2010 – the 1st grand year of:
• 3.5G...3.9G level mobile Internet
• system-on-a-chip (SoC) and
• reflective display technologies
Why viewed most (till Feb 1):
• Marvell SoC leadership
• Android 2.3 & 3.0
• Hanvon's strategy
• Welcome! or Home pages
• Treesaver (LATELY #2!) and
• IMT-Advanced (4G)
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28nm Acer Android Apple Asustek China China Mobile China Unicom cloud client Computers and Internet e-reading Google HSPA+ HTC HTML5 Huawei India Intel JavaScript Lenovo LTE Lumia Marvell MediaTek Microsoft Nokia Qualcomm SaaS Samsung slates smartphones SoC Symbian Tablets Taiwan TD-LTE TD-SCDMA User Experience UX Windows 7 Windows 7 [Phone / Embedded / Handheld] Windows 8 Windows Phone 7 Xbox ZTETop posts
- Plane to Line Switching (PLS) screen technology (Samsung)
- Qualcomm moving to Applications DSP (ADSP)
- Qualcomm’s SoC business future is questioned first time
- Qualcomm quad-core Cortex-A7 SoCs with Adreno 305 and 1080p coming for the high-volume global market and China
- Boosting the MediaTek MT6575 success story with the MT6577 announcement -- UPDATED with MT6588/83 coming in Q4 2012 and 8-core MT6599 in 2013
- China’s HW engineering lead: The Rockchip RK292 series (RK2928 and RK2926) example
- Continued Toshiba-SanDisk dominance for flash memories
- MediaTek’s ‘smart-feature phone’ effort with likely Nokia tie-up
- TI’s OMAP4460 in Samsung GALAXY Nexus with Android 4.0
- 5G WiFi with Wi-Fi CERTIFIED™ ac Miracast™ from Broadcom for streaming content to UHD (4K) TVs as well
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Meta
Tag Archives: digital signage
Can VIA Technologies save the mobile computing future of the x86 (x64) legacy platform?
After Urgent search for an Intel savior [this same blog, Nov 21, 2012] this is a quite legitimate and important question. Watch Cher Wang, the founder and still the chairman of the VIA Technologies (also HTC), speaking about the enterpreneurship … Continue reading →
Posted in SoC, Geopolitics, intelligent systems, embedded computing
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Tagged Apple, HTC, Atom, IOT, HP, Windows 8, cloud computing, 40nm, 65nm, x86, low-power, digital signage, Internet of Things, COTS, Intel Atom, VIA Technologies, mobile computing, x64, Bonnell microarchitecture, Bonnell, Centaur Technology, Isaiah microarchitecture, Isaiah, Nano, VIA Nano, Cher Wang, Silvermont, VIA Embedded, Mini-ITX, EPIA, Nano-ITX, Em-ITX, Mobile-ITX, Pico-ITX, fanless design, QuadCore, Centaur, Glenn Henry, Wenchi Chen, CN-R, VIA QuadCore, CN-Q, VIA Nano X2, VIA V4 bus, PadLock, mini-PCs, VIA ARTiGO, semi-embedded, medical computing, thin clients, hardware encryption, security co-processor, encryption, on-the-fly encryption, WonderMedia PRIZM SoC, WonderMedia, medical devices, instruments, ARM designs, low-power servers, VX11 chipset, VX11, Kernel-based Virtual Machine, KVM, KVM hypervisor, VIA Eden, market share, Eden X2, VX900 chipset, VX900, Devon IT, ZOTAC, Posiflex Technology, POS terminals, driver support, VIA EPIA-P910, Media System Processor, MSP, small form factor, SFF, VIA Chrome 640\645, Chromotion, VIA Chromotion, VIA Vinyl, Vinyl, S3 Graphics, WTI, VIA ARTiGO A1250, VIA ARTiGO A1150, VIA ARTiGO A1200, 64-bit, out-of-order, speculative out-of-order, media processing, VIA Nano 3000 Series, VIA VN1000, VIA Nano DC Platform, xITX Standards, xITX, COM Express, QSeven, ETX, Q Seven, VIA VAB-800 Pico-ITX, Kontron, System-on-Module, Computer-on-Module, SOM, COM, Advantech, stackable computer, carrier board, Seco, ULP-COM, PICMG, SGet, Standardisation Group for Embedded Technologies
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6 Comments
The future of Windows Embedded: from standalone devices to intelligent systems
Updates: Kevin Dallas on intelligent systems [WindowsEmbedded YouTube Channel, March 28, 2012] Kevin Dallas, GM for Windows Embedded at Microsoft, talks with Steve Clayton about the emergence of intelligent systems and Windows Embedded Standard 8 community technology preview. http://www.microsoft.com/presspass/presskits/embedded - Feature: Intelligent Systems in … Continue reading →
Posted in Cloud Computing strategy, intelligent systems
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Tagged agile development, digital signage, healthcare devices, Intel, intelligent kiosks, Intelligent Systems, Internet of Things, IOT, manufacturing, medicine, retail, smart digital signage, Windows Embedded, Windows Embedded Standard 8, Windows Embedded Standard 8 Community Technology Preview, Windows Embedded Standard 8 CTP
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5 Comments
E Ink strategic value proposition: displays on every smart surface
Updates: Reflective OutLook: Shades of Gray or Colorful? [Touch and Display-Enhancement Issue of Information Display, Sept 21, 2012] … E Ink and SiPix Meanwhile, could color have anything do to do with E Ink’s recent announcement of its intention to … Continue reading →
Posted in consumer devices, E-readers, Reflectivity/Sunlight readability
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Tagged Amazon, Amazon Kindle, AUO, Barnes&Noble, cloud client, Cortex A9, digital signage, E-Ink display, E-Ink-Holdings, e-reading, ECTACO JetBook Color, eDocument, eDocument reader, educational sector, EIH, Epson, Eton Ruckus, fill-out forms, Freescale, IFeL, innovation, Kindle, leasure reading, Marvell, matrix displays, mobile phones, Motorola, Pearl, Peruvemba, ruggedness, Russia, russian schools, Samsung, segmented displays, signage, SiPix, smart surfaces, Sony, Sri Peruvemba, Sriram Peruvemba, SURF display, Taiwan, Texas Instruments, textbooks, Toppan, Triton
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