Tag Archives: TSMC

TSMC’s 16nm FinFET process to be further optimised with Imagination’s PowerVR Series6 GPUs and Cadence design infrastructure

Posted on April 8, 2013 by Nacsa Sándor

OR After CPU level optimisation With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology [‘Experiencing the Cloud’ April 3, 2013] the world #1 foundry decided to further optimise its crucial … Continue reading →

With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology

Posted on April 3, 2013 by Nacsa Sándor

Cortex-A57? – 3x performance of 2012 superphones- 64-bit support for future consumer apps + current and future enterprise apps- Scalable beyond 16 cores … First Cortex-A50 series chips available from 2014 Update: TSMC 16nm FinFET to enter mass production within … Continue reading →

Posted in SoC | Tagged 16nm, 16nm FinFET, 20/16nm, 2012, 2013, 2014, 20nm, 28nm, ARM, ARM Cortex-A57, ARM Holdings, ARMv8, contract chip manufacturing, Cortex-A57, fabless semiconductor industry, finFET, FinFET technology, Morris Chang, Taiwan Semiconductor Manufacturing Company, tape-out, TSMC, TSMC OIP, TSMC Open Innovation Platform | 3 Comments

The future of the semiconductor IP ecosystem

Posted on December 13, 2012 by Nacsa Sándor

December 13 Report:- Intel’s next-gen SoC manufacturing process will be able to deliver the next Bay Trail Atom only for 2014 products (with higher end Haswell for H2 2013), and it is just a 26nm process in terminology used by … Continue reading →

Posted in Geopolitics, SoC | Tagged 14 nm, 14nm, 20 nm, 20nm, 22 nm, 22nm, 28 nm, 28nm, 3D devices, Allwinner, AndesCore, ARM Artisan IP, ARM Holdings, ARM Physical IP division, Artisan Physical IP Platform, Atom, BA22-AP, Bay Trail, Beyond BA22, big.LITTLE Processing, bulk CMOS, CAST Inc., CAST IP, CEVA, choice IP partner, Cortex A15, Cortex-A7, EnSilica eSi-3250, Fastec Imaging Corporation, Fastec TS3, FD-SOI, finFET, foundries, foundry and IP business model, foundry business, Freescale, Freescale ColdFire, general-purpose foundry business, GlobalFoundries, Haswell, Haswell-ULT, in-house IP blocks, inflection points, Intel, Intellectual Property, interface products, Internet of Things, IOT, IP suppliers, Kinetis, LEON3, licensable IP blocks, Lincroft, logic products, mainstream CMOS, Mali, MarketsandMarkets, MediaTek, memory compilers, MIPS32, mobile computing, Motomic, MT6588, MT6589, OpenRISC, planar transistor, POP, prime IP partners, Processor Optimization Pack, reusable subsystems, Samsung, semiconductor design, semiconductor intellectual property market, semiconductor IP, semiconductor IP ecosystem, semiconductor IP market, semiconductor IP revenue, silicon IP market, SoC manufacturing process, SoC process, Sodaville, SOI, standard cells, standard industry IP blocks, STMicroelectronics, system IP, tablet PC, transistor designs, Tri-Gate, Tri-Gate transistor, TSMC, TSMC IP Alliance, TSMC IP portfolio, TSMC Soft-IP Alliance, UMC, VIA Technologies, Z670 | 4 Comments

$99 Android 4.0.3 7” IPS tablet with an Allwinner SoC capable of 2160p Quad HD and built-in HDMI–another inflection point, from China again

Posted on December 3, 2012 by Nacsa Sándor

[This is a huge, compiled collection basically finished in September, 2012. Contains updates till November, 2012. It was published in early December, 2012. A new USD 99 Allwinner blog was launched on Nov 30, 2012 based on this compilation. Please … Continue reading →

Posted in SoC, Cloud client SW platforms, Geopolitics, Cloud Computing strategy, tablets, consumer devices, consumer computing | Tagged Intel, Microsoft, Android, Toshiba, China, Samsung, MediaTek, Acer, Asustek, Windows 8, Shanzhai, white-box vendors, IDC, Digitimes Research, LG, TSMC, Fuzhou Rockchip Electronics, Rockchip, Chimei Innolux, 3D TV, tablet market, CMMB, Windows 8 tablets, ARM Holdings, Wi-Fi, global market, IHS iSuppli, devices and services, mainland China, Shenzhen, Android tablet wars, crowd funding, Allwinner, A10, A13, white-box tablets, 2160p, Quad HD, PRC, PCMCIA card, PC Card, EOMA-68, FLOSS, Zhuhai, Nufront, NS115, 4K, strategic inflection point, $99, USD 99 Allwinner, mobile device market, 2013, hardware is dead, investment bank, Andy Grove, memory chips, Only the Paranoid Survive, DRAM market, Junko Yoshida, Tablet PCs, Mobile PC, NPD DisplaySearch, non-Apple tablets, branded tablets, white-box tablet PCs, 全志, 珠海, AllWinner Technology, Guangdong, Zhang Jianhui, 张建辉, Zhuhai Victory Technology, Zhao Guangmin, 赵广民先, Actions Semiconductor, Chinese semiconductor industry, Victory Microelectronics, MP3 chips, IC design company, PRC IC design, mainland China IC design companies, Zhao Guangmin Memorial, Android tablet SoC, China grey market, Rockchip Electronics, VIA, RK3066, AMLogic, VPU, DPU, A10s, HD video codec, white-box tablet vendors, Ainol, Ampe, Bmorn, Eken, Gemei, ICOO, iNote, Onda, Ployer, Sanei, Teclast, Haipad, Shenzhen SMIT, VIA8850, Infotmic, AAPPAA, Hott, OMG, Miracast, NVIDIA Tegra 3, Miracast Wireless Display, Wi-Fi Alliance, Wi-Fi Direct, CEVO Engine, Nicolas Charbonnier, Charbax, Glassless 3D, Toshiba Regza RZ1, DisplaySearch, Ballmer, PC market, Supply chain, contract manufacturers, Embedded Open Modular Architecture, Luke Kenneth Casson Leighton, Rhombus Tech, embedded Linux, PCMCIA CPU Card, EOMA-68 CPU Card, Allwinner EOMA-68-compliant module, Tom Cubie, CUBIETECH, Cubieboard, CedarX, Mele A1000, Mele A2000, Mele, Mobile TV, T-MMB, EUHT, UHT | 8 Comments

Microsoft Surface with some questions about the performance and smoothness of the experience

Posted on November 12, 2012 by Nacsa Sándor

Update: Upstream supply chain sees Surface RT orders cut by half [DIGITIMES, Nov 28, 2012] The upstream supply chain of Microsoft’s Surface RT has recently seen the tablet’s orders reduced by half, and with other Windows RT-based tablet orders also … Continue reading →

Posted in consumer computing, consumer devices, Geopolitics, SoC, tablets | Tagged 28nm, advanced manufacturing, ARM, experience, fabless semiconductor companies, fabs, Intel, Ivy Bridge, Kal-El, Microsoft, Microsoft Surface, Microsoft Surface Pro, NVIDIA, performance, semiconductor foundry, smoothness, SoC competition, SoCs, Surface Pro, Tegra, Tegra 3, TSMC, US economy, User Experience, Windows 8, Windows RT, x86 | 6 Comments

Qualcomm’s critical reliance on supply constrained 28nm foundry capacity

Posted on July 27, 2012 by Nacsa Sándor

KEY UPDATES: TSMC Board of Directors Meeting Resolutions [TSMC press release, Nov 13, 2012] Hsinchu, Taiwan, R.O.C. – November 13, 2012 – TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions: 1. … Continue reading →

Posted in SoC | Tagged 28 nanometer, 28nm, 3-D Tri-Gate, Apple, APQ8064, Atrenta, CMOS, FD-SOI, finFET, foundry, foundry capacity, GlobalFoundries, HKMG, IDM foundry, IP portfolio, IP quality, iPhone 5, Krait, LTE, MDM9x15, Mobile Devices, MSM8960, MSM8x25, MSM8x30, quaility, Qualcomm, Samsung Foundry, semiconductor industry, semiconductor manufacturing, Snapdragon, Snapdragon S4, SoC, SoC quality, ST-Ericsson, STMicroelectronics, supply constraints, Tri-Gate, tri-gate transistors, TSMC, TSMC 9000 IP library, TSMC IP Alliance, TSMC IP portfolio, TSMC Soft-IP Alliance, TSMC9000 IP library, UMC, United Microelectronics Corporation | 5 Comments

MWC 2012: Fuzhou Rockchip Electronics

Posted on March 13, 2012 by Nacsa Sándor

Follow-up: Core post: China’s HW engineering lead: The Rockchip RK292 series (RK2928 and RK2926) example [Oct 27, 2012] Exclusive : ST Ericsson, Rockchip To Join Windows 8 For ARM Club In 2013 [Feb 29, 2012] Rockchip RK30xx ARM Cortex-A9 announced at Mobile World Congress … Continue reading →

Posted in consumer devices, smartphones, SoC | Tagged 40nm, 55nm, 65nm, Android 4.0, ARM, ARM Holdings, Chartered, Chartered Semiconductor Manufacturing, Fuzhou Rockchip Electronics, Global Foundries, Hisilicon, RK28xx, RK2918, RK29xx, RK30xx, Rockchip, SoC, Spreadtrum, TSMC, Vivante, Wabook, WebM, Windows 8 | 4 Comments

Marvell SoCs to win both Microsoft and Nokia for Windows Phone and Windows 8 platforms (after the Kinect success)

Posted on February 1, 2012 by Nacsa Sándor

Update: – Marvell licenses VeriSilicon DSP cores [Feb 13, 2012] SAN FRANCISCO—Marvell Technology Group Ltd. has signed a licensing agreement for VeriSilicon Holdings Co. Ltd.’s ZSP G3 intellectual property cores, including the dual-MAC ZSP800M and ZSP880M synthesizable DSP cores, VeriSilicon … Continue reading →

Posted in Cloud client SW platforms, Geopolitics, smartphones, SoC, tablets | Tagged 28nm, ARMADA, China, cloud client, Jack Kang, Kinect, Lumia, Marvell, Microsoft, Nokia, Nokia Lumia, notebooks, smartphones, SoC, Tablets, TD-SCDMA, TSMC, Windows 8, Windows Phone 7, Xbox | 2 Comments

The new, high-volume market in China is ready to define the 2012 smartphone war

Posted on January 6, 2012 by Nacsa Sándor

Follow-up: Boosting the MediaTek MT6575 success story with the MT6577 announcement [June 27, 2012] - China TD-SCDMA and W-CDMA 3G subscribers by the end of 2011: China Mobile lost its original growth momentum [Jan 21, 2011] Updates: China market: Local vendors to roll out CNY300 … Continue reading →

Posted in Cloud client SW platforms, Cloud Computing strategy, Geopolitics, smartphones, SoC | Tagged 3.5G, 3G, Amoi, Android, Apple, Broadcom, China, China Mobile, China Unicom, China Wireless Technologies, cloud client, Coolpad, GLBenchmark, Hisense, HTC, Huawei, iPhone 3G S, Lenovo, MediaTek, Motorola, MStar, MT6573, MT6575, MTK6573, MTK6575, Philips, PowerVR, Qualcomm, Sang Fei, smartphones, SoC, Spreadtrum, Taiwan, TCL, TCL Communication Technology, TD-SCDMA, TSMC, UMC, W-CDMA, Yulong, ZTE | 9 Comments

TD-SCDMA: US$3B into the network (by the end of 2012) and 6 million phones procured (just in October)

Posted on October 18, 2011 by Nacsa Sándor

Updates: China government not expected to issue TD-LTE operating license for the time being [Jan 16, 2012] While China Mobile has been actively promoting TD-LTE, the China government is not expected to issue a TD-LTE operating license to China Mobile … Continue reading →

Posted in Geopolitics, Mobile Internet, smartphones | Tagged 3G, Android, Asus, Asustek, China, China Mobile, China Unicom, cloud client, Computers and Internet, Marvell, Spreadtrum, TD-SCDMA, TSMC, W-CDMA | 1 Comment

Tag Archives: TSMC

TSMC’s 16nm FinFET process to be further optimised with Imagination’s PowerVR Series6 GPUs and Cadence design infrastructure

With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology

The future of the semiconductor IP ecosystem

$99 Android 4.0.3 7” IPS tablet with an Allwinner SoC capable of 2160p Quad HD and built-in HDMI–another inflection point, from China again

Microsoft Surface with some questions about the performance and smoothness of the experience

Qualcomm’s critical reliance on supply constrained 28nm foundry capacity

MWC 2012: Fuzhou Rockchip Electronics

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