Home » consumer computing » Intel is ready to push big in smartphones next year with its winning multimode voice and data, multiband LTE modem technology capable of global LTE roaming via a single SKU

Intel is ready to push big in smartphones next year with its winning multimode voice and data, multiband LTE modem technology capable of global LTE roaming via a single SKU

Prerequisites (June 2015⇒):

Welcome to technologies trend tracking for 2015⇒2019 !!! v0.7
5G: 2015⇒2019 5G Technologies for the New Era of Wireless Internet of the 2020’s and 2030’s
Networked Society—WTF ??? v0.5
Microsoft Cloud state-of-the-art v0.7
• Service/telco for Networked Society
• Cloud for Networked Society
• Chrome for Networked Society
• Windows for Networked Society

Opportunity for Microsoft and its Partners in FY17:

As progressed since FY15:

Or enter your email address to subscribe to this blog and receive notifications of new posts by email:

Join 94 other followers

2010 – the 1st grand year of:

3.5G...3.9G level mobile Internet
• system-on-a-chip (SoC) and
reflective display technologies

Why viewed most (till Feb 1):

Marvell SoC leadership
Android 2.3 & 3.0
Hanvon's strategy
Welcome! or Home pages
Treesaver (LATELY #2!) and
IMT-Advanced (4G)
MORE ON THE STATISTICS PAGE

Core information:

To play it safe the chip is still produced by TSMC (as with Infineon bought in 2011 by Intel) and could continue so in the foreseeable future. 

IDF 2013: Intel CEO shows 22 nanometer-based, LTE smartphone [ITworld YouTube channel, Sept 11, 2013]

Intel CEO Brian Krzanich at IDF in San Francisco showed a smartphone based on Intel’s 22 nanometer architecture. He demonstrated a smartphone platform featuring both the Intel XMM 7160 LTE solution and Intel’s next-generation Intel® Atom™ SoC for 2014 smartphones and tablets codenamed “Merrifield.” Based on the Silvermont microarchitecture, “Merrifield” will deliver increased performance (with 50 percent more performance than the previous Clover Trail+ platform), power-efficiency and battery life over Intel’s current-generation offering.

From: Intel’s CEO Discusses Q3 2013 Results – Earnings Call Transcript [Seeking Alpha, Oct 15, 2013]

In the Wireless business, I was pleased with our progress on LTE. Our multimode data modem is now available in the Samsung Galaxy Tab 3. By the end of the year, we expect to have voice-over-LTE versions available for customers and our second generation of voice-over-LTE product with carrier aggregation will be available in the first half of next year.

Intel Webcast – Accelerating Wireless [intelmarkus YouTube channel, Oct 30, 2013]

Thomas Lindner, senior director for Multicomm Marketing and Product Planning at Intel, said that LTE has so far presented unique and demanding challenges for device makers. “There is fragmentation in the market, with over 40 LTE bands in use worldwide, and each country using its own set of bands,” he said. With 15 of these bands in one product, Intel “enables devices to operate on a global basis in all major markets”, he added. The XMM 7160 is also the first generation capable of handling the full data rates supported by today’s 4G networks, according to Lindner, enabling downlink speeds up to 150Mbps. It also has support for Voice over LTE (VoLTE), which means that it can be used to deliver voice calls with better voice quality over LTE networks. Over time, this capability will see 2G and 3G networks phased out and make “legacy cellular technologies obsolete”, Lindner said. “[With the XMM 7160] manufacturers of devices can serve the global market with a single global SKU or small number of SKUs between one and three”, he added. … Lindner disclosed that Intel also plans to deliver a second generation LTE module in 2014. The XMM 7260 will support higher network speeds and additional capabilities such as support for the TD-LTE standard and the ability to combine bands for higher bandwidth. Despite its perceived sluggishness to enter the mobile space, Lindner claimed that Intel is entering the 4G market “just as it’s about to take off”. There are 166 million 4G subscribers in 2013 and this is expected to grow to over 1 billion in 2017, he added.

See also: Intel® XMM™ 7160 Slim Modem [ARK | Your Source for Intel® Product Information, June 23, 2012]

Interview AnandTech with Aicha Evans — Scale & Integration- Addressing the Global Market for LTE [channelintel YouTube channel, Aug 14, 2013]

Interview AnandTech with Aicha Evans — Intel’s Approach to Wireless Innovation [channelintel YouTube channel, Aug 14, 2013]

Background information: Ask the Experts: Intel’s Aicha Evans Talks Wireless and Answers Your Questions [AnandTech, Aug 15, 2013]

Intel proves that it has what it takes when it comes to LTE [By Michael Thelander on Spirent blogs, March 19, 2013]

Signals Research Group (SRG) recently completed its eighth collaborative effort with Spirent Communications and its sixteenth “Chips and Salsa” report on cellular chipsets. In the most recent collaboration, we brought together LTE baseband chipsets from eight different suppliers (Altair Semiconductor, GCT, Intel, NVIDIA, Qualcomm, Renesas Mobile, Samsung, and Sequans) to determine who has the best performing chipset, based on a series of 32 test scenarios that we derived from industry accepted 3GPP test specifications. SRG facilitated the benchmark study and was responsible for reviewing and analyzing the results. Spirent provided engineering support, and most importantly, the use of its 8100 test system to conduct the automated and highly repeatable tests on each chipset.
The most recent study marked our second benchmark study of LTE chipsets. Previous studies with Spirent have included HSPA+, HSDPA, UMTS call reliability and A-GNSS. To date, we are still recognized as the only independent provider of baseband chipset performance benchmark studies in the industry. And as a testament to our long-standing relationship, the companies that participated in the most recent round are already clamoring for the next round to take place. The companies that came out on top want to prove that they are not a one trick pony and the companies that came out toward the bottom want redemption. The few companies that were not ready to participate in the last study are also ready to enter the competition. There was a reason that we titled the report, “Sweet 16 and never been benchmarked” since some of these companies have been noticeably absent from prior studies due to the uncertain viability of their chipsets.
The results from the most recent round are interesting, to say the least. First, Spirent and SRG were able to bring together numerous pre-commercial and commercial chipsets. I imagine that most people were surprised that Intel actually had a working LTE chipset, let alone find out that it was the best performing chipset (more on this facet in a bit). Additionally, the list included pre-commercial solutions from Sequans, Renesas Mobile and NVIDIA. It would be virtually impossible for any organization to assemble such a line-up!
As I hinted in the title, Intel came out on topbeating the likes of perennial favorite and San Diego native, Qualcomm. To be fair, the results were incredibly close with only a few percentage points separating the two companies, but Intel’s results were better and close only counts in horseshoes and hand grenades. We could add another activity to the list, but this blog is intended to be family friendly. And if you are assuming that Qualcomm came in second place then you might want to rethink your assumption – nothing we wrote in this blog suggests that they did.
In hindsight, Intel’s results should not be all that surprising since it highly leverages the Infineon 3G platform and stellar RF performance that has since evolved to support LTE under the Intel moniker. Infineon, I note, was always a strong performer in our HSPA+/HSDPA chipset studies and it was in the original 3G iPhone until Qualcomm won the slot, in part due to its ability to support the requirements of a certain North American operator whose name rhymes with Horizon Direless. Intel may have lost the ARM war, but you can’t throw the baby out with the bath water.
Separate from the overall results, I once again saw some pretty big performance differences among all of the chipsets, in particular for the more challenging fading scenarios. As a side note, in addition to the more basic static channel conditions, our 32 test scenarios included various simulated fading channels (EVA5, EPA5, ETU70, and ETU300), SNR values, and MIMO correlation factors to create a range of challenging, albeit realistic, scenarios. In many cases the variance between the top-performing and bottom-performing LTE baseband chipset exceeded twenty percentage points. Even for the top-performing LTE baseband chipsets, it was clearly evident in the results that some chipsets did better in some scenarios than in other scenarios.
Now that we’ve set the bar for how chipsets should perform, I expect to witness material improvements in our next round, which we have planned for later this year. Just to keep everyone honest, I plan to change the test scenarios for the next round. In the interim, Spirent and SRG are investigating some additional benchmark studies that we can do together. These studies could include the industry’s first independent over-the-air (OTA) testing of leading platforms in commercial devices (imagine Samsung S III versus Apple iPhone 5) as well as our second round of A-GNSS testing.
If you are interested in the published report, please feel free to visit our website at www.signalsresearch.com where you can download a report preview.
Click here for more information on testing LTE chipset and mobile device performance.

From Intel® Mobile Phone System Platform Products and Features

Intel® XMM™ 7160 platform

Multimode LTE & DC-HSPA

Based on Intel® X-GOLD™ 716 digital and analog baseband with integrated Power Management Unit and Intel® SMARTi™ transceiver for 2G, 3G, 4G, and LTE, the Intel® XMM™ 7160 platform is the most compact solution for LTE and DC-HSPA smartphones for worldwide deployment.

View the Intel® XMM™ 7160 platform brief > [June 23, 2012]

  • LTE capabilities of 150Mbps and 50Mbps (Cat 4)
  • HSDPA and HSUPA capabilities of 42Mbps and 11.5Mbps with EDGE multislot class 33
  • Multi-band LTE, penta-band 3G, quad-band EDGE for worldwide connectivity
  • Excellent power consumption and extremely small PCB footprint
  • Hardware and software interfaces to applications processors or to a PC as a wireless modem

From the announcement in February 2012 via product launch in Q1’13 to first commercial delivery in October 2013:

From: Intel Expands Smartphone Portfolio: New Customers, Products, Software and Services [press release, Feb 27, 2012]
Addressing the growing handset opportunity in emerging markets where consumers look for more value at lower prices, Intel disclosed plans for the Intel® Atom™ processor Z2000.
The Z2000 is aimed squarely at the value smartphone market segment, which industry sources predict could reach up to 500 million units by 20151.The platform includes a 1.0 GHz Atom CPU offering great graphics and video performance, and the ability to access the Web and play Google Android* games. It also supports the Intel® XMM 6265 3G HSPA+ modem with Dual-SIM 2G/3G, offering flexibility on data/voice calling plans to save on costs. Intel will sample the Z2000 in mid-2012 with customer products scheduled by early 2013.
Building on these 32nm announcements, Otellini discussed how the Atom™ processor will outpace Moore’s Law and announced that Intel will ship 22nm SoCs for carrier certification next year, and is already in development on 14nm SoC technology.
In 2011, Intel shipped in more than 400 million cellular platforms. Building on this market segment position, Intel announced the XMM 7160, an advanced multimode LTE/3G/2G platform with support for 100Mbps downlink and 50Mbps uplink, and support for HSPA+ 42Mbps. Intel will sample the product in the second quarter with customer designs scheduled to launch by the end of 2012.
Intel also announced that it is sampling the XMM 6360 platform, a new slim modem 3G HSPA+ solution supporting 42Mbps downlink and 11.5Mbps uplink for small form factors.
From: Intel Accelerates Mobile Computing Push [press release, Feb 24, 2013]
Long-Term Evolution (4G LTE)
Intel’s strategy is to deliver a leading low-power, global modem solution that works across multiple bands, modes, regions and devices.
The Intel® XMM™ 7160 is one of the world’s smallest2 and lowest-power multimode-multiband LTE solutions (LTE / DC-HSPA+ / EDGE), supporting multiple devices including smartphones, tablets and Ultrabook™ systems. The 7160 global modem supports 15 LTE bands simultaneously, more than any other in-market solution. It also includes a highly configurable RF architecture running real time algorithms for envelope tracking and antenna tuning that enables cost-efficient multiband configurations, extended battery life, and global roaming in a single SKU.
“The 7160 is a well-timed and highly competitive 4G LTE solution that we expect will meet the growing needs of the emerging global 4G market,” [Hermann] Eul[, Intel vice president and co-general manager of the Mobile and Communications Group] said. “Independent analysts have shown our solution to be world class and I’m confident that our offerings will lead Intel into new multi-comm solutions. With LTE connections projected to double over the next 12 months to more than 120 million connections, we believe our solution will give developers and service providers a single competitive offering while delivering to consumers the best global 4G experience. Building on this, Intel will also accelerate the delivery of new advanced features to be timed with future advanced 4G network deployments.”
Intel is currently shipping its single mode 4G LTE data solution and will begin multimode shipments later in the first half of this year. The company is also optimizing its LTE solutions concurrently with its SoC roadmap to ensure the delivery of leading-edge low-power combined solutions to the marketplace.

From: Signals Ahead: Chips And Salsa XVI – Sweet 16 And Never Been Benchmarked [Feb 25, 2013] 
Executive Summary

In December 2011 we published the industry’s first performance benchmark study of LTE baseband modem chipsets. In that study we tested five commercially-procured chipsets from four chipset suppliers. We tested two different Qualcomm chipsets. Fast forward fourteen months and we are finally out with the results from our most recent study in which three companies vie for top honors. Intel’s pre-commercial solution was the top-performing solution that we tested.

This report is our sixteenth Chips and Salsa report since 2004, with the overwhelming majority of these reports focused specifically on performance benchmarking. Over the years, we’ve benchmarked UMTS (call reliability) HSDPA, HSPA+, Mobile WiMAX, A-GNSS and LTE chipsets, with the results always providing the industry with a fully independent and objective assessment of how the chipsets compare with each other for the given set of evaluation criteria. For the eighth time, we have collaborated with Spirent Communications to get access to their 8100 test system and engineering support in order to obtain highly objective results.
The significant advantage of conducting lab-based tests is that we can easily replicate and repeat each test scenario in an automated fashion, thus ensuring a common and consistent set of test scenarios for each device/chipset that we tested. And with the Spirent 8100 test system that we used for the tests, we know that we went with a test platform that is widely recognized and being used in several early LTE deployments. SRG takes full responsibility for the analysis and conclusions associated with this benchmarking exercise.
In the most recent round of chipset testing, we tested a seemingly staggering number of solutions – we tested solutions from eight different chipset suppliers (reference Table 1). We attempted to test a solution from HiSilicon, but through no fault of their own we ran into some difficulties and faced time constraints with MWC just around the corner. We reserve the right to publish their results in the near future and provide updated rankings. Many of these solutions were pre-commercial chipsets and/or the chipsets that came directly from the chipset suppliers. This approach ensured that the results that we are providing in this report are very forward looking and highly differentiated. It would be virtually impossible for any single organization to get access to all of these chipsets and replicate this study.
Worth noting, we personally invited all companies with LTE chipset aspirations to participate in this study, and given our history in doing these tests, companies recognize the importance of supporting our efforts. Needless to say, if we didn’t include a company’s LTE chipset in this study then they probably don’t have a solution that is ready to be benchmarked against their peers. It is one thing to issue a press release, demonstrate a working PHY Layer without any upper protocol layers, or show a chipset operating under ideal conditions. It is another situation all together to put your proverbial money where your mouth is and allow a third party to benchmark your solution and publish the results for all to read. Sweet 16 and never been benchmarked!

image

As previously alluded to in this report, we used throughput as the primary criteria for evaluating the chipsets. We recognize that device manufacturers and operators use other objective and subjective criteria to select their chipset partners. The criteria includes support for multiple RF bands and legacy technologies, power consumption, time to market, price, engineering support, and the inclusion of peripherals (e.g., application processor, connectivity solutions, etc.). However, no one can dispute the importance of throughput and the ability of the chipset to make the most efficient use of available network resources.
We subjected the chipsets to 32 different test scenarios that combined a mix of fading profiles (Static Channel, EPA5, EVA5, ETU70 and ETU300) and transmission modes (Transmit Diversity, Open Loop MIMO and Closed Loop MIMO). All of the chipsets that we tested performed quite well with the less challenging test scenarios but we observed a fairly large separation of results with the more challenging test scenarios. In many cases the performance difference was in excess of 20% between the top- and bottom-performing solutions.

Based on our highly objective evaluation criteria, Intel had the top-performing solution by a very slight margin. This result may surprise some readers, but we point out that the Infineon 3G solution was always a strong contender in our previous benchmark studies. That scenario is in stark contrast to its application processor which has continuously struggled to be competitive and to attract market share. Don’t throw the baby out with the bathwater. All this and more in this issue of Signals Ahead.

From: Innovation, Reinvention on Intel® Architecture Fuel  Wave of 2-in-1 Devices, New Mobile Computing Experiences [press release, Jun 3, 2013]
Accelerating Fast: Tablets, Smartphones and LTE
Intel’s 22nm low-power, high-performance Silvermont microarchitecture is enabling the company to accelerate and significantly enhance its tablet and smartphone offerings.
For tablets on shelves for holiday 2013, Intel’s next-generation, 22nm quad-core Atom SoC (“Bay Trail-T”) will deliver superior graphics and more than two times the CPU performance of the current generation. It will also enable sleek designs with 8 or more hours3 of battery life and weeks of standby, as well as support Android* and Windows 8.1*.
For the first time, [Executive Vice President Tom] Kilroy demonstrated Intel’s 4G LTE multimode solution in conjunction with the next-generation 22nm quad-core Atom SoC for tablets. The Intel® XMM 7160 is one of the world’s smallest4and lowest-power multimode-multiband LTE solutions and will support global LTE roaming in a single SKU.
With a number of phones with Intel silicon inside having shipped across more than 30 countries, Kilroy previewed what’s coming. He showed for the first time a smartphone reference design platform based on “Merrifield,” Intel’s next-generation 22nm Intel Atom SoC for smartphones that will deliver increased performance and battery life. The platform includes an integrated sensor hub for personalized services, as well as capabilities for data, device and privacy protection.
From: Intel Readies ‘Bay Trail’ for  Holiday 2013 Tablets and 2-in-1 Devices [press release, Jun 4, 2013]
At an industry event in Taipei today, Hermann Eul, general manager of Intel’s Mobile and Communications Group, unveiled new details about the company’s forthcoming Intel®  Atom™ processor-based  SoC for tablets (“Bay Trail-T”) due in market for holiday this year.
Eul also spoke to recent momentum and announcements around the smartphone business and demonstrated the Intel® XMM 7160 multimode 4G LTE solution, now in final interoperability testing (IOT) with Tier 1 service providers across North America, Europe and Asia.

Long-Term Evolution (4G LTE)
Intel’s strategy is to deliver leading low-power, global  modem solutions that work across multiple bands, regions and devices.
Intel’s XMM 7160 is one of the world’s smallest and lowest-power multimode-multiband LTE solutions. The modem supports 15 LTE bands simultaneously, and also includes a highly configurable RF architecture running real-time algorithms for envelope tracking and antenna tuning that enables cost-efficient multiband configurations, extended battery life and global LTE roaming in a single SKU.
Eul demonstrated the solution by showcasing a Bay Trail-based tablet over an LTE network connection, and said that Intel will begin shipments of multimode data 4G LTE in the coming weeks following final IOT with Tier 1 service providers in North America, Europe and Asia.

Intel announced that the new Samsung GALAXY Tab 3 10.1-inch is powered by the Intel® Atom™ processor Z2560 (“Clover Trail+”). Additionally, the new Samsung GALAXY Tab 3 10.1-inch tablet will come equipped with Intel’s XMM 6262 3G modem solution or Intel’s XMM 7160 4G LTE solution.
From: New Intel CEO, President Outline Product Plans, Future of Computing Vision to ‘Mobilize’ Intel and Developers [press release, Sept 10, 2013]
In high-speed 4G wireless data communications, [Intel CEO Brian] Krzanich said Intel’s new LTE solution provides a compelling alternative for multimode, multiband 4G connectivity, removing a critical barrier to Intel’s progress in the smartphone market segment. Intel is now shipping a multimode chip, the Intel® XMM™ 7160 modem, which is one of the world’s smallest and lowest-power multimode-multiband solutions for global LTE roaming.
As an example of the accelerating development pace under Intel’s new management team, Krzanich said that the company’s next-generation LTE product, the Intel® XMM™ 7260 modem, is now under development. Expected to ship in 2014, the Intel XMM 7260 modem will deliver LTE-Advanced features, such as carrier aggregation, timed with future advanced 4G network deployments. Krzanich showed the carrier aggregation feature of the Intel XMM 7260 modem successfully doubling throughput speeds during his keynote presentation.
He also demonstrated a smartphone platform featuring both the Intel XMM 7160 LTE solution and Intel’s next-generation Intel® Atom™ SoC for 2014 smartphones and tablets codenamed “Merrifield.” Based on the Silvermont microarchitecture, “Merrifield” will deliver increased performance, power-efficiency and battery life over Intel’s current-generation offering.

Intel Announces First Commercial Availability of 4G LTE Modem; Introduces Module for 4G Connected Tablets and Ultrabooks™ [press release, Oct 30, 2013]

NEWS HIGHLIGHTS

  • Intel® XMM™ 7160 LTE modem is now shipping in the 4G version of the Samsung GALAXY Tab 3 (10.1) – available in Asia and Europe.
  • Intel® XMM™ 7160 provides multimode (2G/3G/4G LTE) voice and data with simultaneous support for 15 LTE bands for global LTE roaming.
  • Intel announces PCIe M.2 LTE wireless data modules expected to ship in 2014 tablet and Ultrabook™ designs from leading manufacturers.

Intel Corporation today announced the commercial availability of its multimode, multiband 4G LTE solution. The Intel® XMM™ 7160 platform is featured in the LTE version of the Samsung GALAXY Tab 3 (10.1)*, now available in Asia and Europe.
Intel has also expanded its portfolio of 4G LTE connectivity solutions, introducing PCIe (PCI Express) M.2 modules for 4G connected tablets, Ultrabooks™ and 2 in 1 devices as well as an integrated radio frequency (RF) transceiver module, the Intel® SMARTi™ m4G. These new products make it simple, efficient and cost effective for device manufacturers to add high performance wireless connectivity to their product designs.
“As LTE networks expand at a rapid pace, 4G connectivity will be an expected ingredient in devices from phones to tablets as well as laptops,” said Hermann Eul, vice president and general manager of Intel’s Mobile and Communications Group. “Intel is providing customers an array of options for fast, reliable LTE connectivity while delivering a competitive choice and design flexibility for the mobile ecosystem.”
The commercial availability of the Intel XMM 7160 solution follows successful interoperability testing with major infrastructure vendors and tier-one operators across Asia, Europe and North America. The Intel XMM 7160 is one of the world’s smallest and lowest-power multimode, multiband LTE solutions for phones and tablets. The solution provides seamless connectivity across 2G, 3G and 4G LTE networks,supports 15 LTE bands simultaneously and is voice-over LTE (VoLTE) capable. It features a highly configurable RF architecture, running real-time algorithms for envelope tracking and antenna tuning that enables cost-efficient multiband configurations, extended battery life and global LTE roaming in a single SKU.
Intel offers a broad portfolio of mobile platform solutions including SoCs, cost-optimized integrated circuits, reference designs and feature-rich software stacks supporting 2G, 3G and 4G LTE. Building on the Intel XMM 7160 platform, Intel today announced two multimode LTE solutions that pave the way for 4G connected devices in a variety of form factors.
New Intel PCIe M.2 LTE Modules and Intel SMARTi m4G Solution
Intel introduced Intel PCIe M.2 LTE modules, which are small, cost-effective, embedded modules in a standardized form factor for adding multimode (2G/3G/4G LTE) data connectivity across a variety of device types. The Intel M.2 module supports peak downlink speeds of 100Mbps over LTE. The modules support up to 15 LTE frequency bands for global roaming. In addition, those modules also feature support for Global Navigation Satellite Systems (GNSS) based on the Intel CG1960 GNSS solution.
For manufacturers, the M.2 module makes it simple to add 4G connectivity to their designs while reducing integration and certification expenses, and improving time-to-market. The M.2 module is currently undergoing interoperability testing with tier-one global service providers. Intel M.2-based modules will soon be available from Huawei*, Sierra Wireless* and Telit*. These modules are expected to ship globally in 2014 tablet and Ultrabook designs from leading manufacturers.
imageIn addition to the new M.2 LTE module, Intel also offers the new Intel SMARTi m4G a highly integrated radio transceiver module. The Intel SMARTi m4G was developed in cooperation with Murata* and integrates the Intel SMARTi 4G transceiver with most front-end components in one LTCC (low temperature co-fired ceramic) package. When paired with the Intel® X-GOLD™ 716 baseband, manufacturers can meet the certification requirements of service providers with minimal design cycles in an easy-to-place, low-profile solution. With the Intel SMARTi m4G, the overall component count can be reduced by more than 40 components and the required PCB area is reduced up to 20 percent.
Intel plans to deliver next-generation LTE solutions, including the Intel® XMM™ 7260 in 2014. The Intel XMM 7260 adds LTE Advanced features, such as carrier aggregation, faster speeds and support for both TD-LTE and TD-SCDMA. More information about Intel’s mobile communications solutions is available at http://www.intel.com/content/www/us/en/wireless-products/mobile-communications.html.

See also: Intel Talks about Multimode LTE Modems – XMM7160 and Beyond [AnandTech, Aug 20, 2013] from which I will include here:

image

XMM7160 is still built on TSMC’s 40nm CMOS process, and its SMARTi 4G transceiver is built on 65nm at TSMC, but Intel still claims it has a 20–30% power advantage for modem and RF compared to a competitor smartphone platform, though it wouldn’t say which. … The transition of modem to Intel Architecture (away from two different DSP architectures) also remains to be seen, and I’m told it will be two to three years before Intel’s modems are ready to intercept the Intel fabrication roadmap and get built on Intel silicon instead of at TSMC. …

From: Mobile Wireless M2M Value Proposition Product Portfolio and Roadmap for M2M 2G-4G [Intel presentation, Nov 26, 2012]

image image

image

image

image

image

image


Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s

%d bloggers like this: