2010 – the 1st grand year of:
• 3.5G...3.9G level mobile Internet
• system-on-a-chip (SoC) and
• reflective display technologies
Why viewed most (till Feb 1):
• Marvell SoC leadership
• Android 2.3 & 3.0
• Hanvon's strategy
• Welcome! or Home pages
• Treesaver (LATELY #2!) and
• IMT-Advanced (4G)
MORE ON THE STATISTICS PAGE-
Recent Posts
- Windows Embedded is an enterprise business now, like the whole Windows business, with Handheld and Compact versions to lead in the overall Internet of Things market as well
- Microsoft betting on boosting Windows RT demand with top level ARM SoCs from its SoC partners, Windows 8.1 enhancements, Outlook addition to the Office 2013 RT and very deep tactical discounts to its OEM partners for tablet offerings of more value and capability
- “Cloud first” from Microsoft is ready to change enterprise computing in all of its facets
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Core information:
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28nm Acer Android Apple ARM Asustek China China Mobile China Unicom cloud client Computers and Internet e-reading Google HSPA+ HTC HTML5 Huawei India Intel Lenovo LTE Lumia Marvell MediaTek Microsoft Nokia Qualcomm SaaS Samsung slates smartphones SoC Symbian Tablets Taiwan TD-LTE TD-SCDMA TSMC UX Windows 7 Windows 7 [Phone / Embedded / Handheld] Windows 8 Windows Phone 7 Windows RT ZTETop posts
- Qualcomm moving to Applications DSP (ADSP)
- Plane to Line Switching (PLS) screen technology (Samsung)
- Boosting the MediaTek MT6575 success story with the MT6577 announcement -- UPDATED with MT6588/83 coming in Q4 2012 and 8-core MT6599 in 2013
- China’s HW engineering lead: The Rockchip RK292 series (RK2928 and RK2926) example
- Welcome!
- MediaTek MT6589 quad-core Cortex-A7 SoC with HSPA+ and TD-SCDMA is available for Android smartphones and tablets of Q1 delivery
- Qualcomm’s SoC business future is questioned first time
- Windows Embedded is an enterprise business now, like the whole Windows business, with Handheld and Compact versions to lead in the overall Internet of Things market as well
- Mobile Internet (Aug'11)
- Nokia Lumia (Windows Phone 7) value proposition
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Category Archives: SoC
ARM Cortex-A12 CPU cores and Mali-T622 GPU cores with Process Optimization Packs (POPs), plus Mali-V500 video block for mid-range mobile devices of the end of 2014
in order to cover (very competitively) the hole existing in ARM-based SoCs so far: Arm unveiled the Cortex A12 processor during a news conference at Computex in Taipei on June 3, 2013. AnandTech’s judgement about the Cortex-A12 announcement: … The … Continue reading
Posted in smartphones, SoC, tablets
Tagged 28nm, 40-bit addressing, 40nm, 45nm, ARM, ARM Holdings, big.LITTLE, big.LITTLE Processing, Cortex A15, Cortex A9, Cortex-A12, Cortex-A7, CPU, diversification, Entropic, Exynos 4 Dual, Exynos 4210, GlobalFoundries, GLOBALFOUNDRIES 28-SLP HKMG, GPU, Mali-T622, Mali-V500, mid range, OMAP, OMAP 4430, POP, Process Optimization Pack, Samsung, Samsung Exynos 4 Dual, Samsung Exynos 4210, Samsung Orion, SoC, Texas Instruments OMAP 4430, TSMC, TSMC 28HPM, video block, virtualization
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China: Entry-level dual core IPS WVGA (480×800) smartphones $65+ now, quad-core $70+ in June
China market: Qualcomm, Spreadtrum cutting quad-core processor prices [DIGITIMES, April 25, 2013] Qualcomm and Spreadtrum Communications have both cut prices for their quad-core products to better compete against MediaTek, which controls half of the smartphone-chip market in China, according to … Continue reading
Posted in consumer computing, consumer devices, Geopolitics, smartphones, SoC
Tagged 2.5G, Android, China, China Mobile, dual core, entry level, 蘑菇手机, HSPA+, HSUPA, IPS, MediaTek, MOGO OS, Mogu, Mogu Phone, MOGU蘑菇手机, Qualcomm, SC6825, SC8825, smartphones, Spreadtrum, TD-SCDMA, WVGA
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TSMC’s 16nm FinFET process to be further optimised with Imagination’s PowerVR Series6 GPUs and Cadence design infrastructure
OR After CPU level optimisation With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology [‘Experiencing the Cloud’ April 3, 2013] the world #1 foundry decided to further optimise its crucial … Continue reading
Posted in SoC
Tagged 16nm, 16nm FinFET process, 16nm node, 20nm, advanced process technologies, Cadence, design flows, design infrastructure, EDA, Graphics IP, Imagination, Imagination Technologies, optimisation, PowerVR, PowerVR GPU, Soft-IP Alliance program, TSMC, TSMC OIP 2012, TSMC Open Innovation Platform, TSMC Soft-IP Alliance program
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The future of mobile gaming at GDC 2013 and elsewhere
Laszlo Kishonti at MWC 2013 (see the video embedded later, as well as the CLBenchmark data supporting the below statement): [1:20] Currently Mali T-600 is the first and only GPU which can run this desktop grade software. [1:27] The Great … Continue reading
Posted in Cloud client SW platforms, consumer computing, consumer devices, smartphones, SoC, tablets
Tagged AAA Game, Arndale Board, CLBenchmark, CLBenchmark 1.1 Desktop Edition, console gaming, digital gaming, Exynos 5 Dual, Exynos 5250, F8000, GDC 2013, GLBenchmark, GLbenchmark 2.5, Glu Mobile, Google Nexus 10, Hisilicon K3V3, Image filter, Kishonti Informatics, Mali SeeMore Demo, Mali-T600 Series, Mali-T604, Mali-T624, Mali-T628, Mali-T658, Mali-T678, mobile gaming, OpenCL CPU Compute, OpenCL GPU Compute, Optical flow, PowerVR competition, Raytrace, Samsung Smart TV, SPH Fluid Simulation, Synopsis, Synthesis Super-Resolution Scaler Demo, Timbuktu2, triple-A game, WQXGA display
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With 28nm non-exclusive in 2013 TSMC tested first tape-out of an ARM Cortex™-A57 processor on 16nm FinFET process technology
Cortex-A57? – 3x performance of 2012 superphones- 64-bit support for future consumer apps + current and future enterprise apps- Scalable beyond 16 cores … First Cortex-A50 series chips available from 2014 Update: TSMC 16nm FinFET to enter mass production within … Continue reading
Posted in SoC
Tagged 16nm, 16nm FinFET, 20/16nm, 2012, 2013, 2014, 20nm, 28nm, ARM, ARM Cortex-A57, ARM Holdings, ARMv8, contract chip manufacturing, Cortex-A57, fabless semiconductor industry, finFET, FinFET technology, Morris Chang, Taiwan Semiconductor Manufacturing Company, tape-out, TSMC, TSMC OIP, TSMC Open Innovation Platform
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Windows RT Buzz: only the naming will disappear?
Microsoft defends Windows RT as necessary disruption [CNET, March 21, 2013]vs.Microsoft to merge Windows RT into next-generation Windows OS [DIGITIMES, March 27, 2013] These headlines tell everything. And don’t forget, end of March is the end of PRISM when all … Continue reading
Posted in Cloud client SW platforms, SoC, tablets
Tagged ARM, Atom, Intel, Microsoft, Microsoft Surface, Windows 8, Windows Blue, Windows RT
1 Comment
