Tag Archives: SoC

Qualcomm’s SoC business future is questioned first time

Posted on May 1, 2013 by Nacsa Sándor

Among the hits for simple ‘Qualcomm’ search between April 25 and 30 you will first time find headlines such as: Qualcomm And The Demise Of The Commodity Processor >>> Qualcomm’s profit hurt by competition from China >>> Qualcomm’s earnings outlook … Continue reading →

Posted in "smart" feature phones, consumer computing, consumer devices, Geopolitics, smartphones, SoC, tablets | Tagged 28nm, automation, Callbar, D.Phone, domestic brands, entry-level dual core, 闻泰, G-five, Haier, Huawei, industrial chain, industrial cluster, Intex, IQ2010, Jiaxing, Karbon, Lava, LG, LitePoint, local brands, MediaTek, Micromax, Motorola, MSM8225Q, MSM8625Q, MT6572, MT6582, MT6589M, MTK6572, MTK6582, ODM, Philips, Qualcomm, robots, SC6600W, Snapdragon 800, SoC, Spice, Spreadtrum, Spreadtrum quad-core, Sunspan, Sunspan D18, Sunspan D28X, T-Smart, TCL, Videocon, WING, WingTech, WingTech Communications, Xi’an, 华为, 天迈, 海尔 | 1 Comment

Saving Intel: next-gen Intel ultrabooks for enterprise and professional markets from $500; next-gen Intel notebooks, other value devices and tablets for entry level computing and consumer markets from $300

Posted on April 17, 2013 by Nacsa Sándor

OR “2 for 1” (or “two-for-one”) touch and voice enabled ultrabooks of convertible and detachable form factors with Haswell / 4th generation Intel Core processor family (shipping now and on track for Q2’13 launch) starting as low as $500. Touch-enabled … Continue reading →

Posted in consumer computing, consumer devices, Enterprise computing, notebooks, tablets | Tagged 14nm, 2 for 1, 22nm, 22nm Tri Gate, 4th generation Intel Core processor, Android, Atom SoC, Bay Trail, Bay Trail D, Bay Trail M, clamshell laptops, consumer market, convertible form factors, convertibles detachables, desktops, detachable form factors, Enterprise Market, entry level computing, foundry, full PC experience, Haswell, IDF 2013 Beijing, Intel, Intel Media, Intel WiDi, Kirk Skaugen, Lenovo, more competitive Atom, multi OS support, next generation, notebooks, ODMs, OEMs, Paul Otellini, PC ecosystem, professional market, Set-Top Box, SoC, System on Chip, technology transitions, Tick-Tock model, Toshiba, touch enablement, touch price points, touch-enabled thin notebooks, two-for-one, Ultrabook detachable, Ultrabook reference design, Ultrabook™ Convertible, Ultrabooks, value all-in-one computers, value convertibles, value devices, voice enablement, Windows 8, Windows 8 adoption | 1 Comment

Qualcomm moving ahead of Allwinner et al. in CPU and GPU while trying to catch up with Allwinner in Ultra HD

Posted on January 12, 2013 by Nacsa Sándor

[Updated Feb 27, 2013] The ”Allwinner phenomenon” coming from nowhere in 2012 is threatening all established players in the SoC industry, even the industry’s undisputed leader Qualcomm. This was the reason why Qualcomm was forced to strengthen its Cortex based … Continue reading →

Posted in consumer devices, SoC | Tagged 28nm, 4K, 802.11ac, 8030AB, 8230AB, 8630AB, 8930AB, Adreno 330, Allwinner, Allwinner phenomenon, CES, CES 2013, CPU, Dual-SIM Dual-Active, Dual-SIM Dual-Standby, entry-level smartphones, GPU, high volume devices, high-end mobile, HPm, Krait 200, Krait 300, Krait 400, LTE Cat 4, mid-high tier devices, Miracast, multimedia, Paul Jacobs, premium devices, processor brand tiers, quad core, Qualcomm, S200, S4 Play, S4 Plus, S4 Pro, S400, S600, S800, Snapdragon, SoC, SoC leadership, Ultra HD, UltraHD | 4 Comments

Allwinner vis-à-vis HTC on 2013 International CES

Posted on December 11, 2012 by Nacsa Sándor

From Allwinner: Allwinner has launched its latest quad-core application processor A31 in December 2012 and will create another legend in the consuming world. If you would like to know more about A31, please schedule a meeting with us at CES … Continue reading →

Posted in Cloud Computing strategy, Geopolitics, intelligent systems, notebooks, smartphones, SoC, tablets | Tagged 2013 International CES, A31, Allwinner, Allwinner et al phenomenon, Allwinner phenonmenon, Centaur Technology, HTC, ICT market researchers, IDC, Isaiah micro architecture, Isaiah/CN micro architecture, portable PC, quad-core application processor, Rockchip, SoC, Tablets, VIA Technologies, Windows RT | 2 Comments

ST-Ericsson: Fundamental repositioning for modem, APE and ModAps spaces

Posted on October 8, 2012 by Nacsa Sándor

Rumour: Microsoft to expand ARM processor choices to Samsung and ST-Ericsson SOCs in next Windows update [Oct 5, 2012] MSNerd, long time Microsoft leaker, has passed on a little tip about the next version of Windows on ARM. Currently Windows … Continue reading →

Posted in Geopolitics, smartphones, SoC, tablets | Tagged SoC, Microsoft, LTE, Android, HSPA+, Tablets, Samsung, ST-Ericsson, smartphones, Windows, finFET, 28nm, GlobalFoundries, HKMG, 32nm, Windows Phone, STMicroelectronics, Windows RT, FD-SOI, modem, APE, ModAps, NovaThor, L8540, L8580, U8500, U8520, M7400 | 2 Comments

Qualcomm decided to compete with the existing Cortex-A5/Krait-based offerings till the end of 2012

Posted on September 30, 2012 by Nacsa Sándor

Update: Nvidia Tegra 3 under strong pressure from S4 Pro, say Taiwan makers [DIGITIMES, Dec 7, 2012] Snapdragon S4 Pro series processors developed by Qualcomm have brought increasing competitive pressure on Nvidia’s Tegra 3 because of its superior overall performance-cost … Continue reading →

Posted in consumer computing, consumer devices, smartphones, SoC | Tagged 28nm, 45nm, Adreno, Adreno 305, Android, benchmarking, CDMA/UMTS, China, Cortex-A5, Cortex-A7, entry-level smartphones, HTC, HTC One XL, Krait, LTE, mass-market smartphones, MediaTek, mid-range smartphones, MSM7225A, MSM7227A, MSM7625A, MSM7627A, MSM7x25A, MSM7x27A, MSM8225, MSM8225Q, MSM8227, MSM8230, MSM8260A, MSM8625, MSM8625Q, MSM8630, MSM8930, MSM8960, MSM8960 Lite, MSM8x25, MSM8x30, MSM8x35, MSM8x60, premium smartphones, Qualcomm, S1, S4 Play, S4 Plus, Samsung Galaxy S III, Snapdragon, Snapdragon S4, SoC, Spreadtrum, TD-SCDMA, UMTS, Vellamo, Windows Phone, World Mode | 4 Comments

Qualcomm’s critical reliance on supply constrained 28nm foundry capacity

Posted on July 27, 2012 by Nacsa Sándor

KEY UPDATES: TSMC Board of Directors Meeting Resolutions [TSMC press release, Nov 13, 2012] Hsinchu, Taiwan, R.O.C. – November 13, 2012 – TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions: 1. … Continue reading →

Posted in SoC | Tagged 28 nanometer, 28nm, 3-D Tri-Gate, Apple, APQ8064, Atrenta, CMOS, FD-SOI, finFET, foundry, foundry capacity, GlobalFoundries, HKMG, IDM foundry, IP portfolio, IP quality, iPhone 5, Krait, LTE, MDM9x15, Mobile Devices, MSM8960, MSM8x25, MSM8x30, quaility, Qualcomm, Samsung Foundry, semiconductor industry, semiconductor manufacturing, Snapdragon, Snapdragon S4, SoC, SoC quality, ST-Ericsson, STMicroelectronics, supply constraints, Tri-Gate, tri-gate transistors, TSMC, TSMC 9000 IP library, TSMC IP Alliance, TSMC IP portfolio, TSMC Soft-IP Alliance, TSMC9000 IP library, UMC, United Microelectronics Corporation | 5 Comments

Thin/Zero Client and Virtual Desktop Futures

Posted on May 30, 2012 by Nacsa Sándor

26 years of Wyse and Citrix collaboration resulted in an advanced infrastructure solution bringing the Windows desktop into a virtualised cloud environment and accessible from any cloud computing client device, including even thin client and zero client devices, or ones … Continue reading →

Posted in Cloud client SW platforms, Cloud SW engineering, Cloud Computing strategy | Tagged alternative computing, ARMADA 510, Citrix, Citrix HDX, Citrix HDX SoC, Citrix HDX SoC initiative, Citrix Ready, Citrix Receiver, Citrix SoC initiative, client virtualization, cloud client, cloud PC, completely secure, Consumerization of IT, Dell, Dell vision, Dell Wyse, desktop virtualization, differentiator, education, educational sector, eLearning Africa, end user computing, end user computing strategy, financial sector, financial services, government healthcare, HDX Ready, health care, management, Marvell, Microsoft, mobility, PocketCloud, private sector, product differentiation, public sector, regulated industries, RemotePC, SoC, thin client, ThinOS, universal client, USB, VDI, verticals, virtual desktop, virtualization, virus immune, VMware, Windows Embedded, Windows MultiPoint Server, Wyse, Wyse E01, Wyse PocketCloud, Wyse Stratus, Wyse Technologies, Wyse ThinOS, Wyse Xenith, Wyse Z class, Wyse Zero, Wyse Zero Engine, XenClient, XenDesktop, Z class, zero client | 1 Comment

MWC 2012: Fuzhou Rockchip Electronics

Posted on March 13, 2012 by Nacsa Sándor

Follow-up: Core post: China’s HW engineering lead: The Rockchip RK292 series (RK2928 and RK2926) example [Oct 27, 2012] Exclusive : ST Ericsson, Rockchip To Join Windows 8 For ARM Club In 2013 [Feb 29, 2012] Rockchip RK30xx ARM Cortex-A9 announced at Mobile World Congress … Continue reading →

Posted in consumer devices, smartphones, SoC | Tagged 40nm, 55nm, 65nm, Android 4.0, ARM, ARM Holdings, Chartered, Chartered Semiconductor Manufacturing, Fuzhou Rockchip Electronics, Global Foundries, Hisilicon, RK28xx, RK2918, RK29xx, RK30xx, Rockchip, SoC, Spreadtrum, TSMC, Vivante, Wabook, WebM, Windows 8 | 4 Comments

MWC 2012: the 4G/LTE lightRadio network

Posted on March 8, 2012 by Nacsa Sándor

Day 1: Alcatel-Lucent at MWC 2012 – lightRadio [AlcatelLucentCorp YouTube channel, Feb 28, 2012] Video of Day 1 at Mobile World Congress 2012. Booth tour, images from Telefonica’s press conference about their live LTE network with lightRadio, interviews and more… … Continue reading →

Posted in Cloud Computing strategy, Mobile Internet | Tagged 3.9G, 4G, Alcatel-Lucent, base station, baseband processing, Bell Labs, Bill Huang, China, China Mobile, China Mobile Research Institute, co-creation, digital signal processing, Ericsson, Freescale, IP platform, lightRadio, lightRadio network, lightRadio WiFi, LTE, mobile broadband, mobile broadband platform, mobile broadband services, Mobile World Congress 2012, MWC 2012, QoE, QorIQ Qonverge, quality of experience, Radio Access Network, RAN, Samsung, Samsung Mobile, small cells, SoC, Spain, TD-LTE, Telefonica, video call, WB-AAA, Wi-Fi, Wi-Fi hotspots, wideband active antenna arrays | 5 Comments

Tag Archives: SoC

Qualcomm’s SoC business future is questioned first time

Saving Intel: next-gen Intel ultrabooks for enterprise and professional markets from $500; next-gen Intel notebooks, other value devices and tablets for entry level computing and consumer markets from $300

Qualcomm moving ahead of Allwinner et al. in CPU and GPU while trying to catch up with Allwinner in Ultra HD

Allwinner vis-à-vis HTC on 2013 International CES

ST-Ericsson: Fundamental repositioning for modem, APE and ModAps spaces

Qualcomm decided to compete with the existing Cortex-A5/Krait-based offerings till the end of 2012

Qualcomm’s critical reliance on supply constrained 28nm foundry capacity

MWC 2012: Fuzhou Rockchip Electronics

MWC 2012: the 4G/LTE lightRadio network

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