is designed for mid-range smartphone and tablet devices, the Cortex-A12 processor leads with an excellent efficiency profile, making it an ideal fit for other use cases like home networking, residential gateway and auto infotainment systems.
ARM has also designed the Cortex-A12 processor to work efficiently with a complimentary family of high performance, low power ARM CoreLink™ System IP components:
image 
The system diagram shown above illustrates the system IP components that will typically support the Cortex-A12 processor in a mobile SoC. To deliver effortless 1080p30 graphics with 1080p encode/decode the system also features a Mali™-T622 GPU supporting OpenGL/ES 3.0 and a Mali-V500 video accelerator.
The CoreLink CCI-400 cache coherent interconnect provides an IO coherent channel with Mali and opens up a number of exciting possibilities for offload and acceleration of tasks. When combined with a Cortex-A7 processor (not shown) on the ACE port, CCI-400 also allows big.LITTLE operation with full L2 cache coherency between the Cortex-A12 and Cortex-A7 processors. Efficient voltage scaling and power management is enabled with the CoreLink ADB-400 enabling efficient DVFS control of the Cortex-A12 processor.
CoreLink MMU-500 provides a hardware accelerated, common memory view for all SoC components and minimizes software overhead for virtual machines to get on with other system management functions. In this system, the Cortex-A12 processor also enjoys a secure, optimized path to memory to further enhance its market-leading performance with the aid of CoreLink TZC-400 TrustZone address space controller and DMC solution. All interconnect components and the ARM DMC guarantee bandwidth and latency requirements by utilizing in-built dynamic QoS mechanisms.
ARM POP™ IP supports the physical implementation of the Cortex-A12 processor and Mali GPU to enable best power, performance, and area so critical to success in the highly competitive mid-range SoC market. ARM CoreSight™ debug and trace on-chip hardware, coupled with the ARM DS-5™ software development toolchain, enable the debug of random, time-related software bugs, and the non-intrusive analysis of critical areas of software. The ARM Development Studio 5 (DS-5TM) toolchain also makes use of performance counters embedded in the processor, graphics processor and interconnect to enable system-wide optimization.
The ARM Cortex-A12 processor is the highest-performance, mid-range CPU. It is specifically designed for the mid-range mobile market, and is broadly supported by a range of other ARM technology IP including ARM system IP, POP IP and development tools to enable ARM Powered® solutions that contribute to the very best user experience in terms of responsiveness and battery life. At the same time, it allows ARM partners to accelerate time to market for mid-range SoCs, while freeing development time to add their own differentiation. The Cortex-A12 is a highly tuned processor that will bring the performance of high-end mobile devices into mid-range smartphone and tablets, as well as into other great market opportunities we haven’t even considered.
* Source: Bank of America
Related Blogs:

ARM and GLOBALFOUNDRIES to Optimize Next-Generation ARM Mobile Processors for 28nm-SLP Process Technology [press release, June 3, 2013]

New ARM POP technology provides core-hardening acceleration for Cortex-A12 and Cortex-A7 processors
Milpitas, Calif. and Cambridge, UK, June 3, 2013 – In conjunction with the launch of the ARM®  Cortex®-A12 processor, ARM and GLOBALFOUNDRIES today announced new power, performance and cost-optimized POP™ technology offerings for the ARM Cortex-A12 and Cortex-A7 processors for GLOBALFOUNDRIES 28nm-SLP High-K Metal Gate (HKMG) process technology. The Cortex-A12 processor was introduced by ARM today as part of a suite of IP targeting the rapidly growing market for mid-range mobile devices.
The companies will combine ARM’s next-generation mobile processor and POP IP with GLOBALFOUNDRIES 28nm-SLP HKMG process solution, enabling a new level of system performance and power efficiency with the optimum economics necessary to serve the mid-range mobile device market.   The new initiative builds on the existing robust ARM Artisan® physical IP platform and POP IP for the Cortex-A9 processor already available on GLOBALFOUNDRIES 28nm-SLP, signifying another milestone in the multi-year collaboration between ARM and GLOBALFOUNDRIES.
Central to this increase in functionality for mid-range mobile devices is the new ARM Cortex-A12 processor. The Cortex-A12 processor provides a 40 percent performance uplift and direct upgrade path from the incredibly successful Cortex-A9 processor, while matching the energy efficiency of its predecessor. The Cortex-A12 processor provides best-in-class efficiency as a standalone solution, but additionally supports the innovative big.LITTLE™ processing technology with the Cortex-A7 processor, bringing this energy-efficient technology to the mid-range.  GLOBALFOUNDRIES 28nm-SLP process technology and associated ARM POP IP for the Cortex-A12 processor enables up to 70 percent higher performance (measured single-thread performance) and up to 2x better power efficiency in comparison to a Cortex-A9 processor using 40nm process technology. Designers can achieve even higher performance by trading off for lower power efficiency, depending on their application needs. Click here for more information on the Cortex-A12 processor.
The newest POP technology enables customers to accelerate core-hardening of Cortex-A12 and Cortex-A7 processors on GLOBALFOUNDRIES 28nm-SLP HKMG process. POP IP for Cortex processors has successfully enabled ARM-based SoCs with more than 30 different licenses since being introduced over three years ago. POP IP is composed of three elements necessary to achieve an optimized ARM processor implementation: core-specific tuned Artisan physical IP logic libraries and memory instances, comprehensive benchmarking reports, and implementation knowledge that detail the methodology used to achieve the result, to enable the end customer to achieve the same implementation quickly and at low risk.
“With 580 million mid-range smartphones and tablets forecast to be sold in 2015[i], consumers are increasingly looking for the right combination of performance, low power and cost effectiveness,” said Dr. Dipesh Patel, executive vice president and general manager, Physical IP Division at ARM. “With the Cortex-A12 processor and suite of IP announced today, ARM is delivering an optimized system solution leveraging the most innovative technologies available for this market. The POP IP solution on GLOBALFOUNDRIES 28nm-SLP helps designers balance the performance, power and cost tradeoffs to achieve their targets for this growing market.”
GLOBALFOUNDRIES 28nm-SLP technology is ideally suited for the next generation of smart mobile devices, enabling designs with faster processing speeds, smaller feature sizes, lower standby power and longer battery life. The technology is based on GLOBALFOUNDRIES’ “Gate First” approach to High-K Metal Gate (HKMG), which has been in volume production for more than two years. The technology offers a combination of performance, power efficiency and cost that is ideally suited for the mid-range mobile market.
“GLOBALFOUNDRIES is committed to a deep relationship with ARM to enable best-in-class solutions for our mutual customers. Our collaboration on the ARM Cortex-A12 processor implementation is a direct result of this focus and collaboration,” said Mike Noonen, executive vice president of Marketing, Sales, Design and Quality at GLOBALFOUNDRIES.
GLOBALFOUNDRIES’ next-generation 14nm-XM FinFET technology is expected to bring another dimension of enhanced power, performance and area for ARM mobile processors. A Cortex-A9 processor implemented on 14nm-XM technology, using 9-track libraries, is projected to enable a greater than 60 percent increase in frequency at constant power, or a decrease of more than 60 percent in power consumption at constant performance, when compared to implementation on 28nm-SLP technology using 12-track libraries. Similar results are expected for Cortex-A12 processor implementations. Click here for more details on GLOBALFOUNDRIES’ 14nm-XM FinFet technology.
For further discussions about GLOBALFOUNDRIES process technologies or ARM IP offerings please visit the companies’ respective exhibits at the Design Automation Conference (DAC), June 3-5, 2013 in Austin, Texas. ARM is located in booth 931, and GLOBALFOUNDRIES can be found at booth 1314.

Qualcomm’s SoC business future is questioned first time

Among the hits for simple ‘Qualcomm’ search between April 25 and 30 you will first time find headlines such as:

  • Qualcomm And The Demise Of The Commodity Processor >>>
  • Qualcomm’s profit hurt by competition from China >>>
  • Qualcomm’s earnings outlook points to rising competition from smaller rivals >>>

While such headlines are in minority by far and had been market balanced by Qualcomm’s media wide Snapdragon 800 communication (“Snapdragon 800 to enter mass production in late May”) we are witnessing first time that Qualcomm’s SoC future had been questioned for very first time. So it is worth to examine this abrupt change in a little more detail than the articles behind those worries:

First of all China: Entry-level dual core IPS WVGA (480×800) smartphones $65+ now, quad-core $70+ in June [‘Experiencing the Cloud’, April 29, 2013] behind of which there is a very said turn of events from Qualcomm’s point of view that:

Qualcomm recently quoted its quad-core solutions at less than US$10, slightly cheaper than MediaTek’s offerings, the sources indicated. Meanwhile, Spreadtrum has lowered its quad-core processor prices to similar levels. Both firms are trying to gain market share through aggressive pricing, the sources said.

That is Qualcomm has no other way against its market dominant entry-level rival MediaTek as start an outright price competition. In fact it is an even bigger problem as its hastily reworked new SoC product line setup:
was meant to be a very broad offensive move as it was noted in Qualcomm moving ahead of Allwinner et al. in CPU and GPU while trying to catch up with Allwinner in Ultra HD [‘Experiencing the Cloud’, Jan 12 -Feb 27, 2013]

Even more, in China: Entry-level dual core IPS WVGA (480×800) smartphones $65+ now, quad-core $70+ in June [‘Experiencing the Cloud’, April 29, 2013] we already had the following slide from yet another Chinese rival Spreadtrum:

So while Qualcomm is trying to undercut MediaTek prices in the quad-core entry-level SoC segment its another rival had been pushed to do the same, and now Qualcomm has another very potent rival, already much better established in the entry-level segment than Qualcomm, even outside China as was shown by Temporary Nokia setback in India [‘Experiencing the Cloud’, April 28, 2013]. Should Qualcomm drop its quad-core entry level price further? Hardly, as those $10 SoC prices are at the very bottom from the point of view of deterring additional entry-level quad-core rivals like Allwinner to enter that segment at large.

The competition between these three parties in terms of the entry level functionality looks like as follows (availability data is suggesting Q3 2013 entry level smartphone devices with extremely high volume production from Tier 1 international vendors down to a large number of white-box Chinese vendors):

 

MediaTek

Qualcomm

Spreadtrum

Product

MT6582

MSM8225Q, MSM8625Q

SCXXXX

Availability

Q3 2013 volume

Q1 2013 sample

Q2 2013 sample

Modem

TD-SCDMA/W-CDMA/ TD + W

CDMA multimode / UMTS modem options

TD-SCDMA/W-CDMA/ TD + W

Integrated App processor

Quad Cortex-A7

Quad Cortex-A5

Quad Cortex-A7

Speed

1.x GHz

1.4 GHz

1.x GHz

GPU

ARM Mali 400

Adreno 203

ARM Mali-400MP2 likely

Block diagrams of the MT6572 entry level SoC from MediaTek, the quad-core MT6582 will differ from that only in the number of cores:

image
From: Mediatek “Wu Song” [MT6572] uphill [product], against the Spreadtrum “Tiger” [SC8825] / 联发科武松上山,展讯猛虎迎战 [52RD, March 8, 2013]

and

image
from 28-nanometer dual-core MT6572 WCDMA version is first to debut / 28纳米双核MT6572临近 WCDMA版本率先登场 [MTK手机网/MTK Mobile Phone Network, March 23, 2013] based on which a brief English report was the Mediatek MT6572 Chipset Details [Quazmo, April 6, 2013]

Meanwhile the first MT6572-based products are already launched:
MTK6572 mobile phone, Sunspan [天迈] D18/D28X first appearance [China Unlocked Phone Review, April 26, 2013] which is the rough English translation (therefore I made some manual edits to it) of MTK6572手机来了 天迈D18/D28X率先亮相 [MTK手机网/MTK Mobile Phone Network, April 26, 2013] article

MediaTek MT6572 dual-core processor was adopted some time ago by the majority of mobile solution providers. Informed sources said MT6572 began mass production, in addition to the dual-core MT6572, quad-core chip MT6582 coming soon. There is no quad-core version of the specific information of MT6582 chip, but to guess from the naming of the quad-core chip may be rumors it is MT6572 quad core version .

Description of MT6572

MediaTek MTK/MT6572 is a low-power highly integrated single-chip phone processor. The chip is based on Cortex-A7 architecture, using the 28-nanometer process. a single core’s clocked at 1.xGHz, it also has built-in Mali-400MP graphics processor, support for TD-SCDMA, WCDMA and EDGE 2.75G network, integrated 4-in-1 wireless chip. In addition to that it has been listed dual-core and quad-core chip versions. The MT6572 product line also has speed and price advantages. It is learned that old Spreadtrum customers, including WingTech (闻泰) etc. will be launching MTK6572 products, but the end product equipped with MT6572 chip will be officially listed in May.

image

T-SMART D28X/D26X

T-Smart Sunspan Communication, operating in the field of TD for many years and in good cooperation with China Mobile and other operators, signed a 600,000 full year supply agreement with D.Phone [who claims to be China’s largest retailer of mobile phones and accessories, with over 1300 stores, more than 800 of which are directly owned stores, see its TMall store for current offerings]. In this year’s upcoming new machine, Sunspan D28X/D26X and D18/D96X, several new machines will be using MTK6572 program, the listing of these models has been formed, will soon be listed.

Sunspan D28X/D26X

The two Sunspan D28X/D26X machines have the same appearance. Body size is 132 * 68 * 10.5 mm, which is equipped with MTK6572 dual-core processor, clock frequency is 1GHz, the screen size is 4.5 inches with 5MP camera, and running Android 4.2 version of the system. Another standard capacity of 1600 mAh battery, built-in commonly used sensor. The D28X/D26X both support different network standards, the D28X will provide the China Mobile’s customized one, i.e. can support the TD-SCDMA network, while the D26X has the Unicom [W-CDMA] version.

image

T-SMART D18/D96X

In addition to the Sunspan D28X/D26X, there are also new D18/D96X machines which to be powered by the MTK6572 dual-core processor. The D18/D96X models also differ in supported networks. D18 is the China Mobile version and D96X is the Unicom version. In addition to that the D18 will run Android 4.2 system, equipped with a 2MP camera, while the the D96X using system version 4.1, the camera pixel is higher, 3MP. D18/D96X body style is more upright, while the color is much richer, the machine size is 126 * 64 * 10.9 mm.

Hardware parameters of both are also consistent: with a 4-inch screen, the battery capacity of 1500 mAh, supports common sensors.

MT6572 is primarily intended for [so called] one thousand yuan [~$150] mobile terminal products, so the MTK6572 phone sells are worth of the wait, as several new machines with lower to Sunspan hardware specifications, maybe the same, will have a friendly price. After May a large number of MTK6572 dual-core processor models will become available, the choice available to users will be more and more, and we look forward to the MT6572′s performance.

And those first Sunspan products were produced by the largest cellphone ODM in mainland China, WingTech [闻泰] Communications:
From the feature to quickly switch your Smartphone / 从功能机到智能机的快速切换 [Jiaxing Daily, March 22, 2013] as traslated by Bing and Google, with manual edits:

Decoding the “top ten 2012 to take a new road to industrialization enterprises”: WingTech Communications Review

“Sales of only 640 million yuan [$104M] in the first half of last year, while in the second half, sales more than doubled over the first half, jumped to 1.2 billion yuan [$195M]. In January to February period of this year, sales have exceeded 600 million yuan [$97M], an increase of 140%.” At the time of describing the achievement WingTech Communications Vice Chairman Xiao Xuebing [肖学兵] conceals his excitement inside: benefit from timely adjustment, increased research and development, decisiveness in the transformation and upgrading.

… From the first half of 2012 Xiao Xuebing introduced in Wingtech a timely transformation and upgrading, increased investment in the development of 3G smart phones in order to gradually force new products onto the market in the second half of the year, and quickly switch from the feature phone market to the most popular smart phone market.

… WingTech has large scale, low-cost advantage, which thanks to ODM orders from Huawei [华为], Haier [海尔], Sunspan [天迈], TCL and other domestic brands, as well as a powerful combination with carriers and falling smartphone prices lead to rapid sales growth and rapid adoption in the market. Now WingTech is still mass recruiting the staff, nevertheless it is expected that the whole production would exceed 3 million units in March, again hitting an all-time record.

Even in the worst economic situation of the winter of 2008 the 1000 people strong R&D team of WingTech Communications, under the leadership of CEO Zhang Xuezheng [张学政], still advocated a “while others are ‘dormant’ we need to have ‘winter’ “ approach – a gathering of its hundreds of elite “retreats” hundred days focus research and development. This spirit of innovation remains to this day – still coming down.

“After the 4-inch dual-core smartphones, we will soon launch 5-inch and 6-inch quad-core smart phones, as well as 7-inch, 8-inch and 10-inch PAD tablets, for which WingTech will use its own core technology, building more ordinary people affordable smart electronic products.” said Xiao Xuebing “The new products apply a lot of new technologies from the latest R&D. In the upcoming smartphones we’ve designed in a dual microphone, one for sound recording and the other for filtering the background noise. In the dual camera space, as distinct from the existing front camera, the light rear camera consists in fact two cameras, so as to achieve a 3D effect shooting.”

Outside of research and innovation, during the manufacturing process, WingTech is also vigorously promoting technological innovation, introducing more robots and constantly increasing automation. Automation can not only rapidly increase productivity, but also can help with the stability of product quality. “Product testing was done by manual inspection in the past, only one at a time, and now with automated tools, we can have a simultaneous inspection, measuring eight mobile phones at once” – young workers of the company are saying.

Meanwhile, thanks to the technology innovation, there are cost savings to the WingTech. “Circuit boards used to have a border. Now with a free border process, as long as the increase in the tray, the circuit board does not require a border.” For businesses less materials, for society reduced energy consumption and reduced waste generation.

“Last year we had less than 2000 people working for us, of which 500 were short-term employed, but at full horsepower we may take up to 3000 employees.” Xiao Xuebing told reporters that: “In March this year, the unit sales of cell phones would reach 3 million units and sales volume will reach 500 million yuan [$81M]. WingTech Communications’ annual target for the year 2013 is to exceed unit sales of 40 million and the value of production to be over 4 billion yuan [$649M], up to 6 billion yuan [$973M].”

Automation was indeed a primary direction when moving to the smartphone production, as evidenced by Wingtech Chooses LitePoint IQ2010 to Calibrate and Test Smartphones [LitePoint press release, Feb 5, 2013]

/PRNewswire/ — LitePoint( http://www.litepoint.com )(R) announced today that Wingtech Electronics Tech( http://www.wingtech.com/EngLish ), one of China’s leading providers of mobile phone design and manufacturing services, has chosen LitePoint’s IQ2010 for production calibration and verification of Wi-Fi and Bluetooth functionality in its new line of smartphones.
With the surge in the use of high-end smartphones and the increasing complexity of technology built into these devices, Wi-Fi testing is expected—and often mandated by the cellular service provider. Being at the forefront of smartphone design and development, Wingtech recognized the need for a fast, accurate and cost-effective production test solution. YeHua, Director of Research and Development at Wingtech, said, “We looked into a variety of solutions to test our products and chose the IQ2010 because of the system’s overall performance, as well as the confidence we have in LitePoint as a total solution provider. The IQ2010 addresses our need for a high-quality, turn-key test solution, so it was the obvious choice for us.”
Manufacturing cost-effective mobile devices requires a comprehensive wireless test solution that provides complete functional verification while maximizing unit throughput—the deployment of which typically occurs under intense time-to-market pressure. “Cost considerations in setting up a production line, coupled with demanding quality assurance requirements, mandate high-speed wireless test without sacrificing test coverage,” said Gary Wang, general manager of LitePoint, China. “The IQ2010 is well suited for the growing China smartphone market and designed to meet rigorous production test requirements while optimizing the total cost of ownership.”
Availability
LitePoint’s IQ2010 solution is available today.
About Wingtech
Wingtech ( http://www.wingtech.com/EngLish ) is a new technology enterprise group in the China wireless network communication market that provides mobile phone design services, manufacturing services and value-added services based on wireless terminal series. Wingtech is mainly dedicated to product customization, research and development, production and sales of wireless terminals. It also focuses on providing solutions using new business models with vertical integration of cell phone design and manufacturing of integrated terminal, brand, mobile Internet solutions for the Internet of things.
About LitePoint
LitePoint( http://www.litepoint.com ), a wholly owned subsidiary of Teradyne, Inc.(http://www.teradyne.com ) (TER), is based in Sunnyvale, California. The company designs, develops and supports advanced wireless test solutions( http://www.litepoint.com/Solutions.html ) for developers of wireless devices and consumer electronics, contract manufacturers and wireless integrated circuit designers. LitePoint solutions( http://www.litepoint.com/Solutions.html ) have enabled optimization and verification of the operation of more than one billion wireless devices worldwide. LitePoint products( http://www.litepoint.com/Products.html ) are used in development and high-volume manufacturing, providing its customers with improved ROI, time-to-market, manufacturing yields, and product quality. For more, go to www.litepoint.com.

Previously WingTech was supported by the state and party to becomer the largest feature phone maker in China, as evidenced by: Party Secretary and Chief Executive of Huangpu District in Shanghai Zhou Wei Inspected Industrialized Base for Wingtech Cell Phones [WingTech press release]

On June 18, 2009, accompanied by … <a long list of people> … Zhou Wei, deputy party secretary and chief executive of Huangpu District paid a visit to the industrialized base for Wingtech cell phones.
Zhou Wei and his companions toured the showroom, test room and production lines of Wenxun and Wendi. After that, the leaders and Zhang Xuezheng, the CSO of Wingtech Group, held a symposium, where Mr. Zhang reported in details the company’s history and achievements since its establishment, and current situations.
Zhou Wei, deputy party secretary and chief executive of Huangpu District, said that it was not easy for Wingtech to be developed into the largest cell phone maker in China within less than two years. As a leading enterprise in the communication industry, Wingtech has made its great contributions in terms of fiscal revenue, personnel introduction, protection of intellectual property rights and technological innovation. He also added that the District Government of Huangpu should pay closer attentions on caring about and supporting high-tech groups like Wingtech so as to support its sustainable development.
With regards to patent application and protection, leaders from the Science Committee of Huangpu District expressed that more supports would be provided to enterprise like Wingtech in protecting the intellectual property rights, and the smooth transfer should be ensured in executing the policies of the state, municipality and the district and the enterprise, so as to promote Wingtech to make new progresses in technological innovation and application and protection of intellectual property rights.
With respect to finance and taxes, the leader from the Finance Bureau of Huangpu said special funds invested in Wingtech would increase and preferential tax policies supporting Wingtech and other high-tech enterprises be implemented so as to reduce their burdens and enhance their strength for development.
For the issue of personnel indraught, the leaders concerned expressed that Shanghai may need a large number of highly qualified personnel in the field of communication to satisfy the economic development, whereas Wingtech, as a leading enterprise in the sector, can serve as a cradle to attract and foster the communication personnel. In order to support enterprises like Wingtech to attract and retain personnel, the government of Huangpu District will further study and discuss such matters as household registration policies, individual income tax and education of children so as to figure out a practical preference scheme as soon as possible. In addition, as Wingtech Group develops rapidly, its office space becomes over crowded due to the suddenly increased number of personnel. Leaders from Huangpu said they would solve this issue as soon as possible.
During the meeting, Zhou Wei, the deputy secretary and chief executive of Huangpu District, presented on behalf of Huangpu District Government a gift—Hangguang Porcelain to Wingtech Group. The gift indicates that Wingtech Group could develop stably, maintain its foundation permanently and make innovations and breakthroughs continuously so as to be the model enterprise in the communication industry in both China and the world.

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More information of the above kind is in the Wingtech Group honored with “outstanding performance prize of China mobile phone industry 2010 [press release, Dec 21, 2010]

The still old company profile About Wingtech [闻泰] Group [集团] [LinkedIn, originally created on July 23, 2009], the corrections in square brackets are from the WingTech profile page in Chinese (http://www.wingtech.com/Chinese/Company-Content-ID-8.html) in the hope that it contains later information

As a high-tech company, Wingtech Group mainly provides clients with the integrated cell phones program design, production, and wireless terminal-based value-added service, and is committed to the customized service, R&D, production, sales, after-sales service of wireless terminal products.

Founded in 2006, Wingtech Group consists of Shanghai R&D Center, Shenzhen Operation Center, and Jiaxing Production Center. Currently, Wingtech has a team of nearly 2000 [4000] employees. Its products cover PHS, GSM(GPRS), CDMA(1X), EDGE, TD-SCDMA[, EVDO] and all handheld device series ranging from 2G to 4G, with an annual turnover of hundreds of millions of US dollars.

Since its foundation, Wingtech has always persisted in the independent technical innovation, and make a lot of efforts in development and application of new technology of wireless communication. So far, Wingtech has owned nearly one thousand technical patents, a number of the world leading technologies, and is increasing 500 patents every year. Meanwhile, Wingtech has been in possession of perfect sales networks and under total process control systems (ISO9001:2000, ISO14001, QC080000).

Wingtech puts focus on local strengths while eyeing the world. Due to strong innovation, reliable quality, and high cost performance, Wingtech products have been very popular with customers at home and abroad. Currently, Wingtech products have been exported to over 30 countries, and over 50 [80] million consumers around the world are enjoying happy wireless mobile experience through Wingtech products and services.

Website: http://www.wingtech.com

Industry: Telecommunications

Type: Privately Held

Company Size: 1001-5000 employees

The latest external to China (actually for India) Overview [Callbar, July 15, 2011]

Callbar is a world leading mobile phone brand owned by WINGTECH GROUP LIMITED. Registered in HK with operation center in Shenzhen, manufacture base in Jiaxing and R&D center in Shanghai & Xi’an, we directly or indirectly employ over 4,000 people in China and other countries worldwide. Since establishment in 2006, we’ve evolved into a leading ODM supplier serving customers including MOTOROLA, LG, Philips and HUAWEI. In last 2 years we successfully extended our business into Wireless Terminal Internet Service and international distribution with our own brand WING. Our annual turnover reached USD 600million in 2009. Consumers around the world are enjoying Callbar mobile phones which features innovation, quality and cost effectiveness.

Better Quality, Better Price.

And the latest external to China milestone descriptions (actually for India):
History [Callbar, July 15, 2011]

2006 Y
In 2006,Wingtech Telecom was registered in Hong Kong and marched into cell phone PCBA industrial.
2007 Y
In May 2007, Zhejiang Communication Industry (Jiaxing) Base and Wingtech Cell Phone Industrialization Base started to be built.
In May 2007, Wingtech Telecom cooperated with SpreadTrum in the field of 3G industry in order to promote the development of 3G industry
In November 2007, Wingtech Telecom joined TD-SCDMA industry alliance, focusing on development and application of TD technique.
In December 2007, Wingtech Telecom sold 20 million sets of cell phones in total, which made Wingtech to be NO.1 of iSuppli.
2008 Y
In April 2008, Wingtech Telecom ranked the top one in the Chinese IDH industry.
In April 2008, Wingtech and Indian famous cell phone company-FRIWO cooperated to establish a mobile terminal product showroom in New Delhi, which is a totally new mode of cooperation between China and India.
In November 2008, Wingtech held the “Wireless Communication New Tech Summit”.
In November 2008, Zhejiang Communication Industry (Jiaxing) Base and the Wingtech Cell Phone Industrialization Base were put into production.
2009 Y
In March 2009, Wingtech and China Telecommunication Technology Labs entered into the cooperative agreement to establish the strategic cooperative relationship.
In May 2009, Xi’an R&D centre established, which further enhances Wingtech telecom R&D capability.
2011 Y
Wingtech launches its Callbar brand strategy all over the world so as to make more people to be serviced by Wingtech.

While the latest external to China (actually for India) Structure [Callbar, July 15, 2011], with geographical inserts added as required

Shanghai R&D centre
Shanghai R&D Center has a team of over one thousand R&D staff members, with R&D achievement covering the whole series of mobile terminal products of GSM, CDMA, EDGE, TD-SCDMA, EVDO etc, ranging from 2G to 3G. So far, the R&D Center has owned nearly one thousand national patents.
With strong R&D strength and firm technical foundation, the R&D Center has been rewarded many titles by Shanghai Government.Meanwhile, Wingtech joins the TD-SCDMA industrial alliance to actively conduct the R&D and application of TD products so as to speed up the Chinese industrialization.
Jiaxing production centre
In addition to the cell phone design service, Wingtech can provide customers with the high-efficiency and high-quality production service.Wingtech invested $70 million in building a cell phone industrial base of over 140 000 square meters in Jiaxing,in which Wingtech produces mobile phones of first class for world famous brands.
Wingtech Cell Phone Industrial Base has given an impetus to the development of the local communications industry.  And with this impetus, a world-class cell phone industrial cluster with an output of more than 30,000,000 sets, and an annual turnover of RMB 10 billion formed around this Cell Phone Industrial Base.
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More information: Jiaxing [Wikipedia article]
Shenzhen operation centre
To better serve market and customers, Wingtech Telecom establishes the Operation Center in Shenzhen which is responsible for the procurement, sales and technical support. And with the help of its reliable supply chain system, professional marketing team, the world-class ERP and logistics guarantee system, Shenzhen Operation Centre provides first class service to our local and worldwide customers.
At present, over 70 million consumers around the world are enjoying happy wireless mobile experience through Wingtech products and services.
Xi’an R&D Centre
Founded in 2009, Xi’an R&D Centre is a wholly-owned subsidiary of Wingtech Group. It is mainly engaged in R&D and application of wireless communication new technology for providing 2G-4G GSM, CDMA and TD-SCDMA full system mobile terminal devices.
Xi’an Wingtech enjoys an internationally top grade R&D team and powerful R&D capacity. Among the over 100 R&D engineers, above 60% of them are doctoral degree holders and master degree holders. As for quality control, Xi’an Wingtech has introduced whole process quality control system (ISO9001:200, ISO14001, QC080000), and performs Six Sigma Management following quality control standards of internationally top grade enterprises for developing and providing stable and reliable products to customers.
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Xi’an is on the far left of this map, Jiaxing and Shanghai are on the far right
More information: Xi’an [Wikipedia article]

Note that in Xi’an another cellphone industrial cluster has been created, as evidenced by World’s biggest wireless semiconductor producer establishes branch in N.W China city [Xinhua, Dec 23, 2011] news article

Qualcomm, the world’s largest wireless semiconductor company, has announced it will set up a branch in Xi’an, capital of northwest Shaanxi province, according to the management committee of the city’s high-tech area on Friday.
In the past years, the U.S.-based global leader in 3G and next generation wireless telecommunication technologies has established cooperative relationships with Chinese counterparts such as Huawei, ZTE, Yulong Coolpad and Wingtech.
Qualcomm’s branch in Xi’an is a strategic option and also a good beginning, said Zhao Hongzhuan, director of the Xi’an high-tech area management committee, adding that the area will provide “big support and quality service” to Qualcomm, and said he hopes the company will expand its investment in Xi’an.
China has already become one of the fastest growing markets for Qualcomm, said Wang Xiang, president of Qualcomm greater China. “Qualcomm decided to set up its branch in Xi’an because of the city’s complete industrial chain, strong technical strengths and rich talent,” Wang said.
Qualcomm entered the Chinese market in the late 1990s and already has branches in Beijing, Shanghai and Shenzhen.

Note as well that Wingtech’s engagement with Spreadtrum goes much older:
Spreadtrum and WingTech Enter Strategic Partnership [joint press release, April 24, 2008]

JIAXING, China, April 24 /Xinhua-PRNewswire-FirstCall/ — Spreadtrum Communications, Inc. (Nasdaq: SPRD), one of China’s leading wireless baseband chipset providers, today announced during the “International Handset Supply Chain Summit 2008” that Spreadtrum and WingTech Group have entered into a strategic partnership aimed at leveraging their respective leading edge chip and handset design technologies. This two-day summit, sponsored by Jiaxing Communication Industry Association and organized by WingTech Communication Science and Technology Co. Ltd., promotes the theme of “Developing hand in hand for mutual benefits in the future.”
The announced Spreadtrum-WingTech partnership is expected to benefit both companies and their customers as it is intended to capitalize on Spreadtrum’s technology expertise in developing chipsets and WingTech’s strengths in handset design for the industry. With the establishment of this new strategic partnership, WingTech will deploy Spreadtrum’s SC6600W chip in its handsets. The SC6600W is a single chip quad-band GSM/GPRS multimedia baseband intended for WingTech handsets targeted at feature rich entry-level phones that include features such as MP3 playback, stereo output, voice recording, and Bluetooth interface for wireless data transmissions. Like Spreadtrum’s other highly integrated basebands, the SC6600W features an integrated multimedia processor and built-in power management circuits on a single chip, which should reduce production costs, while enabling customers such as WingTech to develop new, differentiated products within a quick time-to-market threshold.
Referring to this strategic partnership, president of WingTech Group, Zhang Xueying said, “WingTech and Spreadtrum have a long history of close and steady partnership. Spreadtrum’s advanced technologies and products are one of the important factors that account for WingTech’s rapid growth. By entering this partnership, we believe we will be in the best possible position to win additional market share through use of the customized SC6600W chip, since it may greatly reduce the time-to-market and overall cost while improving core competitiveness of our products. This announcement further strengthens the strategic alliance between our two companies, but also starts a new mode of business collaboration in the industry to push the differentiation of the terminal products. WingTech will commit itself to unite all the segments in the industry to develop hand in hand for mutual benefits in the future.”
Dr. Ping Wu, President and CEO of Spreadtrum, expressed, “By establishing this strategic partnership, we hope to expand and deepen the cooperation with WingTech in technology, marketing and other aspects to further expand our markets and accelerate our respective technology innovation. We believe that closer cooperation between the handset design solution provider and chip designer will be in everyone’s interest to further improve the features and diversity of future handset products. We look forward to a sustained, close partnership with WingTech and to driving a new round of development in China’s communication industry.”
About Spreadtrum:
Spreadtrum Communications, Inc. (Nasdaq: SPRD; “Spreadtrum”) is a fabless semiconductor company that designs, develops, and markets baseband processor solutions for the mobile wireless communications market. Spreadtrum combines its semiconductor design expertise with its software development capabilities to deliver highly-integrated baseband processors with multimedia functionality and power management. Spreadtrum has developed its solutions based on an open development platform, enabling its customers to develop customized wireless products that are feature-rich and meet their cost and time-to-market requirements.
For more information, please check: http://www.spreadtrum.com
About WingTech:
WingTech group was founded in Hong Kong at the end of 2005 and ever since then, it has been devoting to R&D, manufacturing and marketing of mobile terminals. The main business scope includes complete design solution for mobile phones and value-added services based on mobile terminals. With technological strength and excellent products, after only two years from its establishment, WingTech has risen to be one of the top Chinese mobile companies

Meanwhile WingTech has well established itself in India:
– originally as a feature phone ODM for a number of leading local brands in India, as evidenced by: Wingtech Group [microsite on Importers.com, May 31, 2010]:

Company already designing mobiles for Lava, Karbon, Spice, Intex, Videocon, Micromax, G-five. Now plannig to launch their own brand”WING”. Looking for importers.

– in addition indeed introducing its first own brand, WING in 2010, as evidenced by the History page of a separate http://www.wingtele.com/ site
– then by the already referenced Callbar brand a year later, as evidenced by another separate site http://www.callbar.in
– then becoming available under the Wingtech brand itself, evidenced by Wingtech Mobile Phones in India [Sulekha.com] microsite


Background: MediaTek: Ready For Prime Time [stock analysis report from Maybank, April 25, 2013]

With smartphones hitting the mainstream market, the replacement cycle for feature phones seems to be accelerating and tablet adoption in the emerging markets (in particular China) is gathering momentum. Against this backdrop, we think MTK may have to raise its target unit shipments of 400-450m smartphones and 100m tablets for 2013.

Best positioned to benefit from new secular trend. MTK is stepping up efforts to diversify its product portfolio to capture the proliferation of smart devices. It will have all its application processors (APs) on 28nm node this year, with designs based on the latest Cortex-A7 and/or Cortex-A15. By mid-year, it will introduce several low-cost models (MT6572/6582/6589M) to consolidate its position in the white-box market and enhance its cost structure. Also, MTK will foray into tablet markets (MT8389/8135 [big.Little design]), a new addressable market. By 4Q13, it will sample its high-end 4G/LTE/LTE-TDSCDMA modem chipset. Importantly, the ongoing consolidation of the AP industry and recent hiring of high-profile executives from Qualcomm could spur MTK to become a major force in the global smart device industry.

We note that MTK’s shipments include the white-box market, which is not captured by third-party research firms such as IDC. As such, analysing the change in MTK’s handset types may offer a clue to the dynamics of the handset industry, especially in the global emerging markets. We estimate MTK may ship close to 90m smartphones in 1H13 and its full-year target of 200m units (400-450m for global emerging markets) thus seems too conservative to us. An official upgrade in shipment per se and industry revisions should be expected. We currently forecast MTK to ship 235-240m smartphones in 2013. Back in November last year, our industry forecast of 500-550m unit shipments sounded aggressive, but now, it might look realistic given the speed of the replacement cycle and the popularity of smartphones in the global emerging countries.

Best positioned to benefit from new secular trend. MTK is stepping up efforts to diversify its product portfolio to capture the proliferation of smart devices. It will have all its APs on 28nm node this year, with designs based on the latest CortexA7 and/or Cortex-A15. In this section, we provide an update on MTK’s new products and compare them to some of the solutions offered by its peers. Figures 7-8 illustrate the timeline of product introduction and specifications.

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  1. MT6572 enters mass production in 2Q13 with the first shipment expected between late-May and June. MT6572 (dual-core, Cortex A7) is designed to replace MT6515 (single-core, Cortex A9) with significant cost savings and battery life enhancement. The die size of MT6572 is significantly smaller (than MT6515) and this AP comes with an integrated WiFi chipset – the first for MTK. Coupled with 28nm node and requiring only four layers of PCB board, we believe MT6572 offers significant cost savings for handset OEMs. MT6572 will also be a significant volume runner for MTK as it comes with various connectivity such as MT6572E (for 2.75G), MT6572T (TD-SCDMA) and MT6572W (WCDMA). The W-version targets smartphones with ASP of CNY1,000 (USD160) while the E-and-T-versions will go well-below CNY1,000 (USD100-125), and both should be well-received by the white-box market. We believe MT6572T can hold its own against Spreadtrum’s latest SC8825 (dual-core Cortex A5, TD-SCDMA on 40nm node and without integrated WiFi).
  2. The MT6582 has features similar to those of the MT6572 but the former comes with Quad-core, Cortex A7 engines as opposed to the latter’s dualcore engine. Like the MT6572, MT6582 targets the white-box market for better system performance. We expect volume shipments to commence in 3Q13. We believe the MT6582W will compete well with Qualcomm’s MSM8225Q, the low-end Quad-core Cortex A5 AP which only supports WCDMA networks.
  3. MT6589M is a cost-down version of the currently leading quad-core MT6589, which began shipment in March and has found favour among OEM customers (60-70 clients) in China. MT6589M shares most of the features and design architecture of MT6589. But it comes with HD and 8MP camera compared with full HD and 13MP camera for the latter. In addition, we estimate MTK could achieve 15-20% cost savings on MT6589M by tweaking some foundry and back-end processes. As such, MT6589M offers a lower cost solution for handset OEMs who do not wish to equip their smartphones with similar high-end features as MT6589. With a lower ASP, MTK could narrow the price gap between MT6589M and Qualcomm’s MSM8225Q by 10-15% and yet offer better features. We estimate the price gap between MT6589 and MSM8225Q currently is at least 30-40%. That being said, we note that MSM8225Q is a quad-core using Cortex A5 and 40nm node, and does not support TD-SCDMA network.

China: Entry-level dual core IPS WVGA (480×800) smartphones $65+ now, quad-core $70+ in June

China market: Qualcomm, Spreadtrum cutting quad-core processor prices [DIGITIMES, April 25, 2013]

Qualcomm and Spreadtrum Communications have both cut prices for their quad-core products to better compete against MediaTek, which controls half of the smartphone-chip market in China, according to industry sources.

Qualcomm recently quoted its quad-core solutions at less than US$10, slightly cheaper than MediaTek’s offerings, the sources indicated. Meanwhile, Spreadtrum has lowered its quad-core processor prices to similar levels. Both firms are trying to gain market share through aggressive pricing, the sources said.

Monthly shipments of MediaTek’s smartphone chips have topped 15 million units recently, and even approached the 20 million level, the sources revealed. The booming shipments already lifted MediaTek’s share of China’s smartphone-IC market to 50%, the sources said.

MediaTek’s quad-core solutions reportedly have attracted orders from Coolpad, Huawei, Lenovo and ZTE.

In other news, MediaTek has reported higher-than-expected sales for the first quarter of 2013. The firm has scheduled an investors meeting on May 6 to discuss its performance in the first quarter, and business outlook.

Remark: the inserted slides are from 1Q13 Investor Roadshow Presentation [Feb 26, 2013] from Spreadtrum

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And as $48 Mogu M0 “peoplephone”, i.e. an Android smartphone for everybody to hit the Chinese market on November 15 [Nov 9, 2012]
now Mogu S2 went on sale today [China Smartphones, April 22, 2013]

A leader in the production of super cheap smart phones, the Chinese company Mogu, today held a preliminary sales of its new budget smartphone Mogu S2. The official price of the unit is 399 yuan, or about $65. Today, the sale was put on a limited batch of 5000 smartphones at the price of 299 yuan ($48).

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Mogu S2 is running the 2-core processor with a clock speed of 1.2 Ghz, and used 4-inch screen with a resolution of WVGA [480×800] to display the information. In addition there is 512 MB RAM, 4GB of ROM and a 5-megapixel camera. A nice addition is its support for two SIM cards, modules, WIFI, Bluetooth, and GPS. The operating system is installed MOGO OS (Android 2.3 Gingerbread).

Additional key information from the company’s product page [MOGU蘑菇手机, April 20, 2013]: i.e. IPS display and the Spreadtrum SC8825 or SC6825 SoC

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We’ve seen the effect of the earlier SC6820 SoC leading to Temporary Nokia setback in India [‘Experiencing the Cloud’, April 28, 2013]. This is how Spreadtrum presented this situtation recently:

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The two new SoCs are the same to the maximum as SC8825 has only the following additional functionality:

TD-SCDMA standards (3GPP R7), 2010~2025MHz / 1880~1920MHz/2300~2400MHz

and prospects for that additional functionality (internal to China) were presented as exceptionally bright by the company: 

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Spreadtrum Announces Commercial Launch of Dual-Core Smartphone Chipsets for TD-SCDMA and EDGE [press release, April 2, 2013]

SC8825 (TD-SCDMA) and SC6825 (EDGE) set new standard for dual-core smartphone chipset cost and performance with high level of integration, standout graphics performance and best-in-class TD-SCDMA technology
Spreadtrum Communications, Inc. (NASDAQ: SPRD; “Spreadtrum” or the “Company”), a leading fabless semiconductor provider inChina with advanced technology in 2G, 3G and 4G wireless communications standards, today announced the commercial availability of its dual-core 1.2GHz smartphone chipsets for TD-SCDMA (SC8825) and EDGE (SC6825), following the successful qualification of its platform by China Mobile.
“With our new dual-core chipsets, Spreadtrum has leveraged our expertise in system design to deliver the lowest-cost dual-core platform in combination with high end graphics performance for the TD-SCDMA and EDGE markets,” said Dr. Leo Li, chairman and CEO of Spreadtrum. “This combination of low-cost architecture, standout graphics performance, and best-in-class TD-SCDMA technology provides smartphone designers with unprecedented value in bringing high end features to low-cost devices.”
Spreadtrum’s SC8825, which supports dual-mode TD-SCDMA/HSPA & EDGE/GPRS/GSM and the SC6825, which supports EDGE/GPRS/GSM, are based on a highly efficient multi-core architecture delivering the lowest cost platform available for dual-core TD-SCDMA and EDGE smartphone products. The single-chip chipsets integrate a dual-core 1.2GHz Cortex-A5 core processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators for differentiated performance and user experience. Both chipsets are further paired with a single-chip mutimode RF transceiver for a high level of integration and are pin-to-pin compatible, enabling handset makers to leverage a common handset development effort for products shipping to China as well as to emerging markets.
In addition to their high level of integration and low-cost architecture, Spreadtrum’s chipsets further deliver standout graphics performance. The solutions’ powerful graphics processing capability enhances the user experience for games and other graphics-rich applications, and enables Spreadtrum to bring high end features such as the larger screen sizes more commonly found in premium smartphones to low-cost devices.
“The benchmark results we are achieving for our dual-core solution, measured by popular benchmark programs such as AnTuTu and GLBenchmark 2.5, significantly outperform other commercial dual-core products,” added Dr. Li. “This powerful processing capability provides our customers with an even more cost-effective and power-efficient way to deliver high end features in low-cost smartphones.”
Other features of Spreadtrum’s SC8825 and SC6825 chipsets include support for HD 1280×720 LCD display, H.264 720p video playback, up to 8 megapixel RGB camera and dual-SIM, dual-standby capability. The chipsets ship with turnkey Android and systems software, reducing the engineering time and resources required by handset makers to bring devices to market, with reference implementations available for both 4-layer and 6-layer PCB layouts.
The SC8825 and SC6825 are commercially available now. The chipsets have already been incorporated by leading China handset makers into smartphone models that are expected to ship commercially during 2Q 2013.
About Spreadtrum Communications, Inc.
Spreadtrum Communications, Inc. (NASDAQ:SPRD; “Spreadtrum”) is a fabless semiconductor company that develops mobile chipset platforms for smartphones, feature phones and other consumer electronics products, supporting 2G, 3G and 4G wireless communications standards. Spreadtrum’s solutions combine its highly integrated, power-efficient chipsets with customizable software and reference designs in a complete turnkey platform, enabling customers to achieve faster design cycles with a lower development cost. Spreadtrum’s customers include global and China-based manufacturers developing mobile products for consumers in China and emerging markets around the world. For more information, visit www.spreadtrum.com.

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SC8825 TD-HSPA+/TD-SCDMA/GSM/GPRS/EDGE Baseband Chip [product site, April 2, 2013]

Spreadtrum’s SC8825 is a highly integrated mixed signal baseband processor for dual-mode TD-SCDMA/HSDPA/HSUPA/HSPA+ and GSM/GPRS/EDGE applications. SC8825 integrates a dual-core 1.2GHz ARM Cortex-A5 processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators in a highly efficient system architecture that brings differentiated performance and user experience to low-cost smartphones. SC8825 is coupled with Spreadtrum’s single-chip tri-band TD-SCDMA/quad-band EDGE/GPRS/GSM RF transceiver for small footprint, and ships with turnkey Android systems software for rapid time to market and efficiency in handset design.

SC8825 Baseband Chip Diagram

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SC8825 Key Features

Core Description

  • ARM Cortex-A5 dual-core, clock speeds up to 1.2GHz
  • 32KB I-Cache, 32KB D-Cache
  • 32KB I-Cache, 32KB D-Cache
  • 128bit FP data path

Communication Features

  • GSM/GPRS/EDGE standards, GSM850/EGSM900/DCS1800/PCS1900
  • EGPRS Class 12
  • TD-SCDMA standards (3GPP R7), 2010~2025MHz / 1880~1920MHz/2300~2400MHz
  • HR, FR, EFR, AMR-NB
  • HSPA+ 4.2 Mbps,HSUPA 2.2 Mbps

Multimedia Support For

  • Mali 400 GPU MP2, 40MTri/s, 700Mpix/s, OpenGL ES 1.1/2.0
  • Decoder: MPEG4/H.263 720p@30fps; H.264 720p@30fps ; VP8 720p@30fps
  • Encoder:H.263/H.264/MPEG4 D1@30fps
  • Video Streaming: MPEG4/H.263/H.264 720p@30fps
  • 3G-324M Video Telephony
  • 8 MP Camera Sub-system JPEG decoder/encoder
  • Support MP3/AAC/AAC+/MIDI/AMR-NB/WAV format
  • Audio codec included

LCD Display Features

  • Support up to HD resolution
  • Built-in LCD Controller,touch panel controller
  • MIPI and RGB @60fps
  • Support OSD / Rotation / Scaling

Memory I/F Support For

  • NAND flash(8bit and 16 bit devices)
  • HW ECC, multi-bit ECC
  • 2G byte SDR/LPDDR1/LPDDR2 (16bit and 32bit devices)
  • eMMC(4.4.1) boot

Peripheral I/F Support For

  • HS USB 2.0
  • 4 x UART
  • 3 x SPI interface , 3-wire SPI,4-wire SPI, synchronous SPI
  • 4 x I2C interfaces
  • 2 x I2S and PCM interface
  • 3 x SDIO interfaces
  • 1 x eMMC interfaces
  • 2 x SIM/USIM interfaces
  • 4 x PWM outputs
  • ETM port
  • More than 100 GPIO pins
  • 8*8 keyboard interfaces

Other Features

  • Operating ambient temperature range: -45 to +95 degrees centigrade
  • 12.1mm×12.1mm 517-ball, 0.4mm ball pitch

SC6825 GSM/GPRS/EDGE Baseband Chip [product site, April 2, 2013]

Spreadtrum’s SC6825 is a highly integrated mixed signal baseband processor for GSM/GPRS/EDGE applications. SC6825 integrates a dual-core 1.2GHz ARM Cortex-A5 core processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators in a highly efficient system architecture that brings differentiated performance and user experience to low-cost smartphones. SC6825 is coupled with Spreadtrum’s single-chip quad-band EDGE/GPRS/GSM RF transceiver for small footprint, and ships with turnkey Android systems software for rapid time to market and efficiency in handset design.

SC6825 Baseband Chip Diagram

image

SC6825 Key Features

Core Description

  • ARM Cortex-A5 dual-core, clock speeds up to 1.2GHz
  • 32KB I-Cache, 32KB D-Cache
  • 256KB L2 Cache
  • 128bit FP data path

Communication Features

  • GSM/GPRS/EDGE standards, GSM850/EGSM900/DCS1800/PCS1900
  • EGPRS Class 12
  • HR, FR, EFR, AMR-NB

Multimedia Support For

  • Mali 400 GPU MP2, 40MTri/s, 700Mpix/s, OpenGL ES 1.1/2.0
  • Decoder:MPEG4/H.263 720p@30fps; H.264 720p@30fps ; VP8 720p@30fps
  • Encoder:H.263/H.264/MPEG4 D1@30fps
  • Video Streaming: MPEG4/H.263/H.264 720p@30fps
  • 3G-324M Video Telephony
  • 8 MP Camera Sub-system JPEG decoder/encoder
  • Support MP3/AAC/AAC+/MIDI/AMR-NB/WAV format
  • Audio codec included

LCD Display Features

  • Support up to HD resolution
  • Built-in LCD Controller,touch panel controller
  • MIPI and RGB @60fps
  • Support OSD / Rotation / Scaling

Memory I/F Support For

  • NAND flash(8bit and 16 bit devices)
  • HW ECC, multi-bit ECC
  • 2G byte SDR/LPDDR1/LPDDR2 (16bit and 32bit devices)
  • eMMC(4.4.1) boot

Peripheral I/F Support For

  • HS USB 2.0
  • 4 x UART
  • 3 x SPI interface , 3-wire SPI,4-wire SPI, synchronous SPI
  • 4 x I2C interfaces
  • 2 x I2S and PCM interface
  • 3 x SDIO interfaces
  • 1 x eMMC interfaces
  • 2 x SIM/USIM interfaces
  • 4 x PWM outputs
  • ETM port
  • More than 100 GPIO pins
  • 8*8 keyboard interfaces

Other Features

  • Operating ambient temperature range: -45 to +95 degrees centigrade
  • 12.1mm×12.1mm 517-ball, 0.4mm ball pitch

Software defined server without Microsoft: HP Moonshot

Updates as of Dec 6, 2013 (8 months after the original post):

image

Martin Fink, CTO and Director of HP Labs, Hewlett-Packard Company [Oct 29, 2013]:

This Cloud, Social, Big Data and Mobile we are referring to as this “New Style of IT” [when talking about the slide shown above]

Through the Telescope: 3 Minutes on HP Moonshot [HewlettPackardVideos YouTube channel, July 24, 2013]

Steven Hagler (Senior Director, HP Americas Moonshot) provides insight on Moonshot, why it’s right for the market, and what it means for your business. http://hp.com/go/moonshot

HIGHLY RECOMMENDED READING:
HP Offers Exclusive Peek Inside Impending Moonshot Servers [Enterprise Tech, Nov 26, 2013]: “The company is getting ready to launch a bunch of new server nodes for Moonshot in a few weeks”.
– So far, the most simple and understandable info is serviced in Visual Configuration Moonshot diagram set: http://www.goldeneggs.fi/documents/GE-HP-MOONSHOT-A.pdf  This site includes also full visualisation for all x86 rack, desktop and blade servers.

From HP Launches Investment Solutions to Ease Organizations’ Transitions to “New Style of IT” [press release, Dec 6, 2013]

The HP accelerated migration program for cloud—helps …

The HP Pre-Provisioning Solution—lets …

New investment solutions for HP Moonshot servers and HP Converged Systems—provide customers and channel partners with quick access to the latest HP products through a simple, scalable and predictable monthly payment that aligns technology and financial requirements to business needs.   

Access the world’s first software defined server [HP offering, Nov 27, 2013]
With predictable and scalable monthly payments

HP Moonshot Financing
Cloud, Mobility, Security and Big Data require a different level of technology efficiency and scalability. Traditional systems may no longer be able to handle the increasing internet workloads with optimal performance. Having and investment strategy that gives you access to newer technology such as HP Moonshot allows you to meet the requirements for the New Style of IT.
A simple and flexible payment structure can help you access the latest technology on your terms.
Why leverage a predictable monthly payment?
• Provides financial flexibility to scale up your business
• May help mitigate the financial risk of your IT transformation
Enables IT refresh cycles to keep up with latest technology
• May help improve your cash flow
• Offers predictable monthly payments which can help you stay within budget
How does it work?
• Talk to your HP Sales Rep about acquiring HP Moonshot using a predictable monthly payment
Expand your capacity easily with a simple add-on payment
• Add spare capacity needed for even greater agility
• Set your payment terms based on your business needs
• After an agreed term, you’ll be able to refresh your technology

From The HP Moonshot team provides answers to your questions about the datacenter of the future [The HP Blog Hub, as of Aug 29, 2013]

Q: WHAT IS THE FUNDAMENTAL IDEA BEHIND THE HP MOONSHOT SYSTEM?

A: The idea is simple—use energy-efficient CPU’s attuned to a particular application to achieve radical power, space and cost savings. Stated another way; creating software defined servers for specific applications that run at scale.

Q: WHAT IS INNOVATIVE ABOUT THE HP MOONSHOT ARCHITECTURE?

A: The most innovative characteristic of HP Moonshot is the architecture. Everything that is a common resource in a traditional server has been converged into the chassis. The power, cooling, management, fabric, switches and uplinks are all shared across 45 hot-pluggable cartridges in a 4.3U chassis.

Q: EXPLAIN WHAT IS MEANT BY “SOFTWARE DEFINED” SERVER

A: Software defined servers achieve optimal useful work per watt by specializing for a given workload: matching a software application with available technology that can provide the most optimal performance. For example, the firstMoonshot server is tuned for the web front end LAMP (Linux/Apache/MySQL/PHP) stack. In the most extreme case of a future FPGA (Field Programmable Gate Array) cartridge, the hardware truly reflects the exact algorithm required.

Q: DESCRIBE THE FABRIC THAT HAS BEEN INTEGRATED INTO THE CHASSIS

A: The HP Moonshot 1500 Chassis has been built for future SOC designs that will require a range of network capabilities including cartridge to cartridge interconnect. Additionally, different workloads will have a range of storage needs. 

There are four separate and independent fabrics that support a range of current and future capabilities; 8 lanes of Ethernet; storage fabric (6Gb SATA) that enable shared storage amongst cartridges or storage expansion to a single cartridge; a dedicated iLO management network to manage all the servers as one; a cluster fabric with point to point connectivity and low latency interconnect between servers.

image

Martin Fink, CTO and Director of HP Labs, Hewlett-Packard Company [Oct 29, 2013]:

We’ve actually announced three ARM-based cartridges. These are available in our Discovery Labs now, and they’ll be shipping next year with new processor technology. [When talking about the slide shown above.]

Calxeda Midway in HP Moonshot [Janet Bartleson YouTube channel, Oct 28, 2013]

HP’s Paul Santeler encourages you to test Calxeda’s Midway-based Moonshot server cartridges in the HP Discovery Labs. http://www.hp.com/go/moonshot http://www.calxeda.com

Details about the latest and future Calxeda SoCs see in the closing part of this Dec 7 update

@SC13: HP Moonshot ProLiant m800 Server Cartridge with Texas Instruments [Janet Bartleson YouTube channel, Nov 26, 2013]

@SC13, Texas Instruments’ Arnon Friedmann shows the HP ProLiant m800 Server Cartridge with 4 66K2H12 Keystone II SoCs each with 4 ARM Cortex A15 cores and 8 C66x DSP cores–alltogether providing 500 gigaflops of DSP performance and 8Gigabytes of data on the server cartridge. It’s lower power, lower cost than traditional servers.

Details about the latest Texas Instruments DSP+ARM SoCs see after the Calxeda section in the closing part of this Dec 7 update

The New Style of IT & HP Moonshot: Keynote by HP’s Martin Fink at ARM TechCon ’13 [ARMflix YouTube channel, recorded on Oct 29, published on Nov 11, 2013]

Keynote Presentation: The New Style of IT Speaker: Martin Fink, CTO and Director of HP Labs, Hewlett-Packard Company It’s an exciting time to be in technology. The IT industry is at a major inflection point driven by four generation-defining trends: the cloud, social, Big Data, and mobile. These trends are forever changing how consumers and businesses communicate, collaborate, and access information. And to accommodate these changes, enterprises, governments and fast growing companies desperately need a “New Style of IT.” Shaping the future of IT starts with a radically different approach to how we think about compute — for example, in servers, HP has a game-changing new category that requires 80% less space, uses 89% less energy, costs 77% less–and is 97% less complex. There’s never been a better time to be part of the ecosystem and usher in the next-generation of innovation.

From Big Data and the future of computing – A conversation with John Sontag [HP Enterprise 20/20 Blog, October 28, 2013]

20/20 Team: Where is HP today in terms of helping everyone become a data scientist?
John Sontag: For that to happen we need a set of tools that allow us to be data scientists in more than the ad hoc way I just described. These tools should let us operate productively and repeatably, using vocabulary that we can share – so that each of us doesn’t have to learn the same lessons over and over again. Currently at HP, we’re building a software tool set that is helping people find value in the data they’re already surrounded by. We have HAVEn for data management, which includes the Vertica data store, and Autonomy for analysis. For enterprise security we have ArcSight and ThreatCentral. We have our work around StoreOnce to compress things, and Express Query to allow us to consume data in huge volumes. Then we have hardware initiatives like Moonshot, which is bringing different kinds of accelerators to bear so we can actually change how fast – and how effectively – we can chew on data.
20/20 Team: And how is HP Labs helping shape where we are going?
John Sontag: One thing we’re doing on the software front is creating new ways to interrogate data in real time through an interface that doesn’t require you to be a computer scientist.  We’re also looking at how we present the answers you get in a way that brings attention to the things you most need to be aware of. And then we’re thinking about how to let people who don’t have massive compute resources at their disposal also become data scientists.
20/20 Team: What’s the answer to that?
John Sontag: For that, we need to rethink the nature of the computer itself. If Moonshot is helping us make computers smaller and less energy-hungry, then our work on memristors will allow us to collapse the old processor/memory/storage hierarchy, and put processing right next to the data. Next, our work on photonics will help collapse the communication fabric and bring these very large scales into closer proximity. That lets us combine systems in new and interesting ways. And then we’re thinking about how to package these re-imagined computers into boxes of different sizes that match the needs of everyone from the individual to the massive, multinational entity. On top of all that, we need to reduce costs – if we tried to process all the data that we’re predicting we’ll want to at today’s prices, we’d collapse the world economy – and we need to think about how we secure and manage that data, and how we deliver algorithms that let us transform it fast enough so that you, your colleagues, and partners across the world can conduct experiments on this data literally as fast as we can think them up.
About John Sontag:
John Sontag is vice president and director of systems research at HP Labs. The systems research organization is responsible for research in memristor, photonics, physical and system architectures, storing data at high volume, velocity and variety, and operating systems. Together with HP business units and partners, the team reaches from basic research to advanced development of key technologies.
With more than 30 years of experience at HP in systems and operating system design and research, Sontag has had a variety of leadership roles in the development of HP-UX on PA-RISC and IPF, including 64-bit systems, support for multiple input/output systems, multi-system availability and Symmetric Multi-Processing scaling for OLTP and web servers.
Sontag received a bachelor of science degree in electrical engineering from Carnegie Mellon University.

Meet the Innovators [HewlettPackardVideos YouTube channel, May 23, 2013]

Meet those behind the innovative technology that is HP Project Moonshot http://www.hp.com/go/moonshot

From Meet the innovators behind the design and development of Project Moonshot [The HP Blog Hub, June 6, 2013]

This video introduces you to key HP team members who were part of the team that brings you the innovative technology that fundamentally changes how hyperscale servers are built and operated such as:
• Chandrakant Patel – HP Senior Fellow and HP Labs Chief Engineer
• Paul Santeler  – Senior Vice President and General Manager of the HyperScale Business Unit
• Kelly Pracht – Moonshot Hardware Platform Manager, HyperScale Business Unit
• Dwight Barron – HP Fellow, Chief Technologist, HyperScale Business Unit

From Six IT technologies to watch [HP Enterprise 20/20 Blog, Sept 5, 2013]

1. Software-defined everything
Over the last couple of years we have heard a lot about software defined networks (SDN) and more recently, software defined data center (SDDC). There are fundamentally two ways to implement a cloud. Either you take the approach of the major public cloud providers, combining low-cost skinless servers with commodity storage, linked through cheap networking. You establish racks and racks of them. It’s probably the cheapest solution, but you have to implement all the management and optimization yourself. You can use software tools to do so, but you will have to develop the policies, the workflows and the automation.
Alternatively you can use what is becoming known as “converged infrastructure,” a term originally coined by HP, but now used by all our competitors. Servers, storage and networking are integrated in a single rack, or a series of interconnected ones, and the management and orchestration software included in the offering, provides an optimal use of the environment. You get increased flexibility and are able to respond faster to requests and opportunities.
We all know that different workloads require different characteristics. Infrastructures are typically implemented using general purpose configurations that have been optimized to address a very large variety of workloads. So, they do an average job for each. What if we could change the configuration automatically whenever the workload changes to ensure optimal usage of the infrastructure for each workload? This is precisely the concept of software defined environments. Configurations are no longer stored in the hardware, but adapted as and when required. Obviously this requires more advanced software that is capable of reconfiguring the resources.
A software-defined data center is described as a data center where the infrastructure is virtualized and also delivered as a service. Control of the data center is automated by software – meaning hardware configuration is maintained through intelligent software systems. Three core components comprise the SDDC, server virtualization, network virtualization and storage virtualization. It remains to be said that some workloads still require physical systems (often referred to as bare metal), hence the importance of projects such as OpenStack’s Ironic which could be defined as a hypervisor for physical environments.

2. Specialized servers

As I mentioned, all workloads are not equal, but run on the same, general purpose servers (typically x86). What if we create servers that are optimized for specific workloads? In particular, when developing cloud environments delivering multi-tenant SaaS services, one could well envisage the use of servers specialized for a specific task, for example video manipulation, dynamic web service management. Developing efficient, low energy specialized servers that can be configured through software is what HP’s Project Moonshot is all about. Today, although still in its infancy, there is much more to come. Imagine about 45 server/storage cartridges linked through three fabrics (for networking, storage and high speed cartridge to cartridge interconnections), sharing common elements such as network controllers, management functions and power management. If you then build the cartridges using low energy servers, you reduce energy consumption by nearly 90%. If you build SaaS type environments, using multi-tenant application modules, do you still need virtualization? This simplifies the environment, reduces the cost of running it and optimizes the use of server technology for every workload.

Particularly for environments that constantly run certain types of workloads, such as analyzing social or sensor data, the use of specialized servers can make the difference. This is definitely an evolution to watch.

3. Photonics

Let’s now complement those specialized servers with photonic based connections enabling flat, hyper-efficient networks boosting bandwidth, and we have an environment that is optimized to deliver the complex tasks of analyzing and acting upon signals provided by the environment in its largest sense.

But technology is going even further. I talked about the three fabrics, over time; why not use photonics to improve the speed of the fabrics themselves, increasing the overall compute speed. We are not there yet, but early experiments with photonic backplanes for blade systems have shown overall compute speed increased up to a factor seven. That should be the second step.

The third step takes things further. The specialized servers I talked about are typically system on a chip (SoC) servers, in other words, complete computers on a single chip. Why not use photonics to link those chips with their outside world? On-chip lasers have been developed in prototypes, so we are not that far out. We could even bring things one step further and use photonics within the chip itself, but that is still a little further out. I can’t tell you the increase in compute power that such evolutions will provide you, but I would expect it to be huge.

4. Storage
Storage is at a crossroads. On the one hand, hard disk drives (HDD) have improved drastically over the last 20 years, both in reading speed and in density. I still remember the 20MB hard disk drive, weighing 125Kg of the early 80’s. When I compare that with the 3TB drive I bought a couple months ago for my home PC, I can easily depict this evolution. But then the SSD (solid state disk) has appeared. Where a HDD read will take you 4 ms, the SDD read is down at 0.05 ms.

Using nanotechnologies, HP Labs did develop prototypes of the Memristor, a new approach to data storage, faster than Flash memory and consumes way less energy. Such a device could store up to 1 petabit of information per square centimeter and could replace both memory and storage, speeding up access to data and allowing order of magnitude increase in the amount of data stored. Since HP has been busy preparing production of these devices. First production units should be available towards the end of 2013 or early in 2014. It will transform our storage approaches completely.


Details about the latest and future Calxeda SoCs:

Calxeda EnergyCore ECX-2000 family – ARM TechCon ’13 [ARMflix YouTube channel, recorded on Oct 30, 2013]

Calxeda tells us about their new EnergyCore ECX-2000 product line based on ARM Cortex-A15. http://www.calxeda.com/ecx-2000-family/

From ECX-2000 Product Brief [October, 2013]

The Calxeda EnergyCore ECX-2000 Series is a family of SoC (Server-on-Chip) products that delivers the power efficiency of ARM® processors, and the OpenStack, Linux, and virtualization software needed for modern cloud infrastructures. Using the ARM Cortex A15 quad-core processor, the ECX-2000 delivers roughly twice the performance, three times the memory bandwidth, and four times the memory capacity of the ground-breaking ECX-1000. It is extremely scalable due to the integrated Fleet Fabric Switch, while the embedded Fleet Engine simultaneously provides out-of-band control and intelligence for autonomic operation.

In addition to enhanced performance, the ECX-2000 provides hardware virtualization support via KVM and Xen hypervisors. Coupled with certified support for Ubuntu 13.10 and the Havana Openstack release, this marks the first time an ARM SoC is ready for Cloud computing. The Fleet Fabric enables the highest network and interconnect bandwidth in the MicroServer space, making this an ideal platform for streaming media and network-intensive applications.

The net result of the EnergyCore SoC architecture is a dramatic reduction in power and space requirements, allowing rapidly growing data centers to quickly realize operating and capital cost savings.

image

Scalability you can grow into. An integrated EnergyCore Fabric Switch within every SoC provides up to five 10 Gigabit lanes for connecting thousands of ECX-2000 server nodes into clusters capable of handling distributed applications at extreme scale. Completely topology agnostic, each SoC can be deployed to work in a variety of mesh, grid, or tree network structures, providing opportunities to find the right balance of network throughput and fault resiliency for any given workload.

Fleet Fabric Switch
• Integrated 80Gb (8×8) crossbar switch with through-traffic support
• Five (5) 10Gb external channels, three (3) 10Gb internal channels
• Configurable topology capable of connecting up to 4096 nodes
• Dynamic Link Speed Control from 1Gb to 10Gb to minimize power and maximize performance
• Network Proxy Support maintains network presence even with node powered off
• In-order flow delivery
• MAC learning provider support for virtualization

ARM Servers and Xen — Hypervisor Support at Hyperscale – Larry Wikelius, [Co-Founder of] Calxeda [TheLinuxFoundation YouTube channel, Oct 1, 2013]

[Xen User Summit 2013] The emergence of power optimized hyperscale servers is leading to a revolution in Data Center design. The intersection of this revolution with the growth of Cloud Computing, Big Data and Scale Out Storage solutions is resulting in innovation at rate and pace in the Server Industry that has not been seen for years. One particular example of this innovation is the deployment of ARM based servers in the Data Center and the impact these servers have on Power, Density and Scale. In this presentation we will look at the role that Xen is playing in the Revolution of ARM based server design and deployment and the impact on applications, systems management and provisioning.

Calxeda Launches Midway ARM Server Chips, Extends Roadmap [EnterpriseTech, Oct 28, 2013]

ARM server chip supplier Calxeda is just about to ship its second generation of EnergyCore processors for hyperscale systems and most of its competitors are still working on their first products. Calxeda is also tweaking its roadmap to add a new chip to its lineup, which will bridge between the current 32-bit ARM chips and its future 64-bit processors.
There is going to be a lot of talk about server-class ARM processors this week, particularly with ARM Holdings hosting its TechCon conference in Santa Clara.
A month ago, EnterpriseTech told you about the “Midway” chip that Calxeda had in the works and as well as its roadmap to get beefier 64-bit cores and extend its Fleet Services fabric to allow for more than 100,000 nodes to be linked together.
The details were a little thin on the Midway chip, but we now know that it will be commercialized as the ECX-2000, and that Calxeda is sending out samples to server makers right now. The plan is to have the ECX-2000 generally available by the end of the year, and that is why company is ready to talk about some feeds and speeds. Karl Freund, vice president of marketing at Calxeda, walked EnterpriseTech through the details.

image

The Midway chip is fabricated in the same 40 nanometer process as the existing “High Bank” ECX-1000 chip that Calxeda first put into the field in November 2011 in the experimental “Redstone” hyperscale servers from Hewlett-Packard. That 32-bit chip, based on the ARM Cortex-A9 core, was subsequently adopted in systems from Penguin Computing, Boston, and a number of other hyperscale datacenter operators who did proofs of concept with the chips. The ECX-1000 has four cores and was somewhat limited in its performance and was definitely limited in its main memory, which topped out at 4 GB across the four-core processor. But the ECX-2000 addresses these issues.
The ECX-2000 is based on ARM Holding’s Cortex-A15 core and has the 40-bit physical memory extensions, which allows for up to 16 GB of memory to be physically attached to each socket. With the 40-bit physical addressing added with the Cortex-A15, the memory controller can, in theory, address up to 1 TB of main memory; this is called Large Physical Address Extension (LPAE) in the ARM lingo, and it maps the 32-bit physical addressing on the core to a 40-bit virtual address space. Each core on the ECX-2000 has 32 KB of L1 instruction cache and 32 KB of L1 data cache, and ARM licensees are allowed to scale the L2 cache as they see fit. The ECX-2000 has 4 MB of L2 cache shared across the four cores on the die. These are exactly the same L1 and L2 cache sizes as used in the prior ECX-1000 chips.
The Cortex-A15 design was created to scale to 2.5 GHz, but as you crank up the clocks on any chip, the amount of energy consumed and heat radiated grows progressively larger as clock speeds go up. At a certain point, it just doesn’t make sense to push clock speeds. Moreover, every drop in clock speed gives a proportionately larger increase in thermal efficiency, and this is why, says Freund, Calxeda is making its implementation of the Cortex-A15 top out at 1.8 GHz. The company will offer lower-speed parts running at 1.1 GHz and 1.4 GHz for customers that need an even better thermal profile or a cheaper part where low cost is more important than raw performance or thermals.
What Calxeda and its server and storage array customers are focused on is the fact that the Midway chip running at 1.8 GHz has twice the integer, floating point, and Java performance of a 1.1 GHz High Bank chip. That is possible, in part, because the new chip has four times the main memory and three times the memory bandwidth as the old chip in addition to a 64 percent boost in clock speed. Calxeda is not yet done benchmarking systems using the chips to get a measure of their thermal efficiency, but is saying that there is as much as a 33 percent boost in performance per watt comparing old to new ECX chips.
The new ECX-2000 chip has a dual-core Cortex-A7 chip on the die that is used as a controller for the system BIOS as well as a baseboard management controller and a power management controller for the servers that use them. These Fleet Engines, as Calxeda calls them, eliminate yet another set of components, and therefore their cost, in the system. These engines also control the topology of the Fleet Services fabric, which can be set up in 2D torus, mesh, butterfly tree, and fat tree network configurations.
The Fleet Services fabric has 80 Gb/sec of aggregate bandwidth and offers multiple 10 Gb/sec Ethernet links coming off the die to interconnect server nodes on a single card, multiple cards in an enclosure, multiple enclosures in a rack, and multiple racks in a data center. The Ethernet links are also used to allow users to get to applications running on the machines.
Freund says that the ECX-2000 chip is aimed at distributed, stateless server workloads, such as web server front ends, caching servers, and content distribution. It is also suitable for analytics workloads like Hadoop and distributed NoSQL data stores like Cassandra, all of which tend to run on Linux. Both Red Hat and Canonical are cooking up commercial-grade Linuxes for the Calxeda chips, and SUSE Linux is probably not going to be far behind. The new chips are also expected to see action in scale-out storage systems such as OpenStack Swift object storage or the more elaborate Gluster and Ceph clustered file systems. The OpenStack cloud controller embedded in the just-announced Ubuntu Server 13.10 is also certified to run on the Midway chip.
Hewlett-Packard has confirmed that it is creating a quad-node server cartridge for its “Moonshot” hyperscale servers, which should ship to customers sometime in the first or second quarter of 2014. (It all depends on how long HP takes to certify the system board.) Penguin Computing, Foxconn, Aaeon, and Boston are expected to get beta systems out the door this year using the Midway chip and will have them in production in the first half of next year. Yes, that’s pretty vague, but that is the server business, and vagueness is to be expected in such a young market as the ARM server market is.
Looking ahead, Calxeda is adding a new processor to its roadmap, code-named “Sarita.” Here’s what the latest system-on-chip roadmap looks like now:

image

The future “Lago” chip is the first 64-bit chip that will come out of Calxeda, and it is based on the Cortex-A57 design from ARM Holdings –one of several ARMv8 designs, in fact. (The existing Calxeda chips are based on the ARMv7 architecture.)
Both Sarita and Lago will be implemented in TSMC’s 28 nanometer processes, and that shrink from the current 40 nanometer to 28 nanometer processes is going to allow for a lot more cores and other features to be added to the die and also likely a decent jump in clock speed, too. Freund is not saying at the moment which way it will go.
But what Freund will confirm is that Sarita will be pin-compatible with the existing Midway chip, meaning that server makers who adopt Midway will have a processor bump they can offer in a relatively easy fashion. It will also be based on the Cortex-A57 cores from ARM Holdings, and will sport four cores on a die that deliver about a 50 percent performance increase compared to the Midway chips.
The Lago chips, we now know, will scale to eight cores on a die and deliver about twice the performance of the Midway chips. Both Lago and Sarita are on the same schedule, in fact, and they are expected to tape out this quarter. Calxeda expects to start sampling them to customers in the second quarter of 2014, with production quantities being available at the end of 2014.
Not Just Compute, But Networking, Too
As important as the processing is to a system, the Fleet Services fabric interconnect is perhaps the key differentiator in its design. The current iteration of that interconnect, which is a distributed Layer 2 switch fabric that is spread across each chip in a cluster, can scale across 4,096 nodes without requiring top-of-rack and aggregation switches.

image

Both of the Lago and Sarita chips will be using the Fleet Services 2.0 intehttp://www.ti.com/product/66ak2h12rconnect that is now being launched with Midway. This iteration of the interconnect has all kinds of tweaks and nips and tucks but no scalability enhancements beyond the 4,096 nodes in the original fabric.
Freund says that the Fleet Services 3.0 fabric, which allows the distributed switch architecture to scale above 100,000 nodes in a flat network, will probably now come with the “Ratamosa” chips in 2015. It was originally – and loosely – scheduled for Lago next year. The circuits that do the fabric interconnect is not substantially different, says Freund, but the scalability is enabled through software. It could be that customers are not going to need such scalability as rapidly as Calxeda originally thought.
The “Navarro” kicker to the Ratamosa chip is presumably based on the ARMv9 architecture, and Calxeda is not saying anything about when we might see that and what properties it might have. All that it has said thus far is that it is aimed at the “enterprise server era.”


Details about the latest Texas Instruments DSP+ARM SoCs:

A Better Way to Cloud [MultiVuOnlineVideo YouTube channel, Nov 13, 2012]

To most technologists, cloud computing is about applications, servers, storage and connectivity. To Texas Instruments Incorporated (TI) (NASDAQ: TXN) it means much more. Today, TI is unveiling a BETTER way to cloud with six new multicore System-on-Chips (SoCs). Based on its award winning KeyStone architecture, TI’s SoCs are designed to revitalize cloud computing, inject new verve and excitement into pivotal infrastructure systems and, despite their feature rich specifications and superior performance, actually reduce energy consumption. To view Multimedia News Release, go to http://www.multivu.com/mnr/54044-texas-instruments-keystone-multicore-socs-revitalize-cloud-applications

Infinite Scalability in Multicore Processors [Texas Instruments YouTube channel, Aug 27, 2012]

Over the years, our industry has preached how different types of end equipments and applications are best served by distinctive multicore architectures tailored to each. There are even those applications, such as high performance computing, which can be addressed by more than one type of multicore architecture. Yet most multicore devices today tend to be suited for a specific approach or a particular set of markets. This keynote address, from the 2012 Multicore Developer’s Conferece, touches upon why the market needs an “infinitely scalable” multicore architecture which is both scalable and flexible enough to support disparate markets and the varied ways in which certain applications are addressed. The speaker presents examples of how a single multicore architecture can be scalable enough to address the needs of various high performance markets, including cloud RAN, networking, imaging and high performance computing. Ramesh Kumar manages the worldwide business for TI’s multicore growth markets organization. The organization develops multicore processors and software that are targeted for the communication infrastructure space, including multimedia and networking infrastructure equipment, as well as end equipment that requires multicore processors like public safety, medical imaging, high performance computing and test and measurement. Ramesh is a graduate of Northeastern University, where he obtained an executive MBA, and Purdue University where he received a master of science in electrical engineering.

From Imagine the impact…TI’s KeyStone SoC + HP Moonshot [TI’s Multicore Mix Blog, April 19, 2013]

TI’s participation in HP’s Pathfinder Innovation Ecosystem is the first step towards arming HP’s customers with optimized server systems that are ideally suited for workloads such as oil and gas exploration, Cloud Radio Access Networks (C-RAN), voice over LTE and video transcoding. This collaboration between TI and HP is a bold step forward, enabling flexible, optimized servers to bring differentiated technologies, such as TI’s DSPs, to a broader set of application providers. TI’s KeyStone II-based SoCs, which integrate fixed- and floating- point DSP cores with multiple ARM® Cortex™A-15 MPCore processors, packet and security processing, and high speed interconnect, give customers the performance, scalability and programmability needed to build software-defined servers. HP’s Moonshot system integrates storage, networking and compute cards with a flexible interconnect, allowing customers to choose the optimized ratio enabling the industry’s first software-defined server platform. Bringing TI’s KeyStone II-based SoCs into HP’s Moonshot system opens up several tantalizing possibilities for the future. Let’s look at a few examples:
Think about the number of voice conversations happening over mobile devices every day. These conversations are independent of each other, and each will need transcoding from one voice format to another as voice travels from one mobile device, through the network infrastructure and to the other mobile device. The sheer number of such conversations demand that the servers used for voice transcoding be optimized for this function. Voice is just one example. Now think about video and music, and you can imagine the vast amount of processing required. Using TI’s KeyStone II-based SoCs with DSP technology provides optimized server architecture for these applications because our SoCs are specifically tuned for signal processing workloads.
Another example can be with C-RAN. We have seen a huge push for mobile operators to move most of the mobile radio processing to the data center. There are several approaches to achieve this goal, and each has pros and cons associated with them. But one thing is certain – each approach has to do wireless symbol processing to achieve optimum 3G or 4G communications with smart mobile devices. TI’s KeyStone II-based SoCs are leading the wireless communication infrastructure market and combine key accelerators such as BCP (Bit Rate Co-Processor), VCP (Viturbi Co-Processor) and others to enable 3G/4G standards compliant for wireless processing. These key accelerators offload standard-based wireless processing from the ARM and/or DSP cores, freeing the cores for value-added processing. The combination of ARM/DSP with these accelerators provides an optimum SoC for 3G/4G wireless processing. By combining TI’s KeyStone II-based SoC with HP’s Moonshot system, operators and network equipment providers can now build customized servers for C-RAN to achieve higher performance systems at lower cost and ultimately provide better experiences to their customers.

A better way to cloud: TI’s new KeyStone multicore SoCs [embeddednewstv YouTube channel, published on Jan 12,2013 (YouTube: Oct 21, 2013)]

Brian Glinsman, vice president of multicore processors at Texas Instruments, discusses TI’s new KeyStone multicore SoCs for cloud infrastructure applications. TI announced six new SoCs, based on their 28-nm KeyStone architecture, featuring the Industry’s first implementation of quad ARM Cortex-A15 MPCore processors and TMS320C66x DSPs for purpose built servers, networking, high performance computing, gaming and media processing applications.

Texas Instruments Offers System on a Chip for HPC Applications [RichReport YouTube channel, Nov 20, 2012]

In this video from SC12, Arnon Friedmann from Texas Instruments describes the company’s new multicore System-on-Chips (SoCs). Based on its award winning KeyStone architecture, TI’s SoCs are designed to revitalize cloud computing, inject new verve and excitement into pivotal infrastructure systems and, despite their feature rich specifications and superior performance, actually reduce energy consumption. “Using multicore DSPs in a cloud environment enables significant performance and operational advantages with accelerated compute intensive cloud applications,” said Rob Sherrard, VP of Service Delivery, Nimbix. “When selecting DSP technology for our accelerated cloud compute environment, TI’s KeyStone multicore SoCs were the obvious choice. TI’s multicore software enables easy integration for a variety of high performance cloud workloads like video, imaging, analytics and computing and we look forward to working with TI to help bring significant OPEX savings to high performance compute users.”

A better way to cloud: TI’s new KeyStone multicore SoCs revitalize cloud applications, enabling new capabilities and a quantum leap in performance at significantly reduced power consumption

    • Industry’s first implementation of quad ARM® Cortex™-A15 MPCore™ processors in infrastructure-class embedded SoC offers developers exceptional capacity & performance at significantly reduced power for networking, high performance computing and more
    • Unmatched combination of Cortex-A15 processors, C66x DSPs, packet processing, security processing and Ethernet switching, transforms the real-time cloud into an optimized high performance, power efficient processing platform
    • Scalable KeyStone architecture now features 20+ software compatible devices, enabling customers to more easily design integrated, power and cost-efficient products for high-performance markets from a range of devices

ELECTRONICA – MUNICH (Nov.13, 2012) /PRNewswire/ — To most technologists, cloud computing is about applications, servers, storage and connectivity. To Texas Instruments Incorporated (TI) (NASDAQ: TXN) it means much more. Today, TI is unveiling a BETTER way to cloud with six new multicore System-on-Chips (SoCs). Based on its award winning KeyStone architecture, TI’s SoCs are designed to revitalize cloud computing, inject new verve and excitement into pivotal infrastructure systems and, despite their feature rich specifications and superior performance, actually reduce energy consumption.

To TI, a BETTER way to cloud means:

    • Safer communities thanks to enhanced weather modeling;
    • Higher returns from time sensitive financial analysis;
    • Improved productivity and safety in energy exploration;
    • Faster commuting on safer highways in safer cars;
    • Exceptional video on any screen, anywhere, any time;
    • More productive and environmentally friendly factories; and
    • An overall reduction in energy consumption for a greener planet.
    TI’s new KeyStone multicore SoCs are enabling this – and much more. These 28-nm devices integrate TI’s fixed-and floating-point TMS320C66x digital signal processor (DSP) generation cores – yielding the best performance per watt ratio in the DSP industry – with multiple ARM® Cortex™-A15 MPCore™ processors – delivering unprecedented processing capability combined with low power consumption – facilitating the development of a wide-range of infrastructure applications that can enable more efficient cloud experiences. The unique combination of Cortex-A15 processors and C66x DSPcores, with built-in packet processing and Ethernet switching, is designed to efficiently offload and enhance the cloud’s first generation general purpose servers; servers that struggle with big data applications like high performance computing and video processing.
    “Using multicore DSPs in a cloud environment enables significant performance and operational advantages with accelerated compute intensive cloud applications,” said Rob Sherrard, VP of Service Delivery, Nimbix. “When selecting DSP technology for our accelerated cloud compute environment, TI’s KeyStone multicore SoCs were the obvious choice. TI’s multicore software enables easy integration for a variety of high performance cloud workloads like video, imaging, analytics and computing and we look forward to working with TI to help bring significant OPEX savings to high performance compute users.”
    TI’s six new high-performance SoCs include the 66AK2E02, 66AK2E05, 66AK2H06, 66AK2H12, AM5K2E02 and AM5K2E04, all based on the KeyStone multicore architecture. With KeyStone’s low latency high bandwidth multicore shared memory controller (MSMC), these new SoCs yield 50 percent higher memory throughput when compared to other RISC-based SoCs. Together, these processing elements, with the integration of security processing, networking and switching, reduce system cost and power consumption, allowing developers to support the development of more cost-efficient, green applications and workloads, including high performance computing, video delivery and media and image processing. With the matchless combination TI has integrated into its newest multicore SoCs, developers of media and image processing applications will also create highly dense media solutions.

    image

    “Visionary and innovative are two words that come to mind when working with TI’s KeyStone devices,” said Joe Ye, CEO, CyWee. “Our goal is to offer solutions that merge the digital and physical worlds, and with TI’s new SoCs we are one step closer to making this a reality by pushing state-of-the-art video to virtualized server environments. Our collaboration with TI should enable developers to deliver richer multimedia experiences in a variety of cloud-based markets, including cloud gaming, virtual office, video conferencing and remote education.”
    Simplified development with complete tools and support
    TI continues to ease development with its scalable KeyStone architecture, comprehensive software platform and low-cost tools. In the past two years, TI has developed over 20 software compatible multicore devices, including variations of DSP-based solutions, ARM-based solutions and hybrid solutions with both DSP and ARM-based processing, all based on two generations of the KeyStone architecture. With compatible platforms across TI’s multicore DSPs and SoCs, customers can more easily design integrated, power and cost-efficient products for high-performance markets from a range of devices, starting at just $30 and operating at a clock rate of 850MHz all the way to 15GHz of total processing power.
    TI is also making it easier for developers to quickly get started with its KeyStone multicore solutions by offering easy-to-use, evaluation modules (EVMs) for less than $1K, reducing developers’ programming burdens and speeding development time with a robust ecosystem of multicore tools and software.
    In addition, TI’s Design Network features a worldwide community of respected and well established companies offering products and services that support TI multicore solutions. Companies offering supporting solutions to TI’s newest KeyStone-based multicore SoCs include 3L Ltd., 6WIND, Advantech, Aricent, Azcom Technology, Canonical, CriticalBlue Enea, Ittiam Systems, Mentor Graphics, mimoOn, MontaVista Software, Nash Technologies, PolyCore Software and Wind River.
    Availability and pricing
    TI’s 66AK2Hx SoCs are currently available for sampling, with broader device availability in 1Q13 and EVM availability in 2Q13. AM5K2Ex and 66AK2Ex samples and EVMs will be available in the second half of 2013. Pricing for these devices will start at $49 for 1 KU.

    66AK2H14 (ACTIVE) Multicore DSP+ARM KeyStone II System-on-Chip (SoC) [TI.com, Nov 10, 2013]
    The same as below for 66AK2H12 SoC with addition of:

    More Literature:

    From that the below excerpt is essential to understand the added value above 66AK2H12 SoC:

    image

    Figure 1. TI’s KeyStone™ 66AK2H14 SoC

    The 66AK2H14 SoC shown in Figure 1, with the raw computing power of eight C66x processors and quad ARM Cortex-A15s at over 1GHz performance, enables applications such as very large fast fourier transforms (FFT) in radar and multiple camera image analytics where a 10Gbit/s networking connection is needed. There are, and have been, several sophisticated technologies that have offered the bandwidth and additional features to fill this role. Some such as Serial RapidIO® and Infiniband have been successful in application domains that Gigabit Ethernet could not address, and continue to make sense, but 10Gbit/s Ethernet will challenge their existence.

    66AK2H12 (ACTIVE) Multicore DSP+ARM KeyStone II System-on-Chip (SoC) [TI.com, created on Nov 8, 2012]

    Datasheet manual [351 pages]:

    More Literature:

    Description

    The 66AK2Hx platform is TI’s first to combine the quad ARM® Cortex™-A15 MPCore™ processors with up to eight TMS320C66x high-performance DSPs using the KeyStone II architecture. Unlike previous ARM Cortex-A15 devices that were designed for consumer products, the 66AK2Hx platform provides up to 5.6 GHz of ARM and 11.2 GHz of DSP processing coupled with security and packet processing and Ethernet switching, all at lower power than multi-chip solutions making it optimal for embedded infrastructure applications like cloud computing, media processing, high-performance computing, transcoding, security, gaming, analytics and virtual desktop. Using TI’s heterogeneous programming runtime software and tools, customers can easily develop differentiated products with 66AK2Hx SoCs.

    image

    Taking Multicore to the Next Level: KeyStone II Architecture [Texas Instruments YouTube channel, Feb 26, 2012]

    TI’s scalable KeyStone II multicore architecture includes support for both TMS320C66x DSP cores and multiple cache coherent quad ARM Cortex™-A15 clusters, for a mixture of up to 32 DSP and RISC cores. With significant updates to its award-winning KeyStone architecture, TI is now paving the way for a new era of high performance 28-nm devices that meld signal processing, networking, security and control functionality, with KeyStone II. Ideal for applications that demand superior performance and low power, devices based on the KeyStone architecture are optimized for high performance markets including communications infrastructure, mission critical, test and automation, medical imaging and high performance and cloud computing. For more information, please visit http://www.ti.com/multicore.

    Introducing the EVMK2H [Texas Instruments YouTube channel, Nov 15, 2013]

    Introducing the EVMK2H evaluation module, the cost-efficient development tool from Texas Instruments that enables developers to quickly get started working on designs for the 66AK2H06, 66AK2H12, and 66AK2H14 multicore DSP + ARM devices based on the KeyStone architecture.

    Kick start development of high performance compute systems with TI’s new KeyStone™ SoC and evaluation module [TI press release, Nov 14, 2013]

    Combination of DSP + ARM® cores and high-speed peripherals offer developers an optimal compute solution at low power consumption

    DALLAS, Nov. 14, 2013 /PRNewswire/ — Further easing the development of processing-intensive applications, Texas Instruments (TI) (NASDAQ: TXN) is unveiling a new system-on-chip (SoC), the 66AK2H14, and evaluation module (EVM) for its KeyStoneTM-based 66AK2Hx family of SoCs. With the new 66AK2H14 device, developers designing high-performance compute systems now have access to a 10Gbps Ethernet switch-on-chip. The inclusion of the 10GigE switch, along with the other high-speed, on-chip interfaces, saves overall board space, reduces chip count and ultimately lowers system cost and power. The EVM enables developers to evaluate and benchmark faster and easier. The 66AK2H14 SoC provides industry-leading computational DSP performance at 307 GMACS/153 GFLOPS and 19600 DMIPS of ARM performance, making it ideal for a wide variety of applications such as video surveillance, radar processing, medical imaging, machine vision and geological exploration.

    “Customers today require increased performance to process compute-intensive workloads using less energy in a smaller footprint,” said Paul Santeler, vice president and general manager, Hyperscale Business, HP. “As a partner in HP’s Moonshot ecosystem dedicated to the rapid development of new Moonshot servers, we believe TI’s KeyStone design will provide new capabilities across multiple disciplines to accelerate the pace of telecommunication innovations and geological exploration.”

    Meet TI’s new 10Gbps Ethernet DSP + ARM SoC
    TI’s newest silicon variant, the 66AK2H14, is the latest addition to its high-performance 66AK2Hx SoC family which integrates multiple ARM Cortex™-A15 MPCore™ processors and TI’s fixed- and floating-point TMS320C66x digital signal processor (DSP) generation cores. The 66AK2H14 offers developers exceptional capacity and performance (up to 9.6 GHz of cumulative DSP processing) at industry-leading size, weight, and power. In addition, the new SoC features a wide array of unique high-speed interfaces, including PCIe, RapidIO, Hyperlink, 1Gbps and 10Gbps Ethernet, achieving total I/O throughput of up to 154Gbps. These interfaces are all distinct and not multiplexed, allowing designers tremendous flexibility with uncompromising performance in their designs.
    Ease development and debugging with TI’s tools and software
    TI helps simplify the design process by offering developers highly optimized software for embedded HPC systems along with development and debugging tools for the EVMK2H – all for under $1,000. The EVMK2H features a single 66AK2H14 SoC, a status LCD, two 1Gbps Ethernet RJ-45 interfaces and on-board emulation. An optional EVM breakout card (available separately) also provides two 10Gbps Ethernet optical interfaces for 20Gbps backplane connectivity and optional wire rate switching in high density systems.
    The EVMK2H is bundled with TI’s Multicore Software Development Kit (MCSDK), enabling faster development with production ready foundational software. The MCSDK eases development and reduces time to market by providing highly-optimized bundles of foundational, platform-specific drivers, optimized libraries and demos.
    Complementary analog products to increase system performance
    TI offers a wide range of power management and analog signal chain components to increase the system performance of 66AK2H14 SoC-based designs. For example, the TPS53xx integrated FET DC/DC converters provide the highest level of power conversion efficiency even at light loads, while the LM10011 VID converter with dynamic voltage control helps reduce system power consumption. The CDCM6208 low-jitter clock generator also eliminates the need for external buffers, jitter cleaners and level translators.
    Availability and pricing
    TI’s EVMK2H is available now through TI distribution partners or TI.com for $995. In addition to TI’s Linux distribution provided in the MCSDK, Wind River® Linux is available now for the 66AK2Hxx family of SoCs. Green Hills® INTEGRITY® RTOS and Wind River VxWorks® RTOS support will each be available before the end of the year. Pricing for the 66AK2H14 SoC will start at $330 for 1 KU. The 10Gbps Ethernet breakout card will be available from Mistral.

    Ask the Expert: How can developers accelerate scientific computing with TI’s multicore DSPs? [Texas Instruments YouTube channel, Feb 7, 2012]

    Dr. Arnon Friedmann is the business manager for TI’s high performance computing products in the multicore and media infrastructure business. In this video, he explains how TI’s multicore DSPs are well suited for computing applications in oil and gas exploration, financial modeling and molecular dynamics, where ultra- high performance, low power and easy programmability are critical requirements.

    Ask the Expert: Arnon Friedmann [Texas Instruments YouTube channel, Sept 6, 2012]

    How are TI’s latest multicore devices a fit for video surveillance and smart analytic camera applications? Dr. Arnon Friedmann, PhD, is a business manager for multicore processors at Texas Instruments. In this role, he is responsible for growing TI’s business in high performance computing, mission critical, test and measurement and imaging markets. Prior to his current role, Dr. Friedmann served as the marketing director for TI’s wireless base station infrastructure group, where he was responsible for all marketing and design activities. Throughout his 14 years of experience in digital communications research and development, Dr. Friedmann has accumulated patents in the areas of disk drive systems, ADSL modems and 3G/4G wireless communications. He holds a PhD in electrical engineering and bachelor of science in engineering physics, both from the University of California, San Diego.

    End of Updates as of Dec 6, 2013


    The original post (8 months ago):

    HP Moonshot: Designed for the Data Center, Built for the Planet [HP press kit, April 8, 2013]

    On April 8, 2013, HP unveiled the world’s first commercially available HP Moonshot system, delivering compelling new infrastructure economics by using up to 89 percent less energy, 80 percent less space and costing 77 percent less, compared to traditional servers. Today’s mega data centers are nearing a breaking point where further growth is restricted due to the current economics of traditional infrastructure. HP Moonshot servers are a first step organizations can take to address these constraints.

    For more details on the disruptive potential of HP Moonshot, visit TheDisruption.com

    Introducing HP Moonshot [HewlettPackardVideos April 11, 2013]

    See how HP is defining disruption with the introduction of HP Moonshot.

    HP’s Cutting Edge Data Center Innovation [Ramón Baez, Senior Vice President and Chief Information Officer (CIO) of HP, HP Next [launched on April 2], April 10, 2013]

    This is an exciting time to be in the IT industry right now. For those of you who have been around for a while — as I have — there have been dramatic shifts that have changed how businesses operate.
    From the early days of the mainframes, to the explosion of the Internet and now social networks, every so often very important game-changing innovation comes along. We’re in the midst of another sea change in technology.
    Inside HP IT, we are testing the company’s Moonshot servers. With these servers running the same chips found in smart phones and tablets, they are using incredibly less power, require considerably less cooling and have a smaller footprint.

    We currently are running some of our intensive hp.com applications on Moonshot and are seeing very encouraging results. Over half a billion people will visit hp.com this year, and the new Moonshot technology will run at a fraction of the space, power and cost – basically we expect to run HP.com off of the same amount of energy needed for a dozen 60-watt light bulbs.

    This technology will revolutionize data centers.
    Within HP IT, we are fortunate in that over the past several years we have built a solid data center foundation to run our company. Like many companies, we were a victim of IT sprawl — with more than 85 data centers in 29 countries. We decided to make a change and took on a total network redesign, cutting our principle worldwide data centers down to six and housing all of them in the United States.
    With the addition of four new EcoPODs to our infrastructure and these new Moonshot servers, we are in the perfect position to build out our private cloud and provide our businesses with the speed and quality of innovation they need.
    Moonshot is just the beginning.The product roadmap for Moonshot is extremely promising and I am excited to see what we can do with it within HP IT, and what benefits our customers will see.

    What Calxeda is saying about HP Moonshot [HewlettPackardVideos YouTube channel, April 8, 2013] which is best to start with for its simple and efficient message, as well as what Intel targeting ARM based microservers: the Calxeda case [‘Experiencing the Cloud’ blog, Dec 14, 2012] already contained on this blog earlier:

    Calxeda discusses HP’s Project Moonshot and the cost, space, and efficiency innovations being enabled through the Pathfinder Innovation Ecosystem. http://hp.com/go/moonshot

    Then we can turn to the Moonshot product launch by HP 2 days ago:

    Note that the first three videos following here were released 3 days later, so don’t be surpised by YouTube dates, in fact the same 3 videos (as well as the “Introducing HP Moonshot” embedded above) were delivered on April 8 live webcast, see the first 18 minutes of that, and then follow according HP’s flow of the presentation if you like. I would certainly recommend my own presentation compiled here.

    HP president and CEO Meg Whitman on the emergence of a new style of IT [HewlettPackardVideos YouTube channel, April 11, 2013]

    HP president and CEO Meg Whitman outlines the four megatrends causing strain on current infrastructure and how HP Project Moonshot servers are built to withstand data center challenges.

    EVP and GM of HP’s Enterprise Group Dave Donatelli discusses HP Moonshot [HewlettPackardVideos YouTube channel, April 11, 2013]

    EVP and GM of HP’s Enterprise Group Dave Donatelli details how HP Moonshot redefines the server market.

    Tour the Houston Discovery Lab — where the next generation of innovation is created [HewlettPackardVideos YouTube channel, April 11, 2013]

    SVP and GM of HP’s Industry Standard Servers and Software Mark Potter and VP and GM of HP’s Hyperscale Business Unit Paul Santeler tour HP’s Discovery Lab in Houston, Texas. HP’s Discovery Lab allows customers to test, tune and port their applications on HP Moonshot servers in-person and remotely.

    A new era of accelerated innovation [HP Moonshot minisite, April 8, 2013]

    Cloud, Mobility, Security, and Big Data are transforming what the business expects from IT resulting in a “New Style of IT.” The result of alternative thinking from a proven industry leader, HP Moonshot is the world’s first software defined server that will accelerate innovation while delivering breakthrough efficiency and scale.

    Watch the unveiling [link to HP Moonshot – The Disruption [HP Event registration page at ‘thedisruption.com’]image

    On the right is the Moonshot System with the very first Moonshot servers (“microservers/server appliances” as called by the industry) based on Intel® Atom S1200 processors and for supporting web-hosting workloads (see also on right part  of the image below). Currently there is also a storage cartridge (on the left of the below image) and a multinode for highly dense computing solutions (see in the hands of presenter on the image below). Many more are to come later on.

    image

    imageWith up to a 180 servers inside the box (45 now) it was necessary to integrate network switching. There are two sockets (see left) for the network switch so you can configure for redundancy. The downlink module which talks to the cartridges is on left of the below image. This module is paired with an uplink module (see on the middle of the below image as taken out, and then shown with the uplink module on the right) that is in the back of the server. There will be more options available.image

    More information:
    Enterprise Information Library for Moonshot
    HP Moonshot System [Technical white paper from HP, April 5, 2013] from which I will include here the following excerpts for more information:

    HP Moonshot 1500 Chassis

    The HP Moonshot 1500 Chassis is a 4.3U form factor and slides out of the rack on a set of rails like a file cabinet drawer. It supports 45 HP ProLiant Moonshot Servers and an HP Moonshot-45G Switch Module that are serviceable from the top.
    It is a modern architecture engineered for the new style of IT that can support server cartridges, server and storage cartridges, storage only cartridges and a range of x86, ARM or accelerator based processor technologies.
    As an initial offering, the HP Moonshot 1500 Chassis is fully populated 45 HP ProLiant Moonshot Servers and one HP Moonshot-45G Switch Module and a second HP Moonshot-45G Switch Module can be purchased as an option. Future offerings will include quad server cartridges and will result in up to 180 servers per chassis. The 4.3U form factor allows for 10 chassis per rack, which with the quad server cartridge amounts to 1800 servers in a single rack.
    The Moonshot 1500 Chassis simplifies management with four iLO processors that share management responsibility for the 45 servers, power, cooling, and switches.

    Highly flexible fabric

    Built into the HP Moonshot 1500 Chassis architecture are four separate and independent fabrics that support a range of current and future capabilities:
    • Network fabric
    • Storage fabric
    • Management fabric
    • Integrated cluster fabric
    Network fabric
    The Network fabric provides the primary external communication path for the HP Moonshot 1500 Chassis.
    For communication within the chassis, the network switch has four communication channels to each of the 45 servers. Each channel supports a 1-GbE or 10-GbE interface. Each HP Moonshot-45G Switch Module supports 6 channels of 10GbE interface to the HP Moonshot-6SFP network uplink modules located in the rear of the chassis.
    Storage fabric
    The Storage fabric provides dedicated SAS lanes between server and storage cartridges. We utilize HP Smart Storage firmware found in the ProLiant family of servers to enable multiple core to spindle ratios for specific solutions. A hard drive can be shared among multiple server cartridges to enable low cost boot, logging, or attached to a node to provide storage expansion.
    The current HP Moonshot System configuration targets light scale-out applications. To provide the best operating environment for these applications, it includes HP ProLiant Moonshot Servers with a hard disk drive (HDD) as part of the server architecture. Shared storage is not an advantage for these environments. Future releases of the servers thattarget different solutions will take advantage of the storage fabric.
    Management fabric
    We utilize the Integrated Lights-Out (iLO) application-specific integrated circuit (ASIC) standard in the HP ProLiant family of servers to provide the innovative management features in the HP Moonshot System. To handle the range of extreme low energy processors we provide a device neutral approach to management, which can be easily consumed by data center operators to deploy at scale.
    The Management fabric enables management of the HP Moonshot System components as one platform with a dedicated iLO network. Benefits of the management fabric include:
    • The iLO Chassis Manager aggregates data to a common set of management interfaces.
    • The HP Moonshot 1500 Chassis has a single Ethernet port gateway that is the single point of access for the Moonshot Chassis manager.
    • Intelligent Platform Management Interface (IPMI) and Serial Console for each server
    • True out-of-band firmware update services
    • SL-APM Rack Management spans rack or multiple racks
    Integrated Cluster fabric
    The Integrated Cluster fabric provides a high-speed interface among future server cartridge technologies that will benefit from high bandwidth node-to-node communication. North, south, east, and west lanes are provided between individual server cartridges.
    The current HP ProLiant Moonshot Servertargets light scale-out applications. These applications do not benefit from the node-to-node communications, so the Integrated Cluster fabric is not utilized. Future releases of the cartridges that target different workloads that require low latency interconnects will take advantage of the Integrated Cluster fabric.

    HP ProLiant Moonshot Server

    HP will bring a growing library of cartridges, utilizing cutting-edge technology from industry leading partners. Each server will target specific solutions that support emerging Web, Cloud, and Massive-Scale Environments, as well as Analytics and Telecommunications. We are continuing server development for other applications, including Big Data, High-Performance Computing, Gaming, Financial Services, Genomics, Facial Recognition, Video Analysis, and more.
    Figure 4. Cartridges target specific solutions

    image

    The first server cartridge now available is HP ProLiant Moonshot Server, which includes the Intel® Atom Processor S1260. This is a low power processor that is right-sized for the light workloads. It has dedicated memory and storage, with discrete resources. This server design is idealfor light scale-out applications. Light scale-out applications require relatively little processing but moderately high I/O and include environments that perform the following functions:
    • Dedicated web hosting
    • Simple content delivery
    The HP ProLiant Moonshot Server can hot plug in the HP Moonshot 1500 Chassis. If service is necessary, it can be removed without affecting the other servers in the chassis. Table 1 defines the HP ProLiant Moonshot Server specifications.
    Table 1. HP ProLiant Moonshot Server specifications

    Processor
    One Intel® Atom Processor S1260
    Memory
    8 GB DDR3 ECC 1333 MHz
    Networking
    Integrated dual-port 1Gb Ethernet NIC
    Storage
    500 GB or 1 TB HDD or SSD, non-hot-plug, small form factor
    Operating systems
    Canonical Ubuntu 12.04
    Red Hat Enterprise Linux 6.4
    SUSE Linux Enterprise Server 11 SP2

    imageWith that HP CEO Seeks Turnaround Unveiling ‘Moonshot’ Super-Server: Tech [Bloomberg, April, 2013] as well as HP Moonshot: Say Goodbye to the Vanilla Server [Forbes, April 8, 2013]. HP however is much more eyeing the ARM based Moonshot servers which are expected to come later, because of the trends reflected on the left (source: HP). The software defined server concept is very general. image

    There are a number of quite different server cartridges expected to come, all specialised by server software installed on it. Typical specialised servers, for example, are the ones on which CyWee from Taiwan is working on with Texas Instruments’ new KeyStone II architecture featuring both ARM Cortex-A15 CPU cores and TI’s own C66x DSP cores for a mixture of up to 32 DSP and RISC cores in TI’s new 66AK2Hx family of SoCs, first of which is the TMS320TCI6636 implemented in 28nm foundry technology. Based on that CyWee will deliver multimedia Moonshot server cartridges for cloud gaming, virtual office, video conferencing and remote education (see even the first Keystone announcement). This CyWee involvement in HP Moonshot effort is part of HP’s Pathfinder Partner Program which Texas Instruments also joined recently to exploit a larger opportunity as:

    TI’s 66AK2Hx family and its integrated c66x multicore DSPs are applicable for workloads ranging from high performance computing, media processing, video conferencing, off-line image processing & analytics, video recorders (DVR/NVR), gaming, virtual desktop infrastructure and medical imaging.

    But Intel was able to win the central piece of the Moonshot System launch (originally initiated by HP as the “Moonshot Project” in November 2011 for disruption in terms of power and TCO for servers, actually with a Calxeda board used for research and development with other partners), at least as it was productized just two days ago:
    Raejeanne Skillern from Intel – HP Moonshot 2013 – theCUBE [siliconangle YouTube channel]

    Raejeanne Skillern, Intel Director of Marketing for Cloud Computing, at HP Moonshot 2013 with John Furrier and Dave Vellante

    However ARM was not left out either just relegated in the beginning to highly advanced and/or specialised server roles with its SoC partners, and coming later in the year:

    • Applied Micro with networking and connectivity background having now the X-Gene ARM 64-bit Server on a Chip platform as well which features 8 ARM 64-bit high-performance cores developed from scratch according to an architecture license (i.e. not ARM’s own Cortex-A50 series core), clocked at up to 2.4GHz and also has 4 smaller cores for network and storage offloads (see AppliedMicro on the X-Gene ARM Server Platform and HP Moonshot [SiliconANGLE blog [April 9, 2013]). Sample reference boards to key customers were shipped in March (see Applied Micro’s cloud chip is an ARM-based, switch-killing machine [GigaOM, April 3, 2013]). In the latest X-Gene Arrives in Silicon [Open Compute Summit Winter 2013 presentation, Jan 16, 2013] video you can have the most recent strategic details (upto 2014 with FinFET implementation of a “Software defined X-Gene based data center components”, should be assumed that at 16nm). Here I will include a more product-oriented AppliedMicro Shows ARM 64-bit X-Gene Server on a Chip Hardware and Software [Charbax YouTube channel, Nov 3, 2012] overview video:
      Vinay Ravuri, Vice President and General Manager, Server Products at AppliedMicro gives an update on the 64bit ARM X-Gene Server Platform. At ARM Techcon 2012, AppliedMicro, ARM and several open-source software providers gave updates on their support of the ARM 64-bit X-Gene Server on a Chip Platform.

      More information: A 2013 Resolution for the Data Center [Applied Micro on Smart Connected Devices blog from ARM, Feb 4, 2013] about “plans from Oracle, Red Hat, Citrix and Cloudera to support this revolutionary architecture … Dell’s “Iron” server concept with X-Gene … an X-Gene based ARM server managed by the Dell DCS Software suite …” etc.

    • Texas Instruments with digital signal processing (DSP) background, as it was already presented above. 
    • Calxeda with integration of storage fabric and Internet switching background, with details coming later, etc.:

    This is what is empasized by Lakshmi Mandyam from ARM – HP Moonshot 2013 – theCUBE [siliconangle YouTube channel, April 8, 2013]

    Lakshmi Mandyam, Director of Server Systems and Ecosystems, ARM, at HP Moonshot 2013, with John Furrier and Dave Vellante

    She is also mentioning in the talk the achievements which could put ARM and its SoC partners into a role which Intel now has with its general Atom S1200 based server cartridge product fitting into the Moonshot system. Perspective information on that is already available on my ‘Experiencing the Cloud’ blog here:
    The state of big.LITTLE processing [April 7, 2013]
    The future of mobile gaming at GDC 2013 and elsewhere [April 6, 2013]
    TSMC’s 16nm FinFET process to be further optimised with Imagination’s PowerVR Series6 GPUs and Cadence design infrastructure [April 8, 2013]
    With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology [April 3, 2013]

    The absence of Microsoft is even more interesting as AMD is also on this Moonshot bandwagon: Suresh Gopalakrishnan from AMD – HP Moonshot 2013 – theCUBE [siliconangle YouTube channel, April 8, 2013]

    Suresh Gopalakrishnan, Vice President and General Manager, Server Business, AMD, at HP Moonshot 2013, with John Furrier and Dave Vellante

    already showing a Moonshot fitting server cartridge with AMD’s four next-generation SoCs (while Intel’s already productized cartridge is not yet at an SoC level). We know from CES 2013 that AMD Unveils Innovative New APUs and SoCs that Give Consumers a More Exciting and Immersive Experience [press release, Jan 7, 2013] with the:

    Temash” … elite low-power mobility processor for Windows 8 tablets and hybrids … to be the highest-performance SoC for tablets in the market, with 100 percent more graphics processing performance2 than its predecessor (codenamed “Hondo.”)
    Kabini” [SoC which] targets ultrathin notebooks with exceptional battery life and offers impressive levels of performance in both dual- and quad-core options. “Kabini” is expected to deliver an increase of more than 50 percent in performance3 over the previous generation of AMD essential computing APUs (codenamed “Brazos 2.0.”)
    Both APUs are scheduled to ship in the first half of 2013

    so AMD is really close to a server SoC to be delivered soon as well.

    The “more information” sections which follow her are:

    1. The Announcement
    2. Software Partners
    3. Hardware Partners


    1. The Announcement

    HP Moonshot [MultiVuOnlineVideo YouTube channel, April 8, 2013]

    HP today unveiled the world’s first commercially available HP Moonshot system, delivering compelling new infrastructure economics by using up to 89 percent less energy, 80 percent less space and costing 77 percent less, compared to traditional servers. Today’s mega data centers are nearing a breaking point where further growth is restricted due to the current economics of traditional infrastructure. HP Moonshot servers are a first step organizations can take to address these constraints.

    HP Launches New Class of Server for Social, Mobile, Cloud and Big Data [press release, April 8, 2013]

    Software defined servers designed for the data center and built for the planet
    … Built from HP’s industry-leading server intellectual property (IP) and 10 years of extensive research from HP Labs, the company’s central research arm, HP Moonshot delivers a significant improvement in energy, space, cost and simplicity. …
    The HP Moonshot system consists of the HP Moonshot 1500 enclosure and application-optimized HP ProLiant Moonshot servers. These servers will offer processors from multiple HP partners, each targeting a specific workload.
    With support for up to 1,800 servers per rack, HP Moonshot servers occupy one-eighth of the space required by traditional servers. This offers a compelling solution to the problem of physical data center space.(3) Each chassis shares traditional components including the fabric, HP Integrated Lights-Out (iLo) management, power supply and cooling fans. These shared components reduce complexity as well as add to the reduction in energy use and space.  
    The first HP ProLiant Moonshot server is available with the Intel® Atom S1200 processor and supports web-hosting workloads. HP Moonshot 1500, a 4.3u server enclosure, is fully equipped with 45 Intel-based servers, one network switch and supporting components.
    HP also announced a comprehensive roadmap of workload-optimized HP ProLiant Moonshot servers incorporating processors from a broad ecosystem of HP partners including AMD, AppliedMicro, Calxeda, Intel and Texas Instruments Incorporated.

    Scheduled to be released in the second half of 2013, the new HP ProLiant Moonshot servers will support emerging web, cloud and massive scale environments, as well as analytics and telecommunications. Future servers will be delivered for big data, high-performance computing, gaming, financial services, genomics, facial recognition, video analysis and other applications.

    The HP Moonshot system is immediately available in the United States and Canada and will be available in Europe, Asia and Latin America beginning next month.
    Pricing begins at $61,875 for the enclosure, 45 HP ProLiant Moonshot servers and an integrated switch.(4)
    (4) Estimated U.S. street prices. Actual prices may vary.

    More information:
    HP Moonshot System [Family data sheet, April 8, 2013]
    HP Moonshot – The Disruption [HP Event registration page at ‘thedisruption.com’ with embedded video gallery, press kit and more, originally created on April 12, 2010, obviously updated for the April 8, 2013 event]

    Moonshot 101 [HewlettPackardVideos YouTube channel, April 8, 2013]

    Paul Santeler, Vice President & GM of Hyperscale Business Unit at HP, discusses how HP Project Moonshot creates the new style of IT.http://hp.com/go/moonshot

    Alert for Microsoft:

    [4:42] We defined the industry standard server market [reference to HP’s Compaq heritage] and we’ve been the leader for years. With Moonshot we bring to find the market and taking it to the next level. [4:53]

    People Behind HP Moonshot [HP YouTube channel, April 10, 2013]

    HP Moonshot is a groundbreaking new class of server that requires less energy, less space and less cost. Built from HP’s industry-leading server IP and 10 years of research from HP Labs, HP Moonshot is an example of the best of HP working together. In the video: Gerald Kleyn, Director of Platform Research and Development, Hyperscale Business Unit, Industry Standard Servers; Scott Herbel, Worldwide Product Marketing Manager, Hyperscale Business Unit, Industry Standard Servers; Ron Mann, Director of Engineering, Industry Standard Servers; Kelly Pracht, Hardware Platform Manager R&D, Hyperscale Business Unit, Industry Standard Servers; Mike Sabotta, Distinguished Technologist, Hyperscale Business Unit, Industry Standard Servers; Dwight Barron, HP Fellow, Chief Technologist, Hyperscale Business Unit, Industry Standard Servers. For more information, visit http://www.hpnext.com.

    HP Moonshot System Tour [HewlettPackardVideos YouTube channel, April 8, 2013]

    Kelly Pracht, Moonshot Hardware Platform Program Manager, HP, takes you on a private tour of the HP Moonshot System and introduces the foundational HW components of HP Project Moonshot. This video guides you around the entire system highlighting the cartridges and switches.http://hp.com/go/moonshot

    HP Moonshot System is Hot Pluggable [HewlettPackardVideos YouTube channel, April 8, 2013]

    “Show me around the HP Moonshot System!” Vicki Doehring, Moonshot Hardware Engineer, HP, shows us just how simple and intuitive it is to remove components in the HP Moonshot System. This video explains how HP’s hot pluggable technology works with the HP Moonshot System.http://hp.com/go/moonshot

    Alert for Microsoft: how and when will you have a system like this with all the bells and whistles as presented above, as well as the rich ecosystem of hardware and software partners given below 

    HP Pathfinder Innovation Ecosystem [HewlettPackardVideos YouTube channel, April 8, 2013]

    A key element of HP Moonshot, the HP Pathfinder Innovation Ecosystem brings together industry leading sofware and hardware partners to accelerate the development of workload optimized applications. http://hp.com/go/moonshot

    Software partners:

    What Linaro is saying about HP Moonshot [HewlettPackardVideos YouTube channel, April 8, 2013]

    Linaro discusses HP’s Project Moonshot and the cost, space, and efficiency innovations being enabled through the Pathfinder Innovation Ecosystem. http://hp.com/go/moonshot

    Alert for Microsoft:

    [0:11] In HP approach Linaro is about forming an enterprise group. What they were hoping for, what’s happened is to get a bunch of companies who are interested in taking the ARM architecture into the server space. [0:26]

    Canonical joins Linaro Enterprise Group (LEG) and commits Ubuntu Hyperscale Availability for ARM V8 in 2013 [press release, Nov 1, 2012]

      • Canonical continues its leadership of commercial deployment for ARM-based servers through membership of Linaro Enterprise Group (LEG)
      • Ubuntu, the only commercially supported OS for ARM v7 today, commits to support ARM v8 server next year
      • Ubuntu extends its position as the natural choice for hyperscale  server computing with long term support

    … “Canonical has been supporting our work optimising and consolidating the Linux kernel since our founding in June 2010”, said George Grey, CEO of Linaro. “We’re very happy to welcome them as a member of the Linaro Enterprise Group, building on our relationship to help accelerate development of the ARM server software ecosystem.” …

    … “Calxeda has been thrilled with Canonical’s leadership in developing the ARM ecosystem”,  said Karl Freund, VP marketing at Calxeda. “These guys get it. They are driving hard and fast, already delivering enterprise-class code and support for Calxeda’s 32-bit product today to our mutual clients.  Working together in LEG will enable us to continue to build on the momentum we have already created.” …

    What Canonical is saying about HP Moonshot [HewlettPackardVideos YouTube channel, April 8, 2013]

    HP Moonshot and Ubuntu work together [Ubuntu partner site, April 9, 2013]

    … Ubuntu, as the lead operating system platform for x86 and ARM-based HP Moonshot Systems, featured extensively at the launch of the program in April 2013. …
    Ubuntu Server is the only OS fully operational today across HP Moonshot x86 and ARM servers, launched in April 2013.
    Ubuntu is recognised as the leader in scale out and Hyperscale. Together, Canonical and HP are delivering massive reductions in data-center energy, space and costs. …

    Canonical has been working with HP for the past two years
    on HP Moonshot
    , and with Ubuntu, customers can achieve higher performance with greater manageability across both x86 and ARM chip sets” Paul Santeler, VP & GM, Hyperscale Business Unit, HP

    Ubuntu & HP’s project Moonshot [Canonical blog, Nov 2, 2011]

    Today HP announced Project Moonshot  – a programme to accelerate the use of low power processors in the data centre.
    The three elements of the announcement are the launch of Redstone – a development platform that harnesses low-power processors (both ARM & x86),  the opening of the HP Discovery lab in Houston and the Pathfinder partnership programme.
    Canonical is delighted to be involved in all three elements of HP’s Moonshot programme to reduce both power and complexity in data centres.
    imageThe HP Redstone platform unveiled in Palo Alto showcases HP’s thinking around highly federated environments and Calxeda’s EnergyCore ARM processors. The Calxeda system on chip (SoC) design is powered by Calxeda’s own ARM based processor and combines mobile phone like power consumption with the attributes required to run a tangible proportion of hyperscale data centre workloads.
    The promise of server grade SoC’s running at less than 5W and achieving per rack density of 2800+ nodes is impressive, but what about the software stacks that are used to run the web and analyse big data – when will they be ready for this new architecture?
    Ubuntu Server is increasingly the operating system of choice for web, big data and cloud infrastructure workloads. Films like Avatar are rendered on Ubuntu, Hadoop is run on it and companies like Rackspace and HP are using Ubuntu Server as the foundation of their public cloud offerings.
    The good news is that Canonical has been working with ARM and Calxeda for several years now and we released the first version of Ubuntu Server ported for ARM Cortex A9 class  processors last month.
    The Ubuntu 11.10 release (download) is an functioning port and over the next six months and we will be working hard to benchmark and optimize Ubuntu Server and the workloads that our users prioritize on ARM.  This work, by us and by upstream open source projects is going to be accelerated by today’s announcement and access to hardware in the HP Discovery lab.
    As HP stated today, this is beginning of a journey to re-inventing a power efficient and less complex data center. We look forward to working with HP and Calxeda on that journey.

    The biggest enterprise alert for Microsoft because of what was discussed in Will Microsoft Stand Out In the Big Data Fray? [Redmondmag.com, March 22, 2013]: What NuoDB is saying about HP Moonshot [HewlettPackardVideos YouTube channel, April 9, 2013] especially as it is a brand new offering, see NuoDB Announces General Availability of Industry’s First & Only Cloud Data Management System at Live-Streamed Event [press release, Jan 15, 2013] now available in archive at this link: http://go.nuodb.com/cdms-2013-register-e.html

    Barry Morris, founder and CEO of NuoDB discusses HP’s Project Moonshot and the database innovations delivered by the combined offering

    Extreme density on HP’s Project Moonshot [NuoDB Techblog, April 9, 2013]

    A few months ago HP came to us with something very cool. It’s called Project Moonshot, and it’s a new way of thinking about how you design infrastructure. Essentially, it’s a composable system that gives you serious flexibility and density.

    A single Moonshot System is 4.3u tall and holds 45 independent servers connected to each other via 1-Gig Ethernet. There’s a 10-Gig Ethernet interface to the system as a whole, and management interfaces for the system and each individual server. The long-term design is to have servers that provide specific capabilities (compute, storage, memory, etc.) and can scale to up to 180 nodes in a single 4.3u chassis.
    The initial system, announced this week, comes with a single server configuration: an Intel Atom S1260 processor, 8 Gigabytes of memory and either a 200GB SSD or a 500GB HDD. On its own, that’s not a powerful server, but when you put 45 of these into a 4.3 rack-unit space you get something in aggregate that has a lot of capacity while still drawing very little power (see below). The challenge, then, is how to really take advantage of this collection of servers.

    NuoDB on Project Moonshot: Density and Efficiency

    We’ve shown how NuoDB can scale a single database to large transaction rates. For this new system, however, we decided to try a different approach. Rather than make a single database scale to large volume we decided to see how many individual, smaller databases we could support at the same time. Essentially, could we take a fully-configured HP Project Moonshot System and turn it into a high-density, low-power, easy to manage hosting appliance.

    To put this in context, think about a web site that hosts blogs. Typically, each blog is going to have a single database supporting it (just like this blog you’re reading). The problem is that while a few blogs will be active all the time, most of them see relatively light traffic. This is known as a long-tail pattern. Still, because the blogs always need to be available, so too the backing databases always need to be running.

    This leads to a design trade-off. Do you map the blogs to a single database (breaking isolation and making management harder) or somehow try to juggle multiple database instances (which is hard to automate, expensive in resource-usage and makes migration difficult)? And what happens when a blog suddenly takes off in popularity? In other words, how do you make it easy to manage the databases and make resource-utilization as efficient as possible so you don’t over-spend on hardware?

    As I’ve discussed on this blog NuoDB is a multi-tenant system that manages individual databases dynamically and efficiently. That should mean that we’re a perfect fit for this very cool (pun intended) new system from HP.

    The Design

    After some initial profiling on a single server, we came up with a goal: support 7,200 active databases. You can read all about how we did the math, but essentially this was a balance between available CPU, Memory, Disk and bandwidth. In this case a “database” is a single Transaction Engine and Storage Manager pair, running on one of the 45 available servers.

    When we need to start a database, we pick the server that’s least-utilized. We choose this based on local monitoring at each server that is rolled up through the management tier to the Connection Brokers. It’s simple to do given all that NuoDB already provides, and because we know what each server supports it lets us calculate a single capacity percentage.
    It gets better. Because a NuoDB database is made of an agile collection of processes, it’s very inexpensive to start or stop a database. So, in addition to monitoring for server capacity we also watch what’s going on inside each database, and if we think it’s been idle long enough that something else could use the associated resources more effectively we shut it down. In other words, if a database isn’t doing anything active we stop it to make room for other databases.
    When an SQL client needs to access that database, we simply re-start it where there are available resources. We call this mechanism hibernating and waking a database. This on-demand resource management means that while there are some number of databases actively running, we can really support a much larger in total (remember, we’re talking about applications that exhibit a long-tail access pattern). With this capability, our original goal of 7,200 active databases translates into 72,000 total supported databases. On a single 4.3u System.
    The final piece we added is what we call database bursting. If a single database gets really popular it will start to take up too many resources on a single server. If you provision another server, separate from the Moonshot System, then we’ll temporarily “burst” a high-activity database to that new host until activity dies down. It’s automatic, quick and gives you on-demand capacity support when something gets suddenly hot.
    The Tests
    I’m not going to repeat too much here about how we drove our tests. That’s already covered in the discussion on how we’re trying to design a new kind of benchmark focused on density and efficiency. You should go check that out … it’s pretty neat. Suffice it say, the really critical thing to us in all of this was that we were demonstrating something that solves a real-world problem under real-world load.
    You should also go read about how we setup and ran on a Moonshot System. The bottom-line is that the system worked just like you’d expect, and gave us the kinds of management and monitoring features to go beyond basic load testing.
    The Results
    We were really lucky to be given access to a full Moonshot System. It gave us a chance to test out our ideas, and we actually were able to do better than our target. You can see this in the view from our management interface running against a real system under our benchmark load. You can see there that when we hit 7200 active databases we were only at about 70% utilization, so there was a lot more room to grow. Huge thanks to HP for giving us time on a real Moonshot System to see all those idea work!

    Something that’s easy to lose track of in all this discussion is the question of power. Part of the value proposition from Project Moonshot is in energy efficiency, and we saw that in spades. Under load a single server only draws 18 Watts, and the system infrastructure is closer to 250 Watts. Taken together, that’s a seriously dense system that is using very little energy for each database.

    Bottom Line
    We were psyched to have the chance to test on a Moonshot System. It gave us the chance to prove out ideas around automation and efficiency that we’ll be folding into NuoDB over the next few releases. It also gave us the perfect platform to put our architecture through its paces and validate a lot about the flexibility of our core architecture.
    We’re also seriously impressed by what we experienced from Project Moonshot itself. We were able to create something self-contained and easy to manage that solves a real-world problem. Couple that with the fact that a Moonshot System draws so little power, the Total Cost of Ownership is impressively low.  That’s probably the last point to make about all this: the combination of our two technologies gave us something where we could talk concretely about capacity and TCO, something that’s usually hard to do in such clear terms.
    In case it’s not obvious, we’re excited. We’ve already been posting this week about some ideas that came out of this work, and we’ll keep posting as the week goes on. Look for the moonshot tag and please follow-up with comments if you’re curious about anything specific and would like to hear more!

    Project Moonshot by the Numbers [NuoDB Techblog, April 9, 2013]

    To really understand the value from HP Project Moonshot you need to think beyond the list price of one system and focus instead on the Total Cost of Ownership. Figuring out the TCO for a server running arbitrary software is often a hard (and thankless?) task, so one of the things we’ve tried to do is not just demonstrate great technology but something that naturally lets you think about TCO in a simple way. We think the final metrics are pretty simple, but to get there requires a little math.

    Executive Summary

    If you’re a CIO, and just want to know the bottom line, then we’ll ruin the suspense and cut to the chase. It will cost you about $70,500 up-front, $1,800 in your first year’s electricity bills and take 8.3 rack-units to support the web-front end and database back-end for 72,000 blogs under real-world load.

    Cost of a Single Database
    Recall that we set the goal at 72,000 databases within a single system. At launch the list price for a fully-configured Moonshot System is around $60,000, so we start out at 83 cents per-database. In practice were seeing much higher capacity in our tests, but let’s start with this conservative number.
    Now consider the power used by the system. From what we’ve measured through the iLO interfaces a single server draws no more than 18 Watts at peak load (measured against CPU and IO activity). The System itself (fans, switches etc.) draws around 250 Watts in our tests. That means that under full load each database is drawing about .015 Watts.
    NuoDB is a commercial software offering, which means that you pay up-front to deploy the software (and get support as part of that fee). For anyone who wants to run a Moonshot System in production as a super-dense NuoDB appliance we’ll offer you a flat-rate license.
    Put together, we can say that the cost per database-watt is 1.22 cents. That’s on a 4.3 rack-unit system. Awesome.
    Quantify the Supported Load
    As we discussed in our post on benchmarking, we’re trying to test under real-world load. As a simple starting-point we chose a profile based on WordPress because it’s fairly ubiquitous and has somewhat serious transactional requirements. In our benchmarking discussion we explain that a typical application action (post, read, comment) does around 20 SQL operations.
    Given 72,000 databases most of these are fairly inactive, so on average we’ll say that each database gets about 250 hits a day (generous by most reports I’ve seen). That’s 18,000,000 hits a day or 208 hits per-second. 4,166 SQL statements a second isn’t much for a single database, but it’s pretty significant given that we’re spreading it across many databases some of which might have to be “woken” on-demand.
    HP was generous enough not only to give us time on a Moonshot System but also access to some co-located servers for driving our load tests. In this case, 16 lower-powered ARM-based Calxeda systems that all went through the same 1-Gig ethernet connection to our Moonshot System. These came from HP’s Discovery Lab; check out our post about working with the Moonshot System for more details.
    From these load-drivers we able to run our benchmark application with up to 16 threads per server, simulating 128 simultaneous clients. In this case a typical “client” would be a web server trying to respond to a web client request. We averaged around 320 hits per-second, well above the target of 208. From what we could observe, we expect that given more capable network and client drivers we would be able to get 3 or 4 times that rate easily.
    Tangible Cost
    We have the cost of the Moonshot System itself. We also know that it can support expected load from a fairly small collection of low-end servers. In our own labs we use systems that cost around $10,000, fit in 3 rack-units and would be able to drive at least the same kind of load we’re citing here. Add a single switch at around $500 and you have a full system ready to serve blogs. That’s $70,500 total in 8.3 rack units, still under $1 per database.
    I don’t know what power costs you have in your data center, but I’ve seen numbers ranging from 2.5 to 25 cents per Kilowatt-Hour. In our tests, where we saw .015 Watts per-database, if you assume an average rate of 13.75 cents per KwH that comes out to .00020625 cents per-hour per-database in energy costs. In one year, with no down-time, that would cost you $1,276.77 in total electricity fees.
    Just as an aside, according to the New York Times, Facebook uses around 60,000,000 Watts a year!
    One of the great things about a Moonshot System is that the 45 servers are already being switched inside the chassis. This means that you don’t need to buy switches & cabling, and you don’t need to allocate all the associated space in your racks. For our systems administrator that alone would make him very happy.
    Intangible Cost
    What I haven’t been talking about in all of this are the intangible costs. This is where figuring out TCO becomes harder.
    For instance, one of the value-propositions here is that the Moonshot System is a self-contained, automated component. That means that systems administrators are freed up from the tasks of figuring out how to allocate and monitor databases, and how to size the data-center for growth. Database developers can focus more easily on their target applications. CIOs can spend less time staring at spreadsheets … or, at least, can allocate more time to spreadsheets on different topics.
    Providing a single number in terms of capacity makes it easy to figure out what you need in your datacenter. When a single server within a Moonshot System fails you can simply replace it, and in the meantime you know that the system will still run smoothly just with slightly lower capacity. From a provisioning point of view, all you need to figure out is where your ceiling is and how much stand-by capacity you need to have at the ready.
    NuoDB by its nature is dynamic, even when you’re doing upgrades. This means that you can roll through a running Moonshot System applying patches or new versions with no down-time. I don’t know how you calculate the value in saved cost here, but you probably do!
    Comparisons and Planned Optimizations
    It’s hard to do an “apples-to-apples” comparison against other database software here. Mostly, this is because other databases aren’t designed to be dynamic enough to support hibernation, bursting and capacity-based automated balancing. So, you can’t really get the same levels of density, and a lot of the “intangible” cost benefits would go away.
    Still, to be fair, we tried running MySQL on the same system and under the same benchmarks. We could indeed run 7200 instances, although that was already hitting the upper-bounds of memory/swap. In order to get the same density you would need 10 Moonshot Systems, or you would need larger-powered expensive servers. Either way, the power, density, automation and efficiency savings go out the window, and obviously there’s no support for bursting to more capable systems on-demand.
    Unsurprisingly, the response time was faster on-average (about half the time) from MySQL instances. I say “unsurprisingly” for two reasons. First, we tried to use schema/queries directly from WordPress to be fair in our comparison, and these are doing things that are still known to be less-optimized in NuoDB. They’re also in the path of what we’re currently optimizing and expect to be much faster in the near-term.
    The second is that NuoDB clients were originally designed assuming longer-running connections (or pooled connections) to databases that always run with security & encryption enabled. We ran all of our tests in our default modes to be fair. That means we’re spending more time on each action setting up & tearing down a connection. We’ve already been working on optimizations here that would shrink the gap pretty substantially.
    In the end, however, our response time is still on the order of a few hundred milliseconds worst-case, and is less important than the overall density and efficiency metrics that we proved out. We think the value in terms of ease of use, density, flexibility on load spikes and low-cost speaks for itself. This setup is inexpensive by comparison to deploying multiple servers and supports what we believe is real-world load. Just wait until the next generation of HP Project Moonshot servers roll out and we can start scaling out individual databases at the same time!

    More information:
    Benchmarking Density & Efficiency [NuoDB Techblog, April 9, 2013]
    Database Hibernation and Bursting [NuoDB Techblog, April 8, 2013]
    An Enterprise Management UI for Project Moonshot [NuoDB Techblog, April 9, 2013]Regarding the cloud based version of NuoDB see:
    NuoDB Partners with Amazon [press release, March 26, 2013]
    NuoDB Extends Database Leadership in Scalability & Performance on a Private Cloud [press release, March 14, 2013] “… the industry’s first and only patented, elastically scalable Cloud Data Management System (CDMS), announced performance of 1.84 million transactions per second (TPS) running on 32 machines. … With NuoDB Starlings release 1.0.1, available as of March 1, 2013, the company has made advancements in performance and scalability and customers can now experience 26% improvement in TPS per machine.
    Google Compute Engine: interview with NuoDB [GoogleDevelopers YouTube channel, March 21, 2013]

    Meet engineers from NuoDB: an elastically scalable SQL database built for the cloud. We will learn about their approach to distributed SQL databases and get a live demo. We’ll cover the steps they took to get NuoDB running on Google Compute Engine, talk about how they evaluate infrastructure (both physical hardware and cloud), and reveal the results of their evaluation of Compute Engine performance.

    Actually Calxeda was best to explain the preeminence of software over the SoC itself:
    Karl Freund from Calxeda – HP Moonshot 2013 – theCUBE [siliconangle YouTube channel, April 8, 2013], see also HP Moonshot: It’s a lot closer than it looks! [Calxeda’s ‘ARM Servers, Now!’ blog, April 8, 2013]

    Karl Freund, VP of Marketing, Calxeda, at HP Moonshot 2013 with John Furrier and Dave Vellante.

    as well as ending with Calxeda’s very practical, gradual approach to ARM based served market with things like:

    [16.03] Our 2nd generation platform called Midway, which will be out later this year [in the 2nd half of the year], that’s probably the target for Big Data. Our current product is great for web serving, it’s great for media serving, it’s great for storage. It doesn’t have enough memory for Big Data … in a large. So we’ll getting that 2nd generation product out, and that should be a really good Big Data platform. Why? Because it’s low power, it’s low cost, but it’s also got a lot of I/O. Big Data is all that moving a lot of data around. And if you do that more cost effectively you save a lot of money. [16:38]

    mentioning also that their strategy is using standard ARM cores like the Cortex-A57 for their H1 2014 product, and focus on things like the fabric and the management, which actually allows them to work with a streamlined staff of around 150 people.

    Detailed background about Calxeda in a concise form:
    Redefining Datacenter Efficiency: An Overview of Calxeda’s architecture and early performance measurements [Karl Freund, Nov 12, 2012] from where the core info is:

      • Founded in 2008   
      • $103M Funding       
      • 1st Product Announced with HP,  Nov  2011   
      • Initial Shipments in Q2 2012   
      • Volume production in Q4 2012

    image

    image* The power consumed under normal operating conditions
    under full application load (ie, 100% CPU utilization)

    imageA small Calxeda Cluster: a Simple Example
    • Start with four ServerNodes
    • Consumes only 20W total power   
    • Connected via distributed fabric switches   
    • Connect up to 4 SATA drives per node   
    • Then scale this to thousands of ServerNodes

    EnergyCard: a Quad-Node Reference Design

      • Four-node reference platform from Calxeda
      • Available as product and/or design
      • Plugs into OEM system board with passive fabric, no additional switch HW
        EnergyCard delivers 80Gb Bandwidth to the system board. (8 x 10Gb links)

    image

    image

    It is also important to have a look at what were the Open Source Software Packages for Initial Calxeda Shipments [Calxeda’s ‘ARM Servers, Now!’ blog, May 24, 2012]

    We are often asked what open-source software packages are available for initial shipments of Calxeda-based servers.

    Here’s the current list (changing frequently).  Let us know what else you need!

    image

    Then Perspectives From Linaro Connect [Calxeda’s ‘ARM Servers, Now!’ blog, March 20, 2013] sheds more light on the recent software alliances which make Calxeda to deliver:

    – From Larry Wikelius,   Co-Founder and VP Ecosystems,  Calxeda:

    The most recent Linaro Connect (Linaro Connect Asia 2013 – LCA), held in Hong Kong the first week of March, really put a spotlight on the incredible momentum around ARM based technology and products moving into the Data Center.  Yes – you read that correctly – the DATA CENTER!

    When Linaro was originally launched almost three years ago the focus was exclusively on the mobile and client market – where ARM has and continues to be dominant.  However, as Calxeda has demonstrated, the opportunity for the ARM architecture goes well beyond devices that you carry in your pocket.  Calxeda was a key driver in the formation of the Linaro Enterprise Group (LEG), which was publicly launched at the previous LinaroConnect event in Copenhagen in early November, 2012.

    LEG has been an exciting development for Linaro and now has 13 member companies that include server vendors such as Calxeda, Linux distribution companies Red Hat and Canonical, OEM representation from HP and even Hyperscale Data Center end user Facebook.  There were many sessions throughout the week that focused on Server specific topics such as UEFI, ACPI, Virtualization, Hyperscale Testing with LAVA and Distributed Storage.  Calxeda was very active throughout the week with the team participating directly in a number of roadmap definition sessions, presenting on Server RAS and providing guidance in key areas such as application optimization and compiler focus for Servers.

    Linaro Connect is proving to be a tremendous catalyst for the the growing eco-system around the ARM software community as a whole and the server segment in particular.  A great example of this was the keynote presentation given jointly by Mark Heath and Lars Kurth from Citrix on Tuesday morning.  Mark is the VP of XenServer at Citirix and Lars is well know in the OpenSource community for his work with Xen.  The most exciting announcement coming out of Mark’s presentation is that Citrix will be joining Linaro as a member of LEG.  Citrix will be certainly prove to be another valuable member of the Linaro team and during the week attendees were able to appreciate how serious Citrix is about supporting ARM servers.  The Xen team has not only added full support for ARM V7 systems in the Xen 4.3 release but they have accomplished some very impressive optimizations for the ARM platform.  The Xen team has leveraged Device Tree for optimal device discovery.  Combined with a number of other code optimizations they showed a dramatically smaller code base for the ARM platform.  We at Calxeda are thrilled to welcome Citrix into LEG!

    As an indication of the draw that the Linaro Connect conference is already having on the broader industry the Open Compute Project (OCP) held their first International Event co-incident with LCA at the same venue.  The synergy between Linaro and OCP is significant with the emphasis on both organizations around Open Source development (one software and one hardware) along with the dramatically changing design points for today’s Hyperscale Data Center.  In fact the keynote at LCA on Wednesday morning really put a spotlight on how significant this is likely to be.  Jason Taylor, Director of Capacity Engineering and Analysis at Facebook, presented on Facebook’s approach to ARM based servers.   Facebook’s consumption of Data Center equipment is quite stunning – Jason quoted from Facebook’s 10-Q filed in October 2012 which stated that “The first nine months of 2012 … $1.0 billion for capital expenditures” related to data center equipment and infrastructure.  Clearly with this level of investment Facebook is extremely motivated to optimize where possible.  Jason focused on the strategic opportunity for ARM based severs in a disaggregated Data Center of the future to provide lower cost computing capabilities with much greater flexibility.

    Calxeda has been very active in building the Server Eco-System for ARM based servers.  This week in Hong Kong really underscored how important that investment has become – not just for Calxeda but for the industry as a whole. Our commitment to Open Source software development in general and Linaro in particular has resulted in a thriving Linux Infrastructure for ARM servers that allows Calxeda to leverage and focus on key differentiation for our end users.  The Open Compute Project, which we are an active member in and have contributed to key projects such as the Knockout Storage design as well as the Open Slot Specification, demonstrates how the combination of an Open Source approach for both Software and Hardware can compliment each other and can drive Data Center innovation.  We are early in this journey but it is very exciting!

    Calxeda will continue to invest aggressively in forums and industry groups such as these to drive the ARM based server market.  We look forward to continue to work with the incredibly innovative partners that are members in these groups and we are confident that more will join this exciting revolution.  If you are interested in more information on these events and activities please reach out to us directly at info@calxeda.com.

    The next Linaro Connnect is scheduled for early July in Dublin. We expect more exciting events and topics there and hope to see you there!

    They are also referring on their blog to Mobile, cloud computing spur tripling of micro server shipments this year [IHS iSuppli press release, Feb 6, 2013] which showing the general market situation well into the future as:

    Driven by booming demand for new data center services for mobile platforms and cloud computing, shipments of micro servers are expected to more than triple this year, according to an IHS iSuppli Compute Platforms Topical Report from information and analytics provider IHS (NYSE: IHS).
    Shipments this year of micro servers are forecast to reach 291,000 units, up 230 percent from 88,000 units in 2012. Shipments of micro servers commenced in 2011 with just 19,000 units. However, shipments by the end of 2016 will rise to some 1.2 million units, as shown in the attached figure.

    image

    The penetration of micro servers compared to total server shipments amounted to a negligible 0.2 percent in 2011. But by 2016, the machines will claim a penetration rate of more than 10 percent—a stunning fiftyfold jump.
    Micro servers are general-purpose computers, housing single or multiple low-power microprocessors and usually consuming less than 45 watts in a single motherboard. The machines employ shared infrastructure such as power, cooling and cabling with other similar devices, allowing for an extremely dense configuration when micro servers are cascaded together.
    “Micro servers provide a solution to the challenge of increasing data-center usage driven by mobile platforms,” said Peter Lin, senior analyst for compute platforms at IHS. “With cloud computing and data centers in high demand in order to serve more smartphones, tablets and mobile PCs online, specific aspects of server design are becoming increasingly important, including maintenance, expandability, energy efficiency and low cost. Such factors are among the advantages delivered by micro servers compared to higher-end machines like mainframes, supercomputers and enterprise servers—all of which emphasize performance and reliability instead.”
    Server Salad Days
    Micro servers are not the only type of server that will experience rapid expansion in 2013 and the years to come. Other high-growth segments of the server market are cloud servers, blade servers and virtualization servers.
    The distinction of fastest-growing server segment, however, belongs solely to micro servers.
    The compound annual growth rate for micro servers from 2011 to 2016 stands at a remarkable 130 percent—higher than that of the entire server market by a factor of 26. Shipments will rise by double- and even triple-digit percentages for each year during the period.
    Key Players Stand to Benefit
    Given the dazzling outlook for micro servers, makers with strong product portfolios of the machines will be well-positioned during the next five years—as will their component suppliers and contract manufacturers.
    A slew of hardware providers are in line to reap benefits, including microprocessor vendors like Intel, ARM and AMD; server original equipment manufacturers such as Dell and Hewlett-Packard; and server original development manufacturers including Taiwanese firms Quanta Computer and Wistron.
    Among software providers, the list of potential beneficiaries from the micro server boom extends to Microsoft, Red Hat, Citrix and Oracle. For the group of application or service providers that offer micro servers to the public, entities like Amazon, eBay, Google and Yahoo are foremost.
    The most aggressive bid for the micro server space comes from Intel and ARM.
    Intel first unveiled the micro server concept and reference design in 2009, ostensibly to block rival ARM from entering the field.
    ARM, the leader for many years in the mobile world with smartphone and tablet chips because of the low-power design of its central processing units, has been just as eager to enter the server arena—dominated by x86 chip architecture from the likes of Intel and a third chip player, AMD. ARM faces an uphill battle, as the majority of server software is written for x86 architecture. Shifting from x86 to ARM will also be difficult for legacy products.
    ARM, however, is gaining greater support from software and OS vendors, which could potentially put pressure on Intel in the coming years.
    Read More > Micro Servers: When Small is the Next Big Thing

    Then there are a number of Intel competitive posts on Calxeda’s ‘ARM Servers, Now!’ blog:
    What is a “Server-Class” SOC? [Dec 12, 2012]
    Comparing Calxeda ECX1000 to Intel’s new S1200 Centerton chip [Dec 11, 2012]
    which you can also find in my Intel targeting ARM based microservers: the Calxeda case [‘Experiencing the Cloud’ blog, Dec 14, 2012] with significantly wider additional information upto binary translation from x86 to ARM with Linux

    See also:
    ARM Powered Servers: 2013 is off to a great start & it is only March! [Smart Connected Devices blog of ARM, March 6, 2013]
    Moonshot – a shot in the ARM for the 21st century data center [Smart Connected Devices blog of ARM, April 9, 2013]
    Are you running out of data center space? It may be time for a new server architecture: HP Moonshot [Hyperscale Computing Blog of HP, April 8, 2013]
    HP Moonshot: the HP Labs team that did some of the groundbreaking research [Innovation @ HP Labs blog of HP, April 9, 2013]
    HP Moonshot: An Accelerator for Hyperscale Workloads [Moor Insights White Paper, April 8, 2013]
    Comparing Pattern Mining on a Billion Records with HP Vertica and Hadoop [HP Vertica blog, April 9, 2013] by team of HP Labs researchers show how the Vertica Analytics Platform can be used to find patterns from a billion records in a couple of minutes, about 9x faster than Hadoop.
    PCs and cloud clients are not parts of Hewlett-Packard’s strategy anymore [‘Experiencing the Cloud’, Aug 11, 2011 – Jan 17, 2012] see the Autonomy IDOL related content there
    ENCO Systems Selects HP Autonomy for Audio and Video Processing [HP Autonomy press release, April 8, 2013]

    HP Autonomy today announced that ENCO Systems, a global provider of radio automation and live television audio solutions, has selected Autonomy’s Intelligent Data Operating Layer (IDOL) to upgrade ENCO’s latest-generation enCaption product.

    ENCO Systems provides live automated captioning solutions to the broadcast industry, leveraging technology to deliver closed captioning by taking live audio data and turning it into text. ENCO Systems is capitalizing on IDOL’s unique ability to understand meaning, concepts and patterns within massive volumes of spoken and visual content to deliver more accurate speech analytics as part of enCaption3.

    “Many television stations count on ENCO to provide real-time closed captioning so that all of their viewers get news and information as it happens, regardless of their auditory limitations,” said Ken Frommert, director, Marketing, ENCO Systems. “Autonomy IDOL helps us provide industry-leading automated closed captioning for a fraction of the cost of traditional services.”
    enCaption3 is the only fully automated speech recognition-based closed captioning system for live television that does not require speaker training. It gives broadcasters the ability to caption their programming, including breaking news and weather, any time, day or night, since it is always on and always available. enCaption3 provides captioning in near real time-with only a 3 to 6 second delay-in nearly 30 languages.
    “Television networks are under increasing pressure to provide real-time closed captioning services-they face fines if they don’t, and their growing and diverse viewers demand it,” said Rohit de Souza, general manager, Power, HP Autonomy. “This is another example of a technology company integrating Autonomy IDOL to create a stronger, faster and more accurate product offering, and demonstrates yet another powerful way in which IDOL can be applied to help organizations succeed in the human information era.”

    Using Big Data to change the game in the Energy industry [Enterprise Services Blog of HP, Oct 24, 2012]

    … Tools like HP’s Autonomy that analyzes the unstructured data found in call recordings, survey responses, chat logs, e-mails, social media posts and more. Autonomy’s Intelligent Data Operating Layer (IDOL) technology uses sophisticated pattern-matching techniques and probabilistic modeling to interpret information in much the same way that humans do. …

    Stouffer Egan turns the tables on computers in keynote address at HP Discover [Enterprise Services Blog of HP, June 8, 2012]

    For decades now, the human mind has adjusted itself to computers by providing and retrieving structured data in two-dimensional worksheets with constraints on format, data types, list of values, etc. But, this is not the way the human mind has been architected to work. Our minds have the uncanny ability to capture the essence of what is being conveyed in a facial expression in a photograph, the tone of voice or inflection in an audio and the body language in a video. At the HP Discover conference, Autonomy VP for United States, Stouffer Egan showed the audience how software can begin to do what the human mind has being doing since the dawn of time. In a demonstration where Iron Man came live out of a two-dimensional photograph, Egan turned the tables on computers. It is about time computers started thinking like us rather than us forcing us to think like them.
    Egan states that the “I” in IT is where the change is happening. We have a newfound wealth of data through various channels including video, social, click stream, audio, etc. However, data unprocessed without any analysis is just that — raw data. For enterprises to realize business value from this unstructured data, we need tools that can process it across multiple media. Imagine software that recognizes the picture in a photograph and searches for a video matching the person in the picture. The cover page of a newspaper showing a basketball star doing a slam dunk suddenly turns live pulling up the video of this superstar’s winning shot in last night’s game. …


    2. Software Partners

    image
    HP Moonshot is setting the roadmap for next generation data centers by changing the model for density, power, cost and innovation. Ubuntu has been designed to meet the needs of Hyperscale customers and, combined with its management tools, is ideally suited be the operating system platform for HP Moonshot. Canonical has been working with HP since the beginning of the Moonshot Project, and Ubuntu is the only OS integrated and fully operational across the complete Moonshot System covering x86 and ARM chip technologies.
    What Canonical is saying about HP Moonshot
    image
    As mobile workstyles become the norm, the scalability needs of today’s applications and devices are increasingly challenging what traditional infrastructures can support. With HP’s Moonshot System, customers will be able to rapidly deploy, scale, and manage any workload with dramatically lower space and energy constraints. The HP Pathfinder Innovation Ecosystem is a prime opportunity for Citrix to help accelerate the development of innovative solutions that will benefit our enterprise cloud, virtualization and mobility customers.
    image
    We’re committed to helping enterprises achieve the most from their Big Data initiatives. Our partnership with HP enables joint customers to keep and query their data at scale so they can ask bigger questions and get bigger answers. By using HP’s Moonshot System, our customers can benefit from the improved resource utilization of next generation data center solutions that are workload optimized for specific applications.
     
    imageToday’s interactive applications are accessed 24×365 by millions of web and mobile users, and the volume and velocity of data they generate is growing at an unprecedented rate. Traditional technologies are hard pressed to keep up with the scalability and performance demands of these new applications. Couchbase NoSQL database technology combined with HP’s Moonshot System is a powerful offering for customers who want to easily develop interactive web and mobile applications and run them reliably at scale. image
    Our partnership with HP facilitates CyWee’s goal of offering solutions that merge the digital and physical worlds. With TI’s new SoCs, we are one step closer to making this a reality by pushing state-of-the-art video to specialized server environments. Together, CyWee and HP will deliver richer multimedia experiences in a variety of cloud-based markets, including cloud gaming, virtual office, video conferencing and remote education.
    image
    HP’s new Moonshot System will enable organizations to increase the energy efficiency of their data centers while reducing costs. Our Cassandra-based database platform provides the massive scalability and multi-datacenter capabilities that are a perfect complement to this initiative, and we are excited to be working with HP to bring this solution to a wide range of customers.
    image
    Big data comes in a wide range for formats and types and is a result of the connected everything world we live in. Through Project Moonshot, HP has enabled a new class of infrastructure to run more efficient workloads, like Apache Hadoop, and meet the market demand of more performance for less.
    image
    The unprecedented volume and variety of data introduces unique challenges to organizations today… By combining the HP Moonshot system with Autonomy IDOL’s unique ability to understand concepts in information, organizations can dramatically reduce the cost, space, and energy requirements for their big data initiatives, and at the same time gain insights that grow revenue, reduce risk, and increase their overall Return on Information.
    image
    Big Data is not just for Big Companies – or Big Servers – anymore – it’s affecting all sectors of the market. At HP Vertica we’re very excited about the work we’ve been doing with the Moonshot team on innovative configurations and types of analytic appliances which will allow us to bring the benefits of real-time Big Data analytics to new segments of the market. The combination of the HP Vertica Analytics Platform and Moonshot is going to be a game-changer for many.
    image
    HP worked closely with Linaro to establish the Linaro Enterprise Group (LEG). This will help accelerate the development of the software ecosystem around ARM Powered servers. HP’s Moonshot System is a great platform for innovation – encouraging a wide range of silicon vendors to offer competing ‘plug-and-play’ server solutions, which will give end users maximum choice for all their different workloads.
    What Linaro is saying about HP Moonshot[HewlettPackardVideos YouTube channel, April 8, 2013]
    image
    Organizations are looking for ways to rapidly deploy, scale, and manage their infrastructure, with an architecture that is optimized for today’s application workloads. HP Moonshot System is an energy efficient, space saving, workload-optimized solution to meet these needs, and HP has partnered with MapR Technologies, a Hadoop technology leader, to accelerate innovation and deployment of Big Data solutions.
    image
    NuoDB and HP are shattering the scalability and density barriers of a traditional database server. NuoDB on the HP Moonshot System delivers unparalleled database density, where customers can now run their applications across thousands of databases on a single box, significantly reducing the total cost across hardware, software, and power consumption. The flexible architecture of HP Moonshot coupled with NuoDB’s hyper-pluggable database design and its innovative “database hibernation” technology makes it possible to bring this unprecedented hardware and software combination to market.
    What NuoDB is saying about HP Moonshot [HewlettPackardVideos YouTube channel, April 9, 2013]
    image
    As the leading solution provider for the hosting market, Parallels is excited to be collaborating in the HP Pathfinder Innovation Ecosystem. The HP Moonshot System in concert with Parallels Plesk Panel and Parallels Containers provides a flexible and efficient solution for cloud computing and hosting.
    image
    Red Hat Enterprise Linux on HP’s converged infrastructure means predictability, consistency and stability. Companies around the globe rely on these attributes when deploying applications every day, and our value proposition is just as important in the Hyperscale segment. When customers require a standard operating environment based on Red Hat Enterprise Linux, I believe they will look to the HP Moonshot System as a strong platform for high-density Hyperscale implementations.
    What Red Hat is saying about HP Moonshot [HewlettPackardVideos YouTube channel, April 8, 2013]
    image
    HP Project Moonshot’s promise of extreme low-energy servers is a game changer, and SUSE is pleased to partner with HP to bring this new innovation to market. For more than twenty years, SUSE has adapted its enterprise-grade Linux operating system to achieve ever-increasing performance needs that succeed both today and tomorrow in areas such as Big Data and cloud computing.
    What SUSE is saying about HP Moonshot [HewlettPackardVideos YouTube channel, April 8, 2013]


    3. Hardware Partners

    image
    AMD is excited to continue our deep collaboration with HP to bring extreme low-energy, ultra dense, specialized server solutions to the market. Both companies share a passion to bring innovative workload optimized solutions to the market, enabling customers to scale-out to new levels within existing energy and space constraints. The new low-power x86 AMD Opteron™ APU is optimized in the HP Moonshot System to dramatically lower TCO in quickly emerging media oriented workloads.
    What AMD is saying about HP Moonshot
    image

    It is exciting to see HP take the lead in innovating low-energy servers for the cloud. Applied Micro’s ARM 64-bit X-Gene Server on a Chip will enable performance levels seen in today’s deployments while offering higher densities, greatly improved I/O, and substantial reductions in the total cost of ownership. Together, we will unleash innovation unlike anything we’ve seen in the server market for decades.

    What Applied Micro is saying about HP Moonshot

    image
    In the current economic and power realities, today’s server infrastructure cannot meet the needs of the next billion data users, or the evolving needs of currently supported users. Customers need innovative SoC solutions which deliver more integration and optimization than has historically been required by traditional enterprise workloads. HP’s Moonshot System is a departure from the one size fits all approach of traditional enterprise and embraces a range of ARM partner solutions that address different performance, workloads and cost points.
    What ARM is saying HP Moonshot
    image
    Calxeda and HP’s new Moonshot System are a powerful combination, and sets a new standard for ultra-efficient web and application serving. Fulfilling a journey started together in November 2011, Project Moonshot creates the foundation for the new age of application-specific computing.
    What Calxeda is saying about HP Moonshot
    image
    HP Moonshot System is a game changer for delivering optimized server solutions. It beautifully balances the need for mixing different processor solutions optimized for different workloads under a standard hardware and software framework. Cavium’s Project Thunder will provide a family of 64-bit ARM v8 processors with dense and scalable sever class performance at extremely attractive power and cost metrics. We are doing this by blending performance and power efficient compute, high performance memory and networking into a single, highly integrated SoC.
    What Cavium is saying about HP Moonshot
    image
    Intel is proud to deliver the only server class, 64-bit SoC technology that powers the first and only production shipping HP ProLiant Moonshot Server today. 64-bit Intel Atom processor S1200 family features extreme low power combined with required datacenter class capabilities for lightweight web scale workloads, such as low end dedicated hosting and static web serving. In collaboration with HP, we have a strong roadmap of additional server solutions shipping later this year, including Intel’s 2nd generation 64-bit SoC, “Avoton” based on leading 22nm manufacturing technology, that will deliver best in class energy efficiency and density for HP Moonshot System.
    What Intel is saying about HP Moonshot
    image What Marvell is saying about HP Moonshot
    image
    HP Moonshot System’s high density packaging coupled with integrated network capability provides the perfect platform to enable HP Pathfinder Innovation Ecosystem partners to deliver cutting edge technology to the hyper-scale market. SRC Computers is excited to bring its history of delivering paradigm shifting high-performance, low-power, reconfigurable processors to HP Project Moonshot’s vision of optimizing hardware for maximum application performance at lowest TCO.
    What SRC Computers is saying about HP Moonshot
    image
    The scalability and high performance at low power offered through HP’s Moonshot System gives customers an unmatched ability to adapt their solutions to the ever-changing and demanding market needs in the high performance computing, cloud computing and communications infrastructure markets. The strong collaboration efforts between HP and TI through the HP Pathfinder Innovation Ecosystem ensure that customers understand and get the most benefit from the processors at a system-level.
    What TI is saying about HP Moonshot

    TSMC’s 16nm FinFET process to be further optimised with Imagination’s PowerVR Series6 GPUs and Cadence design infrastructure

    OR After CPU level optimisation With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology [‘Experiencing the Cloud’ April 3, 2013] the world #1 foundry decided to further optimise its crucial 16nm FinFET process with the most demanding from implementation point of view PowerVR Series6 GPUs for graphics and compute applications

    Update: TSMC 16nm FinFET to enter mass production within one year after 20nm ramp-up, says Chang [DIGITIMES, April 18, 2013]

    TSMC’s 16nm FinFET process will enter mass production in less than one year after ramping up production of 20nm chips, company chairman and CEO Morris Chang said at an investors meeting today (April 18).

    Chang indicated that TSMC already moved its 20nm process to risk production in the first quarter of 2013. As for 16nm FinFET, the node will be ready for risk production by the year-end, Chang said.

    While stepping up efforts to bring newer nodes online, TSMC has revised upward its 2013 capex to US$9.5-10 billion. The foundry previously set capex for the year at US$9 billion.
    In addition, Chang reiterated his previous remark that production of TSMC’s 28nm wafers and revenues generated from the process in 2013 will triple those of 2012. The node technology will continue to play the major driver of TSMC’s revenue growth in 2013, said Chang, adding that the foundry’s share of the 28nm foundry market will remain high this year.

    The essence:

    … As part of this new phase of their relationship, Imagination will work closely with TSMC to develop highly optimised reference design flows and silicon implementations using Imagination’s industry-leading PowerVR Series6 GPUs combined with TSMC’s advanced process technologies, including 16-nanometer (nm) FinFET process technology.
    Imagination and TSMC R&D teams will also work together to create fully characterised reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology capability to demonstrate new levels of system performance and capabilities while retaining all the essential characteristics of power, silicon area and small package footprint demanded by high volume mobile SoCs. …

    … “Just as memory drove silicon processes in the ‘80s and ‘90s, and CPUs drove processes further in the late ‘90s and ‘00s, high performance mobile GPUs for graphics and compute applications are one of the major drivers for our most advanced process technologies,” says Dr. Cliff Hou, TSMC Vice President, R&D. “We’re pleased to be working with Imagination, an established leader in mobile and embedded GPU IP, to understand how best to use PowerVR GPUs to work with us to optimize future generations of our most advanced process technologies, and advanced system design techniques.” …

    This close cooperation will significantly help TSMC to reach mass production at 16nm node in H2 2014 at the latest, as shown by the advanced technology ramp-up information at TSMC given below:

    Back in November it was reported that TSMC 16nm FinFET rollout to come earlier than expected, says Digitimes Research analyst [Nov 8, 2012]:

    Taiwan Semiconductor Manufacturing Company (TSMC) is expected to ramp up 20nm production ahead of schedule, and also put its 16nm FinFET process into production far earlier than expected, according to Digitimes Research analyst Nobunaga Chai.
    Chai indicated that information revealed by TSMC at its most-recent investors meeting clearly shows that the foundry has made significant progress in the development of advanced process technology, especially its first FinFET process that will be at 16nm. TSMC’s 16nm FinFET process should be able to enter mass production in less than one year after ramping up production of 20nm chips, Chai predicts.
    Speculation has been circulating that TSMC’s 20nm process will help the foundry attract its first orders for application chips from Apple. Chai said that he expects TSMC’s 16nm FinFET process to play an important role in Apple’s “breakthrough” product. TSMC’s 20nm process is likely to grab orders for Apple’s next processor, which could be merely an upgrade of the existing A6 version.
    During a Q&A session at TSMC’s recent investors meeting, company CFO Lora Ho revealed that the foundry’s 20nm process has received around 50 product tape-outs – about one-fifth of TSMC’s previous tape-outs using 28nm process. Ho added that actual production at the newer node will not kick off until 2014.

    As for 16nm FinFET, TSMC chairman and CEO Morris Chang disclosed that the company expects to start “risk” production of the process in November 2013, followed by mass production a year later.

    and a few days ago came the news that TSMC to install 20nm fab equipment ahead of schedule, says report [DIGITIMES, April 2, 2013]

    Taiwan Semiconductor Manufacturing Company (TSMC) plans to begin installing production equipment at its 20nm-capable facilities on April 20, about two months ahead of schedule, according to a Chinese-language Economic Dailys News (EDN) report.
    Following the equipment move-in, TSMC is expected to tape out SoC products at 20nm around the end of the second quarter with initial capacity of 5,000 12-inch wafer starts per month, the report cited unnamed fab tool suppliers as indicating. The new technology node is set to enter volume production in the third quarter with monthly capacity reaching more than 10,000 wafer starts, the report said.
    TSMC internally set a target of growing its capacity for 20nm products to 30,000-40,000 wafer starts monthly by the end of the first quarter, 2014, the report noted.
    TSMC in April 2012 disclosed that its 20nm technology would begin volume production at Phase 6 of its Fab 12 wafer fab (Hsinchu, northern Taiwan) in 2013, and Phase 5 of Fab 14 (Tainan, southern Taiwan) will be the foundry’s second 20nm-capable fab, which is scheduled to enter volume production in early 2014.
    TSMC also began construction on Phase 3 of Fab 15 (Taichung, central Taiwan) in September 2011. The module will be TSMC’s second gigafab equipped for 20nm process technology. The foundry has not provided a timeframe to volume produce 20nm products at Phase 3 of Fab 15, but already set the initial capacity at 40,000 wafer starts per month.

    The evolution which led to the crucial TSMC-Imagination-Cadence collaboration at the 16nm node was:

    TSMC OIP 2012 – David Harold (Director of PR, Imagination Technologies) interview [chipestimate YouTube channel, Oct 26, 2012]

    Sean O’Kane, Producer/Host ChipEstimate.TV interviews at TSMC OIP (Open Innovation Platform) 2012 John Blyler, Editor-in-Chief, Chip Design and Embedded Intel magazines David Harold, Director of PR, Imagination Technologies. See Latest Imagination Technologies IP at http://www.chipestimate.com/prime-partner/211/Imagination-Technologies-IP-Catalog

    Implementing and Optimising Graphics IP in SoCs [Imagination Technologies presentation at TSMC OIP 2012, Oct 16, 2012] by Steven Riddle

    Abstract

    As major IP blocks such as GPUs increasingly dominate the area, power and performance of next generation SoCs, traditional “Soft IP” fully synthesisable, process-neutral solutions need to be re-evaluated to maintain the optimum balance between maximum portability and maximum performance. In this paper, we will discuss the techniques being used by Imagination and its partners to address some of the highest performance corners of this envelope, and how the characteristics of the latest processes such as 28HPM and beyond are being taken increasingly into account when designing future Soft IP high performance solutions.

    Imagination highlights how GPUs are driving silicon performance and SoC innovation [press release, Oct 16, 2012]

    Imagination’s engineers to present paper on GPU Optimisation Techniques at TSMC’s Open Innovation Platform Forum
    San Jose: Imagination Technologies, a leading multimedia and communications technologies company, observes that the growth in performance of mobile GPUs, such as its PowerVR IP cores, is driving future generations of silicon process and packaging technologies, as well as SoC (system on chip) processing performance across a growing range of markets.
    The GPU’s ability to deliver unprecedented processing horsepower (measured in GFLOPS) whilst also delivering amazing graphics performance per mm2 and per mW, means that GPU capabilities are becoming the dominant force driving heterogeneous processing performance in everything from mobile phones through to TVs, in-car information and entertainment, games consoles and even cloud computing.
    Recognising this trend, Imagination is further developing its roadmaps, architectures and support to ensure its partners can select IP solutions optimized for the latest silicon process and SIP (System in Package) technologies, enabling them to realise the full potential of what GPUs can deliver in SoCs, both for graphics and compute capabilities.
    To help its partners, Imagination is already working with leading silicon foundries to implement high performance mobile GPU-based systems delivering unheard-of levels of memory bandwidth, using the latest PowerVR Series6 GPUs combined with wide I/O memory and advanced 3DIC assembly and process technologies. Imagination is also working with foundries and EDA vendors to ensure that licensees of all of Imagination’s IP (intellectual property) cores can benefit from well-defined tool flows and optimized libraries to achieve the most aggressive speed, area and power consumption targets.
    Reflecting closer ties to key foundries, Imaginations’ engineers will be speaking at the TSMC Open Innovation Platform Forum 2012 in San Jose, CA, on ‘Implementing and Optimising Graphics IP in SoCs’. Imagination will also be demonstrating its latest PowerVR GPU and VPU (video processor) as well as Ensigma RPU (radio processor) and Meta CPU IP technologies at the event (booth 201).

    Says Tony King-Smith, VP marketing, Imagination: “Just as memory drove silicon processes in the ‘80s and ‘90s, and CPUs drove these in the late ‘90s and ‘00s, mobile GPUs are now becoming the most demanding on-chip function driving tomorrow’s advanced SoCs and silicon processes. We see our strengthening relationships with leading foundries, EDA vendors and library providers, as well as strategic activities with industry standards bodies such as HSA Foundation and Khronos Group, as key to ensuring we continue to drive and deliver the leading edge capabilities our customers have come to expect from us.”

    More information:
    Imagination Technologies will boost mobile graphics performance through customization [VentureBeat, Oct 15, 2012]

    … Imagination usually gives a “synthesizable core,” or a ready-to-go finished design, to its chip licensee partners. The partners take that core and incorporate it in their chips and take it to a foundry partner, which makes the chip. The change now will be that Imagination will optimize its cores for a particular foundry’s factory, such as a 28-nanometer manufacturing line at TSMC, so that the resulting chip will be faster and use less power.

    “We’re doing this because our customers are asking for it,” said Tony King-Smith (pictured), vice president of marketing at London-based Imagination Technologies, at a press briefing in San Jose, Calif. “They say they want a chip tuned to a particular foundry.”
    King-Smith said the result would be faster and lower power chips, but he couldn’t quantify how much. …

    Imagination tools graphics cores for 28 nm [EETimes, Oct 15, 2012]

    Imagination is working with EDA tool and library developers as well as foundries to help optimize the physical layout of its GPUs. However, the company currently has no plans to sell hardened macros.
    New capabilities will span a broad range of chip design areas including standard cell libraries, voltage scaling in process nodes and clock-tree optimization, Tony King-Smith, vice president of marketing at Imagination, said here the day before the opening of the TSMC event. “People are asking us to do more process tuning,” said King-Smith. “We will not deviate from our IP being fully synthesizable, however we will complement it more and more with tuned libraries and tool flows.”
    “We are making the design more aware of the process with hints in the design database itselfmost library vendors with an open mind will be talking with us,” King-Smith added.
    Hard macros are rarely used because “no one has the same [chip] floor plan, so it’s better to tune up the flows and libraries so people can harden the designs themselves more effectively,” he added.
    The extent of improvements in reduced power consumption, area or increased performance will vary greatly among design teams, depending on the time they put into the optimizations, he said, declining to provide any hard figures.
    Foundries as well as SoC designers are driving the demand for more optimization, he said.  Most of the effort is now going on at the 28-nm node, but programs have started at 20- and 14/16-nm nodes using FinFETs, he added.
    “The foundries are coming to us when characterizing 28- or 20-nm nodes looking  for reference designs for what will push their processes,” said King-Smith. “Historically, it has been memory and processors [in that role but] now GPUs are consuming the most area and power on the chip,” he said.

    Imagination Optimizes its IP Capabilities with TSMC on Latest Silicon Process Technologies [press release, June 14, 2012]

    Imagination Technologies, a leading multimedia and communications technologies company, announced its collaboration with TSMC to ensure that licensees of all of Imagination’s IP (intellectual property) cores can optimize speed, area and power consumption on TSMC’s most advanced 28nm and below processes.
    By bringing together engineers from both companies, this collaboration aims to improve power, performance, and area by co-optimising TSMC process technologies and foundation IPs with Imagination’s most advanced IP cores, including its latest PowerVR GPUs.
    Imagination, a member of TSMC’s Soft-IP Alliance program, is making this announcement as part of a closer relationship with TSMC. Imagination intends to validate its IP cores through the TSMC Soft-IP Alliance program.
    Imagination’s IP core families in this collaboration include:
    • PowerVR graphics, the de facto standard for mobile, embedded and computing graphics
    • PowerVR video and display, the comprehensive and widely adopted range of multistandard decoder, encoder and enhancement cores for applications from mobile to ultra-HD
    • Ensigma communications, the multi-standard programmable communications and connectivity technology for TV, radio, Wi-Fi and Bluetooth
    • Meta processors, the advanced 32-bit hardware multi-threaded processor architecture that delivers the best in both general purpose and signal processing performance
    Imagination is one of the world’s leading semiconductor IP suppliers, with cores which can be synthesised for a broad range of silicon processes. As more customers use Imagination’s IP cores to deliver the key high performance processing on their SoCs (System on Chip), Imagination plays a key role in the semiconductor IP segment to deliver the levels of performance demanded by leading edge customers.
    Says Tony King-Smith, VP marketing, Imagination: “Many of our licensees rely on TSMC to provide them with leading edge low power, high performance silicon foundry capabilities. This strengthening of our relationship with TSMC reflects our determination to deliver the best possible SoC solutions on the latest silicon processes for our SoC IP licensing partners. We believe this initiative will ensure that Imagination’s licensees to continue to push the boundaries of what is possible for future generations of advanced SoCs.”
    Says Mark Dunn, VP of IMGWorks, Imagination’s SoC implementation group: “The characteristics of the latest processes such as 28HPM and beyond have to be taken increasingly into account when designing future high performance IP-based solutions. As major blocks such as GPUs increasingly dominate the area, power and performance of next generation SoCs, design flows need to be tuned to maintain the optimum balance between maximizing IP portability and achieving the best possible performance. We believe this extensive engineering partnership will greatly benefit all of our IP partners.”
    “We are delighted to be working with Imagination to deliver the full benefits of TSMC’s latest and most advanced processes for mobile and embedded applications,” says Suk Lee, Senior Director of Design Infrastructure Marketing Division, TSMC.  “By leveraging Imagination’s leadership position in the market, we can help our customers to ship the most highly optimised SoCs.”

    Imagination and TSMC Strengthen Technology Collaboration [press release, March 25, 2013]

    TSMC optimising 16nm FinFET design flows using PowerVR GPUs to drive mobile performance
    Kings Langley and Hsinchu – March 25, 2013 – TSMC (TWSE: 2330, NYSE: TSM) and Imagination Technologies (LSE: IMG.L), a leading multimedia, processor, communications and cloud technologies company, today announced the next phase of their technology collaboration.
    As part of this new phase of their relationship, Imagination will work closely with TSMC to develop highly optimised reference design flows and silicon implementations using Imagination’s industry-leading PowerVR Series6 GPUs combined with TSMC’s advanced process technologies, including 16-nanometer (nm) FinFET process technology.
    Imagination and TSMC R&D teams will also work together to create fully characterised reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology capability to demonstrate new levels of system performance and capabilities while retaining all the essential characteristics of power, silicon area and small package footprint demanded by high volume mobile SoCs.
    As GPUs increasingly dominate the area, power and performance of next generation SoCs and the options available to designers using advanced silicon processes become more complex, design flows and libraries need to be optimally tuned to enable design teams to achieve the best possible performance, power consumption and silicon area in ever more demanding timescales. To address these challenges, Imagination and TSMC are investigating how the characteristics of the latest processes, such as 16FinFET, influence the design of high performance IP-based SoCs.
    Says Hossein Yassaie, CEO of Imagination: “Many of our licensees rely on TSMC to provide them with leading edge low power, high performance silicon foundry capabilities. Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products. We are delighted to announce our strengthening relationship with TSMC, and look forward to seeing the fruits of these projects benefiting our many mutual customers.”

    “Just as memory drove silicon processes in the ‘80s and ‘90s, and CPUs drove processes further in the late ‘90s and ‘00s, high performance mobile GPUs for graphics and compute applications are one of the major drivers for our most advanced process technologies,” says Dr. Cliff Hou, TSMC Vice President, R&D. “We’re pleased to be working with Imagination, an established leader in mobile and embedded GPU IP, to understand how best to use PowerVR GPUs to work with us to optimize future generations of our most advanced process technologies, and advanced system design techniques.”

    Imagination IP cores for next generation SoCs
    Imagination is a member of TSMC’s Soft-IP Alliance program, through which it has begun to validate all of its major IP core families so that TSMC’s customers can take full advantage of the results of this collaboration. Imagination’s IP portfolio is unrivalled in its breadth, including:
    • PowerVR GPU (graphics processor) Series5, 5XT and 6 (‘Rogue’): the most widely shipped for mobile and embedded graphics and GPU Compute
    • PowerVR VPU (video processor) Series3 and 4: the industry’s most widely deployed range of multi-standard video decoder and encoder cores for applications from mobile to ultra-HD
    • Ensigma RPU (radio processor) Series3 and 4: the multi-standard programmable communications and connectivity technology for TV, radio, Wi-Fi and Bluetooth
    • MIPS CPU and embedded processors: advanced processor architectures featuring hardware multi-threading that deliver class-leading performance from high end Android-based applications processors down to small yet highly efficient embedded processors

    Cadence and TSMC Strengthen Collaboration on Design Infrastructure for 16nm FinFET Process Technology [press release, April 8, 2013]

    Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications. The deep collaboration, beginning earlier in the design process than usual, will effectively address the design challenges specific to FinFETs – from design analysis through signoff – and will deliver the infrastructure necessary to enable ultra low-power, high-performance chips.
    FinFETs help deliver the power, performance, and area (PPA) advantages that are needed to develop highly differentiated SoC designs at 16 nanometers and smaller process technologies. Unlike a planar FET, the FinFET employs a vertical fin-like structure protruding from the substrate with the gate wrapping around the sides and top of the fin, thereby producing transistors with low leakage currents and fast switching performance. This extended Cadence-TSMC collaboration will produce the design infrastructure that chip designers need for accurate electrical characteristics and parasitic models required for advanced FinFET designs for mobile and enterprise applications.
    The FinFET device requires greater accuracy, from analysis through signoff, and that is why TSMC is teaming with Cadence on this project,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. “This collaboration will enable designers to use the new process technology with confidence earlier than ever before, allowing our mutual customers to meet their power, performance and time-to-market goals.”
    Producing the design infrastructure necessary for these types of complex, groundbreaking processes requires close collaboration between foundries and EDA technology innovators,” said Chi-Ping Hsu, senior vice president, Silicon Realization Group at Cadence. “In joining with TSMC, a leader in FinFET technology, Cadence brings unique technology innovations and expertise that will provide designers with the FinFET design capabilities they need to bring high-performance, power-efficient products to market.”
    About Cadence
    Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

    The state of big.LITTLE processing

    Complementary post reminder: Eight-core MT6592 for superphones and big.LITTLE MT8135 for tablets implemented in 28nm HKMG are coming from MediaTek to further disrupt the operations of Qualcomm and Samsung [‘Experiencing the Cloud’, July 20, 2013] from which the following excerpts I will include here as the ones directly related to the content given here as well:
    There are also two software models now available, that ARM and Linaro have developed to enable control of workloads, performance, and power management on big.LITTLE SoCs. … The second is the Global Task Scheduling (GTS) [also known as big.LITTLE MP] software developed (and now named) by ARM.
    Until GTS functionality is fully upstream, ARM is supporting the big.LITTLE MP patch set for its licensees, leveraging Linaro’s public monthly and Linaro LSK builds, so that it is available to all ARM licensees for product integration and deployment. Linaro also expect to provide a topic branch for the latest work available on the upstream GTS implementation for interested developers.
    ARM and Linaro now recommend product development and deployment to be based on the GTS solution. However, there are some cases where hardware limitations or a requirement for the traditional Linux scheduler (for example in some embedded applications) may lead to IKS still being required.
    Real Life Results
    ARM has published further information on big.LITTLE configurations and performance in a blog entry here [Ten Things to Know About big.LITTLE [Brian Jeff on SoC Design blog of ARM, June 18, 2013]].
    The first commercial products based on big.LITTLE are certain international versions of the latest Galaxy S4 phone from Linaro member, Samsung. Samsung-LSI provide an ‘Octa-core’ 4+4 big.LITTLE chip for this phone. As has been publicly noted, the current generation of hardware cannot yet take full advantage of the IKS or the GTS designs because the hardware power-saving core switching feature is implemented on a cluster basis rather than on a per-core or a per-pair basis. …
    End of the complementary post reminder

    The first big.LITTLE device (Samsung Galaxy S4, Exynos 5 Octa version) was announced mid-March and hopefully will be available from end of April at the earliest, and in a few countries only (US is one of them). The price is also way too high: $1,379 unlocked on Amazon. 70% of the first 10M S4 smartphones will come with the quad-core Snapdragon S600 instead (seemingly for as low price as $800). The reason is: Samsung Semiconductor is just entering 28nm production with this SoC so it is “scheduled for mass-production in the second quarter of 2013”. While we should therefore wait probably till Q3 for larger scale availability it is already time to examine both the product and the form of big.LITTLE processing delivered with it:

    Introducing Samsung GALAXY S 4 [Samsung Mobile Press, March 14, 2013]

    Developed to redefine the way we live, the GALAXY S 4 makes every moment of our life meaningful. It understands the value of relationships, enables true connections with friends and family, and believes in the importance of effortless experience.
    Highly crafted design with a larger screen and battery, thin bezel, housed in a light 130g and slim 7.9mm chassis. The new Samsung GALAXY S 4 is slimmer, yet stronger.
    The GALAXY S 4 gets you closer to what matters in life, and brings your world together.
    For a richer, simpler and fuller life.
    To find out more, click here http://www.samsung.com/galaxys4/

    Samsung Introduces the GALAXY S 4 – A Life Companion for a richer, simpler and fuller life [Samsung press release, March 14, 2013] in US: Pre Order with Octa-Core … Will Ship on Date 30 April By Fedex

    … Samsung GALAXY S 4 will be available from Q2 globally [in UK: from April 26th but the Qualcomm Quad-Core; in US: Pre Order with Octa-Core … Will Ship on Date 30 April By Fedex] including US, partnering with AT&T, Sprint, T-Mobile, Verizon Wireless, as well as US Cellular and Cricket. In Europe, Samsung GALAXY S 4 is partnering with global mobile operators such as Deutsche Telecom, EE, H3G, Orange, Telenor, Telia Sonera, Telefonica, and Vodafone. …

    AP

    • 1.9 GHz [Qualcomm] Quad-Core Processor / 1.6 GHz [Samsung] Octa-Core Processor
    • The selection of AP will be differed by markets.

    70% of first Galaxy S4s to come with Snapdragon 600 CPU. Samsung LSI couldn’t make enough Exynos 5 Octas in time [Unwired.com, March 25, 2013]

    70% of the first 10 million Samsung Galaxy S4 production batch will come with Qualcomm Snapdragon 600 CPU, instead of its own Exynos 5 Octa, Korean ETNEws reports.
    Samsung’s LSI division, responsible for the next generation Exynos CPU, failed to iron out the production and performance issues to have enough chips in time for Galaxy S4 launch. Couple of weeks ago Samsung announced that Exynos 5 Octa applications processor is scheduled for mass production only in Q2 2013. Which is too late for the huge volumes of Galaxy S4 shipments that will start in late April.
    Last year Samsung already faced production problems with Galaxy S3 and lost a lot of sales in early summer because of it. This year, Sammy doubled the initial sales forecasts for the new flagship and wants to sell 40 million of them in the first three months. So instead of risking the chip supply shortages, they are now turning to Qualcomm for Snapdragon 600 CPU, which was initially slated to go mostly to U.S. versions of SGS4.
    Taking a step back to fix the production and performances issues of one of the most important parts in your flagship device, is a smart thing to do. If you launch your new top of the line phone with serious quality issues, the initial bad press can be fatal to your plans to sell 100 million them over the product lifecycle.
    Going with tried and true chip like Snapdragon 600, that you know will perform as it should, is the best way for Samsung for now. Especially since most of the users won’t notice the difference and won’t care anyway.

    Samsung Announces the Availability of Exynos 5 Octa for New Generation of Mobile Devices [press release, March 15, 2013] (internal name: Exynos 5410)

    Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, announced that its new Exynos 5 Octa application processor is scheduled for mass-production in the second quarter of 2013.
    As highlighted at CES 2013, the Exynos 5 Octa is the world’s first mobile application processor to implement the new concept of processing architecture, big.LITTLE™, based on the Cortex-A15™ CPU to offer optimal core use. By housing a total of eight cores to draw from—four powerful Cortex-A15™cores for processing-intense tasks along with Cortex-A7™ quad cores for lighter workloads—the Exynos 5 Octa enables mobile devices to achieve maximum performance. This approach offers up to 70 percent energy saving when performing various tasks, compared to using Cortex- A15™cores only.

    The newest Exynos processor will be manufactured using Samsung’s latest 28-nanometer (nm) HKMG (High-k Metal Gate) low power process and power-saving design, which increases the power efficiency of the processor by minimizing the static current leakage.

    The Samsung Exynos 5 Octa enhances the powerful 3D graphics processing capabilities by more than two-times over the Exynos 4 Quad.
    With today’s advanced display technology transitioning toward ever higher and sharper resolutions, the Exynos 5 Octa is powerful enough to drive WQXGA (2560×1600) display, the best crystal-clear resolution currently available for mobile devices, enabling users to enjoy crisper video images on their premium smartphones and tablets.
    By adopting e-MMC (embedded multimedia card) 5.0 and USB 3.0 interface for the first time in the industry, the new Exynos application processor boasts fast data transfer speed, a feature that is increasingly required to support advanced processing power on mobile devices so that users can fully experience upgraded mobile computing such as faster booting, web browsing and 3D game loading.
    The Samsung Exynos 5 Octa incorporates a full HD 60fps (frame per second) video hardware codec engine for 1080p video recording and play-back, an embedded 13 mega-pixel 30fps image signal processor interface for high-quality camera functionality, and 12.8GB/s memory bandwidth interface that enables Full HD Wifi display.

    Samsung Exynos at MWC 2013: Exynos 5 Octa Explained [SamsungExynos YouTube channel, March 14, 2013]

    This animated display for the Exynos 5 Octa mobile processor was featured in the Samsung Exynos booth at Mobile World Congress 2013. Samsung’s Exynos 5 Octa is the industry’s first ARM® big.LITTLE™-enabled mobile application processor (AP). The Exynos 5 Octa pairs ultra-efficient ARM® Cortex™-A7 (LITTLE) cores with Cortex™-A15 (big) cores designed for the highest performance. This new system-on-chip (SoC) uses LITTLE cores to handle tasks like emailing, light web search and map navigation and uses the big cores for heavy-duty applications like graphic-intensive gaming. Find out more about how Samsung Exynos is driving the discovery of what’s possible: http://www.samsung.com/global/business/semiconductor/minisite/Exynos/index.html

    ARM® Big.LITTLE™ Technology Demo on Exynos 5 Octa Reference Tablet at MWC 2013 [SamsungExynos YouTube channel, March 19, 2013]

    ARM’s Eric Gowland demoed ARM® big.LITTLE™ processing technology on an Exynos 5 Octa reference tablet in the ARM booth at Mobile World Congress 2013. Gowland showed us the big.LITTLE-enabled Exynos 5 Octa reference platform running a series of benchmarks for tablet activities like web browsing, video playback, graphics rendering and map navigation. In addition to displaying the CPU migration as the processor switched between activities, the demo showed the relative energy usage throughout, highlighting the extreme power efficiency of big.LITTLE architecture. To learn more about ARM® big.LITTLE™ technology, visit our MWC 2013 webpage: http://www.samsung.com/global/business/semiconductor/minisite/Exynos/index.html You can also find more information on ARM’s specialized microsite:http://thinkbiglittle.com/

    Samsung Exynos at MWC 2013: Low-Power High K Metal Gate (HKMG) Process Technology [SamsungExynos YouTube channel, March 14, 2013]

    Samsung’s Low-Power High K Metal Gate (HKMG) advanced process technology was featured in this animated display inside the Exynos booth at Mobile World Congress 2013. It demonstrates the progression in process technology from 90nm to 28nm, which has resulted in greater speeds and energy-efficiency in Exynos mobile application processors (APs) developed with the technology. For example, the Exynos 5 Octa can offer up to 70% in energy savings thanks to Samsung’s HKMG process. To learn more about Samsung’s HKMG advanced process technology, visit our website: http://www.samsung.com/global/business/semiconductor/minisite/Exynos/index.html

    big.LITTLE Processing [ARM technology site, March 20, 2013] [Linaro internal: IKS [In Kernel Switcher]

    ARM big.LITTLE™ processing is an energy saving technology where the highest performance ARM CPUs are combined with the most efficient ARM CPUs in a combined processor subsystem to deliver greater performance at lower power than today’s best-in-class systems. With big.LITTLE processing, software workloads are dynamically and instantly transitioned to the appropriate CPU based on performance needs. This software load balancing is so fast that it is completely seamless to the user. By selecting the optimum processor for each task, big.LITTLE can reduce energy consumption in the processor by 70% or more on light workloads and background tasks, and by 50% for moderately intense work, while still delivering the peak performance of the high performance cores.

    More information can be found below or on the Think big.LITTLE microsite

    Software

    Software can control the allocation of threads of execution to the appropriate core, or in some versions of the software simply move the whole processor context up to big or down to LITTLE based on measured load. There are two software approaches to handling the CPU selection decision, described below. In both software approaches, cache coherence is required to enable the software to quickly move execution from LITTLE to big and from big to LITTLE as appropriate. Cache coherence allows one CPU cluster to look up in the caches of the other CPU cluster, and full hardware cache coherence between the two clusters is key to making big.LITTLE software fast and transparent. Cache coherence can be provided by the ARM CCI-400 cache coherent interconnect or any interconnect that follows the AMBA4 ACE protocol.             

    In a big.LITTLE SoCs, the OS kernel dynamically and seamlessly moves tasks between the ‘big’ and ‘LITTLE’ CPUs. In reality this is an extension of the operating system power management software in wide use today on mobile phone SoCs.  

    Most OS kernels already support Symmetric Multi-core Processing (SMP) and those techniques can easily be extended to support big.LITTLE systems. There are two main variants of big.LITTLE software scheduling.

    big.LITTLE CPU Migration [Linaro internal: IKS (In Kernel Switcher) or simply the big.LITTLE.Switcher project]

    In CPU migration a whole workload of a CPU gets move to a differently CPU, once the OS detects it requires more or less performance. This builds on generic techniques in an OS to wake up and put to sleep CPUs in an SMP system. The key extension is around the detection that a CPU is running at maximum frequency while still requesting further performance and thus the workload needs to be moved to a ‘bigger’ CPU. Once the workload has reduced, it can moved back to a ‘smaller’ CPU. 

    image

    This CPU migration software is available today from Linaro [was released to Linaro partners on Dec 20, 2012 as part of Linaro 12.2 release], and is being actively developed by multiple ARM partners [while Linaro continues to fix bugs on it].

    big.LITTLE MP [the final name now is Global Task Scheduling (GTS)]

    Task migration (aka big.LITTLE MP [as in the Linaro internal project]) detects a high intensity task and will schedule that onto a ‘big’ CPU. Similarly it will detect a low intensity task and move this back to a ‘LITTLE’ core.

    image

    The advantage of task migration over CPU migration is that a system can benefit from all its CPU at the same time, if the processing demands are extremely high. For example in a 2x ‘big’ + 2x ‘LITTLE’ system all 4 CPUs can be used at peak demand times, where as CPU migration would only be able to use 2 CPUs. 

    [According to Vincent Guittot at Linaro Connect 2013 (March 4 –8) in Hong Kong Linaro will release mid of 2013 the big.LITTLE MP prototype for external testing]

    ARM and Linaro have been developing Linux support for both migration models. For more information go to:

    Embedded Linux Conference 2013 – In Kernel Switcher [IKS]: A Solution [TheLinuxFoundation YouTube channel, recorded Feb 22, published March 1, 2013], slides are downloadable in PDF format

    The Linux Foundation Embedded Linux Conference 2013 In Kernel Switcher: A Solution to Support ARM’s New big.LITTLE Implementation By Matheiu Poirer San Francisco, California The ‘In Kernel Switcher’ (IKS) is a solution developed by Linaro and ARM to support ARM’s new big.LITTLE implementation. It is pairing together an A7 (LITTLE) and an A15 (big) processor into a logical entity that is then presented to the kernel as one CPU. From there the solution is seeking to achieve optimal performance and power consumption by switching between the big or the LITTLE core based on system usage. This session will present the IKS solution. After giving an overview of the big.LITTLE processor we will present the solution itself, how frequencies are masqueraded to the cpufreq core, the steps involved in doing a “switch” between cores and some of the optimisation made to the interactive governor. The session will conclude by presenting the results that we obtained as well as a brief overview of Linaro’s upstreaming plan.

    ELC: In-kernel switcher [IKS] for big.LITTLE [LWN.net, Feb 27, 2013]

    The ARM big.LITTLE architecture has been the subject of a number of LWN articles (here’s another) and conference talks, as well as a fair amount of code. A number of upcoming systems-on-chip (SoCs) will be using the architecture, so some kind of near-term solution for Linux support is needed. Linaro’s Mathieu Poirier came to the 2013Embedded Linux Conference to describe that interim solution: the in-kernel switcher.
    Two kinds of CPUs
    Big.LITTLE incorporates architecturally similar CPUs that have different power and performance characteristics. The similarity must consist of a one-to-one mapping between instruction sets on the two CPUs, so that code can “migrate seamlessly”, Poirier said. Identical CPUs are grouped into clusters.
    The SoC he has been using for testing consists of three Cortex-A7 CPUs (LITTLE: less performance, less power consumption) in one cluster and two Cortex-A15s (big) in the other. The SoC was deliberately chosen to have a different number of processors in the clusters as a kind of worst case to catch any problems that might arise from the asymmetry. Normally, one would want the same number of processors in each cluster, he said.
    The clusters are connected with a cache-coherent interconnect, which can snoop the cache to keep it coherent between clusters. There is an interrupt controller on the SoC that can route any interrupt from or to any CPU. In addition, there is support in the SoC for I/O coherency that can be used to keep GPUs or other external processors cache-coherent, but that isn’t needed for Linaro’s tests.
    The idea behind big.LITTLE is to provide a balance between power consumption and performance. The first idea was to run CPU-hungry tasks on the A15s, and less hungry tasks on the A7s. Unfortunately, it is “hard to predict the future”, Poirier said, which made it difficult to make the right decisions because there is no way to know what tasks are CPU intensive ahead of time.
    Two big.LITTLE approaches
    That led Linaro to a two-pronged approach to solving the problem: Heterogeneous Multi-Processing (HMP) and the In-Kernel Switcher (IKS). The two projects are running in parallel and are both in the same kernel tree. Not only that, but you can enable either on the kernel command line or switch at run time via sysfs.
    With HMP, all of the cores in the SoC can be used at the same time, but the scheduler needs to be aware of the capabilities of the different processors to make its decisions. It will lead to higher peak performance for some workloads, Poirier said. HMP is being developed in the open, and anyone can participate, which means it will take somewhat longer before it is ready, he said.
    IKS is meant to provide a “solution for now”, he said, one that can be used to build products with. The basic idea is that one A7 and one A15 are coupled into a single virtual CPU. Each virtual CPU in the system will then have the same capabilities, thus isolating the core kernel from the asymmetry of big.LITTLE. That means much less code needs to change.
    Only one of the two processors in a virtual CPU is active at any given time, so the decision on which of the two to use can be made at the CPU frequency (cpufreq) driver level. IKS was released to Linaro members in December 2012, and is “providing pretty good results”, Poirier said.
    An alternate way to group the processors would be to put all the A15s together and all the A7s into another group. That turned out to be too coarse as it was “all or nothing” in terms of power and performance. There was also a longer synchronization period needed when switching between those groups. Instead, it made more sense to integrate “vertically”, pairing A7s with A15s.
    For the test SoC, the “extra” A7 was powered off, leaving two virtual CPUs to use. The processors are numbered (A15_0, A15_1, A7_0, A7_1) and then paired up (i.e. {A15_0, A7_0}) into virtual CPUs; “it’s not rocket science”, Poirier said. One processor in each group is turned off, but only the cpufreq driver and the switching logic need to know that there are more physical processors than virtual processors.
    The virtual CPU presents a list of operating frequencies that encompass the range of frequencies that both A7 and A15 can operate at. While the numbers look like frequencies (ranging from 175MHz to 1200MHz in the example he gave), they don’t really need to be as they are essentially just indexes into a table in the cpufreq driver. The driver maps those values to a real operating point for one of the two processors.
    Switching CPUs
    The cpufreq core is not aware of the big.LITTLE architecture, so the driver does a good bit of work, Poirier said, but the code for making the switching decision is simple. If the requested frequency can’t be supported by the current processor, switch to the other. That part is eight lines of code, he said.
    For example, if virtual CPU 0 is running on the A7 at 200MHz and a request comes in to go to 1.2GHz, the driver recognizes that the A7 cannot support that. In that case, it decides to power down the A7 (which is called the outbound processor) and power up the A15 (inbound). There is a synchronization process that happens as part of the transition so that the inbound processor can use the existing cache. That process is described in Poirier’s slides [PDF], starting at slide 17.
    The outbound processor powers up the inbound and continues executing normal kernel/user-space code until it receives the “inbound alive” signal. After sending that signal, the inbound processor initializes both the cluster and interconnect if it is the first in its cluster (i.e. the other processor of the same type, in the other virtual CPU is powered down). It then waits for a signal from the outbound processor.
    Once the outbound processor receives “inbound alive” signal, the blackout period (i.e. time when no kernel or user code is running on the virtual CPU) begins. The outbound processor disables interrupts, migrates the interrupt signals to the inbound processor, then saves the current CPU context. Once that’s done, it signals the inbound processor, which restores the context, enables interrupts, and continues executing from where the outbound processor left off. All of that is possible because the instruction sets of the two processors are identical.
    As part of its cleanup, the outbound processor creates a new stack for itself so that it won’t interfere with the inbound. It then flushes the local cache and checks to see if it is the last one standing in its cluster; if so, it flushes the cluster cache and disables the cache-coherent interconnect. It then powers itself off.
    There are some pieces missing from the picture that he painted, Poirier said, including “vlocks” and other mutual exclusion mechanisms to handle simultaneous desired cluster power states. Also missing was discussion of the “early poke” mechanism as well as code needed to track the CPU and cluster states.
    Performance
    One of Linaro’s main targets is Android, so it used the interactive power governor for its testing. Any governor will work, he said, but will need to be tweaked. A second threshold (hispeed_freq2) was added to the interactive governor to delay going into “overdrive” on the A15 too quickly as those are “very power hungry” states.
    For testing, BBench was used. It gives a performance score based on how fast web pages are loaded. That was run with audio playing in the background. The goal was to get 90% of the performance of two A15s, while using 60% of the power, which was achieved. Different governor parameters gave 95% performance with 65% of the power consumption.
    It is important to note that tuning is definitely required—without it you can do worse than the performance of two A7s. “If you don’t tune, all efforts are wasted”, Poirier said. The interactive governor has 15-20 variables, but Linaro mainly concentrated on hispeed_load and hispeed_freq (and the corresponding*2 parameters added for handling overdrive). The basic configuration had the virtual CPU run on the A7 until the load reached 85%, when it would switch to the first six (i.e. non-overdrive) frequencies on the A15. After 95% load, it would use the two overdrive frequencies.
    The upstreaming process has started, with the cluster power management code getting “positive remarks” on the ARM Linux mailing list. The goal is to upstream the code entirely, though some parts of it are only available to Linaro members at the moment. The missing source will be made public once a member ships a product using IKS. But, IKS is “just a stepping stone”, Poirier said, and “HMP will blow this out of the water”. It may take a while before HMP is ready, though, so IKS will be available in the meantime.

    Exynos Octa and why you need to stop the drama about the 8 cores [XDA Developers, March 15, 2013]

    I’m going to write this as an guide/information page so we stop as soon as possible the stupid discussions about how 8 cores are useless.
    What’s it all about?
    The Exynos Octa or Exynos 5410 is a big.LITTLE design engineered by ARM and is the first consumer implementation of this technology. Samsung was their lead partner in terms of bringing this to market first. Reneseas is the other current chip designer who has publicly announced a big.LITTLE design.
      • Misconception #1: Samsung didn’t design this, ARM did. This is not some stupid marketing gimmick.

        The point of the design is to meld the advantages of the A7 processor architectures, with its extreme power efficiency, with the A15 architecture, with extreme performance at a cost of power consumption. The A7 cores are slightly slower than an A9 equivalent, but using much less power. The A15 cores are in another ballpark in terms of performance but their power consumption is also extreme on this current manufacturing generation.
        The effective goal is to achieve the best of both worlds. Qualcomm on the other does this by using their own architecture which is similar in some design aspects to the A15 architecture, but compromises on feature and performance to achieve higher power efficiency. The end result is for the user can be expressed in 2 measurements: IPC (Instrucitons per clock), and Perf/W (Performance per Watt).
        In terms of IPC, the A15 leads the pack by quite a margin, followed by Krait 400, Krait 300, Krait 200, A9, A7, and A8 cores, in that order.
        In terms of Perf/W, the A7 leads by a margin, followed by A9’s and the Krait cores, with the A15 at a distant last in terms of efficiency.
        Real-world use
        Of course, the Exynos Octa is the first to use this:

        image

        Currently, the official word seems to be that the A7 cluster is configured to run from 200 to 1200MHz, and the A15 cluster from 200 to 1600MHz.
        There are several use-cases of how the design can be used, and it is purely limited by software, as the hardware configuration is completely flexible.
        In-Kernel Switcher (IKS)
        This is what most of us will see this in our consumer products this year; Effectively, you only have a virtual quad-core processor. The A15 cores are paired up with the A7 core clusters. Each A15 has a corresponding A7 “partner”. Hardware wise, this pair-up has no physical representation as provided by an actual die-shot of the Exynos Octa.
        The IKS does the same thing as a CPU governor. But instead of switching CPU frequency depending on the load, it will switch between CPUs.

        image    image

        Effecively, you are jumping from one performance/power curve to another: And that’s it. Nothing more, nothing less.
        The actual implementation is a very simple driver on the side of the kernel which measures load and acts much like a CPU governor.
        [PhoneArena YouTube channel, Feb 25, 2013] For more details, check out our web site:http://www.phonearena.com/ PhoneArena presents a video demonstration of the new Samsung Exynos 5 Octa chipset – the manufacturer’s first octa-core processor! As you can imagine, the Exynos 5 Octa is very new and not available in any handset yet, but we expect it to make an appearance in the Galaxy S IV! So, it’s definitely worth checking!
        The above is a demonstration; you can see how at most times the A7 cores are used for video playback, simple tasks, and miscellaneous computations. The A15 cores will kick in when there is more demanding load being processed, and then quickly drop out again to the A7 cores when it’s not doing much anymore.
        • Misconception #2: You DON’T need to have all 8 cores online, actually, only maximum 4 cores will ever be online at the same time.
        • Misconception #3: If the workload is thread-light, just as we did hot-plugging on previous CPUs, big.LITTLE pairs will simply remain offline under such light loads. There is no wasted power with power-gating.
        • Misconception #4: As mentioned, each pair can switch independently of other pairs. It’s not he whole cluster who switches between A15 and A7 cores. You can have only a single A15 online, together with two A7’s, while the fourth pair is completely offline.
        • Misconception #5: The two clusters have their own frequency planes. This means A15 cores all run on one frequency while the A7 cores can be running on another. However, inside of the frequency planes, all cores run at the same frequency, meaning there is only one frequency for all cores of a type at a time.
        Heterogeneous Multi-Processing (HMP)
        This is the other actual implemented function mode of a big.LITTLE CPU. In this case, all 8 cores can be used simultaneously by the system.
        This is a vastly more complex working mechanism, and its implementation is also an order of magnitude more sophisticated. It requires the kernel scheduler to actually be aware of the differentiation of between the A7 and A15 cores. Currently, the Linux kernel is not capable of doing this and treats all CPUs as equals. This is a problem since we do not want to use the A15 cores when a task can simply me processed on an A7 core with a much lower power cost.
        The Linaro working-group already finished the first implementation of the HMP design as a series of patches to be applied against the Linux 3.8 kernel. What they did is to make the scheduler smart enough to be able to track the load of single process entities, and with that information to schedule the threads smartly on either the A7 cores or the A15 cores. This achieves much lower latency in terms of switching workloads, or better said, switching the environments (CPUs) to the respective work-loads, and exposes the full processing capabilities of the silicon as all cores can be used at once.
        You can follow the advancements of this in the publications of the Linaro Connect summits that happen every few months. The code was only published in the middle of February this year for the first working implementation equivalent in power consumption to the IKS.
        • Misconception #6: Yes the CPU is a true 8-core processor. It’s just not being used as such in its initial software implementations

        big.LITTLE In Kernel Switcher [IKS] by Nicolas Pitre and Viresh Kumar [Charbax YouTube channel, March 16, 2013]

        Nicolas Pitre and Viresh Kumar are part of the core team from Linaro that is working on developing future solutions for the latest ARM architecture: big LITTLE. Here they discuss some of the internals of the famous IKS solution. They are joined by Naresh Kamboju who is part of QA team working for Linaro. This team including few more got “Outstanding team for 2012 for their work on IKS”. Filmed at Linaro Connect 2013 [March 4-8] in Hong Kong.

        Vincent Guittot on the Linaro big.LITTLE MP work [Charbax YouTube channel, April 1, 2013]

        Vincent Guittot, Linaro assignee from ST-Ericsson, talks about the work that is being done at Linaro to Extend the Linux kernel to support ARM’s big.LITTLE MP architecture, building on the features provided by the big.LITTLE Switcher project. The most powerful use model of big.LITTLE is called MP and enables the use of all physical cores at the same time. Threads with high priority and/or computationally intensive can in this case be allocated to the A15 cores while threads with less priority or less computationally intensive such as background tasks can be performed by the A7 cores. Filmed at Linaro Connect 2013 [March 4-8] in Hong Kong.